LUXPIA LWM1030 Small size surface mount type Datasheet

Specification for Approval
(Ver 1.0)
Part No. : LWM1030
comments
LUXPIA Co., Ltd.
Designed by
Checked by
Approved by
/
/
/
Date : 2015 .
04 .
21 .
Approved by Approved by Approved by
/
Date :
/
.
/
.
.
LUXPIA CO.,LTD.
948-1, Dunsan-Li Bongdong-Eup, Wanju-Gun, JeonBuk, Korea
Tel 82-70-8671-2500
Fax 82-70-8620-8081
-
CONTENTS
-
1. Features
2. Package Outline Dimensions and Materials
3. Absolute Maximum Ratings
4. Electro-Optical Characteristics
5. CIE Chromaticity Diagram
6. Materials
7. Taping
8. Packing
9. Reliability
10. Cautions
11. Warranty
12. Characteristic Diagrams
(Ver 1.0)
1/16
1. Features
 Package : SMD Top View Type ( 1chip in 1 PKG)
 Dimension : 3.2 × 2.0 × 0.8 [mm] (L× W× H)
 Small size surface mount type
 Viewing angle : extremely wide(120˚)
 Soldering methods : Pb-free reflow
2. Package Outline Dimensions and Recommended Solder Patterns
Unit [mm]
(Ver 1.0)
2/16
3. Absolute Maximum Ratings
(Ta=25℃)
item
symbol
value
unit
IF
120
mA
IFP
250
mA
reverse voltage
VR
5
V
power dissipation
PD
300
mW
operating temperature
Topr
-30 to+85
℃
storage temperature
Tstg
-40 to +100
℃
forward current
pulse forward current
1)
1)
IFP conditions : pulse width ≤ 10msec & duty ratio ≤ 1/10
* Absolute Maximum ratings is not normal operating condition.
4. Electro-Optical Characteristics
(Ta=25℃)
item
rank
forward
voltage
2)
luminous
intensity
3)
Reverse
current
min
typ
max
V29
2.90
-
3.00
V30
3.00
V31
symbol
-
3.20
V32
3.20
-
3.30
V33
3.30
-
3.40
4E10
10.0
-
11.0
11.0
-
12.0
12.0
-
13.0
-
-
50
IV
IF= 100mA
IF= 100mA
4E12
-
IR
VR= 5V
2)
Forward voltages are tested at a current pulse duration of 10 ms and an accuracy within ± 0.1V.
3)
The allowance of luminous intensity measurement is within ± 11%..
* To avoid optical difference, please do not mix differently ranked product.
* All measurements were made under the standardized environment of LUXPIA.
(Ver 1.0)
3/16
unit
3.10
3.10
4E11
VF
condition
V
cd
㎂
5. CIE Chromaticity Diagram
4)
(Ta=25℃, IF=100mA)
4)
The allowance of color coordinates measurement is within ± 0.01. (CIE1931 standard colorimetric system)
(Ver 1.0)
4/16
6. Materials
item
material
LED chip
InGaN
wire
gold
lead frame
copper alloy/Ni/Ag plating
encapsulation
Silicone resin + phosphor
heat-resistant polymer
PPA
7. Taping
7.1. tape (Material : Conductive PS, Surface Resistivity < 107Ω/sq)
(Units : mm)
(Ver 1.0)
5/16
7.2. wheel (color : black)
(Units : mm)
- quantity per reel
LWM1030 : 3,500 pcs
7.3. label
part no.
size (L X W) : 85mm  50mm
LWM1030
C3 – 4E10 - V31
3,500ea
color rank
(Ver 1.0)
IV rank
VF rank
6/16
8. Packing
• The LEDs are packed in cardboard boxes after taping.
The label shows part number, lot
number, rank, and quantity.
• In order to protect the LEDs from mechanical shock, they are packed with cardboard boxes
for transportation.
• The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so cautions must be taken to prevent any possible damage.
• The boxes are not water-resistant and, therefore, must be kept away from water and
moisture.
• When the LEDs are transported, it is recommended that the same packing method as
Luxpia's is used.
• If noticeable damage on a box appears upon arrival at the user’s warehouse, the user should
submit a claim to Luxpia within one week after arrival of the products.
(Ver 1.0)
7/16
9. Reliability
9.1. test items and results
NO
1.
Test Item
Test Conditions
Note
Tsld=245℃, 10sec.
1 times
Solderability
Tsld=215± 5℃, 3sec
1 time
(Reflow Soldering)
(Lead Solder)
over 95%
Resistance to Soldering Heat
(Reflow Soldering)
2
-40℃~25℃~100℃
3
Temperature Cycle
4
High Temperature Storage
5
6
7
0/22
0/22
0/22
Ta=85℃
1000 hrs
0/22
Temperature Humidity Storage
Ta=60℃, RH=90%
1000 hrs
0/22
Low Temperature Storage
Ta=-40℃
1000 hrs
0/22
Ta=25℃, IF=100mA
1000 hrs
0/22
Ta=85℃, IF=20mA
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
Steady State Operating Life
Condition
High Temperature
10
Damaged
100 cycles
30min. 5min. 30min
Steady State Operating Life of
9
Number of
Steady State Operating Life of
60℃, RH=90%,
High Humidity Heat
IF=40mA
Steady State Operating Life of
Low Temperature
Ta=-30℃, IF=100mA
* LED with Luxpia standard circuit board
9.2. criteria for judging the damage
item
symbol
test condition
forward voltage
VF
luminous intensity
IV
5)
U.S.L. : upper standard level
6)
L.S.L. : lower standard level
(Ver 1.0)
criteria for judgement
min
max
IF = 100mA
-
U.S.L.5) × 1.1
IF = 100mA
L.S.L.6) × 0.7
-
8/16
10. Cautions
The LEDs are device which are materialized by combining Blue LEDs and special phosphors. Consequently,
the color of White LEDs is subject to change a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture-Proof Package
• When moisture is absorbed into the SMT package it may vaporize and expand products during soldering.
There is a possibility that this may cause exfoliation of the contacts and damage to the optical characteristics
of the LEDs.
For this reason, the moisture-proof package is used to keep moisture to a minimum in the
package.
• A package of a moisture-absorbent material (silica gel) is inserted into the shielding bag.
The silica gel
changes its color from yellow to green as it absorbs moisture.
(2) Storage
• Storage Conditions
- After opening the package :
The LEDs should be kept at 5℃~40℃ or less and 30%RH or less.
hours after opening the package.
The LEDs should be soldered within 24
If unused LEDs remain, they should be stored in moisture-proof packages,
such as sealed containers with packages of moisture-absorbent material (silica gel).
It is also recommended
to return the LEDs to the original moisture-proof bag and to reseal the moisture-proof bag again.
• If the moisture-absorbent material (silica gel) has faded away or the LEDs have exceeded the
recommended storage time, baking treatment should be performed using the following conditions.
- Baking treatment : more than 24 hours at 60± 5℃ (Reel condition)
more than 12 hours at 125± 5℃ (Each piece condition)
• After assembly and during use, silver plating can be affected by the corrosive gases emitted by components
and materials in close proximity of the LEDs within an end product, and the gases entering into the product
from the external atmosphere. The above should be taken into consideration when designing.
• Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
• Thermal design of the end product is of paramount importance.
LED when the system is designed.
Please consider the heat generation of the
The coefficient of temperature increase per input electric power is
affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as
other components.
It is necessary to avoid intense heat generation and operate within the maximum ratings
given in the specification.
• The operating current should be decided after considering the ambient maximum temperature of LEDs.
(Ver 1.0)
9/16
(4) Recommended circuit
• In designing a circuit, the current though each LED must not exceed its absolute maximum rating. It is
recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile,
when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the
variation in forward (VF) of the LEDs. In worst case, some LED may be subjected to stresses in excess of the
absolute maximum rating.
• This product should be operated in forward bias. Driving circuit must be designed so that the product is not
subjected to either forward or reverse voltage while it is off.
In particular, if a reverse voltage is continuously
applied to the product, such operation can cause migration resulting in LED damage.
• Please determine the operating current with consideration of the ambient temperature local to the LED and
refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this
specifications.
Please also take measures to remove heat from the area near the LED to improve the
operational characteristics of the LED.
(5) Handling Precautions
• Bare Hand
When handling the product, touching encapsulant with bare hands will contaminate its surface that could
affects optical characteristics. In the worst cases, excessive force the encapsulant by hands might result in
catastrophic failure of the LEDs due to wire deformation and/or breakage.
• Tweezers
Since silicone used as encapsulating resin in this product is a soft material, the upper surface of the product
is soft. Pressuring onto the product might cause catastrophic failure of the LEDs due to damage to
encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and
LED detachment.
(Ver 1.0)
10/16
• Pick and Place
Recommended conditions: Outer nozzle≥Φ1.75mm
※ Avoid direct contact to the encapsulant with the picking nozzle.
Failure to comply might result in damage to encapsulant and in the worst cases, catastrophic failure of the
LEDs due to wire deformation and/or breakage.
• Drop
Please note that a package damage such as crack might occur when having dropped the product.
(Ver 1.0)
11/16
• Printed Circuit Board Assembled (PCB with LEDs soldered)
Do not stack assembled PCBs together. Since silicone is a soft material abrasion between two PCB
assembled with encapsulate LED might cause catastrophic failure of the LEDs due to damage to encapsulant
(such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED
detachment.
(6) Soldering Conditions
• The LEDs can be soldered in place using the reflow soldering method.
Luxpia does not make any
guarantee on the LEDs after they have been assembled using the dip soldering method.
• Recommended soldering conditions
Reflow Soldering
Hand Soldering
Pre-Heat
120~150℃
Pre-Heat Time
120sec Max.
Temperature
Peak Temperature
245℃ Max.
Soldering Time
Soldering Time
Condition
10sec Max.
refer to profile ①
350℃ Max.
3sec Max.
(one time only)
* Although the recommended soldering conditions are specified in the above table, reflow soldering at the
lowest possible temperature is desirable for the LEDs.
* A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-Profile (surface of circuit board)]
Use the conditions shown to the following figures.
<① : Reflow Solder>
(Ver 1.0)
12/16
• Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during
air reflow. It is recommended that the User use the nitrogen reflow method.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a doublehead soldering iron should be used. It should be confirmed beforehand whether the characteristics of the
LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board.
(7) Cleaning
• It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other
solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or
not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. Do not clean
the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test
should be done to confirm whether any damage to the LEDs will occur.
(8) Static Electricity
• Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an antielectrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be properly grounded. It is recommended that measurements
be taken against surge voltage to the equipment that mounts the LEDs.
• When inspecting the final products in which LEDs were assembled, it is recommended to check whether the
assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a lighton test or a VF test at a lower current (below 1mA is recommended).
• Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the
forward voltage becomes lower, or the LEDs do not light at the low current.
- criteria : VF > 1.8V at IF=0.5㎃
(9) Others
• This LED complies with RoHS Directive.
• The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking
directly at the LEDs with unaided eyes for more than a few seconds.
• Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions
during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it.
• The customer not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Luxpia. When defective LEDs are found, the User shall inform Luxpia directly before
disassembling or analysis.
• The warranties of quality set forth herein are exclusive. All previous negotiations and agreements not
specifically incorporated herein are superseded and rendered null and void.
• Both parties shall sincerely try to find a solution when any disagreement occurs regarding these
specifications.
• These specifications can be revised upon mutual agreement.
• Luxpia understands that the User accepts the content of these specifications, if the User does not return
these specifications with signatures within 3 weeks after receipt.
• The LEDs described in the specification are intended to be used for ordinary electronic equipment (such as
office equipment, communications equipment, on the applications in which exceptional quality and reliability
are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health
(such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic
control equipment, life support systems and safety devices)
(Ver 1.0)
13/16
11. Warranty
(1) Luxpia warrants that its LEDs conform to the foregoing specifications and that Luxpia will convey good
title to all LEDs sold.
(2) LUXPIA disclaims all other warranties including the implied warranties of merchantability and fitness for a
particular purpose.
(3) In the event any LED supplied by Luxpia is found not to conform to the foregoing specifications within
ninety days of receipt, Luxpia will repair or replace the LED, at Luxpia’s discretion, provided that the User (a)
promptly notifies Luxpia in writing of the details of the defect (b) ships the LEDs at the User’s expense to
Luxpia for examination, and (c) the defect is due to the negligence of Luxpia and not mishandling or misuse
by the User.
(4) Luxpia will not take responsibility for any trouble that is caused by using the LEDs at conditions exceeding
our specifications.
(5) These specifications are applied only when a LED stands alone and it is strongly recommended that the
User of the LEDs confirms the properties upon assembly. Luxpia is not responsible for failures caused during
and after assembling. It will be excepted from the rule if the failure would caused undoubtedly by Luxpia.
(6) A claim report stating details about the defect shall be made when returning defective LEDs.
investigate the report immediately and inform the user of the results.
Luxpia will
(7) LUXPIA’s liability for defective lamps shall be limited to replacement and in no event shall LUXPIA be liable
for consequential damage or lost profits.
(8) LUXPIA’s guarantees that the chip paste and material stuck paste should not be blackened.
(Ver 1.0)
14/16
12. Characteristic Diagrams
*All Characteristic shown are for reference only are not guarantee.
60
(1) forward voltage vs. forward current
(2) forward current vs. relative luminosity
(Ta=25℃)
(Ta=25℃)
3.0
120
50
2.5
relative luminosity [a.u.]
forward current IF [mA]
100
80
60
40
40
20
2.0
1.5
1.0
0.5
0
0
1
1.5
30
2.0
2.5
3.0
3.5
50
(3) ambient temperature vs. allowable
20
forward current
(IF=100㎃)
10
120
10
90
60
30
-20
20
0
20
40
60
80
relative luminosity[a.u.]
allowable forward current IAF[mA]
250
(4) ambient temperature vs. relative luminosity
150
1
60
40
0.1
-40
100
ambient temperature Ta[℃]
(Ver 1.0)
200
150
forward current IF[mA]
forward voltage VF[V]
0
100
4.0
-20
0
20
80
40
60
80
ambient temperature Ta[℃]
15/16
10
100
(5) relative spectral emission
Intensity [a.u]
(Ta=25℃, IF=100mA)
Wavelength [nm]
(6) radiation characteristics
(Ver 1.0)
(Ta=25℃, IF=100mA)
16/16
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