TI1 LM431BIM3X Lm431 adjustable precision zener shunt regulator Datasheet

LM431
www.ti.com
SNVS020G – MAY 2000 – REVISED APRIL 2013
LM431 Adjustable Precision Zener Shunt Regulator
Check for Samples: LM431
FEATURES
DESCRIPTION
•
•
The LM431 is a 3-terminal adjustable shunt regulator
with ensured temperature stability over the entire
temperature range of operation. The output voltage
may be set at any level greater than 2.5V (VREF) up to
36V merely by selecting two external resistors that
act as a voltage divided network. Due to the sharp
turn-on characteristics this device is an excellent
replacement for many zener diode applications.
1
2
•
•
•
Average Temperature Coefficient 50 ppm/°C
Temperature Compensated for Operation Over
the Full Temperature Range
Programmable Output Voltage
Fast Turn-On Response
Low Output Noise
Connection Diagram
Figure 1. TO-92: Plastic Package
Top View
A.
Figure 2. SOT-23: 3-Lead Small Outline
Top View
Note: NC = Not internally connected.
Figure 3. SOIC: 8-Pin Surface Mount
Top view
Symbol and Functional Diagrams
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM431
SNVS020G – MAY 2000 – REVISED APRIL 2013
www.ti.com
DC Test Circuits
Note:
VZ = VREF (1 + R1/R2) + IREF• R1
Figure 4. Test Circuit for VZ = VREF
Figure 5. Test Circuit for VZ > VREF
Figure 6. Test Circuit for Off-State Current
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
−65°C to +150°C
Storage Temperature Range
Operating Temperature Range
−40°C to +85°C
Industrial (LM431xI)
Commercial (LM431xC)
Soldering Information
0°C to +70°C
Infrared or Convection (20 sec.)
235°C
Wave Soldering (10 sec.)
260°C (lead temp.)
Cathode Voltage
37V
−10 mA to +150 mA
Continuous Cathode Current
Reference Voltage
−0.5V
Reference Input Current
10 mA
Internal Power Dissipation (3) (4)
(1)
(2)
(3)
(4)
TO-92 Package
0.78W
SOIC Package
0.81W
SOT-23 Package
0.28W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its rated operating conditions.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
TJ Max = 150°C.
Ratings apply to ambient temperature at 25°C. Above this temperature, derate the TO-92 at 6.2 mW/°C, the SOIC at 6.5 mW/°C, the
SOT-23 at 2.2 mW/°C.
Operating Conditions
Min
Max
Cathode Voltage
VREF
37V
Cathode Current
1.0 mA
100 mA
2
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
LM431
www.ti.com
SNVS020G – MAY 2000 – REVISED APRIL 2013
LM431 Electrical Characteristics
TA = 25°C unless otherwise specified
Symbol
VREF
Parameter
Conditions
Reference Voltage
VDEV
Deviation of Reference Input Voltage Over
Temperature (1)
ΔVREF/ΔVZ
Ratio of the Change in Reference Voltage
to the Change in Cathode Voltage
Min
Typ
Max
Units
VZ = VREF, II = 10 mA
LM431A (Figure 4 )
2.440
2.495
2.550
V
VZ = VREF, II = 10 mA
LM431B (Figure 4 )
2.470
2.495
2.520
V
VZ = VREF, II = 10 mA
LM431C (Figure 4 )
2.485
2.500
2.510
V
8.0
17
mV
VZ from VREF to 10V
−1.4
−2.7
mV/V
VZ from 10V to 36V
−1.0
−2.0
2.0
4.0
μA
VZ = VREF, II = 10 mA,
TA = Full Range (Figure 4 )
IZ = 10 mA
(Figure 5 )
IREF
Reference Input Current
R1 = 10 kΩ, R2 = ∞, II = 10 mA
(Figure 5 )
∝IREF
Deviation of Reference Input Current over
Temperature
R1 = 10 kΩ, R2 = ∞, II = 10 mA,
TA = Full Range (Figure 5 )
0.4
1.2
μA
IZ(MIN)
Minimum Cathode Current for Regulation
VZ = VREF(Figure 4 )
0.4
1.0
mA
IZ(OFF)
Off-State Current
VZ = 36V, VREF = 0V (Figure 6)
0.3
1.0
μA
rZ
Dynamic Output Impedance (2)
VZ = VREF, LM431A,
Frequency = 0 Hz (Figure 4 )
0.75
Ω
VZ = VREF, LM431B, LM431C
Frequency = 0 Hz (Figure 4 )
0.50
Ω
(1)
Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature
range.
The average temperature coefficient of the reference input voltage, ∝VREF, is defined as:
Where:
T2 − T1 = full temperature change (0-70°C).
VREF can be positive or negative depending on whether the slope is positive or negative.
Example: VDEV = 8.0 mV, VREF = 2495 mV, T2 − T1 = 70°C, slope is positive.
(2)
The dynamic output impedance, rZ, is defined as:
When the device is programmed with two external resistors, R1 and R2, (see Figure 5 ), the dynamic output impedance of the overall
circuit, rZ, is defined as:
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
3
LM431
SNVS020G – MAY 2000 – REVISED APRIL 2013
www.ti.com
Equivalent Circuit
4
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
LM431
www.ti.com
SNVS020G – MAY 2000 – REVISED APRIL 2013
Typical Performance Characteristics
Input Current
vs
VZ
Thermal Information
Figure 7.
Figure 8.
Input Current
vs
VZ
Dynamic Impedance
vs
Frequency
Figure 9.
Figure 10.
Stability Boundary Conditions
Note: The areas under the curves represent conditions that may
cause the device to oscillate. For curves B, C, and D, R2 and V+ were
adjusted to establish the initial VZ and IZ conditions with CL = 0. V+
and CL were then adjusted to determine the ranges of stability.
Figure 11.
Figure 12.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
5
LM431
SNVS020G – MAY 2000 – REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
6
Test Circuit for Curve A Above
Test Circuit for Curves B, C and D Above
Figure 13.
Figure 14.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
LM431
www.ti.com
SNVS020G – MAY 2000 – REVISED APRIL 2013
Typical Applications
Figure 15. Shunt Regulator
Figure 16. Single Supply Comparator with Temperature Compensated Threshold
Figure 17. Series Regulator
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
7
LM431
SNVS020G – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 18. Output Control of a Three Terminal Fixed Regulator
Figure 19. Higher Current Shunt Regulator
Figure 20. Crow Bar
8
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
LM431
www.ti.com
SNVS020G – MAY 2000 – REVISED APRIL 2013
Figure 21. Over Voltage/Under Voltage Protection Circuit
Figure 22. Voltage Monitor
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
9
LM431
SNVS020G – MAY 2000 – REVISED APRIL 2013
www.ti.com
Figure 23. Delay Timer
Figure 24. Current Limiter or Current Source
Figure 25. Constant Current Sink
10
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
LM431
www.ti.com
SNVS020G – MAY 2000 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision F (April 2013) to Revision G
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM431
11
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM431ACM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LM431
ACM
LM431ACM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM431
ACM
LM431ACM3
ACTIVE
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
N1F
LM431ACM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1F
LM431ACM3X
ACTIVE
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
N1F
LM431ACM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1F
LM431ACMX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
LM431
ACM
LM431ACMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM431
ACM
LM431ACZ/LFT3
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM431
ACZ
LM431ACZ/LFT4
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM431
ACZ
LM431ACZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 85
LM431
ACZ
LM431AIM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LM431
AIM
LM431AIM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM431
AIM
LM431AIM3
ACTIVE
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
N1E
LM431AIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1E
LM431AIM3X
ACTIVE
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
N1E
LM431AIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1E
LM431AIMX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
LM431
AIM
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM431AIMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM431AIZ/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM431AIZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 85
LM431
AIZ
LM431BCM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
431
BCM
LM431BCM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
431
BCM
LM431BCM3
ACTIVE
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
N1D
LM431BCM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1D
LM431BCM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1D
LM431BCMX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
431
BCM
LM431BCMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
431
BCM
LM431BCZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 85
LM431
BCZ
LM431BIM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
431
BIM
LM431BIM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
431
BIM
LM431BIM3
ACTIVE
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
N1C
LM431BIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1C
LM431BIM3X
ACTIVE
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
N1C
LM431BIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1C
LM431BIMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
431
BIM
Addendum-Page 2
-40 to 85
LM431
AIM
LM431
AIZ
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM431CCM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
431
CCM
LM431CCM3
ACTIVE
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
N1B
LM431CCM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1B
LM431CCM3X
ACTIVE
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
N1B
LM431CCM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1B
LM431CCZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 85
LM431
CCZ
LM431CIM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
431
CIM
LM431CIM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
431
CIM
LM431CIM3
ACTIVE
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
-40 to 85
N1A
LM431CIM3/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1A
LM431CIM3X
ACTIVE
SOT-23
DBZ
3
3000
TBD
Call TI
Call TI
-40 to 85
N1A
LM431CIM3X/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N1A
LM431CIZ/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM431CIZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM431
CIZ
-40 to 85
LM431
CIZ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM431ACM3
SOT-23
DBZ
3
1000
178.0
8.4
LM431ACM3/NOPB
SOT-23
DBZ
3
1000
178.0
LM431ACM3X
SOT-23
DBZ
3
3000
178.0
LM431ACM3X/NOPB
SOT-23
DBZ
3
3000
LM431ACMX
SOIC
D
8
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM431ACMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM431AIM3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431AIM3/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431AIM3X
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431AIM3X/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431AIMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM431AIMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM431BCM3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431BCM3/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431BCM3X/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431BCMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM431BCMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM431BIM3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM431BIM3/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
LM431BIM3X
SOT-23
DBZ
3
3000
178.0
8.4
LM431BIM3X/NOPB
SOT-23
DBZ
3
3000
178.0
LM431BIMX/NOPB
SOIC
D
8
2500
330.0
LM431CCM3
SOT-23
DBZ
3
1000
178.0
LM431CCM3/NOPB
SOT-23
DBZ
3
1000
LM431CCM3X
SOT-23
DBZ
3
3000
LM431CCM3X/NOPB
SOT-23
DBZ
3
W
Pin1
(mm) Quadrant
3.3
2.9
1.22
4.0
8.0
Q3
3.3
2.9
1.22
4.0
8.0
Q3
8.4
3.3
2.9
1.22
4.0
8.0
Q3
12.4
6.5
5.4
2.0
8.0
12.0
Q1
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431CIM3
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431CIM3/NOPB
SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431CIM3X
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
LM431CIM3X/NOPB
SOT-23
DBZ
3
3000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM431ACM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431ACM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431ACM3X
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431ACM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431ACMX
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM431ACMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM431AIM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431AIM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431AIM3X
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431AIM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431AIMX
SOIC
D
8
2500
367.0
367.0
35.0
LM431AIMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM431BCM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431BCM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431BCM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431BCMX
SOIC
D
8
2500
367.0
367.0
35.0
LM431BCMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM431BIM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431BIM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431BIM3X
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431BIM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431BIMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM431CCM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431CCM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431CCM3X
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431CCM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431CIM3
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431CIM3/NOPB
SOT-23
DBZ
3
1000
210.0
185.0
35.0
LM431CIM3X
SOT-23
DBZ
3
3000
210.0
185.0
35.0
LM431CIM3X/NOPB
SOT-23
DBZ
3
3000
210.0
185.0
35.0
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages