MC74AC574, MC74ACT574 Octal D Flip-Flop with 3-State Outputs The MC74AC574/74ACT574 is a high–speed, low power octal flip–flop with a buffered common Clock (CP) and a buffered common Output Enable (OE). The information presented to the D inputs is stored in the flip–flops on the LOW–to–HIGH Clock (CP) transition. The MC74AC574/74ACT574 is functionally identical to the MC74AC374/74ACT374 except for the pinouts. • Inputs and Outputs on Opposite Sides of Package • • • • • http://onsemi.com PDIP–20 N SUFFIX CASE 738 20 Allowing Easy Interface with Microprocessors Useful as Input or Output Port for Microprocessors Functionally Identical to MC74AC374/74ACT374 3-State Outputs for Bus-Oriented Applications Outputs Source/Sink 24 mA ′ACT574 Has TTL Compatible Inputs 1 SO–20 DW SUFFIX CASE 751 20 1 20 1 VCC O0 O1 O2 O3 O4 O5 O6 O7 CP 20 19 18 17 16 15 14 13 12 11 TSSOP–20 DT SUFFIX CASE 948E EIAJ–20 M SUFFIX CASE 967 20 1 ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 OE D0 D1 D2 D3 D4 D5 D6 D7 GND Figure 1. Pinout: 20–Lead Packages Conductors (Top View) PIN ASSIGNMENT Device Package Shipping MC74AC574N PDIP–20 18 Units/Rail MC74ACT574N PDIP–20 18 Units/Rail MC74AC574DW SOIC–20 38 Units/Rail MC74AC574DWR2 SOIC–20 1000 Tape & Reel MC74ACT574DW SOIC–20 38 Units/Rail MC74ACT574DWR2 SOIC–20 1000 Tape & Reel 75 Units/Rail PIN FUNCTION D0–D7 Data Inputs MC74AC574DT TSSOP–20 CP Clock Pulse Input MC74AC574DTR2 TSSOP–20 2500 Tape & Reel OE 3–State Output Enable Input MC74ACT574DT TSSOP–20 O0–O7 3–State Outputs MC74ACT574DTR2 TSSOP–20 2500 Tape & Reel 75 Units/Rail MC74AC574M EIAJ–20 40 Units/Rail MC74AC574MEL EIAJ–20 2000 Tape & Reel MC74ACT574M EIAJ–20 40 Units/Rail MC74ACT574MEL EIAJ–20 2000 Tape & Reel DEVICE MARKING INFORMATION See general marking information in the device marking section on page 8 of this data sheet. Semiconductor Components Industries, LLC, 2001 May, 2001 – Rev. 6 1 Publication Order Number: MC74AC574/D MC74AC574, MC74ACT574 FUNCTION TABLE D0 D1 D2 D3 D4 D5 D6 D7 CP Inputs Outputs F nction Function OE O0 O1 O2 O3 O4 O5 O6 O7 Figure 2. Logic Symbol FUNCTIONAL DESCRIPTION The MC74AC574/74ACT574 consists of eight edgetriggered flip–flops with individual D–type inputs and 3–state true outputs. The buffered clock and buffered Output Enable are common to all flip–flops. The eight flip–flops will store the state of their individual D inputs that meet the setup and hold time requirements on the LOW–to–HIGH Clock (CP) transition. With the Output Enable (OE) LOW, the contents of the eight flip–flops are available at the outputs. When OE is HIGH, the outputs go to the high impedance state. Operation of the OE input does not affect the state of the flip–flops. D0 Internal D1 OE CP D Q On H H H H L L L L H H L H L H L H L H NC NC L H L H NC NC Z Z Z Z L H NC NC H H Hold Hold Load Load Data Available Data Available No Change in Data No Change in Data H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance = LOW-to-HIGH Clock Transition NC = No Change D2 D3 D4 D5 D6 D7 CP C D C D C D C D C D C C D D C Q Q Q Q Q Q Q Q O0 O1 O2 O3 O4 O5 O6 O7 OE NOTE: This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) –0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) –0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature –65 to +150 °C * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. http://onsemi.com 2 D MC74AC574, MC74ACT574 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max Unit ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 – VCC VCC @ 3.0 V – 150 – VCC @ 4.5 V – 40 – VCC @ 5.5 V – 25 – VCC @ 4.5 V – 10 – VCC @ 5.5 V – 8.0 – – – 140 °C –40 25 85 °C V V ns/V tr, tf In ut Rise and Fall Time (Note 2) Input ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current – High – – –24 mA IOL Output Current – Low – – 24 mA ns/V 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 3 MC74AC574, MC74ACT574 DC CHARACTERISTICS Symbol VIH VIL VOH VOL Parameter Minimum High g Level I Input V Voltage l Maximum Low Level I Input V Voltage l Minimum High g Level O Output V Voltage l Maximum Low Level O V l Output Voltage IIN Maximum a u Input u Leakage Current IOLD IOHD †Minimum Dynamic † y Output Current ICC Maximum a u Quiescent Qu esce Supply Current VCC (V) 74AC 74AC TA = +25°C TA = –40°C to +85°C Unit Conditions Typ Guaranteed Limits 3.0 1.5 2.1 2.1 4.5 2.25 3.15 3.15 5.5 2.75 3.85 3.85 3.0 1.5 0.9 0.9 4.5 2.25 1.35 1.35 5.5 2.75 1.65 1.65 3.0 2.99 2.9 2.9 4.5 4.49 4.4 4.4 5.5 5.49 5.4 5.4 3.0 – 2.56 2.46 4.5 – 3.86 3.76 5.5 – 4.86 4.76 3.0 0.002 0.1 0.1 4.5 0.001 0.1 0.1 5.5 0.001 0.1 0.1 3.0 – 0.36 0.44 4.5 – 0.36 0.44 5.5 – 0.36 0.44 55 5.5 – ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND 5.5 – – 75 mA 5.5 – – –75 mA VOLD = 1.65 V Max VOHD = 3.85 V Min 55 5.5 – 80 8.0 80 µA VIN = VCC or GND V VOUT = 0.1 V or VCC – 0.1 V V VOUT = 0.1 V or VCC – 0.1 V IOUT = –50 µA V V 4 IOH –24 mA –24 mA IOUT = 50 µA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA * All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: Note: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com *VIN = VIL or VIH –12 mA MC74AC574, MC74ACT574 AC CHARACTERISTICS (For Figures and Waveforms — See Section 3) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. fmax Maximum Clock Frequency 3.3 5.0 75 95 – – – – 60 85 – – MHz 3–3 tPLH Propagation Delay CP to On 3.3 5.0 3.5 2.0 – – 13.5 9.5 3.5 2.0 15 11 ns 3–6 tPHL Propagation Delay CP to On 3.3 5.0 3.5 2.0 – – 12 8.5 3.5 2.0 13.5 9.5 ns 3–6 tPZH Output Enable Time 3.3 5.0 2.5 2.0 – – 11 8.5 2.5 2.0 12 9.0 ns 3–7 tPZL Output Enable Time 3.3 5.0 3.0 1.5 – – 10.5 8.0 3.5 2.0 11.5 9.0 ns 3–8 tPHZ Output Disable Time 3.3 5.0 4.0 2.0 – – 12 9.5 4.5 2.0 13 10.5 ns 3–7 tPLZ Output Disable Time 3.3 5.0 2.0 1.5 – – 9.0 7.5 2.5 1.5 10 8.5 ns 3–8 Unit Fig. No. * Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. AC OPERATING REQUIREMENTS Symbol VCC* (V) Parameter Typ 74AC 74AC TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Guaranteed Minimum ts Setup Time, HIGH or LOW Dn to CP 3.3 5.0 – – 2.5 1.5 3.0 2.0 ns 3–9 th Hold Time, HIGH or LOW Dn to CP 3.3 5.0 – – 1.5 1.5 1.5 1.5 ns 3–9 tw CP Pulse Width HIGH or LOW 3.3 5.0 – – 6.0 4.0 7.0 5.0 ns 3–6 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 5 MC74AC574, MC74ACT574 DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = –40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum u High g Level e e Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC – 0.1 V VIL Maximum a u Low o Level e e Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC – 0.1 V VOH Minimum u High g Level e e Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 – – 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 – – 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND 1.5 mA VI = VCC – 2.1 V VOL Maximum a u Low o Level e e Output Voltage IOUT = –50 µA *VIN = VIL or VIH –24 mA IOH –24 mA V IOUT = 50 µA V IIN Maximum a u Input u Leakage Current 55 5.5 – ∆ICCT Additional Max. ICC/Input 5.5 0.6 IOZ Maximum a u 3-State C Current 5.5 – ±0.5 ±5.0 µA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min 55 5.5 – 80 8.0 80 µA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic O t t Current Output C t Maximum a u Quiescent Qu esce Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms — See Section 3) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. fmax ma Maximum Clock Frequency 50 5.0 100 – – 85 – ns 3–3 tPLH Pro agation Delay Propagation CP to On 50 5.0 25 2.5 – 11 20 2.0 12 ns 3–6 tPHL Pro agation Delay Propagation CP to On 50 5.0 20 2.0 – 10 15 1.5 11 ns 3–6 tPZH Output Enable Time 5.0 2.0 – 9.5 1.5 10 ns 3–7 tPZL Output Enable Time 5.0 2.0 – 9.0 1.5 10 ns 3–8 tPHZ Output Disable Time 5.0 2.0 – 10.5 1.5 11.5 ns 3–7 tPLZ Output Disable Time 5.0 2.0 – 8.5 1.5 9.0 ns 3–8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 6 MC74AC574, MC74ACT574 AC OPERATING REQUIREMENTS Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Typ Unit Fig. No. Guaranteed Minimum ts Setu Time, HIGH or LOW Setup Dn to CP 50 5.0 – 25 2.5 25 2.5 ns 3–9 th Hold Time, HIGH or LOW Dn to CP 50 5.0 – 10 1.0 10 1.0 ns 3–9 tw CP Pulse Width HIGH or LOW 50 5.0 – 30 3.0 40 4.0 ns 3–6 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 40 pF VCC = 5.0 V http://onsemi.com 7 MC74AC574, MC74ACT574 MARKING DIAGRAMS PDIP–20 SO–20 MC74AC574N AWLYYWW AC574 AWLYYWW MC74ACT574N AWLYYWW ACT574 AWLYYWW A WL, L YY, Y WW, W TSSOP–20 EIAJ–20 AC 574 ALYW 74AC574 AWLYWW ACT 574 ALYW 74ACT574 AWLYWW = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 8 MC74AC574, MC74ACT574 PACKAGE DIMENSIONS PDIP–20 N SUFFIX 20 PIN PLASTIC DIP PACKAGE CASE 738–03 ISSUE E –A– 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C –T– K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0 15 0.51 1.01 SO–20 DW SUFFIX 20 PIN PLASTIC SOIC PACKAGE CASE 751D–05 ISSUE F A 20 X 45 h 1 10 20X B B 0.25 M T A S B S A L H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 18X e A1 SEATING PLANE C T http://onsemi.com 9 DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0 7 MC74AC574, MC74ACT574 PACKAGE DIMENSIONS TSSOP–20 DT SUFFIX 20 PIN PLASTIC TSSOP PACKAGE CASE 948E–02 ISSUE A 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U V S S 11 J J1 B L –U– PIN 1 IDENT ÍÍÍ ÍÍÍ ÍÍÍ K K1 SECTION N–N 1 10 0.25 (0.010) N 0.15 (0.006) T U S M A –V– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M N F DETAIL E –W– C G D H DETAIL E 0.100 (0.004) –T– SEATING MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 PLANE EIAJ–20 M SUFFIX 20 PIN PLASTIC EIAJ PACKAGE CASE 967–01 ISSUE O 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M L 10 DETAIL P Z D VIEW P e A c A1 b 0.13 (0.005) M 0.10 (0.004) http://onsemi.com 10 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --0.032 MC74AC574, MC74ACT574 Notes http://onsemi.com 11 MC74AC574, MC74ACT574 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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