PRELIMINARY CM1452 LCD & Camera EMI Filter Array with ESD Protection Features Applications 4, 6 and 8 channels of EMI filtering 15kV ESD protection (IEC 61000-4-2, contact discharge) 30kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz Chip Scale Package (CSP) with 0.40mm pitch and 0.25mm CSP solder ball which features extremely low parasitic inductance for optimum filter and ESD performance LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules OptiGuard Coating for improved reliability at assembly Lead-free version available General Description California Micro Devices’ CM1452 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-L-C) in CSP form factor with 0.40mm pitch. Each EMI filter channel of the CM1452 is implemented as a 3-pole L-C filter where the component values are 20pF-17nH-20pF. The CM1452’s roll-off frequency at -6dB attenuation is 330MHz and can be used in applications where the data rates are as high as 132Mbps while providing greater than 30dB over the 800MHz to 2.7GHz frequency range. The parts include ESD diodes on every I/O pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 15kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy-to-use pin assignments. In particular, the CM1452 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. The CM1452 incorporates OptiGuard which results in improved reliability at assembly. The CM1452 is available in a space saving, low profile Chip Scale Package with optional lead-free finishing (95.5Sn/3.8Ag/0.7Cu). It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. Schematic Diagram CM1452 schematic diagram of 3-pole L-C filter array with ESD. © 2005 California Micro Devices Corp. All rights reserved. 6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 PRELIMINARY Package Diagrams CM1452-04 (4-channel) mechanical diagram. CM1452-06 (6-channel) mechanical diagram. CM1452-08 (8-channel) mechanical diagram. Pin Number Pin Description Pin Number Pin Description A1 A2 A3 A4 A5 A6 A7 A8 B1 B2 Filter #1 Filter #2 Filter #3 Filter #4 Filter #5 Filter #6 Filter #7 Filter #8 GND GND B3 B4 C1 C2 C3 C4 C5 C6 C7 C8 GND GND Filter #1 Filter #2 Filter #3 Filter #4 Filter #5 Filter #6 Filter #7 Filter #8 © 2005 California Micro Devices Corp. All rights reserved. 6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 2 PRELIMINARY Part Ordering Information Pins Package Lead-free Finish 10 15 20 CSP CSP CSP CM1452-04CP CM1452-06CP CM1452-08CP Electrical Specifications Specifications: (At 25 C unless specified otherwise) Min. Channel Inductance Total Channel Capacitance at 2.5Vdc; 1MHz, 30mVac Capacitance C1 at 2.5V dc; 1MHz, 30mV ac 16 Cut-off Frequency, ZSOURCE = 50 , ZLOAD = 50 Roll-off Frequency at -6dB Attenuation, ZSOURCE = 50 , ZLOAD = 50 Stand-off Voltage, I = 10mA Diode Leakage at 3.3V reverse bias voltage Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, -10mA In-system ESD withstand voltage*: Human Body Model (MIL-STD-883, method 3015) IEC 61000-4-2, contact discharge method Dynamic Resistance 32 Max. 17 40 48 20 24 148 330 5.6 -1.5 Unit nH pF pF MHz MHz 5.5 0.1 1.0 V µA 6.8 -0.8 9.0 -0.4 V V kV kV 30 15 Positive Negative Temperature Range: Operating Storage Current per Inductor: DC Package Power Rating: Typ. 2.3 0.9 -40 -65 85 150 30 0.5 C mA W * ESD applied to input/output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Unused pins are left open. These parameters are guaranteed by design. © 2005 California Micro Devices Corp. All rights reserved. 6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 3 PRELIMINARY Typical EMI Filter Performance (0V d.c., 50 environment) Typical Diode Capacitance vs. Input Voltage (normalized to 2.5V d.c.) © 2005 California Micro Devices Corp. All rights reserved. 6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 4 PRELIMINARY PRINTED CIRCUIT BOARD RECOMMENDATIONS Pad size in PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Bond Trace Finish Tolerance – Edge to Corner Ball Solder Ball Side Coplanarity Soldering Minimum Temperature Maximum Dwell Time above Liquidous (183°C) Soldering Maximum Temperature 0.240mm Round Non Solder Mask Defined Pads 0.290mm Round 0.150mm 0.300mm (round) 50/50 by volume No Clean OSP (Entek Cu Plus 106A) 50µm 20µm 205’C for at least 30 seconds 60 seconds 260’C for at less than 2 minutes © 2005 California Micro Devices Corp. All rights reserved. 6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 5 PRELIMINARY Solder Reflow Profile Eutectic (SnPb) Solder Ball Reflow Profile Lead-free (SnAgCu) Solder Ball Reflow Profile Tape & Reel Information CMD PART # CM1452-04CP CM1452-06CP CM1452-08CP CHIP SIZE (mm) POCKET SIZE (mm) Bo x Ao x Ko 1.67 x 1.05 x 0.57 2.47 x 1.05 x 0.57 3.30 x 1.05 x 0.57 TAPE WIDTH W 8mm 8mm 8mm REEL DIAMETER QTY PER REEL P0 P1 178mm (7”) 178mm (7”) 178mm (7”) 3500 3500 3500 4mm 4mm 4mm 4mm 4mm 4mm © 2005 California Micro Devices Corp. All rights reserved. 6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 6