Renesas HFA1110IBZ 750mhz, low distortion unity gain, closed loop buffer Datasheet

DATASHEET
DESIGNS
DED FOR NEW
NOT RECOMMEN
PART
REPLACEMENT
RECOMMENDED
HFA1112
HFA1110
FN2944
Rev 8.00
June 6, 2006
750MHz, Low Distortion Unity Gain, Closed Loop Buffer
The HFA1110 is a unity gain closed loop buffer that achieves
-3dB bandwidth of 750MHz, while offering excellent video
performance and low distortion. Manufactured on Intersil’s
proprietary complementary bipolar UHF-1 process, the
HFA1110 also offers very fast slew rate, and high output
current. It is one more example of Intersil’s intent to enhance
its leadership position in products for high speed signal
processing applications.
The HFA1110’s settling time of 11ns to 0.1%, low distortion
and ability to drive capacitive loads make it an ideal flash
A/D driver.
The HFA1110 is an enhanced, pin compatible upgrade for
the AD9620, AD9630, CLC110, EL2072, BUF600 and
BUF601.
Features
• Wide -3dB Bandwidth. . . . . . . . . . . . . . . . . . . . . . 750MHz
• Very Fast Slew Rate. . . . . . . . . . . . . . . . . . . . . . 1300V/s
• Fast Settling Time (0.2%). . . . . . . . . . . . . . . . . . . . . . 7ns
• High Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 60mA
• Fixed Gain of +1
• Gain Flatness (100MHz) . . . . . . . . . . . . . . . . . . . . 0.03dB
• Differential Phase . . . . . . . . . . . . . . . . . . . . . . . . . . 0.025°
• Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.04%
• 3rd Harmonic Distortion (50MHz). . . . . . . . . . . . . . -80dBc
• 3rd Order Intercept (100MHz) . . . . . . . . . . . . . . . . 30dBm
For buffer applications requiring a standard op amp pinout,
or selectable gain (-1, +1, +2), see the HFA1112 data sheet.
For output limiting see the HFA1113 data sheet.
• Pb-Free Plus Anneal Available (RoHS Compliant)
For military grade product please refer to the HFA1110/883
data sheet.
• Video Switching and Routing
Pinout
• Driving Flash A/D Converters
HFA1110
(SOIC)
TOP VIEW
V+
1
OPT V+
2
NC
IN
• Impedance Transformation
OUT
7
NC
3
6
OPT V-
4
5
V-
Pin Descriptions
NAME
PIN
NUMBER
V+
1
Positive Supply
Opt V+
2
Optional Positive Supply
NC
3
No Connection
IN
4
Input
V-
5
Negative Supply
Opt V-
6
Optional Negative Supply
NC
7
No Connection
OUT
8
Output
FN2944 Rev 8.00
June 6, 2006
• RF/IF Processors
• High-Speed Communications
8
- +
Applications
DESCRIPTION
• Line Driving
• Radar Systems
Ordering Information
PART
NUMBER
PART
TEMP.
MARKING RANGE (°C) PACKAGE
PKG.
DWG. #
HFA1110IB
1110IB
-40 to 85
8 Ld SOIC
M8.15
HFA1110IBZ
(Note)
1110IBZ
-40 to 85
8 Ld SOIC
(Pb-free)
M8.15
HFA1110EVAL High Speed Buffer DIP Evaluation Board
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
Page 1 of 9
HFA1110
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSUPPLY
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60mA
Thermal Resistance (Typical, Note 1)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
JA (°C/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
158
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VSUPPLY = 5V, RL = 100, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP (°C)
MIN
TYP
MAX
UNITS
25
-
8
25
mV
Full
-
-
35
mV
INPUT CHARACTERISTICS
Output Offset Voltage (Note 2)
Output Offset Voltage Drift
Full
-
10
-
V/°C
PSRR
25
39
45
-
dB
Full
35
-
-
dB
25
-
14
-
nV/Hz
Input Noise Voltage (Note 2)
100kHz
Input Noise Current (Note 2)
100kHz
Input Bias Current (Note 2)
25
-
51
-
pA/Hz
25
-
10
40
A
Full
-
-
65
A
Input Resistance
25
25
50
-
k
Input Capacitance
25
-
2
-
pF
TRANSFER CHARACTERISTICS
Gain
DC Non-Linearity (Note 2)
VOUT = 2VP-P
2V Full Scale
25
0.980
0.990
1.02
V/V
Full
0.975
-
1.025
V/V
25
-
0.003
-
%
25
3.0
3.3
-
V
Full
2.5
3.0
-
V
OUTPUT CHARACTERISTICS
Output Voltage (Note 2)
Output Current (Note 2)
RL = 50
25, 85
50
60
-
mA
-40
35
50
-
mA
Full
4.5
-
5.5
V
POWER SUPPLY CHARACTERISTICS
Supply Voltage Range
Supply Current (Note 2)
25
-
21
26
mA
Full
-
-
33
mA
VOUT = 0.2VP-P
25
-
750
-
MHz
Slew Rate
VOUT = 5VP-P
25
-
1300
-
V/s
Full Power Bandwidth (Note 2)
VOUT = 4VP-P
25
-
150
-
MHz
AC CHARACTERISTICS
-3dB Bandwidth (Note 2)
Gain Flatness (Note 2)
To 100MHz
25
-
0.03
-
dB
To 30MHz
25
-
0.01
-
dB
Linear Phase Deviation (Note 2)
DC to 100MHz
25
-
0.3
-
°
2nd Harmonic Distortion (Note 2)
50MHz, VOUT = 2VP-P
25
-
-60
-
dBc
3rd Harmonic Distortion (Note 2)
50MHz, VOUT = 2VP-P
25
-
-80
-
dBc
3rd Order Intercept (Note 2)
100MHz
25
-
30
-
dBm
FN2944 Rev 8.00
June 6, 2006
Page 2 of 9
HFA1110
Electrical Specifications
VSUPPLY = 5V, RL = 100, Unless Otherwise Specified (Continued)
TEMP (°C)
MIN
TYP
MAX
UNITS
-1dB Gain Compression
PARAMETER
100MHz
TEST CONDITIONS
25
-
14
-
dBm
Reverse Gain (S12, Note 2)
100MHz, VOUT = 1VP-P
25
-
-60
-
dB
TRANSIENT RESPONSE
Rise Time
VOUT = 0.5V Step
25
-
0.5
-
ns
Overshoot (Note 2)
VOUT = 1.0V Step, Input Signal
Rise/Fall = 1ns
25
-
2.5
-
%
0.2% Settling Time (Note 2)
VOUT = 1V to 0V
25
-
7
-
ns
0.1% Settling Time (Note 2)
VOUT = 1V to 0V
Overdrive Recovery Time
25
-
11
-
ns
25
-
15
-
ns
Differential Gain
3.58MHz, RL = 75
25
-
0.04
-
%
Differential Phase
3.58MHz, RL = 75
25
-
0.025
-
°
NOTE:
2. See Typical Performance Curves for more information.
Application Information
PC Board Layout
The frequency performance of this amplifier depends a great
deal on the amount of care taken in designing the PC board.
The use of low inductance components such as chip
resistors and chip capacitors is strongly recommended,
while a solid ground plane is a must!
Attention should be given to decoupling the power supplies.
A large value (10F) tantalum in parallel with a small value
chip (0.1F) capacitor works well in most cases.
50
1
+5V
0.1F
10F
2
3
IN
8
OUT
RS
7
HFA1110
4
6
-5V
5
10F
50
0.1F
SCHEMATIC DIAGRAM
BOTTOM LAYOUT
Terminated microstrip signal lines are recommended at the
input and output of the device. Output capacitance, such as
that resulting from an improperly terminated transmission
line will degrade the frequency response of the amplifier and
may cause oscillations. In most cases, the oscillation can be
avoided by placing a resistor (RS) in series with the output.
See the “Recommended RS vs Load Capacitance” graph for
specific recommendations.
An example of a good high frequency layout is the
Evaluation Board shown below.
Evaluation Board
An evaluation board is available for the HFA1110 (part
number HFA1110EVAL). Please contact your local sales
office for information.
TOP LAYOUT
The layout and schematic of the board are shown here:
NOTE: The SOIC version may be evaluated in the DIP board by
using a SOIC-to-DIP adapter such as Aries Electronics Part Number
08-350000-10.
FN2944 Rev 8.00
June 6, 2006
1
Page 3 of 9
HFA1110
Typical Performance Curves
VSUPPLY = 5V, TA = 25°C, RL = 100Unless Otherwise Specified
1.2
80
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (mV)
120
40
0
-40
-80
-120
0.8
0.4
0
-0.4
-0.8
-1.2
TIME (5ns/DIV)
TIME (5ns/DIV)
FIGURE 1. SMALL SIGNAL PULSE RESPONSE
FIGURE 2. LARGE SIGNAL PULSE RESPONSE
2
-45
-2
-90
-3
-135
-4
-180
PHASE
VOUT = 200mVP-P
-5
-6
RL = 100
3
0
RL = 50
-3
-6
0
-225
-90
-270
-180
-7
-8
0
200M
400M
600M
800M
1M
1G
-360
1G
100M
FREQUENCY (Hz)
FIGURE 3. FREQUENCY RESPONSE
FIGURE 4. FREQUENCY RESPONSE FOR VARIOUS LOAD
RESISTORS
890
1
870
BANDWIDTH (MHz)
0
-1
-2
VOUT = 200mVP-P
VOUT = 2.5VP-P
VOUT = 4VP-P
-3
-4
-5
850
830
810
790
770
750
-6
730
-7
710
-8
10M
FREQUENCY (Hz)
2
GAIN (dB)
-270
RL = 1k
PHASE (°)
0
-1
GAIN (dB)
GAIN (dB)
0
RL = 1k
6
PHASE (°)
GAIN
VOUT = 200mVP-P
VOUT = 1VP-P
1
1M
10M
100M
FREQUENCY (Hz)
1G
FIGURE 5. FREQUENCY RESPONSE FOR VARIOUS OUTPUT
VOLTAGES
FN2944 Rev 8.00
June 6, 2006
-50
-30
-10
10
30
50
70
90
110
130
TEMPERATURE (°C)
FIGURE 6. -3dB BANDWIDTH vs TEMPERATURE
Page 4 of 9
HFA1110
VSUPPLY = 5V, TA = 25°C, RL = 100Unless Otherwise Specified (Continued)
0.25
2.0
0.20
1.5
0.15
1.0
DEVIATION (°)
GAIN (dB)
Typical Performance Curves
0.10
0.05
0
0.5
0
-0.5
-1.0
-0.05
-1.5
-0.10
-2.0
1M
10M
FREQUENCY (Hz)
0
100M 200M
15M 30M 45M 60M 75M 90M 105M 120M 135M 150M
FREQUENCY (Hz)
FIGURE 7. GAIN FLATNESS
FIGURE 8. DEVIATION FROM LINEAR PHASE
-30
+90
PHASE
GAIN
-40
+45
0
-50
-60
INTERCEPT POINT (dBm)
+135
PHASE (°)
GAIN (dB)
50
-20
40
30
20
10
VOUT = 1VP-P
0
200M
400M
600M
800M
0
1G
0
50M
100M
150M
200M
250M
400M
FIGURE 9. REVERSE GAIN AND PHASE (S12)
FIGURE 10. TWO-TONE, THIRD ORDER INTERMODULATION
INTERCEPT
-30
-40
-40
100MHz
-50
DISTORTION (dBc)
DISTORTION (dBc)
350M
FREQUENCY (Hz)
-30
50MHz
-60
-70
30MHz
-80
100MHz
-50
-60
-70
50MHz
-80
30MHz
-90
-90
-100
300M
FREQUENCY (Hz)
-100
-5
-3
-1
1
3
5
7
9
11
OUTPUT POWER (dBm)
FIGURE 11. SECOND HARMONIC DISTORTION vs POUT
FN2944 Rev 8.00
June 6, 2006
13
-5
-3
-1
1
3
5
7
9
11
OUTPUT POWER (dBm)
FIGURE 12. THIRD HARMONIC DISTORTION vs POUT
Page 5 of 9
13
HFA1110
Typical Performance Curves
VSUPPLY = 5V, TA = 25°C, RL = 100Unless Otherwise Specified (Continued)
0.8
0.4
0.2
0
-0.2
-0.4
RS ()
SETTLING ERROR (%)
VOUT = 1V
-0.8
-5
0
5
10
15
20
25
30
35
40
50
45
40
35
30
25
20
15
10
5
0
0
40
80
120
45
200
240
280
320
360
CL (pF)
TIME (ns)
FIGURE 13. SETTLING RESPONSE
160
FIGURE 14. RECOMMENDED SERIES OUTPUT RESISTOR vs
CLOAD
0.04
21
RL = 200
0.02
15
RL = 100
12
VO = 2.0VP-P
VO = 1.0VP-P
9
RL = 1k
ERROR (%)
OVERSHOOT (%)
18
6
0
-0.02
VO = 0.5VP-P
3
0
200
300
400
500
600
700
800
900
-0.04
1000
-3.0
-2.0
-1.0
0
1.0
INPUT VOLTAGE (V)
INPUT RISE TIME (ps)
3.0
FIGURE 16. INTEGRAL LINEARITY ERROR
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
25
24
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
FIGURE 15. OVERSHOOT vs INPUT RISETIME
2.0
23
22
21
20
19
18
17
5
6
7
8
9
TOTAL SUPPLY VOLTAGE (V+ - V-, V)
FIGURE 17. SUPPLY CURRENT vs SUPPLY VOLTAGE
FN2944 Rev 8.00
June 6, 2006
10
-60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 18. SUPPLY CURRENT vs TEMPERATURE
Page 6 of 9
HFA1110
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
-60
VSUPPLY = 5V, TA = 25°C, RL = 100Unless Otherwise Specified (Continued)
10
OUTPUT OFFSET VOLTAGE (mV)
BIAS CURRENT (A)
Typical Performance Curves
-40
-20
0
20
40
60
80
100
9.8
9.6
9.4
9.2
9
8.8
8.6
8.4
8.2
8
7.8
-60
120
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 19. BIAS CURRENT vs TEMPERATURE
FIGURE 20. OFFSET VOLTAGE vs TEMPERATURE
3.8
100
200
80
160
60
120
3.5
+VOUT (RL = 100)
3.4
3.3
+VOUT (RL = 50)
|-VOUT |(RL = 100)
3.2
3.1
|-VOUT |(RL = 50)
3
40
80
INI
20
40
2.9
2.8
-60
ENI
-40
-20
0
20
40
60
80
100
TEMPERATURE (°C)
FIGURE 21. OUTPUT VOLTAGE vs TEMPERATURE
FN2944 Rev 8.00
June 6, 2006
120
0
100
1k
10k
0
100k
FREQUENCY (Hz)
FIGURE 22. INPUT NOISE vs FREQUENCY
Page 7 of 9
NOISE CURRENT (pA/Hz)
3.6
NOISE VOLTAGE (nV/Hz)
OUTPUT VOLTAGE (V)
3.7
HFA1110
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
63 mils x 44 mils x 19 mils
1600m x 1130m x 483m
Type: Nitride
Thickness: 4kÅ 0.5kÅ
METALLIZATION:
TRANSISTOR COUNT:
Type: Metal 1: AlCu(2%)/TiW
Thickness: Metal 1: 8kÅ 0.4kÅ
Type: Metal 2: AlCu(2%)
Thickness: Metal 2: 16kÅ 0.8kÅ
52
SUBSTRATE POTENTIAL (POWERED UP):
Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1110
NC
IN
V-
NC
NC
NC
NC
V+
OUT
FN2944 Rev 8.00
June 6, 2006
Page 8 of 9
HFA1110
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
SYMBOL
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e

B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N

NOTES:
MILLIMETERS
8
0°
8
8°
0°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
7
8°
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
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Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
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FN2944 Rev 8.00
June 6, 2006
Page 9 of 9
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