TI1 LM380N Lm380 2.5w audio power amplifier Datasheet

LM380
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SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
LM380 2.5W Audio Power Amplifier
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FEATURES
DESCRIPTION
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The LM380 is a power audio amplifier for consumer
applications. In order to hold system cost to a
minimum, gain is internally fixed at 34 dB. A unique
input stage allows ground referenced input signals.
The output automatically self-centers to one-half the
supply voltage.
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Wide Supply Voltage Range: 10V-22V
Low Quiescent Power Drain: 0.13W (VS= 18V)
Voltage Gain Fixed at 50
High Peak Current Capability: 1.3A
Input Referenced to GND
High Input Impedance: 150kΩ
Low Distortion
Quiescent Output Voltage is at One-Half of the
Supply Voltage
Standard Dual-In-Line Package
The output is short circuit proof with internal thermal
limiting. The package outline is standard dual-in-line.
The LM380N uses a copper lead frame. The center
three pins on either side comprise a heat sink. This
makes the device easy to use in standard PC layouts.
Uses include simple phonograph amplifiers,
intercoms, line drivers, teaching machine outputs,
alarms, ultrasonic drivers, TV sound systems, AM-FM
radio, small servo drivers, power converters, etc.
A selected part for more power on higher supply
voltages is available as the LM384. For more
information see SNAA086.
Connection Diagrams
(Dual-In-Line Packages, Top View)
Figure 1. 14-Pin PDIP
See NFF0014A Package
Figure 2. 8-Pin PDIP
See P Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1994–2013, Texas Instruments Incorporated
LM380
SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
www.ti.com
Block and Schematic Diagrams
Figure 3. 14-Pin PDIP
Figure 4. 8-Pin PDIP
Figure 5.
2
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SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Supply Voltage
22V
Peak Current
1.3A
14-Pin PDIP (3)
Package Dissipation
8-Pin PDIP
8.3W
(3)
1.67W
Input Voltage
±0.5V
−65°C to +150°C
Storage Temperature
Operating Temperature
0°C to +70°C
Junction Temperature
+150°C
Lead Temperature (Soldering, 10 sec.)
+260°C
ESD rating to be determined
Thermal Resistance
(1)
(2)
(3)
θJC (14-Pin PDIP)
30°C/W
θJC (8-Pin PDIP)
37°C/W
θJA (14-Pin PDIP)
79°C/W
θJA (8-Pin PDIP)
107°C/W
"Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The package is to be derated at 15°C/W junction to heat sink pins for 14-pin pkg; 75°C/W for 8-pin.
Electrical Characteristics (1)
Symbol
Parameter
Conditions
RL = 8Ω, THD = 3% (2) (3)
POUT(RMS)
Output Power
AV
Gain
VOUT
Output Voltage Swing
ZIN
Input Resistance
THD
Total Harmonic Distortion
See (3) (4)
PSRR
Power Supply Rejection Ratio
See (5)
VS
Supply Voltage
BW
Bandwidth
IQ
Quiescent Supply Current
VOUTQ
Quiescent Output Voltage
IBIAS
Bias Current
ISC
Short Circuit Current
(1)
(2)
(3)
(4)
(5)
Min
Typ
40
RL = 8Ω
Units
W
50
60
14
Ω
0.2
%
38
POUT = 2W, RL = 8Ω
dB
22
100k
8
V/V
Vp-p
150k
10
Inputs Floating
Max
2.5
V
Hz
7
25
9.0
10
mA
V
100
nA
1.3
A
VS = 18V and TA = 25°C unless otherwise specified.
With device Pins 3, 4, 5, 10, 11, 12 soldered into a 1/16″ epoxy glass board with 2 ounce copper foil with a minimum surface of 6 square
inches.
CBYPASS = 0.47 μfd on Pin 1.
The maximum junction temperature of the LM380 is 150°C.
Rejection ratio referred to the output with CBYPASS = 5 μF.
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LM380
SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
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Heat Sink Dimensions
Staver Heat Sink #V-7
Staver Company
41 Saxon Ave.
P.O. Drawer H
Bayshore, NY 11706
Tel: (516) 666-8000
Copper Wings
2 Required
Soldered to
Pins 3, 4, 5,
10, 11, 12
Thickness 0.04
Inches
4
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LM380
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SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
Typical Performance Characteristics
Maximum Device Dissipation vs Ambient Temperature
Device Dissipation vs Output Power—4Ω Load
Figure 6.
Figure 7.
Device Dissipation vs Output Power—8Ω Load
Device Dissipation vsOutput Power—16Ω Load
Figure 8.
Figure 9.
Power Supply Current vs Supply Voltage
Total Harmonic Distortion vs Frequency
Figure 10.
Figure 11.
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LM380
SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
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Typical Performance Characteristics (continued)
6
Output Voltage Gain and Phase vs Frequency
Total Harmonic Distortion vs Output Power
Figure 12.
Figure 13.
Device Dissipation vs Output Power
Supply Decoupling vs Frequency
Figure 14.
Figure 15.
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SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
Typical Applications
Figure 16. Phono Amplifier
Figure 17. Bridge Amplifier
Figure 18. Intercom
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Figure 19. Phase Shift Oscillator
8
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SNAS546C – DECEMBER 1994 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
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Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM380N
ACTIVE
PDIP
NFF
14
25
TBD
Call TI
Call TI
0 to 70
LM380N
LM380N-8/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
SN
Level-1-NA-UNLIM
0 to 70
LM
380N-8
LM380N/NOPB
ACTIVE
PDIP
NFF
14
25
Pb-Free (RoHS
Exempt)
SN
Level-1-NA-UNLIM
0 to 70
LM380N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
MECHANICAL DATA
NFF0014A
N0014A
N14A (Rev G)
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