PF PRESSURE SENSOR
2002.10.23 7:58 PM
Page 27
PF (ADP1)
• A wide range of rated pressure,
including a minute pressure
There are 10 types of sensors covering a
wide range of rated pressure from a
minute pressure between 4.9 kPa {0.05
kgf/cm2}, to a maximum pressure of
980.7 kPa {10 kgf/cm2}.
• Realization of highly accurate, linear
characteristics
This sensor employs a semiconductor
strain gauge method, ensuring accurate
and linear detection characteristics. It
also has excellent repeatability of pressure characteristics.
• Impressive line-up of models
• Taking their place alongside the standard 5kΩ bridge resistance models are
those with a 3.3kΩ resistance which is
optimally suited to 5V drive circuits.
• Economy model (no glass base) gives
outstanding value for consumer appliances
40 kPa (0.4 kgf/cm2) and 49 kPa (0.5
kgf/cm2) units are also available.
<Cross-section of Sensor Chip>
Silicon
Piezo resistance
strain gauge
Anode
junction
Pressure
Glass
base
Highly reliable wire
bonding technology
Pressure
High reliability
die bonding
technology
Very strong,
heat resistant body
PF PRESSURE
SENSOR
Example of pressure characteristics
(when the rated pressure is between 98.1 kPa
{1.0 kgf/cm2}
Drive current: 1.5 mA rated current; ambient temperature: 25°C 77°F
100
Output voltage, mV
PRECISION
SEMICONDUCTOR
PRESSURE SENSOR
50
0
0 {0}
49 {0.5}
98.1 {1}
Pressure (gauge pressure), (kPa {kgf/cm2})
TYPICAL
APPLICATIONS
• Medical equipment: Electronic hemodynamometer
• Home appliance: Vacuum cleaner
• Gas equipment: Microprocessor gas
meter, gas leakage detector
• Industrial equipment: Absorption
device, etc.
ORDERING INFORMATION
Ex. ADP
Part No.
1
Terminal profile and direction
Rated pressure
1: DIP terminal: Dirtection opposite the
pressure inlet direction
ADP1:
PF pressure sensor
2: DIP terminal: Pressure inlet direction
0:
1:
2:
3:
4:
5:
6:
7:
8:
9:
A:
DIP terminal:
Direction opposite
the pressure inlet
direction
Terminal
Pressure
Economy type
(Without glass
base)
{approx. 0.05 kgf/cm2}
{approx. 0.15 kgf/cm2}
{approx. 0.35 kgf/cm2}
{approx. 0.5 kgf/cm2}
{approx. 1.0 kgf/cm2}
{approx. 2.0 kgf/cm2}
{approx. 3.5 kgf/cm2}
{approx. 5.0 kgf/cm2}
{approx. 8.5 kgf/cm2}
{approx. 10.0 kgf/cm2}
{approx. 0.4 kgf/cm2}
Type
1 : Standard type
(With glass base)
2: Economy type
(Without glass
base)
5.0kΩ
Bridge resistance
Standard
type
(With glass
base)
4.9 kPa
14.7 kPa
34.3 kPa
49.0 kPa
98.1 kPa
196.1 kPa
343.2 kPa
490.3 kPa
833.6 kPa
980.7 kPa
40.0 kPa
Bridge resistance
Nil : 5.0kΩ
3 : 3.3kΩ
3.3kΩ
DIP terminal:
Pressure inlet
direction
DIP terminal:
Direction opposite
the pressure inlet
direction
DIP terminal:
Pressure inlet
direction
4.9kPa
approx. 0.05kgf/cm2
ADP1101
ADP1201
——
——
14.7kPa
approx. 0.15kgf/cm2
ADP1111
ADP1211
——
——
34.3kPa
approx. 0.35kgf/cm
ADP1121
ADP1221
——
——
49.0kPa
approx. 0.5kgf/cm2
ADP1131
ADP1231
——
——
98.1kPa
approx. 1.0kgf/cm2
ADP1141
ADP1241
——
——
196.1kPa
approx. 2.0kgf/cm2
ADP1151
ADP1251
——
——
343.2kPa
2
approx. 3.5kgf/cm
ADP1161
ADP1261
——
——
490.3kPa
approx. 5.0kgf/cm2
ADP1171
ADP1271
——
——
833.6kPa
approx. 8.5kgf/cm2
ADP1181
ADP1281
——
——
980.7kPa
approx. 10.0kgf/cm2
ADP1191
ADP1291
——
——
2
40.0kPa
approx. 0.4kgf/cm
——
——
ADP11A23
ADP12A23
49.0kPa
approx. 0.5kgf/cm2
ADP1132
ADP1232
——
——
2
27
PF PRESSURE SENSOR
2002.10.23 7:58 PM
Page 28
PF (ADP1)
SPECIFICATIONS
Type
Type of pressure
Pressure medium
Unit: kPa
Rated
pressure Unit: kgf/cm2 (approx.)
Max. applied pressure
Bridge resistance
Economy type
4.9
0.05
Standard type (With glass base)
(Without glass base)
Gauge pressure
Air (For other medium, please consult us.)
34.3
49.0
98.1
196.1
343.2
490.3
833.6
980.7
40.0
49.0
0.35
0.5
1.0
2.0
3.5
5.0
8.5
10.0
0.4
0.5
Twice the rated pressure
1.5 times the rated pressure Twice the rated pressure
5000±1000 Ω
3300±600 Ω 5000±1000 Ω
–5 to 50°C –20 to 100°C
–20 to 100°C –4 to 212°F (no freezing or condensation)
–7 to 122°F –4 to 212°F
–20 to 70°C –40 to 120°C
–40 to 120°C –40 to 248°F (no freezing or condensation)
–4 to 158°F –70 to 248°F
5 to 45°C 0 to 50°C
0 to 50°C 32 to 122°F
41 to 113°F 32 to 122°F
1.5 mA DC
100±40 mV
43.5±22.5 mV 85±45 mV
±20 mV
±15 mV ±25 mV
±0.3%FS
±0.5%FS
±0.6%FS
±0.3%FS
±0.2%FS
±0.4%FS
±0.7%FS
14.7
0.15
Ambient temperature
Storage temperature
Temperature compensation range
Drive current (constant current)
Output span voltage
Offset voltage
Linearity
Pressure hysteresis
Offset voltage-temperature
characteristics (0 to 50°C 32 to 122°F)
Sensitivity-temperature
characteristics (0 to 50°C 32 to 122°F)
40±20 mV
±0.7%FS ±0.5%FS
±0.6%FS ±0.4%FS
±15%FS
±5.0%FS
±10%FS
±8%FS
±10%FS
±2.5%FS
±1.3%FS ±2.5%FS
Notes) 1. Unless otherwise specified, measurements were taken with a drive current of1.5 mA ±0.01 mA at a temperature of 25°C 77°F and humidity ranging from 25% to
85%.
2. Please consult us if a pressure medium other than air is to be used.
3. This is the regulation which applies within the compensation temperature range.
4. Please consult us if the intended use involves a negative pressure.
DATA
ADP1141
Drive current: 1.5 mA; temperature: 25°C 77°F
Output voltage (mV)
80
60
40
20
0
–20
–40
1-<3> Sensitivity – temperature
characteristics (%FS)
ADP1141
Drive current: 1.5 mA; rating ±5%FS
ADP1141
Drive current: 1.5 mA; rating ±2.5%FS
Offset voltage – temperature characteristics (%FS)
100
1-<2> Offset voltage – temperature
characteristics
0
49 {0.5}
kpa {kgf/cm2}
98.1 {1}
Rated pressure
4
4
Sensitivity – temperature characteristics (%FS)
1. Characteristics data
1-<1> Output characteristics
3
2
1
0
–1
–2
0
32
25
47
50
122
Temperature (°C °F)
3
2
1
0
–1
–2
0
32
25
47
50
122
Temperature (°C °F)
2. Pressure cycle range (0 to rated pressure)
Tested sample: ADP1131, temperature: 25°C 77°F
2-<1> Offset voltage range
2-<2> Output span voltage range
2
Output span voltage range (%FS)
Offset voltage range (%FS)
2
1
0
–1
–2
0
1×105
5×105 1×106
Pressure cycle (cycle)
28
Even after testing for 1 million times, the variations in the offset voltage and output span
voltage are minimal.
1
0
–1
–2
0
1×105
5×105 1×106
Pressure cycle (cycle)
PF PRESSURE SENSOR
2002.10.23 7:58 PM
Page 29
PF (ADP1)
3. Evaluation test
Tested item
Storage at high
temperature
Storage at low
temperature
Environmental
characteristics
Tested condition
Temperature: Left in a 120°C 248°F constant temperature bath
Time: 1,000 hrs.
Temperature: Left in a –40°C –40°F constant temperature bath
Time: 1,000 hrs.
Temperature/humidity: Left at 40°C 104°F, 90% RH
Time: 1,000 hrs.
Temperature: –40°C to 120°C –40°F to 248°F
1 cycle: 30 min.
Times of cycle: 100
Temperature/humidity: 40°C 104°F, 90% RH
Operation times: 106, rated voltage applied
Double amplitude: 1.5 mm .059 inch
Vibration: 10 to 55 Hz
Applied vibration direction: X, Y, Z 3 directions
Times: 2 hrs each
Dropping height: 75 cm 29.528 inch
Times: 2 times
Pulling strength: 9.8 N {1 kgf}, 10 sec.
Bending strength: 4.9 N {0.5 kgf}, left and right 90° 1 time
Temperature: 230°C 446°F
Time: 5 sec.
Temperature: 260°C 500°F
Time: 10 sec.
Humidity
Temperature cycle
Endurance
characteristics
High temperature/high
humidity operation
Vibration resistance
Mechanical
characteristics
Dropping resistance
Terminal strength
Soldered in
DIP soldering bath
Soldering
Resistance
Temperature
Result
Passed
Passed
Passed
Passed
Passed
Passed
Passed
Passed
Passed
Passed
Note: For details other than listed above, please consult us.
General tolerance: ±0.3 ±.012 mm inch
DIMENTIONS
1. Terminal direction: Direction opposite the pressure inlet
derection ADP11mm (m)
2. Terminal direction: Pressure inlet direction
ADP12mm (m)
10.0
.394
Atmospheric
pressure
inlet hole
Atmospheric
pressure
inlet hole
0.5 dia.
.020 dia.
10.0
.394
0.5 dia.
.020 dia.
8.6
.339
3.0 +0
−0.1 dia.
.118 +0
−.004 dia.
8.6
.339
10.16 ±0.25
.400 ±.010
C0.5
.020
Pressure
inlet hole
0.8 dia.
.031 dia.
2.54 ±0.25 2.54 ±0.25
.100 ±.010 .100 ±.010
Pressure
inlet hole
0.8 dia.
.031 dia.
1.2 ±0.1 .047 ±.004
6.0
.236
0.6
.024
3.3 .130
1.1
.043
4.9
0.6
.024 .193
±0.1
±.004
0.5
.020
1.2 ±0.1 .047 ±.004
0 to 15˚
0.5 ±0.1 .020 ±.004
R0.5
.020
0.25
.010
0.25 +0.1
−0.05
.010 +.004
−.002
3.0 +0
−0.1 dia.
.118 +0
−.004 dia.
C0.5
.020
0.25 +0.1
−0.05
.010 +.004
−.002
6.0
4.0 .236
.157
R0.5
.020
3.3 .130
10.16 ±0.25
.400 ±.010
0 to 15˚
2.54 ±0.25 2.54 ±0.25
.100 ±.010 .100 ±.010
Recommended PC board pattern
(BOTTOM VIEW)
Recommended PC board pattern
(BOTTOM VIEW)
6-0.9 dia.
6-.035 dia.
6-0.9 dia.
6-.035 dia.
10.16
.400
2.54 .100
5.08 .200
6 dia.
.236 dia.
2.54
.100
2.54 .100
5.08 .200
Tolerance: ±0.1 .004
10.16
.400
2.54
.100
Tolerance: ±0.1 .004
3. Terminal connection diagram
+Input
R1
R2
+Output
−Output
R3
R4
−Input
Terminal No.
Name
1
Output (−)
2
Power supply (+)
3
Output (+)
4
No connection
5
Power supply (−)
6
Output (−)
Note: Leave terminal 4 unconnected.
29
PF PRESSURE SENSOR
2002.10.23 7:58 PM
Page 30
PF (ADP1)
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely fixed.
2. Soldering
1) Due to its small size, the thermal
capacity of the pressure sensor DIP type
is low. Therefore, take steps to minimize
the effects of external heat.
Dip soldering bath: Max. 260°C 500°F, 5
sec.
Soldering iron: 260 to 300°C 500 to
572°F (30W) within 5 sec.
2) Use a non-corrosive resin type of flux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
flux to enter inside.
3. Cleaning
1) Since the pressure sensor chip is
exposed to the atmosphere, do not allow
cleaning fluid to enter inside.
2) Avoid ultrasonic cleaning since this
may cause breaks or disconnections in
the wiring.
4. Environment
Consult with us before using or storing
the pressure sensor chip in a place
exposed to corrosive gases (such as the
gases given off by organic solvents, sulfites, hydrogen sulfides, etc.) which will
adversely affect the performance of the
pressure sensor chip.
5. Quality check under actual loading
conditions
1) To assure reliability, check the sensor
under actual loading conditions. Avoid
any situation that may adversely affect
its performance.
2) As for test data, please contact us.
6. Other handling precautions
1) That using the wrong pressure range
or mounting method may result in accidents.
2) Air can be used directly as a pressure
medium. Consult with us before using a
corrosive gas (such as a gas given off by
an organic solvent, sulfite or hydrogen
sulfide) as the pressure medium.
3) The pressure sensor chip is positioned inside the pressure inlet. Never
poke wires or other foreign matter
through the pressure inlet since they
may damage the chip or block the inlet.
Avoid use when the atmospheric pressure inlet is blocked.
4) Leave pin No. 4 unconnected since
the pressure sensor chip may be damaged if a voltage is applied to this pin.
5) Use an operating pressure which is
within the rated pressure range. Using a
pressure beyond this range may cause
damage.
6) Since this pressure sensor chip does
not have a water-proof construction, consult with us if it is to be used in a location
where it may be sprayed with water, etc.
7) Avoid using the pressure sensor chip
in an environment where condensation
may form. Furthermore, its output may
fluctuate if any moisture adhering to it
freezes.
APPLICATION CIRCUIT
DIAGRAM (EXAMPLE)
MOUNTING METHOD
The pressure sensor is designed to convert a voltage by means of constant current drive and then, if necessary, it
amplifies the voltage for use. The circuit
shown below is a typical example of a
circuit in which the pressure sensor is
used.
Amplifier circuit unit
Constant current
circuit unit
Pressure
sensor
The general method for transmitting air
pressures differs depending on whether
the pressure is low or high.
• Checkpoints for use
<1> Select a pressure inlet pipe which is
sturdy enough to prevent pressure
leaks.
<2> Fix the pressure inlet pipe securely
so as to prevent pressure leaks.
<3> Do not block the pressure inlet pipe.
8) The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light.
Especially when pressure is to be
applied by means of a transparent tube,
take steps to prevent the pressure sensor chip from being exposed to light.
9) Avoid using the pressure sensor chip
where it will be susceptible to ultrasonic
or other high-frequency vibration.
10) Since static charge can damage the
pressure sensor chip, bear in mind the
following handling precautions.
• When storing the pressure sensor
chips, use a conductive material to
short the pins or wrap the entire chip in
aluminum foil. Plastic containers
should not be used to store or transport
the chips since they readily become
charged.
• When using the pressure sensor chips,
all the charged articles on the bench
surface and the work personnel should
be grounded so that any ambient static
will be safely discharged.
11) Due to the pressures involved, give
due consideration to the securing of the
pressure sensor DIP type and to the
securing and selection of the inlet tube.
Consult us if you have any queries.
Methods of transmitting air pressures
When the pressure
is low
(4.9 to 98.1 kPa)
Printedcircuit
board
When the pressure
is high
(196.1 to 980.7 kPa)
Printedcircuit
board
O-ring
Tube
Pressure
inlet pipe
If a tube is used as the pressure inlet pipe,
it may become disengaged. Therefore, use
a sturdy tube and secure it using O-rings.
OP
AMP
OP
AMP
OP
AMP
12/1/2002
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