CALMIRCO CM1452-04CP Lcd & camera emi filter array with esd protection Datasheet

PRELIMINARY
CM1452
LCD & Camera EMI Filter Array with ESD Protection
Features
Applications
4, 6 and 8 channels of EMI filtering
15kV ESD protection
(IEC 61000-4-2, contact discharge)
30kV ESD protection (HBM)
Greater than 30dB of attenuation at 1GHz
Chip Scale Package (CSP) with 0.40mm pitch and
0.25mm CSP solder ball which features extremely
low parasitic inductance for optimum filter and ESD
performance
LCD and Camera data lines in mobile
handsets
I/O port protection for mobile handsets,
notebook computers, PDAs etc.
EMI filtering for data ports in cell phones,
PDAs or notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
OptiGuard Coating for improved reliability at assembly
Lead-free version available
General Description
California Micro Devices’ CM1452 is a family of pi-style EMI filter arrays with ESD protection, which
integrates four, six and eight filters (C-L-C) in CSP form factor with 0.40mm pitch. Each EMI filter channel
of the CM1452 is implemented as a 3-pole L-C filter where the component values are 20pF-17nH-20pF.
The CM1452’s roll-off frequency at -6dB attenuation is 330MHz and can be used in applications where the
data rates are as high as 132Mbps while providing greater than 30dB over the 800MHz to 2.7GHz
frequency range. The parts include ESD diodes on every I/O pin, which provide a very high level of
protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD
strikes of 15kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than 30kV.
This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its
small package format and easy-to-use pin assignments. In particular, the CM1452 is ideal for EMI filtering
and protecting data and control lines for the LCD display and camera interface in mobile handsets.
The CM1452 incorporates OptiGuard which results in improved reliability at assembly. The CM1452 is
available in a space saving, low profile Chip Scale Package with optional lead-free finishing
(95.5Sn/3.8Ag/0.7Cu). It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up
to 28% board space savings vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.
Schematic Diagram
CM1452 schematic diagram of 3-pole L-C filter array with ESD.
© 2005 California Micro Devices Corp. All rights reserved.
6/23/05
430 N. McCarthy Blvd., Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
1
PRELIMINARY
Package Diagrams
CM1452-04 (4-channel) mechanical diagram.
CM1452-06 (6-channel) mechanical diagram.
CM1452-08 (8-channel) mechanical diagram.
Pin Number
Pin Description
Pin Number
Pin Description
A1
A2
A3
A4
A5
A6
A7
A8
B1
B2
Filter #1
Filter #2
Filter #3
Filter #4
Filter #5
Filter #6
Filter #7
Filter #8
GND
GND
B3
B4
C1
C2
C3
C4
C5
C6
C7
C8
GND
GND
Filter #1
Filter #2
Filter #3
Filter #4
Filter #5
Filter #6
Filter #7
Filter #8
© 2005 California Micro Devices Corp. All rights reserved.
6/23/05
430 N. McCarthy Blvd., Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
2
PRELIMINARY
Part Ordering Information
Pins
Package
Lead-free Finish
10
15
20
CSP
CSP
CSP
CM1452-04CP
CM1452-06CP
CM1452-08CP
Electrical Specifications
Specifications:
(At 25 C unless specified otherwise)
Min.
Channel Inductance
Total Channel Capacitance at 2.5Vdc; 1MHz, 30mVac
Capacitance C1 at 2.5V dc; 1MHz, 30mV ac
16
Cut-off Frequency, ZSOURCE = 50 , ZLOAD = 50
Roll-off Frequency at -6dB Attenuation, ZSOURCE = 50 ,
ZLOAD = 50
Stand-off Voltage, I = 10mA
Diode Leakage at 3.3V reverse bias voltage
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, -10mA
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883, method 3015)
IEC 61000-4-2, contact discharge method
Dynamic Resistance
32
Max.
17
40
48
20
24
148
330
5.6
-1.5
Unit
nH
pF
pF
MHz
MHz
5.5
0.1
1.0
V
µA
6.8
-0.8
9.0
-0.4
V
V
kV
kV
30
15
Positive
Negative
Temperature Range:
Operating
Storage
Current per Inductor:
DC Package Power Rating:
Typ.
2.3
0.9
-40
-65
85
150
30
0.5
C
mA
W
* ESD applied to input/output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the
EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Unused pins are left
open. These parameters are guaranteed by design.
© 2005 California Micro Devices Corp. All rights reserved.
6/23/05
430 N. McCarthy Blvd., Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
3
PRELIMINARY
Typical EMI Filter Performance (0V d.c., 50 environment)
Typical Diode Capacitance vs. Input Voltage (normalized to 2.5V d.c.)
© 2005 California Micro Devices Corp. All rights reserved.
6/23/05
430 N. McCarthy Blvd., Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
4
PRELIMINARY
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad size in PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Bond Trace Finish
Tolerance – Edge to Corner Ball
Solder Ball Side Coplanarity
Soldering Minimum Temperature
Maximum Dwell Time above Liquidous (183°C)
Soldering Maximum Temperature
0.240mm
Round
Non Solder Mask Defined Pads
0.290mm Round
0.150mm
0.300mm (round)
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
50µm
20µm
205’C for at least 30 seconds
60 seconds
260’C for at less than 2 minutes
© 2005 California Micro Devices Corp. All rights reserved.
6/23/05
430 N. McCarthy Blvd., Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
5
PRELIMINARY
Solder Reflow Profile
Eutectic (SnPb) Solder Ball Reflow
Profile
Lead-free (SnAgCu) Solder Ball Reflow
Profile
Tape & Reel Information
CMD PART #
CM1452-04CP
CM1452-06CP
CM1452-08CP
CHIP SIZE
(mm)
POCKET SIZE
(mm)
Bo x Ao x Ko
1.67 x 1.05 x 0.57
2.47 x 1.05 x 0.57
3.30 x 1.05 x 0.57
TAPE
WIDTH
W
8mm
8mm
8mm
REEL
DIAMETER
QTY PER
REEL
P0
P1
178mm (7”)
178mm (7”)
178mm (7”)
3500
3500
3500
4mm
4mm
4mm
4mm
4mm
4mm
© 2005 California Micro Devices Corp. All rights reserved.
6/23/05
430 N. McCarthy Blvd., Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
6
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