Anpec APX9270RI-TRG Direct pwm variable speed fan motor driver Datasheet

APX9270
Direct PWM Variable Speed Fan Motor Driver
Features
General Description
•
Single Phase Full Wave Fan Driver
The APX9270 is a single phase, DC brushless motor
•
Low Quiescent Current (6mA Typical)
•
Built-in Variable Speed Function
driver with PWM variable speed control and current limit
features suitable for the fan of personal computer’s power
•
Current Limit Circuit (includes both internal and
external Current Limit)
•
Built-in Lock Protection and Auto Restart Function
•
FG (rotation speed detection) Output
•
Soft Switching Circuit (before phase change,
enabling low-consumption, low loss and low
noise drive.)
•
Over Voltage Protection (16.5V Typical)
•
Built-in Kickback Absorption Circuit
•
Built-in Thermal Protection Circuit
•
Lead Free and Green Devices Available (RoHS
Compliant)
supply and CPU cooler. The PWM control system includes
thermistor input signal and direct PWM input signal, enabling highly silent and low vibration speed control. The
device is equipped with a built-in lock protection, which
protects the fan when it is locked. It also has rotation
speed detection output and thermal protection function.
The APX9270 is available in SSOP-20 and TSSOP-20P
packages (see Pin Configurations).
Applications
•
•
CPU Coolers
Variable Speed Control Fans
Ordering and Marking Information
Package Code
N : SSOP-20
R: TSSOP-20P
Operating Ambient Temperature Range
I : -40 to 90 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APX9270
Assembly Material
Handling Code
Temperature Range
Package Code
APX9270
XXXXX
APX9270 N/R :
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Pin Configurations
PGND 1
20 PGND
PGND 1
20 PGND
OUT2 2
19 PGND
OUT2 2
19 PGND
VM 3
VCC 4
18 OUT1
17 SGND
VM 3
VCC 4
18 OUT1
17 SGND
OSCH 5
SSOP-20
OSCL 6
SET 7
MIN 8
PWM 9
OSC10
16 6VREG
OSCH 5
15 CT
14 IN -
OSCL 6
SET 7
MIN 8
13 HB
12 IN +
PWM 9
OSC10
11 FG
TSSOP-20P
16 6VREG
15 CT
14 IN 13 HB
12 IN +
11 FG
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain
the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
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APX9270
Absolute Maximum Ratings
Symbol
Ratings
Unit
VCC
VCC Pin Supply Voltage (VCC to SGND)
-0.3 to 18
V
VM
VM Pin Supply Voltage (VM to SGND)
-0.3 to VCC
V
IOUT
OUT1/OUT2 Pin Maximum Output Current
1.2
A
VPGND-0.3 to VM
V
-0.3 to 0.3
V
VOUT1/VOUT2
VPGND
IHB
Parameter
OUT1/OUT2 Pin Output Voltage (OUT1, OUT2 to SGND)
PGND to SGND Voltage
HB Pin Output Current
0 to 15
mA
VSET
SET Pin Input Voltage (SET to SGND)
-0.3 to 7
V
VMIN
MIN Pin Input Voltage (MIN to SGND)
-0.3 to 7
V
VPWM
PWM Pin Input Voltage (PWM to SGND)
-0.3 to VCC
V
VFG
FG Pin Output Voltage (FG to SGND)
-0.3 to VCC
V
IFG
FG Pin Output Current
0 to 10
mA
OSC Pin Input Voltage (OSC to SGND)
-0.3 to 7
V
CT Pin Input Voltage (CT to SGND)
-0.3 to 7
V
1.2
W
VOSC
VCT
Power Dissipation
PD
SSOP-20
TSSOP-20P
TJ
1.5
Maximum Junction Temperature
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
150
°C
-55 to 150
°C
260
°C
Note 1: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device.
Thermal Characteristics
Symbol
Parameter
Value
Unit
SSOP-20
104
°
C/W
TSSOP-20P
83
Thermal Resistance-Junction to Ambient
RTH,JA
Note 2: Mounted on a board (60x38x1.6t mm, Glass epoxy).
Recommended Operating Conditions
Symbol
Parameter
Rating
Unit
VCC
VCC Pin Supply Voltage
4.5 to 15
V
VM
VM Pin Supply Voltage
3.5 to 15
V
VSET
SET Pin Input Voltage Range
0 to 6
V
VMIN
MIN Pin Input Voltage Range
0 to 6
V
VPWM
PWM Pin Input Voltage Range
0 to VCC
V
VOSCH/VOSCL
VICM
TA
0 to 6
V
Hall Input Common Phase Input Voltage Range
OSC High/Low Level Input Voltage Range
0.2 to 3
V
Ambient Temperature
-40 to 90
°C
Copyright  ANPEC Electronics Corp.
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APX9270
Electrical Characteristics
Symbol
(VCC = 12V, TA = 25°C, RL= 0Ω, unless otherwise specified)
Parameter
Test Conditions
APX9270
Min.
Typ.
Max.
Unit
SUPPLY CURRENT
V6VREG
VHB
ICC1
ICC2
6VREG Pin Output Voltage
I6VREG = 5mA
5.85
6
6.15
V
HB Pin Output Voltage
IHB = 5mA
1.2
1.3
1.4
V
Rotation Mode
-
6
8
mA
Lock Protection Mode
-
6
8
mA
Operating Current
OSCILLATOR
IOSC1
OSC Charge Current
7.5
10
12.5
µA
IOSC2
OSC Discharge Current
7.5
10
12.5
µA
LOCK PROTECTION
VCTH
CT Pin High Level Voltage
CCT = 1µF
3.4
3.6
3.8
V
VCTL
CT Pin Low Level Voltage
CCT = 1µF
1.4
1.6
1.8
V
ICT1
CT Charge Current
VCT = 0V
1.65
2.2
2.75
µA
ICT2
CT Discharge Current
VCT = 3.6V
0.165
0.22
0.275
µA
RCT
CT Charge/Discharge Current Ratio
RCT = ICT1/ICT2
8
10
12
-
IOUT = 400mA
-
0.2
0.3
V
OUTPUT DRIVERS
VOL
Output Lower Side Saturation
VOH
Output Upper Side Saturation
IOUT = 400mA
-
0.4
0.6
V
VFG
FG Pin Low Voltage
IFG = 5mA
-
0.2
0.4
V
IFGL
FG Pin Leak Current
VFG = 7V
-
0.1
1
µA
Zero to peak including offset
and hysteresis
-
25
35
mV
-
1200
-
mA
-
960
-
mA
Thermal Protection Temperature
-
160
-
Thermal Protection Hysteresis
-
20
-
-
16.5
-
HALL SENSITIVITY
VHN
Hall Input Sensitivity
CURRENT-LIMIT
ILIM
Internal Current-Limit
IRL
External Current-Limit
RL= 0.5Ω
THERMAL PROTECTION
°C
Over-Voltage Protection
VOV
Over-Voltage Threshold
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
3
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APX9270
Typical Operating Characteristics
VCC Supply Current vs. VCC Supply Voltage
VCC Supply Current vs. VCC Supply Voltage
7
7
Rotation Mode
Lock Mode
6
VCC Supply Current (mA)
VCC Supply Current (mA)
6
5
4
3
2
1
0
4
3
2
1
0
0
5
10
15
0
5
10
15
VCC Supply Voltage (V)
VCC Supply Voltage (V)
OSC Charge/Discharge Current vs.
VCC Supply Voltage
CT Charge/Discharge Current vs.
VCC Supply Voltage
3
CT Charge/Discharge Current (µA)
11
OSC Charge/Discharge Current (µA)
5
10.5
Charge Current
10
Discharge Current
9.5
9
0
5
10
2.5
Charge Current
2
1.5
1
0.5
Discharge Current
0
15
0
5
10
15
VCC Supply Voltage (V)
VCC Supply Voltage (V)
Output Saturation Voltage vs.
Output Current
FG Pin Low Voltage vs. Sink Current
2000
300
250
1600
1400
FG Pin Low Voltage (mV)
Output Saturation Voltage (mV)
1800
Upper Side
Saturation Voltage
1200
1000
800
600
400
200
Lower Side
Saturation Voltage
0
0
200
400
600
800
150
100
50
0
0
1000
Output Current (mA)
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
200
1
2
3
4
5
6
7
8
9
10
FG Pin Sink Current (mA)
4
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APX9270
Typical Operating Characteristics
Maximum Power Dissipation vs.
Ambient Temperature
Maximum Power Dissipation (W)
1.6
TSSOP-20P
1.4
1.2
1
0.8
0.6
SSOP-20
0.4
0.2
0
0
25
50
75
100
125
Ambient Temperature ( °C)
150
Operating Waveforms
Rotation Waveform 1
Rotation Waveform 2
VCC
VOUT1
VOUT1
1, 2
1
VOUT2
2, 3
VOUT2
VIN3, 4
4
VIN+
Ch1 : VOUT1, 5V/Div, DC
Ch2 : VOUT2, 5V/Div, DC
Ch3 : VIN+, 100mV/Div, AC
Ch4 : VIN-, 100mV/Div, AC
Time : 2ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
IIN
Ch1 : VCC, 5V/Div, DC
Ch2 : VOUT1, 5V/Div, DC
Ch3 : VOUT2, 5V/Div, DC
Ch4 : IIN, 500mA/Div, DC
Time : 2ms/Div
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APX9270
Operating Waveforms (Cont.)
Power ON Waveform
Rotation Waveform 3
VCC
VOUT1
VCC
VOUT2
VOUT1
1
1
2, 3
2, 3
VOUT2
4
4
IIN
IIN
Ch1 : VCC, 5V/Div, DC
Ch2 : VOUT1, 5V/Div, DC
Ch3 : VOUT2, 5V/Div, DC
Ch4 : IIN, 500mA/Div, DC
Time : 50ms/Div
Ch1 : VCC, 5V/Div, DC
Ch2 : VOUT1, 5V/Div, DC
Ch3 : VOUT2, 5V/Div, DC
Ch4 : IIN, 200mA/Div, DC
Time : 2ms/Div
Lock Protection Waveform 1
Lock Protection Waveform 2
VOUT2
1, 2
3
4
VOUT2
1, 2
VOUT1
3
VCT
VCT
4
IIN
Ch1 : VOUT1, 5V/Div, DC
Ch2 : VOUT2, 5V/Div, DC
Ch3 : VCT, 2V/Div, DC
Ch4 : IIN, 1A/Div, DC
Time : 1s/Div
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
VOUT1
IIN
Ch1 : VOUT1, 5V/Div, DC
Ch2 : VOUT2, 5V/Div, DC
Ch3 : VCT, 2V/Div, DC
Ch4 : IIN, 1A/Div, DC
Time : 1s/Div
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APX9270
Pin Description
PIN
FUNCTION
NO.
NAME
1
PGND
Power Stage GND.
2
OUT2
H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and
four-protection diode for switching applications.
3
VM
Supply Voltage for Output Stage Input Pin.
4
VCC
Supply Voltage Input Pin.
5
OSCH
Setting of the OSC Waveform High Level Voltage. Use a voltage divider from 6VREG to
set OSC waveform high-level voltage.
6
OSCL
Setting of the OSC Waveform Low Level Voltage. Use a voltage divider from 6VREG to set
OSC waveform low-level voltage.
7
SET
Speed Setting. An external voltage into SET pin to set fan speed.
8
MIN
Minimum Speed Setting. Use a voltage divider from 6VREG to set MIN pin voltage for
setting minimum speed.
9
PWM
PWM Signal Input Terminal.
10
OSC
Oscillator Frequency Setting. Connect a capacitor to SGND to set oscillation frequency.
11
FG
Rotation Speed Output. This is an open-collector output.
12
IN+
Hall Input +. Connect to hell element positive output.
13
HB
Hall Bias. This is a 1.3V constant-voltage output for hall element bias.
14
IN-
Hall Input -. Connect to hell element negative output.
15
CT
Shutdown Time and Restart Time Setting. Connect a capacitor to SGND to set shutdown
time and restart time in lock mode.
16
6VREG
6V Regulator Output. This is a 6V constant-voltage output for application circuit biases.
17
SGND
Control Stage GND.
18
OUT1
H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and
four-protection diode for switching applications.
19
PGND
Power Stage GND.
20
PGND
Power Stage GND.
Copyright  ANPEC Electronics Corp.
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APX9270
Block Diagram
FG
Thermal
Protection
VCC
External Current
Limiter
VM
6V Regulator
6VREG
Level
Shift
HB
Hall
Bias
Internal
Current
Limiter
Control
circuit
M
IN+
HALL
OUT 1
Level
Shift
IN -
OUT 2
Oscillating
circuit
Charge/discharge
circuit
SGND
CT
PWM MIN SET
OSCH OSCL
OSC
PGND
Typical Application Circuits
1. With external current limiter
IIN
RL
VIN
Pull High
R1=1Ω Voltage
VCC
CM=4.7µF
/25V
VM
RFG=10KΩ
6VREG
R6
FG
PWM
PWM
input
R7
OUT1
R2
OSCH
R4
R3
M
OSCL
R5
OUT2
MIN
HB
SET
Thermistor
IN+
OSC
COSC=100pF
H
IN-
CT
SGND
PGND
CCT=0.47 to 1µF
Copyright  ANPEC Electronics Corp.
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APX9270
Typical Application Circuits (Cont.)
2. Without external current limiter
IIN
VIN
Pull High
Voltage
R1=2Ω
C1=4.7µF/25V
VCC
VM
RFG=10KΩ
6VREG
R6
FG
PWM
PWM input
R7
OUT1
R2
OSCH
R4
R3
M
OSCL
R5
OUT2
MIN
HB
SET
IN+
OSC
Thermistor
COSC=100pF
H
IN-
CT
SGND
PGND
CCT=0.47 to 1µF
Note 3: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Placing a
resistor (R1) in series with a capacitor (C1 or CM) dampens the overshoot.
Copyright  ANPEC Electronics Corp.
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APX9270
Function Description
the fan is locked. Connecting the capacitor from CT pin to
Variable Speed Control
GND determines the shutdown time and restart time. As
the fan is locked, the charge/discharge circuit will charge
The APX9270 is designed with a variable speed controller which has two external input signals, a temperature
the CT capacitor to 3.6V by a 2.2µA source current for a
locked detection time, and then the circuit will switch the
signal sensed by a thermistor and an external PWM
signal.
capacitor to discharge. During the discharging interval,
the output drivers are switched off until the CT voltage is
Temperature Speed Control
discharged to 1.6V by a 0.22µA sink current, and the
circuit will switch the capacitor to charge. In the charging
Using thermistor get temperature to make SET pin voltage.
The fan’s speed is decided by comparing OSC and
SET pin voltage. In addition, the lowest drive duty is
interval, the IC enters the restart time; one output is high
and another is low, which makes a torque for fan rotation
set by comparing the OSC oscillating voltage and MIN
pin voltage (only for temperature speed control side).
until the CT voltage is charged to 3.6V by a 2.2µA source
current. If the locked condition still remains, the charge/
Temperature control system works by comparing the
voltage of SET and OSC. When SET voltage is lower than
discharge process will be recurred until the locked
condition is released (see Figure 2: Lock/Auto Restart
OSC voltage, one OUT pulled high and another OUT
pulled low. On the contrary, when SET voltage is higher
Waveform).
than OSC voltage, upper side transistors are OFF;
meanwhile, the coil current re-circulates lower side
VINVIN+
transistor. Therefore, with decreasing SET voltage, the
output ON-Duty will be increasing, which results in the
TOFF
VOUT2
TOFF
increasing of the coil current and motor rotation speed.
TON
VOUT1
External PWM Speed Control
This is a pin for the direct PWM speed control. PWM pin
input is pulled down to GND when it is not used. The
minimum duty is performed by R6 and R7 resistances
VCT
(see Typical Application Circuit). R7 is left open if you
want to stop rotation when PWM duty is 0%.
VFG
(see Figure 1: Rotation Control Curve)
Lock
External PWM-Duty
OUT -DUTY(%)
Lock
Detection
Release
Figure 2: Lock/Auto Restart Waveform
Current Limit
Duty 100%
The APX9270 includes both internal and external current
limiters. External current limiter value is programmed by
Duty 50 %
RL which is located between VCC pin and VM pin. The
external current limiter works when the voltage difference
Duty 0%
between both sides of RL raises to be 0.48V or higher.
For example, the RL=0.5Ω, the external current limiter
TA (oC)
value is fixed and internally set at 960mA. The internal
current limiter value is different in rotation mode and lock
Figure 1: Rotation Control Curve
mode. It is 1.2A in rotation mode, but it decreases to 0.6A
in lock mode. This feature can reduce power consump-
Lockup Protection and Automatic Restart
The APX9270 provides the lockup protection and auto-
tion while the fan is locked. In general application, it is
matic restart functions to prevent the coil burnout while
Copyright  ANPEC Electronics Corp.
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APX9270
Function Description (Cont.)
Current Limit (Cont.)
Thermal Protection
recommended to short RL resistance and remove CM ca-
The APX9270 is designed with a thermal protection to
protect the IC from the damage of over temperature.
pacitor to disable external current limiter because the
internal current limiter is sufficient to avoid overload.
When internal junction temperature reaches 160°C, the
output devices will be switched off. When the IC’s junc-
FG Output
tion temperature cools by 20°C, the thermal sensor will
turn the output devices on again resulting in a pulsed
The FG pin is an open drain output connecting a pull up
resistor to a high level voltage for the speed detection
output during continuous thermal overload.
function. When VIN- is larger than VIN+, the VFG is low (switch
on); when VIN- is smaller than VIN+, the VFG is high (switch
off). Leave it open when not in using.
Truth Table
SET
L
H
-
PWM
L
L
L
L
H
H
-
Input
INH
L
H
L
H
L
H
L
IN+
L
H
L
H
L
H
L
H
CT
L
H
OUT1
H
L
OFF
L
OFF
L
OFF
L
Output
OUT2
L
H
L
OFF
L
OFF
L
OFF
FG
L
OFF
L
OFF
L
OFF
L
OFF
Mode
Rotation (Drive)
Rotation (Regeneration)
Output Regeneration Mode by External
Signal
Lock Mode
SET or PWM=[L], “L” means that SET or PWM voltage is smaller than OSC voltage.
Also, SET or PWM=[H], “H” means that SET or PWM voltage is greater than OSC voltage.
Application Information
Input Protection Diode & Capacitor
and then it will discharge C OSC to V OSCL by 10µA sink
The input protection diode (D1) between supply voltage
and VCC pin has to be used to prevent the reverse current
current. The circuit can generate a triangular waveform.
The triangular waveform is determinded by COSC, R2, R3,
flowing into the supply power. However, the protection
diode will cause a voltage drop on the supply voltage.
R4, and R4. (see Typical Application Circuit)
The current rating of the diode must be larger than the
maximum output current. For the noise reduction purpose,
a capacitor (C1/CM) must be connected between VCC/VM
and SGND/PGND. The C1/CM should be placed near the
VOSCH = V 6 VREG ×
R3
R2 + R3
VOSCL = V 6 VREG ×
R5
R 4 + R5
fOSC =
device VCC/VM pin as close as possible.
0.5 × ISOC1
( VOSCH − VOSCL) × COSC
For example:
Setting of the Oscillator Frequency and Output Voltage
The oscillator is used for PWM speed control. Compare
COSC=100pF, R2 = R5 = 10kΩ,
the OSC and SET pin voltages can decide PWM duty and
PWM frequency depends on the oscillator frequency. The
R3 = R4 = 20kΩ, IOSC1=10µA
VOSCH= 4V, VOSCL= 2V, fOSC=25kHz
oscillator is based on internal charge/discharge circuit.
The circuit charges COSC to VOSCH by a 10µA source current,
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
The recommended OSC frequency range is from 22kHz
to 32kHz.
11
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APX9270
Application Information (Cont.)
HB Bias Output and Hall Input Signals
Thermal Pad Consideration
The IC outputs a 1.3V voltage on HB pin to provide bias
The thermal pad on the bottom of the TSSOP-20P pack-
for the external hall element. The IC also has two pins
IN+ and IN- to receive the hall signals from the hall
age should be soldered down to a copper pad on the
circuit board. Heat can be conducted away from the ther-
element. The hall signals are very weak so the layout
tracks must be short and far away from those noise
mal pad through the copper plane to ambient. If the copper plane is not on the top surface of the circuit board, 8 to
sources to avoid noise coupling. The hall input amplifier
has 20mV hysteresis. Therefore, the recommended dif-
10 vias of 13 mil or smaller in diameter should be used to
thermally couple the thermal pad to the bottom plane. For
ferential hall input voltage should be more than 60mV.
good thermal conduction, the vias must be plated through
and solder filled. The copper plane is used to conduct
CT Capacitor
heat away from the thermal pad should be as large as
practical.
If the ambient temperature is higher than 25οC, a larger
The capacitor that is connected from CT pin to GND
determines the shutdown time and restart time.
Locked Detection Time =
Restart Time =
CCT × (V CT1 − 0.2 V )
ICT1
copper plane or forced-air cooling will be required to keep
the APX9270 junction temperature below the thermal pro-
CCT × (V CT1 − V CT2 )
ICT1
Shutdown Time =
tection temperature (160οC).
Thermal Consideration
CCT × (V CT1 − V CT2 )
ICT2
Refer to “Maximum Power Dissipation vs. Ambient
Temperature”, the IC is safe to operate below the curve
and it will cause the thermal protection if the operating
where
area is above the line. For example, TA= 50οC, the SSOP20 package maximum power dissipation is about 0.95W.
CCT = CT pin capacitor
For example:
Power dissipation can be calculated by the following
VCC=12V, CCT=1µF
Locked Detection Time = 1.545 s
equation:
(
For example:
When VCC = 12V, ICC = 6mA, IOUT = 300mA, VOUT1 = 11.66V,
The value of charge capacitor in the range of 0.47µF to
1µF is recommended.
VOUT2 = 0.13V, then PD = 0.213W
According the power dissipation issue, we could adapt
FG Resistor
this SSOP-20 package.
The value of the FG resistor could be decided by the
following equation
RFG =
)
PD = VCC − VOUT1 − VOUT2 × IOUT + VCC × ICC
Restart Time = 0.909 s
Shutdown Time = 9.091 s
V 6VREG − VFG
IFG
For example:
V6VREG = 6V, IFG = 5mA, VFG = 0.2V, RFG = 1.16kΩ
The value of resistor in the range of 1kΩ to 10kΩ is
recommended.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
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APX9270
Package Information
SSOP-20
D
h X 45
E
E1
SEE VIEW A
c
A
0.25
b
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e
VIEW A
S
Y
M
B
O
L
A
SSOP-20
MILLIMETERS
MIN.
INCHES
MAX.
MIN.
MAX.
0.004
0.010
1.75
0.25
0.069
A1
0.10
A2
1.24
b
0.20
0.30
0.008
0.012
0.049
c
0.15
0.25
0.006
0.010
D
8.56
8.76
0.337
0.345
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
e
0.635 BSC
0.157
0.025 BSC
L
0.40
1.27
0.016
0.050
h
0.25
0.50
0.010
0.020
0
0°
8°
0°
8°
Note : 1. Follow JEDEC MO-137 AD.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
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APX9270
Package Information
TSSOP-20P
D
SEE VIEW A
b
A
0.25
c
GAUGE PLANE
SEATING PLANE
A1
A2
e
VIEW A
S
Y
M
B
O
L
L
0
EXPOSE
D PAD
E
E2
E1
D1
TSSOP-20P
INCHES
MILLIMETERS
MIN.
MIN.
MAX.
A
MAX.
0.047
1.20
A1
0.05
0.15
0.002
0.006
A2
0.80
1.05
0.031
0.041
b
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.008
D
6.40
6.60
0.252
0.260
D1
2.20
5.00
0.087
0.197
0.177
0.157
E
6.40 BSC
0.252 BSC
E1
4.30
4.50
0.169
E2
1.50
4.00
0.059
0.75
0.018
e
L
0
0.65 BSC
0.45
0
o
0.026 BSC
8
o
0.030
o
0
8
o
Note : 1. Follow JEDEC MO-153 ACT.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
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APX9270
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SSOP-20
Application
TSSOP-20P
A
H
T1
C
16.4+2.00 13.0+0.50
-0.00
-0.20
330±2.00
50 MIN.
P0
P1
P2
4.0±0.10
8.0±0.10
2.0±0.10
A
H
330.0±2.00
50 MIN.
P0
P1
D0
1.5+0.10
-0.00
d
D
1.5 MIN.
D1
1.5 MIN.
T1
C
d
16.4+2.00 13.0+0.50
-0.00
-0.20 1.5 MIN.
P2
4.00±0.10 8.00±0.10 2.00±0.10
D0
1.5+0.10
-0.00
D1
W
E1
20.2 MIN. 16.0±0.30 1.75±0.10
T
0.6+0.00
-0.40
D
A0
B0
1.5 MIN. 0.30±0.05
7.5±0.1
K0
6.40±0.20 9.00±0.20 2.10±0.20
W
E1
20.2 MIN. 16.0±0.30 1.75±0.10
T
F
A0
6.9±0.20
B0
F
7.50±0.10
K0
6.90±0.20 1.60±0.20
(mm)
Devices Per Reel
Package Type
Unit
Quantity
SSOP-20
Tape & Reel
2500
TSSOP-20P
Tape & Reel
2000
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
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APX9270
Reflow Condition (IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
t 25°C to Peak
25
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1 tr > 100mA
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
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APX9270
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
3
Package Thickness
Volume mm
<350
<2.5 mm
240 +0/-5°C
≥2.5 mm
225 +0/-5°C
3
Volume mm
≥350
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Package Thickness
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C)
at the rated MSL level.
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Jun., 2008
17
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