LM431 www.ti.com SNVS020G – MAY 2000 – REVISED APRIL 2013 LM431 Adjustable Precision Zener Shunt Regulator Check for Samples: LM431 FEATURES DESCRIPTION • • The LM431 is a 3-terminal adjustable shunt regulator with ensured temperature stability over the entire temperature range of operation. The output voltage may be set at any level greater than 2.5V (VREF) up to 36V merely by selecting two external resistors that act as a voltage divided network. Due to the sharp turn-on characteristics this device is an excellent replacement for many zener diode applications. 1 2 • • • Average Temperature Coefficient 50 ppm/°C Temperature Compensated for Operation Over the Full Temperature Range Programmable Output Voltage Fast Turn-On Response Low Output Noise Connection Diagram Figure 1. TO-92: Plastic Package Top View A. Figure 2. SOT-23: 3-Lead Small Outline Top View Note: NC = Not internally connected. Figure 3. SOIC: 8-Pin Surface Mount Top view Symbol and Functional Diagrams 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM431 SNVS020G – MAY 2000 – REVISED APRIL 2013 www.ti.com DC Test Circuits Note: VZ = VREF (1 + R1/R2) + IREF• R1 Figure 4. Test Circuit for VZ = VREF Figure 5. Test Circuit for VZ > VREF Figure 6. Test Circuit for Off-State Current These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −65°C to +150°C Storage Temperature Range Operating Temperature Range −40°C to +85°C Industrial (LM431xI) Commercial (LM431xC) Soldering Information 0°C to +70°C Infrared or Convection (20 sec.) 235°C Wave Soldering (10 sec.) 260°C (lead temp.) Cathode Voltage 37V −10 mA to +150 mA Continuous Cathode Current Reference Voltage −0.5V Reference Input Current 10 mA Internal Power Dissipation (3) (4) (1) (2) (3) (4) TO-92 Package 0.78W SOIC Package 0.81W SOT-23 Package 0.28W Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. TJ Max = 150°C. Ratings apply to ambient temperature at 25°C. Above this temperature, derate the TO-92 at 6.2 mW/°C, the SOIC at 6.5 mW/°C, the SOT-23 at 2.2 mW/°C. Operating Conditions Min Max Cathode Voltage VREF 37V Cathode Current 1.0 mA 100 mA 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 LM431 www.ti.com SNVS020G – MAY 2000 – REVISED APRIL 2013 LM431 Electrical Characteristics TA = 25°C unless otherwise specified Symbol VREF Parameter Conditions Reference Voltage VDEV Deviation of Reference Input Voltage Over Temperature (1) ΔVREF/ΔVZ Ratio of the Change in Reference Voltage to the Change in Cathode Voltage Min Typ Max Units VZ = VREF, II = 10 mA LM431A (Figure 4 ) 2.440 2.495 2.550 V VZ = VREF, II = 10 mA LM431B (Figure 4 ) 2.470 2.495 2.520 V VZ = VREF, II = 10 mA LM431C (Figure 4 ) 2.485 2.500 2.510 V 8.0 17 mV VZ from VREF to 10V −1.4 −2.7 mV/V VZ from 10V to 36V −1.0 −2.0 2.0 4.0 μA VZ = VREF, II = 10 mA, TA = Full Range (Figure 4 ) IZ = 10 mA (Figure 5 ) IREF Reference Input Current R1 = 10 kΩ, R2 = ∞, II = 10 mA (Figure 5 ) ∝IREF Deviation of Reference Input Current over Temperature R1 = 10 kΩ, R2 = ∞, II = 10 mA, TA = Full Range (Figure 5 ) 0.4 1.2 μA IZ(MIN) Minimum Cathode Current for Regulation VZ = VREF(Figure 4 ) 0.4 1.0 mA IZ(OFF) Off-State Current VZ = 36V, VREF = 0V (Figure 6) 0.3 1.0 μA rZ Dynamic Output Impedance (2) VZ = VREF, LM431A, Frequency = 0 Hz (Figure 4 ) 0.75 Ω VZ = VREF, LM431B, LM431C Frequency = 0 Hz (Figure 4 ) 0.50 Ω (1) Deviation of reference input voltage, VDEV, is defined as the maximum variation of the reference input voltage over the full temperature range. The average temperature coefficient of the reference input voltage, ∝VREF, is defined as: Where: T2 − T1 = full temperature change (0-70°C). VREF can be positive or negative depending on whether the slope is positive or negative. Example: VDEV = 8.0 mV, VREF = 2495 mV, T2 − T1 = 70°C, slope is positive. (2) The dynamic output impedance, rZ, is defined as: When the device is programmed with two external resistors, R1 and R2, (see Figure 5 ), the dynamic output impedance of the overall circuit, rZ, is defined as: Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 3 LM431 SNVS020G – MAY 2000 – REVISED APRIL 2013 www.ti.com Equivalent Circuit 4 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 LM431 www.ti.com SNVS020G – MAY 2000 – REVISED APRIL 2013 Typical Performance Characteristics Input Current vs VZ Thermal Information Figure 7. Figure 8. Input Current vs VZ Dynamic Impedance vs Frequency Figure 9. Figure 10. Stability Boundary Conditions Note: The areas under the curves represent conditions that may cause the device to oscillate. For curves B, C, and D, R2 and V+ were adjusted to establish the initial VZ and IZ conditions with CL = 0. V+ and CL were then adjusted to determine the ranges of stability. Figure 11. Figure 12. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 5 LM431 SNVS020G – MAY 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 Test Circuit for Curve A Above Test Circuit for Curves B, C and D Above Figure 13. Figure 14. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 LM431 www.ti.com SNVS020G – MAY 2000 – REVISED APRIL 2013 Typical Applications Figure 15. Shunt Regulator Figure 16. Single Supply Comparator with Temperature Compensated Threshold Figure 17. Series Regulator Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 7 LM431 SNVS020G – MAY 2000 – REVISED APRIL 2013 www.ti.com Figure 18. Output Control of a Three Terminal Fixed Regulator Figure 19. Higher Current Shunt Regulator Figure 20. Crow Bar 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 LM431 www.ti.com SNVS020G – MAY 2000 – REVISED APRIL 2013 Figure 21. Over Voltage/Under Voltage Protection Circuit Figure 22. Voltage Monitor Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 9 LM431 SNVS020G – MAY 2000 – REVISED APRIL 2013 www.ti.com Figure 23. Delay Timer Figure 24. Current Limiter or Current Source Figure 25. Constant Current Sink 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 LM431 www.ti.com SNVS020G – MAY 2000 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision F (April 2013) to Revision G • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM431 11 PACKAGE OPTION ADDENDUM www.ti.com 18-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM431ACM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM431 ACM LM431ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM431 ACM LM431ACM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1F LM431ACM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1F LM431ACM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 N1F LM431ACM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1F LM431ACMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM431 ACM LM431ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM431 ACM LM431ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM431 ACZ LM431ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM431 ACZ LM431ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM431 ACZ LM431AIM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM431 AIM LM431AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM431 AIM LM431AIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1E LM431AIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1E LM431AIM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 N1E LM431AIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1E LM431AIMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM431 AIM Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-May-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM431AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM431AIZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM431AIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM431 AIZ LM431BCM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 431 BCM LM431BCM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 431 BCM LM431BCM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1D LM431BCM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1D LM431BCM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1D LM431BCMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 431 BCM LM431BCMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 431 BCM LM431BCZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM431 BCZ LM431BIM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 431 BIM LM431BIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 431 BIM LM431BIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1C LM431BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1C LM431BIM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 N1C LM431BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1C LM431BIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 431 BIM Addendum-Page 2 -40 to 85 LM431 AIM LM431 AIZ Samples PACKAGE OPTION ADDENDUM www.ti.com 18-May-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM431CCM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 431 CCM LM431CCM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1B LM431CCM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1B LM431CCM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 N1B LM431CCM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1B LM431CCZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM431 CCZ LM431CIM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 431 CIM LM431CIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 431 CIM LM431CIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1A LM431CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1A LM431CIM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 N1A LM431CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 N1A LM431CIZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM431CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM431 CIZ -40 to 85 LM431 CIZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-May-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM431ACM3 SOT-23 DBZ 3 1000 178.0 8.4 LM431ACM3/NOPB SOT-23 DBZ 3 1000 178.0 LM431ACM3X SOT-23 DBZ 3 3000 178.0 LM431ACM3X/NOPB SOT-23 DBZ 3 3000 LM431ACMX SOIC D 8 W Pin1 (mm) Quadrant 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431AIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431AIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431AIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431AIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431AIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431BCM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BCM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BCM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BCMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431BCMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431BIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM431BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 LM431BIM3X SOT-23 DBZ 3 3000 178.0 8.4 LM431BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 LM431BIMX/NOPB SOIC D 8 2500 330.0 LM431CCM3 SOT-23 DBZ 3 1000 178.0 LM431CCM3/NOPB SOT-23 DBZ 3 1000 LM431CCM3X SOT-23 DBZ 3 3000 LM431CCM3X/NOPB SOT-23 DBZ 3 W Pin1 (mm) Quadrant 3.3 2.9 1.22 4.0 8.0 Q3 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 12.4 6.5 5.4 2.0 8.0 12.0 Q1 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM431ACM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431ACM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431ACM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431ACM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431ACMX SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM431ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431AIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431AIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431AIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431AIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431AIMX SOIC D 8 2500 367.0 367.0 35.0 LM431AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431BCM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BCM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BCM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431BCMX SOIC D 8 2500 367.0 367.0 35.0 LM431BCMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431BIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431CCM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431CCM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431CCM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431CCM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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