MCP1252/3
Low-Noise, Positive-Regulated Charge Pump
Features:
Description:
• Inductorless, Buck/Boost, DC/DC Converter
• Low Power: 80 µA (Typical)
• High Output Voltage Accuracy:
- ±2.5% (VOUT Fixed)
• 120 mA Output Current
• Wide Operating Temperature Range:
- Industrial Temperature (I): -40°C to +85°C
- Extended Temperature (E): -40°C to +125°C
• Thermal Shutdown and Short-Circuit Protection
• Uses Small Ceramic Capacitors
• Switching Frequency:
- MCP1252: 650 kHz
- MCP1253: 1 MHz
• Low-Power Shutdown Mode: 0.1 µA (Typical)
• Shutdown Input Compatible with 1.8V Logic
• VIN Range: 2.0V to 5.5V
• Selectable Output Voltage (3.3V or 5.0V) or
Adjustable Output Voltage
• Space-Saving, 8-Lead MSOP
• Soft-Start Circuitry to Minimize In-Rush Current
• AEC-Q100 Qualified
The MCP1252/3 are inductorless, positive-regulated
charge pump DC/DC converters. The devices generate
a regulated fixed (3.3V or 5.0V) or adjustable output
voltage. They are specifically designed for applications
requiring low noise and high efficiency and are able to
deliver up to 120 mA output current. The devices allow
the input voltage to be lower or higher than the output
voltage, by automatically switching between buck/
boost operation.
Applications:
•
•
•
•
•
•
•
White LED Backlighting
Color Display Bias
Local 3V-to-5V Conversions
Flash Memory Supply Voltage
SIM Interface Supply for GSM Phones
Smart Card Readers
PCMCIA Local 5V Supplies
The MCP1252 has a switching frequency of 650 kHz,
avoiding interference with sensitive IF bands. The
MCP1253 has a switching frequency of 1 MHz and
allows the use of smaller capacitors than the
MCP1252, thus saving board space and cost.
Both devices feature a power-good output that can be
used to detect out-of-regulation conditions. Extremely
low supply current and low external parts count (three
capacitors) make these devices ideal for small, batterypowered applications. A shutdown mode is also provided for further power reduction. The MCP1252 and
MCP1253 feature thermal and short-circuit protection
and are offered in space-saving, 8-lead, MSOP
packages.
Package Types
MSOP (Fixed)
8
SELECT
MCP1252
7
SHDN
3 MCP1253
6
C+
4
5
C-
PGOOD
1
VOUT
2
VIN
GND
MSOP (Adjustable)
1
8
FB
VOUT
2 MCP1252
7
SHDN
VIN
3 MCP1253
6
C+
4
5
C-
PGOOD
GND
2002-2014 Microchip Technology Inc.
DS20001752C-page 1
MCP1252/3
Functional Block Diagram
MCP1252-33X50
MCP1253-33X50
PGOOD
140 k
SELECT
+
-
173 k
84 mV
+
1.21V
+
100 k
+
+
VOUT
200 mV
+
SHDN
C+
C-
Switch
Control
VIN
GND
MCP1252-ADJ
MCP1253-ADJ
PGOOD
FB
+
84 mV
+
1.21V
+
+
+
VOUT
200 mV
+
Switch
Control
SHDN
C+
C-
VIN
GND
DS20001752C-page 2
2002-2014 Microchip Technology Inc.
MCP1252/3
1.0
ELECTRICAL
CHARACTERISTICS
†Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
Power Supply Voltage, VIN ...............................................6.0V
Voltage on Any Pin w.r.t. GND ............... -0.3V to (VIN + 0.3V)
Output Short Circuit Duration ................................continuous
Storage Temperature Range .........................-65°C to +150°C
Ambient Temperature with Power Applied ....-55°C to +125°C
Junction Temperature ................................................. +150°C
ESD Ratings:
Human Body Model (1.5 k in Series with 100 pF) 4 kV
Machine Body Model (200 pF, No Series Resistance)400V
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40°C to +85°C ("I" Temperature), TA = -40°C
to +125°C ("E" Temperature), SHDN = VIN, CIN = COUT = 10 µF, CFLY = 1 µF, IOUT = 10 mA. Typical values are for TA = +25°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = VIN, VOUT = 3.3V
VIN
2.1
—
5.5
V
Output Voltage Accuracy
VOUT
-2.5
±0.5
+2.5
%
Output Current
IOUT
Supply Voltage
SELECT Logic Input Voltage High
VIH
2.3V VIN < 2.5V, IOUT 80 mA
2.5V VIN 5.5V, IOUT120 mA
80
100
—
mA
2.3V VIN < 2.5V
120
150
—
mA
2.5V VIN 5.5V
1.4
—
—
V
MCP1252-33X50, MCP1253-33X50
Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = GND, VOUT = 5.0V
VIN
2.7
—
5.5
V
Output Voltage Accuracy
VOUT
-2.5
±0.5
+2.5
%
Output Current
IOUT
mA
Supply Voltage
SELECT Logic Input Voltage Low
VIL
40
80
—
120
150
—
—
—
0.4
V
V
2.7V VIN < 3.0V, IOUT 40 mA
3.0V VIN5.5V, IOUT120 mA
2.7V VIN < 3.0V
3.0V VIN 5.5V
MCP1252-33X50, MCP1253-33X50
Adjustable Output - MCP1252-ADJ, MCP1253-ADJ
VIN
2.0
—
5.5
VOUT
1.5
—
5.5
V
VOUT(MAX) < 2 x VIN
VFB
1.18
1.21
1.24
V
MCP1252-ADJ, MCP1253-ADJ
Supply Current
IDD
—
60
120
µA
No load
Output Short-Circuit Current
ISC
—
200
—
mA
VOUT = GND, foldback current
ISHDN
—
0.1
2.0
µA
SHDN = 0V
—
81
—
%
VIN = 3.0V, VOUT = 5V
IOUT =120 mA
—
68
—
Supply Voltage
Output Voltage Adjustment Range
FB Regulation Voltage
ALL DEVICES
Shutdown Current
Power Efficiency
VIN = 3.6V, VOUT = 5V
IOUT =120 mA
SHDN Logic Input Voltage Low
VIL
—
—
0.4
V
SHDN Logic Input Voltage High
VIH
1.4
—
—
V
PGOOD_VOL
—
0.01
—
V
PGOOD Threshold Voltage
VTH
—
0.93VOUT
—
V
PGOOD Hysteresis
VHYS
—
0.04VOUT
—
V
PGOOD Output Voltage
2002-2014 Microchip Technology Inc.
IPGOOD = 0.5 mA
DS20001752C-page 3
MCP1252/3
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40°C to +85°C ("I" Temperature), TA = -40°C
to +125°C ("E" Temperature), SHDN = VIN, CIN = COUT = 10 µF, CFLY = 1 µF, IOUT = 10 mA. Typical values are for TA = +25°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Internal Oscillator Frequency
FOSC
520
650
780
kHz
800
1000
1200
Ripple Voltage
VRIP
—
50
—
mVp-p
—
45
—
mVp-p
MCP1253
µsec
VIN = 3.6V, IOUT = 10 mA,
SHDN = VIH(MIN),
VOUT from 0 to 90% Nominal
Regulated Output Voltage
VOUT Wake-Up Time From Shutdown TWKUP
Conditions
MCP1252
MCP1253
MCP1252
—
200
—
SELECT = VIN
—
300
—
SELECT = GND
TEMPERATURE SPECIFICATIONS
Parameters
Symbol
Min.
TA
-40
-40
Typ.
Max.
Units
—
+85
°C
—
+125
Conditions
Temperature Ranges:
Specified Temperature Range
"I" Temperature range
"E" Temperature range
Maximum Operating Junction
Temperature
TJ
—
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
206
—
°C/W
Thermal Package Resistances:
Thermal Resistance, 8 Pin MSOP
DS20001752C-page 4
Single-Layer SEMI G42-88
board, Natural Convection
2002-2014 Microchip Technology Inc.
MCP1252/3
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10 µF, CFLY = 1 µF, all capacitors X7R ceramic.
5.04
10 mA
5.03
5.02
80 mA
120 mA
5.01
MCP1252-33X50
SELECT = GND
OUT
V
= 5.0V
5.00
Percent Efficiency (%)
Output Voltage (V)
5.05
4.99
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
100
90
80
70
60
50
40
30
20
10
0
10 mA
MCP1252-33X50
SELECT = GND
VOUT = 5.0V
2.0
6.0
80 mA
120 mA
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Supply Voltage (V)
FIGURE 2-1:
Output Voltage vs. Supply
Voltage (MCP1252-33X50).
FIGURE 2-4:
Percent Efficiency vs.
Supply Voltage (MCP1252-33X50).
.
Power Efficiency (%)
Output Voltage (V)
3.34
80 mA
3.33
120 mA
3.32
10 mA
MCP1252-33X50
SELECT = VIN
VOUT = 3.3V
3.31
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
100
90
80
70
60
50
40
30
20
10
0
10 mA
80 mA
120 mA
MCP1252-33X50
SELECT = VIN
VOUT = 3.3V
2.0
6.0
2.5
3.0
Supply Voltage (V)
FIGURE 2-2:
Output Voltage vs. Supply
Voltage (MCP1252-33X50).
10 mA
80 mA
MCP1252-ADJ
VOUT = 3.0V
2.99
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
FIGURE 2-3:
Output Voltage vs. Supply
Voltage (MCP1252-ADJ).
2002-2014 Microchip Technology Inc.
Power Efficiency (%)
Output Voltage (V)
3.01
120 mA
4.0
4.5
5.0
5.5
6.0
FIGURE 2-5:
Power Efficiency vs. Supply
Voltage (MCP1252-33X50).
3.02
3.00
3.5
Supply Voltage (V)
100
90
80
70
60
50
40
30
20
10
0
10 mA
80 mA
120 mA
MCP1252-ADJ
VOUT = 3.0V
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
FIGURE 2-6:
Power Efficiency vs. Supply
Voltage (MCP1252-ADJ).
DS20001752C-page 5
MCP1252/3
Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10 mF, CFLY = 1 mF, all capacitors X7R ceramic.
80
Output Voltage (V)
MCP1253-33X50
5.02
5.01
MCP1252-33X50
5.00
SELECT = GND
VOUT = 5.0V
IOUT = 120 mA
4.99
Supply Current (uA)
5.03
70
VIN = 3.6V
65
VIN = 2.7V
60
55
VIN = 2.3V
50
45
MCP1253-33X50
SELECT = GND
VOUT = 5.0V, IOUT = 0 mA
40
4.98
-40 -25 -10 5
-40 -25 -10
20 35 50 65 80 95 110 125
Temperature (°C)
FIGURE 2-7:
Output Voltage vs.
Temperature (MCP1252-33X50,
MCP1253-33X50).
3.31
MCP1252-33X50
3.30
SELECT = VIN
VOUT = 3.3V
IOUT = 120 mA
3.29
Supply Current (uA)
3.32
20 35 50 65 80 95 110 125
FIGURE 2-10:
Quiescent Current vs.
Temperature (MCP1253-33X50).
80
MCP1253-33X50
5
Temperature (°C)
3.33
Output Voltage (V)
VIN = 5.5V
75
75
70
VIN = 5.5V
VIN = 3.6V
65
60
VIN = 2.7V
55
50
MCP1252-33X50
SELECT = GND
VOUT = 5.0V, IOUT = 0 mA
VIN = 2.3V
45
40
3.28
-40 -25 -10 5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
Temperature (°C)
FIGURE 2-8:
Output Voltage vs.
Temperature (MCP1252-33X50,
MCP1253-33X50).
FIGURE 2-11:
Quiescent Current vs.
Temperature (MCP1252-33X50).
FIGURE 2-9:
FIGURE 2-12:
DS20001752C-page 6
Line Transient Response.
Load Transient Response.
2002-2014 Microchip Technology Inc.
MCP1252/3
Output Voltage Ripple (mV)
Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10mF, CFLY = 1mF, all capacitors X7R ceramic.
70
60
50
40
30
80 mA
10 mA
120 mA
20
MCP1252-33X50
SELECT = GND
VOUT = 5.0V
10
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
FIGURE 2-16:
Time.
Output Voltage Ripple vs.
FIGURE 2-14:
Output Voltage Ripple vs.
Supply Voltage (MCP1252-33X50).
FIGURE 2-17:
Time.
Output Voltage Ripple vs.
FIGURE 2-15:
FIGURE 2-18:
Start-Up (MCP1253-33X50).
FIGURE 2-13:
Output Voltage Ripple vs.
Supply Voltage (MCP1252-33X50).
Output Voltage Ripple (mV)
70
60
50
40
30
120 mA
80 mA
10 mA
MCP1252-33X50
SELECT = VIN
VOUT = 3.3V
20
10
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Start-Up (MCP1252-33X50).
2002-2014 Microchip Technology Inc.
DS20001752C-page 7
MCP1252/3
3.0
PIN FUNCTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Name
1
PGOOD
2
VOUT
3
VIN
4
GND
5
C-
Open-Drain Power GOOD Output
Regulated Output Voltage
Power Supply Input
Ground Terminal
Flying Capacitor Negative Terminal
6
C+
Flying Capacitor Positive Terminal
7
SHDN
Shutdown Mode, Active-Low Input
8
SELECT
FB
3.1
Function
Output Voltage Select Pin (MCP1252-33X50, MCP1253-33X50)
Feedback Input Pin for Adjustable Output (MCP1252-ADJ, MCP1253-ADJ)
Open-Drain Power Good Output
(PGOOD)
3.6
Flying Capacitor Positive Terminal
(C+)
PGOOD is a high-impedance when the output voltage
is in regulation. A logic-low is asserted when the output
falls 7% (typical) below the nominal value. The PGOOD
output remains low until VOUT is within 3% (typical) of
its nominal value. On start-up, this pin indicates when
the output voltage reaches its final value. PGOOD is
high-impedance when SHDN is low.
The charge pump capacitor (flying capacitor) is used to
transfer charge from the input supply to the regulated
output.
3.2
Bypass to GND with a filter capacitor.
A logic-low signal applied to SHDN disables the device.
A logic-high signal applied to this pin allows normal
operation.
3.3
3.8
Regulated Output Voltage (VOUT)
Power Supply Input (VIN)
It is recommended that VIN be tied to a ceramic bypass
capacitor.
3.4
Ground (GND)
It is recommended that the ground pin be tied to a
ground plane for best performance.
3.5
Flying Capacitor Negative
Terminal (C-)
The charge pump capacitor (flying capacitor) is used to
transfer charge from the input supply to the regulated
output.
Proper orientation is imperative when using a polarized
capacitor.
3.7
Shutdown Input (SHDN)
Select (SELECT) Input or
Feedback (FB) Input
MCP1252-33X50, MCP1253-33X50:
SELECT: Select Input Pin.
Connect SELECT to VIN for 3.3V fixed output. Connect
SELECT to GND for a 5.0V fixed output.
MCP1252-ADJ, MCP1253-ADJ:
FB: Feedback Pin.
A resistor divider connected to this pin determines the
adjustable VOUT value (1.5V to 5.5V).
It is recommended that a low ESR (equivalent series
resistance) capacitor be used.
DS20001752C-page 8
2002-2014 Microchip Technology Inc.
MCP1252/3
4.0
DEVICE OVERVIEW
4.1
Theory of Operation
The MCP1252 and MCP1253 family of devices employ
a switched capacitor charge pump to buck or boost an
input supply voltage (VIN) to a regulated output voltage.
Referring to the Functional Block Diagram and
Figure 4-1, the devices perform conversion and
regulation in three phases. When the devices are not in
shutdown mode and a steady-state condition has been
reached, the three phases are continuously cycled
through. The first phase transfers charge from the input
to the flying capacitor (CFLY) connected to pins C+ and
C-. This phase always occurs for half of the internal
oscillator period. During this phase, switches S1 and S2
are closed.
START
PHASE 1:
Charge Transfer
From VIN to CFLY
No
Yes
PHASE 2:
Idle State
Once the first phase is complete, all switches are
opened and the second phase (idle phase) is entered.
The device compares the internal or external feedback
voltage with an internal reference. If the feedback voltage is below the regulation point, the device transitions
to the third phase.
The devices automatically transition between buck or
boost operation. This provides a low-cost, compact and
simple solution for step-down/step-up DC/DC
conversion. This is especially true for battery-operated
applications that require a fixed output above or below
the input.
2002-2014 Microchip Technology Inc.
Yes
VFB > VREF
No
The third phase transfers energy from the flying capacitor to the output capacitor connected to VOUT and the
load. If regulation is maintained, the device returns to
the idle phase. If the charge transfer occurs for half the
internal oscillator period, more charge is needed in the
flying capacitor and the device transitions back to the
first phase.
The regulation control is hysteretic, otherwise referred
to as a bang-bang control. The output is regulated
around a fixed reference with some hysteresis. As a
result, typically 50 mV of peak-to-peak ripple will be
observed at the output independent of load current.
The frequency of the output ripple, however, will be
influenced heavily by the load current and output
capacitance. The maximum frequency that will be
observed is equal to the internal oscillator frequency.
1
t 1 = ---------------2F OSC
PHASE 3:
Charge Transfer
From CFLY to COUT
1
t 3 = ---------------2F OSC
Yes
No
No
VFB > VREF
Yes
FIGURE 4-1:
Flow Algorithm.
DS20001752C-page 9
MCP1252/3
4.2
Power Efficiency
4.6
Thermal Shutdown
The power efficiency, , is determined by the mode of
operation. In boost mode, the efficiency is
approximately half of a linear regulator. In buck mode,
the efficiency is approximately equal to that of a linear
regulator. The following formulas can be used to
approximate the power efficiency with any significant
amount of output current. At light loads, the quiescent
current of the device must be taken into consideration.
The MCP1252 and MCP1253 feature thermal
shutdown with temperature hysteresis. When the die
temperature exceeds 160°C, typically, the device shuts
down. When the die cools by 15°C, typically, the device
automatically turns back on. If high die temperature is
caused by output overload and the load is not removed,
the device will turn on and off, resulting in a pulse
output.
EQUATION 4-1:
5.0
BOOST
P OUT
V OUT I OUT
V OUT
= ------------- = ------------------------------------ = -----------------PIN
VIN 2 I OUT
V IN 2
V OUT IOUT
V OUT
P OUT
BUCK = ------------= -------------------------------- = ------------PIN
V IN I OUT
VIN
APPLICATIONS
The MCP1252 and MCP1253 are inductorless,
positive-regulated, charge pump DC/DC converters. A
typical circuit configuration for the fixed output version
is depicted in Figure 5-1. The adjustable version is
depicted in Figure 5-2.
SELECTABLE OUTPUT VOLTAGE
MCP1252-33X50
6
4.3
CFLY
Shutdown Mode
Driving SHDN low places the MCP1252 or MCP1253 in
a low-power shutdown mode. This disables the charge
pump switches, oscillator and control logic, reducing
the quiescent current to 0.1 µA (typical). The PGOOD
output is in a high-impedance state during shutdown.
5
2.7V to 5.5V
C+
PGOOD Output
The PGOOD output is an open-drain output that sinks
current when the regulator output voltage falls below
0.93VOUT (typical). The output voltage can either be
fixed when the selectable output device is chosen
(MCP1252-33X50, MCP1253-33X50) or adjustable
from an external resistive divider when the adjustable
device is chosen (MCP1252-ADJ, MCP1253-ADJ). If
the regulator output voltage falls below 0.93VOUT
(typical) for less than 200 µsec and then recovers,
glitch-immunity circuits prevent the PGOOD signal
from transitioning low. A 10 k to 1 M pull-up resistor
from PGOOD to VOUT may be used to provide a logic
output. Connect PGOOD to GND or leave unconnected
if not used.
4.5
Soft-Start and Short-Circuit
Protection
The MCP1252 and MCP1253 feature foldback shortcircuit protection. This circuitry provides an internal
soft-start function by limiting in-rush current during
startup and also limits the output current to 200 mA
(typical) if the output is shorted to GND. The internal
soft-start circuitry requires approximately 300 µsec,
typical with a 5V output, from either initial power-up or
release from shutdown for the output voltage to be in
regulation.
DS20001752C-page 10
+
C-
RPU
3 V
IN
+
PGOOD
CIN
7
SELECT
SHDN
ON
4.4
+5.0V ±2.5%
VOUT 2
1
8
GND
4
OFF
Shutdown
Control
COUT
PGOOD Flag
To PIC®
Microcontroller
CFLY = 1 µF
CIN = 10 µF
COUT = 10 µF
RPU = 100 k
FIGURE 5-1:
Typical Circuit Configuration
for Fixed Output Device.
ADJUSTABLE OUTPUT VOLTAGE
MCP1252-ADJ
6
CFLY
5
2.7V to 5.5V
+
7
OFF
Shutdown
Control
VOUT 2
+4.0V
RPU
C-
3 V
IN
CIN
ON
C+
+ COUT
R1
PGOOD 1
SHDN
GND
4
FB 8
VOUT = 1.21V (1 + R1/R2)
PGOOD Flag
To PIC®
Microcontroller
R2
CFLY = 1 µF
CIN = 10 µF
COUT = 10 µF
RPU = 100 k
R1 = 23.2 k
R2 = 10 k
FIGURE 5-2:
Typical Circuit Configuration
for Adjustable Output Device.
2002-2014 Microchip Technology Inc.
MCP1252/3
5.1
Capacitor Selection
The style and value of capacitors used with the
MCP1252 and MCP1253 family of devices determine
several important parameters such as output voltage
ripple and charge pump strength. To minimize noise
and ripple, it is recommended that low ESR (0.1 )
capacitors be used for both CIN and COUT. These
capacitors should be either ceramic or tantalum and
should be 10 µF or higher. Aluminum capacitors are not
recommended because of their high ESR.
If the source impedance to VIN is very low, up to several
megahertz, CIN may not be required. Alternatively, a
somewhat smaller value of CIN may be substituted for
the recommended 10 µF, but will not be as effective in
preventing ripple on the VIN pin.
The value of COUT controls the amount of output voltage ripple present on VOUT. Increasing the size of
COUT will reduce output ripple at the expense of a
slower turn-on time from shutdown and a higher in-rush
current.
The flying capacitor (CFLY) controls the strength of the
charge pump. In order to achieve the maximum rated
output current (120 mA), it is necessary to have at least
1 µF of capacitance for the flying capacitor. A smaller
flying capacitor delivers less charge per clock cycle to
the output capacitor, resulting in lower output ripple.
The output ripple is reduced at the expense of maximum output current and efficiency.
5.2
Output Voltage Setting
The MCP1252-33X50 and MCP1253-33X50 feedback
controllers select between an internally-set, regulated
output voltage (3.3V or 5.0V). Connect SELECT to
GND for a regulated 5.0V output and connect SELECT
to VIN for a regulated 3.3V output.
The MCP1252-ADJ and MCP1253-ADJ utilize an
external resistor divider that allows the output voltage
to be adjusted between 1.5V and 5.5V. For an adjustable output, connect a resistor between VOUT and FB
(R1) and another resistor between FB and GND (R2). In
the following equation, choose R2 to be less than or
equal to 30 k and calculate R1 from the following
formula:
Note that the tolerance of the external resistors will
have an effect on the accuracy of the output voltage.
For optimum results, it is recommended that the
external resistors have a tolerance no larger than 1%.
5.3
Recommended Layout
The MCP1252 and MCP1253 family of devices transfer
charge at high switching frequencies, producing fast,
high peak, transient currents. As a result, any stray
inductance in the component layout will produce
unwanted noise in the system. Proper board layout
techniques are required to ensure optimum performance. Figure 5-3 depicts the recommended board
layout. The input capacitor connected between VIN and
GND, and the output capacitor connected between
VOUT and GND, are 10 µF ceramic, X7R dielectric, in
1206 packages. The flying capacitor connected
between C+ and C- is a 1 µF ceramic, X7R dielectric in
a 0805 package. The layout is scaled 3:1.
PGOOD
VOUT
SELECT
SHDN
C+
GND
C-
VIN
FIGURE 5-3:
Recommended Printed
Circuit Board Layout.
EQUATION 5-1:
R 1 = R 2 V OUT V FB – 1
and:
EQUATION 5-2:
V OUT = V FB 1 + R 1 R 2
where:
VOUT is the desired output voltage from 1.5V to 5.5V
VFB is the internal regulation voltage, nominally 1.21V
2002-2014 Microchip Technology Inc.
DS20001752C-page 11
MCP1252/3
6.0
TYPICAL APPLICATION CIRCUITS
Single Cell Lithium-Ion Battery To 5V Converter
1 µF
5
6
C3
Single
Li-Ion
Cell
+ 10 µF
-
7
100 k
1
C+
VIN
VOUT
SHDN
SELECT
PGOOD
GND
2
8
5V
10 µF
4
MCP1252-33X50
White LED Bias
1 µF
5
6
C-
C+
UP TO 6 WHITE LEDS
3
Single
Li-Ion
Cell
+ 10 µF
-
7
100 k
1
VIN
VOUT
SHDN
SELECT
PGOOD
GND
2
8
10 µF
59
4
59
59
59
59
59
MCP1252-ADJ
PWM Contrast
Control
Alternative White LED Bias
1 µF
5
C-
6
C+
UP TO 6 WHITE LEDS
3
Single
Li-Ion
Cell
+ 10 µF
-
7
100 k
1
VIN
SHDN
VOUT
SELECT
2
8
10 µF
24k
10k
PGOOD
GND
4
10
10
10
10
10
10
MCP1252-ADJ
PWM Contrast
Control
DS20001752C-page 12
2002-2014 Microchip Technology Inc.
MCP1252/3
7.0
PACKAGING INFORMATION
7.1
Package Marking
8-Lead MSOP (Fixed)
Example:
1252SX
412256
8-Lead MSOP (Adjustable)
Example:
1253DJ
1253EX
412256
412256
OR
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2002-2014 Microchip Technology Inc.
DS20001752C-page 13
MCP1252/3
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001752C-page 14
2002-2014 Microchip Technology Inc.
MCP1252/3
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2014 Microchip Technology Inc.
DS20001752C-page 15
MCP1252/3
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001752C-page 16
2002-2014 Microchip Technology Inc.
MCP1252/3
APPENDIX A:
REVISION HISTORY
Revision C (July 2014)
The following is the list of modifications:
1.
Added the Extended Temperature (E) option
and related information throughout the
document.
Revision B (January 2013)
The following is the list of modifications:
1.
Added a note to each package outline drawing.
2002-2014 Microchip Technology Inc.
DS20001752C-page 17
MCP1252/3
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
PART NO.
Device
-XXX
Tape and Reel
Option
X
Temperature
Voltage
Option Range
/XX
Package
Examples:
a)
b)
MCP1252: Low-Noise, Positive-Regulated Charge Pump
MCP1252T: Low-Noise, Positive-Regulated Charge Pump
(Tape and Reel)
MCP1253: Low-Noise, Positive-Regulated Charge Pump
MCP1253T: Low-Noise, Positive-Regulated Charge Pump
(Tape and Reel)
Tape and Reel Option: T
ADJ
= Adjustable Voltage
33X50 = Selectable Voltage
Temperature Range:
I
E
= -40C to +85C
= -40C to +125C
Package:
MS
=
DS20001752C-page 18
a)
b)
= Tape and Reel(1)
Output Voltage:
c)
c)
(Industrial)
(Extended) (MCP1253 only)
Plastic Micro Small Outline (MSOP), 8-lead
MCP1252-33X50I/MS: Low-Noise, Positive-Regulated Charge Pump, Fixed Output
MCP1252-ADJI/MS: Low-Noise, PositiveRegulated Charge Pump, Adjustable Output
MCP1252T-33X50I/MS: Tape and Reel,
Low-Noise, Positive-Regulated Charge
Pump, Fixed Output
MCP1253-33X50I/MS: Low-Noise, Positive-Regulated Charge Pump, Fixed Output
MCP1253-ADJI/MS:
Low-Noise, Positive-Regulated Charge Pump, Adjustable
Output
MCP1253T-ADJI/MS: Tape and Reel,
Low-Noise, Positive-Regulated Charge
Pump, Adjustable Output
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
2002-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-373-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2002-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001752C-page 19
Worldwide Sales and Service
AMERICAS
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EUROPE
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Technical Support:
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DS20001752C-page 20
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03/25/14
2002-2014 Microchip Technology Inc.