Microchip DSPIC30F2013AT-20I/PF-ES General purpose and sensor families high-performance digital signal controller Datasheet

dsPIC30F Data Sheet
General Purpose and Sensor Families
High-Performance
Digital Signal Controllers
 2004 Microchip Technology Inc.
Preliminary
DS70083G
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70083G-page ii
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
dsPIC30F Enhanced Flash 16-bit Digital Signal Controllers
General Purpose and Sensor Families
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
High Performance Modified RISC CPU:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Modified Harvard architecture
C compiler optimized instruction set architecture
84 base instructions
24-bit wide instructions, 16-bit wide data path
Linear program memory addressing up to 4M
instruction words
Linear data memory addressing up to 64 Kbytes
Up to 144 Kbytes on-chip Flash program space
Up to 48K instruction words
Up to 8 Kbytes of on-chip data RAM
Up to 4 Kbytes of non-volatile data EEPROM
16 x 16-bit working register array
Three Address Generation Units that enable:
- Dual data fetch
- Accumulator write back for DSP operations
Flexible Addressing modes supporting:
- Indirect, Modulo and Bit-Reversed modes
Two 40-bit wide accumulators with optional
saturation logic
17-bit x 17-bit single cycle hardware fractional/
integer multiplier
Single cycle Multiply-Accumulate (MAC)
operation
40-stage Barrel Shifter
Up to 30 MIPs operation:
- DC to 40 MHz external clock input
- 4 MHz-10 MHz oscillator input with
PLL active (4x, 8x, 16x)
Up to 41 interrupt sources:
- 8 user selectable priority levels
Vector table with up to 62 vectors:
- 54 interrupt vectors
- 8 processor exceptions and software traps
 2004 Microchip Technology Inc.
Peripheral Features:
• High current sink/source I/O pins: 25 mA/25 mA
• Up to 5 external interrupt sources
• Timer module with programmable prescaler:
- Up to five 16-bit timers/counters; optionally
pair up 16-bit timers into 32-bit timer modules
• 16-bit Capture input functions
• 16-bit Compare/PWM output functions:
- Dual Compare mode available
• Data Converter Interface (DCI) supports common
audio Codec protocols, including I2S and AC’97
• 3-wire SPI™ modules (supports 4 Frame modes)
• I2C™ module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
• Addressable UART modules supporting:
- Interrupt on address bit
- Wake-up on Start bit
- 4 characters deep TX and RX FIFO buffers
• CAN bus modules
Analog Features:
• 12-bit Analog-to-Digital Converter (A/D) with:
- 100 Ksps conversion rate
- Up to 16 input channels
- Conversion available during Sleep and Idle
• Programmable Low Voltage Detection (PLVD)
• Programmable Brown-out Detection and Reset
generation
Preliminary
DS70083G-page 1
dsPIC30F
Special Microcontroller Features:
CMOS Technology:
• Enhanced Flash program memory:
- 10,000 erase/write cycle (min.) for
industrial temperature range, 100K (typical)
• Data EEPROM memory:
- 100,000 erase/write cycle (min.) for
industrial temperature range, 1M (typical)
• Self-reprogrammable under software control
• Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
• Flexible Watchdog Timer (WDT) with on-chip low
power RC oscillator for reliable operation
• Fail-Safe Clock Monitor operation:
- Detects clock failure and switches to on-chip
low power RC oscillator
• Programmable code protection
• In-Circuit Serial Programming™ (ICSP™) via
3 pins and power/ground
• Selectable Power Management modes:
- Sleep, Idle and Alternate Clock modes
•
•
•
•
DS70083G-page 2
Low power, high speed Flash technology
Wide operating voltage range (2.5V to 5.5V)
Industrial and Extended temperature ranges
Low power consumption
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Bytes
Instructions
SRAM EEPROM Timer
Bytes
Bytes
16-bit
Input
Cap
Output Comp/ A/D 12-bit
Std PWM
100 Ksps
I2C™
Pins
SPI™
Program Memory
Device
UART
dsPIC30F Sensor Processor Family
dsPIC30F2011
18
12K
4K
1024
0
3
2
2
8 ch
1
1
1
dsPIC30F3012
18
24K
8K
2048
1024
3
2
2
8 ch
1
1
1
dsPIC30F2012
28
12K
4K
1024
0
3
2
2
10 ch
1
1
1
dsPIC30F3013
28
24K
8K
2048
1024
3
2
2
10 ch
2
1
1
Pin Diagrams
18-Pin SOIC and PDIP
18
17
16
15
14
13
12
11
10
AVDD
AVSS
AN6/SCK1/INT0/OCFA/RB6
EMUD2/AN7/OC2/IC2/INT2/RB7
VDD
VSS
PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5
PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4
EMUC2/OC1/IC1/INT1/RD0
dsPIC30F2012
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AVDD
AVSS
AN6/OCFA/RB6
EMUD2/AN7/RB7
AN8/OC1/RB8
AN9/OC2/RB9
CN17/RF4
CN18/RF5
VDD
VSS
PGC/EMUC/U1RX/SDI1/SDA/RF2
PGD/EMUD/U1TX/SDO1/SCL/RF3
SCK1/INT0/RF6
EMUC2/IC1/INT1/RD8
dsPIC30F3013
1
2
3
4
5
6
7
8
9
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AVDD
AVSS
AN6/OCFA/RB6
EMUD2/AN7/RB7
AN8/OC1/RB8
AN9/OC2/RB9
U2RX/CN17/RF4
U2TX/CN18/RF5
VDD
VSS
PGC/EMUC/U1RX/SDI1/SDA/RF2
PGD/EMUD/U1TX/SDO1/SCL/RF3
SCK1/INT0/RF6
EMUC2/IC1/INT1/RD8
dsPIC30F2011
dsPIC30F3012
MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
28-Pin PDIP and SOIC
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
VSS
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
VDD
IC2/INT2/RD9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28-Pin PDIP and SOIC
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
VSS
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
VDD
IC2/INT2/RD9
Note:
1
2
3
4
5
6
7
8
9
10
11
12
13
14
For descriptions of individual pins, see Section 1.0.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 3
dsPIC30F
Pin Diagrams (Continued)
44
43
42
41
40
39
38
37
36
35
34
PGD/EMUD/U1TX/SDO1/SCL/RF3
SCK1/INT0/RF6
EMUC2/IC1/INT1/RD8
NC
NC
NC
NC
IC2/INT2/RD9
VDD
EMUC1/SOSCO/T1CK / U1ARX / CN0 / RC14
EMUD1/SOSCI/T2CK / U1ATX / CN1 / RC13
44-Pin QFN
1
2
3
4
5
6
7
8
9
10
11
dsPIC30F3013
33
32
31
30
29
28
27
26
25
24
23
OSC2/CLKO/RC15
OSC1/CLKI
VSS
VSS
NC
NC
AN5/CN7/RB5
AN4/CN6/RB4
AN3/CN5/RB3
NC
AN2/SS1/LVDIN/CN4/RB2
EMUD2/AN7/RB7
NC
AN6/OCFA/RB6
NC
AVSS
AVDD
MCLR
EMUD3/AN0/VREF+/CN2/RB0
EMUC3/AN1/VREF-/CN3/RB1
NC
NC
12
13
14
15
16
17
18
19
20
21
22
PGC/EMUC/U1RX/SDI1/SDA/RF2
VSS
NC
VDD
NC
NC
U2TX/CN18/RF5
NC
U2RX/CN17/RF4
AN9/OC2/RB9
AN8/OC1/RB8
Note:
For descriptions of individual pins, see Section 1.0.
DS70083G-page 4
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
CAN
Output
SRAM EEPROM Timer Input
Codec A/D 12-bit
Comp/Std
Bytes
16-bit Cap
Interface 100 Ksps
Bytes Instructions Bytes
PWM
I2C™
Pins
SPI™
Program Memory
Device
UART
dsPIC30F General Purpose Controller Family
dsPIC30F3014 40/44
24K
8K
2048
1024
3
2
2
—
13 ch
2
1
1
-
dsPIC30F4013 40/44
48K
16K
2048
1024
5
4
4
AC’97, I2S
13 ch
2
1
1
1
dsPIC30F5011
64
66K
22K
4096
1024
5
8
8
AC’97, I2S
16 ch
2
2
1
2
dsPIC30F6011
64
132K
44K
6144
2048
5
8
8
—
16 ch
2
2
1
2
dsPIC30F6012
64
144K
48K
8192
4096
5
8
8
AC’97, I2S
16 ch
2
2
1
2
dsPIC30F5013
80
66K
22K
4096
1024
5
8
8
AC’97, I2S
16 ch
2
2
1
2
dsPIC30F6013
80
132K
44K
6144
2048
5
8
8
—
16 ch
2
2
1
2
dsPIC30F6014
80
144K
48K
8192
4096
5
8
8
AC’97, I2S
16 ch
2
2
1
2
Pin Diagrams
40-Pin PDIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
dsPIC30F3014
MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AN8/RB8
VDD
VSS
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
INT0/RA11
IC2/INT2/RD9
RD3
VSS
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
AVDD
AVSS
AN9/RB9
AN10/RB10
AN11/RB11
AN12/RB12
EMUC2/OC1/RD0
EMUD2/OC2/RD1
VDD
VSS
RF0
RF1
U2RX/CN17/RF4
U2TX/CN18/RF5
U1RX/SDI1/SDA/RF2
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
IC1/INT1/RD8
RD2
VDD
40-Pin PDIP
Note:
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
dsPIC30F4013
MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/IC7/CN6/RB4
AN5/IC8/CN7/RB5
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AN8/RB8
VDD
VSS
OSC1/CLKI
OSC2/CLKO/RC15
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
INT0/RA11
IC2/INT2/RD9
OC4/RD3
VSS
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
AVDD
AVSS
AN9/CSCK/RB9
AN10/CSDI/RB10
AN11/CSDO/RB11
AN12/COFS/RB12
EMUC2/OC1/RD0
EMUD2/OC2/RD1
VDD
VSS
C1RX/RF0
C1TX/RF1
U2RX/CN17/RF4
U2TX/CN18/RF5
U1RX/SDI1/SDA/RF2
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
IC1/INT1/RD8
OC3/RD2
VDD
For descriptions of individual pins, see Section 1.0.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 5
dsPIC30F
Pin Diagrams (Continued)
dsPIC30F3014
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
10
11
NC
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
OSC2/CLKO/RC15
OSC1/CLKI
VSS
VDD
AN8/RB8
PGD/EMUD/AN7/RB7
PGC/EMUC/AN6/OCFA/RB6
AN5/CN7/RB5
AN4/CN6/RB4
NC
NC
AN10/RB10
AN9/RB9
AVSS
AVDD
MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
U1RX/SDI1/SDA/RF2
U2TX/CN18/RF5
U2RX/CN17/RF4
C1TX/RF1
C1RX/RF0
VSS
VDD
EMUD2/OC2/RD1
EMUC2/OC1/RD0
AN12/RB12
AN11/RB11
44
43
42
41
40
39
38
37
36
35
34
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
INT1/RD8
RD2
VDD
VSS
RD3
IC2/INT2/RD1
INT0/RA11
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
NC
44-Pin TQFP
Note:
For descriptions of individual pins, see Section 1.0.
DS70083G-page 6
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Pin Diagrams (Continued)
dsPIC30F4013
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
10
11
NC
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
OSC2/CLKO/RC15
OSC1/CLKI
VSS
VDD
AN8/RB8
PGD/EMUD/TB7/AN7/RB7
PGC/EMUC/TB6/AN6/OCFA/RB6
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
NC
NC
AN10/CSDI/RB10
AN9/CSCK/RB9
AVSS
AVDD
MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
U1RX/SDI1/SDA/RF2
U2TX/CN18/RF5
U2RX/CN17/RF4
CTX1/RF1
CRX1/RF0
VSS
VDD
EMUD2/OC2/RD1
EMUC2/OC1/RD0
AN12/COFS/RB12
AN11/CSDO/RB11
44
43
42
41
40
39
38
37
36
35
34
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
IC1/INT1/RD8
OC3/RD2
VDD
VSS
OC4/RD3
IC2/INT2/RD1
INT0/RA11
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
NC
44-Pin TQFP
Note:
For descriptions of individual pins, see Section 1.0.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 7
dsPIC30F
Pin Diagrams (Continued)
44
43
42
41
40
39
38
37
36
35
34
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
IC1/INT1/RD8
RD2
VDD
VSS
RD3
IC2/INT2/RD9
INT0/RA11
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
44-Pin QFN
1
2
3
4
5
6
7
8
9
10
11
dsPIC30F3014
33
32
31
30
29
28
27
26
25
24
23
OSC2/CLKO/RC15
OSC1/CLKI
VSS
VSS
VDD
VDD
AN8/RB8
PGD/EMUD/AN7/RB7
PGC/EMUC/AN6/OCFA/RB6
AN5/CN7/RB5
AN4/CN6/RB4
AN11/RB11
NC
AN10/RB10
AN9/RB9
AVSS
AVDD
MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
12
13
14
15
16
17
18
19
20
21
22
U1RX/SDI1/SDA/RF2
U2TX/CN18/RF5
U2RX/CN17/RF4
C1TX/RF1
C1RX/RF0
VSS
VDD
VDD
EMUD2/OC2/RD1
EMUC2/OC1/RD0
AN12/RB12
Note:
For descriptions of individual pins, see Section 1.0.
DS70083G-page 8
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Pin Diagrams (Continued)
44
43
42
41
40
39
38
37
36
35
34
EMUD3/U1TX/SDO1/SCL/RF3
EMUC3/SCK1/RF6
INT1/RD8
TOC3/RD2
VDD
VSS
OC4/RD3
IC2/INT2/RD1
INT0/RA11
EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14
EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13
44-Pin QFN
1
2
3
4
5
6
7
8
9
10
11
dsPIC30F4013
33
32
31
30
29
28
27
26
25
24
23
OSC2/CLKO/RC15
OSC1/CLKI
VSS
VSS
VDD
VDD
AN8/RB8
PGD/EMUD/TB7/AN7/RB7
PGC/EMUC/TB6/AN6/OCFA/RB6
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN11/CSDO/RB11
NC
AN10/CSDI/RB10
AN9/CSCK/RB9
AVSS
AVDD
MCLR
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
12
13
14
15
16
17
18
19
20
21
22
U1RX/SDI1/SDA/RF2
U2TX/CN18/RF5
U2RX/CN17/RF4
CTX1/RF1
CRX1/RF0
VSS
VDD
VDD
EMUD2/OC2/RD1
EMUC2/OC1/RD0
AN12/COFS/RB12
Note:
For descriptions of individual pins, see Section 1.0.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 9
dsPIC30F
Pin Diagrams (Continued)
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
CSDO/RG13
CSDI/RG12
CSCK/RG14
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
64-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC30F5011
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC2/OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKI
VDD
SCL/RG2
SDA/RG3
EMUC3/SCK1/INT0/RF6
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/CN17/RF4
U2TX/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COFS/RG15
T2CK/RC1
T3CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/LVDIN/CN4/RB2
AN1/VREF-/CN3/RB1
AN0/VREF+/CN2/RB0
Note:
For descriptions of individual pins, see Section 1.0.
DS70083G-page 10
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Pin Diagrams (Continued)
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
RG13
RG12
RG14
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
64-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC30F6011
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC2/OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKI
VDD
SCL/RG2
SDA/RG3
EMUC3/SCK1/INT0/RF6
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
AN6/OCFA/RB6
AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/CN17/RF4
U2TX/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
RG15
T2CK/RC1
T3CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/LVDIN/CN4/RB2
PGC/EMUC/AN1/VREF-/CN3/RB1
PGD/EMUD/AN0/VREF+/CN2/RB0
Note:
For descriptions of individual pins, see Section 1.0.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 11
dsPIC30F
Pin Diagrams (Continued)
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
CSDO/RG13
CSDI/RG12
CSCK/RG14
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
64-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC30F6012
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC2/OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKI
VDD
SCL/RG2
SDA/RG3
EMUC3/SCK1/INT0/RF6
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
AN6/OCFA/RB6
AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/CN17/RF4
U2TX/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COFS/RG15
T2CK/RC1
T3CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/LVDIN/CN4/RB2
PGC/EMUC/AN1/VREF-/CN3/RB1
PGD/EMUD/AN0/VREF+/CN2/RB0
Note:
For descriptions of individual pins, see Section 1.0.
DS70083G-page 12
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Pin Diagrams (Continued)
IC5/RD12
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
OC7/CN15/RD6
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/CN16/RD7
CSCK/RG14
RA7/CN23
RA6/CN22
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
CSDO/RG13
CSDI/RG12
80-Pin TQFP
COFS/RG15
1
T2CK/RC1
2
T3CK/RC2
3
T4CK/RC3
T5CK/RC4
SCK2/CN8/RG6
4
SDI2/CN9/RG7
7
SDO2/CN10/RG8
MCLR
8
5
6
9
SS2/CN11/RG9
VSS
10
VDD
12
INT1/RA12
13
EMUC1/SOSCO/T1CK/CN0/RC14
59
EMUD1/SOSCI/CN1/RC13
58
EMUC2/OC1/RD0
57
56
IC4/RD11
IC3/RD10
55
IC2/RD9
54
IC1/RD8
53
INT4/RA15
52
INT3/RA14
VSS
51
dsPIC30F5013
11
60
49
OSC2/CLKO/RC15
OSC1/CLKI
48
VDD
50
47
SCL/RG2
46
SDA/RG3
45
44
EMUC3/SCK1/INT0/RF6
SDI1/RF7
INT2/RA13
AN5/CN7/RB5
14
AN4/CN6/RB4
AN3/CN5/RB3
16
AN2/SS1/LVDIN/CN4/RB2
PGC/EMUC/AN1/CN3/RB1
18
43
EMUD3/SDO1/RF8
19
42
U1RX/RF2
PGD/EMUD/AN0/CN2/RB0
20
41
U1TX/RF3
Note:
15
29
30
31
32
33
34
35
36
37
38
39
40
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
IC7/CN20/RD14
IC8/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
28
AN11/RB11
27
AN9/RB9
AN10/RB10
26
AVSS
25
AVDD
AN8/RB8
24
VREF-/RA9
VREF+/RA10
AN7/RB7
23
21
22
AN6/OCFA/RB6
17
For descriptions of individual pins, see Section 1.0.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 13
dsPIC30F
Pin Diagrams (Continued)
IC5/RD12
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
OC7/CN15/RD6
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/CN16/RD7
RG14
RA7/CN23
RA6/CN22
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
RG13
RG12
80-Pin TQFP
RG15
1
T2CK/RC1
2
T3CK/RC2
3
T4CK/RC3
T5CK/RC4
SCK2/CN8/RG6
4
SDI2/CN9/RG7
7
SDO2/CN10/RG8
MCLR
8
5
6
9
SS2/CN11/RG9
VSS
VDD
10
INT1/RA12
13
14
AN4/CN6/RB4
AN3/CN5/RB3
16
EMUD1/SOSCI/CN1/RC13
58
EMUC2/OC1/RD0
57
56
IC4/RD11
IC3/RD10
55
IC2/RD9
54
IC1/RD8
53
INT4/RA15
52
INT3/RA14
VSS
49
OSC2/CLKO/RC15
OSC1/CLKI
48
VDD
50
12
INT2/RA13
AN5/CN7/RB5
EMUC1/SOSCO/T1CK/CN0/RC14
59
51
dsPIC30F6013
11
60
15
17
47
SCL/RG2
46
SDA/RG3
45
44
EMUC3/SCK1/INT0/RF6
SDI1/RF7
Note:
29
30
31
32
33
34
35
36
37
38
39
40
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
IC7/CN20/RD14
IC8/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
28
AN9/RB9
AN11/RB11
27
AN10/RB10
26
AVDD
AVSS
25
AN8/RB8
24
U1TX/RF3
VREF+/RA10
41
23
20
VREF-/RA9
U1RX/RF2
PGD/EMUD/AN0/CN2/RB0
21
EMUD3/SDO1/RF8
42
22
43
19
AN7/RB7
18
AN6/OCFA/RB6
AN2/SS1/LVDIN/CN4/RB2
PGC/EMUC/AN1/CN3/RB1
For descriptions of individual pins, see Section 1.0.
DS70083G-page 14
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Pin Diagrams (Continued)
IC5/RD12
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
OC7/CN15/RD6
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/CN16/RD7
CSCK/RG14
RA7/CN23
RA6/CN22
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
CSDO/RG13
CSDI/RG12
80-Pin TQFP
COFS/RG15
1
T2CK/RC1
2
T3CK/RC2
3
T4CK/RC3
T5CK/RC4
SCK2/CN8/RG6
4
SDI2/CN9/RG7
7
SDO2/CN10/RG8
MCLR
8
5
6
9
SS2/CN11/RG9
VSS
10
VDD
12
INT1/RA12
13
60
EMUC1/SOSCO/T1CK/CN0/RC14
59
EMUD1/SOSCI/CN1/RC13
58
EMUC2/OC1/RD0
57
56
IC4/RD11
IC3/RD10
55
IC2/RD9
54
IC1/RD8
53
INT4/RA15
52
INT3/RA14
VSS
51
dsPIC30F6014
49
OSC2/CLKO/RC15
OSC1/CLKI
48
VDD
50
11
47
SCL/RG2
46
SDA/RG3
45
44
EMUC3/SCK1/INT0/RF6
SDI1/RF7
INT2/RA13
AN5/CN7/RB5
14
AN4/CN6/RB4
AN3/CN5/RB3
16
AN2/SS1/LVDIN/CN4/RB2
PGC/EMUC/AN1/CN3/RB1
18
43
EMUD3/SDO1/RF8
19
42
U1RX/RF2
PGD/EMUD/AN0/CN2/RB0
20
41
U1TX/RF3
Note:
15
29
30
31
32
33
34
35
36
37
38
39
40
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
IC7/CN20/RD14
IC8/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
28
AN11/RB11
27
AN9/RB9
AN10/RB10
26
AVSS
25
AVDD
AN8/RB8
24
VREF-/RA9
VREF+/RA10
AN7/RB7
23
21
22
AN6/OCFA/RB6
17
For descriptions of individual pins, see Section 1.0.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 15
dsPIC30F
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 17
2.0 CPU Architecture Overview........................................................................................................................................................ 21
3.0 Memory Organization ................................................................................................................................................................. 35
4.0 Address Generator Units ............................................................................................................................................................ 47
5.0 Interrupts .................................................................................................................................................................................... 55
6.0 Flash Program Memory .............................................................................................................................................................. 63
7.0 Data EEPROM Memory ............................................................................................................................................................. 69
8.0 I/O Ports ..................................................................................................................................................................................... 75
9.0 Timer1 Module ........................................................................................................................................................................... 81
10.0 Timer2/3 Module ........................................................................................................................................................................ 85
11.0 Timer4/5 Module ....................................................................................................................................................................... 91
12.0 Input Capture Module................................................................................................................................................................. 95
13.0 Output Compare Module ............................................................................................................................................................ 99
14.0 SPI Module............................................................................................................................................................................... 103
15.0 I2C Module ............................................................................................................................................................................... 107
16.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 115
17.0 CAN Module ............................................................................................................................................................................. 123
18.0 Data Converter Interface (DCI) Module.................................................................................................................................... 135
19.0 12-bit Analog-to-Digital Converter (A/D) Module ...................................................................................................................... 145
20.0 System Integration ................................................................................................................................................................... 153
21.0 Instruction Set Summary .......................................................................................................................................................... 169
22.0 Development Support............................................................................................................................................................... 177
23.0 Electrical Characteristics .......................................................................................................................................................... 183
24.0 Packaging Information.............................................................................................................................................................. 223
Index .................................................................................................................................................................................................. 237
On-Line Support................................................................................................................................................................................. 243
Systems Information and Upgrade Hot Line ...................................................................................................................................... 243
Reader Response .............................................................................................................................................................................. 244
Product Identification System............................................................................................................................................................. 245
TO OUR VALUED CUSTOMERS
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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DS70083G-page 16
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
1.0
DEVICE OVERVIEW
Figure 1-1 shows a sample device block diagram.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
Note:
This document contains device family specific
information for the dsPIC30F family of Digital Signal
Controller (DSC) devices. The dsPIC30F devices
contain extensive Digital Signal Processor (DSP)
functionality within a high performance 16-bit
microcontroller (MCU) architecture.
 2004 Microchip Technology Inc.
Preliminary
The device(s) depicted in this block
diagram are representative of the
corresponding device family. Other
devices of the same family may vary in
terms of number of pins and multiplexing
of pin functions. Typically, smaller devices
in the family contain a subset of the
peripherals present in the device(s) shown
in this diagram.
DS70083G-page 17
dsPIC30F
FIGURE 1-1:
dsPIC30F5013/6013/6014 BLOCK DIAGRAM
CN22/RA6
CN23/RA7
VREF-/RA9
VREF+/RA10
INT1/RA12
INT2/RA13
INT3/RA14
INT4/RA15
Y Data Bus
X Data Bus
16
16
Interrupt
Controller
PSV & Table
Data Access
24 Control Block
Data Latch
Y Data
RAM
(4 Kbytes)
Address
Latch
16
8
24
24
Address Latch
Data EEPROM
(4 Kbytes)
16
PORTA
PGD/EMUD/AN0/CN2/RB0
PGC/EMUC/AN1/CN3/RB1
AN2/SS1/LVDIN/CN4/RB2
AN3/CN5/RB3
AN4/CN6/RB4
AN5/CN7/RB5
AN6/OCFA/RB6
AN7/RB7
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
16
X RAGU
X WAGU
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Data Latch
X Data
RAM
(4 Kbytes)
Address
Latch
16
16
Program Memory
(144 Kbytes)
16
16
Effective Address
16
Data Latch
ROM Latch
16
24
PORTB
T2CK/RC1
T3CK/RC2
T4CK/RC3
T5CK/RC4
EMUD1/SOSCI/CN1/RC13
EMUC1/SOSCO/T1CK/CN0/RC14
OSC2/CLKO/RC15
IR
16
16
16 x 16
W Reg Array
Decode
Instruction
Decode &
Control
Control Signals
to Various Blocks
Power-up
Timer
DSP
Engine
Divide
Unit
ALU<16>
POR/BOR
Reset
MCLR
VDD, VSS
AVDD, AVSS
CAN1,
CAN2
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
OC5/CN13/RD4
OC6/CN14/RD5
OC7/CN15/RD6
OC8/CN16/RD7
IC1/RD8
IC2/RD9
IC3/RD10
IC4/RD11
IC5/RD12
IC6/CN19/RD13
IC7/CN20/RD14
IC8/CN21/RD15
Oscillator
Start-up Timer
Timing
Generation
OSC1/CLKI
PORTC
16 16
Watchdog
Timer
Low Voltage
Detect
12-bit ADC
Timers
16
16
PORTD
Input
Capture
Module
DCI
Output
Compare
Module
I2C
SPI1,
SPI2
UART1,
UART2
C1RX/RF0
C1TX/RF1
U1RX/RF2
U1TX/RF3
U2RX/CN17/RF4
U2TX/CN18/RF5
EMUC3/SCK1/INT0/RF6
SDI1/RF7
EMUD3/SDO1/RF8
PORTF
C2RX/RG0
C2TX/RG1
SCL/RG2
SDA/RG3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
CSDI/RG12
CSDO/RG13
CSCK/RG14
COFS/RG15
PORTG
DS70083G-page 18
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Table 1-1 provides a brief description of device I/O
pinouts and the functions that may be multiplexed to a
port pin. Multiple functions may exist on one port pin.
When multiplexing occurs, the peripheral module’s
functional requirements may force an override of the
data direction of the port pin.
TABLE 1-1:
PINOUT I/O DESCRIPTIONS
Pin
Type
Buffer
Type
AN0-AN15
I
Analog
AVDD
P
P
AVSS
P
P
CLKI
I
ST/CMOS
CLKO
O
—
CN0-CN23
I
ST
Input change notification inputs.
Can be software programmed for internal weak pull-ups on all
inputs.
COFS
CSCK
CSDI
CSDO
I/O
I/O
I
O
ST
ST
ST
—
Data Converter Interface frame synchronization pin.
Data Converter Interface serial clock input/output pin.
Data Converter Interface serial data input pin.
Data Converter Interface serial data output pin.
C1RX
C1TX
C2RX
C2TX
I
O
I
O
ST
—
ST
—
CAN1 bus receive pin.
CAN1 bus transmit pin.
CAN2 bus receive pin.
CAN2 bus transmit pin
EMUD
EMUC
EMUD1
I/O
I/O
I/O
ST
ST
ST
EMUC1
EMUD2
EMUC2
EMUD3
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data
input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data
input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
Pin Name
Description
Analog input channels.
AN0 and AN1 are also used for device programming data and
clock inputs, respectively.
Positive supply for analog module.
Ground reference for analog module.
External clock source input. Always associated with OSC1 pin
function.
Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes. Always associated with OSC2 pin
function.
EMUC3
I/O
IC1-IC8
I
ST
Capture inputs 1 through 8.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
LVDIN
I
Analog
MCLR
I/P
ST
Master Clear (Reset) input or programming voltage input. This
pin is an active low Reset to the device.
OCFA
OCFB
OC1-OC8
I
I
O
ST
ST
—
Compare Fault A input (for Compare channels 1, 2, 3 and 4).
Compare Fault B input (for Compare channels 5, 6, 7 and 8).
Compare outputs 1 through 8.
Legend:
Low Voltage Detect Reference Voltage input pin.
CMOS = CMOS compatible input or output
ST
= Schmitt Trigger input with CMOS levels
I
= Input
 2004 Microchip Technology Inc.
Analog = Analog input
O
= Output
P
= Power
Preliminary
DS70083G-page 19
dsPIC30F
TABLE 1-1:
PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
OSC1
I
ST/CMOS
OSC2
I/O
—
Oscillator crystal input. ST buffer when configured in RC mode;
CMOS otherwise.
Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes.
PGD
PGC
I/O
I
ST
ST
In-Circuit Serial Programming data input/output pin.
In-Circuit Serial Programming clock input pin.
RA6-RA7
RA9-RA10
RA12-RA15
I/O
I/O
I/O
ST
ST
ST
PORTA is a bidirectional I/O port.
Pin Name
Description
RB0-RB15
I/O
ST
PORTB is a bidirectional I/O port.
RC1-RC4
RC13-RC15
I/O
I/O
ST
ST
PORTC is a bidirectional I/O port.
RD0-RD15
I/O
ST
PORTD is a bidirectional I/O port.
RF0-RF8
I/O
ST
PORTF is a bidirectional I/O port.
RG0-RG3
RG6-RG9
RG12-RG15
I/O
I/O
I/O
ST
ST
ST
PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I
I/O
I
O
I
ST
ST
—
ST
ST
ST
—
ST
Synchronous serial clock input/output for SPI1.
SPI1 Data In.
SPI1 Data Out.
SPI1 Slave Synchronization.
Synchronous serial clock input/output for SPI2.
SPI2 Data In.
SPI2 Data Out.
SPI2 Slave Synchronization.
SCL
SDA
I/O
I/O
ST
ST
Synchronous serial clock input/output for I2C.
Synchronous serial data input/output for I2C.
SOSCO
SOSCI
O
I
—
ST/CMOS
T1CK
T2CK
T3CK
T4CK
T5CK
I
I
I
I
I
ST
ST
ST
ST
ST
Timer1 external clock input.
Timer2 external clock input.
Timer3 external clock input.
Timer4 external clock input.
Timer5 external clock input.
U1RX
U1TX
U1ARX
U1ATX
U2RX
U2TX
I
O
I
O
I
O
ST
—
ST
—
ST
—
UART1 Receive.
UART1 Transmit.
UART1 Alternate Receive.
UART1 Alternate Transmit.
UART2 Receive.
UART2 Transmit.
VDD
P
—
Positive supply for logic and I/O pins.
VSS
P
—
Ground reference for logic and I/O pins.
VREF+
I
Analog
Analog Voltage Reference (High) input.
I
Analog
Analog Voltage Reference (Low) input.
VREF-
Legend:
32 kHz low power oscillator crystal output.
32 kHz low power oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise.
CMOS = CMOS compatible input or output
ST
= Schmitt Trigger input with CMOS levels
I
= Input
DS70083G-page 20
Analog = Analog input
O
= Output
P
= Power
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
2.0
CPU ARCHITECTURE
OVERVIEW
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
2.1
Core Overview
The core has a 24-bit instruction word. The Program
Counter (PC) is 23-bits wide with the Least Significant
(LS) bit always clear (refer to Section 3.1), and the
Most Significant (MS) bit is ignored during normal program execution, except for certain specialized instructions. Thus, the PC can address up to 4M instruction
words of user program space. An instruction pre-fetch
mechanism is used to help maintain throughput. Program loop constructs, free from loop count management overhead, are supported using the DO and
REPEAT instructions, both of which are interruptible at
any point.
The working register array consists of 16 x 16-bit registers, each of which can act as data, address or offset
registers. One working register (W15) operates as a
software stack pointer for interrupts and calls.
The data space is 64 Kbytes (32K words) and is split
into two blocks, referred to as X and Y data memory.
Each block has its own independent Address Generation Unit (AGU). Most instructions operate solely
through the X memory, AGU, which provides the
appearance of a single unified data space. The
Multiply-Accumulate (MAC) class of dual source DSP
instructions operate through both the X and Y AGUs,
splitting the data address space into two parts (see
Section 3.2). The X and Y data space boundary is
device specific and cannot be altered by the user. Each
data word consists of 2 bytes, and most instructions
can address data either as words or bytes.
There are two methods of accessing data stored in
program memory:
• The upper 32 Kbytes of data space memory can
be mapped into the lower half (user space) of program space at any 16K program word boundary,
defined by the 8-bit Program Space Visibility Page
(PSVPAG) register. This lets any instruction
access program space as if it were data space,
with a limitation that the access requires an additional cycle. Moreover, only the lower 16 bits of
each instruction word can be accessed using this
method.
• Linear indirect access of 32K word pages within
program space is also possible using any working
register, via table read and write instructions.
Table read and write instructions can be used to
access all 24 bits of an instruction word.
 2004 Microchip Technology Inc.
Overhead-free circular buffers (modulo addressing) are
supported in both X and Y address spaces. This is primarily intended to remove the loop overhead for DSP
algorithms.
The X AGU also supports bit-reversed addressing on
destination effective addresses to greatly simplify input
or output data reordering for radix-2 FFT algorithms.
Refer to Section 4.0 for details on modulo and
bit-reversed addressing.
The core supports Inherent (no operand), Relative,
Literal, Memory Direct, Register Direct, Register
Indirect, Register Offset and Literal Offset Addressing
modes. Instructions are associated with predefined
Addressing modes, depending upon their functional
requirements.
For most instructions, the core is capable of executing
a data (or program data) memory read, a working register (data) read, a data memory write and a program
(instruction) memory read per instruction cycle. As a
result, 3-operand instructions are supported, allowing
C = A+B operations to be executed in a single cycle.
A DSP engine has been included to significantly
enhance the core arithmetic capability and throughput.
It features a high speed 17-bit by 17-bit multiplier, a
40-bit ALU, two 40-bit saturating accumulators and a
40-bit bidirectional barrel shifter. Data in the accumulator or any working register can be shifted up to 15 bits
right, or 16 bits left in a single cycle. The DSP instructions operate seamlessly with all other instructions and
have been designed for optimal real-time performance.
The MAC class of instructions can concurrently fetch
two data operands from memory while multiplying two
W registers. To enable this concurrent fetching of data
operands, the data space has been split for these
instructions and linear for all others. This has been
achieved in a transparent and flexible manner, by dedicating certain working registers to each address space
for the MAC class of instructions.
The core does not support a multi-stage instruction
pipeline. However, a single stage instruction pre-fetch
mechanism is used, which accesses and partially
decodes instructions a cycle ahead of execution, in
order to maximize available execution time. Most
instructions execute in a single cycle with certain
exceptions, as outlined in Section 2.3.
The core features a vectored exception processing
structure for traps and interrupts, with 62 independent
vectors. The exceptions consist of up to 8 traps (of
which 4 are reserved) and 54 interrupts. Each interrupt
is prioritized based on a user assigned priority between
1 and 7 (1 being the lowest priority and 7 being the
highest), in conjunction with a predetermined ‘natural
order’. Traps have fixed priorities ranging from 8 to 15.
Preliminary
DS70083G-page 21
dsPIC30F
2.2
Programmer’s Model
2.2.2
The programmer’s model is shown in Figure 2-1 and
consists of 16 x 16-bit working registers (W0 through
W15), 2 x 40-bit accumulators (AccA and AccB),
STATUS register (SR), Data Table Page register
(TBLPAG), Program Space Visibility Page register
(PSVPAG), DO and REPEAT registers (DOSTART,
DOEND, DCOUNT and RCOUNT) and Program
Counter (PC). The working registers can act as data,
address or offset registers. All registers are memory
mapped. W0 acts as the W register for file register
addressing.
Some of these registers have a shadow register associated with each of them, as shown in Figure 2-1. The
shadow register is used as a temporary holding register
and can transfer its contents to or from its host register
upon the occurrence of an event. None of the shadow
registers are accessible directly. The following rules
apply for transfer of registers into and out of shadows.
SOFTWARE STACK POINTER/
FRAME POINTER
In order to protect against misaligned
stack accesses, W15<0> is always clear.
W15 is initialized to 0x0800 during a Reset. The user
may reprogram the SP during initialization to any
location within data space.
W14 has been dedicated as a stack frame pointer as
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same
manner as all other W registers.
DS70083G-page 22
The upper byte of the STATUS register contains the
DSP Adder/Subtracter status bits, the DO Loop Active
bit (DA) and the Digit Carry (DC) status bit.
Most SR bits are read/write. Exceptions are:
1.
The DA bit: DA is read and clear only because
accidentally setting it could cause erroneous
operation.
The RA bit: RA is a read only bit because accidentally setting it could cause erroneous operation. RA is only set on entry into a REPEAT loop,
and cannot be directly cleared by software.
The OV, OA, OB and OAB bits: These bits are
read only and can only be set by the DSP engine
overflow logic.
The SA, SB and SAB bits: These are read and
clear only and can only be set by the DSP
engine saturation logic. Once set, these flags
remain set until cleared by the user, irrespective
of the results from any subsequent DSP
operations.
4.
Note 1: Clearing the SAB bit will also clear both
the SA and SB bits.
The dsPIC® devices contain a software stack. W15 is
the dedicated software Stack Pointer (SP), and will be
automatically modified by exception processing and
subroutine calls and returns. However, W15 can be referenced by any instruction in the same manner as all
other W registers. This simplifies the reading, writing
and manipulation of the stack pointer (e.g., creating
stack frames).
Note:
SRL contains all the MCU ALU operation status flags
(including the Z bit), as well as the CPU Interrupt Priority Level status bits, IPL<2:0> and the Repeat Active
status bit, RA. During exception processing, SRL is
concatenated with the MS Byte of the PC to form a
complete word value which is then stacked.
3.
When a byte operation is performed on a working register, only the Least Significant Byte of the target register is affected. However, a benefit of memory mapped
working registers is that both the Least and Most Significant Bytes can be manipulated through byte wide
data memory space accesses.
2.2.1
The dsPIC core has a 16-bit STATUS register (SR), the
LS Byte of which is referred to as the SR Low byte
(SRL) and the MS Byte as the SR High byte (SRH).
See Figure 2-1 for SR layout.
2.
• PUSH.S and POP.S
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits
only) are transferred.
• DO instruction
DOSTART, DOEND, DCOUNT shadows are
pushed on loop start, and popped on loop end.
STATUS REGISTER
2: When the memory mapped STATUS register (SR) is the destination address for
an operation which affects any of the SR
bits, data writes are disabled to all bits.
2.2.2.1
Z Status Bit
Instructions that use a carry/borrow input (ADDC,
CPB, SUBB and SUBBR) will only be able to clear Z (for
a non-zero result) and can never set it. A multiprecision sequence of instructions, starting with an
instruction with no carry/borrow input, will thus automatically logically AND the successive results of the
zero test. All results must be zero for the Z flag to
remain set by the end of the sequence.
All other instructions can set as well as clear the Z bit.
2.2.3
PROGRAM COUNTER
The program counter is 23-bits wide; bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 2-1:
PROGRAMMER’S MODEL
D15
D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3
Legend
W4
DSP Operand
Registers
W5
W6
W7
Working Registers
W8
W9
DSP Address
Registers
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
Stack Pointer Limit Register
SPLIM
AD39
AD15
AD31
AD0
AccA
DSP
Accumulators
AccB
PC22
PC0
Program Counter
0
0
7
TABPAG
TBLPAG
7
Data Table Page Address
0
PSVPAG
Program Space Visibility Page Address
15
0
RCOUNT
REPEAT Loop Counter
15
0
DCOUNT
DO Loop Counter
22
0
DOSTART
DO Loop Start Address
DOEND
DO Loop End Address
22
15
0
Core Configuration Register
CORCON
OA
OB
SA
SB OAB SAB DA
SRH
 2004 Microchip Technology Inc.
DC IPL2 IPL1 IPL0 RA
N
OV
Z
C
Status Register
SRL
Preliminary
DS70083G-page 23
dsPIC30F
2.3
Instruction Flow
There are 8 types of instruction flows:
1.
Normal one-word, one-cycle instructions: these
instructions take one effective cycle to execute
as shown in Figure 2-2.
FIGURE 2-2:
INSTRUCTION PIPELINE FLOW: 1-WORD, 1-CYCLE
TCY0
1. MOV.b #0x55,W0
Fetch 1
TCY1
TCY4
TCY5
TCY4
TCY5
Execute 2
Fetch 3
3. ADD.b W0,W1,W2
2.
TCY3
Execute 1
Fetch 2
2. MOV.b #0x35,W1
TCY2
Execute 3
One-word, two-cycle (or three-cycle) instructions that are flow control instructions: these
instructions include the relative branches, relative call, skips and returns. When an instruction
changes the PC (other than to increment it), the
pipelined fetch is discarded. This causes the
instruction to take two effective cycles to execute as shown in Figure 2-3. Some instructions
that change program flow require 3 cycles, such
as the RETURN, RETFIE and RETLW instructions, and instructions that skip over 2-word
instructions.
FIGURE 2-3:
INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE
TCY0
1. MOV
#0x55,W0
Fetch 1
2. BTSC W1,#3
3. ADD
W0,W1,W2
4. BRA
SUB_1
5. SUB
W0,W1,W3
TCY1
TCY2
Fetch 2
Execute 2
Skip Taken
Fetch 3
Flush
Fetch 4
Execute 4
Fetch 5
Flush
Fetch SUB_1
6. Instruction @ address SUB_1
DS70083G-page 24
TCY3
Execute 1
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
3.
One-word, two-cycle instructions that are not
flow control instructions: the only instructions of
this type are the MOV.D (load and store doubleword) instructions, as shown in Figure 2-4.
FIGURE 2-4:
INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE MOV.D OPERATIONS
TCY0
1. MOV
Fetch 1
W0,0x1234
TCY2
4.
Fetch 3
W1,0x00AA
TCY5
Execute 2
R/W Cycle2
Stall
Execute 3
Fetch 4
0x0CC, W0
Execute 4
Table read/write instructions: these instructions
will suspend the fetching to insert a read or write
cycle to the program memory. The instruction
fetched while executing the table operation is
saved for 1 cycle and executed in the cycle
immediately after the table operation as shown
in Figure 2-5.
FIGURE 2-5:
INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE TABLE OPERATIONS
TCY0
Fetch 1
1. MOV #0x1234,W0
TCY1
TCY2
TCY4
TCY5
Execute 2
Fetch 3
3. MOV #0x00AA,W1
Execute 2
Read Cycle
Bus Read
3a. Table Operation
4. MOV
TCY3
Execute 1
Fetch 2
2. TBLRDL [W0++],W1
5.
TCY4
Execute 2
R/W Cycle 1
3a. Stall
4. MOV
TCY3
Execute 1
Fetch 2
2. MOV.D [W0++],W1
3. MOV
TCY1
Execute 3
Fetch 4
#0x0CC,W0
Execute 4
Two-word instructions for CALL and GOTO: in
these instructions, the fetch after the instruction
provides the remainder of the jump or call destination address. These instructions require 2
cycles to execute, 1 cycle to fetch the 2 instruction words (enabled by a high speed path on the
second fetch), and 1 cycle to flush the pipeline
as shown in Figure 2-6.
FIGURE 2-6:
INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE GOTO, CALL
TCY0
1. MOV #0x1234,W0
Fetch 1
2. GOTO LABEL
2a. Second Word
TCY1
TCY2
Fetch 2L
TCY5
NOP
Fetch
LABEL
Execute
LABEL
Fetch 4
W1, #BIT3
 2004 Microchip Technology Inc.
TCY4
Update PC
Fetch 2H
3. Instruction @ address LABEL
4. BSET
TCY3
Execute 1
Preliminary
Execute 4
DS70083G-page 25
dsPIC30F
6.
Two-word instructions for DO: in these instructions, the fetch after the instruction contains an
address offset. This address offset is added to
the first instruction address to generate the last
loop instruction address. Therefore, these
instructions require 2 cycles as shown in
Figure 2-7.
FIGURE 2-7:
INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE DO, DOW
TCY0
Fetch 1
1. PUSH DOEND
TCY1
Execute 2
Fetch 3
3. 1st Instruction of Loop
Execute 3
Instructions that are subjected to a stall due to a
data dependency between the X RAGU and
X WAGU: an additional cycle is inserted to
resolve the resource conflict as shown in
Figure 2-7. Instruction stalls caused by data
dependencies are further discussed in
Section 4.0.
FIGURE 2-8:
INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE WITH INSTRUCTION STALL
TCY0
1. MOV.b W0,[W1]
Fetch 1
2. MOV.b [W1],PORTB
TCY1
TCY2
Fetch 2
DS70083G-page 26
TCY4
TCY5
NOP
Stall
Execute 2
Fetch 3
3. MOV.b W0,PORTB
Interrupt recognition execution:
Section 6.0 for details on interrupts.
TCY3
Execute 1
2a. Stall (NOP)
8.
TCY4
NOP
Fetch 2H
2a. Second Word
7.
TCY3
Execute 1
Fetch 2L
2. DO LABEL,#COUNT
TCY2
refer
Execute 3
to
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
2.4
Divide Support
The dsPIC devices feature a 16/16-bit signed fractional
divide operation, as well as 32/16-bit and 16/16-bit
signed and unsigned integer divide operations, in the
form of single instruction iterative divides. The following
instructions and data sizes are supported:
1.
2.
3.
4.
5.
DIVF - 16/16 signed fractional divide
DIV.sd - 32/16 signed divide
DIV.ud - 32/16 unsigned divide
DIV.sw - 16/16 signed divide
DIV.uw - 16/16 unsigned divide
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
The quotient for all divide instructions is stored in W0,
and the remainder in W1. DIV and DIVF can specify
any W register for both the 16-bit dividend and divisor.
All other divides can specify any W register for the
16-bit divisor, but the 32-bit dividend must be in an
aligned W register pair, such as W1:W0, W3:W2, etc.
TABLE 2-1:
The non-restoring divide algorithm requires one cycle
for an initial dividend shift (for integer divides only), one
cycle per divisor bit, and a remainder/quotient correction cycle. The correction cycle is the last cycle of the
iteration loop but must be performed (even if the
remainder is not required) because it may also adjust
the quotient. A consequence of this is that DIVF will
also produce a valid remainder (though it is of little use
in fractional arithmetic).
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g., a
series of discrete divide instructions) will not function
correctly because the instruction flow depends on
RCOUNT. The divide instruction does not automatically
set up the RCOUNT value and it must, therefore, be
explicitly and correctly specified in the REPEAT instruction as shown in Table 2-1 (REPEAT will execute the target instruction {operand value+1} times). The REPEAT
loop count must be setup for 18 iterations of the DIV/
DIVF instruction. Thus, a complete divide operation
requires 19 cycles.
Note:
The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
DIVIDE INSTRUCTIONS
Instruction
Function
DIVF
Signed fractional divide: Wm/Wn → W0; Rem → W1
DIV.sd
Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.sw or
DIV.s
Signed divide: Wm/Wn → W0; Rem → W1
DIV.ud
Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.uw or
DIV.u
Unsigned divide: Wm/Wn → W0; Rem → W1
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 27
dsPIC30F
2.5
DSP Engine
Concurrent operation of the DSP engine with MCU
instruction flow is not possible, though both the MCU
ALU and DSP engine resources may be used concurrently by the same instruction (e.g., ED and EDAC
instructions).
The DSP engine consists of a high speed 17-bit x
17-bit multiplier, a barrel shifter and a 40-bit adder/
subtracter (with two target accumulators, round and
saturation logic).
Data input to the DSP engine is derived from one of the
following:
1.
2.
3.
Directly from the W array (registers W4, W5, W6
or W7) via the X and Y data buses for the MAC
class of instructions (MAC,
MSC,
MPY,
MPY.N, ED, EDAC, CLR and MOVSAC).
From the X bus for all other DSP instructions.
From the X bus for all MCU instructions which
use the barrel shifter.
Data output from the DSP engine is written to one of the
following:
1.
2.
3.
The DSP engine also has the capability to perform
inherent
accumulator-to-accumulator
operations,
which require no additional data. These instructions are
ADD, SUB and NEG.
The DSP engine has various options selected through
various bits in the CPU Core Configuration register
(CORCON), as listed below:
1.
2.
3.
4.
5.
6.
Fractional or integer DSP multiply (IF).
Signed or unsigned DSP multiply (US).
Conventional or convergent rounding (RND).
Automatic saturation on/off for AccA (SATA).
Automatic saturation on/off for AccB (SATB).
Automatic saturation on/off for writes to data
memory (SATDW).
Accumulator Saturation mode selection
(ACCSAT).
7.
Note:
For CORCON layout, see Table 4-3.
A block diagram of the DSP engine is shown in
Figure 2-9.
The target accumulator, as defined by the DSP
instruction being executed.
The X bus for MAC, MSC, CLR and MOVSAC
accumulator writes, where the EA is derived
from W13 only. (MPY, MPY.N, ED and EDAC
do not offer an accumulator write option.)
The X bus for all MCU instructions which use the
barrel shifter.
DS70083G-page 28
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 2-9:
DSP ENGINE BLOCK DIAGRAM
40
S
a
40 Round t 16
u
Logic r
a
t
e
40-bit Accumulator A
40-bit Accumulator B
Carry/Borrow Out
Carry/Borrow In
Saturate
Adder
Negate
40
40
40
16
X Data Bus
Barrel
Shifter
40
Y Data Bus
Sign-Extend
32
16
Zero Backfill
32
33
17-bit
Multiplier/Scaler
16
16
To/From W Array
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 29
dsPIC30F
2.5.1
MULTIPLIER
When the multiplier is configured for fractional multiplication, the data is represented as a two’s complement
fraction, where the MSB is defined as a sign bit and the
radix point is implied to lie just after the sign bit (QX
format). The range of an N-bit two’s complement fraction with this implied radix point is -1.0 to (1 – 21-N). For
a 16-bit fraction, the Q15 data range is -1.0 (0x8000)
to 0.999969482 (0x7FFF) including ‘0’ and has a
precision of 3.01518x10-5. In Fractional mode, the
16x16 multiply operation generates a 1.31 product
which has a precision of 4.65661 x 10-10.
The 17 x 17-bit multiplier is capable of signed or
unsigned operation and can multiplex its output using a
scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. The respective number representation
formats are shown in Figure 2-10. Unsigned operands
are zero-extended into the 17th bit of the multiplier
input value. Signed operands are sign-extended into
the 17th bit of the multiplier input value. The output of
the 17 x 17-bit multiplier/scaler is a 33-bit value which
is sign-extended to 40 bits. Integer data is inherently
represented as a signed two’s complement value,
where the MSB is defined as a sign bit. Generally
speaking, the range of an N-bit two’s complement integer is -2N-1 to 2N-1 – 1. For a 16-bit integer, the data
range is -32768 (0x8000) to 32767 (0x7FFF) including
‘0’ (see Figure 2-10). For a 32-bit integer, the data
range is -2,147,483,648 (0x8000 0000) to
2,147,483,645 (0x7FFF FFFF).
FIGURE 2-10:
16-BIT INTEGER AND FRACTIONAL MODES
Different Representations of 0x4001
Integer:
0
1
0
0
14
13
2
2
2
0
2
12
0
0
11
2
0
0
0
0
0
0
0
0
0
1
20
....
0x4001 = 214 + 20 = 16385
1.15 Fractional:
0
.
-20
1
0
-1
-2
2
2
0
-3
2
0
0
0
0
0
0
0
0
0
0
0
1
2-15
...
0x4001 = 2-1 + 2-15 = 0.500030518
Certain multiply operations always operate on signed
data. These include the MAC/MSC, MPY[.N] and
ED[AC] instructions. The 40-bit adder/subtracter may
also optionally negate one of its operand inputs to
change the result sign (without changing the operands). This is used to create a multiply and subtract
(MSC), or multiply and negate (MPY.N) operation.
In the special case when both input operands are 1.15
fractions and equal to 0x8000 (-110), the result of the
multiplication is corrected to 0x7FFFFFFF (as the
closest approximation to +1) by hardware before it is
used.
It should be noted that with the exception of DSP multiplies, the dsPIC30F ALU operates identically on integer and fractional data. Namely, an addition of two
integers will yield the same result (binary number) as
the addition of two fractional numbers. The only difference is how the result is interpreted by the user. However, multiplies performed by DSP operations are
DS70083G-page 30
different. In these instructions, data format selection is
made with the IF bit (CORCON<0>) and US bits
(CORCON<12>), and it must be set accordingly (‘0’ for
Fractional mode, ‘1’ for Integer mode in the case of the
IF bit, and ‘0’ for Signed mode, ‘1’ for Unsigned mode
in the case of the US bit). This is required because of
the implied radix point used by dsPIC30F fractions. In
Integer mode, multiplying two 16-bit integers produces
a 32-bit integer result. However, multiplying two 1.15
values generates a 2.30 result. Since the dsPIC30F
uses 1.31 format for the accumulators, a DSP multiply
in Fractional mode also includes a left shift by one bit to
keep the radix point properly aligned. This feature
reduces the resolution of the DSP multiplier to 2-30, but
has no other effect on the computation.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
The same multiplier is used to support the MCU multiply instructions which include integer 16-bit signed,
unsigned and mixed sign multiplies. Additional data
paths are provided to allow these instructions to write
the result back into the W array and X data bus (via the
W array). These paths are placed prior to the data
scaler. The IF bit in the CORCON register, therefore,
only affects the result of the MAC class of DSP instructions. All other multiply operations are assumed to be
integer operations. If the user executes a MAC instruction on fractional data without clearing the IF bit, the
result must be explicitly shifted left by the user program
after multiplication in order to obtain the correct result.
The MUL instruction may be directed to use byte or
word sized operands. Byte operands will direct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
2.5.2
DATA ACCUMULATORS AND
ADDER/SUBTRACTER
Adder/Subtracter, Overflow and
Saturation
The adder/subtracter is a 40-bit adder with an optional
zero input into one side and either true, or complement
data into the other input. In the case of addition, the
carry/borrow input is active high and the other input is
true data (not complemented), whereas in the case of
subtraction, the carry/borrow input is active low and the
other input is complemented. The adder/subtracter
generates overflow status bits SA/SB and OA/OB,
which are latched and reflected in the STATUS register:
• Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
• Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation, if selected. It
uses the result of the adder, the overflow status bits
described above, and the SATA/B (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
 2004 Microchip Technology Inc.
1.
2.
3.
4.
5.
6.
The data accumulator consists of a 40-bit adder/
subtracter with automatic sign extension logic. It can
select one of two accumulators (A or B) as its preaccumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be
accumulated or loaded can be optionally scaled via the
barrel shifter, prior to accumulation.
2.5.2.1
Six STATUS register bits have been provided to
support saturation and overflow; they are:
OA:
AccA overflowed into guard bits
OB:
AccB overflowed into guard bits
SA:
AccA saturated (bit 31 overflow and saturation)
or
AccA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
SB:
AccB saturated (bit 31 overflow and saturation)
or
AccB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
OAB:
Logical OR of OA and OB
SAB:
Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the corresponding overflow trap flag enable bit (OVATEN, OVBTEN) in
the INTCON1 register (refer to Section 5.0) is set. This
allows the user to take immediate action, for example,
to correct system gain.
The SA and SB bits are modified each time data
passes through the adder/subtracter but can only be
cleared by the user. When set, they indicate that the
accumulator has overflowed its maximum range (bit 31
for 32-bit saturation, or bit 39 for 40-bit saturation) and
will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has
occurred. If the COVTE bit in the INTCON1 register is
set, SA and SB bits will generate an arithmetic warning
trap when saturation is disabled.
The overflow and saturation status bits can optionally
be viewed in the STATUS register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). This allows programmers to check
one bit in the STATUS register to determine if either
accumulator has overflowed, or one bit to determine if
either accumulator has saturated. This would be useful
for complex number arithmetic which typically uses
both the accumulators.
Preliminary
DS70083G-page 31
dsPIC30F
The device supports three saturation and overflow
modes:
1.
2.
3.
Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive 9.31
(0x7FFFFFFFFF), or maximally negative 9.31
value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until
cleared by the user. This is referred to as ‘super
saturation’ and provides protection against erroneous data, or unexpected algorithm problems
(e.g., gain calculations).
Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF), or maximally
negative 1.31 value (0x0080000000) into the
target accumulator. The SA or SB bit is set and
remains set until cleared by the user. When this
Saturation mode is in effect, the guard bits are
not used (so the OA, OB or OAB bits are never
set).
Bit 39 Catastrophic Overflow:
The bit 39 overflow status bit from the adder is
used to set the SA or SB bit which remain set
until cleared by the user. No saturation operation
is performed and the accumulator is allowed to
overflow (destroying its sign). If the COVTE bit in
the INTCON1 register is set, a catastrophic
overflow can initiate a trap exception.
2.5.2.2
Accumulator ‘Write Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following Addressing modes are supported:
1.
2.
2.5.2.3
Round Logic
The round logic is a combinational block which performs a conventional (biased) or convergent (unbiased) round function during an accumulator write
(store). The Round mode is determined by the state of
the RND bit in the CORCON register. It generates a 16bit, 1.15 data value which is passed to the data space
write saturation logic. If rounding is not indicated by the
instruction, a truncated 1.15 data value is stored and
the LS Word is simply discarded.
The two Rounding modes are shown in Figure 2-10.
Conventional rounding takes bit 15 of the accumulator,
zero-extends it and adds it to the ACCxH word (bits 16
through 31 of the accumulator). If the ACCxL word
(bits 0 through 15 of the accumulator) is between
0x8000 and 0xFFFF (0x8000 included), ACCxH is
incremented. If ACCxL is between 0x0000 and
0x7FFF, ACCxH is left unchanged. A consequence of
this algorithm is that over a succession of random
rounding operations, the value will tend to be biased
slightly positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. If this is the case, the LS bit
(bit 16 of the accumulator) of ACCxH is examined. If it
is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not
modified. Assuming that bit 16 is effectively random in
nature, this scheme will remove any rounding bias that
may accumulate.
The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents
of the target accumulator to data memory via the X bus
(subject to data saturation, see Section 2.5.2.4). Note
that for the MAC class of instructions, the accumulator
write back operation will function in the same manner,
addressing combined MCU (X and Y) data space
though the X bus. For this class of instructions, the data
is always subject to rounding.
W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a 1.15
fraction.
[W13]+=2, Register Indirect with Post-Increment:
The rounded contents of the non-target accumulator are written into the address pointed to by
W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).
DS70083G-page 32
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
2.5.2.4
Data Space Write Saturation
2.5.3
BARREL SHIFTER
In addition to adder/subtracter saturation, writes to data
space may also be saturated but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These are
combined and used to select the appropriate 1.15
fractional value as output to write to data space
memory.
The barrel shifter is capable of performing up to 15-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators, or the X bus (to support multi-bit
shifts of register or memory data).
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly, For input data greater than
0x007FFF, data written to memory is forced to the
maximum positive 1.15 value, 0x7FFF. For input data
less than 0xFF8000, data written to memory is forced
to the maximum negative 1.15 value, 0x8000. The MS
bit of the source (bit 39) is used to determine the sign
of the operand being tested.
The barrel shifter is 40-bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 to
31 for right shifts, and bit positions 0 to 15 for left shifts.
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value will shift the operand
right. A negative value will shift the operand left. A
value of ‘0’ will not modify the operand.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 33
dsPIC30F
NOTES:
DS70083G-page 34
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
3.0
MEMORY ORGANIZATION
User program space access is restricted to the lower
4M instruction word address range (0x000000 to
0x7FFFFE) for all accesses other than TBLRD/TBLWT,
which use TBLPAG<7> to determine user or configuration space access. In Table 3-1, Program Space
Address Construction, bit 23 allows access to the
Device ID, the User ID and the configuration bits.
Otherwise, bit 23 is always clear.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
Note:
3.1
The address map shown in Figure 3-5 is
conceptual, and the actual memory configuration may vary across individual
devices depending on available memory.
Program Address Space
The program address space is 4M instruction words. It
is addressable by a 24-bit value from either the 23-bit
PC, table instruction EA, or data space EA, when program space is mapped into data space as defined by
Table 3-1. Note that the program space address is
incremented by two between successive program
words in order to provide compatibility with data space
addressing.
TABLE 3-1:
PROGRAM SPACE ADDRESS CONSTRUCTION
Program Space Address
Access
Space
Access Type
<23>
<22:16>
<15>
<14:1>
Instruction Access
User
TBLRD/TBLWT
User
(TBLPAG<7> = 0)
TBLPAG<7:0>
Data EA<15:0>
TBLRD/TBLWT
Configuration
(TBLPAG<7> = 1)
TBLPAG<7:0>
Data EA<15:0>
Program Space Visibility
User
FIGURE 3-1:
<0>
PC<22:1>
0
0
PSVPAG<7:0>
0
Data EA<14:0>
DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
23 bits
Using
Program
Counter
Program Counter
0
Select
Using
Program
Space
Visibility
0
1
0
EA
PSVPAG Reg
8 bits
15 bits
EA
Using
Table
Instruction
1/0
User/
Configuration
Space
Select
Note:
TBLPAG Reg
8 bits
16 bits
24-bit EA
Byte
Select
Program space visibility cannot be used to access bits <23:16> of a word in program memory.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 35
dsPIC30F
3.1.1
PROGRAM SPACE ALIGNMENT
AND DATA ACCESS USING TABLE
INSTRUCTIONS
A set of table instructions are provided to move byte or
word sized data to and from program space.
1.
This architecture fetches 24-bit wide program memory.
Consequently, instructions are always aligned.
However, as the architecture is modified Harvard, data
can also be present in program space.
There are two methods by which program space can
be accessed: via special table instructions, or through
the remapping of a 16K word program space page into
the upper half of data space (see Section 3.1.2). The
TBLRDL and TBLWTL instructions offer a direct method
of reading or writing the LS Word of any address within
program space, without going through data space. The
TBLRDH and TBLWTH instructions are the only method
whereby the upper 8 bits of a program space word can
be accessed as data.
2.
3.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word wide address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space which contains the LS Data Word,
and TBLRDH and TBLWTH access the space which
contains the MS Data Byte.
4.
TBLRDL: Table Read Low
Word: Read the LS Word of the program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the LS Bytes of the program
address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> maps to the destination byte when byte
select = 1.
TBLWTL: Table Write Low (refer to Section 6.0
for details on Flash Programming)
TBLRDH: Table Read High
Word: Read the MS Word of the program address;
P<23:16> maps to D<7:0>; D<15:8> will always
be = 0.
Byte: Read one of the MS Bytes of the program
address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be = 0 when
byte select = 1.
TBLWTH: Table Write High (refer to Section 6.0
for details on Flash Programming)
Figure 3-1 shows how the EA is created for table operations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
FIGURE 3-2:
PROGRAM DATA TABLE ACCESS (LS WORD)
PC Address
0x000000
0x000002
0x000004
0x000006
Program Memory
‘Phantom’ Byte
(read as ‘0’)
DS70083G-page 36
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDL.W
TBLRDL.B (Wn<0> = 0)
TBLRDL.B (Wn<0> = 1)
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 3-3:
PROGRAM DATA TABLE ACCESS (MS BYTE)
TBLRDH.W
PC Address
0x000000
0x000002
0x000004
0x000006
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDH.B (Wn<0> = 0)
Program Memory
‘Phantom’ Byte
(read as ‘0’)
3.1.2
TBLRDH.B (Wn<0> = 1)
PROGRAM SPACE VISIBILITY
FROM DATA SPACE
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word program space page. This
provides transparent access of stored constant data
from X data space without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions).
Program space access through the data space occurs
if the MS bit of the data space EA is set and program
space visibility is enabled by setting the PSV bit in the
Core Control register (CORCON). The functions of
CORCON are discussed in Section 2.5, DSP Engine.
Data accesses to this area add an additional cycle to
the instruction being executed, since two program
memory fetches are required.
Note that the upper half of addressable data space is
always part of the X data space. Therefore, when a
DSP operation uses program space mapping to access
this memory region, Y data space should typically contain state (variable) data for DSP operations, whereas
X data space should typically contain coefficient
(constant) data.
Although each data space address, 0x8000 and
higher, maps directly into a corresponding program
memory address (see Figure 3-4), only the lower
16 bits of the 24-bit program word are used to contain
the data. The upper 8 bits should be programmed to
force an illegal instruction to maintain machine robustness. Refer to the Programmer’s Reference Manual
(DS70030) for details on instruction encoding.
 2004 Microchip Technology Inc.
Note that by incrementing the PC by 2 for each
program memory word, the LS 15 bits of data space
addresses directly map to the LS 15 bits in the corresponding program space addresses. The remaining
bits are provided by the Program Space Visibility Page
register, PSVPAG<7:0>, as shown in Figure 3-4.
Note:
PSV access is temporarily disabled during
table reads/writes.
For instructions that use PSV which are executed
outside a REPEAT loop:
• The following instructions will require one
instruction cycle in addition to the specified
execution time:
- MAC class of instructions with data operand
pre-fetch
- MOV instructions
- MOV.D instructions
• All other instructions will require two instruction
cycles in addition to the specified execution time
of the instruction.
For instructions that use PSV which are executed
inside a REPEAT loop:
• The following instances will require two instruction
cycles in addition to the specified execution time
of the instruction:
- Execution in the first iteration
- Execution in the last iteration
- Execution prior to exiting the loop due to an
interrupt
- Execution upon re-entering the loop after an
interrupt is serviced
• Any other iteration of the REPEAT loop will allow
the instruction accessing data, using PSV, to
execute in a single cycle.
Preliminary
DS70083G-page 37
dsPIC30F
FIGURE 3-4:
DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION
Program Space
Data Space
0x0000
EA<15> = 0
PSVPAG(1)
0x21
8
15
Data 16
Space
15
EA
EA<15> = 1
0x8000
15
Address
Concatenation 23
0x108000
23
15
0
0x108200
Upper Half of Data
Space is Mapped
into Program Space
0x10FFFF
0xFFFF
BSET
MOV
MOV
MOV
CORCON,#2
#0x21, W0
W0, PSVPAG
0x8200, W0
; PSV bit set
; Set PSVPAG register
; Access program memory location
; using a data space access
Data Read
Note:
PSVPAG is an 8-bit register, containing bits <22:15> of the program space address (i.e., it defines
the page in program space to which the upper half of data space is being mapped).
DS70083G-page 38
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 3-5:
3.2
SAMPLE PROGRAM
SPACE MEMORY MAP
Reset - GOTO Instruction
Reset - Target Address
000000
000002
000004
Vector Tables
User Memory
Space
Interrupt Vector Table
Reserved
Alternate Vector Table
User Flash
Program Memory
(48K instructions)
Reserved
(Read ‘0’s)
Data EEPROM
(4 Kbytes)
017FFE
018000
7FEFFE
7FF000
7FFFFE
800000
Configuration Memory
Space
Reserved
UNITID (32 instr.)
8005BE
8005C0
8005FE
800600
Reserved
Device Configuration
Registers
F7FFFE
F80000
F8000E
F80010
Reserved
DEVID (2)
Note:
The core has two data spaces. The data spaces can be
considered either separate (for some DSP instructions), or as one unified linear address range (for MCU
instructions). The data spaces are accessed using two
Address Generation Units (AGUs) and separate data
paths.
3.2.1
00007E
000080
000084
0000FE
000100
Data Address Space
DATA SPACES
The X data space is used by all instructions and supports all Addressing modes. There are separate read
and write data buses. The X read data bus is the return
data path for all instructions that view data space as
combined X and Y address space. It is also the X
address space data path for the dual operand read
instructions (MAC class). The X write data bus is the
only write path to data space for all instructions.
The X data space also supports modulo addressing for
all instructions, subject to Addressing mode restrictions. Bit-reversed addressing is only supported for
writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to
provide two concurrent data read paths. No writes
occur across the Y bus. This class of instructions dedicates two W register pointers, W10 and W11, to always
address Y data space, independent of X data space,
whereas W8 and W9 always address X data space.
Note that during accumulator write back, the data
address space is considered a combination of X and Y
data spaces, so the write occurs across the X bus.
Consequently, the write can be to any address in the
entire data space.
The Y data space can only be used for the data prefetch operation associated with the MAC class of
instructions. It also supports modulo addressing for
automated circular buffers. Of course, all other instructions can access the Y data address space through the
X data path as part of the composite linear space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-8 and is not user programmable. Should an EA point to data outside its own
assigned address space, or to a location outside physical memory, an all zero word/byte will be returned. For
example, although Y address space is visible by all
non-MAC instructions using any Addressing mode, an
attempt by a MAC instruction to fetch data from that
space using W8 or W9 (X space pointers) will return
0x0000.
FEFFFE
FF0000
FFFFFE
These address boundaries may vary from one
device to another.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 39
dsPIC30F
TABLE 3-2:
EFFECT OF INVALID
MEMORY ACCESSES
Attempted Operation
FIGURE 3-6:
EA = an unimplemented address
0x0000
W8 or W9 used to access Y data
space in a MAC instruction
0x0000
W10 or W11 used to access X
data space in a MAC instruction
0x0000
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
3.2.2
DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organized as 16-bit wide words. Data space memory is
organized in byte addressable, 16-bit wide blocks.
3.2.3
DATA ALIGNMENT
To help maintain backward compatibility with
PICmicro® devices and improve data space memory
usage efficiency, the dsPIC30F instruction set supports
both word and byte operations. Data is aligned in data
memory and registers as words, but all data space EAs
resolve to bytes. Data byte reads will read the complete
word which contains the byte, using the LS bit of any
EA to determine which byte to select. The selected byte
is placed onto the LS Byte of the X data path (no byte
accesses are possible from the Y data path as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte wide entities with shared (word) address decode
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a consequence of this byte accessibility, all effective
address calculations (including those generated by the
DSP operations which are restricted to word sized
data) are internally scaled to step through word aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode
[Ws++] will result in a value of Ws+1 for byte operations
and Ws+2 for word operations.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported so
care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. Should a misaligned read or write be attempted, an address error
trap will be generated. If the error occurred on a read,
the instruction underway is completed, whereas if it
occurred on a write, the instruction will be executed but
the write will not occur. In either case, a trap will then
be executed, allowing the system and/or user to examine the machine state prior to execution of the address
fault.
DS70083G-page 40
15
Data Returned
DATA ALIGNMENT
MS Byte
87
LS Byte
0
0001
Byte1
Byte 0
0000
0003
Byte3
Byte 2
0002
0005
Byte5
Byte 4
0004
All byte loads into any W register are loaded into the LS
Byte. The MSB is not modified.
A sign-extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
zero-extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words.
3.2.4
DATA SPACE MEMORY MAP
The data space memory is split into two blocks, X and
Y data space. A key element of this architecture is that
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent linear
addressing space, X and Y spaces have contiguous
addresses.
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the 64Kbyte data address space (including all Y addresses).
When executing one of the MAC class of instructions,
the X block consists of the 64-Kbyte data address
space excluding the Y address block (for data reads
only). In other words, all other instructions regard the
entire data memory as one composite address space.
The MAC class instructions extract the Y address space
from data space and address it using EAs sourced from
W10 and W11. The remaining X data space is
addressed using W8 and W9. Both address spaces are
concurrently accessed only with the MAC class
instructions.
An example data space memory map is shown in
Figure 3-8.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
3.2.5
NEAR DATA SPACE
3.2.6
An 8-Kbyte ‘near’ data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly addressable via a 13-bit absolute address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
addressable indirectly. Additionally, the whole of X data
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
The stack pointer always points to the first available
free word and grows from lower addresses towards
higher addresses. It pre-decrements for stack pops and
post-increments for stack pushes as shown in Figure 37. Note that for a PC push during any CALL instruction,
the MSB of the PC is zero-extended before the push,
ensuring that the MSB is always clear.
Note:
A PC push during exception processing
will concatenate the SRL register to the
MSB of the PC prior to the push.
SOFTWARE STACK
The dsPIC devices contain a software stack. W15 is
used as the stack pointer.
There is a Stack Pointer Limit register (SPLIM) associated with the stack pointer. SPLIM is uninitialized at
Reset. As is the case for the stack pointer, SPLIM<0>
is forced to ‘0’ because all stack operations must be
word aligned. Whenever an effective address (EA) is
generated using W15 as a source or destination
pointer, the address thus generated is compared with
the value in SPLIM. If the contents of the Stack Pointer
(W15) and the SPLIM register are equal and a push
operation is performed, a Stack Error Trap will not
occur. The Stack Error Trap will occur on a subsequent
push operation. Thus, for example, if it is desirable to
cause a Stack Error Trap when the stack grows beyond
address 0x2000 in RAM, initialize the SPLIM with the
value, 0x1FFE.
Similarly, a stack pointer underflow (stack error) trap is
generated when the stack pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
FIGURE 3-7:
CALL STACK FRAME
Stack Grows Towards
Higher Address
0x0000 15
0
PC<15:0>
W15 (before CALL)
000000000 PC<22:16>
<Free Word>
W15 (after CALL)
POP : [--W15]
PUSH : [W15++]
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 41
dsPIC30F
FIGURE 3-8:
SAMPLE DATA SPACE MEMORY MAP
MS Byte
Address
MSB
2-Kbyte
SFR Space
LS Byte
Address
16 bits
LSB
0x0000
0x0001
SFR Space
0x07FE
0x0800
0x07FF
0x0801
8-Kbyte
Near
Data
Space
X Data RAM (X)
8-Kbyte
SRAM Space
0x17FF
0x1801
0x17FE
0x1800
0x1FFF
0x1FFE
Y Data RAM (Y)
0x27FF
0x27FE
0x2801
0x2800
0x8001
0x8000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFE
0xFFFF
Note:
The address map shown in Figure 3-8 is conceptual, and may vary across individual devices
depending on available memory.
DS70083G-page 42
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE
SFR SPACE
SFR SPACE
X SPACE
FIGURE 3-9:
Y SPACE
UNUSED
X SPACE
(Y SPACE)
X SPACE
UNUSED
UNUSED
Non-MAC Class Ops (Read/Write)
MAC Class Ops (Write)
Indirect EA from any W
 2004 Microchip Technology Inc.
MAC Class Ops (Read)
Indirect EA from W8, W9
Preliminary
Indirect EA from W10, W11
DS70083G-page 43
DS70083G-page 44
Preliminary
003C
003E
0040
0042
DOSTARTH
DOENDL
DOENDH
SR
OA
—
—
—
—
—
Bit 15
u = uninitialized bit
003A
DOSTARTL
Legend:
0038
0032
TBLPAG
DCOUNT
0030
PCH
0036
002E
PCL
RCOUNT
002C
ACCBU
0034
002A
ACCBH
PSVPAG
0028
001A
W13
ACCBL
0018
W12
0026
0016
W11
ACCAU
0014
W10
0024
0012
W9
ACCAH
0010
W8
0022
000E
W7
ACCAL
000C
W6
0020
000A
W5
SPLIM
0008
W4
001E
0006
W3
W15
0004
W2
001C
0002
W1
W14
0000
W0
SFR Name
OB
—
—
—
—
—
Bit 14
Bit 12
Bit 11
SA
—
—
—
—
—
SB
—
—
—
—
—
OAB
—
—
—
—
—
Sign-Extension (ACCB<39>)
SAB
—
—
—
—
—
Bit 10
Sign-Extension (ACCA<39>)
Bit 13
CORE REGISTER MAP
Address
(Home)
TABLE 3-3:
DA
—
—
—
—
—
DCOUNT
RCOUNT
—
—
—
PCL
ACCBH
ACCBL
ACCAH
ACCAL
SPLIM
W15
W14
W13
W12
W11
W10
W9
W8
W7
W6
W5
W4
W3
W2
W1
DC
—
DOENDL
—
IPL2
—
—
—
Bit 7
W0 / WREG
Bit 8
DOSTARTL
Bit 9
IPL1
Bit 6
IPL0
Bit 5
Bit 3
RA
N
DOENDH
DOSTARTH
PSVPAG
TBLPAG
PCH
ACCBU
ACCAU
Bit 4
OV
Bit 2
Z
Bit 1
C
0
0
Bit 0
0000 0000 0000 0000
0000 0000 0uuu uuuu
uuuu uuuu uuuu uuu0
0000 0000 0uuu uuuu
uuuu uuuu uuuu uuu0
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 1000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
Reset State
dsPIC30F
 2004 Microchip Technology Inc.
 2004 Microchip Technology Inc.
004E
0050
0052
YMODSRT
YMODEND
XBREV
DISICNT
—
BREN
—
YMODEN
—
Bit 14
US
—
—
Bit 12
—
Bit 13
EDT
Bit 11
DL1
Bit 9
BWM<3:0>
DL2
Bit 10
YE<15:1>
YS<15:1>
XE<15:1>
XS<15:1>
DL0
Bit 8
Bit 4
SATDW ACCSAT
Bit 5
YWM<3:0>
SATB
Bit 6
DISICNT<13:0>
XB<14:0>
SATA
Bit 7
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
u = uninitialized bit
004C
XMODEND
Legend:
0048
004A
XMODSRT
XMODEN
—
0044
0046
CORCON
Bit 15
CORE REGISTER MAP (CONTINUED)
Address
(Home)
MODCON
SFR Name
TABLE 3-3:
IPL3
Bit 3
RND
Bit 1
XWM<3:0>
PSV
Bit 2
1
0
1
0
IF
Bit 0
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuu1
uuuu uuuu uuuu uuu0
uuuu uuuu uuuu uuu1
uuuu uuuu uuuu uuu0
0000 0000 0000 0000
0000 0000 0010 0000
Reset State
dsPIC30F
Preliminary
DS70083G-page 45
dsPIC30F
NOTES:
DS70083G-page 46
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
4.0
ADDRESS GENERATOR UNITS
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
The dsPIC core contains two independent address
generator units: the X AGU and Y AGU. Further, the X
AGU has two parts: X RAGU (Read AGU) and X
WAGU (Write AGU). The X RAGU and X WAGU support byte and word sized data space reads and writes
for both MCU and DSP instructions. The Y AGU supports word sized data reads for the DSP MAC class of
instructions only. They are each capable of supporting
two types of data addressing:
When executing instructions which require just one
source operand to be fetched from data space, the X
RAGU and X WAGU are used to calculate the effective
address. The X RAGU and X WAGU can generate any
address in the 64-Kbyte data space. They support all
MCU Addressing modes and modulo addressing for
low overhead circular buffers. The X WAGU also supports bit-reversed addressing to facilitate FFT data
reorganization.
When executing instructions which require two source
operands to be concurrently fetched (i.e., the MAC class
of DSP instructions), both the X RAGU and Y AGU are
used simultaneously and the data space is split into two
independent address spaces, X and Y. The Y AGU supports register indirect post-modified and modulo
addressing only.
Note:
The data write phase of the MAC class of
instructions does not split X and Y address
space. The write EA is calculated using
the X WAGU and the data space is
configured for full 64-Kbyte access.
• Linear Addressing
• Modulo (Circular) Addressing
In addition, the X WAGU can support:
• Bit-Reversed Addressing
Linear and Modulo Data Addressing modes can be
applied to data space or program space. Bit-reversed
addressing is only applicable to data space addresses.
4.1
Data Space Organization
Although the data space memory is organized as 16-bit
words, all effective addresses (EAs) are byte
addresses. Instructions can thus access individual
bytes as well as properly aligned words. Word
addresses must be aligned at even boundaries. Misaligned word accesses are not supported, and if
attempted, will initiate an address error trap.
In the Split Data Space mode, some W register address
pointers are dedicated to X RAGU, and others to Y
AGU. The EAs of each operand must, therefore, be
restricted within different address spaces. If they are
not, one of the EAs will be outside the address space
of the corresponding data space (and will fetch the bus
default value, 0x0000).
4.2
Instruction Addressing Modes
The Addressing modes in Table 4-1 form the basis of
the Addressing modes optimized to support the specific
features of individual instructions. The Addressing
modes provided in the MAC class of instructions are
somewhat different from those in the other instruction
types.
Some Addressing mode combinations may lead to a
one-cycle stall during instruction execution, or are not
allowed, as discussed in Section 4.3.
TABLE 4-1:
FUNDAMENTAL ADDRESSING MODES SUPPORTED
Addressing Mode
Description
File Register Direct
The address of the File register is specified explicitly.
Register Direct
The contents of a register are accessed directly.
Register Indirect
The contents of Wn forms the EA.
Register Indirect Post-modified
The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-modified
Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset
 2004 Microchip Technology Inc.
The sum of Wn and a literal forms the EA.
Preliminary
DS70083G-page 47
dsPIC30F
4.2.1
FILE REGISTER INSTRUCTIONS
Most File register instructions use a 13-bit address field
(f) to directly address data present in the first 8192
bytes of data memory. These memory locations are
known as File registers. Most File register instructions
employ a working register, W0, which is denoted as
WREG in these instructions. The destination is typically
either the same File register or WREG (with the exception of the MUL instruction), which writes the result to a
register or register pair. The MOV instruction can use a
16-bit address field.
4.2.2
In summary, the following Addressing modes are
supported by move and accumulator instructions:
•
•
•
•
•
•
•
•
MCU INSTRUCTIONS
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
Note:
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
Not all instructions support all the
Addressing modes given above. Individual
instructions may support different subsets
of these Addressing modes.
where Operand 1 is always a working register (i.e., the
Addressing mode can only be register direct) which is
referred to as Wb. Operand 2 can be the W register
fetched from data memory or 5-bit literal. In twooperand instructions, the result location is the same as
that of one of the operands. Certain MCU instructions
are one-operand operations. The following addressing
modes are supported by MCU instructions:
4.2.4
•
•
•
•
•
The 2 source operand pre-fetch registers must be a
member of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 will always be directed to the X
RAGU and W10 and W11 will always be directed to the
Y AGU. The effective addresses generated (before and
after modification) must, therefore, be valid addresses
within X data space for W8 and W9 and Y data space
for W10 and W11.
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
5-bit or 10-bit Literal
Note:
4.2.3
Not all instructions support all the
Addressing modes given above. Individual
instructions may support different subsets
of these Addressing modes.
MOVE AND ACCUMULATOR
INSTRUCTIONS
For the MOV instructions, the Addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (register offset)
field is shared between both source and
destination (but typically only used by
one).
DS70083G-page 48
Note:
Register indirect with register offset
addressing is only available for W9 (in X
space) and W11 (in Y space).
In summary, the following Addressing modes are
supported by the MAC class of instructions:
Move instructions and the DSP accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
Addressing modes supported by most MCU instructions, move and accumulator instructions also support
Register Indirect with Register Offset Addressing
mode, also referred to as Register Indexed mode.
Note:
MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
Addressing modes to allow the user to effectively
manipulate the data pointers through register indirect
tables.
•
•
•
•
•
Register Indirect
Register Indirect Post-modified by 2
Register Indirect Post-modified by 4
Register Indirect Post-modified by 6
Register Indirect with Register Offset (Indexed)
4.2.5
OTHER INSTRUCTIONS
Besides the various Addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
4.3
4.3.1
4.3.2
Instruction Stalls
During the instruction pre-decode, the core determines
if any address register dependency is imminent across
an instruction boundary. The stall detection logic compares the W register (if any) used for the destination EA
of the instruction currently being executed, with the W
register to be used by the source EA (if any) of the prefetched instruction. As the W registers are also memory
mapped, the stall detection logic also derives an SFR
address from the W register being used by the destination EA, and determines whether this address is being
issued during the write phase of the instruction
currently being executed.
INTRODUCTION
In order to maximize data space, EA calculation and
operand fetch time, the X data space read and write
accesses are partially pipelined. The latter half of the
read phase overlaps the first half of the write phase of
an instruction, as shown in Section 2.0.
Address register data dependencies, also known as
‘Read After Write’ (RAW) dependencies may, therefore, arise between successive read and write operations using common registers. They occur across
instruction boundaries and are detected by the
hardware.
When it observes a match between the destination and
source registers, a set of rules is applied to decide
whether or not to stall the instruction by one cycle.
Table 4-2 lists out the various RAW conditions which
cause an instruction execution stall.
An example of a RAW dependency is a write operation
(in the current instruction) that modifies W5, followed
by a read operation (in the next instruction) that uses
W5 as a source address pointer. W5 will not be valid for
the read operation until the earlier write completes.
This problem is resolved by stalling the instruction execution for one instruction cycle, thereby allowing the
write to complete before the next read is started.
TABLE 4-2:
RAW DEPENDENCY DETECTION
RAW DEPENDENCY RULES (DETECTION BY HARDWARE)
Destination
Source Addressing
Addressing Mode
Mode Using Wn
Using Wn
Examples
(Wn = W2)
Status
Direct
Direct
Direct
Indirect
Stall
ADD.w
MOV.w
W0, W1, W2
[W2], W3
Direct
Indirect with Pre- or
Post-Modification
Stall
ADD.w
MOV.w
W0, W1, W2
[W2++], W3
Indirect
Direct
No Stall ADD.w
MOV.w
W0, W1, [W2]
W2, W3
Indirect
Indirect
No Stall ADD.w
MOV.w
W0, W1, [W2]
[W2], W3
Indirect
Indirect
Indirect
Indirect with Pre- or
Post-Modification
Indirect
Indirect with Pre- or
Post-Modification
Indirect with Pre- or Direct
Post-Modification
No Stall ADD.w
MOV.w
Stall
ADD.w
MOV.w
W2)
No Stall ADD.w
MOV.w
Stall
ADD.w
MOV.w
W2)
No Stall ADD.w
MOV.w
W0, W1, W2
W2, W3
W0, W1, [W2] ; W2=0x0004 (mapped W2)
[W2], W3
; (i.e. if W2 = addr. of
W0, W1, [W2]
[W2++], W3
W0, W1, [W2] ; W2=0x0004 (mapped W2)
[W2++], W3
; (i.e. if W2 = addr. of
W0, W1, [W2++]
W2, W3
Indirect with Pre- or Indirect
Post-Modification
Stall
ADD.w
MOV.w
W0, W1, [W2++]
[W2], W3
Indirect with Pre- or Indirect with Pre- or
Post-Modification
Post-Modification
Stall
ADD.w
MOV.w
W0, W1, [W2++]
[W2++], W3
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 49
dsPIC30F
4.4
Modulo Addressing
Modulo addressing is a method of providing an automated means to support circular data buffers using
hardware. The objective is to remove the need for software to perform data address boundary checks when
executing tightly looped code, as is typical in many
DSP algorithms.
Modulo addressing can operate in either data or program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can
be supported in each of the X (which also provides the
pointers into program space) and Y data spaces. Modulo addressing can operate on any W register pointer.
However, it is not advisable to use W14 or W15 for modulo addressing since these two registers are used as
the stack frame pointer and stack pointer, respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing
buffers) based upon the direction of the buffer.
The only exception to the usage restrictions is for buffers which have a power-of-2 length. As these buffers
satisfy the start and end address criteria, they may
operate in a Bidirectional mode (i.e., address boundary
checks will be performed on both the lower and upper
address boundaries).
4.4.1
START AND END ADDRESS
The modulo addressing scheme requires that a starting
and an ending address be specified and loaded into the
16-bit Modulo Buffer Address registers: XMODSRT,
XMODEND, YMODSRT, YMODEND (see Table 3-3).
Note:
The start and end addresses are the first
and last byte addresses of the buffer (irrespective of whether it is a word or byte
buffer, or an increasing or decreasing
buffer). Moreover, the start address must
be even and the end address must be odd
(for both word and byte buffers).
For example, if the start address was chosen to be
0x2000, then the X/YMODEND would be set to
(0x2000 + 0x0064 – 1) = 0x2063.
Note:
In the case of a decrementing buffer, the last ‘N’ bits of
the data buffer end address must be ones. There are
no such restrictions on the start address of a decrementing buffer. For example, if the buffer size (modulus
value) is chosen to be 100 bytes (0x64), then the buffer
end address for a decrementing buffer must contain
7 Least Significant ones. Valid end addresses may,
therefore, be 0xXXFF and 0xXX7F, where ‘X’ is any
hexadecimal value. Subtracting the buffer length from
this value and adding 1 will give the start address to be
written into X/YMODSRT. For example, if the end
address was chosen to be 0x207F, then the start
address would be (0x207F – 0x0064 + 1) = 0x201C,
which is the first physical address of the buffer.
Note:
Y space modulo addressing EA calculations assume word sized data (LS bit of
every EA is always clear).
The length of a circular buffer is not directly specified. It
is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words
(64 Kbytes).
A write operation to the MODCON register should not
be immediately followed by an indirect read operation
using any W register.
Note 1: Using a POP instruction to pop the contents of the top-of-stack (TOS) location
into MODCON also constitutes a write to
MODCON. Therefore, the instruction
immediately following such a POP cannot
be any instruction performing an indirect
read operation.
If the length of an incrementing buffer is greater than
M = 2N-1, but not greater than M = 2N bytes, then the
last ‘N’ bits of the data buffer start address must be
zeros. There are no such restrictions on the end
address of an incrementing buffer. For example, if the
buffer size (modulus value) is chosen to be 100 bytes
(0x64), then the buffer start address for an incrementing buffer must contain 7 Least Significant zeros. Valid
start addresses may, therefore, be 0xXX00 and
0xXX80, where ‘X’ is any hexadecimal value. Adding
the buffer length to this value and subtracting ‘1’ will
give the end address to be written into X/YMODEND.
DS70083G-page 50
‘Start address’ refers to the smallest
address boundary of the circular buffer.
The first access of the buffer may be at
any address within the modulus range
(see Section 4.4.4).
Preliminary
2: It should be noted that some instructions
perform an indirect read operation
implicitly. These are: POP, RETURN,
RETFIE, RETLW and ULNK.
 2004 Microchip Technology Inc.
dsPIC30F
4.4.2
W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control register MODCON<15:0> contains enable flags as well as
a W register field to specify the W address registers.
The XWM and YWM fields select which registers will
operate with modulo addressing. If XWM = 15, X
RAGU and X WAGU modulo addressing is disabled.
Similarly, if YWM = 15, Y AGU modulo addressing is
disabled.
Note:
The XMODSRT and XMODEND registers
and the XWM register selection are
shared between X RAGU and X WAGU.
FIGURE 4-1:
The X Address Space Pointer W register (XWM), to
which modulo addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo addressing is
enabled for X data space when XWM is set to any value
other than ‘15’ and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM), to
which modulo addressing is to be applied, is stored in
MODCON<7:4>. Modulo addressing is enabled for Y
data space when YWM is set to any value other than
‘15’ and the YMODEN bit is set at MODCON<14>.
INCREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
0x1100
MOV
MOV
MOV
MOV
MOV
MOV
#0x1100,W0
W0,XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
MOV
#0x0000,W0
;W0 holds buffer fill value
MOV
#0x1110,W1
;point W1 to buffer
DO
AGAIN,#0x31
MOV
W0,[W1++]
AGAIN: INC W0,W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;fill the 50 buffer locations
;fill the next location
;increment the fill value
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 51
dsPIC30F
FIGURE 4-2:
DECREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
0x11D0
MOV
MOV
MOV
MOV
MOV
MOV
#0x11D0,W0
#0,XMODSRT
0x11FF,W0
W0,XMODEND
#0x8001,W0
W0,MODCON
MOV
#0x000F,W0
;W0 holds buffer fill value
MOV
#0x11E0,W1
;point W1 to buffer
DO
AGAIN,#0x17
MOV
W0,[W1--]
AGAIN: DEC W0,W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;fill the 24 buffer locations
;fill the next location
; decrement the fill value
0x11FF
Start Addr = 0x11D0
End Addr = 0x11FF
Length = 0x0018 words
DS70083G-page 52
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
4.4.3
MODULO ADDRESSING
APPLICABILITY
4.5
Modulo addressing can be applied to the effective
address (EA) calculation associated with any W register. It is important to realize that the address boundaries check for addresses less than, or greater than the
upper (for incrementing buffers), and lower (for decrementing buffers) boundary addresses (not just equal
to). Address changes may, therefore, jump over boundaries and still be adjusted correctly (see Section 4.4.4
for restrictions).
Note:
4.4.4
The modulo corrected effective address is
written back to the register only when PreModify or Post-Modify Addressing mode is
used to compute the effective address.
When an address offset (e.g., [W7+W2]) is
used, modulo address correction is performed but the contents of the register
remain unchanged.
MODULO ADDRESSING
RESTRICTIONS
For an incrementing buffer, the circular buffer start
address (lower boundary) is arbitrary but must be at a
‘zero’ power-of-two boundary (see Section 4.4.1). For
a decrementing buffer, the circular buffer end address
is arbitrary but must be at a ‘ones’ boundary.
There are no restrictions regarding how much an EA
calculation can exceed the address boundary being
checked and still be successfully corrected.
Once configured, the direction of successive
addresses into a buffer should not be changed.
Although all EAs will continue to be generated correctly, irrespective of offset sign, only one address
boundary is checked for each type of buffer. Thus, if a
buffer is set up to be an incrementing buffer by choosing an appropriate starting address, then correction of
the effective address will be performed by the AGU at
the upper address boundary, but no address correction
will occur if the EA crosses the lower address boundary. Similarly, for a decrementing boundary, address
correction will be performed by the AGU at the lower
address boundary, but no address correction will take
place if the EA crosses the upper address boundary.
The circular buffer pointer may be freely modified in
both directions without a possibility of out-of-range
address access only when the start address satisfies
the condition for an incrementing buffer (last ‘N’ bits are
zeroes) and the end address satisfies the condition for
a decrementing buffer (last ‘N’ bits are ones). Thus, the
modulo addressing capability is truly bidirectional only
for modulo-2 length buffers.
Bit-Reversed Addressing
Bit-reversed addressing is intended to simplify data reordering for radix-2 FFT algorithms. It is supported by
the X WAGU only (i.e., for data writes only).
The modifier, which may be a constant value or register
contents, is regarded as having its bit order reversed. The
address source and destination are kept in normal order.
Thus, the only operand requiring reversal is the modifier.
4.5.1
BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-reversed addressing is enabled when:
1.
BWM (W register selection) in the MODCON
register is any value other than ‘15’ (the stack
cannot be accessed using bit-reversed
addressing) and
the BREN bit is set in the XBREV register and
the Addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
2.
3.
If the length of a bit-reversed buffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer start address
must be zeros.
XB<14:0> is the bit-reversed address modifier or ‘pivot
point’ which is typically a constant. In the case of an
FFT computation, its value is equal to half of the FFT
data buffer size.
Note:
All bit-reversed EA calculations assume
word sized data (LS bit of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
When enabled, bit-reversed addressing will only be
executed for register indirect with pre-increment or
post-increment addressing and word sized data writes.
It will not function for any other Addressing mode or for
byte sized data, and normal addresses will be generated instead. When bit-reversed addressing is active,
the W address pointer will always be added to the
address modifier (XB) and the offset associated with
the Register Indirect Addressing mode will be ignored.
In addition, as word sized data is a requirement, the LS
bit of the EA is ignored (and always clear).
Note:
Modulo addressing and bit-reversed
addressing should not be enabled together.
In the event that the user attempts to do
this, bit-reversed addressing will assume
priority when active for the X WAGU, and X
WAGU modulo addressing will be disabled.
However, modulo addressing will continue
to function in the X RAGU.
If bit-reversed addressing has already been enabled by
setting the BREN (XBREV<15>) bit, then a write to the
XBREV register should not be immediately followed by
an indirect read operation using the W register that has
been designated as the bit-reversed pointer.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 53
dsPIC30F
FIGURE 4-3:
BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b4
b3 b2 b1
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b1
b2 b3 b4
0
Bit-Reversed Address
Pivot Point
XB = 0x0008 for a 16-word Bit-Reversed Buffer
TABLE 4-3:
BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address
Bit-Reversed Address
A3
A2
A1
A0
Decimal
A3
A2
A1
A0
Decimal
0
0
0
0
0
0
0
1
0
1
0
1
0
0
0
0
0
0
0
8
0
0
0
0
1
1
0
1
2
3
0
1
1
1
0
0
0
0
4
12
0
0
1
1
0
0
0
1
4
5
0
1
0
0
1
1
0
0
2
10
0
0
1
1
1
1
0
1
6
7
0
1
1
1
1
1
0
0
6
14
1
1
0
0
0
0
0
1
8
9
0
1
0
0
0
0
1
1
1
9
1
1
1
0
0
1
1
1
0
0
1
0
10
11
12
0
1
0
1
1
0
0
0
1
1
1
1
5
13
3
1
1
1
1
0
1
1
0
13
14
1
0
0
1
1
1
1
1
11
7
1
1
1
1
15
1
1
1
1
15
TABLE 4-4:
DS70083G-page 54
BIT-REVERSED ADDRESS MODIFIER VALUES
Buffer Size (Words)
XB<14:0> Bit-Reversed Address Modifier Value
32768
0x4000
16384
8192
0x2000
0x1000
4096
2048
0x0800
0x0400
1024
512
0x0200
0x0100
256
128
0x0080
0x0040
64
32
0x0020
0x0010
16
0x0008
8
0x0004
4
2
0x0002
0x0001
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
5.0
INTERRUPTS
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
• INTCON1<15:0>, INTCON2<15:0>
Global interrupt control functions are derived from
these two registers. INTCON1 contains the control and status flags for the processor exceptions.
The INTCON2 register controls the external
interrupt request signal behavior and the use of
the alternate vector table.
Note:
The dsPIC30F Sensor and General Purpose Family
has up to 41 interrupt sources and 4 processor exceptions (traps) which must be arbitrated based on a
priority scheme.
The CPU is responsible for reading the Interrupt Vector
Table (IVT) and transferring the address contained in
the interrupt vector to the program counter. The interrupt vector is transferred from the program data bus
into the program counter via a 24-bit wide multiplexer
on the input of the program counter.
The Interrupt Vector Table (IVT) and Alternate Interrupt
Vector Table (AIVT) are placed near the beginning of
program memory (0x000004). The IVT and AIVT are
shown in Table 5-2.
The interrupt controller is responsible for preprocessing the interrupts and processor exceptions
prior to them being presented to the processor core.
The peripheral interrupts and traps are enabled, prioritized and controlled using centralized Special Function
Registers:
• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>
All interrupt request flags are maintained in these
three registers. The flags are set by their respective peripherals or external signals, and they are
cleared via software.
• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>
All interrupt enable control bits are maintained in
these three registers. These control bits are used
to individually enable interrupts from the
peripherals or external signals.
• IPC0<15:0>... IPC10<7:0>
The user assignable priority level associated with
each of these 41 interrupts is held centrally in
these twelve registers.
• IPL<3:0>
The current CPU priority level is explicitly stored
in the IPL bits. IPL<3> is present in the CORCON
register, whereas IPL<2:0> are present in the
STATUS register (SR) in the processor core.
 2004 Microchip Technology Inc.
Interrupt flag bits get set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an
interrupt.
All interrupt sources can be user assigned to one of 7
priority levels, 1 through 7, via the IPCx registers. Each
interrupt source is associated with an interrupt vector,
as shown in Table 5-2. Levels 7 and 1 represent the
highest and lowest maskable priorities, respectively.
Note:
Assigning a priority level of ‘0’ to an interrupt source is equivalent to disabling that
interrupt.
If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts is prevented. Thus, if an interrupt is currently
being serviced, processing of a new interrupt is prevented even if the new interrupt is of higher priority than
the one currently being serviced.
Note:
The IPL bits become read only whenever
the NSTDIS bit has been set to ‘1’.
Certain interrupts have specialized control bits for features like edge or level triggered interrupts, interrupton-change, etc. Control of these features remains
within the peripheral module which generates the
interrupt.
The DISI instruction can be used to disable the processing of interrupts of priorities 6 and lower for a certain number of instructions, during which the DISI bit
(INTCON2<14>) remains set.
When an interrupt is serviced, the PC is loaded with the
address stored in the vector location in program memory that corresponds to the interrupt. There are 63 different vectors within the IVT (refer to Table 5-2). These
vectors are contained in locations 0x000004 through
0x0000FE of program memory (refer to Table 5-2).
These locations contain 24-bit addresses and in order
to preserve robustness, an address error trap will take
place should the PC attempt to fetch any of these
words during normal execution. This prevents execution of random data as a result of accidentally decrementing a PC into vector space, accidentally mapping
a data space address into vector space, or the PC rolling over to 0x000000 after reaching the end of implemented program memory space. Execution of a GOTO
instruction to this vector space will also generate an
address error trap.
Preliminary
DS70083G-page 55
dsPIC30F
5.1
TABLE 5-1:
Interrupt Priority
The user assignable interrupt priority (IP<2:0>) bits for
each individual interrupt source are located in the LS
3 bits of each nibble within the IPCx register(s). Bit 3 of
each nibble is not used and is read as a ‘0’. These bits
define the priority level assigned to a particular interrupt
by the user.
Note:
The user selectable priority levels start at
0 as the lowest priority and level 7 as the
highest priority.
Since more than one interrupt request source may be
assigned to a specific user specified priority level, a
means is provided to assign priority within a given level.
This method is called “Natural Order Priority”.
Table 5-1 lists the interrupt numbers and interrupt
sources for the dsPIC device and their associated
vector numbers.
Note 1: The natural order priority scheme has 0
as the highest priority and 53 as the
lowest priority.
2: The natural order priority number is the
same as the INT number.
The ability for the user to assign every interrupt to one
of seven priority levels implies that the user can assign
a very high overall priority level to an interrupt with a
low natural order priority. For example, the PLVD (Low
Voltage Detect) can be given a priority of 7. The INT0
(External Interrupt 0) may be assigned to priority level
1, thus giving it a very low effective priority.
DS70083G-page 56
INT
Number
NATURAL ORDER PRIORITY
Vector
Number
Interrupt Source
Highest Natural Order Priority
0
8
INT0 - External Interrupt 0
1
9
IC1 - Input Capture 1
2
10
OC1 - Output Compare 1
3
11
T1 - Timer 1
4
12
IC2 - Input Capture 2
5
13
OC2 - Output Compare 2
6
14
T2 - Timer 2
7
15
T3 - Timer 3
8
16
SPI1
9
17
U1RX - UART1 Receiver
10
18
U1TX - UART1 Transmitter
11
19
ADC - ADC Convert Done
12
20
NVM - NVM Write Complete
13
21
SI2C - I2C Slave Interrupt
14
22
MI2C - I2C Master Interrupt
15
23
Input Change Interrupt
16
24
INT1 - External Interrupt 1
17
25
IC7 - Input Capture 7
18
26
IC8 - Input Capture 8
19
27
OC3 - Output Compare 3
20
28
OC4 - Output Compare 4
21
29
T4 - Timer 4
22
30
T5 - Timer 5
23
31
INT2 - External Interrupt 2
24
32
U2RX - UART2 Receiver
25
33
U2TX - UART2 Transmitter
26
34
SPI2
27
35
C1 - Combined IRQ for CAN1
28
36
IC3 - Input Capture 3
29
37
IC4 - Input Capture 4
30
38
IC5 - Input Capture 5
31
39
IC6 - Input Capture 6
32
40
OC5 - Output Compare 5
33
41
OC6 - Output Compare 6
34
42
OC7 - Output Compare 7
35
43
OC8 - Output Compare 8
36
44
INT3 - External Interrupt 3
37
45
INT4 - External Interrupt 4
38
46
C2 - Combined IRQ for CAN2
39-40
47-48 Reserved
41
49
DCI - Codec Transfer Done
42
50
LVD - Low Voltage Detect
43-53
51-61 Reserved
Lowest Natural Order Priority
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
5.2
Reset Sequence
5.3
A Reset is not a true exception, because the interrupt
controller is not involved in the Reset process. The processor initializes its registers in response to a Reset
which forces the PC to zero. The processor then begins
program execution at location 0x000000. A GOTO
instruction is stored in the first program memory location immediately followed by the address target for the
GOTO instruction. The processor executes the GOTO to
the specified address and then begins operation at the
specified target (start) address.
5.2.1
Traps can be considered as non-maskable, non-stable
interrupts, which adhere to a predefined priority, as
shown in Table 5-2. They are intended to provide the
user a means to correct erroneous operation during
debug and when operating within the application.
Note:
RESET SOURCES
In addition to external Reset and Power-on Reset
(POR), there are 6 sources of error conditions which
‘trap’ to the Reset vector.
• Watchdog Time-out:
The watchdog has timed out, indicating that the
processor is no longer executing the correct flow
of code.
• Uninitialized W Register Trap:
An attempt to use an uninitialized W register as
an address pointer will cause a Reset.
• Illegal Instruction Trap:
Attempted execution of any unused opcodes will
result in an illegal instruction trap. Note that a
fetch of an illegal instruction does not result in an
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change.
• Brown-out Reset (BOR):
A momentary dip in the power supply to the
device has been detected which may result in
malfunction.
• Trap Lockout:
Occurrence of multiple trap conditions
simultaneously will cause a Reset.
 2004 Microchip Technology Inc.
Traps
If the user does not intend to take corrective action in the event of a trap error condition, these vectors must be loaded with
the address of a default handler that simply contains the RESET instruction. If, on
the other hand, one of the vectors containing an invalid address is called, an
address error trap is generated.
Note that many of these trap conditions can only be
detected when they occur. Consequently, the questionable instruction is allowed to complete prior to trap
exception processing. If the user chooses to recover
from the error, the result of the erroneous action that
caused the trap may have to be corrected.
There are 8 fixed priority levels for traps: level 8 through
level 15, which implies that the IPL3 is always set
during processing of a trap.
If the user is not currently executing a trap, and he sets
the IPL<3:0> bits to a value of ‘0111’ (level 7), then all
interrupts are disabled but traps can still be processed.
5.3.1
TRAP SOURCES
The following traps are provided with increasing priority. However, since all traps can be nested, priority has
little effect.
• Math Error Trap:
The math error trap executes under the following
four circumstances:
1. Should an attempt be made to divide by
zero, the divide operation will be aborted on
a cycle boundary and the trap taken.
2. If enabled, a math error trap will be taken
when an arithmetic operation on either
accumulator A or B causes an overflow
from bit 31 and the accumulator guard bits
are not utilized.
3. If enabled, a math error trap will be taken
when an arithmetic operation on either
accumulator A or B causes a catastrophic
overflow from bit 39 and all saturation is
disabled.
4. If the shift amount specified in a shift
instruction is greater than the maximum
allowed shift amount, a trap will occur.
Preliminary
DS70083G-page 57
dsPIC30F
• Address Error Trap:
This trap is initiated when any of the following
circumstances occurs:
1. A misaligned data word access is
attempted.
2. A data fetch from and unimplemented data
memory location is attempted.
3. A data fetch from an unimplemented program memory location is attempted.
4. An instruction fetch from vector space is
attempted.
Note:
In the MAC class of instructions, wherein
the data space is split into X and Y data
space, unimplemented X space includes
all of Y space, and unimplemented Y
space includes all of X space.
5.
Execution of a “BRA #literal” instruction or a
“GOTO #literal” instruction, where literal
is an unimplemented program memory address.
6. Executing instructions after modifying the PC to
point to unimplemented program memory
addresses. The PC may be modified by loading
a value into the stack and executing a RETURN
instruction.
• Stack Error Trap:
This trap is initiated under the following
conditions:
1. The stack pointer is loaded with a value
which is greater than the (user programmable) limit value written into the SPLIM
register (stack overflow).
2. The stack pointer is loaded with a value
which is less than 0x0800 (simple stack
underflow).
• Oscillator Fail Trap:
This trap is initiated if the external oscillator fails
and operation becomes reliant on an internal RC
backup.
5.3.2
HARD AND SOFT TRAPS
It is possible that multiple traps can become active
within the same cycle (e.g., a misaligned word stack
write to an overflowed address). In such a case, the
fixed priority shown in Figure 5-2 is implemented,
which may require the user to check if other traps are
pending in order to completely correct the fault.
‘Soft’ traps include exceptions of priority level 8 through
level 11, inclusive. The arithmetic error trap (level 11)
falls into this category of traps. Soft traps can be treated
like non-maskable sources of interrupt that adhere to
the priority assigned by their position in the IVT. Soft
traps are processed like interrupts and require 2 cycles
to be sampled and Acknowledged prior to exception
processing. Therefore, additional instructions may be
executed before a soft trap is Acknowledged.
‘Hard’ traps include exceptions of priority level 12
through level 15, inclusive. The address error (level
12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
Like soft traps, hard traps can also be viewed as nonmaskable sources of interrupt. The difference between
hard traps and soft traps is that hard traps force the
CPU to stop code execution after the instruction causing the trap has completed. Normal program execution
flow will not resume until after the trap has been
Acknowledged and processed.
If a higher priority trap occurs while any lower priority
trap is in progress, processing of the lower priority trap
will be suspended and the higher priority trap will be
Acknowledged and processed. The lower priority trap
will remain pending until processing of the higher
priority trap completes.
Each hard trap that occurs must be Acknowledged
before code execution of any type may continue. If a
lower priority hard trap occurs while a higher priority
trap is pending, Acknowledged, or is being processed,
a hard trap conflict will occur. The conflict occurs
because the lower priority trap cannot be Acknowledged until processing for the higher priority trap
completes.
The device is automatically reset in a hard trap conflict
condition. The TRAPR status bit (RCON<15>) is set
when the Reset occurs so that the condition may be
detected in software.
In the case of a math error trap or oscillator failure trap,
the condition that causes the trap to occur must be
removed before the respective trap flag bit in the
INTCON1 register may be cleared.
DS70083G-page 58
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
5.4
FIGURE 5-2:
Interrupt Sequence
Decreasing
Priority
All interrupt event flags are sampled in the beginning of
each instruction cycle by the IFSx registers. A pending
interrupt request (IRQ) is indicated by the flag bit being
equal to a ‘1’ in an IFSx register. The IRQ will cause an
interrupt to occur if the corresponding bit in the Interrupt
Enable (IECx) register is set. For the remainder of the
instruction cycle, the priorities of all pending interrupt
requests are evaluated.
IVT
If there is a pending IRQ with a priority level greater
than the current processor priority level in the IPL bits,
the processor will be interrupted.
The processor then stacks the current program counter
and the low byte of the processor STATUS register
(SRL), as shown in Figure 5-1. The low byte of the
STATUS register contains the processor priority level at
the time prior to the beginning of the interrupt cycle.
The processor then loads the priority level for this interrupt into the STATUS register. This action will disable
all lower priority interrupts until the completion of the
Interrupt Service Routine.
FIGURE 5-1:
Stack Grows Towards
Higher Address
0x0000 15
AIVT
INTERRUPT STACK
FRAME
5.5
0
PC<15:0>
SRL IPL3 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
POP : [--W15]
PUSH: [W15++]
Note 1: The user can always lower the priority
level by writing a new value into SR. The
Interrupt Service Routine must clear the
interrupt flag bits in the IFSx register
before lowering the processor interrupt
priority, in order to avoid recursive
interrupts.
EXCEPTION VECTORS
Reset - GOTO Instruction
Reset - GOTO Address
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
~
~
~
Interrupt 52 Vector
Interrupt 53 Vector
Reserved
Reserved
Reserved
Oscillator Fail Trap Vector
Stack Error Trap Vector
Address Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
~
~
~
Interrupt 52 Vector
Interrupt 53 Vector
0x000000
0x000002
0x000004
0x000014
0x00007E
0x000080
0x000082
0x000084
0x000094
0x0000FE
Alternate Vector Table
In program memory, the Interrupt Vector Table (IVT) is
followed by the Alternate Interrupt Vector Table (AIVT),
as shown in Table 5-2. Access to the alternate vector
table is provided by the ALTIVT bit in the INTCON2 register. If the ALTIVT bit is set, all interrupt and exception
processes will use the alternate vectors instead of the
default vectors. The alternate vectors are organized in
the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a
means to switch between an application and a support
environment without requiring the interrupt vectors to
be reprogrammed. This feature also enables switching
between applications for evaluation of different
software algorithms at run time.
If the AIVT is not required, the program memory allocated to the AIVT may be used for other purposes.
AIVT is not a protected section and may be freely
programmed by the user.
2: The IPL3 bit (CORCON<3>) is always
clear when interrupts are being processed. It is set only during execution of
traps.
The RETFIE (return from interrupt) instruction will
unstack the program counter and STATUS registers to
return the processor to its state prior to the interrupt
sequence.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 59
dsPIC30F
5.6
Fast Context Saving
5.7
A context saving option is available using shadow registers. Shadow registers are provided for the DC, N,
OV, Z and C bits in SR, and the registers W0 through
W3. The shadows are only one level deep. The shadow
registers are accessible using the PUSH.S and POP.S
instructions only.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current
value of the aforementioned registers into their
respective shadow registers.
If an ISR of a certain priority uses the PUSH.S and
POP.S instructions for fast context saving, then a
higher priority ISR should not include the same instructions. Users must save the key registers in software
during a lower priority interrupt if the higher priority ISR
uses fast context saving.
DS70083G-page 60
External Interrupt Requests
The interrupt controller supports up to five external
interrupt request signals, INT0-INT4. These inputs are
edge sensitive; they require a low-to-high or a high-tolow transition to generate an interrupt request. The
INTCON2 register has five bits, INT0EP-INT4EP, that
select the polarity of the edge detection circuitry.
5.8
Wake-up from Sleep and Idle
The interrupt controller may be used to wake-up the
processor from either Sleep or Idle modes, if Sleep or
Idle mode is active when the interrupt is generated.
If an enabled interrupt request of sufficient priority is
received by the interrupt controller, then the standard
interrupt request is presented to the processor. At the
same time, the processor will wake-up from Sleep or
Idle and begin execution of the Interrupt Service
Routine (ISR) needed to process the interrupt request.
Preliminary
 2004 Microchip Technology Inc.
0084
IFS0
 2004 Microchip Technology Inc.
—
—
—
—
00A2
00A4
00A6
00A8
u = uninitialized bit
IPC8
IPC9
IPC10
Legend:
Preliminary
—
—
OC8IP<2:0>
IC6IP<2:0>
C1IP<2:0>
INT2IP<2:0>
OC3IP<2:0>
CNIP<2:0>
—
—
—
IC3IE
NVMIE
—
IC3IF
NVMIF
—
—
Bit 12
—
—
—
—
—
—
—
—
—
—
—
—
C1IE
ADIE
—
C1IF
ADIF
—
—
Bit 11
DCIIF
U2TXIF
U1RXIF
—
OVBTE
Bit 9
LVDIE
SPI2IE
SPI1IE
—
U2RXIF
SPI1IF
—
COVTE
Bit 8
LVDIP<2:0>
C2IP<2:0>
OC7IP<2:0>
IC5IP<2:0>
SPI2IP<2:0>
T5IP<2:0>
IC8IP<2:0>
MI2CIP<2:0>
U1TXIP<2:0>
T2IP<2:0>
OC1IP<2:0>
DCIIE
—
U2TXIE U2RXIE
U1TXIE U1RXIE
LVDIF
SPI2IF
U1TXIF
—
OVATE
Bit 10
—
—
—
—
—
—
—
—
—
—
—
—
INT2IE
T3IE
—
INT2IF
T3IF
—
—
Bit 7
C2IE
T5IE
T2IE
C2IF
T5IF
T2IF
—
—
Bit 6
Bit 4
INT3IE
OC4IE
IC2IE
INT3IF
OC4IF
IC2IF
INT4EP
MATHERR
DCIIP<2:0>
INT41IP<2:0>
OC6IP<2:0>
IC4IP<2:0>
U2TXIP<2:0>
T4IP<2:0>
IC7IP<2:0>
SI2CIP<2:0>
U1RXIP<2:0>
OC2IP<2:0>
IC1IP<2:0>
INT4IE
T4IE
OC2IE
INT4IF
T4IF
OC2IF
—
—
Bit 5
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
—
—
—
IPC7
—
—
009E
009C
IPC4
—
00A0
009A
IPC3
ADIP<2:0>
—
IPC6
0098
IPC2
T1IP<2:0>
T31P<2:0>
—
—
IC4IE
SI2CIE
—
IC4IF
—
IPC5
0094
0096
IPC0
—
—
0090
IPC1
IC5IE
IC6IE
008E
IEC1
IEC2
MI2CIE
CNIE
008C
—
—
IEC0
IC5IF
IC6IF
0086
0088
IFS1
SI2CIF
—
MI2CIF
—
—
Bit 13
—
Bit 14
IFS2
CNIF
0080 NSTDIS
0082 ALTIVT
Bit 15
INTCON1
ADR
INTERRUPT CONTROLLER REGISTER MAP
INTCON2
SFR
Name
TABLE 5-2:
—
—
—
—
—
—
—
—
—
—
—
OC8IE
OC3IE
T1IE
OC8IF
OC3IF
T1IF
INT3EP
ADDRERR
Bit 3
Bit 1
—
OC7IE
IC8IE
OC1IE
OC7IF
IC8IF
OC1IF
INT2EP
—
INT3IP<2:0>
OC5IP<2:0>
IC3IP<2:0>
U2RXIP<2:0>
OC4IP<2:0>
INT1IP<2:0>
NVMIP<2:0>
SPI1IP<2:0>
IC2IP<2:0>
INT0IP<2:0>
OC6IE
IC7IE
IC1IE
OC6IF
IC7IF
IC1IF
INT1EP
STKERR OSCFAIL
Bit 2
0000 0000 0000 0000
Reset State
—
OC5IE
INT1IE
INT0IE
OC5IF
INT1IF
INT0IF
0000 0100 0100 0000
0000 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0100 0100 0100 0100
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
INT0EP 0000 0000 0000 0000
—
Bit 0
dsPIC30F
DS70083G-page 61
dsPIC30F
NOTES:
DS70083G-page 62
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
6.0
FLASH PROGRAM MEMORY
6.2
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions. With RTSP, the user
may erase and program 32 instructions (96 bytes) at a
time.
6.3
The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are
two methods by which the user can program this
memory:
1.
2.
6.1
Table Instruction Operation
Summary
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
Word or Byte mode.
Run-Time Self-Programming (RTSP)
In-Circuit Serial Programming™ (ICSP™)
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can access program memory in Word or
Byte mode.
In-Circuit Serial Programming
(ICSP)
A 24-bit program memory address is formed using
bits<7:0> of the TBLPAG register and the effective
address (EA) from a W register specified in the table
instruction, as shown in Figure 6-1.
dsPIC30F devices can be serially programmed while in
the end application circuit. This is simply done with two
lines for Programming Clock and Programming Data
(which are named PGC and PGD respectively), and
three other lines for Power (VDD), Ground (VSS) and
Master Clear (MCLR). this allows customers to manufacture boards with unprogrammed devices, and then
program the microcontroller just before shipping the
product. This also allows the most recent firmware or a
custom firmware to be programmed.
FIGURE 6-1:
Run-Time Self-Programming
(RTSP)
ADDRESSING FOR TABLE AND NVM REGISTERS
24 bits
Using
Program
Counter
Program Counter
0
0
NVMADR Reg EA
Using
NVMADR
Addressing
1/0
NVMADRU Reg
8 bits
16 bits
Working Reg EA
Using
Table
Instruction
User/Configuration
Space Select
 2004 Microchip Technology Inc.
1/0
TBLPAG Reg
8 bits
16 bits
24-bit EA
Preliminary
Byte
Select
DS70083G-page 63
dsPIC30F
6.4
RTSP Operation
6.5
The dsPIC30F Flash program memory is organized
into rows and panels. Each row consists of 32 instructions or 96 bytes. Each panel consists of 128 rows or
4K x 24 instructions. RTSP allows the user to erase and
program one row (32 instructions) at a time. RTSP may
be used to program multiple program memory panels,
but the table pointer must be changed at each panel
boundary.
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to
the actual programming operation, the write data must
be loaded into the panel write latches. The data to be
programmed into the panel is loaded in sequential
order into the write latches: instruction 0, instruction 1,
etc. The instruction words loaded must always be from
a group of 32 boundary.
The basic sequence for RTSP programming is to set up
a table pointer, then do a series of TBLWT instructions
to load the write latches. Programming is performed by
setting the special bits in the NVMCON register. Four
TBLWTL and four TBLWTH instructions are required to
load the four instructions. To fully program a row of
program memory, eight cycles of four TBLWTL and four
TBLWTH are required. If multiple panel programming
is required, the table pointer needs to be changed and
the next set of multiple write latches written.
All of the table write operations are single word writes
(2 instruction cycles) because only the table latches are
written. A total of 32 programming passes, each writing
4 instruction words, are required per row.
The Flash program memory is readable, writable, and
erasable during normal operation over the entire VDD
range.
DS70083G-page 64
Control Registers
The four SFRs used to read and write the program
Flash memory are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
6.5.1
NVMCON REGISTER
The NVMCON register controls which blocks are to be
erased, which memory type is to be programmed and
start of the programming cycle.
6.5.2
NVMADR REGISTER
The NVMADR register is used to hold the lower two
bytes of the effective address. The NVMADR register
captures the EA<15:0> of the last table instruction that
has been executed and selects the row to write.
6.5.3
NVMADRU REGISTER
The NVMADRU register is used to hold the upper byte
of the effective address. The NVMADRU register captures the EA<23:16> of the last table instruction that
has been executed.
6.5.4
NVMKEY REGISTER
NVMKEY is a write only register that is used for write
protection. To start a programming or an erase
sequence, the user must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 6.6 for
further details.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
6.6
Programming Operations
4.
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A programming operation is nominally 2 msec in
duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>)
starts the operation, and the WR bit is automatically
cleared when the operation is finished.
6.6.1
5.
PROGRAMMING ALGORITHM FOR
PROGRAM FLASH
The user can erase one row of program Flash memory
at a time. The user can program one block
(4 instruction words) of Flash memory at a time. The
general process is:
1.
2.
3.
Read one row of program Flash (32 instruction
words) and store into data RAM as a data
“image”.
Update the data image with the desired new
data.
Erase program Flash row.
a) Setup NVMCON register for multi-word,
program Flash, erase, and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMADR.
c) Write ‘55’ to NVMKEY.
d) Write ‘AA’ to NVMKEY.
e) Set the WR bit. This will begin erase cycle.
f) CPU will stall for the duration of the erase
cycle.
g) The WR bit is cleared when erase cycle
ends.
EXAMPLE 6-1:
6.
Write 32 instruction words of data from data
RAM into the program Flash write latches.
Program 32 instruction words into program
Flash.
a) Setup NVMCON register for multi-word,
program Flash, program, and set WREN
bit.
b) Write ‘55’ to NVMKEY.
c) Write ‘AA’ to NVMKEY.
d) Set the WR bit. This will begin program
cycle.
e) CPU will stall for duration of the program
cycle.
f) The WR bit is cleared by the hardware
when program cycle ends.
Repeat steps 1 through 5 as needed to program
desired amount of program Flash memory.
6.6.2
ERASING A ROW OF PROGRAM
MEMORY
Example 6-1 shows a code sequence that can be used
to erase a row (32 instructions) of program memory.
ERASING A ROW OF PROGRAM MEMORY
; Setup NVMCON for erase operation, multi word
; program memory selected, and writes enabled
MOV
#0x4041,W0
;
;
MOV
W0,NVMCON
; Init pointer to row to be ERASED
MOV
#tblpage(PROG_ADDR),W0
;
;
MOV
W0,NVMADRU
MOV
#tbloffset(PROG_ADDR),W0
;
MOV
W0, NVMADR
;
DISI
#5
;
;
MOV
#0x55,W0
;
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
;
MOV
W1,NVMKEY
BSET
NVMCON,#WR
;
NOP
;
NOP
;
 2004 Microchip Technology Inc.
write
Init NVMCON SFR
Initialize PM Page Boundary SFR
Intialize in-page EA[15:0] pointer
Initialize NVMADR SFR
Block all interrupts with priority <7 for
next 5 instructions
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
Preliminary
DS70083G-page 65
dsPIC30F
6.6.3
LOADING WRITE LATCHES
Example 6-2 shows a sequence of instructions that can
be used to load the 96 bytes of write latches. Four
TBLWTL and four TBLWTH instructions are needed to
load the write latches selected by the table pointer.
EXAMPLE 6-2:
LOADING WRITE LATCHES
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV
#0x0000,W0
;
; Initialize PM Page Boundary SFR
MOV
W0,TBLPAG
MOV
#0x6000,W0
; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV
#LOW_WORD_0,W2
;
MOV
#HIGH_BYTE_0,W3
;
; Write PM low word into program latch
TBLWTL W2,[W0]
; Write PM high byte into program latch
TBLWTH W3,[W0++]
; 1st_program_word
MOV
#LOW_WORD_1,W2
;
MOV
#HIGH_BYTE_1,W3
;
; Write PM low word into program latch
TBLWTL W2,[W0]
; Write PM high byte into program latch
TBLWTH W3,[W0++]
; 2nd_program_word
MOV
#LOW_WORD_2,W2
;
MOV
#HIGH_BYTE_2,W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
•
•
•
; 31st_program_word
MOV
#LOW_WORD_3,W2
;
MOV
#HIGH_BYTE_3,W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
TBLWTH W3, [W0++]
; Write PM high byte into program latch
Note: In Example 6-2, the contents of the upper byte of W3 has no effect.
6.6.4
INITIATING THE PROGRAMMING
SEQUENCE
For protection, the write initiate sequence for NVMKEY
must be used to allow any erase or program operation
to proceed. After the programming command has been
executed, the user must wait for the programming time
until programming is complete. The two instructions following the start of the programming sequence should
be NOPs.
EXAMPLE 6-3:
INITIATING A PROGRAMMING SEQUENCE
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
DS70083G-page 66
;
;
;
;
;
;
;
;
;
Block all interrupts with priority <7 for
next 5 instructions
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
Preliminary
 2004 Microchip Technology Inc.
0764
0766
NVMADRU
NVMKEY
—
—
—
WREN
Bit 14
—
WR
Bit 15
—
—
—
—
—
—
—
—
—
Bit 12 Bit 11 Bit 10
—
—
—
Bit 9
—
Bit 7
—
—
NVMADR<15:0>
TWRI
Bit 8
Bit 6
Bit 5
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
—
—
WRERR
Bit 13
NVM REGISTER MAP
u = uninitialized bit
0762
Legend:
0760
NVMCON
Addr.
NVMADR
File Name
TABLE 6-1:
Bit 3
Bit 2
KEY<7:0>
NVMADR<23:16>
PROGOP<6:0>
Bit 4
Bit 1
Bit 0
0000 0000 0000 0000
0000 0000 uuuu uuuu
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
All RESETS
dsPIC30F
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 67
dsPIC30F
NOTES:
DS70083G-page 68
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
7.0
DATA EEPROM MEMORY
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
The Data EEPROM Memory is readable and writable
during normal operation over the entire VDD range. The
data EEPROM memory is directly mapped in the
program memory address space.
The four SFRs used to read and write the program
Flash memory are used to access data EEPROM
memory, as well. As described in Section 6.5, these
registers are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
Control bit WR initiates write operations similar to program Flash writes. This bit cannot be cleared, only set,
in software. They are cleared in hardware at the completion of the write operation. The inability to clear the
WR bit in software prevents the accidental or
premature termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit is
set when a write operation is interrupted by a MCLR
Reset or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can
check the WRERR bit and rewrite the location. The
address register NVMADR remains unchanged.
Note:
7.1
The EEPROM data memory allows read and write of
single words and 16-word blocks. When interfacing to
data memory, NVMADR in conjunction with the
NVMADRU register are used to address the EEPROM
location being accessed. TBLRDL and TBLWTL
instructions are used to read and write data EEPROM.
The dsPIC30F devices have up to 8 Kbytes (4K
words) of data EEPROM with an address range from
0x7FF000 to 0x7FFFFE.
Interrupt flag bit NVMIF in the IFS0 register is set when write is complete. It must be
cleared in software.
Reading the Data EEPROM
A TBLRD instruction reads a word at the current program word address. This example uses W0 as a
pointer to data EEPROM. The result is placed in
register W4 as shown in Example 7-1.
EXAMPLE 7-1:
MOV
MOV
MOV
TBLRDL
DATA EEPROM READ
#LOW_ADDR_WORD,W0 ; Init Pointer
#HIGH_ADDR_WORD,W1
W1,TBLPAG
[ W0 ], W4
; read data EEPROM
A word write operation should be preceded by an erase
of the corresponding memory location(s). The write typically requires 2 ms to complete but the write time will
vary with voltage and temperature.
A program or erase operation on the data EEPROM
does not stop the instruction flow. The user is responsible for waiting for the appropriate duration of time
before initiating another data EEPROM write/erase
operation. Attempting to read the data EEPROM while
a programming or erase operation is in progress results
in unspecified data.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 69
dsPIC30F
7.2
7.2.1
Erasing Data EEPROM
ERASING A BLOCK OF DATA
EEPROM
In order to erase a block of data EEPROM, the
NVMADRU and NVMADR registers must initially point
to the block of memory to be erased. Configure
NVMCON for erasing a block of data EEPROM, and
set the ERASE and WREN bits in the NVMCON
register. Setting the WR bit initiates the erase as
shown in Example 7-2.
EXAMPLE 7-2:
DATA EEPROM BLOCK ERASE
; Select data EEPROM block, ERASE, WREN bits
MOV
#4045,W0
; Initialize NVMCON SFR
MOV
W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7 for
; next 5 instructions
MOV
#0x55,W0
;
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
MOV
W1,NVMKEY
; Write the 0xAA key
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
7.2.2
ERASING A WORD OF DATA
EEPROM
The TBLPAG and NVMADR registers must point to the
block. Select erase a block of data Flash, and set the
ERASE and WREN bits in the NVMCON register. Setting the WR bit initiates the erase as shown in
Example 7-3.
EXAMPLE 7-3:
DATA EEPROM WORD ERASE
; Select data EEPROM word, ERASE, WREN bits
MOV
#4044,W0
MOV
W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7 for
; next 5 instructions
MOV
#0x55,W0
;
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
; Write the 0xAA key
MOV
W1,NVMKEY
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
DS70083G-page 70
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
7.3
Writing to the Data EEPROM
To write an EEPROM data location, the following
sequence must be followed:
1.
2.
3.
Erase data EEPROM word.
a) Select word, data EEPROM erase, and set
WREN bit in NVMCON register.
b) Write address of word to be erased into
NVMADR.
c) Enable NVM interrupt (optional).
d) Write ‘55’ to NVMKEY.
e) Write ‘AA’ to NVMKEY.
f) Set the WR bit. This will begin erase cycle.
g) Either poll NVMIF bit or wait for NVMIF
interrupt.
h) The WR bit is cleared when the erase cycle
ends.
Write data word into data EEPROM write
latches.
Program 1 data word into data EEPROM.
a) Select word, data EEPROM program, and
set WREN bit in NVMCON register.
b) Enable NVM write done interrupt (optional).
c) Write ‘55’ to NVMKEY.
d) Write ‘AA’ to NVMKEY.
e) Set the WR bit. This will begin program
cycle.
f) Either poll NVMIF bit or wait for NVM
interrupt.
g) The WR bit is cleared when the write cycle
ends.
EXAMPLE 7-4:
The write will not initiate if the above sequence is not
exactly followed (write 0x55 to NVMKEY, write 0xAA to
NVMCON, then set WR bit) for each word. It is strongly
recommended that interrupts be disabled during this
code segment.
Additionally, the WREN bit in NVMCON must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM due to unexpected code execution. The WREN bit should be kept clear at all times
except when updating the EEPROM. The WREN bit is
not cleared by hardware.
After a write sequence has been initiated, clearing the
WREN bit will not affect the current write cycle. The WR
bit will be inhibited from being set unless the WREN bit
is set. The WREN bit must be set on a previous instruction. Both WR and WREN cannot be set with the same
instruction.
At the completion of the write cycle, the WR bit is
cleared in hardware and the Non-Volatile Memory
Write Complete Interrupt Flag bit (NVMIF) is set. The
user may either enable this interrupt or poll this bit.
NVMIF must be cleared by software.
7.3.1
WRITING A WORD OF DATA
EEPROM
Once the user has erased the word to be programmed,
then a table write instruction is used to write one write
latch, as shown in Example 7-4.
DATA EEPROM WORD WRITE
; Point to data memory
MOV
#LOW_ADDR_WORD,W0
MOV
#HIGH_ADDR_WORD,W1
MOV
W1,TBLPAG
MOV
#LOW(WORD),W2
TBLWTL
W2,[ W0]
; The NVMADR captures last table access address
; Select data EEPROM for 1 word op
MOV
#0x4004,W0
MOV
W0,NVMCON
; Operate key to allow write operation
DISI
#5
; Init pointer
; Get data
; Write data
; Block all interrupts with priority <7 for
; next 5 instructions
MOV
#0x55,W0
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
; Write the 0xAA key
MOV
W1,NVMKEY
BSET
NVMCON,#WR
; Initiate program sequence
NOP
NOP
; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 71
dsPIC30F
7.3.2
WRITING A BLOCK OF DATA
EEPROM
To write a block of data EEPROM, write to all sixteen
latches first, then set the NVMCON register and
program the block.
EXAMPLE 7-5:
DATA EEPROM BLOCK WRITE
MOV
MOV
MOV
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
MOV
DISI
#5
#LOW_ADDR_WORD,W0
#HIGH_ADDR_WORD,W1
W1,TBLPAG
#data1,W2
W2,[ W0]++
#data2,W2
W2,[ W0]++
#data3,W2
W2,[ W0]++
#data4,W2
W2,[ W0]++
#data5,W2
W2,[ W0]++
#data6,W2
W2,[ W0]++
#data7,W2
W2,[ W0]++
#data8,W2
W2,[ W0]++
#data9,W2
W2,[ W0]++
#data10,W2
W2,[ W0]++
#data11,W2
W2,[ W0]++
#data12,W2
W2,[ W0]++
#data13,W2
W2,[ W0]++
#data14,W2
W2,[ W0]++
#data15,W2
W2,[ W0]++
#data16,W2
W2,[ W0]++
#0x400A,W0
W0,NVMCON
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
DS70083G-page 72
; Init pointer
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
Get 1st data
write data
Get 2nd data
write data
Get 3rd data
write data
Get 4th data
write data
Get 5th data
write data
Get 6th data
write data
Get 7th data
write data
Get 8th data
write data
Get 9th data
write data
Get 10th data
write data
Get 11th data
write data
Get 12th data
write data
Get 13th data
write data
Get 14th data
write data
Get 15th data
write data
Get 16th data
write data. The NVMADR captures last table access address.
Select data EEPROM for multi word op
Operate Key to allow program operation
Block all interrupts with priority <7 for
next 5 instructions
; Write the 0x55 key
; Write the 0xAA key
; Start write cycle
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
7.4
Write Verify
7.5
Depending on the application, good programming
practice may dictate that the value written to the memory should be verified against the original value. This
should be used in applications where excessive writes
can stress bits near the specification limit.
Protection Against Spurious Write
There are conditions when the device may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, the WREN bit is cleared;
also, the Power-up Timer prevents EEPROM write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during brown-out,
power glitch, or software malfunction.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 73
dsPIC30F
NOTES:
DS70083G-page 74
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
8.0
I/O PORTS
Any bit and its associated data and control registers
that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx
registers and the port pin will read as zeros.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless
regarded as a dedicated port because there is no
other competing source of outputs. An example is the
INT4 pin.
All of the device pins (except VDD, VSS, MCLR, and
OSC1/CLKI) are shared between the peripherals and
the parallel I/O ports.
The format of the registers for PORTA are shown in
Table 8-1.
All I/O input ports feature Schmitt Trigger inputs for
improved noise immunity.
8.1
The TRISA (Data Direction Control) register controls
the direction of the RA<7:0> pins, as well as the INTx
pins and the VREF pins. The LATA register supplies
data to the outputs and is readable/writable. Reading
the PORTA register yields the state of the input pins,
while writing the PORTA register modifies the contents
of the LATA register.
Parallel I/O (PIO) Ports
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
may be read but the output driver for the parallel port bit
will be disabled. If a peripheral is enabled but the
peripheral is not actively driving a pin, that pin may be
driven by a port.
A parallel I/O (PIO) port that shares a pin with a peripheral is, in general, subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pad cell. Figure 8-2 shows how ports are shared
with other peripherals and the associated I/O cell (pad)
to which they are connected. Table 8-2 through
Table 8-6 show the formats of the registers for the
shared ports, PORTB through PORTG.
All port pins have three registers directly associated
with the operation of the port pin. The Data Direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
Writes to the latch, write the latch (LATx). Reads from
the port (PORTx), read the port pins and writes to the
port pins, write the latch (LATx).
FIGURE 8-1:
Note:
The actual bits in use vary between
devices.
BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE
Dedicated Port Module
Read TRIS
I/O Cell
TRIS Latch
Data Bus
D
WR TRIS
CK
Q
Data Latch
D
WR LAT +
WR Port
Q
I/O Pad
CK
Read LAT
Read Port
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 75
dsPIC30F
FIGURE 8-2:
BLOCK DIAGRAM OF A SHARED PORT STRUCTURE
Output Multiplexers
Peripheral Module
Peripheral Input Data
Peripheral Module Enable
I/O Cell
Peripheral Output Enable
1 Output Enable
0
Peripheral Output Data
1
PIO Module
Output Data
0
Read TRIS
I/O Pad
Data Bus
D
WR TRIS
CK
Q
TRIS Latch
D
WR LAT +
WR Port
Q
CK
Data Latch
Read LAT
Input Data
Read Port
8.2
8.2.1
Configuring Analog Port Pins
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared
(output), the digital output level (VOH or VOL) will be
converted.
When reading the Port register, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
DS70083G-page 76
I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP.
EXAMPLE 8-1:
MOV
0xFF00, W0
MOV
NOP
W0, TRISB
btss
PORTB, #13
Preliminary
PORT WRITE/READ
EXAMPLE
;
;
;
;
Configure PORTB<15:8>
as inputs
and PORTB<7:0> as outputs
additional instruction
cylcle
; bit test RB13 and skip if
set
 2004 Microchip Technology Inc.
Legend:
 2004 Microchip Technology Inc.
Bit 12
LATA14
LATA13
RA13
LATA12
RA12
Bit 11
Bit 10
Preliminary
02D0
u = uninitialized bit
LATC
Legend:
Bit 14
Bit 13
LATC14
RC14
LATC13
RC13
Legend:
LATD14
u = uninitialized bit
LATD15
RD14
LATD13
RD13
LATD12
RD12
LATD11
RD11
LATD10
RD10
LATD9
RD9
02D6
RD15
LATD
Bit 9
02D4
Bit 10
02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9
Bit 11
PORTD
Bit 12
TRISD
Bit 13
—
—
—
Bit 9
LATB9
RB9
TRISB9
Addr.
Bit 14
—
—
—
Bit 10
LATB10
RB10
Bit 9
LATA9
RA9
SFR
Name
Bit 15
—
—
—
—
—
—
Bit 11
LATB11
RB11
Bit 12
PORTD REGISTER MAP
LATC15
RC15
02CE
TABLE 8-4:
LATB12
RB12
TRISC15 TRISC14 TRISC13
02CC
Bit 15
PORTC
Addr.
LATB13
RB13
PORTC REGISTER MAP
TRISC
SFR
Name
LATB14
RB14
u = uninitialized bit
TABLE 8-3:
Legend:
LATB15
RB15
02CB
Bit 12
LATA10
—
LATB
Bit 13
RA10
—
02C8
Bit 14
Bit 9
TRISA10 TRISA9
Bit 10
02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10
Bit 15
PORTB REGISTER MAP
LATA15
RA14
—
Bit 11
PORTB
Addr.
Bit 13
TRISB
SFR
Name
TABLE 8-2:
02C4
u = uninitialized bit
LATA
RA15
02C2
PORTA
Bit 14
TRISA15 TRISA14 TRISA13 TRISA12
Bit 15
02C0
Addr.
PORTA REGISTER MAP
TRISA
SFR
Name
TABLE 8-1:
LATD8
RD8
TRISD8
Bit 8
—
—
—
Bit 8
LATB8
RB8
Bit 6
LATA6
RA6
TRISA6
Bit 6
Bit 5
—
—
—
Bit 5
Bit 4
—
—
—
Bit 4
Bit 3
—
—
—
Bit 3
Bit 2
—
—
—
Bit 2
Bit 1
—
—
—
Bit 1
Bit 0
—
—
—
Bit 0
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
1111 0110 1100 0000
Reset State
Bit 7
—
—
—
LATD7
RD7
TRISD7
—
—
—
RB6
LATD6
RD6
TRISD6
Bit 6
—
—
—
Bit 5
LATB6
Bit 6
LATB7
RB7
RB3
Bit 4
LATC3
RC3
RB2
Bit 2
Bit 2
LATC2
RC2
RB1
Bit 1
LATB1
Bit 1
LATC1
RC1
TRISC1
LATB2
TRISC2
Bit 3
TRISC3
Bit 3
LATB3
RB0
Bit 0
—
—
—
Bit 0
LATB0
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
1110 0000 0001 1110
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
LATD5
RD5
LATD4
RD4
LATD3
RD3
LATD2
RD2
LATD1
RD1
LATD0
RD0
0000 0000 0000 0000
0000 0000 0000 0000
TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111
Bit 5
LATC4
RC4
RB4
LATB4
TRISC4
Bit 4
LATB5
RB5
TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
Bit 7
LATA7
RA7
TRISA7
Bit 7
Bit 7
TRISB8
Bit 8
—
—
—
Bit 8
dsPIC30F
DS70083G-page 77
DS70083G-page 78
02E2
LATF
02E8
LATG
—
—
—
Bit 12
Bit 14
Bit 13
Bit 12
LATG15
RG15
LATG14
RG14
LATG12
RG12
—
—
—
—
—
—
LATG9
RG9
Bit 8
LATG8
RG8
Bit 7
LATG7
RG7
Bit 6
RF5
—
—
—
Bit 5
LATF5
LATG6
RG6
Bit 5
TRISF5
TRISG6
Bit 6
LATF6
RF6
TRISF6
TRISG7
Bit 7
LATF7
RF7
TRISF7
TRISG8
Bit 8
LATF8
RF8
TRISF8
TRISG9
Bit 9
—
—
—
Bit 9
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
LATG13
RG13
Bit 10
—
—
—
Bit 10
Bit 11
—
—
—
Bit 11
TRISG15 TRISG14 TRISG13 TRISG12
Bit 15
u = uninitialized bit
02E6
Legend:
02E4
TRISG
Addr.
PORTG
SFR
Name
—
—
—
Bit 13
PORTG REGISTER MAP
u = uninitialized bit
TABLE 8-6:
Legend:
—
02E0
—
—
—
02DE
TRISF
PORTF
—
—
Bit 15
Bit 14
PORTF REGISTER MAP
Addr.
SFR
Name
TABLE 8-5:
—
—
—
Bit 4
LATF4
RF4
TRISF4
Bit 4
LATG3
RG3
TRISG3
Bit 3
LATF3
RF3
TRISF3
Bit 3
LATG2
RG2
TRISG2
Bit 2
LATF2
RF2
TRISF2
Bit 2
LATG1
RG1
TRISG1
Bit 1
LATF1
RF1
TRISF1
Bit 1
LATG0
RG0
TRISG0
Bit 0
LATF0
RF0
TRISF0
Bit 0
0000 0000 0000 0000
0000 0000 0000 0000
1111 0011 1100 1111
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
0000 0001 1111 1111
Reset State
dsPIC30F
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
8.3
Input Change Notification Module
The input change notification module provides the
dsPIC30F devices the ability to generate interrupt
requests to the processor, in response to a change of
state on selected input pins. This module is capable of
detecting input change of states even in Sleep mode,
when the clocks are disabled. There are up to 24 external signals (CN0 through CN23) that may be selected
(enabled) for generating an interrupt request on a
change of state.
TABLE 8-7:
SFR
Name
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8)
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset State
CNEN1
00C0
CN15IE
CN14IE
CN13IE
CN12IE
CN11IE
CN10IE
CN9IE
CN8IE
0000 0000 0000 0000
CNEN2
00C2
—
—
—
—
—
—
—
—
0000 0000 0000 0000
CNPU1
00C4
CN9PUE
CN8PUE
0000 0000 0000 0000
CNPU2
00C6
—
—
0000 0000 0000 0000
Legend:
u = uninitialized bit
Bit 0
Reset State
TABLE 8-8:
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE
—
—
—
—
—
—
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0)
SFR
Name
Addr.
CNEN1
00C0
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000 0000 0000 0000
CNEN2
00C2
CN23IE
CN22IE
CN21IE
CN20IE
CN19IE
CN18IE
CN17IE
CN16IE
0000 0000 0000 0000
CNPU1
00C4
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000 0000 0000 0000
CNPU2
00C6
CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE
CN16PUE
0000 0000 0000 0000
Legend:
u = uninitialized bit
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 79
dsPIC30F
NOTES:
DS70083G-page 80
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
9.0
TIMER1 MODULE
These Operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1
presents a block diagram of the 16-bit timer module.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
16-bit Timer Mode: In the 16-bit Timer mode, the timer
increments on every instruction cycle up to a match
value preloaded into the Period register PR1, then
resets to ‘0’ and continues to count.
This section describes the 16-bit General Purpose
(GP) Timer1 module and associated Operational
modes. Figure 9-1 depicts the simplified block diagram
of the 16-bit Timer1 module.
When the CPU goes into the Idle mode, the timer will
stop incrementing unless the TSIDL (T1CON<13>)
bit = 0. If TSIDL = 1, the timer module logic will resume
the incrementing sequence upon termination of the
CPU Idle mode.
The following sections provide a detailed description
including setup and control registers, along with associated block diagrams for the Operational modes of the
timers.
16-bit Synchronous Counter Mode: In the 16-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in PR1,
then resets to ‘0’ and continues.
The Timer1 module is a 16-bit timer which can serve as
the time counter for the real-time clock, or operate as a
free-running interval timer/counter. The 16-bit timer has
the following modes:
When the CPU goes into the Idle mode, the timer will
stop incrementing unless the respective TSIDL bit = 0.
If TSIDL = 1, the timer module logic will resume the
incrementing sequence upon termination of the CPU
Idle mode.
• 16-bit Timer
• 16-bit Synchronous Counter
• 16-bit Asynchronous Counter
Further, the following operational characteristics are
supported:
16-bit Asynchronous Counter Mode: In the 16-bit
Asynchronous Counter mode, the timer increments on
every rising edge of the applied external clock signal.
The timer counts up to a match value preloaded in PR1,
then resets to ‘0’ and continues.
• Timer gate operation
• Selectable prescaler settings
• Timer operation during CPU Idle and Sleep
modes
• Interrupt on 16-bit Period register match or falling
edge of external gate signal
FIGURE 9-1:
When the timer is configured for the Asynchronous
mode of operation and the CPU goes into the Idle
mode, the timer will stop incrementing if TSIDL = 1.
16-BIT TIMER1 MODULE BLOCK DIAGRAM
PR1
Equal
Comparator x 16
TSYNC
1
Reset
Sync
TMR1
0
T1IF
Event Flag
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
TGATE
TON
SOSCO/
T1CK
1x
LPOSCEN
SOSCI
 2004 Microchip Technology Inc.
TCKPS<1:0>
2
Gate
Sync
01
TCY
00
Preliminary
Prescaler
1, 8, 64, 256
DS70083G-page 81
dsPIC30F
9.1
Timer Gate Operation
9.4
The 16-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to
increment the respective timer when the gate input signal (T1CK pin) is asserted high. Control bit TGATE
(T1CON<6>) must be set to enable this mode. The
timer must be enabled (TON = 1) and the timer clock
source set to internal (TCS = 0).
When the CPU goes into the Idle mode, the timer will
stop incrementing unless TSIDL = 0. If TSIDL = 1, the
timer will resume the incrementing sequence upon
termination of the CPU Idle mode.
9.2
Timer Prescaler
The input clock (FOSC/4 or external clock) to the 16-bit
Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256,
selected by control bits TCKPS<1:0> (T1CON<5:4>).
The prescaler counter is cleared when any of the
following occurs:
• a write to the TMR1 register
• clearing of the TON bit (T1CON<15>)
• device Reset, such as POR and BOR
However, if the timer is disabled (TON = 0), then the
timer prescaler cannot be reset since the prescaler
clock is halted.
TMR1 is not cleared when T1CON is written. It is
cleared by writing to the TMR1 register.
9.3
Timer Interrupt
The 16-bit timer has the ability to generate an interrupt on
period match. When the timer count matches the Period
register, the T1IF bit is asserted and an interrupt will be
generated if enabled. The T1IF bit must be cleared in
software. The timer interrupt flag, T1IF, is located in the
IFS0 Control register in the interrupt controller.
When the Gated Time Accumulation mode is enabled,
an interrupt will also be generated on the falling edge of
the gate signal (at the end of the accumulation cycle).
Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt
enable bit is located in the IEC0 Control register in the
interrupt controller.
9.5
Real-Time Clock
Timer1, when operating in Real-Time Clock (RTC)
mode, provides time of day and event time-stamping
capabilities. Key operational features of the RTC are:
•
•
•
•
Operation from 32 kHz LP oscillator
8-bit prescaler
Low power
Real-Time Clock interrupts
These Operating modes are determined by setting the
appropriate bit(s) in the T1CON Control register.
FIGURE 9-2:
RECOMMENDED
COMPONENTS FOR
TIMER1 LP OSCILLATOR
RTC
Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will operate if:
• The timer module is enabled (TON = 1) and
• The timer clock source is selected as external
(TCS = 1) and
• The TSYNC bit (T1CON<2>) is asserted to a logic
‘0’ which defines the external clock source as
asynchronous.
When all three conditions are true, the timer will continue to count up to the Period register and be reset to
0x0000.
When a match between the timer and the Period register occurs, an interrupt can be generated if the
respective timer interrupt enable bit is asserted.
DS70083G-page 82
Preliminary
C1
SOSCI
32.768 kHz
XTAL
dsPIC30FXXXX
SOSCO
C2
R
C1 = C2 = 18 pF; R = 100K
 2004 Microchip Technology Inc.
dsPIC30F
9.5.1
RTC OSCILLATOR OPERATION
9.5.2
When the TON = 1, TCS = 1 and TGATE = 0, the timer
increments on the rising edge of the 32 kHz LP oscillator output signal, up to the value specified in the Period
register and is then reset to ‘0’.
The TSYNC bit must be asserted to a logic ‘0’
(Asynchronous mode) for correct operation.
Enabling LPOSCEN (OSCCON<1>) will disable the
normal Timer and Counter modes and enable a timer
carry-out wake-up event.
RTC INTERRUPTS
When an interrupt event occurs, the respective interrupt
flag, T1IF, is asserted and an interrupt will be generated
if enabled. The T1IF bit must be cleared in software. The
respective Timer interrupt flag, T1IF, is located in the
IFS0 Status register in the interrupt controller.
Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt
enable bit is located in the IEC0 Control register in the
interrupt controller.
When the CPU enters Sleep mode, the RTC will continue to operate provided the 32 kHz external crystal
oscillator is active and the control bits have not been
changed. The TSIDL bit should be cleared to ‘0’ in
order for RTC to continue operation in Idle mode.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 83
0102
0104
u = uninitialized bit
PR1
T1CON
Legend:
DS70083G-page 84
—
Bit 14
TSIDL
Bit 13
—
Bit 12
—
Bit 11
—
Bit 10
—
Bit 9
—
Bit 7
Bit 6
—
TGATE
Period Register 1
Timer1 Register
Bit 8
Bit 4
TCKPS1 TCKPS0
Bit 5
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
TON
0100
TMR1
Bit 15
Addr.
TIMER1 REGISTER MAP
SFR Name
TABLE 9-1:
—
Bit 3
TSYNC
Bit 2
TCS
Bit 1
—
Bit 0
0000 0000 0000 0000
1111 1111 1111 1111
uuuu uuuu uuuu uuuu
Reset State
dsPIC30F
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
10.0
TIMER2/3 MODULE
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
This section describes the 32-bit General Purpose
(GP) Timer module (Timer2/3) and associated Operational modes. Figure 10-1 depicts the simplified block
diagram of the 32-bit Timer2/3 module. Figure 10-2
and Figure 10-3 show Timer2/3 configured as two
independent 16-bit timers, Timer2 and Timer3,
respectively.
The Timer2/3 module is a 32-bit timer (which can be
configured as two 16-bit timers) with selectable
Operating modes. These timers are utilized by other
peripheral modules, such as:
• Input Capture
• Output Compare/Simple PWM
The following sections provide a detailed description,
including setup and control registers, along with associated block diagrams for the Operational modes of the
timers.
The only functional difference between Timer2 and
Timer3 is that Timer2 provides synchronization of the
clock prescaler output. This is useful for high frequency
external clock inputs.
32-bit Timer Mode: In the 32-bit Timer mode, the timer
increments on every instruction cycle, up to a match
value preloaded into the combined 32-bit Period
register PR3/PR2, then resets to ‘0’ and continues to
count.
For synchronous 32-bit reads of the Timer2/Timer3
pair, reading the LS Word (TMR2 register) will cause
the MS word to be read and latched into a 16-bit
holding register, termed TMR3HLD.
For synchronous 32-bit writes, the holding register
(TMR3HLD) must first be written to. When followed by
a write to the TMR2 register, the contents of TMR3HLD
will be transferred and latched into the MSB of the
32-bit timer (TMR3).
32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in the
combined 32-bit period register PR3/PR2, then resets
to ‘0’ and continues.
The 32-bit timer has the following modes:
• Two independent 16-bit timers (Timer2 and
Timer3) with all 16-bit Operating modes (except
Asynchronous Counter mode)
• Single 32-bit timer operation
• Single 32-bit synchronous counter
Further, the following operational characteristics are
supported:
•
•
•
•
•
16-bit Timer Mode: In the 16-bit mode, Timer2 and
Timer3 can be configured as two independent 16-bit
timers. Each timer can be set up in either 16-bit Timer
mode or 16-bit Synchronous Counter mode. See
Section 9.0, Timer1 Module for details on these two
Operating modes.
ADC event trigger
Timer gate operation
Selectable prescaler settings
Timer operation during Idle and Sleep modes
Interrupt on a 32-bit period register match
When the timer is configured for the Synchronous
Counter mode of operation and the CPU goes into the
Idle mode, the timer will stop incrementing unless the
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
module logic will resume the incrementing sequence
upon termination of the CPU Idle mode.
Note:
These Operating modes are determined by setting the
appropriate bit(s) in the 16-bit T2CON and T3CON
SFRs.
For 32-bit timer/counter operation, Timer2 is the LS
Word and Timer3 is the MS Word of the 32-bit timer.
Note:
In some devices, one or more of the TxCK
pins may be absent. Therefore, for such
timers, the following modes should not be
used:
1. TCS = 1 (16-bit counter)
2. TCS = 0, TGATE = 1 (gated time
accumulation.
For 32-bit timer operation, T3CON control
bits are ignored. Only T2CON control bits
are used for setup and control. Timer2
clock and gate inputs are utilized for the
32-bit timer module but an interrupt is generated with the Timer3 interrupt flag (T3IF)
and the interrupt is enabled with the
Timer3 interrupt enable bit (T3IE).
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 85
dsPIC30F
FIGURE 10-1:
32-BIT TIMER2/3 BLOCK DIAGRAM
Data Bus<15:0>
TMR3HLD
16
16
Write TMR2
Read TMR2
16
Reset
TMR3
TMR2
MSB
LSB
Sync
ADC Event Trigger
Equal
Comparator x 32
PR3
PR2
0
T3IF
Event Flag
1
D
Q
CK
TGATE (T2CON<6>)
TCS
TGATE
TGATE
(T2CON<6>)
Q
TON
T2CK
Note:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
Timer configuration bit T32 (T2CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
DS70083G-page 86
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 10-2:
16-BIT TIMER2 BLOCK DIAGRAM
PR2
Equal
Comparator x 16
TMR2
Sync
Reset
T2IF
Event Flag
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
TGATE
TON
T2CK
FIGURE 10-3:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
16-BIT TIMER3 BLOCK DIAGRAM
PR3
ADC Event Trigger
Equal
Comparator x 16
TMR3
Reset
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
T3IF
Event Flag
TGATE
T3CK
Sync
TON
1x
01
TCY
 2004 Microchip Technology Inc.
Preliminary
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
DS70083G-page 87
dsPIC30F
10.1
Timer Gate Operation
10.4
The 32-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to
increment the respective timer when the gate input signal (T2CK pin) is asserted high. Control bit TGATE
(T2CON<6>) must be set to enable this mode. When in
this mode, Timer2 is the originating clock source. The
TGATE setting is ignored for Timer3. The timer must be
enabled (TON = 1) and the timer clock source set to
internal (TCS = 0).
The falling edge of the external signal terminates the
count operation but does not reset the timer. The user
must reset the timer in order to start counting from zero.
10.2
ADC Event Trigger
When a match occurs between the 32-bit timer (TMR3/
TMR2) and the 32-bit combined period register (PR3/
PR2), or between the 16-bit timer (TMR3) and the 16bit period register (PR3), a special ADC trigger event
signal is generated by Timer3.
10.3
Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will not operate
because the internal clocks are disabled.
10.5
Timer Interrupt
The 32-bit timer module can generate an interrupt on
period match or on the falling edge of the external gate
signal. When the 32-bit timer count matches the
respective 32-bit period register, or the falling edge of
the external “gate” signal is detected, the T3IF bit
(IFS0<7>) is asserted and an interrupt will be generated if enabled. In this mode, the T3IF interrupt flag is
used as the source of the interrupt. The T3IF bit must
be cleared in software.
Enabling an interrupt is accomplished via the
respective timer interrupt enable bit, T3IE (IEC0<7>).
Timer Prescaler
The input clock (FOSC/4 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64, and 1:256,
selected by control bits TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
originating clock source is Timer2. The prescaler operation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
• a write to the TMR2/TMR3 register
• clearing either of the TON (T2CON<15> or
T3CON<15>) bits to ‘0’
• device Reset, such as POR and BOR
However, if the timer is disabled (TON = 0), then the
Timer 2 prescaler cannot be reset since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.
DS70083G-page 88
Preliminary
 2004 Microchip Technology Inc.
010A
010C
010E
0110
0112
u = uninitialized bit
TMR3
PR2
PR3
T2CON
T3CON
Legend:
 2004 Microchip Technology Inc.
—
—
TSIDL
TSIDL
—
—
Bit 12
—
—
Bit 11
Bit 9
Bit 7
Timer2 Register
Bit 8
Bit 6
Bit 5
—
—
—
—
—
—
—
—
TGATE
TGATE
Period Register 3
Period Register 2
Timer3 Register
Bit 4
TCKPS1 TCKPS0
TCKPS1 TCKPS0
Timer3 Holding Register (for 32-bit timer operations only)
Bit 10
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
TON
0108
TMR3HLD
TON
0106
TMR2
Bit 13
Bit 15
SFR Name Addr.
Bit 14
TIMER2/3 REGISTER MAP
TABLE 10-1:
—
T32
Bit 3
—
—
Bit 2
TCS
TCS
Bit 1
—
—
Bit 0
0000 0000 0000 0000
0000 0000 0000 0000
1111 1111 1111 1111
1111 1111 1111 1111
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
Reset State
dsPIC30F
Preliminary
DS70083G-page 89
dsPIC30F
NOTES:
DS70083G-page 90
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
11.0
TIMER4/5 MODULE
The Operating modes of the Timer4/5 module are
determined by setting the appropriate bit(s) in the
16-bit T4CON and T5CON SFRs.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
For 32-bit timer/counter operation, Timer4 is the LS
Word and Timer5 is the MS Word of the 32-bit timer.
Note:
For 32-bit timer operation, T5CON control
bits are ignored. Only T4CON control bits
are used for setup and control. Timer4
clock and gate inputs are utilized for the
32-bit timer module but an interrupt is generated with the Timer5 interrupt flag (T5IF)
and the interrupt is enabled with the
Timer5 interrupt enable bit (T5IE).
Note:
In some devices, one or more of the TxCK
pins may be absent. Therefore, for such
timers, the following modes should not be
used:
1. TCS = 1 (16-bit counter)
2. TCS = 0, TGATE = 1 (gated time
accumulation)
This section describes the second 32-bit General Purpose (GP) Timer module (Timer4/5) and associated
Operational modes. Figure 11-1 depicts the simplified
block diagram of the 32-bit Timer4/5 module.
Figure 11-2 and Figure 11-3 show Timer4/5 configured
as two independent 16-bit timers, Timer4 and Timer5,
respectively.
The Timer4/5 module is similar in operation to the
Timer2/3 module. However, there are some differences
which are listed below:
• The Timer4/5 module does not support the ADC
event trigger feature
• Timer4/5 can not be utilized by other peripheral
modules, such as input capture and
output compare
FIGURE 11-1:
32-BIT TIMER4/5 BLOCK DIAGRAM
Data Bus<15:0>
TMR5HLD
16
16
Write TMR4
Read TMR4
16
Reset
Equal
TMR5
TMR4
MSB
LSB
Sync
Comparator x 32
PR5
PR4
0
T5IF
Event Flag
1
Q
D
Q
CK
TGATE (T4CON<6>)
TCS
TGATE
TGATE
(T4CON<6>)
TON
T4CK
Note:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
Timer configuration bit T32 (T4CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All
control bits are respective to the T4CON register.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 91
dsPIC30F
FIGURE 11-2:
16-BIT TIMER4 BLOCK DIAGRAM
PR4
Equal
Reset
TMR4
Sync
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
T4IF
Event Flag
Comparator x 16
TGATE
TON
T4CK
FIGURE 11-3:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
16-BIT TIMER5 BLOCK DIAGRAM
PR5
ADC Event Trigger
Equal
Comparator x 16
TMR5
Reset
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
T5IF
Event Flag
TGATE
T5CK
TON
Sync
1x
01
TCY
DS70083G-page 92
Preliminary
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
 2004 Microchip Technology Inc.
0120
T5CON
TON
TON
Bit 15
 2004 Microchip Technology Inc.
TSIDL
TSIDL
Bit 13
—
—
Bit 12
—
—
Bit 11
Bit 9
Bit 7
Bit 6
Timer 4 Register
Bit 8
Bit 5
—
—
—
—
—
—
—
—
TGATE
TGATE
Period Register 5
Period Register 4
Timer 5 Register
TCKPS1
TCKPS1
Timer 5 Holding Register (for 32-bit operations only)
Bit 10
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
—
—
Bit 14
TIMER4/5 REGISTER MAP
u = uninitialized
011E
T4CON
Legend:
011A
011C
0118
TMR5
PR4
0116
PR5
0114
TMR4
Addr.
TMR5HLD
SFR Name
TABLE 11-1:
TCKPS0
TCKPS0
Bit 4
—
T45
Bit 3
—
—
Bit 2
TCS
TCS
Bit 1
—
—
Bit 0
0000 0000 0000 0000
0000 0000 0000 0000
1111 1111 1111 1111
1111 1111 1111 1111
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
Reset State
dsPIC30F
Preliminary
DS70083G-page 93
dsPIC30F
NOTES:
DS70083G-page 94
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
12.0
INPUT CAPTURE MODULE
The key operational features of the input capture
module are:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
• Simple Capture Event mode
• Timer2 and Timer3 mode selection
• Interrupt on input capture event
These Operating modes are determined by setting the
appropriate bits in the ICxCON register (where
x = 1,2,...,N). The dsPIC devices contain up to 8
capture channels (i.e., the maximum value of N is 8).
This section describes the input capture module and
associated Operational modes. The features provided
by this module are useful in applications requiring frequency (period) and pulse measurement. Figure 12-1
depicts a block diagram of the input capture module.
Input capture is useful for such modes as:
• Frequency/Period/Pulse Measurements
• Additional Sources of External Interrupts
FIGURE 12-1:
INPUT CAPTURE MODE BLOCK DIAGRAM
From GP Timer Module
T3_CNT
T2_CNT
16
1
ICx pin
Prescaler
1, 4, 16
3
Clock
Synchronizer
Edge
Detection
Logic
16
0
ICTMR
FIFO
R/W
Logic
ICM<2:0>
Mode Select
ICxBUF
ICBNE, ICOV
ICI<1:0>
ICxCON
Interrupt
Logic
Data Bus
Note:
Set Flag
ICxIF
Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture
channels 1 through N.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 95
dsPIC30F
12.1
12.1.3
Simple Capture Event Mode
The simple capture events in the dsPIC30F product
family are:
•
•
•
•
•
Capture every falling edge
Capture every rising edge
Capture every 4th rising edge
Capture every 16th rising edge
Capture every rising and falling edge
CAPTURE PRESCALER
There are four input capture prescaler settings specified by bits ICM<2:0> (ICxCON<2:0>). Whenever the
capture channel is turned off, the prescaler counter will
be cleared. In addition, any Reset will clear the
prescaler counter.
12.1.2
The input capture module consists of up to 8 input capture channels. Each channel can select between one of
two timers for the time base, Timer2 or Timer3.
Selection of the timer resource is accomplished
through SFR bit, ICTMR (ICxCON<7>). Timer3 is the
default timer resource available for the input capture
module.
These simple Input Capture modes are configured by
setting the appropriate bits ICM<2:0> (ICxCON<2:0>).
12.1.1
TIMER2 AND TIMER3 SELECTION
MODE
CAPTURE BUFFER OPERATION
Each capture channel has an associated FIFO buffer
which is four 16-bit words deep. There are two status
flags which provide status on the FIFO buffer:
12.1.4
HALL SENSOR MODE
When the input capture module is set for capture on
every edge, rising and falling, ICM<2:0> = 001, the following operations are performed by the input capture
logic:
• The input capture interrupt flag is set on every
edge, rising and falling.
• The interrupt on Capture mode setting bits,
ICI<1:0>, is ignored since every capture
generates an interrupt.
• A capture overflow condition is not generated in
this mode.
• ICBFNE - Input Capture Buffer Not Empty
• ICOV - Input Capture Overflow
The ICBFNE will be set on the first input capture event
and remain set until all capture events have been read
from the FIFO. As each word is read from the FIFO, the
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events and a fifth capture event occurs prior to a read
of the FIFO, an overflow condition will occur and the
ICOV bit will be set to a logic ‘1’. The fifth capture event
is lost and is not stored in the FIFO. No additional
events will be captured until all four events have been
read from the buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.
DS70083G-page 96
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
12.2
12.2.2
Input Capture Operation During
Sleep and Idle Modes
An input capture event will generate a device wake-up
or interrupt, if enabled, if the device is in CPU Idle or
Sleep mode.
Independent of the timer being enabled, the input capture module will wake-up from the CPU Sleep or Idle
mode when a capture event occurs if ICM<2:0> = 111
and the interrupt enable bit is asserted. The same wakeup can generate an interrupt if the conditions for processing the interrupt have been satisfied. The wake-up
feature is useful as a method of adding extra external pin
interrupts.
12.2.1
INPUT CAPTURE IN CPU SLEEP
MODE
CPU Sleep mode allows input capture module operation with reduced functionality. In the CPU Sleep mode,
the ICI<1:0> bits are not applicable and the input capture module can only function as an external interrupt
source.
The capture module must be configured for interrupt
only on rising edge (ICM<2:0> = 111) in order for the
input capture module to be used while the device is in
Sleep mode. The prescale settings of 4:1 or 16:1 are
not applicable in this mode.
 2004 Microchip Technology Inc.
INPUT CAPTURE IN CPU IDLE
MODE
CPU Idle mode allows input capture module operation
with full functionality. In the CPU Idle mode, the Interrupt mode selected by the ICI<1:0> bits is applicable,
as well as the 4:1 and 16:1 capture prescale settings
which are defined by control bits ICM<2:0>. This mode
requires the selected timer to be enabled. Moreover,
the ICSIDL bit must be asserted to a logic ‘0’.
If the input capture module is defined as
ICM<2:0> = 111 in CPU Idle mode, the input capture
pin will serve only as an external interrupt pin.
12.3
Input Capture Interrupts
The input capture channels have the ability to generate
an interrupt based upon the selected number of capture events. The selection number is set by control bits
ICI<1:0> (ICxCON<6:5>).
Each channel provides an interrupt flag (ICxIF) bit. The
respective capture channel interrupt flag is located in
the corresponding IFSx Status register.
Enabling an interrupt is accomplished via the respective capture channel interrupt enable (ICxIE) bit. The
capture interrupt enable bit is located in the
corresponding IEC Control register.
Preliminary
DS70083G-page 97
DS70083G-page 98
014E
0150
0152
0154
0156
0158
015A
IC4CON
IC5BUF
IC5CON
IC6BUF
IC6CON
IC7BUF
IC7CON
u = uninitialized bit
—
—
—
—
—
—
—
—
Bit 15
—
—
—
—
—
—
—
—
Bit 14
ICSIDL
ICSIDL
ICSIDL
ICSIDL
ICSIDL
ICSIDL
ICSIDL
ICSIDL
Bit 13
—
—
—
—
—
—
—
—
Bit 12
—
—
—
—
—
—
—
—
Bit 11
INPUT CAPTURE REGISTER MAP
—
—
—
—
—
—
—
—
Bit 10
—
—
—
—
—
—
—
—
Bit 8
Bit 7
ICTMR
ICTMR
ICTMR
ICTMR
ICTMR
ICTMR
ICTMR
—
ICTMR
Input 8 Capture Register
—
Input 7 Capture Register
—
Input 6 Capture Register
—
Input 5 Capture Register
—
Input 4 Capture Register
—
Input 3 Capture Register
—
Input 2 Capture Register
—
Input 1 Capture Register
Bit 9
Bit 5
ICI<1:0>
ICI<1:0>
ICI<1:0>
ICI<1:0>
ICI<1:0>
ICI<1:0>
ICI<1:0>
ICI<1:0>
Bit 6
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
Legend:
015E
014C
IC4BUF
IC8CON
014A
IC3CON
015C
0148
IC3BUF
IC8BUF
0144
0146
IC2CON
IC1CON
IC2BUF
0140
0142
IC1BUF
Addr.
SFR Name
TABLE 12-1:
ICOV
ICOV
ICOV
ICOV
ICOV
ICOV
ICOV
ICOV
Bit 4
ICBNE
ICBNE
ICBNE
ICBNE
ICBNE
ICBNE
ICBNE
ICBNE
Bit 3
Bit 2
ICM<2:0>
ICM<2:0>
ICM<2:0>
ICM<2:0>
ICM<2:0>
ICM<2:0>
ICM<2:0>
ICM<2:0>
Bit 1
Bit 0
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Reset State
dsPIC30F
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
13.0
OUTPUT COMPARE MODULE
The key operational features of the output compare
module include:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
This section describes the output compare module and
associated Operational modes. The features provided
by this module are useful in applications requiring
Operational modes, such as:
• Generation of Variable Width Output Pulses
• Power Factor Correction
Figure 13-1 depicts a block diagram of the output
compare module.
FIGURE 13-1:
•
•
•
•
•
•
Timer2 and Timer3 Selection mode
Simple Output Compare Match mode
Dual Output Compare Match mode
Simple PWM mode
Output Compare During Sleep and Idle modes
Interrupt on Output Compare/PWM Event
These Operating modes are determined by setting the
appropriate bits in the 16-bit OCxCON SFR (where
x = 1,2,3,...,N). The dsPIC devices contain up to 8
compare channels (i.e., the maximum value of N is 8).
OCxRS and OCxR in Figure 13-1 represent the Dual
Compare registers. In the Dual Compare mode, the
OCxR register is used for the first compare and OCxRS
is used for the second compare.
OUTPUT COMPARE MODE BLOCK DIAGRAM
Set Flag bit
OCxIF
OCxRS
Output
Logic
OCxR
3
1
OCTSEL
0
1
Note:
OCx
OCFA
(for x = 1, 2, 3 or 4)
or OCFB
(for x = 5, 6, 7 or 8)
From GP
Timer Module
TMR2<15:0
Output
Enable
OCM<2:0>
Mode Select
Comparator
0
S Q
R
TMR3<15:0> T2P2_MATCH
T3P3_MATCH
Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channels 1 through N.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 99
dsPIC30F
13.1
Timer2 and Timer3 Selection Mode
Each output compare channel can select between one
of two 16-bit timers, Timer2 or Timer3.
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3>). Timer2 is the default timer resource
for the output compare module.
13.2
Simple Output Compare Match
Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 001,
010 or 011, the selected output compare channel is
configured for one of three simple Output Compare
Match modes:
• Compare forces I/O pin low
• Compare forces I/O pin high
• Compare toggles I/O pin
Dual Output Compare Match Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 100
or 101, the selected output compare channel is configured for one of two Dual Output Compare modes,
which are:
• Single Output Pulse mode
• Continuous Output Pulse mode
13.3.1
• Determine instruction cycle time TCY.
• Calculate desired pulse width value based on TCY.
• Calculate time to start pulse from timer start value
of 0x0000.
• Write pulse width start and stop times into OCxR
and OCxRS Compare registers (x denotes
channel 1, 2, ...,N).
• Set Timer Period register to value equal to, or
greater than value in OCxRS Compare register.
• Set OCM<2:0> = 100.
• Enable timer, TON (TxCON<15>) = 1.
To initiate another single pulse, issue another write to
set OCM<2:0> = 100.
Simple PWM Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 110
or 111, the selected output compare channel is configured for the PWM mode of operation. When configured
for the PWM mode of operation, OCxR is the main latch
(read only) and OCxRS is the secondary latch. This
enables glitchless PWM transitions.
The user must perform the following steps in order to
configure the output compare module for PWM
operation:
1.
2.
4.
For the user to configure the module for the generation
of a single output pulse, the following steps are
required (assuming timer is off):
DS70083G-page 100
• Determine instruction cycle time TCY.
• Calculate desired pulse value based on TCY.
• Calculate timer to start pulse width from timer start
value of 0x0000.
• Write pulse width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2, ...,N)
Compare registers, respectively.
• Set Timer Period register to value equal to, or
greater than value in OCxRS Compare register.
• Set OCM<2:0> = 101.
• Enable timer, TON (TxCON<15>) = 1.
3.
SINGLE PULSE MODE
CONTINUOUS PULSE MODE
For the user to configure the module for the generation
of a continuous stream of output pulses, the following
steps are required:
13.4
The OCxR register is used in these modes. The OCxR
register is loaded with a value and is compared to the
selected incrementing timer count. When a compare
occurs, one of these Compare Match modes occurs. If
the counter resets to zero before reaching the value in
OCxR, the state of the OCx pin remains unchanged.
13.3
13.3.2
Set the PWM period by writing to the appropriate
period register.
Set the PWM duty cycle by writing to the OCxRS
register.
Configure the output compare module for PWM
operation.
Set the TMRx prescale value and enable the
Timer, TON (TxCON<15>) = 1.
13.4.1
INPUT PIN FAULT PROTECTION
FOR PWM
When control bits OCM<2:0> (OCxCON<2:0>) = 111,
the selected output compare channel is again configured for the PWM mode of operation with the additional
feature of input FAULT protection. While in this mode,
if a logic ‘0’ is detected on the OCFA/B pin, the respective PWM output pin is placed in the high impedance
input state. The OCFLT bit (OCxCON<4>) indicates
whether a FAULT condition has occurred. This state will
be maintained until both of the following events have
occurred:
• The external FAULT condition has been removed.
• The PWM mode has been re-enabled by writing
to the appropriate control bits.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
13.4.2
PWM PERIOD
When the selected TMRx is equal to its respective
period register, PRx, the following four events occur on
the next increment cycle:
The PWM period is specified by writing to the PRx
register. The PWM period can be calculated using
Equation 13-1.
• TMRx is cleared.
• The OCx pin is set.
- Exception 1: If PWM duty cycle is 0x0000,
the OCx pin will remain low.
- Exception 2: If duty cycle is greater than PRx,
the pin will remain high.
• The PWM duty cycle is latched from OCxRS into
OCxR.
• The corresponding timer interrupt flag is set.
EQUATION 13-1:
PWM period = [(PRx) + 1] • 4 • TOSC •
(TMRx prescale value)
PWM frequency is defined as 1 / [PWM period].
See Figure 13-2 for key PWM period comparisons.
Timer3 is referred to in Figure 13-2 for clarity.
FIGURE 13-2:
PWM OUTPUT TIMING
Period
Duty Cycle
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = Duty Cycle
(OCxR)
13.5
Output Compare Operation During
CPU Sleep Mode
When the CPU enters Sleep mode, all internal clocks
are stopped. Therefore, when the CPU enters the
Sleep state, the output compare channel will drive the
pin to the active state that was observed prior to
entering the CPU Sleep state.
For example, if the pin was high when the CPU entered
the Sleep state, the pin will remain high. Likewise, if the
pin was low when the CPU entered the Sleep state, the
pin will remain low. In either case, the output compare
module will resume operation when the device wakes
up.
13.6
Output Compare Operation During
CPU Idle Mode
When the CPU enters the Idle mode, the output
compare module can operate with full functionality.
The output compare channel will operate during the
CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at
logic ‘0’ and the selected time base (Timer2 or Timer3)
is enabled and the TSIDL bit of the selected timer is set
to logic ‘0’.
 2004 Microchip Technology Inc.
TMR3 = Duty Cycle
(OCxR)
13.7
Output Compare Interrupts
The output compare channels have the ability to generate an interrupt on a compare match, for whichever
Match mode has been selected.
For all modes except the PWM mode, when a compare
event occurs, the respective interrupt flag (OCxIF) is
asserted and an interrupt will be generated if enabled.
The OCxIF bit is located in the corresponding IFS
Status register and must be cleared in software. The
interrupt is enabled via the respective compare interrupt enable (OCxIE) bit located in the corresponding
IEC Control register.
For the PWM mode, when an event occurs, the respective timer interrupt flag (T2IF or T3IF) is asserted and
an interrupt will be generated if enabled. The IF bit is
located in the IFS0 Status register and must be cleared
in software. The interrupt is enabled via the respective
timer interrupt enable bit (T2IE or T3IE) located in the
IEC0 Control register. The output compare interrupt
flag is never set during the PWM mode of operation.
Preliminary
DS70083G-page 101
0184
0186
0188
018A
018C
018E
0190
0192
0194
0196
0198
019A
019C
019E
01A0
01A2
01A4
01A6
01A8
01AA
01AC
01AE
u = uninitialized bit
OC2RS
OC2R
OC2CON
OC3RS
OC3R
OC3CON
DS70083G-page 102
OC4RS
OC4R
OC4CON
OC5RS
OC5R
OC5CON
OC6RS
OC6R
OC6CON
OC7RS
OC7R
OC7CON
OC8RS
OC8R
OC8CON
Legend:
Preliminary
—
—
—
—
—
—
—
—
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 7
Bit 6
—
—
—
Output Compare 1 Main Register
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Output Compare 8 Main Register
Output Compare 8 Secondary Register
—
Output Compare 7 Main Register
Output Compare 7 Secondary Register
—
Output Compare 6 Main Register
Output Compare 6 Secondary Register
—
Output Compare 5 Main Register
Output Compare 5 Secondary Register
—
Output Compare 4 Main Register
Output Compare 4 Secondary Register
—
Output Compare 3 Main Register
Output Compare 3 Secondary Register
—
Output Compare 2 Main Register
Output Compare 2 Secondary Register
—
—
—
—
—
—
—
—
—
Bit 5
Output Compare 1 Secondary Register
Bit 9
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
—
—
—
—
—
—
—
—
0182
Bit 10
OC1CON
Bit 11
OC1R
Bit 12
0180
Bit 13
Bit 15
Addr.
SFR Name
OC1RS
Bit 14
OUTPUT COMPARE REGISTER MAP
TABLE 13-1:
OCFLT
OCFLT
OCFLT
OCFLT
OCFLT
OCFLT
OCFLT
OCFLT
Bit 4
OCTSEL
OCTSEL
OCTSEL
OCTSEL
OCTSEL
OCTSEL
OCTSE
OCTSEL
Bit 3
Bit 2
OCM<2:0>
OCM<2:0>
OCM<2:0>
OCM<2:0>
OCM<2:0>
OCM<2:0>
OCM<2:0>
OCM<2:0>
Bit 1
Bit 0
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
dsPIC30F
 2004 Microchip Technology Inc.
dsPIC30F
14.0
SPI MODULE
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
The Serial Peripheral Interface (SPI) module is a synchronous serial interface. It is useful for communicating
with other peripheral devices, such as EEPROMs, shift
registers, display drivers and A/D converters, or other
microcontrollers. It is compatible with Motorola's SPI™
and SIOP interfaces.
14.1
Operating Function Description
Each SPI module consists of a 16-bit shift register,
SPIxSR (where x = 1 or 2), used for shifting data in and
out, and a buffer register, SPIxBUF. A control register,
SPIxCON, configures the module. Additionally, a status
register, SPIxSTAT, indicates various status conditions.
The serial interface consists of 4 pins: SDIx (serial data
input), SDOx (serial data output), SCKx (shift clock
input or output), and SSx (active low slave select).
In Master mode operation, SCK is a clock output but in
Slave mode, it is a clock input.
A series of eight (8) or sixteen (16) clock pulses shift
out bits from the SPIxSR to SDOx pin and simultaneously shift in data from SDIx pin. An interrupt is generated when the transfer is complete and the
corresponding interrupt flag bit (SPI1IF or SPI2IF) is
set. This interrupt can be disabled through an interrupt
enable bit (SPI1IE or SPI2IE).
The receive operation is double-buffered. When a complete byte is received, it is transferred from SPIxSR to
SPIxBUF.
If the receive buffer is full when new data is being transferred from SPIxSR to SPIxBUF, the module will set the
SPIROV bit indicating an overflow condition. The transfer of the data from SPIxSR to SPIxBUF will not be
completed and the new data will be lost. The module
will not respond to SCL transitions while SPIROV is ‘1’,
effectively disabling the module until SPIxBUF is read
by user software.
Transmit writes are also double-buffered. The user
writes to SPIxBUF. When the master or slave transfer
is completed, the contents of the shift register (SPIxSR)
are moved to the receive buffer. If any transmit data has
been written to the buffer register, the contents of the
transmit buffer are moved to SPIxSR. The received
data is thus placed in SPIxBUF and the transmit data in
SPIxSR is ready for the next transfer.
Note:
In Master mode, the clock is generated by prescaling
the system clock. Data is transmitted as soon as a
value is written to SPIxBUF. The interrupt is generated
at the middle of the transfer of the last bit.
In Slave mode, data is transmitted and received as
external clock pulses appear on SCK. Again, the interrupt is generated when the last bit is latched. If SSx
control is enabled, then transmission and reception are
enabled only when SSx = low. The SDOx output will be
disabled in SSx mode with SSx high.
The clock provided to the module is (FOSC/4). This
clock is then prescaled by the primary (PPRE<1:0>)
and the secondary (SPRE<2:0>) prescale factors. The
CKE bit determines whether transmit occurs on transition from active clock state to Idle clock state, or vice
versa. The CKP bit selects the Idle state (high or low)
for the clock.
14.1.1
WORD AND BYTE
COMMUNICATION
A control bit, MODE16 (SPIxCON<10>), allows the
module to communicate in either 16-bit or 8-bit mode.
16-bit operation is identical to 8-bit operation except
that the number of bits transmitted is 16 instead of 8.
The user software must disable the module prior to
changing the MODE16 bit. The SPI module is reset
when the MODE16 bit is changed by the user.
A basic difference between 8-bit and 16-bit operation is
that the data is transmitted out of bit 7 of the SPIxSR for
8-bit operation, and data is transmitted out of bit15 of
the SPIxSR for 16-bit operation. In both modes, data is
shifted into bit 0 of the SPIxSR.
14.1.2
SDOx DISABLE
A control bit, DISSDO, is provided to the SPIxCON register to allow the SDOx output to be disabled. This will
allow the SPI module to be connected in an input only
configuration. SDO can also be used for general
purpose I/O.
14.2
Framed SPI Support
The module supports a basic framed SPI protocol in
Master or Slave mode. The control bit FRMEN enables
framed SPI support and causes the SSx pin to perform
the frame synchronization pulse (FSYNC) function.
The control bit SPIFSD determines whether the SSx
pin is an input or an output (i.e., whether the module
receives or generates the frame synchronization
pulse). The frame pulse is an active high pulse for a
single SPI clock cycle. When frame synchronization is
enabled, the data transmission starts only on the
subsequent transmit edge of the SPI clock.
Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 103
dsPIC30F
FIGURE 14-1:
SPI BLOCK DIAGRAM
Internal
Data Bus
Read
Write
SPIxBUF
SPIxBUF
Receive
Transmit
SPIxSR
SDIx
bit 0
SDOx
Shift
Clock
Clock
Control
SS and FSYNC
Control
Edge
Select
SSx
Secondary
Prescaler
1,2,4,6,8
SCKx
Primary
Prescaler
1, 4, 16, 64
FCY
Enable Master Clock
Note: x = 1 or 2.
FIGURE 14-2:
SPI MASTER/SLAVE CONNECTION
SPI Master
SPI Slave
SDOx
SDIy
Serial Input Buffer
(SPIxBUF)
SDIx
Shift Register
(SPIxSR)
MSb
Serial Input Buffer
(SPIyBUF)
SDOy
LSb
Shift Register
(SPIySR)
MSb
SCKx
Serial Clock
PROCESSOR 1
LSb
SCKy
PROCESSOR 2
Note: x = 1 or 2, y = 1 or 2.
DS70083G-page 104
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
14.3
Slave Select Synchronization
14.5
The SSx pin allows a Synchronous Slave mode. The
SPI must be configured in SPI Slave mode with SSx pin
control enabled (SSEN = 1). When the SSx pin is low,
transmission and reception are enabled and the SDOx
pin is driven. When SSx pin goes high, the SDOx pin is
no longer driven. Also, the SPI module is resynchronized, and all counters/control circuitry are
reset. Therefore, when the SSx pin is asserted low
again, transmission/reception will begin at the MS bit
even if SSx had been de-asserted in the middle of a
transmit/receive.
14.4
SPI Operation During CPU Idle
Mode
When the device enters Idle mode, all clock sources
remain functional. The SPISIDL bit (SPIxSTAT<13>)
selects if the SPI module will stop or continue on Idle. If
SPISIDL = 0, the module will continue to operate when
the CPU enters Idle mode. If SPISIDL = 1, the module
will stop when the CPU enters Idle mode.
SPI Operation During CPU Sleep
Mode
During Sleep mode, the SPI module is shutdown. If the
CPU enters Sleep mode while an SPI transaction is in
progress, then the transmission and reception is
aborted.
The transmitter and receiver will stop in Sleep mode.
However, register contents are not affected by entering
or exiting Sleep mode.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 105
DS70083G-page 106
u = uninitialized bit
Legend:
0228
022A
SPI2CON
SPI2BUF
SPIFSD
SPISIDL
Bit 13
—
—
Bit 12
—
FRMEN
—
Bit 14
SPIEN
Bit 15
—
—
Bit 12
—
Bit 10
—
Bit 10
DISSDO MODE16
—
Bit 11
DISSDO MODE16
—
Bit 11
CKE
—
Bit 8
SSEN
—
Bit 7
CKP
SPIROV
Bit 6
CKE
—
Bit 8
SSEN
—
Bit 7
Bit 6
CKP
SPIROV
Transmit and Receive Buffer
SMP
—
Bit 9
Transmit and Receive Buffer
SMP
—
Bit 9
MSTEN
—
Bit 5
MSTEN
—
Bit 5
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
SPIFSD
SPISIDL
Bit 13
SPI2 REGISTER MAP
u = uninitialized bit
0226
Legend:
Addr.
SFR Name
SPI2STAT
TABLE 14-2:
0224
SPI1BUF
—
FRMEN
—
0222
SPIEN
0220
SPI1STAT
Bit 14
SPI1CON
Bit 15
Addr.
SPI1 REGISTER MAP
SFR
Name
TABLE 14-1:
SPRE2
—
Bit 4
SPRE2
—
Bit 4
—
Bit 2
SPRE0
—
Bit 2
SPRE1 SPRE0
—
Bit 3
SPRE1
—
Bit 3
PPRE1
SPITBF
Bit 1
PPRE1
SPITBF
Bit 1
Reset State
PPRE0
SPIRBF
Bit 0
PPRE0
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
SPIRBF 0000 0000 0000 0000
Bit 0
dsPIC30F
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
15.0
I2C MODULE
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
The Inter-Integrated Circuit (I2CTM) module provides
complete hardware support for both Slave and MultiMaster modes of the I2C serial communication
standard, with a 16-bit interface.
This module offers the following key features:
• I2C interface supporting both master and slave
operation.
• I2C Slave mode supports 7 and 10-bit address.
• I2C Master mode supports 7 and 10-bit address.
• I2C port allows bidirectional transfers between
master and slaves.
• Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control).
• I2C supports multi-master operation; detects bus
collision and will arbitrate accordingly.
15.1
Operating Function Description
The hardware fully implements all the master and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
Thus, the I2C module can operate either as a slave or
a master on an I2C bus.
15.1.1
VARIOUS I2C MODES
The following types of I2C operation are supported:
•
•
•
I2C slave operation with 7-bit address
I2C slave operation with 10-bit address
I2C master operation with 7 or 10-bit address
See the I2C programmer’s model in Figure 15-1.
FIGURE 15-1:
PROGRAMMER’S MODEL
I2CRCV (8 bits)
Bit 7
Bit 0
Bit 7
Bit 0
I2CTRN (8 bits)
I2CBRG (9 bits)
Bit 8
Bit 0
I2CCON (16 bits)
Bit 15
Bit 0
Bit 15
Bit 0
I2CSTAT (16 bits)
I2CADD (10 bits)
Bit 9
15.1.2
Bit 0
PIN CONFIGURATION IN I2C MODE
I 2C
has a 2-pin interface: the SCL pin is clock and the
SDA pin is data.
15.1.3
I2C REGISTERS
I2CCON and I2CSTAT are control and status registers,
respectively. The I2CCON register is readable and writable. The lower 6 bits of I2CSTAT are read only. The
remaining bits of the I2CSTAT are read/write.
The I2CADD register holds the slave address. A status
bit, ADD10, indicates 10-bit Address mode. The
I2CBRG acts as the baud rate generator reload value.
In receive operations, I2CRSR and I2CRCV together
form a double-buffered receiver. When I2CRSR
receives a complete byte, it is transferred to I2CRCV
and an interrupt pulse is generated. During
transmission, the I2CTRN is not double-buffered.
Note:
I2CRSR is the shift register used for shifting data,
whereas I2CRCV is the buffer register to which data
bytes are written, or from which data bytes are read.
I2CRCV is the receive buffer as shown in Figure 15-1.
I2CTRN is the transmit register to which bytes are
written during a transmit operation, as shown in
Figure 15-2.
 2004 Microchip Technology Inc.
Preliminary
Following a RESTART condition in 10-bit
mode, the user only needs to match the
first 7-bit address.
DS70083G-page 107
dsPIC30F
FIGURE 15-2:
I2C BLOCK DIAGRAM
Internal
Data Bus
I2CRCV
Read
SCL
Shift
Clock
I2CRSR
LSB
SDA
Addr_Match
Match Detect
Write
I2CADD
Read
Start and
Stop bit Detect
I2CSTAT
Write
Control Logic
Start, RESTART,
Stop bit Generate
Write
I2CCON
Collision
Detect
Acknowledge
Generation
Clock
Stretching
Read
Read
Write
I2CTRN
LSB
Shift
Clock
Read
Reload
Control
BRG Down
Counter
DS70083G-page 108
Write
I2CBRG
FOSC
Preliminary
Read
 2004 Microchip Technology Inc.
dsPIC30F
15.2
I2C Module Addresses
The I2CADD register contains the Slave mode
addresses. The register is a 10-bit register.
If the A10M bit (I2CCON<10>) is ‘0’, the address is
interpreted by the module as a 7-bit address. When an
address is received, it is compared to the 7 LS bits of
the I2CADD register.
If the A10M bit is ‘1’, the address is assumed to be a
10-bit address. When an address is received, it will be
compared with the binary value ‘11110 A9 A8’ (where
A9 and A8 are two Most Significant bits of I2CADD). If
that value matches, the next address will be compared
with the Least Significant 8 bits of I2CADD, as specified
in the 10-bit addressing protocol.
received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
ninth clock.
If the RBF flag is set, indicating that I2CRCV is still
holding data from a previous operation (RBF = 1), then
ACK is not sent; however, the interrupt pulse is generated. In the case of an overflow, the contents of the
I2CRSR are not loaded into the I2CRCV.
Note:
7-bit I2C Slave Addresses supported by dsPIC30F:
0x00
General call address or start byte
0x01-0x03
Reserved
0x04-0x77
Valid 7-bit addresses
0x78-0x7b
Valid 10-bit addresses (lower 7
bits)
0x7c-0x7f
Reserved
15.3
15.4
The I2C specification dictates that a slave must be
addressed for a write operation with two address bytes
following a Start bit.
I2C 7-bit Slave Mode Operation
If an address match occurs, an Acknowledgement will
be sent, and the slave event interrupt flag (SI2CIF) is
set on the falling edge of the ninth (ACK) bit. The
address match does not affect the contents of the
I2CRCV buffer or the RBF bit.
SLAVE TRANSMISSION
If the R_W bit received is a ‘1’, then the serial port will
go into Transmit mode. It will send ACK on the ninth bit
and then hold SCL to ‘0’ until the CPU responds by writing to I2CTRN. SCL is released by setting the SCLREL
bit, and 8 bits of data are shifted out. Data bits are
shifted out on the falling edge of SCL, such that SDA is
valid during SCL high. The interrupt pulse is sent on the
falling edge of the ninth clock pulse, regardless of the
status of the ACK received from the master.
15.3.2
SLAVE RECEPTION
If the R_W bit received is a ‘0’ during an address
match, then Receive mode is initiated. Incoming bits
are sampled on the rising edge of SCL. After 8 bits are
 2004 Microchip Technology Inc.
I2C 10-bit Slave Mode Operation
In 10-bit mode, the basic receive and transmit operations are the same as in the 7-bit mode. However, the
criteria for address match is more complex.
Once enabled (I2CEN = 1), the slave module will wait
for a Start bit to occur (i.e., the I2C module is ‘Idle’). Following the detection of a Start bit, 8 bits are shifted into
I2CRSR and the address is compared against
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>
are compared against I2CRSR<7:1> and I2CRSR<0>
is the R_W bit. All incoming bits are sampled on the rising edge of SCL.
15.3.1
The I2CRCV will be loaded if the I2COV
bit = 1 and the RBF flag = 0. In this case,
a read of the I2CRCV was performed but
the user did not clear the state of the
I2COV bit before the next receive
occurred. The Acknowledgement is not
sent (ACK = 1) and the I2CRCV is
updated.
The A10M bit is a control bit that signifies that the
address in I2CADD is a 10-bit address rather than a 7-bit
address. The address detection protocol for the first byte
of a message address is identical for 7-bit and 10-bit
messages, but the bits being compared are different.
I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is
compared against a literal ‘11110’ (the default 10-bit
address) and I2CRSR<2:1> are compared against
I2CADD<9:8>. If a match occurs and if R_W = 0, the
interrupt pulse is sent. The ADD10 bit will be cleared to
indicate a partial address match. If a match fails or
R_W = 1, the ADD10 bit is cleared and the module
returns to the Idle state.
The low byte of the address is then received and compared with I2CADD<7:0>. If an address match occurs,
the interrupt pulse is generated and the ADD10 bit is
set, indicating a complete 10-bit address match. If an
address match did not occur, the ADD10 bit is cleared
and the module returns to the Idle state.
15.4.1
10-BIT MODE SLAVE
TRANSMISSION
Once a slave is addressed in this fashion with the full
10-bit address (we will refer to this state as
“PRIOR_ADDR_MATCH”), the master can begin
sending data bytes for a slave reception operation.
Preliminary
DS70083G-page 109
dsPIC30F
15.4.2
10-BIT MODE SLAVE RECEPTION
Once addressed, the master can generate a Repeated
Start, reset the high byte of the address and set the
R_W bit without generating a Stop bit, thus initiating a
slave transmit operation.
15.5
Automatic Clock Stretch
In the Slave modes, the module can synchronize buffer
reads and write to the master device by clock stretching.
15.5.1
vice the ISR and read the contents of the I2CRCV
before the master device can initiate another receive
sequence. This will prevent buffer overruns from
occurring.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
falling edge of the ninth clock, the
SCLREL bit will not be cleared and clock
stretching will not occur.
2: The SCLREL bit can be set in software
regardless of the state of the RBF bit. The
user should be careful to clear the RBF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
TRANSMIT CLOCK STRETCHING
Both 10-bit and 7-bit Transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock, if the TBF bit is cleared, indicating the buffer is empty.
In Slave Transmit modes, clock stretching is always
performed irrespective of the STREN bit.
Clock synchronization takes place following the ninth
clock of the transmit sequence. If the device samples
an ACK on the falling edge of the ninth clock and if the
TBF bit is still clear, then the SCLREL bit is automatically cleared. The SCLREL being cleared to ‘0’ will
assert the SCL line low. The user’s ISR must set the
SCLREL bit before transmission is allowed to continue.
By holding the SCL line low, the user has time to service the ISR and load the contents of the I2CTRN
before the master device can initiate another transmit
sequence.
Note 1: If the user loads the contents of I2CTRN,
setting the TBF bit before the falling edge
of the ninth clock, the SCLREL bit will not
be cleared and clock stretching will not
occur.
2: The SCLREL bit can be set in software,
regardless of the state of the TBF bit.
15.5.2
RECEIVE CLOCK STRETCHING
The STREN bit in the I2CCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCL pin will be held low at the
end of each data receive sequence.
15.5.3
CLOCK STRETCHING DURING
10-BIT ADDRESSING (STREN = 1)
Clock stretching takes place automatically during the
addressing sequence. Because this module has a
register for the entire address, it is not necessary for
the protocol to wait for the address to be updated.
After the address phase is complete, clock stretching
will occur on each data receive or transmit sequence as
was described earlier.
15.6
Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is ‘1’, the SCLREL bit may be
cleared by software to allow software to control the
clock stretching. The logic will synchronize writes to the
SCLREL bit with the SCL clock. Clearing the SCLREL
bit will not assert the SCL output until the module
detects a falling edge on the SCL output and SCL is
sampled low. If the SCLREL bit is cleared by the user
while the SCL line has been sampled low, the SCL output will be asserted (held low). The SCL output will
remain low until the SCLREL bit is set, and all other
devices on the I2C bus have de-asserted SCL. This
ensures that a write to the SCLREL bit will not violate
the minimum high time requirement for SCL.
If the STREN bit is ‘0’, a software write to the SCLREL
bit will be disregarded and have no effect on the
SCLREL bit.
CLOCK STRETCHING DURING
7-BIT ADDRESSING (STREN = 1)
When the STREN bit is set in Slave Receive mode, the
SCL line is held low when the buffer register is full. The
method for stretching the SCL output is the same for
both 7 and 10-bit Addressing modes.
Clock stretching takes place following the ninth clock of
the receive sequence. On the falling edge of the ninth
clock at the end of the ACK sequence, if the RBF bit is
set, the SCLREL bit is automatically cleared, forcing
the SCL output to be held low. The user’s ISR must set
the SCLREL bit before reception is allowed to continue.
By holding the SCL line low, the user has time to ser-
DS70083G-page 110
15.5.4
15.7
Interrupts
The I2C module generates two interrupt flags, MI2CIF
(I2C Master Interrupt Flag) and SI2CIF (I2C Slave Interrupt Flag). The MI2CIF interrupt flag is activated on
completion of a master message event. The SI2CIF
interrupt flag is activated on detection of a message
directed to the slave.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
15.8
15.12 I2C Master Operation
Slope Control
The I2C standard requires slope control on the SDA
and SCL signals for Fast mode (400 kHz). The control
bit, DISSLW, enables the user to disable slew rate control if desired. It is necessary to disable the slew rate
control for 1 MHz mode.
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
15.9
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the data direction bit. In
this case, the data direction bit (R_W) is logic ‘0’. Serial
data is transmitted 8 bits at a time. After each byte is
transmitted, an ACK bit is received. Start and Stop conditions are output to indicate the beginning and the end
of a serial transfer.
IPMI Support
The control bit, IPMIEN, enables the module to support
Intelligent Peripheral Management Interface (IPMI).
When this bit is set, the module accepts and acts upon
all addresses.
15.10 General Call Address Support
The general call address can address all devices.
When this address is used, all devices should, in
theory, respond with an Acknowledgement.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0’s with R_W = 0.
The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CCON<15> = 1).
Following a Start bit detection, 8 bits are shifted into
I2CRSR and the address is compared with I2CADD,
and is also compared with the general call address
which is fixed in hardware.
If a general call address match occurs, the I2CRSR is
transferred to the I2CRCV after the eighth clock, the
RBF flag is set and on the falling edge of the ninth bit
(ACK bit), the master event interrupt flag (MI2CIF) is
set.
In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device
(7 bits) and the data direction bit. In this case, the data
direction bit (R_W) is logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address, followed by a ‘1’ to indicate receive bit. Serial data is received via SDA while
SCL outputs the serial clock. Serial data is received
8 bits at a time. After each byte is received, an ACK bit
is transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
15.12.1
I2C MASTER TRANSMISSION
15.11 I2C Master Support
Transmission of a data byte, a 7-bit address, or the second half of a 10-bit address is accomplished by simply
writing a value to I2CTRN register. The user should
only write to I2CTRN when the module is in a WAIT
state. This action will set the Buffer Full Flag (TBF) and
allow the baud rate generator to begin counting and
start the next transmission. Each bit of address/data
will be shifted out onto the SDA pin after the falling
edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
transmit is in progress.
As a master device, six operations are supported:
15.12.2
• Assert a Start condition on SDA and SCL.
• Assert a RESTART condition on SDA and SCL.
• Write to the I2CTRN register initiating
transmission of data/address.
• Generate a Stop condition on SDA and SCL.
• Configure the I2C port to receive data.
• Generate an ACK condition at the end of a
received byte of data.
Master mode reception is enabled by programming the
Receive Enable bit, RCEN (I2CCON<11>). The I2C
module must be Idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The baud rate
generator begins counting and on each rollover, the
state of the SCL pin ACK and data are shifted into the
I2CRSR on the rising edge of each clock.
When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the
I2CRCV to determine if the address was device
specific or a general call address.
 2004 Microchip Technology Inc.
Preliminary
I2C MASTER RECEPTION
DS70083G-page 111
dsPIC30F
15.12.3
BAUD RATE GENERATOR
2
In I C Master mode, the reload value for the BRG is
located in the I2CBRG register. When the BRG is
loaded with this value, the BRG counts down to ‘0’ and
stops until another reload has taken place. If clock arbitration is taking place, for instance, the BRG is reloaded
when the SCL pin is sampled high.
As per the I2C standard, FSCL may be 100 kHz or
400 kHz. However, the user can specify any baud rate
up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.
EQUATION 15-1:
I2CBRG =
15.12.4
SERIAL CLOCK RATE
CY
( FFSCL
–
FCY
1,111,111
)
The master will continue to monitor the SDA and SCL
pins, and if a Stop condition occurs, the MI2CIF bit will
be set.
A write to the I2CTRN will start the transmission of data
at the first data bit regardless of where the transmitter
left off when bus collision occurred.
–1
CLOCK ARBITRATION
Clock arbitration occurs when the master de-asserts
the SCL pin (SCL allowed to float high) during any
receive, transmit, or RESTART/Stop condition. When
the SCL pin is allowed to float high, the baud rate generator (BRG) is suspended from counting until the SCL
pin is actually sampled high. When the SCL pin is sampled high, the baud rate generator is reloaded with the
contents of I2CBRG and begins counting. This ensures
that the SCL high time will always be at least one BRG
rollover count in the event that the clock is held low by
an external device.
15.12.5
If a Start, RESTART, Stop or Acknowledge condition
was in progress when the bus collision occurred, the
condition is aborted, the SDA and SCL lines are deasserted, and the respective control bits in the I2CCON
register are cleared to ‘0’. When the user services the
bus collision Interrupt Service Routine, and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
MULTI-MASTER COMMUNICATION,
BUS COLLISION, AND BUS
ARBITRATION
Multi-master operation support is achieved by bus arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA by letting SDA float high
while another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
In a multi-master environment, the interrupt generation
on the detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the I2CSTAT
register, or the bus is Idle and the S and P bits are
cleared.
15.13 I2C Module Operation During CPU
Sleep and Idle Modes
15.13.1
I2C OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
Sleep occurs in the middle of a transmission and the
state machine is partially into a transmission as the
clocks stop, then the transmission is aborted. Similarly,
if Sleep occurs in the middle of a reception, then the
reception is aborted.
15.13.2
I2C OPERATION DURING CPU IDLE
MODE
For the I2C, the I2CSIDL bit selects if the module will
stop on Idle or continue on Idle. If I2CSIDL = 0, the
module will continue operation on assertion of the Idle
mode. If I2CSIDL = 1, the module will stop on Idle.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are de-asserted and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service Routine, if the I2C bus is free (i.e., the P bit is set), the user
can resume communication by asserting a Start
condition.
DS70083G-page 112
Preliminary
 2004 Microchip Technology Inc.
0206
0208
020A
u = uninitialized bit
I2CCON
I2CSTAT
I2CADD
Legend:
 2004 Microchip Technology Inc.
—
TRSTAT
—
—
—
—
—
Bit 12
—
—
—
Bit 11
—
—
—
—
—
—
I2CSIDL SCLREL IPMIEN
—
—
—
Bit 13
—
BCL
A10M
—
—
—
Bit 10
GCSTAT
DISSLW
—
—
—
Bit 9
ADD10
SMEN
—
—
Bit 8
IWCOL
GCEN
Bit 7
I2COV
STREN
Bit 6
Bit 3
Transmit Register
Receive Register
Bit 4
P
Address Register
D_A
ACKEN
S
RCEN
Baud Rate Generator
Bit 5
ACKDT
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
—
ACKSTAT
I2CEN
—
0204
—
I2CBRG
—
—
0202
Bit 14
—
0200
I2CRCV
Bit 15
I2C REGISTER MAP
I2CTRN
SFR Name Addr.
TABLE 15-1:
R_W
PEN
Bit 2
RBF
RSEN
Bit 1
TBF
SEN
Bit 0
0000 0000 0000 0000
0000 0000 0000 0000
0001 0000 0000 0000
0000 0000 0000 0000
0000 0000 1111 1111
0000 0000 0000 0000
Reset State
dsPIC30F
Preliminary
DS70083G-page 113
dsPIC30F
NOTES:
DS70083G-page 114
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
16.0
UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART) MODULE
16.1
The key features of the UART module are:
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
This section describes the Universal Asynchronous
Receiver/Transmitter Communications module.
•
•
•
•
•
•
•
•
•
•
•
FIGURE 16-1:
UART Module Overview
Full-duplex, 8 or 9-bit data communication
Even, odd or no parity options (for 8-bit data)
One or two Stop bits
Fully integrated baud rate generator with 16-bit
prescaler
Baud rates range from 38 bps to 1.875 Mbps at a
30 MHz instruction rate
4-word deep transmit data buffer
4-word deep receive data buffer
Parity, framing and buffer overrun error detection
Support for interrupt only on address detect
(9th bit = 1)
Separate transmit and receive interrupts
Loopback mode for diagnostic support
UART TRANSMITTER BLOCK DIAGRAM
Internal Data Bus
Control and Status bits
Write
UTX8
Write
UxTXREG Low Byte
Transmit Control
– Control TSR
– Control Buffer
– Generate Flags
– Generate Interrupt
Load TSR
UxTXIF
UTXBRK
Data
Transmit Shift Register (UxTSR)
‘0’ (Start)
UxTX
‘1’ (Stop)
Parity
Parity
Generator
16 Divider
16x Baud Clock
from Baud Rate
Generator
Control
Signals
Note:
x = 1 or 2.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 115
dsPIC30F
FIGURE 16-2:
UART RECEIVER BLOCK DIAGRAM
Internal Data Bus
16
Write
Read
Read Read
UxMODE
Write
UxSTA
URX8 UxRXREG Low Byte
Receive Buffer Control
– Generate Flags
– Generate Interrupt
– Shift Data Characters
0
· Start bit Detect
· Parity Check
· Stop bit Detect
· Shift Clock Generation
· Wake Logic
Load RSR
to Buffer
Receive Shift Register
(UxRSR)
Control
Signals
FERR
UxRX
8-9
PERR
LPBACK
From UxTX
1
16 Divider
16x Baud Clock from
Baud Rate Generator
UxRXIF
DS70083G-page 116
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
16.2
16.2.1
Enabling and Setting Up UART
16.3
ENABLING THE UART
16.3.1
The UART module is enabled by setting the UARTEN
bit in the UxMODE register (where x = 1 or 2). Once
enabled, the UxTX and UxRX pins are configured as an
output and an input respectively, overriding the TRIS
and LATCH register bit settings for the corresponding
I/O port pins. The UxTX pin is at logic ‘1’ when no
transmission is taking place.
16.2.2
Disabling the UART module resets the buffers to empty
states. Any data characters in the buffers are lost and
the baud rate counter is reset.
1.
2.
3.
4.
All error and status flags associated with the UART
module are reset when the module is disabled. The
URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and
UTXBF bits are cleared, whereas RIDLE and TRMT
are set. Other control bits, including ADDEN,
URXISEL<1:0>, UTXISEL, as well as the UxMODE
and UxBRG registers, are not affected.
Clearing the UARTEN bit while the UART is active will
abort all pending transmissions and receptions and
reset the module as defined above. Re-enabling the
UART will restart the UART in the same configuration.
16.2.3
16.2.4
5.
Set up the UART:
First, the data length, parity and number of Stop
bits must be selected. Then, the transmit and
receive interrupt enable and priority bits are
setup in the UxMODE and UxSTA registers.
Also, the appropriate baud rate value must be
written to the UxBRG register.
Enable the UART by setting the UARTEN bit
(UxMODE<15>).
Set the UTXEN bit (UxSTA<10>), thereby
enabling a transmission.
Write the byte to be transmitted to the lower byte
of UxTXREG. The value will be transferred to the
Transmit Shift register (UxTSR) immediately
and the serial bit stream will start shifting out
during the next rising edge of the baud clock.
Alternatively, the data byte may be written while
UTXEN = 0, following which, the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
A transmit interrupt will be generated, depending on the value of the interrupt control bit
UTXISEL (UxSTA<15>).
16.3.2
ALTERNATE I/O
The alternate I/O function is enabled by setting the
ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX
and UxARX pins (alternate transmit and alternate
receive pins, respectively) are used by the UART module instead of the UxTX and UxRX pins. If ALTIO = 0,
the UxTX and UxRX pins are used by the UART
module.
SETTING UP DATA, PARITY AND
STOP BIT SELECTIONS
Control bits PDSEL<1:0> in the UxMODE register are
used to select the data length and parity used in the
transmission. The data length may either be 8 bits with
even, odd or no parity, or 9 bits with no parity.
The STSEL bit determines whether one or two Stop bits
will be used during data transmission.
The default (power-on) setting of the UART is 8 bits, no
parity and 1 Stop bit (typically represented as 8, N, 1).
 2004 Microchip Technology Inc.
TRANSMITTING IN 8-BIT DATA
MODE
The following steps must be performed in order to
transmit 8-bit data:
DISABLING THE UART
The UART module is disabled by clearing the UARTEN
bit in the UxMODE register. This is the default state
after any Reset. If the UART is disabled, all I/O pins
operate as port pins under the control of the latch and
TRIS bits of the corresponding port pins.
Transmitting Data
TRANSMITTING IN 9-BIT DATA
MODE
The sequence of steps involved in the transmission of
9-bit data is similar to 8-bit transmission, except that a
16-bit data word (of which the upper 7 bits are always
clear) must be written to the UxTXREG register.
16.3.3
TRANSMIT BUFFER (UXTXB)
The transmit buffer is 9 bits wide and 4 characters
deep. Including the Transmit Shift register (UxTSR),
the user effectively has a 5-deep FIFO (First-In, FirstOut) buffer. The UTXBF status bit (UxSTA<9>)
indicates whether the transmit buffer is full.
If a user attempts to write to a full buffer, the new data
will not be accepted into the FIFO, and no data shift will
occur within the buffer. This enables recovery from a
buffer overrun condition.
The FIFO is reset during any device Reset but is not
affected when the device enters or wakes up from a
Power Saving mode.
Preliminary
DS70083G-page 117
dsPIC30F
16.3.4
TRANSMIT INTERRUPT
16.4.2
The transmit interrupt flag (U1TXIF or U2TXIF) is
located in the corresponding interrupt flag register.
The transmitter generates an edge to set the UxTXIF
bit. The condition for generating the interrupt depends
on the UTXISEL control bit:
a)
b)
If UTXISEL = 0, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift register (UxTSR). This implies
that the transmit buffer has at least one empty
word.
If UTXISEL = 1, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift register (UxTSR) and the
transmit buffer is empty.
Switching between the two Interrupt modes during
operation is possible and sometimes offers more
flexibility.
16.3.5
TRANSMIT BREAK
RECEIVE BUFFER (UXRXB)
The receive buffer is 4 words deep. Including the
Receive Shift register (UxRSR), the user effectively
has a 5-word deep FIFO buffer.
URXDA (UxSTA<0>) = 1 indicates that the receive
buffer has data available. URXDA = 0 implies that the
buffer is empty. If a user attempts to read an empty
buffer, the old values in the buffer will be read and no
data shift will occur within the FIFO.
The FIFO is reset during any device Reset. It is not
affected when the device enters or wakes up from a
Power Saving mode.
16.4.3
RECEIVE INTERRUPT
The receive interrupt flag (U1RXIF or U2RXIF) can be
read from the corresponding interrupt flag register. The
interrupt flag is set by an edge generated by the
receiver. The condition for setting the receive interrupt
flag depends on the settings specified by the
URXISEL<1:0> (UxSTA<7:6>) control bits.
Setting the UTXBRK bit (UxSTA<11>) will cause the
UxTX line to be driven to logic ‘0’. The UTXBRK bit
overrides all transmission activity. Therefore, the user
should generally wait for the transmitter to be Idle
before setting UTXBRK.
a)
To send a break character, the UTXBRK bit must be set
by software and must remain set for a minimum of 13
baud clock cycles. The UTXBRK bit is then cleared by
software to generate Stop bits. The user must wait for
a duration of at least one or two baud clock cycles in
order to ensure a valid Stop bit(s) before reloading the
UxTXB, or starting other transmitter activity. Transmission of a break character does not generate a transmit
interrupt.
b)
c)
16.4
Switching between the Interrupt modes during operation is possible, though generally not advisable during
normal operation.
16.4.1
Receiving Data
RECEIVING IN 8-BIT OR 9-BIT
DATA MODE
If URXISEL<1:0> = 00 or 01, an interrupt is generated every time a data word is transferred
from the Receive Shift register (UxRSR) to the
receive buffer. There may be one or more
characters in the receive buffer.
If URXISEL<1:0> = 10, an interrupt is generated
when a word is transferred from the Receive Shift
register (UxRSR) to the receive buffer, which as a
result of the transfer, contains 3 characters.
If URXISEL<1:0> = 11, an interrupt is set when
a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a
result of the transfer, contains 4 characters (i.e.,
becomes full).
16.5
Reception Error Handling
The following steps must be performed while receiving
8-bit or 9-bit data:
16.5.1
1.
2.
3.
The OERR bit (UxSTA<1>) is set if all of the following
conditions occur:
4.
5.
Set up the UART (see Section 16.3.1).
Enable the UART (see Section 16.3.1).
A receive interrupt will be generated when one
or more data words have been received,
depending on the receive interrupt settings
specified by the URXISEL bits (UxSTA<7:6>).
Read the OERR bit to determine if an overrun
error has occurred. The OERR bit must be reset
in software.
Read the received data from UxRXREG. The act
of reading UxRXREG will move the next word to
the top of the receive FIFO, and the PERR and
FERR values will be updated.
DS70083G-page 118
a)
b)
c)
RECEIVE BUFFER OVERRUN
ERROR (OERR BIT)
The receive buffer is full.
The Receive Shift register is full, but unable to
transfer the character to the receive buffer.
The Stop bit of the character in the UxRSR is
detected, indicating that the UxRSR needs to
transfer the character to the buffer.
Once OERR is set, no further data is shifted in UxRSR
(until the OERR bit is cleared in software or a Reset
occurs). The data held in UxRSR and UxRXREG
remains valid.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
16.5.2
FRAMING ERROR (FERR)
16.6
The FERR bit (UxSTA<2>) is set if a ‘0’ is detected
instead of a Stop bit. If two Stop bits are selected, both
Stop bits must be ‘1’, otherwise FERR will be set. The
read only FERR bit is buffered along with the received
data. It is cleared on any Reset.
16.5.3
PARITY ERROR (PERR)
The PERR bit (UxSTA<3>) is set if the parity of the
received word is incorrect. This error bit is applicable
only if a Parity mode (odd or even) is selected. The
read only PERR bit is buffered along with the received
data bytes. It is cleared on any Reset.
16.5.4
IDLE STATUS
When the receiver is active (i.e., between the initial
detection of the Start bit and the completion of the Stop
bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the completion of the Stop bit and detection of the next Start bit,
the RIDLE bit is ‘1’, indicating that the UART is Idle.
16.5.5
RECEIVE BREAK
The receiver will count and expect a certain number of
bit times based on the values programmed in the
PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)
bits.
If the break is longer than 13 bit times, the reception is
considered complete after the number of bit times
specified by PDSEL and STSEL. The URXDA bit is set,
FERR is set, zeros are loaded into the receive FIFO,
interrupts are generated if appropriate and the RIDLE
bit is set.
When the module receives a long break signal and the
receiver has detected the Start bit, the data bits and the
invalid Stop bit (which sets the FERR), the receiver
must wait for a valid Stop bit before looking for the next
Start bit. It cannot assume that the break condition on
the line is the next Start bit.
Break is regarded as a character containing all ‘0’s with
the FERR bit set. The break character is loaded into the
buffer. No further reception can occur until a Stop bit is
received. Note that RIDLE goes high when the Stop bit
has not yet been received.
Address Detect Mode
Setting the ADDEN bit (UxSTA<5>) enables this special mode in which a 9th bit (URX8) value of ‘1’ identifies the received word as an address, rather than data.
This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have any
impact on interrupt generation in this mode since an
interrupt (if enabled) will be generated every time the
received word has the 9th bit set.
16.7
Loopback Mode
Setting the LPBACK bit enables this special mode in
which the UxTX pin is internally connected to the UxRX
pin. When configured for the Loopback mode, the
UxRX pin is disconnected from the internal UART
receive logic. However, the UxTX pin still functions as
in a normal operation.
To select this mode:
a)
b)
c)
Configure UART for desired mode of operation.
Set LPBACK = 1 to enable Loopback mode.
Enable transmission as defined in Section 16.3.
16.8
Baud Rate Generator
The UART has a 16-bit baud rate generator to allow
maximum flexibility in baud rate generation. The baud
rate generator register (UxBRG) is readable and
writable. The baud rate is computed as follows:
BRG = 16-bit value held in UxBRG register
(0 through 65535)
FCY = Instruction Clock Rate (1/TCY)
The Baud Rate is given by Equation 16-1.
EQUATION 16-1:
BAUD RATE
Baud Rate = FCY / (16*(BRG+1))
Therefore, the maximum baud rate possible is
FCY /16 (if BRG = 0),
and the minimum baud rate possible is
FCY / (16* 65536).
With a full 16-bit baud rate generator at 30 MIPs
operation, the minimum baud rate achievable is
28.5 bps.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 119
dsPIC30F
16.9
16.10.2
Auto Baud Support
To allow the system to determine baud rates of
received characters, the input can be optionally linked
to a capture input (IC1 for UART1, IC2 for UART2). To
enable this mode, the user must program the input capture module to detect the falling and rising edges of the
Start bit.
UART OPERATION DURING CPU
IDLE MODE
For the UART, the USIDL bit selects if the module will
stop operation when the device enters Idle mode or
whether the module will continue on Idle. If USIDL = 0,
the module will continue operation during Idle mode. If
USIDL = 1, the module will stop on Idle.
16.10 UART Operation During CPU
Sleep and Idle Modes
16.10.1
UART OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If entry
into Sleep mode occurs while a transmission is in
progress, then the transmission is aborted. The UxTX
pin is driven to logic ‘1’. Similarly, if entry into Sleep
mode occurs while a reception is in progress, then the
reception is aborted. The UxSTA, UxMODE, transmit
and receive registers and buffers, and the UxBRG
register are not affected by Sleep mode.
If the WAKE bit (UxSTA<7>) is set before the device
enters Sleep mode, then a falling edge on the UxRX pin
will generate a receive interrupt. The Receive Interrupt
Select mode bit (URXISEL) has no effect for this function. If the receive interrupt is enabled, then this will
wake-up the device from Sleep. The UARTEN bit must
be set in order to generate a wake-up interrupt.
DS70083G-page 120
Preliminary
 2004 Microchip Technology Inc.
0212
0214
u = uninitialized bit
U1RXREG
U1BRG
Legend:
 2004 Microchip Technology Inc.
—
—
—
—
—
Bit 12
—
—
—
—
—
021E
u = uninitialized bit
U2BRG
Legend:
—
—
—
—
—
Bit 12
ALTIO
Bit 10
—
Bit 10
—
—
—
—
—
—
UTXBRK UTXEN
—
Bit 11
—
—
UTXBRK UTXEN
—
Bit 11
—
—
UTXBF
—
Bit 9
—
—
URX8
UTX8
TRMT
—
Bit 8
LPBACK
Bit 6
LPBACK
Bit 6
ABAUD
Bit 5
PERR
—
Bit 3
RIDLE
—
Bit 4
PERR
—
Bit 3
Receive Register
Transmit Register
RIDLE
—
Bit 4
Receive Register
Transmit Register
URXISEL1 URXISEL0 ADDEN
WAKE
Bit 7
Baud Rate Generator Prescaler
URX8
UTX8
TRMT
—
Bit 8
ABAUD
Bit 5
URXISEL1 URXISEL0 ADDEN
WAKE
Bit 7
Baud Rate Generator Prescaler
UTXBF
—
Bit 9
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
021A
021C
U2RXREG
—
USIDL
—
UARTEN
—
Bit 13
Bit 14
UTXISEL
Bit 15
UART2 REGISTER MAP
—
—
—
—
—
—
USIDL
—
—
U2TXREG
0216
0218
U2MODE
U2STA
Addr.
SFR
Name
TABLE 16-2:
0210
U1TXREG
UARTEN
020E
UTXISEL
020C
U1MODE
U1STA
Bit 13
Bit 15
SFR Name Addr.
Bit 14
UART1 REGISTER MAP
TABLE 16-1:
Bit 1
Bit 0
Reset State
Bit 1
OERR
FERR
OERR
PDSEL1 PDSEL0
Bit 2
FERR
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
0000 000u uuuu uuuu
URXDA 0000 0001 0001 0000
STSEL 0000 0000 0000 0000
Bit 0
0000 0000 0000 0000
0000 0000 0000 0000
0000 000u uuuu uuuu
URXDA 0000 0001 0001 0000
PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
Bit 2
dsPIC30F
Preliminary
DS70083G-page 121
dsPIC30F
NOTES:
DS70083G-page 122
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
17.0
CAN MODULE
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
17.1
Overview
The Controller Area Network (CAN) module is a serial
interface, useful for communicating with other CAN
modules or microcontroller devices. This interface/
protocol was designed to allow communications within
noisy environments.
The CAN module is a communication controller implementing the CAN 2.0 A/B protocol, as defined in the
BOSCH specification. The module will support
CAN 1.2, CAN 2.0A, CAN 2.0B Passive, and CAN 2.0B
Active versions of the protocol. The module implementation is a full CAN system. The CAN specification is
not covered within this data sheet. The reader may
refer to the BOSCH CAN specification for further
details.
The module features are as follows:
• Implementation of the CAN protocol CAN 1.2,
CAN 2.0A and CAN 2.0B
• Standard and extended data frames
• 0-8 bytes data length
• Programmable bit rate up to 1 Mbit/sec
• Support for remote frames
• Double-buffered receiver with two prioritized
received message storage buffers (each buffer
may contain up to 8 bytes of data)
• 6 full (standard/extended identifier) acceptance
filters, 2 associated with the high priority receive
buffer and 4 associated with the low priority
receive buffer
• 2 full acceptance filter masks, one each
associated with the high and low priority receive
buffers
• Three transmit buffers with application specified
prioritization and abort capability (each buffer may
contain up to 8 bytes of data)
• Programmable wake-up functionality with
integrated low-pass filter
• Programmable Loopback mode supports self-test
operation
• Signaling via interrupt capabilities for all CAN
receiver and transmitter error states
• Programmable clock source
• Programmable link to Input Capture module (IC2,
for both CAN1 and CAN2) for time-stamping and
network synchronization
• Low power Sleep and Idle mode
 2004 Microchip Technology Inc.
The CAN bus module consists of a protocol engine and
message buffering/control. The CAN protocol engine
handles all functions for receiving and transmitting
messages on the CAN bus. Messages are transmitted
by first loading the appropriate data registers. Status
and errors can be checked by reading the appropriate
registers. Any message detected on the CAN bus is
checked for errors and then matched against filters to
see if it should be received and stored in one of the
receive registers.
17.2
Frame Types
The CAN module transmits various types of frames
which include data messages or remote transmission
requests initiated by the user, as other frames that are
automatically generated for control purposes. The
following frame types are supported:
• Standard Data Frame:
A standard data frame is generated by a node
when the node wishes to transmit data. It includes
an 11-bit standard identifier (SID) but not an 18-bit
extended identifier (EID).
• Extended Data Frame:
An extended data frame is similar to a standard
data frame but includes an extended identifier as
well.
• Remote Frame:
It is possible for a destination node to request the
data from the source. For this purpose, the destination node sends a remote frame with an identifier that matches the identifier of the required data
frame. The appropriate data source node will then
send a data frame as a response to this remote
request.
• Error Frame:
An error frame is generated by any node that
detects a bus error. An error frame consists of 2
fields: an error flag field and an error delimiter
field.
• Overload Frame:
An overload frame can be generated by a node as
a result of 2 conditions. First, the node detects a
dominant bit during interframe space which is an
illegal condition. Second, due to internal conditions, the node is not yet able to start reception of
the next message. A node may generate a maximum of 2 sequential overload frames to delay the
start of the next message.
• Interframe Space:
Interframe space separates a proceeding frame
(of whatever type) from a following data or remote
frame.
Preliminary
DS70083G-page 123
dsPIC30F
FIGURE 17-1:
CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM
Acceptance Mask
RXM1
BUFFERS
Acceptance Filter
RXF2
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB2
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
MESSAGE
TXB1
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB0
A
c
c
e
p
t
R
X
B
0
Message
Queue
Control
Acceptance Mask
RXM0
Acceptance Filter
RXF3
Acceptance Filter
RXF0
Acceptance Filter
RXF4
Acceptance Filter
RXF1
Acceptance Filter
RXF5
Identifier
M
A
B
Data Field
Transmit Byte Sequencer
Data Field
PROTOCOL
ENGINE
Note 1:
RERRCNT
TERRCNT
Transmit
Error
Counter
CRC Generator
R
X
B
1
Identifier
Receive
Error
Counter
Transmit Shift
A
c
c
e
p
t
Err Pas
Bus Off
Receive Shift
Protocol
Finite
State
Machine
CRC Check
Transmit
Logic
Bit
Timing
Logic
CiTX(1)
CiRX(1)
Bit Timing
Generator
i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2).
DS70083G-page 124
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
17.3
Modes of Operation
The CAN module can operate in one of several Operation
modes selected by the user. These modes include:
•
•
•
•
•
•
Initialization Mode
Disable Mode
Normal Operation Mode
Listen Only Mode
Loopback Mode
Error Recognition Mode
Note:
Modes are requested by setting the REQOP<2:0> bits
(CiCTRL<10:8>), except the Error Recognition mode
which is requested through the RXM<1:0> bits
(CiRXnCON<6:5>, where n = 0 or 1 represents a particular receive buffer). Entry into a mode is Acknowledged by monitoring the OPMODE<2:0> bits
(CiCTRL<7:5>). The module will not change the mode
and the OPMODE bits until a change in mode is
acceptable, generally during bus Idle time which is
defined as at least 11 consecutive recessive bits.
17.3.1
INITIALIZATION MODE
In the Initialization mode, the module will not transmit or
receive. The error counters are cleared and the interrupt flags remain unchanged. The programmer will
have access to configuration registers that are access
restricted in other modes. The module will protect the
user from accidentally violating the CAN protocol
through programming errors. All registers which control
the configuration of the module can not be modified
while the module is on-line. The CAN module will not
be allowed to enter the Configuration mode while a
transmission is taking place. The Configuration mode
serves as a lock to protect the following registers.
•
•
•
•
•
Typically, if the CAN module is allowed to
transmit in a particular mode of operation
and a transmission is requested immediately after the CAN module has been
placed in that mode of operation, the module waits for 11 consecutive recessive bits
on the bus before starting transmission. If
the user switches to Disable Mode within
this 11-bit period, then this transmission is
aborted and the corresponding TXABT bit
is set and TXREQ bit is cleared.
NORMAL OPERATION MODE
Normal Operating mode is selected when
REQOP<2:0> = 000. In this mode, the module is activated and the I/O pins will assume the CAN bus functions. The module will transmit and receive CAN bus
messages via the CxTX and CxRX pins.
17.3.4
LISTEN ONLY MODE
If the Listen Only mode is activated, the module on the
CAN bus is passive. The transmitter buffers revert to
the port I/O function. The receive pins remain inputs.
For the receiver, no error flags or Acknowledge signals
are sent. The error counters are deactivated in this
state. The Listen Only mode can be used for detecting
the baud rate on the CAN bus. To use this, it is necessary that there are at least two further nodes that
communicate with each other.
LISTEN ALL MESSAGES MODE
The module can be set to ignore all errors and receive
any message. The Error Recognition mode is activated
by setting REQOP<2:0> = 111. In this mode, the data
which is in the message assembly buffer until the time
an error occurred, is copied in the receive buffer and
can be read via the CPU interface.
DISABLE MODE
In Disable mode, the module will not transmit or
receive. The module has the ability to set the WAKIF bit
due to bus activity, however, any pending interrupts will
remain and the error counters will retain their value.
If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the
module will enter the Module Disable mode. If the module
is active, the module will wait for 11 recessive bits on the
CAN bus, detect that condition as an Idle bus, then
accept the module disable command. When the
OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indicates whether the module successfully went into Module
Disable mode. The I/O pins will revert to normal I/O
function when the module is in the Module Disable mode.
 2004 Microchip Technology Inc.
17.3.3
17.3.5
All Module Control Registers
Baud Rate and Interrupt Configuration Registers
Bus Timing Registers
Identifier Acceptance Filter Registers
Identifier Acceptance Mask Registers
17.3.2
The module can be programmed to apply a low-pass
filter function to the CiRX input line while the module or
the CPU is in Sleep mode. The WAKFIL bit
(CiCFG2<14>) enables or disables the filter.
17.3.6
LOOPBACK MODE
If the Loopback mode is activated, the module will connect the internal transmit signal to the internal receive
signal at the module boundary. The transmit and
receive pins revert to their port I/O function.
Preliminary
DS70083G-page 125
dsPIC30F
17.4
17.4.1
Message Reception
17.4.4
RECEIVE BUFFERS
The CAN bus module has 3 receive buffers. However,
one of the receive buffers is always committed to monitoring the bus for incoming messages. This buffer is
called the Message Assembly Buffer (MAB). So there
are 2 receive buffers visible, RXB0 and RXB1, that can
essentially instantaneously receive a complete
message from the protocol engine.
All messages are assembled by the MAB and are transferred to the RXBn buffers only if the acceptance filter
criterion are met. When a message is received, the
RXnIF flag (CiINTF<0> or CiINRF<1>) will be set. This
bit can only be set by the module when a message is
received. The bit is cleared by the CPU when it has completed processing the message in the buffer. If the
RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an interrupt
will be generated when a message is received.
RXF0 and RXF1 filters with RXM0 mask are associated
with RXB0. The filters RXF2, RXF3, RXF4, and RXF5
and the mask RXM1 are associated with RXB1.
17.4.2
MESSAGE ACCEPTANCE FILTERS
The message acceptance filters and masks are used to
determine if a message in the message assembly
buffer should be loaded into either of the receive buffers. Once a valid message has been received into the
Message Assembly Buffer (MAB), the identifier fields of
the message are compared to the filter values. If there
is a match, that message will be loaded into the
appropriate receive buffer.
The acceptance filter looks at incoming messages for
the RXIDE bit (CiRXnSID<0>) to determine how to
compare the identifiers. If the RXIDE bit is clear, the
message is a standard frame and only filters with the
EXIDE bit (CiRXFnSID<0>) clear are compared. If the
RXIDE bit is set, the message is an extended frame,
and only filters with the EXIDE bit set are compared.
Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can
override the EXIDE bit.
17.4.3
MESSAGE ACCEPTANCE FILTER
MASKS
The mask bits essentially determine which bits to apply
the filter to. If any mask bit is set to a zero, then that bit
will automatically be accepted regardless of the filter
bit. There are 2 programmable acceptance filter masks
associated with the receive buffers, one for each buffer.
RECEIVE OVERRUN
An overrun condition occurs when the Message
Assembly Buffer (MAB) has assembled a valid
received message, the message is accepted through
the acceptance filters, and when the receive buffer
associated with the filter has not been designated as
clear of the previous message.
The overrun error flag, RXnOVR (CiINTF<15> or
CiINTF<14>), and the ERRIF bit (CiINTF<5>) will be
set and the message in the MAB will be discarded.
If the DBEN bit is clear, RXB1 and RXB0 operate independently. When this is the case, a message intended
for RXB0 will not be diverted into RXB1 if RXB0 contains an unread message and the RX0OVR bit will be
set.
If the DBEN bit is set, the overrun for RXB0 is handled
differently. If a valid message is received for RXB0 and
RXFUL = 1 indicates that RXB0 is full and RXFUL = 0
indicates that RXB1 is empty, the message for RXB0
will be loaded into RXB1. An overrun error will not be
generated for RXB0. If a valid message is received for
RXB0 and RXFUL = 1, indicating that both RXB0 and
RXB1 are full, the message will be lost and an overrun
will be indicated for RXB1.
17.4.5
RECEIVE ERRORS
The CAN module will detect the following receive
errors:
• Cyclic Redundancy Check (CRC) Error
• Bit Stuffing Error
• Invalid Message Receive Error
These receive errors do not generate an interrupt.
However, the receive error counter is incremented by
one in case one of these errors occur. The RXWAR bit
(CiINTF<9>) indicates that the receive error counter
has reached the CPU warning limit of 96 and an
interrupt is generated.
17.4.6
RECEIVE INTERRUPTS
Receive interrupts can be divided into 3 major groups,
each including various conditions that generate
interrupts:
• Receive Interrupt:
A message has been successfully received and
loaded into one of the receive buffers. This interrupt is activated immediately after receiving the
End of Frame (EOF) field. Reading the RXnIF flag
will indicate which receive buffer caused the
interrupt.
• Wake-up Interrupt:
The CAN module has woken up from Disable
mode or the device has woken up from Sleep
mode.
DS70083G-page 126
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
• Receive Error Interrupts:
A receive error interrupt will be indicated by the
ERRIF bit. This bit shows that an error condition
occurred. The source of the error can be determined by checking the bits in the CAN Interrupt
Status register, CiINTF.
- Invalid Message Received:
If any type of error occurred during reception of
the last message, an error will be indicated by
the IVRIF bit.
- Receiver Overrun:
The RXnOVR bit indicates that an overrun
condition occurred.
- Receiver Warning:
The RXWAR bit indicates that the receive error
counter (RERRCNT<7:0>) has reached the
warning limit of 96.
- Receiver Error Passive:
The RXEP bit indicates that the receive error
counter has exceeded the error passive limit of
127 and the module has gone into error passive
state.
17.5
17.5.1
Message Transmission
TRANSMIT BUFFERS
The CAN module has three transmit buffers. Each of
the three buffers occupies 14 bytes of data. Eight of the
bytes are the maximum 8 bytes of the transmitted message. Five bytes hold the standard and extended
identifiers and other message arbitration information.
17.5.2
TRANSMIT MESSAGE PRIORITY
Transmit priority is a prioritization within each node of
the pending transmittable messages. There are
4 levels of transmit priority. If TXPRI<1:0>
(CiTXnCON<1:0>, where n = 0, 1 or 2 represents a particular transmit buffer) for a particular message buffer is
set to ‘11’, that buffer has the highest priority. If
TXPRI<1:0> for a particular message buffer is set to
‘10’ or ‘01’, that buffer has an intermediate priority. If
TXPRI<1:0> for a particular message buffer is ‘00’, that
buffer has the lowest priority.
17.5.3
Setting TXREQ bit simply flags a message buffer as
enqueued for transmission. When the module detects
an available bus, it begins transmitting the message
which has been determined to have the highest priority.
If the transmission completes successfully on the first
attempt, the TXREQ bit is cleared automatically, and an
interrupt is generated if TXIE was set.
If the message transmission fails, one of the error condition flags will be set, and the TXREQ bit will remain
set indicating that the message is still pending for transmission. If the message encountered an error condition
during the transmission attempt, the TXERR bit will be
set, and the error condition may cause an interrupt. If
the message loses arbitration during the transmission
attempt, the TXLARB bit is set. No interrupt is
generated to signal the loss of arbitration.
17.5.4
ABORTING MESSAGE
TRANSMISSION
The system can also abort a message by clearing the
TXREQ bit associated with each message buffer. Setting the ABAT bit (CiCTRL<12>) will request an abort of
all pending messages. If the message has not yet
started transmission, or if the message started but is
interrupted by loss of arbitration or an error, the abort
will be processed. The abort is indicated when the
module sets the TXABT bit and the TXnIF flag is not
automatically set.
17.5.5
TRANSMISSION ERRORS
The CAN module will detect the following transmission
errors:
• Acknowledge Error
• Form Error
• Bit Error
These transmission errors will not necessarily generate
an interrupt but are indicated by the transmission error
counter. However, each of these errors will cause the
transmission error counter to be incremented by one.
Once the value of the error counter exceeds the value
of 96, the ERRIF (CiINTF<5>) and the TXWAR bit
(CiINTF<10>) are set. Once the value of the error
counter exceeds the value of 96, an interrupt is
generated and the TXWAR bit in the Error Flag register
is set.
TRANSMISSION SEQUENCE
To initiate transmission of the message, the TXREQ bit
(CiTXnCON<3>) must be set. The CAN bus module
resolves any timing conflicts between setting of the
TXREQ bit and the Start of Frame (SOF), ensuring that if
the priority was changed, it is resolved correctly before the
SOF occurs. When TXREQ is set, the TXABT
(CiTXnCON<6>), TXLARB (CiTXnCON<5>) and TXERR
(CiTXnCON<4>) flag bits are automatically cleared.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 127
dsPIC30F
17.5.6
17.6
TRANSMIT INTERRUPTS
Baud Rate Setting
Transmit interrupts can be divided into 2 major groups,
each including various conditions that generate
interrupts:
All nodes on any particular CAN bus must have the
same nominal bit rate. In order to set the baud rate, the
following parameters have to be initialized:
• Transmit Interrupt:
At least one of the three transmit buffers is empty
(not scheduled) and can be loaded to schedule a
message for transmission. Reading the TXnIF
flags will indicate which transmit buffer is available
and caused the interrupt.
•
•
•
•
•
•
• Transmit Error Interrupts:
A transmission error interrupt will be indicated by
the ERRIF flag. This flag shows that an error condition occurred. The source of the error can be
determined by checking the error flags in the CAN
Interrupt Status register, CiINTF. The flags in this
register are related to receive and transmit errors.
- Transmitter Warning Interrupt:
The TXWAR bit indicates that the transmit error
counter has reached the CPU warning limit of
96.
- Transmitter Error Passive:
The TXEP bit (CiINTF<12>) indicates that the
transmit error counter has exceeded the error
passive limit of 127 and the module has gone to
error passive state.
- Bus Off:
The TXBO bit (CiINTF<13>) indicates that the
transmit error counter has exceeded 255 and
the module has gone to the bus off state.
FIGURE 17-2:
Synchronization Jump Width
Baud Rate Prescaler
Phase Segments
Length determination of Phase Segment 2
Sample Point
Propagation Segment bits
17.6.1
BIT TIMING
All controllers on the CAN bus must have the same
baud rate and bit length. However, different controllers
are not required to have the same master oscillator
clock. At different clock frequencies of the individual
controllers, the baud rate has to be adjusted by
adjusting the number of time quanta in each segment.
The nominal bit time can be thought of as being divided
into separate non-overlapping time segments. These
segments are shown in Figure 17-2.
•
•
•
•
Synchronization Segment (Sync Seg)
Propagation Time Segment (Prop Seg)
Phase Segment 1 (Phase1 Seg)
Phase Segment 2 (Phase2 Seg)
The time segments and also the nominal bit time are
made up of integer units of time called time quanta or
TQ. By definition, the nominal bit time has a minimum
of 8 TQ and a maximum of 25 TQ. Also, by definition,
the minimum nominal bit time is 1 µsec corresponding
to a maximum bit rate of 1 MHz.
CAN BIT TIMING
Input Signal
Sync
Prop
Segment
Phase
Segment 1
Phase
Segment 2
Sync
Sample Point
TQ
DS70083G-page 128
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
17.6.2
PRESCALER SETTING
17.6.5
There is a programmable prescaler with integral values
ranging from 1 to 64, in addition to a fixed divide-by-2
for clock generation. The time quantum (TQ) is a fixed
unit of time derived from the oscillator period, and is
given by Equation 17-1, where FCAN is FCY (if the CANCKS bit is set) or 4FCY (if CANCKS is clear).
Note:
FCAN must not exceed 30 MHz. If
CANCKS = 0, then FCY must not exceed
7.5 MHz.
EQUATION 17-1:
TIME QUANTUM FOR
CLOCK GENERATION
17.6.6
PROPAGATION SEGMENT
This part of the bit time is used to compensate physical
delay times within the network. These delay times consist of the signal propagation time on the bus line and
the internal delay time of the nodes. The Prop Seg can
be programmed from 1 TQ to 8 TQ by setting the
PRSEG<2:0> bits (CiCFG2<2:0>).
17.6.4
PHASE SEGMENTS
The phase segments are used to optimally locate the
sampling of the received bit within the transmitted bit
time. The sampling point is between Phase1 Seg and
Phase2 Seg. These segments are lengthened or shortened by resynchronization. The end of the Phase1 Seg
determines the sampling point within a bit period. The
segment is programmable from 1 TQ to 8 TQ. Phase2
Seg provides delay to the next transmitted data transition. The segment is programmable from 1 TQ to 8 TQ,
or it may be defined to be equal to the greater of
Phase1 Seg or the information processing time (2 TQ).
The Phase1 Seg is initialized by setting bits
SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is
initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).
The following requirement must be fulfilled while setting
the lengths of the phase segments:
Prop Seg + Phase1 Seg > = Phase2 Seg
The sample point is the point of time at which the bus
level is read and interpreted as the value of that respective bit. The location is at the end of Phase1 Seg. If the
bit timing is slow and contains many TQ, it is possible to
specify multiple sampling of the bus line at the sample
point. The level determined by the CAN bus then corresponds to the result from the majority decision of three
values. The majority samples are taken at the sample
point and twice before with a distance of TQ/2. The
CAN module allows the user to choose between sampling three times at the same point or once at the same
point, by setting or clearing the SAM bit (CiCFG2<6>).
Typically, the sampling of the bit should take place at
about 60 - 70% through the bit time, depending on the
system parameters.
TQ = 2 (BRP<5:0> + 1) / FCAN
17.6.3
SAMPLE POINT
SYNCHRONIZATION
To compensate for phase shifts between the oscillator
frequencies of the different bus stations, each CAN
controller must be able to synchronize to the relevant
signal edge of the incoming signal. When an edge in
the transmitted data is detected, the logic will compare
the location of the edge to the expected time (Synchronous Segment). The circuit will then adjust the values
of Phase1 Seg and Phase2 Seg. There are 2
mechanisms used to synchronize.
17.6.6.1
Hard Synchronization
Hard synchronization is only done whenever there is a
‘recessive’ to ‘dominant’ edge during bus Idle indicating
the start of a message. After hard synchronization, the
bit time counters are restarted with the Sync Seg. Hard
synchronization forces the edge which has caused the
hard synchronization to lie within the synchronization
segment of the restarted bit time. If a hard synchronization is done, there will not be a resynchronization within
that bit time.
17.6.6.2
Resynchronization
As a result of resynchronization, Phase1 Seg may be
lengthened or Phase2 Seg may be shortened. The
amount of lengthening or shortening of the phase
buffer segment has an upper bound known as the synchronization jump width, and is specified by the
SJW<1:0> bits (CiCFG1<7:6>). The value of the synchronization jump width will be added to Phase1 Seg or
subtracted from Phase2 Seg. The resynchronization
jump width is programmable between 1 TQ and 4 TQ.
The following requirement must be fulfilled while setting
the SJW<1:0> bits:
Phase2 Seg > Synchronization Jump Width
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 129
DS70083G-page 130
—
Receive Acceptance Filter 1 Extended Identifier <5:0>
—
—
Receive Acceptance Filter 3 Extended Identifier <5:0>
030C
0310
0312
0314
0318
0320
0322
0324
C1RXF2SID
C1RXF2EIDH
C1RXF2EIDL
C1RXF3SID
C1RXF3EIDH 031A
031C
C1RXF1EIDL
C1RXF3EIDL
C1RXF4SID
C1RXF4EIDH
C1RXF4EIDL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Preliminary
0346
0348
034A
034C
034E
C1TX2B2
C1TX2B3
C1TX2B4
C1TX2CON
Legend:
—
—
—
—
—
Transmit Buffer 1 Extended Identifier <5:0>
Transmit Buffer 1 Extended Identifier
<17:14>
—
—
—
—
—
—
—
Transmit Buffer 1 Standard Identifier <10:6>
—
Transmit Buffer 2 Byte 7
Transmit Buffer 2 Byte 5
Transmit Buffer 2 Byte 3
Transmit Buffer 2 Byte 1
Transmit Buffer 2 Extended Identifier <5:0>
Transmit Buffer 2 Extended Identifier
<17:14>
u = uninitialized bit
0354
0344
C1TX2DLC
C1TX2B1
C1TX1DLC
0342
C1TX2EID
0350
0340
C1TX2SID
0352
Transmit Buffer 2 Standard Identifier <10:6>
C1RXM1EIDL 033C
C1TX1EID
Receive Acceptance Mask 1 Extended Identifier <5:0>
C1RXM1EIDH 033A
C1TX1SID
—
0338
C1RXM1SID
—
—
—
—
—
0334
C1RXM0EIDL
—
—
Receive Acceptance Mask 0 Extended Identifier <5:0>
—
—
C1RXM0EIDH 0332
—
—
0330
C1RXM0SID
—
Receive Acceptance Filter 5 Extended Identifier <5:0>
032C
C1RXF5EIDL
—
—
—
—
—
—
0328
—
Receive Acceptance Filter 4 Extended Identifier <5:0>
—
—
—
—
Receive Acceptance Filter 2 Extended Identifier <5:0>
—
—
—
—
C1RXF5EIDH 032A
C1RXF5SID
—
0308
C1RXF1EIDH 030A
—
Receive Acceptance Filter 0 Extended Identifier <5:0>
—
C1RXF1SID
—
0304
—
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TXRTR
—
—
—
TXRTR
—
—
—
—
—
—
—
—
—
—
—
—
TXRB1
—
—
—
TXRB1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit 2
TXABT TXLARB TXERR
TXREQ
Transmit Buffer 2 Byte 6
Transmit Buffer 2 Byte 4
Transmit Buffer 2 Byte 2
Transmit Buffer 2 Byte 0
DLC<3:0>
DLC<3:0>
—
Transmit Buffer 1 Extended Identifier <13:6>
—
—
Transmit Buffer 2 Extended Identifier <13:6>
Transmit Buffer 1 Standard Identifier <5:0>
TXRB0
—
—
Transmit Buffer 2 Standard Identifier <5:0>
TXRB0
—
Receive Acceptance Mask 1 Extended Identifier <17:6>
Receive Acceptance Mask 1 Standard Identifier <10:0>
—
—
Receive Acceptance Mask 0 Extended Identifier <17:6>
Receive Acceptance Mask 0 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 5 Extended Identifier <17:6>
Receive Acceptance Filter 5 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 4 Extended Identifier <17:6>
Receive Acceptance Filter 4 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 3 Extended Identifier <17:6>
Receive Acceptance Filter 3 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 2 Extended Identifier <17:6>
Receive Acceptance Filter 2 Standard Identifier <10:0>
—
Bit 3
Receive Acceptance Filter 1 Extended Identifier <17:6>
Receive Acceptance Filter 1 Standard Identifier <10:0>
—
Bit 4
Receive Acceptance Filter 0 Extended Identifier <17:6>
Receive Acceptance Filter 0 Standard Identifier <10:0>
Bit 10
C1RXF0EIDL
—
Bit 11
0300
—
Bit 12
0302
—
Bit 13
C1RXF0SID
Bit 14
Bit 15
CAN1 REGISTER MAP
Addr.
C1RXF0EIDH
SFR Name
TABLE 17-1:
—
SRR
Reset State
0000 uuuu uuuu uuuu
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
—
—
uuuu uuuu uuuu u000
uuuu 0000 uuuu uuuu
TXIDE uuuu u000 uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu u000
uuuu 0000 uuuu uuuu
TXIDE uuuu u000 uuuu uuuu
—
MIDE
—
MIDE
—
EXIDE 000u uuuu uuuu uu0u
—
EXIDE 000u uuuu uuuu uu0u
—
EXIDE 000u uuuu uuuu uu0u
—
EXIDE 000u uuuu uuuu uu0u
—
EXIDE 000u uuuu uuuu uu0u
—
EXIDE 000u uuuu uuuu uu0u
Bit 0
TXPRI<1:0>
—
SRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit 1
dsPIC30F
 2004 Microchip Technology Inc.
 2004 Microchip Technology Inc.
Preliminary
C1CFG2
CANCAP
Legend:
u = uninitialized bit
—
—
—
—
—
—
—
—
Receive Buffer 1 Byte 7
Receive Buffer 1 Byte 5
Receive Buffer 1 Byte 3
—
RX1OVR
—
TXEP
—
—
ABAT
—
RXEP
—
—
CANCKS
—
—
—
—
—
—
—
TXRB1
—
—
—
Bit 8
—
—
SEG2PH<2:0>
—
REQOP<2:0>
—
—
—
—
—
DLC<3:0>
TXABT TXLARB TXERR
RXFUL
—
—
—
—
—
RXRTRRO
Receive Buffer 1 Byte 6
Receive Buffer 1 Byte 4
Receive Buffer 1 Byte 2
Receive Buffer 1 Byte 0
RXRB0
—
—
IVRIE
IVRIF
SEG2PHTS
WAKIE
WAKIF
SAM
SJW<1:0>
—
—
RXRB0
—
TX2IF
TX2IE
SRR
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu u000
uuuu 0000 uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu 000u uuuu
0000 uuuu uuuu uuuu
RXIDE 000u uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu 000u uuuu
0000 uuuu uuuu uuuu
RXIDE 000u uuuu uuuu uuuu
FILHIT<2:0>
DLC<3:0>
TX1IF
TX1IE
TX0IE
TX0IF
RX1E
RX1IF
—
0u00 0uuu uuuu uuuu
0000 0000 0000 0000
0000 0100 1000 0000
0000 0000 0000 0000
RX0IE 0000 0000 0000 0000
RX0IF 0000 0000 0000 0000
PRSEG<2:0>
ICODE<2:0>
BRP<5:0>
Receive Error Count Register
ERRIE
SRR
Reset State
uuuu uuuu uuuu uuuu
TXIDE uuuu u000 uuuu uuuu
TXPRI<1:0>
—
SRR
DLC<3:0>
—
—
Bit 0
TXPRI<1:0>
Bit 1
RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
SEG1PH<2:0>
—
—
Receive Buffer 0 Byte 6
Receive Buffer 0 Byte 4
Receive Buffer 0 Byte 2
Receive Buffer 0 Byte 0
ERRIF
OPMODE<2:0>
RXFUL
—
TXREQ
Transmit Buffer 0 Byte 6
Transmit Buffer 0 Byte 4
Transmit Buffer 0 Byte 2
Transmit Buffer 0 Byte 0
Receive Buffer 0 Extended Identifier <17:6>
RXRTR RXRB1
TXREQ
Transmit Buffer 1 Byte 6
Transmit Buffer 1 Byte 4
Bit 2
Transmit Buffer 0 Extended Identifier <13:6>
Receive Buffer 0 Standard Identifier <10:0>
—
—
Bit 3
Transmit Buffer 1 Byte 2
Receive Buffer 1 Extended Identifier <17:6>
RXRTR RXRB1
—
Bit 4
Transmit Buffer 1 Byte 0
Bit 5
TXABT TXLARB TXERR
Bit 6
Transmit Buffer 0 Standard Identifier <5:0>
TXRB0
—
Bit 7
Receive Buffer 1 Standard Identifier <10:0>
—
TXRTR
—
—
—
Bit 9
TXWAR RXWAR EWARN
Transmit Error Count Register
—
TXBO
—
—
CSIDLE
—
—
Receive Buffer 0 Byte 7
Receive Buffer 0 Byte 5
Receive Buffer 0 Byte 3
Receive Buffer 0 Byte 1
—
039A
0392
—
—
Receive Buffer 1 Byte 1
—
C1EC
0390
C1CTRL
C1CFG1
—
RX0OVR
038E
C1RX0CON
0398
038C
C1RX0B4
0396
038A
C1RX0B3
—
—
—
Transmit Buffer 0 Byte 7
Transmit Buffer 0 Byte 5
Transmit Buffer 0 Byte 3
Transmit Buffer 0 Byte 1
Receive Buffer 0 Extended Identifier <5:0>
—
—
—
—
—
—
C1INTF
0388
C1RX0B2
—
Receive Buffer 1 Extended Identifier <5:0>
—
—
—
—
—
—
C1INTE
0386
C1RX0B1
—
Transmit Buffer 0 Extended Identifier <5:0>
WAKFIL
0384
C1RX0DLC
—
Transmit Buffer 1 Byte 7
—
—
0382
C1RX0EID
Transmit Buffer 1 Byte 3
Bit 10
—
0394
0380
C1RX0SID
Bit 11
Transmit Buffer 1 Byte 5
Transmit Buffer 0 Extended Identifier
<17:14>
—
037E
C1RX1CON
Bit 12
Transmit Buffer 1 Byte 1
Bit 13
—
—
Bit 14
Transmit Buffer 0 Standard Identifier <10:6>
—
Bit 15
CAN1 REGISTER MAP (CONTINUED)
—
037C
0370
C1RX1SID
C1RX1B4
036E
C1TX0CON
037A
036C
C1TX0B4
C1RX1B3
036A
C1TX0B3
0378
0368
C1TX0B2
0376
0366
C1TX0DLC
C1TX0B1
C1RX1B2
0364
C1TX0EID
C1RX1B1
0362
C1TX0SID
0374
0360
C1TX1CON
C1RX1DLC
035E
C1TX1B4
0372
035C
C1TX1B3
C1RX1EID
0358
035A
C1TX1B2
0356
Addr.
C1TX1B1
SFR Name
TABLE 17-1:
dsPIC30F
DS70083G-page 131
DS70083G-page 132
Preliminary
0414
—
—
—
—
—
—
Bit 13
—
Bit 12
Bit 11
Bit 10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Transmit Buffer 2 Byte 7
Transmit Buffer 2 Byte 5
Transmit Buffer 2 Byte 3
Transmit Buffer 2 Byte 1
—
Transmit Buffer 1 Extended Identifier <5:0>
Transmit Buffer 1 Extended Identifier
<17:14>
Transmit Buffer 1 Standard Identifier <10:6>
—
—
Transmit Buffer 2 Extended Identifier <5:0>
Transmit Buffer 2 Extended Identifier
<17:14>
Transmit Buffer 2 Standard Identifier <10:6>
—
—
—
—
—
Receive Acceptance Mask 1 Extended Identifier <5:0>
—
—
Receive Acceptance Mask 0 Extended Identifier <5:0>
—
—
Receive Acceptance Filter 5 Extended Identifier <5:0>
—
—
Receive Acceptance Filter 4 Extended Identifier <5:0>
—
—
Receive Acceptance Filter 3 Extended Identifier <5:0>
—
—
Receive Acceptance Filter 2 Extended Identifier <5:0>
—
—
Receive Acceptance Filter 1 Extended Identifier <5:0>
—
—
Receive Acceptance Filter 0 Extended Identifier <5:0>
Bit 14
Bit 15
CAN2 REGISTER MAP
u = uninitialized bit
C2TX1DLC
Legend:
0410
040E
C2TX2CON
0412
040C
C2TX2B4
C2TX1SID
040A
C2TX2B3
C2TX1EID
0408
C2TX2B2
C2TX2EID
0404
0402
C2TX2SID
0406
0400
C2RXM1EIDL
C2TX2B1
03FC
C2RXM1EIDH
C2TX2DLC
03F8
03FA
C2RXM1SID
03F2
03F4
C2RXM0EIDH
03F0
C2RXM0SID
C2RXM0EIDL
03EA
03EC
C2RXF5EIDH
03E8
C2RXF5SID
C2RXF5EIDL
03E2
03E4
C2RXF4EIDH
03E0
C2RXF4SID
C2RXF4EIDL
03DA
03DC
C2RXF3EIDH
03D8
C2RXF3SID
C2RXF3EIDL
03D2
03D4
C2RXF2EIDH
03D0
C2RXF2SID
C2RXF2EIDL
03CA
03CC
C2RXF1EIDH
03C8
C2RXF1SID
C2RXF1EIDL
03C2
03C4
C2RXF0EIDH
03C0
C2RXF0EIDL
Addr.
SFR Name
C2RXF0SID
TABLE 17-2:
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TXRTR
—
—
—
TXRTR
—
—
—
—
—
—
—
TXRB1
—
—
—
TXRB1
—
—
—
TXRB0
—
TXRB0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit 2
TXLARB
TXERR
TXREQ
—
—
DLC<3:0>
—
Transmit Buffer 1 Extended Identifier <13:6>
Transmit Buffer 1 Standard Identifier <5:0>
TXABT
Transmit Buffer 2 Byte 6
Transmit Buffer 2 Byte 4
Transmit Buffer 2 Byte 2
Transmit Buffer 2 Byte 0
DLC<3:0>
Transmit Buffer 2 Extended Identifier <13:6>
Transmit Buffer 2 Standard Identifier <5:0>
—
Receive Acceptance Mask 1 Extended Identifier <17:6>
—
Receive Acceptance Mask 0 Extended Identifier <17:6>
—
Receive Acceptance Mask 1 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 5 Extended Identifier <17:6>
—
Receive Acceptance Mask 0 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 4 Extended Identifier <17:6>
—
Receive Acceptance Filter 5 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 3 Extended Identifier <17:6>
—
Receive Acceptance Filter 4 Standard Identifier <10:0>
—
—
Receive Acceptance Filter 2 Extended Identifier <17:6>
—
Receive Acceptance Filter 3 Standard Identifier <10:0>
—
—
—
Bit 3
Receive Acceptance Filter 1 Extended Identifier <17:6>
—
Receive Acceptance Filter 2 Standard Identifier <10:0>
—
Bit 4
Receive Acceptance Filter 0 Extended Identifier <17:6>
—
Receive Acceptance Filter 1 Standard Identifier <10:0>
—
Receive Acceptance Filter 0 Standard Identifier <10:0>
Bit 0
—
TXIDE
—
MIDE
—
MIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
SRR
—
TXIDE
TXPRI<1:0>
—
SRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit 1
Reset State
uuuu uuuu uuuu u000
uuuu 0000 uuuu uuuu
uuuu u000 uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu u000
uuuu 0000 uuuu uuuu
uuuu u000 uuuu uuuu
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
000u uuuu uuuu uu0u
dsPIC30F
 2004 Microchip Technology Inc.
 2004 Microchip Technology Inc.
Preliminary
—
Bit 14
—
Bit 12
Bit 11
—
—
Transmit Buffer 1 Byte 7
Transmit Buffer 1 Byte 5
Transmit Buffer 1 Byte 3
Transmit Buffer 1 Byte 1
Bit 13
—
RX0OVR
—
—
CANCAP
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TXEP
—
—
ABAT
—
—
RXEP
—
—
CANCKS
—
—
—
—
—
RXWAR
—
—
RXRB1
—
EWARN
—
—
RXRB1
SEG2PH<2:0>
—
—
TXRB0
—
Bit 7
Bit 4
Transmit Buffer 1 Byte 2
TXLARB
TXERR
RXFUL
TXABT
—
—
TXERR
—
—
—
SEG2PHTS
IVRIE
WAKIE
WAKIF
SAM
SJW<1:0>
IVRIF
—
RXRB0
TX2IE
TX1IE
TX1IF
Receive Error Count Register
ERRIE
TX2IF
SRR
SRR
TX0IE
RXIDE
RX1E
RX1IF
RX0IE
RX0IF
—
FILHIT0
RXIDE
PRSEG<2:0>
JTOFF
DLC<3:0>
TX0IF
BRP<5:0>
—
TXIDE
TXPRI<1:0>
—
SRR
FILHIT<2:0>
ICODE<2:0>
Bit 0
TXPRI<1:0>
Bit 1
DLC<3:0>
—
—
RXRTRRO DBEN
SEG1PH<2:0>
—
—
Receive Buffer 0 Byte 6
Receive Buffer 0 Byte 4
Receive Buffer 0 Byte 2
Receive Buffer 0 Byte 0
ERRIF
—
—
RXRTRRO
Receive Buffer 1 Byte 6
Receive Buffer 1 Byte 4
Receive Buffer 1 Byte 2
Receive Buffer 1 Byte 0
RXRB0
TXREQ
Transmit Buffer 0 Byte 6
Transmit Buffer 0 Byte 4
Transmit Buffer 0 Byte 2
Transmit Buffer 0 Byte 0
DLC<3:0>
TXLARB
OPMODE<2:0>
RXFUL
—
—
Bit 2
Transmit Buffer 0 Extended Identifier <13:6>
Receive Buffer 0 Extended Identifier <17:6>
—
TXREQ
Transmit Buffer 1 Byte 6
Transmit Buffer 1 Byte 4
Receive Buffer 1 Extended Identifier <17:6>
—
Bit 3
Transmit Buffer 1 Byte 0
Bit 5
Transmit Buffer 0 Standard Identifier <5:0>
TXABT
Bit 6
Receive Buffer 0 Standard Identifier <10:0>
RXRTR
—
—
TXRB1
—
—
—
Bit 8
Receive Buffer 1 Standard Identifier <10:0>
RXRTR
—
TXRTR
—
—
—
Bit 9
REQOP<2:0>
TXWAR
Transmit Error Count Register
—
TXBO
—
—
CSIDLE
—
—
—
—
—
—
Bit 10
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
—
RX1OVR
WAKFIL
—
—
—
Receive Buffer 0 Byte 7
Receive Buffer 0 Byte 5
Receive Buffer 0 Byte 3
Receive Buffer 0 Byte 1
Receive Buffer 0 Extended Identifier <5:0>
—
—
—
Receive Buffer 1 Byte 7
Receive Buffer 1 Byte 5
Receive Buffer 1 Byte 3
Receive Buffer 1 Byte 1
Receive Buffer 1 Extended Identifier <5:0>
—
—
—
Transmit Buffer 0 Byte 7
Transmit Buffer 0 Byte 5
Transmit Buffer 0 Byte 3
Transmit Buffer 0 Byte 1
Transmit Buffer 0 Extended Identifier <5:0>
Transmit Buffer 0 Extended Identifier
<17:14>
Transmit Buffer 0 Standard Identifier <10:6>
—
Bit 15
CAN2 REGISTER MAP (CONTINUED)
u = uninitialized bit
045A
C2EC
Legend:
0458
0452
C2CFG1
C2INTE
0450
C2CTRL
0454
044E
C2RX0CON
0456
044C
C2RX0B4
C2CFG2
044A
C2RX0B3
C2INTF
0448
0440
C2RX0SID
C2RX0B2
043E
C2RX1CON
0446
043C
C2RX1B4
C2RX0B1
043A
C2RX1B3
0442
0438
C2RX1B2
0444
0436
C2RX1B1
C2RX0DLC
0434
C2RX1DLC
C2RX0EID
0430
042E
C2TX0CON
0432
042C
C2TX0B4
C2RX1SID
042A
C2TX0B3
C2RX1EID
0428
C2TX0EID
C2TX0B2
0422
C2TX0SID
0424
0420
C2TX1CON
0426
041E
C2TX1B4
C2TX0B1
041C
C2TX1B3
C2TX0DLC
0418
041A
C2TX1B2
0416
Addr.
C2TX1B1
SFR Name
TABLE 17-2:
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0u00 0uuu uuuu uuuu
0000 0000 0000 0000
0000 0100 1000 0000
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu 000u uuuu
0000 uuuu uuuu uuuu
000u uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu 000u uuuu
0000 uuuu uuuu uuuu
000u uuuu uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu u000
uuuu 0000 uuuu uuuu
uuuu u000 uuuu uuuu
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
dsPIC30F
DS70083G-page 133
dsPIC30F
NOTES:
DS70083G-page 134
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
18.0
DATA CONVERTER
INTERFACE (DCI) MODULE
18.2.3
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
18.1
Module Introduction
The dsPIC30F Data Converter Interface (DCI) module
allows simple interfacing of devices, such as audio
coder/decoders (Codecs), A/D converters and D/A
converters. The following interfaces are supported:
• Framed Synchronous Serial Transfer (Single or
Multi-Channel)
• Inter-IC Sound (I2S) Interface
• AC-Link Compliant mode
• Programmable word size up to 16 bits
• Support for up to 16 time slots, for a maximum
frame size of 256 bits
• Data buffering for up to 4 samples without CPU
overhead
18.2
The serial data input (CSDI) pin is configured as an
input only pin when the module is enabled.
18.2.3.1
The DCI module accesses the shadow registers while
the CPU is in the process of accessing the memory
mapped buffer registers.
BUFFER DATA ALIGNMENT
Data values are always stored left justified in the buffers since most Codec data is represented as a signed
2’s complement fractional number. If the received word
length is less than 16 bits, the unused LS bits in the
receive buffer registers are set to ‘0’ by the module. If
the transmitted word length is less than 16 bits, the
unused LS bits in the transmit buffer register are
ignored by the module. The word length setup is
described in subsequent sections of this document.
18.2.5
Module I/O Pins
COFS PIN
The Codec frame synchronization (COFS) pin is used
to synchronize data transfers that occur on the CSDO
and CSDI pins. The COFS pin may be configured as an
input or an output. The data direction for the COFS pin
is determined by the COFSD control bit in the
DCICON1 register.
18.2.4
The DCI module provides the following general
features:
CSDI PIN
TRANSMIT/RECEIVE SHIFT
REGISTER
There are four I/O pins associated with the module.
When enabled, the module controls the data direction
of each of the four pins.
The DCI module has a 16-bit shift register for shifting
serial data in and out of the module. Data is shifted in/
out of the shift register MS bit first, since audio PCM
data is transmitted in signed 2’s complement format.
18.2.1
18.2.6
CSCK PIN
The CSCK pin provides the serial clock for the DCI
module. The CSCK pin may be configured as an input
or output using the CSCKD control bit in the DCICON2
SFR. When configured as an output, the serial clock is
provided by the dsPIC30F. When configured as an
input, the serial clock must be provided by an external
device.
18.2.2
CSDO PIN
The serial data output (CSDO) pin is configured as an
output only pin when the module is enabled. The
CSDO pin drives the serial bus whenever data is to be
transmitted. The CSDO pin is tri-stated or driven to ‘0’
during CSCK periods when data is not transmitted,
depending on the state of the CSDOM control bit. This
allows other devices to place data on the serial bus
during transmission periods not used by the DCI
module.
 2004 Microchip Technology Inc.
DCI BUFFER CONTROL
The DCI module contains a buffer control unit for transferring data between the shadow buffer memory and
the serial shift register. The buffer control unit is a simple 2-bit address counter that points to word locations
in the shadow buffer memory. For the receive memory
space (high address portion of DCI buffer memory), the
address counter is concatenated with a ‘0’ in the MSb
location to form a 3-bit address. For the transmit memory space (high portion of DCI buffer memory), the
address counter is concatenated with a ‘1’ in the MSb
location.
Note:
Preliminary
The DCI buffer control unit always
accesses the same relative location in the
transmit and receive buffers, so only one
address counter is provided.
DS70083G-page 135
dsPIC30F
FIGURE 18-1:
DCI MODULE BLOCK DIAGRAM
BCG Control bits
SCKD
FOSC/4
Sample Rate
CSCK
Generator
FSD
Word Size Selection bits
Frame Length Selection bits
16-bit Data Bus
DCI Mode Selection bits
Frame
Synchronization
Generator
COFS
Receive Buffer
Registers w/Shadow
DCI Buffer
Control Unit
15
Transmit Buffer
Registers w/Shadow
0
DCI Shift Register
CSDI
CSDO
DS70083G-page 136
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
18.3
18.3.1
18.3.4
DCI Module Operation
MODULE ENABLE
The DCI module is enabled or disabled by setting/
clearing the DCIEN control bit in the DCICON1 SFR.
Clearing the DCIEN control bit has the effect of resetting the module. In particular, all counters associated
with CSCK generation, frame sync, and the DCI buffer
control unit are reset.
FRAME SYNC MODE
CONTROL BITS
The type of frame sync signal is selected using the
Frame
Synchronization
mode
control
bits
(COFSM<1:0>) in the DCICON1 SFR. The following
operating modes can be selected:
The DCI clocks are shutdown when the DCIEN bit is
cleared.
•
•
•
•
When enabled, the DCI controls the data direction for
the four I/O pins associated with the module. The Port,
LAT and TRIS register values for these I/O pins are
overridden by the DCI module when the DCIEN bit is set.
The operation of the COFSM control bits depends on
whether the DCI module generates the frame sync
signal as a master device, or receives the frame sync
signal as a slave device.
It is also possible to override the CSCK pin separately
when the bit clock generator is enabled. This permits
the bit clock generator to operate without enabling the
rest of the DCI module.
The master device in a DSP/Codec pair is the device
that generates the frame sync signal. The frame sync
signal initiates data transfers on the CSDI and CSDO
pins and usually has the same frequency as the data
sample rate (COFS).
18.3.2
The DCI module is a frame sync master if the COFSD
control bit is cleared and is a frame sync slave if the
COFSD control bit is set.
WORD SIZE SELECTION BITS
The WS<3:0> word size selection bits in the DCICON2
SFR determine the number of bits in each DCI data
word. Essentially, the WS<3:0> bits determine the
counting period for a 4-bit counter clocked from the
CSCK signal.
Any data length, up to 16-bits, may be selected. The
value loaded into the WS<3:0> bits is one less the
desired word length. For example, a 16-bit data word
size is selected when WS<3:0> = 1111.
Note:
18.3.3
These WS<3:0> control bits are used only
in the Multi-Channel and I2S modes. These
bits have no effect in AC-Link mode since
the data slot sizes are fixed by the protocol.
FRAME SYNC GENERATOR
The frame sync generator (COFSG) is a 4-bit counter
that sets the frame length in data words. The frame
sync generator is incremented each time the word size
counter is reset (refer to Section 18.3.2). The period for
the frame synchronization generator is set by writing
the COFSG<3:0> control bits in the DCICON2 SFR.
The COFSG period in clock cycles is determined by the
following formula:
EQUATION 18-1:
COFSG PERIOD
Frame Length = Word Length • (FSG Value + 1)
Frame lengths, up to 16 data words, may be selected.
The frame length in CSCK periods can vary up to a
maximum of 256 depending on the word size that is
selected.
Note:
Multi-Channel mode
I2S mode
AC-Link mode (16-bit)
AC-Link mode (20-bit)
18.3.5
MASTER FRAME SYNC
OPERATION
When the DCI module is operating as a frame sync
master device (COFSD = 0), the COFSM mode bits
determine the type of frame sync pulse that is
generated by the frame sync generator logic.
A new COFS signal is generated when the frame sync
generator resets to ‘0’.
In the Multi-Channel mode, the frame sync pulse is
driven high for the CSCK period to initiate a data transfer. The number of CSCK cycles between successive
frame sync pulses will depend on the word size and
frame sync generator control bits. A timing diagram for
the frame sync signal in Multi-Channel mode is shown
in Figure 18-2.
In the AC-Link mode of operation, the frame sync signal has a fixed period and duty cycle. The AC-Link
frame sync signal is high for 16 CSCK cycles and is low
for 240 CSCK cycles. A timing diagram with the timing
details at the start of an AC-Link frame is shown in
Figure 18-3.
In the I2S mode, a frame sync signal having a 50% duty
cycle is generated. The period of the I2S frame sync
signal in CSCK cycles is determined by the word size
and frame sync generator control bits. A new I2S data
transfer boundary is marked by a high-to-low or a
low-to-high transition edge on the COFS pin.
The COFSG control bits will have no effect
in AC-Link mode since the frame length is
set to 256 CSCK periods by the protocol.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 137
dsPIC30F
18.3.6
SLAVE FRAME SYNC OPERATION
When the DCI module is operating as a frame sync
slave (COFSD = 1), data transfers are controlled by the
Codec device attached to the DCI module. The
COFSM control bits control how the DCI module
responds to incoming COFS signals.
In the Multi-Channel mode, a new data frame transfer
will begin one CSCK cycle after the COFS pin is sampled high (see Figure 18-2). The pulse on the COFS
pin resets the frame sync generator logic.
FIGURE 18-2:
In the I2S mode, a new data word will be transferred
one CSCK cycle after a low-to-high or a high-to-low
transition is sampled on the COFS pin. A rising or falling edge on the COFS pin resets the frame sync
generator logic.
In the AC-Link mode, the tag slot and subsequent data
slots for the next frame will be transferred one CSCK
cycle after the COFS pin is sampled high.
The COFSG and WS bits must be configured to provide the proper frame length when the module is operating in the Slave mode. Once a valid frame sync pulse
has been sampled by the module on the COFS pin, an
entire data frame transfer will take place. The module
will not respond to further frame sync pulses until the
data frame transfer has completed.
FRAME SYNC TIMING, MULTI-CHANNEL MODE
CSCK
COFS
CSDI/CSDO
FIGURE 18-3:
MSB
LSB
FRAME SYNC TIMING, AC-LINK START OF FRAME
BIT_CLK
CSDO or CSDI
S12 S12 S12 Tag Tag Tag
bit 2 bit 1 LSb MSb bit 14 bit 13
SYNC
FIGURE 18-4:
I2S INTERFACE FRAME SYNC TIMING
CSCK
CSDI or CSDO
MSB
LSB MSB
LSB
WS
Note:
A 5-bit transfer is shown here for illustration purposes. The I2S protocol does not specify word length - this will
be system dependent.
DS70083G-page 138
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
18.3.7
18.3.8
BIT CLOCK GENERATOR
The DCI module has a dedicated 12-bit time base that
produces the bit clock. The bit clock rate (period) is set
by writing a non-zero 12-bit value to the BCG<11:0>
control bits in the DCICON1 SFR.
When the BCG<11:0> bits are set to zero, the bit clock
will be disabled. If the BCG<11:0> bits are set to a nonzero value, the bit clock generator is enabled. These
bits should be set to ‘0’ and the CSCKD bit set to ‘1’ if
the serial clock for the DCI is received from an external
device.
SAMPLE CLOCK EDGE
CONTROL BIT
The sample clock edge (CSCKE) control bit determines
the sampling edge for the CSCK signal. If the CSCK bit
is cleared (default), data will be sampled on the falling
edge of the CSCK signal. The AC-Link protocols and
most Multi-Channel formats require that data be sampled on the falling edge of the CSCK signal. If the
CSCK bit is set, data will be sampled on the rising edge
of CSCK. The I2S protocol requires that data be
sampled on the rising edge of the CSCK signal.
The formula for the bit clock frequency is given in
Equation 18-2.
18.3.9
EQUATION 18-2:
In most applications, the data transfer begins one
CSCK cycle after the COFS signal is sampled active.
This is the default configuration of the DCI module. An
alternate data alignment can be selected by setting the
DJST control bit in the DCICON2 SFR. When DJST = 1,
data transfers will begin during the same CSCK cycle
when the COFS signal is sampled active.
BIT CLOCK FREQUENCY
FBCK =
FCY
2 • (BCG + 1)
The required bit clock frequency will be determined by
the system sampling rate and frame size. Typical bit
clock frequencies range from 16x to 512x the converter
sample rate depending on the data converter and the
communication protocol that is used.
To achieve bit clock frequencies associated with common audio sampling rates, the user will need to select
a crystal frequency that has an ‘even’ binary value.
Examples of such crystal frequencies are listed in
Table 18-1.
TABLE 18-1:
DEVICE FREQUENCIES FOR
COMMON CODEC CSCK
FREQUENCIES
FOSC
PLL
FCYC
2.048 MHz
16x
32.768 MIPs
4.096 MHz
8x
32.768 MIPs
4.800 MHz
8x
38.4 MIPs
9.600 MHz
4x
38.4 MIPs
Note 1: When the CSCK signal is applied externally (CSCKD = 1), the BCG<11:0> bits
have no effect on the operation of the DCI
module.
2: When the CSCK signal is applied externally (CSCKD = 1), the external clock
high and low times must meet the device
timing requirements.
 2004 Microchip Technology Inc.
18.3.10
DATA JUSTIFICATION
CONTROL BIT
TRANSMIT SLOT ENABLE BITS
The TSCON SFR has control bits that are used to
enable up to 16 time slots for transmission. These control bits are the TSE<15:0> bits. The size of each time
slot is determined by the WS<3:0> word size selection
bits and can vary up to 16 bits.
If a transmit time slot is enabled via one of the TSE bits
(TSEx = 1), the contents of the current transmit shadow
buffer location will be loaded into the CSDO Shift register and the DCI buffer control unit is incremented to
point to the next location.
During an unused transmit time slot, the CSDO pin will
drive ‘0’s or will be tri-stated during all disabled time
slots depending on the state of the CSDOM bit in the
DCICON1 SFR.
The data frame size in bits is determined by the chosen
data word size and the number of data word elements
in the frame. If the chosen frame size has less than 16
elements, the additional slot enable bits will have no
effect.
Each transmit data word is written to the 16-bit transmit
buffer as left justified data. If the selected word size is
less than 16 bits, then the LS bits of the transmit buffer
memory will have no effect on the transmitted data. The
user should write ‘0’s to the unused LS bits of each
transmit buffer location.
Preliminary
DS70083G-page 139
dsPIC30F
18.3.11
RECEIVE SLOT ENABLE BITS
18.3.14
The RSCON SFR contains control bits that are used to
enable up to 16 time slots for reception. These control
bits are the RSE<15:0> bits. The size of each receive
time slot is determined by the WS<3:0> word size
selection bits and can vary from 1 to 16 bits.
If a receive time slot is enabled via one of the RSE bits
(RSEx = 1), the shift register contents will be written to
the current DCI receive shadow buffer location and the
buffer control unit will be incremented to point to the
next buffer location.
Data is not packed in the receive memory buffer locations if the selected word size is less than 16 bits. Each
received slot data word is stored in a separate 16-bit
buffer location. Data is always stored in a left justified
format in the receive memory buffer.
18.3.12
SLOT ENABLE BITS OPERATION
WITH FRAME SYNC
The TSE and RSE control bits operate in concert with
the DCI frame sync generator. In the Master mode, a
COFS signal is generated whenever the frame sync
generator is reset. In the Slave mode, the frame sync
generator is reset whenever a COFS pulse is received.
The TSE and RSE control bits allow up to 16 consecutive time slots to be enabled for transmit or receive.
After the last enabled time slot has been transmitted/
received, the DCI will stop buffering data until the next
occurring COFS pulse.
18.3.13
SYNCHRONOUS DATA
TRANSFERS
The amount of data that is buffered between interrupts
is determined by the buffer length (BLEN<1:0>) control
bits in the DCISTAT SFR. The size of the transmit and
receive buffers may be varied from 1 to 4 data words
using the BLEN control bits. The BLEN control bits are
compared to the current value of the DCI buffer control
unit address counter. When the 2 LS bits of the DCI
address counter match the BLEN<1:0> value, the
buffer control unit will be reset to ‘0’. In addition, the
contents of the receive shadow registers are transferred to the receive buffer registers and the contents
of the transmit buffer registers are transferred to the
transmit shadow registers.
18.3.15
BUFFER ALIGNMENT WITH DATA
FRAMES
There is no direct coupling between the position of the
AGU address pointer and the data frame boundaries.
This means that there will be an implied assignment of
each transmit and receive buffer that is a function of the
BLEN control bits and the number of enabled data slots
via the TSE and RSE control bits.
As an example, assume that a 4-word data frame is
chosen and that we want to transmit on all four time
slots in the frame. This configuration would be established by setting the TSE0, TSE1, TSE2, and TSE3
control bits in the TSCON SFR. With this module setup,
the TXBUF0 register would be naturally assigned to
slot #0, the TXBUF1 register would be naturally
assigned to slot #1, and so on.
Note:
The DCI buffer control unit will be incremented by one
word location whenever a given time slot has been
enabled for transmission or reception. In most cases,
data input and output transfers will be synchronized,
which means that a data sample is received for a given
channel at the same time a data sample is transmitted.
Therefore, the transmit and receive buffers will be filled
with equal amounts of data when a DCI interrupt is
generated.
In some cases, the amount of data transmitted and
received during a data frame may not be equal. As an
example, assume a two-word data frame is used. Furthermore, assume that data is only received during
slot #0 but is transmitted during slot #0 and slot #1. In
this case, the buffer control unit counter would be incremented twice during a data frame but only one receive
register location would be filled with data.
DS70083G-page 140
BUFFER LENGTH CONTROL
Preliminary
When more than four time slots are active
within a data frame, the user code must
keep track of which time slots are to be
read/written at each interrupt. In some
cases, the alignment between transmit/
receive buffers and their respective slot
assignments could be lost. Examples of
such cases include an emulation breakpoint or a hardware trap. In these situations, the user should poll the SLOT status
bits to determine what data should be
loaded into the buffer registers to
resynchronize the software with the DCI
module.
 2004 Microchip Technology Inc.
dsPIC30F
18.3.16
TRANSMIT STATUS BITS
18.3.19
There are two transmit status bits in the DCISTAT SFR.
The TMPTY bit is set when the contents of the transmit
buffer registers are transferred to the transmit shadow
registers. The TMPTY bit may be polled in software to
determine when the transmit buffer registers may be
written. The TMPTY bit is cleared automatically by the
hardware when a write to one of the four transmit
buffers occurs.
The TUNF bit is read only and indicates that a transmit
underflow has occurred for at least one of the transmit
buffer registers that is in use. The TUNF bit is set at the
time the transmit buffer registers are transferred to the
transmit shadow registers. The TUNF status bit is
cleared automatically when the buffer register that
underflowed is written by the CPU.
Note:
18.3.17
The transmit status bits only indicate status for buffer locations that are used by the
module. If the buffer length is set to less
than four words, for example, the unused
buffer locations will not affect the transmit
status bits.
RECEIVE STATUS BITS
There are two receive status bits in the DCISTAT SFR.
CSDO MODE BIT
The CSDOM control bit controls the behavior of the
CSDO pin during unused transmit slots. A given transmit time slot is unused if it’s corresponding TSEx bit in
the TSCON SFR is cleared.
If the CSDOM bit is cleared (default), the CSDO pin will
be low during unused time slot periods. This mode will
be used when there are only two devices attached to
the serial bus.
If the CSDOM bit is set, the CSDO pin will be tri-stated
during unused time slot periods. This mode allows multiple devices to share the same CSDO line in a multichannel application. Each device on the CSDO line is
configured so that it will only transmit data during
specific time slots. No two devices will transmit data
during the same time slot.
18.3.20
DIGITAL LOOPBACK MODE
Digital Loopback mode is enabled by setting the
DLOOP control bit in the DCISTAT SFR. When the
DLOOP bit is set, the module internally connects the
CSDO signal to CSDI. The actual data input on the
CSDI I/O pin will be ignored in Digital Loopback mode.
18.3.21
UNDERFLOW MODE CONTROL BIT
The ROV status bit is read only and indicates that a
receive overflow has occurred for at least one of the
receive buffer locations. A receive overflow occurs
when the buffer location is not read by the CPU before
new data is transferred from the shadow registers. The
ROV status bit is cleared automatically when the buffer
register that caused the overflow is read by the CPU.
When an underflow occurs, one of two actions may
occur depending on the state of the Underflow mode
(UNFM) control bit in the DCICON2 SFR. If the UNFM
bit is cleared (default), the module will transmit ‘0’s on
the CSDO pin during the active time slot for the buffer
location. In this Operating mode, the Codec device
attached to the DCI module will simply be fed digital
‘silence’. If the UNFM control bit is set, the module will
transmit the last data written to the buffer location. This
Operating mode permits the user to send continuous
data to the Codec device without consuming CPU
overhead.
When a receive overflow occurs for a specific buffer
location, the old contents of the buffer are overwritten.
18.4
The RFUL status bit is read only and indicates that new
data is available in the receive buffers. The RFUL bit is
cleared automatically when all receive buffers in use
have been read by the CPU.
Note:
18.3.18
The receive status bits only indicate status
for buffer locations that are used by the
module. If the buffer length is set to less
than four words, for example, the unused
buffer locations will not affect the transmit
status bits.
SLOT STATUS BITS
The SLOT<3:0> status bits in the DCISTAT SFR indicate the current active time slot. These bits will correspond to the value of the frame sync generator counter.
The user may poll these status bits in software when a
DCI interrupt occurs to determine what time slot data
was last received and which time slot data should be
loaded into the TXBUF registers.
 2004 Microchip Technology Inc.
DCI Module Interrupts
The frequency of DCI module interrupts is dependent
on the BLEN<1:0> control bits in the DCICON2 SFR.
An interrupt to the CPU is generated each time the set
buffer length has been reached and a shadow register
transfer takes place. A shadow register transfer is
defined as the time when the previously written TXBUF
values are transferred to the transmit shadow registers
and new received values in the receive shadow
registers are transferred into the RXBUF registers.
Preliminary
DS70083G-page 141
dsPIC30F
18.5
18.5.1
DCI Module Operation During CPU
Sleep and Idle Modes
DCI MODULE OPERATION DURING
CPU SLEEP MODE
The DCI module has the ability to operate while in
Sleep mode and wake the CPU when the CSCK signal
is supplied by an external device (CSCKD = 1). The
DCI module will generate an asynchronous interrupt
when a DCI buffer transfer has completed and the CPU
is in Sleep mode.
18.5.2
DCI MODULE OPERATION DURING
CPU IDLE MODE
If the DCISIDL control bit is cleared (default), the module will continue to operate normally even in Idle mode.
If the DCISIDL bit is set, the module will halt when Idle
mode is asserted.
18.6
AC-Link Mode Operation
The AC-Link protocol is a 256-bit frame with one 16-bit
data slot, followed by twelve 20-bit data slots. The DCI
module has two Operating modes for the AC-Link protocol. These Operating modes are selected by the
COFSM<1:0> control bits in the DCICON1 SFR. The
first AC-Link mode is called ‘16-bit AC-Link mode’ and
is selected by setting COFSM<1:0> = 10. The second
AC-Link mode is called ‘20-bit AC-Link mode’ and is
selected by setting COFSM<1:0> = 11.
18.6.1
16-BIT AC-LINK MODE
In the 16-bit AC-Link mode, data word lengths are
restricted to 16 bits. Note that this restriction only
affects the 20-bit data time slots of the AC-Link protocol. For received time slots, the incoming data is simply
truncated to 16 bits. For outgoing time slots, the 4 LS
bits of the data word are set to ‘0’ by the module. This
truncation of the time slots limits the A/D and DAC data
to 16 bits but permits proper data alignment in the
TXBUF and RXBUF registers. Each RXBUF and
TXBUF register will contain one data time slot value.
18.6.2
20-BIT AC-LINK MODE
The 20-bit AC-Link mode allows all bits in the data time
slots to be transmitted and received but does not maintain data alignment in the TXBUF and RXBUF
registers.
The 20-bit mode treats each 256-bit AC-Link frame as
sixteen, 16-bit time slots. In the 20-bit AC-Link mode,
the module operates as if COFSG<3:0> = 1111 and
WS<3:0> = 1111. The data alignment for 20-bit data
slots is ignored. For example, an entire AC-Link data
frame can be transmitted and received in a packed
fashion by setting all bits in the TSCON and RSCON
SFRs. Since the total available buffer length is 64 bits,
it would take 4 consecutive interrupts to transfer the
AC-Link frame. The application software must keep
track of the current AC-Link frame segment.
18.7
I2S Mode Operation
The DCI module is configured for I2S mode by writing
a value of ‘01’ to the COFSM<1:0> control bits in the
DCICON1 SFR. When operating in the I2S mode, the
DCI module will generate frame synchronization signals with a 50% duty cycle. Each edge of the frame
synchronization signal marks the boundary of a new
data word transfer.
The user must also select the frame length and data
word size using the COFSG and WS control bits in the
DCICON2 SFR.
18.7.1
I2S FRAME AND DATA WORD
LENGTH SELECTION
The WS and COFSG control bits are set to produce the
period for one half of an I2S data frame. That is, the
frame length is the total number of CSCK cycles
required for a left or a right data word transfer.
The BLEN bits must be set for the desired buffer length.
Setting BLEN<1:0> = 01 will produce a CPU interrupt,
once per I2S frame.
18.7.2
I2S DATA JUSTIFICATION
As per the I2S specification, a data word transfer will, by
default, begin one CSCK cycle after a transition of the
WS signal. A ‘MS bit left justified’ option can be
selected using the DJST control bit in the DCICON2
SFR.
If DJST = 1, the I2S data transfers will be MS bit left justified. The MS bit of the data word will be presented on
the CSDO pin during the same CSCK cycle as the rising or falling edge of the COFS signal. The CSDO pin
is tri-stated after the data word has been sent.
The 20-bit AC-Link mode functions similar to the MultiChannel mode of the DCI module, except for the duty
cycle of the frame synchronization signal. The AC-Link
frame synchronization signal should remain high for 16
CSCK cycles and should be low for the following
240 cycles.
DS70083G-page 142
Preliminary
 2004 Microchip Technology Inc.
—
—
DCIEN
—
0240
0242
0244
DCICON1
DCICON2
DCICON3
DCISTAT
0250
0252
0254
0256
0258
025A
025C
025E
u = uninitialized bit
RXBUF0
RXBUF1
RXBUF2
RXBUF3
TXBUF0
TXBUF1
TXBUF2
TXBUF3
Legend:
 2004 Microchip Technology Inc.
RSE13
TSE13
—
—
RSE12
TSE12
—
—
—
—
Bit 12
RSE11
TSE11
SLOT3
BLEN1
DLOOP
Bit 11
RSE10
TSE10
SLOT2
BLEN0
CSCKD
Bit 10
Bit 7
RSE8
TSE8
SLOT0
CSDOM
Bit 6
RSE7
TSE7
—
DJST
Bit 5
RSE6
TSE6
—
Transmit Buffer #3 Data Register
Transmit Buffer #2 Data Register
Transmit Buffer #1 Data Register
Transmit Buffer #0 Data Register
Receive Buffer #3 Data Register
Receive Buffer #2 Data Register
Receive Buffer #1 Data Register
RSE5
TSE5
—
BCG<11:0>
COFSG<3:0>
COFSD UNFM
Bit 8
Receive Buffer #0 Data Register
RSE9
TSE9
SLOT1
—
CSCKE
Bit 9
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
RSE14
TSE14
TSE15
RSE15
0248
024C
TSCON
—
—
0246
RSCON
—
—
—
DCISIDL
Bit 13
Bit 15
Addr.
SFR Name
Bit 14
DCI REGISTER MAP
TABLE 18-2:
TSE3
ROV
—
Bit 3
RSE4 RSE3
TSE4
—
—
—
Bit 4
RSE2
TSE2
RFUL
—
Bit 2
RSE1
TSE1
TUNF
WS<3:0>
COFSM1
Bit 1
Reset State
RSE0
TSE0
TMPTY
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
COFSM0 0000 0000 0000 0000
Bit 0
dsPIC30F
Preliminary
DS70083G-page 143
dsPIC30F
NOTES:
DS70083G-page 144
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
19.0
12-BIT ANALOG-TO-DIGITAL
CONVERTER (A/D) MODULE
The A/D module has six 16-bit registers:
•
•
•
•
•
•
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046).
The ADCON1, ADCON2 and ADCON3 registers control the operation of the A/D module. The ADCHS register selects the input channels to be converted. The
ADPCFG register configures the port pins as analog
inputs or as digital I/O. The ADCSSL register selects
inputs for scanning.
The 12-bit Analog-to-Digital converter (A/D) allows
conversion of an analog input signal to a 12-bit digital
number. This module is based on a Successive
Approximation Register (SAR) architecture and provides a maximum sampling rate of 100 ksps. The A/D
module has up to 16 analog inputs which are multiplexed into a sample and hold amplifier. The output of
the sample and hold is the input into the converter
which generates the result. The analog reference voltage is software selectable to either the device supply
voltage (AVDD/AVSS) or the voltage level on the
(VREF+/VREF-) pin. The A/D converter has a unique
feature of being able to operate while the device is in
Sleep mode with RC oscillator selection.
FIGURE 19-1:
A/D Control Register 1 (ADCON1)
A/D Control Register 2 (ADCON2)
A/D Control Register 3 (ADCON3)
A/D Input Select Register (ADCHS)
A/D Port Configuration Register (ADPCFG)
A/D Input Scan Selection Register (ADCSSL)
Note:
The SSRC<2:0>, ASAM, SMPI<3:0>,
BUFM and ALTS bits, as well as the
ADCON3 and ADCSSL registers, must
not be written to while ADON = 1. This
would lead to indeterminate results.
The block diagram of the 12-bit A/D module is shown in
Figure 19-1.
12-BIT A/D FUNCTIONAL BLOCK DIAGRAM
VREF+
AVDD
AVSS
VREF0000
0001
AN2
0010
AN3
0011
AN4
0100
AN5
0101
AN6
0110
AN7
0111
AN8
1000
AN9
1001
AN10
1010
AN11
1011
AN12
1100
AN13
1101
AN14
1110
AN15
Conversion Logic
16-word, 12-bit
Dual Port
Buffer
Sample/Sequence
Control
Sample
Input
Switches
Input Mux
Control
1111
CH0G
CH0R
 2004 Microchip Technology Inc.
12-bit SAR
Bus Interface
AN1
Comparator
DAC
Data Format
AN0
S/H
CH0
Preliminary
DS70083G-page 145
dsPIC30F
19.1
A/D Result Buffer
19.3
Selecting the Conversion
Sequence
The module contains a 16-word dual port read only
buffer, called ADCBUF0...ADCBUFF, to buffer the A/D
results. The RAM is 12 bits wide but the data obtained
is represented in one of four different 16-bit data formats. The contents of the sixteen A/D Conversion
Result Buffer registers, ADCBUF0 through ADCBUFF,
cannot be written by user software.
Several groups of control bits select the sequence in
which the A/D connects inputs to the sample/hold
channel, converts a channel, writes the buffer memory
and generates interrupts.
19.2
The SMPI bits select the number of acquisition/
conversion sequences that would be performed before
an interrupt occurs. This can vary from 1 sample per
interrupt to 16 samples per interrupt.
Conversion Operation
After the A/D module has been configured, the sample
acquisition is started by setting the SAMP bit. Various
sources, such as a programmable bit, timer time-outs
and external events, will terminate acquisition and start
a conversion. When the A/D conversion is complete,
the result is loaded into ADCBUF0...ADCBUFF, and
the DONE bit and the A/D interrupt flag ADIF are set after
the number of samples specified by the SMPI bit. The
ADC module can be configured for different interrupt
rates as described in Section 19.3.
The following steps should be followed for doing an
A/D conversion:
1.
2.
3.
4.
5.
6.
7.
Configure the A/D module:
• Configure analog pins, voltage reference and
digital I/O
• Select A/D input channels
• Select A/D conversion clock
• Select A/D conversion trigger
• Turn on A/D module
Configure A/D interrupt (if required):
• Clear ADIF bit
• Select A/D interrupt priority
Start sampling.
Wait the required acquisition time.
Trigger acquisition end, start conversion:
Wait for A/D conversion to complete, by either:
• Waiting for the A/D interrupt, or
• Waiting for the DONE bit to get set.
Read A/D result buffer, clear ADIF if required.
The sequence is controlled by the sampling clocks.
The BUFM bit will split the 16-word results buffer into
two 8-word groups. Writing to the 8-word buffers will be
alternated on each interrupt event.
Use of the BUFM bit will depend on how much time is
available for the moving of the buffers after the
interrupt.
If the processor can quickly unload a full buffer within
the time it takes to acquire and convert one channel,
the BUFM bit can be ‘0’ and up to 16 conversions (corresponding to the 16 input channels) may be done per
interrupt. The processor will have one acquisition and
conversion time to move the sixteen conversions.
If the processor cannot unload the buffer within the
acquisition and conversion time, the BUFM bit should be
‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,
then eight conversions will be loaded into 1/2 of the
buffer, following which an interrupt occurs. The next
eight conversions will be loaded into the other 1/2 of the
buffer. The processor will have the entire time between
interrupts to move the eight conversions.
The ALTS bit can be used to alternate the inputs
selected during the sampling sequence. The input
multiplexer has two sets of sample inputs: MUX A and
MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are
selected for sampling. If the ALTS bit is ‘1’ and
SMPI<3:0> = 0000 on the first sample/convert
sequence, the MUX A inputs are selected and on the
next acquire/convert sequence, the MUX B inputs are
selected.
The CSCNA bit (ADCON2<10>) will allow the multiplexer input to be alternately scanned across a
selected number of analog inputs for the MUX A group.
The inputs are selected by the ADCSSL register. If a
particular bit in the ADCSSL register is ‘1’, the corresponding input is selected. The inputs are always
scanned from lower to higher numbered inputs, starting
after each interrupt. If the number of inputs selected is
greater than the number of samples taken per interrupt,
the higher numbered inputs are unused.
DS70083G-page 146
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
19.4
Programming the Start of
Conversion Trigger
Example 19-1 shows a sample calculation for the
ADCS<5:0> bits, assuming a device operating speed
of 30 MIPS.
The conversion trigger will terminate acquisition and
start the requested conversions.
EXAMPLE 19-1:
The SSRC<2:0> bits select the source of the conversion trigger. The SSRC bits provide for up to 4 alternate
sources of conversion trigger.
When SSRC<2:0> = 000, the conversion trigger is
under software control. Clearing the SAMP bit will
cause the conversion trigger.
A/D CONVERSION CLOCK
CALCULATION
Minimum TAD = 667 nsec
TCY = 33 nsec (30 MIPS)
TAD
–1
TCY
667 nsec
=2•
–1
33 nsec
= 39.4
ADCS<5:0> = 2
When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under A/D clock control. The SAMC
bits select the number of A/D clocks between the start
of acquisition and the start of conversion. This provides
the fastest conversion rates on multiple channels.
SAMC must always be at least 1 clock cycle.
Therefore,
Set ADCS<5:0> = 40
Other trigger sources can come from timer modules or
external interrupts.
Actual TAD =
19.5
Aborting a Conversion
Clearing the ADON bit during a conversion will abort
the current conversion and stop the sampling sequencing until the next sampling trigger. The ADCBUF will not
be updated with the partially completed A/D conversion
sample. That is, the ADCBUF will continue to contain
the value of the last completed conversion (or the last
value written to the ADCBUF register).
TCY
(ADCS<5:0> + 1)
2
33 nsec
=
(40 + 1)
2
= 677 nsec
If the clearing of the ADON bit coincides with an autostart, the clearing has a higher priority and a new
conversion will not start.
After the A/D conversion is aborted, a 2 TAD wait is
required before the next sampling may be started by
setting the SAMP bit.
19.6
Selecting the A/D Conversion
Clock
The A/D conversion requires 15 TAD. The source of the
A/D conversion clock is software selected, using a
six-bit counter. There are 64 possible options for TAD.
EQUATION 19-1:
A/D CONVERSION CLOCK
TAD = TCY * (0.5*(ADCS<5:0> + 1))
The internal RC oscillator is selected by setting the
ADRC bit.
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
of 667 nsec (for VDD = 5V). Refer to the Electrical
Specifications section for minimum TAD under other
operating conditions.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 147
dsPIC30F
19.7
required to charge the capacitor CHOLD. The combined
impedance of the analog sources must therefore be
small enough to fully charge the holding capacitor
within the chosen sample time. To minimize the effects
of pin leakage currents on the accuracy of the A/D converter, the maximum recommended source impedance, RS, is 2.5 kΩ. After the analog input channel is
selected (changed), this sampling function must be
completed prior to starting the conversion. The internal
holding capacitor will be in a discharged state prior to
each sample operation.
A/D Acquisition Requirements
The analog input model of the 12-bit A/D converter
is shown in Figure 19-2. The total sampling time for the
A/D is a function of the internal amplifier settling time
and the holding capacitor charge time.
For the A/D converter to meet its specified accuracy,
the charge holding capacitor (CHOLD) must be allowed
to fully charge to the voltage level on the analog input
pin. The source impedance (RS), the interconnect
impedance (RIC), and the internal sampling switch
(RSS) impedance combine to directly affect the time
FIGURE 19-2:
12-BIT A/D CONVERTER ANALOG INPUT MODEL
VDD
Rs
VA
ANx
CPIN
RIC ≤ 250Ω
VT = 0.6V
Sampling
Switch
RSS ≤ 3 kΩ
RSS
VT = 0.6V
I leakage
± 500 nA
CHOLD
= DAC capacitance
= 18 pF
VSS
Legend: CPIN
= input capacitance
VT
= threshold voltage
I leakage = leakage current at the pin due to
various junctions
RIC
= interconnect resistance
RSS
= sampling switch resistance
CHOLD
= sample/hold capacitance (from DAC)
Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 2.5 kΩ.
DS70083G-page 148
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
19.8
Module Power-down Modes
The module has 2 internal Power modes.
When the ADON bit is ‘1’, the module is in Active mode;
it is fully powered and functional.
When ADON is ‘0’, the module is in Off mode. The digital and analog portions of the circuit are disabled for
maximum current savings.
In order to return to the Active mode from Off mode, the
user must wait for the ADC circuitry to stabilize.
19.9
19.9.1
A/D Operation During CPU Sleep
and Idle Modes
19.9.2
A/D OPERATION DURING CPU IDLE
MODE
The ADSIDL bit selects if the module will stop on Idle or
continue on Idle. If ADSIDL = 0, the module will continue operation on assertion of Idle mode. If ADSIDL =
1, the module will stop on Idle.
19.10 Effects of a Reset
A/D OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’.
If Sleep occurs in the middle of a conversion, the conversion is aborted. The converter will not continue with
a partially completed conversion on exit from Sleep
mode.
Register contents are not affected by the device
entering or leaving Sleep mode.
The A/D module can operate during Sleep mode if the
A/D clock source is set to RC (ADRC = 1). When the RC
clock source is selected, the A/D module waits one
instruction cycle before starting the conversion. This
allows the SLEEP instruction to be executed which eliminates all digital switching noise from the conversion.
When the conversion is complete, the CONV bit will be
cleared and the result loaded into the ADCBUF register.
FIGURE 19-3:
If the A/D interrupt is enabled, the device will wake-up
from Sleep. If the A/D interrupt is not enabled, the A/
D module will then be turned off, although the ADON bit
will remain set.
A device Reset forces all registers to their Reset state.
This forces the A/D module to be turned off, and any
conversion and sampling sequence is aborted. The values that are in the ADCBUF registers are not modified.
The A/D Result register will contain unknown data after
a Power-on Reset.
19.11 Output Formats
The A/D result is 12 bits wide. The data buffer RAM is
also 12 bits wide. The 12-bit data can be read in one of
four different formats. The FORM<1:0> bits select the
format. Each of the output formats translates to a 16-bit
result on the data bus. Write data will always be in right
justified (integer) format.
A/D OUTPUT DATA FORMATS
RAM Contents:
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Read to Bus:
Signed Fractional
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
Fractional
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
Signed Integer
Integer
 2004 Microchip Technology Inc.
d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Preliminary
DS70083G-page 149
dsPIC30F
19.12 Configuring Analog Port Pins
19.13 Connection Considerations
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be
converted.
The analog inputs have diodes to VDD and VSS as ESD
protection. This requires that the analog input be
between VDD and VSS. If the input voltage exceeds this
range by greater than 0.3V (either direction), one of the
diodes becomes forward biased and it may damage the
device if the input current specification is exceeded.
The A/D operation is independent of the state of the
CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.
An external RC filter is sometimes added for antialiasing of the input signal. The R component should be
selected to ensure that the sampling time requirements
are satisfied. Any external components connected (via
high impedance) to an analog input pin (capacitor,
zener diode, etc.) should have very little leakage
current at the pin.
When reading the Port register, all pins configured as
analog input channels will read as cleared.
Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a
digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
DS70083G-page 150
Preliminary
 2004 Microchip Technology Inc.
 2004 Microchip Technology Inc.
Preliminary
u = uninitialized bit
CSSL12
Bit 8
—
—
FORM<1:0>
Bit 9
CH0SB<3:0>
SAMC<4:0>
CSCNA
—
Bit 10
—
ADRC
BUFS
Bit 7
CSSL11
CSSL10 CSSL9
CSSL8
CSSL7
Bit 5
CSSL6
CSSL5
PCFG6 PCFG5
—
—
—
—
ADC Data Buffer 15
ADC Data Buffer 14
ADC Data Buffer 13
ADC Data Buffer 12
ADC Data Buffer 11
ADC Data Buffer 10
ADC Data Buffer 9
ADC Data Buffer 8
ADC Data Buffer 7
ADC Data Buffer 6
ADC Data Buffer 5
ADC Data Buffer 4
ADC Data Buffer 3
ADC Data Buffer 2
ADC Data Buffer 1
ADC Data Buffer 0
Bit 6
SSRC<2:0>
PCFG11 PCFG10 PCFG9 PCFG8 PCFG7
—
—
CH0NB
—
Bit 11
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit 12
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
CSSL15 CSSL14 CSSL13
Legend:
—
—
ADSIDL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bit 13
PCFG15 PCFG14 PCFG13 PCFG12
02A8
02AA
—
—
ADCSSL
02A6
ADCHS
—
VCFG<2:0>
—
ADPCFG
02A2
02A4
ADCON2
ADCON3
02A0
ADCON1
—
—
—
029E
ADCBUFF
ADON
—
—
ADCBUFE 029C
—
ADCBUFB
—
0294
ADCBUFA
—
—
ADCBUFD 029A
0292
ADCBUF9
—
—
—
0290
ADCBUF8
—
—
—
028E
ADCBUF7
—
—
ADCBUFC 0298
028C
ADCBUF6
—
—
—
028A
ADCBUF5
—
—
—
0288
ADCBUF4
—
—
0296
0286
ADCBUF3
—
—
—
—
Bit 14
—
0284
ADCBUF2
—
—
Bit 15
A/D CONVERTER REGISTER MAP
—
0280
0282
ADCBUF0
ADCBUF1
Addr.
SFR
Name
TABLE 19-1:
—
Bit 3
CSSL4
PCFG4
CH0NA
ASAM
Bit 2
BUFM
SAMP
Bit 1
CSSL3
CSSL2
CSSL1
PCFG3 PCFG2 PCFG1
CH0SA<3:0>
ADCS<5:0>
SMPI<3:0>
—
Bit 4
CSSL0
PCFG0
ALTS
DONE
Bit 0
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
0000 uuuu uuuu uuuu
Reset State
dsPIC30F
DS70083G-page 151
dsPIC30F
NOTES:
DS70083G-page 152
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
20.0
SYSTEM INTEGRATION
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
There are several features intended to maximize system reliability, minimize cost through elimination of
external components, provide Power Saving Operating
modes and offer code protection:
• Oscillator Selection
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
• Watchdog Timer (WDT)
• Power Saving Modes (Sleep and Idle)
• Code Protection
• Unit ID Locations
• In-Circuit Serial Programming (ICSP)
dsPIC30F devices have a Watchdog Timer which is
permanently enabled via the configuration bits or can
be software controlled. It runs off its own RC oscillator
for added reliability. There are two timers that offer
necessary delays on power-up. One is the Oscillator
Start-up Timer (OST), intended to keep the chip in
Reset until the crystal oscillator is stable. The other is
the Power-up Timer (PWRT) which provides a delay on
power-up only, designed to keep the part in Reset while
the power supply stabilizes. With these two timers onchip, most applications need no external Reset
circuitry.
 2004 Microchip Technology Inc.
Sleep mode is designed to offer a very low current
Power-down mode. The user can wake-up from Sleep
through external Reset, Watchdog Timer Wake-up, or
through an interrupt. Several oscillator options are also
made available to allow the part to fit a wide variety of
applications. In the Idle mode, the clock sources are
still active but the CPU is shut-off. The RC oscillator
option saves system cost while the LP crystal option
saves power.
20.1
Oscillator System Overview
The dsPIC30F oscillator system has the following
modules and features:
• Various external and internal oscillator options as
clock sources
• An on-chip PLL to boost internal operating
frequency
• A clock switching mechanism between various
clock sources
• Programmable clock postscaler for system power
savings
• A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
• Clock Control register (OSCCON)
• Configuration bits for main oscillator selection
Configuration bits determine the clock source upon
Power-on Reset (POR) and Brown-out Reset (BOR).
Thereafter, the clock source can be changed between
permissible clock sources. The OSCCON register
controls the clock switching and reflects system clock
related status bits.
Table 20-1 provides a summary of the dsPIC30F
Oscillator Operating modes. A simplified diagram of the
oscillator system is shown in Figure 20-1.
Preliminary
DS70083G-page 153
dsPIC30F
TABLE 20-1:
OSCILLATOR OPERATING MODES
Oscillator Mode
Description
XTL
200 kHz-4 MHz crystal on OSC1:OSC2.
XT
4 MHz-10 MHz crystal on OSC1:OSC2.
XT w/ PLL 4x
4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled.
XT w/ PLL 8x
4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled.
XT w/ PLL 16x
4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1).
LP
32 kHz crystal on SOSCO:SOSCI(2).
HS
10 MHz-25 MHz crystal.
HS/2 w/ PLL 4x
10 MHz-25 MHz crystal, divide by 2, 4x PLL enabled.
HS/2 w/ PLL 8x
10 MHz-25 MHz crystal, divide by 2, 8x PLL enabled.
HS/2 w/ PLL 16x
10 MHz-25 MHz crystal, divide by 2, 16x PLL enabled.
HS/3 w/ PLL 4x
10 MHz-25 MHz crystal, divide by 3, 4x PLL enabled.
HS/3 w/ PLL 8x
10 MHz-25 MHz crystal, divide by 3, 8x PLL enabled.
HS/3 w/ PLL 16x
10 MHz-25 MHz crystal, divide by 3, 16x PLL enabled.
EC
External clock input (0-40 MHz).
ECIO
External clock input (0-40 MHz), OSC2 pin is I/O.
EC w/ PLL 4x
External clock input (0-40 MHz), OSC2 pin is I/O, 4x PLL enabled(1).
EC w/ PLL 8x
External clock input (0-40 MHz), OSC2 pin is I/O, 8x PLL enabled(1).
EC w/ PLL 16x
External clock input (0-40 MHz), OSC2 pin is I/O, 16x PLL enabled(1).
ERC
External RC oscillator, OSC2 pin is FOSC/4 output(3).
ERCIO
External RC oscillator, OSC2 pin is I/O(3).
FRC
8 MHz internal RC oscillator.
FRC w/ PLL 4x
8 MHz Internal RC oscillator, 4x PLL enabled.
FRC w/ PLL 8x
8 MHz Internal RC oscillator, 8x PLL enabled.
FRC w/ PLL 16x
7.5 MHz Internal RC oscillator, 16x PLL enabled.
LPRC
512 kHz internal RC oscillator.
Note 1:
2:
3:
4:
dsPIC30F maximum operating frequency of 120 MHz must be met.
LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1.
Requires external R and C. Frequency operation up to 4 MHz.
Some devices support a subset of the above modes. Refer to individual device data sheets for details.
DS70083G-page 154
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 20-1:
OSCILLATOR SYSTEM BLOCK DIAGRAM
Oscillator Configuration bits
PWRSAV Instruction
Wake-up Request
OSC1
OSC2
FPLL
Primary
Oscillator
PLL
PLL
x4, x8, x16
Lock
COSC<2:0>
Primary Osc
NOSC<2:0>
Primary
Oscillator
OSWEN
Stability Detector
POR Done
Oscillator
Start-up
Timer
Clock
Secondary Osc
Switching
and Control
Block
SOSCO
SOSCI
32 kHz LP
Oscillator
Secondary
Oscillator
Stability Detector
Programmable
Clock Divider System
Clock
2
POST<1:0>
Internal Fast RC
Oscillator (FRC)
Internal Low
Power RC
Oscillator (LPRC)
LPRC
FCKSM<1:0>
2
Fail-Safe Clock
Monitor (FSCM)
CF
Oscillator Trap
To Timer1
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 155
dsPIC30F
20.2
Oscillator Configurations
20.2.1
The selection is as shown in Table 20-2.
Note:
INITIAL CLOCK SOURCE
SELECTION
Some devices may have different FOS
and FPR values from Table 20-2, depending on the oscillator modes supported.
Refer to individual device data sheets for
details.
While coming out of Power-on Reset or Brown-out
Reset, the device selects its clock source based on:
a)
b)
FOS<2:0> configuration bits that select one of
four oscillator groups,
and FPR<4:0> configuration bits that select one
of 13 oscillator choices within the primary group.
TABLE 20-2:
CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode
ECIO w/ PLL 4x
Oscillator
Source
FOS<2:0>
OSC2
Function
FPR<4:0>
PLL
1
1
1
0
1
1
0
1
I/O
ECIO w/ PLL 8x
PLL
1
1
1
0
1
1
1
0
I/O
ECIO w/ PLL 16x
PLL
1
1
1
0
1
1
1
1
I/O
FRC w/ PLL 4x
PLL
1
1
1
0
0
0
0
1
I/O
FRC w/ PLL 8x
PLL
1
1
1
0
1
0
1
0
I/O
FRC w/ PLL 16x
PLL
1
1
1
0
0
0
1
1
I/O
XT w/ PLL 4x
PLL
1
1
1
0
0
1
0
1
OSC2
XT w/ PLL 8x
PLL
1
1
1
0
0
1
1
0
OSC2
XT w/ PLL 16x
PLL
1
1
1
0
0
1
1
1
OSC2
HS2 w/ PLL 4x
PLL
1
1
1
1
0
0
0
1
OSC2
HS2 w/ PLL 8x
PLL
1
1
1
1
0
0
1
0
OSC2
HS2 w/ PLL 16x
PLL
1
1
1
1
0
0
1
1
OSC2
HS3 w/ PLL 4x
PLL
1
1
1
1
0
1
0
1
OSC2
HS3 w/ PLL 8x
PLL
1
1
1
1
0
1
1
0
OSC2
HS3 w/ PLL 16x
PLL
1
1
1
1
0
1
1
1
OSC2
ECIO
External
0
1
1
0
1
1
0
0
I/O
XT
External
0
1
1
0
0
1
0
0
OSC2
HS
External
0
1
1
0
0
0
1
0
OSC2
EC
External
0
1
1
0
1
0
1
1
CLKOUT
ERC
External
0
1
1
0
1
0
0
1
CLKOUT
ERCIO
External
0
1
1
0
1
0
0
0
I/O
XTL
External
0
1
1
0
0
0
0
0
OSC2
LP
Secondary
0
0
0
X
X
X
X
X
(Notes 1, 2)
FRC
Internal FRC
0
0
1
X
X
X
X
X
(Notes 1, 2)
Internal LPRC
0
1
0
X
X
X
X
X
(Notes 1, 2)
LPRC
Note 1:
2:
OSC2 pin function is determined by (FPR<4:0>).
Note that OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock
source is selected at all times.
DS70083G-page 156
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
20.2.2
OSCILLATOR START-UP TIMER
(OST)
20.2.5
In order to ensure that a crystal oscillator (or ceramic
resonator) has started and stabilized, an Oscillator
Start-up Timer is included. It is a simple 10-bit counter
that counts 1024 TOSC cycles before releasing the
oscillator clock to the rest of the system. The time-out
period is designated as TOST. The TOST time is involved
every time the oscillator has to restart (i.e., on POR,
BOR and wake-up from Sleep). The Oscillator Start-up
Timer is applied to the LP oscillator, XT, XTL, and HS
modes (upon wake-up from Sleep, POR and BOR) for
the primary oscillator.
20.2.3
LP OSCILLATOR CONTROL
Enabling the LP oscillator is controlled with two
elements:
1.
2.
The current oscillator group bits COSC<2:0>.
The LPOSCEN bit (OSCON register).
The LP oscillator is on (even during Sleep mode) if
LPOSCEN = 1. The LP oscillator is the device clock if:
The FRC oscillator is a fast (8 MHz nominal) internal
RC oscillator. This oscillator is intended to provide
reasonable device operating speeds without the use of
an external crystal, ceramic resonator, or RC network.
The FRC oscillator can be used with the PLL to obtain
higher clock frequencies.
The dsPIC30F operates from the FRC oscillator whenever the current oscillator selection control bits in the
OSCCON register (OSCCON<14:12>) are set to ‘001’.
The four bit field specified by TUN<3:0> (OSCON
<15:14> and OSCON<11:10>) allows the user to tune
the internal fast RC oscillator (nominal 8.0 MHz). The
user can tune the FRC oscillator within a range of
+10.5% (840 kHz) and -12% (960 kHz) in steps of
1.50% around the factory-calibrated setting, see
Table 20-4.
If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are
set to ‘00101’, ‘00110’ or ‘00111’, then a PLL multiplier
of 4, 8 or 16 (respectively) is applied.
Note:
• COSC<2:0> = 00 (LP selected as main oscillator)
and
• LPOSCEN = 1
Keeping the LP oscillator on at all times allows for a fast
switch to the 32 kHz system clock for lower power operation. Returning to the faster main oscillator will still
require a start-up time
20.2.4
TUN<3:0>
Bits
The PLL multiplies the clock which is generated by the
primary oscillator. The PLL is selectable to have either
gains of x4, x8, and x16. Input and output frequency
ranges are summarized in Table 20-3.
PLL FREQUENCY RANGE
FIN
PLL
Multiplier
FOUT
4 MHz-10 MHz
x4
16 MHz-40 MHz
4 MHz-10 MHz
x8
32 MHz-80 MHz
4 MHz-7.5 MHz
x16
64 MHz-160 MHz
The PLL features a lock output which is asserted when
the PLL enters a phase locked state. Should the loop
fall out of lock (e.g., due to noise), the lock signal will be
rescinded. The state of this signal is reflected in the
read only LOCK bit in the OSCCON register.
 2004 Microchip Technology Inc.
When a 16x PLL is used, the FRC frequency must not be tuned to a frequency
greater than 7.5 MHz.
TABLE 20-4:
PHASE LOCKED LOOP (PLL)
TABLE 20-3:
FAST RC OSCILLATOR (FRC)
Preliminary
0111
0110
0101
0100
0011
0010
0001
0000
1111
1110
1101
1100
1011
1010
1001
1000
FRC TUNING
FRC Frequency
+ 10.5%
+ 9.0%
+ 7.5%
+ 6.0%
+ 4.5%
+ 3.0%
+ 1.5%
Center Frequency (oscillator is
running at calibrated frequency)
- 1.5%
- 3.0%
- 4.5%
- 6.0%
- 7.5%
- 9.0%
- 10.5%
- 12.0%
DS70083G-page 157
dsPIC30F
20.2.6
LOW POWER RC OSCILLATOR
(LPRC)
The LPRC oscillator is a component of the Watchdog
Timer (WDT) and oscillates at a nominal frequency of
512 kHz. The LPRC oscillator is the clock source for
the Power-up Timer (PWRT) circuit, WDT, and clock
monitor circuits. It may also be used to provide a low
frequency clock source option for applications where
power consumption is critical and timing accuracy is
not required
If the oscillator has a very slow start-up time coming out
of POR, BOR or Sleep, it is possible that the PWRT
timer will expire before the oscillator has started. In
such cases, the FSCM will be activated and the FSCM
will initiate a clock failure trap, and the COSC<2:0> bits
are loaded with FRC oscillator selection. This will effectively shut-off the original oscillator that was trying to
start.
The user may detect this situation and restart the
oscillator in the clock fail trap ISR.
The LPRC oscillator is always enabled at a Power-on
Reset because it is the clock source for the PWRT.
After the PWRT expires, the LPRC oscillator will
remain on if one of the following is TRUE:
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
• The Fail-Safe Clock Monitor is enabled
• The WDT is enabled
• The LPRC oscillator is selected as the system
clock via the COSC<2:0> control bits in the
OSCCON register
2.
3.
The COSC bits (OSCCON<14:12>) are loaded
with the FRC oscillator selection value.
CF bit is set (OSCCON<3>).
OSWEN control bit (OSCCON<0>) is cleared.
For the purpose of clock switching, the clock sources
are sectioned into four groups:
If one of the above conditions is not true, the LPRC will
shut-off after the PWRT expires.
Note 1: OSC2 pin function is determined by the
Primary Oscillator mode selection
(FPR<4:0>).
2: OSC1 pin cannot be used as an I/O pin
even if the secondary oscillator or an
internal clock source is selected at all
times.
20.2.7
1.
FAIL-SAFE CLOCK MONITOR
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by appropriately
programming the FCKSM configuration bits (clock
switch and monitor selection bits) in the FOSC Device
Configuration register. If the FSCM function is enabled,
the LPRC internal oscillator will run at all times (except
during Sleep mode) and will not be subject to control by
the SWDTEN bit.
In the event of an oscillator failure, the FSCM will generate a clock failure trap event and will switch the system clock over to the FRC oscillator. The user will then
have the option to either attempt to restart the oscillator
or execute a controlled shutdown. The user may decide
to treat the trap as a warm Reset by simply loading the
Reset address into the oscillator fail trap vector. In this
event, the CF (Clock Fail) status bit (OSCCON<3>) is
also set whenever a clock failure is recognized.
1.
2.
3.
4.
Primary
Secondary
Internal FRC
Internal LPRC
The user can switch between these functional groups
but cannot switch between options within a group. If the
primary group is selected, then the choice within the
group is always determined by the FPR<4:0>
configuration bits.
The OSCCON register holds the control and status bits
related to clock switching.
• COSC<1:0>: Read only status bits always reflect
the current oscillator group in effect.
• NOSC<2:0>: Control bits which are written to
indicate the new oscillator group of choice.
- On POR and BOR, COSC<2:0> and
NOSC<1:0> are both loaded with the
configuration bit values FOS<2:0>.
• LOCK: The LOCK status bit indicates a PLL lock.
• CF: Read only status bit indicating if a clock fail
detect has occurred.
• OSWEN: Control bit changes from a ‘0’ to a ‘1’
when a clock transition sequence is initiated.
Clearing the OSWEN control bit will abort a clock
transition in progress (used for hang-up
situations).
If configuration bits FCKSM<2:0> = 1x, then the clock
switching and Fail-Safe Clock monitoring functions are
disabled. This is the default configuration bit setting.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.
DS70083G-page 158
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
If clock switching is disabled, then the FOS<2:0> and
FPR<4:0> bits directly control the oscillator selection
and the COSC<2:0> bits do not control the clock selection. However, these bits will reflect the clock source
selection.
Note:
The application should not attempt to
switch to a clock of frequency lower than
100 KHz when the fail-safe clock monitor is
enabled. If such clock switching is
performed, the device may generate an
oscillator fail trap and switch to the Fast RC
oscillator.
20.2.8
PROTECTION AGAINST
ACCIDENTAL WRITES TO OSCCON
A write to the OSCCON register is intentionally made
difficult because it controls clock switching and clock
scaling.
To write to the OSCCON low byte, the following code
sequence must be executed without any other
instructions in between:
Byte Write “0x46” to OSCCON low
Byte Write “0x57” to OSCCON low
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
To write to the OSCCON high byte, the following
instructions must be executed without any other
instructions in between:
20.3
Reset
The dsPIC30F differentiates between various kinds of
Reset:
a)
b)
c)
d)
e)
f)
g)
h)
Power-on Reset (POR)
MCLR Reset during normal operation
MCLR Reset during Sleep
Watchdog Timer (WDT) Reset (during normal
operation)
Programmable Brown-out Reset (BOR)
RESET Instruction
Reset caused by trap lockup (TRAPR)
Reset caused by illegal opcode or by using an
uninitialized W register as an address pointer
(IOPUWR)
Different registers are affected in different ways by various Reset conditions. Most registers are not affected
by a WDT wake-up since this is viewed as the resumption of normal operation. Status bits from the RCON
register are set or cleared differently in different Reset
situations, as indicated in Table 20-5. These bits are
used in software to determine the nature of the Reset.
A block diagram of the On-Chip Reset Circuit is shown
in Figure 20-2.
A MCLR noise filter is provided in the MCLR Reset
path. The filter detects and ignores small pulses.
Internally generated Resets do not drive MCLR pin low.
Byte Write “0x78” to OSCCON high
Byte Write “0x9A” to OSCCON high
FIGURE 20-2:
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
RESET SYSTEM BLOCK DIAGRAM
RESET
Instruction
Digital
Glitch Filter
MCLR
Sleep or Idle
WDT
Module
POR
VDD Rise
Detect
S
VDD
Brown-out
Reset
BOR
BOREN
R
Q
SYSRST
Trap Conflict
Illegal Opcode/
Uninitialized W Register
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 159
dsPIC30F
20.3.1
POR: POWER-ON RESET
A power-on event will generate an internal POR pulse
when a VDD rise is detected. The Reset pulse will occur
at the POR circuit threshold voltage (VPOR) which is
nominally 1.85V. The device supply voltage characteristics must meet specified starting voltage and rise rate
requirements. The POR pulse will reset a POR timer
and place the device in the Reset state. The POR also
selects the device clock source identified by the oscillator configuration fuses.
The POR circuit inserts a small delay, TPOR, which is
nominally 10 µs and ensures that the device bias circuits are stable. Furthermore, a user selected powerup time-out (TPWRT) is applied. The TPWRT parameter
is based on device configuration bits and can be 0 ms
(no delay), 4 ms, 16 ms, or 64 ms. The total delay is at
device power-up, TPOR + TPWRT. When these delays
have expired, SYSRST will be negated on the next
leading edge of the Q1 clock and the PC will jump to the
Reset vector.
The timing for the SYSRST signal is shown in
Figure 20-3 through Figure 20-5.
FIGURE 20-3:
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
VDD
MCLR
INTERNAL POR
TOST
OST TIME-OUT
TPWRT
PWRT TIME-OUT
INTERNAL Reset
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
FIGURE 20-4:
VDD
MCLR
INTERNAL POR
TOST
OST TIME-OUT
TPWRT
PWRT TIME-OUT
INTERNAL Reset
DS70083G-page 160
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 20-5:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
VDD
MCLR
INTERNAL POR
TOST
OST TIME-OUT
TPWRT
PWRT TIME-OUT
INTERNAL Reset
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 161
dsPIC30F
20.3.1.1
POR with Long Crystal Start-up Time
(with FSCM Enabled)
The oscillator start-up circuitry is not linked to the POR
circuitry. Some crystal circuits (especially low frequency crystals) will have a relatively long start-up
time. Therefore, one or more of the following conditions
is possible after the POR timer and the PWRT have
expired:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has not expired (if a
crystal oscillator is used).
• The PLL has not achieved a LOCK (if PLL is
used).
If the FSCM is enabled and one of the above conditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap ISR.
20.3.1.2
Operating without FSCM and PWRT
A BOR will generate a Reset pulse which will reset the
device. The BOR will select the clock source based on
the device configuration bit values (FOS<1:0> and
FPR<3:0>). Furthermore, if an Oscillator mode is
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the POR time-out (TPOR) and the PWRT
time-out (TPWRT) will be applied before the internal Reset
is released. If TPWRT = 0 and a crystal oscillator is being
used, then a nominal delay of TFSCM = 100 µs is applied.
The total delay in this case is (TPOR + TFSCM).
The BOR status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit, if enabled,
will continue to operate while in Sleep or Idle modes
and will reset the device should VDD fall below the BOR
threshold voltage.
FIGURE 20-6:
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit rapidly from Reset on power-up. If the clock source is
FRC, LPRC, EXTRC or EC, it will be active
immediately.
If the FSCM is disabled and the system clock has not
started, the device will be in a frozen state at the Reset
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
20.3.2
VDD
D
C
Note 1:
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit. The main purpose of
the BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (i.e.,
missing portions of the AC cycle waveform due to bad
power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned
on).
•
•
•
•
2:
3:
Note:
2.0V
2.7V
4.2V
4.5V
Note:
R
R1
BOR: PROGRAMMABLE
BROWN-OUT RESET
The BOR module allows selection of one of the
following voltage trip points:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
MCLR
dsPIC30F
External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when VDD powers down.
R should be suitably chosen so as to make
sure that the voltage drop across R does not
violate the device’s electrical specifications.
R1 should be suitably chosen so as to limit
any current flowing into MCLR from external
capacitor C, in the event of MCLR/VPP pin
breakdown due to Electrostatic Discharge
(ESD), or Electrical Overstress (EOS).
Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
The BOR voltage trip points indicated here
are nominal values provided for design
guidance only. Refer to the Electrical
Specifications in the specific device data
sheet for BOR voltage limit specifications.
DS70083G-page 162
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Table 20-5 shows the Reset conditions for the RCON
register. Since the control bits within the RCON register
are R/W, the information in the table implies that all the
bits are negated prior to the action specified in the
condition column.
TABLE 20-5:
INITIALIZATION CONDITION FOR RCON REGISTER: CASE 1
Condition
Program
Counter
TRAPR IOPUWR EXTR SWR WDTO
Idle
Sleep
POR BOR
Power-on Reset
0x000000
0
0
0
0
0
0
0
1
1
Brown-out Reset
0x000000
0
0
0
0
0
0
0
0
1
MCLR Reset during normal
operation
0x000000
0
0
1
0
0
0
0
0
0
Software Reset during
normal operation
0x000000
0
0
0
1
0
0
0
0
0
MCLR Reset during Sleep
0x000000
0
0
1
0
0
0
1
0
0
MCLR Reset during Idle
0x000000
0
0
1
0
0
1
0
0
0
WDT Time-out Reset
0x000000
0
0
0
0
1
0
0
0
0
PC + 2
WDT Wake-up
0
0
0
0
1
0
1
0
0
Interrupt Wake-up from
Sleep
PC + 2
(1)
0
0
0
0
0
0
1
0
0
Clock Failure Trap
0x000004
0
0
0
0
0
0
0
0
0
Trap Reset
0x000000
1
0
0
0
0
0
0
0
0
Illegal Operation Trap
0x000000
0
1
0
0
0
0
0
0
0
Legend:
Note 1:
u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 163
dsPIC30F
Table 20-6 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assumed the user has set/cleared specific bits prior to
action specified in the condition column.
TABLE 20-6:
INITIALIZATION CONDITION FOR RCON REGISTER: CASE 2
Condition
Program
Counter
TRAPR IOPUWR EXTR SWR WDTO
Idle
Sleep
POR BOR
Power-on Reset
0x000000
0
0
0
0
0
0
0
1
1
Brown-out Reset
0x000000
u
u
u
u
u
u
u
0
1
MCLR Reset during normal
operation
0x000000
u
u
1
0
0
0
0
u
u
Software Reset during
normal operation
0x000000
u
u
0
1
0
0
0
u
u
MCLR Reset during Sleep
0x000000
u
u
1
u
0
0
1
u
u
MCLR Reset during Idle
0x000000
u
u
1
u
0
1
0
u
u
WDT Time-out Reset
0x000000
u
u
0
0
1
0
0
u
u
PC + 2
WDT Wake-up
u
u
u
u
1
u
1
u
u
Interrupt Wake-up from
Sleep
PC + 2
(1)
u
u
u
u
u
u
1
u
u
Clock Failure Trap
0x000004
u
u
u
u
u
u
u
u
u
Trap Reset
0x000000
1
u
u
u
u
u
u
u
u
Illegal Operation Reset
0x000000
u
1
u
u
u
u
u
u
u
Legend:
Note 1:
u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
DS70083G-page 164
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
20.4
20.4.1
Watchdog Timer (WDT)
20.6
WATCHDOG TIMER OPERATION
The primary function of the Watchdog Timer (WDT) is
to reset the processor in the event of a software malfunction. The WDT is a free-running timer which runs
off an on-chip RC oscillator, requiring no external component. Therefore, the WDT timer will continue to operate even if the main processor clock (e.g., the crystal
oscillator) fails.
20.4.2
There are two power saving states that can be entered
through the execution of a special instruction, PWRSAV;
these are Sleep and Idle.
The format of the PWRSAV instruction is as follows:
PWRSAV <parameter>, where ‘parameter’ defines
Idle or Sleep mode.
20.6.1
ENABLING AND DISABLING
THE WDT
Setting FWDTEN = 1 enables the Watchdog Timer. The
enabling is done when programming the device. By
default, after chip erase, FWDTEN bit = 1. Any device
programmer capable of programming dsPIC30F
devices allows programming of this and other
configuration bits.
If enabled, the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset
(except during Sleep). To prevent a WDT time-out, the
user must clear the Watchdog Timer using a CLRWDT
instruction.
If a WDT times out during Sleep, the device will wakeup. The WDTO bit in the RCON register will be cleared
to indicate a wake-up resulting from a WDT time-out.
Setting FWDTEN = 0 allows user software to enable/
disable the Watchdog Timer via the SWDTEN
(RCON<5>) control bit.
The Fail-Safe Clock Monitor is not functional during
Sleep since there is no clock to monitor. However,
LPRC clock remains active if WDT is operational during
Sleep.
The brown-out protection circuit and the Low Voltage
Detect circuit, if enabled, will remain functional during
Sleep.
The processor wakes up from Sleep if at least one of
the following conditions has occurred:
• any interrupt that is individually enabled and
meets the required priority level
• any Reset (POR, BOR and MCLR)
• WDT time-out
On waking up from Sleep mode, the processor will
restart the same clock that was active prior to entry into
Sleep mode. When clock switching is enabled, bits
COSC<1:0> will determine the oscillator source that
will be used on wake-up. If clock switch is disabled,
then there is only one system clock.
Note:
Low Voltage Detect
The Low Voltage Detect (LVD) module is used to detect
when the VDD of the device drops below a threshold
value, VLVD, which is determined by the LVDL<3:0>
bits (RCON<11:8>) and is thus user programmable.
The internal voltage reference circuitry requires a nominal amount of time to stabilize, and the BGST bit
(RCON<13>) indicates when the voltage reference has
stabilized.
In some devices, the LVD threshold voltage may be
applied externally on the LVDIN pin.
The LVD module is enabled by setting the LVDEN bit
(RCON<12>).
 2004 Microchip Technology Inc.
SLEEP MODE
In Sleep mode, the clock to the CPU and peripherals is
shutdown. If an on-chip oscillator is being used, it is
shutdown.
The Watchdog Timer can be “Enabled” or “Disabled”
only through a configuration bit (FWDTEN) in the
Configuration register, FWDT.
20.5
Power Saving Modes
If a POR or BOR occurred, the selection of
the oscillator is based on the FOS<1:0>
and FPR<3:0> configuration bits.
If the clock source is an oscillator, the clock to the
device will be held off until OST times out (indicating a
stable oscillator). If PLL is used, the system clock is
held off until LOCK = 1 (indicating that the PLL is
stable). In either case, TPOR, TLOCK and TPWRT delays
are applied.
If EC, FRC, LPRC or EXTRC oscillators are used, then
a delay of TPOR (~ 10 µs) is applied. This is the smallest
delay possible on wake-up from Sleep.
Moreover, if LP oscillator was active during Sleep and
LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have -the smallest possible start-up delay when waking up from Sleep,
one of these faster wake-up options should be selected
before entering Sleep.
Preliminary
DS70083G-page 165
dsPIC30F
Any interrupt that is individually enabled (using the corresponding IE bit) and meets the prevailing priority level
will be able to wake-up the processor. The processor will
process the interrupt and branch to the ISR. The Sleep
status bit in the RCON register is set upon wake-up.
Note:
In spite of various delays applied (TPOR,
TLOCK and TPWRT), the crystal oscillator
(and PLL) may not be active at the end of
the time-out (e.g., for low frequency crystals). In such cases, if FSCM is enabled,
then the device will detect this as a clock
failure and process the clock failure trap, the
FRC oscillator will be enabled and the user
will have to re-enable the crystal oscillator. If
FSCM is not enabled, then the device will
simply suspend execution of code until the
clock is stable and will remain in Sleep until
the oscillator clock has started.
All Resets will wake-up the processor from Sleep
mode. Any Reset, other than POR, will set the Sleep
status bit. In a POR, the Sleep bit is cleared.
If the Watchdog Timer is enabled, then the processor
will wake-up from Sleep mode upon WDT time-out. The
Sleep and WDTO status bits are both set.
20.6.2
IDLE MODE
Any interrupt that is individually enabled (using IE bit)
and meets the prevailing priority level will be able to
wake-up the processor. The processor will process the
interrupt and branch to the ISR. The Idle status bit in
the RCON register is set upon wake-up.
Any Reset other than POR will set the Idle status bit.
On a POR, the Idle bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Idle mode upon WDT time-out. The Idle
and WDTO status bits are both set.
Unlike wake-up from Sleep, there are no time delays
involved in wake-up from Idle.
20.7
The configuration bits in each device configuration register specify some of the Device modes and are
programmed by a device programmer, or by using the
In-Circuit Serial Programming™ (ICSP™) feature of
the device. Each device configuration register is a
24-bit register, but only the lower 16 bits of each register are used to hold configuration data. There are four
device configuration registers available to the user:
FOSC (0xF80000): Oscillator Configuration
Register
FWDT (0xF80002): Watchdog Timer
Configuration Register
FBORPOR (0xF80004): BOR and POR
Configuration Register
FGS (0xF8000A): General Code Segment
Configuration Register
1.
2.
In Idle mode, the clock to the CPU is shutdown while
peripherals keep running. Unlike Sleep mode, the clock
source remains active.
Device Configuration Registers
3.
Several peripherals have a control bit in each module
that allows them to operate during Idle.
4.
LPRC Fail-Safe Clock remains active if clock failure
detect is enabled.
The placement of the configuration bits is automatically
handled when you select the device in your device programmer. The desired state of the configuration bits
may be specified in the source code (dependent on the
language tool used), or through the programming interface. After the device has been programmed, the application software may read the configuration bit values
through the table read instructions. For additional information, please refer to the Programming Specifications
of the device.
The processor wakes up from Idle if at least one of the
following conditions has occurred:
• any interrupt that is individually enabled (IE bit is
‘1’) and meets the required priority level
• any Reset (POR, BOR, MCLR)
• WDT time-out
Upon wake-up from Idle mode, the clock is re-applied
to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV
instruction.
DS70083G-page 166
Note:
Preliminary
If the code protection configuration fuse
bits (FGS<GCP> and FGS<GWRP>)
have been programmed, an erase of the
entire code-protected device is only
possible at voltages VDD ≥ 4.5V.
 2004 Microchip Technology Inc.
dsPIC30F
20.8
Peripheral Module Disable (PMD)
Registers
The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a
peripheral is disabled via the appropriate PMD control
bit, the peripheral is in a minimum power consumption
state. The control and status registers associated with
the peripheral will also be disabled so writes to those
registers will have no effect and read values will be
invalid.
A peripheral module will only be enabled if both the
associated bit in the the PMD register is cleared and
the peripheral is supported by the specific dsPIC variant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
Note:
If a PMD bit is set, the corresponding module is disabled after a delay of 1 instruction
cycle. Similarly, if a PMD bit is cleared, the
corresponding module is enabled after a
delay of 1 instruction cycle (assuming the
module control registers are already
configured to enable module operation).
20.9
When MPLAB ICD2 is selected as a Debugger, the InCircuit Debugging functionality is enabled. This function allows simple debugging functions when used with
MPLAB IDE. When the device has this feature enabled,
some of the resources are not available for general
use. These resources include the first 80 bytes of Data
RAM and two I/O pins.
One of four pairs of Debug I/O pins may be selected by
the user using configuration options in MPLAB IDE.
These pin pairs are named EMUD/EMUC, EMUD1/
EMUC1, EMUD2/EMUC2 and MUD3/EMUC3.
In each case, the selected EMUD pin is the Emulation/
Debug Data line, and the EMUC pin is the Emulation/
Debug Clock line. These pins will interface to the
MPLAB ICD 2 module available from Microchip. The
selected pair of Debug I/O pins is used by MPLAB
ICD 2 to send commands and receive responses, as
well as to send and receive data. To use the In-Circuit
Debugger function of the device, the design must
implement ICSP connections to MCLR, VDD, VSS,
PGC, PGD, and the selected EMUDx/EMUCx pin pair.
This gives rise to two possibilities:
1.
Note 1: In the dsPIC30F6011 and dsPIC30F6013
devices, the DCIMD bit is readable and
writeable, and will be read as “1” when
set.
2: In the dsPIC30F3014 device, the T4MD,
T5MD, IC7MD, IC8MD, OC3MD, OC4MD
DCIMD and C1MD bits are readable and
writeable, and will be reas as “1” when
set.
In-Circuit Debugger
2.
If EMUD/EMUC is selected as the Debug I/O pin
pair, then only a 5-pin interface is required, as
the EMUD and EMUC pin functions are multiplexed with the PGD and PGC pin functions in
all dsPIC30F devices.
If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/
EMUC3 is selected as the Debug I/O pin pair,
then a 7-pin interface is required, as the
EMUDx/EMUCx pin functions (x = 1, 2 or 3) are
not multiplexed with the PGD and PGC pin
functions.
3: In the dsPIC30F2011, dsPIC30F3012
and dsPIC30F2012 devices, the U2MD
bit is readable and writeable, and will be
read as “1” when set.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 167
DS70083G-page 168
IC8MD
T5MD
—
—
Bit 13
—
IC7MD
T4MD
IC6MD
T3MD
Bit 12
IC5MD
T2MD
LVDEN
COSC<2:0>
IC4MD
T1MD
—
Bit 11
Bit 9
IC3MD
—
IC2MD
—
F8000A
FGS
Bit 14
MCLREN
—
—
—
FWDTEN
—
—
—
FCKSM<1:0>
Bit 15
—
—
—
—
Bit 13
—
—
—
—
Bit 12
—
—
—
—
SWR
Bit 6
U2MD
—
—
—
Bit 10
—
—
—
FOS<2:0>
Bit 9
OC8MD OC7MD
I2CMD
POST<1:0>
EXTR
Bit 7
—
—
—
Bit 8
OC6MD
U1MD
LOCK
SWDTEN
Bit 5
Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.
F80004
FBORPOR
—
—
F80000
F80002
FOSC
FWDT
Bits 23-16
IC1MD
DCIMD
Bit 8
Bit 11
NOSC<2:0>
LVDL<3:0>
Bit 10
DEVICE CONFIGURATION REGISTER MAP
Addr.
TABLE 20-8:
File Name
Bit 14
TRAPR IOPUWR BGST
Bit 15
SYSTEM INTEGRATION REGISTER MAP
Reset state depends on type of Reset.
Reset state depends on configuration bits.
0772
1:
2:
PMD2
Note
0774
0770
PMD1
0742
OSCTUN
0740
OSCCON
Addr.
RCON
SFR
Name
TABLE 20-7:
TUN3
CF
Sleep
Bit 3
—
BOREN
—
—
Bit 7
OC5MD
C2MD
TUN2
—
Idle
Bit 2
—
—
—
—
Bit 6
TUN1
Bit 4
OC2MD
C1MD
—
BORV<1:0>
—
POR
Bit 0
0000 0000 0000 0000
(Note 2)
(Note 1)
Reset State
—
—
Bit 3
Bit 1
—
—
Bit 0
GCP
GWRP
FPWRT<1:0>
FWPSB<3:0>
FPR<4:0>
Bit 2
OC1MD 0000 0000 0000 0000
ADCMD 0000 0000 0000 0000
TUN0
LPOSCEN OSWEN
BOR
Bit 1
FWPSA<1:0>
—
Bit 5
OC4MD OC3MD
SPI2MD SPI1MD
—
WDTO
Bit 4
dsPIC30F
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
21.0
INSTRUCTION SET SUMMARY
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the dsPIC30F Family Reference
Manual (DS70046). For more information on the device
instruction set and programming, refer to the dsPIC30F
Programmer’s Reference Manual (DS70030).
The dsPIC30F instruction set adds many
enhancements to the previous PICmicro® instruction
sets, while maintaining an easy migration from
PICmicro instruction sets.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single word instruction is a 24-bit word divided
into an 8-bit opcode which specifies the instruction
type, and one or more operands which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
•
•
•
•
•
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register
(specified by a literal value or indirectly by the
contents of register ‘Wb’)
The literal instructions that involve data movement may
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by the value of ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand which is a register ‘Wb’
without any address modifier
• The second source operand which is a literal
value
• The destination of the result (only if not the same
as the first source operand) which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions may use some of the
following operands:
Table 21-1 shows the general symbols used in
describing the instructions.
The dsPIC30F instruction set summary in Table 21-2
lists all the instructions, along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand which is typically a
register ‘Wb’ without any address modifier
• The second source operand which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions
have two operands:
• The file register specified by the value ‘f’
• The destination, which could either be the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
 2004 Microchip Technology Inc.
Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space pre-fetch operations
• The X and Y address space pre-fetch destinations
• The accumulator write back destination
The other DSP instructions do not involve any
multiplication, and may include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift specified by a W register ‘Wn’
or a literal value
The control instructions may use some of the following
operands:
• A program memory address
• The mode of the table read and table write
instructions
Preliminary
DS70083G-page 169
dsPIC30F
All instructions are a single word, except for certain
double-word instructions, which were made doubleword instructions so that all the required information is
available in these 48 bits. In the second word, the
8 MSbs are ‘0’s. If this second word is executed as an
instruction (by itself), it will execute as a NOP.
Most single word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the instruction. In these cases, the execution takes two instruction
cycles with the additional instruction cycle(s) executed
as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table
reads and writes, and RETURN/RETFIE instructions,
TABLE 21-1:
which are single word instructions but take two or three
cycles. Certain instructions that involve skipping over
the subsequent instruction require either two or three
cycles if the skip is performed, depending on whether
the instruction being skipped is a single word or twoword instruction. Moreover, double-word moves
require two cycles. The double-word instructions
execute in two instruction cycles.
Note:
For more details on the instruction set,
refer to the Programmer’s Reference
Manual.
SYMBOLS USED IN OPCODE DESCRIPTIONS
Field
Description
#text
Means literal defined by “text”
(text)
Means “content of text”
[text]
Means “the location addressed by text”
{ }
Optional field or operation
<n:m>
Register bit field
.b
Byte mode selection
.d
Double-Word mode selection
.S
Shadow register select
.w
Word mode selection (default)
Acc
One of two accumulators {A, B}
AWB
Accumulator write back destination address register ∈ {W13, [W13]+=2}
bit4
4-bit bit selection field (used in word addressed instructions) ∈ {0...15}
C, DC, N, OV, Z
MCU status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr
Absolute address, label or expression (resolved by the linker)
f
File register address ∈ {0x0000...0x1FFF}
lit1
1-bit unsigned literal ∈ {0,1}
lit4
4-bit unsigned literal ∈ {0...15}
lit5
5-bit unsigned literal ∈ {0...31}
lit8
8-bit unsigned literal ∈ {0...255}
lit10
10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode
lit14
14-bit unsigned literal ∈ {0...16384}
lit16
16-bit unsigned literal ∈ {0...65535}
lit23
23-bit unsigned literal ∈ {0...8388608}; LSB must be 0
None
Field does not require an entry, may be blank
OA, OB, SA, SB
DSP status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate
PC
Program Counter
Slit10
10-bit signed literal ∈ {-512...511}
Slit16
16-bit signed literal ∈ {-32768...32767}
Slit6
6-bit signed literal ∈ {-16...16}
DS70083G-page 170
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 21-1:
SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field
Description
Wb
Base W register ∈ {W0..W15}
Wd
Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo
Destination W register ∈
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn
Dividend, Divisor working register pair (direct addressing)
Wm*Wm
Multiplicand and Multiplier working register pair for Square instructions ∈
{W4*W4,W5*W5,W6*W6,W7*W7}
Wm*Wn
Multiplicand and Multiplier working register pair for DSP instructions ∈
{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}
Wn
One of 16 working registers ∈ {W0..W15}
Wnd
One of 16 destination working registers ∈ {W0..W15}
Wns
One of 16 source working registers ∈ {W0..W15}
WREG
W0 (working register used in file register instructions)
Ws
Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso
Source W register ∈
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx
X data space pre-fetch address register for DSP instructions
∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2,
[W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2,
[W9+W12],none}
Wxd
X data space pre-fetch destination register for DSP instructions ∈ {W4..W7}
Wy
Y data space pre-fetch address register for DSP instructions
∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2,
[W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2,
[W11+W12], none}
Wyd
Y data space pre-fetch destination register for DSP instructions ∈ {W4..W7}
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 171
dsPIC30F
TABLE 21-2:
Base
Instr
#
1
2
3
4
Assembly
Mnemonic
ADD
ADDC
AND
ASR
5
BCLR
6
BRA
7
8
INSTRUCTION SET OVERVIEW
BSET
BSW
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
ADD
Acc
Add Accumulators
1
1
ADD
f
f = f + WREG
1
1
OA,OB,SA,SB
C,DC,N,OV,Z
ADD
f,WREG
WREG = f + WREG
1
1
C,DC,N,OV,Z
ADD
#lit10,Wn
Wd = lit10 + Wd
1
1
C,DC,N,OV,Z
ADD
Wb,Ws,Wd
Wd = Wb + Ws
1
1
C,DC,N,OV,Z
ADD
Wb,#lit5,Wd
Wd = Wb + lit5
1
1
C,DC,N,OV,Z
ADD
Wso,#Slit4,Acc
16-bit Signed Add to Accumulator
1
1
OA,OB,SA,SB
ADDC
f
f = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
f,WREG
WREG = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
#lit10,Wn
Wd = lit10 + Wd + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,Ws,Wd
Wd = Wb + Ws + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,#lit5,Wd
Wd = Wb + lit5 + (C)
1
1
C,DC,N,OV,Z
AND
f
f = f .AND. WREG
1
1
N,Z
AND
f,WREG
WREG = f .AND. WREG
1
1
N,Z
AND
#lit10,Wn
Wd = lit10 .AND. Wd
1
1
N,Z
AND
Wb,Ws,Wd
Wd = Wb .AND. Ws
1
1
N,Z
AND
Wb,#lit5,Wd
Wd = Wb .AND. lit5
1
1
N,Z
ASR
f
f = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
f,WREG
WREG = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
Ws,Wd
Wd = Arithmetic Right Shift Ws
1
1
C,N,OV,Z
ASR
Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns
1
1
N,Z
ASR
Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5
1
1
N,Z
BCLR
f,#bit4
Bit Clear f
1
1
None
BCLR
Ws,#bit4
Bit Clear Ws
1
1
None
BRA
C,Expr
Branch if Carry
1
1 (2)
None
None
BRA
GE,Expr
Branch if greater than or equal
1
1 (2)
BRA
GEU,Expr
Branch if unsigned greater than or equal
1
1 (2)
None
BRA
GT,Expr
Branch if greater than
1
1 (2)
None
BRA
GTU,Expr
Branch if unsigned greater than
1
1 (2)
None
BRA
LE,Expr
Branch if less than or equal
1
1 (2)
None
BRA
LEU,Expr
Branch if unsigned less than or equal
1
1 (2)
None
BRA
LT,Expr
Branch if less than
1
1 (2)
None
BRA
LTU,Expr
Branch if unsigned less than
1
1 (2)
None
BRA
N,Expr
Branch if Negative
1
1 (2)
None
BRA
NC,Expr
Branch if Not Carry
1
1 (2)
None
BRA
NN,Expr
Branch if Not Negative
1
1 (2)
None
BRA
NOV,Expr
Branch if Not Overflow
1
1 (2)
None
BRA
NZ,Expr
Branch if Not Zero
1
1 (2)
None
BRA
OA,Expr
Branch if Accumulator A overflow
1
1 (2)
None
BRA
OB,Expr
Branch if Accumulator B overflow
1
1 (2)
None
BRA
OV,Expr
Branch if Overflow
1
1 (2)
None
BRA
SA,Expr
Branch if Accumulator A saturated
1
1 (2)
None
BRA
SB,Expr
Branch if Accumulator B saturated
1
1 (2)
None
BRA
Expr
Branch Unconditionally
1
2
None
BRA
Z,Expr
Branch if Zero
1
1 (2)
None
BRA
Wn
Computed Branch
1
2
None
BSET
f,#bit4
Bit Set f
1
1
None
BSET
Ws,#bit4
Bit Set Ws
1
1
None
BSW.C
Ws,Wb
Write C bit to Ws<Wb>
1
1
None
BSW.Z
Ws,Wb
Write Z bit to Ws<Wb>
1
1
None
DS70083G-page 172
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 21-2:
Base
Instr
#
9
10
11
12
13
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
BTG
BTSC
BTSS
BTST
BTSTS
14
CALL
15
CLR
Assembly Syntax
f,#bit4
Bit Toggle f
1
1
Ws,#bit4
Bit Toggle Ws
1
1
None
BTSC
f,#bit4
Bit Test f, Skip if Clear
1
1
(2 or 3)
None
BTSC
Ws,#bit4
Bit Test Ws, Skip if Clear
1
1
(2 or 3)
None
BTSS
f,#bit4
Bit Test f, Skip if Set
1
1
(2 or 3)
None
BTSS
Ws,#bit4
Bit Test Ws, Skip if Set
1
1
(2 or 3)
None
BTST
f,#bit4
Bit Test f
1
1
Z
Ws,#bit4
Bit Test Ws to C
1
1
C
BTST.Z
Ws,#bit4
Bit Test Ws to Z
1
1
Z
BTST.C
Ws,Wb
Bit Test Ws<Wb> to C
1
1
C
BTST.Z
Ws,Wb
Bit Test Ws<Wb> to Z
1
1
Z
BTSTS
f,#bit4
Bit Test then Set f
1
1
Z
C
BTSTS.C
Ws,#bit4
Bit Test Ws to C, then Set
1
1
BTSTS.Z
Ws,#bit4
Bit Test Ws to Z, then Set
1
1
Z
CALL
lit23
Call subroutine
2
2
None
CALL
Wn
Call indirect subroutine
1
2
None
CLR
f
f = 0x0000
1
1
None
CLR
WREG
WREG = 0x0000
1
1
None
CLR
Ws
Ws = 0x0000
1
1
None
CLR
Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator
1
1
OA,OB,SA,SB
Clear Watchdog Timer
1
1
WDTO,Sleep
f
f=f
1
1
N,Z
COM
f,WREG
WREG = f
1
1
N,Z
COM
Ws,Wd
Wd = Ws
1
1
N,Z
CP
f
Compare f with WREG
1
1
C,DC,N,OV,Z
17
COM
COM
20
21
CP0
CP1
CPB
None
BTST.C
CLRWDT
19
Status Flags
Affected
BTG
CLRWDT
CP
# of
# of
Words Cycles
BTG
16
18
Description
CP
Wb,#lit5
Compare Wb with lit5
1
1
C,DC,N,OV,Z
CP
Wb,Ws
Compare Wb with Ws (Wb - Ws)
1
1
C,DC,N,OV,Z
CP0
f
Compare f with 0x0000
1
1
C,DC,N,OV,Z
CP0
Ws
Compare Ws with 0x0000
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
CP1
f
Compare f with 0xFFFF
1
1
CP1
Ws
Compare Ws with 0xFFFF
1
1
C,DC,N,OV,Z
CPB
f
Compare f with WREG, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,#lit5
Compare Wb with lit5, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,Ws
Compare Wb with Ws, with Borrow
(Wb - Ws - C)
1
1
C,DC,N,OV,Z
22
CPSEQ
CPSEQ
Wb, Wn
Compare Wb with Wn, skip if =
1
1
(2 or 3)
None
23
CPSGT
CPSGT
Wb, Wn
Compare Wb with Wn, skip if >
1
1
(2 or 3)
None
24
CPSLT
CPSLT
Wb, Wn
Compare Wb with Wn, skip if <
1
1
(2 or 3)
None
25
CPSNE
CPSNE
Wb, Wn
Compare Wb with Wn, skip if ≠
1
1
(2 or 3)
None
26
DAW
DAW
Wn
Wn = decimal adjust Wn
1
1
C
27
DEC
DEC
f
f = f -1
1
1
C,DC,N,OV,Z
28
DEC2
DEC
f,WREG
WREG = f -1
1
1
C,DC,N,OV,Z
DEC
Ws,Wd
Wd = Ws - 1
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
DEC2
f
f = f -2
1
1
DEC2
f,WREG
WREG = f -2
1
1
C,DC,N,OV,Z
DEC2
Ws,Wd
Wd = Ws - 2
1
1
C,DC,N,OV,Z
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 173
dsPIC30F
TABLE 21-2:
Base
Instr
#
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
29
DISI
DISI
#lit14
Disable Interrupts for k instruction cycles
1
1
None
30
DIV
DIV.S
Wm,Wn
Signed 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.SD
Wm,Wn
Signed 32/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.U
Wm,Wn
Unsigned 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.UD
Wm,Wn
Unsigned 32/16-bit Integer Divide
1
18
N,Z,C,OV
N,Z,C,OV
31
DIVF
DIVF
Wm,Wn
Signed 16/16-bit Fractional Divide
1
18
32
DO
DO
#lit14,Expr
Do code to PC+Expr, lit14+1 times
2
2
None
DO
Wn,Expr
Do code to PC+Expr, (Wn)+1 times
2
2
None
33
ED
ED
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate)
1
1
OA,OB,OAB,
SA,SB,SAB
34
EDAC
EDAC
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance
1
1
OA,OB,OAB,
SA,SB,SAB
35
EXCH
EXCH
Wns,Wnd
Swap Wns with Wnd
1
1
None
36
FBCL
FBCL
Ws,Wnd
Find Bit Change from Left (MSb) Side
1
1
C
37
FF1L
FF1L
Ws,Wnd
Find First One from Left (MSb) Side
1
1
C
38
FF1R
FF1R
Ws,Wnd
Find First One from Right (LSb) Side
1
1
C
39
GOTO
GOTO
Expr
Go to address
2
2
None
GOTO
Wn
Go to indirect
1
2
None
40
41
42
INC
INC2
IOR
INC
f
f=f+1
1
1
C,DC,N,OV,Z
INC
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
INC
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
INC2
f
f=f+2
1
1
C,DC,N,OV,Z
INC2
f,WREG
WREG = f + 2
1
1
C,DC,N,OV,Z
INC2
Ws,Wd
Wd = Ws + 2
1
1
C,DC,N,OV,Z
IOR
f
f = f .IOR. WREG
1
1
N,Z
IOR
f,WREG
WREG = f .IOR. WREG
1
1
N,Z
IOR
#lit10,Wn
Wd = lit10 .IOR. Wd
1
1
N,Z
IOR
Wb,Ws,Wd
Wd = Wb .IOR. Ws
1
1
N,Z
IOR
Wb,#lit5,Wd
Wd = Wb .IOR. lit5
1
1
N,Z
LAC
LAC
Wso,#Slit4,Acc
Load Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
44
LNK
LNK
#lit14
Link frame pointer
1
1
None
45
LSR
LSR
f
f = Logical Right Shift f
1
1
C,N,OV,Z
LSR
f,WREG
WREG = Logical Right Shift f
1
1
C,N,OV,Z
LSR
Ws,Wd
Wd = Logical Right Shift Ws
1
1
C,N,OV,Z
LSR
Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns
1
1
N,Z
LSR
Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5
1
1
N,Z
MAC
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MAC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
43
46
47
48
MAC
MOV
MOVSAC
MOV
f,Wn
Move f to Wn
1
1
None
MOV
f
Move f to f
1
1
N,Z
MOV
f,WREG
Move f to WREG
1
1
N,Z
MOV
#lit16,Wn
Move 16-bit literal to Wn
1
1
None
MOV.b
#lit8,Wn
Move 8-bit literal to Wn
1
1
None
MOV
Wn,f
Move Wn to f
1
1
None
MOV
Wso,Wdo
Move Ws to Wd
1
1
None
MOV
WREG,f
Move WREG to f
1
1
N,Z
MOV.D
Wns,Wd
Move Double from W(ns):W(ns+1) to Wd
1
2
None
MOV.D
Ws,Wnd
Move Double from Ws to W(nd+1):W(nd)
1
2
None
Pre-fetch and store accumulator
1
1
None
MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB
DS70083G-page 174
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 21-2:
Base
Instr
#
49
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
MPY
Assembly Syntax
Multiply Wm by Wn to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
-(Multiply Wm by Wn) to Accumulator
1
1
None
Multiply and Subtract from Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
MPY.N
MPY.N
MSC
MSC
52
MUL
54
55
NOP
POP
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,
AWB
MUL.SS
Wb,Ws,Wnd
{Wnd+1, Wnd} = signed(Wb) * signed(Ws)
1
1
None
MUL.SU
Wb,Ws,Wnd
{Wnd+1, Wnd} = signed(Wb) * unsigned(Ws)
1
1
None
MUL.US
Wb,Ws,Wnd
{Wnd+1, Wnd} = unsigned(Wb) * signed(Ws)
1
1
None
MUL.UU
Wb,Ws,Wnd
{Wnd+1, Wnd} = unsigned(Wb) *
unsigned(Ws)
1
1
None
MUL.SU
Wb,#lit5,Wnd
{Wnd+1, Wnd} = signed(Wb) * unsigned(lit5)
1
1
None
MUL.UU
Wb,#lit5,Wnd
{Wnd+1, Wnd} = unsigned(Wb) *
unsigned(lit5)
1
1
None
MUL
f
W3:W2 = f * WREG
1
1
None
NEG
Acc
Negate Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
NEG
f
f=f+1
1
1
C,DC,N,OV,Z
NEG
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
NEG
Ws,Wd
C,DC,N,OV,Z
Wd = Ws + 1
1
1
NOP
No Operation
1
1
None
NOPR
No Operation
1
1
None
POP
f
Pop f from top-of-stack (TOS)
1
1
None
POP
Wdo
Pop from top-of-stack (TOS) to Wdo
1
1
None
POP.D
Wnd
Pop from top-of-stack (TOS) to
W(nd):W(nd+1)
1
2
None
Pop Shadow Registers
1
1
All
Push f to top-of-stack (TOS)
1
1
None
None
POP.S
56
PUSH
Status Flags
Affected
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
50
NEG
# of
# of
Words Cycles
MPY
51
53
Description
PUSH
f
PUSH
Wso
Push Wso to top-of-stack (TOS)
1
1
PUSH.D
Wns
Push W(ns):W(ns+1) to top-of-stack (TOS)
1
2
None
Push Shadow Registers
1
1
None
WDTO,Sleep
PUSH.S
57
PWRSAV
PWRSAV
Go into Sleep or Idle mode
1
1
58
RCALL
RCALL
Expr
Relative Call
1
2
None
RCALL
Wn
Computed Call
1
2
None
59
REPEAT
#lit1
REPEAT
#lit14
Repeat Next Instruction lit14+1 times
1
1
None
REPEAT
Wn
Repeat Next Instruction (Wn)+1 times
1
1
None
60
RESET
RESET
Software device Reset
1
1
None
61
RETFIE
RETFIE
Return from interrupt
1
3 (2)
None
62
RETLW
RETLW
None
63
RETURN
RETURN
64
RLC
RLC
65
66
67
RLNC
RRC
RRNC
#lit10,Wn
Return with literal in Wn
1
3 (2)
Return from Subroutine
1
3 (2)
None
f
f = Rotate Left through Carry f
1
1
C,N,Z
RLC
f,WREG
WREG = Rotate Left through Carry f
1
1
C,N,Z
RLC
Ws,Wd
Wd = Rotate Left through Carry Ws
1
1
C,N,Z
N,Z
RLNC
f
f = Rotate Left (No Carry) f
1
1
RLNC
f,WREG
WREG = Rotate Left (No Carry) f
1
1
N,Z
RLNC
Ws,Wd
Wd = Rotate Left (No Carry) Ws
1
1
N,Z
C,N,Z
RRC
f
f = Rotate Right through Carry f
1
1
RRC
f,WREG
WREG = Rotate Right through Carry f
1
1
C,N,Z
RRC
Ws,Wd
Wd = Rotate Right through Carry Ws
1
1
C,N,Z
N,Z
RRNC
f
f = Rotate Right (No Carry) f
1
1
RRNC
f,WREG
WREG = Rotate Right (No Carry) f
1
1
N,Z
RRNC
Ws,Wd
Wd = Rotate Right (No Carry) Ws
1
1
N,Z
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 175
dsPIC30F
TABLE 21-2:
Base
Instr
#
68
Assembly
Mnemonic
SAC
69
SE
70
SETM
71
72
73
74
75
76
INSTRUCTION SET OVERVIEW (CONTINUED)
SFTAC
SL
SUB
SUBB
SUBR
SUBBR
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
SAC
Acc,#Slit4,Wdo
Store Accumulator
1
1
SAC.R
Acc,#Slit4,Wdo
Store Rounded Accumulator
1
1
None
None
SE
Ws,Wnd
Wnd = sign-extended Ws
1
1
C,N,Z
SETM
f
f = 0xFFFF
1
1
None
SETM
WREG
WREG = 0xFFFF
1
1
None
SETM
Ws
Ws = 0xFFFF
1
1
None
SFTAC
Acc,Wn
Arithmetic Shift Accumulator by (Wn)
1
1
OA,OB,OAB,
SA,SB,SAB
SFTAC
Acc,#Slit6
Arithmetic Shift Accumulator by Slit6
1
1
OA,OB,OAB,
SA,SB,SAB
SL
f
f = Left Shift f
1
1
C,N,OV,Z
SL
f,WREG
WREG = Left Shift f
1
1
C,N,OV,Z
SL
Ws,Wd
Wd = Left Shift Ws
1
1
C,N,OV,Z
SL
Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns
1
1
N,Z
SL
Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5
1
1
N,Z
SUB
Acc
Subtract Accumulators
1
1
OA,OB,OAB,
SA,SB,SAB
SUB
f
f = f - WREG
1
1
C,DC,N,OV,Z
SUB
f,WREG
WREG = f - WREG
1
1
C,DC,N,OV,Z
SUB
#lit10,Wn
Wn = Wn - lit10
1
1
C,DC,N,OV,Z
SUB
Wb,Ws,Wd
Wd = Wb - Ws
1
1
C,DC,N,OV,Z
SUB
Wb,#lit5,Wd
Wd = Wb - lit5
1
1
C,DC,N,OV,Z
SUBB
f
f = f - WREG - (C)
1
1
C,DC,N,OV,Z
SUBB
f,WREG
WREG = f - WREG - (C)
1
1
C,DC,N,OV,Z
SUBB
#lit10,Wn
Wn = Wn - lit10 - (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBB
Wb,Ws,Wd
Wd = Wb - Ws - (C)
1
1
SUBB
Wb,#lit5,Wd
Wd = Wb - lit5 - (C)
1
1
SUBR
f
f = WREG - f
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBR
f,WREG
WREG = WREG - f
1
1
C,DC,N,OV,Z
SUBR
Wb,Ws,Wd
Wd = Ws - Wb
1
1
C,DC,N,OV,Z
SUBR
Wb,#lit5,Wd
Wd = lit5 - Wb
1
1
C,DC,N,OV,Z
SUBBR
f
f = WREG - f - (C)
1
1
C,DC,N,OV,Z
SUBBR
f,WREG
WREG = WREG -f - (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBBR
Wb,Ws,Wd
Wd = Ws - Wb - (C)
1
1
SUBBR
Wb,#lit5,Wd
Wd = lit5 - Wb - (C)
1
1
C,DC,N,OV,Z
SWAP.b
Wn
Wn = nibble swap Wn
1
1
None
77
SWAP
SWAP
Wn
Wn = byte swap Wn
1
1
None
78
TBLRDH
TBLRDH
Ws,Wd
Read Prog<23:16> to Wd<7:0>
1
2
None
79
TBLRDL
TBLRDL
Ws,Wd
Read Prog<15:0> to Wd
1
2
None
80
TBLWTH
TBLWTH
Ws,Wd
Write Ws<7:0> to Prog<23:16>
1
2
None
81
TBLWTL
TBLWTL
Ws,Wd
Write Ws to Prog<15:0>
1
2
None
82
ULNK
ULNK
Unlink frame pointer
1
1
None
83
XOR
XOR
f
f = f .XOR. WREG
1
1
N,Z
XOR
f,WREG
WREG = f .XOR. WREG
1
1
N,Z
XOR
#lit10,Wn
Wd = lit10 .XOR. Wd
1
1
N,Z
XOR
Wb,Ws,Wd
Wd = Wb .XOR. Ws
1
1
N,Z
84
ZE
XOR
Wb,#lit5,Wd
Wd = Wb .XOR. lit5
1
1
N,Z
ZE
Ws,Wnd
Wnd = Zero-extend Ws
1
1
C,Z,N
DS70083G-page 176
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
22.0
DEVELOPMENT SUPPORT
22.1
The PICmicro® microcontrollers are supported with a
full range of hardware and software development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Assemblers/Compilers/Linkers
- MPASM™ Assembler
- MPLAB C17 and MPLAB C18 C Compilers
- MPLINK™ Object Linker/
MPLIB™ Object Librarian
- MPLAB C30 C Compiler
- MPLAB ASM30 Assembler/Linker/Library
• Simulators
- MPLAB SIM Software Simulator
- MPLAB dsPIC30 Software Simulator
• Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB ICE 4000 In-Circuit Emulator
• In-Circuit Debugger
- MPLAB ICD 2
• Device Programmers
- PRO MATE® II Universal Device Programmer
- PICSTART® Plus Development Programmer
• Low Cost Demonstration Boards
- PICDEM™ 1 Demonstration Board
- PICDEM.net™ Demonstration Board
- PICDEM 2 Plus Demonstration Board
- PICDEM 3 Demonstration Board
- PICDEM 4 Demonstration Board
- PICDEM 17 Demonstration Board
- PICDEM 18R Demonstration Board
- PICDEM LIN Demonstration Board
- PICDEM USB Demonstration Board
• Evaluation Kits
- KEELOQ®
- PICDEM MSC
- microID®
- CAN
- PowerSmart®
- Analog
MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows®
based application that contains:
• An interface to debugging tools
- simulator
- programmer (sold separately)
- emulator (sold separately)
- in-circuit debugger (sold separately)
• A full-featured editor with color coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High level source code debugging
• Mouse over variable inspection
• Extensive on-line help
The MPLAB IDE allows you to:
• Edit your source files (either assembly or C)
• One touch assemble (or compile) and download
to PICmicro emulator and simulator tools
(automatically updates all project information)
• Debug using:
- source files (assembly or C)
- absolute listing file (mixed assembly and C)
- machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost effective
simulators, through low cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increasing flexibility
and power.
22.2
MPASM Assembler
The MPASM assembler is a full-featured, universal
macro assembler for all PICmicro MCUs.
The MPASM assembler generates relocatable object
files for the MPLINK object linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and
generated machine code and COFF files for
debugging.
The MPASM assembler features include:
• Integration into MPLAB IDE projects
• User defined macros to streamline assembly code
• Conditional assembly for multi-purpose source
files
• Directives that allow complete control over the
assembly process
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 177
dsPIC30F
22.3
MPLAB C17 and MPLAB C18
C Compilers
22.6
The MPLAB C17 and MPLAB C18 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC17CXXX and PIC18CXXX family of
microcontrollers. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
22.4
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK object linker combines relocatable
objects created by the MPASM assembler and the
MPLAB C17 and MPLAB C18 C compilers. It can link
relocatable objects from pre-compiled libraries, using
directives from a linker script.
The MPLIB object librarian manages the creation and
modification of library files of pre-compiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
22.5
MPLAB C30 C Compiler
MPLAB C30 is distributed with a complete ANSI C
standard library. All library functions have been validated and conform to the ANSI C library standard. The
library includes functions for string manipulation,
dynamic memory allocation, data conversion, timekeeping, and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic
information for high level source debugging with the
MPLAB IDE.
DS70083G-page 178
MPLAB ASM30 assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 compiler uses the
assembler to produce it’s object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
•
•
•
•
•
•
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
22.7
MPLAB SIM Software Simulator
The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the
PICmicro series microcontrollers on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until
Break, or Trace mode.
The MPLAB SIM simulator fully supports symbolic
debugging using the MPLAB C17 and MPLAB C18
C Compilers, as well as the MPASM assembler. The
software simulator offers the flexibility to develop and
debug code outside of the laboratory environment,
making it an excellent, economical software
development tool.
22.8
The MPLAB C30 C compiler is a full-featured, ANSI
compliant, optimizing compiler that translates standard
ANSI C programs into dsPIC30F assembly language
source. The compiler also supports many commandline options and language extensions to take full
advantage of the dsPIC30F device hardware capabilities, and afford fine control of the compiler code
generator.
MPLAB ASM30 Assembler, Linker,
and Librarian
MPLAB SIM30 Software Simulator
The MPLAB SIM30 software simulator allows code
development in a PC hosted environment by simulating
the dsPIC30F series microcontrollers on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a file, or user defined key press, to any of the pins.
The MPLAB SIM30 simulator fully supports symbolic
debugging using the MPLAB C30 C Compiler and
MPLAB ASM30 assembler. The simulator runs in either
a Command Line mode for automated tasks, or from
MPLAB IDE. This high speed simulator is designed to
debug, analyze and optimize time intensive DSP
routines.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
22.9
MPLAB ICE 2000
High Performance Universal
In-Circuit Emulator
22.11 MPLAB ICD 2 In-Circuit Debugger
The MPLAB ICE 2000 universal in-circuit emulator is
intended to provide the product development engineer
with a complete microcontroller design tool set for
PICmicro microcontrollers. Software control of the
MPLAB ICE 2000 in-circuit emulator is advanced by
the MPLAB Integrated Development Environment,
which allows editing, building, downloading and source
debugging from a single environment.
The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring
features. Interchangeable processor modules allow the
system to be easily reconfigured for emulation of different processors. The universal architecture of the
MPLAB ICE in-circuit emulator allows expansion to
support new PICmicro microcontrollers.
The MPLAB ICE 2000 in-circuit emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
22.10 MPLAB ICE 4000
High Performance Universal
In-Circuit Emulator
The MPLAB ICE 4000 universal in-circuit emulator is
intended to provide the product development engineer
with a complete microcontroller design tool set for highend PICmicro microcontrollers. Software control of the
MPLAB ICE in-circuit emulator is provided by the
MPLAB Integrated Development Environment, which
allows editing, building, downloading and source
debugging from a single environment.
The MPLAB ICD 4000 is a premium emulator system,
providing the features of MPLAB ICE 2000, but with
increased emulation memory and high speed performance for dsPIC30F and PIC18XXXX devices. Its
advanced emulator features include complex triggering
and timing, up to 2 Mb of emulation memory, and the
ability to view variables in real-time.
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low cost, run-time development tool,
connecting to the host PC via an RS-232 or high speed
USB interface. This tool is based on the Flash
PICmicro MCUs and can be used to develop for these
and other PICmicro microcontrollers. The MPLAB
ICD 2 utilizes the in-circuit debugging capability built
into the Flash devices. This feature, along with
Microchip’s In-Circuit Serial Programming™ (ICSPTM)
protocol, offers cost effective in-circuit Flash debugging
from the graphical user interface of the MPLAB Integrated Development Environment. This enables a
designer to develop and debug source code by setting
breakpoints, single-stepping and watching variables,
CPU status and peripheral registers. Running at full
speed enables testing hardware and applications in
real-time. MPLAB ICD 2 also serves as a development
programmer for selected PICmicro devices.
22.12 PRO MATE II Universal Device
Programmer
The PRO MATE II is a universal, CE compliant device
programmer with programmable voltage verification at
VDDMIN and VDDMAX for maximum reliability. It features
an LCD display for instructions and error messages
and a modular detachable socket assembly to support
various package types. In Stand-Alone mode, the
PRO MATE II device programmer can read, verify, and
program PICmicro devices without a PC connection. It
can also set code protection in this mode.
22.13 PICSTART Plus Development
Programmer
The PICSTART Plus development programmer is an
easy-to-use, low cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB
Integrated Development Environment software makes
using the programmer simple and efficient. The
PICSTART Plus development programmer supports
most PICmicro devices up to 40 pins. Larger pin count
devices, such as the PIC16C92X and PIC17C76X,
may be supported with an adapter socket. The
PICSTART Plus development programmer is CE
compliant.
The MPLAB ICE 4000 in-circuit emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple,
unified application.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 179
dsPIC30F
22.14 PICDEM 1 PICmicro
Demonstration Board
22.17 PICDEM 3 PIC16C92X
Demonstration Board
The PICDEM 1 demonstration board demonstrates the
capabilities of the PIC16C5X (PIC16C54 to
PIC16C58A), PIC16C61, PIC16C62X, PIC16C71,
PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All
necessary hardware and software is included to run
basic demo programs. The sample microcontrollers
provided with the PICDEM 1 demonstration board can
be programmed with a PRO MATE II device programmer, or a PICSTART Plus development programmer.
The PICDEM 1 demonstration board can be connected
to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232
interface, a potentiometer for simulated analog input,
push button switches and eight LEDs.
The PICDEM 3 demonstration board supports the
PIC16C923 and PIC16C924 in the PLCC package. All
the necessary hardware and software is included to run
the demonstration programs.
22.15 PICDEM.net Internet/Ethernet
Demonstration Board
The PICDEM.net demonstration board is an Internet/
Ethernet demonstration board using the PIC18F452
microcontroller and TCP/IP firmware. The board
supports any 40-pin DIP device that conforms to the
standard pinout used by the PIC16F877 or
PIC18C452. This kit features a user friendly TCP/IP
stack, web server with HTML, a 24L256 Serial
EEPROM for Xmodem download to web pages into
Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface, and a
16 x 2 LCD display. Also included is the book and
CD-ROM “TCP/IP Lean, Web Servers for Embedded
Systems,” by Jeremy Bentham
22.16 PICDEM 2 Plus
Demonstration Board
The PICDEM 2 Plus demonstration board supports
many 18-, 28-, and 40-pin microcontrollers, including
PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers
provided with the PICDEM 2 demonstration board can
be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or
MPLAB ICD 2 with a Universal Programmer Adapter.
The MPLAB ICD 2 and MPLAB ICE in-circuit emulators
may also be used with the PICDEM 2 demonstration
board to test firmware. A prototype area extends the
circuitry for additional application components. Some
of the features include an RS-232 interface, a 2 x 16
LCD display, a piezo speaker, an on-board temperature
sensor, four LEDs, and sample PIC18F452 and
PIC16F877 Flash microcontrollers.
DS70083G-page 180
22.18 PICDEM 4 8/14/18-Pin
Demonstration Board
The PICDEM 4 can be used to demonstrate the capabilities of the 8-, 14-, and 18-pin PIC16XXXX and
PIC18XXXX MCUs, including the PIC16F818/819,
PIC16F87/88, PIC16F62XA and the PIC18F1320 family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts,
including LIN and Motor Control using ECCP. Special
provisions are made for low power operation with the
super capacitor circuit, and jumpers allow on-board
hardware to be disabled to eliminate current draw in
this mode. Included on the demo board are provisions
for Crystal, RC or Canned Oscillator modes, a five volt
regulator for use with a nine volt wall adapter or battery,
DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2,
2x16 liquid crystal display, PCB footprints for H-Bridge
motor driver, LIN transceiver and EEPROM. Also
included are: header for expansion, eight LEDs, four
potentiometers, three push buttons and a prototyping
area. Included with the kit is a PIC16F627A and a
PIC18F1320. Tutorial firmware is included along with
the User’s Guide.
22.19 PICDEM 17 Demonstration Board
The PICDEM 17 demonstration board is an evaluation
board that demonstrates the capabilities of several
Microchip microcontrollers, including PIC17C752,
PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device
programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user
tailored application development. The PICDEM 17
demonstration board supports program download and
execution from external on-board Flash memory. A
generous prototype area is available for user hardware
expansion.
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
22.20 PICDEM 18R PIC18C601/801
Demonstration Board
22.23 PICDEM USB PIC16C7X5
Demonstration Board
The PICDEM 18R demonstration board serves to assist
development of the PIC18C601/801 family of Microchip
microcontrollers. It provides hardware implementation
of both 8-bit Multiplexed/De-multiplexed and 16-bit
Memory modes. The board includes 2 Mb external
Flash memory and 128 Kb SRAM memory, as well as
serial EEPROM, allowing access to the wide range of
memory types supported by the PIC18C601/801.
The PICDEM USB Demonstration Board shows off the
capabilities of the PIC16C745 and PIC16C765 USB
microcontrollers. This board provides the basis for
future USB products.
In addition to the PICDEM series of circuits, Microchip
has a line of evaluation kits and demonstration software
for these products.
22.21 PICDEM LIN PIC16C43X
Demonstration Board
The powerful LIN hardware and software kit includes a
series of boards and three PICmicro microcontrollers.
The small footprint PIC16C432 and PIC16C433 are
used as slaves in the LIN communication and feature
on-board LIN transceivers. A PIC16F874 Flash microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus
communication.
22.22 PICkit™ 1 Flash Starter Kit
A complete "development system in a box", the PICkit
Flash Starter Kit includes a convenient multi-section
board for programming, evaluation, and development
of 8/14-pin Flash PIC® microcontrollers. Powered via
USB, the board operates under a simple Windows GUI.
The PICkit 1 Starter Kit includes the user's guide (on
CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB® IDE (Integrated Development Environment) software, software
and hardware "Tips 'n Tricks for 8-pin Flash PIC®
Microcontrollers" Handbook and a USB Interface
Cable. Supports all current 8/14-pin Flash PIC
microcontrollers, as well as many future planned
devices.
 2004 Microchip Technology Inc.
22.24 Evaluation and
Programming Tools
• KEELOQ evaluation and programming tools for
Microchip’s HCS Secure Data Products
• CAN developers kit for automotive network
applications
• Analog design boards and filter design software
• PowerSmart battery charging evaluation/
calibration kits
• IrDA® development kit
• microID development and rfLab™ development
software
• SEEVAL® designer kit for memory evaluation and
endurance calculations
• PICDEM MSC demo boards for Switching mode
power supply, high power IR driver, delta sigma
ADC, and flow rate sensor
Check the Microchip web page and the latest Product
Line Card for the complete list of demonstration and
evaluation kits.
Preliminary
DS70083G-page 181
dsPIC30F
NOTES:
DS70083G-page 182
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
23.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Note:
The specifications listed in this section are provided for design guidance only. Please refer to the individual
device data sheets for electrical characteristics specific to each device.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to VSS (Note 1) ......................................................................................... 0V to +13.25V
Total power dissipation (Note 2) ...............................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD) ..........................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ................................................................................................... ±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)
2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup.
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to VSS.
†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
All peripheral electrical characteristics are specified. For exact peripherals available on specific
devices, please refer the the Family Cross Reference Table.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 183
dsPIC30F
23.1
DC Characteristics
TABLE 23-1:
OPERATING MIPS VS. VOLTAGE
Max MIPS
VDD Range
Temp Range
dsPIC30FXXX-30I
dsPIC30FXXX-20I
dsPIC30FXXX-20E
30
20
—
4.5-5.5V
-40°C to 85°C
4.5-5.5V
-40°C to 125°C
—
—
20
3.0-3.6V
-40°C to 85°C
15
10
—
3.0-3.6V
-40°C to 125°C
—
—
10
2.5-3.0V
-40°C to 85°C
10
7.5
—
TABLE 23-2:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
Conditions
Operating Voltage(2)
DC10
VDD
Supply Voltage
2.5
—
5.5
V
Industrial temperature
DC11
VDD
Supply Voltage
3.0
—
5.5
V
Extended temperature
Voltage(3)
DC12
VDR
RAM Data Retention
—
1.5
—
V
DC16
VPOR
VDD Start Voltage
to ensure internal
Power-on Reset signal
—
VSS
—
V
DC17
SVDD
VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05
Note 1:
2:
3:
V/ms 0-5V in 0.1 sec
0-3V in 60 ms
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which VDD can be lowered without losing RAM data.
DS70083G-page 184
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-3:
DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2)
DC20
—
—
mA
-40°C
DC20a
4
—
mA
25°C
DC20b
—
—
mA
85°C
DC20c
—
—
mA
125°C
DC20d
—
—
mA
-40°C
DC20e
7
—
mA
25°C
DC20f
—
—
mA
85°C
DC20g
—
—
mA
125°C
DC23
—
—
mA
-40°C
DC23a
13
—
mA
25°C
DC23b
—
—
mA
85°C
DC23c
—
—
mA
125°C
DC23d
—
—
mA
-40°C
DC23e
22
—
mA
25°C
DC23f
—
—
mA
85°C
DC23g
—
—
mA
125°C
DC24
—
—
mA
-40°C
DC24a
29
—
mA
25°C
DC24b
—
—
mA
85°C
DC24c
—
—
mA
125°C
DC24d
—
—
mA
-40°C
DC24e
50
—
mA
25°C
DC24f
—
—
mA
85°C
DC24g
—
—
mA
125°C
DC25
—
—
mA
-40°C
DC25a
23
—
mA
25°C
DC25b
—
—
mA
85°C
DC25c
—
—
mA
125°C
DC25d
—
—
mA
-40°C
DC25e
41
—
mA
25°C
DC25f
—
—
mA
85°C
—
—
mA
125°C
DC25g
Note 1:
2:
3.3V
1 MIPS EC mode
5V
3.3V
4 MIPS EC mode, 4X PLL
5V
3.3V
10 MIPS EC mode, 4X PLL
5V
3.3V
8 MIPS EC mode, 8X PLL
5V
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 185
dsPIC30F
TABLE 23-3:
DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2)
DC27
—
—
mA
-40°C
DC27a
50
—
mA
25°C
DC27b
—
—
mA
85°C
DC27c
—
—
mA
-40°C
DC27d
90
—
mA
25°C
DC27e
—
—
mA
85°C
DC27f
—
—
mA
125°C
DC28
—
—
mA
-40°C
DC28a
42
—
mA
25°C
DC28b
—
—
mA
85°C
DC28c
—
—
mA
-40°C
DC28d
76
—
mA
25°C
DC28e
—
—
mA
85°C
DC28f
—
—
mA
125°C
DC29
—
—
mA
-40°C
DC29a
146
—
mA
25°C
DC29b
—
—
mA
85°C
DC29c
—
—
mA
125°C
DC30
—
—
mA
-40°C
DC30a
7.0
—
mA
25°C
DC30b
—
—
mA
85°C
DC30c
—
—
mA
125°C
DC30d
—
—
mA
-40°C
DC30e
12
—
mA
25°C
DC30f
—
—
mA
85°C
DC30g
—
—
mA
125°C
DC31
—
—
mA
-40°C
DC31a
1.5
—
mA
25°C
DC31b
—
—
mA
85°C
DC31c
—
—
mA
125°C
DC31d
—
—
mA
-40°C
DC31e
2.5
—
mA
25°C
DC31f
—
—
mA
85°C
DC31g
—
—
mA
125°C
Note 1:
2:
3.3V
20 MIPS EC mode, 8X PLL
5V
3.3V
16 MIPS EC mode, 16X PLL
5V
5V
30 MIPS EC mode, 16X PLL
3.3V
FRC (~ 2 MIPS)
5V
3.3V
LPRC (~ 512 kHz)
5V
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
DS70083G-page 186
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-4:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Idle Current (IIDLE): Core OFF Clock ON Base Current(2)
DC40
—
—
mA
-40°C
DC40a
3
—
mA
25°C
DC40b
—
—
mA
85°C
DC40c
—
—
mA
125°C
DC40d
—
—
mA
-40°C
DC40e
5
—
mA
25°C
DC40f
—
—
mA
85°C
DC40g
—
—
mA
125°C
DC43
—
—
mA
-40°C
DC43a
7.7
—
mA
25°C
DC43b
—
—
mA
85°C
DC43c
—
—
mA
125°C
DC43d
—
—
mA
-40°C
DC43e
13
—
mA
25°C
DC43f
—
—
mA
85°C
DC43g
—
—
mA
125°C
DC44
—
—
mA
-40°C
DC44a
15
—
mA
25°C
DC44b
—
—
mA
85°C
DC44c
—
—
mA
125°C
DC44d
—
—
mA
-40°C
DC44e
29
—
mA
25°C
DC44f
—
—
mA
85°C
DC44g
—
—
mA
125°C
DC45
—
—
mA
-40°C
DC45a
13
—
mA
25°C
DC45b
—
—
mA
85°C
DC45c
—
—
mA
125°C
DC45d
—
—
mA
-40°C
DC45e
24
—
mA
25°C
DC45f
—
—
mA
85°C
DC45g
—
—
mA
125°C
Note 1:
2:
3.3V
1 MIPS EC mode
5V
3.3V
4 MIPS EC mode, 4X PLL
5V
3.3V
10 MIPS EC mode, 4X PLL
5V
3.3V
8 MIPS EC mode, 8X PLL
5V
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
Base IIDLE current is measured with Core off, Clock on and all modules turned off.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 187
dsPIC30F
TABLE 23-4:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Idle Current (IIDLE): Core OFF Clock ON Base Current(2)
DC47
—
—
mA
-40°C
DC47a
29
—
mA
25°C
DC47b
—
—
mA
85°C
DC47c
—
—
mA
-40°C
DC47d
52
—
mA
25°C
DC47e
—
—
mA
85°C
DC47f
—
—
mA
125°C
DC48
—
—
mA
-40°C
DC48a
24
—
mA
25°C
DC48b
—
—
mA
85°C
DC48c
—
—
mA
-40°C
DC48d
43
—
mA
25°C
DC48e
—
—
mA
85°C
DC48f
—
—
mA
125°C
DC49
—
—
mA
-40°C
DC49a
73
—
mA
25°C
DC49b
—
—
mA
85°C
DC49c
—
—
mA
125°C
DC50
—
—
mA
-40°C
DC50a
4.0
—
mA
25°C
DC50b
—
—
mA
85°C
DC50c
—
—
mA
125°C
DC50d
—
—
mA
-40°C
DC50e
7.0
—
mA
25°C
DC50f
—
—
mA
85°C
DC50g
—
—
mA
125°C
DC51
—
—
mA
-40°C
DC51a
1.0
—
mA
25°C
DC51b
—
—
mA
85°C
DC51c
—
—
mA
125°C
DC51d
—
—
mA
-40°C
DC51e
1.5
—
mA
25°C
DC51f
—
—
mA
85°C
DC51g
—
—
mA
125°C
Note 1:
2:
3.3V
20 MIPS EC mode, 8X PLL
5V
3.3V
16 MIPS EC mode, 16X PLL
5V
5V
30 MIPS EC mode, 16X PLL
3.3V
FRC (~ 2 MIPS)
5V
3.3V
LPRC (~ 512 kHz)
5V
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
Base IIDLE current is measured with Core off, Clock on and all modules turned off.
DS70083G-page 188
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-5:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Power Down Current (IPD)(2)
DC60
—
—
µA
-40°C
DC60a
0.1
—
µA
25°C
DC60b
—
—
µA
85°C
DC60c
—
—
µA
125°C
DC60d
—
—
µA
-40°C
DC60e
0.2
—
µA
25°C
DC60f
—
—
µA
85°C
DC60g
—
—
µA
125°C
DC61
—
—
µA
-40°C
DC61a
6.8
—
µA
25°C
DC61b
—
—
µA
85°C
DC61c
—
—
µA
125°C
DC61d
—
—
µA
-40°C
DC61e
16
—
µA
25°C
DC61f
—
—
µA
85°C
DC61g
—
—
µA
125°C
DC62
—
—
µA
-40°C
DC62a
5.5
—
µA
25°C
DC62b
—
—
µA
85°C
DC62c
—
—
µA
125°C
DC62d
—
—
µA
-40°C
DC62e
7.5
—
µA
25°C
DC62f
—
—
µA
85°C
DC62g
—
—
µA
125°C
DC63
—
—
µA
-40°C
DC63a
32
—
µA
25°C
DC63b
—
—
µA
85°C
DC63c
—
—
µA
125°C
DC63d
—
—
µA
-40°C
DC63e
38
—
µA
25°C
DC63f
—
—
µA
85°C
DC63g
—
—
µA
125°C
Note 1:
2:
3:
3.3V
Base Power Down Current(3)
5V
3.3V
Watchdog Timer Current: ∆IWDT(3)
5V
3.3V
Timer 1 w/32 kHz Crystal: ∆ITI32(3)
5V
3.3V
BOR On: ∆IBOR(3)
5V
Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. LVD, BOR, WDT, etc. are all switched off.
The ∆ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 189
dsPIC30F
TABLE 23-5:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Power Down Current (IPD)(2)
DC66
—
—
µA
-40°C
DC66a
25
—
µA
25°C
DC66b
—
—
µA
85°C
DC66c
—
—
µA
125°C
DC66d
—
—
µA
-40°C
DC66e
30
—
µA
25°C
DC66f
—
—
µA
85°C
—
—
µA
125°C
DC66g
Note 1:
2:
3:
3.3V
Low Voltage Detect: ∆ILVD(3)
5V
Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. LVD, BOR, WDT, etc. are all switched off.
The ∆ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
DS70083G-page 190
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-6:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Min
Typ(1)
Max
Units
I/O pins:
with Schmitt Trigger buffer
VSS
—
0.2 VDD
V
DI15
MCLR
VSS
—
0.2 VDD
V
DI16
OSC1 (in XT, HS and LP modes)
VSS
—
0.2 VDD
V
VIL
DI10
Characteristic
Conditions
Input Low Voltage(2)
(3)
DI17
OSC1 (in RC mode)
VSS
—
0.3 VDD
V
DI18
SDA, SCL
TBD
—
TBD
V
SM bus disabled
SDA, SCL
TBD
—
TBD
V
SM bus enabled
I/O pins:
with Schmitt Trigger buffer
0.8 VDD
—
VDD
V
DI25
MCLR
0.8 VDD
—
VDD
V
DI26
OSC1 (in XT, HS and LP modes) 0.7 VDD
—
VDD
V
DI27
(3)
OSC1 (in RC mode)
0.9 VDD
—
VDD
V
DI28
SDA, SCL
TBD
—
TBD
V
SM bus disabled
DI29
SDA, SCL
TBD
—
TBD
V
SM bus enabled
50
250
400
µA
VDD = 5V, VPIN = VSS
TBD
TBD
TBD
µA
VDD = 3V, VPIN = VSS
DI19
VIH
DI20
ICNPU
Input High Voltage(2)
CNXX Pull-up
Current(2)
DI30
DI31
IIL
Input Leakage Current(2)(4)(5)
DI50
I/O ports
—
0.01
±1
µA
VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
DI51
Analog input pins
—
0.50
—
µA
VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
DI55
MCLR
—
0.05
±5
µA
VSS ≤ VPIN ≤ VDD
DI56
OSC1
—
0.05
±5
µA
VSS ≤ VPIN ≤ VDD, XT, HS
and LP Osc mode
Note 1:
2:
3:
4:
5:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that
the dsPIC30F device be driven with an external clock while in RC mode.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 191
dsPIC30F
TABLE 23-7:
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
—
—
0.6
V
IOL = 8.5 mA, VDD = 5V
Conditions
Output Low Voltage(2)
VOL
DO10
I/O ports
—
—
TBD
V
IOL = 2.0 mA, VDD = 3V
DO16
OSC2/CLKOUT
—
—
0.6
V
IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode)
—
—
TBD
V
IOL = 2.0 mA, VDD = 3V
VDD – 0.7
—
—
V
IOH = -3.0 mA, VDD = 5V
TBD
—
—
V
IOH = -2.0 mA, VDD = 3V
Output High Voltage(2)
VOH
DO20
I/O ports
DO26
OSC2/CLKOUT
(RC or EC Osc mode)
VDD – 0.7
—
—
V
IOH = -1.3 mA, VDD = 5V
TBD
—
—
V
IOH = -2.0 mA, VDD = 3V
Capacitive Loading Specs
on Output Pins(2)
DO50
COSCO
OSC2/SOSCO pin
—
—
15
pF
In XTL, XT, HS and LP modes
when external clock is used to
drive OSC1.
DO56
CIO
All I/O pins and OSC2
—
—
50
pF
RC or EC Osc mode
DO58
CB
SCL, SDA
—
—
400
pF
In I2C mode
Note 1:
2:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
FIGURE 23-1:
LOW-VOLTAGE DETECT CHARACTERISTICS
VDD
LV10
LVDIF
(LVDIF set by hardware)
DS70083G-page 192
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-8:
ELECTRICAL CHARACTERISTICS: LVDL
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
LV10
Characteristic(1)
Symbol
VPLVD
Min
Typ
Max
Units
LVDL Voltage on VDD transition LVDL = 0000(2)
high to low
—
—
—
V
LVDL = 0001(2)
—
—
—
V
LVDL = 0010(2)
—
—
—
V
—
—
—
V
LVDL = 0100
2.50
—
2.65
V
LVDL = 0101
2.70
—
2.86
V
LVDL = 0110
2.80
—
2.97
V
LVDL = 0111
3.00
—
3.18
V
LVDL = 1000
3.30
—
3.50
V
LVDL = 1001
3.50
—
3.71
V
LVDL = 1010
3.60
—
3.82
V
LVDL = 1011
3.80
—
4.03
V
LVDL = 1100
4.00
—
4.24
V
LVDL = 1101
4.20
—
4.45
V
LVDL = 1110
4.50
—
4.77
V
LVDL = 1111
—
—
—
V
LVDL = 0011
LV15
Note 1:
2:
VLVDIN
External LVD input pin
threshold voltage
(2)
Conditions
These parameters are characterized but not tested in manufacturing.
These values not in usable operating range.
FIGURE 23-2:
BROWN-OUT RESET CHARACTERISTICS
VDD
BO10
(Device in Brown-out Reset)
BO15
(Device not in Brown-out Reset)
RESET (due to BOR)
Power Up Time-out
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 193
dsPIC30F
TABLE 23-9:
ELECTRICAL CHARACTERISTICS: BOR
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
VBOR
BO10
Min
Typ(1)
Max
Units
BORV = 00(3)
—
—
—
V
BORV = 01
2.7
—
2.86
V
BORV = 10
4.2
—
4.46
V
BORV = 11
4.5
—
4.78
V
—
5
—
mV
Characteristic
BOR Voltage(2) on
VDD transition high to
low
Conditions
Not in operating
range
BO15
VBHYS
Note 1:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
00 values not in usable operating range.
2:
3:
TABLE 23-10: DC CHARACTERISTICS: PROGRAM AND EEPROM
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
Conditions
Data EEPROM Memory(2)
D120
ED
Byte Endurance
100K
1M
—
E/W
D121
VDRW
VDD for Read/Write
VMIN
—
5.5
V
-40°C ≤ TA ≤ +85°C
Using NVMCON to read/write
VMIN = Minimum operating
voltage
D122
TDEW
Erase/Write Cycle Time
—
2
—
ms
D123
TRETD
Characteristic Retention
40
100
—
Year
Provided no other specifications
are violated
D124
IDEW
IDD during Programming
—
10
30
mA
Row erase
-40°C ≤ TA ≤ +85°C
(2)
Program FLASH Memory
D130
EP
Cell Endurance
10K
100K
—
E/W
D131
VPR
VDD for Read
VMIN
—
5.5
V
D132
VEB
VDD for Bulk Erase
3.0
—
5.5
V
D133
VPEW
VDD for Erase/Write
3.0
—
5.5
V
D134
TPEW
Erase/Write Cycle Time
—
2
—
ms
D135
TRETD
Characteristic Retention
40
100
—
Year
D136
TEB
ICSP Block Erase Time
—
4
—
ms
D137
IPEW
IDD during Programming
—
10
30
mA
Row erase
D138
IEB
IDD during Programming
—
10
30
mA
Bulk erase
Note 1:
2:
VMIN = Minimum operating
voltage
Provided no other specifications
are violated
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DS70083G-page 194
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
23.2
AC Characteristics and Timing Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
TABLE 23-11: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Operating voltage VDD range as described in DC Spec Section 23.0.
AC CHARACTERISTICS
FIGURE 23-3:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 - for all pins except OSC2
Load Condition 2 - for OSC2
VDD/2
RL
CL
Pin
VSS
CL
Pin
RL = 464 Ω
CL = 50 pF for all pins except OSC2
5 pF for OSC2 output
VSS
FIGURE 23-4:
EXTERNAL CLOCK TIMING
Q4
Q1
Q2
Q3
Q4
Q1
OSC1
OS20
OS30
OS25
OS30
OS31
OS31
CLKOUT
OS40
 2004 Microchip Technology Inc.
Preliminary
OS41
DS70083G-page 195
dsPIC30F
TABLE 23-12: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
FOSC
OS10
Characteristic
Min
Typ(1)
Max
Units
External CLKIN Frequency(2)
(External clocks allowed only
in EC mode)
DC
4
4
4
—
—
—
—
40
10
10
7.5
MHz
MHz
MHz
MHz
EC
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
Oscillator Frequency(2)
DC
0.4
4
4
4
4
10
31
—
—
—
—
—
—
—
—
—
—
8
512
4
4
10
10
10
7.5
25
33
—
—
MHz
MHz
MHz
MHz
MHz
MHz
MHz
kHz
MHz
kHz
RC
XTL
XT
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS
LP
FRC internal
LPRC internal
—
—
—
—
See parameter OS10
for FOSC value
Conditions
OS20
TOSC
TOSC = 1/FOSC
OS25
TCY
Instruction Cycle Time(2)(3)
33
—
DC
ns
See Table 23-14
OS30
TosL,
TosH
External Clock(2) in (OSC1)
High or Low Time
.45 x TOSC
—
—
ns
EC
OS31
TosR,
TosF
External Clock(2) in (OSC1)
Rise or Fall Time
—
—
20
ns
EC
OS40
TckR
CLKOUT Rise Time(2)(4)
—
6
10
ns
OS41
TckF
CLKOUT Fall Time(2)(4)
—
6
10
ns
Note 1:
2:
3:
4:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
Measurements are taken in EC or ERC modes. The CLKOUT signal is measured on the OSC2 pin.
CLKOUT is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).
DS70083G-page 196
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-13: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)
Symbol
Min
Typ(2)
Max
Units
Conditions
OS50
FPLLI
PLL Input Frequency Range(2)
4
—
10
MHz
EC, XT modes with PLL
OS51
FSYS
On-chip PLL Output(2)
16
—
120
MHz
EC, XT modes with PLL
OS52
TLOC
PLL Start-up Time (Lock Time)
—
20
50
µs
OS53
DCLK
CLKOUT Stability (Jitter)
TBD
1
TBD
%
Note 1:
2:
Measured over 100 ms
period
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
TABLE 23-14: INTERNAL CLOCK TIMING EXAMPLES
Clock
Oscillator
Mode
FOSC
(MHz)(1)
TCY (µsec)(2)
MIPS(3)
w/o PLL
MIPS(3)
w PLL x4
MIPS(3)
w PLL x8
MIPS(3)
w PLL x16
EC
0.200
20.0
0.05
—
—
—
XT
Note 1:
2:
3:
4
1.0
1.0
4.0
8.0
16.0
10
0.4
2.5
10.0
20.0
—
25
0.16
25.0
—
—
—
4
1.0
1.0
4.0
8.0
16.0
10
0.4
2.5
10.0
20.0
—
Assumption: Oscillator Postscaler is divide by 1.
Instruction Execution Cycle Time: TCY = 1 / MIPS.
Instruction Execution Frequency: MIPS = (FOSC * PLLx) / 4 [since there are 4 Q clocks per instruction
cycle].
TABLE 23-15: INTERNAL RC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ
Max
Units
Conditions
TBD
—
TBD
%
-40°C to +85°C
VDD = 3.3V
TBD
—
TBD
%
-40°C to +85°C
VDD = 5V
F20
TBD
—
TBD
%
-40°C to +85°C
VDD = 3V
F21
TBD
—
TBD
%
-40°C to +85°C
VDD = 5V
FRC @ Freq = 8 MHz(1)
F16
F19
LPRC @ Freq = 512 kHz(2)
Note 1:
2:
3:
Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
LPRC frequency after calibration.
Change of LPRC frequency as VDD changes.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 197
dsPIC30F
FIGURE 23-5:
CLKOUT AND I/O TIMING CHARACTERISTICS
I/O Pin
(Input)
DI35
DI40
I/O Pin
(Output)
New Value
Old Value
DO31
DO32
Note: Refer to Figure 23-3 for load conditions.
TABLE 23-16: CLKOUT AND I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
DO31
Symbol
TIOR
Characteristic(1)(2)(3)
Port output rise time
Min
Typ(4)
Max
Units
Conditions
—
10
25
ns
—
DO32
TIOF
Port output fall time
—
10
25
ns
—
DI35
TINP
INTx pin high or low time (output)
20
—
—
ns
—
TRBP
CNx high or low time (input)
2 TCY
—
—
ns
—
DI40
Note 1:
2:
3:
4:
These parameters are asynchronous events not related to any internal clock edges
Measurements are taken in RC mode and EC mode where CLKOUT output is 4 x TOSC.
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
DS70083G-page 198
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-6:
VDD
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
SY12
MCLR
SY10
Internal
POR
SY11
PWRT
Time-out
OSC
Time-out
SY30
Internal
RESET
Watchdog
Timer
RESET
SY13
SY20
SY13
I/O Pins
SY35
FSCM
Delay
Note: Refer to Figure 23-3 for load conditions.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 199
dsPIC30F
TABLE 23-17: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
SY10
TmcL
MCLR Pulse Width (low)
SY11
TPWRT
Power-up Timer Period
Min
Typ(2)
Max
Units
Conditions
2
—
—
µs
-40°C to +85°C
TBD
TBD
TBD
TBD
0
4
16
64
TBD
TBD
TBD
TBD
ms
-40°C to +85°C
User programmable
-40°C to +85°C
SY12
TPOR
Power On Reset Delay
3
10
30
µs
SY13
TIOZ
I/O Hi-impedance from MCLR
Low or Watchdog Timer Reset
—
—
100
ns
SY20
TWDT1
Watchdog Timer Time-out Period
(No Prescaler)
1.8
2.0
2.2
ms
VDD = 5V, -40°C to +85°C
1.9
2.1
2.3
ms
VDD = 3V, -40°C to +85°C
SY25
TBOR
Brown-out Reset Pulse Width(3)
100
—
—
µs
VDD ≤ VBOR (D034)
SY30
TOST
Oscillation Start-up Timer Period
—
1024 TOSC
—
—
TOSC = OSC1 period
SY35
TFSCM
Fail-Safe Clock Monitor Delay
—
100
—
µs
-40°C to +85°C
TWDT2
Note 1:
2:
3:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Refer to Figure 23-2 and Table 23-9 for BOR.
FIGURE 23-7:
BAND GAP START-UP TIME CHARACTERISTICS
VBGAP
0V
Enable Band Gap
(see Note)
Band Gap
Stable
SY40
Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.
TABLE 23-18: BAND GAP START-UP TIME REQUIREMENTS
AC CHARACTERISTICS
Param
No.
SY40
Note 1:
2:
Symbol
TBGAP
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic(1)
Min
Typ(2)
Max
Units
Band Gap Start-up Time
—
20
50
µs
Conditions
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13>Status bit
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
DS70083G-page 200
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-8:
TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS
TxCK
Tx11
Tx10
Tx15
Tx20
OS60
TMRX
Note: Refer to Figure 23-3 for load conditions.
TABLE 23-19: TYPE A TIMER (TIMER1) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TA10
TA11
TA15
Symbol
TTXH
TTXL
TTXP
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TA15
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
TCY + 10
—
—
ns
Greater of:
20 ns or
(TCY + 40)/N
—
—
—
TxCK Input Period Synchronous,
no prescaler
Synchronous,
with prescaler
Asynchronous
OS60
Ft1
TA20
TCKEXTMRL Delay from External TQCK Clock
Edge to Timer Increment
Note:
SOSCI/T1CK oscillator input
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
20
—
—
ns
DC
—
50
kHz
6 TOSC
—
2 TOSC
Must also meet
parameter TA15
N = prescale
value
(1, 8, 64, 256)
Timer1 is a Type A.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 201
dsPIC30F
TABLE 23-20: TYPE B TIMER (TIMER2 AND TIMER4) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TB10
TB11
TB15
Symbol
TtxH
TtxL
TtxP
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
TCY + 10
—
—
ns
—
6 TOSC
—
TxCK Input Period Synchronous,
no prescaler
Synchronous,
with prescaler
TB20
Note:
TCKEXTMRL Delay from External TQCK Clock
Edge to Timer Increment
Greater of:
20 ns or
(TCY + 40)/N
2 TOSC
Conditions
Must also meet
parameter TB15
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
Timer2 and Timer4 are Type B.
TABLE 23-21: TYPE C TIMER (TIMER3 AND TIMER5) EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
TC10
TtxH
TxCK High Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC11
TtxL
TxCK Low Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC15
TtxP
TxCK Input Period Synchronous,
no prescaler
TCY + 10
—
—
ns
N = prescale
value
(1, 8, 64, 256)
—
6 TOSC
—
Synchronous,
with prescaler
TC20
Note:
TCKEXTMRL Delay from External TQCK Clock
Edge to Timer Increment
Greater of:
20 ns or
(TCY + 40)/N
2 TOSC
Timer3 and Timer5 are Type C.
DS70083G-page 202
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-9:
INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
ICX
IC10
IC11
IC15
Note: Refer to Figure 23-3 for load conditions.
TABLE 23-22: INPUT CAPTURE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)
Symbol
IC10
TccL
ICx Input Low Time
No Prescaler
IC11
TccH
ICx Input High Time
No Prescaler
IC15
TccP
ICx Input Period
Min
Max
Units
0.5 TCY + 20
—
ns
10
—
ns
0.5 TCY + 20
—
ns
With Prescaler
With Prescaler
Note 1:
10
—
ns
(2 TCY + 40)/N
—
ns
Conditions
N = prescale
value (1, 4, 16)
These parameters are characterized but not tested in manufacturing.
FIGURE 23-10:
OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
OCx
(Output Compare
or PWM Mode)
OC10
OC11
Note: Refer to Figure 23-3 for load conditions.
TABLE 23-23: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ(2)
Max
Units
Conditions
OC10
TccF
OCx Output Fall Time
—
10
25
ns
—
OC11
TccR
OCx Output Rise Time
—
10
25
ns
—
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 203
dsPIC30F
FIGURE 23-11:
OC/PWM MODULE TIMING CHARACTERISTICS
OC20
OCFA/OCFB
OC15
OCx
TABLE 23-24: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ(2)
Max
Units
25
ns
OC15 TFD
Fault Input to PWM I/O
Change
—
—
OC20 TFLT
Fault Input Pulse Width
—
—
Note 1:
2:
Conditions
VDD = 3V
TBD
ns
VDD = 5V
50
ns
VDD = 3V
TBD
ns
VDD = 5V
-40°C to +85°C
-40°C to +85°C
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
DS70083G-page 204
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-12:
DCI MODULE (MULTICHANNEL, I2S MODES) TIMING CHARACTERISTICS
CSCK
(SCKE = 1)
CS11
CS10
CS21
CS20
CS20
CS21
CSCK
(SCKE = 0)
COFS
CS55 CS56
CS35
CS51
CSDO
HIGH-Z
70
CS50
LSb
MSb
CS30
CSDI
HIGH-Z
CS31
LSb IN
MSb IN
CS40 CS41
Note: Refer to Figure 23-3 for load conditions.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 205
dsPIC30F
TABLE 23-25: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
TcSCKL
CS10
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
TCY / 2 + 20
—
—
ns
—
30
—
—
ns
—
TCY / 2 + 20
—
—
ns
—
CSCK Output High Time(3)
(CSCK pin is an output)
30
—
—
ns
—
CSCK Input Low Time
(CSCK pin is an input)
CSCK Output Low Time(3)
(CSCK pin is an output)
TcSCKH
CS11
CSCK Input High Time
(CSCK pin is an input)
CS20
TcSCKF
CSCK Output Fall Time(4)
(CSCK pin is an output)
—
10
25
ns
—
CS21
TcSCKR
CSCK Output Rise Time(4)
(CSCK pin is an output)
—
10
25
ns
—
CS30
TcSDOF
CSDO Data Output Fall Time(4)
—
10
25
ns
—
Time(4)
CS31
TcSDOR
CSDO Data Output Rise
—
10
25
ns
—
CS35
TDV
Clock edge to CSDO data valid
—
—
10
ns
—
CS36
TDIV
Clock edge to CSDO tri-stated
10
—
20
ns
—
CS40
TCSDI
Setup time of CSDI data input to
CSCK edge (CSCK pin is input
or output)
20
—
—
ns
—
CS41
THCSDI
Hold time of CSDI data input to
CSCK edge (CSCK pin is input
or output)
20
—
—
ns
—
CS50
TcoFSF
COFS Fall Time
(COFS pin is output)
—
10
25
ns
Note 1
CS51
TcoFSR
COFS Rise Time
(COFS pin is output)
—
10
25
ns
Note 1
CS55
TscoFS
Setup time of COFS data input to
CSCK edge (COFS pin is input)
20
—
—
ns
—
CS56
THCOFS
Hold time of COFS data input to
CSCK edge (COFS pin is input)
20
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all DCI pins.
DS70083G-page 206
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-13:
DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS
BIT_CLK
(CSCK)
CS61
CS60
CS62
CS21
CS20
CS71
CS70
CS72
SYNC
(COFS)
CS76
CS75
CS80
SDO
(CSDO)
MSb
LSb
LSb
CS76
CS75
MSb IN
SDI
(CSDI)
CS65 CS66
TABLE 23-26: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
CS60
CS61
CS62
CS65
CS66
CS70
CS71
CS72
CS75
CS76
CS77
CS78
CS80
Note
Symbol
Characteristic(1)(2)
Min
Typ(3)
Max
Units
Conditions
TBCLKL
TBCLKH
TBCLK
TSACL
BIT_CLK Low Time
36
40.7
45
ns
—
BIT_CLK High Time
36
40.7
45
ns
—
BIT_CLK Period
—
81.4
—
ns
Bit clock is input
Input Setup Time to
—
—
10
ns
—
Falling Edge of BIT_CLK
THACL
Input Hold Time from
—
—
10
ns
—
Falling Edge of BIT_CLK
TSYNCLO SYNC Data Output Low Time
—
19.5
—
µs
Note 1
—
1.3
—
µs
Note 1
TSYNCHI SYNC Data Output High Time
SYNC Data Output Period
—
20.8
—
µs
Note 1
TSYNC
TRACL
Rise Time, SYNC, SDATA_OUT
—
10
25
ns
CLOAD = 50 pF, VDD = 5V
TFACL
Fall Time, SYNC, SDATA_OUT
—
10
25
ns
CLOAD = 50 pF, VDD = 5V
Rise Time, SYNC, SDATA_OUT
—
TBD
TBD
ns
CLOAD = 50 pF, VDD = 3V
TRACL
Fall Time, SYNC, SDATA_OUT
—
TBD
TBD
ns
CLOAD = 50 pF, VDD = 3V
TFACL
—
—
15
ns
—
TOVDACL Output valid delay from rising
edge of BIT_CLK
1: These parameters are characterized but not tested in manufacturing.
2: These values assume BIT_CLK frequency is 12.288 MHz.
3: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 207
dsPIC30F
FIGURE 23-14:
SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
BIT14 - - - - - -1
MSb
SDOx
SP31
SDIx
LSb
SP30
MSb IN
LSb IN
BIT14 - - - -1
SP40 SP41
Note: Refer to Figure 23-3 for load conditions.
TABLE 23-27: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
—
—
ns
—
TscL
SCKX Output Low Time(3)
TCY / 2
SP11
TscH
SCKX Output High
Time(3)
TCY / 2
—
—
ns
—
SP20
TscF
SCKX Output Fall Time(4
—
10
25
ns
—
SP21
TscR
SCKX Output Rise Time(4)
—
10
25
ns
—
SP30
TdoF
SDOX Data Output Fall Time(4)
—
10
25
ns
—
SP10
(4)
SP31
TdoR
SDOX Data Output Rise Time
—
10
25
ns
—
SP35
TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70083G-page 208
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-15:
SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
SP36
SCKX
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKX
(CKP = 1)
SP35
SDOX
BIT14 - - - - - -1
MSb
SP40
SDIX
LSb
SP30,SP31
MSb IN
BIT14 - - - -1
LSb IN
SP41
Note: Refer to Figure 23-3 for load conditions.
TABLE 23-28: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscL
SCKX output low time(3)
TCY / 2
—
—
ns
—
SP11
TscH
SCKX output high time(3)
TCY / 2
—
—
ns
—
—
10
25
ns
—
—
10
25
ns
—
—
10
25
ns
—
—
10
25
ns
—
time(4)
SP20
TscF
SCKX output fall
SP21
TscR
SCKX output rise time(4)
time(4)
SP30
TdoF
SDOX data output fall
SP31
TdoR
SDOX data output rise time(4)
SP35
TscH2doV, SDOX data output valid after
TscL2doV SCKX edge
—
—
30
ns
—
SP36
TdoV2sc, SDOX data output setup to
TdoV2scL first SCKX edge
30
—
—
ns
—
SP40
TdiV2scH, Setup time of SDIX data input
TdiV2scL to SCKX edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
20
—
—
ns
—
Note 1:
2:
3:
4:
Hold time of SDIX data input
to SCKX edge
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 209
dsPIC30F
FIGURE 23-16:
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP20
SP21
SP20
SP21
SCKX
(CKP = 1)
SP35
MSb
SDOX
LSb
BIT14 - - - - - -1
SP51
SP30,SP31
SDIX
MSb IN
SP40
BIT14 - - - -1
LSb IN
SP41
Note: Refer to Figure 23-3 for load conditions.
TABLE 23-29: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SCKX Input Low Time
30
—
—
ns
—
SP70
TscL
SP71
TscH
SCKX Input High Time
30
—
—
ns
—
SP20
TscF
SCKX Output Fall Time(3)
—
10
25
ns
—
—
10
25
ns
—
—
10
25
ns
—
Time(3)
SP21
TscR
SCKX Output Rise
SP30
TdoF
SDOX Data Output Fall Time(3)
SDOX Data Output Rise
Time(3)
SP31
TdoR
—
10
25
ns
—
SP35
TscH2doV, SDOX Data Output Valid after
TscL2doV SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH, Setup Time of SDIX Data Input
TdiV2scL to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL, Hold Time of SDIX Data Input
TscL2diL to SCKX Edge
20
—
—
ns
—
SP50
TssL2scH, SSX↓ to SCKX↑ or SCKX↓ Input
TssL2scL
120
—
—
ns
—
SP51
TssH2doZ SSX↑ to SDOX Output
Hi-Impedance(3)
10
—
50
ns
—
SP52
TscH2ssH SSX after SCK Edge
TscL2ssH
1.5 TCY +40
—
—
ns
—
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
3:
DS70083G-page 210
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-17:
SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP60
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP20
SP21
SP20
SP21
SCKX
(CKP = 1)
SP35
SP52
MSb
SDOX
BIT14 - - - - - -1
LSb
SP30,SP31
SDIX
MSb IN
SP51
BIT14 - - - -1
LSb IN
SP41
SP40
Note: Refer to Figure 23-3 for load conditions.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 211
dsPIC30F
TABLE 23-30: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscL
SCKX Input Low Time
30
—
—
ns
—
SP71
TscH
SCKX Input High Time
30
—
—
ns
—
—
10
25
ns
—
—
10
25
ns
—
(3)
SP20
TscF
SCKX Output Fall Time
SP21
TscR
SCKX Output Rise Time(3)
(3)
SP30
TdoF
SDOX Data Output Fall Time
—
10
25
ns
—
SP31
TdoR
SDOX Data Output Rise Time(3)
—
10
25
ns
—
SP35
TscH2doV, SDOX Data Output Valid after
TscL2doV SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH, Setup Time of SDIX Data Input
TdiV2scL to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL, Hold Time of SDIX Data Input
TscL2diL to SCKX Edge
20
—
—
ns
—
SP50
TssL2scH, SSX↓ to SCKX↓ or SCKX↑ input
TssL2scL
120
—
—
ns
—
SP51
TssH2doZ SS↑ to SDOX Output
Hi-Impedance(4)
10
—
50
ns
—
SP52
TscH2ssH SSX↑ after SCKX Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
—
SP60
TssL2doV SDOX Data Output Valid after
SSX Edge
—
—
50
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70083G-page 212
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-18:
I2C BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
SCL
IM31
IM34
IM30
IM33
SDA
Stop
Condition
Start
Condition
Note: Refer to Figure 23-3 for load conditions.
FIGURE 23-19:
I2C BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM20
IM21
IM11
IM10
SCL
IM11
IM26
IM10
IM25
IM33
SDA
In
IM40
IM40
IM45
SDA
Out
Note: Refer to Figure 23-3 for load conditions.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 213
dsPIC30F
TABLE 23-31: I2C BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IM10
Min(1)
Max
Units
Conditions
TLO:SCL Clock Low Time 100 kHz mode
TCY / 2 (BRG + 1)
—
ms
—
400 kHz mode
TCY / 2 (BRG + 1)
—
ms
—
1 MHz mode(2)
TCY / 2 (BRG + 1)
—
ms
—
Clock High Time 100 kHz mode
TCY / 2 (BRG + 1)
—
ms
—
400 kHz mode
TCY / 2 (BRG + 1)
—
ms
—
THI:SCL
IM11
Characteristic
TCY / 2 (BRG + 1)
—
ms
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
100
ns
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
300
ns
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
1 MHz mode(2)
TBD
—
ns
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
ms
1 MHz mode(2)
TBD
—
ns
100 kHz mode
TCY / 2 (BRG + 1)
—
ms
400 kHz mode
TCY / 2 (BRG + 1)
—
ms
1 MHz mode(2)
TCY / 2 (BRG + 1)
—
ms
100 kHz mode
TCY / 2 (BRG + 1)
—
ms
400 kHz mode
TCY / 2 (BRG + 1)
—
ms
1 MHz mode(2)
TCY / 2 (BRG + 1)
—
ms
100 kHz mode
TCY / 2 (BRG + 1)
—
ms
400 kHz mode
TCY / 2 (BRG + 1)
—
ms
1 MHz mode(2)
TCY / 2 (BRG + 1)
—
ms
100 kHz mode
TCY / 2 (BRG + 1)
—
ns
400 kHz mode
TCY / 2 (BRG + 1)
—
ns
1 MHz mode(2)
TCY / 2 (BRG + 1)
—
ns
100 kHz mode
—
3500
ns
—
400 kHz mode
—
1000
ns
—
1 MHz mode
TF:SCL
IM20
TR:SCL
IM21
SDA and SCL
Fall Time
SDA and SCL
Rise Time
TSU:DAT Data Input
Setup Time
IM25
THD:DAT Data Input
Hold Time
IM26
TSU:STA
IM30
Start Condition
Setup Time
THD:STA Start Condition
Hold Time
IM31
TSU:STO Stop Condition
Setup Time
IM33
THD:STO Stop Condition
IM34
Hold Time
TAA:SCL
IM40
Output Valid
From Clock
(2)
—
—
ns
100 kHz mode
4.7
—
ms
400 kHz mode
1.3
—
ms
1 MHz mode(2)
TBD
—
ms
—
400
pF
1 MHz mode
TBF:SDA Bus Free Time
IM45
CB
IM50
Note 1:
2:
(2)
Bus Capacitive Loading
—
CB is specified to be
from 10 to 400 pF
CB is specified to be
from 10 to 400 pF
—
—
Only relevant for
repeated Start
condition
After this period the
first clock pulse is
generated
—
—
—
Time the bus must be
free before a new
transmission can start
BRG is the value of the I2C Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ (I2C)”
in the dsPIC30F Family Reference Manual.
Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
DS70083G-page 214
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-20:
I2C BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
SCL
IS34
IS31
IS30
IS33
SDA
Stop
Condition
Start
Condition
FIGURE 23-21:
I2C BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCL
IS30
IS26
IS31
IS25
IS33
SDA
In
IS40
IS40
IS45
SDA
Out
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 215
dsPIC30F
TABLE 23-32: I2C BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
IS10
IS11
IS20
IS21
IS25
IS26
IS30
IS31
IS33
IS34
IS40
IS45
IS50
Note 1:
Symbol
TLO:SCL
THI:SCL
TF:SCL
TR:SCL
TSU:DAT
THD:DAT
TSU:STA
THD:STA
TSU:STO
THD:STO
TAA:SCL
TBF:SDA
CB
Characteristic
Clock Low Time
Clock High Time
SDA and SCL
Fall Time
SDA and SCL
Rise Time
Data Input
Setup Time
Data Input
Hold Time
Min
Max
Units
100 kHz mode
4.7
—
µs
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
1.3
—
µs
Device must operate at a
minimum of 10 MHz.
1 MHz mode(1)
0.5
—
µs
100 kHz mode
4.0
—
µs
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
0.6
—
µs
Device must operate at a
minimum of 10 MHz
1 MHz mode(1)
0.5
—
µs
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(1)
—
100
ns
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(1)
—
300
ns
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
1 MHz mode(1)
100
—
ns
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
1 MHz mode(1)
µs
0
0.3
µs
100 kHz mode
4.7
—
µs
400 kHz mode
0.6
—
1 MHz mode(1)
µs
0.25
—
µs
100 kHz mode
4.0
—
µs
400 kHz mode
0.6
—
1 MHz mode(1)
µs
0.25
—
µs
100 kHz mode
4.7
—
µs
400 kHz mode
0.6
—
1 MHz mode(1)
µs
0.6
—
µs
Stop Condition
100 kHz mode
4000
—
ns
Hold Time
400 kHz mode
600
—
ns
1 MHz mode(1)
250
Start Condition
Setup Time
Start Condition
Hold Time
Stop Condition
Setup Time
0
3500
ns
0
1000
ns
1 MHz mode(1)
0
350
ns
100 kHz mode
4.7
—
µs
400 kHz mode
1.3
—
1 MHz mode(1)
µs
0.5
—
µs
—
400
pF
Bus Capacitive
Loading
—
—
CB is specified to be from
10 to 400 pF
CB is specified to be from
10 to 400 pF
—
—
Only relevant for repeated
Start condition
After this period the first
clock pulse is generated
—
—
ns
Output Valid From 100 kHz mode
Clock
400 kHz mode
Bus Free Time
Conditions
—
Time the bus must be free
before a new transmission
can start
—
Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
DS70083G-page 216
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
FIGURE 23-22:
CXTX Pin
(output)
CAN MODULE I/O TIMING CHARACTERISTICS
New Value
Old Value
CA10 CA11
CXRX Pin
(input)
CA20
TABLE 23-33: CAN MODULE I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)
Symbol
Min
Typ(2)
Max
Units
Conditions
CA10
TioF
Port Output Fall Time
—
10
25
ns
—
CA11
TioR
Port Output Rise Time
—
10
25
ns
—
CA20
Tcwf
Pulse Width to Trigger
CAN Wakeup Filter
500
ns
—
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 217
dsPIC30F
TABLE 23-34: 12-BIT A/D MODULE SPECIFICATIONS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
Device Supply
AD01
AVDD
Module VDD Supply
Greater of
VDD - 0.3
or 2.7
—
Lesser of
VDD + 0.3
or 5.5
V
—
AD02
AVSS
Module VSS Supply
VSS - 0.3
—
VSS + 0.3
V
—
AD05
VREFH
Reference Voltage High
AVDD
V
—
AD06
VREFL
Reference Voltage Low
AD07
VREF
Absolute Reference
Voltage
AD08
IREF
Current Drain
AD10
VINH-VINL Full-Scale Input Span
Reference Inputs
AVSS + 2.7
—
AVSS
—
AVDD - 2.7
V
—
AVSS - 0.3
—
AVDD + 0.3
V
—
—
200
.001
300
3
µA
µA
A/D operating
A/D off
VREFH
V
See Note
Analog Input
VREFL
AD11
VIN
Absolute Input Voltage
AVDD + 0.3
V
AD12
—
Leakage Current
AVSS - 0.3
—
±0.001
±0.610
µA
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
Source Impedance =
2.5 kΩ
AD13
—
Leakage Current
—
±0.001
±0.610
µA
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
Source Impedance =
2.5 kΩ
AD15
RSS
Switch Resistance
—
3.2K
—
Ω
—
pF
—
Ω
—
—
AD16
CSAMPLE
Sample Capacitor
—
18
AD17
RIN
Recommended Impedance
of Analog Voltage Source
—
—
AD20
Nr
Resolution
AD21
INL
Integral Nonlinearity
—
±0.75
TBD
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD21A INL
Integral Nonlinearity
—
±0.75
TBD
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD22
DNL
Differential Nonlinearity
—
±0.5
< ±1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD22A DNL
Differential Nonlinearity
—
±0.5
< ±1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
GERR
Gain Error
—
±1.25
TBD
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD23A GERR
Gain Error
—
±1.25
TBD
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
2.5K
DC Accuracy
AD23
Note 1:
12 data bits
bits
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
DS70083G-page 218
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-34: 12-BIT A/D MODULE SPECIFICATIONS (CONTINUED)
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
EOFF
Offset Error
—
±1.25
TBD
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 5V
AD24A EOFF
Offset Error
—
±1.25
TBD
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3V
AD25
—
Monotonicity(1)
—
—
—
—
AD26
CMRR
Common-Mode Rejection
—
TBD
—
dB
—
AD27
PSRR
Power Supply Rejection
Ratio
—
TBD
—
dB
—
AD28
CTLK
Channel to Channel
Crosstalk
—
TBD
—
dB
—
AD30
THD
Total Harmonic Distortion
—
—
—
dB
—
AD31
SINAD
Signal to Noise and
Distortion
—
TBD
—
dB
—
AD32
SFDR
Spurious Free Dynamic
Range
—
TBD
—
dB
—
AD33
FNYQ
Input Signal Bandwidth
—
—
50
kHz
—
AD34
ENOB
Effective Number of Bits
—
TBD
TBD
bits
—
AD24
Guaranteed
Dynamic Performance
Note 1:
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 219
dsPIC30F
FIGURE 23-23:
12-BIT A/D CONVERSION TIMING CHARACTERISTICS
(ASAM = 0, SSRC = 000)
AD50
ADCLK
Instruction
Execution BSF SAMP
BCF SAMP
SAMP
ch0_dischrg
ch0_samp
eoc
AD61
AD60
TSAMP
AD55
DONE
ADIF
ADRES(0)
1
2
3
4
5
6
7
8
9
1 - Software sets ADCON. SAMP to start sampling.
2 - Sampling starts after discharge period.
TSAMP is described in the dsPIC30F Family Reference Manual, Section 18.
3 - Software clears ADCON. SAMP to start conversion.
4 - Sampling ends, conversion sequence starts.
5 - Convert bit 11.
6 - Convert bit 10.
7 - Convert bit 1.
8 - Convert bit 0.
9 - One TAD for end of conversion.
DS70083G-page 220
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
TABLE 23-35: 12-BIT A/D CONVERSION TIMING REQUIREMENTS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
Clock Parameters
AD50
TAD
A/D Clock Period
AD51
tRC
A/D Internal RC Oscillator Period
—
667
—
ns
1.2
1.5
1.8
µs
VDD = 3-5.5V (Note 1)
—
Conversion Rate
AD55
tCONV
Conversion Time
—
14 TAD
AD56
FCNV
Throughput Rate
—
—
100
ksps
AD57
TSAMP
Sample Time
—
1 TAD
—
ns
AD60
tPCS
Conversion Start from Sample
Trigger
AD61
tPSS
AD62
AD63
ns
—
VDD = VREF = 5V
VDD = 3-5.5V source
resistance
RS = 0-2.5 kΩ
Timing Parameters
Note 1:
2:
—
—
TAD
ns
—
Sample Start from Setting
Sample (SAMP) Bit
0.5 TAD
—
1.5 TAD
ns
—
tCSS
Conversion Completion to
Sample Start (ASAM = 1)
—
—
TBD
ns
—
tDPU
Time to Stabilize Analog Stage
from A/D Off to A/D On
—
—
TBD
µs
—
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
These parameters are characterized but not tested in manufacturing.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 221
dsPIC30F
NOTES:
DS70083G-page 222
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
24.0
PACKAGING INFORMATION
24.1
Package Marking Information
18-Lead PDIP
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead PDIP
dsPIC30F3012-30I/P
0348017
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
18-Lead SOIC
dsPIC30F2012-30I/SP
0348017
Example
dsPIC30F2011
-30I/SO
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
0348017
28-Lead SOIC (.300”)
Example
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
Note:
PIC30F2012-30I/SO
0310017
Customer specific information*
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard device marking consists of Microchip part number, year code, week code, and traceability code.
For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 223
dsPIC30F
24.1
Package Marking Information (Continued)
40-Lead PDIP
Example
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
YYWWNNN
dsPIC30F3014-30I/P
0348017
44-Lead TQFP
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC30F
3014-30I/PT
0348017
44-Lead QFN
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC30F4013-30I/ML
0310017
64-Lead TQFP (10x10x1mm)
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
dsPIC30F
5011-30I/PT
0348017
64-Lead TQFP (14x14x1mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
DS70083G-page 224
Example
Example
dsPIC30F6011
-30I/PF
0348017
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
24.1
Package Marking Information (Continued)
80-Lead TQFP (12x12x1mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
dsPIC30F5013
-30I/PT
0348017
80-Lead TQFP (14x14x1mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
 2004 Microchip Technology Inc.
Example
Example
dsPIC30F6013
-30I/PF
0348017
Preliminary
DS70083G-page 225
dsPIC30F
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
α
1
E
A2
A
L
c
A1
B1
β
p
B
eB
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
18
.100
.155
.130
MAX
MILLIMETERS
NOM
18
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
22.61
22.80
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
.015
A1
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
.240
.250
.260
E1
Overall Length
D
.890
.898
.905
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
eB
Overall Row Spacing
§
.310
.370
.430
α
Mold Draft Angle Top
5
10
15
β
Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
DS70083G-page 226
Preliminary
MAX
4.32
3.68
8.26
6.60
22.99
3.43
0.38
1.78
0.56
10.92
15
15
 2004 Microchip Technology Inc.
dsPIC30F
28-Lead Plastic Dual In-line (SP) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
β
B1
A1
eB
Units
Number of Pins
Pitch
p
B
Dimension Limits
n
p
INCHES*
MIN
NOM
MILLIMETERS
MAX
MIN
NOM
28
MAX
28
.100
2.54
Top to Seating Plane
A
.140
.150
.160
3.56
3.81
4.06
Molded Package Thickness
A2
.125
.130
.135
3.18
3.30
3.43
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.310
.325
7.62
7.87
8.26
Molded Package Width
E1
.275
.285
.295
6.99
7.24
7.49
Overall Length
D
1.345
1.365
1.385
34.16
34.67
35.18
Tip to Seating Plane
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
L
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.040
.053
.065
1.02
1.33
1.65
Lower Lead Width
B
.016
.019
.022
0.41
0.48
0.56
eB
α
.320
.350
.430
8.13
8.89
10.92
5
10
15
5
10
15
5
10
15
5
10
15
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
β
0.38
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 227
dsPIC30F
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
E
p
E1
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.093
.088
.004
.394
.291
.446
.010
.016
0
.009
.014
0
0
A1
INCHES*
NOM
18
.050
.099
.091
.008
.407
.295
.454
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.462
.029
.050
8
.012
.020
15
15
MILLIMETERS
NOM
18
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.39
7.49
11.33
11.53
0.25
0.50
0.41
0.84
0
4
0.23
0.27
0.36
0.42
0
12
0
12
MIN
MAX
2.64
2.39
0.30
10.67
7.59
11.73
0.74
1.27
8
0.30
0.51
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
DS70083G-page 228
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
E
E1
p
D
B
2
1
n
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
A1
MIN
.093
.088
.004
.394
.288
.695
.010
.016
0
.009
.014
0
0
INCHES*
NOM
28
.050
.099
.091
.008
.407
.295
.704
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.712
.029
.050
8
.013
.020
15
15
MILLIMETERS
NOM
28
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.32
7.49
17.65
17.87
0.25
0.50
0.41
0.84
0
4
0.23
0.28
0.36
0.42
0
12
0
12
MIN
MAX
2.64
2.39
0.30
10.67
7.59
18.08
0.74
1.27
8
0.33
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 229
dsPIC30F
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
E1
D
α
2
1
n
E
A2
A
L
c
β
B1
A1
eB
p
B
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
40
.100
.175
.150
MAX
MILLIMETERS
NOM
40
2.54
4.06
4.45
3.56
3.81
0.38
15.11
15.24
13.46
13.84
51.94
52.26
3.05
3.30
0.20
0.29
0.76
1.27
0.36
0.46
15.75
16.51
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.160
.190
Molded Package Thickness
A2
.140
.160
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.595
.600
.625
Molded Package Width
.530
.545
.560
E1
Overall Length
D
2.045
2.058
2.065
Tip to Seating Plane
L
.120
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
.030
.050
.070
B1
Lower Lead Width
B
.014
.018
.022
eB
Overall Row Spacing
§
.620
.650
.680
α
Mold Draft Angle Top
5
10
15
β
Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
DS70083G-page 230
Preliminary
MAX
4.83
4.06
15.88
14.22
52.45
3.43
0.38
1.78
0.56
17.27
15
15
 2004 Microchip Technology Inc.
dsPIC30F
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
n
CH x 45 °
α
A
c
φ
β
L
A1
A2
(F)
Units
Dimension Limits
n
p
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
n1
A
A2
A1
L
(F)
φ
E
D
E1
D1
c
B
CH
α
β
MIN
.039
.037
.002
.018
0
.463
.463
.390
.390
.004
.012
.025
5
5
INCHES
NOM
44
.031
11
.043
.039
.004
.024
.039
3.5
.472
.472
.394
.394
.006
.015
.035
10
10
MAX
.047
.041
.006
.030
7
.482
.482
.398
.398
.008
.017
.045
15
15
MILLIMETERS*
NOM
44
0.80
11
1.00
1.10
0.95
1.00
0.05
0.10
0.45
0.60
1.00
0
3.5
11.75
12.00
11.75
12.00
9.90
10.00
9.90
10.00
0.09
0.15
0.30
0.38
0.64
0.89
5
10
5
10
MIN
MAX
1.20
1.05
0.15
0.75
7
12.25
12.25
10.10
10.10
0.20
0.44
1.14
15
15
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 231
dsPIC30F
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
DS70083G-page 232
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
n
CH x 45 °
α
A
c
A2
φ
L
β
A1
(F)
Units
Dimension Limits
n
p
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
n1
A
A2
A1
L
(F)
φ
E
D
E1
D1
c
B
CH
α
β
MIN
.039
.037
.002
.018
0
.463
.463
.390
.390
.005
.007
.025
5
5
INCHES
NOM
64
.020
16
.043
.039
.006
.024
.039
3.5
.472
.472
.394
.394
.007
.009
.035
10
10
MAX
.047
.041
.010
.030
7
.482
.482
.398
.398
.009
.011
.045
15
15
MILLIMETERS*
NOM
64
0.50
16
1.00
1.10
0.95
1.00
0.05
0.15
0.45
0.60
1.00
0
3.5
11.75
12.00
11.75
12.00
9.90
10.00
9.90
10.00
0.13
0.18
0.17
0.22
0.64
0.89
5
10
5
10
MIN
MAX
1.20
1.05
0.25
0.75
7
12.25
12.25
10.10
10.10
0.23
0.27
1.14
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 233
dsPIC30F
64-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
n
CH x 45 °
α
A
c
A2
φ
L
β
A1
(F)
Units
Dimension Limits
n
p
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
n1
A
A2
A1
L
(F)
φ
E
D
E1
D1
c
B
CH
α
β
INCHES
NOM
64
.032
16
MIN
.037
.002
.018
MAX
.039
.024
.039
0
MIN
MILLIMETERS*
NOM
64
0.80
16
.047
.041
.006
.030
0.95
0.05
0.45
7
0
.630
.630
.551
.551
.004
.019
.013
11
11
1.00
0.60
1.00
MAX
1.20
1.05
0.15
0.75
7
16.00
16.00
14.00
14.00
.008
.018
0.09
0.30
13
13
11
11
0.32
0.20
0.45
13
13
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
DS70083G-page 234
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
n
CH x 45 °
A
α
c
φ
β
L
A2
A1
(F)
Units
Dimension Limits
n
p
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
n1
A
A2
A1
L
(F)
φ
E
D
E1
D1
c
B
CH
α
β
MIN
.039
.037
.002
.018
0
.541
.541
.463
.463
.004
.007
.025
5
5
INCHES
NOM
80
.020
20
.043
.039
.004
.024
.039
3.5
.551
.551
.472
.472
.006
.009
.035
10
10
MAX
.047
.041
.006
.030
7
.561
.561
.482
.482
.008
.011
.045
15
15
MILLIMETERS*
NOM
80
0.50
20
1.00
1.10
0.95
1.00
0.05
0.10
0.45
0.60
1.00
0
3.5
13.75
14.00
13.75
14.00
11.75
12.00
11.75
12.00
0.09
0.15
0.17
0.22
0.64
0.89
5
10
5
10
MIN
MAX
1.20
1.05
0.15
0.75
7
14.25
14.25
12.25
12.25
0.20
0.27
1.14
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 235
dsPIC30F
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
n
CH x 45 °
A
α
c
φ
β
L
A2
A1
(F)
Units
Dimension Limits
n
p
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
n1
A
A2
A1
L
(F)
φ
E
D
E1
D1
c
B
CH
α
β
INCHES
NOM
80
.026
20
MIN
.037
.002
.018
.039
.024
.039
0
.
.004
.009
MAX
MIN
MILLIMETERS*
NOM
80
0.65
20
.047
.041
.006
.030
0.95
0.05
0.45
7
0
.630
.630
.551
.551
.013
11
11
1.00
0.60
1.00
MAX
1.20
1.05
0.15
0.75
7
16.00
16.00
14.00
14.00
.008
.015
0.09
0.22
13
13
11
11
0.32
0.20
0.38
13
13
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
DS70083G-page 236
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
INDEX
Numerics
12-bit Analog-to-Digital Converter (A/D) Module .............. 145
A
A/D .................................................................................... 145
Aborting a Conversion .............................................. 147
ADCHS Register ....................................................... 145
ADCON1 Register..................................................... 145
ADCON2 Register..................................................... 145
ADCON3 Register..................................................... 145
ADCSSL Register ..................................................... 145
ADPCFG Register..................................................... 145
Configuring Analog Port Pins.............................. 76, 150
Connection Considerations....................................... 150
Conversion Operation ............................................... 146
Effects of a Reset...................................................... 149
Operation During CPU Idle Mode ............................. 149
Operation During CPU Sleep Mode.......................... 149
Output Formats ......................................................... 149
Power-down Modes .................................................. 149
Programming the Sample Trigger............................. 147
Register Map............................................................. 151
Result Buffer ............................................................. 146
Sampling Requirements............................................ 148
Selecting the Conversion Clock ................................ 147
Selecting the Conversion Sequence......................... 146
AC Characteristics ............................................................ 195
Load Conditions ........................................................ 195
AC Temperature and Voltage Specifications .................... 195
AC-Link Mode Operation .................................................. 142
16-bit Mode ............................................................... 142
20-bit Mode ............................................................... 142
Address Generator Units .................................................... 47
Alternate Vector Table ........................................................ 59
Analog-to-Digital Converter. See A/D.
Assembler
MPASM Assembler................................................... 177
Automatic Clock Stretch.................................................... 110
During 10-bit Addressing (STREN = 1)..................... 110
During 7-bit Addressing (STREN = 1)....................... 110
Receive Mode ........................................................... 110
Transmit Mode .......................................................... 110
B
Bandgap Start-up Time
Requirements............................................................ 200
Timing Characteristics .............................................. 200
Barrel Shifter ....................................................................... 33
Bit Reversed Addressing
Example ...................................................................... 54
Implementation ........................................................... 53
Bit-Reversed Addressing .................................................... 53
Modifier Values Table ................................................. 54
Sequence Table (16-Entry)......................................... 54
Block Diagrams
12-bit A/D Functional ................................................ 145
16-bit Timer1 Module .................................................. 81
16-bit Timer2............................................................... 87
16-bit Timer3............................................................... 87
16-bit Timer4............................................................... 92
16-bit Timer5............................................................... 92
32-bit Timer2/3............................................................ 86
32-bit Timer4/5............................................................ 91
 2004 Microchip Technology Inc.
CAN Buffers and Protocol Engine ............................ 124
DCI Module............................................................... 136
Dedicated Port Structure ............................................ 75
DSP Engine ................................................................ 29
dsPIC30F5013/6013/6014.......................................... 18
External Power-on Reset Circuit .............................. 162
I2C ............................................................................ 108
Input Capture Mode.................................................... 95
Oscillator System...................................................... 155
Output Compare Mode ............................................... 99
Reset System ........................................................... 159
Shared Port Structure................................................. 76
SPI............................................................................ 104
SPI Master/Slave Connection................................... 104
UART Receiver......................................................... 116
UART Transmitter..................................................... 115
BOR Characteristics ......................................................... 194
BOR. See Brown-out Reset.
Brown-out Reset
Characteristics.......................................................... 193
Timing Requirements ............................................... 200
C
C Compilers
MPLAB C17.............................................................. 178
MPLAB C18.............................................................. 178
MPLAB C30.............................................................. 178
CAN Module ..................................................................... 123
Baud Rate Setting .................................................... 128
CAN1 Register Map.................................................. 130
CAN2 Register Map.................................................. 132
Frame Types ............................................................ 123
I/O Timing Characteristics ........................................ 217
Message Reception.................................................. 126
Message Transmission............................................. 127
Modes of Operation .................................................. 125
Overview................................................................... 123
CLKOUT and I/O Timing
Characteristics.......................................................... 198
Requirements ........................................................... 198
Code Examples
Data EEPROM Block Erase ....................................... 70
Data EEPROM Block Write ........................................ 72
Data EEPROM Read.................................................. 69
Data EEPROM Word Erase ....................................... 70
Data EEPROM Word Write ........................................ 71
Erasing a Row of Program Memory ........................... 65
Initiating a Programming Sequence ........................... 66
Loading Write Latches................................................ 66
Code Protection ................................................................ 153
Core Architecture................................................................ 21
Overview..................................................................... 21
D
Data Accumulators and Adder/Subtractor .......................... 31
Data Space Write Saturation ...................................... 33
Overflow and Saturation ............................................. 31
Round Logic ............................................................... 32
Write Back .................................................................. 32
Data Address Space........................................................... 39
Alignment.................................................................... 40
Alignment (Figure) ...................................................... 40
Effect of Invalid Memory Accesses (Table) ................ 40
MCU and DSP (MAC Class) Instructions Example .... 43
Memory Map............................................................... 40
Near Data Space ........................................................ 41
Preliminary
DS70083G-page 237
dsPIC30F
Sample Memory Map .................................................. 42
Software Stack ............................................................ 41
Spaces ........................................................................ 39
Width........................................................................... 40
Data Converter Interface (DCI) Module ............................ 135
Data EEPROM Memory ...................................................... 69
Erasing ........................................................................ 70
Erasing, Block ............................................................. 70
Erasing, Word ............................................................. 70
Protection Against Spurious Write .............................. 73
Reading....................................................................... 69
Write Verify ................................................................. 73
Writing ......................................................................... 71
Writing, Block .............................................................. 72
Writing, Word .............................................................. 71
Data Space Organization .................................................... 47
DC Characteristics ............................................................ 184
BOR .......................................................................... 194
Brown-out Reset ....................................................... 193
I/O Pin Input Specifications ....................................... 191
I/O Pin Output Specifications .................................... 192
Idle Current (IIDLE) .................................................... 187
Low-Voltage Detect................................................... 192
LVDL ......................................................................... 193
Operating Current (IDD)............................................. 185
Power-Down Current (IPD) ........................................ 189
Program and EEPROM............................................. 194
Temperature and Voltage Specifications .................. 184
DCI Module
Bit Clock Generator................................................... 139
Buffer Alignment with Data Frames .......................... 140
Buffer Control ............................................................ 135
Buffer Data Alignment ............................................... 135
Buffer Length Control................................................ 140
COFS Pin.................................................................. 135
CSCK Pin.................................................................. 135
CSDI Pin ................................................................... 135
CSDO Mode Bit ........................................................ 141
CSDO Pin ................................................................. 135
Data Justification Control Bit ..................................... 139
Device Frequencies for Common Codec CSCK Frequencies (Table) ....................................................... 139
Digital Loopback Mode ............................................. 141
Enable....................................................................... 137
Frame Sync Generator ............................................. 137
Frame Sync Mode Control Bits ................................. 137
I/O Pins ..................................................................... 135
Interrupts ................................................................... 141
Introduction ............................................................... 135
Master Frame Sync Operation .................................. 137
Operation .................................................................. 137
Operation During CPU Idle Mode ............................. 142
Operation During CPU Sleep Mode .......................... 142
Receive Slot Enable Bits........................................... 140
Receive Status Bits ................................................... 141
Register Map............................................................. 143
Sample Clock Edge Control Bit................................. 139
Slave Frame Sync Operation .................................... 138
Slot Enable Bits Operation with Frame Sync ............ 140
Slot Status Bits.......................................................... 141
Synchronous Data Transfers .................................... 140
Timing Characteristics
AC-Link Mode ................................................... 207
Multichannel, I2S Modes ................................... 205
DS70083G-page 238
Timing Requirements
AC-Link Mode................................................... 207
Multichannel, I2S Modes................................... 206
Transmit Slot Enable Bits ......................................... 139
Transmit Status Bits.................................................. 141
Transmit/Receive Shift Register ............................... 135
Underflow Mode Control Bit...................................... 141
Word Size Selection Bits .......................................... 137
Demonstration Boards
PICDEM 1................................................................. 180
PICDEM 17............................................................... 180
PICDEM 18R PIC18C601/801.................................. 181
PICDEM 2 Plus......................................................... 180
PICDEM 3 PIC16C92X............................................. 180
PICDEM 4................................................................. 180
PICDEM LIN PIC16C43X ......................................... 181
PICDEM USB PIC16C7X5 ....................................... 181
PICDEM.net Internet/Ethernet .................................. 180
Development Support ....................................................... 177
Device Configuration
Register Map ............................................................ 168
Device Configuration Registers
FBORPOR ................................................................ 166
FGS .......................................................................... 166
FOSC........................................................................ 166
FWDT ....................................................................... 166
Device Overview................................................................ 17
Disabling the UART .......................................................... 117
Divide Support .................................................................... 27
Instructions (Table) ..................................................... 27
DSP Engine ........................................................................ 28
Multiplier ..................................................................... 30
Dual Output Compare Match Mode .................................. 100
Continuous Pulse Mode............................................ 100
Single Pulse Mode.................................................... 100
E
Electrical Characteristics .................................................. 183
AC............................................................................. 195
DC ............................................................................ 184
Enabling and Setting Up UART
Alternate I/O ............................................................. 117
Setting Up Data, Parity and Stop Bit Selections ....... 117
Enabling the UART ........................................................... 117
Equations
A/D Conversion Clock............................................... 147
Baud Rate................................................................. 119
Bit Clock Frequency.................................................. 139
COFSG Period.......................................................... 137
Serial Clock Rate ...................................................... 112
Time Quantum for Clock Generation ........................ 129
Errata .................................................................................. 16
Evaluation and Programming Tools.................................. 181
Exception Processing ......................................................... 55
External Clock Timing Characteristics
Type A, B and C Timer ............................................. 201
External Clock Timing Requirements ............................... 196
Type A Timer ............................................................ 201
Type B Timer ............................................................ 202
Type C Timer ............................................................ 202
External Interrupt Requests ................................................ 60
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
F
Fast Context Saving............................................................ 60
Flash Program Memory ...................................................... 63
Control Registers ........................................................ 64
NVMADR ............................................................ 64
NVMADRU.......................................................... 64
NVMCON ............................................................ 64
NVMKEY............................................................. 64
I
I/O Pin Specifications
Input .......................................................................... 191
Output ....................................................................... 192
I/O Ports .............................................................................. 75
Parallel (PIO) .............................................................. 75
I2C ..................................................................................... 107
I2C 10-bit Slave Mode Operation ...................................... 109
Reception.................................................................. 110
Transmission............................................................. 109
I2C 7-bit Slave Mode Operation ........................................ 109
Reception.................................................................. 109
Transmission............................................................. 109
I2C Master Mode Operation .............................................. 111
Baud Rate Generator................................................ 112
Clock Arbitration........................................................ 112
Multi-Master Communication, Bus Collision
and Bus Arbitration ........................................... 112
Reception.................................................................. 111
Transmission............................................................. 111
I2C Master Mode Support ................................................. 111
I2C Module ........................................................................ 107
Addresses ................................................................. 109
Bus Data Timing Characteristics
Master Mode ..................................................... 213
Slave Mode ....................................................... 215
Bus Data Timing Requirements
Master Mode ..................................................... 214
Slave Mode ....................................................... 216
Bus Start/Stop Bits Timing Characteristics
Master Mode ..................................................... 213
Slave Mode ....................................................... 215
General Call Address Support .................................. 111
Interrupts................................................................... 110
IPMI Support ............................................................. 111
Operating Function Description ................................ 107
Operation During CPU Sleep and Idle Modes .......... 112
Pin Configuration ...................................................... 107
Programmer’s Model................................................. 107
Register Map............................................................. 113
Registers................................................................... 107
Slope Control ............................................................ 111
Software Controlled Clock Stretching (STREN = 1).. 110
Various Modes .......................................................... 107
I2S Mode Operation .......................................................... 142
Data Justification....................................................... 142
Frame and Data Word Length Selection................... 142
Idle Current (IIDLE) ............................................................ 187
In-Circuit Serial Programming (ICSP) ......................... 63, 153
Input Capture (CAPX) Timing Characteristics .................. 203
Input Capture Module ......................................................... 95
Interrupts..................................................................... 97
Register Map............................................................... 98
Input Capture Operation During Sleep and Idle Modes ...... 97
CPU Idle Mode............................................................ 97
CPU Sleep Mode ........................................................ 97
 2004 Microchip Technology Inc.
Input Capture Timing Requirements................................. 203
Input Change Notification Module....................................... 79
Register Map (Bits 15-8)............................................. 79
Register Map (Bits 7-0)............................................... 79
Instruction Addressing Modes ............................................ 47
File Register Instructions ............................................ 48
Fundamental Modes Supported ................................. 47
MAC Instructions ........................................................ 48
MCU Instructions ........................................................ 48
Move and Accumulator Instructions ........................... 48
Other Instructions ....................................................... 48
Instruction Flow................................................................... 24
Pipeline
1-Word, 1-Cycle (Figure) .................................... 24
1-Word, 2-Cycle (Figure) .................................... 24
1-Word, 2-Cycle MOV.D Operations (Figure)..... 25
1-Word, 2-Cycle Table Operations (Figure) ....... 25
1-Word, 2-Cycle with Instruction Stall (Figure) ... 26
2-Word, 2-Cycle DO, DOW (Figure)................... 26
2-Word, 2-Cycle GOTO, CALL (Figure) ............. 25
Instruction Set
Overview................................................................... 172
Summary .................................................................. 169
Instruction Stalls ................................................................. 49
Introduction................................................................. 49
Raw Dependency Detection ....................................... 49
Inter-Integrated Circuit. See I2C.
Internal Clock Timing Examples ....................................... 197
Interrupt Controller
Register Map .............................................................. 61
Interrupt Priority .................................................................. 56
Interrupt Sequence ............................................................. 59
Interrupt Stack Frame................................................. 59
Interrupts ............................................................................ 55
L
Load Conditions................................................................ 195
Low Voltage Detect (LVD) ................................................ 165
Low-Voltage Detect Characteristics.................................. 192
LVDL Characteristics ........................................................ 193
M
Memory Organization ......................................................... 17
Core Register Map ..................................................... 43
Modes of Operation
Disable...................................................................... 125
Initialization............................................................... 125
Listen All Messages.................................................. 125
Listen Only................................................................ 125
Loopback .................................................................. 125
Normal Operation ..................................................... 125
Modulo Addressing ............................................................. 50
Applicability................................................................. 53
Decrementing Buffer Operation Example................... 52
Incrementing Buffer Operation Example .................... 51
Restrictions................................................................. 53
Start and End Address ............................................... 50
W Address Register Selection.................................... 51
MPLAB ASM30 Assembler, Linker, Librarian ................... 178
MPLAB ICD 2 In-Circuit Debugger ................................... 179
MPLAB ICE 2000 High Performance Universal
In-Circuit Emulator.................................................... 179
MPLAB ICE 4000 High Performance Universal
In-Circuit Emulator.................................................... 179
Preliminary
DS70083G-page 239
dsPIC30F
MPLAB Integrated Development Environment Software .. 177
MPLINK Object Linker/MPLIB Object Librarian ................ 178
Multiplier
16-bit Integer and Fractional Modes Example ............ 30
N
NVM
Register Map............................................................... 67
O
OC/PWM Module Timing Characteristics.......................... 204
Operating Current (IDD)..................................................... 185
Operating Frequency vs Voltage
dsPIC30FXXXX-20 (Extended)................................. 184
Oscillator
Configurations ........................................................... 156
Fail-Safe Clock Monitor..................................... 158
Fast RC (FRC) .................................................. 157
Initial Clock Source Selection ........................... 156
Low Power RC (LPRC) ..................................... 158
LP Oscillator Control ......................................... 157
Phase Locked Loop (PLL) ................................ 157
Start-up Timer (OST) ........................................ 157
Operating Modes (Table) .......................................... 154
System Overview ...................................................... 153
Oscillator Selection ........................................................... 153
Oscillator Start-up Timer
Timing Characteristics .............................................. 199
Timing Requirements ................................................ 200
Output Compare Interrupts ............................................... 101
Output Compare Module..................................................... 99
Register Map............................................................. 102
Timing Characteristics .............................................. 203
Timing Requirements ................................................ 203
Output Compare Operation During CPU Idle Mode.......... 101
Output Compare Sleep Mode Operation........................... 101
P
Packaging Information ...................................................... 223
Marking ..................................................................... 223
Peripheral Module Disable (PMD) Registers .................... 167
PICkit 1 Flash Starter Kit................................................... 181
PICSTART Plus Development Programmer ..................... 179
Pinout Descriptions ............................................................. 19
PLL Clock Timing Specifications....................................... 197
POR. See Power-on Reset.
Port Write/Read Example.................................................... 76
PORTA Register Map ......................................................... 77
PORTB Register Map ......................................................... 77
PORTC Register Map ......................................................... 77
PORTD Register Map ......................................................... 77
PORTF Register Map.......................................................... 78
PORTG Register Map ......................................................... 78
Power Saving Modes ........................................................ 165
Idle ............................................................................ 166
Sleep......................................................................... 165
Sleep and Idle ........................................................... 153
Power-Down Current (IPD) ................................................ 189
Power-up Timer
Timing Characteristics .............................................. 199
Timing Requirements ................................................ 200
PRO MATE II Universal Device Programmer ................... 179
Program Address Space ..................................................... 35
Alignment and Data Access Using Table
Instructions.......................................................... 36
Construction ................................................................ 35
DS70083G-page 240
Data Access from, Address Generation ..................... 35
Data Space Window into Operation............................ 38
Data Table Access (LS Word) .................................... 36
Data Table Access (MS Byte)..................................... 37
Memory Map............................................................... 39
Table Instructions
TBLRDH ............................................................. 36
TBLRDL.............................................................. 36
TBLWTH............................................................. 36
TBLWTL ............................................................. 36
Visibility from Data Space........................................... 37
Program and EEPROM Characteristics............................ 194
Program Counter ................................................................ 22
Programmable .................................................................. 153
Programmer’s Model .......................................................... 22
Diagram ...................................................................... 23
Programming Operations.................................................... 65
Algorithm for Program Flash....................................... 65
Erasing a Row of Program Memory............................ 65
Initiating the Programming Sequence......................... 66
Loading Write Latches ................................................ 66
Protection Against Accidental Writes to OSCCON ........... 159
R
Reset ........................................................................ 153, 159
BOR, Programmable ................................................ 162
Brown-out Reset (BOR)............................................ 153
Oscillator Start-up Timer (OST) ................................ 153
POR
Operating without FSCM and PWRT................ 162
With Long Crystal Start-up Time ...................... 162
POR (Power-on Reset)............................................. 160
Power-on Reset (POR)............................................. 153
Power-up Timer (PWRT) .......................................... 153
Reset Sequence ................................................................. 57
Reset Sources ............................................................ 57
Reset Sources
Brown-out Reset (BOR).............................................. 57
Illegal Instruction Trap ................................................ 57
Trap Lockout............................................................... 57
Uninitialized W Register Trap ..................................... 57
Watchdog Time-out .................................................... 57
Reset Timing Characteristics............................................ 199
Reset Timing Requirements ............................................. 200
RTSP Operation ................................................................. 64
Run-Time Self-Programming (RTSP) ................................. 63
S
Serial Peripheral Interface. See SPI.
Simple Capture Event Mode............................................... 96
Buffer Operation ......................................................... 96
Hall Sensor Mode ....................................................... 96
Prescaler .................................................................... 96
Timer2 and Timer3 Selection Mode............................ 96
Simple OC/PWM Mode Timing Requirements ................. 204
Simple Output Compare Match Mode .............................. 100
Simple PWM Mode ........................................................... 100
Input Pin Fault Protection ......................................... 100
Period ....................................................................... 101
Software Simulator (MPLAB SIM) .................................... 178
Software Simulator (MPLAB SIM30) ................................ 178
Software Stack Pointer, Frame Pointer .............................. 22
CALL Stack Frame ..................................................... 41
SPI .................................................................................... 103
SPI Module ....................................................................... 103
Framed SPI Support ................................................. 103
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
Operating Function Description ................................ 103
Operation During CPU Idle Mode ............................. 105
Operation During CPU Sleep Mode.......................... 105
SDOx Disable ........................................................... 103
Slave Select Synchronization ................................... 105
SPI1 Register Map.................................................... 106
SPI2 Register Map.................................................... 106
Timing Characteristics
Master Mode (CKE = 0) .................................... 208
Master Mode (CKE = 1) .................................... 209
Slave Mode (CKE = 1) .............................. 210, 211
Timing Requirements
Master Mode (CKE = 0) .................................... 208
Master Mode (CKE = 1) .................................... 209
Slave Mode (CKE = 0) ...................................... 210
Slave Mode (CKE = 1) ...................................... 212
Word and Byte Communication ................................ 103
Status Bits, Their Significance and the Initialization
Condition for RCON Register, Case 1 ...................... 163
Status Bits, Their Significance and the Initialization
Condition for RCON Register, Case 2 ...................... 164
Status Register ................................................................... 22
Z Status Bit ................................................................. 22
Symbols Used in Opcode Descriptions............................. 170
System Integration ............................................................ 153
Register Map............................................................. 168
T
Table Instruction Operation Summary ................................ 63
Temperature and Voltage Specifications
AC ............................................................................. 195
DC............................................................................. 184
Timer1 Module .................................................................... 81
16-bit Asynchronous Counter Mode ........................... 81
16-bit Synchronous Counter Mode ............................. 81
16-bit Timer Mode....................................................... 81
Gate Operation ........................................................... 82
Interrupt....................................................................... 82
Operation During Sleep Mode .................................... 82
Prescaler..................................................................... 82
Real-Time Clock ......................................................... 82
Interrupts............................................................. 83
Oscillator Operation ............................................ 83
Register Map............................................................... 84
Timer2 and Timer3 Selection Mode .................................. 100
Timer2/3 Module ................................................................. 85
16-bit Timer Mode....................................................... 85
32-bit Synchronous Counter Mode ............................. 85
32-bit Timer Mode....................................................... 85
ADC Event Trigger...................................................... 88
Gate Operation ........................................................... 88
Interrupt....................................................................... 88
Operation During Sleep Mode .................................... 88
Register Map............................................................... 89
Timer Prescaler........................................................... 88
Timer4/5 Module ................................................................. 91
Register Map............................................................... 93
Timing Characteristics
A/D Conversion
10-Bit (ASAM = 0, SSRC = 000)....................... 220
Bandgap Start-up Time............................................. 200
CAN Module I/O........................................................ 217
CLKOUT and I/O....................................................... 198
DCI Module
AC-Link Mode ................................................... 207
Multichannel, I2S Modes ................................... 205
 2004 Microchip Technology Inc.
External Clock .......................................................... 195
I2C Bus Data
Master Mode..................................................... 213
Slave Mode ...................................................... 215
I2C Bus Start/Stop Bits
Master Mode..................................................... 213
Slave Mode ...................................................... 215
Input Capture (CAPX)............................................... 203
OC/PWM Module...................................................... 204
Oscillator Start-up Timer........................................... 199
Output Compare Module .......................................... 203
Power-up Timer ........................................................ 199
Reset ........................................................................ 199
SPI Module
Master Mode (CKE = 0).................................... 208
Master Mode (CKE = 1).................................... 209
Slave Mode (CKE = 0)...................................... 210
Slave Mode (CKE = 1)...................................... 211
Type A, B and C Timer External Clock..................... 201
Watchdog Timer ....................................................... 199
Timing Diagrams
CAN Bit..................................................................... 128
Frame Sync, AC-Link Start of Frame ....................... 138
Frame Sync, Multi-Channel Mode ............................ 138
I2S Interface Frame Sync ......................................... 138
PWM Output ............................................................. 101
Time-out Sequence on Power-up
(MCLR Not Tied to VDD), Case 1 ..................... 160
Time-out Sequence on Power-up
(MCLR Not Tied to VDD), Case 2 ..................... 161
Time-out Sequence on Power-up
(MCLR Tied to VDD) ......................................... 160
Timing Diagrams and Specifications
DC Characteristics - Internal RC Accuracy .............. 197
Timing Diagrams.See Timing Characteristics
Timing Requirements
A/D Conversion
10-Bit ................................................................ 221
Bandgap Start-up Time ............................................ 200
Brown-out Reset....................................................... 200
CLKOUT and I/O ...................................................... 198
DCI Module
AC-Link Mode................................................... 207
Multichannel, I2S Modes................................... 206
External Clock .......................................................... 196
I2C Bus Data (Master Mode) .................................... 214
I2C Bus Data (Slave Mode) ...................................... 216
Input Capture............................................................ 203
Oscillator Start-up Timer........................................... 200
Output Compare Module .......................................... 203
Power-up Timer ........................................................ 200
Reset ........................................................................ 200
Simple OC/PWM Mode ............................................ 204
SPI Module
Master Mode (CKE = 0).................................... 208
Master Mode (CKE = 1).................................... 209
Slave Mode (CKE = 0)...................................... 210
Slave Mode (CKE = 1)...................................... 212
Type A Timer External Clock.................................... 201
Type B Timer External Clock.................................... 202
Type C Timer External Clock.................................... 202
Watchdog Timer ....................................................... 200
Timing Specifications
PLL Clock ................................................................. 197
Preliminary
DS70083G-page 241
dsPIC30F
Traps ................................................................................... 57
Hard and Soft .............................................................. 58
Sources ....................................................................... 57
Address Error Trap ............................................. 58
Math Error Trap................................................... 57
Oscillator Fail Trap.............................................. 58
Stack Error Trap.................................................. 58
U
UART Module
Address Detect Mode ............................................... 119
Auto Baud Support.................................................... 120
Baud Rate Generator ................................................ 119
Enabling and Setting Up ........................................... 117
Framing Error (FERR)............................................... 119
Idle Status ................................................................. 119
Loopback Mode ........................................................ 119
Operation During CPU Sleep and Idle Modes .......... 120
Overview ................................................................... 115
Parity Error (PERR) .................................................. 119
Receive Break........................................................... 119
Receive Buffer (UxRXB) ........................................... 118
Receive Buffer Overrun Error (OERR Bit) ................ 118
Receive Interrupt....................................................... 118
Receiving Data.......................................................... 118
Receiving in 8-bit or 9-bit Data Mode........................ 118
Reception Error Handling.......................................... 118
DS70083G-page 242
Transmit Break ......................................................... 118
Transmit Buffer (UxTXB) .......................................... 117
Transmit Interrupt ..................................................... 118
Transmitting Data ..................................................... 117
Transmitting in 8-bit Data Mode................................ 117
Transmitting in 9-bit Data Mode................................ 117
UART1 Register Map................................................ 121
UART2 Register Map................................................ 121
UART Operation
Idle Mode .................................................................. 120
Sleep Mode .............................................................. 120
Unit ID Locations .............................................................. 153
Universal Asynchronous Receiver Transmitter. See UART.
W
Wake-up from Sleep ......................................................... 153
Wake-up from Sleep and Idle ............................................. 60
Watchdog Timer
Timing Characteristics .............................................. 199
Timing Requirements................................................ 200
Watchdog Timer (WDT)............................................ 153, 165
Enabling and Disabling ............................................. 165
Operation .................................................................. 165
WWW, On-Line Support ..................................................... 16
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 243
dsPIC30F
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
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Would you like a reply?
Device: dsPIC30F
Y
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Literature Number: DS70083G
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS70083G-page 244
Preliminary
 2004 Microchip Technology Inc.
dsPIC30F
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
d s P I C 3 0 F 4 0 1 3 AT- 3 0 I / P - E S
Custom ID (3 digits) or
Engineering Sample (ES)
Trademark
Package
PT = TQFP 10x10
PT = TQFP 12x12
PF = TQFP 14x14
P = DIP
SO = SOIC
SP = SPDIP
ML = QFN 6x6 or 8x8
S = Die (Waffle Pack)
W = Die (Wafers)
Architecture
Flash
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Speed
20 = 20 MIPS
30 = 30 MIPS
Device ID
T = Tape and Reel
A,B,C… = Revision Level
Examples:
a) dsPIC30F2011AT-E/SO = Extended temp., SOIC package, Rev. A.
b) dsPIC30F5011AT-I/PT = Industrial temp., TQFP package, Rev. A.
c) dsPIC30F3012AT-I/P = Industrial temp., DIP package, Rev. A.
 2004 Microchip Technology Inc.
Preliminary
DS70083G-page 245
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
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EUROPE
Corporate Office
2355 West Chandler Blvd.
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Tel: 480-792-7200
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Technical Support:
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Tel: 61-2-9868-6733
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Tel: 91-11-5160-8632
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08/24/04
DS70083G-page 246
Preliminary
 2004 Microchip Technology Inc.