Material Content Data Sheet Sales Product Name IPA65R190E6 Issued MA# MA001039010 Package PG-TO220-3-111 29. August 2013 Weight* 2241.82 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 7439-89-6 7723-14-0 7440-50-8 9.451 0.42 0.687 0.03 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.42 4216 4216 307 0.206 0.01 686.221 30.61 30.65 306101 92 306500 2.563 0.11 0.11 1143 1143 2.195 0.10 979 206.301 9.20 888.850 39.66 48.96 396485 489489 7.942 0.35 0.35 3543 3543 0.305 0.01 0.001 0.00 0.442 0.02 1.106 0.05 2.875 0.13 0.433 0.02 0.130 0.01 432.110 19.27 92024 136 0.01 1 493 0.20 1282 2. 3. 58 19.30 192750 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1972 193 Important Remarks: 1. 136 197 193001 1000000