TI1 LM3450AMTX/NOPB Led drivers with active power factor correction and phase dimming decoder Datasheet

LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
LED Drivers with Active Power Factor Correction and Phase Dimming Decoder
Check for Samples: LM3450
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
•
•
•
The LM3450/50A is a power factor controller (PFC)
with separate phase dimming decoder. The PFC
regulates the output voltage while maintaining
excellent power factor. The phase dimming decoder
interprets the phase angle and remaps it to a 500Hz
PWM output. This device is ideal for implementing a
dimmable off-line LED driver for 10-100W loads.
1
2
Critical Conduction Mode PFC
Over-Voltage Protection
Feedback Short Circuit Protection
70:1 PWM Decoded From Phase Dimmer
Analog Dimming
Programmable Dimming Range
Digital Angle and Dimmer Detection
Dynamic Holding Current
Smooth Dimming Transitions
Low Power Operation
Start-Up Pre-Regulator Bias
Precision Voltage Reference
The phase dimming decoder has several unique
features. The input-output mapping is programmable
for design flexibility, while a dynamic filter and
variable sampling rate provide smooth uniform
dimming. A dynamic hold circuit ensures that the
phase dimmer angle is decoded properly while
minimizing extra power loss.
The LM3450A is identical to the LM3450 with the
exception of one circuit operation. The dynamic hold
current is sampled in the LM3450 while it
continuously operates in the LM3450A. This
difference between the two devices defines the
suitable applications for each. The following is a
general guideline for choosing the correct device:
• Any 120V designs with POUT > 15W - LM3450A
• Any 230V designs with POUT > 25W - LM3450A
• 120V 2-Stage designs with POUT < 15W - LM3450
• 230V 2-Stage designs with POUT < 25W - LM3450
APPLICATIONS
•
•
•
•
Dimmable Downlights, Troffers, and Lowbays
Large Form Factor Bulbs
Indoor and Outdoor Area SSL
Power Supply PFC
Typical Application
VREF
BIAS
VADJ
HOLD
FLT2
ZCD
FLT1
VCC
RETURN
EMI FILTER
SECONDARY
LED DRIVER
LM3450/50A
PWM
AC
INPUT
DIM
GATE
VAC
CS
COMP
GND
FB
ISEN
LED
LOAD
OPTICAL
ISOLATION
PWM
HOLD
RETURN
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
Connection Diagram
Top View
1
2
3
4
5
6
7
VREF
BIAS
VADJ
HOLD
FLT2
ZCD
FLT1
VCC
DIM
GATE
VAC
CS
COMP
8
FB
GND
16
15
14
13
12
11
10
ISEN
9
Figure 1. 16-Lead TSSOP
Package Number PW
PIN DESCRIPTIONS
Pin
2
Name
Description
Application Information
1
VREF
3V Reference
Reference Output: Connect directly to VADJ or to resistor divider feeding VADJ
and to necessary external circuits.
2
VADJ
Analog Adjust
Analog Dim and Phase Dimming Range Input: Connect directly to VREF to force
standard 70% phase dimming range. Connect to resistor divider from VREF to
extend usable range of some phase dimmers or for analog dimming. Connect to
GND for low power mode.
3
FLT2
Filter 2
Ramp Comparator Input: Connect a series resistor from FLT1 capacitor and a
capacitor to GND to establish second filter pole.
4
FLT1
Filter 1
Angle Decoder Output: Connect a series resistor to a capacitor to GND to
establish first filter pole.
5
DIM
500 Hz PWM Output
6
VAC
Sampled Rectified Line
Multiplier and Angle Decoder Input: Connect to resistor divider from rectified AC
line.
7
COMP
Compensation
Error Amplifier Output and PWM Comparator Input: Connect a capacitor to GND
to set the compensation.
8
FB
Feedback
Error Amplifier Inverting Input: Connect to output voltage via resistor divider to
control PFC voltage loop for non-isolated designs. Connect a 5.11kΩ resistor to
GND for isolated designs (bypasses error amplifier). Also includes over-voltage
protection and shutdown modes.
9
ISEN
Input Current Sense
10
GND
Power Ground
System Ground
11
CS
Current Sense
MosFET Current Sense Input: Connect to positive terminal of sense resistor in
PFC MosFET source.
12
GATE
Gate Drive
13
VCC
Input Supply
14
ZCD
Zero Crossing Detector
Demagnetization Sense Input: Connect a 100kΩ resistor to transformer/inductor
winding to detect when all energy has been transferred.
15
HOLD
Dynamic Hold
Open Drain Dynamic Hold Input: Connect to holding resistor which is connected
to source of passFET.
16
BIAS
Pre-regulator Gate Bias
Open Drain PWM Dim Output: Connect to dimming input of output stage LED
driver (directly or with isolation) to provide decoded dimming command.
Input Current Sense Non-Inverting Input: Connect to diode bridge return and
resistor to GND to sense input current for dynamic hold. Connect a 0.1µF
capacitor and Schottky diode to GND, and a 0.22µF capacitor to HOLD.
Gate Drive Output: Connect to gate of main power MosFET for PFC.
Power Supply Input: Connect to primary bias supply. Connect a 0.1µF bypass
capacitor to ground.
Pre-regulator Gate Bias Output: Connect to gate of passFET and through
resistor to rectified AC (drain of passFET) to aid with startup.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
VCC, HOLD, DIM, BIAS
-0.3V to 25.0V
HOLD Power
250 mW Continuous
BIAS Current
5.0mA Continuous
ZCD Current
+/- 10mA
COMP, FB, VAC, FLT1, FLT2, VREF, CS, VADJ
-0.3V to 7.0V
ISEN
-7.0V to 7.0V
GATE
-0.3V to 18V Continuous
-2.5V for 100ns
20.5V for 100ns
-1mA to +1mA Continuous
Continuous Power Dissipation
Internally Limited
Maximum Junction Temperature
Internally Limited
Storage Temperature Range
-65°C to +150°C
Maximum Lead Temperature (Solder and Reflow)
ESD Susceptibility
(1)
(2)
(3)
(4)
(4)
(3)
260°C
HBM
2kV
MM
200V
FICDM
750V
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified and do not imply ensured performance limits. For specified performance limits and associated
test conditions, see the Electrical Characteristics table. All voltages are with respect to the potential at the GND pin, unless otherwise
specified.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Refer to http://www.ti.com/packaging for more detailed information and mounting techniques.
Human Body Model, applicable std. JESD22-A114-C. Machine Model, applicable std. JESD22-A115-A. Field Induced Charge Device
Model, applicable std. JESD22-C101-C.
OPERATING CONDITIONS
(1)
VCC Range
8.5V to 20V
Junction Temperature Range
(1)
-40°C to +125°C
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified and do not imply ensured performance limits. For specified performance limits and associated
test conditions, see the Electrical Characteristics table. All voltages are with respect to the potential at the GND pin, unless otherwise
specified.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
3
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS (1)
Unless otherwise specified VCC = 14V. Specifications in standard type face are for TJ = 25°C and those with boldface type
apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Typical values represent the most likely
parametric norm at TA = TJ = +25°C, and are provided for reference purposes only.
Symbol
Parameter
Conditions
Min (2)
Typ (3)
Max (2)
Units
SUPPLY VOLTAGE INPUT (VCC)
VCC-RISE
Controller Enable Threshold
VCC Rising
12.2
13.0
13.6
VCC-FALL
Controller Disable Threshold
VCC falling
7.4
7.9
8.5
Glitch Filter Delay
9
Turn-on Delay
40
V
µs
IQ
VCC Quiescent Current
No Switching
1.6
IQ-SD
VCC Shutdown Current
VFB = 0V
515
625
mA
µA
2.50
2.57
V
µS
ERROR AMPLIFIER & COMPENSATION (FB, COMP)
VFB
FB Reference (Normal Operation)
GM
2.43
Input Bias Current
VFB = 2.5V
Transconductance
VFB =2.5V
Output Source / Sink Capability
FB Pull-up Current Source
VFB < 1.8V
100
115
161
60
85
110
43
51
59
COMP Pull-up Resistor
VCMP-B
COMP Low Threshold (Burst)
VCMP Falling
COMP Low Hysteresis
VFB-SD
Low Threshold (Shutdown)
FB Mid Threshold (EA Disabled)
150
VFB Falling
328
VTHM
kΩ
V
168
186
346
mV
368
20
FB High Threshold (Over-voltage)
COMP Pre-bias Source Current
5
VTHM -0.08
20
FB Mid Hysteresis
VFB-OV
µA
20
VFB Falling
FB Low Hysteresis
VFB-EAD
nA
69
1.20 x VFB
VCMP= 0.5V
Minimum COMP Voltage (Normal)
1.22 x VFB
V
415
µA
1.47
V
ANGLE DEMODULATION & MULTIPLIER (COMP, VAC)
VAC-DET
VAC Angle Detection Threshold
Angle Demodulation Delay Time
334
Both edges
0 to 5.5
COMP Dynamic Input Voltage Range
VTHM to
VTHM+2
Multiplier Gain (Includes Internal
Resistor Divider)
378
8
VAC Dynamic Input Voltage Range
VAC Input Impedance
KM
356
VAC = 3V, VCMP =
VTHM+1.5V
mV
µs
V
500
kΩ
0.5
1/V
ZERO CURRENT DETECTOR (ZCD)
VZCD-RIS
ZCD Input Threshold
VZCORising
Hysteresis
Delay to Output
1.45
1.5
1.55
V
150
200
250
mV
135
VZCD-H
Positive Clamp Voltage
IZCO = 1mA
6.0
VZCD-L
Negative Clamp Voltage
IZCO = –50µA
0.61
ns
V
PWM COMPARATOR (CS)
VOS
(1)
(2)
(3)
4
PWM Comparator Input Offset Voltage
30
mV
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified and do not imply ensured performance limits. For specified performance limits and associated
test conditions, see the Electrical Characteristics table. All voltages are with respect to the potential at the GND pin, unless otherwise
specified.
All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are
100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC)
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely norm.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS(1) (continued)
Unless otherwise specified VCC = 14V. Specifications in standard type face are for TJ = 25°C and those with boldface type
apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Typical values represent the most likely
parametric norm at TA = TJ = +25°C, and are provided for reference purposes only.
Symbol
Parameter
Conditions
Min (2)
PWM Comparator Input Bias Current
VLIM
Typ (3)
20
CS Current Limit Threshold
1.40
CS Delay to Output
1.50
Leading Edge Blanking (LEB) Time
Units
nA
1.60
V
100
ns
1
kΩ
140
ns
CS Blanking Sinking Impedance
tLEB
Max (2)
ANALOG ADJUST INPUT (VADJ)
VADJ-LP
VADJ Low Threshold (Low Power Mode)
VADJ Falling
56
75
mV
VADJ Low Hysteresis
50
VADJ Pull-up Current Source
1
µA
3
V
VADJ Open Voltage
VADJ Open
DYNAMIC HOLD CIRCUIT (HOLD, ISEN)
RDSON-HD
HOLD MosFET On-Resistance
VSEN-REF
ISEN Reference Voltage
ISEN Short to GND
22
30
42
Ω
162
200
232
mV
ISEN Bias Current
5
µA
PRE-REGULATOR GATE DRIVE OUTPUT (BIAS)
VBIAS
BIAS High Voltage @ 100µA
VCC < VCC-FALL
18.8
21
22.6
BIAS Low Voltage @ 100µA
VCC > VCC-RISE
13.5
14
14.5
V
GATE DRIVER OUTPUT (GATE)
VGATE-H
GATE Voltage High
IGATE = 20mA
11.5
IGATE = 200mA
10.5
GATE Pull Down Resistance
2
V
Ω
8
(4)
GATE Peak Current
±1.5
A
REFERENCE VOLTAGE OUTPUT (VREF)
VREF
Reference Voltage
No Load
Current Limit
2.85
3
3.15
V
1.5
2.0
3.0
mA
DIMMING OUTPUT (DIM, FLT1, FLT2)
FLT1 Output Impedance
Triangle Waveform Compared to FLT2
Standby Mode
500
Transition mode
1.6
High
1.49
Low
fDIM
DIM Frequency
kΩ
V
15
180
460
mV
700
Hz
OFF-TIMERS
tOFF-MAX
Maximum Off-Time (Normal Operation)
340
tOFF-LP
Off-Time (Low Power Mode)
42
µs
THERMAL SHUTDOWN
Thermal Limit Threshold
(4)
Thermal Limit Hysteresis
160
°C
20
THERMAL RESISTANCE
θJA
Junction to Ambient
θJC
Junction to Case
(4)
(5)
TSSOP-16 (4) (5)
38.0
10.0
°C/W
These electrical parameters are specified by design, and are not verified by test.
Junction-to-ambient thermal resistance is highly board-layout dependent. In applications where high maximum power dissipation exists,
namely driving a large MOSFET at high switching frequency from a high input voltage, special care must be paid to thermal dissipation
issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C for Q1, or
150°C for Q0), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance
of the package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
5
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
TA=+25°C and VCC = 14V unless otherwise specified
Leading Edge Blanking vs. Junction Temperature
150
36
146
32
142
tLEB (ns)
RDS-ON ( )
HOLD RDSON vs. Junction Temperature
40
28
24
20
-50
138
134
-14
22
58
94
130
-50
130
-14
94
130
TEMPERATURE (°C)
Figure 2.
Figure 3.
Current Limit Threshold vs. Junction Temperature
VAC = 3V; VCMP = VTHM + 1.5V
Multiplier Gain vs. Junction Temperature
VAC = 3V; VCMP = VTHM + 1.5V
1.505
0.510
1.503
0.504
1.501
0.498
1.499
0.492
1.497
0.486
1.495
-50
-14
22
58
94
0.480
-50
130
-14
TEMPERATURE (°C)
22
58
94
130
TEMPERATURE (°C)
Figure 4.
Figure 5.
Transconductance
VFB = 2.5V; ΔVFB = 50mV
BIAS Voltage vs. Junction Temperature
High @ VCC < VCCFALL; Low @ VCC > VCCRISE
140
25
130
22
120
19
VBIAS (V)
GM (S)
58
KM
VLIM (V)
TEMPERATURE (°C)
22
110
BIAS High
16
BIAS Low
100
90
-50
13
-14
22
58
94
130
10
-50
TEMPERATURE (°C)
22
58
94
130
TEMPERATURE (°C)
Figure 6.
6
-14
Figure 7.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA=+25°C and VCC = 14V unless otherwise specified
VCC UVLO Threshold vs. Junction Temperature
Shutdown Current vs. Junction Temperature
14
580
13
560
11
540
IQ (#A)
VCC (V)
UVLO Rising
10
UVLO Falling
8
7
-50
-14
22
58
520
500
94
480
-50
130
-14
TEMPERATURE (°C)
22
FB Reference vs. Junction Temperature
2.510
3.02
2.506
3.01
2.502
VFB (V)
VREF (V)
VREF Reference vs. Junction Temperature
3.00
2.498
2.99
2.494
22
58
94
2.490
-50
130
-14
TEMPERATURE (°C)
22
58
94
130
TEMPERATURE (°C)
Figure 10.
Figure 11.
ISEN Reference vs. Junction Temperature
VAC Detection Threshold vs. Junction Temperature
205
357.0
203
356.6
VVAC-REF (mv)
VSEN-REF (mv)
130
Figure 9.
3.03
-14
94
TEMPERATURE (°C)
Figure 8.
2.98
-50
58
201
199
197
195
-50
356.2
355.8
355.4
-14
22
58
94
130
355.0
-50
TEMPERATURE (°C)
-14
22
58
94
130
TEMPERATURE (°C)
Figure 12.
Figure 13.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
7
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA=+25°C and VCC = 14V unless otherwise specified
Transconductance vs. VFB
Current Sense Threshold vs. VCOMP and VAC
250
4.90
200
3.92
150
2.94
VCS (V)
GM (Ps)
VAC = 4V
100
1.96
50
0.98
VAC = 3V
VAC = 2V
VAC = 1V
VAC = 0.5V
VAC = 0.1V
0
1.5
2.0
2.5
3.0
0.00
1.0
3.5
1.8
2.6
3.4
VFB (V)
VCMP (V)
Figure 14.
Figure 15.
4.2
5.0
Decoder Mapping from VAC to DIM
1.0
DIM PIN DUTY CYCLE
0.8
0.5V
0.6
0.4
1V
1.5V
2V
2.5V
0.2
0.0
VADJ=3V
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
DEMODULATED VAC PIN DUTY CYCLE
Figure 16.
8
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
BLOCK DIAGRAM
*LM3450 and LM3450A are identical except where indicated in blue
DIM
FLT2
VCCUV
+
-
FLT1
VCCUV
500 Hz Triangle
1 PA
VADJ
75 mV
+
-
+
-
3V
Low Power
VREF
Amplitude Adjust
+
-
HOLD
5 PA
SAMPLE and
LOG REMAP
VAC
500 k:
DOUT
ISEN
40 k:
LM3450A has
Continuous Hold
Multiplier
1.4V
+
-
Burst
LEB
+
-
R
GND
Sampled Hold
DIN
2R
+
-
Transition
ANGLE DIN
DOUT
DEMOD
COMP
PRE-BIAS
COMP
PWM
50 PA
2.7V
FB
2.5V
346mV
168mV
3V
1 k:
Current Limit
5V
5 k:
Zero Crossing
+
+
-
Error Amp
Disable
+
-
Shutdown
+
-
Over Voltage
+
+
-
THERMAL
SHUTDOWN
1.5V
1.5V
ZCD
6V
Burst
LOGIC
&
CONTROL
CS
1.5V
INTERNAL
REGULATORS
VCC
VCC UVLO
VCCUV
10V
BIAS
Low Power
14V
GATE
R Q
6V
S
VCCUV
Q
Timer Expired
Low Power
MAXIMUM
OFF-TIME
(340 Ps, 42 Ps)
Reset Off-Timer
LEB
140 ns
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
9
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
RBS
CPFC
VREF
CREF
RETURN
DSW
BIAS
QPS
RAD2
+
COUT
RHLD
VADJ
HOLD
FLT2
ZCD
FLT1
VCC
FLYBACK
OUTPUT
-
RAD1
RZCD
RF2
CF2
AC
INPUT
CF1
RF1
CVCC
LM3450/50A
PWM
TO OPTO
DIM
GATE
VAC
CS
24V
QSW
RAC2
RCS
RAC1
COMP
FEEDBACK
FROM OPTO
GND
CHLD
CCMP
FB
CSEN
RSEN
ISEN
RFB1
RETURN
Figure 17. Typical Flyback Application
THEORY OF OPERATION
The LM3450/50A is a single device with both power factor control (PFC) and phase dimming decoder functions.
This device is designed to control isolated flyback converters and provide active power factor correction. In
addition to being a PFC, the LM3450/50A can interpret a phase dimming (frequently called triac dimming) input
and provide a corresponding PWM output to properly dim an LED load. This combination of features provides an
excellent method to convert a standard AC mains input to a dimmable LED output of 10-100W. It should be
noted that the LM3450/50A can control a boost converter in a similar manner. However, this datasheet will focus
mostly on the flyback topology due to the high demand for isolated LED driver applications. Discussion of the
LM3450/50A functionality will refer to Figure 17 component designators.
The PFC control operates in critical conduction mode (CRM) using zero crossing detection (ZCD) to terminate
the off-time. The PFC portion of this device includes an error amplifier, multiplier, current sense circuit, zero
crossing detector, and gate driver. The internal error amplifier is used for feedback of the output voltage in nonisolated designs. However, it can be disabled for isolated designs where the error amplifier needs to be on the
secondary side.
The phase dimmer decoder detects the dimming angle of the rectified AC line, decodes, filters and remaps it to a
500Hz PWM output. The PWM output can then be sent directly, or through optical isolation, to the dimming input
of a second stage LED driver. To ensure the decoder properly interprets the dimming angle, dynamic hold is
provided which prevents the phase dimmer from misfiring. The input current is sensed and when the current
drops below a preset minimum, the system adds more current.
Both the dynamic hold and the decoder are sampled synchronously in the LM3450 to reduce the overall
efficiency drop due to the additional hold current. When a decoding sample period occurs, the dynamic hold is
activated to ensure a proper angle is decoded. Because of this sampling method, non-sampled cycles will
potentially cause the phase dimmer to misfire but should not affect the output LED current regulation.
10
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
For higher power applications, where the dynamic hold provides much less current on average, the LM3450A
can be used. The LM3450A has continuous dynamic hold which prevents the dimmer from ever misfiring. This is
extremely helpful when designing for single stage solutions, where there is no second stage to provide good line
rejection. The continuous dynamic hold is also helpful for the higher power two stage applications where the
input capacitance is larger.
One last feature of the phase decoder is a dynamic filter that, combined with the variable sampling rate, provides
fast, smooth dimming transitions.
Switching Regulator
EMI
Bridge Rectifier
Energy
Storage
VREF
+
+
+
VREF
Figure 18. PFC System Architecture
PFC BACKGROUND
Power factor (PF) is a number between 0 and 1 that indicates how well energy is transmitted from input to output
of a system. It can be described by average power (PAVG), RMS voltage (VRMS), and RMS current (IRMS):
PF =
PAVG
VRMS x IRMS
(1)
Or by distortion factor (KDIST) and displacement factor (KDISP):
PF = K DIST x K DISP
(2)
With a purely resistive system, PF = 1. The addition of reactive elements necessary in any converter, such as
EMI filters and energy storage, will induce some amount of displacement (phase shift between the input voltage
and input current). The addition of switching devices will also create distortion (energy present in the harmonics
relative to the switching frequencies). These non-idealities decrease the PF towards zero.
Active power factor correction attempts to make the input impedance look as resistive as possible to the power
source. Since the output of the converter is usually a regulated voltage or current, there is a need for large
energy storage elements to remove the twice line frequency (100Hz or 120Hz) ripple. A power factor control
architecture, as shown in Figure 18, has very little capacitance at the input. Instead, the twice line frequency
content is removed with large energy storage capacitance at the output.
Using this control architecture, the converter is able to provide two important functions at the same time:
• Shape the input current
• Regulate the output voltage
The PFC control approach requires two separate control loops to achieve both functions: a fast loop which
shapes the input current, and a slow loop that regulates the output voltage.
The fast control loop shapes the input current to have the same sinusoidal shape as the AC input voltage.
Assuming both are perfect sinusoids with zero distortion or phase shift, the power factor will be perfect (unity).
Unfortunately, distortion is always present in switching converters. An input filter, which is required to comply with
EMI standards, helps to attenuate the switching content, thereby reducing distortion. However, the added filter
capacitance will increase the phase shift at the same time. Though perfect PF is not achievable within real
applications, extremely high PF (>.99) is possible using most active PFCs.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
11
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
The output voltage has to be regulated slowly to ensure the converter ignores the twice line frequency ripple
present on the output. Therefore, the voltage loop containing the error amplifier should have a bandwidth at least
an order of magnitude slower (<20Hz is common). Sometimes the bandwidth is increased to improve transient
response, which is the case with off-line dimmable LED drivers. Though PF decreases with the increase in
bandwidth, high PF (>.95) is still possible.
iL (t)
IL-MAX
IL
0
t
tON = DTS
tOFF = (1-D)TS
TS
Figure 19. Basic CRM Inductor Current Waveform
CRM BACKGROUND
During critical conduction mode (CRM), a converter operates at the boundary of continuous conduction mode
(CCM) and discontinuous conduction mode (DCM). This is usually implemented as follows. The main switching
MosFET (QSW) is turned on and the inductor current rises to a peak threshold. QSW is then turned off and the
current falls until it reaches zero. At this point, QSW is turned on and the cycle repeats. Near zero voltage
switching, enabled by the inductor current return to zero, gives CRM topologies an efficiency improvement
compared to CCM topologies. Figure 19 shows the resulting inductor current waveform, where the average
inductor current (IL) is half of the peak current (IL-MAX).
In a CRM flyback PFC application, the rectified AC input is fed forward to the control loop, creating a sinusoidal
primary peak current envelope (IP-pk) as shown in Figure 20. The secondary peak current envelope (IS-pk) will
simply be a scaled version of the primary according to the turns ratio of the transformer. Assuming good
attenuation of the switching ripple via the EMI filter, the average input current (IIN), represented by the red line in
Figure 20, can also be approximated as a sinusoid proportional to the duty cycle (D(t)):
Iin(t) =
IP- PK x D(t)
2
(3)
Since CRM operation is hysteretic and the input voltage is fed-forward, the input current shaping loop is as fast
as possible. Only the output voltage needs to be regulated with a narrow bandwidth error amplifier, which greatly
simplifies the system dynamics.
12
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
i
IS-PK
IP-PK
IIN-PK
tON
t
TSW
Figure 20. CRM Flyback Current Waveforms
Rectified AC
L
LM3450/50A
VAC
RAC2
+
1/3
COMP
50 P$
5V
2.5V
OPTO
(Isolated)
VOUT
(Nonisolated)
5 k:
+
-
2.7V
FB
RFB2
QSW
LOGIC
CCMP
RFB1
1.5V
GATE
Multiplier
RAC1
ZCD
RZCD
CS
+
RCS
Error Amp
Disable
346mV
+
-
168mV
+
-
Shutdown
+
-
OVP
3V
GND
Figure 21. PFC Control Circuit
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
13
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
POWER FACTOR CONTROLLER
The LM3450/50A uses CRM control to regulate the output voltage and provide power factor correction. In a nonisolated boost topology, an external voltage divider (RFB1, RFB2) is used to sense the output voltage, as shown in
Figure 21. The divider is connected to the inverting input (FB) of the internal error amplifier. The LM3450/50A
regulates the feedback voltage (VFB) to 2.5V in a closed loop fashion.
The FB pin has a shutdown mode to protect against a feedback short and an OVP mode which terminates
switching when output over-voltage is sensed.
With the FB shutdown mode, it is necessary to have a preliminary biasing method for the output of the error
amplifier (COMP). Otherwise, the converter would never start. COMP is pre-biased with a 415µA current until the
voltage at COMP (VCMP) exceeds the minimum operational voltage (VTHM).
For an isolated flyback topology, where the error amplifier is on the secondary, the LM3450/50A internal error
amplifier can be bypassed using a single 5.11kΩ resistor (RFB1) from FB to GND. This engages an internal 5kΩ
pull-up resistor at COMP. COMP can then be connected directly to the optical isolation as shown in Figure 21.
COMP and the sensed rectified AC input voltage (VAC), provided via a resistor divider (RAC1, RAC2), are inputs to
the multiplier. The current through the sense resistor (RCS) produces a voltage (VCS) that is compared to the
multiplier output. When VCS exceeds the multiplier output, QSW is turned off. The peak detect threshold and the
current slope during an on-time are proportionally changing which yields a nearly constant on-time, shown in
Figure 20:
t ON =
L x IP- PK
VIN - PK
(4)
Once QSW is turned off, the LM3450/50A waits until the inductor (boost) or transformer (flyback) is demagnetized
to turn QSW on again. Demagnetization, sensed at ZCD, occurs when the current through the magnetic
component falls to zero. Since the output voltage is regulated, the slope of the current remains relatively constant
and, coupled with the variable peak detect, creates a variable off-time.
The sinusoidal peak detection envelope creates an input current that is sinusoidal and in phase with the input
voltage providing excellent PF. The PWM comparator 30mV input offset voltage ensures current is drawn at the
zero-crossings of the AC line, reducing distortion and further improving PF.
CURRENT SENSE
The LM3450/50A senses current through QSW via a sense resistor (RCS) between the source of QSW and GND.
When VCS exceeds the output of the multiplier (VMLT), QSW is turned off. VMLT is variable over the line cycle and is
a function of the scaled rectified AC voltage (VAC), the COMP voltage referenced from its operational minimum
(VCOMP-VTHM), the multiplier gain (KM) and the PWM comparator offset (VOS):
VMLT = KM x VAC x (VCOMP - VTHM ) + VOS
(5)
The LM3450/50A has a leading edge blanking (LEB) circuit that pulls the current sense input to the PWM
comparator low for 140µs at the beginning of each on-time. The LEB blanks the current spike and associated
ringing due to the turn-on transient of QSW, limiting the minimum achievable duty cycle.
OVER CURRENT PROTECTION
The LM3450/50A has a current limit threshold (VLIM = 1.5V) at CS to protect the system from over-current
conditions. If VCS exceeds VLIM, QSW is immediately turned off until ZCD triggers a new on-time.
14
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
VSW
VRING
VR
VIN
t
VZCD
1.3V
t
Figure 22. ZCD Waveforms for Flyback Design
ZERO CURRENT DETECTION
ZCD is implemented with a 100kΩ resistor from the ZCD pin to a coupled winding on the transformer or inductor
as shown in Figure 21. This winding is also used to bootstrap VCC after start-up. When QSW turns off, the voltage
at the ZCD pin (VZCD) increases as energy is transferred through the auxiliary winding. The circuit arms when
VZCD exceeds 1.5V. Then, when the energy is fully transferred, VZCD decreases towards zero. When VZCD falls
below 1.3V, the transformer is assumed to be demagnetized, the circuit disarms, and QSW is turned back on as
shown in Figure 22. The ZCD pin voltage will remain low until QSW is turned off via peak detection and the cycle
repeats.
SWITCHING FREQUENCY
With a constant on-time and variable off-time, there is a variable switching frequency:
·
§V
fSW = D(t) x ¨¨ IN-PK ¸¸
L
x
I
P - PK ¹
©
(6)
Figure 20 shows that the minimum switching frequency occurs at the peak of the rectified AC waveform, while
the maximum switching frequency occurs at the valley.
ERROR AMPLIFIER
The LM3450/50A internal error amplifier is used for non-isolated designs (boost) where the output voltage can be
directly sensed, via a resistor divider, at the FB pin. The FB pin is the inverting input of the trans-conductance
amplifier which is regulated to 2.5V. The COMP pin is the output of the amplifier and external compensation is
placed from COMP to GND in the form of a single capacitor (CCMP) as shown in Figure 21, a series resistor and
capacitor, or both. The output of the amplifier sources or sinks current as necessary to force the inputs of the
amplifier to be equal. The compensation method depends upon the transient performance desired and requires a
loop gain analysis. This analysis can be somewhat complex and cumbersome. A detailed analysis can be found
Application Notes AN-2098 (literature number SNVA463) and/or AN-2150 (literature number SNVA485).
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
15
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
If the COMP pin voltage (VCMP) falls below 1.4V at any time, the device enters burst mode where the GATE is off
for 340µs then is turned on. If VCMP is still below 1.4V at the end of the on-time then another 340µs off-time
occurs. However, if VCMP has risen above 1.4V, the converter continues switching until it falls below the threshold
again. This feature is necessary to prevent the output of the converter from rising arbitrarily high because the
minimum on-time of the device prevents less energy transfer.
The LM3450/50A also implements both feedback short circuit protection and output over-voltage protection
(OVP) functions at the FB pin. If VFB exceeds 3V, then OVP is engaged and the part stops switching until VFB
falls below 3V. In the same manner, if VFB falls below 168mV, then shutdown is engaged and switching stops
until VFB exceeds 188mV.
The flyback topology is frequently used to provide isolation from input to output. Since, the current transfer ratio
(CTR) of standard optical isolation varies over temperature, proper regulation using primary error amplifiers is
difficult. An error amplifier is usually placed in the secondary to regulate the output voltage accurately. To
accommodate isolated designs, the LM3450/50A internal error amplifier can be bypassed by placing a 5.11kΩ
resistor from FB to GND. This engages a 5kΩ pull-up resistor from COMP to an internal 5V rail.
SECONDARY ERROR AMPLIFIER
For isolated designs, the error amplifier on the secondary should take the form of a proportional integral (PI)
compensator. The amplifier is frequently implemented with an LMV431. The output voltage resistor divider (RFB1,
RFB2) provides the sensed output voltage to the LMV431 inverting input. The PI compensation is achieved by
connecting RSC and CSC in between the LMV431 input and output, shown in Figure 23. In addition, CCMP is
placed from COMP to GND on the primary for higher frequency noise attenuation.
In addition to the basic error amplifier, a soft-start circuit can be implemented using a capacitor, two diodes and a
Zener diode as shown in Figure 23. This secondary softstart circuit has no restart mechanism, therefore a
primary side softstart is recommended as described in the SOFTSTART section of this document.
LM3450/50A
5V
5k
FB
VSB
COMP
RFB
SOFT
START
VOUT
RSBS
OPTO
RFB2
CCMP
RSC
CSC
LMV431
RFB1
Figure 23. Secondary Error Amplifier
PRECISION VOLTAGE REFERENCE
The LM3450/50A provides a 3V voltage reference (VREF) for biasing the VADJ pin as well as any external circuitry.
VREF is regulated once VCC exceeds 3V. There is a 2mA current limit for the reference. A 10nF ceramic bypass
capacitor should be placed from VREF to GND.
16
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
LOW POWER SHUTDOWN
The LM3450/50A can be placed into a low power shutdown by grounding the VADJ pin (any voltage below 75mV).
During low power shutdown, the device will turn on the GATE for one cycle followed by a fixed off-time of 42µs
and the cycle repeats. During shutdown, the DIM output will be high (zero light output) since the buffer rail at
FLT1 will be at or near zero. This feature is designed to hold up the PFC output voltage while removing the load
(turning the LEDs off).
THERMAL SHUTDOWN
Internal thermal shutdown circuitry is provided to protect the IC in the event that the maximum junction
temperature is exceeded. The threshold for thermal shutdown is 160°C with a 20°C hysteresis. During thermal
shutdown GATE is disabled.
(a)
(b)
DELAY
(c)
DELAY
Figure 24. Phase Dimming Waveforms
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
17
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
PHASE DIMMER OPERATION
A simplified schematic of a phase dimmer is shown in Figure 25. An RC network consisting of R1, R2, and C1
delay the turn-on of the triac until the voltage on C1 reaches the trigger voltage of the diac. Increasing the
resistance of the potentiometer (wiper moving downward) increases the turn-on delay which decreases the ontime or “conduction angle” of the triac (θ). This reduces the average power delivered to the load.
FORWARD PHASE DIMMER
BRIGHT
R1MAX
250 k:
DIM
R2
3.3 k:
TRIAC
DIAC
C1
100 nF
AC
MAINS
LOAD
Figure 25. Basic Forward Phase Dimmer
Phase dimmer voltage waveforms are shown in Figure 24.
Figure 24a shows the full sinusoid of the input voltage. Even when set to full brightness; few dimmers will provide
100% conduction angle.
Figure 24b shows a waveform from a forward phase dimmer. The off-time can be referred to as the firing angle
and is simply 180° – θ.
Figure 24c shows the waveform of a reverse phase dimmer (also called an electronic dimmer in the lighting
industry). These typically or more expensive, microcontroller based dimmers that use switching devices other
than triacs. Note that the conduction angle starts from the zero-crossing, and terminates some time later. This
method of control reduces the noise spike at the transition.
Any form of phase dimming modulates the incoming AC waveform by chopping part of the sinusoid, reducing the
average power to the load. These dimmers work very well with standard incandescent bulbs, but not with power
converters. A converter attempts to regulate the load in with presence of any input, effectively ignoring the phase
angle. To implement a dimmable converter, the angle must be sensed at the input, decoded and used to properly
control the LED current regulator.
18
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
VCC
Rectified AC
RAC2
0-3V
Analog
Input
RAC1
VSB
RPB
OPTO
PWM OUT
VREF VADJ
VAC
ANGLE
DEMOD
DIM
500 Hz
RSB
+
3V
REF
FLT2
DIN
500k
SAMPLE / REMAP DOUT
DOUT
FLT1
RF1
RF2
CF1
Transition
CF2
DIN
LM3450/50A
Figure 26. Dimming Decoder Circuit
PHASE DIMMING DECODER
The LM3450/50A uses the rectified AC line voltage to interpret the conduction angle. Figure 26 shows the
LM3450/50A decoder circuit with associated external circuitry. The rectified AC line voltage is scaled via a
resistor divider (RAC1, RAC2) and connected to the VAC pin. VAC is compared to a 356mV reference to generate a
twice line frequency PWM signal with corresponding duty cycle as shown in Figure 27.
356 mV
VAC
DIN
Figure 27. Phase Angle Demodulation
For best results, RAC1 and RAC2 are suggested to be sized so that the VAC voltage crosses the 356mV threshold
when the rectified AC line is as follows:
• 120V systems: 25V to 45V
• 230V systems: 40V to 70V
The demodulated duty cycle is sampled and logarithmically remapped to a 300Hz PWM signal improving the
resolution of low dimming levels to the human eye. A minimum duty cycle limits the maximum achievable
contrast ratio to approximately 70:1. The remapped PWM signal is buffered and output at FLT1 with amplitude
equal to VADJ as shown in Figure 28.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
19
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
VADJ
VFLT2
VFLT1
Figure 28. FLT1 to FLT2 Mapping
The FLT1 signal is routed through a 2 pole low pass filter (RF1, CF1, RF2, CF2), as shown in Figure 26, to remove
the twice line frequency ripple. The resulting analog signal at FLT2 is compared to a 500Hz Triangle wave to
create the inverted PWM signal at the DIM pin as shown in Figure 29:
VFLT2
VDIM
Figure 29. FLT2 to DIM Mapping
This PWM signal at the DIM pin can be used as the dim input to a secondary LED driver. DIM is an open drain
output designed for isolated solutions. Optical isolation is used to transmit signals across the isolation boundary.
With most opto-isolators, the edge rate is dependent on the amount of drive current through the photodiode. The
open-drain configuration allows the primary bias supply (VCC) to provide the current as shown in Figure 26. The
choice of resistor (RPB) between VCC and the photodiode anode will set the drive current. This enables the user
to trade-off PWM accuracy with system efficiency.
The open drain configuration also ensures that the secondary has a resistor from the phototransistor’s emitter to
secondary ground (not from collector to secondary bias). During system turn-off, this prevents an undesired LED
blink because the secondary stage LED driver is forced off.
A variable sample rate and dynamic filter ensure fast, smooth dimming transitions (movement of the dimmer)
while maintaining robust flicker-free behavior when the dimmer is static. The sample rate depends on past and
present angle information. The dynamic filter is a dual mode filter. During standby mode, when a transition has
not been made and the dimmer is static, a 500kΩ series resistor is connected between the buffered output and
FLT1 as shown in Figure 26.
The 500kΩ resistor is shorted when the LM3450/50A senses a large transition of the dimmer. This increases the
filter speed while the dimmer is transitioning between levels to improve response time.
The FLT1 and FLT2 poles created by each RC pair (RF1 and CF1, RF2 and CF2) should be set as follows:
• CF1 and CF2 can be 1µF ceramic capacitors for all designs.
• RF1 and RF2 should be set between 15kΩ (~10Hz) and 75kΩ (~2Hz).
2 Hz poles provide a “smooth fade” while 10Hz poles create a “snappy” response.
These component values ensure that the static filter condition in standby mode has 1 pole approximately a
decade lower than the nominal in order to provide good noise immunity to the system.
20
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
DIM PIN DUTY CYCLE (INVERTED)
1.2
VADJ=3V
1.0
2.5V
2V
0.8
0.6
1.5V
0.4
1V
0.2
0.5V
0.0
0.0
0.2
0.4
0.6
0.8
1.0
LM3450/A DEMODULATED VAC PIN DUTY CYCLE
Figure 30. Complete Decoder Mapping
Since the buffered decoder output has amplitude equal to VADJ and the resulting PWM signal is filtered into an
analog voltage at FLT2, the VADJ pin can be used to change the mapping as shown in Figure 30. The maximum
LED current (DIM = 0) when VADJ = 3V corresponds to decoded angles of 70% or greater. Some dimmers have a
maximum angle greater than this. If VADJ is reduced to 2.5V, the maximum LED current will correspond to an
angle of 80% and at VADJ = 2V the maximum will occur at a decoded angle of 95%.
The VADJ pin can also be used to implement a standard analog adjust function. If the demodulated phase angle
at VAC is above 85%, then the fast filter is always enabled (500kΩ shorted) and the VADJ pin can solely be used
to scale the DIM pin duty cycle. When VADJ is pulled below 75mV the part enters low power shutdown so the
maximum attainable contrast ratio using VADJ only is approximately 40:1.
Both FLT1 and FLT2 have pull-down MosFETs that are turned on when VCC UVLO falling threshold is triggered.
This provides a quick discharge path for the capacitors and eliminates the possibility of an undesired light level at
the next startup.
Rectified AC
RBS
QPS
QPS
thermal
protection
circuit
Connect if thermal
protection circuit is
not desired
3904
15k
BIAS
AC
AC
10k
NTC
RHLD
CHLD
HOLD
5 P$
ISEN
40 k:
+
-
GND
-
VSEN
+
RSEN
CSEN
Sample
LM3450/50A
Figure 31. Dynamic Hold Circuit
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
21
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
DYNAMIC HOLD
A forward phase “triac” dimmer requires a minimum amount of current to be flowing through it during the entire
conduction angle. This is referred to as hold current. If the minimum hold current requirement is not met, the triac
will shut off (misfire). During normal operation, the converter will demand some amount of input current.
However, at any point during the cycle, the input current can be low enough to cause a misfire.
During an LM3450/50A sampling period, the triac should not misfire or the decoded angle will be inaccurate as
shown in Figure 32. Since the triac is asymmetrical phase-to-phase, misfires can occur at different points in the
waveform. After the triac misfires, the voltage returns to zero exponentially. This can create a large difference
between decoded angles which can be observed as a “fluttering” of the light.
Misfire
356 mV
VAC
Original
Angle
DIN
1
2
Figure 32. Forward Phase Waveform
To ensure the triac does not misfire during a sampling period and the angle is correctly decoded, a dynamic hold
function is enabled. The input current is sensed with a resistor (RSEN) from GND to ISEN (the return of the full
bridge rectifier). If the voltage across this resistor is less than 200mV, the device adds holding current via the
HOLD circuitry to maintain 200mV across RSEN.
The hold current is added by linearly adjusting the gate voltage of QHLD as shown in Figure 31. As the gate
voltage of QHLD is increased, the HOLD pin voltage decreases, forcing a voltage across the resistance (RHLD)
from the source of QPS to HOLD. This extra current is drawn from the input through the triac, but is not
processed by the converter. Figure 33 shows a typical dynamic hold waveform of the LM3450 where interval 1 is
a non-sampled conduction angle, 2 is the firing angle, and 3 is a sampled conduction angle. It should be noted
that using the LM3450A will ensure every conduction angle looks like interval 3 in Figure 33.
Misfire
Added
Hold
Current
IIN-MIN-REG
IIN
1
2
3
~VCC
VHOLD
1
2
Figure 33. Dynamic Hold Waveform
22
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
The dynamic hold function is also necessary for reverse phase dimmers, but for a different reason. Reverse
phase dimmers do not use triacs, therefore they do not require a minimum “holding” current. Instead, they need
what is commonly called bleeder current. When a reverse phase dimmer turns off, the AC voltage is at a high
value. There is an RC time constant associated with discharging the total effective input capacitance (EMI
capacitors, PFC capacitor, damper capacitance). The decoder does not record the angle until the voltage
reaches the 356mV threshold. This can cause the decoded angle to be much larger than it actually is and
dependent on the RC time constant as shown in Figure 34.
Turn-off
no bleeder
Turn-off
with bleeder
356 mV
VAC
DIN
1
2
Figure 34. Reverse Phase Waveforms
The dynamic hold will quickly bleed off the excess charge in an attempt to regulate the voltage across RSEN. This
will preserve the accuracy of the decoded phase angle.
During the conduction angle (θ), dynamic hold is enabled only during a sample period for the LM3450. However,
during the firing angle (delay time), dynamic hold is always enabled with the LM3450. This will ensure the
rectified line voltage does not begin to rise due to leakage currents through the phase dimmer. Again, with the
LM3450A the dynamic hold is continuously active during all conduction and firing angles.
The minimum regulated input current can be calculated:
IIN- MIN-REG =
200 mV
RSEN
(7)
The maximum possible additional holding current (which can occur when HOLD is still transitioning usually at the
rising edge of the triac firing) can be approximated:
IHOLD-MAX =
VCC
RHLD + 30 :
(8)
It is recommended that the maximum hold current is set 10-15% higher than the minimum regulated input
current.
A minimum of 0.1µF capacitance should be placed between ISEN and HOLD to limit the bandwidth of the dynamic
hold circuit to well below the switching frequency. However, if too large a capacitor is used, the bandwidth will be
too low to respond to line transients. A maximum of 0.47µF should ensure good performance.
Finally, a small Schottky diode should be placed from GND to ISEN to absorb the large current spikes associated
with the triac firing edge. This diode should have a forward voltage above 200mV at the worst-case operating
temperature so that it won’t interfere with dynamic hold regulation.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
23
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
THERMAL PROTECTION
With the LM3450A, QPS has to dissipate more power than with the LM3450. During worst case conditions such
as open LED load, the converter will be demanding very little current regardless of the triac position. If the phase
dimmer conduction angle is large and the load is not present, QPS has to dissipate many watts since the dynamic
hold is attempting to regulate the current to ten's of mA. Using the LM3450, this is nominally not a problem since
it is sampling the dynamic hold infrequently. However, the LM3450A is drawing the hold current every cycle
which becomes a problem very quickly. It should be noted that If the input AC line is very noisy, the VAC input to
the decoder could have enough variation in steady state to cause the decoder to think the dimmer is transitioning
all of the time. This would increase the sampling rate dramatically, putting much more thermal strain on the
passFET in LM3450 applications as well.
To mitigate these problems, a thermal protection circuit should be implemented on the LM3450A designs (and
can be on the LM3450 designs as well) as shown in red in Figure 31. The NTC thermistor should be placed on
the opposite side of the PCB directly under the drain of QPS. This will provide the best thermal coupling while
maintaining the necessary high voltage spacing constraints. At startup the NTC is at a high resistance value,
turning the PNP fully on which provides the dynamic hold path. As the NTC heats up the resistance decreases
and the base voltage increases. Eventually, the PNP will transition into linear mode and the effective resistance
from collector to emitter will increase. This will decrease the maximum holding current, thereby decreasing the
thermal stress on QPS. Given enough headroom, the circuit should reach thermal equilibrium in a safe controlled
manner.
Since this method of thermal protection linearly reduces the maximum hold current with increasing temperature,
the foldback will not be perceptible to the consumer. Instead, the result of the foldback will simply be a reduction
of contrast ratio, meaning the minimum achievable LED current will increase as the temperature increases
beyond the foldback level.
Rectified AC
RBS
AC
AC
QPS
RETURN
CVCC
BIAS
14V
6V
24V
VCC
QSW
VCC UVLO
VCCUV
LM3450/50A
Figure 35. Primary Bias Circuitry
PRIMARY BIAS SUPPLY
The LM3450/50A requires a supply voltage at VCC, not to exceed 25V. The device has VCC under-voltage lockout
(UVLO) with rising and falling thresholds of 12.9V and 7.9V respectively. A 24V Zener diode should be placed
from the VCC pin to GND to protect the device from substantial spikes that could cause damage.
24
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
Figure 35 shows how the LM3450/50A provides a quick way to generate the necessary primary bias supply at
start-up. Since the AC line peak voltage is always higher than the rating of the controller, all designs require an
N-channel MosFET (passFET). The passFET (QPS) is connected with its drain attached to the rectified AC. The
gate of QPS is connected to the BIAS pin which has a stack of 2 Zener diodes internal to the device. These
diodes are then biased from the rectified AC line through series resistance (RBS). The source of QPS is held at a
VGS below the Zener voltage and current flows through QPS to charge up whatever capacitance is present. If the
capacitance is large enough, the source voltage will remain relatively constant over the line cycle and this
becomes the input bias supply at VCC.
This bias circuit enables instant turn-on. However, once the circuit is operational it is desirable to bootstrap VCC
to an auxiliary winding of the inductor or transformer (also used for ZCD). The two bias paths are each
connected to VCC through a diode to ensure the higher of the two is providing VCC current. This bootstrapping
greatly improves efficiency when quick start-up is necessary.
To ensure that the auxiliary winding is powering VCC at all times except start-up, the LM3450/50A has a dual
BIAS mode. The BIAS voltage at startup is 20V through two Zener diodes. When the VCC UVLO rising threshold
is exceeded and the device turns on, the BIAS pin voltage is reduced to 14V (bottom 6V Zener is shorted). Once
the VCC UVLO falling threshold is reached again, the BIAS pin will return to 20V to attempt to restart the device.
It should be noted that the large hysteresis of VCC UVLO and the dual BIAS mode allow for a large variation of
the auxiliary bias circuitry easing the design of the magnetics.
SOFTSTART
As in any off-line system, softstart is an important part of the design. Since the LM3450/50A are used with phase
dimming applications, the typical startup problems are magnified since a phase dimmer is frequently turned on
and off rapidly. This requires a softstart mechanism that quickly resets when the LM3450/50A turns off. Since the
LM3450/50A has two distinct functional parts (PFC and phase decoder), ideally both should be softstarted
simultaneously. This will ensure the most controlled start-up possible.
The circuit in Figure 36 provides this exact functionality. Both VADJ and COMP are diode or'ed into an RC
charging circuit fed from VCC. The reset mechanism is accomplished using an 18V Zener from BIAS, a current
limiting resistor and an NPN transistor. The reset is activated when VCC uvlo falling is triggered and BIAS
transitions to 20V. This discharges the RC to zero and as soon as VCC uvlo rising is passed BIAS transitions to
14V again, releasing the clamp on the RC softstart circuit. The RC will charge up to the 3.9V Zener clamp (which
is above the dynamic range of COMP and VADJ and become effectively out of the circuit until the next turn-off.
LM3450/50A
BIAS
COMP VADJ VCC
500k
18V
3.9V
47uF
20k
Figure 36. Dual Softstart Circuit
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
25
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
DESIGN INFORMATION
HOW TO SELECT THE CORRECT DEVICE (LM3450 or LM3450A)
What application(s) are suitable for the LM3450, and when is the LM3450A appropriate? The difference centers
on the power dissipation in the passFET. The passFET stands off the high AC voltage from the LM3450/50A,
and provides a path for the hold current. The passFET operates in the linear region and dissipates power equal
to the product of the voltage across it and the current through it.
The LM3450 was designed to minimize the power dissipation in the passFET by applying holding current in a
sampled form. The standby sampling rate (when the dimmer is not moving) is infrequent, allowing minimal impact
on the thermal considerations of the passFET. Sampling of the dynamic hold is not desired for some applications
although. An example where the sampled hold current may cause undesirable effects is the single stage flyback
topology where the output of the flyback is directly connected to the LEDs. If the phase dimmer is allowed to
misfire or create erratic differences in the input voltage and current waveforms, this behavior will appear as a
"fluttering" of the LED light output at the sampling rate when the single stage topology is used. The light flutter is
most observable at low input currents (dimming). A small perturbation in the input voltage due to phase dimmer
misfire can create a visible difference in the output light. Using a secondary LED driver stage eliminates this
problem.
Cost sensitive applications may drive the design to a single stage solution, and the LM3450A was developed to
address this market. The LM3450A provides continuous dynamic hold current on every AC cycle preventing the
phase dimmer from misfire, and the sampling frequency from appearing at the output. Another design
consideration where continuous dynamic hold may be advantageous is the reduced stresses on input EMI R/C
snubber networks.
The designer must pay close attention to the power loss of the passFET when using the LM3450A. Designers
must consider worst case possibilities with any power conversion designs. Worst case operating conditions with
the LM3450A are usually found with the largest triac holding current requirements. Many phase dimmers require
25mA-40mA of holding current, and frequently designers are choosing 50mA as their minimum holding current
requirement. The passFET package for common LM3450/50A designs should be capable of dissipating between
1W and 1.5W. The pass-FET can always be increased in size and/or the hold current can be reduced. Power
calculations for the dynamic hold circuit as well as effective thermal protection are both described in the
DYNAMIC HOLD section.
The LM3450 and LM3450A is best differentiated in terms of the appropriate applications for each device. The
Table 1 can be used as a general guide for when to use each part.
Table 1. Device Selection Guide
Product
AC Input
120V
High End Downlight
230V
Low Cost Downlight
or
Large High End Bulb
26
Output Power
Device
POUT < 15W
LM3450
POUT > 15W
LM3450A
POUT < 25W
LM3450
POUT > 25W
LM3450A
120V
POUT > 15W
230V
POUT > 25W
Submit Documentation Feedback
LM3450A
Topology
Two Stage Design
Single Stage Design
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
Applications Information
See AN-2098 (literature number SNVA463) and/or AN-2150 (literature number SNVA485) for detailed design and
application information.
TWO STAGE LED DRIVER – LM3450 PRIMARY AND LM3409HV SECONDARY
SOFTSTART
VADJ
L1
R27
EMI
FILTER
R7
AC
MAINS
Q6
D17
R28
C5
R2
L2
D10
C2
VREF
C3
R1
-
D4
D18
VCC
+
BIAS COMP
RETURN
C1
L3
C4
C6
R10
R3
D1
D6
VREF
BIAS
VADJ
HOLD
Q1
C10
R6
D7
R4
C11
C7
D2
AUX
R5
R8
FLT2
VOUT
T1
ZCD
AUX
C12
D5
D3
R9
C8
VCC
FLT1
C13
PWM
D8
C9
LM3450
Q2
DIM
GATE
VAC
CS
R11
GND
FB
ISEN
D12
C14
C15
D9
R13
R16
VOP2
CONTROL
FEEDBACK
OPTO1
RETURN
VOUT
C20
R17
D13
UVLO
VIN
IADJ
VCC
C17
C21
C19
LMV431
D14
EN
VCC
R20
LM3409HV
CSP
R23
DIMMING
CSN
COFF
VOP2
R22
OPTO2
C22
DAP
PGATE
GND
R21
Q5
L4
VLED
PWM
VOP1
C16
C18
R18
R19
D11
R15
HOLD
VOP1
Q3
Q4
R14
R12
COMP
R24
R25
D15
SECONDARY
LED DRIVER
D16
VLED
LED
LOAD
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
27
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
15W TWO STAGE DESIGN SPECIFICATIONS
AC Input Voltage: 120VAC nominal (90VAC - 135VAC) or 230VAC nominal (180VAC - 265VAC)
Regulated Flyback Output Voltage: 50V
Regulated LED Current: 350mA
LED Stack Voltage Maximum: 45V
Table 2. Bill of Materials (1)
Reference Designator
Description
Manufacturer
Part Number
LM3450
IC PFC CONT 16-TSSOP
TI
LM3450MT
LM3409HV
IC LED DRIVR 10-eMSOP
TI
LM3409HVMY
LMV431
IC SHUNT REG SOT-23
TI
LMV431AIM5
120V
CAP CER 0.22µF 250V 1210
MURATA
GRM32DR72E224KW01L
230V
CAP CER 68nF 250V 1210
MURATA
GRM32QR72E683KW01L
CAP MPY 33nF 250VAC X1 RAD
EPCOS
B32912A3333M
C1a, C1b, C5a,
C5b
C2
C3
CAP CER 47µF 6.3V 0805
TAIYO YUDEN
JMK212BJ476MG-T
120V
CAP MPY 0.1µF 400V RAD
EPCOS
B32612A4104J008
230V
CAP MPY 33nF 1000V RAD
WIMA
MKP10 - .033/1000/10
C6
CAP CER 4.7nF 500VAC Y1 RAD
EPCOS
VY1472M63Y5UQ63V0
C7a
CAP ELEC 470µF 63V RAD
NICHICON
UPW1J471MHD3
C7b, C8b, C9b, C11, C15
CAP CER 0.1µF 50V 1206
MURATA
GRM188R71H104KA93D
C8a, C9a
CAP ELEC 100µF 50V RAD
NICHICON
UHE1H101MPD
C10
CAP CER 10nF 25V 0603
MURATA
GRM188R71E103KA01D
C12, C13 C14, C21
CAP CER 1µF 16V 0603
MURATA
GRM188R71C105KA12D
C16
CAP CER 0.22µF 16V 0603
TDK
C1608X7R1C224K
C17
CAP CER 10µF 16V 1206
MURATA
GRM31CR71C106KAC7L
C18, C20
CAP CER 1µF 100V 1206
TDK
C3216X7R2A105M
C19
CAP CER 2.2µF 6.3V 0603
TDK
C1608X5R0J225M
C22
CAP CER 470pF 100V 0603
TDK
C1608C0G2A471J
120V
DIODE ULTRAFAST 200V 1A SMA
FAIRCHILD
ES1D
230V
DIODE FAST 400V 1A DO-214AC
FAIRCHILD
ES1G
D2
DIODE ULTRAFAST 200V 1A SMA
FAIRCHILD
ES1D
D3, D5
DIODE ULTRAFAST 100V 0.2A SOT-23
FAIRCHILD
MMBD914
D4
DIODE DUAL SCHOTTKY 20V 0.5A SOT-23
NXP SEMI
PMEG3005CT,215
120V
DIODE TVS 150V 600W UNI SMB
LITTLEFUSE
SMBJ150A
230V
C4
D1
D6
DIODE TVS 220V 600W UNI SMB
LITTLEFUSE
SMBJ220A
D7
DIODE ULTRAFAST 600V 1A SMA
FAIRCHILD
ES1J
D8
DIODE ZENER 24V 1.5W SMA
MICRO-SEMI
SMAJ5934B-TP
D9
DIODE SCHOTTKY 20V 3A SMA
FAIRCHILD
ES2AA-13-F
D10
DIODE RECT 600V 0.5A Minidip
COMCHIP
HD06
D11, D12
DIODE ZENER 10V 500mW SOD-123
FAIRCHILD
MMSZ5240B
D13
DIODE ULTRAFAST 70V 0.2A SOT-23
FAIRCHILD
BAV99
D14
DIODE ZENER 3.3V 500mW SOD-123
ON-SEMI
MMSZ3V3T1G
D15
DIODE ZENER 1.8V 500MW SOD-123
ON-SEMI
MMSZ4678T1G
D16
DIODE SCHOTTKY 60V 2A SMB
ON-SEMI
SS26T3G
D17
DIODE ZENER 3.9V 500MW SOD-123
ON-SEMI
MMSZ4686T1G
D18
DIODE ZENER 18V 500MW SOD-123
ON-SEMI
MMSZ5248T1G
L1, L2, L3
IND SHIELD 1mH 0.46A SMT
COILCRAFT
MSS1038-105KL
(1)
28
Components are used in both versions unless otherwise noted
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
Table 2. Bill of Materials(1) (continued)
Reference Designator
Description
Manufacturer
Part Number
L4
IND SHIELD 470µH 1.06A SMT
COILCRAFT
MSS1278-474KLB
Q1
MOSFET N-CH 800V 3A DPAK
ST MICRO
STD4NK80ZT4
120V
MOSFET N-CH 600V 4.4A DPAK
INFINEON
IPD60R950C6
230V
MOSFET N-CH 800V 3A DPAK
ST MICRO
STD4NK80ZT4
Q3, Q4
TRANS NPN 40V 0.6A SOT-23
FAIRCHILD
MMBT4401
Q5
MOSFET P-CH 70V 5.7A DPAK
ZETEX
ZXMP7A17K
Q6
TRANS PNP 40V 0.2A SOT-23
FAIRCHILD
MMBT3904
120V
RES 330Ω 5% 1W 2512
VISHAY
CRCW2512330RJNEG
230V
RES 510Ω 5% 1W 2512
VISHAY
CRCW2512510RJNEG
120V
RES 430Ω 5% 1W 2512
VISHAY
CRCW2512430RJNEG
230V
RES 1.6kΩ 5% 1W 2512
VISHAY
CRCW25121K60JNEG
120V
RES 402kΩ 1% 0.25W 1206
VISHAY
CRCW1206402KFKEA
230V
RES 953kΩ 1% 0.25W 1206
VISHAY
CRCW1206953KFKEA
R4
RES 100Ω 1% 1W 2512
VISHAY
WSL2512100RFKEA
R5
RES 100kΩ 1% 0.1W 0603
VISHAY
CRCW0603100KFKEA
R6
RES 6.04kΩ 1% 0.1W 0603
VISHAY
CRCW06036K04FKEA
R7
RES 499kΩ 1% 0.1W 0603
VISHAY
CRCW0603499KFKEA
R8, R9
RES 75.0kΩ 1% 0.1W 0603
VISHAY
CRCW060375K0FKEA
R10
RES 20.0kΩ 1% 0.1W 0603
VISHAY
CRCW060320K0FKEA
120V
RES 1.00MΩ 1% 0.25W 1206
VISHAY
CRCW12061M00FKEA
230V
RES 2.00MΩ 1% 0.25W 1206
VISHAY
CRCW12062M00FKEA
R12
RES 15.0kΩ 1% 0.1W 0603
VISHAY
CRCW060315K0FKEA
R13
RES 5.11kΩ 1% 0.1W 0603
VISHAY
CRCW06035K11FKEA
R14a
RES 10Ω 1% 0.25W 1206
VISHAY
CRCW120610R0FKEA
R14b
RES 1.00Ω 1% 0.33W 1210
VISHAY
CRCW12101R00FNEA
R15a, R15b
RES 5.62Ω 1% 0.25W 1206
VISHAY
CRCW12065R62FNEA
R16
RES 2.00kΩ 1% 0.125W 0805
VISHAY
CRCW08052K00FKEA
120V
RES 20.0kΩ 1% 0.1W 0603
VISHAY
CRCW060320K0FKEA
230V
RES 10.0kΩ 1% 0.1W 0603
VISHAY
CRCW060310K0FKEA
R18
RES 105kΩ 1% 0.125W 0805
VISHAY
CRCW0805105KFKEA
R19
RES 2.67kΩ 1% 0.1W 0603
VISHAY
CRCW06032K67FKEA
R20
RES 6.04kΩ 1% 0.125W 0805
VISHAY
CRCW08056K04FKEA
R21
RES 10.0kΩ 1% 0.125W 0805
VISHAY
CRCW080510K0FKEA
R22
RES 80.6kΩ 1% 0.1W 0603
VISHAY
CRCW060380K6FKEA
R23
RES .62Ω 1% 0.5 2010 SMD
ROHM
MCR50JZHFLR620
R24, R25
RES 10kΩ 1% 0.1W 0603
VISHAY
CRCW060310K0FKEA
120V
RES 10Ω 10% 2W FILM
WELWYN
EMC2-10R0
230V
RES 22Ω 10% 2W FILM
WELWYN
EMC2-22R0
OPTO-ISOLATOR SMD
LITE ON
CNY17F-3S
120V
XFORMER 120V 15W OUTPUT 50V
WURTH
750813550
230V
XFORMER 230V 15W OUTPUT 50V
WURTH
750817550
Q2
R1
R2
R3
R11
R17
R27, R28
OPTO1, OPTO2
T1
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
29
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
SINGLE STAGE LED DRIVER – LM3450A FLYBACK
SOFTSTART
VADJ
L1
R27
EMI
FILTER
R7
AC
MAINS
Q6
VREF
C3
R1
D17
L2
R28
C5
R2
D10
C2
+
D4
D18
VCC
-
BIAS COMP
RETURN
C1
L3
C6
C4
R10
R3
D1
D6
VREF
BIAS
VADJ
HOLD
Q1
C10
R6
R4
D7
Thermal
Protect
C11
D2
R5
R8
FLT2
ZCD
VOUT
T1
C7
AUX
AUX
C12
D5
D3
R9
C8
VCC
FLT1
C13
PWM
D8
C9
LM3450A
Q2
DIM
GATE
VAC
CS
R11
R26
C14
D9
C15
1.24V
ISEN
FB
HOLD
VOP1
D11
R15
R13
VOP2
VOP1
RETURN
C16
CONTROL
FEEDBACK
VOP1
R16
D19
VCC
DIMMING
VOP2
R18
1.24V
R19
R22
VOUT
R20
U1
+
-
OPTO1
D12
LMV431
GND
COMP
Q3
Q4
R14
R12
R24
R25
LED
LOAD
OPTO2
R30
R29
VSDIM
C18 C19
R32
VSDIM
+
PWM R21
D13
R23
C17
30
R17
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
30W SINGLE STAGE DESIGN SPECIFICATIONS
AC Input Voltage: 120VAC nominal (90VAC - 135VAC) or 230VAC nominal (180VAC - 265VAC)
Flyback Output Voltage Maximum: 60V
Regulated LED Current: 700mA
Table 3. Bill of Materials (1)
Reference Designator
Description
Manufacturer
Part Number
LM3450A
IC PFC CONT 16-TSSOP
TI
LM3450AMT
LMV431
IC SHUNT REG SOT-23
TI
LMV431AIM5
U1
IC DUAL OP-AMP
TI
LM2904
120V
CAP CER 0.22µF 250V 1210
MURATA
GRM32DR72E224KW01L
230V
C1a, C1b, C1c,
C5a, C5b, C5c
CAP CER 68nF 250V 1210
MURATA
GRM32QR72E683KW01L
C2
CAP MPY 33nF 250VAC X1 RAD
EPCOS
B32912A3333M
C3
CAP CER 47µF 6.3V 0805
TAIYO YUDEN
JMK212BJ476MG-T
120V
CAP MPY 0.22µF 400V RAD
WIMA
MKP10-.22/400/20
230V
CAP MPY 62nF 1000V RAD
VISHAY
BFC238330623
C6
CAP CER 4.7nF 500VAC Y1 RAD
EPCOS
VY1472M63Y5UQ63V0
C7a
CAP ELEC 1mF 63V RAD
NICHICON
UPW1J102MHD
C7b, C8b, C9b, C11, C15
CAP CER 0.1µF 50V 1206
MURATA
GRM188R71H104KA93D
C8a, C9a
CAP ELEC 220µF 50V RAD
NICHICON
UHE1H221MPD
C10
CAP CER 10nF 25V 0603
MURATA
GRM188R71E103KA01D
C12, C13, C14, C18, C19
CAP CER 1µF 16V 0603
MURATA
GRM188R71C105KA12D
C16
CAP CER 0.22µF 16V 0603
TDK
C1608X7R1C224K
C17
CAP CER 10µF 16V 1206
MURATA
GRM31CR71C106KAC7L
120V
DIODE ULTRAFAST 200V 1A SMA
FAIRCHILD
ES1D
230V
DIODE FAST 400V 1A DO-214AC
FAIRCHILD
ES1G
D2
DIODE ULTRAFAST 200V 1A SMA
FAIRCHILD
ES1D
D3, D5
DIODE ULTRAFAST 100V 0.2A SOT-23
FAIRCHILD
MMBD914
C4
D1a, D1b
D4
DIODE DUAL SCHOTTKY 20V 0.5A SOT-23
NXP SEMI
PMEG3005CT,215
120V
DIODE TVS 150V 600W UNI SMB
LITTLEFUSE
SMBJ150A
230V
DIODE TVS 220V 600W UNI SMB
LITTLEFUSE
SMBJ220A
D7
DIODE ULTRAFAST 600V 1A SMA
FAIRCHILD
ES1J
D8
DIODE ZENER 24V 1.5W SMA
MICRO-SEMI
SMAJ5934B-TP
D9
DIODE SCHOTTKY 20V 3A SMA
FAIRCHILD
ES2AA-13-F
D10
DIODE RECT 600V 0.5A Minidip
COMCHIP
HD06
D11, D12
DIODE ZENER 10V 500mW SOD-123
FAIRCHILD
MMSZ5240B
D13
DIODE ZENER 1.8V 500MW SOD-123
ON-SEMI
MMSZ4678T1G
D17
DIODE ZENER 3.9V 500MW SOD-123
ON-SEMI
MMSZ4686T1G
D18
DIODE ZENER 18V 500MW SOD-123
ON-SEMI
MMSZ5248T1G
D19
DIODE SCHOTTKY 30V 200mA SOT-23
FAIRCHILD
BAT54
L1
IND LINE FILTER 6mH 0.3A 11M
PANASONIC
ELF-11M030E
L1, L2, L3
IND SHIELD 1mH 1.18A SMT
COILCRAFT
MSS1278-105KL
L4
IND SHIELD 270µH 2.34A SMT
COILCRAFT
MSS1278-274KLB
Q1
MOSFET N-CH 800V 3A DPAK
ST MICRO
STD4NK80ZT4
120V
MOSFET N-CH 500V 9A DPAK
ST MICRO
STD11NM50N
230V
MOSFET N-CH 800V 6A DPAK
INFINEON
SPD06N80C3
Q3, Q4
TRANS NPN 40V 0.6A SOT-23
FAIRCHILD
MMBT4401
Q6
TRANS NPN 40V 0.2A SOT-23
FAIRCHILD
MMBT3904
D6
Q2
(1)
Components are used in both versions unless otherwise noted
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
31
LM3450
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
Table 3. Bill of Materials(1) (continued)
Reference Designator
Description
Manufacturer
Part Number
R1
120V
RES 330Ω 5% 1W 2512
VISHAY
CRCW2512330RJNEG
230V
RES 510Ω 5% 1W 2512
VISHAY
CRCW2512510RJNEG
120V
RES 430Ω 5% 1W 2512
VISHAY
CRCW2512430RJNEG
230V
RES 1.6kΩ 5% 1W 2512
VISHAY
CRCW25121K60JNEG
120V
RES 402kΩ 1% 0.25W 1206
VISHAY
CRCW1206402KFKEA
230V
RES 953kΩ 1% 0.25W 1206
VISHAY
CRCW1206953KFKEA
R4
RES 100Ω 1% 1W 2512
VISHAY
WSL2512100RFKEA
R5
RES 100kΩ 1% 0.1W 0603
VISHAY
CRCW0603100KFKEA
R6
RES 6.04kΩ 1% 0.1W 0603
VISHAY
CRCW06036K04FKEA
R7
RES 499kΩ 1% 0.1W 0603
VISHAY
CRCW0603499KFKEA
R8, R9
RES 49.9kΩ 1% 0.1W 0603
VISHAY
CRCW060349K9FKEA
R2
R3
R10
RES 20kΩ 1% 0.1W 0603
VISHAY
CRCW060320K0FKEA
120V
RES 1.00MΩ 1% 0.25W 1206
VISHAY
CRCW12061M00FKEA
230V
RES 2.00MΩ 1% 0.25W 1206
VISHAY
CRCW12062M00FKEA
R12
RES 15.0kΩ 1% 0.1W 0603
VISHAY
CRCW060315K0FKEA
R13
RES 5.11kΩ 1% 0.1W 0603
VISHAY
CRCW06035K11FKEA
R14a, R14b, R23a, R23b,
R23c
RES 1.00Ω 1% 0.33W 1206
VISHAY
CRCW12061R00FKEA
R15a, R15b
RES 5.62Ω 1% 0.25W 1206
VISHAY
CRCW12065R62FKEA
R16
RES 1.00kΩ 1% 0.125W 0805
VISHAY
CRCW08051K00FKEA
120V
RES 30.1kΩ 1% 0.1W 0603
VISHAY
CRCW060330K1FKEA
230V
R11
R17
RES 15.0kΩ 1% 0.1W 0603
VISHAY
CRCW060315K0FKEA
R18
RES 105kΩ 1% 0.125W 0805
VISHAY
CRCW0805105KFKEA
R19
RES 2.49kΩ 1% 0.1W 0603
VISHAY
CRCW06035K49FKEA
R20
RES 6.04kΩ 1% 0.125W 0805
VISHAY
CRCW08056K04FKEA
R21
RES 10.0kΩ 1% 0.125W 0805
VISHAY
CRCW080510K0FKEA
R22
RES 1.4kΩ 1% 0.125W 0805
VISHAY
CRCW08051K40FKEA
R24, R25
R26
R27, R28
RES 10kΩ 1% 0.1W 0603
VISHAY
CRCW060310K0FKEA
120V
RES 2.49kΩ 1% 0.125W 0805
VISHAY
CRCW08052K49FKEA
230V
RES 4.99kΩ 1% 0.125W 0805
VISHAY
CRCW08054K99FKEA
120V
RES 5Ω 10% 3W WIREWOUND
VISHAY
PAC300005008FAC000
230V
RES 10Ω 10% 3W WIREWOUND
VISHAY
PAC300001009FAC000
R29, R30
RES 4.99kΩ 1% 0.1W 0603
VISHAY
CRCW06034K99FKEA
R32
RES 909Ω 1% 0.1W 0603
VISHAY
CRCW0603909RFKEA
OPTO1, OPTO2
T1
Thermal Protect
32
OPTO-ISOLATOR SMD
LITE ON
CNY17F-3S
120V
XFORMER 120V 30W OUTPUT 50V
WURTH
750813651
230V
XFORMER 230V 30W OUTPUT 50V
WURTH
750817651
see DYNAMIC HOLD section
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
LM3450
www.ti.com
SNVS681D – NOVEMBER 2010 – REVISED MAY 2013
REVISION HISTORY
Changes from Revision C (May 2013) to Revision D
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 32
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3450
33
PACKAGE OPTION ADDENDUM
www.ti.com
10-Sep-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM3450AMT/NOPB
ACTIVE
TSSOP
PW
16
92
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
LM3450
AMT
LM3450AMTX/NOPB
ACTIVE
TSSOP
PW
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
LM3450
AMT
LM3450MT/NOPB
ACTIVE
TSSOP
PW
16
92
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
LM3450
MT
LM3450MTX/NOPB
ACTIVE
TSSOP
PW
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
LM3450
MT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Sep-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM3450AMTX/NOPB
TSSOP
PW
16
2500
330.0
12.4
6.95
5.6
1.6
8.0
12.0
Q1
LM3450MTX/NOPB
TSSOP
PW
16
2500
330.0
12.4
6.95
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3450AMTX/NOPB
TSSOP
PW
16
2500
367.0
367.0
35.0
LM3450MTX/NOPB
TSSOP
PW
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated