Material Content Data Sheet Sales Product Name SAB-C161O-LM 3V HA MA# MA000455572 Package PG-MQFP-80-7 Issued 29. August 2013 Weight* 989.87 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 17.388 1.76 0.375 0.04 379 1.624 0.16 1640 7.494 0.76 240.318 24.28 25.24 242776 252366 3.906 0.39 0.39 3946 3946 2.096 0.21 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.76 17566 17566 7571 2117 88.729 8.96 607.826 61.41 70.58 614043 705797 9.487 0.96 0.96 9584 9584 7.024 0.71 0.71 7096 7096 0.722 0.07 2.887 0.29 89636 729 0.36 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2917 3646 1000000