DRV2604 www.ti.com SLOS824 – DECEMBER 2012 Haptic Driver for ERM and LRA with Internal Memory and Smart Loop Architecture Check for Samples: DRV2604 FEATURES DESCRIPTION • The DRV2604 is designed to give extremely flexible haptic control of ERM and LRA actuators over a shared I2C compatible bus. This relieves the host processor from ever generating pulse-width modulated (PWM) drive signals, saving both costly timer interrupts and hardware pins. 1 • • • • • • • • • • (1) Flexible Haptic/Vibra Driver – LRA (Linear Resonance Actuator) – ERM (Eccentric Rotating Mass) I2C Controlled Digital Playback Engine – Internal RAM for Customized Waveforms – Real-Time Playback Mode via I2C Smart Loop Architecture(1) – Automatic Overdrive/Braking (ERM/LRA) – Automatic Resonance Tracking (LRA) – Automatic Actuator Diagnostic (ERM/LRA) – Automatic Level Calibration (ERM/LRA) Optional PWM Input with 0% to 100% Duty Cycle Control Range Optional Analog Input Control Optional Hardware Trigger Pin Efficient Output Drive Fast Start Up Time Constant Acceleration Over Supply Voltage 1.8 V Compatible, VDD Tolerant Digital Pins Available in a 9-Ball, 0.5 mm Pitch WCSP The DRV2604 includes enough integrated RAM to allow the user to pre-load over 100 customized waveforms. These waveforms can be instantly played back via I2C or optionally triggered via a hardware trigger pin. Additionally, the real-time playback mode allows the host processor to bypass the library playback engine and play waveforms directly from the host via I2C. The DRV2604 also contains a smart loop architecture, which allows effortless auto resonant drive for LRA as well as feedback-optimized ERM drive. This feedback gives automatic overdrive and braking, which creates a simplified input waveform paradigm as well as reliable motor control and consistent motor performance. The DRV2604 features a trinary-modulated output stage, providing greater efficiency than linear-based output drivers. The 9-ball WCSP footprint, flexible operation, and low component count make the DRV2604 the ideal choice for portable and touchenabled vibratory and haptic applications. Patent pending control algorithm APPLICATIONS • • • Mobile Phones Tablets Touch-Enabled Devices CVREG 2.5 V – 5.5 V VDD DRV2604 I2C Control EN IN/Trigger SDA I2C I/F RAM Feedback Detection REG SCL OUT+ Playback Engine Auto Calibration Auto Diagnostic LRA or DC Motor Driver GND OUT- 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 12-Dec-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Samples (3) (Requires Login) DRV2604YZFR ACTIVE DSBGA YZF 9 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM DRV2604YZFT ACTIVE DSBGA YZF 9 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Dec-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device DRV2604YZFR Package Package Pins Type Drawing SPQ DSBGA 3000 YZF 9 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 1.65 B0 (mm) K0 (mm) P1 (mm) 1.65 0.81 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Dec-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV2604YZFR DSBGA YZF 9 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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