DS99R124AQ DS99R124AQ 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter Literature Number: SNLS342 DS99R124AQ 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter General Description Features The DS99R124AQ converts FPD-Link II to FPD-Link. It translates a high-speed serialized interface with an embedded clock over a single pair (FPD-Link II) to three LVDS data/control streams and one LVDS clock pair (FPD-Link). This serial bus scheme greatly eases system design by eliminating skew problems between clock and data, reduces the number of connector pins, reduces the interconnect size, weight, and cost, and overall eases PCB layout. In addition, internal DC balanced decoding is used to support AC-coupled interconnects. The DS99R124AQ converter recovers the data (RGB) and control signals and extracts the clock from a serial stream (FPD-Link II). It is able to lock to the incoming data stream without the use of a training sequence or special SYNC patterns and does not require a reference clock. A link status (LOCK) output signal is provided. Adjustable input equalization of the serial input stream provides compensation for transmission medium losses of the cable and reduces the medium-induced deterministic jitter. EMI is minimized by the use of low voltage differential signaling, output state select feature, and additional output spread spectrum generation. With fewer wires to the physical interface of the display, FPDLink output with LVDS technology is ideal for high speed, low power and low EMI data transfer. The DS99R124AQ is offered in a 48-pin LLP package and is specified over the automotive AEC-Q100 Grade 2 temperature range of -40˚C to +105˚C. ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 5 – 43 MHz support (140 Mbps to 1.2 Gbps Serial Link) 4-channel (3 data + 1 clock) FPD-Link LVDS outputs 3 low-speed over-sampled LVCMOS outputs AC Coupled STP Interconnect up to 10 meters in length Integrated input termination @ Speed link BIST mode and reporting pin Optional I2C compatible Serial Control Bus RGB666 + VS, HS, DE converted from 1 pair Power down mode minimizes power dissipation FAST random data lock; no reference clock required Adjustable input receive equalization LOCK (real time link status) reporting pin Low EMI FPD-Link output SSCG option for lower EMI 1.8V or 3.3V compatible I/O interface Automotive grade product: AEC-Q100 Grade 2 qualified >8 kV HBM and ISO 10605 ESD Rating Applications ■ Automotive Display for Navigation ■ Automotive Display for Entertainment Applications Diagram 30154927 TRI-STATE® is a registered trademark of National Semiconductor Corporation. © 2011 National Semiconductor Corporation 301549 www.national.com DS99R124AQ 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter July 15, 2011 DS99R124AQ DS99R124AQ Pin Diagram 30154919 FPD-Link II to FPD-Link Convertor - DS99R124AQ Pin Descriptions Pin Name Pin # I/O, Type Description FPD-Link II Input Interface RIN+ 40 I, LVDS True input The input must be AC coupled with a 100 nF capacitor. Internal termination. RIN- 41 I, LVDS Inverting input The input must be AC coupled with a 100 nF capacitor. Internal termination. CMF 42 I, Analog Common-Mode Filter VCM center-tap is a virtual ground which maybe ac-coupled to ground to increase receiver common mode noise immunity. Recommended value is 4.7 μF or higher. FPD-Link Output Interface TxOUT[2:0]+ 19, 21, 23 O, LVDS True LVDS Data Output This pair should have a 100 Ω termination for standard LVDS levels. TxOUT[2:0]- 20, 22, 24 O, LVDS Inverting LVDS Data Output This pair should have a 100 Ω termination for standard LVDS levels. TxCLKOUT+ 17 O, LVDS True LVDS Clock Output This pair should have a 100 Ω termination for standard LVDS levels. TxCLKOUT- 18 O, LVDS Inverting LVDS Clock Output This pair should have a 100 Ω termination for standard LVDS levels. www.national.com 2 Pin # I/O, Type Description LVCMOS Outputs OS[2:0] 12, 11, 10 O, LVMOS Over-Sampled Low Frequency Outputs These bits map to the DS99R421's OS[2:0] over-sampled low-frequency inputs. Signals must be slower the TxCLK/5. On the DS90UR241 these map to the DIN[23:21] inputs. OS0 = DIN21, OS1 = DIN22, OS2 = DIN23. LOCK 27 O, LVMOS LOCK Status Output LOCK = 1, PLL is locked, outputs are active. LOCK = 0, PLL is unlocked, output states determined by OSS_SEL. Maybe used as a Link Status or to flag when the Video Data is active (ON/OFF). Control and Configuration PDB 1 I, LVCMOS w/ pull-down Power Down Mode Input PDB = 1, Device is enabled (normal operation) PDB = 0, Device is in power-down, the output are controlled by the settings. Control registers are RESET. VODSEL 33 I, LVCMOS w/ pull-down Differential Driver Output Voltage Select VODSEL = 1, LVDS VOD is ±400 mV, 800 mVp-p (typ) — Long Cable / De-E Applications VODSEL = 0, LVDS VOD is ±250 mV, 500 mVp-p (typ) SeeTable 2 OEN 34 I, LVCMOS w/ pull-down Output Enable Input OEN = 1, FPD-Link outputs are enabled (active). OEN = 0, FPD-Link outputs are TRI-STATE. OSS_SEL 35 I, LVCMOS w/ pull-down Output Sleep State Select Input See Table 1 LFMODE 36 I, LVCMOS w/ pull-down Low Frequency Mode — Pin or Register Control LF_MODE = 1, low frequency mode (TxCLKOUT = 5-20 MHz) LF_MODE = 0, high frequency mode (TxCLKOUT = 20-43 MHz) SSC[2:0] 7, 3, 2 I, LVCMOS w/ pull-down Spread Spectrum Clock Generation (SSCG) Range Select SeeTable 3 and Table 4 RES[1:0] 37, 15 I, LVCMOS w/ pull-down Reserved Tie Low Control and Configuration — STRAP PIN For a High State, use a 10 kΩ pull up to VDDIO; for a Low State, the IO includes an internal pull down. The STRAP pin is read upon power-up and set device configuration. Pin number listed along with shared LVCMOS Output name in square bracket. EQ 28 [PASS] STRAP I, LVCMOS w/ pull-down EQ Gain Control of FPD-Link II Input EQ = 1, EQ gain is enabled (~13 dB) EQ = 0, EQ gain is disabled (~1.625 dB) Optional BIST Mode BISTEN 29 I, LVCMOS w/ pull-down BIST Enable Input – Optional BISTEN = 1, BIST Mode is enabled. BISTEN = 0, normal mode. BISTM 30 I, LVCMOS w/ pull-down BIST Mode Input – Optional BISTM = 1, selects Payload Error Mode BISTM = 0, selects Pass / Fail Result-Only Mode PASS 28 O, LVCMOS PASS Output (BIST Mode) – Optional PASS = 1, no errors detected PASS = 0, errors detected Leave open if unused. Route to a test point (pad) recommended. Optional Serial Bus Control Interface SCL 5 I, LVCMOS Serial Control Bus Clock Input - Optional SCL requires an external pull-up resistor to VDDIO. SDA 4 I/O, LVCMOS Open Drain Serial Control Bus Data Input / Output - Optional SDA requires an external pull-up resistor to VDDIO. 3 www.national.com DS99R124AQ Pin Name DS99R124AQ Pin Name Pin # I/O, Type Description ID[x] 16 I, Analog Serial Control Bus Device ID Address Select — Optional Resistor to Ground and 10 kΩ pull-up to 1.8V rail. See Table 5. Power and Ground VDDL 6, 31 Power Logic Power, 1.8 V ±5% VDDA 38, 43 Power Analog Power, 1.8 V ±5% VDDP 8, 46, 47 Power SSC Generator Power, 1.8 V ±5% VDDTX 13 Power FPD-Link Power, 3.3 V ±10% VDDIO 25 Power LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10% GND 9, 14, 26, 32, 39, 44, 45, 48 Ground Ground DAP DAP Ground DAP is the large metal contact at the bottom side, located at the center of the LLP package. Connected to the ground plane (GND) with at least 9 vias. NOTE: 1 = HIGH, 0 = LOW Ordering Information NSID Package Description Quantity SPEC Package ID DS99R124AQSQE 48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch 250 NOPB SQA48A DS99R124AQSQ 48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch 1000 NOPB SQA48A DS99R124AQSQX 48–pin LLP, 7.0 X 7.0 X 0.8 mm, 0.5 mm pitch 2500 NOPB SQA48A Note: Automotive Grade (Q) product incorporates enhanced manufacturing and support processes for the automotive market, including defect detection methodologies. Reliability qualification is compliant with the requirements and temperature grades defined in the AEC Q100 standard. Automotive Grade products are identified with the letter Q. For more information go to http://www.national.com/automotive. Block Diagram 30154929 FPD-Link II to FPD-Link Convertor www.national.com 4 If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage – VDDn (1.8V) Supply Voltage – VDDTX (3.3V) Supply Voltage – VDDIO LVCMOS I/O Voltage Receiver Input Voltage LVDS Output Voltage Junction Temperature Storage Temperature Lead Temperature (Soldering, 4s) 48L LLP Package Maximum Power Dissipation Capacity at 25°C Derate above 25°C −0.3V to +2.5V −0.3V to +4.0V −0.3V to +4.0V −0.3V to +(VDDIO + 0.3V) −0.3V to (VDD + 0.3V) −0.3V to (VDDTX + 0.3V) +150°C −65°C to +150°C ESD Rating (ISO10605), RD = 2kΩ, CS = 150 & 330pF Air Discharge (RIN+, RIN−) ≥±15 kV Contact Discharge (RIN+, RIN−) ≥±8 kV ESD Rating (HBM) ≥±8 kV ESD Rating (MM) +260°C θJA 1/ θJA°C/W 27.7 °C/W θJC 3.0 °C/W ≥±1.25 kV ≥±250 V ESD Rating (CDM) Recommended Operating Conditions Supply Voltage (VDDn) LVCMOS Supply Voltage (VDDIO) LVCMOS Supply Voltage (VDDIO) Operating Free Air Temperature (TA) TxCLK Clock Frequency Supply Noise (Note 7) ESD Rating (IEC, powered-up only), RD = 330Ω, CS = 150pF Air Discharge (RIN+, RIN−) ≥±30 kV Contact Discharge (RIN+, RIN−) ≥±6 kV Min 1.71 1.71 Nom 1.8 1.8 Max 1.89 1.89 Units V V 3.0 3.3 3.6 V −40 +25 +105 °C 43 100 MHz mVP-P 5 DC Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2, Note 3) and (Note 4) Symbol Parameter Conditions Pin/Freq. Min Typ Max Units VODSEL = L 100 250 400 mV VODSEL = H 200 400 600 mV FPD-Link LVDS Output |VOD| Differential Output Voltage VODp-p Differential Output Voltage A-B ΔVOD Output Voltage Unbalance RL = 100Ω VOS Offset Voltage ΔVOS Offset Voltage Unbalance IOS Output Short Circuit Current Vout = GND Output TRI-STATE® Current OEN = GND, Vout =VDDTX, or GND IOZ VODSEL = L 500 mVp-p VODSEL = H 800 mVp-p TxCLKOUT+, TxCLKOUT-, VODSEL = L TxOUT[2:0]+, VODSEL = H TxOUT[2:0]- 1.0 1 50 mV 1.2 1.5 V 1.2 1 V 50 -5 mV mA -10 +10 µA 2.2 VDDIO V GND 0.8 V +15 μA 3.3 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 3.0 to 3.6V VIH High Level Input Voltage VIL Low Level Input Voltage IIN Input Current PDB, VODSEL, OEN, OSS_SEL, LFMODE, SSC[2:0], BISTEN, BISTM VIN = 0V or VDDIO 5 −15 ±1 www.national.com DS99R124AQ ESD Rating (ISO10605), RD = 330Ω, CS = 150 & 330pF Air Discharge (RIN+, RIN−) ≥±15 kV Contact Discharge (RIN+, RIN−) ≥±8 kV Absolute Maximum Ratings (Note 1) DS99R124AQ Symbol Parameter Conditions VOH High Level Output Voltage IOH = −0.5 mA VOL Low Level Output Voltage IOL = +0.5 mA IOS Output Short Circuit Current VOUT = 0V TRI-STATE® Output Current PDB = 0V, OSS_SEL = 0V, VOUT = 0V or VDDIO IOZ Pin/Freq. Min Typ VDDIO0.2 VDDIO LOCK, PASS, OS [2:0] GND Max Units V 0.2 -10 V mA −10 +10 µA 0.7 VDDIO VDDIO V GND 0.35* VDDIO V +10 μA 1.8 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 1.71 to 1.89V VIH High Level Input Voltage VIL Low Level Input Voltage IIN Input Current VIN = 0V or VDDIO VOH High Level Output Voltage IOH = −0.1 mA VOL Low Level Output Voltage IOL = +0.1 mA IOS Output Short Circuit Current VOUT = 0V IOZ TRI-STATE Output Current VOUT = 0V or VDDIO PDB, VODSEL, OEN, OSS_SEL, LFMODE, SSC[2:0], BISTEN, BISTM LOCK, PASS, OS [2:0] −10 ±1 VDDIO - 0.2 VDDIO GND V 0.2 -3 -15 V mA +15 µA +50 mV FPD-Link II LVDS RECEIVER DC SPECIFICATIONS VTH Differential Input Threshold High Voltage VTL Differential Input Threshold Low Voltage VCM Common Mode Voltage, Internal VBIAS RT Input Termination VCM = +1.2V (Internal VBIAS) RIN+, RIN- −50 mV 1.2 V 100 120 Ω 70 80 mA 30 40 mA 0.35 1 mA 1 1.5 mA 0.15 4 mA VDDTX = 3.6V VDDTX 0.01 0.1 mA VDDIO=1.89V 0.1 0.4 mA 0.4 0.8 mA 80 SUPPLY CURRENT IDD1 IDDTX1 IDDIO1 Supply Current (includes load current) 43 MHz Clock All VDD(1.8) VDDn= 1.89V Checker Board pins Pattern, VODSEL = H, V = 3.6V VDDTX DDTX SSCG = On VDDIO=1.89V Figure 1 VDDIO VDDIO = 3.6V IDDZ IDDTXZ VDD= 1.89V Supply Current Power Down IDDIOZ www.national.com PDB = 0V, All other LVCMOS Inputs = 0V VDDIO = 3.6V 6 All VDD(1.8) pins VDDIO Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2) and (Note 3) Symbol Parameter Conditions Pin/Freq. Min Typ Max Units FPD-Link II tDDLT tDJIT Lock Time (Note 5) Input Jitter Tolerance SSCG = Off 5 MHz 6 ms SSCG = On 5 MHz 14 ms SSCG = Off 43 MHz 5 ms SSCG = On 43 MHz 8 ms >0.45 UI EQ = Off Jitter Frequency > 10 MHz Figure 11 FPD-Link Output tTLHT Low to High Transition Time tTHLT High to Low Transition Time tDCCJ Cycle-to-Cycle Output Jitter (Note 6, Note 8) tTTP1 Transmitter Pulse Position for bit 1 tTTP0 RL = 100Ω TxCLKOUT±, TxOUT [2:0]± 0.3 TxCLKOUT = 5 MHz TxCLKOUT± 75 TxCLKOUT = 43 MHz TxOUT[2:0]± 0.6 ns 0.3 0.6 ns 900 2100 ps 125 ps 0 UI Transmitter Pulse Position for bit 0 1 UI tTPP6 Transmitter Pulse Position for bit 6 2 UI tTTP5 Transmitter Pulse Position for bit 5 3 UI tTTP4 Transmitter Pulse Position for bit 4 4 UI tTTP3 Transmitter Pulse Position for bit 3 5 UI tTTP2 Transmitter Pulse Position for bit 2 6 UI tTPDD Power Down Delay active to OFF Figure 3 TxCLKOUT = 43 MHz Enable Delay OFF to active Figure 4 TxCLKOUT = 43 MHz tTXZR 6 10 ns 40 55 ns 10 15 ns 10 15 ns 560 570 ns 70 75 ns LVCMOS Outputs tCLH Low to High Transition Time tCHL High to Low Transition Time tPASS BIST PASS Valid Time, BISTEN = 1, Figure 9 CL = 8 pF Figure 2 LOCK, PASS, OS[2:0] TxCLKOUT = 5 MHz PASS TxCLKOUT = 43 MHz SSCG Mode fDEV fMOD Spread Spectrum Clocking Deviation Frequency (Note 9) Spread Spectrum Clocking Modulation Frequency (Note 9) 7 TxCLKOUT = 5 to 43 MHz, SSC[3:0] = ON ±0.5 ±2 % TxCLKOUT = 5 to 43 MHz, SSC[3:0] = ON 8 100 kHz www.national.com DS99R124AQ Switching Characteristics DS99R124AQ Recommended Timing for the Serial Control Bus Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter fSCL SCL Clock Frequency tLOW SCL Low Period Conditions Standard Mode Fast Mode Min Max Units 0 Typ 100 kHz 0 400 kHz Standard Mode 4.7 us Fast Mode 1.3 us Standard Mode 4.0 us tHIGH SCL High Period Fast Mode 0.6 us tHD;STA Hold time for a start or a repeated start condition, Figure 10 Standard Mode 4.0 us 0.6 us Set Up time for a start or a repeated start condition, Figure 10 Standard Mode 4.7 us 0.6 us Data Hold Time, Figure 10 Standard Mode 0 3.45 us Fast Mode 0 0.9 us Data Set Up Time, Figure 10 Standard Mode 250 ns Fast Mode 100 ns tSU;STO Set Up Time for STOP Condition, Figure 10 Standard Mode 4.0 us Fast Mode 0.6 us tBUF Bus Free Time Between STOP and START, Figure 10 Standard Mode 4.7 us 1.3 us SCL & SDA Rise Time, Figure 10 Standard Mode 1000 ns Fast Mode 300 ns SCL & SDA Fall Time, Figure 10 Standard Mode 300 ns Fast mode 300 ns Max Units 0.7* VDDIO VDDIO V GND 0.3* VDDIO V tSU:STA tHD;DAT tSU;DAT tr tf Fast Mode Fast Mode Fast Mode DC and AC Serial Control Bus Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions VIH Input High Level SDA and SCL VIL Input Low Level Voltage SDA and SCL VHY Input Hysteresis Min Typ >50 VOL SDA, IOL = +0.5 mA Iin SDA or SCL, Vin = VDDIO or GND SDA, RPU = X, Cb ≤ 400pF mV 0 0.36 V -10 +10 µA tR SDA RiseTime – READ 800 ns tF SDA Fall Time – READ 50 ns tSU;DAT Set Up Time — READ 540 ns tHD;DAT Hold Up Time — READ 600 ns tSP Input Filter Cin Input Capacitance www.national.com SDA or SCL 8 50 ns <5 pF Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. Note 3: Typical values represent most likely parametric norms at VDDn = 1.8V, VDDTX = 3.3V, VDDIO = 1.8V or 3.3V, Ta = +25 °C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed. Note 4: Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD, ΔVOD, VTH and VTL which are differential voltages. Note 5: tDDLT is the time required by the deserializer to obtain lock when exiting power-down state with an active PCLK. Note 6: tDCCJ is the maximum amount of jitter between adjacent clock cycles. Note 7: Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8V) supply with amplitude = 100 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter cable shows no error when the noise frequency on the Ser is less than 750 kHz. The Des on the other hand shows no error when the noise frequency is less than 400 kHz. Note 8: Specification is guaranteed by characterization and is not tested in production. Note 9: Specification is guaranteed by design and is not tested in production. AC Timing Diagrams and Test Circuits 30154932 FIGURE 1. Checkerboard Data Pattern 30154905 FIGURE 2. LVCMOS Transition Times 9 www.national.com DS99R124AQ Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. DS99R124AQ 30154988 FIGURE 3. FPD-Link & LVCMOS Powerdown Delay 30154989 FIGURE 4. FPD-Link Outputs Enable Delay 30154914 FIGURE 5. Deserializer PLL Lock Times www.national.com 10 DS99R124AQ 30154906 FIGURE 6. FPD-Link (LVDS) Single-ended and Differential Waveforms 30154917 FIGURE 7. FPD-Link Transmitter Pulse Positions 30154916 FIGURE 8. Receiver Input Jitter Tolerance 11 www.national.com DS99R124AQ 30154952 FIGURE 9. BIST PASS Waveform 30154936 FIGURE 10. Serial Control Bus Timing Diagram Typical Performance Characteristics 30154991 FIGURE 11. Typical Input Jitter Tolerance Curve at 43 MHz www.national.com 12 DS99R124AQ 30154992 FIGURE 12. Typical Total IDD Current (1.8V Supply) as a Function of PCLK 30154993 FIGURE 13. Typical IDDTX Current (3.3V Supply) as a function of PCLK 13 www.national.com DS99R124AQ The Des can attain lock to a data stream without the use of a separate reference clock source, which greatly simplifies system complexity and overall cost. The Des also synchronizes to the Ser regardless of the data pattern, delivering true automatic “plug and lock” performance. It can lock to the incoming serial stream without the need of special training patterns or sync characters. The Des recovers the clock and data by extracting the embedded clock information, validating and then deserializing the incoming data stream. The DS99R421Q / DS99R124AQ chipset supports 18-bit color depth, HS, VS and DE video control signals and up to three over-sampled low-speed (general purpose) data bits. Functional Description The DS99R124AQ receives 24-bits of data over a single serial FPD-Link II pair operating at 140Mbps to 1.2Gbps. The serial stream also contains an embedded clock, and the DCbalance information which enhances signal quality and supports AC coupling. The receiver copnverts the serial stream into a 4-channel (3 data and 1 clock) FPD-Link LVDS Interface. The device is intended to be used with the DS90UR241or the DS99R421 FPD-Link II serializers. The Des converts a single input serial data stream to a FPDLink output bus, and also provides a signal check for the chipset Built In Self Test (BIST) mode. The device can be configured via external pins or through the optional serial control bus. The Des features enhance signal quality on the link by supporting the FPD-Link II data coding that provides randomization, scrambling, and DC balancing of the data. The Des includes multiple features to reduce EMI associated with display data transmission. This includes the randomization and scrambling of the data, FPD-Link LVDS Output interface, and also the output spread spectrum clock generation (SSCG) support. The Des' power saving features include a power down mode, and optional LVCMOS (1.8 V) interface compatibility. DATA TRANSFER The DS99R124AQ will receive a pixel of data in the following format: C1 and C0 represent the embedded clock in the serial stream. C1 is always HIGH and C0 is always LOW. b[23:0] contain the scrambled data. DCB is the DC-Balanced control bit. DCB is used to minimize the short and long-term DC bias on the signal lines. This bit determines if the data is unmodified or inverted. DCA is used to validate data integrity in the embedded data stream. Both DCA and DCB coding schemes are generated by the Ser and decoded by the Des automatically. Figure 14 illustrates the serial stream per PCLK cycle. 30154937 FIGURE 14. FPD-Link II Serial Stream (DS99R421/DS99R124A) The device supports clocks in the range of 5 MHz to 43 MHz. With every clock cycle 24 bits of payload are received along with the four overhead bits. Thus, the line rate is 1.2 Gbps maximum (140 Mbps minimum) with an effective data rate of 1.03 Gbps maximum. The link is extremely efficient at 86% (24/28). The FPD-Link output will pass along the data to the Display in the format shown in Figure 15. tion capability. A 4.7 µF capacitor may be connected to this pin to Ground. OUTPUT INTERFACES (LVCMOS & FPD-LINK) OS[2:0] LVCMOS Outputs Additional signals maybe received across the serial link per PCLK. The over-sampled bits are restricted to be low speed signals and should be less than 1/5 of the frequency of the PCLK. Signals should convey level information only, as pulse width distrotion will occur by the over sampling technique and location of the sampling clock. The three over sampled bits are exactly mapped to DS99R421's; and to DS90UR421 bits are: OS0 = DIN21, OS1 = DIN22, and OS2 = DIN23. CLOCK-DATA RECOVERY STATUS FLAG (LOCK) and OUTPUT STATE SELECT (OSS_SEL) When PDB is driven HIGH, the CDR PLL begins locking to the serial input, LOCK is Low and the FPD-Link interface state is determined by the state of the OSS_SEL pin. After the DS99R124AQ completes its lock sequence to the input serial data, the LOCK output is driven HIGH, indicating valid data and clock recovered from the serial input is available on the FPD-Link outputs. The TxCLK output is held at its current state at the change from OSC_CLK (if this is enabled via OSC_SEL) to the recovered clock (or vice versa). Note that the FPD-Link outputs may be held in an inactive state (TRI-STATE) through the use of the Output Enable pin (OEN). 30154928 FIGURE 15. FPD-Link Output Format FPD-LINK II INPUT Common Mode Filter Pin (CMF) — Optional The Des provides access to the center tap of the internal termination. A capacitor may be placed on this pin for additional common-mode filtering of the differential pair. This can be useful in high noise environments for additional noise rejec- www.national.com 14 DS99R124AQ If there is a loss of clock from the input serial stream, LOCK is driven Low and the state of the outputs are based on the OSS_SEL setting (configuration pin or register). TABLE 1. Output State Table INPUTS OUTPUTS PDB OEN OSS_SEL LOCK OTHER OUTPUTS L X L Z TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are TRI-STATE PASS is TRI-STATE L X H L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are LOW PASS is TRI-STATE H L L L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are LOW PASS is HIGH H L H L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are LOW PASS is LOW H H L L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are TRI-STATE PASS is HIGH H H H L TxCLKOUT is TRI-STATE TxOUT[2:0] areLOW OS[2:0] are LOW PASS is LOW H L X H TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are Active PASS is Active (This setting allows the system to run BIST or use the OS[2:0] bits while the panel is off) H H X H TxCLKOUT is Active TxOUT[2:0] are Active OS[2:0] are Active PASS is Active (Normal operating mode) LVCMOS 1.8V / 3.3V VDDIO Operation The LVCMOS inputs and outputs can operate with 1.8 V or 3.3 V levels (VDDIO) for target (Display) compatibility. The 1.8 V levels will offer a lower noise (EMI) and also a system power savings. SSCG Generation — Optional The Des provides an internally generated spread spectrum clock (SSCG) to modulate its outputs. Both clock and data outputs are modulated. This will aid to lower system EMI. Output SSCG deviations to ±2.0% (4% total) at up to 35kHz modulations nominally are available. See Table 3 and Table 4. This feature may be controlled by pins or by register. The LFMODE should be set appropriately if the SSCG is being used. Set LFMODE High if the clock frequency is between 5 MHz and 20 MHz, set LFMODE Low if the clock frequency is between 20 MHz and 43 MHz. FPD-LINK OUTPUT VODSEL The differential output voltage of the FPD-Link interface is controlled by the VODSEL input. TABLE 2. VODSEL Configuration Table VODSEL Result L VOD is 250mV TYP (500mVp-p) H VOD is 400mV TYP (800mVp-p) 15 www.national.com DS99R124AQ TABLE 3. SSCG Configuration (LFMODE = L) — Des Output SSC[2:0] Inputs LFMODE = L (20 - 43 MHz) SSC2 SSC1 L L L L H H Result SSC0 fdev (%) fmod (kHz) L L OFF OFF L H ±0.9 H L ±1.2 H H ±1.9 L L ±2.3 L H ±0.7 H H L ±1.3 H H H ±1.7 CLK/2168 CLK/1300 TABLE 4. SSCG Configuration (LFMODE = H) — Des Output SSC[2:0] Inputs LFMODE = H (5 - 20 MHz) SSC2 SSC1 L L Result SSC0 fdev (%) fmod (kHz) L L OFF OFF L H ±0.7 L H L ±1.3 L H H ±1.8 H L L ±2.2 H L H ±0.7 H H L ±1.2 H H H ±1.7 CLK/625 CLK/385 Stop Stream SLEEP Feature The Des will enter a low power SLEEP state when the input serial stream is stopped. A STOP condition is detected when the embedded clock bits are not present. When the serial stream starts again, the Des will then lock to the incoming signal and recover the data. Note – in STOP STREAM SLEEP, the optional Serial Bus Control Registers values are RETAINED. Built In Self Test (BIST) — Optional An optional At-Speed Built In Self Test (BIST) feature supports the testing of the high-speed serial link. This is useful in the prototype stage, equipment production, in-system test and also for system diagnostics. In the BIST mode only an input clock is required along with control to the Ser and Des BISTEN input pins. The Ser outputs a test pattern (PRBS7) and drives the link at speed. The Des detects the PRBS7 pattern and monitors it for errors. The PASS output pin toggles to flag any payloads that are received with 1 to 24 bit errors. The BISTM pin selects the operational mode of the PASS pin. If BISTM = L, the PASS pins reports the final result only. If BISTM = H, the PASS pins counts payload errors and also results the result. The result of the test is held on the PASS output until reset (new BIST test or Power Down). A high on PASS indicates NO ERRORS were detected. A Low on PASS indicates one or more errors were detected. The duration of the test is controlled by the pulse width applied to the Des BISTEN pin. 30154933 FIGURE 16. SSCG Waveform POWER SAVING FEATURES PowerDown Feature (PDB) The Des has a PDB input pin to ENABLE or POWER DOWN the device. This pin can be controlled by the system to save power, disabling the Des when the display is not needed. An auto detect mode is also available. In this mode, the PDB pin is tied High and the Des will enter POWER DOWN when the serial stream stops. When the serial stream starts up again, the Des will lock to the input stream and assert the LOCK pin and output valid data. In POWER DOWN mode, the Data and PCLK output states are determined by the OSS_SEL status. Note – in POWER DOWN, the optional Serial Bus Control Registers are RESET. www.national.com 16 30154943 FIGURE 17. BIST Mode Flow Diagram Sample BIST Sequence SeeFigure 17 for the BIST mode flow diagram. Step 1: For the DS99R421 FPD-Link II Ser BIST Mode is enabled via the BISTEN pin. For the DS90UR241 Ser, BIST mode is enetered by setting all the input data of the device to Low state. A PCLK is required for all the Ser options. When 30154964 FIGURE 18. BIST Waveforms 17 www.national.com DS99R124AQ the Des detects the BIST mode pattern and command (DCA and DCB code) the RGB and control signal outputs are shut off. Step 2: Place the DS99R124AQ Des in BIST mode by setting the BISTEN = H. The Des is now in the BIST mode. If BISTM = H, the Des will check the incoming serial payloads for errors. If an error in the payload (1 to 24) is detected, the PASS pin will switch low for one half of the clock period. During the BIST test, the PASS output can be monitored and counted to determine the payload error rate. Step 3: To Stop the BIST mode, the Des BISTEN pin is set Low. The Des stops checking the data. The final test result is held on the PASS pin. If the test ran error free, the PASS output will be High. If there was one or more errors detected, the PASS output will be Low. The PASS output state is held until a new BIST is run, the device is RESET, or Powered Down. The BIST duration is user controlled by the duration of the BISTEN signal. Step 4: To return the link to normal operation, the Ser BISTEN input is set Low. The Link returns to normal operation. Figure 18 shows the waveform diagram of a typical BIST test for two cases. Case 1 is error free, and Case 2 shows one with multiple errors. In most cases it is difficult to generate errors due to the robustness of the link (differential data transmission etc.), thus they may be introduced by greatly extending the cable length, faulting the interconnect, reducing signal condition enhancements (De-Emphasis, VODSEL, or Rx Equalization). DS99R124AQ Serial Bus Control — Optional The DS99R124AQ may also be configured by the use of a serial control bus that is I2C protocol compatible. By default, the I2C reg_0x00'h is set to 00'h and all configuration is set by control/strap pins. A write of 01'h to reg_0x00'h will enable/ allow configuration by registers; this will override the control/ strap pins. Multiple devices may share the serial control bus since multiple addresses are supported. See Figure 19. The serial bus is comprised of three pins. The SCL is a Serial Bus Clock Input. The SDA is the Serial Bus Data Input / Output signal. Both SCL and SDA signals require an external pull up resistor to VDDIO. For most applications a 4.7 k pull up resistor to VDDIO may be used. The resistor value may be adjusted for capacitive loading and data rate requirements. The signals are either pulled High, or driven Low. 30154951 FIGURE 20. START and STOP Conditions To communicate with a remote device, the host controller (master) sends the slave address and listens for a response from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is addressed correctly, it Acknowledges (ACKs) the master by driving the SDA bus low. If the address doesn't match a device's slave address, it Not-acknowledges (NACKs) the master by letting SDA be pulled High. ACKs also occur on the bus when data is being transmitted. When the master is writing data, the slave ACKs after every data byte is successfully received. When the master is reading data, the master ACKs after every data byte is received to let the slave know it wants to receive another data byte. When the master wants to stop reading, it NACKs after the last data byte and creates a stop condition on the bus. All communication on the bus begins with either a Start condition or a Repeated Start condition. All communication on the bus ends with a Stop condition. A READ is shown in Figure 21 and a WRITE is shown in Figure 22. If the Serial Bus is not required, the three pins may be left open (NC). 30154941 FIGURE 19. Serial Control Bus Connection The third pin is the ID[X] pin. This pin sets one of four possible device addresses. Two different connections are possible. The pin may be pulled to VDD (1.8V, NOT VDDIO)) with a 10 kΩ resistor. Or a 10 kΩ pull up resistor (to VDD 1.8V, NOT VDDIO)) and a pull down resistor of the recommended value to set other three possible addresses may be used. See Table 5 for the Des. The Serial Bus protocol is controlled by START, START-Repeated, and STOP phases. A START occurs when SCL transitions Low while SDA is High. A STOP occurs when SDA transition High while SCL is also HIGH. See Figure 20 TABLE 5. ID[x] Resistor Value – DS99R124AQ Des Resistor RID kΩ (5%tol) Address 7'b Address 8'b 0 appended (WRITE) 0.47 7b' 111 0001 (h'71) 8b' 1110 0010 (h'E2) 2.7 7b' 111 0010 (h'72) 8b' 1110 0100 (h'E4) 8.2 7b' 111 0011 (h'73) 8b' 1110 0110 (h'E6) Open 7b' 111 0110 (h'76) 8b' 1110 1100 (h'EC) 30154938 FIGURE 21. Serial Control Bus — READ 30154939 FIGURE 22. Serial Control Bus — WRITE www.national.com 18 DS99R124AQ TABLE 6. DS99R124AQ — Serial Bus Control Registers ADD ADD Register Name (dec) (hex) 0 1 2 0 1 2 Des Config 1 Slave ID Des Features 1 Bit(s) R/W Defa Function ult (bin) Description 7 R/W 0 LFMODE SSCG Mode – low frequency support 0: 20 to 43 MHz Operation 1: 5 to 20 MHz Operation 6 R/W 0 OSS_SEL Output Sleep State Select TBD 5 R/W 0 Reserved Reserved 4 R/W 0 Reserved Reserved 3:2 R/W 00 Reserved Reserved 1 R/W 0 SLEEP Note – not the same function as PowerDown (PDB) 0: normal mode 1: Sleep Mode – Register settings retained. 0 R/W 0 REG Control 0: Configurations set from control pins 1: Configurations set from registers (except I2C_ID) 7 R/W 0 ADD_SEL 0: Address from ID[X] Pin 1: Address from Register 6:0 R/W 7 R/W 0 OEN Output Enable Input 0: FPD-Link output are TRI-STATE 1: FPD-Link outputs are enabled (active) 6 R/W 0 Reserved Reserved 5:4 R/W 00 Reserved Reserved 3 R/W 0 VODSEL Differential Driver Output Voltage Select 0: LVDS VOD is ±250 mV, 500 mVp-p (typ) 1: LVDS VOD is ±400 mV, 800 mVp-p (typ) 2:0 R/W 00 OSC_SEL 000: OFF 001: Reserved 010: 25 MHz ±40% 011: 16.7 MHz ±40% 100: 12.5 MHz ±40% 101: 10 MHz ±40% 110: 8.3 MHz ±40% 111: 6.3 MHz ±40% 1110 ID[X] 000 Serial Bus Device ID, Four IDs are: 7b '1110 001 (h'71); 8b ' 1110 0010 (h'E2) 7b '1110 010 (h'72); 8b ' 1110 0100 (h'E4) 7b '1110 011 (h'73); 8b ' 1110 0110 (h'E6) 7b '1110 110 (h'76); 8b ' 1110 1100 (h'EC) All other addresses are Reserved. 19 www.national.com DS99R124AQ ADD ADD Register Name (dec) (hex) 3 3 www.national.com Des Features 2 Bit(s) R/W Defa Function ult (bin) Description 7:5 R/W 000 EQ Gain 000: ~1.625 dB 001: ~3.25 dB 010: ~4.87 dB 011: ~6.5 dB 100: ~8.125 dB 101: ~9.75 dB 110: ~11.375 dB 111: ~13 dB 4 R/W 0 EQ Enable 0: EQ = disabled 1: EQ = enabled 3 R/W 0 Reserved Reserved 2:0 R/W 000 SSC IF LFMODE = 0, then: 000: SSCG OFF 001: fdev = ±0.9%, fmod = CLK/2168 010: fdev = ±1.2%, fmod = CLK/2168 011: fdev = ±1.9%, fmod = CLK/2168 100: fdev = ±2.3%, fmod = CLK/2168 101: fdev = ±0.7%, fmod = CLK/1300 110: fdev = ±1.3%, fmod = CLK/1300 111: fdev = ±1.57%, fmod = CLK/1300 IF LFMODE = 1, then: 000: SSCG OFF 001: fdev = ±0.7%, fmod = CLK/625 010: fdev = ±1.3%, fmod = CLK/625 011: fdev = ±1.8%, fmod = CLK/625 100: fdev = ±2.2%, fmod = CLK/625 101: fdev = ±0.7%, fmod = CLK/385 110: fdev = ±1.2%, fmod = CLK/385 111: fdev = ±1.7%, fmod = CLK/385 20 DISPLAY APPLICATION The DS99R124AQ, in conjunction with the DS99R421Q or DS90UR241Q, is intended for interfacing between a host (graphics processor) and a Display. It supports an 18-bit color depth (RGB666) and up to WVGA display formats. In a RGB666 application, 18 color bits (R[5:0], G[5:0], B[5:0]), Pixel Clock (PCLK) and three control bits (VS, HS and DE) are supported across the serial link with PCLK rates from 5 to 43MHz. 30154945 FIGURE 23. DS99R124AQ Typical Connection Diagram — Pin Control 21 www.national.com DS99R124AQ TYPICAL APPLICATION CONNECTION Figure 23 shows a typical application of the DS99R124AQQ Des in pin mode for a 43 MHz WVGA Display Application. The LVDS inputs utilize 100 nF coupling capacitors to the line and the Receiver provides internal termination. Bypass capacitors are placed near the power supply pins. Ferrite beads are placed on the power lines for effective noise suppression. Applications Information DS99R124AQ A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing the impedance at high frequency. Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs. Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the LVDS lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closelycoupled differential lines of 100 Ohms are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled noise will appear as commonmode and thus is rejected by the receivers. The tightly coupled lines will also radiate less. Information on the LLP style package is provided in National Application Note: AN-1187. POWER UP REQUIREMENTS AND PDB PIN The VDD (VDDn), VDDTX and VDDIO supply ramps should be faster than 1.5 ms with a monotonic rise. Supplies may power up in any order, however device operation should be initiated only after all supplies are in their valid operating ranges. The optional serial bus address selection is done upon power up also. Thus, if using this optional feature, the PDB signal must be delayed to allow time for the ID setting to occur. The delay maybe done by simply holding the PDB pin at a Low, or with an external RC delay based off the VDDIO rail which would then need to lag the others in time. If the PDB pin is pulled to VDDIO, it is recommended to use a 10 kΩ pull-up and a 10 uF cap to GND to delay the PDB input signal. TRANSMISSION MEDIA The Ser/Des chipset is intended to be used in a point-to-point configuration, through a PCB trace, or through twisted pair cable. The Ser and Des provide internal terminations providing a clean signaling environment. The interconnect for LVDS should present a differential impedance of 100 Ohms. Use cables and connectors that have matched differential impedance to minimize impedance discontinuities. Shielded or un-shielded cables may be used depending upon the noise environment and application requirements. LIVE LINK INSERTION The Ser and Des devices support live pluggable applications. The automatic receiver lock to random data “plug & go” hot insertion capability allows the DS99R124AQ to attain lock to the active data stream during a live insertion event. LVDS INTERCONNECT GUIDELINES See AN-1108 and AN-905 for full details. • Use 100Ω coupled differential pairs • Use the S/2S/3S rule in spacings – S = space between the pair – 2S = space between pairs – 3S = space to LVCMOS signal • Minimize the number of Vias • Use differential connectors when operating above 500Mbps line speed • Maintain balance of the traces • Minimize skew within the pair • Terminate as close to the TX outputs and RX inputs as possible Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the National web site at: www.national.com/lvds PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS Circuit board layout and stack-up for the LVDS Ser/Des devices should be designed to provide low-noise power feed to the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the tantalum capacitors should be at least 5X the power supply voltage being used. Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor will increase the inductance of the path. www.national.com Revision History • • • • • • 22 March 2, 2011 Pin assignments for SSC[1] and SSC[0] have changed Pin assignments for OS[2] and OS[0] have changed RTlimits have changed from 75(min) and 92(max) to 80 (min) and 120(max) IDDTXZmax has changed from 0.05mA to 0.1mA Serial control bus timing parameters updated to typical only: tR, tF, tSU:DATtHD:DAT DS99R124AQ Physical Dimensions inches (millimeters) unless otherwise noted 48–pin LLP Package (7.0 mm x 7.0 mm x 0.8 mm, 0.5 mm pitch) NS Package Number SQA48A 23 www.national.com DS99R124AQ 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise® Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise® Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. 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