Freescale Semiconductor Technical Data MPX5500 Rev 6, 05/2005 MPX5500 SERIES Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated INTEGRATED PRESSURE SENSOR 0 to 500 kPa (0 to 72.5 psi) 0.2 to 4.7 V Output The MPX5500 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • • • • • 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element Available in Differential and Gauge Configurations MPX5500D CASE 867-08 ORDERING INFORMATION Device Type Case Type Options Basic Element Differential 867 Ported Elements Differential Dual Ports MPX Series Order Number Device Marking MPX5500D MPX5500D 867C MPX5500DP MPX5500DP VS MPX5500DP CASE 867C-05 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 4, 5, and 6 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic © Freescale Semiconductor, Inc., 2005. All rights reserved. PIN NUMBERS(1) 1 Vout 4 N/C 2 GND 5 N/C 3 VS 6 N/C 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Table 1. Maximum Ratings(1) Rating Symbol Value Unit P1max 2000 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C (2) Maximum Pressure (P2 ≤ 1 Atmosphere) 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4. required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 0 — 500 kPa Supply Voltage VS 4.75 5.0 5.25 Vdc Supply Current IO — 7.0 10 mAdc (0 to 85°C) Voff 0.088 0.20 0.313 Vdc Full Scale Output (0 to 85°C) VFSO 4.587 4.70 4.813 Vdc Span(5) (0 to 85°C) VFSS — 4.50 — Vdc (0 to 85°C) — — — ±2.5 %VFSS V/P — 9.0 —- mV/kPa tR — 1.0 —- ms IO+ — 0.1 —- mAdc — — 20 —- ms Pressure Range(1) (2) Zero Pressure Offset(3) (4) Full Scale Accuracy(6) Sensitivity Response Time (7) Output Source Current at Full Scale Output Warm-Up Time(8) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. Table 3. Mechanical Characteristics Characteristics Weight, Basic Element (Case 867) Typ Unit 4.0 grams MPX5500 2 Sensors Freescale Semiconductor Figure 3 illustrates the Differential/Gauge basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (For use of the MPX5500D in a high pressure, cyclic application, consult the factory.) The MPX5500 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. 5.0 Transfer Function: Vout = VS*(0.0018*P+0.04) ± Error VS = 5.0 Vdc Temperature = 0 to 85°C 4.5 4.0 3.5 Output (V) Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. TYPICAL 3.0 2.5 MAX 2.0 MIN 1.5 1.0 0.5 0 0 50 100 150 200 250 300 350 400 Differential Pressure (kPa) 450 500 550 Figure 2. Output versus Pressure Differential Fluoro Silicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Lead Frame RTV Die Bond P2 Epoxy Case Figure 3. Cross-Sectional Diagrams (not to scale) +5 V Vout Output Vs IPS 1.0 µF 0.01 µF GND 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5500 Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number MPX5500D MPX5500DP Case Type 867 867C Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking MPX5500 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. STYLE 2: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N BASIC ELEMENT P 0.25 (0.010) M T Q -A- M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N -Q- PORT #2 VACUUM (P2) B PIN 1 1 C SEATING PLANE -T- -TJ 2 3 4 5 K 6 S SEATING PLANE G F D 6 PL 0.13 (0.005) M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP) MPX5500 Sensors Freescale Semiconductor 5 NOTES MPX5500 6 Sensors Freescale Semiconductor NOTES MPX5500 Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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