APDS-9702 Signal Conditioning IC for Optical Proximity Sensors with Digital I2C Interface Data Sheet Description Features APDS-9702 is a signal conditioning IC that enhances the performance and robustness of the optical sensors used for proximity or object detection. x Low power consumption – Internal oscillation circuit to drive LED in pulse mode – Low shut down current – External LED drive-current control APDS-9702 is a single chip solution that consists of an I2C Write function, oscillation circuit, LED driver circuit and sunlight cancellation circuit integrated into a single chip. APDS-9702 has artificial light immunity and is also operational under the sun. Design flexibility is optimized as APDS-9702 can be paired up with an integrated proximity sensor or discrete pair solution. APDS-9702 can be disabled to maximize power savings and battery life in applications such as portable or battery-operated devices. The LED current of the optical proximity sensors can be configured to different levels using a limiting resistor at the LEDA pin. APDS-9702 also provides user options in frequency, suitable burst rate, comparator threshold setting and burst off period that can reduce power consumption. These low power consumption features makes it also ideal for low power mobile and handheld devices. APDS-9702 is capable of operating at voltage supply ranging from 2.4 V to 3.6 V. APDS-9702 has two separate output pins for analog and digital outputs. This provides flexibility to use either the analog or digital output (or both) depending on the requirements of the application. The device is packaged in 8-pin QFN package measuring 0.55mm(H) x 2mm(W) x 2mm(L). x Complete shutdown mode – Low shutdown current x Supply voltage : 2.4 V to 3.6 V x Operational in sunlight conditions up to 100klux(with HSDL-9100) x Artificial light immunity x Analog & Digital output available – Built in comparator for digital output – Digital output remains Low during object detected. x Wide bandwidth Trans-impedance amplifier x External capacitor and resistor for integration and gain controls x Flexibility to enhance detection distance up to 200mm with HSDL-9100 or further with external discrete pair x Small 2mm x 2mm QFN 8-pin package x Design flexibility to pair with Avago Proximity Sensors or discrete pair solution x Lead-free & RoHS Compliant Applications x PDA and mobile phones Ordering Information x Digital Camera Part Number Packaging Quantity x Portable and Handheld devices APDS-9702-020 Tape & Reel 2500 per reel x Personal Computers/Notebooks x Amusement/Games/Vending Machines Application Support Information x Industrial Automation The Application Engineering Group is available to assist you with the application design associated with APDS-9702 module. You can contact them through your local sales representatives for additional details. x Contactless Switches x Sanitary Automation APDS-9702 Block Diagram VCC (8) VCC Rp Rp (7) LEDA Timing Control (1) SDA I2C (2) SCL Sunlight Cancellation Oscillator R1 Avago Proximity Sensor (5) PD TIA VCC R2 (6) PFILT CX3 V-I Converter (3) DOUT + Latch Comparator 100k 300k 500k (4) GND Figure 1. APDS-9702 Block Diagram 2 LED PIN R3 (Optional) APDS-9702 pin-out and I/O Configurations PIN #1 CORNER Pin 1 Pin 8 Pin 2 Pin 7 Pin 3 Pin 6 Pin 4 Pin 5 I/O Pins Configuration Table Pin Symbol Type Description 1 SDA Digital I/O I2C Serial Data I/O terminal 2 SCL Digital I/P I2C input / output signal I2C Serial Clock Input terminal I2C clock input signal 3 DOUT Digital O/P Digital Output An open drain output that requires a pull-up resistor of recommended value 10k : DOUT = Low at last LED pulse of burst when VPFILT > V TH, DOUT remains Low during object detected. DOUT = High at last LED pulse of burst when VPFILT < V TH, DOUT remains High during object not detected. Please refer to Output Waveforms Definition. 4 GND Ground Ground 5 PD Analog I/P Photo-Detector Input Connect to Cathode of photo-detector (proximity sensor) 6 PFILT Analog O/P Analog Output Connect to integration circuit (R3 & CX3) 7 LEDA Analog O/P LED Driver Output Connect to Anode of LED (proximity sensor) 8 VCC Supply Voltage Supply Absolute Maximum Ratings Parameter Symbol Min. Max. Units Conditions Supply Voltage VCC 0 3.6 V Ta=25°C Input Logic Voltage VI 0 3.6 V Ta=25°C 260 °C Reflow Soldering Temperature Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA -40 85 °C Storage Temperature TS -40 125 °C Supply Voltage VCC 2.4 3.6 V 3 Conditions Electrical & Optical Specifications (Ta=25°C) Parameters Input Symbol Minimum Logic High Input Voltage VIH 0.7*VCC Logic Low Input Voltage VIL Typical Maximum Units Conditions V 0.3* VCC V Logic High Input Current IIH 0.1 PA VI ≥ VIH Logic Low Input Current IIL 0.1 PA VI ≤ VIL Shutdown Current ISD Standby Current ISB 70 1 PA Vcc = 3.0 V, TRG = X, PWR = 0 100 PA Vcc = 3.0 V, TRG = 0, PWR = 1 0.3 V IDOUT(Low) = 2 mA, Vcc = 3.0 V V : Vcc = 3.0 V, R2 = 10k: mA Vcc = 3.0 V, R1 = 10: Output Digital Output Low Level VOL 0 Digital Output High Level VOH Vcc – 0.3 Built-in Resistor at PFILT RFILT 100k, 300k, 500k ILED 125 Through I2C set. Transmitter ILED Pulse Current Number of LED Pulse 16 x (1, 2, …, 16 times) LED Pulse Frequency 12.5, 25, 50, 100 LED Burst Duration vs. OFF Period 1/16, 1/64, 1/128, 1/256 235 Through I2C set. kHz Through I2C set. Pulse Duty Cycle = 50%. Through I2C set. Receiver 0 3 PA Photodiode Input Current (PD) IPD Current Gain IPFILT/IPD 20 times Vcc = 3.0 V [1] V TH 0.12 0.17 0.22 0.27 0.32 0.37 0.42 0.47 0.52 0.57 0.62 0.67 0.72 0.77 0.82 0.87 V TH = 0000, TH = 0001, TH = 0010, TH = 0011, TH = 0100, TH = 0101, TH = 0110, TH = 0111, TH = 1000, TH = 1001, TH = 1010, TH = 1011, TH = 1100, TH = 1101, TH = 1110, TH = 1111 IDC 100 PA Vcc = 3.0 V[1] Comparator Threshold Threshold voltage Sunlight Cancellation DC Current, PD Note: 1. Specified by design, not production tested. 4 Typical Application Circuit VCC Rp Rp R2 SDA SDA 1 8 VCC CX1 SCL SCL 2 7 LEDA CX2 R1 R3 (Optional) MCU DOUT GPIO APDS-9702 3 6 PFILT CX3 (Optional) GND ADC 4 5 Avago Proximity Sensor PD Reflective Object Figure 2. Typical Application Circuit for APDS-9702 Recommended Avago Proximity Sensor Description HSDL-9100 Integrated Reflective Proximity Sensor Component Recommended Values ( with HSDL-9100) R1 10 : ± 5%, 0.25W R2 10k: ± 5% R3 1M: ± 5% Rp 10k: ± 5% CX1 100 nF ± 20% X 7R, Ceramic, CX2 6.8 PF ± 20%, Tantalum CX3 3.3 nF ± 20% X 7R, Ceramic 5 I2C Definition APDS-9702 operates as slave device on I2C bus for clock frequency (SCL) up to 400 kHz. The basic protocol of I2C bus is described below, for more details and specifications, please refer to I2C-bus specification and user manual. SDA SCL S P START condition STOP condition START and STOP conditions P SDA MSB acknowledgement signal from slave MSB acknowledgement signal from receiver MSB SCL 1 S or Sr 2 7 START or repeated START condition 8 1 9 ACK byte complete, interrupt within slave 2 3 to 8 9 ACK 1 2 3 to 8 9 ACK clock line held LOW while interrupts are serviced Sr Sr or P STOP or repeated START condition Data transfer on I2C bus SDA SCL 1-7 8 9 1-7 8 9 1-7 8 9 P S START condition ADDRESS W ACK DATA Low byte ACK DATA High byte ACK STOP condition A complete data transfer 1 7 1 1 8 1 8 1 1 S Slave Address Wr A Data Byte A Data Byte A P S Start Condition Wr Write”0” A Acknowledge (0 for ACK) P Stop Condition Master-to-Slave Slave-to-Master Slave Address: 1010100 (Default) 6 Register Definition Bit Default 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 TRG PWR NB3 NB2 NB1 NB0 F1 F0 DC1 DC0 TH3 TH2 TH1 TH0 R1 R0 0 0 0 0 0 1 0 0 1 0 0 1 0 0 0 0 Register Type Description TRG Trigger This pin is active high. TRG = 1 o Normal proximity sensing operations TRG = 0 o No operation (Default) PWR Power PWR = 0 o Power Shut Down (Default) PWR = 1 and TRG = 0 o Standby PWR = 1 and TRG = 1 o Active Operations NB<3:0> NBurst Number of LED Pulse per Burst = 16 x (1, 2, …, 16 times); 0x0 = 16-pulse, 0x1 = 32-pulse (Default), …, 0xE = 240-pulse, 0xF = 256-pulse Figure 3 F<1:0> Frequency 00 = 12.5kHz (Default), 01 = 25kHz, 10 = 50kHz, 11 = 100kHz; Wave is fixed at 50% Duty Cycle Figure 3 DC<1:0> Duration Cycle LED Burst Duration versus OFF period; 00 = 1:16, 01 = 1:64, 10 = 1:128 (Default) and 11 = 1:256 Figure 3 TH<3:0> Threshold, VTH 16 options of Comparator Threshold Setting; 0000 = 0.12V, 0001 = 0.17V, 0010 = 0.22V, 0011 = 0.27V, 0100 = 0.32V (Default), 0101 = 0.37V, 0110 = 0.42V, 0111 = 0.47V, 1000 = 0.52V, 1001 = 0.57V, 1010 = 0.62V, 1011 = 0.67V, 1100 = 0.72V, 1101 = 0.77V, 1110 = 0.82V, 1111 = 0.87V Figure 4 R<1:0> RFLIT Programmable Filter Register; 00 = No resistor (Default), 01 = 100k, 10 = 300k, 11 = 500k Figure 5 50% DC Number of LED Pulses LED Burst Duration Figure 3. LEDA Burst Pulses Definition 7 Remark Burst Pulse OFF Period Duration Cycle = LED Burst Duration: Burst Pulse OFF Period Transmit Burst Pulses Definition Operation ON/OFF condition is shown in the following table: TRG PWR Condition X 0 Shut down 0 1 Standby Mode 1 1 Active Mode, pulses sent The burst pulses at LEDA pin will be activated under 2 state conditions with 2 different start-up timing. The following diagrams explained these 2 scenarios. (a) State condition 1: From Shut down -> Standby Mode -> Active Mode: Burst pulses at LEDA pin are activated after 1.3 ms LEDA Burst Pulses I2C Shutdown I2C Standby I2C Active >1.3 ms (b) State condition 2: From Shut down -> Active Mode: Burst pulses at LEDA pin are activated after 1.3 ms LEDA Burst Pulses I2C Shutdown I2C Active >1.3 ms 8 Output Waveforms Definition Burst Pulses LEDA VTH PFILT Object detected DOUT Figure 4. Output Waveforms Definition 9 Object detected Object not detected No object detected RFILT Definition There are built-in resistors at PFILT (pin 6) to provide 4 options to set the desired resistor for integrated RC circuit. R0 R1 Resistor Value 0 0 Open. External resistor R3 is required to be in parallel with CX3 0 1 100k ohm. R3 become optional. 1 0 300k ohm. R3 become optional. 1 1 500k ohm. R3 become optional. (6) PFILT V-I Converter + Comparator 100K 300K 500K (4) GND Figure 5. RFILT definition 10 CX3 R3 (Optional) APDS 9702 Performance Charts RELATIVE LED CURRENT VS VCC 1.60 1.40 RELATIVE LED CURRENT RELATIVE LED CURRENT 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 2.2 2.6 2.8 3 VCC (V) 3.2 3.4 3.6 0.80 0.60 0.40 -60 3.8 RELATIVE ICC STANDY CURRENT VS VCC -40 -20 0 20 40 TEMPERATURE (°C) 60 80 100 RELATIVE STANDBY CURRENT VS TEMPERATURE 1.20 1.00 1 RELATIVE ICC STANDBY RELATIVE ICC STANDY CURRENT 1.00 0.00 2.4 0.8 0.6 0.4 0.2 0.80 0.60 0.40 0.20 0.00 0 2.2 2.4 2.6 2.8 3 3.2 VCC (V) 3.4 3.6 3.8 AVERAGE PEAK LED CURRENT VS R1 300 PEAK LED CURRENT (mA) 1.20 0.20 1.2 250 200 VCC 3.3V 3.0V 2.7V 2.4V 150 100 50 0 11 RELATIVE LED CURRENT VS TEMPERATURE 1.60 0 2 4 6 R1 (OHMS) 8 10 12 -60 -40 -20 0 20 40 TEMPERATURE (°C) 60 80 100 APDS-9702 Package Dimensions QFN 8-Pin Package 2 7 6 5 1 2 3 4 2 8 Pin #1 ID On Top 0.02 0.50 0.10 TOP VIEW SIDE VIEW 1.20 0.28 0.40 2 3 4 8 7 6 5 0.60 0.7 1 0.35 X 45° 0.125 (x4) 0.25 (x8) 0.25 (x6) BOTTOM VIEW Note: 1. All Dimensions in mm. Tolerance ±0.1mm unless specified. 2. Marking Information: The unit is marked ‘YWW LLa’ on the chip. Y = Year (Last digit of the year) WW = work week (1-54) LL = Lot number (01-99) a = Denote this is an I2C part. 12 0.1 0.32 0.5 Recommended Minimum Land pattern and Keep-out Area Keep-out Area Recommendations: 0.22 R0 .17 5 2 2.2 Area of Solder Land pattern = 2.3mm x 2.1mm Module placement tolerance & keep out on each side with no lead = 0.55mm & keep out on each side solder lead = 0.8mm Keep-out area = 3.9mm x 3.2mm 0.25 0.25 0.5 2 SOLDER LAND PATTERN Dimension in mm. Recommended tolerances +/-0.1mm 13 APDS-9702 Tape and Reel Dimensions Tape Dimensions 4.00 ± 0.10 2.00 ± .05 Ø 1.50 + .10 4.00 ± 0.10 1.75 ± 0.10 3.50 ± .05 .30 8.00 + .10 Ø 1.00 + 0.25 YWW LLa UNIT ORIENTATION IN POCKET .254 ± 0.02 5° MAX 5° MAX 2.30 ± 0.10 A. 0.75 ± 0.10 K. ALL DIMENSIONS IN mm. 14 2.30 ± 0.10 B. Reel Dimensions W3 (INCLUDES FLANGE DISTORTION AT OUTER EDGE) W2 (MEASURE AT HUB) B W1 (MEASURE AT HUB) ø60.0 ± 0.5 ø56.8 ± 0.5 A A øN R12.7 øA 60° E R75.0 REEL MADE IN MALAYSIA 1.6 SEE DETAIL A 11.3 1.6 1.9 FRONT VIEW B SECTION: BB BACK VIEW 1.5 MIN 0.5 ø13.0 ±0.2 ø20.2 MIN SECTION: AA ARBOR HOLE DETAIL A SCALE 2:1 Product SPecifications TAPE WIDTH ØA 08MM 180 –2.0 +0.0 ØN WT 60 ±2.0 8.4 –0.0 +1.5 W2 (MAX) W3 14.4 8.4 –0.5 +2.5 E 4.0 ± 0.1 All Dimensions in mm. Packaging All APDS-9702 options are shipped in ESD proof packaging. This part is compliant to JEDEC MSL 1. Recommended Storage Conditions Storage Temperature The units in tape and reel are recommended to be kept in a controlled climate environment, with temp at 25 +5/-10°C and relative humidity at 55 +/-15%. Time from unsealing to soldering This part is compliant to JEDEC MSL-1 (unlimited floor life at < 30°C / 85%RH) 15 Recommended Reflow Profile MAX 260C T - TEMPERATURE (°C) 255 R3 230 217 200 180 150 120 R2 R4 60 sec to 90 sec Above 217 C R5 R1 80 25 0 50 P1 HEAT UP 100 150 P2 SOLDER PASTE DRY The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different 'T/'time temperature change rates or duration. The 'T/'time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9702 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and APDS-9702 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300 t-TIME (SECONDS) Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9702 pins to change dimensions evenly, putting minimal stresses on the APDS-9702. It is recommended to perform reflow soldering no more than twice. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-2238EN - March 3, 2010