Holt HI-1570PST 5v monolithic dual variable amplitudetransceiver Datasheet

HI-1570
MIL-STD-1553 / 1760
5V Monolithic Dual Variable AmplitudeTransceiver
The HI-1570 is a low power CMOS dual +5V transceiver
with the ability to vary the amplitude of the transmitter
outputs. It is designed to meet the requirements of the
MIL-STD-1553 / 1760 specifications.
The transmitter section of each bus takes complementary
CMOS / TTL Manchester II bi-phase data and converts it
to differential voltages suitable for driving the bus isolation
transformer. Separate transmitter inhibit control signals
are provided for each transmitter. A single pin allows the
user to control the transmitter output amplitude.
The receiver section of each bus converts the 1553 bus
bi-phase differential data to complementary CMOS / TTL
data suitable for inputting to a Manchester decoder. Each
receiver has a separate enable input which can be used to
force the output of the receiver to a logic “0“.
To minimize the package size for this function, the
transmitter outputs are internally connected to the
receiver inputs so that only two pins are required for
connection to each coupling transformer. For designs
requiring independent access to transmitter and receiver
1553 signals, please contact your Holt Sales
representative.
FEATURES
!
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Compliant to MIL-STD-1553A & B,
MIL-STD-1760, ARINC 708A
44 N/C
43 BUSA
42 BUSA
41 BUSA
40 BUSA
39 VCONT A&B
38 VCONT A&B
37 TXA
36 TXA
35 N/C
34 N/C
PIN CONFIGURATIONS
DESCRIPTION
N/C 1
RXENA 2
GNDA 3
GNDA 4
GNDA 5
VDDA/B 6
VDDA/B 7
BUSB 8
BUSB 9
BUSB 10
BUSB 11
33 N/C
32 N/C
31 TXINHA
30 RXA
29 RXA
28 N/C
27 N/C
26 TXB
25 TXB
24 TXINHB
23 N/C
1570PCI
1570PCT
N/C 12
N/C 13
N/C 14
N/C 15
RXENB 16
GNDB 17
GNDB 18
GNDB 19
RXB 20
RXB 21
N/C 22
July 2009
44 Pin Plastic 7mm x 7mm
Chip-scale package
VCONT A&B 1
BUSA 2
BUSA 3
RXENA 4
GNDA 5
VDDA/B 6
BUSB 7
BUSB 8
RXENB 9
GNDB 10
1570PSI
1570PST
1570PSM
20
19
18
17
16
15
14
13
12
11
TXA
TXA
TXINHA
RXA
RXA
TXB
TXB
TXINHB
RXB
RXB
20 Pin Plastic ESOIC - WB package
CMOS technology for low standby power
Single +5V power supply
Variable transmitter output amplitude
Smallest footprint available in 7mm x 7mm
plastic chip-scale (QFN) package with
integral heatsink
Less than 1.0W maximum power dissipation
Industrial and extended temperature ranges
Industry standard pin configurations
VCONT A&B 1
20 TXA
BUSA 2
19 TXA
BUSA 3
18 TXINHA
17 RXA
RXENA 4
GNDA 5
VDDA/B 6
1570CDI
1570CDT
1570CDM
16 RXA
15 TXB
BUSB 7
14 TXB
BUSB 8
13 TXINHB
RXENB 9
12 RXB
GNDB 10
11 RXB
20 Pin Ceramic DIP package
(DS1570 Rev. G)
HOLT INTEGRATED CIRCUITS
www.holtic.com
07/09
HI-1570
PIN DESCRIPTIONS
PIN
SYMBOL
FUNCTION
VCONT A/B
analog Input
Transmit output amplitude control (0 - 5 Vdc, see Figure 4)
2
BUSA
analog output
MIL-STD-1533 bus driver A, positive signal
3
BUSA
analog output
MIL-STD-1553 bus driver A, negative signal
4
RXENA
digital input
5
GNDA
power supply
Ground for bus A
6
VDDA/B
power supply
+5 volt power for both bus A and bus B
1
DESCRIPTION
Receiver A enable. If low, forces RXA and RXA low
7
BUSB
analog output
MIL-STD-1533 bus driver B, positive signal
8
BUSB
analog output
MIL-STD-1553 bus driver B, negative signal
9
RXENB
digital input
10
GNDB
power supply
Ground for bus B
Receiver B enable. If low, forces RXB and RXB low
11
RXB
digital output
Receiver B output, inverted
12
RXB
digital output
Receiver B output, non-inverted
13
TXINHB
digital input
Transmit inhibit, bus B. If high BUSB, BUSB disabled
14
TXB
digital input
Transmitter B digital data input, non-inverted
15
TXB
digital input
Transmitter B digital data input, inverted
16
RXA
digital output
Receiver A output, inverted
17
RXA
digital output
Receiver A output, non-inverted
18
TXINHA
digital input
Transmit inhibit, bus A. If high BUSA, BUSA disabled
19
TXA
digital input
Transmitter A digital data input, non-inverted
20
TXA
digital input
Transmitter A digital data input, inverted
FUNCTIONAL DESCRIPTION
The HI-1570 data bus transceiver contains differential voltage source drivers and differential receivers. They are intended for applications using a MIL-STD-1553 A/B data
bus. The device produces a trapezoidal output waveform
during transmission.
TRANSMITTER
Data input to the device’s transmitter section is from the
complementary CMOS / TTL inputs TXA/B and TXA/B.
The transmitter accepts Manchester II bi-phase data and
converts it to differential voltages on BUSA/B and BUSA/B.
The transceiver outputs are either direct or transformer coupled to the MIL-STD-1553 data bus. Both coupling methods produce a nominal voltage on the bus of 7.5 volts peak
to peak at VCONT A&B = 5.0 Vdc. Refer to Figure 4 for
transmitter output amplitudes at other values of VCONT
A&B between 0 - 5 Vdc. (Contact your Holt Sales Representative about the 0 - 10 Vdc Control Voltage option).
The transmitter is automatically inhibited and placed in the
high impedance state when both TXA/B and TXA/B are either at a logic “1” or logic “0” simultaneously. A logic “1” applied to the TXINHA/B input will force the transmitter to the
high impedance state, regardless of the state of TXA/B and
TXA/B.
RECEIVER
The receiver accepts bi-phase differential data from the
MIL-STD-1553 bus through the same direct or transformer
coupled interface as the transmitter. The receiver’s differential input stage drives a filter and threshold comparator
that produces CMOS/TTL data at the RXA/B and RXA/B
output pins.
Each set of receiver outputs can be independently forced
to a logic "0" by setting RXENA or RXENB low.
MIL-STD-1553 BUS INTERFACE
A direct coupled interface (see Figure 2) uses a 1:2.5 ratio
isolation transformer and two 55 ohm isolation resistors
between the transformer and the bus.
In a transformer coupled interface (see Figure 3), the
transceiver is connected to a 1:1.79 isolation transformer
which in turn is connected to a 1:1.4 coupling transformer.
The transformer coupled method also requires two
coupling resistors equal to 75% of the bus characteristic
impedance (Zo) between the coupling transformer and the
bus.
HOLT INTEGRATED CIRCUITS
2
HI-1570
Data Bus
Each Bus
TRANSMITTER
Isolation
Transformer
VCONT A&B
Coupler
Network
BUSA/B
TXA/B
Transmit
Logic
Slope
Control
Direct or
Transformer
TXA/B
BUSA/B
TXINHA/B
RECEIVER
RXA/B
Input
Filter
Receive
Logic
RXA/B
RXENA/B
Comparator
Figure 1. Block Diagram
TRANSMIT WAVEFORM - EXAMPLE PATTERN
TXA/B
TXA/B
BUSA/B - BUSA/B
RECEIVE WAVEFORMS - EXAMPLE PATTERN
Vin
(Line to Line)
RXA/B
RXA/B
HOLT INTEGRATED CIRCUITS
3
HI-1570
RECOMMENDED OPERATING CONDITIONS
ABSOLUTE MAXIMUM RATINGS
Supply voltage (VDD)
Logic input voltage range
Supply Voltage
-0.3 V to +7 V
VDD....................................... 5V... ±5%
-0.3 V dc to +5.5 V
Receiver differential voltage
10 Vp-p
Temperature Range
Driver peak output current
+1.0 A
Power dissipation at 25°C
ceramic DIL, derate
1.0 W
7mW/°C
Solder Temperature
Industrial Screening.........-40°C to +85°C
Hi-Temp Screening........-55°C to +125°C
NOTE:
Stresses above absolute maximum
ratings or outside recommended operating
conditions may cause permanent damage to the
device. These are stress ratings only. Operation
at the limits is not recommended.
275°C for 10 sec.
Junction Temperature
175°C
Storage Temperature
-65°C to +150°C
DC ELECTRICAL CHARACTERISTICS
VDD = 5.0V, GND = 0V, VCONT A/B = 5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
4.75
5
5.25
V
Operating Voltage
VDD
Total Supply Current
ICC1
Not Transmitting
20
30
mA
ICC2
Transmit one bus @
50% duty cycle
200
340
mA
ICC3
Transmit one bus @
100% duty cycle
400
550
mA
0.11
W
0.95
W
Power Dissipation
PD1
Not Transmitting
PD2
Transmit one bus @
100% duty cycle
0.70
Min. Input Voltage
(HI)
VIH
Digital inputs
Max. Input Voltage
(LO)
VIL
Digital inputs
Min. Input Current
(HI)
IIH
VIH = 4.9V, Digital inputs
Max. Input Current
(LO)
IIL
VIL = 0.1V, Digital inputs
-20
µA
Min. Output Voltage
(HI)
VOH
IOUT = -0.4mA, Digital outputs
2.7
V
(LO)
VIH
IOUT = 4.0mA, Digital outputs
Max. Output Voltage
RECEIVER
2.0
1.4
1.4
V
0.8
V
20
µA
0.4
V
(Measured at Point “AD“ in Figure 2 unless otherwise specified)
Input resistance
Input capacitance
Common mode rejection ratio
Differential
CIN
Differential
CMRR
Input Level
VIN
Input common mode voltage
Threshold Voltage - Direct-coupled
RIN
Detect
VTHD
VTHND
Threshold Voltage - Transformer-coupled Detect
VTHD
No Detect
VTHND
5
40
Differential
pF
dB
9
Vp-p
-5.0
5.0
V-pk
1 Mhz Sine Wave
(Measured at Point “AD“ in Figure 2)
1.15
20.0
Vp-p
0.28
Vp-p
1 MHz Sine Wave
(Measured at Point “AT“ in Figure 3)
0.86
14.0
Vp-p
0.20
Vp-p
VICM
No Detect
KW
20
HOLT INTEGRATED CIRCUITS
4
HI-1570
DC ELECTRICAL CHARACTERISTICS (cont.)
VDD = 5.0V, GND = 0V, VCONT A/B = 5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
TRANSMITTER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
7.0
9.0
Vp-p
20.0
27.0
Vp-p
10.0
mVp-p
-90
90
mV
-250
250
mV
(Measured at Point “AD” in Figure 2 unless otherwise specified)
Output Voltage
Direct coupled
VOUT
Transformer coupled
VOUT
Output Noise
35W load
(Measured at Point “AD“ in Figure 2)
70W load
(Measured at Point “AT“ in Figure 3)
VON
Output Dynamic Offset Voltage
Direct coupled
VDYN
Transformer coupled
VDYN
Output Resistance
Differential, inhibited
35W load
(Measured at Point “AD“ in Figure 2)
70W load
(Measured at Point “AT“ in Figure 3)
ROUT
Differential, not transmitting
Output Capacitance
COUT
1 MHz sine wave
Control Line Resistance
RCONT
KW
10
15
pF
KW
5
AC ELECTRICAL CHARACTERISTICS
VDD = 5.0V, GND = 0V, VCONT A/B = 5.0V, TA =Operating Temperature Range (unless otherwise specified).
PARAMETER
RECEIVER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
450
ns
40
ns
(Measured at Point “AD” in Figure 2)
Receiver Delay
tDR
Receiver Enable Delay
From input zero crossing to RXA/B or RXA/B
From RXENA/B rising or falling edge to
tREN
RXA/B or RXA/B
TRANSMITTER
(Measured at Point “AD” in Figure 2)
Driver Delay
Rise time
Fall Time
Inhibit Delay
tDT
TXA/B, TXA/B to BUSA/B, BUSA/B
150
ns
tr
35 ohm load
100
300
ns
100
tf
35 ohm load
300
ns
tDI-H
Inhibited output
100
ns
tDI-L
Active output
150
ns
TRANSMITTER
1:2.5
55 W
BUSA/B
TXA/B
35 W
TXA/B
BUSA/B
TXINHA/B
Isolation
Transformer
55 W
VCONT A&B
55 W
Point “AD“
RECEIVER
2.5:1
RXA/B
Point “AD“
35 W
55 W
RXA/B
Isolation
Transformer
RXENA/B
Figure 2. Direct Coupled Test Circuits
HOLT INTEGRATED CIRCUITS
5
HI-1570
TRANSMITTER
1:1.79
Point
“AT”
1:1.4
BUSA/B
TXA/B
52.5 W
(.75 Zo)
35 W (.5 Zo)
TXA/B
BUSA/B
TXINHA/B
Isolation
Transformer
VCONT A&B
52.5 W
(.75 Zo)
1.4:1
Coupling
Transformer
Point
“AT” 1.79:1
52.5 W
(.75 Zo)
RECEIVER
RXA/B
35 W (.5 Zo)
52.5 W
(.75 Zo)
RXA/B
Coupling
Transformer
Isolation
Transformer
RXENA/B
Figure 3. Transformer Coupled Test Circuits
7.5
FS
Output Amplitude
(Vo p-p @ point AD)
Slope = DVo ÷ DVCONT A&B
6.0
0.8FS
4.5
0.6FS
3.0
0.4FS
1.5
0.2FS
0
0
1.0
2.0
3.0
4.0
0
5.0
Control Voltage - VCONT A&B
Figure 4. Transmitter Output Amplitude (Vo)
vs VCONT A&B Voltage
HOLT INTEGRATED CIRCUITS
6
HI-1570
HEAT SINK - ESOIC PACKAGE
APPLICATIONS NOTE
The HI-1570PSI/T/M all use a 20-pin thermally enhanced
SOIC package. The package include a metal heat sink
located on the bottom surface of the device. The heat
sink should be soldered down to the printed circuit board
for optimum thermal dissipation. The heat sink is also
electrically isolated and may be soldered to any
convenient power or ground plane.
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
THERMAL CHARACTERISTICS
PART NUMBER
PACKAGE STYLE
HI-1570PSI / T / M
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
HI-1570PSI / T / M
HI-1570CDI / T / M
HI-1570CDI / T / M
HI-1570PCI / T
HI-1570PCI / T
JUNCTION TEMPERATURE
CONDITION
ØJA
Heat sink
unsoldered
54°C/W
66°C
126°C
166°C
Heat sink
soldered
47°C/W
61°C
121°C
161°C
20-pin Ceramic
side-brazed DIP
Socketed
62°C/W
72°C
132°C
172°C
44-pin Plastic chipscale package
Heat sink
unsoldered
49°C/W
62°C
122°C
162°C
TA=25°C
TA=85°C TA=125°C
Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.
RECOMMENDED TRANSFORMERS
The HI-1570 transceiver has been characterized for
compliance with the electrical requirements of MIL-STD1553 when used with the following transformers. Holt
MANUFACTURER
Technoltrol
Premier Magnetics
Technoltrol
Premier Magnetics
recommends the Premier Magnetics parts as offering the
best combination of electrical performance, low cost and
small footprint.
PART NUMBER
APPLICATION
TURNS RATIO(S)
DIMENSIONS
TL1553-45
Isolation
Dual tapped 1:1.79, 1:2.5
.630 x .630 x .155 inches
PM-DB2725EX
Isolation
Dual tapped 1:1.79, 1:2.5
.500 x .500 x .375 inches
TQ1553-2
Stub coupling
1:1.4
.625 x .625 x .250 inches
PM-DB2702
Stub coupling
1:1.4
.625 x .625 x .250 inches
HOLT INTEGRATED CIRCUITS
7
HI-1570
ORDERING INFORMATION
HI - 1570PS x x (Plastic)
PART
NUMBER
Blank
F
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
NO
T
-55°C TO +125°C
T
NO
M
-55°C TO +125°C
M
YES
PART
NUMBER
RXENA = 0 RXENB = 0 PACKAGE
RXA RXA RXB RXB DESCRIPTION
1570PC
0
0
0
0
44 PIN PLASTIC CHIP-SCALE LPCC (44PSC)
not available with ‘M’ flow
1570PS
0
0
0
0
20 PIN PLASTIC ESOIC, Thermally Enhanced
Wide SOIC with Heat Sink (20HWE)
HI - 1570CD x (Ceramic)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
NO
Gold (Pb-free, RoHS compliant)
T
-55°C TO +125°C
T
NO
Gold (Pb-free, RoHS compliant)
M
-55°C TO +125°C
M
YES
PART
NUMBER
1570CD
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
RXENA = 0 RXENB = 0 PACKAGE
RXA RXA RXB RXB DESCRIPTION
0
0
0
0
20 PIN CERAMIC SIDE BRAZED DIP (20C)
HOLT INTEGRATED CIRCUITS
8
HI-1570
REVISION HISTORY
Document Rev. Date
Description of Change
DS1570
Clarification of transmitter and receiver functions in Description, clarified available
temperature ranges, and corrected a dimension in Recommended Transformers table.
Correct typographical errors in package dimensions.
F
09/26/08
G
07/24/09
HOLT INTEGRATED CIRCUITS
9
PACKAGE DIMENSIONS
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
Package Type: 20HWE
.0105 ± .0015
(.267 ± .038)
.504 ± .008
(12.79 ± .19)
.407 ± .013
(10.325 ± .32)
inches (millimeters)
.290 typ
(7.37)
Bottom
View
.205 typ
(5.21)
.295 ± .002
(7.493 ± .05)
Top View
See Detail A
.0165 ± .0035
(.419 ± .089)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.090 ± .01
(2.29 ± .25)
.050
BSC
(1.27)
0° to 8°
.0075 ± .004
(.191 ± .089)
.033 ± .017
(.838 ± .432)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Detail A
20-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 20C
1.000 ±.010
(25.400 ±.254)
.310 ±.010
(7.874 ±.254)
.050 TYP.
(1.270 TYP.)
.125 min
(3.175)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.300 ± .010
(7.620 ± .254)
.085 ±.009
(2.159 ± .229)
.200
max
(5.080)
.100
BSC
(2.54)
.017 ±.002
(.432 ±.051)
HOLT INTEGRATED CIRCUITS
10
.010 + 0. 02/-.001
(.254 ±.051/-.025)
PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE
inches (millimeters)
Package Type: 44PCS
.276
BSC
(7.00)
.203 ± .006
(5.15 ± .15)
.020 BSC
(0.50)
.276
BSC
(7.00)
.203 ± .006
(5.15 ± .15)
Top View
Bottom
View
.010
(0.25) typ
.039
max
(1.00)
.008 typ
(0.2)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
11
.016 ± .002
(0.40 ± .05)
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