Skyworks CLA4606-219 Silicon limiter diodes, packaged and bondable chip Datasheet

DATA SHEET
CLA Series: Silicon Limiter Diodes, Packaged and Bondable
Chips
Applications
x Limiters
Features
x Established Skyworks limiter diode process
x High power, mid-range, and cleanup designs
x Low insertion loss: 0.1 dB @ 10 GHz
x Power handling to +66 dBm
x Tight control of I layer base width
x Mesa and planar chip designs
Description
Skyworks CLA series of silicon limiter diodes provides passive
receiver protection over a wide range of frequencies from
100 MHz to over 30 GHz. These devices use Skyworks wellestablished silicon technology resulting in high resistivity and
tightly controlled base width PIN limiter diodes. Limiter circuits
using these devices perform with strong limiting action and low
loss.
The CLA series consists of nine individual chip designs of different
intrinsic region base widths and capacitances designed to
accommodate multi-stage limiter applications. The mesaconstructed, thin base width, low capacitance CLA4601-000,
CLA4602-000, CLA4604-000, and CLA4605-000 are designed for
low-level and cleanup applications. The CLA4603-000 and
CLA4606-000 through CLA4608-000 are planar designs
designated for high-power and mid-range applications.
The CLA4609-000 thick base width mesa diode is designed for
coarse limiter-stage applications.
The absolute maximum ratings of the CLA diode series are
provided in Table 1. Electrical specifications are specified in
Table 2. Typical performance characteristics are provided in
Table 3 and Figures 1 through 5. Table 4 identifies the die part
numbers with their corresponding top contact diameters and die
outline drawings. Table 5 identifies the hermetic part numbers
together with their thermal resistance specifications and hermetic
outline drawings.
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DATA SHEET • CLA SERIES DIODES
Table 1. CLA Series Absolute Maximum Ratings
Parameter
Symbol
Minimum
Typical
Maximum
Units
Power dissipation
PDIS
Maximum TJ Case Temp
Thermal Re sis tan ce junctiontocase
W
Reverse voltage
VR
Minimum rated breakdown voltage
V
Forward current
IF
200
mA
Junction temperature
TJ
–65
+175
qC
Storage temperature
TSTG
–65
+200
qC
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. CLA Series Electrical Specifications (Note 1)
(TOP = +25 qC, CJ Measured at 1 MHz, RS Measured at 500 MHz, CW Thermal Resistance for Infinite Heat Sink, Pulse Thermal Resistance
for Single 1 μs Pulse, Unless Otherwise Noted)
Part Number
Breakdown
Voltage (V)
I Region
(μm)
Junction
Capacitance
(CJ) @ 0 V
(pF)
Junction
Capacitance
(CJ) @ 6 V
(pF)
Series
Resistance (RS)
@ 10 mA
(Ω)
Minority
Carrier
Lifetime (TL)
@ 10 mA
(ns)
Average
(qC/W)
1 μs Pulse
(qC/W)
Thermal Impedance (θ)
Min – Max
Nominal
Typical
Maximum
Maximum
Typical
Maximum
Typical
CLA4601-000
15 – 30
1
0.12
0.10
2.5
5
120
15
CLA4602-000
15 – 30
1
0.20
0.15
2.0
5
80
10
CLA4603-000
20 – 45
1.5
0.20
0.15
2.0
5
100
10
CLA4604-000
30 – 60
2.0
0.12
0.10
2.5
7
100
10
CLA4605-000
30 – 60
2.0
0.20
0.15
2.0
7
70
7.0
CLA4606-000
45 – 75
2.5
0.20
0.15
2.0
10
80
7.0
CLA4607-000
120 – 180
7.0
0.20
0.15 @ 50 V
2.0
50
40
1.2
CLA4608-000
120 – 180
7.0
0.80
0.50 @ 50 V
1.2
100
15
0.3
CLA4609-000
250 (Min.)
28
0.26
0.14
1.5
1175
15
0.3
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated
temperatures may reduce reliability of the device.
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DATA SHEET • CLA SERIES DIODES
Table 3. Typical Performance @ 25 °C
Part Number
Insertion Loss
@ –10 dBm
(dB)
Input Power for
1 dB Loss
(dBm)
Maximum Pulsed
Input Power
(dBm)
Output @ Maximum
Pulsed Input
(dBm)
Maximum CW
Input power
(W)
Recovery Time
(ns)
CLA4601-000
0.1
7
47
21
2
5
CLA4602-000
0.1
7
50
24
3
5
CLA4603-000
0.1
10
50
22
2
10
CLA4604-000
0.1
12
47
24
3
10
CLA4605-000
0.1
12
50
27
4
10
CLA4606-000
0.1
15
53
27
3
20
CLA4607-000
0.1
20
60
39
6
50
CLA4608-000
0.2
20
66
44
15
100
CLA4609-000
0.3
38
70
50
20
1000
Notes:
Insertion loss for CLA4601-000 through CLA4607-000 @ 10 GHz. Insertion loss for CLA4608-000 @ 5 GHz. Insertion loss for CLA4609-000 @ 2.1 GHz.
Limiter power results @ 1 GHz for shunt connected, single limiter diode and DC return in 50 Ω line.
Maximum pulsed power for 1 μs pulse and 0.1% duty factor with chip @ 25 °C heat sink. Derate linearly to 0 W @ 175 °C.
Maximum CW input power @ 25 °C heat sink. Derate linearly to 0 W @ 175 °C.
Recovery time to insertion loss from limiting state.
Table 4. CLA Series Parts – Die Packages
Part Number
Typical Top Contact Diameter (mils/mm)
Die Drawing
CLA4601-000
1.10/0.028
150-806
CLA4602-000
1.25/0.032
150-806
CLA4603-000
2.00/0.050
149-815
CLA4604-000
1.65/0.042
150-806
CLA4605-000
2.05/0.052
150-813
CLA4606-000
2.25/0.057
149-815
CLA4607-000
3.50/0.089
149-815
CLA4608-000
7.50/0.190
149-815
CLA4609-000
6.50/0.165
150-813
Table 5. Hermetic Packages
Hermetic Stripline
Drawing
Typical θJC
(°C/W)
Hermetic Pill
Drawing
Typical θJC
(°C/W)
Hermetic Pill
Drawing
Typical θJC
(°C/W)
Hermetic Pill
Drawing
Typical θJC
(°C/W)
CLA4601-240
200
CLA4601-203
150
CLA4601-219
200
CLA4601-210
140
CLA4602-240
160
CLA4602-203
110
CLA4602-219
160
CLA4602-210
100
CLA4603-240
180
CLA4603-203
130
CLA4603-219
180
CLA4603-210
120
CLA4604-240
160
CLA4604-203
130
CLA4604-219
180
CLA4604-210
120
CLA4605-240
150
CLA4605-203
100
CLA4605-219
150
CLA4605-210
90
CLA4606-240
160
CLA4606-203
110
CLA4606-219
160
CLA4606-210
100
CLA4607-240
120
CLA4607-203
70
CLA4607-219
120
CLA4607-210
60
CLA4608-240
100
CLA4608-203
45
CLA4608-219
100
CLA4608-210
35
CLA4609-240
100
CLA4609-203
45
CLA4609-219
100
CLA4609-210
35
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DATA SHEET • CLA SERIES DIODES
Typical Performance Characteristics at 25 °C
+50
100
Output Power (dBm)
+30
Pulsed Thermal Impedance °C/W
Normalized to 1 μs
CLA4607
+40
CLA4606
CLA4604
CLA4603
+20
CLA4601
+10
0
0
+10
+20
+30
+40
+50
+60
CLA4608
CLA4607
10
CLA4601/2
CLA4606
CLA4603/4/5
1
1.00E-06
+66
1.00E-04
Input Power (dBm)
Figure 2. Normalized Pulsed Thermal Impedance
+50
0.5
Bonding Wires
50 Ω
0.4
Single Diode Section
Peak Power Output (dBm)
Diode Chip
RP 50 Ω
50 Ω CJ
0.50 pF
0.30 pF
0.3
0.15 pF
0.2
0.1
2
4
6
8
10
12
14
16
Frequency (GHz)
Figure 3. Typical Diode Insertion Loss vs Frequency
18
Diode 50 Ω
Chip
+40
CLA4607
+30
CLA4606
CLA4604
CLA4603
+20
CLA4601
+10
0
0
0
+10
+20
+30
+40
+50
+60
Peak Output Power Input (dBm)
Figure 4. Typical Peak Leakage Power @ 1 GHz
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1.00E+00
Pulse Width (sec)
Figure 1. Typical Peak Leakage Power @ 1 GHz
Insertion Loss (dB)
1.00E-02
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+66
Power Derating Factor
DATA SHEET • CLA SERIES DIODES
1.00
0.75
0.50
0.25
–50
0
+50
+100
+150
Case Temperature (°C)
Figure 5. Power Handling Capability vs Temperature
Technical Description
The CLA4603 and CLA4606 limiter diodes are constructed in a
passivated flat-chip configuration and are available in a basic chip
form or encapsulated in several Skyworks hermetic ceramic
packages.
Limiter diodes with lower capacitance values to 0.08 pF and
constructed with a passivated mesa configuration are available in
the CLA4601 and CLA4605 series. The mesa devices offer low
capacitance and, therefore, broader bandwidth, lower loss, and
faster response at reduced power. These diodes are also available
in chip package form and represent the ultimate in limiter
performance not approached by other manufacturers.
The CLA4607 diodes (highest power) are available in both planar
and mesa construction.
Figures 6 and 7 illustrate the fundamental structures of diodes
mounted in a 50 Ω microstrip circuit.
Additional bonding and handling methods are contained in the
Skyworks Application Notes, Waffle Pack Chip Carrier
Handling/Opening Procedure (document #200146) and Diode
Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and
Packaging (document #200146).
Basic Applications
In microstrip limiters, the bonding wire length and diameter
together with the chip capacitance, form a low-pass filter (see
Figure 8). Line lengths (X1 and X2) are varied to provide
broadband matching and flat leakage characteristics. Typically,
X1 and X2 are on the order of 0.1 wavelength. In Figure 9, the
CLA4607 chip provides about 20 dB attenuation, reducing a 1 kW
input signal to a 10 W output signal. The CLA4606 reduces this to
100 mW and the CLA4603 to about 20 mW.
During the rise time of the incident pulse, the diodes behave in
the following manner. The CLA4603, due to its thin I region, is the
first to change to a low impedance. Experiments indicate that the
CLA4603 reaches the 10 dB isolation point in about 1 ns and
20 dB in 1.5 ns with an incident power of 10 W.
The CLA4606 takes about 4 ns and the CLA4607 about 50 ns to
achieve 10 dB isolation. Consequently, the CLA4603 provides
protection during the initial stages of pulse rise time with the
thicker diodes progressively “turning on” as the power increases.
With proper spacing (X1 and X2), the “on” diodes reflect high
impedances to the upstream diodes, reducing the turn-on time for
those diodes and ensuring that essentially all of the incident
power is reflected by the input diode, preventing burnout of the
thinner diodes.
At the end of the pulse the process reverses and the diodes
“recover” to their high impedance states; the free charge that
was injected into their I regions by the high-incident power signal
leaks off through the ground return and is also reduced by internal
recombination. With a ground return, recovery time is on the order
of 50 ns. With a high impedance return (for example, the circuit
shown in Figure 10), the Schottky diode (such as the CDF7621-000)
recovers or “opens” in practically zero time. Internal recombination
on the order of several diode lifetimes is the only available
mechanism for recovery of the limiter diodes. This recovery time
can be long – on the order of 1 ms for the CLA4607 series. The
shunt resistor (RR) minimizes the problem. One hundred Ohms
approximately doubles the recovery time compared to a short circuit.
When the Schottky diode is directly coupled to the transmission
line in cascade after the coarse limiter, the leakage power is less
than if a 0 Ω ground return were used. If the Schottky is
decoupled too much, the leakage power increases due to the high
DC impedance of a Schottky. Similarly, a 3 Ω ground return
causes an increase of about 3 dB in leakage power compared to a
0 Ω return.
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DATA SHEET • CLA SERIES DIODES
50 Ω
Connector
0.020 in.
Typ.
0.001 in. Gold Wire
Bond, Typical
Ground
Solder or
Plane Epoxy Die Bond
Microstrip Board
TFG 0.006 in. Thick, Typical
Figure 6. Diodes in 50 Ω Microstrip Circuit (Side View)
Diode, Typical
TFG Board
Ground
Return
X1
50 Ω
Conductor
0.022 in., Typical
X2
Figure 7. Diodes in 50 Ω Microstrip Circuit (Top View)
Coil for Ground Return
X1
50 Ω
CJ
RR
X2
CJ
RP
CJ
RP
50 Ω
Figure 8. Low-Level Equivalent Circuit
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DATA SHEET • CLA SERIES DIODES
RF
CLA4607 &
CLA4609
Ground
Return
<1Ω
CLA4606
CLA4603
Receiver
Figure 9. Cascaded Limiter Design
CLA4607
Schottky Barrier
CDF7621
RR
RF
Receiver
Figure 10. Quasi-Active Limiter Design
Coil for Ground Return
X2
X1
50 Ω
RS
RS
RS
50 Ω
Figure 11. High-Power Equivalent Circuit
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DATA SHEET • CLA SERIES DIODES
Package Outline Drawings
Package outline die drawings for the CLA diode series are shown
in Figures 12, 13, and 14. Hermetic package outlines are shown
in Figures 15 through 18.
Die Packages
Schematic
1
Anode
Top Contact, Gold
0.002 (0.050 mm)
Dia. Min.
2
0.014 ± 0.001
(0.325 ± 0.025 mm)
0.014 ± 0.001
(0.325 ± 0.025 mm)
0.004 (0.010 mm)
0.006 (0.015 mm) Nom.
1
Cathode Metallized Back
Contact, Gold
2
S1565
Figure 12. 149-815 Package
Schematic
1
Anode
Metallized
Gold Dot
0.010 (0.251 mm) Min.
0.014 (0.356 mm) Max. Sq.
2
150-801:
0.002 (0.051 mm) Min.
150-806:
0.0011 (0.028 mm) Nom.
0.004 (0.127 mm) Min.
0.006 (0.152 mm) Max.
1
Silicon
2
Cathode Metallized Back
Contact: Gold
S1567
Figure 13. 150 Series Package
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DATA SHEET • CLA SERIES DIODES
Die Packages (Continued)
Schematic
1
Metallized Gold Dot
0.002 (0.05 mm) Min. Dia.
2
0.014 ± 0.001
(± 0.025 mm)
0.014 ± 0.001
(± 0.025 mm)
Silicon
Metallized Back
Contact Gold
1
0.005
(0.13 mm) Nom.
S1566
2
Figure 14. 150-813 Package
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DATA SHEET • CLA SERIES DIODES
Hermetic Packages
Schematic
N-Type
1
1
0.050 (1.27 mm)
0.040 (1.02 mm)
2
2
0.055 (1.40 mm)
0.051 (1.30 mm)
Dia.
S1569
Figure 15. -203 Package
Schematic
1
0.064 (1.63 mm)
0.060 (1.52 mm)
2 Places
0.124 (3.15 mm)
0.119 (3.02 mm) Dia.
2
1
0.025 (0.63 mm)
Max.
0.097 (2.46 mm)
0.83 (2.11 mm)
0.225 (5.72 mm)
0.205 (5.20 mm)
2
0.064 (1.63 mm)
0.060 (1.52 mm)
0.083 (2.20 mm)
0.077 (1.95 mm)
S1570
Figure 16. -210 Package
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DATA SHEET • CLA SERIES DIODES
Hermetic Packages (Continued)
Schematic
1
2
0.075 (1.91 mm)
0.065 (1.65 mm)
Sq.
Cathode
0.020 (0.51 mm) Typ.
0.033 (0.84 mm)
Min.
0.045 (1.14 mm)
0.030 (0.76 mm)
1
2
0.010 (0.24 mm)
Ref.
S1564
Figure 17. -219 Package
Schematic
1
-011 (240)
50°
45°
0.175 (4.44 mm)
0.125 (3.18 mm)
2 Plcs.
1
0.098 (2.49 mm)
0.092 (2.34 mm)
Cover Dia.
2
2
0.022 (0.56 mm)
0.018 (0.46 mm)
2 Plcs.
Colored Dot
Denotes Cathode
0.104 (2.64 mm)
0.092 (2.34 mm)
Sq.
0.005 (1.27 mm)
0.003 (0.76 mm)
0.042 (1.06 mm)
0.028 (0.71 mm)
S1568
Figure 18. -240 Package
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DATA SHEET • CLA SERIES DIODES
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