Freescale DSP56F801 16-bit digital signal controller Datasheet

56F801
Data Sheet
Preliminary Technical Data
56F800
16-bit Digital Signal Controllers
DSP56F801
Rev. 16
01/2007
freescale.com
56F801 General Description
• Up to 30 MIPS operation at 60MHz core frequency
• 8K × 16-bit words (16KB) Program Flash
• Up to 40 MIPS operation at 80MHz core frequency
• 1K × 16-bit words (2KB) Program RAM
• DSP and MCU functionality in a unified,
C-efficient architecture
• 2K × 16-bit words (4KB) Data Flash
• MCU-friendly instruction set supports both DSP and
controller functions: MAC, bit manipulation unit, 14
addressing modes
• 2K × 16-bit words (4KB) Boot Flash
• Hardware DO and REP loops
• JTAG/OnCETM port for debugging
• 6-channel PWM Module
• On-chip relaxation oscillator
• Two 4-channel, 12-bit ADCs
• 11 shared GPIO
• Serial Communications Interface (SCI)
• 48-pin LQFP Package
• 1K × 16-bit words (2KB) Data RAM
• General Purpose Quad Timer
• Serial Peripheral Interface (SPI)
6
PWM Outputs
PWMA
RESET
Fault Input
IRQA
6
VCAPC VDD
VSS
2
5*
4
JTAG/
OnCE
Port
4
4
A/D1
A/D2
VREF
Program Memory
8188 x 16 Flash
1024 x 16 SRAM
Quad Timer C
3
Quad Timer D
or GPIO
4
•
•
16-Bit
56800
Core
•
CGDB
XAB1
XAB2
COP/
Watchdog
Application-Specific
Memory &
Peripherals
Bit
Manipulation
Unit
PLL
•
XDB2
•
Analog Reg
Data ALU
16 x 16 + 36 → 36-Bit MAC
Three 16-bit Input Registers
Two 36-bit Accumulators
Address
Generation
Unit
PAB
PDB
VSSA
Low Voltage
Supervisor
•
INTERRUPT
CONTROLS
16
SCI0
or
GPIO
SPI
or
GPIO
Program Controller
and
Hardware Looping Unit
Boot Flash
2048 x 16 Flash
Data Memory
2048 x 16 Flash
1024 x 16 SRAM
2
Digital Reg
ADC
Interrupt
Controller
VDDA
•
Clock Gen
or Optional
Internal
Relaxation Osc.
GPIOB3/XTAL
GPIOB2/EXTAL
•
IPBB
CONTROLS
16
COP RESET
MODULE CONTROLS
ADDRESS BUS [8:0]
IPBus Bridge
(IPBB)
DATA BUS [15:0]
*includes TCS pin which is reserved for factory use and is tied to VSS
56F801 Block Diagram
56F801 Technical Data, Rev. 16
Freescale Semiconductor
3
Part 1 Overview
1.1 56F801 Features
1.1.1
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1.1.2
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Digital Signal Processing Core
Efficient 16-bit 56800 family controller engine with dual Harvard architecture
As many as 40 Million Instructions Per Second (MIPS) at 80MHz core frequency
Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC)
Two 36-bit accumulators including extension bits
16-bit bidirectional barrel shifter
Parallel instruction set with unique processor addressing modes
Hardware DO and REP loops
Three internal address buses and one external address bus
Four internal data buses and one external data bus
Instruction set supports both DSP and controller functions
Controller style addressing modes and instructions for compact code
Efficient C compiler and local variable support
Software subroutine and interrupt stack with depth limited only by memory
JTAG/OnCE debug programming interface
Memory
Harvard architecture permits as many as three simultaneous accesses to Program and Data memory
On-chip memory including a low-cost, high-volume Flash solution
— 8K × 16 bit words of Program Flash
— 1K × 16-bit words of Program RAM
— 2K × 16-bit words of Data Flash
— 1K × 16-bit words of Data RAM
— 2K × 16-bit words of Boot Flash
•
1.1.3
•
•
•
•
•
Programmable Boot Flash supports customized boot code and field upgrades of stored code through a
variety of interfaces (JTAG, SPI)
Peripheral Circuits for 56F801
Pulse Width Modulator (PWM) with six PWM outputs, two Fault inputs, fault-tolerant design with deadtime
insertion; supports both center- and edge-aligned modes
Two 12-bit, Analog-to-Digital Converters (ADCs), which support two simultaneous conversions with two
4-multiplexed inputs; ADC and PWM modules can be synchronized
General Purpose Quad Timer: Timer D with three pins (or three additional GPIO lines)
Serial Communication Interface (SCI) with two pins (or two additional GPIO lines)
Serial Peripheral Interface (SPI) with configurable four-pin port (or four additional GPIO lines)
56F801 Technical Data, Rev. 16
4
Freescale Semiconductor
56F801 Description
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1.1.4
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Eleven multiplexed General Purpose I/O (GPIO) pins
Computer-Operating Properly (COP) watchdog timer
One dedicated external interrupt pin
External reset pin for hardware reset
JTAG/On-Chip Emulation (OnCE™) for unobtrusive, processor speed-independent debugging
Software-programmable, Phase Locked Loop-based frequency synthesizer for the controller core clock
Oscillator flexibility between either an external crystal oscillator or an on-chip relaxation oscillator for
lower system cost and two additional GPIO lines
Energy Information
Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs
Uses a single 3.3V power supply
On-chip regulators for digital and analog circuitry to lower cost and reduce noise
Wait and Stop modes available
1.2 56F801 Description
The 56F801 is a member of the 56800 core-based family of processors. It combines, on a single chip, the
processing power of a DSP and the functionality of a microcontroller with a flexible set of peripherals to
create an extremely cost-effective solution. Because of its low cost, configuration flexibility, and
compact program code, the 56F801 is well-suited for many applications. The 56F801 includes many
peripherals that are especially useful for applications such as motion control, smart appliances, steppers,
encoders, tachometers, limit switches, power supply and control, automotive control, engine
management, noise suppression, remote utility metering, and industrial control for power, lighting, and
automation.
The 56800 core is based on a Harvard-style architecture consisting of three execution units operating in
parallel, allowing as many as six operations per instruction cycle. The microprocessor-style programming
model and optimized instruction set allow straightforward generation of efficient, compact code for both
DSP and MCU applications. The instruction set is also highly efficient for C compilers to enable rapid
development of optimized control applications.
The 56F801 supports program execution from either internal or external memories. Two data operands can
be accessed from the on-chip Data RAM per instruction cycle. The 56F801 also provides one external
dedicated interrupt lines and up to 11 General Purpose Input/Output (GPIO) lines, depending on peripheral
configuration.
The 56F801 controller includes 8K words (16-bit) of Program Flash and 2K words of Data Flash (each
programmable through the JTAG port) with 1K words of both Program and Data RAM. A total of 2K
words of Boot Flash is incorporated for easy customer-inclusion of field-programmable software routines
that can be used to program the main Program and Data Flash memory areas. Both Program and Data Flash
memories can be independently bulk erased or erased in page sizes of 256 words. The Boot Flash memory
can also be either bulk or page erased.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
5
A key application-specific feature of the 56F801 is the inclusion of a Pulse Width Modulator (PWM)
module. This modules incorporates six complementary, individually programmable PWM signal outputs
to enhance motor control functionality. Complementary operation permits programmable dead-time
insertion, and separate top and bottom output polarity control. The up-counter value is programmable to
support a continuously variable PWM frequency. Both edge- and center-aligned synchronous pulse width
control (0% to 100% modulation) are supported. The device is capable of controlling most motor types:
ACIM (AC Induction Motors), both BDC and BLDC (Brush and Brushless DC motors), SRM and VRM
(Switched and Variable Reluctance Motors), and stepper motors. The PWMs incorporate fault protection
and cycle-by-cycle current limiting with sufficient output drive capability to directly drive standard
opto-isolators. A “smoke-inhibit”, write-once protection feature for key parameters is also included. The
PWM is double-buffered and includes interrupt control to permit integral reload rates to be programmable
from 1 to 16. The PWM modules provide a reference output to synchronize the Analog-to-Digital
Converters.
The 56F801 incorporates an 8 input, 12-bit Analog-to-Digital Converter (ADC). A full set of standard
programmable peripherals is provided that include a Serial Communications Interface (SCI), a Serial
Peripheral Interface (SPI), and two Quad Timers. Any of these interfaces can be used as General-Purpose
Input/Outputs (GPIO) if that function is not required. An on-chip relaxation oscillator provides flexibility
in the choice of either on-chip or externally supplied frequency reference for chip timing operations.
Application code is used to select which source is to be used.
1.3 State of the Art Development Environment
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•
Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use
component-based software application creation with an expert knowledge system.
The Code Warrior Integrated Development Environment is a sophisticated tool for code navigation,
compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards
will support concurrent engineering. Together, PE, Code Warrior and EVMs create a complete, scalable
tools solution for easy, fast, and efficient development.
56F801 Technical Data, Rev. 16
6
Freescale Semiconductor
Product Documentation
1.4 Product Documentation
The four documents listed in Table 1-1 are required for a complete description and proper design with the
56F801. Documentation is available from local Freescale distributors, Freescale semiconductor sales
offices, Freescale Literature Distribution Centers, or online at www.freescale.com.
Table 1-1 56F801 Chip Documentation
Topic
Description
Order Number
56800E
Family Manual
Detailed description of the 56800 family architecture, and
16-bit core processor and the instruction set
56800EFM
DSP56F801/803/805/807
User’s Manual
Detailed description of memory, peripherals, and interfaces
of the 56F801, 56F803, 56F805, and 56F807
DSP56F801-7UM
56F801
Technical Data Sheet
Electrical and timing specifications, pin descriptions, and
package descriptions (this document)
DSP56F801
56F801
Errata
Details any chip issues that might be present
56F801E
1.5 Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
This is used to indicate a signal that is active when pulled low. For example, the RESET pin is
active when low.
“asserted”
A high true (active high) signal is high or a low true (active low) signal is low.
“deasserted”
A high true (active high) signal is low or a low true (active low) signal is high.
Examples:
Signal/Symbol
Logic State
Signal State
Voltage1
PIN
True
Asserted
VIL/VOL
PIN
False
Deasserted
VIH/VOH
PIN
True
Asserted
VIH/VOH
PIN
False
Deasserted
VIL/VOL
1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
7
Part 2 Signal/Connection Descriptions
2.1 Introduction
The input and output signals of the 56F801 are organized into functional groups, as shown in Table 2-1
and as illustrated in Figure 2-1. In Table 2-2 through Table 2-12, each table row describes the signal or
signals present on a pin.
Table 2-1 Functional Group Pin Allocations
Number of
Pins
Detailed
Description
Power (VDD or VDDA)
5
Table 2-2
Ground (VSS or VSSA)
6
Table 2-3
Supply Capacitors
2
Table 2-4
PLL and Clock
2
Table 2-5
Interrupt and Program Control
2
Table 2-6
Pulse Width Modulator (PWM) Port
7
Table 2-7
Serial Peripheral Interface (SPI) Port1
4
Table 2-8
Serial Communications Interface (SCI) Port1
2
Table 2-9
Analog-to-Digital Converter (ADC) Port
9
Table 2-10
Quad Timer Module Port
3
Table 2-11
JTAG/On-Chip Emulation (OnCE)
6
Table 2-12
Functional Group
1. Alternately, GPIO pins
56F801 Technical Data, Rev. 16
8
Freescale Semiconductor
Introduction
Power Port
Ground Port
Power Port
Ground Port
VDD
4
VSS
5*
VDDA
1
VSSA
1
Other
Supply
Port
VCAPC
PLL and Clock
or GPIO
EXTAL (GPIOB2)
XTAL (GPIOB3)
PWMA0-5
2
6
1
FAULTA0
1
SCLK (GPIOB4)
1
MOSI (GPIOB5)
1
MISO (GPIOB6)
1
SS (GPIOB7)
1
TXD0 (GPIOB0)
1
RXD0 (GPIOB1)
8
ANA0-7
1
VREF
3
TD0-2 (GPIOA0-2)
1
IRQA
1
RESET
1
1
56F801
TCK
TMS
TDI
JTAG/OnCE™
Port
TDO
TRST
DE
SPI Port
or GPIO
SCI0 Port
or GPIO
ADCA Port
Quad
Timer D
or GPIO
1
1
1
1
Interrupt/
Program
Control
1
1
*includes TCS pin which is reserved for factory use and is tied to VSS
Figure 2-1 56F801 Signals Identified by Functional Group1
1. Alternate pin functionality is shown in parenthesis.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
9
2.2 Power and Ground Signals
Table 2-2 Power Inputs
No. of Pins
Signal Name
Signal Description
4
VDD
Power—These pins provide power to the internal structures of the chip, and should all be
attached to VDD.
1
VDDA
Analog Power—This pin is a dedicated power pin for the analog portion of the chip and
should be connected to a low noise 3.3V supply.
Table 2-3 Grounds
No. of Pins
Signal Name
Signal Description
4
VSS
GND—These pins provide grounding for the internal structures of the chip, and should all
be attached to VSS.
1
VSSA
Analog Ground—This pin supplies an analog ground.
1
TCS
TCS—This Schmitt pin is reserved for factory use and must be tied to VSS for normal use.
In block diagrams, this pin is considered an additional VSS.
Table 2-4 Supply Capacitors and VPP
No. of
Pins
Signal
Name
Signal
Type
State
During Reset
2
VCAPC
Supply
Supply
Signal Description
VCAPC—Connect each pin to a 2.2 μFor greater bypass capacitor in order
to bypass the core logic voltage regulator (required for proper chip
operation). For more information, refer to Section 5.2.
2.3 Clock and Phase Locked Loop Signals
Table 2-5 PLL and Clock
No. of
Pins
Signal
Name
Signal
Type
State
During Reset
1
EXTAL
Input
Input
External Crystal Oscillator Input—This input should be connected to an
8MHz external crystal or ceramic resonator. For more information, please
refer to Section 3.5.
GPIOB2
Input/
Output
Input
Port B GPIO—This multiplexed pin is a General Purpose I/O (GPIO) pin that
can be programmed as an input or output pin. This I/O can be utilized when
using the on-chip relaxation oscillator so the EXTAL pin is not needed.
Signal Description
56F801 Technical Data, Rev. 16
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Freescale Semiconductor
Interrupt and Program Control Signals
Table 2-5 PLL and Clock (Continued)
No. of
Pins
Signal
Name
Signal
Type
State
During Reset
1
XTAL
Output
Chipdriven
Signal Description
Crystal Oscillator Output—This output should be connected to an 8MHz
external crystal or ceramic resonator. For more information, please refer to
Section 3.5.
This pin can also be connected to an external clock source. For more
information, please refer to Section 3.5.3.
GPIOB3
Input/
Output
Input
Port B GPIO—This multiplexed pin is a General Purpose I/O (GPIO) pin that
can be programmed as an input or output pin. This I/O can be utilized when
using the on-chip relaxation oscillator so the XTAL pin is not needed.
2.4 Interrupt and Program Control Signals
Table 2-6 Interrupt and Program Control Signals
No. of
Pins
Signal
Name
Signal
Type
State
During Reset
1
IRQA
Input
(Schmitt)
Input
External Interrupt Request A—The IRQA input is a synchronized
external interrupt request that indicates that an external device is
requesting service. It can be programmed to be level-sensitive or
negative-edge- triggered.
1
RESET
Input
(Schmitt)
Input
Reset—This input is a direct hardware reset on the processor. When
RESET is asserted low, the controller is initialized and placed in the
Reset state. A Schmitt trigger input is used for noise immunity. When the
RESET pin is deasserted, the initial chip operating mode is latched from
the EXTBOOT pin. The internal reset signal will be deasserted
synchronous with the internal clocks, after a fixed number of internal
clocks.
Signal Description
To ensure complete hardware reset, RESET and TRST should be
asserted together. The only exception occurs in a debugging
environment when a hardware device reset is required and it is
necessary not to reset the OnCE/JTAG module. In this case, assert
RESET, but do not assert TRST.
2.5 Pulse Width Modulator (PWM) Signals
Table 2-7 Pulse Width Modulator (PWMA) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
6
PWMA0-5
Output
Tri-stated
1
FAULTA0
Input
(Schmitt)
Input
Signal Description
PWMA0-5— These are six PWMA output pins.
FAULTA0— This fault input pin is used for disabling selected PWMA
outputs in cases where fault conditions originate off-chip.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
11
2.6 Serial Peripheral Interface (SPI) Signals
Table 2-8 Serial Peripheral Interface (SPI) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
MISO
Input/Output
Input
SPI Master In/Slave Out (MISO)—This serial data pin is an input to
a master device and an output from a slave device. The MISO line of
a slave device is placed in the high-impedance state if the slave
device is not selected.
Input
Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can
be individually programmed as input or output pin.
Signal Description
Input/Output
GPIOB6
After reset, the default state is MISO.
1
MOSI
Input/Output
Input
Input/Output
GPIOB5
Input
SPI Master Out/Slave In (MOSI)—This serial data pin is an output
from a master device and an input to a slave device. The master
device places data on the MOSI line a half-cycle before the clock
edge that the slave device uses to latch the data.
Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can
be individually programmed as input or output pin.
After reset, the default state is MOSI.
1
SCLK
Input/Output
Input
SPI Serial Clock—In master mode, this pin serves as an output,
clocking slaved listeners. In slave mode, this pin serves as the data
clock input.
Input
Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can
be individually programmed as an input or output pin.
Input/Output
GPIOB4
After reset, the default state is SCLK.
1
SS
Input
Input
GPIOB7
Input/Output
Input
SPI Slave Select—In master mode, this pin is used to arbitrate
multiple masters. In slave mode, this pin is used to select the slave.
Port E GPIO—This pin is a General Purpose I/O (GPIO) pin that can
be individually programmed as an input or output pin.
After reset, the default state is SS.
56F801 Technical Data, Rev. 16
12
Freescale Semiconductor
Serial Communications Interface (SCI) Signals
2.7 Serial Communications Interface (SCI) Signals
Table 2-9 Serial Communications Interface (SCI0) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
TXD0
Output
Input
Transmit Data (TXD0)—SCI0 transmit data output
GPIOB0
Input/Output
Input
Port B GPIO—This pin is a General Purpose I/O (GPIO) pin that
can be individually programmed as an input or output pin.
Signal Description
After reset, the default state is SCI output.
1
RXD0
Input
Input
Receive Data (RXD0)—SCI0 receive data input
GPIOB1
Input/Output
Input
Port B GPIO—This pin is a General Purpose I/O (GPIO) pin that
can be individually programmed as an input or output pin.
After reset, the default state is SCI input.
2.8 Analog-to-Digital Converter (ADC) Signals
Table 2-10 Analog to Digital Converter Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
4
ANA0-3
Input
Input
ANA0-3—Analog inputs to ADC, channel 1
4
ANA4-7
Input
Input
ANA4-7—Analog inputs to ADC, channel 2
1
VREF
Input
Input
VREF—Analog reference voltage for ADC. Must be set to
VDDA-0.3V for optimal performance.
Signal Description
2.9 Quad Timer Module Signals
Table 2-11 Quad Timer Module Signals
No. of
Pins
Signal
Name
Signal Type
State During
Reset
3
TD0-2
Input/Output
Input
TD0-2—Timer D Channel 0-2
Input
Port A GPIO—This pin is a General Purpose I/O (GPIO) pin that
can be individually programmed as an input or output pin.
Signal Description
Input/Output
GPIOA0-2
After reset, the default state is the quad timer input.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
13
2.10 JTAG/OnCE
Table 2-12 JTAG/On-Chip Emulation (OnCE) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
TCK
Input
(Schmitt)
Input, pulled
low internally
1
TMS
Input
(Schmitt)
Input, pulled Test Mode Select Input—This input pin is used to sequence the JTAG
high internally TAP controller’s state machine. It is sampled on the rising edge of TCK and
has an on-chip pull-up resistor.
Signal Description
Test Clock Input—This input pin provides a gated clock to synchronize the
test logic and shift serial data to the JTAG/OnCE port. The pin is connected
internally to a pull-down resistor.
Note:
1
TDI
Input
(Schmitt)
1
TDO
Output
1
TRST
Input
(Schmitt)
Always tie the TMS pin to VDD through a 2.2K resistor.
Input, pulled Test Data Input—This input pin provides a serial input data stream to the
high internally JTAG/OnCE port. It is sampled on the rising edge of TCK and has an
on-chip pull-up resistor.
Tri-stated
Test Data Output—This tri-statable output pin provides a serial output data
stream from the JTAG/OnCE port. It is driven in the Shift-IR and Shift-DR
controller states, and changes on the falling edge of TCK.
Input, pulled Test Reset—As an input, a low signal on this pin provides a reset signal to
high internally the JTAG TAP controller. To ensure complete hardware reset, TRST should
be asserted whenever RESET is asserted. The only exception occurs in a
debugging environment when a hardware device reset is required and it is
necessary not to reset the OnCE/JTAG module. In this case, assert RESET,
but do not assert TRST.
Note: For normal operation, connect TRST directly to VSS. If the design is to be
used in a debugging environment, TRST may be tied to VSS through a 1K resistor.
1
DE
Output
Output
Debug Event—DE provides a low pulse on recognized debug events.
Part 3 Specifications
3.1 General Characteristics
The 56F801 is fabricated in high-density CMOS with 5-volt tolerant TTL-compatible digital inputs. The
term “5-volt tolerant” refers to the capability of an I/O pin, built on a 3.3V compatible process technology,
to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices
designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V and 5V- compatible
I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ± 10% during
normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings
of 3.3V I/O levels while being able to receive 5V levels without being damaged.
Absolute maximum ratings given in Table 3-1 are stress ratings only, and functional operation at the
maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent
damage to the device.
56F801 Technical Data, Rev. 16
14
Freescale Semiconductor
General Characteristics
The 56F801 DC and AC electrical specifications are preliminary and are from design simulations. These
specifications may not be fully tested or guaranteed at this early stage of the product life cycle. Finalized
specifications will be published after complete characterization and device qualifications have been
completed.
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields.
However, normal precautions are advised to avoid
application of any voltages higher than maximum rated
voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an
appropriate voltage level.
Table 3-1 Absolute Maximum Ratings
Characteristic
Symbol
Min
Max
Unit
Supply voltage
VDD
VSS – 0.3
VSS + 4.0
V
All other input voltages, excluding Analog inputs
VIN
VSS – 0.3
VSS + 5.5V
V
Voltage difference VDD to VDDA
ΔVDD
- 0.3
0.3
V
Voltage difference VSS to VSSA
ΔVSS
- 0.3
0.3
V
Analog inputs ANA0-7 and VREF
VIN
VSSA– 0.3
VDDA+ 0.3
V
Analog inputs EXTAL, XTAL
VIN
VSSA– 0.3
VSSA+ 3.0
V
I
—
10
mA
Current drain per pin excluding VDD, VSS, & PWM ouputs
Table 3-2 Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
Supply voltage, digital
VDD
3.0
3.3
3.6
V
Supply Voltage, analog
VDDA
3.0
3.3
3.6
V
Voltage difference VDD to VDDA
ΔVDD
-0.1
-
0.1
V
Voltage difference VSS to VSSA
ΔVSS
-0.1
-
0.1
V
ADC reference voltage1
VREF
2.7
–
3.3V
V
TA
–40
–
85
°C
Ambient operating temperature
1. VREF must be 0.3 below VDDA.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
15
Table 3-3 Thermal Characteristics6
Value
Characteristic
Comments
Symbol
Unit
Notes
48-pin LQFP
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
RθJA
50.6
°C/W
2
RθJMA
47.4
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
39.1
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
37.9
°C/W
1,2
Junction to case
RθJC
17.3
°C/W
3
Junction to center of case
ΨJT
1.2
°C/W
4, 5
I/O pin power dissipation
P I/O
User Determined
W
Power dissipation
PD
P D = (IDD x VDD + P I/O)
W
PDMAX
(TJ - TA) /RθJA
W
Junction to center of case
7
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
2.
Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where s is the number of signal layers and p is the number
of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the
non-single layer boards is Theta-JMA.
3.
Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
4.
Thermal Characterization Parameter, Psi-JT (ΨJT ), is the "resistance" from junction to reference point
thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction
temperature in steady state customer environments.
5.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
6.
See Section 5.1 from more details on thermal design considerations.
7.
TJ = Junction Temperature
TA = Ambient Temperature
56F801 Technical Data, Rev. 16
16
Freescale Semiconductor
DC Electrical Characteristics
3.2 DC Electrical Characteristics
Table 3-4 DC Electrical Characteristics
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Typ
Max
Unit
Input high voltage (XTAL/EXTAL)
VIHC
2.25
—
2.75
V
Input low voltage (XTAL/EXTAL)
VILC
0
—
0.5
V
Input high voltage [GPIOB(2:3)]1
VIH[GPIOB(2:3)]
2.0
—
3.6
V
Input low voltage [GPIOB(2:3)]1
VIL[GPIOB(2:3)]
-0.3
—
0.8
V
Input high voltage (Schmitt trigger inputs)2
VIHS
2.2
—
5.5
V
Input low voltage (Schmitt trigger inputs)2
VILS
-0.3
—
0.8
V
Input high voltage (all other digital inputs)
VIH
2.0
—
5.5
V
Input low voltage (all other digital inputs)
VIL
-0.3
—
0.8
V
Input current high (pullup/pulldown resistors disabled, VIN=VDD)
IIH
-1
—
1
μA
Input current low (pullup/pulldown resistors disabled, VIN=VSS)
IIL
-1
—
1
μA
Input current high (with pullup resistor, VIN=VDD)
IIHPU
-1
—
1
μA
Input current low (with pullup resistor, VIN=VSS)
IILPU
-210
—
-50
μA
Input current high (with pulldown resistor, VIN=VDD)
IIHPD
20
—
180
μA
Input current low (with pulldown resistor, VIN=VSS)
IILPD
-1
—
1
μA
RPU, RPD
Nominal pullup or pulldown resistor value
30
KΩ
Output tri-state current low
IOZL
-10
—
10
μA
Output tri-state current high
IOZH
-10
—
10
μA
Input current high (analog inputs, VIN=VDDA)3
IIHA
-15
—
15
μA
Input current low (analog inputs, VIN=VSSA)3
IILA
-15
—
15
μA
Output High Voltage (at IOH)
VOH
VDD – 0.7
—
—
V
Output Low Voltage (at IOL)
VOL
—
—
0.4
V
Output source current
IOH
4
—
—
mA
Output sink current
IOL
4
—
—
mA
PWM pin output source current4
IOHP
10
—
—
mA
PWM pin output sink current5
IOLP
16
—
—
mA
Input capacitance
CIN
—
8
—
pF
COUT
—
12
—
pF
Output capacitance
56F801 Technical Data, Rev. 16
Freescale Semiconductor
17
Table 3-4 DC Electrical Characteristics (Continued)
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Typ
Max
Unit
Run7 (80MHz operation)
—
120
130
mA
Run7 (60MHz operation)
—
102
111
mA
Wait8
—
96
102
mA
Stop
—
62
70
mA
VDD supply current
IDDT6
Low Voltage Interrupt, external power supply9
VEIO
2.4
2.7
3.0
V
Low Voltage Interrupt, internal power supply10
VEIC
2.0
2.2
2.4
V
Power on Reset11
VPOR
—
1.7
2.0
V
1. Since the GPIOB[2:3] signals are shared with the XTAL/EXTAL function, these inputs are not 5.5 volt tolerant.
2. Schmitt Trigger inputs are: FAULTA0, IRQA, RESET, TCS, TCK, TMS, TDI, and TRST.
3. Analog inputs are: ANA[0:7], XTAL and EXTAL. Specification assumes ADC is not sampling.
4. PWM pin output source current measured with 50% duty cycle.
5. PWM pin output sink current measured with 50% duty cycle.
6. IDDT = IDD + IDDA (Total supply current for VDD + VDDA)
7. Run (operating) IDD measured using 8MHz clock source. All inputs 0.2V from rail; outputs unloaded. All ports configured as
inputs; measured with all modules enabled.
8. Wait IDD measured using external square wave clock source (fosc = 8MHz) into XTAL; all inputs 0.2V from rail; no DC loads;
less than 50pF on all outputs. CL = 20pF on EXTAL; all ports configured as inputs; EXTAL capacitance linearly affects wait IDD;
measured with PLL enabled.
9. This low voltage interrupt monitors the VDDA external power supply. VDDA is generally connected to the same potential as VDD
via separate traces. If VDDA drops below VEIO, an interrupt is generated. Functionality of the device is guaranteed under transient
conditions when VDDA>VEIO (between the minimum specified VDD and the point when the VEIO interrupt is generated).
10. This low voltage interrupt monitors the internally regulated core power supply. If the output from the internal voltage is regulator
drops below VEIC, an interrupt is generated. Since the core logic supply is internally regulated, this interrupt will not be generated
unless the external power supply drops below the minimum specified value (3.0V).
11. Power–on reset occurs whenever the internally regulated 2.5V digital supply drops below 1.5V typical. While power is ramping
up, this signal remains active for as long as the internal 2.5V is below 1.5V typical no matter how long the ramp up rate is. The
internally regulated voltage is typically 100 mV less than VDD during ramp up until 2.5V is reached, at which time it self regulates.
56F801 Technical Data, Rev. 16
18
Freescale Semiconductor
AC Electrical Characteristics
160
IDD Digital
IDD Analog
IDD Total
IDD (mA)
120
80
40
0
10
20
30
40
50
60
70
80
Freq. (MHz)
Figure 3-1 Maximum Run IDD vs. Frequency (see Note 7. in Table 3-15)
3.3 AC Electrical Characteristics
Timing waveforms in Section 3.3 are tested using the VIL and VIH levels specified in the DC Characteristics
table. In Figure 3-2 the levels of VIH and VIL for an input signal are shown.
Low
VIH
Input Signal
High
90%
50%
10%
Midpoint1
VIL
Fall Time
Rise Time
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 3-2 Input Signal Measurement References
Figure 3-3 shows the definitions of the following signal states:
•
•
•
Active state, when a bus or signal is driven, and enters a low impedance state.
Tri-stated, when a bus or signal is placed in a high impedance state.
Data Valid state, when a signal level has reached VOL or VOH.
•
Data Invalid state, when a signal level is in transition between VOL and VOH.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
19
Data2 Valid
Data1 Valid
Data3 Valid
Data2
Data1
Data3
Data
Tri-stated
Data Invalid State
Data Active
Data Active
Figure 3-3 Signal States
3.4 Flash Memory Characteristics
Table 3-5 Flash Memory Truth Table
Mode
XE1
YE2
SE3
OE4
PROG5
ERASE6
MAS17
NVSTR8
Standby
L
L
L
L
L
L
L
L
Read
H
H
H
H
L
L
L
L
Word Program
H
H
L
L
H
L
L
H
Page Erase
H
L
L
L
L
H
L
H
Mass Erase
H
L
L
L
L
H
H
H
1. X address enable, all rows are disabled when XE = 0
2. Y address enable, YMUX is disabled when YE = 0
3. Sense amplifier enable
4. Output enable, tri-state Flash data out bus when OE = 0
5. Defines program cycle
6. Defines erase cycle
7. Defines mass erase cycle, erase whole block
8. Defines non-volatile store cycle
Table 3-6 IFREN Truth Table
Mode
IFREN = 1
IFREN = 0
Read
Read information block
Read main memory block
Word program
Program information block
Program main memory block
Page erase
Erase information block
Erase main memory block
Mass erase
Erase both block
Erase main memory block
56F801 Technical Data, Rev. 16
20
Freescale Semiconductor
Flash Memory Characteristics
Table 3-7 Flash Timing Parameters
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Typ
Max
Unit
Figure
Program time
Tprog*
20
–
–
us
Figure 3-4
Erase time
Terase*
20
–
–
ms
Figure 3-5
Mass erase time
Tme*
100
–
–
ms
Figure 3-6
Endurance1
ECYC
10,000
20,000
–
cycles
Data Retention1
DRET
10
30
–
years
The following parameters should only be used in the Manual Word Programming Mode
PROG/ERASE to NVSTR set
up time
Tnvs*
–
5
–
us
Figure 3-4,
Figure 3-5,
Figure 3-6
NVSTR hold time
Tnvh*
–
5
–
us
Figure 3-4,
Figure 3-5
NVSTR hold time (mass erase)
Tnvh1*
–
100
–
us
Figure 3-6
NVSTR to program set up time
Tpgs*
–
10
–
us
Figure 3-4
Recovery time
Trcv*
–
1
–
us
Figure 3-4,
Figure 3-5,
Figure 3-6
Cumulative program
HV period2
Thv
–
3
–
ms
Figure 3-4
Program hold time3
Tpgh
–
–
–
Figure 3-4
Address/data set up time3
Tads
–
–
–
Figure 3-4
Address/data hold time3
Tadh
–
–
–
Figure 3-4
1. One cycle is equal to an erase program and read.
2. Thv is the cumulative high voltage programming time to the same row before next erase. The same address cannot be
programmed twice before next erase.
3. Parameters are guaranteed by design in smart programming mode and must be one cycle or greater.
*The Flash interface unit provides registers for the control of these parameters.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
21
IFREN
XADR
XE
Tadh
YADR
YE
DIN
Tads
PROG
Tnvs
Tprog
Tpgh
NVSTR
Tpgs
Tnvh
Trcv
Thv
Figure 3-4 Flash Program Cycle
IFREN
XADR
XE
YE=SE=OE=MAS1=0
ERASE
Tnvs
NVSTR
Tnvh
Terase
Trcv
Figure 3-5 Flash Erase Cycle
56F801 Technical Data, Rev. 16
22
Freescale Semiconductor
External Clock Operation
IFREN
XADR
XE
MAS1
YE=SE=OE=0
ERASE
Tnvs
NVSTR
Tnvh1
Tme
Trcv
Figure 3-6 Flash Mass Erase Cycle
3.5 External Clock Operation
The 56F801 device clock is derived from either 1) an internal crystal oscillator circuit working in
conjunction with an external crystal, 2) an external frequency source, or 3) an on-chip relaxation oscillator.
To generate a reference frequency using the internal crystal oscillator circuit, a reference crystal external
to the chip must be connected between the EXTAL and XTAL pins. Paragraphs 3.5.1 and 3.5.4 describe
these methods of clocking. Whichever type of clock derivation is used provides a reference signal to a
phase-locked loop (PLL) within the 56F801. In turn, the PLL generates a master reference frequency that
determines the speed at which chip operations occur.
Application code can be set to change the frequency source between the relaxation oscillator and crystal
oscillator or external source, and power down the relaxation oscillator if desired. Selection of which clock
is used is determined by setting the PRECS bit in the PLLCR (phase-locked loop control register) word
(bit 2). If the bit is set to 1, the external crystal oscillator circuit is selected. If the bit is set to 0, the internal
relaxation oscillator is selected, and this is the default value of the bit when power is first applied.
3.5.1
Crystal Oscillator
The internal oscillator is also designed to interface with a parallel-resonant crystal resonator in the
frequency range specified for the external crystal in Table 3-10. Figure 3-7 shows a recommended crystal
oscillator circuit. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal
parameters determine the component values required to provide maximum stability and reliable start-up.
The crystal and associated components should be mounted as close as possible to the EXTAL and XTAL
pins to minimize output distortion and start-up stabilization time. The internal 56F80x oscillator circuitry
56F801 Technical Data, Rev. 16
Freescale Semiconductor
23
is designed to have no external load capacitors present. As shown in Figure 3-8 no external load capacitors
should be used.
The 56F80x components internally are modeled as a parallel resonant oscillator circuit to provide a
capacitive load on each of the oscillator pins (XTAL and EXTAL) of 10pF to 13pF over temperature and
process variations. Using a typical value of internal capacitance on these pins of 12pF and a value of 3pF
as a typical circuit board trace capacitance the parallel load capacitance presented to the crystal is 9pF as
determined by the following equation:
CL1 * CL2
CL =
CL1 + CL2
12 * 12
+ Cs =
+ 3 = 6 + 3 = 9pF
12 + 12
This is the value load capacitance that should be used when selecting a crystal and determining the actual
frequency of operation of the crystal oscillator circuit.
EXTAL XTAL
Rz
Recommended External Crystal
Parameters:
Rz = 1 to 3 MΩ
fc = 8MHz (optimized for 8MHz)
fc
Figure 3-7 External Crystal Oscillator Circuit
3.5.2
Ceramic Resonator
It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system
design can tolerate the reduced signal integrity. In Figure 3-8, a typical ceramic resonator circuit is
shown. Refer to supplier’s recommendations when selecting a ceramic resonator and associated
components. The resonator and components should be mounted as close as possible to the EXTAL and
XTAL pins. The internal 56F80x oscillator circuitry is designed to have no external load capacitors
present. As shown in Figure 3-7 no external load capacitors should be used.
EXTAL XTAL
Rz
Recommended Ceramic Resonator
Parameters:
Rz = 1 to 3 MΩ
fc = 8MHz (optimized for 8MHz)
fc
Figure 3-8 Connecting a Ceramic Resonator
Note: Freescale recommends only two terminal ceramic resonators vs. three terminal resonators
(which contain an internal bypass capacitor to ground).
56F801 Technical Data, Rev. 16
24
Freescale Semiconductor
External Clock Operation
3.5.3
External Clock Source
The recommended method of connecting an external clock is given in Figure 3-9. The external clock
source is connected to XTAL and the EXTAL pin is grounded.
56F801
XTAL
EXTAL
External Clock
VSS
Figure 3-9 Connecting an External Clock Signal
Table 3-8 External Clock Operation Timing Requirements3
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C
Characteristic
Symbol
Min
Typ
Max
Unit
Frequency of operation (external clock driver)1
fosc
0
—
802
MHz
Clock Pulse Width3, 4
tPW
6.25
—
—
ns
1. See Figure 3-9 for details on using the recommended connection of an external clock driver.
2. May not exceed 60MHz for the DSP56F801FA60 device.
3. The high or low pulse width must be no smaller than 6.25ns or the chip will not function.
4. Parameters listed are guaranteed by design.
VIH
External
Clock
90%
50%
10%
90%
50%
10%
tPW
tPW
VIL
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 3-10 External Clock Timing
3.5.4
Use of On-Chip Relaxation Oscillator
An internal relaxation oscillator can supply the reference frequency when an external frequency source or
crystal are not used. During a 56F801 boot or reset sequence, the relaxation oscillator is enabled by default,
and the PRECS bit in the PLLCR word is set to 0 (Section 3.5). If an external oscillator is connected, the
relaxation oscillator can be deselected instead by setting the PRECS bit in the PLLCR to 1. When this
occurs, the PRECSS bit in the PLLSR (prescaler clock select status register) data word also sets to 1. If a
changeover between internal and external oscillators is required at startup, internal device circuits
56F801 Technical Data, Rev. 16
Freescale Semiconductor
25
compensate for any asynchronous transitions between the two clock signals so that no glitches occur in the
resulting master clock to the chip. When changing clocks, the user must ensure that the clock source is not
switched until the desired clock is enabled and stable.
To compensate for variances in the device manufacturing process, the accuracy of the relaxation oscillator
can be incrementally adjusted to within ±0.25% of 8MHz by trimming an internal capacitor. Bits 0-7 of
the IOSCTL (internal oscillator control) word allow the user to set in an additional offset (trim) to this
preset value to increase or decrease capacitance. The default value of this trim is 128 units, making the
power-up default capacitor size 432 units. Each unit added or deleted changes the output frequency by
about 0.2%, allowing incremental adjustment until the desired frequency accuracy is achieved.
Table 3-9 Relaxation Oscillator Characteristics
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C
Characteristic
Symbol
Min
Typ
Max
Unit
Δf
—
+2
+5
%
Frequency Drift over Temp
Δf/Δt
—
+0.1
—
%/oC
Frequency Drift over Supply
Δf/ΔV
—
0.1
—
%/V
ΔfT
—
+0.25
—
%
Frequency Accuracy1
Trim Accuracy
1. Over full temperature range.
56F801 Technical Data, Rev. 16
26
Freescale Semiconductor
External Clock Operation
8.2
Output Frequency
8.1
8.0
7.9
7.8
7.7
7.6
-40
-25
-5
15
35
55
75
85
Temperature (oC)
Figure 3-11 Typical Relaxation Oscillator Frequency vs. Temperature
(Trimmed to 8MHz @ 25oC)
11
10
9
8
7
6
5
0
10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0
Figure 3-12 Typical Relaxation Oscillator Frequency vs. Trim Value @ 25oC
56F801 Technical Data, Rev. 16
Freescale Semiconductor
27
3.5.5
Phase Locked Loop Timing
Table 3-10 PLL Timing
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C
Characteristic
Symbol
Min
Typ
Max
Unit
fosc
4
8
10
MHz
fout/2
40
—
803
MHz
PLL stabilization time4 0o to +85oC
tplls
—
10
—
ms
PLL stabilization time4 -40o to 0oC
tplls
—
100
200
ms
External reference crystal frequency for the PLL1
PLL output frequency2
1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work
correctly. The PLL is optimized for 8MHz input crystal.
2. ZCLK may not exceed 80MHz. For additional information on ZCLK and fout/2, please refer to the OCCS chapter in the
User Manual. ZCLK = fop
3. Will not exceed 60MHz for the DSP56F801FA60 device.
4. This is the minimum time required after the PLL setup is changed to ensure reliable operation.
56F801 Technical Data, Rev. 16
28
Freescale Semiconductor
Reset, Stop, Wait, Mode Select, and Interrupt Timing
3.6 Reset, Stop, Wait, Mode Select, and Interrupt Timing
Table 3-11 Reset, Stop, Wait, Mode Select, and Interrupt Timing1, 5
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Max
Unit
See
RESET Assertion to Address, Data and Control
Signals High Impedance
tRAZ
—
21
ns
Figure 3-13
Minimum RESET Assertion Duration2
OMR Bit 6 = 0
OMR Bit 6 = 1
tRA
275,000T
128T
—
—
ns
ns
RESET De-assertion to First External Address
Output
tRDA
33T
34T
ns
Figure 3-13
Edge-sensitive Interrupt Request Width
tIRW
1.5T
—
ns
Figure 3-14
IRQA, IRQB Assertion to External Data Memory
Access Out Valid, caused by first instruction
execution in the interrupt service routine
tIDM
15T
—
ns
Figure 3-15
IRQA, IRQB Assertion to General Purpose Output
Valid, caused by first instruction execution in the
interrupt service routine
tIG
16T
—
ns
Figure 3-15
IRQA Low to First Valid Interrupt Vector Address
Out recovery from Wait State3
tIRI
13T
—
ns
Figure 3-16
IRQA Width Assertion to Recover from Stop State4
tIW
2T
—
ns
Figure 3-17
Delay from IRQA Assertion to Fetch of first
instruction (exiting Stop)
OMR Bit 6 = 0
OMR Bit 6 = 1
tIF
Figure 3-13
Figure 3-17
—
—
Duration for Level Sensitive IRQA Assertion to
Cause the Fetch of First IRQA Interrupt Instruction
(exiting Stop)
OMR Bit 6 = 0
OMR Bit 6 = 1
tIRQ
Delay from Level Sensitive IRQA Assertion to First
Interrupt Vector Address Out Valid (exiting Stop)
OMR Bit 6 = 0
OMR Bit 6 = 1
tII
275,000T
12T
ns
ns
Figure 3-18
—
—
275,000T
12T
ns
ns
Figure 3-18
—
—
275,000T
12T
ns
ns
1. In the formulas, T = clock cycle. For an operating frequency of 80MHz, T = 12.5ns.
2. Circuit stabilization delay is required during reset when using an external clock or crystal oscillator in two cases:
• After power-on reset
• When recovering from Stop state
3. The minimum is specified for the duration of an edge-sensitive IRQA interrupt required to recover from the Stop state. This is not
the minimum required so that the IRQA interrupt is accepted.
4. The interrupt instruction fetch is visible on the pins only in Mode 3.
5. Parameters listed are guaranteed by design.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
29
RESET
tRA
tRAZ
tRDA
A0–A15,
D0–D15
First Fetch
PS, DS,
RD, WR
First Fetch
Figure 3-13 Asynchronous Reset Timing
IRQA,
IRQB
tIRW
Figure 3-14 External Interrupt Timing (Negative-Edge-Sensitive)
A0–A15,
PS, DS,
RD, WR
First Interrupt Instruction Execution
tIDM
IRQA,
IRQB
a) First Interrupt Instruction Execution
General
Purpose
I/O Pin
tIG
IRQA,
IRQB
b) General Purpose I/O
Figure 3-15 External Level-Sensitive Interrupt Timing
56F801 Technical Data, Rev. 16
30
Freescale Semiconductor
Reset, Stop, Wait, Mode Select, and Interrupt Timing
IRQA,
IRQB
tIRI
A0–A15,
PS, DS,
RD, WR
First Interrupt Vector
Instruction Fetch
Figure 3-16 Interrupt from Wait State Timing
tIW
IRQA
tIF
A0–A15,
PS, DS,
RD, WR
First Instruction Fetch
Not IRQA Interrupt Vector
Figure 3-17 Recovery from Stop State Using Asynchronous Interrupt Timing
tIRQ
IRQA
tII
A0–A15
PS, DS,
RD, WR
First IRQA Interrupt
Instruction Fetch
Figure 3-18 Recovery from Stop State Using IRQA Interrupt Service
56F801 Technical Data, Rev. 16
Freescale Semiconductor
31
3.7 Serial Peripheral Interface (SPI) Timing
Table 3-12 SPI Timing1
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Cycle time
Master
Slave
Min
Max
Unit
50
25
—
—
ns
ns
—
25
—
—
ns
ns
—
100
—
—
ns
ns
17.6
12.5
—
—
ns
ns
24.1
25
—
—
ns
ns
20
0
—
—
ns
ns
0
2
—
—
ns
ns
4.8
15
ns
3.7
15.2
ns
—
—
4.5
20.4
ns
ns
0
0
—
—
ns
ns
—
—
11.5
10.0
ns
ns
—
—
9.7
9.0
ns
ns
tC
Enable lead time
Master
Slave
tELD
Enable lag time
Master
Slave
tELG
Clock (SCK) high time
Master
Slave
tCH
Clock (SCK) low time
Master
Slave
tCL
Data setup time required for inputs
Master
Slave
tDS
Data hold time required for inputs
Master
Slave
tDH
Access time (time to data active from
high-impedance state)
Slave
tA
Disable time (hold time to high-impedance state)
Slave
tD
Data Valid for outputs
Master
Slave (after enable edge)
tDV
Data invalid
Master
Slave
tDI
Rise time
Master
Slave
tR
Fall time
Master
Slave
tF
See Figure
Figures 3-19, 3-20,
3-21, 3-22
Figure 3-22
Figure 3-22
Figures 3-19, 3-20,
3-21, 3-22
Figures 3-19, 3-20,
3-21, 3-22
Figures 3-19, 3-20,
3-21, 3-22
Figures 3-19, 3-20,
3-21, 3-22
Figure 3-22
Figure 3-22
Figures 3-19, 3-20,
3-21, 3-22
Figures 3-19, 3-20,
3-21, 3-22
Figures 3-19, 3-20,
3-21, 3-22
Figures 3-19, 3-20,
3-21, 3-22
1. Parameters listed are guaranteed by design.
56F801 Technical Data, Rev. 16
32
Freescale Semiconductor
Serial Peripheral Interface (SPI) Timing
SS
SS is held High on master
(Input)
tC
tR
tF
tCL
SCLK (CPOL = 0)
(Output)
tF
tCH
tR
tCL
SCLK (CPOL = 1)
(Output)
tDH
tCH
tDS
MISO
(Input)
MSB in
Bits 14–1
tDI
MOSI
(Output)
LSB in
tDI(ref)
tDV
Master MSB out
Bits 14–1
Master LSB out
tF
tR
Figure 3-19 SPI Master Timing (CPHA = 0)
SS
SS is held High on master
(Input)
tF
tC
tR
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tCL
SCLK (CPOL = 1)
(Output)
tCH
MISO
(Input)
MSB in
tDH
Bits 14–1
tDI
tDV(ref)
MOSI
(Output)
tDS
tR
Master MSB out
LSB in
tDV
Bits 14– 1
tF
Master LSB out
tR
Figure 3-20 SPI Master Timing (CPHA = 1)
56F801 Technical Data, Rev. 16
Freescale Semiconductor
33
SS
(Input)
tC
tF
tCL
SCLK (CPOL = 0)
(Input)
tELG
tR
tCH
tELD
tCL
SCLK (CPOL = 1)
(Input)
tCH
tA
MISO
(Output)
Slave MSB out
tDS
tR
tF
tD
Bits 14–1
Slave LSB out
tDV
tDI
tDI
tDH
MOSI
(Input)
MSB in
Bits 14–1
LSB in
Figure 3-21 SPI Slave Timing (CPHA = 0)
SS
(Input)
tC
tF
tCL
SCLK (CPOL = 0)
(Input)
tCH
tELG
tELD
SCLK (CPOL = 1)
(Input)
tR
tDV
tCL
tR
tCH
tA
MISO
(Output)
Slave MSB out
Bits 14–1
tDV
tDS
tDH
MOSI
(Input)
MSB in
tD
tF
Bits 14–1
Slave LSB out
tDI
LSB in
Figure 3-22 SPI Slave Timing (CPHA = 1)
56F801 Technical Data, Rev. 16
34
Freescale Semiconductor
Quad Timer Timing
3.8 Quad Timer Timing
Table 3-13 Timer Timing1, 2
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Max
Unit
PIN
4T+6
—
ns
Timer input high/low period
PINHL
2T+3
—
ns
Timer output period
POUT
2T
—
ns
POUTHL
1T
—
ns
Timer input period
Timer output high/low period
1.
In the formulas listed, T = clock cycle. For 80MHz operation, T = 12.5ns.
2. Parameters listed are guaranteed by design.
Timer Inputs
PIN
PINHL
PINHL
POUTHL
POUTHL
Timer Outputs
POUT
Figure 3-23 Timer Timing
3.9 Serial Communication Interface (SCI) Timing
Table 3-14 SCI Timing4
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Max
Unit
BR
—
(fMAX*2.5)/(80)
Mbps
RXD2 Pulse Width
RXDPW
0.965/BR
1.04/BR
ns
TXD3 Pulse Width
TXDPW
0.965/BR
1.04/BR
ns
Baud Rate1
1. fMAX is the frequency of operation of the system clock in MHz.
2. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1.
3. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1.
4. Parameters listed are guaranteed by design.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
35
RXD
SCI receive
data pin
(Input)
RXDPW
Figure 3-24 RXD Pulse Width
TXD
SCI receive
data pin
(Input)
TXDPW
Figure 3-25 TXD Pulse Width
3.10 Analog-to-Digital Converter (ADC) Characteristics
Table 3-15 ADC Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
VADCIN
01
—
VREF2
V
Resolution
RES
12
—
12
Bits
Integral Non-Linearity3
INL
—
+/- 4
+/- 5
LSB4
Differential Non-Linearity
DNL
—
+/- 0.9
+/- 1
LSB4
ADC input voltages
Monotonicity
GUARANTEED
ADC internal clock5
fADIC
0.5
—
5
MHz
Conversion range
RAD
VSSA
—
VDDA
V
Conversion time
tADC
—
6
—
tAIC cycles6
Sample time
tADS
—
1
—
tAIC cycles6
Input capacitance
CADI
—
5
—
pF6
Gain Error (transfer gain)5
EGAIN
1.00
1.10
1.15
—
VOFFSET
+10
+230
+325
mV
Offset Voltage5
56F801 Technical Data, Rev. 16
36
Freescale Semiconductor
Analog-to-Digital Converter (ADC) Characteristics
Table 3-15 ADC Characteristics (Continued)
Characteristic
Symbol
Min
Typ
Max
Unit
THD
55
60
—
dB
Signal-to-Noise plus Distortion5
SINAD
54
56
—
dB
Effective Number of Bits5
ENOB
8.5
9.5
—
bit
Spurious Free Dynamic Range5
SFDR
60
65
—
dB
Bandwidth
BW
—
100
—
KHz
ADC Quiescent Current (both ADCs)
IADC
—
50
—
mA
VREF Quiescent Current (both ADCs)
IVREF
—
12
16.5
mA
Total Harmonic Distortion5
1. For optimum ADC performance, keep the minimum VADCIN value > 250mV. Inputs less than 250mV volts may convert to
a digital output code of 0 or cause erroneous conversions.
2. VREF must be equal to or less than VDDA - 0.3V and must be greater than 2.7V.
3. Measured in 10-90% range.
4. LSB = Least Significant Bit.
5. Guaranteed by characterization.
6.
tAIC = 1/fADIC
ADC analog input
1
3
2
4
1. Parasitic capacitance due to package, pin to pin, and pin to package base coupling. (1.8pf)
2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing. (2.04pf)
3. Equivalent resistance for the ESD isolation resistor and the channel select mux. (500 ohms)
4. Sampling capacitor at the sample and hold circuit. Capacitor 4 is normally disconnected from the input and is only connected to it at
sampling time. (1pf)
Figure 3-26 Equivalent Analog Input Circuit
56F801 Technical Data, Rev. 16
Freescale Semiconductor
37
3.11 JTAG Timing
Table 3-16 JTAG Timing 1, 3
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Max
Unit
TCK frequency of operation2
fOP
DC
10
MHz
TCK cycle time
tCY
100
—
ns
TCK clock pulse width
tPW
50
—
ns
TMS, TDI data setup time
tDS
0.4
—
ns
TMS, TDI data hold time
tDH
1.2
—
ns
TCK low to TDO data valid
tDV
—
26.6
ns
TCK low to TDO tri-state
tTS
—
23.5
ns
tTRST
50
—
ns
tDE
8T
—
ns
TRST assertion time
DE assertion time
1. Timing is both wait state and frequency dependent. For the values listed, T = clock cycle. For 80MHz
operation, T = 12.5ns.
2. TCK frequency of operation must be less than 1/8 the processor rate.
3. Parameters listed are guaranteed by design.
tCY
tPW
tPW
VIH
VM
TCK
(Input)
VM = VIL + (VIH – VIL)/2
VM
VIL
Figure 3-27 Test Clock Input Timing Diagram
56F801 Technical Data, Rev. 16
38
Freescale Semiconductor
JTAG Timing
TCK
(Input)
tDS
TDI
TMS
(Input)
tDH
Input Data Valid
tDV
TDO
(Output)
Output Data Valid
tTS
TDO
(Output)
tDV
TDO
(Output)
Output Data Valid
Figure 3-28 Test Access Port Timing Diagram
TRST
(Input)
tTRST
Figure 3-29 TRST Timing Diagram
DE
tDE
Figure 3-30 OnCE—Debug Event
56F801 Technical Data, Rev. 16
Freescale Semiconductor
39
Part 4 Packaging
4.1 Package and Pin-Out Information 56F801
ANA5
ANA6
ANA7
ORIENTATION
MARK
TDO
ANA4
PIN 37
TD1
TD2
PWMA0
VCAPC1
VDD
VSS
PWMA1
PWMA2
PWMA3
PWMA4
PWMA5
This section contains package and pin-out information for the 48-pin LQFP configuration of the 56F801.
ANA3
VREF
PIN 1
/SS
ANA2
MISO
ANA1
MOSI
ANA0
SCLK
FAULTA0
TXDO
VSS
VSS
VDD
VDD
VSSA
PIN 25
RXD0
VDDA
PIN 13
DE
TRST
TDO
XTAL
EXTAL
VDD
VSS
VCAPC2
TDI
IREQA
TMS
TCK
TCS
RESET
Figure 4-1 Top View, 56F801 48-pin LQFP Package
56F801 Technical Data, Rev. 16
40
Freescale Semiconductor
Package and Pin-Out Information 56F801
Table 4-1 56F801 Pin Identification by Pin Number
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
1
TD0
13
TCS
25
RESET
37
ANA5
2
TD1
14
TCK
26
VDDA
38
ANA6
3
TD2
15
TMS
27
VSSA
39
ANA7
4
SS
16
IREQA
28
VDD
40
PWMA0
5
MISO
17
TDI
29
VSS
41
VCAPC1
6
MOSI
18
VCAPC2
30
FAULTA0
42
VDD
7
SCLK
19
VSS
31
ANA0
43
VSS
8
TXD0
20
VDD
32
ANA1
44
PWMA1
9
VSS
21
EXTAL
33
ANA2
45
PWMA2
10
VDD
22
XTAL
34
VREF
46
PWMA3
11
RXD0
23
TDO
35
ANA3
47
PWMA4
12
DE
24
TRST
36
ANA4
48
PWMA5
56F801 Technical Data, Rev. 16
Freescale Semiconductor
41
4X
0.200 AB T-U Z
DETAIL Y
A
P
A1
48
37
1
36
T
U
B
V
AE
B1
12
25
13
AE
V1
24
Z
S1
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
L
M
N
P
R
S
S1
V
V1
W
AA
T, U, Z
S
DETAIL Y
4X
0.200 AC T-U Z
0.080 AC
G
AB
AD
AC
M°
BASE METAL
TOP & BOTTOM
R
J
0.250
N
MILLIMETERS
MIN MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400 1.600
0.170 0.270
1.350 1.450
0.170 0.230
0.500 BSC
0.050 0.150
0.090 0.200
0.500 0.700
0 °
7°
12 ° REF
0.090 0.160
0.250 BSC
0.150 0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
C
E
GAUGE PLANE
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION
SHALL NOT CAUSE THE D DIMENSION TO
EXCEED 0.350.
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076.
9. EXACT SHAPE OF EACH CORNER IS
OPTIONAL.
F
D
0.080
M
AC T-U Z
SECTION AE-AE
H
CASE 932-03
ISSUE F
W
L°
K
DETAIL AD
AA
Figure 4-2 48-pin LQFP Mechanical Information
Please see www.freescale.com for the most current case outline.
56F801 Technical Data, Rev. 16
42
Freescale Semiconductor
Thermal Design Considerations
Part 5 Design Considerations
5.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
Equation 1: TJ = T A + ( P D × RθJA )
Where:
TA = ambient temperature °C
RθJA = package junction-to-ambient thermal resistance °C/W
PD = power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance:
Equation 2: RθJA = R θJC + R θCA
Where:
RθJA = package junction-to-ambient thermal resistance °C/W
RθJC = package junction-to-case thermal resistance °C/W
RθCA = package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether
the thermal performance is adequate, a system level model may be appropriate.
Definitions:
A complicating factor is the existence of three common definitions for determining the junction-to-case
thermal resistance in plastic packages:
•
Measure the thermal resistance from the junction to the outside surface of the package (case) closest to the
chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation
across the surface.
56F801 Technical Data, Rev. 16
Freescale Semiconductor
43
•
Measure the thermal resistance from the junction to where the leads are attached to the case. This definition
is approximately equal to a junction to board thermal resistance.
•
Use the value obtained by the equation (TJ – TT)/PD where TT is the temperature of the package case
determined by a thermocouple.
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
5.2 Electrical Design Considerations
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields.
However, normal precautions are advised to avoid
application of any voltages higher than maximum rated
voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an
appropriate voltage level.
Use the following list of considerations to assure correct operation:
•
Provide a low-impedance path from the board power supply to each VDD pin on the controller, and from the
board ground to each VSS (GND) pin.
•
The minimum bypass requirement is to place 0.1 μF capacitors positioned as close as possible to the
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of
the ten VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
performance tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are less than 0.5 inch per capacitor lead.
•
56F801 Technical Data, Rev. 16
44
Freescale Semiconductor
Electrical Design Considerations
•
•
Bypass the VDD and VSS layers of the PCB with approximately 100 μF, preferably with a high-grade
capacitor such as a tantalum capacitor.
Because the controller’s output signals have fast rise and fall times, PCB trace lengths should be minimal.
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the VDD and GND circuits.
•
Take special care to minimize noise levels on the VREF, VDDA and VSSA pins.
•
Designs that utilize the TRST pin for JTAG port or OnCE module functionality (such as development or
debugging systems) should allow a means to assert TRST whenever RESET is asserted, as well as a means
to assert TRST independently of RESET. TRST must be asserted at power up for proper operation. Designs
that do not require debugging functionality, such as consumer products, TRST should be tied low.
Because the Flash memory is programmed through the JTAG/OnCE port, designers should provide an
interface to this port to allow in-circuit Flash programming.
•
•
56F801 Technical Data, Rev. 16
Freescale Semiconductor
45
Part 6 Ordering Information
Table 6-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor
sales office or authorized distributor to determine availability and to order parts.
Table 6-1 56F801 Ordering Information
Pin
Count
Ambient
Frequency
(MHz)
Order Number
Low Profile Plastic Quad Flat Pack (LQFP)
48
80
DSP56F801FA80
3.0–3.6 V
Low Profile Plastic Quad Flat Pack (LQFP)
48
60
DSP56F801FA60
56F801
3.0–3.6 V
Low Profile Plastic Quad Flat Pack (LQFP)
48
80
DSP56F801FA80E*
56F801
3.0–3.6 V
Low Profile Plastic Quad Flat Pack (LQFP)
48
60
DSP56F801FA60E*
Part
Supply
Voltage
56F801
3.0–3.6 V
56F801
Package Type
*This package is RoHS compliant.
56F801 Technical Data, Rev. 16
46
Freescale Semiconductor
Electrical Design Considerations
56F801 Technical Data, Rev. 16
Freescale Semiconductor
47
How to Reach Us:
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RoHS-compliant and/or Pb-free versions of Freescale products have the
functionality and electrical characteristics of their non-RoHS-compliant
and/or non-Pb-free counterparts. For further information, see
http://www.freescale.com or contact your Freescale sales representative.
For information on Freescale’s Environmental Products program, go to
http://www.freescale.com/epp.
Information in this document is provided solely to enable system and
software implementers to use Freescale Semiconductor products. There are
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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor,
Inc. All other product or service names are the property of their respective owners.
This product incorporates SuperFlash® technology licensed from SST.
© Freescale Semiconductor, Inc. 2005. All rights reserved.
DSP56F801
Rev. 16
01/2007