Microchip BM70BLES1FC2 Bluetoothâ® low energy (ble) module Datasheet

BM70/71
Bluetooth® Low Energy (BLE) Module
Features
• Bluetooth SIG 4.2 qualified
• Certified to FCC, IC, MIC, KCC, NCC and SRRC
radio regulations
• European R&TTE Directive Assessed Radio module
• RoHS compliant
• UART, I2C, and SPI interface supported
• Supports transparent UART data service of BLE
• Built around Microchip IS187x SoC
• BM70 supports 3-channel PWM and BM71 supports 1-channel PWM
• Precision Temperature Sensor (PTS) with
operating range of -20°C ~ +70°C with an
accuracy of ±3°C
• 12-bit ADC (ENOB=10/8-bits) support for battery
and voltage detection.
• 8-channel ADC for BM70 and 5-channel ADC for
BM71 is provided
• 18 general purpose I/O pins (BM70) and 9 general purpose I/O pins (BM71)
• Integrated 32 MHZ crystal
• Small and compact surface mount module
• Castellated SMT pads for easy and reliable PCB
mounting
Note:
RF Features
•
•
•
•
•
ISM Band 2.402 GHz to 2.480 GHz operation
Channels: 0-39
Receive Sensitivity: typical -90 dBm (LE)
Transmit Power: 0 dBm (typical)
Received Signal Strength Indication (RSSI)
monitor with 1 db resolution
These images are for the representation
purpose only and the original product
might differ in markings.
Antenna
• Integrated chip antenna (BM7xBLES1FC2)
• External antenna connection through RF pad
(BM7xBLE01FC2)
MAC/Baseband/Higher Layer Features
Power Management
• Secure AES128 encryption
• GAP, GATT, SM, L2CAP and integrated public
profile
• Create custom services using User Interface (UI)
tool, a Windows® configuration utility
• I/O capability for BT4.0/BT4.2 authentication
• Software configurable role as peripheral/central,
client/server
• Low-power modes supported, system wake-up
through any GPIO
• Peak current: Tx 13 mA and Rx 13 mA with buck
at 3.0V VBAT input
 2015-2016 Microchip Technology Inc.
Operating Conditions
• Operating voltage range: 1.9V to 3.6V
• Operating temperature: -20ºC to +70ºC
DS60001372D-Page 1
BM70/71
General Description
The BM70/71 module offers Bluetooth Low Energy
solution for embedded applications. It conforms to the
Bluetooth core specification version 4.2 to enhance the
throughput and security for the IoT applications. It also
supports Beacon technology to enhance user experience for the IoT applications and enables users to control the cloud and receive data without opening the
application through a smart phone.
The BM70/71 has Bluetooth stack integrated and is
available in different form factor to optimize the space,
cost, and RF performance. For portable and wearable
applications, it provides power-optimized design to
minimize the current consumption to extend the battery
life.
Applications
•
•
•
•
•
•
•
Internet of Things (IoT)
Payment or Security
Wearable Devices
Home and Security
Health and Fitness
Beacons
Industrial and Data Logger
DS60001372D-Page 2
 2015-2016 Microchip Technology Inc.
BM70/71
Table of Contents
1.0 Device Overview .............................................................................................................................................................................. 5
2.0 Application information................................................................................................................................................................... 13
3.0 Module Configuration ..................................................................................................................................................................... 25
4.0 Antenna.......................................................................................................................................................................................... 27
5.0 Electrical Characteristics................................................................................................................................................................ 35
6.0 Packaging Information ................................................................................................................................................................... 41
7.0 Soldering Recommendations ......................................................................................................................................................... 49
8.0 Ordering Guide .............................................................................................................................................................................. 51
Appendix A: Certification Notices......................................................................................................................................................... 53
Appendix B: Revision History............................................................................................................................................................... 59
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 2015-2016 Microchip Technology Inc.
DS60001372D-Page 3
BM70/71
NOTES:
DS60001372D-Page 4
 2015-2016 Microchip Technology Inc.
BM70/71
1.0
DEVICE OVERVIEW
The BM70/71 embedded 2.4 GHz Bluetooth version 4.2
BLE module is built around Microchip Technology
IS1870/71 BLE System on Chip (SoC). The IS1870/71
SoC incorporates Bluetooth stack, power management
subsystem, 2.4 GHz transceiver, and RF power amplifier. The user can embed Bluetooth functionality into any
applications using the BM70/71 module.
The BM70/71 enables faster product development and
time to market. It is designed to provide simple Bluetooth
solutions with the following features:
•
•
•
•
Simple integration and programming
Reduced development time
Superior wireless module with low-cost system
Interoperability with Apple® iOS and Android™
OS
• Wide range of applications
FIGURE 1-1:
In addition, the BM70/71 supports Beacon technology
to improve user experiences in IoT applications, such
as auto connection/control and data to cloud.
The BM70/71 can independently maintain a low-power
wireless connection, and the low-power usage and flexible power management maximizes the module’s lifetime
in battery operated devices. Also, wide operating temperature range enables its use in indoor and outdoor
environments.
The BM70/71 is a small, compact, surface mount on the
host PCB with the castellated pads making the interface
easy and reliable. The BM71 is relatively small form factor module targeted for applications, such as wearable
sports, fitness devices and so on.
1.1
Interface Description
Figure 1-1 and Figure 1-2 illustrate an example of the
BM70/71 module-based system. Figure 1-3 through
Figure 1-6 illustrate the pin diagrams. Table 1-1 provides
pin descriptions.
BM70-BASED SYSTEM BLOCK DIAGRAM
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DS60001372D-Page 5
BM70/71
FIGURE 1-2:
DS60001372D-Page 6
BM71-BASED SYSTEM BLOCK DIAGRAM
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BM70/71
FIGURE 1-3:
BM70BLE01FC2 PIN DIAGRAM
FIGURE 1-4:
BM70BLES1FC2 PIN DIAGRAM
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DS60001372D-Page 7
BM70/71
FIGURE 1-5:
BM71BLE01FC2 PIN DIAGRAM
FIGURE 1-6:
BM71BLES1FC2 PIN DIAGRAM
DS60001372D-Page 8
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BM70/71
TABLE 1-1:
PIN DESCRIPTION
BM70BLE0 BM70BLE BM71BLE BM71BLE
Pin Name
1FC2
S1FC2
01FC2
S1FC2
—
1
—
—
GND
Type
Power
Description
Ground reference
—
2
—
—
GND
Power
Ground reference
1
3
12
13
GND
Power
Ground reference
2
4
11
14
VBAT
Power
Battery input. Voltage range: 1.9V to 3.6V
—
—
10
—
BK_IN
Power
Buck input. Voltage range: 1.9V to 3.6V
3
5
—
—
P2_2
DIO
4
6
—
—
VDD_IO
Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
5
7
—
—
VDD_IO
Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
6
8
—
—
ULPC_O
Power
1.2V programmable ULPC LDO output
for AON-logic and retention memory supply. Internal use only, do not connect to
other devices.
7
9
—
—
P2_3
DI
8
10
—
—
BK_O
Power
1.55V buck output. internal use only, do
not connect to other devices.
—
—
13
6
P1_6
DIO
AI
P1_6
External 32.768 kHz crystal input: XI32K
—
—
14
5
P1_7
DIO
AO
P1_7
External 32.768 kHz crystal output:
XO32K
9
11
15
15
P2_7
DIO
AI
DO
DO
GPIO: P2_7
ADC Input: AD14
TX_IND
SPI bus: NCS2, second SPI bus (Master
mode)
10
12
—
—
P1_1
DIO
AI
DI
GPIO: P1_1
ADC Input: AD9
SPI bus: MISO2, second SPI bus (Master
mode)
11
13
2
3
P1_2
DIO
AI
I/O
GPIO, default pull-high input
AD10
I2C SCL
12
14
3
4
P1_3
DIO
AI
DIO
GPIO, default pull-high input
AD11
I2C SDA
13
15
8
11
P0_0
DIO
AI
DI
GPIO, default pull-high input
AD0
UART flow-control CTS
14
16
—
—
P1_0
DIO
AI
GPIO, default pull-high input
AD8
15
17
6
9
P3_6
DIO
DO
DO
GPIO, default pull-high input
PWM0
UART flow-control RTS
Legend:
A = Analog
 2015-2016 Microchip Technology Inc.
D = Digital
GPIO, default pull-high input PWM1
GPIO, default pull-high input PWM2
I = Input
O = Output
DS60001372D-Page 9
BM70/71
BM70BLE0 BM70BLE BM71BLE BM71BLE
Pin Name
1FC2
S1FC2
01FC2
S1FC2
Type
Description
System configuration, default pull-high
input
H: Application mode
L: Test mode
16
18
16
16
P2_0
DI
17
19
—
—
P2_4
DIO
18
20
—
—
NC
—
No connection
19
21
7
10
RST_N
DI
Module Reset (active-low) (internal
pull-up)
20
22
5
7
HCI_RXD
DI
HCI UART data input
21
23
4
8
HCI_TXD
DO
HCI UART data output
22
24
—
—
P3_1
DIO
DO
GPIO: P3_1
SPI bus: NCS, SPI Flash: CSN
23
25
—
—
P3_2
DIO
DO
GPIO: P3_2
SPI bus: MISO, SPI Flash: SDO
24
26
—
—
P3_3
DIO
DI
GPIO: P3_3
SPI bus: MOSI, SPI Flash: SDI
25
27
—
—
P3_4
DIO
DO
GPIO: P3_4
SPI bus: SCLK, SPI Flash: SCK
26
28
—
—
P3_5
DIO
DO
GPIO, default pull-high input
LED1
27
29
—
—
P0_7
DIO
AI
GPIO, default pull-high input
AD7
28
30
9
12
P0_2/LED
DIO
AI
P02
AD2
29
31
17
2
GND
Power
—
32
—
—
GND
Power
30
—
1
1
BT_RF
AI
—
33
—
—
GND
Power
Legend:
A = Analog
DS60001372D-Page 10
D = Digital
GPIO, default pull-high input
Ground reference
Ground reference
External antenna connection (50 Ohm)
Only for BM70BLE01FC2 and
BM71BLE01FC2
NC for BM71BLES1FC2
Ground reference
I = Input
O = Output
 2015-2016 Microchip Technology Inc.
BM70/71
Table 1-2 provides the BM70/71 and BLE Development
Kit Version 3 (BLEDK3) features.
Note:
The BLEDK3 application is one of the
application firmwares of the BM70/71. For
more information on the BLEDK3 application, refer to the “IS187x_BM7x BLEDK3
Application Note”.
TABLE 1-2:
BM70/71 HARDWARE AND BLEDK3 FEATURES(1)
Feature/ Modules
BM70BLES1FC2
BM70BLE01FC2
BM71BLES1FC2
BM71BLE01FC2
Configuration
Module
H/W
BLEDK3
Module
H/W
BLEDK3
Module
H/W
BLEDK3
Module
H/W
BLEDK3
UART
1
1
1
1
1
1
1
1
GPIO (see Note 2)
18
13
18
13
9
4
9
4
12-bit ADC Channels
8
6
8
6
5
3
5
3
PWM
3
2
3
2
1
0
1
0
SPI
2
0
2
0
1
0
1
0
I2C
1
0
1
0
1
0
1
0
Total Pins
33
—
30
—
16
—
17
—
On-board Antenna
with Shielded Can
Yes
—
—
—
Yes
—
—
—
No Antenna
—
—
Yes
—
—
—
Yes
—
Government Regulatory RF Certified
Yes
—
—
—
Yes
—
—
—
Size (mm)
12x22x2.4
—
12x15x1.6
—
9x11.5x2.1
—
6x8x1.6
—
Note 1:
2:
The GPIO, ADC and PWM pin numbers in the BLEDK3 application is calculated by taking out the default
pins of UART peripherals and LED indication, which are listed in Table 1-4.
For detailed GPIO configuration example for the BLEDK3 Manual Pattern, refer to the "BLEDK3 Manual
Pattern User’s Guide”.
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DS60001372D-Page 11
BM70/71
Table 1-3 provides the details of the test pads used for
the production test on the bottom of the BM70/71.
Table 1-4 provides GPIO pins and its connection
details.
TABLE 1-3:
TEST PADS DETAILS
BM70BLE
01FC2
BM70BLE
S1FC2
BM71BLE
01FC2
BM71BLE
S1FC2
Pin Name
Type
Description
TP-1
TP-1
TP-3
TP-3
VCC_PA
Power
1.55V RF PA LDO
TP-2
TP-2
TP-1
TP-1
CLDO_O
Power
1.2V CLDO output
TP-3
TP-3
TP-2
TP-2
VCC_RF
Power
1.28V RF LDO output
—
—
TP-4
TP-4
ULPC_O
Power
1.2V ULPC LDO output
—
—
TP-5
TP-5
BK_O
Power
1.55V buck output
TABLE 1-4:
GPIO PIN DETAILS
GPIO Pins
Connection details
P2_0
System configuration
P0_2
LED0
P0_0
UART_CTS
P2_7
UART_RX_IND
P3_6
UART_RTS
DS60001372D-Page 12
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BM70/71
2.0
APPLICATION INFORMATION
2.1
Reference Schematics
Figure 2-1 through Figure 2-4 illustrate the BM70/71
reference circuits for various Stock Keeping Units
(SKUs). The GPIOs are configurable and the connection depends on the user’s application circuit.
The power input range is 1.9V~3.6V. If the battery is
used, the battery reverse protection circuit is
recommended. The VDD_IO voltage is same as power
input. If the LED is used, ensure that the voltage is
more than 3V to drive the LED. A 1.8V Reset IC is
added as an optional circuit to prevent the Flash data
crash when VBAT power is unstable. It is recommended
to implement the RF antenna matching circuit as
illustrated in Figure 2-3 and Figure 2-5 to fine tune the
antenna impedance matching.
FIGURE 2-1:
BM70BLES1FC2 REFERENCE CIRCUIT
FIGURE 2-2:
BM70BLES1FC2 REFERENCE CIRCUIT
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DS60001372D-Page 13
BM70/71
FIGURE 2-3:
BM70BLE01FC2 REFERENCE CIRCUIT
FIGURE 2-4:
BM70BLE01FC2 REFERENCE CIRCUIT
DS60001372D-Page 14
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BM70/71
FIGURE 2-5:
BM71BLE01FC2 REFERENCE CIRCUIT
Note 1: Place the capacitor C3 as close as possible to the module. Connect the BK_IN and VBAT trace at C3.
2: The antenna matching component value depends on the user’s antenna and PCB layout.
FIGURE 2-6:
BM71BLE01FC2 REFERENCE CIRCUIT
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DS60001372D-Page 15
BM70/71
FIGURE 2-7:
BM71BLES1FC2 REFERENCE CIRCUIT
Note 1: Place the capacitor C3 as close as possible to the module.
FIGURE 2-8:
DS60001372D-Page 16
BM71BLES1FC2 REFERENCE CIRCUIT - OPTIONAL
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BM70/71
2.2
External Configuration and
Programming
The BM70/71 can be configured and programmed
using an external configuration and programming tool.
Figure 2-9 illustrates the test points that must be
included on the host PCB for the development.
FIGURE 2-9:
Configuration and programming modes can be entered
according to the system configuration I/O pins. For
additional information, refer to Section 3.4, System
Configuration.
EXTERNAL CONFIGURATION AND PROGRAMMING
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DS60001372D-Page 17
BM70/71
2.3
2.3.1
Host MCU Interface
HOST MCU INTERFACE OVER
UART
Figure 2-10 and Figure 2-11 illustrate the BM70/71 to
host MCU interface over UART. The Host Control Interface (HCI) UART lines are used to communicate
FIGURE 2-10:
Note 1:
2:
between the BM70/71 and MCU. The interface also
illustrates the power scheme using a 3.3V Low-Drop
Out (LDO) regulator that supply 3.3V to the BM70/71
(BAT_IN) and MCU VDD. This power scheme ensures
that the BM70/71 and MCU I/O voltages are compatible.
BM70 TO MCU INTERFACE
Ensure that VBAT(=I/O Voltage) and MCU VDD voltages are compatible.
Control and indication ports are configurable.
DS60001372D-Page 18
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BM70/71
FIGURE 2-11:
Note 1:
2:
3:
4:
BM71 TO MCU INTERFACE
Ensure that VBAT=I/O Voltage) and MCU VDD voltages are compatible.
Control and indication ports are configurable.
10 μF (X5R) and 330 Ohm resistor are required for the BM71 module.
BK_IN connect to VBAT for BM71BLE01FC2.
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DS60001372D-Page 19
BM70/71
2.3.2
UART READY AFTER EXTERNAL
RESET
In
MCU
applications,
the
time
between
Reset/power-on and the BM70/71 UART port read
must be notified. Figure 2-12 illustrates the timing of
the BM70/71 UART port ready for Test mode and
Application mode after Reset.
FIGURE 2-12:
DS60001372D-Page 20
TIMING DIAGRAM OF BM70/71 UART READY FOR TEST MODE AFTER RESET
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BM70/71
2.3.3
UART READY AFTER POWER-ON
RESET
Figure 2-13 illustrates the timing of the BM70/71
UART port ready for Test mode and Application mode
after Power-on Reset (POR).
cated by the status pin, or a status report UART command which is sent to inform the MCU that the
BM70/71 is ready for communication.
In Application mode, when the BM70/71 is ready to
communicate with the host MCU after Reset, the
BM70/71 will have either Standby mode which is indi-
FIGURE 2-13:
TIMING DIAGRAM OF BM70 UART READY FOR TEST MODE AFTER POWER ON
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DS60001372D-Page 21
BM70/71
2.4
Standalone Configuration
Figure 2-14 illustrates the standalone configuration for
the BM71BLE01FC2 module. It also illustrates an
application using a coin cell battery at VBAT input. For
FIGURE 2-14:
Note 1:
the BM71, a 10 μF capacitor (X5R/X7R) is applied to
the BAT_IN pin. The BK_IN pin of the BM71BLE01FC2
module must be connected to the BAT_IN pin.
BM71 STANDALONE CONFIGURATION
Applications include ADC, PWM (BM71), I2C, and SPI bus interface.
DS60001372D-Page 22
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BM70/71
2.5
Power-Drop Protection
To prevent the BM70/71 from disruptions, when the
voltage drops to less than 1.9V, an ‘Open Drain’ Reset
chip with a delay time of ≤ 10 ms that triggers Reset at
1.8V output voltage is recommended. Figure 2-15 illustrates the Reset circuit block diagram.
FIGURE 2-15:
RESET CIRCUIT BLOCK DIAGRAM
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DS60001372D-Page 23
BM70/71
NOTES:
DS60001372D-Page 24
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BM70/71
MODULE CONFIGURATION
3.2
The I/O pins on the BM70/71 are configurable as either
control or indication signal. T h e control signals are
input to the BM70/71 and the indication signals are output from the BM70/71. Table 3-1 provides configurable
I/O pin assignment details to control and indication signals of BM70 BLEDK3 (BLE Development Kit V3). For
different BM70/71 applications, the I/O pin assignment
is different. For additional information related to I/O pin
assignment, refer to the “Windows UI Configuration tool
User Guide” of each BM70/71 application firmware.
The BM70/71 features and services can be configured
using the Windows UI Configuration tool. For additional
information, refer to the “Windows UI Configuration tool
User’s Guide”.
UART Interface
The BM70/71 UART pins, TXD and RXD, are connected to the UART pins of the host MCU. It is recommended to use hardware flow control pins, RTS and
CTS. By default, the BM70/71 hardware flow control is
disabled, and users must configure the pin to enable
the same. The UART baud rate is configurable.
P1_0
Default
P3_1
Default
P3_2
Default
P3_3
Default
P3_4
Default
P0_7
Default
P1_1
Default
P2_2
Default
P2_4
Default
P3_5
Default
Note:
BLEDK_STATUS2_IND (*Note)
BLEDK_STATUS1_IND (*Note)
UART_RX_IND
LINK_DROP
RSSI_IND
LOW_BATTERY_IND
CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM70 BLEDK3
APPLICATIONS
N/C
PINS
TABLE 3-1:
.
RF_ACTIVE_IND
3.1
Control and Indication I/O Pins
PAIRING_KEY
3.0
For additional information on the BLEDK
application status, refer to the “BLEDK3
Release Notes.”
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DS60001372D-Page 25
BM70/71
Table 3-2 provides pin assignment details for the BM70
BLEDK3 application.
TABLE 3-2:
3.3
PIN ASSIGNMENT FOR BM70 BLEDK3 APPLICATION
Pin Name
Pin Assignment
P3_6
UART_RTS
P0_0
UART_CTS
P2_7
TX_IND
P1_2
I2C_SCL
P1_3
I2C_SDA
P0_2
LED0
Reset (RST_N)
3.4
The Reset input pin (RST_N) is used to Reset the
BM70/71 with an active-low pulse with a minimum pulse
width of 63 ns.
TABLE 3-3:
System Configuration
Table 3-3 provides the system configuration settings of
the P2_0 pin that places the BM70/71 into operation
modes. The P2_0 pin has an internal pull-up.
SYSTEM CONFIGURATION SETTINGS
P2_0
Operational Mode
High
Application mode
Low
Test mode (Write UI/Flash: Firmware Programming)
DS60001372D-Page 26
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BM70/71
4.0
ANTENNA
4.1
Antenna Characteristics
4.1.1
Table 4-1 provides the antenna characteristics of the
BM70BLES1FC2 module.
BM70BLES1FC2 CERAMIC CHIP
ANTENNA
The BM70BLES1FC2 module contains an inbuilt
ceramic chip antenna. The antenna performance of the
BM70BLES1FC2 is shown in Figure 4-1.
FIGURE 4-1:
TABLE 4-1:
BM70BLES1FC2 ANTENNA RADIATION PATTERN
BM70BLES1FC2 ANTENNA CHARACTERISTICS
Parameter
Values
Frequency
2450 MHz
Peak Gain
1.63 dBi
Efficiency
71.55%
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DS60001372D-Page 27
BM70/71
4.1.2
BM71BLES1FC2 CERAMIC CHIP
ANTENNA
Table 4-2 provides the BM71BLES1FC2 antenna characteristics.
The BM71BLES1FC2 module contains an inbuilt
ceramic chip antenna. The antenna performance of the
BM71BLES1FC2 module is shown in Figure 4-2.
FIGURE 4-2:
TABLE 4-2:
BM71BLES1FC2 ANTENNA RADIATION PATTERN
BM71BLES1FC2 ANTENNA CHARACTERISTICS
Parameter
Values
Frequency
2442 MHz
Peak Gain
0.1 dBi
Efficiency
42.7%
DS60001372D-Page 28
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BM70/71
4.2
Antenna Placement
For a Bluetooth wireless product, antenna placement
affects the whole system performance. The antenna
needs free space to transmit RF signals and cannot be
FIGURE 4-3:
surrounded by the GND plane. Figure 4-3 and
Figure 4-4 illustrate a typical example of the antenna
placement on the main application board with ground
plane.
BM70BLES1FC2 ANTENNA PLACEMENT RECOMMENDATION
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DS60001372D-Page 29
BM70/71
FIGURE 4-4:
DS60001372D-Page 30
BM71BLES1FC2 ANTENNA PLACEMENT RECOMMENDATION
 2015-2016 Microchip Technology Inc.
BM70/71
4.3
4.3.1
Host PCB Mounting Suggestion
BM70BLES1FC2 HOST PCB
MOUNTING
Figure 4-5 illustrates the host PCB mounting suggestions for the BM70BLES1FC2 module, and it shows
minimum ground plane area to the left and right of the
module for best antenna performance.
FIGURE 4-5:
While designing the host PCB, the area under the
antenna should not contain any top, inner, or bottom
copper layer. A low-impedance ground plane ensures
the best radio performance (best range, low noise).
The ground plane can be extended beyond the minimum recommended as required for the host PCB EMC
noise reduction. For best range performance, keep all
external metal away by minimum 30 mm from the
ceramic chip antenna.
BM70BLES1FC2 HOST PCB MOUNTING SUGGESTION
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DS60001372D-Page 31
BM70/71
4.3.2
BM70BLE01FC2 HOST PCB
MOUNTING
Figure 4-6 illustrates the mounting suggestions for the
BM70BLE01FC2 module and it also shows a connection to UFL connector. A low-impedance ground plane
will ensure the best radio performance (best range, low
noise).
50 Ohm micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test
points. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it
should be a 50 Ohm controlled impedance.
The pin_30 (BT_RF) is connected to an external
antenna connector, a PCB trace antenna, or a component (ceramic chip) antenna through a host PCB
FIGURE 4-6:
DS60001372D-Page 32
BM70BLE01FC2 HOST PCB MOUNTING SUGGESTIONS
 2015-2016 Microchip Technology Inc.
BM70/71
4.3.3
BM71BLES1FC2 HOST PCB
MOUNTING
Figure 4-7 illustrates the mounting suggestions for the
BM71BLES1FC2 module. It also shows the area
around the antenna required for the best antenna performance.
FIGURE 4-7:
The area under the antenna should not contain any top,
inner, or bottom copper layer when designing the host
PCB. A low-impedance ground plane ensures the best
radio performance (best range, low noise). The ground
plane can be extended beyond the minimum recommended as required for the host PCB EMC noise
reduction. For best range performance, keep all external metal away by minimum 30 mm from the ceramic
chip antenna.
BM71BLES1FC2 HOST MOUNTING SUGGESTION
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 33
BM70/71
4.3.4
BM71BLE01FC2 HOST PCB
MOUNTING
Figure 4-8 illustrates the mounting suggestions for the
BM71BLE01FC2 module. It also shows a connection to
the UFL connector. A low-impedance ground plane will
ensure the best radio performance (best range, low
noise).
FIGURE 4-8:
DS60001372D-Page 34
The pin_1 (BT_RF) is connected to an external
antenna connector, a PCB trace antenna, or a component (ceramic chip) antenna through a host PCB
50 Ohm micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test
posts. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it
should be 50 Ohm controlled impedance.
BM71BLE01FC2 HOST PCB MOUNTING SUGGESTION
 2015-2016 Microchip Technology Inc.
BM70/71
5.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the BM70/71 modules electrical characteristics. Additional information will be
provided in future revisions of this document.
Absolute maximum ratings for the BM70/71 devices are listed here. Exposure to the maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above
the parameters indicated in the operation listings of this specification, is not implied.
5.1
Absolute Maximum Ratings
(See Note 1)
Ambient temperature under bias.............................................................................................................. .-20°C to +70°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Voltage of any digital pin ............................................................................................................-0.3V to VDD + 0.3 ≤ 3.9
Maximum output current sunk by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin....................................................................................................12 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 35
BM70/71
TABLE 5-1:
RECOMMENDED OPERATING CONDITIONS
Symbol
Ambient operating temperature range
Min.
Typ.
Max.
–20°C
+25°C
+70°C
PMU
VDD (VBAT, BK_IN), AVDD
1.9V
3.0V
3.6V
RST_N
1.9V
3.0V
3.6V
1.9V
—
3.6V
Other I/Os
GPIO
VIH (Input High Voltage)
0.7 VDD
—
VDD
VIL (Input Low Voltage)
VSS
—
0.3 VDD
VOH (Output High Voltage) (High drive, 12 mA)
0.8 VDD
—
VDD
VOL (Output Low Voltage) (High drive, 12 mA)
VSS
—
0.2 VDD
Pull-up Resistance
34K
48K
74K
Pull-down Resistance
29K
47K
86K
Supply Current
TX mode peak current at VDD=3V,
TX=0dBm, Buck mode
—
—
13 mA
RX mode peak current at VDD=3V, Buck mode
—
—
13 mA
Link static current
Standby current
Power-Saving
60 μA
1.9 μA
—
2.9 μA
1 μA
—
1.7 μA
Analog to Digital Converter (ADC)
Full scale (BAT_IN)
0V
3.0V
3.6V
Full scale (AD0~AD15)
0V
—
3.6V
Conversion time (ENOB 8-bit)
—
131 μS
—
Conversion time (ENOB 10-bit)
—
387 μS
—
Operating current
DNL
INL
—
—
500 μA
-1.12 LSB
—
+1.12 LSB
-4.38 LSB
—
+4.38 LSB
Precise Temperature Sensor (PTS)
Detect range
-20°C
—
+70°C
Digital Output
1387
—
2448
Resolution
—
12-bit/°C
—
-3°C
—
+3°C
Conversion time (ENOB 10-bit)
—
12.35 mS
—
Operating current
—
—
200 μA
Accuracy
DS60001372D-Page 36
 2015-2016 Microchip Technology Inc.
BM70/71
5.2
5.2.1
Current Consumption Details
Tx/Rx CURRENT CONSUMPTION
DETAILS
Figure 5-1 and Figure 5-2 illustrate the Tx/Rx peak and
average current consumption of an advertising event in
the BLEDK3 beacon mode application.
FIGURE 5-1:
The peak current consumption of the VBAT input is 12
mA and the average current consumption is around
0.23 mA. In this example the advertising interval is 100
mS. Current consumption is measured at 3.3V VBAT
input.
TX/RX PEAK CURRENT CONSUMPTION OF ADVERTISING EVENT IN BLEDK3
BEACON MODE
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DS60001372D-Page 37
BM70/71
FIGURE 5-2:
TX/RX AVERAGE CURRENT CONSUMPTION OF ADVERTISING EVENT IN
BLEDK3 BEACON MODE
For additional information on the current consumption
measurements, test conditions, and test environment
setups in the BLEDK3 application, refer to the
“IS187x_BM7x BLEDK3 Application Note”. This Appli-
TABLE 5-2:
cation Note covers the detailed information about status of BLEDK3 application. Table 5-2 provides the
status and description of the BLEDK3 application.
STATUS OF BLEDK3 APPLICATION EXAMPLE
Status
Description
Shutdown Mode
BLEDK3 is shutdown.
Standby Mode
BLEDK3 sends advertising packets and wait for connection. BLEDK3 is
discoverable and connectible.
BLE Connected Mode
BLE link is established and CCCD of ISSC_Transparent_TX characteristic is
disabled (see Note 1).
Transparent Service Enabled Mode BLE link is established and CCCD of ISSC_Transparent_TX characteristic is
enabled (see Note 1).
Note 1:
Client Characteristic Configuration (CCCD) is the Generic Attribute Profile (GATT) service characteristics.
DS60001372D-Page 38
 2015-2016 Microchip Technology Inc.
BM70/71
BM70BLE01FC2 APPLICATION MODE CURRENT CONSUMPTION(1,2,3,4,5,6)
TABLE 5-3:
Test Mode/Test Condition
Standby Mode
Average Current
Consumption
Note
Advertising Interval: 100 ms
0.23 mA
UI: Set as beacon
Advertising Interval: 500 ms
0.077 mA
UI: Set as beacon
BLE Connected Mode
(no data exchange)
Connection Interval: 500 ms
Slave Latency: 2
0.08 mA
Measured when transparent page
is open on the BLEDK3 Application.
Transparent Service
Enable Mode
Tx data
Connection Interval: 18.75 ms 3.87 mA
Slave Latency: 0
Maximum Tx data throughput setting tested file size: 100 KB
Tx data throughput: 9.863 KB/s
Transparent Service
Enable Mode
Tx data
Connection Interval: 40 ms
Slave Latency: 0
Tested File: 100 KB
Tx data throughput: 4.676 KB/s
Transparent Service
Enable Mode
Rx data
Connection Interval: 18.75 ms 3.06 mA
Slave Latency: 0
(Write with response)
2.77 mA
3.9 mA
(Write with reliable
Burst Transmit)
Transparent Service
Enable Mode
Tx data
Connection Interval: 40 ms
Slave Latency: 0
2.14 mA
(Write with response)
3.03 mA
(Write with reliable
Burst Transmit)
Shut Down mode
Maximum Rx data throughput setting tested file size: 100 KB
Throughput:
4.956 KB/s (Write with response)
9.382 KB/s (Write with reliable
Burst Transmit)
Tested File size: 100 KB
Throughput:
2.494 KB/s (Write with response)
5.056 KB/s (Write with reliable
Burst Transmit)
1.44 μA
Note 1: Test condition: VBAT=3.3V, LED set off and measured in VBAT input.
2: Flash code version: BLEDK3 v1.03, UI version: IS187x_102_BLEDK3_UIv100.123.
3: Test phone: iPhone® 6+ with iOS 9.02.
4: Test application version: BLEDK3 V1.2.
5: UI set flow control and RX_IND.
6: For information on how to measure the current, refer to the “IS187x_BM7x BLEDK3 Application Note”.
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 39
BM70/71
NOTES:
DS60001372D-Page 40
 2015-2016 Microchip Technology Inc.
BM70/71
6.0
PACKAGING INFORMATION
6.1
BM70BLES1FC2
Figure 6-1 illustrates the BM70BLES1FC2 dimensions
and Figure 6-2 illustrates the recommended PCB footprint. Ensure that no top copper layer is near the test
pin area.
FIGURE 6-1:
BM70BLES1FC2 MODULE DIMENSIONS
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 41
BM70/71
FIGURE 6-2:
DS60001372D-Page 42
BM70BLES1FC2 RECOMMENDED PCB FOOTPRINT
 2015-2016 Microchip Technology Inc.
BM70/71
6.2
BM70BLE01FC2
Figure 6-3 illustrates the BM70BLE01FC2 dimensions and Figure 6-4 illustrates the recommended PCB footprint.
FIGURE 6-3:
BM70BLE01FC2 MODULE DIMENSIONS
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 43
BM70/71
FIGURE 6-4:
DS60001372D-Page 44
BM70BLE01FC2 RECOMMENDED PCB FOOT PRINT
 2015-2016 Microchip Technology Inc.
 2015-2016 Microchip Technology Inc.
6.3
BM71BLES1FC2
Figure 6-5 illustrates the BM71BLES1FC2 dimensions and Figure 6-6 illustrates the recommended PCB footprint. Ensure that no top copper layer is near
the test pin area.
FIGURE 6-5:
BM71BLES1FC2 MODULE DIMENSIONS
BM70/71
DS60001372D-Page 45
BM70/71
FIGURE 6-6:
DS60001372D-Page 46
BM71BLES1FC2 RECOMMENDED PCB FOOTPRINT
 2015-2016 Microchip Technology Inc.
 2015-2016 Microchip Technology Inc.
6.4
BM71BLE01FC2
Figure 6-7 illustrates the BM71BLE01FC2 dimensions and Figure 6-8 illustrates the recommended PCB footprint.
FIGURE 6-7:
BM71BLE01FC2 MODULE DIMENSIONS
BM70/71
DS60001372D-Page 47
BM70/71
FIGURE 6-8:
DS60001372D-Page 48
BM71BLE01FC2 RECOMMENDED PCB FOOTPRINT
 2015-2016 Microchip Technology Inc.
BM70/71
7.0
SOLDERING
RECOMMENDATIONS
The BM70/71 should be assembled using a standard
lead-free, re-flow profile IPC/JEDEC J-STD-020. The
module can be soldered to the host PCB using a standard lead or lead-free solder re-flow profiles, see
Figure 7-1.
For additional information on solder re-flow recommendations, refer to the “Solder Re-flow Recommendation
Application Note” (DS00233), which is available for
download from the Microchip web site at:
http://www.microchip.com.
To avoid any damage to the BM70/71, follow these recommendations:
• Do not exceed the peak temperature (TP) of
+250˚C
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If PCB requires multiple flows,
apply the module on the final flow.
FIGURE 7-1:
RE-FLOW PROFILE
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 49
BM70/71
NOTES:
DS60001372D-Page 50
 2015-2016 Microchip Technology Inc.
BM70/71
8.0
ORDERING GUIDE
Table 8-1 provides the ordering information for the
BM70/71 module.
TABLE 8-1:
BM70/71 MODULE VARIANTS
Module
Microchip
IC
BM70
IS1870SF
BM70
Shield
Pin
#
BT4.2 BLE Module,
External
12 mm x 15 mm x 1.6 mm
No
30
No
BM70BLE01FC2
IS1870SF
BT4.2 BLE Module,
12 mm x 22 mm x 2.4mm
On board
Yes
33
FCC, IC, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2
BM71
IS1871SF
BT4.2 BLE Module,
6 mm x 8 mm x 1.6 mm
External
No
17
No
BM71BLE01FC2
BM71
IS1871SF
BT4.2 BLE Module,
On board
9 mm x 11.5 mm x 2.1 mm
Yes
16
FCC, IC, CE,
BM71BLES1FC2
MIC, KCC, NCC
Note:
Description
Antenna
Regulatory
Certification
Part Number
The BM70/71 can be purchased by contacting your local Microchip sales office
(see last page). For pricing and a list of
distributors, visit Microchip web site:
http://www.microchip.com and for a list of
latest certifications visit www.microchip.com/wireless.
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 51
BM70/71
NOTES:
DS60001372D-Page 52
 2015-2016 Microchip Technology Inc.
BM70/BM71
APPENDIX A:
CERTIFICATION
NOTICES
The BM70 module (BM70BLES1FC2) has received the
regulatory approval for the following:
comply with all of the instructions provided by the
Grantee, which indicate installation and/or operating
conditions necessary for compliance.
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM70ABCDEFGH
• Canada
- IC ID: 12246A-BM70BLES1F2
- HVIN: BM70BLES1F2
• Europe/CE
• Japan/MIC: 202-SMD069
• Korea/KCC: MSIP-CRM-mcp-BM70BLES1FC2
• Taiwan/NCC No: CCAN15LP0500T1
• China/SRRC: CMIIT ID: 2015DJ7135
The finished product is required to comply with all applicable FCC equipment authorizations regulations,
requirements and equipment functions not associated
with the transmitter module portion. For example, compliance must be demonstrated to regulations for other
transmitter components within the host product; to
requirements for unintentional radiators (Part 15 Subpart B "Unintentional Radiators"), such as digital
devices, computer peripherals, radio receivers, etc.;
and to additional authorization requirements for the
non-transmitter functions on the transmitter module
(i.e., Verification, or Declaration of Conformity) (e.g.,
transmitter modules may also contain digital logic functions) as appropriate.
The BM71 module (BM71BLES1FC2) has received the
regulatory approval for the following:
A.1.2
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM71S2
• Canada
- IC ID: 12246A-BM71S2
- HVIN: BM71BLES1FC2
• Europe/CE
• Japan/MIC: 005-101150
• Korea/KCC: MSIP-CRM-mcp-BM71BLES1FC2
• Taiwan/NCC No: CCAN16LP0010T5
The BM70/BM71 has been labeled with its own FCC ID
number, and if the FCC ID is not visible when the module is installed inside another device, then the outside
of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label can use wording
as follows:
For the BM70:
A.1
REGULATORY APPROVAL
This section outlines the regulatory information for the
BM70/BM71 for the following countries:
•
•
•
•
•
•
•
•
United States
Canada
Europe
Japan
Korea
Taiwan
China
Other Regulatory Jurisdictions
A.1.1
UNITED STATES
The BM70/BM71 has received Federal Communications Commission (FCC) CFR47 Telecommunications,
Part 15 Subpart C "Intentional Radiators" modular
approval in accordance with Part 15.212 Modular
Transmitter approval. Modular approval allows the end
user to integrate the BM70/BM71 into a finished product without obtaining subsequent and separate FCC
approvals for intentional radiation, provided no
changes or modifications are made to the module circuitry. Changes or modifications could void the user's
authority to operate the equipment. The end user must
 2015-2016 Microchip Technology Inc.
LABELING AND USER
INFORMATION REQUIREMENTS
Contains Transmitter Module
FCC ID:A8TBM70ABCDEFGH
or
Contains FCC ID: A8TBM70ABCDEFGH
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation
For the BM71:
Contains Transmitter Module
FCC ID: A8TBM71S2
or
Contains FCC ID: A8TBM71S2
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation
On the BM71, due to the limited module size
(9.0 mm x 11.5 mm), the FCC identifier is displayed in
the data sheet only and it can not be displayed on the
module label.
DS60001372D-Page 53
BM70/BM71
A user's manual for the finished product should include
the following statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV
technician for help.
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748, which is available at the FCC
Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
A.1.3
From the FCC Grant: Output power listed is conducted.
This grant is valid only when the module is sold to OEM
integrators and must be installed by the OEM or OEM
integrators. This transmitter is restricted for use with
the specific antenna(s) tested in this application for
Certification and must not be co-located or operating in
conjunction with any other antenna or transmitters
within a host device, except in accordance with FCC
multi-transmitter product procedures. This module is
approved for installation into mobile or/and portable
host platforms
HELPFUL WEB SITES
Federal
Communications
http://www.fcc.gov
DS60001372D-Page 54
A.2
Canada
The BM70/BM71 has been certified for use in Canada
under Industry Canada (IC) Radio Standards Specification (RSS) RSS-247 and RSS-Gen. Modular approval
permits the installation of a module in a host device
without the need to recertify the device.
A.2.1
LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the Host Device (from Section 3.1, RSS-Gen, Issue 4, November 2014): The host
device shall be properly labeled to identify the module
within the host device.
On BM71, due to the limited module size
(9.0 mm x 11.5 mm) the IC identifier is displayed in the
data sheet only and can not be displayed on the module label.
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording
expressing the same meaning, as follows:
For the BM70:
Contains transmitter module
IC: 12246A-BM70BLES1F2
For the BM71:
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining
whether proposed or existing transmitting facilities,
operations or devices comply with limits for human
exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
A.1.4
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm.
Commission
(FCC):
Contains transmitter module
IC: 12246A-BM71S2
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 4, November
2014): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alternatively on the device or both:
This device complies with Industry Canada
license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device
may not cause interference, and (2) this device must
accept any interference, including interference that
may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même
si le brouillage est susceptible d'en compromettre le
fonctionnement.
 2015-2016 Microchip Technology Inc.
BM70/BM71
Transmitter Antenna (from Section 8.3, RSS-Gen,
Issue 4, November 2014): User manuals for transmitters shall display the following notice in a conspicuous
location:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type
and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its
gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec
une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il
faut choisir le type d'antenne et son gain de sorte que
la puissance isotrope rayonnée équivalente (p.i.r.e.)
ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
The preceding notice may be affixed to the device
instead of displayed in the user manual.
A.2.2
RF EXPOSURE
All transmitters regulated by IC must comply with RF
exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).
A.2.3
HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
A.3
Europe
The R&TTE Compliance Association provides guidance on modular devices in the document “Technical
Guidance Note 01” which is available for download
from the following location:
http://www.rtteca.com/html/download_area.htm.
To maintain conformance to the testing listed in
Table A-1/Table A-2: European Compliance Testing,
the module shall be installed in accordance with the
installation instructions in this data sheet and shall
not be modified.
When integrating a radio module into a completed
product the integrator becomes the manufacturer of
the final product and is therefore responsible for
demonstrating compliance of the final product with
the essential requirements of the R&TTE Directive.
A.3.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/BM71 must follow CE marking requirements.
The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE
marking.
A.3.2
ANTENNA REQUIREMENTS
From the R&TTE Compliance Association document
Technical Guidance Note 01.
Provided the integrator installing an assessed radio
module with an integral or specific antenna and
installed in conformance with the radio module manufacturer's installation instructions requires no further
evaluation.Under Article 3.2 of the R&TTE Directive
and does not require further involvement of an
R&TTE Directive Notified Body for the final product.
[Section 2.2.4]
The BM70/BM71 is an R&TTE Directive assessed
radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product.
The BM70/BM71 has been tested to R&TTE Directive
1999/5/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility
(EMC) (Article 3.1(b)), and Radio (Article 3.2) and are
summarized in Table A-1/Table A-2. A Notified Body
Opinion has also been issued.
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 55
BM70/BM71
The European Compliance Testing listed in Table A-1
and Table A-2 were performed using the integral
ceramic chip antenna.
TABLE A-1:
EUROPEAN COMPLIANCE TESTING (BM70)
Certification
Safety
Standards
Article
EN60950-1:2006/A11:2009/A1:2010/
A12:2011/A2:2013
[3.1(a)]
Health
EN62479:2010
EMC
EN301489-1 V1.9.2
EN300328 V1.9.1
Notified Body
Opinion
TABLE A-2:
[3.1(b)]
10051137 002
10053580 001
—
10048935 001
Article
EN60950-1:2006/A11:2009/A1:2010/
A12:2011/A2:2013
[3.1(a)]
EN62479:2010
EMC
EN301489-1 V1.9.2
EN300328 V1.9.1
Notified Body
Opinion
HELPFUL WEB SITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are:
• Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
• European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards Institute (ETSI):
http://www.etsi.org
• European Radio Communications Office (ERO):
http://www.ero.dk
• The Radio and Telecommunications Terminal
Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com
DS60001372D-Page 56
Laboratory
Report Number
10053210 001
[3.1(b)]
EN301489-17 V2.2.1
A.3.3
10053580 001
(3.2)
Standards
Health
Radio
TUV
Rheinland
EUROPEAN COMPLIANCE TESTING (BM71)
Certification
Safety
Report Number
10051261 003
EN301489-17 V2.2.1
Radio
Laboratory
TUV
Rheinland
10053433 001
10052964 001
(3.2)
10053433 001
—
10048936 001
A.4
Japan
The BM70/BM71 has received type certification and is
labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their conformance laboratory to determine if this testing is
required.
• There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered
by VCCI: http://www.vcci.jp/vcci_e/index.html
 2015-2016 Microchip Technology Inc.
BM70/BM71
A.4.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/BM71 must follow Japan marking requirements.
The integrator of the module should refer to the labeling
requirements for Japan available at the Ministry of
Internal Affairs and Communications (MIC) website.
The BM70 is labeled with its own technical conformity
mark and certification number. The final product in
which this module is being used must have a label
referring to the type certified module inside:
On the BM71, due to the limited module size
(9.0 mm x 11.5 mm) the KC mark and identifier is displayed in the data sheet only and can not be displayed
on the module label. The final product requires the KC
mark and certificate number of the module:
A.5.2
HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr
National Radio Research Agency (RRA):
http://rra.go.kr
On BM71, due to the limited module size
(9.0 mm x 11.5 mm) the Japan identifier is displayed in
the data sheet only and can not be displayed on the
module label. The final product in which this module is
being used must have a label referring to the type
certified module inside:
A.6
Taiwan
The BM70/BM71 has received compliance approval in
accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their
product should contact Microchip Technology sales or
distribution partners to obtain a Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
A.4.2
HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
A.5
LABELING AND USER
INFORMATION REQUIREMENTS
The BM70 is labeled with its own NCC mark and certificate number as follows:
Korea
The BM70/BM71 has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require
additional radio certification provided installation
instructions are followed and no modifications of the
module are allowed.
A.5.1
A.6.1
On the BM71, due to the limited module size
(9.0 mm x 11.5 mm) the NCC mark and identifier is displayed in the data sheet only and can not be displayed
on the module label.
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/BM71 must follow KC marking requirements.
The integrator of the module should refer to the labeling
requirements for Korea available on the Korea Communications Commission (KCC) website.
The BM70 module is labeled with its own KC mark. The
final product requires the KC mark and certificate number of the module:
The user's manual should contain following warning
(for RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 57
BM70/BM71
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
A.6.2
HELPFUL WEB SITES
National Communications
http://www.ncc.gov.tw
A.7
Commission
(NCC):
China
The BM70 has received certification of conformity in
accordance with the China MIIT Notice 2014-01 of
State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification,
provided installation instructions are followed and no
modifications of the module are allowed.
A.7.1
LABELING AND USER
INFORMATION REQUIREMENTS
The BM70 module is labeled with its own CMIIT ID as
follows:
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must carry a label containing the statement “This device contains SRRC
approved Radio module CMIIT ID: 2015DJ7135”.
A.8
Other Regulatory Jurisdictions
Should other regulatory jurisdiction certification be
required by the customer, or the customer need to
recertify the module for other reasons, contact Microchip for the required utilities and documentation.
DS60001372D-Page 58
 2015-2016 Microchip Technology Inc.
BM70/71
APPENDIX B:
B.1
REVISION HISTORY
Revision A (October 2015)
This is the initial released version of the document.
B.2
Revision B (October 2015)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
TABLE B-1:
MAJOR SECTION UPDATES
Section
Section “Features”
Update Description
This section is updated with certification informations. The data
from this section has been reformatted and distributed in other sections.
Section “MAC/Baseband/Higher Layer Fea- These sections are newly added.
tures”, Section “Power Management”,
“Operating Conditions”,and Section
“Antenna”
Section “General Description”
This section was previously placed in chapter 1 and has been
moved here.
Section 1.0 “Device Overview”
Table 1-2, Table 1-4, and Table 1-5 are added.
Section 2.0 “Application information”
This chapter contains information that was previously located in
Appendix A and Electrical Characteristics.
Section 8.0 “Ordering Guide”
Table 8-1 is updated with Y-axis information and certification information.
Section Appendix B: “Revision History”
This section is updated with images for the Certification Marking
and their numbers. The regulatory information is updated to be the
latest.
Section 5.0 “Electrical Characteristics”
Table 5-3 is added
Revision C (November 2015)
Updated Appendix A: “Certification Notices”.
Revision D (March 2016)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
Section
Update Description
1.1 “Interface Description”
This section is updated with a note.
Updated Figure 1-1, Figure 1-2, Figure 1-6
2.1 “Reference Schematics”
Figure 2-1 through Figure 2-8, Figure 2-10, Figure 5-1, Figure 5-2,
Figure 2-11, Figure 4-1 and Table 4-1, Table 8-1
5.1 “Absolute Maximum Ratings”
Updated this section.
5.2.1 “Tx/Rx current consumption details”
Updated this section with new content.
8.0 “Ordering Guide”
This section is updated with a note.
Appendix A: “Certification Notices”
Content has been updated
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 59
BM70/71
NOTES:
DS60001372D-Page 60
 2015-2016 Microchip Technology Inc.
BM70/71
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2015-2016 Microchip Technology Inc.
DS60001372D-Page 61
BM70/71
NOTES:
DS60001372D-Page 62
 2015-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2015-2016 Microchip Technology Inc.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN:978-1-5224-0410-1
DS60001372D-Page 63
Worldwide Sales and Service
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 2015-2016 Microchip Technology Inc.