ON NCP5623BMUTBG Triple output i2c controlled rgb led driver Datasheet

NCP5623B
Triple Output I2C Controlled
RGB LED Driver
The NCP5623B mixed analog circuit is a triple output LED driver
dedicated to the RGB illumination or backlight LCD display.
The built−in DC/DC converter is based on a high efficient charge
pump structure with operating mode 1x and 2x. It provides a 94% peak
efficiency. The tiny package makes the device suitable for room
limited portable applications.
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LLGA12
MU SUFFIX
CASE 513AA
Features
•
•
•
•
•
•
•
•
•
•
2.7 to 5.5 V Input Voltage Range
RGB Function Fully Supported
Programmable Integrated Gradual Dimming
90 mA Output Current Capability
94% Peak Efficiency
Built−in Short Circuit Protection
Provides Three Independent LED Drives
Support I2C Protocol
Embedded OVP / Open Load Protection
This is a Pb−Free Device
PIN ASSIGNMENT
2
GND
Vbat
VOUT
LED2
SCL
LED1
IREF
1
C1P
C1
11
7
SCL
9
6
GND
GND
(Top View)
7
1
R1
62 k
GVMG
G
8
GV = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
C2
220 nF
SDA
GND
SDA
6
C3
1 mF/6.3 V
MCU
I2C Port
11
MARKING DIAGRAM
+Vbat
GND
CIP
AGND
Multicolor Illuminations
Portable Back Light
Digital Cellular Phone Camera Photo Flash
LCD and Key Board Simultaneous Drive
+Vcc
CIN
LED3
Typical Applications
•
•
•
•
1
Vbat
SDA
SCL
AGND
IREF
12
C1N 10
Vout
LED3
LED2
LED1
GND
NCP5623B
U1
1 mF/10 V
GND
ORDERING INFORMATION
Device
NCP5623BMUTBG
3
D3
4
D2
5
D1
2
Package
Shipping†
LLGA12 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
GND
Figure 1. Typical Multiple White LED Driver
© Semiconductor Components Industries, LLC, 2009
February, 2009 − Rev. 0
1
Publication Order Number:
NCP5623B/D
NCP5623B
C3
220 nF
1
12
NCP5623B
1 mF/6.3 V
GND
C2
1.0 mF/10 V
Vbat
CHARGE PUMP
DC/DC CONVERTER
11
C1
10
Vout
Vbat
AGND
OVER VOLTAGE
6
DIGITAL CONTROL
Vbat
SDA
SCL
LED3
7
9
GND
Vbat
GND
R1
62 k
D3
8
LED2
4
PWM LED#1
ANALOG
FUNCTIONS
PWM LED#2
PWM LED#3
GND LED1
GND
CURRENT
MIRRORS GND
Figure 2. Simplified Block Diagram
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2
3
5
2
GND
D2
D1
GND
NCP5623B
PIN ASSIGNMENT
PIN
Name
Type
Description
1
C1P
POWER
One side of the external charge pump capacitor (CFLY ) is connected to this pin, associated with C1N,
pin 12 (Note 1).
2
GND
POWER
This pin is the GROUND signal for the analog and digital blocks and must be connected to the system
ground. This pin is the GROUND reference for the DC/DC converter and the output current control.
The pin must be connected to the system ground, a ground plane being strongly recommended.
3
LED3
INPUT,
POWER
This pin sinks to ground and monitors the current flowing into the LED3, intended to be used in illumination application (Note 2). The Anode of the associated LED shall be connected to the Vout pin.
4
LED2
INPUT,
POWER
This pin sinks to ground and monitors the current flowing into the LED2, intended to be used in illumination application (Note 2). The Anode of the associated LED shall be connected to the Vout pin.
5
LED1
INPUT,
POWER
This pin sinks to ground and monitors the current flowing into the LED1, intended to be used in illumination application (Note 2).
6
AGND
ANALOG
GROUND
7
SDA
INPUT,
DIGITAL
This pin carries the data provided by the I2C protocol. The content of the SDA byte is used to program the mode of operation and to set up the output current (Note 1).
8
IREF
INPUT,
ANALOG
This pin provides the reference current, based on the internal band−gap voltage reference, to control
the output current flowing in the LED. A 1% tolerance, or better, resistor shall be used to get the
highest accuracy of the LED biases. An external current mirror can be used to bias this pin to dynamically set up the I−LED peak current.
In no case shall the voltage at IREF pin be forced either higher or lower than the 600 mV provided by
the internal reference.
9
SCL
INPUT,
DIGITAL
This pin carries the I2C clock to control the Charge Pump converter and to set up the output current.
The SCL clock is associated with the SDA signal.
10
VOUT
OUTPUT,
POWER
This pin provides the output voltage supplied by the Charge Pump converter. The Vout pin must be
bypassed by 1 mF ceramic capacitor located as close as possible to the VOUT pin to properly bypass
the output voltage to ground. The circuit shall not operate without such bypass capacitor connected
across the Vout pin and Ground (Note 1).
The output voltage is internally clamped to 5.5 V maximum in the event of a no load situation. On the
other hand, the output current is limited to 40 mA (typical) in the event of a short circuit to ground.
11
VBAT
INPUT,
POWER
This pin is the input Battery voltage to supply the analog and digital blocks. The pin must be decoupled to ground by a 1mF or higher ceramic capacitor (Note 1).
12
C1N
POWER
One side of the external charge pump capacitor (CFLY ) is connected to this pin, associated with C1P,
pin 1 (Note 1)
This pin copies the Analog Ground and must be connected to the system ground plane.
1. Using low ESR ceramic capacitor, X5R type, is mandatory to optimize the Charge Pump efficiency and to reduce the EMI.
2. The peak current is 37 mA for each LED, the total charge pump output DC current being limited to 75 mA
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NCP5623B
MAXIMUM RATINGS
Symbol
Rating
Value
Unit
−0.3 < Vbat < 7.0
V
VBAT
Power Supply (see Figure 3)
Vout
Output Power Supply
7.0
V
SDA, SCL,
SHDI2C
Digital Input Voltage
Digital Input Current
−0.3 < V < VBAT
1
V
mA
Human Body Model: R = 1500 W, C = 100 pF (Note 3)
Machine Model
2
200
kV
V
LLGA12 package
Power Dissipation @ TA = +85°C (Note 4)
Thermal Resistance Junction to Case
Thermal Resistance Junction to Air
200
51
200
mW
°C/W
°C/W
ESD
PD
RqJC
RqJA
TA
Operating Ambient Temperature Range
−40 to +85
°C
TJ
Operating Junction Temperature Range
−40 to +125
°C
+150
°C
−65 to +150
°C
±100
mA
TJmax
Tstg
Maximum Junction Temperature
Storage Temperature Range
Latch−up current maximum rating per JEDEC standard: JESD78.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115
4. The maximum package power dissipation limit must not be exceeded.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
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NCP5623B
POWER SUPPLY SECTION:
(Typical values are referenced to TA = +25°C, Min & Max values are referenced −40°C to +85°C ambient temperature, unless otherwise
noted), operating conditions 2.85 V < Vbat < 5.5 V, unless otherwise noted.
Pin
Symbol
Rating
Min
11
Vbat
Power Supply
2.7
10
Iout
Continuous DC current in the load, PWM = 100%
@ Vf = 3.4 V, Vbat = 3.0 V
@ Vf = 3.4 V, 3.3 V < Vbat < 5.5 V
55
75
Typ
Max
Unit
5.5
V
mA
10
Isch
Continuous Output Short Circuit Current
2.85 V < Vbat < 4.2 V
45
10
Vout
Output Voltage Compliance (OVP)
10
Tstart
DC/DC Start time (Cout = 1 mF)
3.0 V < Vbat = nominal < 5.5 V
from last CNTL positive pulse delay to full load operation
150
10
Istdb
Stand By Current
3.0 V ≤ Vbat ≤ 4.2 V, Iout = 0 mA
0.8
10
Iop
Operating Current,
@Iout = 0 mA, 3.0 V ≤ Vbat ≤ 4.2 V
350
mA
3,4,5
ITOL
RGB Output Current Tolerance
@Vbat = 3.6 V, ILED = 10 mA
−25°C < Ta < 85°C
±3
%
3,4,5
IMATCH
RGB Output Current LED Matching
@Vbat = 3.6 V, ILED = 5.0 mA
±0.5
%
Fpwr
Charge Pump Operating Frequency
−40°C < Ta < 85°C
EPWR
Efficiency @ Vbat = 3.6 V
− LED1 to LED3 = 5 mA, Vf = 2.8 V (Total = 15 mA)
− LED1 to LED3 = 20 mA, Vf = 3.2 V (Total = 60 mA)
4.4
0.8
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5
1
90
mA
5.7
V
ms
1.0
1.2
mA
MHz
%
94.2
92.3
NCP5623B
ANALOG SECTION:
(Typical values are referenced to TA = +25°C, Min & Max values are referenced −40°C to +85°C ambient temperature, unless otherwise
noted), operating conditions 2.85 V < Vbat < 5.5 V, unless otherwise noted.
Pin
Symbol
8
IREF
Reference current @Vref = 600 mV (Note 7)
8
Rating
VREF
Reference Voltage (Note 7)
ILEDR
Reference Current (IREF) current ratio
8
Rbias
External Reference current Bias resistor (Note 6)
3,4,5
FPWM
Internal PWM Frequency (Note 8)
Min
Typ
Max
Unit
3
12.5
20
mA
600
+3%
mV
200
kW
−3%
2400
30
48
2.1
kHz
6. The overall output current tolerance depends upon the accuracy of the external resistor. Using 1% or better resistor is recommended.
7. The external circuit must not force the IREF pin voltage either higher or lower than the 600 mV specified. The system is optimized with a
12.5 mA reference current.
8. This parameter, derived from the 1 MHz clock, is guaranteed by design, not tested in production.
DIGITAL PARAMETERS SECTION:
(Typical values are referenced to TA = +25°C, Min & Max values are referenced −40°C to +85°C ambient temperature, unless otherwise
noted), operating conditions 2.85 V < Vbat < 5.5 V, unless otherwise noted.
Pin
Symbol
9
FSCL
Rating
Min
7,9
VIH
Positive going Input High Voltage Threshold,
SDA, SCL signals (Note 9)
7,9
VIL
Negative going Input High Voltage Threshold,
SDA, SCL signals (Note 9)
Typ
Max
Unit
400
kHz
1.6
VBAT
V
0
0.4
V
Input I2C clock frequency
NOTE: Digital inputs undershoot ≤ 0.30 V to ground, Digital inputs overshoot < 0.30 V to VBAT
9. Test guaranteed by design and fully characterized, not implemented in production.
10. The fall time − tf − for both SCL and SDA input signals must be 120 ns maximum.
The chip might be damaged or destroyed
when Vbat is above 7.0 V
Chip functionnal, but no parameter guaranteed
when Vbat is between 5.5 V & 7.0 V
7.0 V
Absolute Maximum Rating
5.5 V
Maximum Voltage Operation
4.2 V
NORMAL Li−IonOPERATION
3.0 V
2.7 V
2.0 V
Power On Reset
No operation during POR
Reserved for internal Reset
Figure 3. Understanding Integrated Circuit Voltage Limitations
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NCP5623B
DC/DC OPERATION
optimize the tolerance of the output current. Although it is
possible to use higher or lower value, as defined in the
analog section, a 48 kW / 1% resistor will provide the best
compromise, the dimming being performed by the
appropriate PWM registers.
On the other hand, care must be observed to avoid leakage
current flowing into either the IREF pin of the bias resistor
network.
Finally, for any desired ILED current, the curve provided
Figure 4 can be recalculated according to the equation:
The converter is based on a charge pump technique to
generate a DC voltage capable to supply the RGB LED load.
The system regulates the current flowing into each LED, not
the DC Vout value, by means of internal current mirrors
associated with the diodes.
Consequently, Vout = Vbat * Mode, with Mode = 1 or
Mode = 2, the extra voltage Vout − Vf being sustained by the
current mirror structure.
The average forward current of each LED can be
independently programmed (by means of the associated
PWM ) to achieve the RGB function. The maximum LED
current, setup by the external bias resistor connected across
IREF pin and Ground, is associated to the digital content of
the I2C register (see Table 1). This peak current applies to
the three LED simultaneously, but, thanks to the RGB
function, the average output current of each LED is
controlled by the independent PWM controllers.
Consequently, the luminosity of each RGB diode can be
independently adjusted to cope with a given illumination
need. Since the peak current is constant, the color of the
RGB diodes is the one defined by the specifications of each
individual LED.
The built−in OVP circuit continuously monitors the Vout
voltage and stops the converter when the voltage is above
5.7 V. The converter resumes to normal operation when the
voltage drops below 4.4 V (no latch−up mechanism).
Consequently, the chip can operate under no load conditions
during any test procedures.
ILED + IREF @ k
31 * n
ILED +
Vref
R
@ 2400
31 * n
(eq. 1)
(eq. 2)
with: n = step value @ 1 ≤ n ≤ 31
with: R = reference resistance
with: k = internal multiplier constant = 2400
Note: n = 0 forces ILED to zero
with: n = 30 and n = 31 yields the same LED current
LOAD CONNECTION
The primary function of the NCP5623B is to control three
LED arranged in the RGB color structure (reference
OSRAM LATB G66x). The brightness of each LED is
independently controlled by a set of dedicated PWM
structure embedded into the silicon chip. The peak current,
identical for each LED, is programmable by means of the
I2C data byte. With 32 steps per PWM, the chip provides
32768 colors hue in a standard display.
Moreover, a built−in gradual dimming provides a smooth
brightness transition for any current level, in both Upward
and Downward direction. The dimming function is
controlled by the I2C interface: see Table 2.
The NCP5623B chip is capable to drive the three LED
simultaneously, as depicted in Figure 1, but the load can be
arranged to accommodate several LED if necessary in the
application. Finally, the three current mirrors can be
connected in parallel to drive a single power full LED, thus
yielding 90 mA current capability in a single LED.
LOAD CURRENT CALCULATION
The load current is derived from the 600 mV reference
voltage provided by the internal Band Gap associated to the
external resistor connected across IREF pin and Ground.
Note : due to the internal structure of this pin, no voltage,
either downward or upward, shall be forced at the IREF pin.
The reference current is multiplied by the constant
k = 2400 to yield the output load current. Since the reference
voltage is based on a temperature compensated Band Gap,
a tight tolerance resistor will provide a very accurate load
current. The resistor is calculated from the Ohm’s law (Rbias
= Vref/IREF) and a more practical equation can be arranged
to define the resistor value for a given maximum output
current:
Rbias = (Vref*k)/Iout
[1]
Rbias = (0.6*2400)/Iout
[2]
Rbias = 1440/Iout
Since the Iref to ILED ratio is very high, it is strongly
recommended to set up the reference current at 12.5 mA to
I2C PROTOCOL
The NCP5623B is programmed by means of the standard
I2C protocol controlled by an external MCU. The
communication takes place with two serial bytes sharing the
same I2C frame:
− Byte#1 ³ physical I2C address
− Byte#2 ³ Selected internal registers & function
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NCP5623B
B6
B7
B5
B4
B3
B2
B1
B0
Byte#1 : I2C Physical Address, based 7 bits : % 011 1000 ³ $38 *
1
0
1
1
0
0
0
R/W
RLED0
BLED4
BLED3
BLED2
BLED1
BLED0
Byte#2 : DATA register
RLED1
RLED2
*Note: according to the I2C specifications, the physical address is based on 7 bits out of the SDA byte, the 8th bit representing the R/W command.
Since the NCP5623B is a receiver only, the R/W command is 0 and the hexadecimal byte send by the MCU is %0111 0000 = $70
B[7:5] : Internal Register Selection:
B7
B6
B5
Function
0
0
0
Chip Shut Down ³ all LED current = zero
0
0
1
Set up the maximum Output LED Current
0
1
0
PWM1 : LED1 control
0
1
1
PWM2 : LED2 control
1
0
0
PWM3 : LED3 control
1
0
1
Set the Upward Iend target
1
1
0
Set the Downward Iend target
1
1
1
Set the number of steps and activate the Gradual Dimming
The contain of bits B[4:0] depends upon the type of function selected by bits B[7:5] as depicted in Table 1
Table 1. Internal Register Bits Assigment
B7
B6
B5
B4
B3
B2
B1
B0
Comments
0
0
0
X
X
X
X
X
Shut down
0
0
1
16
8
4
2
1
Output LED Step, see Figure 4 (Note 11)
0
1
0
BPWM16
BPWM8
BPWM4
BPWM2
BPWM1
PWM1
0
1
1
BPWM16
BPWM8
BPWM4
BPWM2
BPWM1
PWM2
1
0
0
BPWM16
BPWM8
BPWM4
BPWM2
BPWM1
PWM3
1
0
1
GDIM5
16
GDIM4
8
GDIM3
4
GDIM2
2
GDIM1
1
Set Gradual Dimming
Upward Iend Target (Note 12)
1
1
0
GDIM5
16
GDIM4
8
GDIM3
4
GDIM2
2
GDIM1
1
Set Gradual Dimming
Downward Iend Target (Note 12)
1
1
1
GDIM5
128 ms
GDIM4
64 ms
GDIM3
32 ms
GDIM2
16 ms
GDIM1
8 ms
Gradual Dimming
Step Number & run
11. The programmed current applies to the three LED simultaneously, the gradual dimming is not engaged
12. The bit values represent the steps count, not the ILED current: see equations 1 & 2, page 7, to derive the ILED value.
GRADUAL DIMMING
3 – The Upward or Downward mode of operation
When a new gradual dimming sequence is requested, the
output current increases, according to an exponential curve,
from the existing start value to the end value. The end current
value is defined by the contain of the Upward or Downward
registers, the width of each step is defined by the third
register, the number of step being in the 1 to 30 range. In the
event of software error, the system checks that neither the
maximum output current (30 mA), nor the zero level are
forced out of their respective bounds. Similarly, software
errors shall not force the NCP5623B into an uncontrolled
mode of operation.
The purpose of that function is to gradually Increase or
Decrease the brightness of the backlight LED upon
command from the external MCU. The function is activated
and controlled by means of the I2C protocol.
In order to avoid arithmetic division functions at silicon
level, the period (either upward or downward) is equal to the
time defined for each step, multiplied by the number of
steps.
To operate such a function, the MCU will provide three
information:
1 – The target current level (either upward or downward)
2 – The time per step
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NCP5623B
The gradual dimming sequence must be set up before a
new output current data byte is send to the NCP5623B . At
this point, the brightness sequence takes place when the new
data byte is acknowledged by the internal I2C decoder. Since
the six registers are loaded on independent byte flow
associated to the I2C address, any parameter of the
NCP5623B chip can be updated ahead of the next function
as depicted in Table 2.
The dimming is built with 30 steps and the time delay
encoded into the second byte of the I2C transaction: see
Table 1.
When the gradual dimming is deactivated (B7 = B6 = 0,
B5 = 1), the output current is straightforwardly set up to the
level defined by the contain of the related register upon
acknowledge of the output current byte.
Table 2. Basic Programming Sequences
I2C Address
COMMAND Bits[7:0]
Operation
Note
$70
000X XXXX
System Shut Down
Bits[4:0] are irrelevant
$70
0010 0000
0011 1111
Set Up the ILED current
ILED register
Bits[4:0] contain the IMAX value as defined by the
Iref value
$70
0100 0000
0101 1111
Set Up the PWM1
PWM1
Bits[4:0] contain the PWM value
$70
0110 0000
0111 1111
Set Up the PWM2
PWM2
Bits[4:0] contain the PWM value
$70
1000 0000
1001 1111
Set Up the PWM3
PWM3
Bits[4:0] contain the PWM value
$70
1010 0000
1011 1111
Set Up the IEND Upward
UPWARD
Bits[4:0] contain the IEND value
$70
1100 0000
1101 1111
Set Up the IEND Downward
DWNWRD
Bits[4:0] contain the IEND value
$70
1110 0000
1111 1111
Set Up the Gradual Dimming time
and run the sequence
GRAD
Bits[4:0] contain the TIME value
timing was set at 16 ms, the total gradual dimming sequence
will be 160 ms.
To select the direction of the gradual dimming (either
Upward or Downward), one shall send the appropriate
register before to activate the sequence as depicted below:
1010 1111 ³ 1110 0011 ³ select an UPWARD sequence
with 24 ms/step, the end IPEAK current being (IREF *
2400) / (31 − 16) mA.
1100 0001 ³ 1110 0100 ³ select the DOWNWARD
sequence with 32 ms/step, the end IPEAK current being
(IREF * 2400) / (31 − 1) mA.
The number of step for a given sequence, depends upon
the start and end output current range: since the IPEAK
value is encoded in the Bits[4:0] binary scale, a maximum
of 31 steps is achievable during a gradual dimming
operation.
The number of steps will be automatically recalculated by
the chip according to the equation:
Nstep = | existing step position − new step position |
As an example, assuming the previously programmed
step was 5 and the new one is 15, then we will have 10 steps
to run between the actual location to the end value. If the
Table 3. Output Current Programmed Value (ILED = F(Step))
Step
ILED (mA)
Step
ILED (mA)
Step
ILED (mA)
Step
ILED (mA)
0 / $00
0
9 / $09
1.25
18 / $12
2.12
27 $1B
6.90
1 / $01
0.92
10 / $0A
1.31
19 / $13
2.30
28 / $1C
9.20
2 / $02
0.95
11 / $0B
1.38
20 / $14
2.50
29 / $1D
13.80
3 / $03
0.98
12 / $0C
1.45
21 / $15
2.76
30 / $1E
27.60
4 / $04
1.02
13 / $0D
1.53
22 / $16
3.06
31 / $1F
27.60
5 / $05
1.06
14 / $0E
1.62
23 / $17
3.45
6 / $06
1.10
15 / $0F
1.72
24 / $18
3.94
7 / $07
1.15
16 / $10
1.84
25 / $19
4.60
8 / $08
1.20
17 / $11
1.97
26 / $1A
5.52
NOTE:
The table assumes IREF = 11.5 mA
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NCP5623B
30
PWM OPERATION
The built−in PWM are fully independent and can be
programmed to any value during the normal operation of the
NCP5623B chip. The PWM operate with five bits, yielding
a 32 steps range to cover the full modulation (0 to 100%) of
the associated LED:
− PWM = $00 ³ the associated LED is fully OFF,
whatever be the programmed ILED value
− PWM > $00 but < $1F ³ the brightness of the
associated LED is set depending upon the PWM
modulation value
− PWM = $1F ³ the associated LED is fully ON, the
current being the one defined by the ILED value.
Each PWM is programmable, via the I2C port as depicted,
at any time under any sequence arrangement as requested by
the end system’s designer. The PWM does not change the
ILED value, but merely modulate the ON/OFF ratio of the
associated LED. Each step of the PWM represent 100/32 =
3.125% of the full range, the clock being 2.1 kHz (typical).
25
ILED (mA)
20
15
10
5
0
0
5
10
15
20
30
25
35
Step
Figure 4. Output Current Programmed
Value ( ILED = F(Step) )
EFFICIENCY (@ 25 mA/LED) (%)
100
90
Vf = 2.85 V
Vf = 3.8 V
80
70
60
50
40
2.5
3.0
3.5
4.0
4.5
VBAT (V)
Figure 5. NCP5623B Typical Efficiency as a Function of the Vf
NOTE:
Efficiency is measured with the three PWM equal to 100%
C3
+Vbat
+Vcc
1 mF/6.3 V
GND
1
C1P
C1
11
MCU
I2C Port
SDA
7
SCL
9
6
GND
GND
GND
R1
62 k
C2
220 nF
8
Vbat
12
C1N 10
Vout
LED3
SDA
LED2
SCL
AGND
IREF
LED1
GND
NCP5623B
U1
1 mF/10 V
3
D3
4
D2
5
D1
2
GND
Figure 6. Basic RGB Application
http://onsemi.com
10
GND
NCP5623B
PACKAGE DIMENSIONS
LLGA12
CASE 513AA−01
ISSUE O
D
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
2X
0.10 C
2X
E
DIM
A
A1
b
D
D2
E
E2
e
K
L
L1
TOP VIEW
0.10 C
0.10 C
MILLIMETERS
MIN
MAX
0.50
0.60
0.00
0.05
0.15
0.25
2.00 BSC
0.80
1.00
2.00 BSC
0.55
0.65
0.40 BSC
0.25
−−−
0.30
0.50
0.40
0.60
A
12X
0.08 C
SEATING
PLANE
SIDE VIEW
A1
C
D2
L1
6
2
11X
e
SOLDERING FOOTPRINT*
9X
0.66
L
2.30
12X
0.23
1
K
0.40
PITCH
1
E2
e/2
2.06
12
0.93
11
7
12X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
11X
0.56
0.91
0.63
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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NCP5623B/D