PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-9557401QCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC 5962-9557401QDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9557401QDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30501BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC JM38510/30501SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN7432N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI Call TI SN7432N3 OBSOLETE PDIP N 14 TBD Call TI SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS32DG4 ACTIVE SOIC D 14 SN74LS32DR ACTIVE SOIC D SN74LS32DR ACTIVE SOIC SN74LS32DRE4 ACTIVE SN74LS32DRE4 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J 14 TBD Call TI Call TI Call TI SN74LS32J OBSOLETE CDIP J 14 TBD Call TI SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SNJ5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SNJ5432W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC SNJ5432W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SNJ54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC SNJ54S32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC SNJ54S32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated