3.3 VOLT TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE
MATCHING 16,384 X 16,384 CHANNELS
FEATURES:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Up to 64 serial input and output streams
Maximum 16,384 x 16,384 channel non-blocking switching
Accepts data streams at 2.048Mb/s, 4.096Mb/s, 8.192Mb/s,
16.384Mb/s or 32.768Mb/s
Rate matching capability: rate selectable on both RX and TX
in eight groups of 8 streams
Optional Output Enable Indication Pins for external driver
High-Z control
Per-channel Variable Delay Mode for low-latency applications
Per-channel Constant Delay Mode for frame integrity applications
Enhanced Block programming capabilities
TX/RX Internal Bypass
Automatic identification of ST-BUS and GCI serial streams
Per-stream frame delay offset programming
Per-channel High-Impedance output control
Per-channel processor mode to allow microprocessor writes to TX
streams
Bit Error Rate Testing (BERT) for testing
Direct microprocessor access to all internal memories
•
•
•
IDT72V73263
Selectable Synchronous and Asynchronous Microprocessor
bus timing modes
IEEE-1149.1 (JTAG) Test Port
Available in 208-pin (17mm x 17mm) Plastic Ball Grid Array (PBGA)
Operating Temperature Range -40°°C to +85°°C
DESCRIPTION:
The IDT72V73263 has a non-blocking switch capacity of 16,384 x 16,384
channels at 32.768Mb/s. With 64 inputs and 64 outputs, programmable per
stream control, and a variety of operating modes the IDT72V73263 is
designed for the TDM time slot interchange function in either voice or data
applications.
Some of the main features of the IDT72V73263 are LOW power 3.3 Volt
operation, automatic ST-BUS® /GCI sensing, memory block programming,
simple microprocessor interface , JTAG Test Access Port (TAP) and per
stream programmable input offset delay, variable or constant throughput
modes, output enable and processor mode, BER testing, bypass mode, and
advanced block programming.
FUNCTIONAL BLOCK DIAGRAM
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The ST-BUS is a trademark of Mitel Corp.
September 2007
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice
DSC-6160/4
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
PIN CONFIGURATIONS
A1 BALL PAD CORNER
A
C32i
R ESET
ODE
RX1
RX4
TX0
TX4
TX7
TX12/
OEI4
TX15/
OEI7
RX11
RX15
RX20
TX16
TX18
TX19
F32i
Vcc
RX0
RX2
RX5
TX1
TX5
TX8/
OEI0
TX11/
OEI3
TX14/
OEI6
RX10
RX14
RX19
RX23
TX17
TX20
S/A (1)
TMS
TDI
RX3
RX6
TX2
TX6
TX9/
OEI1
TX10/
OEI2
TX13/
OEI5
RX9
RX13
RX18
RX22
TX22
TX21
TDO
TCK
TR ST
DS
RX7
TX3
VCC
VCC
VCC
VCC
RX8
RX12
RX17
RX21
TX24/
OEI16
TX23
CS
R/W
A0
A1
RX16
TX27/
OEI19
TX26/
OEI18
TX25/
OEI17
A2
A3
A4
A5
TX31/
OEI23
TX30/
OEI22
TX29/
OEI21
TX28/
OEI20
A6
A7
A8
VCC
GND
GND
GND
GND
VCC
RX26
RX25
RX24
A9
A10
A11
VCC
GND
GND
GND
GND
VCC
RX29
RX28
RX27
A14
A13
A12
VCC
GND
GND
GND
GND
VCC
RX30
RX31
RX32
D15
D TA/
BEH
A15
VCC
GND
GND
GND
GND
VCC
RX33
RX34
RX35
D12
D13
D14
BEL
RX36
RX37
RX38
RX39
D8
D9
D10
D11
TX32
TX33
TX34
TX35
D5
D6
D7
RX56
TX60/
OEI52
TX56/
OEI48
VCC
VCC
VCC
VCC
RX51
RX47
TX36
TX37
TX38
TX39
D3
D4
RX60
RX57
TX61/
OEI53
TX57/
OEI49
TX53
TX50
TX49
RX54
RX50
RX46
RX43
TX40/
OEI32
TX41/
OE33
TX42/
OEI34
D2
RX63
RX61
RX58
TX62/
OEI54
TX58/
OEI50
TX54
TX51
TX48
RX53
RX49
RX45
RX42
RX40
TX46/
OEI38
TX43/
OEI35
D1
D0
RX62
RX59
TX63/
OEI55
TX59/
OEI51
TX55
TX52
RX55
RX52
RX48
RX44
RX41
TX47/
OEI39
TX45/
OEI37
TX44/
OEI36
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
16
6160 drw03
NOTE:
1. S/A should be tied directly to VCC or GND for proper
operation.
PBGA: 1mm pitch, 17mm x 17mm (BB208-1 order code: BB)
TOP VIEW
2
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
PIN DESCRIPTION
SYMBOL
NAME
A0-A15
Address 0-15
BEL
I/O
PBGA
PIN NO.
DESCRIPTION
I
*See PBGA
Table Below
These address lines access all internal memories.
Byte Enable LOW
I
L4
In synchronous mode, this input will enable the lower byte (D0-7) on to the data bus.
C32i
Clock
I
A1
Serial clock for shifting data in/out on the serial data streams. This input accepts a
32.768MHz clock.
CS
Chip Select
I
E1
Active LOW input used by a microprocessor to activate the microprocessor port of the
device.
D0-15
Data Bus 0-15
I/O
*See PBGA
Table Below
DS
Data Strobe
I
D4
DTA/BEH
F32i
Data Transfer
Acknowledgment
Active LOW Output
Frame Pulse
I/O
K2
I
GND
B1
*See PBGA
Table Below
These pins are the data bus of the microprocessor port.
This active LOW input works in conjunction with CS to enable the read and write
operations. This active LOW input sets the data bus lines (D0-D15).
In asynchronous mode this pin indicates that a data bus transfer is complete. When the
bus cycle ends,this pin drives HIGH and then High-Z allowing for faster bus cycles
with a weaker pull-up resistor. A pull-up resistor is required to hold a HIGH level
when the pin is High-Z. When the device is in /Byte Enable HIGH synchronous
bus mode, this pin acts as an input and will enable the upper byte (D8-15) on to the
data bus.
This input accepts and automatically identifies frame synchronization signals formatted
according to ST-BUS and GCI specifications.
Ground.
ODE
Output Drive Enable
I
A3
This is the output enable control for the TX serial outputs. When ODE input is LOW and
the OSB bit of the CR register is LOW, all TX outputs are in a High-Impedance state. If
this input is HIGH, the TX output drivers are enabled. However, each channel may
still be put into a High-Impedance state by using the per channel control bits in the
Connection Memory HIGH.
RX0-63
RX Input 0 to 63
I
*See PBGA
Table Below
RESET
Device Reset:
I
A2
This input (active LOW) puts the device in its reset state that clears the device internal
counters, registers and brings TX0-63 and microport data outputs to a High-Impedance
state. The RESET pin must be held LOW for a minimum of 20ns to reset the device.
R/W
Read/Write
I
E2
This input controls the direction of the data bus lines (D0-D15) during a microprocessor
access.
S/A
Synchronous/
Asynchronous
Bus Mode
I
C1
This input will select between asynchronous microprocessor bus timing and synchronous
microprocessor bus timing. In synchronous mode, DTA/BEH acts as the BEH input and is
used in conjunction with BEL to output data on the data bus. In asynchronous bus mode,
BEL is tied LOW and DTA/BEH acts as the DTA, data bus acknowledgment output.
TCK
Test Clock
I
D2
Provides the clock to the JTAG test logic.
TDI
Test Serial Data In
I
C3
JTAG serial test instructions and data are shifted in on this pin. This pin is pulled HIGH
by an internal pull-up when not driven.
TDO
Test Serial Data Out
O
D1
JTAG serial data is output on this pin on the falling edge of TCK. This pin is held in
High-Impedance state when JTAG scan is not enabled.
TMS
Test Mode Select
I
C2
JTAG signal that controls the state transitions of the TAP controller. This pin is pulled
HIGH by an internal pull-up when not driven.
TRST
Test Reset
I
D3
Asynchronously initializes the JTAG TAP controller by putting it in the Test-LogicReset state. This pin is pulled by an internal pull-up when not driven. This pin should
be pulsed LOW on power-up, or held LOW, to ensure that the device is in the normal
functional mode.
Serial data Input Stream. These streams may have data rates of 2.048Mb/s,
4.096Mb/s, 8.192Mb/s, 16.384Mb/s, or 32.768Mb/s depending upon the selection in Receive
Data Rate Selection Register (RDRSR).
3
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
PIN DESCRIPTION (CONTINUED)
SYMBOL
NAME
I/O
PBGA
PIN NO.
TX0-7
TX16-23
TX32-39
TX48-55
TX Output
O
*See PBGA
Table Below
Serial data Output Stream. These streams may have data rates of 2.048Mb/s,
4.096Mb/s, 8.192Mb/s,16.384Mb/s, or 32.768Mb/s depending upon the selection in
Transmit Data Rate Selection Register (TDRSR). If G0/G2/G4/G6 are programmed to
32.768Mb/s mode the corresponding odd group is unavailable (G1/G3/G5G7).
O
*See PBGA
Table Below
When output streams are selected via TDRSR, these pins are the TX output streams.
When output enable indication function is selected, these pins reflect the active or HighImpedance status for the corresponding TX output stream.
*See PBGA
Table Below
+3.3 Volt Power Supply.
TX8-15/OEI0-7
TX Output /Output
TX24-31/OEI16-23 Enable Indication
TX40-47/OEI32-39
TX56-63/OEI48-55
VCC
DESCRIPTION
PBGA PIN NUMBER TABLE
SYMBOL
NAME
I/O
A0-A15
Address A0-15
I
E3, E4, F1, F2, F3, F4, G1, G2, G3, H1, H2, H3, J3, J2, J1, K3.
D0-D15
Data Bus 0-15
I/O
T2, T1, R1, P1, P2, N1, N2, N3, M1, M2, M3, M4, L1, L2, L3, K1.
GND
Ground
RX0-63
RX Input 0 to 63
I
B3, A4, B4, C4, A5, B5, C5, D5, D11, C11, B11, A11, D12, C12, B12, A12, E13, D13, C13, B13, A13, D14, C14 , B14,
G16, G15, G14, H16, H15, H14, J14, J15, J16, K14, K15, K16, L13, L14, L15, L16, R14, T13, R13, P13, T12, R12, P12,
N12, T11, R11, P11, N11, T10, R10, P10, T9, N4, P4, R4, T4, P3, R3, T3, R2.
TX0-TX7
TX16-23
TX32-39
TX48-55
TX Output
O
A6, B6, C6, D6, A7, B7, C7, A8
A14, B15, A15, A16, B16, C16, C15, D16
M13, M14, M15, M16, N13, N14, N15, N16
R9, P9, P8, R8. T8, P7, R7, T7
O
B8, C8, C9, B9, A9, C10, B10, A10.
D15, E16, E15, E14, F16, F15, F14, F13.
P14, P15, P16, R16, T16, T15, R15, T14.
N6, P6, R6, T6, N5, P5, R5, T5.
TX8-15/OEI0-7
TX Output/Output
TX24-31/OEI16-23
TX40-47/OEI32-39
TX56-63/OEI48-55
Vcc
PIN NUMBER
G7, G8, G9, G10, H7, H8, H9, H10, J7, J8, J9, J10,K7, K8, K9, K10,
B2, D7, D8, D9, D10, G4, G13, H4, H13, J4, J13, K4, K13, N7, N8, N9, N10.
4
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
DESCRIPTION (CONTINUED):
INDUSTRIAL TEMPERATURE RANGE
MOD2-0 bits are set to 0-0-1 accordingly, that particular channel will be in
Constant Delay Mode. Finally, if the MOD2-0 bits are set to 0-0-0, that particular
channel will be in Variable Delay Mode.
The IDT72V73263 is capable of switching up to 16,384 x 16,384 channels
without blocking. Designed to switch 64 Kbit/s PCM or N x 64 Kbit/s data, the
device maintains frame integrity in data applications and minimizes throughput
delay for voice applications on a per-channel basis.
The 64 serial input streams (RX) of the IDT72V73263 can be run at
2.048Mb/s, 4.096Mb/s, 8.192Mb/s, 16.384Mb/s or 32.768Mb/s allowing 32,
64, 128, 256 or 512 channels per 125µs frame. The data rates on the output
streams can independently be programmed to run at any of these data rates.
With two main operating modes, Processor Mode and Connection Mode, the
IDT72V73263 can easily switch data from incoming serial streams (Data
Memory) or from the controlling microprocessor via Connection Memory.
As control and status information is critical in data transmission, the Processor
Mode is especially useful when there are multiple devices sharing the input and
output streams.
With data coming from multiple sources and through different paths, data
entering the device is often delayed. To handle this problem, the IDT72V73263
has a Frame Offset feature to allow individual streams to be offset from the frame
pulse in half clock-cycle intervals up to +7.5 clock cycles.
The IDT72V73263 also provides a JTAG test access port, memory block
programming, Group Block Programming, RX/TX internal bypass, a simple
microprocessor interface and automatic ST-BUS /GCI sensing to shorten
setup time, aid in debugging and ease use of the device without sacrificing
capabilities.
SERIAL DATA INTERFACE TIMING
The master clock frequency of the IDT72V73263 is 32.768MHz, C32i. For
32.768Mb/s data rates, this results in a single-bit per clock. For 16.384Mb/s,
8.192Mb/s, 4.096Mb/s, and 2.048Mb/s this will result in two, four, eight, and
sixteen clocks per bit, respectively. The IDT72V73263 provides two different
interface timing modes, ST-BUS or GCI. The IDT72V73263 automatically
detects the polarity of an input frame pulse and identifies it as either ST-BUS
or GCI.
For 32.768Mb/s, in ST-BUS Mode, data is clocked out on a falling edge and
is clocked in on the subsequent rising-edge. For 16.384Mb/s, 8.192Mb/s,
4.096Mb/s, and 2.048Mb/s however there is not the typical associated clock
since the IDT72V73263 accepts only a 32.768MHz clock. As a result there will
be 2, 4, 8, and 16 clock between the 32.768Mb/s transmit edge and the
subsequently transmit edges. Although in this is the case, the IDT72V73263
will appropriately transmit and sample on the proper edge as if the respective
clock were present. See ST-BUS Timing for detail.
For 32.768Mb/s, in GCI Mode, data is clocked out on a rising edge and is
clocked in on the subsequent falling-edge. For 16.384Mb/s, 8.192Mb/s,
4.096Mb/s, and 2.048Mb/s however, again there is not the typical associated
clock since the IDT72V73263 accepts only a 32.768MHz clock. As a result there
will 2, 4, 8, and 16 clocks between the 32.768Mb/s transmit edge and the other
transmit edges. Although this is the case, the IDT72V73263 will appropriately
transmit and sample on the proper edge as if the respective clock were present.
See GCI Bus Timing for detail.
FUNCTIONAL DESCRIPTION
DATA AND CONNECTION MEMORY
All data that comes in through the RX inputs go through a serial-to-parallel
conversion before being stored into internal Data Memory. The 8 KHz frame
pulse (F32i) is used to mark the 125µs frame boundaries and to sequentially
address the input channels in Data Memory.
Data output on the TX streams may come from either the serial input streams
(Data Memory) or from the Connection Memory via the microprocessor or in
the case that RX input data is to be output, the addresses in Connection Memory
are used to specify a stream and channel of the input. The Connection Memory
is setup in such a way that each location corresponds to an output channel for
each particular stream. In that way, more than one channel can output the same
data. In Processor Mode, the microprocessor writes data to the Connection
Memory locations corresponding to the stream and channel that is to be output.
The lower half (8 least significant bits) of the Connection Memory LOW is output
every frame until the microprocessor changes the data or mode of the channels.
By using this Processor Mode capability, the microprocessor can access input
and output time-slots on a per-channel basis.
The three least significant bits of the Connection Memory HIGH are used to
control per-channel mode of the output streams. The MOD2-0 bits are used to
select Processor Mode, Constant or Variable Delay Mode, Bit Error Rate, and
the High-Impedance state of output drivers. If the MOD2-0 bits are set to 1-1-1
accordingly, only that particular output channel (8 bits) will be in the HighImpedance state. If the MOD2-0 bits are set to 1-0-0 accordingly, that particular
channel will be in Processor Mode. If the MOD2-0 bits are set to 1-0-1 a Bit Error
Rate Test pattern will be transmitted for that time slot. See BERT section. If the
DELAY THROUGH THE IDT72V73263
The switching of information from the input serial streams to the output serial
streams results in a throughput delay. The device can be programmed to
perform time-slot interchange functions with different throughput delay capabilities
on a per-channel basis. For voice applications, variable throughput delay is best
as it ensure minimum delay between input and output data. In wideband data
applications, constant throughput delay is best as the frame integrity of the
information is maintained through the switch.
The delay through the device varies according to the type of throughput delay
selected in the MOD bits of the Connection Memory.
VARIABLE DELAY MODE (MOD2-0 = 0-0-0)
In this mode, mostly for voice applications where minimum throughput delay
is desired, delay is dependent on the combination of source and destination
channels. The minimum delay achievable is a 3 channel periods of the slower
data rate.
CONSTANT DELAY MODE (MOD2-0 = 0-0-1)
In this mode, frame integrity is maintained in all switching configurations by
making use of a multiple data memory buffer. Input channel data is written into
the data memory buffers during frame n will be read out during frame n+2. In
the IDT72V73263, the minimum throughput delay achievable in Constant Delay
mode will be one frame plus one channel. See Table 14.
5
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
MICROPROCESSOR INTERFACE
The IDT72V73263’s microprocessor interface looks like a standard RAM
interface to improve integration into a system. With a 16-bit address bus and
a 16-bit data bus all memories can be accessed. Using the TSI microprocessor
interface, reads and writes are mapped into Data and Connection memories.
By allowing the internal memories to be randomly accessed, the controlling
microprocessor has more time to manage other peripheral devices
and can more easily and quickly gather information and setup the switch paths.
Table 1 shows the mapping of the addresses into internal memory blocks. In
order to minimize the amount of memory mapped space however, the Memory
Select (MS1-0) bits in the Control Register must be written to first to select between
the Connection Memory HIGH, the Connection Memory LOW, or Data Memory.
Effectively, the Memory Select bits act as an internal mux to select between the
Data Memory, Connection Memory HIGH, and Connection Memory LOW.
INDUSTRIAL TEMPERATURE RANGE
internal memories. The only write operation allowed during a Software Reset
is to the Software Reset bit in the Control Register to complete the Software Reset.
CONNECTION MEMORY CONTROL
If the ODE pin and the Output Standby bit are LOW, all output channels will
be in three-state. See Table 2 for detail.
If MOD2-0 of the Connection Memory HIGH is 1-0-0 accordingly, the output
channel will be in Processor Mode. In this case the lower eight bits of the
Connection Memory LOW are output each frame until the MOD2-0 bits are
changed. If MOD2-0 of the Connection Memory HIGH are 0-0-1 accordingly,
the channel will be in Constant Delay Mode and bits 14-0 are used to address
a location in Data Memory. If MOD2-0 of the Connection Memory HIGH are
0-0-0, the channel will be in Variable Delay Mode and bits 14-0 are used to
address a location in Data Memory. If MOD2-0 of the Connection Memory HIGH
are 1-1-1, the channel will be in High-Impedance mode and that channel will
be in three-state.
MEMORY MAPPING
The address bus on the microprocessor interface selects the internal registers
and memories of the IDT72V73263. The most significant bit of the address select
between the registers and internal memories. See Table 1 for mappings.
As explained in the Initialization section, after system power-up, the TDRSR
and RDRSR, should be programmed immediately to establish the desired
switching configuration.
The data in the Control Register consists of the Software Reset, RX/TX
Bypass, Output Enable Polarity, All Output Enable, Full Block Programming,
Block Programming Data, Begin Block Programming Enable, Reset Connection
Memory LOW in Block Programming, Output Standby, and Memory Select.
RX/TX INTERNAL BYPASS
When the Bypass bit of control registers is 1, all RX streams will be “shorted”
to TX in effect bypassing all internal circuitry of the TSI. This effectively sets the
TSI to a 1-to-1 switch mode with minimal I/O delay. A zero can be written to allow
normal operation. The intention of this mode is to minimize the delay from the RX
input to the TX output making the TSI “invisible”.
INITIALIZATION OF THE IDT72V73263
After power up, the state of the Connection Memory is unknown. As such, the
outputs should be put in High-Impedance by holding the ODE pin LOW. While
the ODE is LOW, the microprocessor can initialize the device by using the Block
Programming feature and program the active paths via the microprocessor bus.
Once the device is configured, the ODE pin (or Output Standby bit depending
on initialization) can be switched to enable the TSI switch.
SOFTWARE RESET
The Software Reset serves the same function as the hardware reset. As
with the hard reset, the Software Reset must also be set HIGH for 20ns before
bringing the Software Reset LOW again for normal operation. Once the Software
Reset is LOW, internal registers and other memories may be read or written.
During Software Reset, the microprocessor port is still able to read from all
6
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 1 — ADDRESS MAPPING
A15
A14
A13
A12
A11
1
STA5
STA4 STA3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A10
STA2 STA1
A9
A8
A7
A6
CH7 CH6
A5
A4
CH5 CH4
A3
A2
CH3 CH2
A1
A0
CH1 CH0
R/W
Location
Hex Value
R/W
Internal
0x8000memory
0xFFFF
(CM, DM
(read only)(1)
STA0
CH8
0
0
X
X
X
X
X
X
X
X
X
R/W
Control
0x00XX
Register
0
0
1
X
X
X
X
X
X
X
X
X
R/W
TDRSR0
0x02XX
0
1
0
X
X
X
X
X
X
X
X
X
R/W
TDRSR1
0x04XX
0
0
1
1
X
X
X
X
X
X
X
X
X
R/W
RDRSR0
0x06XX
0
0
1
0
0
X
X
X
X
X
X
X
X
X
R/W
RDRSR1
0x08XX
0
0
1
0
1
X
X
X
X
X
X
X
X
X
R/W
BPSA
0x0AXX
0
0
0
1
1
0
X
X
X
X
X
X
X
X
X
R/W
BPEA
0x0CXX
0
0
0
0
1
1
1
X
X
X
X
X
X
X
X
X
R/W
BIS
0x-0EXX
0
0
0
1
0
0
0
X
X
X
X
X
X
X
X
X
R/W
BER
0x10XX
0
0
1
0
0
0
0
X
X
X
X
X
X
X
X
X
R/W
FOR0
0x20XX
0
0
1
0
0
0
1
X
X
X
X
X
X
X
X
X
R/W
FOR1
0x22XX
0
0
1
0
0
1
0
X
X
X
X
X
X
X
X
X
R/W
FOR2
0x24XX
0
0
1
0
0
1
1
X
X
X
X
X
X
X
X
X
R/W
FOR3
0x26XX
0
0
1
0
1
0
0
X
X
X
X
X
X
X
X
X
R/W
FOR4
0x28XX
0
0
1
0
1
0
1
X
X
X
X
X
X
X
X
X
R/W
FOR5
0x2AXX
0
0
1
0
1
1
0
X
X
X
X
X
X
X
X
X
R/W
FOR6
0x2CXX
0
0
1
0
1
1
1
X
X
X
X
X
X
X
X
X
R/W
FOR7
0x2EXX
0
0
1
1
0
0
0
X
X
X
X
X
X
X
X
X
R/W
FOR8
0x30XX
0
0
1
1
0
0
1
X
X
X
X
X
X
X
X
X
R/W
FOR9
0x32XX
0
0
1
1
0
1
0
X
X
X
X
X
X
X
X
X
R/W
FOR10
0x34XX
0
0
1
1
0
1
1
X
X
X
X
X
X
X
X
X
R/W
FOR11
0x36XX
0
0
1
1
1
0
0
X
X
X
X
X
X
X
X
X
R/W
FOR12
0x38XX
0
0
1
1
1
0
1
X
X
X
X
X
X
X
X
X
R/W
FOR13
0x3AXX
0
0
1
1
1
1
0
X
X
X
X
X
X
X
X
X
R/W
FOR14
0x3CXX
0
0
1
1
1
1
1
X
X
X
X
X
X
X
X
X
R/W
FOR15
0x3EXX
NOTE:
1) Select Connection Memory High, Connection Memory Low, or Data Memory by setting the MS1-0 bits in the Control Register.
TABLE 2 OUTPUT HIGH-IMPEDANCE CONTROL
MOD2-0 BITS IN
CONNECTION
MEMORY HIGH
OE X BIT OF TDRSR
CONTROL REGISTER
ODE PIN
OSB BIT IN
1-1-1
1
X
X
Per Channel High-Impedance
Any, other than 1-1-1
1
0
0
All TX in High-Impedance
Any, other than 1-1-1
1
0
1
Enable
Any, other than 1-1-1
1
1
0
Enable
Any, other than 1-1-1
1
1
1
Enable
Any, other than 1-1-1
0
X
X
Group x of OEx is in High-Impedance
NOTE:
X = Don't Care.
7
OUTPUT DRIVER STATUS
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 3 CONTROL REGISTER (CR) BITS
Reset Value:
0000H
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SRS
BYP
OEPOL
AOE
PRST
CBER
SBER
FBP
BPD2
BPD1
BPD0
BPE
RCML
OSB
MS1
0
MS0
BIT
NAME
15
SRS
(Software Reset)
A one will reset the device and have the same effect as the RESET pin. Must be zero for normal operation.
14
BYP
(RX/TX Bypass)
When the Bypass bit is 1, all RX streams will be "shorted" to TX—in effect bypassing all internal circuitry of the TSI. This effectively
sets the TSI to a 1-to-1 switch mode with almost only a few nanoseconds of delay. A zero can be written to allow normal operation.
The intention of this mode is to minimize the delay from the RX input to the TX output making the TSI "invisible". Any offset values
in the FOR register will be required.
13
OEPOL
(Output Enable Polarity)
When 1, a one on OEI pin denotes an active state on the output data stream; zero on OEI pin denotes High-Impedance state. When
0, a one denotes High-Impedance and a zero denotes an active state. OEI mode is entered on a per-group basis in the DRSR.
12
AOE
(All Output Enable)
When 1, all output stream pins (TXn) become OEI to allow for a two-chip solution for a larger switching matrix with OEI pins. When
in AOE the DRS must be set to the corresponding data rate of the other device.
11
PRST
(PRBS Reset)
When HIGH, the PRBS transmitter output will be initialized.
10
CBER
(Clear Bit Error Rate)
A low to high transititon of this bit clears the BER register (BERR).
9
SBER
(Start Bit Error Rate)
A low to high transition in this bit starts the bit error rate test. The bit error test results is kept in the BER register (BERR).
8
FBP
(Full Block Programming)
When 1, this bit overrides the BPSA and BPEA registers and programs the full Connection Memory space. When 0, the BPSA
and BPEA determine the Connection Memory space to be programmed.
7-5
DESCRIPTION
BPD2-0
These bits carry the value to be loaded into the Connection Memory block whenever the Connection Memory block programming
(Block Programming Data) features is activated. After the BPE bit is set to 1 from 0, the contents of the bits BPD1-0 are loaded into bit 1 and 0 (MOD2-0) of
the Connection Memory HIGH.
4
BPE
(Begin Block
Programming Enable)
A zero to one transition of this bit enables the Connection Memory block programming feature delimited by the BPSA and BPEA
registers as well as for a full block program. Once the BPE bit is set HIGH, the device will program the Connection Memory block
as fast as than if the user manually programmed each Connection Memory location through the microprocessor. After the programming
function has finished, the BPE bit returns to zero to indicate the operation is completed. When the BPE = 1, the BPE bit can be
set to 0 to abort block programming.
3
RCML
(Reset Connection
Memory LOW in Block
Programming)
When RCML =1, all bits 14-0 in Connection Memory LOW will be reset to zero during block programming; when RCML = 0, bits
14-0 in Connection Memory LOW will retain their original values during block programming.
2
OSB
(Output Standby)
When ODE = 0 and OSB = 0, the output drivers of transmit serial streams are in High-Impedance mode. When either ODE = 1
or OSB = 1, the output serial stream drivers function normally.
1-0
MS1-0
(Memory Select)
These two bits decide which memory to be accessed via microprocessor port.
00
01
10
11
-----
Connection Memory LOW
Connection Memory HIGH
Data Memory
Reserved
8
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
microprocessor more time to perform other functions. Also, the TSI can be more
efficient in programming the locations since one CMH location is programmed
every 32i clock cycles. The group block programming function programs
"channel n" for all streams deliniated by the group before going to "channel n+1".
A C-cycle representation is shown below. The Group Block Programming
feature is composed of the Block Programming Start Address(BPSA), the Block
Programming End Address(BPEA), and the BPE and BPD bits in the Control
Register. The BPSA contains a start address for the block programming and
BPEA contains an end address. The block programming will start at the start
address and program until the end address even if the end address is “less”
than the start address. In other words there is no mechanism to prevent a start
address that is larger than the end address. If this occurs, the inverse CM
locations in the given group are programmed resulting in a “wrap around” effect.
This “wrap around” effect is independent for both the stream and channel
addresses. This is illustrated in the Group Block Programming diagram See
Figure 1 Group Block Programming Feature. Users must not initiat a block
program too close (ahead) of the present transmit location. If this is done the
TSI may simultaneously access the CM location that is being modified and
unpredictable data on TX outputs may occur. It should be noted however, in
order to enable the Group Block Programming the Full Block Program (FBP)
must be 0.
MEMORY BLOCK PROGRAMMING
The IDT72V73263 provides users with the capability of initializing the entire
Connection Memory block in two frames. To set bits 2,1 and 0 of every
Connection Memory HIGH location, set the Full Block Program to 1, write the
desired pattern in to the Block Programming Data Bits (BPD 2). All of the block
programming control can be found in the Control Register and enable the Block
Program Enable bit.
Enabled by setting the Block Program Enable bit of the Control Register HIGH.
When the Block Programming Enable bit of the Control Register is set to HIGH,
the Block Programming data will be loaded into the bits 2,1 and 0 of every
Connection Memory HIGH location regardless of the selected data rate for the
group. The Connection Memory LOW bits will be loaded with zeros when the
Reset Connection Memory LOW(RCML) bit is enabled and is otherwise left
untouched. When the memory block programming is complete, the device resets
the Block Programming Enable and the BPD 2-0 bits to zero.
The IDT72V73263 also incorporates a feature termed Group Block
Programming. Group Block Programming, allows subsections of the Connection
Memory to be block programmed as if the microprocessor were accessing the
Connection Memory HIGH locations in a back-to-back fashion. The results in
one connection memory high location being programmed for each C32i clock
cycle. By having the TSI perform this function it allows the controlling
9
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 4 BLOCK PROGRAMMING STARTING ADDRESS (BPSA) REGISTER
Reset Value:
0000H
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
G2
G1
G0
STA2
STA1
STA0
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
BIT
NAME
15
Unused
Must be zero for normal operation.
DESCRIPTION
14-12
G2-0
(Group Address
bits 2-0)
These bits are used to select which group will be block programmed
11-9
STA2-0
(Stream Address
bits 2-0)
These bits are used to select starting stream number for block programming.
8-0
CHA8-0
(Channel Address
bits 8-0)
These bits are used to select starting channel number for block programming.
TABLE 5 BLOCK PROGRAMMING ENDING ADDRESS (BPEA) REGISTER
Reset Value:
FFFFH
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
STA2
STA1
STA0
CH8
CH7
CH6
CH5
CH4
CH3
CH2
CH1
CH0
BIT
NAME
15-12
Unused
Must be one for normal operation.
DESCRIPTION
11-9
STA2-0
(Stream Address
bits 2-0)
These bits are used to select ending stream number for burst programming.
8-0
CHA8-0
(Channel Address
bits 8-0)
These bits are used to select starting channel number for burst programming.
10
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
CONNECTION MEMORY
0,0
CONNECTION MEMORY
Channels
X
X
0,0
255
Channels
X
Stream 2
X
X
X
X
X
X
Streams
X
X
X
X
X
X
Stream 4
Stream 4
X
7
7
X
Channel 20
0,0
Channels
X
BPSA = St2, Ch20
BPEA = St4, Ch 123
Channel 123
X
X
Channel 20
0,0
255
Channels
X
Stream 2
X
X
X
BPSA = St4, Ch123
BPEA = St2, Ch20
Channel 123
X
255
X
X
Stream 2
X
X
X
X
X
Stream 2
X
X
X
Streams
255
X
X
Streams
X
X
X
X
X
X
X
Streams
X
X
X
X
Stream 4
X
Stream 4
X
7
7
Channel 20
X
BPSA = ST4, CH20
BPEA = ST2, CH23
Channel 123
Channel 20
6140 drw04
X
BPSA = ST4, CH23
BPEA = ST2, CH20
Channel 123
6160 drw04
NOTE:
The group number is defined by the stream address in the BPSA.
Figure 1. Group Block Programming
11
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
int ST, CH
for (CH = StartChannel; CH <= EndChannel; CH++) {
for (ST = StartStream; ST <= EndStream; ST++) {
CMH[ST][CH] = BPD;
}
}
NOTE:
This code is for illustraion purposes only. The IDT72V73263
is a HW instantiation of this kind of software.
Figure 2. "Basic Instantiation"
/* GroupNum is 0-7 */
/* GroupDataRate = 2, 4, 8, 16. or 32 (2Mb/s, 4Mb/s, 8Mb/s, 16Mb/s, 32Mb/s) */
functional BlockProgram (int GroupNum; int GroupDataRate) {
int ST, CH;
int MaxStream = ((GroupNum * 8) + 7);
int MaxChannel = (((GroupDataRate/2) * 32) - 1);
/* StartChannel <= EndChannel */
if (StartChannel <= EndChannel){
for (CH = StartChannel; CH <= EndChannel; CH++){
/* StartStream <= EndStream and StartChannel <= EndChannel */
if (StartStream <= EndStream){
for (ST = StartStream; ST <= EndStream; ST++){
CMH[ST][CH] = BPD;
}
}
/* StartStream > EndStream and StartChannel <= EndChannel */
else{
for (ST = EndStream; ST <= MaxStream; ST++){
CMH [ST] [CH] = BPD;
}
for (ST = (GroupNum*7); ST <= StartStream; ST++){
CMH [ST] [CH] = BPD;
}
}
}
}
/* End > Start Channel */
else{
/* The last part to be programmed */
for (CH = EndChannel; CH <= MaxChannel; CH++){
/* StartStream > EndStream and StartChannel > EndChannel */
if (StartStream <= EndStream){
for (ST = StartStream; ST <= EndStream; ST++){
CMH [ST] [CH] = BPD;
}
}
/* StartStream > EndStream and StartChannel > EndChannel */
else{
for (ST = EndStream; ST <= MaxStream; ST++){
CHM [ST] [CH] = BPD;
}
for (ST = GroupNum*7); ST <= StartStream; ST++){
CMH [ST] [CH] = BPD;
}
}
]
/* The first part to be programmed */
for (CH = 0; CH <= StartChannel; CH++){
/* StartStream > EndStream and StartChannel > EndChannel */
if (StartStream <= EndStream){
for (ST = StartStream; ST <= EndStream; ST++){
CMH [ST] [CH] = BPD;
}
}
/* StartStream > EndStream and StartChannel . EndChannel */
else{
for (ST = EndStream; ST <= MaxStream; ST++){
CMH [ST] [CH] = BPD;
}
for (ST = (GroupNum*7); ST <= StartStream; ST++){
CMH [ST] [CH] = BPD;
}
}
}
}
NOTE:
This code is for illustration purposes only. The IDT72V73263
is a HW instantiation of this kind of software.
Figure 3. "Real" Instantiation of Memory Block Programming
12
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
BIT ERROR RATE
INDUSTRIAL TEMPERATURE RANGE
polled periodically and reset to prevent an overflow condition. To reset the
Pseudo-random bit sequence and the error count registers set the PRST,
CBER,and SBER,of the Control Register to high. See the Control Register for
details.
Following a write to the BERR register a read of the BERR will result in the
present value of the BERR data. Likewise, when the Clear Bit Error Rate bit
(CBER) in the control register is activated, this will clear the internal BERR
(iBERR).
As a general rule, a read of BERR should be proceeded by a write to BERR.
Again, it should be noted that the write to the BERR register will actually initiate
a transfer from the iBERR to the BERR while the microprocessor data is ignored.
Pseudo-Random Bit Sequences (PRBS) can be independently transmitted
and received. By setting the connection memory high bits to the BER transmit
mode, that particular channel will transmit a BER pattern of the form 215-1. For
the receiver only one channel can be specified and monitored at a given time.
By setting the BER Input Selection (BIS) to a given channel, every error in the
BER sequence will be incremented by one.
If the more than 216-1 errors are encountered the BERR register will
automatically overflow and be reset to zero. It is important to note that no interrupt
or warning will be issued in this case. It is recommended that this register be
TABLE 6 BER INPUT SELECTION REGISTER (BIS)
Reset Value:
Unknown (must be programmed)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
BG2
BG1
BG0
BSA2
BSA1
BSA0
BCA8
BCA7
BCA6
BCA5
BCA4
BCA3
BCA2
BCA1
BCA0
BIT
NAME
15
Unused
Must be zero for normal operation
DESCRIPTION
14-12
BG2-BG0
(BER Input Group
Address Bits)
These bits refer to the input data group which receives the BER data.
11-9
BSA2-BSA0
(BER Input
Stream Address Bits)
These bits refer to the input data stream which receives the BER data.
8-0
BCA8-BCA0
These bits refer to the input channel which receives the BER data.
(Local BER Input
Channel Address Bits)
TABLE 7 BIT ERROR RATE REGISTER (BERR)
Reset Value:
15
Unknown (must be programmed)
14
13
12
11
10
BER15 BER14 BER13 BER12 BER11 BER10
BIT
NAME
15-0
BER15-BER0
(Local Bit Error Rate
Count Bits)
9
8
7
6
5
4
3
2
1
0
BER9
BER8
BER7
BER6
BER5
BER4
BER3
BER2
BER1
BER0
DESCRIPTION
These bits refer to the local bit error counts.
NOTE:
Before a read of the BERR, a write to the BERR is neccesary. As a read only register the write will have no effect. See the Bit Error Rate section for more details.
INPUT FRAME OFFSET SELECTION
delayed, this feature is useful in compensating for the skew between input
streams.
Each input stream can have its own delay offset value by programming the
frame input offset registers (FOR, Table 8). The maximum allowable skew is +7.5
clock periods forward with a resolution of ½ clock period, see Table 9. The output
streams cannot be adjusted.
Input frame offset selection allows the channel alignment of individual input
streams to be offset with respect to the output stream channel alignment. Although
all input data comes in at the same speed, delays can be caused by variable
path serial backplanes and variable path lengths which may be implemented
in large centralized and distributed switching systems. Because data is often
13
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 8 FRAME INPUT OFFSET REGISTER (FOR) BITS
Reset Value:
0000H .
Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
FOR0 Register
OF32
OF31
OF30
DLE3
OF22
OF21
OF20
DLE2
OF12
OF11
OF10
DLE1
OF02
OF01
OF00
DLE0
FOR1 Register
OF72
OF71
OF70
DLE7
OF62
OF61
OF60
DLE6
OF52
OF51
OF50
DLE5
OF42
OF41
OF40
DLE4
FOR2 Register
OF112 OF111 OF110 DLE11 OF102 OF101 OF100 DLE10
OF92
OF91
OF90
DLE9
OF82
OF81
OF80
DLE8
FOR3 Register
OF152 OF151 OF150 DLE15 OF142 OF141 OF140 DLE14 OF132 OF131 OF130
DLE13 OF122 OF121 OF120 DLE12
FOR4 Register
OF192 OF191 OF190 DLE19 OF182 OF181 OF180 DLE18 OF172 OF171 OF170
DLE17 OD162 OD161 OF160 DLE16
FOR5 Register
OF232 OF231 OF230 DLE23 OF222 OF221 OF220 DLE22 OF212 OF211 OF210
DLE21 OF202 OF201 OF200 DLE20
FOR6 Register
OF272 OF271 OF270 DLE27 OF262 OF261 OF260 DLE26 OF252 OF251 OF250
DLE25 OF242 OF241 OF240 DLE24
FOR7 Register
OF312 OF311 OF310 DLE31 OF302 OF301 OF300 DLE30 OF292 OF291 OF290
DLE29 OF282 OF281 OF280 DLE28
FOR8 Register
OF352 OF351 OF350 DLE35 OF342 OF341 OF340 DLE34 OF332 OF331 OF330
DLE33 OF322 OF321 OF320 DLE32
FOR9 Register
OF392 OF391 OF390 DLE39 OF382 OF381 OF380 DLE38 OF372 OF371 OF370
DLE37 OF362 OF361 OF360 DLE36
FOR10 Register
OF432 OF431 OF430 DLE43 OF422 OF421 OF420 DLE42 OF412 OF411 OF410
DLE41 OF402 OF401 OF400 DLE40
FOR11 Register
OF472 OF471 OF470 DLE47 OF462 OF461 OF460 DLE46 OF452 OF451 OF450
DLE45 OF442 OF441 OF440 DLE44
FOR12 Register
OF512 OF511 OF510 DLE51 OF502 OF501 OF500 DLE50 OF492 OF491 OF490
DLE49 OF482 OF481 OF480 DLE48
FOR13 Register
OF552 OF551 OF550 DLE55 OF542 OF541 OF540 DLE54 OF532 OF531 OF530
DLE53 OF522 OF521 OF520 DLE52
FOR14 Register
OF592 OF591 OF590 DLE59 OF582 OF581 OF580 DLE58 OF572 OF571 OF570
DLE57 OF562 OF561 OF560 DLE56
FOR15 Register
OF632 OF631 OF630 DLE63 OF622 OF621 OF620 DLE62 OF612 OF611 OF610
DLE61 OF602 OF601 OF600 DLE60
NAME
DESCRIPTION
OFn2, OFn1, OFn0
(Offset Bits 2, 1 & 0)
These three bits define how long the serial interface receiver takes to recognize and store bit 0 from the RX input pin: i.e., to start a new frame.
The input frame offset can be selected to +7.5 clock periods from the point where the external frame pulse input signal is
applied to the FOi input of the device.
DLEn
ST-BUS and
DLEn = 0, offset is on the clock boundary.
(Data Latch Edge)
GCI mode:
DLEn = 1, offset is a half cycle off of the clock boundary.
TABLE 9 OFFSET BITS (OFN2, OFN1, OFN0, DLEN) & FRAME DELAY BITS
(FD11, FD2-0)
INPUT STREAM OFFSET
CLOCK PERIOD SHIFT BASED ON 32.768MHZ CLOCK
CORRESPONDING
OFFSET BITS
32.768Mb/s
16.384Mb/s
8.192Mb/s
4.096Mb/s
OFn2
OFn1
OFn0
DLEn
None
None
None
None
2.048Mb/s
None
0
0
0
0
+ 0.5
+ 1.0
+ 1.0
+ 2.0
+ 4.0
0
0
0
1
+ 1.0
+ 2.0
+ 2.0
+ 4.0
+ 8.0
0
0
1
0
+ 1.5
+ 3.0
+ 3.0
+ 6.0
+ 12.0
0
0
1
1
+ 2.0
+ 4.0
+ 4.0
+ 8.0
+ 16.0
0
1
0
0
+ 2.5
+ 5.0
+ 5.0
+ 10.0
+ 20.0
0
1
0
1
+ 3.0
+ 6.0
+ 6.0
+ 12.0
+ 24.0
0
1
1
0
+ 3.5
+ 7.0
+ 7.0
+ 14.0
+ 28.0
0
1
1
1
1
1
1
1
•••••••••
+ 7.5
+ 15.0
+ 15.0
+30.0
+ 60.0
Examples for Input Offset Delay Timing
14
15
RX Stream @
2Mb/s
RX Stream @
2Mb/s
RX Stream @
2Mb/s
RX Stream @
4Mb/s
RX Stream @
4Mb/s
RX Stream @
4Mb/s
RX Stream @
8Mb/s
RX Stream @
8Mb/s
RX Stream @
8Mb/s
RX Stream @
16Mb/s
RX Stream @
16Mb/s
RX Stream @
16Mb/s
RX Stream @
32Mb/s
RX Stream @
32Mb/s
RX Stream @
32Mb/s
C32i
16MHz Clock
8MHz Clock
4MHz Clock
ST-BUS F32i
Bit 7
Bit 7
Bit 6
Bit 7
Bit 7
NOTE: denotes sample point of RX Data
Bit 7
Bit 6
Bit 5
Bit 7
Bit 6
Bit 6
Bit 5
Bit 4
Bit 7
Bit 7
Bit 5
Bit 4
Bit 3
Bit 6
Bit 5
Bit 7
Bit 7
Bit 4
Bit 6
Bit 3
Bit 2
Bit 6
Bit 3
Bit 5
Bit 4
Bit 2
Bit 1
Bit 0
Bit 7
Bit 6
Bit 5
Bit 1
Bit 7
Bit 0
Bit 6
Bit 4
Bit 3
Bit 0
Bit 7
Bit 5
Bit 4
Figure 4. ST-BUS Offset Timing
Bit 2
Bit 1
Bit 3
Bit 2
Bit 6
Bit 5
Bit 3
Bit 7
Bit 5
Bit 2
Bit 1
Bit 4
Bit 2
Bit 1
Bit 0
Bit 6
Bit 4
Bit 7
Bit 1
Bit 4
Bit 0
Bit 6
Bit 6
Bit 5
Bit 3
Bit 3
Bit 0
6160 drw05
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
16
RX Stream @
2Mb/s
RX Stream @
2Mb/s
RX Stream @
2Mb/s
RX Stream @
4Mb/s
RX Stream @
4Mb/s
RX Stream @
4Mb/s
RX Stream @
8Mb/s
RX Stream @
8Mb/s
RX Stream @
8Mb/s
RX Stream @
16Mb/s
RX Stream @
16Mb/s
RX Stream @
16Mb/s
RX Stream @
32Mb/s
RX Stream @
32Mb/s
RX Stream @
32Mb/s
C32i
16MHz Clock
8MHz Clock
4MHz Clock
GCI BUS F32i
denotes sample point of RX data
Bit 7
Bit 7
Bit 7
Bit 6
Bit 7
Bit 7
Bit 6
Bit 5
Bit 7
Bit 6
Bit 6
Bit 5
Bit 4
Bit 7
Bit 7
Bit 7
Bit 5
Bit 4
Bit 3
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 7
Bit 6
Bit 6
Bit 3
Bit 2
Bit 1
Bit 7
Bit 6
Bit 5
Bit 1
Bit 0
Bit 6
Bit 4
Bit 3
Bit 0
Bit 7
Figure 5. GCI Offset Timing
Bit 5
Bit 4
Bit 2
Bit 1
Bit 0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 5
Bit 3
Bit 2
Bit 7
Bit 4
Bit 6
Bit 6
Bit 5
Bit 1
Bit 2
Bit 1
Bit 0
Bit 7
Bit 4
Bit 4
Bit 1
Bit 6
Bit 6
Bit 0
Bit 3
Bit 0
6160 drw06
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
offset = 1, DLE = 1
offset = 1, DLE = 0
offset = 0, DLE = 0
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
OUTPUT ENABLE INDICATION
The IDT72V73263 has the capability to indicate the state of the outputs (active
or three-state) by enabling the Output Enable Indication in the DRSR. In the
INDUSTRIAL TEMPERATURE RANGE
Output Enable Indication mode however, those output streams cannot be used
to transmit CM or DM data only OE data. In the diagram below notice how the
transmitting stream, TX0 is uneffected by the enabling and disabling of the OE
stream (TX8).
F32i
C32i
TX0
Bit 7
Bit 6
Bit 5
DS
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Set OE1 = 0
in TDRSR0
Set OE1 = 1
in TDRSR0
TX8/OEI0
OEPOL = 1
TX8/OEI0
OEPOL = 0
6160 drw6a
NOTE:
The TX0-7 pins are unaffected by the OEI Change.
Figure 6. The Effect of Enabling and Disabling of the OE Bit in TDRSR
17
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
F32i
1
2
3
4
5
6
7
8
C32i
TX0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
TX8-OEI0
OEPOL =1
TX8-OEI0
OEPOL = 0
6160 drw6b
NOTE:
Group 0 is in 32.768Mb/s and Group 1 is in OEI Mode.
Figure 7. OEI Function
F32i
C32i
TX0(-7)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DS
Set OE0 = 0
in TDRSR0
Set OE0 = 1
in TDRSR0
TX8-OEI0
OEPOL =1
TX8-OEI0
OEPOL = 0
6160 drw6c
NOTE:
The OEI pins are unaffected by the OE0 change.
Figure 8. Group OE Operation
18
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 10 TRANSMIT DATA RATE SELECTION REGISTER (TDRSR)
Reset Value:
0000H
TX DRSR 1
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
OE7
G72
G71
G70
OE6
G62
G61
G60
OE5
G52
G52
G51
OE4
G42
G41
G40
15
14
13
12
11
10
9
7
6
5
4
3
2
1
0
OE3
G32
G31
G30
OE2
G22
G21
OE1
G12
G11
G10
OE0
G02
G01
G00
TX DRSR 0
OEx
8
G20
These bits can be used to High-Z the entire associated group. If OEx = 0 the group will be in High-Z. If OEx =1, the group is in Low-Z (active state).
Gx2-Gx0
These three group bits are used to select the transmit data rates for the eight groups of eight streams. See table 11 for data rates.
Gx2(1)
0
0
0
0
1
1
1
1
Gx1(1)
0
0
1
1
0
0
1
1
Gx0(1)
0
1
0
1
0
1
0
1
Data Rate
2.048Mb/s
4.096Mb/s
8.192Mb/s
16.384Mb/s
32.768Mb/s
Reserved(2)
Reserved(2)
OEI(3)
If G0/G2/G4/G6 are programmed to be run at 32.768Mb/s, then G1/G3/G5/G7 will be unavailable, respectively, except for OEI purposes. In other words if G0 is
programmed for 32.768Mb/s, G1 will only be available for OEI.
NOTES:
1. "x" corresponds to groups 0-7 (8 Data streams per group).
2. If the Gx2-0 are programmed to the reserved values the device will operate in the
default 2.048Mb/s mode.
3. Only odd groups can be programmed for OEI. The OEI rate corresponds it's
associated even group.
TABLE 11 TX GROUPING AND DATA RATES
GROUP
NUMBER
STREAMS
SPEED
WITH OEI=1
G0
0-7
2.048Mb/s-32.768Mb/s
2.048Mb/s-32.768Mb/s
G1
8-15
2.048Mb/s-32.768Mb/s
OEI<0-7>
G2
16-23
2.048Mb/s-32.768Mb/s
2.048Mb/s-32.768Mb/s
G3
24-31
2.048Mb/s-32.768Mb/s
OEI<16-23>
G4
32-39
2.048Mb/s-32.768Mb/s
2.048Mb/s-32.768Mb/s
G5
40-47
2.048Mb/s-32.768Mb/s
OEI<32-39>
G6
48-55
2.048Mb/s-32.768Mb/s
2.048Mb/s-32.768Mb/s
G7
56-63
2.048Mb/s-32.768Mb/s
OEI<48-55>
19
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 12 RECEIVE DATA RATE SELECTION REGISTER(RDRSR)
Reset Value:
0000H
RX DRSR 1
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
G72
G71
G70
0
G62
G61
G60
0
G52
G51
G50
0
G42
G41
G40
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
G32
G31
G30
0
G22
G21
G20
0
G12
G11
G10
0
G02
G01
G00
RX DRSR 0
Gx0-Gx2
These three group bits are used to select the receive data rates for the eight groups of eight streams. See table 13 for data rates.
Gx2(1)
0
0
0
0
1
1
1
1
Gx1(1)
0
0
1
1
0
0
1
1
Gx0(1)
0
1
0
1
0
1
0
1
Data Rate
2.048Mb/s
4.096Mb/s
8.192Mb/s
16.384Mb/s
32.768Mb/s
Reserved(2)
Reserved(2)
Reserved(2)
If G0/G2/G4/G6 are programmed to be run at 32.768Mb/s, then G1/G3/G5/G7 will be unavailable, respectively, except for OEI purposes. In other words if G0 is
programmed for 32.768Mb/s, G1 will only be available for OEI.
NOTES:
1. "x" corresponds to groups 0-7 (8 Data streams per group).
2. If the Gx2-0 are programmed to the reserved values the device will operate in the
default 2.048Mb/s mode.
3. Only odd groups can be programmed for OEI. The OEI rate corresponds to it's
associated even group.
TABLE 13 RX GROUPING AND DATA RATES
GROUP NUMBER
STREAMS
SPEED
G0
0-7
2.048Mb/s-32.768Mb/s
G1
8-15
2.048Mb/s-32.768Mb/s
G2
16-23
2.048Mb/s-32.768Mb/s
G3
24-31
2.048Mb/s-32.768Mb/s
G4
32-39
2.048Mb/s-32.768Mb/s
G5
40-47
2.048Mb/s-32.768Mb/s
G6
48-55
2.048Mb/s-32.768Mb/s
G7
56-63
2.048Mb/s-32.768Mb/s
20
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 14 CONNECTION MEMORY HIGH
Reset Value:
Unknown (must be programmed)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
MOD2
MOD1
MOD0
BIT
NAME
DESCRIPTION
15-3
Unused
Must be zero for normal operation.
2-0
MOD2-0
MOD2
0
0
0
0
1
1
1
1
MOD1
0
0
1
1
0
0
1
1
MOD0
0
1
0
1
0
1
0
1
MODE
Variable Delay Mode
Constant Delay Mode
Reserved
Reserved
Processor Mode
Bit Error Rate Test
Reserved
High-Impedance
TABLE 15 CONNECTION MEMORY LOW
Reset Value:
Unknown (must be programmed)
15
0
BIT
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SAB5
SAB4
SAB3
SAB2
SAB1
SAB0
CAB8
CAB7
CAB6
CAB5
CAB4
CAB3
CAB2
CAB1
CAB0
2
C
B
NAME
15
DESCRIPTION
Unused
Must be zero for normal operation
14-9
SAB5-0
(Source Stream
Address Bits)
The binary value is the number of the data stream for the source of the connection.
8-0
CAB8-0
(Source Channel
Address Bits)
The binary value is the number of the channel for the source of the connection.
NOTES:
1. When running the device at lower bit rates (i.e. 2, 4, 8, or 16.384Mb/s), make sure
the bitscorresponding to the unused channels are set to 0.
2. When G0/G2/G4/G6 are programmed for 32.768Mb/s operation its corresponding
group G1/G3/G5/F7 will be unavailable.
3. In processor mode, data in the lower byte (bits0-7) of the Connection Memory LOW
will be output to the TX streams. The order in which the data are output will be starting
from the LSB (Bit 0) to the MSB (Bit 7) of the lower byte. The figure below illustrates
the sequence:
15
14
13
12
11
10
9
8
7
H
6
G
Figure 9. Processor Mode Bit Sequencing
21
5
F
4
E
3
D
1
0
A
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 16 BOUNDARY SCAN REGISTER BITS
Device Pin
Boundary Scan Bit 0 to 267
Input
Output
Three-state
Scan Cell
Scan Cell
Control
0
Boundary Scan Bit 0 to 267
Output
Three-state
Scan Cell
Control
RX60
Input
Scan Cell
79
RESET
1
RX59
80
C32i
2
RX58
81
F32i
3
RX57
82
S/A
4
RX56
83
DS
5
TX63/OEI31
84
85
CS
6
TX62/OEI30
86
87
R/W
7
TX61/OEI29
88
89
A0
8
TX60/OEI28
90
91
A1
9
TX59/OEI27
92
93
A2
10
TX58/OEI26
94
95
A3
11
TX57/OEI25
96
97
A4
12
TX56/OEI24
98
99
A5
13
TX55/OEi23
100
101
A6
14
TX54/OEi22
102
103
A7
15
TX53/OEI21
104
105
A8
16
TX52/OEI20
106
107
A9
17
TX51/OEI19
108
109
A10
18
TX50/OEI18
110
111
A11
19
TX49/OE17
112
113
A12
20
TX48/OEI16
114
115
A13
21
RX55
116
A14
22
RX54
117
A15
23
RX53
118
ODE
Device Pin
BEL
24
RX52
119
DTA/BEH
25
26
27
RX51
120
D15
28
29
30
RX50
121
D14
31
32
33
RX49
122
D13
34
35
36
RX48
123
D12
37
38
39
RX47
124
D11
40
41
42
RX46
125
D10
43
44
45
RX45
126
D9
46
47
48
RX44
127
D8
49
50
51
RX43
128
D7
52
53
54
RX42
129
D6
55
56
57
RX41
130
D5
58
59
60
RX40
131
D4
61
62
63
TX47/OEI15
132
133
D3
64
65
66
TX46/OEI14
134
135
D2
67
68
69
TX45/OEI13
136
137
D1
70
71
72
TX44/OEI12
138
139
D0
73
74
75
TX43/OEI11
140
141
RX63
76
TX42/OEI10
142
143
RX62
77
TX41/OEI9
144
145
RX61
78
TX40/OEI8
146
147
22
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 16 BOUNDARY SCAN REGISTER BITS (CONTINUED)
Device Pin
Input
Scan Cell
Boundary Scan Bit 0 to 267
Output
Three-state
Scan Cell
Control
Device Pin
Input
Scan Cell
TX39/OEI7
148
149
RX19
216
TX38/OEI6
150
151
RX18
217
TX37/OEI5
152
153
RX17
218
TX36/OEI4
154
155
RX16
219
220
TX35/OEI3
156
157
RX15
TX34/OEI2
158
159
RX14
221
TX33/OEI1
160
161
RX13
222
162
163
Boundary Scan Bit 0 to 267
Output
Three-state
Scan Cell
Control
RX12
223
RX39
164
RX11
224
RX38
165
RX10
225
RX37
166
RX9
226
RX36
167
RX8
227
RX35
168
TX15
228
229
RX34
169
TX14
230
231
RX33
170
TX13
232
233
RX32
171
TX12
234
235
RX31
172
TX11
236
237
RX30
173
TX10
238
239
RX29
174
TX9
240
241
RX28
175
TX8
242
243
RX27
176
TX7
244
245
RX26
177
TX6
246
247
RX25
178
TX5
248
249
RX24
179
TX32/OEI0
TX31
180
TX4
250
251
181
TX3
252
253
254
255
TX30
182
183
TX2
TX29
184
185
TX1
256
257
TX28
186
187
TX0
258
259
TX27
188
189
RX7
260
TX26
190
191
RX6
261
TX25
192
193
RX5
262
TX24
194
195
RX4
263
TX23
196
197
RX3
264
265
TX22
198
199
RX2
TX21
200
201
RX1
266
TX20
202
203
RX0
267
TX19
204
205
TX18
206
207
TX17
208
209
TX16
210
211
RX23
212
RX22
213
RX21
214
RX20
215
23
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
JTAG SUPPORT
The IDT72V73263 JTAG interface conforms to the Boundary-Scan standard
IEEE-1149.1. This standard specifies a design-for-testability technique called
Boundary-Scan test (BST). The operation of the boundary-scan circuitry is
controlled by an external test access port (TAP) Controller.
TEST ACCESS PORT (TAP)
The Test Access Port (TAP) provides access to the test functions of the
IDT72V73263. It consists of three input pins and one output pin.
•Test Clock Input (TCK)
TCK provides the clock for the test logic. The TCK does not interfere with any
on-chip clock and thus remains independent. The TCK permits shifting of test
data into or out of the Boundary-Scan register cells concurrently with the
operation of the device and without interfering with the on-chip logic.
•Test Mode Select Input (TMS)
The logic signals received at the TMS input are interpreted by the TAP
Controller to control the test operations. The TMS signals are sampled at the
rising edge of the TCK pulse. This pin is internally pulled to VCC when it is not
driven from an external source.
•Test Data Input (TDI)
Serial input data applied to this port is fed either into the instruction register or
into a test data register, depending on the sequence previously applied to the
TMS input. Both registers are described in a subsequent section. The received
input data is sampled at the rising edge of TCK pulses. This pin is internally pulled
to VCC when it is not driven from an external source.
•Test Data Output (TDO)
Depending on the sequence previously applied to the TMS input, the contents
of either the instruction register or data register are serially shifted out through
the TDO pin on the falling edge of each TCK pulse. When no data is shifted
through the boundary scan cells, the TDO driver is set to a High-Impedance
state.
INDUSTRIAL TEMPERATURE RANGE
•Test Reset (TRST)
Reset the JTAG scan structure. This pin is internally pulled to VCC when it
is not driven from an external source.
INSTRUCTION REGISTER
In accordance with the IEEE-1149.1 standard, the IDT72V73263 uses public
instructions. The IDT72V73263 JTAG interface contains a four-bit instruction
register. Instructions are serially loaded into the instruction register from the TDI
when the TAP Controller is in its shift-IR state. Subsequently, the instructions are
decoded to achieve two basic functions: to select the test data register that may
operate while the instruction is current, and to define the serial test data register
path, which is used to shift data between TDI and TDO during data register
scanning. See Table 12 for Instruction decoding.
TEST DATA REGISTER
As specified in IEEE-1149.1, the IDT72V73263 JTAG Interface contains two
test data registers:
•The Boundary-Scan register
The Boundary-Scan register consists of a series of Boundary-Scan cells
arranged to form a scan path around the boundary of the IDT72V73263 core
logic.
•The Bypass Register
The Bypass register is a single stage shift register that provides a one-bit path
from TDI to TDO. The IDT72V73263 boundary scan register bits are shown
in Table 14. Bit 0 is the first bit clocked out. All three-state enable bits are active
HIGH.
ID CODE REGISTER
As specified in IEEE-1149.1, this instruction loads the IDR with the Revision
Number, Device ID, JEDEC ID, and ID Register Indicator Bit. See Table 10.
TABLE 17 — IDENTIFICATION REGISTER DEFINITIONS
INSTRUCTION FIELD
Revision Number (31:28)
VALUE
0x0
Reserved for version number
IDT Device ID (27:12)
0x0430
IDT JEDEC ID (11:1)
0x33
ID Register Indicator Bit (Bit 0)
DESCRIPTION
Defines IDT part number
Allows unique identification of device vendor as IDT
1
Indicates the presence of an ID register
TABLE 18 — SCAN REGISTER SIZES
REGISTER NAME
Instruction (IR)
BIT SIZE
4
Bypass (BYR)
1
Identification (IDR)
32
Boundary Scan (BSR)
Note(1)
NOTE:
1. The Boundary Scan Descriptive Language (BSDL) file for this device is available on
the IDT website (www.idt.com), or by contacting your local IDT sales representative.
24
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
TABLE 19 — SYSTEM INTERFACE PARAMETERS
INSTRUCTION
CODE
EXTEST
0000
BYPASS
1111
Places the bypass register (BYR) between TDI and TDO.
IDCODE
0010
Loads the ID register (IDR) with the vendor ID code and places the register between TDI and TDO.
HIGH-Z
0011
Places the bypass register (BYR) between TDI and TDO. Forces all device output drivers to a High-Z state.
SAMPLE/PRELOAD
0001
Places the boundary scan register (BSR) between TDI and TDO. SAMPLE allows data from device inputs(2) and outputs(1) to be
captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the boundary
scan cells via the TDI.
RESERVED
DESCRIPTION
Forces contents of the boundary scan cells onto the device outputs(1). Places the boundary scan register (BSR) between TDI and TDO.
All other codes Several combinations are reserved. Do not use other codes than those identified above.
NOTES:
1. Device outputs = All device outputs except TDO.
2. Device inputs = All device inputs except TDI, TMS and TRST.
TABLE 20 — JTAG AC ELECTRICAL CHARACTERISTICS (1,2,3,4)
SYMBOL
PARAMETER
MIN.
MAX.
UNITS
tJCYC
JTAG Clock Input Period
100
ns
tJCH
JTAG Clock HIGH
40
ns
tJCL
JTAG Clock LOW
40
ns
tJR
JTAG Clock Rise Time
3(1)
ns
tJF
JTAG Clock Fall Time
3(1)
ns
tJRST
JTAG Reset
50
ns
tJRSR
JTAG Reset Recovery
50
ns
tJCD
JTAG Data Output
25
ns
tJDC
JTAG Data Output Hold
0
ns
tJS
JTAG Setup
15
ns
tJH
JTAG Hold
15
ns
NOTES:
1. Guaranteed by design.
2. 30pF loading on external output signals.
3. Refer to AC Electrical Test Conditions stated earlier in this document.
4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet.
tJCYC
tJR
tJF
tJCH
tJCL
TCK
TDI/TMS
(Device Inputs)(1)
tJH
tJS
tJDC
TDO
(Device Outputs)
tJCD
tJRSR
6160 drw07
TRST
tJRST
NOTES:
1. Device inputs = All device inputs except TDI, TMS and TRST.
Figure 10. JTAG Timing Specifications
25
x
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VCC
Parameter
Min.
Max.
Unit
Supply Voltage
-0.5
+4.0
V
Vi
Voltage on Digital Inputs
GND -0.3
VCC +0.3
V
IO
Current at Digital Outputs
-50
50
mA
TS
Storage Temperature
-55
+125
°C
PD
Package Power Dissapation
2
W
NOTE:
1. Exceeding these values may cause permanent damage. Functional operation under
these conditions is not implied.
INDUSTRIAL TEMPERATURE RANGE
RECOMMENDED OPERATING
CONDITIONS(1)
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Positive Supply
3.0
3.3
3.6
V
VIH(1)
Input HIGH Voltage
2.0
VCC
V
VIL
Input LOW Voltage
-0.3
0.8
V
TOP
Operating Temperature
Industrial
-40
25
+85
°C
NOTES:
1. Inputs/Outputs are not 5V tolerant
2. Voltages are with respect to ground (GND) unless otherwise stated.
DC ELECTRICAL CHARACTERISTICS
Symbol
ICC
Parameter
(2)
IIL(3,4)
(3,4)
Min.
Typ.
Max.
Units
Supply Current
380
mA
Input Leakage (input pins)
—
60
µA
60
µA
60
µA
IBL
Input Leakage (I/O pins)
—
IOZ(3,4)
High-Impedance Leakage
VOH(5)
Output HIGH Voltage
2.4
V
VOL(6)
Output LOW Voltage
0.4
V
NOTES:
1. Voltages are with respect to ground (GND) unless otherwise stated.
2. Outputs unloaded.
3. 0 ≤ V ≤ VCC.
4. Maximum leakage on pins (output or I/O pins in High-Impedance state) is over an applied voltage (V).
5. IOH = 10 mA.
6. IOL = 10 mA.
AC ELECTRICAL CHARACTERISTICS - TIMING PARAMETER
MEASUREMENT VOLTAGE LEVELS
Symbol
Rating
Level
Unit
VTT
TTL Threshold
1.5
V
VHM
TTL Rise/Fall Threshold Voltage HIGH
2.0
V
VLM
TTL Rise/Fall Threshold Voltage LOW
0.8
V
Input Pulse Levels
tr,tf
CL(1)
Input Rise/Fall Times
50Ω
Z0 = 50Ω
I/O
V
1
ns
Input Timing Reference Levels
V
Output Reference Levels
V
Output Load
VDD
50
N
Ch
t
e
Y
ot
ara
riz
cte
ed
6160 drw08
Figure 11. AC Termination
pF
VDD
NOTE:
1. JTAG CL is 30pF
330Ω
D.U.T.
Ch
t
e
Y
ot
510Ω
N
ara
riz
cte
30pF*
6160 drw09
Figure 12. AC Test Load
26
ed
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - RESET AND ODE TIMING
Symbol
Parameter
Min.
Typ.
Max.
Units
tRZ
Active to High-Z on Master Reset
—
—
12
ns
tRS
Reset Pulse Width
20
—
—
ns
tODELZ
Output Driver Enable (ODE) to Low-Z
6
—
—
ns
R ESET
tRZ
tRS
TX
ODE
6160 Drw10
Figure 13. Reset and ODE Timing
AC ELECTRICAL CHARACTERISTICS - C32i AND ODE TO HIGH-Z TIMING AND
C32i AND ODE TO LOW-Z TIMING
Symbol
Parameter
t
CLZ(1)
Min.
Clock to Low-Z
tCHZ(1)
Clock to High-Z
tODEA
ODE to Valid Data
tODEHZ
Output Driver Enable (ODE) to High-Z
tODELZ
Outut Driver Enable (ODE) to Low-Z
tSIH(1)
RX Hold Time
tSOD
Clock to Valid Data
Typ.
Max.
Units
3
—
—
ns
—
—
9
ns
6
—
—
ns
3
—
9
ns
4
—
—
ns
4
—
—
ns
3
7
9
ns
NOTE:
1. CL = 30pF.
C 32i
(ST-BUS mode)
C32i
(GCI mode)
ODE
tSOD
tCHZ
TX
tODEA
tODELZ
tODEHZ
VALID DATA
TX
VALID DATA
tCLZ
TX
tSIH
6160 drw12
VALID DATA
6160 drw11
Figure 15. Output Driver Enable (ODE)
Figure 14. Serial Output and External Control
27
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - ST-BUS TIMING
Symbol
Parameter
Min.
Typ.
Max.
Units
tCH
C32i Pulse Width HIGH
Clock rate = 32.768Mb/s
13
15.25
17
ns
tCL
C32i Pulse Width LOW
Clock rate = 32.768Mb/s
13
15.25
17
ns
tCP
C32i Period
Clock rate = 32.768Mb/s
29
30.5
35
ns
tFPH
Frame Pulse Hold Time from C32i falling (ST-BUS or GCI)
5
—
—
ns
tFPS
Frame Pulse Setup Time from C32i falling *ST-BUS or GCI)
5
—
—
ns
tFPW
Frame Pulse Width (ST-BUS, GCI)
Clock rate = 32.768Mb/s
13
—
31
ns
tr,tf
Clock Rise/Fall Time
—
1
—
ns
tSIH
RX Hold Time
4
—
—
ns
tSIS
RX Setup Time
2
—
—
ns
tSOD
Clock to Valid Data
3
7
9
ns
(1)
NOTE:
1. Parameters verified under test conditions.
tFPW
F32i
tr
tf
tFPS
tFPH
tCH
tCL
C32i
tSOD
TX 32.768 Mb/s
Bit 2
Bit 1
tCP
Bit 7
Bit 0
tSIS
RX 32.768 Mb/s
Bit 1
Bit 2
Bit 0
Bit 5
Bit 6
Bit 3
Bit 4
Bit 1
Bit 2
Bit 7
Bit 0
Bit 5
Bit 6
Bit 3
Bit 4
Bit 1
Bit 2
Bit 0
Bit 7
tSIH
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 1
Bit 2
tCH
Bit 0
Bit 7
Bit 6
Bit 5
Bit 3
Bit 4
Bit 1
Bit 2
Bit 7
Bit 0
tCL
CLK-16.384 MHz(1)
tCP
tSOD
TX 16.384 Mb/s
Bit 1
Bit 0
Bit 7
tSIS
RX 16.384 Mb/s
Bit 1
Bit 0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
tSIH
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
tSOD
TX 8.192 Mb/s
Bit 0
Bit 7
Bit 6
tSIS
RX 8.192 Mb/s
Bit 0
Bit 3
Bit 4
Bit 5
tSIH
Bit 7
Bit 6
Bit 5
Bit 4
tCH
tCL
CLK- 8.192 MHz(1)
tCP
tSOD
TX 4.096 Mb/s
Bit 0
Bit 7
RX 4.096 Mb/s
Bit 0
Bit 5
Bit 6
tSIS
tSIH
Bit 7
Bit 6
CLK- 4.096 MHz(1)
tSOD
TX 2.048 Mb/s
Bit 0
Bit 7
Bit 6
tSIS
RX 2.048 Mb/s
tSIH
Bit 7
NOTE:
1. These clocks are for reference purposes only.
The TSI only accepts a 32.768MHz clock.
Figure 16. ST-BUS Timing
28
6160 drw13
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - GCI BUS TIMING
Symbol
Parameter
Min.
Typ.
Max.
Units
tCH
C32i Pulse Width HIGH
Clock rate = 32.768Mb/s
13
15.25
17
ns
tCL
C32i Pulse Width
Clock rate = 32.768Mb/s
13
15.25
17
ns
tCP
C32i Period
Clock rate = 32.768Mb/s
29
30.5
35
ns
tFPH
Frame Pulse Hold Time from C32i falling (ST-BUS or GCI)
5
—
—
ns
tFPS
Frame Pulse Setup Time before C32i falling (ST-BUS or GCI)
5
—
—
ns
tFPW
Frame Pulse Width (ST-BUS or GCI)
Clock rate = 32.768Mb/s
13
—
31
ns
tr,tf
Clock Rise/Fall Time
—
1
—
ns
tSIH
RX Hold Time
4
—
—
ns
tSIS
RX Setup Time
2
—
—
ns
tSOD
Clock to Valid Data
3
7
9
ns
(1)
NOTE:
1. Parameters verified under test conditions.
tFPW
F32i
tr
tf
tFPS
tFPH
tCL
tCH
CLK- 32.768 MHz
tCP
tSOD
TX 32.768 Mb/s
Bit 5
Bit 6
Bit 7
Bit 0
tSIS
RX 32.768 Mb/s
Bit 6
Bit 7
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
tSIH
Bit 0
Bit 1
Bit 3
Bit 2
Bit 4
Bit 6
Bit 5
Bit 7
tCH
Bit 1
Bit 0
Bit 2
Bit 3
Bit 4
Bit 5
Bit 7
Bit 6
tCL
CLK- 16.384 MHz(1)
tCP
tSOD
TX 16.384 Mb/s
Bit 6
Bit 7
Bit 0
Bit 6
Bit 0
Bit 7
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
tSIH
tSIS
RX 16.384 Mb/s
Bit 1
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
tSOD
TX 8.192 Mb/s
Bit 7
Bit 0
Bit 1
tSIS
RX 8.192 Mb/s
Bit 7
Bit 2
Bit 0
Bit 1
Bit 2
tSOD
Bit 7
tCP
Bit 0
Bit 1
tSIH
tSIS
RX 4.096 Mb/s
Bit 3
tCL
tCH
CLK- 8.192 MHz(1)
TX 4.096 Mb/s
Bit 3
tSIH
Bit 7
Bit 0
Bit 1
CLK- 4.096 MHz(1)
tSOD
TX 2.048 Mb/s
Bit 7
Bit 0
tSIH
tSIS
RX 2.048 Mb/s
Bit 0
6160 drw14
NOTE:
1. These clocks are for reference purposes only.
The TSI only accepts a 32.768MHz clock.
Figure 17. GCI Bus Timing
29
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - OEI BUS TIMING IN ST-BUS MODE
Symbol
Parameter
Min.
Typ.
Max.
Units
tCH
C32i Pulse Width HIGH
Clock rate = 32.768Mb/s
13
15.25
17
ns
tCHZ(2)
Clock to High-Z
—
—
9
ns
tCL
C32i Pulse Width
Clock rate = 32.768Mb/s
13
15.25
17
ns
tCLZ(2)
Clock to Low-Z
3
—
—
ns
tCP
C32i Period
Clock rate = 32.768Mb/s
29
30.5
35
ns
tFPH
Frame Pulse Hold Time from C32i falling (ST-BUS or GCI)
5
—
—
ns
tFPS
Frame Pulse Setup Time before C32i falling (ST-BUS or GCI)
5
—
—
ns
tFPW
Frame Pulse Width (ST-BUS or GCI)
Clock rate = 32.768Mb/s
13
—
31
ns
tOEIE
Clock to OEI Enable
3
—
9
ns
tOEID
Clock to OEI Disable
3
—
9
ns
tr,tf
Clock Rise/Fall Time
—
1
—
ns
tSOD
Clock to Valid Data
3
7
9
ns
(1)
NOTE:
1. Parameters verified under test conditions.
2. CL = 300pF
tFPW
F32i
tFPS
tFPH
tCL
tCH
tCP
C32i
tr
tf
tSOD
TX16.384 Mb/s
tCHZ
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
tCLZ
tOEID
tOEIE
OEI(1)
OEI(2)
tOEIE
tOEID
6160 drw15
NOTES:
1) OEPOL = 1
2) OEPOL = 0
Figure 18. OEI Bus Timing in ST-BUS Mode
30
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - RX TO TX INTERNAL BYPASS BIT
SYMBOL
PARAMETER
tBC
MIN.
TYP.
MAX.
UNITS
2
8
12
ns
RX
tBC
tBC
tBC
TX
6160 drw16
tBC = end to end chip delay
Figure 19. RX to TX Internal Bypass Bit
31
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - MOTOROLA NON-MULTIPLEXED BUS
ASYCHRONOUS TIMING MEMORY ACCESS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNITS
tADH
Address Hold after DS Rising
2
—
—
ns
tADS
Address Setup from DS Falling
2
—
—
ns
tAKD(1)
Acknowledgment Delay:
Reading/Writing Memory
—
—
30
ns
tAKH
Acknowledgment Hold Time
—
—
10
ns
tCSH
CS Hold Time after DS Rising
0
—
—
ns
tCSS
CS Setup from DS Falling
0
—
—
ns
tDDR(1)
Data Setup from DTA LOW on Read
2
—
—
ns
tDHR(1)
Data Hold On Read
10
15
25
ns
tDHW
Data Hold on Read
5
—
—
ns
tDSS
Data Strobe Setup Time
2
—
—
ns
tDSPW
Data Strobe on Write
6
—
—
ns
tRWH
R/W Hold after DS Rising
3
—
—
ns
tRWS
R/W Setup from DS Falling
3
—
—
ns
tSWD
Valid Data Delay on Write
2
—
—
ns
(1,2,3)
NOTES:
1. CL = 30pF
2. RL = 1K
3. High-Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL.
4. To achieve on clock cycle fast memory access, this setup time, tDSS should be met. Otherwise, worst-case memory access operation is determined
by tAKD.
CLK GCI
CLK ST-BUS
tDSPW
tDSS
tDSS
DS
tCSS
tCSH
tCSS
tCSH
CS
tRWS
tRWS
tRWH
tRWH
R/W
tADH
tADS
A0-A15
tSWD
D0-D15
tADH
tADS
VALID READ ADDRESS
VALID WRITE ADDRESS
tDHR
tDHW
VALID READ DATA
VALID WRITE DATA
tDDR
tAKD
tAKH
tAKD
tAKH
D TA
6160 drw17
Figure 20. Motorola Non-Multiplexed Bus Asychronous Memory Access
32
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - MOTOROLA NON-MULTIPLEXED BUS
ASYNCRONOUS TIMING REGISTER ACCESS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNITS
tADH
Address Hold after DS Rising
2
—
—
ns
tADS
Address Setup from DS Falling
2
—
—
ns
tAKD(1)
Acknowledgment Delay:
Reading/Writing Registers
—
—
40
ns
tAKH
Acknowledgment Hold Time
—
—
20
ns
tCSH
CS Hold Time after DS Rising
0
—
—
ns
tCSS
CS Setup from DS Falling
0
—
—
ns
tDDR(1)
Data Setup from DTA LOW on Read
2
—
—
ns
tDHR(1)
Data Hold On Read
10
15
25
ns
tDHW
Data Hold on Read
5
—
—
ns
tDSPW
Data Strobe on Write
6
—
—
ns
tDSW
Data Setup on Write
10
—
—
ns
tRWH
R/W Hold after DS Rising
3
—
—
ns
tSWD
R/W Setup from DS Falling
3
—
—
ns
(1,2,3)
NOTES:
1. CL = 30pF
2. RL = 1K
3. High-Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL.
4. To achieve on clock cycle fast memory access, this setup time, tDSS should be met. Otherwise, worst-case memory access operation is determined
by tAKD.
DS
tDSPW
tCSH
tCSS
tCSS
tCSH
CS
tRWS
tRWS
tRWH
tRWH
R/W
tADH
tADS
A0-A15
tADH
tADS
VALID READ ADDRESS
VALID WRITE ADDRESS
tDHR
tDSW
tDHW
VALID WRITE
DATA
D0-D15
VALID READ DATA
tDDR
tAKD
tAKH
tAKD
tAKH
D TA
6160 drw17a
Figure 21. Motorola Non-Multiplexed Bus Asychronous Timing Register Access
33
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - SYNCHRONOUS BUS TIMING
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNITS
tADH
Address Hold
3
—
—
ns
tADS
Address Setup
3
—
—
ns
tBEH
Byte Enable Hold
3
—
—
ns
tBES
Btye Enable Setup
3
—
—
ns
tCD
Clock to Data
—
—
20
ns
tDHR(1,2,3)
Data Hold on Read
10
15
25
ns
tDHW
Data Hold on Write
3
—
—
ns
tDSW
Data Setup on Write
3
—
—
ns
tRWH
R/W Hold
3
—
—
ns
tRWS
R/W Setup
3
—
—
ns
tsCSH
CS Hold
3
—
—
ns
tsCSS
CS Setup
3
—
—
ns
NOTES:
1. CL = 30pF
2. RL = 1K
3. High-Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL.
4. To achieve on clock cycle fast memory access, this setup time, tDSS should be met. Otherwise, worst-case memory access operation is determined
by tAKD.
CLK ST-BUS
CLK GCI
tSCSS
tSCSH
tSCSS
tSCSH
tBES
tBEH
tBES
tBEH
CS
BEN
tRWS
tRWH
tADS
tADH
R/W
A0-15
tRWS
tRWH
tADS
tADH
WRITE
READ
tDSW tDHW
DATA-IN
Dn
tCD
DATA-OUT
Qn
tDHR
Figure 22. Synchronous Bus Timing
34
6160 drw18
IDT72V73263 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH WITH RATE MATCHING 16,384 x 16,384 CHANNELS
INDUSTRIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS - BYTE ENABLE
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNITS
tADH
Address Hold
3
—
—
ns
tADS
Address Setup
3
—
—
ns
tBEH
Byte Enable Hold
3
—
—
ns
tBES
Byte Enable Setup
3
—
—
ns
tCD
Clock to Data
—
—
20
ns
tDHR
Data Hold on Read
10
15
25
ns
tRWH
R/W Hold
3
—
—
ns
tRWS
R/W Setup
3
—
—
ns
tsCSH
CS Hold
3
—
—
ns
tsCSS
CS Setup
3
—
—
ns
(1)
NOTES:
1. CL = 30pF
2. RL = 1K
3. High-Impedance is measured by pulling to the appropriate rail with RL, with timing corrected to cancel time taken to discharge CL.
CLK ST-BUS
CLK GCI
tSCSS
tSCSH
tBES
tBEH
tSCSS
tSCSH
CS
BEL
tBES
tBEH
tRWS
tRWH
BEH
R/W
tRWH
tRWS
A0-15(3)
READ
READ
tADS
tADS
tADH
tADH
D0-7
D0-7
tCD
tCD
tDHR
tDHR
D8-15
D8-15
6160 drw19
Figure 23. Byte Enable
35
ORDERING INFORMATION
IDT
XXXXXX
Device Type
XX
Package
X
Process/
Temperature
Range
BLANK
Commercial (-40°C to +85°C)
BB
DR
Plastic Ball Grid Array (PBGA, BB208-1)
Plastic Quad Flatpack (PQFP, DR208-1)
72V73263
16.384 x 16.384 3.3V Time Slot Interchange Digital Switch with Rate Matching
6160 drw22
DATASHEET DOCUMENT HISTORY
06/30/2003
09/08/2003
10/28/2003
pgs. 9,14 and 33.
pgs. 1, 4, 5, 20, 28, 33 and 34.
pg. 1
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36
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