LINER LTM8047 3.1vin to 32vin isolated module dc/dc converter Datasheet

LTM8047
3.1VIN to 32VIN Isolated
µModule DC/DC Converter
Features
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Description
Complete Switch Mode Power Supply
725VDC Isolation
Wide Input Voltage Range: 3.1V to 32V
Up to 440mA Output Current (VOUT = 2.5V)
2.5V to 12V Output Voltage
Current Mode Control
Programmable Soft-Start
User Configurable Undervoltage Lockout
SnPb or RoHS Compliant Finish
Low Profile (11.25mm × 9mm × 4.92mm) Surface
Mount BGA Package
The LTM8047 is packaged in a thermally enhanced, compact (11.25mm × 9mm × 4.92mm) over-molded ball grid
array (BGA) package suitable for automated assembly by
standard surface mount equipment. The LTM8047 is available with SnPb (BGA) or RoHS compliant terminal finish.
Applications
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The LTM®8047 is an isolated flyback µModule DC/DC
converter. The LTM8047 has an isolation rating of 725VDC.
For a similar product with LDO post regulator, see the
LTM8048. Included in the package are the switching
controller, power switches, transformer, and all support
components. Operating over an input voltage range of 3.1V
to 32V, the LTM8047 supports an output voltage range of
2.5V to 12V, set by a single resistor. Only output, input,
and bypass capacitors are needed to finish the design.
Other components may be used to control the soft-start
control and biasing.
Industrial Sensors
Industrial Switches
Ground Loop Mitigation
L, LT, LTC, LTM, Linear Technology, the Linear logo and µModule are registered trademarks of
Linear Technology Corporation. All other trademarks are the property of their respective owners.
Typical Application
Maximum Load vs VIN
725V DC Isolated Low Noise µModule Regulator
RUN
BIAS
4.7µF
6.98k
ADJ
SS
GND
VOUT
5V
280mA
(15VIN)
VOUT
ISOLATION BARRIER
2.2µF
VIN
22µF
VOUT–
725VDC ISOLATION
8047 TA01
MAXIMUM VOUT LOAD (mA)
LTM8047
VIN
3.1V TO 29V
400
350
300
250
200
150
100
0
5
10
15
VIN (V)
20
25
30
8047 TA01b
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1
LTM8047
Absolute Maximum Ratings
Pin Configuration
(Note 1)
TOP VIEW
VIN, RUN, BIAS .........................................................32V
ADJ, SS........................................................................5V
VOUT Relative to VOUT–...............................................16V
(VIN – GND) + (VOUT – VOUT–)....................................36V
BIAS Above VIN......................................................... 0.1V
GND to VOUT– Isolation (Note 2)......................... 725VDC
Maximum Internal Temperature (Note 3)............... 125°C
Maximum Solder Temperature............................... 250°C
A
B
C
BANK 1
VOUT
BANK 2
VOUT–
D
E
F
BANK 3
VIN
G
BANK 4
GND
RUN
ADJ
H
BIAS SS
1
2
3
4
5
6
7
BGA PACKAGE
45-LEAD (11.25mm × 9mm × 4.92mm)
TJMAX = 125°C, θJA = 16°C/W, θJCbottom = 4.1°C/W, θJCtop = 15°C/W, θJB = 4°C/W
WEIGHT = 1.1g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12
order information
PART NUMBER
PAD OR BALL FINISH
DEVICE
PART MARKING*
CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 3)
LTM8047EY#PBF
SAC305 (RoHS)
LTM8047Y
e1
BGA
3
–40°C to 125°C
LTM8047IY#PBF
SAC305 (RoHS)
LTM8047Y
e1
BGA
3
–40°C to 125°C
LTM8047MPY#PBF
SAC305 (RoHS)
LTM8047Y
e1
BGA
3
–55°C to 125°C
LTM8047MPY
SnPb (63/37)
LTM8047Y
e0
BGA
3
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• Pb-free and Non-Pb-free Part Markings:
www.linear.com/leadfree
• BGA Package and Tray Drawings:
www.linear.com/packaging
Electrical Characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C, RUN = 12V (Note 3).
PARAMETER
CONDITIONS
Minimum Input DC Voltage
BIAS = VIN
l
MIN
VOUT DC Voltage
RADJ = 12.4k
RADJ = 6.98k
RADJ = 3.16k
l
4.75
TYP
2.5
5
12
VIN Quiescent Current
VRUN = 0V
Not Switching
850
VOUT Line Regulation
6V ≤ VIN ≤ 31V, IOUT = 0.15A
1.7
MAX
UNITS
3.1
V
5.25
V
V
V
1
µA
µA
%
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LTM8047
Electrical Characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C, RUN = 12V (Note 3).
PARAMETER
CONDITIONS
VOUT Load Regulation
0.05A ≤ IOUT ≤ 0.2A
MIN
1.5
%
VOUT Ripple (RMS)
IOUT = 0.1A
20
mV
Input Short Circuit Current
VOUT Shorted
RUN Pin Input Threshold
RUN Pin Rising
RUN Pin Current
VRUN = 1V
VRUN = 1.3V
TYP
MAX
UNITS
30
1.18
SS Threshold
SS Sourcing Current
SS = 0V
BIAS Current
VIN = 12V, BIAS = 5V, ILOAD1 = 100mA
Minimum BIAS Voltage (Note 4)
ILOAD1 = 100mA
mA
1.24
1.30
V
2.5
0.1
µA
µA
0.7
V
–10
µA
8
mA
3.1
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTM8047 isolation is tested at 725VDC for one second in each
polarity.
Note 3: The LTM8047E is guaranteed to meet performance specifications
from 0°C to 125°C. Specifications over the –40°C to 125°C internal
temperature range are assured by design, characterization and correlation
V
with statistical process controls. LTM8047I is guaranteed to meet
specifications over the full –40°C to 125°C internal operating temperature
range. The LTM8047MP is guaranteed to meet specifications over the
full –55°C to 125°C internal operating temperature range. Note that
the maximum internal temperature is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors.
Note 4: This is the BIAS pin voltage at which the internal circuitry is
powered through the BIAS pin and not the integrated regulator. See BIAS
Pin Considerations for details.
Typical Performance Characteristics
VOUT = 2.5V
BIAS = 5V
80
12VIN
70
24VIN
60
50
Efficiency vs Load
90
VOUT = 3.3V
BIAS = 5V
12VIN
80
EFFICIENCY (%)
EFFICIENCY (%)
Efficiency vs Load
90
24VIN
70
60
0
100
300
200
400
VOUT CURRENT (mA)
500
8047 G01
50
VOUT = 5V
BIAS = 5V
12VIN
80
EFFICIENCY (%)
Efficiency vs Load
90
24VIN
70
60
0
100
300
200
VOUT CURRENT (mA)
400
8047 G02
50
0
50
100 150 200 250
VOUT CURRENT (mA)
300
350
8047 G03
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3
LTM8047
Typical Performance Characteristics
Efficiency vs Load
100
Efficiency vs Load
100
VOUT = 8V
BIAS = 5V
80
24VIN
12VIN
80
24VIN
70
12VIN
7.5
BIAS CURRENT (mA)
12VIN
BIAS Current vs VOUT Load
VOUT = 2.5V
8.0 BIAS = 5V
VOUT = 12V
BIAS = 5V
90
EFFICIENCY (%)
EFFICIENCY (%)
90
8.5
70
7.0
24VIN
6.5
6.0
5.5
5.0
4.5
50
100 150 200 250
VOUT CURRENT (mA)
300
60
350
10
12VIN
BIAS CURRENT (mA)
BIAS CURRENT (mA)
24VIN
6.5
6.0
5.5
5.0
13
0
100
300
200
VOUT CURRENT (mA)
VOUT = 5V
BIAS = 5V
12
24VIN
6
MAXIMUM VOUT LOAD (mA)
11
10
9
24VIN
8
7
6
300
250
8047 G10
8047 G06
BIAS Current vs VOUT Load
12VIN
9
24VIN
8
7
6
Maximum Load vs VIN
350
2.5VOUT
3.3VOUT
5VOUT
5
10
15
VIN (V)
20
100 150 200 250
VOUT CURRENT (mA)
50
25
8047 G11
350
8047 G09
BIAS = VIN IF VIN ≤ 5V
BIAS = 5V IF VIN > 5V
250
200
150
100
50
30
300
Maximum Load vs VIN
300
200
0
0
8047 G08
250
100
500
10
4
350
300
4
100
150
200
VOUT CURRENT (mA)
100 150 200 250
VOUT CURRENT (mA)
350
150
50
50
400
5
0
0
BIAS = VIN IF VIN ≤ 5V
450 BIAS = 5V IF VIN > 5V
12VIN
200
300
400
VOUT CURRENT (mA)
5
8047 G07
500
100
VOUT = 8V
11 BIAS = 5V
12VIN
7
0
8047 G05
8
4
400
BIAS Current vs VOUT Load
VOUT = 12V
12 BIAS = 5V
BIAS CURRENT (mA)
4.0
250
5
4.5
4.0
150
200
100
VOUT CURRENT (mA)
BIAS Current vs VOUT Load
9
7.5
7.0
50
8047 G04
BIAS Current vs VOUT Load
VOUT = 3.3V
8.0 BIAS = 5V
0
BIAS CURRENT (mA)
8.5
0
MAXIMUM VOUT LOAD (mA)
60
0
8VOUT
12VOUT
0
5
15
10
VIN (V)
20
25
8047 12
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LTM8047
Typical Performance Characteristics
30
25
20
15
10
Minimum Load vs VIN
80
8VOUT
12VOUT
9
6
3
5
10
15
VIN (V)
20
25
0
30
9
5
4
3
3.3VIN
5VIN
12VIN
24VIN
0
50
TEMPERATURE RISE (°C)
TEMPERATURE RISE (°C)
6
0
25
40
30
10
30
100 150 200 250 300 350 400
VOUT LOAD CURRENT (mA)
10
3.3VIN
5VIN
12VIN
24VIN
0
50
16 20
VIN (V)
24
28
32
8047 G15
100 150 200 250 300 350 400
VOUT LOAD CURRENT (mA)
7
6
5
4
3
3.3VIN
5VIN
12VIN
24VIN
2
1
0
0
50
100 150 200 250 300
VOUT LOAD CURRENT (mA)
350
8047 G18
Junction Temperature Rise vs
Load Current
VOUT = 8V
12
8
8047 G17
12
8
VOUT = 5V
9
3
0
4
Junction Temperature Rise vs
Load Current
4
2
0
8047 G14
5
1
10
Output Noise and Ripple
VOUT = 12V
10
8
6
4
3.3VIN
5VIN
12VIN
24VIN
2
0
50
100
150
200
250
VOUT LOAD CURRENT (mA)
300
8047 G19
TEMPERATURE RISE (°C)
TEMPERATURE RISE (°C)
20
6
Junction Temperature Rise vs
Load Current
0
15
VIN (V)
7
8047 G16
12
10
VOUT = 3.3V
8
7
1
50
Junction Temperature Rise vs
Load Current
VOUT = 2.5V
2
5
8047 G13
Junction Temperature Rise vs
Load Current
8
0
TEMPERATURE RISE (°C)
0
60
20
5
0
Input Current vs VIN
VOUT Shorted
70
12
INPUT CURRENT (mA)
35
MINIMUM VOUT LOAD (mA)
15
2.5VOUT
3.3VOUT
5VOUT
MINIMUM VOUT LOAD (mA)
40
Minimum Load vs VIN
10mV/DIV
8
6
4
2µs/DIV
3.3VIN
5VIN
12VIN
24VIN
2
0
0
50
100
150
200
VOUT LOAD CURRENT (mA)
8047 G21
12VIN, 5VOUT at 250mA
0.1μF 250V SAFETY CAPACITOR APPLIED
BETWEEN GND AND VOUT–
250
8047 G20
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5
LTM8047
Pin Functions
VOUT (Bank 1): VOUT and VOUT– comprise the isolated
output of the LTM8047 flyback stage. Apply an external
capacitor between VOUT and VOUT–. Do not allow VOUT– to
exceed VOUT.
VOUT– (Bank 2): VOUT– is the return for VOUT. VOUT and
VOUT– comprise the isolated output of the LTM8047. In
most applications, the bulk of the heat flow out of the
LTM8047 is through the GND and VOUT– pads, so the
printed circuit design has a large impact on the thermal
performance of the part. See the PCB Layout and Thermal
Considerations sections for more details. Apply an external
capacitor between VOUT and VOUT–.
GND (Bank 4): This is the primary side local ground of the
LTM8047 primary. In most applications, the bulk of the heat
flow out of the LTM8047 is through the GND and VOUT–
pads, so the printed circuit design has a large impact on
the thermal performance of the part. See the PCB Layout
and Thermal Considerations sections for more details.
VIN (Bank 3): VIN supplies current to the LTM8047’s internal regulator and to the integrated power switch. These
pins must be locally bypassed with an external, low ESR
capacitor.
RUN (Pin F3): A resistive divider connected to VIN and this
pin programs the minimum voltage at which the LTM8047
will operate. Below 1.24V, the LTM8047 does not deliver
power to the secondary. Above 1.24V, power will be delivered to the secondary and 10µA will be fed into the SS
pin. When RUN is less than 1.24V, the pin draws 2.5µA,
allowing for a programmable hysteresis. Do not allow a
negative voltage (relative to GND) on this pin.
ADJ (Pin G7): Apply a resistor from this pin to GND to set
the output voltage, using the recommended value given
in Table 1. If Table 1 does not list the desired VOUT value,
the equation
(
)
RADJ = 28.4 VOUT –0.879 kΩ
may be used to approximate the value. To the seasoned
designer, this exponential equation may seem unusual.
The equation is exponential due to non-linear current
sources that are used to temperature compensate the
output regulation.
BIAS (Pin H5): This pin supplies the power necessary to
operate the LTM8047. It must be locally bypassed with a
low ESR capacitor of at least 4.7μF. Do not allow this pin
voltage to rise above VIN.
SS (Pin H6): Place a soft-start capacitor here to limit inrush
current and the output voltage ramp rate. Do not allow a
negative voltage (relative to GND) on this pin.
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LTM8047
Block Diagram
VOUT1
VIN
•
•
0.1µF
1µF
RUN
BIAS*
SS
CURRENT
MODE
CONTROLLER
VOUT–
ADJ1
GND
8047 BD
*DO NOT ALLOW BIAS VOLTAGE TO BE ABOVE VIN
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7
LTM8047
Operation
The LTM8047 is a stand-alone isolated flyback switching
DC/DC power supply that can deliver up to 440mA of output
current. This module provides a regulated output voltage
programmable via one external resistor from 2.5V to 12V.
The input voltage range of the LTM8047 is 3.1V to 32V.
Given that the LTM8047 is a flyback converter, the output
current depends upon the input and output voltages, so
make sure that the input voltage is high enough to support
the desired output voltage and load current. The Typical
Performance Characteristics section gives several graphs
of the maximum load versus VIN for several output voltages.
A simplified block diagram is given. The LTM8047 contains
a current mode controller, power switching element, power
transformer, power Schottky diode, a modest amount of
input and output capacitance.
The LTM8047 has a galvanic primary to secondary isolation rating of 725VDC. This is verified by applying 725VDC
between the primary to secondary for 1 second and then
applying –725VDC for 1 second. For details please refer
to the Isolation and Working Voltage section.
An internal regulator provides power to the control circuitry. The bias regulator normally draws power from the
VIN pin, but if the BIAS pin is connected to an external
voltage higher than 3.1V, bias power will be drawn from
the external source, improving efficiency. VBIAS must not
exceed VIN. The RUN pin is used to turn on or off the
LTM8047, disconnecting the output and reducing the input
current to 1μA or less.
The LTM8047 is a variable frequency device. For a fixed
input and output voltage, the frequency increases as the
load increases. For light loads, the current through the
internal transformer may be discontinuous.
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LTM8047
Applications Information
For most applications, the design process is straightforward, summarized as follows:
1. Look at Table 1 and find the row that has the desired
input range and output voltage.
2. Apply the recommended CIN, COUT and RADJ.
3. Connect BIAS as indicated, or tie to an external source
up to 15V or VIN, whichever is less.
While these component combinations have been tested for
proper operation, it is incumbent upon the user to verify
proper operation over the intended system’s line, load and
environmental conditions. Bear in mind that the maximum
output current may be limited by junction temperature,
the relationship between the input and output voltage
magnitude and polarity and other factors. Please refer
to the graphs in the Typical Performance Characteristics
section for guidance.
Capacitor Selection Considerations
The CIN and COUT capacitor values in Table 1 are the
minimum recommended values for the associated operating conditions. Applying capacitor values below those
indicated in Table 1 is not recommended, and may result
in undesirable operation. Using larger values is generally
acceptable, and can yield improved dynamic response, if
it is necessary. Again, it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental conditions.
Ceramic capacitors are small, robust and have very low
ESR. However, not all ceramic capacitors are suitable.
X5R and X7R types are stable over temperature and applied voltage and give dependable service. Other types,
including Y5V and Z5U have very large temperature and
voltage coefficients of capacitance. In an application circuit they may have only a small fraction of their nominal
capacitance resulting in much higher output voltage ripple
than expected.
A final precaution regarding ceramic capacitors concerns
the maximum input voltage rating of the LTM8047. A
ceramic input capacitor combined with trace or cable
inductance forms a high-Q (underdamped) tank circuit. If
the LTM8047 circuit is plugged into a live supply, the input
voltage can ring to much higher than its nominal value,
possibly exceeding the device’s rating. This situation is
easily avoided; see the Hot-Plugging Safely section.
LTM8047 Table 1. Recommended Component Values and Configuration for Specific VOUT Voltages (TA = 25°C)
VIN
VOUT
VBIAS
CIN
COUT
RADJ
3.1V to 32V
2.5V
3.1V to 15V or Open
2.2µF, 50V, 1206
100µF, 6.3V, 1210
12.4k
3.1V to 32V
3.3V
3.1V to 15V or Open
2.2µF, 50V, 1206
100µF, 6.3V, 1210
10k
3.1V to 29V
5V
3.1V to 15V or Open
2.2µF, 50V, 1206
22µF, 16V, 1210
6.98k
3.1V to 26V
8V
3.1V to 15V or Open
2.2µF, 50V, 1206
22µF, 10V, 1206
4.53k
3.1V to 24V
12V
3.1V to 15V or Open
2.2µF, 25V, 0805
10µF, 16V, 1210
3.16k
9V to 15V
2.5V
VIN
2.2µF, 50V, 1206
100µF, 6.3V, 1210
12.4k
9V to 15V
3.3V
VIN
2.2µF, 50V, 1206
47µF, 6.3V, 1210
10k
9V to 15V
5V
VIN
2.2µF, 50V, 1206
22µF, 16V, 1210
6.98k
9V to 15V
8V
VIN
2.2µF, 50V, 1206
22µF, 10V, 1206
4.53k
9V to 15V
12V
VIN
2.2µF, 25V, 0805
10µF, 16V, 1210
3.16k
18V to 32V
2.5V
3.1V to 15V or Open
2.2µF, 50V, 1206
100µF, 6.3V, 1210
12.4k
18V to 32V
3.3V
3.1V to 15V or Open
2.2µF, 50V, 1206
47µF, 6.3V, 1210
10k
18V to 29V
5V
3.1V to 15V or Open
2.2µF, 50V, 1206
22µF, 16V, 1210
6.98k
18V to 26V
8V
3.1V to 15V or Open
2.2µF, 50V, 1206
22µF, 10V, 1206
4.53k
18V to 24V
12V
3.1V to 15V or Open
2.2µF, 50V, 1206
10µF, 16V, 1210
3.16k
Note: Do not allow BIAS to exceed VIN, a bulk input capacitor is required.
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9
LTM8047
Applications Information
BIAS Pin Considerations
The BIAS pin is the output of an internal linear regulator
that powers the LTM8047’s internal circuitry. It is set to
3V and must be decoupled with a low ESR capacitor of at
least 4.7μF. The LTM8047 will run properly without applying a voltage to this pin, but will operate more efficiently
and dissipate less power if a voltage greater than 3.1V is
applied. At low VIN, the LTM8047 will be able to deliver
more output current if BIAS is 3.1V or greater. Up to 40V
may be applied to this pin, but a high BIAS voltage will
cause excessive power dissipation in the internal circuitry.
For applications with an input voltage less than 15V, the
BIAS pin is typically connected directly to the VIN pin. For
input voltages greater than 15V, it is preferred to leave the
BIAS pin separate from the VIN pin, either powered from
a separate voltage source or left running from the internal
regulator. This has the added advantage of keeping the
physical size of the BIAS capacitor small. Do not allow
BIAS to rise above VIN.
Soft-Start
For many applications, it is necessary to minimize the
inrush current at start-up. The built-in soft-start circuit
significantly reduces the start-up current spike and output
voltage overshoot by applying a capacitor from SS to GND.
When the LTM8047 is enabled, whether from VIN reaching
a sufficiently high voltage or RUN being pulled high, the
LTM8047 will source approximately 10µA out of the SS
pin. As this current gradually charges the capacitor from
SS to GND, the LTM8047 will correspondingly increase
the power delivered to the output, allowing for a graceful
turn-on ramp.
Isolation and Working Voltage
The LTM8047 isolation is 100% hi-pot tested by tying
all of the primary pins together, all of the secondary pins
together and subjecting the two resultant circuits to a differential of 725VDC for one second and then –725VDC for
one second. This establishes the isolation voltage rating
of the LTM8047 component, and is most often used to
satisfy component safety specifications issued by agencies
such as UL, TUV, CSA and others.
The isolation rating of the LTM8047 is not the same as
the working or operational voltage that the application
will experience. This is subject to the application’s power
source, operating conditions, the industry where the end
product is used and other factors that dictate design requirements such as the gap between copper planes, traces
and component pins on the printed circuit board, as well
as the type of connector that may be used. To maximize
the allowable working voltage, the LTM8047 has a row of
solder balls removed to facilitate the printed circuit board
design. The ball to ball pitch is 1.27mm, and the typical ball
diameter is 0.78mm. Accounting for the missing row and
the ball diameter, the printed circuit board may be designed
for a metal-to-metal separation of up to 1.76mm. This may
have to be reduced somewhat to allow for tolerances in
solder mask or other printed circuit board design rules.
To reiterate, the manufacturer’s isolation voltage rating
and the required operational voltage are often different
numbers. In the case of the LTM8047, the isolation voltage
rating is established by 100% hi-pot testing. The working
or operational voltage is a function of the end product
and its system level specifications. The actual required
operational voltage is often smaller than the manufacturer’s
isolation rating.
For those situations where information about the spacing
of LTM8047 internal circuitry is required, the minimum
metal to metal separation of the primary and secondary
is 0.44mm.
VOUT to VOUT– Reverse Voltage
The LTM8047 cannot tolerate a reverse voltage from VOUT
to VOUT– during operation. If VOUT– raises above VOUT during operation, the LTM8047 may be damaged. To protect
against this condition, a low forward drop power Schottky
diode has been integrated into the LTM8047, anti-parallel
to VOUT/VOUT–. This can protect the output against many
reverse voltage faults. Reverse voltage faults can be both
steady state and transient. An example of a steady state
voltage reversal is accidentally misconnecting a powered
LTM8047 to a negative voltage source. An example of
transient voltage reversals is a momentary connection to
a negative voltage. It is also possible to achieve a VOUT
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10
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LTM8047
Applications Information
reversal if the load is short-circuited through a long cable.
The inductance of the long cable forms an LC tank circuit
with the VOUT capacitance, which drives VOUT negative.
Avoid these conditions.
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8047. The LTM8047 is nevertheless a switching power supply, and care must be taken to
minimize electrical noise to ensure proper operation. Even
with the high level of integration, you may fail to achieve
specified operation with a haphazard or poor layout. See
Figure 1 for a suggested layout. Ensure that the grounding
and heat sinking are acceptable.
A few rules to keep in mind are:
1. Place the RADJ resistor as close as possible to its respective pin.
2. Place the CIN capacitor as close as possible to the VIN
and GND connections of the LTM8047.
3. Place the COUT capacitor as close as possible to VOUT
and VOUT–.
ADJ
VOUT
LTM8047
4. Place the CIN and COUT capacitors such that their
ground current flow directly adjacent or underneath
the LTM8047.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8047.
6. Use vias to connect the GND copper area to the board’s
internal ground planes. Liberally distribute these GND
vias to provide both a good ground connection and
thermal path to the internal planes of the printed circuit
board. Pay attention to the location and density of the
thermal vias in Figure 1. The LTM8047 can benefit from
the heat sinking afforded by vias that connect to internal
GND planes at these locations, due to their proximity
to internal power handling components. The optimum
number of thermal vias depends upon the printed
circuit board design. For example, a board might use
very small via holes. It should employ more thermal
vias than a board that uses larger holes.
The printed circuit board construction has an impact on
the isolation performance of the end product. For example,
increased trace and layer spacing, as well as the choice
of core and prepreg materials (such as using polyimide
versus FR4) can significantly affect the isolation withstand
of the end product.
Hot-Plugging Safely
SS
COUT
BIAS
GND
VOUT–
RUN
CIN
VIN
THERMAL/INTERCONNECT VIAS
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
bypass capacitor of the LTM8047. However, these capacitors can cause problems if the LTM8047 is plugged into a
live supply (see Linear Technology Application Note 88 for
a complete discussion). The low loss ceramic capacitor
combined with stray inductance in series with the power
source forms an underdamped tank circuit, and the voltage at the VIN pin of the LTM8047 can ring to more than
twice the nominal input voltage, possibly exceeding the
LTM8047’s rating and damaging the part. If the input
8047 F01
Figure 1. Layout Showing Suggested External Components,
Planes and Thermal Vias
8047fb
For more information www.linear.com/LTM8047
11
LTM8047
Applications Information
supply is poorly controlled or the user will be plugging
the LTM8047 into an energized supply, the input network
should be designed to prevent this overshoot. This can
be accomplished by installing a small resistor in series
to VIN, but the most popular method of controlling input
voltage overshoot is adding an electrolytic bulk capacitor
to VIN. This capacitor’s relatively high equivalent series
resistance damps the circuit and eliminates the voltage
overshoot. The extra capacitor improves low frequency
ripple filtering and can slightly improve the efficiency of the
circuit, though it can be a large component in the circuit.
Thermal Considerations
The LTM8047 output current may need to be derated if it
is required to operate in a high ambient temperature. The
amount of current derating is dependent upon the input
voltage, output power and ambient temperature. The
temperature rise curves given in the Typical Performance
Characteristics section can be used as a guide. These curves
were generated by the LTM8047 mounted to a 58cm2
4-layer FR4 printed circuit board. Boards of other sizes
and layer count can exhibit different thermal behavior, so
it is incumbent upon the user to verify proper operation
over the intended system’s line, load and environmental
operating conditions.
For increased accuracy and fidelity to the actual application,
many designers use FEA to predict thermal performance.
To that end, the Pin Configuration section of the data sheet
typically gives four thermal coefficients:
θJA: Thermal resistance from junction to ambient
θJCbottom: Thermal resistance from junction to the bottom of the product case
θJCtop: Thermal resistance from junction to top of the
product case
θJB: Thermal resistance from junction to the printed
circuit board.
While the meaning of each of these coefficients may seem
to be intuitive, JEDEC has defined each to avoid confusion
and inconsistency. These definitions are given in JESD
51-12, and are quoted or paraphrased as follows:
θJA is the natural convection junction-to-ambient air
thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to
as still air although natural convection causes the air to
move. This value is determined with the part mounted to a
JESD 51-9 defined test board, which does not reflect an
actual application or viable operating condition.
θJCbottom is the junction-to-board thermal resistance with
all of the component power dissipation flowing through the
bottom of the package. In the typical µModule converter,
the bulk of the heat flows out the bottom of the package,
but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may
be useful for comparing packages but the test conditions
don’t generally match the user’s application.
θJCtop is determined with nearly all of the component power
dissipation flowing through the top of the package. As the
electrical connections of the typical µModule converter are
on the bottom of the package, it is rare for an application
to operate such that most of the heat flows from the junction to the top of the part. As in the case of θJCbottom, this
value may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
θJB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
µModule converter and into the board, and is really the
sum of the θJCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a two-sided,
two-layer board. This board is described in JESD 51-9.
Given these definitions, it should now be apparent that none
of these thermal coefficients reflects an actual physical
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12
For more information www.linear.com/LTM8047
LTM8047
Applications Information
operating condition of a µModule converter. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 2.
The blue resistances are contained within the µModule
converter, and the green are outside.
The die temperature of the LTM8047 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8047. The bulk of the heat flow out of the LTM8047
is through the bottom of the module and the BGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
CASE (BOTTOM)-TO-BOARD
JUNCTION-TO-CASE
RESISTANCE
(BOTTOM) RESISTANCE
AMBIENT
BOARD-TO-AMBIENT
RESISTANCE
8047 F02
µMODULE DEVICE
Figure 2.
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For more information www.linear.com/LTM8047
13
LTM8047
Typical Applications
Maximum Load vs VIN
3.3V Isolated Flyback Converter
LTM8047
VIN
BIAS
10k
ADJ
SS
ISOLATION BARRIER
RUN
2.2µF
340
VOUT
3.3V
280mA
(10VIN)
VOUT
MAXIMUM VOUT LOAD (mA)
VIN
9V TO 15V
4.7µF
350
47µF
VOUT–
GND
725VDC ISOLATION
330
320
310
300
290
280
270
260
8047 TA02
250
9
10
11
12
VIN (V)
13
14
15
8047 TA02b
Use Two LTM8047 Flyback Converters to Generate ±5V
LTM8047
VIN
BIAS
4.7µF
6.98k
ADJ
SS
1µF
ISOLATION BARRIER
RUN
5V
280mA
(15VIN)
VOUT
Maximum Load Current vs VIN
22µF
400
–
GND
VOUT
725VDC ISOLATION
22µF
LTM8047
VIN
RUN
BIAS
4.7µF
6.98k
ADJ
SS
1µF
GND
ISOLATION BARRIER
2.2µF
VOUT
MAXIMUM VOUT LOAD (mA)
VIN
3.5V TO 31V
2.2µF
350
300
250
200
150
100
22µF
VOUT–
725VDC ISOLATION
8047 TA03
5
10
20
15
VIN (V)
25
30
8047 TA03b
–5V
280mA
(15VIN)
8047fb
14
For more information www.linear.com/LTM8047
LTM8047
Package Description
Pin Assignment Table
(Arranged by Pin Number)
PIN NAME
A1 VOUT–
A2 VOUT–
A3 VOUT–
A4 VOUT–
A5 VOUT–
A6 VOUT
A7 VOUT
PIN NAME
B1 VOUT–
B2 VOUT–
B3 VOUT–
B4 VOUT–
B5 VOUT–
B6 VOUT
B7 VOUT
PIN NAME
C1 VOUT–
C2 VOUT–
C3 VOUT–
C4 VOUT–
C5 VOUT–
C6 VOUT
C7 VOUT
PIN NAME
D1 D2 D3 D4 D5 D6 D7 -
PIN NAME
E1 GND
E2 GND
E3 GND
E4 GND
E5 GND
E6 GND
E7 GND
PIN NAME
F1 F2 F3 RUN
F4 GND
F5 GND
F6 GND
F7 GND
PIN NAME
G1 VIN
G2 VIN
G3 G4 GND
G5 GND
G6 GND
G7 ADJ
PIN NAME
H1 VIN
H2 VIN
H3 H4 GND
H5 BIAS
H6 SS
H7 GND
Package Photo
8047fb
For more information www.linear.com/LTM8047
15
4
For more information www.linear.com/LTM8047
E
SUGGESTED PCB LAYOUT
TOP VIEW
2.540
PACKAGE TOP VIEW
1.270
PIN “A1”
CORNER
0.3175
0.000
0.3175
aaa Z
1.270
Y
4.445
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
D
X
4.7625
4.1275
aaa Z
3.95 – 4.05
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
NOM
4.92
0.60
4.32
0.78
0.63
11.25
9.0
1.27
8.89
7.62
DIMENSIONS
0.15
0.10
0.20
0.30
0.15
MAX
5.12
0.70
4.42
0.85
0.66
NOTES
DETAIL B
PACKAGE SIDE VIEW
TOTAL NUMBER OF BALLS: 45
MIN
4.72
0.50
4.22
0.71
0.60
DETAIL A
b1
0.27 – 0.37
SUBSTRATE
ddd M Z X Y
eee M Z
DETAIL B
MOLD
CAP
ccc Z
A1
A2
A
Z
(Reference LTC DWG # 05-08-1869 Rev A)
Øb (45 PLACES)
// bbb Z
16
2.540
b
3
F
e
SEE NOTES
7
5
4
3
2
1
DETAIL A
PACKAGE BOTTOM VIEW
6
G
H
G
F
E
D
C
B
A
PIN 1
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
7
TRAY PIN 1
BEVEL
!
BGA 45 1212 REV A
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
5. PRIMARY DATUM -Z- IS SEATING PLANE
BALL DESIGNATION PER JESD MS-028 AND JEP95
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
7
SEE NOTES
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
COMPONENT
PIN “A1”
BGA Package
BGA Package
45-Lead (11.25mm
× 9.00mm × 4.92mm)
45-Lead
(11.25mm
× 4.92mm)
(Reference
LTC DWG× #9.00mm
05-08-1869
Rev A)
LTM8047
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
8047fb
3.810
3.810
LTM8047
Revision History
REV
DATE
DESCRIPTION
A
1/14
Correct ADJ resistor on Typical Application schematic.
1
Add Min/Max limits to Output Voltage parameter.
2
B
1/14
PAGE NUMBER
Correct the 5VOUT RADJ value in Table 1.
9
Correct the 5VOUT RADJ value in schematic.
14
Added SnPb terminal finish product option
1, 2
8047fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its circuits
as described
herein will not infringe on existing patent rights.
For more
information
www.linear.com/LTM8047
17
LTM8047
Typical Application
12V Isolated Flyback Converter
2.2µF
RUN
BIAS
4.7µF
3.16k
ADJ
SS
VOUT
12V
180mA
(15VIN)
VOUT
10µF
VOUT–
GND
725VDC ISOLATION
8047 TA04
240
MAXIMUM VOUT LOAD (mA)
LTM8047
VIN
ISOLATION BARRIER
VIN
15VDC TO 24VDC
Maximum Load vs VIN
250
230
220
210
200
190
180
170
160
150
15
18
21
VIN (V)
24
8047 TA04b
Related Parts
PART NUMBER
DESCRIPTION
COMMENTS
LTM8031
Ultralow Noise EMC 1A µModule Regulator
EN55022 Class B Compliant, 3.6V ≤ VIN ≤ 36V; 0.8V ≤ VOUT ≤ 10V
LTM8032
Ultralow Noise EMC 2A µModule Regulator
EN55022 Class B Compliant, 3.6V ≤ VIN ≤ 36V; 0.8V ≤ VOUT ≤ 10V
LTM8033
Ultralow Noise EMC 3A µModule Regulator
EN55022 Class B Compliant, 3.6V ≤ VIN ≤ 36V; 0.8V ≤ VOUT ≤ 24V
LTM4612
Ultralow Noise EMC 5A µModule Regulator
EN55022 Class B Compliant, 5V ≤ VIN ≤ 36V; 3.3V ≤ VOUT ≤ 15V
LTM8061
Li-Ion/Polymer µModule Battery Charger
4.95V ≤ VIN ≤ 32V, 2A, 1-Cell and 2-Cell, 4.1V or 4.2V per Cell
LTM8048
Isolated DC/DC µModule Regulator with LDO
Post Regulator
Low Noise LDO Post Regulator, Similar to the LTM8047
8047fb
18 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LTM8047
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LTM8047
LT 0114 REV B • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2011