LM4876 www.ti.com SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 LM4876 1.1W Audio Power Amplifier with Logic Low Shutdown Check for Samples: LM4876 FEATURES DESCRIPTION • The LM4876 is a single 5V supply bridge-connected audio power amplifier capable of delivering 1.1W (typ) of continuous average power to an 8Ω load with 0.5% THD+N. 1 2 • • • Does Not Require Output Coupling Capacitors, Bootstrap Capacitors, Or Snubber Circuits 10-pin VSSOP and 8-pin SOIC Packages Unity-Gain Stable External Gain Set APPLICATIONS • • • • Mobile Phones Portable Computers Desktop Computers Low-Voltage Audio Systems KEY SPECIFICATIONS • • • • THD+N at 1kHz for 1W Continuous Average Output Power into 8Ω 0.5% (max) Output Power At 1kHz Into 8Ω with 10% THD+N 1.5 W (typ) Shutdown Current 0.01µA (typ) Supply Voltage Range 2.0V to 5.5 V Like other audio amplifiers in the Boomer series, the LM4876 is designed specifically to provide high quality output power with a minimal amount of external components. The LM4876 does not require output coupling capacitors, bootstrap capacitors, or snubber networks. It is perfectly suited for low-power portable systems. The LM4876 features an active low externally controlled, micro-power shutdown mode. Additionally, the LM4876 features an internal thermal shutdown protection mechanism. For PCB space efficiency, the LM4876 is available in VSSOP and SOIC surface mount packages. The unity-gain stable LM4876's closed loop gain is set using external resistors. Typical Application Figure 1. Typical LM4876 Audio Amplifier Application Circuit Numbers in ( ) are specific to the 10-pin VSSOP package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM4876 SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com Connection Diagrams Figure 2. VSSOP Package – Top View See Package Number DGS Figure 3. SOIC Package – Top View See Package Number D These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 6.0V −65°C to +150°C Storage Temperature −0.3V to VDD +0.3V Input Voltage (3) Internally Limited ESD Susceptibility (4) 2500V ESD Susceptibility (5) 250V Power Dissipation Junction Temperature Soldering Information 150°C Small Outline Package Vapor Phase (60 sec.) Infrared (15 sec.) 215°C 220°C θJC (typ)—DGS 56°C/W θJA (typ)—DGS 210°C/W θJC (typ)—D 35°C/W θJA (typ)—D 140°C/W (1) (2) (3) (4) (5) If Military/Aerospace specified devices are required, please contact the Texas Instruments' Sales Office/ Distributors for availability and specifications. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions that ensure specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not ensured for parameters where no limit is given. The typical value, however, is a good indication of device performance. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4876, TJMAX = 150°C. The typical junction-to-ambient thermal resistance is 140°C/W for the D package and 210°C/W for the DGS package. Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine Model, 220 pF–240 pF discharged through all pins. Operating Ratings Temperature Range TMIN ≤ TA ≤ TMAX 2 −40°C ≤ TA ≤ 85° 2.0V ≤ VDD ≤ 5.5V Supply Voltage Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 LM4876 www.ti.com SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 Electrical Characteristics (1) (2) The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA = 25°C. Symbol Parameter Conditions LM4876 Typical (3) Limit (4) Units (Limits) 2.0 V (min) 5.5 V (max) 10.0 mA (max) VDD Supply Voltage IDD Quiescent Power Supply Current VIN = 0V, Io = 0A 6.5 ISD Shutdown Current VPIN1 = 0V 0.01 2 µA (max) VOS Output Offset Voltage VIN = 0V 5 50 mV (max) Po Output Power THD+N PSRR (1) (2) THD = 0.5% (max); f = 1 kHz; RL = 8Ω 1.10 1.0 W (min) THD+N = 10%; f = 1 kHz; RL = 8Ω 1.5 Total Harmonic Distortion+Noise Po = 1 Wrms; AVD = 2; 20 Hz ≤ f ≤ 20 kHz; RL = 8Ω 0.25 W % Power Supply Rejection Ratio VDD = 4.9V to 5.1V 65 dB All voltages are measured with respect to the ground pin, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions that ensure specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not ensured for parameters where no limit is given. The typical value, however, is a good indication of device performance. Typicals are measured at 25°C and represent the parametric norm. Limits are ensured to AOQL (Average Outgoing Quality Level). (3) (4) Electrical Characteristics VDD = 5/3.3/2.6V Symbol Parameter Conditions LM4876 Typical (1) Limit (2) Units (Limits) VIH Shutdown Input Voltage High 1.2 V(min) VIL Shutdown Input Voltage Low 0.4 V(max) (1) (2) Typicals are measured at 25°C and represent the parametric norm. Limits are ensured to AOQL (Average Outgoing Quality Level). External Components Description (Figure 1) Components Functional Description 1. Ri Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass filter with Ci at fC= 1/(2π RiCi). 2. Ci Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a highpass filter with Ri at fC = 1/(2π RiCi). Refer to the section, SELECTING PROPER EXTERNAL COMPONENTS, for an explanation of how to determine the value of Ci. 3. Rf Feedback resistance which sets the closed-loop gain in conjunction with Ri. 4. CS Supply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING section for information concerning proper placement and selection of the supply bypass capacitor. 5. CB Bypass pin capacitor which provides half-supply filtering. Refer to the section, SELECTING PROPER EXTERNAL COMPONENTS, for information concerning proper placement and selection of CB. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 3 LM4876 SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics 4 THD+N vs Frequency THD+N vs Frequency Figure 4. Figure 5. THD+N vs Frequency THD+N vs Output Power Figure 6. Figure 7. THD+N vs Output Power THD+N vs Output Power Figure 8. Figure 9. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 LM4876 www.ti.com SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 Typical Performance Characteristics (continued) Output Power vs Supply Voltage Output Power vs Supply Voltage Figure 10. Figure 11. Output Power vs Supply Voltage Output Power vs Supply Voltage Figure 12. Figure 13. Output Power vs Load Resistance Power Dissipation vs Output Power Figure 14. Figure 15. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 5 LM4876 SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) Power Derating Curve Clipping Voltage vs Supply Voltage Figure 16. Noise Floor 6 Figure 17. Frequency Response vs Input Capacitor Size Figure 18. Figure 19. Power Supply Rejection Ratio Open Loop Frequency Response Figure 20. Figure 21. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 LM4876 www.ti.com SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 Typical Performance Characteristics (continued) Supply Current vs Supply Voltage Supply Current vs Shutdown Voltage LM4876 @ VDD = 5/3.3/2.6Vdc Figure 22. Figure 23. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 7 LM4876 SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com APPLICATION INFORMATION BRIDGE CONFIGURATION EXPLANATION As shown in Figure 1, the LM4876 consists of two operational amplifiers. External resistors Rf and Ri set the closed-loop gain of Amp1, whereas two internal 40kΩ resistors set Amp2's gain at -1. The LM4876 drives a load, such as a speaker, connected between the two amplifier outputs, Vo1 and Vo2 . Figure 1 shows that the Amp1 output serves as the Amp2 input, which results in both amplifiers producing signals identical in magnitude, but 180° out of phase. Taking advantage of this phase difference, a load is placed between Vo1 and Vo2 and driven differentially (commonly referred to as "bridge mode"). This results in a differential gain of AVD = 2 * (Rf/Ri) (1) Bridge mode is different from single-ended amplifiers that drive loads connected between a single amplifier's output and ground. For a given supply voltage, bridge mode has a distinct advantage over the single-ended configuration: its differential output doubles the voltage swing across the load. This results in four times the output power when compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes that the amplifier is not current limited or that the output signal is not clipped. To ensure minimum output signal clipping when choosing an amplifier's closed-loop gain, refer to the AUDIO POWER AMPLIFIER DESIGN section. Another advantage of the differential bridge output is no net DC voltage across the load. This results from biasing Vo1 and Vo2 at half-supply. This eliminates the coupling capacitor that single supply, single-ended amplifiers require. Eliminating an output coupling capacitor in a single-ended configuration forces a single-supply amplifier's half-supply bias voltage across the load. The current flow created by the half-supply bias voltage increases internal IC power dissipation and may permanently damage loads such as speakers. POWER DISSIPATION Power dissipation is a major concern when designing a successful bridged or single-ended amplifier. Equation 2 states the maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a specified output load. PDMAX = (VDD)2 /(2π2 RL) Single-Ended (2) However, a direct consequence of the increased power delivered to the load by a bridge amplifier is higher internal power dissipation for the same conditions. The LM4876 has two operational amplifiers in one package and the maximum internal power dissipation is four times that of a single-ended amplifier. Equation 3 states the maximum power dissipation for a bridge amplifier. However, even with this substantial increase in power dissipation, the LM4876 does not require heatsinking. From Equation 3, assuming a 5V power supply and an 8Ω load, the maximum power dissipation point is 633mW. PDMAX = 4*(VDD)2 /(2π2 RL ) Bridge Mode (3) The maximum power dissipation point given by Equation 3 must not exceed the power dissipation given by Equation 4: PDMAX = (TJMAX -TA) /θJA (4) The LM4876's TJMAX = 150°C. In the D package, the LM4876's θJA is 140°C/W. At any given ambient temperature TA, use Equation 4 to find the maximum internal power dissipation supported by the IC packaging. Rearranging Equation 4 results in Equation 5. This equation gives the maximum ambient temperature that still allows maximum power dissipation without violating the LM4876's maximum junction temperature. TA = TJMAX - PDMAX θJA (5) For a typical application with a 5V power supply and an 8W load, the maximum ambient temperature that allows maximum power dissipation without exceeding the maximum junction temperature is approximately 61°C. TJMAX = PDMAX θJA + TA 8 (6) Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 LM4876 www.ti.com SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 For the VSSOP10A package, θJA = 210°C/W. Equation 6 shows that TJMAX , for the VSSOP10 package, is 158°C for an ambient temperature of 25°C and using the same 5V power supply and an 8Ω load. This violates the LM4876's 150°C maximum junction temperature when using the VSSOP10A package. Reduce the junction temperature by reducing the power supply voltage or increasing the load resistance. Further, allowance should be made for increased ambient temperatures. To achieve the same 61°C maximum ambient temperature found for the SOIC8 package, the VSSOP10 packaged part should operate on a 4.1V supply voltage when driving an 8Ω load. Alternatively, a 5V supply can be used when driving a load with a minimum resistance of 12Ω for the same 61°C maximum ambient temperature. Fully charged Li-ion batteries typically supply 4.3V to portable applications such as cell phones. This supply voltage allows the LM4876 to drive loads with a minimum resistance of 9Ω without violating the maximum junction temperature when the maximum ambient temperature is 61°C. The above examples assume that a device is a surface mount part operating around the maximum power dissipation point. Since internal power dissipation is a function of output power, higher ambient temperatures are allowed as output power or duty cycle decreases. If the result of Equation 3 is greater than that of Equation 4, then decrease the supply voltage, increase the load impedance, or reduce the ambient temperature. If these measures are insufficient, a heat sink can be added to reduce θJA. The heat sink can be created using additional copper area around the package, with connections to the ground pin(s), supply pin and amplifier output pins. When adding a heat sink, the θJA is the sum of θJC, θCS, and θSA. ( θJC is the junction-to-case thermal impedance, θCS is the case-to-sink thermal impedance, and θSA is the sink-to-ambient thermal impedance.) Refer to the Typical Performance Characteristics curves for power dissipation information at lower output power levels. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection. Applications that employ a 5V regulator typically use a 10µF in parallel with a 0.1µF filter capacitors to stabilize the regulator's output, reduce noise on the supply line, and improve the supply's transient response. However, their presence does not eliminate the need for local bypass capacitance at the LM4876's supply pins. Keep the length of leads and traces that connect capacitors between the LM4876's power supply pin and ground as short as possible. Connecting a 1µF capacitor between the BYPASS pin and ground improves the internal bias voltage's stability and improves the amplifier's PSRR. The PSRR improvements increase as the bypass pin capacitor value increases. Too large, however, and the amplifier's click and pop performance can be compromised. The selection of bypass capacitor values, especially CB, depends on desired PSRR requirements, click and pop performance (as explained in the section, SELECTING PROPER EXTERNAL COMPONENTS), system cost, and size constraints. MICRO-POWER SHUTDOWN The voltage applied to the SHUTDOWN pin controls the LM4876's shutdown function. Activate micro-power shutdown by applying a voltage below 400mV to the SHUTDOWN pin. When active, the LM4876's micro-power shutdown feature turns off the amplifier's bias circuitry, reducing the supply current. Though the LM4876 is in shutdown when 400mV is applied to the SHUTDOWN pin, the supply current may be higher than 0.01µA (typ) shutdown current. Therefore, for the lowest supply current during shutdown, connect the SHUTDOWN pin to ground. The relationship between the supply voltage, the shutdown current, and the voltage applied to the SHUTDOWN pin is shown in Typical Performance Characteristics curves. There are a few ways to control the micro-power shutdown. These include using a single-pole, single-throw switch, a microprocessor, or a microcontroller. When using a switch, connect an external pull-down resistor between the SHUTDOWN pin and GND. Connect the switch between the SHUTDOWN pin and VCC. Select normal amplifier operation by closing the switch. Opening the switch connects the SHUTDOWN pin to GND through the pull-down resistor, activating micro-power shutdown. The switch and resistor ensure that the SHUTDOWN pin will not float. This prevents unwanted state changes. In a system with a microprocessor or a microcontroller, use a digital output to apply the control voltage to the SHUTDOWN pin. Driving the SHUTDOWN pin with active circuitry eliminates the pull down resistor. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 9 LM4876 SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com SELECTING PROPER EXTERNAL COMPONENTS Optimizing the LM4876's performance requires properly selecting external components. Though the LM4876 operates well when using external components with wide tolerances, best performance is achieved by optimizing component values. The LM4876 is unity-gain stable, giving a designer maximum design flexibility. The gain should be set to no more than a given application requires. This allows the amplifier to achieve minimum THD+N and maximum signal-tonoise ratio. These parameters are compromised as the closed-loop gain increases. However, low gain demands input signals with greater voltage swings to achieve maximum output power. Fortunately, many signal sources such as audio CODECs have outputs of 1VRMS (2.83VP-P). Please refer to the AUDIO POWER AMPLIFIER DESIGN section for more information on selecting the proper gain. Input Capacitor Value Selection Amplifying the lowest audio frequencies requires high value input coupling capacitor (Ci in Figure 1). A high value capacitor can be expensive and may compromise space efficiency in portable designs. In many cases, however, the speakers used in portable systems, whether internal or external, have little ability to reproduce signals below 150 Hz. Applications using speakers with this limited low frequency response reap little improvement by using a large input capacitor. Besides affecting system cost and size, Ci also affects the LM4876's click and pop performance. When the supply voltage is first applied, a transient (pop) is created as the charge on the input capacitor changes from zero to a quiescent state. The magnitude of the pop is directly proportional to the input capacitor's size. Higher value capacitors need more time to reach a quiescent DC voltage (usually VCC/2) when charged with a fixed current. The amplifier's output charges the input capacitor through the feedback resistor, Rf. Thus, pops can be minimized by selecting an input capacitor value that is no higher than necessary to meet the desired -3dB frequency. As shown in Figure 1, the input resistor (RI) and the input capacitor, CI produce a -3dB high pass filter cutoff frequency that is found using Equation 7. f-3dB = 2πRINCI (7) As an example when using a speaker with a low frequency limit of 150Hz, Equation 7 gives a value of Ci equal to 0.1µF. The 0.22µF Ci shown in Figure 1 allows for a speaker whose response extends down to 75Hz. Bypass Capacitor Value Selection Besides minimizing the input capacitor size, careful consideration should be paid to value of, CB, the capacitor connected to the BYPASS pin. Since CB determines how fast the LM4876 settles to quiescent operation, its value is critical when minimizing turn-on pops. The slower the LM4876's outputs ramp to their quiescent DC voltage (nominally 1/2 VDD), the smaller the turn-on pop. Choosing CB equal to 1.0µF along with a small value of Ci (in the range of 0.1µF to 0.39µF), produces a click-less and pop-less shutdown function. As discussed above, choosing Ci as small as possible helps minimize clicks and pops. AUDIO POWER AMPLIFIER DESIGN Audio Amplifier Design: Driving 1W into an 8Ω Load The following are the desired operational parameters: Power Output 1WRMS Load Impedance 8Ω Input Level 1VRMS Input Impedance 20kΩ Bandwidth 10 100Hz–20kHz ± 0.25dB Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 LM4876 www.ti.com SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 The design begins by specifying the minimum supply voltage necessary to obtain the specified output power. One way to find the minimum supply voltage is to use the Output Power vs Supply Voltage curve in the Typical Performance Characteristics section. Another way, using Equation 8, is to calculate the peak output voltage necessary to achieve the desired output power for a given load impedance. To account for the amplifier's dropout voltage, two additional voltages, based on the Dropout Voltage vs Supply Voltage in the Typical Performance Characteristics curves, must be added to the result obtained by Equation 8. This results in Equation 9. (8) VCC ≥ (VOUTPEAK + (VODTOP + VODBOT)) (9) The Output Power vs Supply Voltage graph for an 8Ω load indicates a minimum supply voltage of 4.6V. This is easily met by the commonly used 5V supply voltage. The additional voltage creates the benefit of headroom, allowing the LM4876 to produce peak output power in excess of 1W without clipping or other audible distortion. The choice of supply voltage must also not create a violation of maximum power dissipation as explained above in the POWER DISSIPATION section. After satisfying the LM4876's power dissipation requirements, the minimum differential gain is found using Equation 10. (10) Thus, a minimum gain of 2.83 allows the LM4876's to reach full output swing and maintain low noise and THD+N performance. For this example, let AVD = 3. The amplifier's overall gain is set using the input (Ri) and feedback (Rf) resistors. With the desired input impedance set at 20kΩ, the feedback resistor is found using Equation 11. Rf/Ri = AVD/2 where • The value of Rf is 30kΩ. (11) The last step in this design example is setting the amplifier's -3dB low frequency bandwidth. To achieve the desired ±0.25dB pass band magnitude variation limit, the low frequency response must extend to at least onefifth the lower bandwidth limit and the high frequency response must extend to at least five times the upper bandwidth limit. The results is an fL = 100 Hz/5 = 20Hz and an FH = 20 kHz*5 = 100kHz As mentioned in the External Components Description section, Ri and Ci create a highpass filter that sets the amplifier's lower bandpass frequency limit. Find the coupling capacitor's value using Equation 12. Ci ≥ 1/(2πRifL) (12) The result is 1/(2π*20kΩ*20Hz) = 0.398µF. Use a 0.39µF capacitor, the closest standard value. The product of the desired high frequency cutoff (100kHz in this example) and the differential gain, AVD, determines the upper passband response limit. With AVD = 3 and fH = 100kHz, the closed-loop gain bandwidth product (GBWP) is 150kHz. This is less than the LM4876's 4MHz GBWP. With this margin, the amplifier can be used in designs that require more differential gain and avoid performance-restricting bandwidth limitations. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 11 LM4876 SNAS054E – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision D (May 2013) to Revision E • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4876 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM4876M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM487 6M LM4876MM/NOPB ACTIVE VSSOP DGS 10 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 G76 LM4876MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM487 6M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM4876MM/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM4876MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4876MM/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0 LM4876MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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