LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY(0.39Inch) Pb Lead-Free Parts LFD415/6SBKS-XX/RP146-PF DATA SHEET DOC. NO REV. DATE : : QW0905- LFD415/6SBKS-XX/RP146-PF A : 30 - Mar. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LFD415/6SBKS-XX/RP146-PF Package Dimensions 7.0(0.276") 40.18(1.582") DIG.1 DIG.2 10.0 (0.39") DP1 DIG.3 DP3 DIG.4 DP2 10.16 (0.4") 12.8 (0.504") DP Ø 0.45 TYP LFD415/6SBKS-XX/RP146-PF LIGITEK A F G E D B C DP 14.6±0.5 2.54X7=17.78 (0.7") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LFD415/6SBKS-XX/RP146-PF Internal Circuit Diagram LFD416SBKS-XX/RP146-PF LFD415SBKS-XX/RP146-PF 14 16 13 3 5 11 15 7 A B DIG. C D 1 E F G DP A B DIG. C D 2 E F G DP DP1 12 DP3 10 A B DIG. C D 8 E F G DP A B DIG. C D 1 E F G DP A B DIG. C D 2 E F G DP DP1 2 DP2 A B DIG. C D 6 E F G DP 3 9 4 1 2 4 12 4 DP2 A B DIG. C D 6 E F G DP 9 1 14 16 13 3 5 11 15 7 DP3 3 10 A B DIG. C D 8 E F G DP 4 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LFD415/6SBKS-XX/RP146-PF Electrical Connection PIN NO. LFD415SBKS-XX/RP146-PF PIN NO. LFD416SBKS-XX/RP146-PF 1. Common Cathode Dig. 1 1. Common Anode Dig. 1 2. Common Cathode Dig. 2 2. Common Anode Dig. 2 3. Anode D 3. Cathode D 4. Cathode DP1,DP2 4. Anode DP1,DP2 5. Anode E 5. Cathode E 6. Common Cathode Dig. 3 6. Common Anode Dig.3 3 7. Anode DP 7. Cathode DP 8. Common Cathode Dig. 4 8. Common Anode Dig.4 9. Anode DP3 9. Cathode DP3 10. Cathode DP3 10. Anode DP3 11. Anode F 11. Cathode F 12. Anode DP1,DP2 12. Cathode DP1,DP2 13. Anode C 13. Cathode C 14. Anode A 14. Cathode A 15. Anode G 15. Cathode G 16. Anode B 16. Cathode B LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD415/6SBKS-XX/RP146-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SBKS Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 120 mW Ir 50 μA ESD 500 V Reverse Current Per Any Chip Electrostatic Discharge( * ) Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Part Selection And Application Information(Ratings at 25℃) common cathode Material Emitted or anode CHIP PART NO △λ Vf(v) (nm) Iv(mcd) IV-M Typ. Max. Min. Typ. Common Cathode LFD415SBKS-XX/RP146-PF 460 InGaN/SiC Blue LFD416SBKS-XX/RP146-PF Electrical λD (nm) 26 3.5 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.2 8.5 15.25 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD415/6SBKS-XX/RP146-PF Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Dominant Wavelength λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD415/6SBKS-XX/RP146-PF Page 6/8 Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.2 Relative Intensity vs. Forward Current 30 1.5 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 1 2 3 4 1.25 1.0 0.75 0.5 0.25 0 5 0 5 Relative Intensity@20mA Forward Current@20mA 40 30 20 10 0 50 75 Ambient Temperature( ℃) 20 25 30 Fig.4 Relative Intensity vs. Wavelength Fig.3 Forward Current vs. Temperature 25 15 Forward Current(mA) Forward Voltage(V) 0 10 100 1.0 0.5 0 380 430 480 530 580 Wavelength (nm) 630 680 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD415/6SBKS-XX/RP146-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD415/6SBKS-XX/RP146-PF Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11