MMIC Power Splitter/Combiner Die 2 Way-0° 50Ω EP2C-D+ 1800 to 12500 MHz The Big Deal • Ultra-Wide Bandwidth, 1800-12500 MHz • High Power Handling, 1.85W as a Splitter Product Overview Mini-Circuits EP2C-D+ is a MMIC splitter/combiner die designed for wideband operation from 1800 to 12500 MHz. This model provides excellent power ratings with up to 1.85W power handling (as a splitter) and up to 0.4A DC current handling. Manufactured using GaAs IPD technology, it provides a high level of ESD protection and excellent reliability. Key Features Feature Advantages Wideband, 1800 to 12500 MHz One power splitter can be used in many applications, saving component count. Also ideal for wideband applications such as military and instrumentation. Excellent power handling: 1.85W as a splitter 0.85W internal dissipation as a combiner In power combiner applications, half the power is dissipated internally. EP2C-D+ is designed to handle 0.85W internal dissipation as a combiner allowing reliable operation without excessive temperature rise. Similar splitters implemented as Wilkinson splitters on PCB require big resistors and additional heat sinking. As a splitter, EP2C-D+ can handle up to 1.85W in a very small package. DC Passing up to 0.4A DC current passing is helpful in applications where both RF & DC need to pass through the DUT, such as antenna mounted hardware. Unpackaged die Enables user to integrate it directly into hybrids. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 1 of 5 MMIC Power Splitter/Combiner Die 2 Way-0° 50Ω EP2C-D+ 1800 to 12500 MHz Features • • • • • Wide bandwidth, 1800 to 12500 MHz Excellent amplitude unbalance, 0.2 dB typ. Good phase unbalance, 6 deg. typ. High ESD level* DC passing Applications • • • • • • • WIMAX ISM Instrumentation Radar WLAN Satellite communications LTE +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications Ordering Information: Refer to Last Page Electrical Specifications1 at 25°C Parameter Frequency (MHz) Frequency Range Min. Typ. 1800 Insertion Loss, above 3.0 dB Isolation Phase Unbalance Amplitude Unbalance VSWR (Port S) VSWR (Port 1-2) 1800-3800 0.8 3800-8500 0.9 8500-12500 1.4 1800-3800 12.0 3800-8500 19.7 8500-12500 17.9 1800-3800 1.5 3800-8500 3.2 8500-12500 4.9 1800-3800 0.05 3800-8500 0.09 8500-12500 0.23 1800-3800 1.4 3800-8500 1.3 8500-12500 1.3 1800-3800 1.2 3800-8500 1.2 8500-12500 1.3 Max. Unit 12500 MHz dB dB Degree dB :1 :1 1. Measured on Mini-Circuits Die Characterization Test Board. Maximum Ratings2,3 Parameter Operating Temperature Power Input (as a splitter) Internal Dissipation DC Current Pad Connections Ratings Function SUM PORT RF OUT1 RF OUT2 -40°C to 85°C 1.85 W max. 0.85 W max. 0.4 A max RF IN RF OUT1 RF OUT2 GROUND ESD rating3 Human body model (HBM): Class 2(1800 to <4000 V) in accordance with ANSI/ESD 5.1-2007 Machine model (MM): Class M3 (200 to <400 V) in accordance with ANSI/ESD 5.2-2009 Pad Number Bottom of die Simplified Electrical Schematic 2. Permanent damage may occur if any of these limits are exceeded. 3. Tested in industry standard 4x4x1mm MCLP package 24-lead Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] REV. OR M153146 EP2C-D+ RS/CP/AM 160510 Page 2 of 5 EP2C-D+ MMIC Power Splitter/Combiner Die Die Layout Die Layout Bonding Pad Position (Dimensions in µm, Typical) RF OUT1 RF IN RF OUT2 Fig 2. Die Layout Critical Dimension CriticalParameter Dimensions Values Die Thickness, um 200 2650 2600 100 x 125 Parameter Die Width, um Die Length, um Die Thickness, µm Bond Pad Size, um Die Width, µm Die Length, µm Values Fig 3. Bonding Pad Positions 200 2650 2600 Bond Pad Size, µm 100 X 125 Assembly and Handling Procedure 1. Storage Dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. ESD MMIC amplifier dice are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter ESD damage to dice. 3. Die Attach The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s cure condition. It is recommended to use antistatic die pick up tools only. 4. Wire Bonding Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. Assembly Diagram Assembly Diagram RF OUT1 Ground Recommended Wire Length, Typical RF IN Wire Wire Length (mm) Wire Loop Height (mm) RF-IN, RF-OUT1, RF OUT2 0.50 0.15 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. RF OUT2 B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp 1 mil wires should be used forstatement RF inputofand RF output. Note: ThreeThree 1 mil bond wiresbond is required Mini-Circuits ® Recommended Wire Length Wire www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Wire Loop Height Wire Length (mm) (mm) RF In, RF Out 1, RF Out 2 0.50 0.15 Page 3 of 5 EP2C-D+ MMIC Power Splitter/Combiner Die Typical Performance Data Frequency (MHz) 500 1000 1800 2000 2500 3000 3800 5000 6000 8500 9000 10000 12500 13000 14000 Total Loss1 (dB) S-1 S-2 3.76 3.78 3.71 3.68 3.62 3.58 3.54 3.54 3.66 3.78 3.74 3.78 4.35 4.33 4.22 3.76 3.78 3.70 3.67 3.60 3.56 3.52 3.52 3.63 3.73 3.70 3.75 4.21 4.17 4.04 Amplitude Unbalance (dB) Isolation (dB) Phase Unbalance (deg.) VSWR S VSWR 1 0.01 0.00 0.00 0.01 0.02 0.02 0.03 0.03 0.02 0.04 0.04 0.03 0.13 0.16 0.16 5.51 8.11 12.14 12.98 14.73 16.30 19.91 31.05 29.09 23.11 24.99 33.38 18.67 17.64 17.00 0.06 0.00 0.00 0.04 0.02 0.05 0.15 0.27 0.25 0.41 0.43 0.34 0.05 0.11 0.26 1.84 1.78 1.66 1.62 1.51 1.41 1.28 1.15 1.29 1.33 1.17 1.09 1.81 1.75 1.51 1.62 1.54 1.49 1.45 1.30 1.16 1.09 1.12 1.25 1.25 1.15 1.15 1.64 1.55 1.26 VSWR 2 1.62 1.54 1.49 1.45 1.29 1.15 1.09 1.14 1.30 1.26 1.19 1.22 1.63 1.57 1.32 1. Total Loss = Insertion Loss + 3dB splitter loss. EP2C-D+ TOTAL LOSS S-1 (dB) 40 S-2 (dB) ISOLATION (dB) TOTAL LOSS (dB) 4.5 4.0 3.5 3.0 30 20 10 0 0 5000 EP2C-D+ ISOLATION 10000 15000 0 EP2C-D+ PHASE UNBALANCE 0.5 10000 15000 EP2C-D+ VSWR 2.0 0.4 #S-VSWR #1-VSWR #2-VSWR 1.8 0.3 0.2 1.5 1.3 0.1 0.0 5000 FREQUENCY (MHz) VSWR PHASE UNBALANCE (Deg.) FREQUENCY (MHz) 0 5000 10000 1.0 15000 FREQUENCY (MHz) 0 5000 10000 FREQUENCY (MHz) 15000 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 4 of 5 EP2C-D+ MMIC Power Splitter/Combiner Die Additional Detailed Technical Information additional information is available on our dash board. Data Table Performance Data Swept Graphs S-Parameter (S2P Files) Data Set with and without port extension(.zip file) Case Style Die Ordering and packaging information (Note 3) Die Quantity, Package Model No. Small, Gel - Pak: 5,10,50 Medium†, Partial wafer: 350 EP2C-DG+ EP2C-DP+ † Available upon request contact sales representative Refer to AN-60-067 Environmental Ratings ENV-80 3. Dice taken from PCM good wafer. No RF or DC test performed. Additional Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults. E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known Good Dice (including, without limitation, proper ESD preventative measures, die preparation, die attach, wire bond ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental effects on Known Good Dice. F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini- Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such third-party of Mini-Circuits or its products. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 5 of 5