Gunter Semiconductor GmbH GFCF30 N Channel High Voltage, Power MOSFET Chip Specification General Description: * Advanced Process Technology * Dynamic dV/dt Rating * 150℃ ℃ Operating Temperature * Fast Switching * Fully Avalanche Rated * High Breakdown Voltage Mechanical Data: D17 Dimension 4.42mm x 5.23mm 480 µm Thickness: Metallization: Al Top : : CrNiAg / Au Backside : Suggested Bonding Conditions: Die Mounting: Solder Perform 95/5 PbSn or 92.5./2.5/5 PbAgIn Source Bonding Wire: 10 mil Al Absolute Maximum Rating Characteristics @Ta=25℃ ℃ Symbol Limit Unit Test Conditions Drain-to-Source Breakdown Voltage V(BR)DSS 900 V VGS=0V, ID=250µΑ Static Drain-to - Source On-resistance RDS(ON) 4 Ω VGS=10V, ID=2.2Α Continuous Drain current ( in target package) ID@25℃ 3.6 A VGS=10V Continuous Drain current ( in target package) ID@100℃ 2.3 A VGS=10V Tj -55~175 ℃ TSTR -55~175 ℃ PD 125 W Operation Junction Storage Temperature Target Device: IRFBF30 TO-220AB @Tc=25℃