NEC MC-7882 Gaas multi-chip module Datasheet

DATA SHEET
GaAs MULTI-CHIP MODULE
MC-7882
870 MHz CATV 20 dB POWER DOUBLER AMPLIFIER
DESCRIPTION
The MC-7882 is a GaAs Multi-chip Module designed for use in CATV applications up to 870 MHz. This unit has
low distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
• Low distortion
• High linear gain
GL = 20.0 dB MIN. @ f = 870 MHz
• Low return loss
ORDERING INFORMATION
Part Number
MC-7882
Package
Supplying Form
7-pin special with heatsink
50 pcs MAX./Tray
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7882
ABSOLUTE MAXIMUM RATINGS (TA = +25°°C)
Parameter
Supply Voltage
Symbol
Ratings
Unit
VDD
30
V
Note
Vi
65.0
dBmV
Operating Case Temperature
TC
−30 to +100
°C
Storage Temperature
Tstg
−40 to +100
°C
Input Voltage
Note In case of single tone
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10314EJ01V0DS (1st edition)
Date Published January 2003 CP(K)
Printed in Japan
 NEC Compound Semiconductor Devices 2002, 2003
MC-7882
RECOMMENDED OPERATING CONDITIONS (ZS = ZL = 75 Ω)
Parameter
Supply Voltage
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
23.5
24.0
24.5
V
−
34.0
37.0
dBmV
−30
+25
+85
°C
MIN.
TYP.
MAX.
Unit
f = 870 MHz
20.0
−
21.0
dB
f = 40 to 870 MHz
0.4
0.8
1.2
dB
f = 40 to 870 MHz, Peak to valley
−
−
0.6
dB
VDD
Input Voltage
Vi
Operating Case Temperature
TC
110 channel,
10 dB tilted across the band
ELECTRICAL CHARACTERISTICS (TC = 30±
±5°°C, VDD = 24 V, ZS = ZL = 75 Ω)
Parameter
Symbol
Linear Gain
GL
Gain Slope
GSlope
Test Conditions
Gain Flatness
GFlatness
Noise Figure 1
NF1
f = 50 MHz
−
−
6.0
dB
Noise Figure 2
NF2
f = 870 MHz
−
−
6.5
dB
Operating Current
IDD
RF OFF
310
−
360
mA
Composite Triple Beat
CTB
110 channel,
−
−
−60
dBc
Cross Modulation
XM
VO = 52 dBmV at 745.25 MHz,
−
−
−55
dBc
Composite 2nd Order Beat
CSO
10 dB tilted across the band
−
−
−63
dBc
Input Return Loss 1
RLi1
f = 40 to 160 MHz
20
−
−
dB
Input Return Loss 2
RLi2
f = 160 to 320 MHz
19
−
−
dB
Input Return Loss 3
RLi3
f = 320 to 640 MHz
17.5
−
−
dB
Input Return Loss 4
RLi4
f = 640 to 870 MHz
16
−
−
dB
Output Return Loss 1
RLo1
f = 40 to 160 MHz
20
−
−
dB
Output Return Loss 2
RLo2
f = 160 to 320 MHz
19
−
−
dB
Output Return Loss 3
RLo3
f = 320 to 640 MHz
17.5
−
−
dB
Output Return Loss 4
RLo4
f = 640 to 870 MHz
16
−
−
dB
2
Data Sheet PG10314EJ01V0DS
MC-7882
PACKAGE DIMENSIONS
7-PIN SPECIAL WITH HEATSINK (UNIT: mm)
8.1 MAX.
38.1±0.25
φ 4.25–0.35
+0.25
27.5 MAX.
4.0±0.25
14.85 MAX.
3.2 MAX.
45.08 MAX.
19.05±0.38
25.4±0.25
6-32UNC2B
0.51±0.05
10.75±0.25
7 8 9
2.62±0.35
5
12.9 MAX.
1 2 3
21.5 MAX.
4.19±0.13
2.54±0.25
A
2.54±0.38
6.3
0.51±0.05
2.5
0.38.. A
±0.05
PIN CONNECTION
VDD
5
1
9
IN
OUT
2
3
7
8
GND
Data Sheet PG10314EJ01V0DS
3
MC-7882
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress
to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Partial Heating
Soldering Conditions
Peak temperature (pin temperature) : 350°C or below
Soldering time (per pin of device)
Recommended Condition Symbol
Note
: 3 seconds or less
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
4
Data Sheet PG10314EJ01V0DS
−
MC-7882
• The information in this document is current as of January, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
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M8E 00. 4 - 0110
Data Sheet PG10314EJ01V0DS
5
MC-7882
SAFETY INFORMATION ON THIS PRODUCT
Caution
GaAs Products
The product contains gallium arsenide, GaAs.
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
• Do not destroy or burn the product.
• Do not cut or cleave off any part of the product.
• Do not crush or chemically dissolve the product.
• Do not put the product in the mouth.
Follow related laws and ordinances for disposal. The product should be excluded from general
industrial waste or household garbage.
Business issue
NEC Compound Semiconductor Devices, Ltd.
5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: [email protected]
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Hong Kong Head Office
FAX: +852-3107-7309
TEL: +852-3107-7303
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http://www.ee.nec.de/
TEL: +49-211-6503-01 FAX: +49-211-6503-487
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http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
Technical issue
NEC Compound Semiconductor Devices, Ltd.
http://www.csd-nec.com/
Sales Engineering Group, Sales Division
E-mail: [email protected] FAX: +81-44-435-1918
0209
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