ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E ® Data Sheet July 11, 2007 ±15kV ESD Protected, 3.3V, Full Fail-Safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers The Intersil ISL317XE are ±15kV IEC61000 ESD Protected, 3.3V-powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125mA/-100mA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are routed to a concentrator via an RS-485 network, so the high allowed node count minimizes the number of repeaters required. FN6307.3 Features • IEC61000 ESD Protection on RS-485 I/O Pins . . . . . ±15kV - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM • Full Fail-safe (Open, Short, Terminated/Floating) Receivers • Hot Plug - Tx and Rx Outputs Remain Three-state During Power-up (Only Versions with Output Enable Pins) • True 1/8 Unit Load Allows up to 256 Devices on the Bus • Single 3.3V Supply • High Data Rates . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps • Low Quiescent Supply Current . . . . . . . . . . .800μA (Max) - Ultra Low Shutdown Supply Current . . . . . . . . . . .10nA Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. • -7V to +12V Common Mode Input/Output Voltage Range Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. • Three State Rx and Tx Outputs Available The ISL3170E through ISL3175E utilize slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. Slew rate limited versions also include receiver input filtering to enhance noise immunity in the presence of slow input signals. The ISL3170E, ISL3171E, ISL3173E, ISL3174E, ISL3176E, ISL3177E are configured for full duplex (separate Rx input and Tx output pins) applications. The half duplex versions multiplex the Rx inputs and Tx outputs to allow transceivers with output disable functions in 8 Ld packages. • Half and Full Duplex Pinouts • Current Limiting and Thermal Shutdown for driver Overload Protection • Tiny MSOP Packages Consume 50% Less Board Space • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Automated Utility Meter Reading Systems • High Node Count Systems • Field Bus Networks • Security Camera Networks • Building Environmental Control/ Lighting Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER HALF/FULL DATA RATE DUPLEX (Mbps) SLEW-RATE LIMITED? HOT PLUG? # DEVICES ON BUS RX/TX ENABLE? QUIESCENT ICC (mA) LOW POWER SHUTDOWN? PIN COUNT ISL3170E FULL 0.25 YES YES 256 YES 510 YES 10, 14 ISL3171E FULL 0.25 YES NO 256 NO 510 NO 8 ISL3172E HALF 0.25 YES YES 256 YES 510 YES 8 ISL3173E FULL 0.5 YES YES 256 YES 510 YES 10, 14 ISL3174E FULL 0.5 YES NO 256 NO 510 NO 8 ISL3175E HALF 0.5 YES YES 256 YES 510 YES 8 ISL3176E FULL 20 NO YES 256 YES 510 YES 10, 14 ISL3177E FULL 20 NO NO 256 NO 510 NO 8 ISL3178E HALF 20 NO YES 256 YES 510 YES 8 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2006, 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Pinouts ISL3171E, ISL3174E, ISL3177E (8 LD MSOP, SOIC) TOP VIEW ISL3172E, ISL3175E, ISL3178E (8 LD MSOP, SOIC) TOP VIEW RO 1 8 VCC VCC 1 8 A RE 2 7 B/Z RO 2 7 B DE 3 6 A/Y DI 3 6 Z 5 Y DI 4 R D 5 GND GND 4 D ISL3170E, ISL3173E, ISL3176E (14 LD SOIC) TOP VIEW ISL3170E, ISL3173E, ISL3176E (10 LD MSOP) TOP VIEW RO 1 R 10 VCC NC 1 RE 2 9 A RO 2 DE 3 8 B RE 3 7 Z DE 4 6 Y DI 5 14 VCC R D DI 4 GND 5 13 NC R 12 A 11 B D 10 Z GND 6 9 Y GND 7 8 NC Ordering Information PART NUMBER (Notes 1, 2) PART MARKING ISL3170EIBZ 3170EIBZ ISL3170EIUZ ISL3171EIBZ ISL3171EIUZ ISL3172EIBZ ISL3172EIUZ ISL3173EIBZ ISL3173EIUZ ISL3174EIBZ ISL3174EIUZ ISL3175EIBZ ISL3175EIUZ ISL3176EIBZ TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # -40 to +85 14 Ld SOIC M14.15 3170Z -40 to +85 10 Ld MSOP M10.118 3171 EIBZ -40 to +85 8 Ld SOIC M8.15 3171Z -40 to +85 8 Ld MSOP M8.118 3172 EIBZ -40 to +85 8 Ld SOIC M8.15 3172Z -40 to +85 8 Ld MSOP M8.118 3173EIBZ -40 to +85 14 Ld SOIC M14.15 3173Z -40 to +85 10 Ld MSOP M10.118 3174 EIBZ -40 to +85 8 Ld SOIC M8.15 3174Z -40 to +85 8 Ld MSOP M8.118 3175 EIBZ -40 to +85 8 Ld SOIC M8.15 3175Z -40 to +85 8 Ld MSOP M8.118 3176EIBZ -40 to +85 14 Ld SOIC M14.15 ISL3176EIUZ 3176Z -40 to +85 10 Ld MSOP M10.118 ISL3177EIBZ 3177 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3177EIUZ 3177Z -40 to +85 8 Ld MSOP M8.118 ISL3178EIBZ 3178 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3178EIUZ 3178Z -40 to +85 8 Ld MSOP M8.118 NOTES: 1. Add “-T” suffix for tape and reel. 2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Truth Tables Truth Tables (continued) TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS RE DE DI Z Y X 1 1 0 1 X 1 0 1 0 0 0 X High-Z High-Z 1 0 X High-Z * High-Z * NOTE: *Shutdown Mode (See Note 9), except for ISL3171E, ISL3174E, ISL3177E RE DE DE Half Duplex Full Duplex OUTPUT A-B RO 0 0 X ≥ -0.05V 1 0 0 X ≤ -0.2V 0 0 0 X Inputs Open/Shorted 1 1 0 0 X High-Z * 1 1 1 X High-Z NOTE: *Shutdown Mode (See Note 9), except for ISL3171E, ISL3174E, ISL3177E Pin Descriptions PIN FUNCTION RO Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t required, connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the Tx enable function isn’t required, connect DE to VCC through a 1kΩ to 3kΩ resistor. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A/Y ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. B/Z ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. A ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input. B ±15kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input. Y ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output. Z ±15kV IEC61000 ESD Protected RS-485/422 level, inverting driver output. VCC System power supply input (3.0V to 3.6V). NC No Connection. 3 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Typical Operating Circuits ISL3172E, ISL3175E, ISL3178E +3.3V +3.3V + 8 0.1µF 0.1µF + 8 VCC 1 RO VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI RT RT DI 4 7 B/Z DE 3 6 A/Y RE 2 RO 1 R D GND GND 5 5 ISL3171E, ISL3174E, ISL3177E +3.3V +3.3V + 1 0.1µF 0.1µF + 1 VCC VCC RT A 8 2 RO R B 7 RT Z 6 3 DI Y 6 Z D 7 B Y 5 D 5 RO 2 R 8 A GND GND 4 4 DI 3 ISL3170E, ISL3173E, ISL3176E (PIN NUMBERS FOR SOIC) +3.3V + 14 VCC 2 RO R A 12 0.1µF +3.3V 0.1µF RT + 14 VCC 9 Y B 11 D 10 Z 3 RE DE 4 RE 3 4 DE Z 10 5 DI DI 5 Y 9 D GND 6, 7 4 RT 11 B R 12 A RO 2 GND 6, 7 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Absolute Maximum Ratings Thermal Information VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical, Note 3) θJA (°C/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 105 8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . 140 10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . 190 14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 128 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 4) PARAMETER TEMP (°C) MIN (Note 18) TYP RL = 100Ω (RS-422) (Figure 1A, Note 15) Full 2 2.3 - V RL = 54Ω (RS-485) (Figure 1A) Full 1.5 2 VCC V - - VCC SYMBOL TEST CONDITIONS MAX (Note 18) UNITS DC CHARACTERISTICS Driver Differential VOUT VOD No Load Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full 1.5 2.2 - V ΔVOD RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V VOC RL = 54Ω or 100Ω (Figure 1A) Full - 2 3 V ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V Logic Input High Voltage VIH DI, DE, RE Full 2 - - V Logic Input Low Voltage VIL DI, DE, RE Full - - 0.8 V DE, RE (Note 14) 25 - 100 - mV Logic Input Hysteresis VHYS Logic Input Current IIN1 DI = DE = RE = 0V or VCC (Note 17) Full -2 - 2 μA Input Current (A, B, A/Y, B/Z) IIN2 DE = 0V, VCC = 0V or VIN = 12V 3.6V VIN = -7V Full - 80 125 μA Output Leakage Current (Y, Z) (Full Duplex Versions Only, Note 12) IIN3 RE = 0V, DE = 0V, VCC = 0V or 3.6V Output Leakage Current (Y, Z) in Shutdown Mode (Full Duplex, Note 12) IIN4 IOSD1 Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage VTH Full -100 -50 - μA VIN = 12V Full - 10 40 μA VIN = -7V Full -40 -10 - μA VIN = 12V Full - 10 40 μA VIN = -7V Full -40 -10 - μA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 6) Full - - ±250 mA -7V ≤ VCM ≤ 12V Full -200 -125 -50 mV RE = VCC, DE = 0V, VCC = 0V or 3.6V Receiver Input Hysteresis ΔVTH VCM = 0V 25 - 15 - mV Receiver Output High Voltage VOH IO = -4mA, VID = -50mV Full VCC - 0.6 - - V 5 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 4) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 18) TYP MAX (Note 18) UNITS Receiver Output Low Voltage VOL IO = -4mA, VID = -200mV Full - 0.17 0.4 V Three-State (high impedance) Receiver Output Current (Note 12) IOZR 0.4V ≤ VO ≤ 2.4V Full -1 0.015 1 μA Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 96 150 - kΩ 0V ≤ VO ≤ VCC Full ±7 30 ±60 mA Full - 150 - °C DE = VCC, RE = 0V or VCC Full - 510 800 μA DE = 0V, RE = 0V Full - 480 700 μA DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.01 12 μA IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV IEC61000-4-2, Contact Discharge Method 25 - ±8 - kV Human Body Model, From Bus Pins to GND 25 - ±15 - kV HBM, per MIL-STD-883 Method 3015 25 - ±7 - kV Machine Model 25 - 200 - V VOD = ±1.5V, CD = 820pF (Figure 4, Note 16) Full 250 800 - kbps Receiver Short-Circuit Current IOSR Thermal Shutdown Threshold TSD SUPPLY CURRENT No-Load Supply Current (Note 5) Shutdown Supply Current (Note 12) ICC ISHDN DI = 0V or VCC ESD PERFORMANCE RS-485 Pins (A, Y, B, Z, A/Y, B/Z) All Pins DRIVER SWITCHING CHARACTERISTICS (ISL3170E, ISL3171E, ISL3172E, 250kbps) Maximum Data Rate fMAX Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 250 1100 1500 ns Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 6 100 ns tR, tF RDIFF = 54Ω, CD = 50pF (Figure 2) Full 350 960 1600 ns Driver Differential Rise or Fall Time Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) Full - 26 600 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) Full - 200 600 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 12) Full - 28 55 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 12) Full - 30 55 ns (Notes 9, 12) Full 50 200 600 ns Time to Shutdown tSHDN Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) Full - 180 700 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12) Full - 100 700 ns VOD = ±1.5V, CD = 820pF (Figure 4, Note 16) Full 500 1600 - kbps DRIVER SWITCHING CHARACTERISTICS (ISL3173E, ISL3174E, ISL3175E, 500kbps) Maximum Data Rate fMAX Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 180 350 800 ns Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 1 30 ns tR, tF RDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 380 800 ns Driver Differential Rise or Fall Time 6 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 4) TEMP (°C) MIN (Note 18) TYP RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) Full - 26 350 ns tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) Full - 100 350 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 12) Full - 28 55 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 12) Full - 30 55 ns (Notes 9, 12) Full 50 200 600 ns PARAMETER SYMBOL TEST CONDITIONS Driver Enable to Output High tZH Driver Enable to Output Low Time to Shutdown tSHDN MAX (Note 18) UNITS Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) Full - 180 700 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12) Full - 100 700 ns VOD = ±1.5V, CD = 350pF (Figure 4, Note 16) Full 20 28 - Mbps DRIVER SWITCHING CHARACTERISTICS (ISL3176E, ISL3177E, ISL3178E, 20Mbps) Maximum Data Rate fMAX Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 27 40 ns Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 1 3 ns RDIFF = 54Ω, CD = 50pF (Figure 2, Note 13) Full - - 11 ns RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 9 15 ns ΔtDSKEW Driver Output Skew, Part-to-Part Driver Differential Rise or Fall Time tR, tF Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) Full - 17 50 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) Full - 16 40 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 12) Full - 25 40 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 12) Full - 28 50 ns (Notes 9, 12) Full 50 200 600 ns Time to Shutdown tSHDN Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) Full - 180 700 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12) Full - 90 700 ns VID = ±1.5V (Note 16) ISL3170E-75E Full 12 20 - Mbps ISL3176E-78E Full 20 35 - Mbps ISL3170E-75E Full 25 70 120 ns ISL3176E-78E Full 25 33 60 ns (Figure 5) Full - 1.5 4 ns (Figure 5, Note 13) Full - - 15 ns RL = 1kΩ, CL = 15pF, ISL3170E-75E SW = GND (Figure 6), ISL3176E-78E (Notes 8, 12) Full 5 15 20 ns Full 5 11 17 ns ISL3170E-75E Full 5 15 20 ns ISL3176E-78E Full 5 11 17 ns RECEIVER SWITCHING CHARACTERISTICS (All Versions) Maximum Data Rate fMAX Receiver Input to Output Delay tPLH, tPHL Receiver Skew | tPLH - tPHL | tSKD ΔtRSKEW Receiver Skew, Part-to-Part Receiver Enable to Output High tZH Receiver Enable to Output Low tZL 7 (Figure 5) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 8, 12) FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 4) PARAMETER SYMBOL Receiver Disable from Output High tHZ Receiver Disable from Output Low RL = 1kΩ, CL = 15pF, ISL3170E-75E SW = GND (Figure 6), ISL3176E-78E (Note 12) tLZ Time to Shutdown TEST CONDITIONS RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 12) tSHDN TEMP (°C) MIN (Note 18) TYP MAX (Note 18) UNITS Full 5 12 20 ns Full 4 7 15 ns ISL3170E-75E Full 5 13 20 ns ISL3176E-78E Full 4 7 15 ns Full 50 180 600 ns (Notes 9, 12) Receiver Enable from Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 9, 11, 12) Full - 240 500 ns Receiver Enable from Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 9, 11, 12) Full - 240 500 ns NOTES: 4. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 5. Supply current specification is valid for loaded drivers when DE = 0V. 6. Applies to peak current. See “Typical Performance Curves” starting on page 12 for more information. 7. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 8. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 9. Versions with a shutdown feature are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See “Low Power Shutdown Mode” on page 12. 10. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN. 11. Set the RE signal high time >600ns to ensure that the device enters SHDN. 12. Does not apply to the ISL3171E, ISL3174E and ISL3177E. 13. ΔtSKEW is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). Only applies to the ISL3176E through ISL3178E. 14. ISL3170E through ISL3175E only. 15. VCC ≥ 3.15V 16. Limits established by characterization and are not production tested. 17. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” on page 3) through a 1kΩ to 3kΩ resistor. 18. Parts are 100% tested at +25°C. Over temperature limits established by characterization and are not production tested. Test Circuits and Waveforms VCC RL/2 DE 375Ω VCC Z DI Z DI VOD D DE Y Y RL/2 FIGURE 1A. VOD AND VOC VOC VCM VOD D RL = 60Ω -7V to +12V 375Ω FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 8 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V VCC tPHL tPLH DE Z DI RDIFF D OUT (Z) VOH OUT (Y) VOL CD Y SIGNAL GENERATOR 90% DIFF OUT (Y to Z) +VOD 90% 10% 10% tR -VOD tF SKEW = |tPLH - tPHL| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 500Ω VCC D SIGNAL GENERATOR SW Y GND 50pF 3V DE NOTE 9 1.5V 1.5V 0V tZH, tZH(SHDN) tHZ OUTPUT HIGH NOTE 9 VOH - 0.25V PARAMETER OUTPUT RE DI SW tHZ Y/Z X 1/0 GND tLZ Y/Z X 0/1 VCC tZL, tZL(SHDN) tZH Y/Z 0 (Note 7) 1/0 GND NOTE 9 tZL Y/Z 0 (Note 7) 0/1 VCC tZH(SHDN) Y/Z 1 (Note 10) 1/0 GND tZL(SHDN) Y/Z 1 (Note 10) 0/1 VOH 50% OUT (Y, Z) 0V tLZ VCC OUT (Y, Z) 50% VOL + 0.25V V OUTPUT LOW VCC FIGURE 3A. TEST CIRCUIT OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E) VCC DE 3V + Z DI 54Ω D CD Y DI 0V VOD - SIGNAL GENERATOR +VOD DIFF OUT (Y to Z) -VOD 0V FIGURE 4B. MEASUREMENT POINTS FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE 9 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Test Circuits and Waveforms (Continued) +1.5V RE GND A 15pF B R A 0V 0V RO -1.5V tPLH tPHL VCC SIGNAL GENERATOR 1.5V RO 1.5V 0V FIGURE 5B. MEASUREMENT POINTS FIGURE 5A. TEST CIRCUIT FIGURE 5. RECEIVER PROPAGATION DELAY RE B GND A R 1kΩ RO SW SIGNAL GENERATOR NOTE 9 VCC GND 3V RE 1.5V 1.5V 15pF 0V tZH, tZH(SHDN) NOTE 9 PARAMETER DE A SW tHZ X +1.5V GND V VOH - 0.25V OH 1.5V RO 0V tLZ X -1.5V VCC tZL, tZL(SHDN) tZH (Note 8) 0 +1.5V GND NOTE 9 tZL (Note 8) 0 -1.5V VCC tZH(SHDN) (Note 11) 0 +1.5V GND tZL(SHDN) (Note 11) 0 -1.5V VCC FIGURE 6A. TEST CIRCUIT tHZ OUTPUT HIGH tLZ VCC RO 1.5V VOL + 0.25V V OUTPUT LOW OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E) Application Information Receiver Features RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one-unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. 10 Receiver input resistance of 96kΩ surpasses the RS-422 spec of 4kΩ and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “one-eighth UL” transceivers and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Receiver inputs function with common mode voltages as great as +9V/-7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages and ground potential differences are realistic concerns. All the receivers include a “Full Fail-Safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating) or shorted. Fail-safe with shorted inputs is achieved by setting the Rx upper switching point to -50mV, thereby ensuring that the Rx sees 0V differential as a high input level. FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs (except on the ISL3171E, ISL3174E and ISL3177E) are tri-statable via the active low RE input. Driver Features The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. All drivers are tri-statable via the active high DE input, except on the ISL3171E, ISL3174E and ISL3177E. The 250kbps and 500kbps driver outputs are slew rate limited to minimize EMI and to reduce reflections in unterminated or improperly terminated networks. Outputs of the ISL3176E through ISL3178E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL317XE versions with output enable pins incorporate a “Hot Plug” function. During power up, circuitry monitoring VCC ensures that the Tx and Rx outputs remain disabled for a period of time, regardless of the state of DE and RE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. ESD Protection All pins on these devices include class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM and ±15kV IEC61000. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the 11 outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc. so it is difficult to obtain repeatable results. The ISL317XE RS-485 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. The ISL317XE survive ±8kV contact discharges on the RS-485 pins. Data Rate, Cables, and Terminations RS-485/422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 250kbps versions can operate at full data rates with lengths of several thousand feet. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Built-In Driver Overload Protection As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15°. If the contention persists, the thermal Typical Performance Curves shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode These CMOS transceivers all use a fraction of the power required by their bipolar counterparts, but some also include a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 50ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 7 through 11, at the end of the “Electrical Specification table” on page 8, for more information. VCC = 3.3V, TA = +25°C; Unless Otherwise Specified 2.35 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 120 100 80 60 40 20 0 0 0.5 1.0 1.5 2.0 2.5 3.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 2.30 2.25 2.15 2.10 2.05 2.00 RDIFF = 54Ω 1.95 1.90 1.85 -40 3.5 RDIFF = 100Ω 2.20 -25 25 50 75 85 TEMPERATURE (°C) FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 200 0.52 ISL3172E/75E/78E, DE = VCC, RE = X ISL3176E/77E/78E 150 0.51 Y OR Z = LOW ISL3170E THRU ISL3175E 100 0.50 ICC (mA) OUTPUT CURRENT (mA) 0 50 ISL3170E/73E/76E, DE = X, RE = 0V; ISL3171E/74E/77E 0.49 0 0.48 -50 Y OR Z = HIGH -100 0.47 ISL3172E/75E/78E, DE = 0V, RE = 0V ISL317XE -150 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 12 0.46 -40 -25 0 25 50 75 85 TEMPERATURE (°C) FIGURE 10. SUPPLY CURRENT vs TEMPERATURE FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Typical Performance Curves VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 8.0 1220 1200 1180 SKEW (ns) PROPAGATION DELAY (ns) 7.5 1160 1140 1120 tPHL 7.0 6.5 6.0 1100 |CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑| tPLH 1080 -40 5.5 -25 0 25 TEMPERATURE (°C) 50 75 FIGURE 11. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3170E, ISL3171E, ISL3172E) 370 1.4 365 1.2 360 1.0 355 -25 0 25 TEMPERATURE (°C) 50 75 85 FIGURE 12. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3170E, ISL3171E, ISL3172E) SKEW (ns) PROPAGATION DELAY (ns) -40 85 0.8 0.6 350 tPHL 0.4 345 tPLH 340 -40 -25 0 25 TEMPERATURE (°C) 50 75 85 FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3173E, ISL3174E, ISL3175E) 13 0.2 -40 |CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑| -25 0 25 TEMPERATURE (°C) 50 75 85 FIGURE 14. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3173E, ISL3174E, ISL3175E) FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Typical Performance Curves VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 32 0.95 31 0.90 0.85 29 28 SKEW (ns) PROPAGATION DELAY (ns) 30 27 tPHL 26 tPLH 25 0.80 0.75 0.70 24 0.65 23 |CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑| -25 0 25 TEMPERATURE (°C) 50 85 75 5 DI 0 5 RO DRIVER INPUT (V) RDIFF = 54Ω, CD = 50pF 0 3.0 2.5 B/Z 2.0 1.5 1.0 A/Y 0.5 0 TIME (400ns/DIV) FIGURE 17. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL3170E, ISL3171E, ISL3172E) 14 0 25 TEMPERATURE (°C) 50 85 75 FIGURE 16. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3176E, ISL3177E, ISL3178E) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3176E, ISL3177E, ISL3178E) -25 RDIFF = 54Ω, CD = 50pF 5 DI 0 5 RO DRIVER INPUT (V) -40 0.60 -40 RECEIVER OUTPUT (V) 22 0 3.0 2.5 A/Y 2.0 1.5 1.0 B/Z 0.5 0 TIME (400ns/DIV) FIGURE 18. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL3170E, ISL3171E, ISL3172E) FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E DI 0 5 RO 0 3.0 B/Z 2.0 1.5 A/Y 1.0 0.5 0 0 5 RO 0 3 2.5 A/Y 2 1.5 1 B/Z 0.5 0 TIME (200ns/DIV) TIME (200ns/DIV) DI 0 5 RO 0 3.0 B/Z 2.0 1.5 A/Y 1.0 RECEIVER OUTPUT (V) 5 DRIVER INPUT (V) RDIFF = 54Ω, CD = 50pF FIGURE 20. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL3173E, ISL3174E, ISL3175E) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) FIGURE 19. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL3173E, ISL3174E, ISL3175E) 2.5 5 DI 0.5 0 RDIFF = 54Ω, CD = 50pF 5 DI 0 5 RO DRIVER INPUT (V) 2.5 RDIFF = 54Ω, CD = 50pF DRIVER INPUT (V) 5 RECEIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DRIVER INPUT (V) VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves 0 3.0 2.5 A/Y 2.0 1.5 1.0 B/Z 0.5 0 TIME (10ns/DIV) TIME (10ns/DIV) FIGURE 21. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL3176E, ISL3177E, ISL3178E) FIGURE 22. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL3176E, ISL3177E, ISL3178E) RECEIVER OUTPUT CURRENT (mA) 35 Die Characteristics VOL, +25°C 30 SUBSTRATE POTENTIAL (POWERED UP): 25 GND VOL, +85°C VOH, +25°C 20 TRANSISTOR COUNT: 535 15 VOH, +85°C PROCESS: 10 Si Gate BiCMOS 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 RECEIVER OUTPUT VOLTAGE (V) FIGURE 23. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 15 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Mini Small Outline Plastic Packages (MSOP) M8.118 (JEDEC MO-187AA) N 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 INCHES E -B- INDEX AREA 1 2 0.20 (0.008) A B C TOP VIEW 4X θ 0.25 (0.010) R1 R GAUGE PLANE SEATING PLANE -CA 4X θ A2 A1 b -H- 0.10 (0.004) L SEATING PLANE C MIN MAX MIN MAX NOTES A 0.037 0.043 0.94 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.030 0.037 0.75 0.95 - b 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.116 0.120 2.95 3.05 4 0.026 BSC 0.20 (0.008) C C a SIDE VIEW CL E1 0.20 (0.008) C D -B- - 0.187 0.199 4.75 5.05 - L 0.016 0.028 0.40 0.70 6 0.037 REF N -A- 0.65 BSC E L1 e D SYMBOL e L1 MILLIMETERS 0.95 REF 8 R 0.003 R1 0 α - 8 - 0.07 0.003 - 5o 15o 0o 6o 7 - - 0.07 - - 5o 15o - 0o 6o Rev. 2 01/03 END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. 16 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) N 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e α B S 0.050 BSC - 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 α 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 1.27 BSC H N NOTES: MILLIMETERS 8 0° 8 8° 0° 7 8° Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 17 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Mini Small Outline Plastic Packages (MSOP) N M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 E INCHES SYMBOL -B- INDEX AREA 1 2 0.20 (0.008) A B C TOP VIEW 4X θ 0.25 (0.010) R1 R GAUGE PLANE A SEATING PLANE -C- A2 A1 b -He D 0.10 (0.004) 4X θ L SEATING PLANE C -A0.20 (0.008) C C a SIDE VIEW CL E1 0.20 (0.008) C D -B- END VIEW MILLIMETERS MAX MIN MAX NOTES A 0.037 0.043 0.94 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.030 0.037 0.75 0.95 - b 0.007 0.011 0.18 0.27 9 c 0.004 0.008 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.116 0.120 2.95 3.05 4 e L1 MIN 0.020 BSC 0.50 BSC - E 0.187 0.199 4.75 5.05 - L 0.016 0.028 0.40 0.70 6 L1 0.037 REF 0.95 REF - N 10 10 7 R 0.003 - 0.07 - - R1 0.003 - 0.07 - - θ 5o 15o 5o 15o - α 0o 6o 0o 6o Rev. 0 12/02 NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only 18 FN6307.3 July 11, 2007 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Small Outline Plastic Packages (SOIC) M14.15 (JEDEC MS-012-AB ISSUE C) N INDEX AREA H 0.25(0.010) M 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- α e A1 B 0.25(0.010) M C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3367 0.3444 8.55 8.75 3 E 0.1497 0.1574 3.80 4.00 4 e C 0.10(0.004) B S 0.050 BSC 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N NOTES: MILLIMETERS α 14 0o 14 8o 0o 7 8o Rev. 0 12/93 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 19 FN6307.3 July 11, 2007