Mitsubishi MH8S64DBKG-6L 536870912-bit (8388608 - word by 64-bit)synchronousdram Datasheet

Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
DESCRIPTION
The MH8S64DBKG is 8388608 - word by 64-bit
Synchronous DRAM module. This consists of eight
industry standard 4Mx16 Synchronous DRAMs in
TSOP and one industory standard EEPROM in
TSSOP.
The mounting of TSOP on a card edge Dual
Inline package provides any application where
high densities and large quantities of memory are
required.
This is a socket type - memory modules, suitable
for easy interchange or addition of modules.
Utilizes industry standard 4M x 16 Sy nchronous DRAMs
TSOP and industry standard EEPROM in TSSOP
144-pin (72-pin dual in-line package)
single 3.3V±0.3V power supply
Max. Clock frequency -6:133MHz,-7,8:100MHz
Fully synchronous operation referenced to clock rising
edge
4 bank operation controlled by BA0,1(Bank Address)
/CAS latency- 2/3(programmable)
FEATURES
Burst length- 1/2/4/8/Full Page(programmable)
Frequency
CLK Access Time
(Component SDRAM)
133MHz
5.4ns(CL=3)
-7,-7L
100MHz
6.0ns(CL=2)
-8,-8L
100MHz
6.0ns(CL=3)
-6,-6L
Burst type- sequential / interleave(programmable)
Column access - random
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycle /64ms
LVTTL Interface
APPLICATION
main memory or graphic memory in computer systems
PCB Outline
(Front)
(Back)
MIT-DS-0340-0.3
1
2
143
144
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Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
PIN CONFIGURATION
PIN
Number
Front side
Pin Name
PIN
Number
Back side
Pin Name
PIN
Number
Front side
Pin Name
PIN
Number
Back side
Pin Name
1
Vss
2
Vss
73
NC
74
CLK1
3
5
DQ0
DQ1
4
6
DQ32
DQ33
75
Vss
76
Vss
77
NC
78
NC
7
9
DQ2
DQ3
8
10
DQ34
DQ35
79
NC
80
NC
81
Vcc
82
Vcc
11
13
Vcc
DQ4
12
14
Vcc
DQ36
83
DQ16
84
DQ48
85
DQ17
86
DQ49
15
DQ5
16
DQ37
87
DQ18
88
DQ50
17
DQ6
18
DQ38
89
DQ19
90
DQ51
19
21
DQ7
Vss
20
DQ39
91
Vss
92
Vss
22
Vss
93
DQ20
94
DQ52
23
DQMB0
24
DQMB4
95
DQ21
96
DQ53
25
DQMB1
26
DQMB5
97
DQ22
98
DQ54
DQ23
27
Vcc
28
Vcc
99
100
DQ55
29
A0
30
A3
101
Vcc
102
Vcc
31
A1
32
A4
103
A6
104
A7
33
A2
34
A5
105
A8
106
BA0
35
Vss
36
Vss
107
Vss
108
Vss
37
DQ8
38
DQ40
109
A9
110
BA1
39
DQ9
40
DQ41
111
A10
112
A11
41
DQ10
42
DQ42
113
Vcc
114
43
DQ11
44
DQ43
115
DQMB2
116
DQMB6
45
Vcc
46
Vcc
117
DQMB3
118
DQMB7
47
DQ12
48
DQ44
119
Vss
120
Vss
49
DQ13
50
DQ45
121
DQ24
122
DQ56
51
DQ14
52
DQ46
123
DQ25
124
DQ57
53
DQ15
54
DQ47
125
DQ26
126
DQ58
55
Vss
56
Vss
127
DQ27
128
DQ59
57
NC
58
NC
129
Vcc
130
Vcc
59
NC
60
NC
131
DQ28
132
DQ60
61
CLK0
62
CKE0
133
DQ29
134
DQ61
63
Vcc
64
Vcc
135
DQ30
136
DQ62
65
/RAS
66
/CAS
137
DQ31
138
DQ63
67
/WE
68
CKE1
139
Vss
140
Vss
69
/S0
70
NC
141
SDA
142
SCL
71
/S1
72
NC
143
Vcc
144
Vcc
Vcc
NC = No Connection
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Block Diagram
/S0
/S1
DQMB0
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQML /CS
DQMB1
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQML /CS
I/O 0
I/O 1 D0
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DQMU
DQMU
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
8
9
10
11
12
13
14
15
0
1 D4
2
3
4
5
6
7
8
9
10
11
12
13
14
15
DQMB2
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQML /CS
DQML /CS
I/O 0
I/O 1 D1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
DQMB3
DQMU
DQMU
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
10Ω
CLK1
CLK0
CKE0
CKE1
/RAS
/CAS
/WE
BA0,BA1,A<11:0>
Vcc
Vss
MIT-DS-0340-0.3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
8
9
10
11
12
13
14
15
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1 D5
2
3
4
5
6
7
8
9
10
11
12
13
14
15
DQMB4
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQMB5
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQMB6
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQMB7
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
DQML /CS
DQML /CS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1 D2
2
3
4
5
6
7
0
1 D6
2
3
4
5
6
7
DQMU
DQMU
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
8
9
10
11
12
13
14
15
8
9
10
11
12
13
14
15
DQML /CS
DQML /CS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1 D3
2
3
4
5
6
7
0
1 D7
2
3
4
5
6
7
DQMU
DQMU
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
8
9
10
11
12
13
14
15
8
9
10
11
12
13
14
15
4loads
4loads
D0 - D3
D4 - D7
D0 - D7
D0 - D7
D0 - D7
D0 - D7
D0 - D7
SERIAL PD
SCL
A0
A1
A2
SDA
D0 - D7
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Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Serial Presence Detect Table I
Byte
SPD enrty data
SPD DATA(hex)
Defines # bytes written into serial memory at module mfgr
128
80
1
Total # bytes of SPD memory device
256 Bytes
08
2
Fundamental memory type
SDRAM
04
0C
0
Function described
3
# Row Addresses on this assembly
A0-A11
4
# Column Addresses on this assembly
A0-A7
08
5
# Module Banks on this assembly
2BANK
02
6
Data Width of this assembly...
x64
40
7
... Data Width continuation
0
00
8
Voltage interface standard of this assembly
LVTTL
7.5ns
01
75
9
SDRAM Cycletime at Max. Supported CAS Latency (CL).
Cycle time for CL=3
10
-6,-6L
-7,-7L,-8,-8L
10ns
A0
SDRAM Access from Clock
-6,-6L
5.4ns
54
tAC for CL=3
-7,-7L,-8,-8L
6ns
60
00
11
DIMM Configuration type (Non-parity,Parity,ECC)
Non-PARITY
12
Refresh Rate/Type
self refresh(15.625uS)
80
13
SDRAM width,Primary DRAM
x16
10
Error Checking SDRAM data width
N/A
00
01
8F
14
15
Minimum Clock Delay,Back to Back Random Column Addresses
16
Burst Lengths Supported
1
1/2/4/8/Full page
17
# Banks on Each SDRAM device
4bank
04
18
CAS# Latency
2/3
06
19
CS# Latency
0
01
20
Write Latency
0
01
SDRAM Module Attributes
non-buffered,non-registered
00
22
SDRAM Device Attributes:General
Precharge All,Auto precharge
0E
23
SDRAM Cycle time(2nd highest CAS latency)
-6,-6L
10ns
A0
-7,-7L
10ns
A0
-8,-8L
13ns
D0
60
21
Cycle time for CL=2
24
SDRAM Access form Clock(2nd highest CAS latency)
tAC for CL=2
25
26
-6,-6L
6ns
-7,-7L
6ns
-8,-8L
7ns
60
70
N/A
00
N/A
00
20ns
14
-6,-6L
15ns
0F
-7,-7L,-8,-8L
20ns
14
20ns
14
-6,-6L
45ns
2D
-7,-7L,-8,-8L
50ns
32
SDRAM Cycle time(3rd highest CAS latency)
SDRAM Access form Clock(3rd highest CAS latency)
27
Precharge to Active Minimum
28
Row Active to Row Active Min.
29
RAS to CAS Delay Min
30
Active to Precharge Min
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Serial Presence Detect Table II
31
32
33
Density of each bank on module
Command and Address signal input setup time
Command and Address signal input hold time
34
Data signal input setup time
35
Data signal input hold time
36-61
Superset Information (may be used in future)
62
SPD Revision
63
Checksum for bytes 0-62
32MByte
08
-6,-6L
1.5ns
15
-7,-7L,-8,-8L
2ns
20
-6,-6L
0.8ns
08
-7,-7L,-8,-8L
1ns
10
-6,-6L
1.5ns
15
-7,-7L,-8,-8L
2ns
20
-6,-6L
0.8ns
08
-7,-7L,-8,-8L
1ns
10
option
00
rev 1.2B
12
Check sum for -6,-6L
9E
Check sum for -7,-7L
05
Check sum for -8,-8L
45
64-71
Manufactures Jedec ID code per JEP-108E
MITSUBISHI
1CFFFFFFFFFFFFFF
72
Manufacturing location
Miyoshi,Japan
01
Tajima,Japan
02
NC,USA
03
91-92
Revision Code
Germany
MH8S64DBKG-6
MH8S64DBKG-6L
MH8S64DBKG-7
MH8S64DBKG-7L
MH8S64DBKG-8
MH8S64DBKG-8L
PCB revision
93-94
Manufacturing date
year/week code
yyww
73-90
Manufactures Part Number
04
4D483853363444424B472D36202020202020
4D483853363444424B472D364C2020202020
4D483853363444424B472D37202020202020
4D483853363444424B472D374C2020202020
4D483853363444424B472D38202020202020
4D483853363444424B472D384C2020202020
rrrr
95-98
Assembly Serial Number
serial number
ssssssss
99-125
Manufacture Specific Data
option
00
126
Intetl specification frequency
100MHz
64
127
Intel specification CAS# Latency support
CL=2/3,AP,CK0,1
CF
CL=3,AP,CK0,1
CD
open
00
-6,-6L,-7,-7L
-8,-8L
128+
Unused storage locations
MIT-DS-0340-0.3
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
PIN FUNCTION
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
CKE0, CKE1
Input
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
/S0, /S1
Input
Chip Select: When /S is high,any command means
No Operation.
/RAS,/CAS,/WE
Input
Combination of /RAS,/CAS,/WE defines basic commands.
Input
A0-11 specify the Row/Column Address in conjunction with
BA0,1.The Row Address is specified by A0-11.The Column
Address is specified by A0-7.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
high at a precharge command, both banks are precharged.
Input
Bank Address:BA0,1 is not simply BA.BA specifies the
bank to which a command is applied.BA0,1 must be set
with ACT,PRE,READ,WRITE commands
CLK
(CLK0 ~ CLK1)
A0-11
BA0,1
DQ0-63
DQMB0-7
Vdd,Vss
Input/Output Data In and Data out are referenced to the rising edge
of CK
Input
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is
high in burst read,Dout is disabled at the next but one cycle.
Power Supply Power Supply for the memory mounted module.
SCL
Input
Serial clock for serial PD
SDA
Output
Serial data for serial PD
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
BASIC FUNCTIONS
The MH8S64DBKG provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge.
In addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and
precharge option,respectively.
To know the detailed definition of commands please see the command truth table.
CK
/S
Chip Select : L=select, H=deselect
/RAS
Command
/CAS
Command
/WE
Command
CKE
Ref resh Option @ref resh
command
Precharge Option @precharge or read/write
command
A10
def ine basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank is
deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks
are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address
are generated internally. After this command, the banks are precharged automatically.
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
COMMAND TRUTH TABLE
CKE CKE
n-1
n
/RAS /CAS
/WE BA0,1 A11
A10 A0-9
COMMAND
MNEMONIC
Deselect
No Operation
DESEL
NOP
H
H
X
X
H
L
X
H
X
H
X
H
X
X
X
X
X
X
X
X
ACT
H
X
L
L
H
H
V
V
V
V
Single Bank Precharge
Precharge All Bank
PRE
PREA
H
H
X
X
L
L
L
L
H
H
L
L
V
X
X
X
L
H
X
X
Column Address Entry
& Write
WRITE
H
X
L
H
L
L
V
V
L
V
Column Address Entry
& Write with AutoPrecharge
WRITEA
H
X
L
H
L
L
V
V
H
V
Column Address Entry
& Read
READ
H
X
L
H
L
H
V
V
L
V
Column Address Entry
& Read with Auto
Precharge
READA
H
X
L
H
L
H
V
V
H
V
Auto-Refresh
Self-Refresh Entry
Self-Refresh Exit
REFA
REFS
REFSX
Burst Terminate
Mode Register Set
TERM
MRS
H
H
L
L
H
H
H
L
H
H
X
X
L
L
H
L
L
L
L
L
X
H
H
L
L
L
X
H
H
L
H
H
X
H
L
L
X
X
X
X
X
L
X
X
X
X
X
L
X
X
X
X
X
L
X
X
X
X
X
V*1
Row Adress Entry &
Bank Activate
/S
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
MIT-DS-0340-0.3
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE
/S
IDLE
H
X
X
X
X
DESEL
NOP
L
H
H
H
X
NOP
NOP
L
H
H
L
X
TBST
ILLEGAL*2
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
L
L
H
L
L
L
L
H
BA,A10
X
PRE/PREA
REFA
L
ROW ACTIVE
READ
/RAS /CAS
L
L
/WE
L
Address
Command
Current State
Op-Code,
Mode-Add
Action
READ/WRITE ILLEGAL*2
MRS
Bank Active,Latch RA
NOP*4
Auto-Refresh*5
Mode Register Set*5
H
X
X
X
X
DESEL
NOP
L
H
H
H
X
NOP
NOP
L
H
H
L
X
TBST
NOP
L
H
L
H
BA,CA,A10
L
H
L
L
BA,CA,A10
L
L
H
H
BA,RA
ACT
Bank Active/ILLEGAL*2
L
L
H
L
BA,A10
PRE/PREA
Precharge/Precharge All
L
L
L
H
X
L
L
L
L
H
X
X
X
X
DESEL
NOP(Continue Burst to END)
L
H
H
H
X
NOP
NOP(Continue Burst to END)
L
H
H
L
X
TBST
Terminate Burst
L
H
L
H
BA,CA,A10
Op-Code,
Mode-Add
READ/READA
Begin Read,Latch CA,
Determine Auto-Precharge
WRITE/
Begin Write,Latch CA,
WRITEA
Determine Auto-Precharge
REFA
ILLEGAL
MRS
ILLEGAL
Terminate Burst,Latch CA,
READ/READA Begin New Read,Determine
Auto-Precharge*3
Terminate Burst,Latch CA,
L
H
L
L
BA,CA,A10 WRITE/WRITEA Begin Write,Determine AutoPrecharge*3
MIT-DS-0340-0.3
L
L
H
H
BA,RA
ACT
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
L
L
L
L
Op-Code,
Mode-Add
Bank Active/ILLEGAL*2
Terminate Burst,Precharge
REFA
ILLEGAL
MRS
ILLEGAL
MITSUBISHI
ELECTRIC
( 9 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE(continued)
Current State
WRITE
/S
/RAS /CAS
/WE
Address
Command
Action
H
X
X
X
X
DESEL
NOP(Continue Burst to END)
L
H
H
H
X
NOP
NOP(Continue Burst to END)
L
H
H
L
X
TBST
Terminate Burst
L
H
L
H
BA,CA,A10
Terminate Burst,Latch CA,
READ/READA Begin Read,Determine AutoPrecharge*3
L
H
L
L
BA,CA,A10
WRITE/
WRITEA
Terminate Burst,Latch CA,
Begin Write,Determine AutoPrecharge*3
L
L
H
H
BA,RA
ACT
Bank Active/ILLEGAL*2
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
REFA
ILLEGAL
L
L
L
L
Op-Code,
Mode-Add
MRS
ILLEGAL
READ with
H
X
X
X
X
AUTO
L
H
H
H
PRECHARGE
L
H
H
L
L
H
L
H
BA,CA,A10
L
H
L
L
BA,CA,A10
L
L
H
H
BA,RA
ACT
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
Terminate Burst,Precharge
DESEL
NOP(Continue Burst to END)
X
NOP
NOP(Continue Burst to END)
X
TBST
ILLEGAL
READ/READA ILLEGAL
WRITE/
WRITEA
Op-Code,
ILLEGAL
Bank Active/ILLEGAL*2
ILLEGAL*2
REFA
ILLEGAL
MRS
ILLEGAL
L
L
L
L
WRITE with
H
X
X
X
X
DESEL
NOP(Continue Burst to END)
AUTO
L
H
H
H
X
NOP
NOP(Continue Burst to END)
PRECHARGE
L
H
H
L
ILLEGAL
H
L
H
X
BA,CA,A10
TBST
L
L
H
L
L
BA,CA,A10
L
L
H
H
BA,RA
ACT
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
REFA
ILLEGAL
L
L
L
L
Op-Code,
Mode-Add
MRS
ILLEGAL
MIT-DS-0340-0.3
Mode-Add
READ/READA ILLEGAL
WRITE/
WRITEA
MITSUBISHI
ELECTRIC
( 10 / 51 )
ILLEGAL
Bank Active/ILLEGAL*2
ILLEGAL*2
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE(continued)
/S
PRE -
H
X
X
X
X
DESEL
NOP(Idle after tRP)
CHARGING
L
H
H
H
X
NOP
NOP(Idle after tRP)
L
H
H
L
X
TBST
ILLEGAL*2
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
L
L
H
L
BA,A10
PRE/PREA
L
L
L
H
X
L
L
L
L
ROW
H
X
X
X
X
DESEL
NOP(Row Active after tRCD
ACTIVATING
L
H
H
H
X
NOP
NOP(Row Active after tRCD
L
H
H
L
X
TBST
ILLEGAL*2
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL*2
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL*2
L
L
L
H
X
L
L
L
L
WRITE RE-
H
X
X
X
X
DESEL
NOP
COVERING
L
H
H
H
X
NOP
NOP
L
H
H
L
X
TBST
ILLEGAL*2
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL*2
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL*2
L
L
L
H
X
L
L
L
L
MIT-DS-0340-0.3
/RAS /CAS
/WE
Address
Command
Current State
Action
READ/WRITE ILLEGAL*2
Op-Code,
Mode-Add
ILLEGAL*2
NOP*4(Idle after tRP)
REFA
ILLEGAL
MRS
ILLEGAL
READ/WRITE ILLEGAL*2
Op-Code,
Mode-Add
REFA
ILLEGAL
MRS
ILLEGAL
READ/WRITE ILLEGAL*2
Op-Code,
Mode-Add
MITSUBISHI
ELECTRIC
( 11 / 51 )
REFA
ILLEGAL
MRS
ILLEGAL
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE(continued)
Current State
/S
/RAS /CAS
/WE
Address
Command
Action
RE-
H
X
X
X
X
DESEL
NOP(Idle after tRC)
FRESHING
L
H
H
H
X
NOP
NOP(Idle after tRC)
L
H
H
L
X
TBST
ILLEGAL
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL
L
L
L
H
X
REFA
ILLEGAL
L
L
L
L
MRS
ILLEGAL
MODE
H
X
X
X
X
DESEL
NOP(Idle after tRSC)
REGISTER
L
H
H
H
X
NOP
NOP(Idle after tRSC)
SETTING
L
H
H
L
X
TBST
ILLEGAL
L
H
L
X
BA,CA,A10
L
L
H
H
BA,RA
ACT
ILLEGAL
L
L
H
L
BA,A10
PRE/PREA
ILLEGAL
L
L
L
H
X
REFA
ILLEGAL
L
L
L
L
MRS
ILLEGAL
READ/WRITE ILLEGAL
Op-Code,
Mode-Add
READ/WRITE ILLEGAL
Op-Code,
Mode-Add
ABBREVIATIONS:
H = Hige Level, L = Low Level, X = Don't Care
BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
1. All entries assume that CKE was High during the preceding clock cycle and the current
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA,
depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
( 12 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE FOR CKE
Current State
CK
n-1
CK
n
/S
SELF -
H
X
X
X
REFRESH*1
L
H
H
L
H
L
/RAS /CAS
/WE
Add
Action
X
X
X
INVALID
X
X
X
X
Exit Self-Refresh(Idle after tRC)
L
H
H
H
X
Exit Self-Refresh(Idle after tRC)
H
L
H
H
L
X
ILLEGAL
L
H
L
H
L
X
X
ILLEGAL
L
H
L
L
X
X
X
ILLEGAL
L
L
X
X
X
X
X
NOP(Maintain Self-Refresh)
POWER
H
X
X
X
X
X
X
INVALID
DOWN
L
H
X
X
X
X
X
Exit Power Down to Idle
L
L
X
X
X
X
X
NOP(Maintain Self-Refresh)
ALL BANKS
H
H
X
X
X
X
X
Refer to Function Truth Table
IDLE*2
H
L
L
L
L
H
X
Enter Self-Refresh
H
L
H
X
X
X
X
Enter Power Down
H
L
L
H
H
H
X
Enter Power Down
H
L
L
H
H
L
X
ILLEGAL
H
L
L
H
L
X
X
ILLEGAL
H
L
L
L
X
X
X
ILLEGAL
L
X
X
X
X
X
X
Refer to Current State = Power Down
ANY STATE
H
H
X
X
X
X
X
Refer to Function Truth Table
other than
H
L
X
X
X
X
X
Begin CK0 Suspend at Next Cycle*3
listed above
L
H
X
X
X
X
X
Exit CK0 Suspend at Next Cycle*3
L
L
X
X
X
X
X
Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A m inimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
( 13 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
SIMPLIFIED STATE DIAGRAM
SELF
REFRESH
REFS
REFSX
MRS
MODE
REGISTER
SET
REFA
AUTO
REFRESH
IDLE
CKEL
CKEH
CLK
SUSPEND
ACT
POWER
DOWN
CKEL
CKEH
ROW
ACTIVE
TERM
TERM
WRITE
READA
WRITEA
CKEL
WRITE
SUSPEND
READ
READ
WRITE
WRITE
CKEL
READ
CKEH
CKEH
WRITEA
READA
WRITEA
READA
CKEL
WRITEA
SUSPEND
POWER
APPLIED
READ
SUSPEND
CKEL
PRE
WRITEA
CKEH
POWER
ON
PRE
PRE
READA
PRE
CKEH
READA
SUSPEND
PRE
CHARGE
Automatic Sequence
Command Sequence
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
( 14 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent
a SDRAM from damaged or malfunctioning.
1. Apply power and start clock.Attempt to maintain CKE high,DQM0-7 high and NOP
condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 200us.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which
may be issued when both banks are in idle state. After tRSC from a MRS command, the
SDRAM is ready for new command.
CK
/S
BA0 BA1 A11 A10 A9
A8
A7
A6
A5
A4 A3
A2
A1 A0
/RAS
/CAS
0
0
0
0
WM
0
0
LTMODE
BT
BL
/WE
BA0,1 A11-0
CL
000
001
LATENCY
MODE
0
0
1
1
1
1
WRITE
MODE
MIT-DS-0340-0.3
1
1
0
0
1
1
0
1
0
1
0
1
0
1
/CAS LATENCY
R
R
2
3
R
R
R
R
BURST
SINGLE BIT
BURST
LENGTH
BURST
TYPE
V
BL
BT= 0
BT= 1
0
0
1
1
0
0
1
0
1
0
1
2
4
8
R
1
2
4
8
R
101
110
111
R
R
FP
R
R
R
0
0
0
0
1
0
1
SEQUENTIAL
INTERLEAVED
R:Reserved for Future Use
FP: Full Page
MITSUBISHI
ELECTRIC
( 15 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
CK
Command
Read
Write
Y
Y
Address
Q0
DQ
CL= 3
BL= 4
/CAS Latency
Q1
Q2
Q3
D0
Burst Length
D1
D2
D3
Burst Length
Burst Type
Initial Address BL
Column Addressing
A2
A1
A0
0
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
1
1
2
3
4
5
6
7
0
1
0
3
2
5
4
7
6
0
1
0
2
3
4
5
6
7
0
1
2
3
0
1
6
7
4
5
0
1
1
3
4
5
6
7
0
1
2
3
2
1
0
7
6
5
4
Sequential
Interleaved
8
1
0
0
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
1
0
1
5
6
7
0
1
2
3
4
5
4
7
6
1
0
3
2
1
1
0
6
7
0
1
2
3
4
5
6
7
4
5
2
3
0
1
1
1
1
7
0
1
2
3
4
5
6
7
6
5
4
3
2
1
0
-
0
0
0
1
2
3
0
1
2
3
-
0
1
1
2
3
0
1
0
3
2
4
-
1
0
2
3
0
1
2
3
0
1
-
1
1
3
0
1
2
3
2
1
0
-
-
0
0
1
0
1
1
0
1
0
2
-
-
1
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
( 16 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
OPERATION DESCRIPTION
BANK ACTIVATE
One of four banks is activated by an ACT command.
An bank is selected by BA0-1. A row is selected by A0-11.
Multiple banks can be active state concurrently by issuing multiple ACT commands.
Minimum activation interval between one bank and another bank is tRRD.
PRECHARGE
An open bank is deactivated by a PRE command.
A bank to be deactivated is designated by BA0-1.
When multiple banks are active, a precharge all command (PREA, PRE + A10=H)
deactivates all of open banks at the same time. BA0-1 are "Don't Care" in this case.
Minimum delay time of an ACT command after a PRE command to the same bank is tRP.
Bank Activation and Precharge All (BL=4, CL=2)
CK
Command ACT
ACT
ACT
tRP
Xa
Xb
Yb
A10
Xa
Xb
0
BA0,1
00
01
01
DQ
PRE
tRCD
tRRD
A0-9,11
READ
Xa
1
Xa
00
Qb0
Qb1
Qb2
Qb3
Precharge all
READ
A READ command can be issued to any active bank. The start address is specified by A07(x16) . 1st output data is available after the /CAS Latency from the READ. The consecutive
data length is defined by the Burst Length. The address sequence of the burst data is
defined by the Burst Type. Minimum delay time of a READ command after an ACT command
to the same bank is tRCD.
When A10 is high at a READ command, auto-precharge (READA) is performed. Any
command (READ, WRITE, PRE, ACT, TBST) to the same bank is inhibited till the internal
precharge is complete. The internal precharge starts at the BL after READA. The next ACT
command can be issued after (BL + tRP) from the previous READA. In any case, tRCD+BL >
tRASmin must be met.
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
( 17 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Multi Bank Interleaving READ (BL=4, CL=2)
CK
Command ACT
READ
ACT
tRCD
READ PRE
tRCD
ACT
tRP
A0-9, 11
Xa
Ya
Xb
Yb
A10
Xa
0
Xb
0
0
Xa
BA0,1
00
00
01
01
00
00
Qa2
Qa3
DQ
Qa0
Qa1
Xa
Qb0
Qb1
Qb2
Qb3
READ with Auto-Precharge (BL=4, CL=2)
CK
Command ACT
READ
tRCD
ACT
tRP
BL
A0-9, 11
Xa
Ya
Xa
A10
Xa
1
Xa
00
00
BA0,1
00
DQ
Qa0
Qa1
Qa2
Qa3
Internal precharge starts
Auto-Precharge Timing (READ BL=4)
CK
Command ACT
READ
tRCD
CL=3
DQ
CL=2
DQ
ACT
BL
Qa0
Qa0
Qa1
Qa2
Qa1
Qa2
Qa3
Qa3
Internal precharge starts
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
( 18 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
WRITE
A WRITE command can be issued to any active bank. The start address is specified by A0-7
(x16). 1st input data is set at the same cycle as the WRITE. The consecutive data length to
be written is defined by the Burst Length. The address sequence of burst data is defined by
the Burst Type. Minimum delay time of a WRITE command after an ACT command to the
same bank is tRCD. From the last input data to the PRE command, the write recovery time
(tWR) is required. When A10 is high at a WRITE command, auto-precharge (WRITEA) is
performed. Any command (READ, WRITE, PRE, ACT, TBST) to the same bank is inhibited till
the internal precharge is complete. The internal precharge starts at tWR after the last input
data cycle. The next ACT command can be issued after (BL + tWR -1 + tRP) from the
previous WRITEA. In any case, tRCD + BL + tWR -1 > tRASmin must be met.
WRITE (BL=4)
CK
Command ACT
Write
PRE
tRCD
BL
A0-9, 11
Xa
Ya
A10
Xa
0
BA0,1
00
00
ACT
tRP
Xa
0
Xa
00
tWR
DQ
Da0
Da1
Da2
Da3
WRITE with Auto-Precharge (BL=4)
CK
Command ACT
Write
ACT
tRCD
tRP
BL
A0-9, 11
Xa
Ya
Xa
A10
Xa
1
Xa
00
00
BA0,1
00
tWR
DQ
Da0
Da1
Da2
Da3
Internal precharge begins
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
( 19 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
BURST INTERRUPTION
[ Read Interrupted by Read ]
Burst read oparation can be interrupted by new read of the same or the other bank. Random
column access is allowed READ to READ interval is minimum 1 CK
Read Interrupted by Read (BL=4, CL=2)
CK
Command
READ
A0-9,11
Ya
Yb
Yc
A10
0
0
0
BA0,1
00
00
10
READ READ
DQ
Qa0
Qa1
Qa2 Qb0
Qc0
Qc1
Qc2
Qc3
[ Read Interrupted by Write ]
Burst read operation can be interrupted by write of any active bank. Random column access
is allowed. In this case, the DQ should be controlled adequately by using the DQMB0-7 to
prevent the bus contention. The output is disabled automatically 2 cycle after WRITE
assertion.
Read Interrupted by Write (BL=4, CL=2)
CK
Command ACT
READ
Write
A0-9,11
Xa
Ya
Ya
A10
Xa
0
0
00
00
BA0,1
00
DQMB0-7
DQ
Qa0
Da0
Da1
Output disable by DQM
MIT-DS-0340-0.3
Da2
Da3
by WRITE
MITSUBISHI
ELECTRIC
( 20 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
[ Read Interrupted by Precharge ]
A burst read operation can be interrupted by precharge of the same bank . READ to PRE
interval is minimum 1 CK. A PRE command output disable latency is equivalent to the
/CAS Latency.
Read Interrupted by Precharge (BL=4)
CK
Command
READ
PRE
DQ
Q0
Q1
Q0
Q1
Q2
CL=3
Command
READ
PRE
DQ
Command
READ PRE
DQ
Command
Q0
PRE
READ
DQ
Q0
Q1
Q2
CL=2
Command
READ
DQ
Command
DQ
MIT-DS-0340-0.3
PRE
Q0
Q1
READ PRE
Q0
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
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MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
[ Read Interrupted by Burst Terminate ]
Sim ilarly to the precharge, burst terminate command can interrupt burst read operation
and disable the data output. The terminated bank remains active,READ to TBST interval is
minimum of 1 CK. A TBSTcommand to output disable latency is equivalent to the /CAS
Latency.
Read Interrupted by Terminate (BL=4)
CK
Command
READ
TBST
DQ
Command
READ
Q0
Q1
Q0
Q1
Q2
TBST
CL=3
DQ
Command
READ TBST
DQ
Command
Q0
TBST
READ
DQ
Command
Q0
Q1
Q2
TBST
READ
CL=2
DQ
Command
DQ
MIT-DS-0340-0.3
Q0
Q1
READ TBST
Q0
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
[ Write Interrupted by Write ]
Burst write operation can be interrupted by new write of any active bank. Random
column access is allowed. WRITE to WRITE interval is minimum 1 CK.
Write Interrupted by Write (BL=4)
CK
Command
Write
A0-9, 11
Write Write
Ya
Yb
Yc
A10
0
0
0
BA0,1
00
00
10
DQ
Da0
Db0
Dc0
Da1
Da2
Dc1
Dc2
Dc3
[ Write Interrupted by Read ]
Burst write operation can be interrupted by read of any active bank. Random column
access is allowed. WRITE to READ interval is minimum 1 CK. The input data on DQ
at the interrupting READ cycle is "don't care".
Write Interrupted by Read (BL=4, CL=2)
CK
Command ACT
Write
READ
A0-9,11
Xa
Ya
Yb
A10
Xa
0
0
BA0,1
00
00
00
DQ
Da0
Da1
Qb0
Qb1
Qb2
Qb3
don't care
MIT-DS-0340-0.3
MITSUBISHI
ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
[ Write Interrupted by Precharge ]
Burst write operation can be interrupted by precharge of the same bank . Write
recovery time(tWR) is required from the last data to PRE command. During write
recovery, data inputs must be masked by DQM.
Write Interrupted by Precharge (BL=4)
CK
Command
ACT
Write
PRE
ACT
tRP
A0-9,11
Xa
Ya
Xa
A10
0
0
0
0
BA0,1
00
00
00
00
DQMB0-7
tWR
DQ
Da0
Da1
[ Write Interrupted by Burst Terminate ]
Burst terminate command can terminate burst write operation. In this case, the
write recovery time is not required and the bank remains active.The WRITE to TBST
minimum interval is 1CK.
Write Interrupted by Burst Terminate (BL=4)
CK
Command
ACT
Write
A0-9,11
Xa
Ya
Yb
A10
0
0
0
BA0,1
00
00
00
DQ
MIT-DS-0340-0.3
Da0
TBST
Da1
Write
Db0
Db1
MITSUBISHI
ELECTRIC
( 24 / 51 )
Db2
Db3
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
[ Write with Auto-Precharge interrupted by Write or Read to anotehr Bank ]
Burst write with auto-precharge can be interrupted by write or read toanother bank .
Next ACT command can be issued after (BL+tWR-1+tRP) from the WRITEA. Autoprecharge interrrupted by a command to the same bank is inhibited.
WRITEA Interrupted by WRITE to another bank (BL=4)
CK
Command
Write
A0-9,11
Write
BL
Ya
ACT
tRP
Ya
Xa
tWR
A10
1
0
Xa
BA0,1
00
10
00
DQ
Da0
Da1
Db0
Db1
Db2
Db3
activate
auto-precharge interrupted
WRITEA interrupted by READ to another bank (CL=2,BL=4)
CK
Command
Write
Read
ACT
BL
Ya
A0-9,11
tRP
Yb
Xa
tWR
A10
1
0
Xa
BA0,1
00
10
00
DQ
Da0
Da1
auto-precharge interrupted
MIT-DS-0340-0.3
Db0
Db1
Db2
Db3
activate
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
[ Read with Auto-Precharge interrupted by Read to anotehr Bank ]
Burst read with auto-precharge can be interrupted by read toanother bank . Next
ACT command can be issued after (BL+tRP) from the READA. Auto-precharge
interrrupted by a command to the same bank is inhibited.
READA Interrupted by READ to another bank (CL=2,BL=4)
CK
Command
Read
A0-9,11
Read
BL
ACT
tRP
Ya
Ya
Xa
A10
1
0
Xa
BA0,1
00
10
00
DQ
Qa0
Qa1
auto-precharge interrupted
Qb0
Qb1
Qb2
Qb3
activate
Full Page Burst
Full page burst length is available for only the sequential burst type. Full page burst
read or write is repeated untill aPrecharge or a Burst Terminate command is
issued. In case of the full page burst , a read or write with auto-precharge command
is illegal.
Single Write
When single write mode is set, burst length for write is always one, independently
of Burst Length defined by (A2-0).
MIT-DS-0340-0.3
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
AUTO REFRESH
Single cycle of auto-refresh is initiated with a REFA(/CS=/RAS=/CAS=L,
/WE=/CKE=H) command. The refresh address is generated internally.4096 REFA
cycle within 64ms refresh 64Mbit memory cells. The auto-refresh is performed on
4banks concurrently. Before performing an auto-refresh, all banks must be in the
idle state. Auto-refresh to auto-refresh interval is minimum tRFC. Any command
must not be issued before tRFC from the REFA command.
Auto-Refresh
CK
/S
NOP or DESLECT
/RAS
/CAS
/WE
CKE
minimum tRFC
A0-11
BA0,1
Auto Refresh on All Banks
MIT-DS-0340-0.3
Auto Refresh on All Banks
MITSUBISHI
ELECTRIC
( 27 / 51 )
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
SELF REFRESH
Self-refresh mode is entered by issuing a REFS command (/CS=/RAS=/CAS=L,
/WE=H, CKE=L). Once the self-refresh is initiated, it is maintained as log as CKE is
kept low.During the self-refresh mode, CKE is asynchronous and the only enabled
input , all other inputs including CK are disabled and ignored, so that power
consumption due to synchronous inputs is saved. To exit the self-refresh, supplying
stable CK inputs, asserting DESEL or NOP command and then asserting CKE=H.
After tRFC from the 1st CK edge follwing CKE=H, all banks are in the idle state and
a new command can be issued after, but DESEL or NOP commands must be
asserted till then.
Self-Refresh
CK
Stable CK
/S
NOP
/RAS
/CAS
/WE
CKE
new command
A0-11
X
BA0,1
00
Self Refresh Entry
MIT-DS-0340-0.3
Self Refresh Exit
MITSUBISHI
ELECTRIC
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minimum tRFC
for recovery
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
CLK SUSPEND and POWER DOWN
CKE controls the internal CLK at the following cycle. Figure below shows how CKE
works. By negating CKE, the next internal CLK is suspended. The purpose of CLK
suspend is power down, output suspend or input suspend. CKE is a synchronous
input except during the self-refresh mode. CLK suspend can be performed either
when the banks are active or idle. A command at the suspended cycle is ignored.
CK
(ext.CLK)
tIH
tIS
tIH
tIS
CKE
int.CLK
Power Down by CKE
CK
Standby Power Down
CKE
Command
PRE NOP
NOP
NOP
Activ e Power Down
CKE
Command
ACT
NOP
NOP
NOP
DQ Suspend by CKE
CK
CKE
Command
DQ
MIT-DS-0340-0.3
Write
D0
READ
D1
D2
D3
MITSUBISHI
ELECTRIC
( 29 / 51 )
Q0
Q1
Q2
Q3
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
DQM CONTROL
DQMB0-7 is a dual function signal defined as the data mask for writes and the
output disable for reads. During writes, DQMB0-7 masks input data word by word.
DQMB0-7 to Data In latency is 0.
During reads, DQMB0-7 forces output to Hi-Z word by word. DQMB0-7 to output Hi-Z
latency is 2.
DQM Function
CK
Command
READ
Write
DQMB0-7
DQ
D0
D2
D3
Q0
masked by DQMB=H
MIT-DS-0340-0.3
Q1
Q3
disabled by DQMB=H
MITSUBISHI
ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
ABSOLUTE M AXIMUM RATINGS
Symbol
Parameter
Condition
Ratings
Unit
Vdd
Supply Voltage
with respect to Vss
-0.5 ~ 4.6
V
VI
Input Voltage
with respect to Vss
-0.5 ~ Vdd+0.5
V
VO
Output Voltage
with respect to Vss
-0.5 ~ Vdd+0.5
V
IO
Output Current
50
mA
Pd
Power Dissipation
8
W
Topr
Operating Temperature
0 ~ 70
°C
Tstg
Storage Temperature
-40 ~ 100
°C
Ta=25°C
RECOM M ENDED OPERATING CONDITION
(Ta=0 ~ 70°C, unless otherwise noted)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Vdd
Supply Voltage
3.0
3.3
3.6
V
Vss
Supply Voltage
0
0
0
V
VIH
High-Level Input Voltage all inputs
2.0
Vdd+0.3
V
VIL
Low-Level Input Voltage all inputs
-0.3
0.8
V
Note)
1:VIH(max)=5.5V f or pulse width less than 10ns.
2.VIL(min)=-1.0 f or pulse width less than 10ns.
CAPACITANCE
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Symbol
Parameter
Test Condition
CI(A)
Input Capacitance, address pin
CI(C)
Input Capacitance, control pin
CI(K)
Input Capacitance, CK pin
CI/O
Input Capacitance, I/O pin
MIT-DS-0340-0.3
VI = 1.4V
f=1MHz
Vi=200mVrms
MITSUBISHI
ELECTRIC
( 31 / 51 )
Limits(max.)
Unit
45
pF
45
pF
35
pF
22
pF
27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
AVERAGE SUPPLY CURRENT from Vdd
(Ta=0 ~70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Symbol
Parameter
Limits
(max)
-7,-7L,
-6,-6L
-8,-8L
Test Condition
operating current
one bank activ e (discrete)
Unit
tRC=min.tCLK=min, BL=1,CL=3
Icc1
precharge stanby
Icc2P CKE=L,tCLK=15ns, /CS>Vcc-0.2V
current
in power-down mode
Icc2PS CKE=CLK=L, /CS>Vcc-0.2V
precharge stanby current Icc2N CKE=H,tCLK=15ns,VIH>Vcc-0.2V,VIL<0.2V
in non power-down mode Icc2NS CKE=H,CLK=L,VIH>Vcc-0.2V,VIL<0.2V(f ixed)
460
440
mA
16
16
mA
8
160
120
8
160
120
mA
mA
mA
active stanby current
in non power-down mode
240
240
mA
200
200
mA
520
1040
440
880
mA
-6,-7,-8
8
8
mA
mA
-6L,-7L,-8L
4
4
mA
one bank activ e (discrete)
burst current
auto-refresh current
self-refresh current
Icc3N
CKE=H,tCLK=15ns
Icc3NS CKE=H,CLK=L
tCLK=min, BL=4, CL=3,all banks activ e(discerte)
Icc4
tRC=min, tCLK=min
Icc5
Icc6
CKE <0.2V
Note)
1:Icc(max) is specif ied at the output open condition.
2.Input signals are changed one time during 30ns.
AC OPERATING CONDITIONS AND CHARACTERISTICS
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Symbol
VOH(DC)
VOL(DC)
IOZ
VOH(AC)
Ii
VOL(AC)
Limits
Min. Max. Unit
High-Level Output Voltage(DC) IOH=-2mA
2.4
V
Low-Level Output Voltage(DC) IOL=2mA
0.4
V
floating VO=0
10 uA
Off-stare
Output
Current
High-Level
Output
Voltage(AC) Q
CL=50pF,
IOH=- ~ Vdd -10
2
V
40
-40
Input Current
2mA
VIH=0 ~ Vdd+0.3V
Low-Level
Output Voltage(AC) CL=50pF,
IOL=2mA
0.8 uA
V
MIT-DS-0340-0.3
Parameter
Test Condition
MITSUBISHI
ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
AC TIMING REQUIREMENTS (SDRAM Component)
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Input Pulse Levels:
0.8V to 2.0V
Input Timing Measurement Level: 1.4V
Symbol Parameter
tCLK
tCH
tCL
tT
tIS
tIH
tRC
tRFC
tRCD
tRAS
tRP
tWR
tRRD
tRSC
tREF
Limits
-7,-7L
Min. Max.
-6,-6L
Min. Max.
CL=2
-8,-8L
Unit
Min. Max.
10
10
13
ns
7.5
2.5
CK High pulse width
2.5
CK Low pilse width
1
Transition time of CK
1.5
Input Setup time(all inputs)
0.8
Input Hold time(all inputs)
67.5
Row cycle time
75
Refresh Cycle time
20
Row to Column Delay
45
Row Active time
20
Row Precharge time
12
Write Recovery time
15
Act to Act Deley time
Mode Register Set Cycle time 10
Refresh Interval time
10
3
3
1
2
1
70
80
20
50
20
12
20
10
10
3
3
1
2
1
70
80
20
50
20
12
20
10
ns
ns
ns
10 ns
ns
ns
ns
ns
ns
100K ns
ns
ns
ns
ns
64 ms
CK cycle tim e
CL=3
10
100K
64
10
100K
64
Note:1 The timing requirements are assumed tT=1ns.If tT is longer than 1ns,(tT-1)ns
should be added to the parameter.
CK
1.4V
Any AC timing is
referenced to the input
Signal
1.4V
signal crossing
through 1.4V.
MIT-DS-0340-0.3
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
SWITCHING CHARACTERISTICS (SDRAM Component)
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise note3)
Limits
-6,-6L
-8,-8L
-7,-7L
Min. Max. Min. Max. Min. Max.
Symbol Parameter
tAC
tOH
tOLZ
tOHZ
Access time from CK
Output Hold tim e
from CK
Unit
CL=2
6
6
7
ns
CL=3
5.4
6
6
ns
CL=2
3
3
3
ns
CL=3
2.7
3
3
ns
0
0
0
ns
Delay time, output low
impedance from CK
Delay time, output high
impedance from CK
5.4
2.7
3
6
3
6
ns
Note)
1 If clock rising time is longer than 1ns,(tT/2-0.5)ns should be added to parameter.
Output Load Condition
CK
1.4V
V OUT
DQ
1.4V
50pF
Output Timing
Measurement
Reference Point
1.4V
CK
tOLZ
DQ
1.4V
tAC
MIT-DS-0340-0.3
tOH
tOHZ
MITSUBISHI
ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Burst Write (single bank) @BL=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
/WE
tWR
tWR
CKE
DQM
A0-7
X
A10
X
X
A8-9,11
X
X
BA0,1
0
Y
0
D0
DQ
ACT#0
X
0
D0
WRITE#0
D0
Y
0
D0
D0
PRE#0
0
0
ACT#0
D0
WRITE#0
D0
D0
PRE#0
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Burst Write (multi bank) @BL=4
0
1
2
3
4
5
6
CLK
7
8
9
10
11
12
13
14
15
16
17
tRC
tRC
/CS
tRRD
tRAS
tRP
/RAS
tRCD
tRCD
tRCD
/CAS
tWR
tWR
/WE
CKE
DQM
A0-7
X
A10
X
X
X
X
A8-9,11
X
X
X
X
BA0,1
0
DQ
ACT#0
Y
X
0
1
D0
D0
Y
1
D0
WRITE#0
ACT#1
D0
D1
X
0
D1
D1
Y
0
0
D1
D0
PRE#0 ACT#0
WRITEA#1
(Auto-Precharge)
X
1
D0
D0
0
D0
WRITE#0
ACT#1
PRE#0
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Burst Read (single bank) @BL=4 CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRAS
tRP
tRAS
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
A0-7
X
A10
X
X
A8-9,11
X
X
BA0,1
0
Y
X
0
0
Q0
DQ
ACT#0
READ#0
Q0
Q0
Y
0
0
0
Q0
Q0
PRE#0 ACT#0
READ#0
Q0
Q0
Q0
PRE#0
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Burst Read (multiple bank) @BL=4 CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
tRC
tRC
/CS
tRAS
tRRD
/RAS
tRCD
tRCD
tRCD
/CAS
/WE
CKE
DQM
A0-7
X
A10
X
X
X
X
A8-9,11
X
X
X
X
BA0,1
0
Y
0
X
Y
1
1
Q0
DQ
ACT#0
READA#0
ACT#1
X
Q0
Q0
Y
0
0
Q1
Q0
X
Q1
ACT#0
READA#1
Q1
0
1
Q1
Q0
Q0
READ#0
Q0
Q0
PRE#0
ACT#1
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Write Interrupted by Write @BL=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
/CAS
tWR
/WE
CKE
DQM
A0-7
X
A10
X
X
X
A8-9,11
X
X
X
BA0,1
0
DQ
Y
X
0
1
D0
D0
Y
Y
0
D0
D0
Y
1
D1
D1
X
0
D1
WRITE#0
ACT#0 WRITE#0
WRITEA#1
ACT#1 interrupt
same bank interrupt
other bank
D1
D0
0
D0
WRITE#0
interrupt
other bank
D0
1
D0
PRE#0
ACT#1
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Read Interrupted by Read @BL=4 CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
tRCD
/CAS
/WE
CKE
DQM
A0-7
X
A10
X
X
X
A8-9,11
X
X
X
BA0,1
0
Y
0
X
Y
1
1
Q0
DQ
ACT#0 READ#0
ACT#1
Y
Q0
Y
1
Q0
Q0
X
0
Q1
Q1
READ#1 READA#1
interrupt
interurrpt
other bank same bank
Q1
1
Q1
Q0
READ#0
interurrpt
other bank
Q0
Q0
Q0
ACT#1
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Write Interrupted by Read, Read Interrupted by Write @BL=4,CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
tRRD
/RAS
tRCD
tRCD
/CAS
tWR
/WE
CKE
DQM
A0-7
X
X
A10
X
X
A8-9,11
X
X
BA0,1
0
1
Y
Y
Y
0
1
1
D0
DQ
ACT#0
D0
WRITE#0 READ#1
ACT#1
Q1
Q1
1
D1
D1
D1
D1
PRE#1
WRITE#1
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Write/Read Terminated by Precharge @BL=4 CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
tRC
/CS
tRRD
tRP
tRAS
tRP
/RAS
tRCD
tRCD
/CAS
tWR
/WE
CKE
DQM
A0-7
X
Y
A10
X
X
X
A8-9,11
X
X
X
BA0,1
0
0
D0
DQ
ACT#0
X
0
Y
0
0
D0
X
0
Q0
PRE#0
ACT#0
Termination
WRITE#0
READ#0
0
Q0
PRE#0
ACT #0
Termination
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Write/Read Terminated by Burst Terminate @BL=4,CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
tWR
/WE
CKE
DQM
A0-7
X
A10
X
A8-9,11
X
BA0,1
0
Y
Y
Y
0
0
0
D0
DQ
ACT#0
D0
D0
Q0
Q0
WRITE#0 TBST READ#0
0
D0
D0
WRITE#0
D0
D0
PRE#0
TBST
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Single Write Burst Read @BL=4 CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-7
X
A10
X
A8-9,11
X
BA0,1
0
Y
Y
0
0
D0
DQ
ACT#0
Q0
Q0
Q0
Q0
READ#0
WRITE#0
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Power-Up Sequence and Intialize
CLK
200us
/CS
tRFC
tRP
tRFC
tRSC
/RAS
/CAS
/WE
CKE
DQM
A0-7
MA
X
A10
0
X
A8-9,11
0
X
BA0,1
0
0
DQ
NOP
Power On
PRE ALL
REFA
REFA
REFA
MRS
ACT#0
Minimum 8 REFA cy c les
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Auto Refresh
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
tRFC
/CS
/RAS
tRP
tRCD
/CAS
/WE
CKE
DQM
A0-7
X
A10
X
A8-9,11
X
BA0,1
0
Y
0
D0
DQ
PRE ALL REFA
ACT #0
D0
D0
D0
WRITE#0
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Self Refresh
0
1
2
3
4
5
6
7
8
9
10
11
12
13 14
15
16
17
CLK
tRFC
/CS
tRP
/RAS
/CAS
/WE
CKE
DQM
A0-7
X
A10
X
A8-9,11
X
0
BA0,1
DQ
PRE ALL
Self Refresh Entry
Self RefreshExit
ACT#0
All banks must be idle bef ore REFS is issued.
MIT-DS-0340-0.3
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
CLK Suspension @BL=4 CL=2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
tRCD
/CAS
/WE
CKE
DQM
A0-7
X
A10
X
A8-9,11
X
BA0,1
0
Y
Y
0
0
D0
DQ
ACT#0
D0
D0
D0
Q0
D0
WRITE#0
Q0
Q0
Q0
READ#0
Internal CLK
suspended
Internal CLK
suspended
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Power Down
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
CLK
/CS
/RAS
/CAS
/WE
Active Power Down
Stanby Power Down
CKE
DQM
A0-7
X
A10
X
A8-9,11
X
BA0,1
0
DQ
PRE ALL
ACT#0
Italic parameter indicates minimum case
MIT-DS-0340-0.3
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
OUTLINE
31.75
20.00
4.00
MIT-DS-0340-0.3
6.00
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ELECTRIC
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27.Mar.2001
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64DBKG -6,-6L-7,-7L,-8,-8L
536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products
better and more reliable, but there is always the possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with
appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1.These materials are intended as a reference to assist our customers in the selection of the
Mitsubishi semiconductor product best suited to the customer's application; they do not
convey any license under any intellectual property rights, or any other rights, belonging to
Mitsubishi Electric Corporation or a third party.
2.Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement
of any third-party's rights, originating in the use of any product data, diagrams, charts,
programs, algorithms, or circuit application examples contained in these materials.
3.All information contained in these materials, including product data, diagrams, charts,
programs and algorithms represents information on products at the time of publication of
these materials, and are subject to change by Mitsubishi Electric Corporation without notice
due to product improvements or other reasons. It is therefore recommended that customers
contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product
distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other
loss rising from these inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by
various means, including the Mitsubishi Semiconductor home page
(http://www.mitsubishichips.com).
4.When using any or all of the information contained in these materials, including product
data, diagrams, charts, programs and algorithms, please be sure to evaluate all information
as a total system before making a final decision on the applicability of the information and
products.
Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in
a device or system that is used under circumstances in which human life is potentially at stake.
Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor
product distributor when considering the use of a product contained herein for any specific
purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace,
nuclear, or undersea repeater use.
6.The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or
reproduce in whole or in part these materials.
7.If these products or technologies are subject to the Japanese export control restrictions, they
must be exported under a license from the Japanese government and cannot be imported
into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or
the country of destination is prohibited.
8.Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor
product distributor for further details on these materials or the products contained therein.
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