TI1 DS99R124AQSQE Ds99r124aq 5 - 43 mhz 18-bit color fpd-link ii to fpd-link converter Datasheet

DS99R124AQ
DS99R124AQ 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter
Literature Number: SNLS342
DS99R124AQ
5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter
General Description
Features
The DS99R124AQ converts FPD-Link II to FPD-Link. It translates a high-speed serialized interface with an embedded
clock over a single pair (FPD-Link II) to three LVDS data/control streams and one LVDS clock pair (FPD-Link). This serial
bus scheme greatly eases system design by eliminating skew
problems between clock and data, reduces the number of
connector pins, reduces the interconnect size, weight, and
cost, and overall eases PCB layout. In addition, internal DC
balanced decoding is used to support AC-coupled interconnects.
The DS99R124AQ converter recovers the data (RGB) and
control signals and extracts the clock from a serial stream
(FPD-Link II). It is able to lock to the incoming data stream
without the use of a training sequence or special SYNC patterns and does not require a reference clock. A link status
(LOCK) output signal is provided.
Adjustable input equalization of the serial input stream provides compensation for transmission medium losses of the
cable and reduces the medium-induced deterministic jitter.
EMI is minimized by the use of low voltage differential signaling, output state select feature, and additional output spread
spectrum generation.
With fewer wires to the physical interface of the display, FPDLink output with LVDS technology is ideal for high speed, low
power and low EMI data transfer.
The DS99R124AQ is offered in a 48-pin LLP package and is
specified over the automotive AEC-Q100 Grade 2 temperature range of -40˚C to +105˚C.
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5 – 43 MHz support (140 Mbps to 1.2 Gbps Serial Link)
4-channel (3 data + 1 clock) FPD-Link LVDS outputs
3 low-speed over-sampled LVCMOS outputs
AC Coupled STP Interconnect up to 10 meters in length
Integrated input termination
@ Speed link BIST mode and reporting pin
Optional I2C compatible Serial Control Bus
RGB666 + VS, HS, DE converted from 1 pair
Power down mode minimizes power dissipation
FAST random data lock; no reference clock required
Adjustable input receive equalization
LOCK (real time link status) reporting pin
Low EMI FPD-Link output
SSCG option for lower EMI
1.8V or 3.3V compatible I/O interface
Automotive grade product: AEC-Q100 Grade 2 qualified
>8 kV HBM and ISO 10605 ESD Rating
Applications
■ Automotive Display for Navigation
■ Automotive Display for Entertainment
Applications Diagram
30154927
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2011 National Semiconductor Corporation
301549
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DS99R124AQ 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter
July 15, 2011
DS99R124AQ
DS99R124AQ Pin Diagram
30154919
FPD-Link II to FPD-Link Convertor - DS99R124AQ
Pin Descriptions
Pin Name
Pin #
I/O, Type
Description
FPD-Link II Input Interface
RIN+
40
I, LVDS
True input
The input must be AC coupled with a 100 nF capacitor. Internal termination.
RIN-
41
I, LVDS
Inverting input
The input must be AC coupled with a 100 nF capacitor. Internal termination.
CMF
42
I, Analog
Common-Mode Filter
VCM center-tap is a virtual ground which maybe ac-coupled to ground to increase receiver
common mode noise immunity. Recommended value is 4.7 μF or higher.
FPD-Link Output Interface
TxOUT[2:0]+
19, 21, 23
O, LVDS
True LVDS Data Output
This pair should have a 100 Ω termination for standard LVDS levels.
TxOUT[2:0]-
20, 22, 24
O, LVDS
Inverting LVDS Data Output
This pair should have a 100 Ω termination for standard LVDS levels.
TxCLKOUT+
17
O, LVDS
True LVDS Clock Output
This pair should have a 100 Ω termination for standard LVDS levels.
TxCLKOUT-
18
O, LVDS
Inverting LVDS Clock Output
This pair should have a 100 Ω termination for standard LVDS levels.
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2
Pin #
I/O, Type
Description
LVCMOS Outputs
OS[2:0]
12, 11, 10
O, LVMOS
Over-Sampled Low Frequency Outputs
These bits map to the DS99R421's OS[2:0] over-sampled low-frequency inputs. Signals
must be slower the TxCLK/5. On the DS90UR241 these map to the DIN[23:21] inputs. OS0
= DIN21, OS1 = DIN22, OS2 = DIN23.
LOCK
27
O, LVMOS
LOCK Status Output
LOCK = 1, PLL is locked, outputs are active.
LOCK = 0, PLL is unlocked, output states determined by OSS_SEL.
Maybe used as a Link Status or to flag when the Video Data is active (ON/OFF).
Control and Configuration
PDB
1
I, LVCMOS
w/ pull-down
Power Down Mode Input
PDB = 1, Device is enabled (normal operation)
PDB = 0, Device is in power-down, the output are controlled by the settings. Control registers
are RESET.
VODSEL
33
I, LVCMOS
w/ pull-down
Differential Driver Output Voltage Select
VODSEL = 1, LVDS VOD is ±400 mV, 800 mVp-p (typ) — Long Cable / De-E Applications
VODSEL = 0, LVDS VOD is ±250 mV, 500 mVp-p (typ)
SeeTable 2
OEN
34
I, LVCMOS
w/ pull-down
Output Enable Input
OEN = 1, FPD-Link outputs are enabled (active).
OEN = 0, FPD-Link outputs are TRI-STATE.
OSS_SEL
35
I, LVCMOS
w/ pull-down
Output Sleep State Select Input
See Table 1
LFMODE
36
I, LVCMOS
w/ pull-down
Low Frequency Mode — Pin or Register Control
LF_MODE = 1, low frequency mode (TxCLKOUT = 5-20 MHz)
LF_MODE = 0, high frequency mode (TxCLKOUT = 20-43 MHz)
SSC[2:0]
7, 3, 2
I, LVCMOS
w/ pull-down
Spread Spectrum Clock Generation (SSCG) Range Select
SeeTable 3 and Table 4
RES[1:0]
37, 15
I, LVCMOS
w/ pull-down
Reserved
Tie Low
Control and Configuration — STRAP PIN
For a High State, use a 10 kΩ pull up to VDDIO; for a Low State, the IO includes an internal pull down. The STRAP pin is read upon
power-up and set device configuration. Pin number listed along with shared LVCMOS Output name in square bracket.
EQ
28 [PASS]
STRAP
I, LVCMOS
w/ pull-down
EQ Gain Control of FPD-Link II Input
EQ = 1, EQ gain is enabled (~13 dB)
EQ = 0, EQ gain is disabled (~1.625 dB)
Optional BIST Mode
BISTEN
29
I, LVCMOS
w/ pull-down
BIST Enable Input – Optional
BISTEN = 1, BIST Mode is enabled.
BISTEN = 0, normal mode.
BISTM
30
I, LVCMOS
w/ pull-down
BIST Mode Input – Optional
BISTM = 1, selects Payload Error Mode
BISTM = 0, selects Pass / Fail Result-Only Mode
PASS
28
O, LVCMOS
PASS Output (BIST Mode) – Optional
PASS = 1, no errors detected
PASS = 0, errors detected
Leave open if unused. Route to a test point (pad) recommended.
Optional Serial Bus Control Interface
SCL
5
I, LVCMOS
Serial Control Bus Clock Input - Optional
SCL requires an external pull-up resistor to VDDIO.
SDA
4
I/O,
LVCMOS
Open Drain
Serial Control Bus Data Input / Output - Optional
SDA requires an external pull-up resistor to VDDIO.
3
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DS99R124AQ
Pin Name
DS99R124AQ
Pin Name
Pin #
I/O, Type
Description
ID[x]
16
I, Analog
Serial Control Bus Device ID Address Select — Optional
Resistor to Ground and 10 kΩ pull-up to 1.8V rail. See Table 5.
Power and Ground
VDDL
6, 31
Power
Logic Power, 1.8 V ±5%
VDDA
38, 43
Power
Analog Power, 1.8 V ±5%
VDDP
8, 46, 47
Power
SSC Generator Power, 1.8 V ±5%
VDDTX
13
Power
FPD-Link Power, 3.3 V ±10%
VDDIO
25
Power
LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10%
GND
9, 14, 26,
32, 39, 44,
45, 48
Ground
Ground
DAP
DAP
Ground
DAP is the large metal contact at the bottom side, located at the center of the LLP package.
Connected to the ground plane (GND) with at least 9 vias.
NOTE: 1 = HIGH, 0 = LOW
Ordering Information
NSID
Package Description
Quantity
SPEC
Package ID
DS99R124AQSQE
48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch
250
NOPB
SQA48A
DS99R124AQSQ
48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch
1000
NOPB
SQA48A
DS99R124AQSQX
48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch
2500
NOPB
SQA48A
Note: Automotive Grade (Q) product incorporates enhanced manufacturing and support processes for the automotive market,
including defect detection methodologies. Reliability qualification is compliant with the requirements and temperature grades
defined in the AEC Q100 standard. Automotive Grade products are identified with the letter Q. For more information go to
http://www.national.com/automotive.
Block Diagram
30154929
FPD-Link II to FPD-Link Convertor
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4
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage – VDDn (1.8V)
Supply Voltage – VDDTX (3.3V)
Supply Voltage – VDDIO
LVCMOS I/O Voltage
Receiver Input Voltage
LVDS Output Voltage
Junction Temperature
Storage Temperature
Lead Temperature
(Soldering, 4s)
48L LLP Package
Maximum Power Dissipation
Capacity at 25°C
Derate above 25°C
−0.3V to +2.5V
−0.3V to +4.0V
−0.3V to +4.0V
−0.3V to +(VDDIO + 0.3V)
−0.3V to (VDD + 0.3V)
−0.3V to (VDDTX + 0.3V)
+150°C
−65°C to +150°C
ESD Rating (ISO10605), RD = 2kΩ, CS = 150 & 330pF
Air Discharge
(RIN+, RIN−)
≥±15 kV
Contact Discharge
(RIN+, RIN−)
≥±8 kV
ESD Rating (HBM)
≥±8 kV
ESD Rating (MM)
+260°C
θJA
1/ θJA°C/W
27.7 °C/W
θJC
3.0 °C/W
≥±1.25 kV
≥±250 V
ESD Rating (CDM)
Recommended Operating
Conditions
Supply Voltage (VDDn)
LVCMOS Supply
Voltage (VDDIO)
LVCMOS Supply
Voltage (VDDIO)
Operating Free Air
Temperature (TA)
TxCLK Clock Frequency
Supply Noise (Note 7)
ESD Rating (IEC, powered-up only), RD = 330Ω, CS = 150pF
Air Discharge
(RIN+, RIN−)
≥±30 kV
Contact Discharge
(RIN+, RIN−)
≥±6 kV
Min
1.71
1.71
Nom
1.8
1.8
Max
1.89
1.89
Units
V
V
3.0
3.3
3.6
V
−40
+25
+105
°C
43
100
MHz
mVP-P
5
DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2, Note 3) and (Note 4)
Symbol
Parameter
Conditions
Pin/Freq.
Min
Typ
Max
Units
VODSEL = L
100
250
400
mV
VODSEL = H
200
400
600
mV
FPD-Link LVDS Output
|VOD|
Differential Output Voltage
VODp-p
Differential Output Voltage
A-B
ΔVOD
Output Voltage Unbalance
RL = 100Ω
VOS
Offset Voltage
ΔVOS
Offset Voltage Unbalance
IOS
Output Short Circuit Current
Vout = GND
Output TRI-STATE® Current
OEN = GND,
Vout =VDDTX, or GND
IOZ
VODSEL = L
500
mVp-p
VODSEL = H
800
mVp-p
TxCLKOUT+,
TxCLKOUT-,
VODSEL = L
TxOUT[2:0]+,
VODSEL = H TxOUT[2:0]-
1.0
1
50
mV
1.2
1.5
V
1.2
1
V
50
-5
mV
mA
-10
+10
µA
2.2
VDDIO
V
GND
0.8
V
+15
μA
3.3 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 3.0 to 3.6V
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
IIN
Input Current
PDB,
VODSEL,
OEN,
OSS_SEL,
LFMODE,
SSC[2:0],
BISTEN,
BISTM
VIN = 0V or VDDIO
5
−15
±1
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DS99R124AQ
ESD Rating (ISO10605), RD = 330Ω, CS = 150 & 330pF
Air Discharge
(RIN+, RIN−)
≥±15 kV
Contact Discharge
(RIN+, RIN−)
≥±8 kV
Absolute Maximum Ratings (Note 1)
DS99R124AQ
Symbol
Parameter
Conditions
VOH
High Level Output Voltage
IOH = −0.5 mA
VOL
Low Level Output Voltage
IOL = +0.5 mA
IOS
Output Short Circuit Current
VOUT = 0V
TRI-STATE® Output Current
PDB = 0V, OSS_SEL = 0V,
VOUT = 0V or VDDIO
IOZ
Pin/Freq.
Min
Typ
VDDIO0.2
VDDIO
LOCK,
PASS, OS
[2:0]
GND
Max
Units
V
0.2
-10
V
mA
−10
+10
µA
0.7
VDDIO
VDDIO
V
GND
0.35*
VDDIO
V
+10
μA
1.8 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 1.71 to 1.89V
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
IIN
Input Current
VIN = 0V or VDDIO
VOH
High Level Output Voltage
IOH = −0.1 mA
VOL
Low Level Output Voltage
IOL = +0.1 mA
IOS
Output Short Circuit Current
VOUT = 0V
IOZ
TRI-STATE Output Current
VOUT = 0V or VDDIO
PDB,
VODSEL,
OEN,
OSS_SEL,
LFMODE,
SSC[2:0],
BISTEN,
BISTM
LOCK,
PASS, OS
[2:0]
−10
±1
VDDIO
- 0.2
VDDIO
GND
V
0.2
-3
-15
V
mA
+15
µA
+50
mV
FPD-Link II LVDS RECEIVER DC SPECIFICATIONS
VTH
Differential Input Threshold
High Voltage
VTL
Differential Input Threshold
Low Voltage
VCM
Common Mode Voltage,
Internal VBIAS
RT
Input Termination
VCM = +1.2V (Internal VBIAS)
RIN+, RIN-
−50
mV
1.2
V
100
120
Ω
70
80
mA
30
40
mA
0.35
1
mA
1
1.5
mA
0.15
4
mA
VDDTX = 3.6V VDDTX
0.01
0.1
mA
VDDIO=1.89V
0.1
0.4
mA
0.4
0.8
mA
80
SUPPLY CURRENT
IDD1
IDDTX1
IDDIO1
Supply Current
(includes load current)
43 MHz Clock
All VDD(1.8)
VDDn= 1.89V
Checker Board
pins
Pattern, VODSEL = H, V
=
3.6V
VDDTX
DDTX
SSCG = On
VDDIO=1.89V
Figure 1
VDDIO
VDDIO = 3.6V
IDDZ
IDDTXZ
VDD= 1.89V
Supply Current Power Down
IDDIOZ
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PDB = 0V, All other
LVCMOS Inputs = 0V
VDDIO = 3.6V
6
All VDD(1.8)
pins
VDDIO
Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2) and (Note 3)
Symbol
Parameter
Conditions
Pin/Freq.
Min
Typ
Max
Units
FPD-Link II
tDDLT
tDJIT
Lock Time
(Note 5)
Input Jitter Tolerance
SSCG = Off
5 MHz
6
ms
SSCG = On
5 MHz
14
ms
SSCG = Off
43 MHz
5
ms
SSCG = On
43 MHz
8
ms
>0.45
UI
EQ = Off
Jitter Frequency > 10 MHz
Figure 11
FPD-Link Output
tTLHT
Low to High Transition Time
tTHLT
High to Low Transition Time
tDCCJ
Cycle-to-Cycle Output Jitter
(Note 6, Note 8)
tTTP1
Transmitter Pulse Position for
bit 1
tTTP0
RL = 100Ω
TxCLKOUT±, TxOUT
[2:0]±
0.3
TxCLKOUT = 5 MHz
TxCLKOUT±
75
TxCLKOUT = 43 MHz
TxOUT[2:0]±
0.6
ns
0.3
0.6
ns
900
2100
ps
125
ps
0
UI
Transmitter Pulse Position for
bit 0
1
UI
tTPP6
Transmitter Pulse Position for
bit 6
2
UI
tTTP5
Transmitter Pulse Position for
bit 5
3
UI
tTTP4
Transmitter Pulse Position for
bit 4
4
UI
tTTP3
Transmitter Pulse Position for
bit 3
5
UI
tTTP2
Transmitter Pulse Position for
bit 2
6
UI
tTPDD
Power Down Delay active to
OFF
Figure 3
TxCLKOUT = 43 MHz
Enable Delay OFF to active
Figure 4
TxCLKOUT = 43 MHz
tTXZR
6
10
ns
40
55
ns
10
15
ns
10
15
ns
560
570
ns
70
75
ns
LVCMOS Outputs
tCLH
Low to High Transition Time
tCHL
High to Low Transition Time
tPASS
BIST PASS Valid Time,
BISTEN = 1, Figure 9
CL = 8 pF
Figure 2
LOCK, PASS, OS[2:0]
TxCLKOUT = 5 MHz
PASS
TxCLKOUT = 43 MHz
SSCG Mode
fDEV
fMOD
Spread Spectrum
Clocking Deviation
Frequency
(Note 9)
Spread Spectrum
Clocking Modulation
Frequency
(Note 9)
7
TxCLKOUT = 5 to 43
MHz,
SSC[3:0] = ON
±0.5
±2
%
TxCLKOUT = 5 to 43
MHz,
SSC[3:0] = ON
8
100
kHz
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DS99R124AQ
Switching Characteristics
DS99R124AQ
Recommended Timing for the Serial Control Bus
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
fSCL
SCL Clock Frequency
tLOW
SCL Low Period
Conditions
Standard Mode
Fast Mode
Min
Max
Units
0
Typ
100
kHz
0
400
kHz
Standard Mode
4.7
us
Fast Mode
1.3
us
Standard Mode
4.0
us
tHIGH
SCL High Period
Fast Mode
0.6
us
tHD;STA
Hold time for a start or a
repeated start condition,
Figure 10
Standard Mode
4.0
us
0.6
us
Set Up time for a start or a
repeated start condition,
Figure 10
Standard Mode
4.7
us
0.6
us
Data Hold Time,
Figure 10
Standard Mode
0
3.45
us
Fast Mode
0
0.9
us
Data Set Up Time,
Figure 10
Standard Mode
250
ns
Fast Mode
100
ns
tSU;STO
Set Up Time for STOP
Condition, Figure 10
Standard Mode
4.0
us
Fast Mode
0.6
us
tBUF
Bus Free Time
Between STOP and START,
Figure 10
Standard Mode
4.7
us
1.3
us
SCL & SDA Rise Time,
Figure 10
Standard Mode
1000
ns
Fast Mode
300
ns
SCL & SDA Fall Time,
Figure 10
Standard Mode
300
ns
Fast mode
300
ns
Max
Units
0.7*
VDDIO
VDDIO
V
GND
0.3*
VDDIO
V
tSU:STA
tHD;DAT
tSU;DAT
tr
tf
Fast Mode
Fast Mode
Fast Mode
DC and AC Serial Control Bus Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
VIH
Input High Level
SDA and SCL
VIL
Input Low Level Voltage
SDA and SCL
VHY
Input Hysteresis
Min
Typ
>50
VOL
SDA, IOL = +0.5 mA
Iin
SDA or SCL, Vin = VDDIO or GND
SDA, RPU = X, Cb ≤ 400pF
mV
0
0.36
V
-10
+10
µA
tR
SDA RiseTime – READ
800
ns
tF
SDA Fall Time – READ
50
ns
tSU;DAT
Set Up Time — READ
540
ns
tHD;DAT
Hold Up Time — READ
600
ns
tSP
Input Filter
Cin
Input Capacitance
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SDA or SCL
8
50
ns
<5
pF
Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 3: Typical values represent most likely parametric norms at VDDn = 1.8V, VDDTX = 3.3V, VDDIO = 1.8V or 3.3V, Ta = +25 °C, and at the Recommended
Operation Conditions at the time of product characterization and are not guaranteed.
Note 4: Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD, ΔVOD,
VTH and VTL which are differential voltages.
Note 5: tDDLT is the time required by the deserializer to obtain lock when exiting power-down state with an active PCLK.
Note 6: tDCCJ is the maximum amount of jitter between adjacent clock cycles.
Note 7: Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8V) supply with amplitude = 100
mVp-p measured at the device VDDn pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter cable shows no error when the noise
frequency on the Ser is less than 750 kHz. The Des on the other hand shows no error when the noise frequency is less than 400 kHz.
Note 8: Specification is guaranteed by characterization and is not tested in production.
Note 9: Specification is guaranteed by design and is not tested in production.
AC Timing Diagrams and Test Circuits
30154932
FIGURE 1. Checkerboard Data Pattern
30154905
FIGURE 2. LVCMOS Transition Times
9
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DS99R124AQ
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
DS99R124AQ
30154988
FIGURE 3. FPD-Link & LVCMOS Powerdown Delay
30154989
FIGURE 4. FPD-Link Outputs Enable Delay
30154914
FIGURE 5. Deserializer PLL Lock Times
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10
DS99R124AQ
30154906
FIGURE 6. FPD-Link (LVDS) Single-ended and Differential Waveforms
30154917
FIGURE 7. FPD-Link Transmitter Pulse Positions
30154916
FIGURE 8. Receiver Input Jitter Tolerance
11
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DS99R124AQ
30154952
FIGURE 9. BIST PASS Waveform
30154936
FIGURE 10. Serial Control Bus Timing Diagram
Typical Performance Characteristics
30154991
FIGURE 11. Typical Input Jitter Tolerance Curve at 43 MHz
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12
DS99R124AQ
30154992
FIGURE 12. Typical Total IDD Current (1.8V Supply) as a Function of PCLK
30154993
FIGURE 13. Typical IDDTX Current (3.3V Supply) as a function of PCLK
13
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DS99R124AQ
The Des can attain lock to a data stream without the use of a
separate reference clock source, which greatly simplifies system complexity and overall cost. The Des also synchronizes
to the Ser regardless of the data pattern, delivering true automatic “plug and lock” performance. It can lock to the incoming serial stream without the need of special training patterns
or sync characters. The Des recovers the clock and data by
extracting the embedded clock information, validating and
then deserializing the incoming data stream.
The DS99R421Q / DS99R124AQ chipset supports 18-bit color depth, HS, VS and DE video control signals and up to three
over-sampled low-speed (general purpose) data bits.
Functional Description
The DS99R124AQ receives 24-bits of data over a single serial FPD-Link II pair operating at 140Mbps to 1.2Gbps. The
serial stream also contains an embedded clock, and the DCbalance information which enhances signal quality and supports AC coupling. The receiver copnverts the serial stream
into a 4-channel (3 data and 1 clock) FPD-Link LVDS Interface. The device is intended to be used with the
DS90UR241or the DS99R421 FPD-Link II serializers.
The Des converts a single input serial data stream to a FPDLink output bus, and also provides a signal check for the
chipset Built In Self Test (BIST) mode. The device can be
configured via external pins or through the optional serial
control bus. The Des features enhance signal quality on the
link by supporting the FPD-Link II data coding that provides
randomization, scrambling, and DC balancing of the data.
The Des includes multiple features to reduce EMI associated
with display data transmission. This includes the randomization and scrambling of the data, FPD-Link LVDS Output interface, and also the output spread spectrum clock generation
(SSCG) support. The Des' power saving features include a
power down mode, and optional LVCMOS (1.8 V) interface
compatibility.
DATA TRANSFER
The DS99R124AQ will receive a pixel of data in the following
format: C1 and C0 represent the embedded clock in the serial
stream. C1 is always HIGH and C0 is always LOW. b[23:0]
contain the scrambled data. DCB is the DC-Balanced control
bit. DCB is used to minimize the short and long-term DC bias
on the signal lines. This bit determines if the data is unmodified or inverted. DCA is used to validate data integrity in the
embedded data stream. Both DCA and DCB coding schemes
are generated by the Ser and decoded by the Des automatically. Figure 14 illustrates the serial stream per PCLK cycle.
30154937
FIGURE 14. FPD-Link II Serial Stream (DS99R421/DS99R124A)
The device supports clocks in the range of 5 MHz to 43 MHz.
With every clock cycle 24 bits of payload are received along
with the four overhead bits. Thus, the line rate is 1.2 Gbps
maximum (140 Mbps minimum) with an effective data rate of
1.03 Gbps maximum. The link is extremely efficient at 86%
(24/28).
The FPD-Link output will pass along the data to the Display
in the format shown in Figure 15.
tion capability. A 4.7 µF capacitor may be connected to this
pin to Ground.
OUTPUT INTERFACES (LVCMOS & FPD-LINK)
OS[2:0] LVCMOS Outputs
Additional signals maybe received across the serial link per
PCLK. The over-sampled bits are restricted to be low speed
signals and should be less than 1/5 of the frequency of the
PCLK. Signals should convey level information only, as pulse
width distrotion will occur by the over sampling technique and
location of the sampling clock. The three over sampled bits
are exactly mapped to DS99R421's; and to DS90UR421 bits
are: OS0 = DIN21, OS1 = DIN22, and OS2 = DIN23.
CLOCK-DATA RECOVERY STATUS FLAG (LOCK) and
OUTPUT STATE SELECT (OSS_SEL)
When PDB is driven HIGH, the CDR PLL begins locking to
the serial input, LOCK is Low and the FPD-Link interface state
is determined by the state of the OSS_SEL pin.
After the DS99R124AQ completes its lock sequence to the
input serial data, the LOCK output is driven HIGH, indicating
valid data and clock recovered from the serial input is available on the FPD-Link outputs. The TxCLK output is held at its
current state at the change from OSC_CLK (if this is enabled
via OSC_SEL) to the recovered clock (or vice versa). Note
that the FPD-Link outputs may be held in an inactive state
(TRI-STATE) through the use of the Output Enable pin (OEN).
30154928
FIGURE 15. FPD-Link Output Format
FPD-LINK II INPUT
Common Mode Filter Pin (CMF) — Optional
The Des provides access to the center tap of the internal termination. A capacitor may be placed on this pin for additional
common-mode filtering of the differential pair. This can be
useful in high noise environments for additional noise rejec-
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14
DS99R124AQ
If there is a loss of clock from the input serial stream, LOCK
is driven Low and the state of the outputs are based on the
OSS_SEL setting (configuration pin or register).
TABLE 1. Output State Table
INPUTS
OUTPUTS
PDB
OEN
OSS_SEL
LOCK
OTHER OUTPUTS
L
X
L
Z
TxCLKOUT is TRI-STATE
TxOUT[2:0] areTRI-STATE
OS[2:0] are TRI-STATE
PASS is TRI-STATE
L
X
H
L
TxCLKOUT is TRI-STATE
TxOUT[2:0] areTRI-STATE
OS[2:0] are LOW
PASS is TRI-STATE
H
L
L
L
TxCLKOUT is TRI-STATE
TxOUT[2:0] areTRI-STATE
OS[2:0] are LOW
PASS is HIGH
H
L
H
L
TxCLKOUT is TRI-STATE
TxOUT[2:0] areTRI-STATE
OS[2:0] are LOW
PASS is LOW
H
H
L
L
TxCLKOUT is TRI-STATE
TxOUT[2:0] areTRI-STATE
OS[2:0] are TRI-STATE
PASS is HIGH
H
H
H
L
TxCLKOUT is TRI-STATE
TxOUT[2:0] areLOW
OS[2:0] are LOW
PASS is LOW
H
L
X
H
TxCLKOUT is TRI-STATE
TxOUT[2:0] areTRI-STATE
OS[2:0] are Active
PASS is Active
(This setting allows the system to run BIST or use the OS[2:0]
bits while the panel is off)
H
H
X
H
TxCLKOUT is Active
TxOUT[2:0] are Active
OS[2:0] are Active
PASS is Active
(Normal operating mode)
LVCMOS 1.8V / 3.3V VDDIO Operation
The LVCMOS inputs and outputs can operate with 1.8 V or
3.3 V levels (VDDIO) for target (Display) compatibility. The 1.8
V levels will offer a lower noise (EMI) and also a system power
savings.
SSCG Generation — Optional
The Des provides an internally generated spread spectrum
clock (SSCG) to modulate its outputs. Both clock and data
outputs are modulated. This will aid to lower system EMI.
Output SSCG deviations to ±2.0% (4% total) at up to 35kHz
modulations nominally are available. See Table 3 and Table
4. This feature may be controlled by pins or by register. The
LFMODE should be set appropriately if the SSCG is being
used. Set LFMODE High if the clock frequency is between 5
MHz and 20 MHz, set LFMODE Low if the clock frequency is
between 20 MHz and 43 MHz.
FPD-LINK OUTPUT
VODSEL
The differential output voltage of the FPD-Link interface is
controlled by the VODSEL input.
TABLE 2. VODSEL Configuration Table
VODSEL
Result
L
VOD is 250mV TYP (500mVp-p)
H
VOD is 400mV TYP (800mVp-p)
15
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DS99R124AQ
TABLE 3. SSCG Configuration (LFMODE = L) — Des Output
SSC[2:0] Inputs
LFMODE = L (20 - 43 MHz)
SSC2
SSC1
L
L
L
L
H
H
Result
SSC0
fdev (%)
fmod (kHz)
L
L
OFF
OFF
L
H
±0.9
H
L
±1.2
H
H
±1.9
L
L
±2.3
L
H
±0.7
H
H
L
±1.3
H
H
H
±1.7
CLK/2168
CLK/1300
TABLE 4. SSCG Configuration (LFMODE = H) — Des Output
SSC[2:0] Inputs
LFMODE = H (5 - 20 MHz)
SSC2
SSC1
L
L
Result
SSC0
fdev (%)
fmod (kHz)
L
L
OFF
OFF
L
H
±0.7
L
H
L
±1.3
L
H
H
±1.8
H
L
L
±2.2
H
L
H
±0.7
H
H
L
±1.2
H
H
H
±1.7
CLK/625
CLK/385
Stop Stream SLEEP Feature
The Des will enter a low power SLEEP state when the input
serial stream is stopped. A STOP condition is detected when
the embedded clock bits are not present. When the serial
stream starts again, the Des will then lock to the incoming
signal and recover the data. Note – in STOP STREAM
SLEEP, the optional Serial Bus Control Registers values are
RETAINED.
Built In Self Test (BIST) — Optional
An optional At-Speed Built In Self Test (BIST) feature supports the testing of the high-speed serial link. This is useful in
the prototype stage, equipment production, in-system test
and also for system diagnostics. In the BIST mode only an
input clock is required along with control to the Ser and Des
BISTEN input pins. The Ser outputs a test pattern (PRBS7)
and drives the link at speed. The Des detects the PRBS7 pattern and monitors it for errors. The PASS output pin toggles
to flag any payloads that are received with 1 to 24 bit errors.
The BISTM pin selects the operational mode of the PASS pin.
If BISTM = L, the PASS pins reports the final result only. If
BISTM = H, the PASS pins counts payload errors and also
results the result. The result of the test is held on the PASS
output until reset (new BIST test or Power Down). A high on
PASS indicates NO ERRORS were detected. A Low on PASS
indicates one or more errors were detected. The duration of
the test is controlled by the pulse width applied to the Des
BISTEN pin.
30154933
FIGURE 16. SSCG Waveform
POWER SAVING FEATURES
PowerDown Feature (PDB)
The Des has a PDB input pin to ENABLE or POWER DOWN
the device. This pin can be controlled by the system to save
power, disabling the Des when the display is not needed. An
auto detect mode is also available. In this mode, the PDB pin
is tied High and the Des will enter POWER DOWN when the
serial stream stops. When the serial stream starts up again,
the Des will lock to the input stream and assert the LOCK pin
and output valid data. In POWER DOWN mode, the Data and
PCLK output states are determined by the OSS_SEL status.
Note – in POWER DOWN, the optional Serial Bus Control
Registers are RESET.
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16
30154943
FIGURE 17. BIST Mode Flow Diagram
Sample BIST Sequence
SeeFigure 17 for the BIST mode flow diagram.
Step 1: For the DS99R421 FPD-Link II Ser BIST Mode is enabled via the BISTEN pin. For the DS90UR241 Ser, BIST
mode is enetered by setting all the input data of the device to
Low state. A PCLK is required for all the Ser options. When
30154964
FIGURE 18. BIST Waveforms
17
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DS99R124AQ
the Des detects the BIST mode pattern and command (DCA
and DCB code) the RGB and control signal outputs are shut
off.
Step 2: Place the DS99R124AQ Des in BIST mode by setting
the BISTEN = H. The Des is now in the BIST mode. If BISTM
= H, the Des will check the incoming serial payloads for errors.
If an error in the payload (1 to 24) is detected, the PASS pin
will switch low for one half of the clock period. During the BIST
test, the PASS output can be monitored and counted to determine the payload error rate.
Step 3: To Stop the BIST mode, the Des BISTEN pin is set
Low. The Des stops checking the data. The final test result is
held on the PASS pin. If the test ran error free, the PASS
output will be High. If there was one or more errors detected,
the PASS output will be Low. The PASS output state is held
until a new BIST is run, the device is RESET, or Powered
Down. The BIST duration is user controlled by the duration of
the BISTEN signal.
Step 4: To return the link to normal operation, the Ser BISTEN
input is set Low. The Link returns to normal operation.
Figure 18 shows the waveform diagram of a typical BIST test
for two cases. Case 1 is error free, and Case 2 shows one
with multiple errors. In most cases it is difficult to generate
errors due to the robustness of the link (differential data transmission etc.), thus they may be introduced by greatly extending the cable length, faulting the interconnect, reducing signal
condition enhancements (De-Emphasis, VODSEL, or Rx
Equalization).
DS99R124AQ
Serial Bus Control — Optional
The DS99R124AQ may also be configured by the use of a
serial control bus that is I2C protocol compatible. By default,
the I2C reg_0x00'h is set to 00'h and all configuration is set
by control/strap pins. A write of 01'h to reg_0x00'h will enable/
allow configuration by registers; this will override the control/
strap pins. Multiple devices may share the serial control bus
since multiple addresses are supported. See Figure 19.
The serial bus is comprised of three pins. The SCL is a Serial
Bus Clock Input. The SDA is the Serial Bus Data Input / Output signal. Both SCL and SDA signals require an external pull
up resistor to VDDIO. For most applications a 4.7 k pull up resistor to VDDIO may be used. The resistor value may be
adjusted for capacitive loading and data rate requirements.
The signals are either pulled High, or driven Low.
30154951
FIGURE 20. START and STOP Conditions
To communicate with a remote device, the host controller
(master) sends the slave address and listens for a response
from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is addressed correctly,
it Acknowledges (ACKs) the master by driving the SDA bus
low. If the address doesn't match a device's slave address, it
Not-acknowledges (NACKs) the master by letting SDA be
pulled High. ACKs also occur on the bus when data is being
transmitted. When the master is writing data, the slave ACKs
after every data byte is successfully received. When the master is reading data, the master ACKs after every data byte is
received to let the slave know it wants to receive another data
byte. When the master wants to stop reading, it NACKs after
the last data byte and creates a stop condition on the bus. All
communication on the bus begins with either a Start condition
or a Repeated Start condition. All communication on the bus
ends with a Stop condition. A READ is shown in Figure 21
and a WRITE is shown in Figure 22.
If the Serial Bus is not required, the three pins may be left
open (NC).
30154941
FIGURE 19. Serial Control Bus Connection
The third pin is the ID[X] pin. This pin sets one of four possible
device addresses. Two different connections are possible.
The pin may be pulled to VDD (1.8V, NOT VDDIO)) with a 10
kΩ resistor. Or a 10 kΩ pull up resistor (to VDD 1.8V, NOT
VDDIO)) and a pull down resistor of the recommended value
to set other three possible addresses may be used. See Table
5 for the Des.
The Serial Bus protocol is controlled by START, START-Repeated, and STOP phases. A START occurs when SCL
transitions Low while SDA is High. A STOP occurs when SDA
transition High while SCL is also HIGH. See Figure 20
TABLE 5. ID[x] Resistor Value – DS99R124AQ Des
Resistor
RID kΩ
(5%tol)
Address
7'b
Address
8'b
0 appended
(WRITE)
0.47
7b' 111 0001 (h'71)
8b' 1110 0010 (h'E2)
2.7
7b' 111 0010 (h'72)
8b' 1110 0100 (h'E4)
8.2
7b' 111 0011 (h'73)
8b' 1110 0110 (h'E6)
Open
7b' 111 0110 (h'76)
8b' 1110 1100 (h'EC)
30154938
FIGURE 21. Serial Control Bus — READ
30154939
FIGURE 22. Serial Control Bus — WRITE
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18
DS99R124AQ
TABLE 6. DS99R124AQ — Serial Bus Control Registers
ADD ADD Register Name
(dec) (hex)
0
1
2
0
1
2
Des Config 1
Slave ID
Des Features 1
Bit(s)
R/W
Defa Function
ult
(bin)
Description
7
R/W
0
LFMODE
SSCG Mode – low frequency support
0: 20 to 43 MHz Operation
1: 5 to 20 MHz Operation
6
R/W
0
OSS_SEL
Output Sleep State Select
TBD
5
R/W
0
Reserved
Reserved
4
R/W
0
Reserved
Reserved
3:2
R/W
00
Reserved
Reserved
1
R/W
0
SLEEP
Note – not the same function as PowerDown (PDB)
0: normal mode
1: Sleep Mode – Register settings retained.
0
R/W
0
REG Control
0: Configurations set from control pins
1: Configurations set from registers (except I2C_ID)
7
R/W
0
ADD_SEL
0: Address from ID[X] Pin
1: Address from Register
6:0
R/W
7
R/W
0
OEN
Output Enable Input
0: FPD-Link output are TRI-STATE
1: FPD-Link outputs are enabled (active)
6
R/W
0
Reserved
Reserved
5:4
R/W
00
Reserved
Reserved
3
R/W
0
VODSEL
Differential Driver Output Voltage Select
0: LVDS VOD is ±250 mV, 500 mVp-p (typ)
1: LVDS VOD is ±400 mV, 800 mVp-p (typ)
2:0
R/W
00
OSC_SEL
000: OFF
001: Reserved
010: 25 MHz ±40%
011: 16.7 MHz ±40%
100: 12.5 MHz ±40%
101: 10 MHz ±40%
110: 8.3 MHz ±40%
111: 6.3 MHz ±40%
1110 ID[X]
000
Serial Bus Device ID, Four IDs are:
7b '1110 001 (h'71); 8b ' 1110 0010 (h'E2)
7b '1110 010 (h'72); 8b ' 1110 0100 (h'E4)
7b '1110 011 (h'73); 8b ' 1110 0110 (h'E6)
7b '1110 110 (h'76); 8b ' 1110 1100 (h'EC)
All other addresses are Reserved.
19
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DS99R124AQ
ADD ADD Register Name
(dec) (hex)
3
3
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Des Features 2
Bit(s)
R/W
Defa Function
ult
(bin)
Description
7:5
R/W
000
EQ Gain
000: ~1.625 dB
001: ~3.25 dB
010: ~4.87 dB
011: ~6.5 dB
100: ~8.125 dB
101: ~9.75 dB
110: ~11.375 dB
111: ~13 dB
4
R/W
0
EQ Enable
0: EQ = disabled
1: EQ = enabled
3
R/W
0
Reserved
Reserved
2:0
R/W
000
SSC
IF LFMODE = 0, then:
000: SSCG OFF
001: fdev = ±0.9%, fmod = CLK/2168
010: fdev = ±1.2%, fmod = CLK/2168
011: fdev = ±1.9%, fmod = CLK/2168
100: fdev = ±2.3%, fmod = CLK/2168
101: fdev = ±0.7%, fmod = CLK/1300
110: fdev = ±1.3%, fmod = CLK/1300
111: fdev = ±1.57%, fmod = CLK/1300
IF LFMODE = 1, then:
000: SSCG OFF
001: fdev = ±0.7%, fmod = CLK/625
010: fdev = ±1.3%, fmod = CLK/625
011: fdev = ±1.8%, fmod = CLK/625
100: fdev = ±2.2%, fmod = CLK/625
101: fdev = ±0.7%, fmod = CLK/385
110: fdev = ±1.2%, fmod = CLK/385
111: fdev = ±1.7%, fmod = CLK/385
20
DISPLAY APPLICATION
The DS99R124AQ, in conjunction with the DS99R421Q or
DS90UR241Q, is intended for interfacing between a host
(graphics processor) and a Display. It supports an 18-bit color
depth (RGB666) and up to WVGA display formats. In a
RGB666 application, 18 color bits (R[5:0], G[5:0], B[5:0]), Pixel Clock (PCLK) and three control bits (VS, HS and DE) are
supported across the serial link with PCLK rates from 5 to
43MHz.
30154945
FIGURE 23. DS99R124AQ Typical Connection Diagram — Pin Control
21
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DS99R124AQ
TYPICAL APPLICATION CONNECTION
Figure 23 shows a typical application of the DS99R124AQQ
Des in pin mode for a 43 MHz WVGA Display Application. The
LVDS inputs utilize 100 nF coupling capacitors to the line and
the Receiver provides internal termination. Bypass capacitors
are placed near the power supply pins. Ferrite beads are
placed on the power lines for effective noise suppression.
Applications Information
DS99R124AQ
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size reduces
the parasitic inductance of the capacitor. The user must pay
attention to the resonance frequency of these external bypass
capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple capacitors are often used to
achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common
practice to use two vias from power and ground pins to the
planes, reducing the impedance at high frequency.
Some devices provide separate power and ground pins for
different portions of the circuit. This is done to isolate switching noise effects between different sections of the circuit.
Separate planes on the PCB are typically not required. Pin
Description tables typically provide guidance on which circuit
blocks are connected to which power pin pairs. In some cases, an external filter many be used to provide clean power to
sensitive circuits such as PLLs.
Use at least a four layer board with a power and ground plane.
Locate LVCMOS signals away from the LVDS lines to prevent
coupling from the LVCMOS lines to the LVDS lines. Closelycoupled differential lines of 100 Ohms are typically recommended for LVDS interconnect. The closely coupled lines
help to ensure that coupled noise will appear as commonmode and thus is rejected by the receivers. The tightly coupled lines will also radiate less.
Information on the LLP style package is provided in National
Application Note: AN-1187.
POWER UP REQUIREMENTS AND PDB PIN
The VDD (VDDn), VDDTX and VDDIO supply ramps should be
faster than 1.5 ms with a monotonic rise. Supplies may power
up in any order, however device operation should be initiated
only after all supplies are in their valid operating ranges. The
optional serial bus address selection is done upon power up
also. Thus, if using this optional feature, the PDB signal must
be delayed to allow time for the ID setting to occur. The delay
maybe done by simply holding the PDB pin at a Low, or with
an external RC delay based off the VDDIO rail which would then
need to lag the others in time. If the PDB pin is pulled to
VDDIO, it is recommended to use a 10 kΩ pull-up and a 10 uF
cap to GND to delay the PDB input signal.
TRANSMISSION MEDIA
The Ser/Des chipset is intended to be used in a point-to-point
configuration, through a PCB trace, or through twisted pair
cable. The Ser and Des provide internal terminations providing a clean signaling environment. The interconnect for LVDS
should present a differential impedance of 100 Ohms. Use
cables and connectors that have matched differential
impedance to minimize impedance discontinuities. Shielded
or un-shielded cables may be used depending upon the noise
environment and application requirements.
LIVE LINK INSERTION
The Ser and Des devices support live pluggable applications.
The automatic receiver lock to random data “plug & go” hot
insertion capability allows the DS99R124AQ to attain lock to
the active data stream during a live insertion event.
LVDS INTERCONNECT GUIDELINES
See AN-1108 and AN-905 for full details.
• Use 100Ω coupled differential pairs
• Use the S/2S/3S rule in spacings
– S = space between the pair
– 2S = space between pairs
– 3S = space to LVCMOS signal
• Minimize the number of Vias
• Use differential connectors when operating above
500Mbps line speed
• Maintain balance of the traces
• Minimize skew within the pair
• Terminate as close to the TX outputs and RX inputs as
possible
Additional general guidance can be found in the LVDS
Owner’s Manual - available in PDF format from the National
web site at: www.national.com/lvds
PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS
Circuit board layout and stack-up for the LVDS Ser/Des devices should be designed to provide low-noise power feed to
the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize unwanted
stray noise pickup, feedback and interference. Power system
performance may be greatly improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This
arrangement provides plane capacitance for the PCB power
system with low-inductance parasitics, which has proven especially effective at high frequencies, and makes the value
and placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic and
tantalum electrolytic types. RF capacitors may use values in
the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be
in the 2.2 uF to 10 uF range. Voltage rating of the tantalum
capacitors should be at least 5X the power supply voltage
being used.
Surface mount capacitors are recommended due to their
smaller parasitics. When using multiple capacitors per supply
pin, locate the smaller value closer to the pin. A large bulk
capacitor is recommend at the point of power entry. This is
typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is recommended to connect power
and ground pins directly to the power and ground planes with
bypass capacitors connected to the plane with via on both
ends of the capacitor. Connecting power or ground pins to an
external bypass capacitor will increase the inductance of the
path.
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Revision History
•
•
•
•
•
•
22
March 2, 2011
Pin assignments for SSC[1] and SSC[0] have changed
Pin assignments for OS[2] and OS[0] have changed
RTlimits have changed from 75(min) and 92(max) to 80
(min) and 120(max)
IDDTXZmax has changed from 0.05mA to 0.1mA
Serial control bus timing parameters updated to typical
only: tR, tF, tSU:DATtHD:DAT
DS99R124AQ
Physical Dimensions inches (millimeters) unless otherwise noted
48–pin LLP Package (7.0 mm x 7.0 mm x 0.8 mm, 0.5 mm pitch)
NS Package Number SQA48A
23
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DS99R124AQ 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter
Notes
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