HI-1570 MIL-STD-1553 / 1760 5V Monolithic Dual Variable AmplitudeTransceiver The HI-1570 is a low power CMOS dual +5V transceiver with the ability to vary the amplitude of the transmitter outputs. It is designed to meet the requirements of the MIL-STD-1553 / 1760 specifications. The transmitter section of each bus takes complementary CMOS / TTL Manchester II bi-phase data and converts it to differential voltages suitable for driving the bus isolation transformer. Separate transmitter inhibit control signals are provided for each transmitter. A single pin allows the user to control the transmitter output amplitude. The receiver section of each bus converts the 1553 bus bi-phase differential data to complementary CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic “0“. To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs so that only two pins are required for connection to each coupling transformer. For designs requiring independent access to transmitter and receiver 1553 signals, please contact your Holt Sales representative. FEATURES ! ! ! ! ! ! ! ! Compliant to MIL-STD-1553A & B, MIL-STD-1760, ARINC 708A 44 N/C 43 BUSA 42 BUSA 41 BUSA 40 BUSA 39 VCONT A&B 38 VCONT A&B 37 TXA 36 TXA 35 N/C 34 N/C PIN CONFIGURATIONS DESCRIPTION N/C 1 RXENA 2 GNDA 3 GNDA 4 GNDA 5 VDDA/B 6 VDDA/B 7 BUSB 8 BUSB 9 BUSB 10 BUSB 11 33 N/C 32 N/C 31 TXINHA 30 RXA 29 RXA 28 N/C 27 N/C 26 TXB 25 TXB 24 TXINHB 23 N/C 1570PCI 1570PCT N/C 12 N/C 13 N/C 14 N/C 15 RXENB 16 GNDB 17 GNDB 18 GNDB 19 RXB 20 RXB 21 N/C 22 July 2009 44 Pin Plastic 7mm x 7mm Chip-scale package VCONT A&B 1 BUSA 2 BUSA 3 RXENA 4 GNDA 5 VDDA/B 6 BUSB 7 BUSB 8 RXENB 9 GNDB 10 1570PSI 1570PST 1570PSM 20 19 18 17 16 15 14 13 12 11 TXA TXA TXINHA RXA RXA TXB TXB TXINHB RXB RXB 20 Pin Plastic ESOIC - WB package CMOS technology for low standby power Single +5V power supply Variable transmitter output amplitude Smallest footprint available in 7mm x 7mm plastic chip-scale (QFN) package with integral heatsink Less than 1.0W maximum power dissipation Industrial and extended temperature ranges Industry standard pin configurations VCONT A&B 1 20 TXA BUSA 2 19 TXA BUSA 3 18 TXINHA 17 RXA RXENA 4 GNDA 5 VDDA/B 6 1570CDI 1570CDT 1570CDM 16 RXA 15 TXB BUSB 7 14 TXB BUSB 8 13 TXINHB RXENB 9 12 RXB GNDB 10 11 RXB 20 Pin Ceramic DIP package (DS1570 Rev. G) HOLT INTEGRATED CIRCUITS www.holtic.com 07/09 HI-1570 PIN DESCRIPTIONS PIN SYMBOL FUNCTION VCONT A/B analog Input Transmit output amplitude control (0 - 5 Vdc, see Figure 4) 2 BUSA analog output MIL-STD-1533 bus driver A, positive signal 3 BUSA analog output MIL-STD-1553 bus driver A, negative signal 4 RXENA digital input 5 GNDA power supply Ground for bus A 6 VDDA/B power supply +5 volt power for both bus A and bus B 1 DESCRIPTION Receiver A enable. If low, forces RXA and RXA low 7 BUSB analog output MIL-STD-1533 bus driver B, positive signal 8 BUSB analog output MIL-STD-1553 bus driver B, negative signal 9 RXENB digital input 10 GNDB power supply Ground for bus B Receiver B enable. If low, forces RXB and RXB low 11 RXB digital output Receiver B output, inverted 12 RXB digital output Receiver B output, non-inverted 13 TXINHB digital input Transmit inhibit, bus B. If high BUSB, BUSB disabled 14 TXB digital input Transmitter B digital data input, non-inverted 15 TXB digital input Transmitter B digital data input, inverted 16 RXA digital output Receiver A output, inverted 17 RXA digital output Receiver A output, non-inverted 18 TXINHA digital input Transmit inhibit, bus A. If high BUSA, BUSA disabled 19 TXA digital input Transmitter A digital data input, non-inverted 20 TXA digital input Transmitter A digital data input, inverted FUNCTIONAL DESCRIPTION The HI-1570 data bus transceiver contains differential voltage source drivers and differential receivers. They are intended for applications using a MIL-STD-1553 A/B data bus. The device produces a trapezoidal output waveform during transmission. TRANSMITTER Data input to the device’s transmitter section is from the complementary CMOS / TTL inputs TXA/B and TXA/B. The transmitter accepts Manchester II bi-phase data and converts it to differential voltages on BUSA/B and BUSA/B. The transceiver outputs are either direct or transformer coupled to the MIL-STD-1553 data bus. Both coupling methods produce a nominal voltage on the bus of 7.5 volts peak to peak at VCONT A&B = 5.0 Vdc. Refer to Figure 4 for transmitter output amplitudes at other values of VCONT A&B between 0 - 5 Vdc. (Contact your Holt Sales Representative about the 0 - 10 Vdc Control Voltage option). The transmitter is automatically inhibited and placed in the high impedance state when both TXA/B and TXA/B are either at a logic “1” or logic “0” simultaneously. A logic “1” applied to the TXINHA/B input will force the transmitter to the high impedance state, regardless of the state of TXA/B and TXA/B. RECEIVER The receiver accepts bi-phase differential data from the MIL-STD-1553 bus through the same direct or transformer coupled interface as the transmitter. The receiver’s differential input stage drives a filter and threshold comparator that produces CMOS/TTL data at the RXA/B and RXA/B output pins. Each set of receiver outputs can be independently forced to a logic "0" by setting RXENA or RXENB low. MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2.5 ratio isolation transformer and two 55 ohm isolation resistors between the transformer and the bus. In a transformer coupled interface (see Figure 3), the transceiver is connected to a 1:1.79 isolation transformer which in turn is connected to a 1:1.4 coupling transformer. The transformer coupled method also requires two coupling resistors equal to 75% of the bus characteristic impedance (Zo) between the coupling transformer and the bus. HOLT INTEGRATED CIRCUITS 2 HI-1570 Data Bus Each Bus TRANSMITTER Isolation Transformer VCONT A&B Coupler Network BUSA/B TXA/B Transmit Logic Slope Control Direct or Transformer TXA/B BUSA/B TXINHA/B RECEIVER RXA/B Input Filter Receive Logic RXA/B RXENA/B Comparator Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN TXA/B TXA/B BUSA/B - BUSA/B RECEIVE WAVEFORMS - EXAMPLE PATTERN Vin (Line to Line) RXA/B RXA/B HOLT INTEGRATED CIRCUITS 3 HI-1570 RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS Supply voltage (VDD) Logic input voltage range Supply Voltage -0.3 V to +7 V VDD....................................... 5V... ±5% -0.3 V dc to +5.5 V Receiver differential voltage 10 Vp-p Temperature Range Driver peak output current +1.0 A Power dissipation at 25°C ceramic DIL, derate 1.0 W 7mW/°C Solder Temperature Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C NOTE: Stresses above absolute maximum ratings or outside recommended operating conditions may cause permanent damage to the device. These are stress ratings only. Operation at the limits is not recommended. 275°C for 10 sec. Junction Temperature 175°C Storage Temperature -65°C to +150°C DC ELECTRICAL CHARACTERISTICS VDD = 5.0V, GND = 0V, VCONT A/B = 5.0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS 4.75 5 5.25 V Operating Voltage VDD Total Supply Current ICC1 Not Transmitting 20 30 mA ICC2 Transmit one bus @ 50% duty cycle 200 340 mA ICC3 Transmit one bus @ 100% duty cycle 400 550 mA 0.11 W 0.95 W Power Dissipation PD1 Not Transmitting PD2 Transmit one bus @ 100% duty cycle 0.70 Min. Input Voltage (HI) VIH Digital inputs Max. Input Voltage (LO) VIL Digital inputs Min. Input Current (HI) IIH VIH = 4.9V, Digital inputs Max. Input Current (LO) IIL VIL = 0.1V, Digital inputs -20 µA Min. Output Voltage (HI) VOH IOUT = -0.4mA, Digital outputs 2.7 V (LO) VIH IOUT = 4.0mA, Digital outputs Max. Output Voltage RECEIVER 2.0 1.4 1.4 V 0.8 V 20 µA 0.4 V (Measured at Point “AD“ in Figure 2 unless otherwise specified) Input resistance Input capacitance Common mode rejection ratio Differential CIN Differential CMRR Input Level VIN Input common mode voltage Threshold Voltage - Direct-coupled RIN Detect VTHD VTHND Threshold Voltage - Transformer-coupled Detect VTHD No Detect VTHND 5 40 Differential pF dB 9 Vp-p -5.0 5.0 V-pk 1 Mhz Sine Wave (Measured at Point “AD“ in Figure 2) 1.15 20.0 Vp-p 0.28 Vp-p 1 MHz Sine Wave (Measured at Point “AT“ in Figure 3) 0.86 14.0 Vp-p 0.20 Vp-p VICM No Detect KW 20 HOLT INTEGRATED CIRCUITS 4 HI-1570 DC ELECTRICAL CHARACTERISTICS (cont.) VDD = 5.0V, GND = 0V, VCONT A/B = 5.0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER TRANSMITTER SYMBOL CONDITION MIN TYP MAX UNITS 7.0 9.0 Vp-p 20.0 27.0 Vp-p 10.0 mVp-p -90 90 mV -250 250 mV (Measured at Point “AD” in Figure 2 unless otherwise specified) Output Voltage Direct coupled VOUT Transformer coupled VOUT Output Noise 35W load (Measured at Point “AD“ in Figure 2) 70W load (Measured at Point “AT“ in Figure 3) VON Output Dynamic Offset Voltage Direct coupled VDYN Transformer coupled VDYN Output Resistance Differential, inhibited 35W load (Measured at Point “AD“ in Figure 2) 70W load (Measured at Point “AT“ in Figure 3) ROUT Differential, not transmitting Output Capacitance COUT 1 MHz sine wave Control Line Resistance RCONT KW 10 15 pF KW 5 AC ELECTRICAL CHARACTERISTICS VDD = 5.0V, GND = 0V, VCONT A/B = 5.0V, TA =Operating Temperature Range (unless otherwise specified). PARAMETER RECEIVER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS 450 ns 40 ns (Measured at Point “AD” in Figure 2) Receiver Delay tDR Receiver Enable Delay From input zero crossing to RXA/B or RXA/B From RXENA/B rising or falling edge to tREN RXA/B or RXA/B TRANSMITTER (Measured at Point “AD” in Figure 2) Driver Delay Rise time Fall Time Inhibit Delay tDT TXA/B, TXA/B to BUSA/B, BUSA/B 150 ns tr 35 ohm load 100 300 ns 100 tf 35 ohm load 300 ns tDI-H Inhibited output 100 ns tDI-L Active output 150 ns TRANSMITTER 1:2.5 55 W BUSA/B TXA/B 35 W TXA/B BUSA/B TXINHA/B Isolation Transformer 55 W VCONT A&B 55 W Point “AD“ RECEIVER 2.5:1 RXA/B Point “AD“ 35 W 55 W RXA/B Isolation Transformer RXENA/B Figure 2. Direct Coupled Test Circuits HOLT INTEGRATED CIRCUITS 5 HI-1570 TRANSMITTER 1:1.79 Point “AT” 1:1.4 BUSA/B TXA/B 52.5 W (.75 Zo) 35 W (.5 Zo) TXA/B BUSA/B TXINHA/B Isolation Transformer VCONT A&B 52.5 W (.75 Zo) 1.4:1 Coupling Transformer Point “AT” 1.79:1 52.5 W (.75 Zo) RECEIVER RXA/B 35 W (.5 Zo) 52.5 W (.75 Zo) RXA/B Coupling Transformer Isolation Transformer RXENA/B Figure 3. Transformer Coupled Test Circuits 7.5 FS Output Amplitude (Vo p-p @ point AD) Slope = DVo ÷ DVCONT A&B 6.0 0.8FS 4.5 0.6FS 3.0 0.4FS 1.5 0.2FS 0 0 1.0 2.0 3.0 4.0 0 5.0 Control Voltage - VCONT A&B Figure 4. Transmitter Output Amplitude (Vo) vs VCONT A&B Voltage HOLT INTEGRATED CIRCUITS 6 HI-1570 HEAT SINK - ESOIC PACKAGE APPLICATIONS NOTE The HI-1570PSI/T/M all use a 20-pin thermally enhanced SOIC package. The package include a metal heat sink located on the bottom surface of the device. The heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is also electrically isolated and may be soldered to any convenient power or ground plane. Holt Applications Note AN-500 provides circuit design notes regarding the use of Holt's family of MIL-STD-1553 transceivers. Layout considerations, as well as recommended interface and protection components are included. THERMAL CHARACTERISTICS PART NUMBER PACKAGE STYLE HI-1570PSI / T / M 20-pin Thermally enhanced plastic SOIC (ESOIC) HI-1570PSI / T / M HI-1570CDI / T / M HI-1570CDI / T / M HI-1570PCI / T HI-1570PCI / T JUNCTION TEMPERATURE CONDITION ØJA Heat sink unsoldered 54°C/W 66°C 126°C 166°C Heat sink soldered 47°C/W 61°C 121°C 161°C 20-pin Ceramic side-brazed DIP Socketed 62°C/W 72°C 132°C 172°C 44-pin Plastic chipscale package Heat sink unsoldered 49°C/W 62°C 122°C 162°C TA=25°C TA=85°C TA=125°C Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled. RECOMMENDED TRANSFORMERS The HI-1570 transceiver has been characterized for compliance with the electrical requirements of MIL-STD1553 when used with the following transformers. Holt MANUFACTURER Technoltrol Premier Magnetics Technoltrol Premier Magnetics recommends the Premier Magnetics parts as offering the best combination of electrical performance, low cost and small footprint. PART NUMBER APPLICATION TURNS RATIO(S) DIMENSIONS TL1553-45 Isolation Dual tapped 1:1.79, 1:2.5 .630 x .630 x .155 inches PM-DB2725EX Isolation Dual tapped 1:1.79, 1:2.5 .500 x .500 x .375 inches TQ1553-2 Stub coupling 1:1.4 .625 x .625 x .250 inches PM-DB2702 Stub coupling 1:1.4 .625 x .625 x .250 inches HOLT INTEGRATED CIRCUITS 7 HI-1570 ORDERING INFORMATION HI - 1570PS x x (Plastic) PART NUMBER Blank F LEAD FINISH Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) PART NUMBER TEMPERATURE RANGE FLOW BURN IN I -40°C TO +85°C I NO T -55°C TO +125°C T NO M -55°C TO +125°C M YES PART NUMBER RXENA = 0 RXENB = 0 PACKAGE RXA RXA RXB RXB DESCRIPTION 1570PC 0 0 0 0 44 PIN PLASTIC CHIP-SCALE LPCC (44PSC) not available with ‘M’ flow 1570PS 0 0 0 0 20 PIN PLASTIC ESOIC, Thermally Enhanced Wide SOIC with Heat Sink (20HWE) HI - 1570CD x (Ceramic) PART NUMBER TEMPERATURE RANGE FLOW BURN IN I -40°C TO +85°C I NO Gold (Pb-free, RoHS compliant) T -55°C TO +125°C T NO Gold (Pb-free, RoHS compliant) M -55°C TO +125°C M YES PART NUMBER 1570CD LEAD FINISH Tin / Lead (Sn / Pb) Solder RXENA = 0 RXENB = 0 PACKAGE RXA RXA RXB RXB DESCRIPTION 0 0 0 0 20 PIN CERAMIC SIDE BRAZED DIP (20C) HOLT INTEGRATED CIRCUITS 8 HI-1570 REVISION HISTORY Document Rev. Date Description of Change DS1570 Clarification of transmitter and receiver functions in Description, clarified available temperature ranges, and corrected a dimension in Recommended Transformers table. Correct typographical errors in package dimensions. F 09/26/08 G 07/24/09 HOLT INTEGRATED CIRCUITS 9 PACKAGE DIMENSIONS 20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB (Wide Body, Thermally Enhanced) Package Type: 20HWE .0105 ± .0015 (.267 ± .038) .504 ± .008 (12.79 ± .19) .407 ± .013 (10.325 ± .32) inches (millimeters) .290 typ (7.37) Bottom View .205 typ (5.21) .295 ± .002 (7.493 ± .05) Top View See Detail A .0165 ± .0035 (.419 ± .089) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. .090 ± .01 (2.29 ± .25) .050 BSC (1.27) 0° to 8° .0075 ± .004 (.191 ± .089) .033 ± .017 (.838 ± .432) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) Detail A 20-PIN CERAMIC SIDE-BRAZED DIP inches (millimeters) Package Type: 20C 1.000 ±.010 (25.400 ±.254) .310 ±.010 (7.874 ±.254) .050 TYP. (1.270 TYP.) .125 min (3.175) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) .300 ± .010 (7.620 ± .254) .085 ±.009 (2.159 ± .229) .200 max (5.080) .100 BSC (2.54) .017 ±.002 (.432 ±.051) HOLT INTEGRATED CIRCUITS 10 .010 + 0. 02/-.001 (.254 ±.051/-.025) PACKAGE DIMENSIONS 44-PIN PLASTIC CHIP-SCALE PACKAGE inches (millimeters) Package Type: 44PCS .276 BSC (7.00) .203 ± .006 (5.15 ± .15) .020 BSC (0.50) .276 BSC (7.00) .203 ± .006 (5.15 ± .15) Top View Bottom View .010 (0.25) typ .039 max (1.00) .008 typ (0.2) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 11 .016 ± .002 (0.40 ± .05)