UMS CHR3861-QEG20 6-9ghz integrated down converter Datasheet

CHR3861-QEG
RoHS COMPLIANT
6-9GHz Integrated Down Converter
GaAs Monolithic Microwave IC in SMD package
Description
The CHR3861-QEG is a multifunction part,
which integrates a balanced cold FET mixer,
a LO bufffer, and a RF LNA including gain
control. It is designed for a wide range of
applications, typically ISM and commercial
communication systems.
UMS
R3861
YYWW
The circuit is manufactured on a pHEMT
process, 0.25µm gate length.
20
It is supplied in lead-free SMD package.
16
Main Features
12
Gain (dB)
■ RF performance 5.9-9.0GHz
■ 12dB conversion gain
■ 1dBm Input IP3
■ 9dB Gain Control
■ 15dBc Image Rejection
■ 24LQFN4x5
■ ESD protected
8
4
0
GC3= -1.5V
-0.7V
-0.6V
-0.5V
-0.4V
0V
-4
6
6.5
7
7.5
8
8.5
9
RF Frequency (GHz)
Main Characteristics
Tamb = +25°C, Vd = 4V
Symbol
Parameter
Min
Typ
Max
Unit
FRF
RF frequency range
5.9
9.0
GHz
FLO
LO frequency range
3.0
12.5
GHz
FIF
IF frequency range
DC
3.5
GHz
Gc
Conversion gain
12
dB
ESD Protections: Electrostatic discharge sensitive device observe handling precautions!
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
1/18
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - BP46 - 91401 Orsay Cedex France
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
9.5
6-9GHz Down Converter
CHR3861-QEG
Electrical Characteristics
Tamb = +25°C, VD = VD1 = 4V
Configuration 1: High linearity with GC4 fixed at 0V
Symbol
Parameter
Min
Typ
Max
Unit
FRF
RF frequency range
5.9
9.0
GHz
FLO
LO frequency range
3.0
12.5
GHz
FIF
IF frequency range
DC
3.5
GHz
Gc
Conversion gain @ min. attenuation (1)
12
dB
∆G
Gain control range with only Gc3
9
dB
NF
Noise Figure @ min. attenuation, for
IF>0.1GHz
2.5
dB
Image rejection (1)
15
dBc
PLO
LO Input power
0
dBm
IIP3
Input IP3@ at Gc max.
1
dBm
DC drain voltage
4
V
Total drain current at Gc max.
380
mA
LNA DC gate voltage
-0.3
V
-4
V
Im_rej
VD, VD1
Id
VG
B
LO buffer & X2 DC voltage
GC3
Gain control DC voltage
-1.5
0
V
GC4
Gain control DC voltage
0
0
V
(1) An external combiner 90° is required on I / Q.
These values are representative of on board measurements as defined on the drawing at
paragraph “Evaluation mother board”.
Note: Id not affected by GC3, GC4.
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
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Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Configuration 2: High Gain & low Noise with GC3 = GC4
Symbol
Parameter
Min
Typ
Max
Unit
FRF
RF frequency range
5.9
9.0
GHz
FLO
LO frequency range
3.0
12.5
GHz
FIF
IF frequency range
DC
3.5
GHz
Gc
Conversion gain@ min. attenuation (1)
22
dB
∆G
Gain control range with Gc3=GC4
18
dB
NF
Noise Figure@ min. attenuation
2
dB
Image rejection (1)
15
dBc
PLO
LO Input power
0
dBm
IIP3
Input IP3@ at Gc max.
-6
dBm
DC drain voltage
4
V
Total drain current at Gc max.
380
mA
LNA DC gate voltage
-0.3
V
-4
V
Im_rej
VD, VD1
Id
VG
B
LO buffer & Mixer DC voltage
GC3, GC4 Gain control DC voltage
-1.5
0
V
(1) An external combiner 90° is required on I / Q.
These values are representative of on board measurements as defined on the drawing at
paragraph “Evaluation mother board”.
Note: Id not affected by GC3, GC4.
Note: Electrostatic discharge sensitive device observe handling precautions!
RefDSCHR3861-QEG1192 - 11 Jul 11
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Absolute Maximum Ratings (1)
Tamb = +25°C
Symbol
Parameter
Values
Unit
VD, VD1
Maximum drain bias voltage
4.5
V
Id
Maximum drain bias current
450
mA
-2.0 to 0.4
V
-5
V
-2 to 1
V
VG
B
LNA DC gate voltage
Buffer & Mixer DC voltage
GCx
Gain control voltage
P_RF
Maximum peak input power overdrive
10
dBm
P_LO
Maximum LO input power
5
dBm
175
°C
(1)
Tch
Maximum channel temperature
Ta
Operating temperature range
-40 to +85
°C
Storage temperature range
-55 to +125
°C
Tstg
(1) Operation of this device above anyone of these paramaters may cause permanent
damage.
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
4/18
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Device thermal performances
All the figures given in this section are obtained assuming that the QFN device is cooled
down only by conduction through the package thermal pad (convection mode not
considered).
The temperature is monitored at the package back-side interface (Tcase) as shown below.
The system maximum temperature must be adjusted in order to guarantee that Tcase
remains below than the maximum value specified in the next table. So, the system PCB must
be designed to comply with this requirement.
A derating must be applied on the dissipated power if the Tcase temperature can not be
maintained below than the maximum temperature specified in order to guarantee the nominal
device life time (MTTF) (see the curve Pdiss. Max below).
DEVICE THERMAL SPECIFICATION : CHR3861-QEG
Recommended max. junction temperature (Tj max)
:
164
Junction temperature absolute maximum rating
:
175
Max. continuous dissipated power (Pdiss. Max.)
:
1.5
=> Pdiss. Max. derating above Tcase(1)= 85
°C :
19
Junction-Case thermal resistance (Rth J-C)(2)
:
<51
Minimum Tcase operating temperature(3)
:
-40
Maximum Tcase operating temperature(3)
:
85
Minimum storage temperature
:
-55
Maximum storage temperature
:
150
°C
°C
W
mW/°C
°C/W
°C
°C
°C
°C
(1) Derating at junctio n temperature co nstant = Tj max.
(2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased.
(3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w).
1.6
1.2
1
0.8
0.6
0.4
Pdiss. Max. @Tj <Tj max (W)
0.2
0
-50
-25
0
25
50
75
100
125
150
175
Tcase
Pdiss. Max. @Tj <Tj max (W)
1.4
Example: QFN 16L 3x3
Location of temeprature
reference point (Tcase)
on package's bottom side
Tcase (°C)
6.1
RefDSCHR3861-QEG1192 - 11 Jul 11
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Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Typical Measured Performances
Tamb = +25°C, VD = VD1 = 4V, VG = -0.3V, B = -4V, P_LO = 0dBm
If no specific mention, the following values are representative of onboard measurements (on
connector access planes) as defined on the drawing at paragrah “Evaluation mother board”.
The board losses are estimated from 0.5 to 0.7dB in the frequency range.
Configuration 1: High linearity
Gain versus GC3 with GC4 = 0V
20
16
Gain (dB)
12
8
4
0
GC3= -1.5V
-0.7V
-0.6V
-0.5V
-0.4V
0V
-4
6
6.5
7
7.5
8
8.5
9
9.5
RF Frequency (GHz)
Input IP3 versus GC3 at RF = 6.2GHz & GC4 = 0V
20
16
Input IP3 (dBm)
12
8
4
0
-4
GC3= -1.5V
-8
-0.7V
-0.6V
-0.5V
-0.4V
0V
-12
-23
-21
-19
-17
-15
-13
-11
-9
Input power DCL (dBm)
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
6/18
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Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Input IP3 versus RF frequency at GC3 = -1.5V & GC4 = 0V
20
16
Input IP3 (dBm)
12
8
4
0
-4
RF= 6.15GHz
7.65GHz
-8
6.65GHz
8.15GHz
7.15GHz
8.65GHz
-12
-23
-21
-19
-17
-15
-13
-11
-9
Input power DCL (dBm)
Noise figure versus temperature with GC3 = -1.5V, GC4 = 0V & IF = 1.4GHz
8
7
-40°C
25°C
85°C
Noise Figure (dB)
6
5
4
3
2
1
0
5
5.5
6
6.5
7
7.5
8
8.5
9
9.5
10
RF Frequency (GHz)
RefDSCHR3861-QEG1192 - 11 Jul 11
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Noise figure versus GC3 with GC4 = 0V at 25°C & IF = 1.4GHz
8
7
Noise Figure (dB)
6
5
4
3
2
1
GC3= -1.5V
-0.4V
-0.7V
-0.2V
-0.6V
0V
-0.5V
0
7
7.5
8
8.5
9
9.5
10
10.5
11
RF Frequency (GHz)
Configuration 2: High Gain & High dynamic
Gain versus GC3 = GC4
24
20
Gain (dB)
16
12
8
4
0
GC3=GC4= -1.5V
-0.7V
-0.6V
-0.5V
-0.4V
0V
-4
6
6.5
7
7.5
8
8.5
9
9.5
RF Frequency (GHz)
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
8/18
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Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Input IP3 at RF=6.2GHz with GC3 = GC4
20
16
Input IP3 (dBm)
12
GC3 & GC4= -1.5V
-0.7V
-0.6V
-0.5V
-0.4V
0V
8
4
0
-4
-8
-12
-23
-21
-19
-17
-15
-13
-11
-9
Input power DCL (dBm)
Noise figure versus temperature with GC3 = GC4 at max. Gain & IF = 1.4GHz
8
7
-40°C
Noise Figure (dB)
6
25°C
85°C
5
4
3
2
1
0
5
5,5
6
6,5
7
7,5
8
8,5
9
9,5
10
RF Frequency (GHz)
RefDSCHR3861-QEG1192 - 11 Jul 11
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Image rejection versus IF with GC3 = GC4 at max. Gain
40
35
Image Rejection (dB)
30
25
20
15
10
IF=1.4GHz
5
2GHz
2.5GHz
3.5GHz
0
5.5
6
6.5
7
7.5
8
8.5
9
9.5
RF Frequency (GHz)
Conversion Gain versus IF with GC3 = GC4 at max. Gain
RF = LO - IF
30
Conversion Gain (dB)
26
22
18
14
IF=1.4GHz
2GHz
2.5GHz
3.5GHz
10
5.5
6
6.5
7
7.5
8
8.5
9
9.5
RF Frequency (GHz)
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
10/18
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Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Conversion Gain versus IF with GC3 = GC4 at max. Gain
RF = LO + IF
30
Conversion Gain (dB)
26
22
18
14
IF=1.4GHz
2GHz
2.5GHz
3.5GHz
10
5.5
6
6.5
7
7.5
8
8.5
9
9.5
RF Frequency (GHz)
Conversion Gain versus temperature at max. Gain
RF = LO - IF
30
Conversion Gain (dB)
26
22
18
14
-40°C
+25°C
+85°C
10
5.5
6
6.5
7
7.5
8
8.5
9
9.5
RF Frequency (GHz)
RefDSCHR3861-QEG1192 - 11 Jul 11
11/18
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
2nd order intermodulation
RF = LO + IF
F_RF = 7.5 GHz
40
FI=2GHz
36
FI=3GHz
32
IM2 (dBc)
28
24
20
16
12
8
4
0
-37
-35
-33
-31
-29
-27
-25
-23
-21
-19
-17
-15
-13
-11
Input power DCL (dBm)
Spurious on IF outputs
RF = LO + IF
P_RF = -30dBm @7GHz / P_LO = 0dBm @6GHz
nLO
mRF
0
1
2
3
4
0
xx
6
26
33
30
1
10
0
24
40
48
2
60
56
28
38
75
3
66
80
70
58
58
4
68
56
80
75
38
All values in dBc below IF power level (IF = 1GHz).
Data measured without external hybrid coupler.
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
12/18
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Package outline (1)
1- Nc
2- Nc
3- Nc
4- GND(2)
5- RF in
6- Nc
7- GC4
8- GC3
9- VG
10- VD1
11- VD
12- B
13- Nc
14- Nc
15- LO in
16- GND(2)
17- Nc
18- Nc
19- Nc
20- IF_I out
21- GND(2)
22- IF_Q out
23- Nc
24- Nc
25- GND Exposed pad
(1)
The package outline drawing included to this data-sheet is given for indication. Refere to
the application note AN0017 available at http://www.ums-gaas.com for exact package
dimensions.
(2)
It is strongly recommended to ground on the PCB board all the pins referenced as GND.
Evaluation mother board
RefDSCHR3861-QEG1192 - 11 Jul 11
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG






Compatible with the proposed footprint.
Based on typically Ro4003 / 8mils or equivalent.
Using a microstrip to coplanar transition to access the package.
Recommended for the implementation of this product on a module board.
Decoupling capacitors of 10nF 10% are recommended for all DC accesses.
(See application note AN0017 for details).
Decoupling Capacitors = 10nF
Hybrid coupler Anaren 90° 2-4GHz
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Notes
16 15
NC
NC
LO IN
17
GND
NC
19 18
NC
NC
Due to ESD protection circuits on RF and LO inputs, an external capacitance might be
requested to isolate the product from external voltage that could be present on these
accesses in the application.
14 13
VD
IF_Q
22
10
VD1
NC
23
9
VG
NC
24
8
GC3
1
2
3
4
5
6
7
GC4
11
NC
21
RF IN
GND
GND
B
NC
12
NC
20
NC
IF_I
ESD protections are also implemented on gate accesses.
The DC connections do not include any decoupling capacitor in package, therefore it is
mandatory to provide a good external DC decoupling on the PC board, as close as possible
to the package.
RefDSCHR3861-QEG1192 - 11 Jul 11
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
DC Schematic
LNA: 4V, 240mA
Vd= 4V
Vd1= 4V
25mA
65mA
1.61k
35
40
300
3.2k
2.5
300
10
85mA
65mA
5
2.8k
1.5
100
100
2.8k
Gc4
Gc3
Vg # -0.3V
LO Buffer: 4V, 140mA
Vd= 4V
105mA
25
6
1.8k
1.5k
40mA
300
1.5k
1.7k
580
300
B= -4V
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
16/18
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Specifications subject to change without notice
6-9GHz Down Converter
CHR3861-QEG
Notes
RefDSCHR3861-QEG1192 - 11 Jul 11
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Specifications subject to change without notice
CHR3861-QEG
RoHS COMPLIANT
Recommended package footprint
Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot
print recommendations and exact package dimensions.
SMD mounting procedure
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Recommended environmental management
Refer to the application note AN0019 available at http://www.ums-gaas.com for
environmental data on UMS package products.
Recommended ESD management
Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD
sensitivity and handling recommendations for the UMS package products.
Ordering Information
QFN 4x5 RoHS compliant package:
CHR3861-QEG/XY
Stick: XY = 20
Tape & reel: XY = 21
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United
Monolithic Semiconductors S.A.S.
Ref. : DSCHR3861-QEG1192 - 11 Jul 11
18/18
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - BP46 - 91401 Orsay Cedex France
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
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