Datasheet AS1371 4 0 0 m A , L o w I n p u t Vo l ta g e , L o w Q u i e s c e n t C u r r e n t L D O 1 General Description 2 Key Features The AS1371 low input voltage, positive voltage regulator is designed to deliver up to 400mA while consuming typically only 15µA of quiescent current. The device operates from input voltages of 1.2V to 3.6V, and is available in fixed output voltages between 0.6V and 3.3V (programmable in 50mV steps). ! Ultra-Low Dropout Voltage: 20mV @ 100mA load ! Operating Input Voltage Range: 1.2V to 3.6V ! Output Voltages: 0.6V to 3.3V in 50mV steps ! Max. Output Current: 400mA ! Output Voltage Accuracy: ±1% Operation at the full 400mA load current is dependent upon the maximum power dissipation available from package and environment. ! Low Shutdown Current: 10nA ! Low Quiescent Current: 50µA @ max load ! Integrated Overtemperature/Overcurrent Protection ! Under-Voltage Lockout Feature ! Chip Enable Input ! Power-OK and Low Battery Detection ! Sense Input Option ! Minimal External Components Required ! Operating Temperature Range: -40°C to +85°C ! 6-pin 2x2 TDFN Package The low input voltage and ultra-low dropout voltage (20mV @ 100mA load and 80mV @ 400mA load) supports single primary cell operation in small applications, when operated with minimum input-tooutput voltage differentials. In addition, the regulator provides a power management life extension by operating from pre-existing 1.8V and 2.5V outputs to provide low output voltages for new generation portable processor cores. The device features stable output voltage with ceramic capacitors down to a value of 1µF, strict output voltage regulation tolerances (±1%), and good line- and loadregulation. 3 Applications The devices are ideal for powering cordless and mobile phones, MP3 players, CD and DVD players, PDAs, hand-held computers, digital cameras, and any other hand-held and/or battery-powered device. The AS1371 is available in a 6-pin 2x2 TDFN package and is qualified for -40°C to +85°C operation. Figure 1. AS1371 - Typical Application Diagram Input 1.2V to 3.6V CIN 1µF ON OFF Output 0.6V to 3.3V OUT IN AS1371 EN GND www.austriamicrosystems.com 100kΩ COUT 1µF POK SENSE Revision 1.04 1 - 14 AS1371 Datasheet - P i n A s s i g n m e n t s 4 Pin Assignments Figure 2. Pin Assignments (Top View) IN 1 6 OUT POK 2 AS1371 EN 3 Exposed Pad 5 SENSE 4 GND Pin Descriptions Table 1. Pin Descriptions Pin Name IN Pin Number 1 POK 2 EN 3 GND 4 SENSE 5 OUT 6 GND Exposed Pad www.austriamicrosystems.com Description LDO Input. Input voltage range: 1.2V to 3.6V. Bypass with 1µF to GND. Power-OK Output. Active-low, open-drain output indicates an out-ofregulation condition. Connect a 100kΩ pull-up resistor to pin OUT for logic levels. Leave this pin unconnected if the Power-OK feature is not used. Active-High Enable Input. A logic low reduces the supply current to < 1µA. Connect to pin IN for normal operation. Ground. This pin also functions as a heat sink. Solder it to a large pad or to the circuit-board ground plane to maximize power dissipation. Sense Input. Represents the input for the Power-OK behaviour. If connected to GND the POK output is related to OUT. LDO Output. Bypass with 1µF to GND. Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad or to the circuit-board ground plane to maximize power dissipation. Internally it is connected GND. Revision 1.04 2 - 14 AS1371 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter Min Max Units IN and EN to GND -0.3 +5.0 V POK and OUT to GND -0.3 VIN + 0.3 V Output Short-Circuit Duration Indefinite V Thermal Resistance θJA +78.6 ºC/W Junction Temperature TJ +150 ºC Operating Temperature Range -40 +85 ºC Storage Temperature Range -65 +150 ºC Package Body Temperature www.austriamicrosystems.com Notes +260 Revision 1.04 ºC Internally limited The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD020D “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). 3 - 14 AS1371 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s 6 Electrical Characteristics VIN = VOUT (Nominal) + 0.5V, EN = IN, CIN = COUT = 1µF, TAMB = -40°C to +85ºC (unless otherwise specified). Typical Values are at TAMB = +25ºC. Table 3. Electrical Characteristics Symbol Parameter VIN Input Voltage VOUT Output Voltage Conditions Output Voltage Accuracy Max Units 1.2 3.6 V Available in 50mV steps, see Ordering Information on page 13 0.6 3.3 V TAMB = +25ºC, IOUT = 1mA, VOUT > 1V -1 +1 TAMB = -40 to +85ºC, IOUT = 1mA, VOUT > 1V Min Typ % -2.7 +2.7 IOUT Maximum Output Current ILIM Current Limit IQ Quiescent Current VIN-VOUT Dropout Voltage ΔVLNR Line Regulation IOUT = 1mA ΔVLDR Load Regulation IOUT = 1mA to 400mA 0.003 %/mA Output Voltage Noise f = 10Hz to 100kHz, IOUT = 10mA 100 µVRMS Output Voltage AC Power-Supply Rejection Ratio f = 10kHz, IOUT = 10mA 50 dB PSRR Shutdown 1 15 IOUT = 400mA 50 IOUT = 100mA 20 IOUT = 400mA 80 -15 3,4 IOFF Enable Supply Current IEN IOUT = 0mA 0 mA 20 50 +15 µA mV mV 2 Exit Delay from Shutdown VIL mA 650 tON VIH 400 90 150 EN = GND, TAMB = +25ºC 0.01 1 EN = GND, TAMB = +85ºC 0.04 1.0 Enable Input Threshold 0.4 Enable Input Bias Current EN = IN or GND, TAMB = +25ºC 0.03 EN = IN or GND, TAMB = +85ºC 0.2 100 µs µA V nA Power-OK Output 5 SENSE = GND, VPOKFALLING 90 94 97 VPOK Power-OK Voltage Threshold VSENSE Power-OK Sense Voltage Threshold VOL POK Output Voltage Low ISINK = 100µA 0.4 V IPOK POK Output Leakage Current 0 ≤ VPOK ≤ 3.6V, TAMB = +25ºC, VOUT in regulation 1 µA www.austriamicrosystems.com SENSE = GND, Hysteresis VOUT = 1.05V, VSENSE falling Hysteresis Revision 1.04 % VOUT 1 650 800 950 50 mV 4 - 14 AS1371 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s Table 3. Electrical Characteristics Symbol Parameter Conditions Min Typ Max Units Thermal Protection TSHDN Thermal Shutdown Temperature 150 ºC ΔTSHDN Thermal Shutdown Hysteresis 15 ºC 1. Dropout voltage = VIN - VOUT when VOUT is 100mV < VOUT for VIN = VOUT(NOM) +0.5V (applies only to output voltages ≥ 1.3V). 2. The rise and fall time of the shutdown signal must not exceed 1ms. 3. The delay time is defined as time required to set VOUT to 95% of its final nominal value. 4. Guaranteed by design. 5. The functionality is proven by production test, limits are guaranteed by design. Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. www.austriamicrosystems.com Revision 1.04 5 - 14 AS1371 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s 7 Typical Operating Characteristics VOUT = 1.8V, VIN = 2.3V, IOUT = 1mA, TAMB = +25°C (unless otherwise specified). Figure 4. Line Regulation, VOUT vs. VIN; 1.9 1.9 1.875 1.875 1.85 1.85 Output Voltage (V) Output Voltage (V) Figure 3. Output Voltage vs. Temperature 1.825 1.8 1.775 1.75 no load 1.725 1.825 1.8 1.775 1.75 - 40°C + 25°C 1.725 Iout = 10mA 1.7 -40 + 85°C 1.7 -20 0 20 40 60 80 2.2 2.4 2.6 Temperature (°C) 100 1.875 90 1.85 1.825 1.8 1.775 1.75 - 40°C + 25°C 3.2 3.4 3.6 no load Iout = 100mA 80 Iout = 400mA 70 60 50 40 30 20 10 + 85°C 1.7 0 0 50 2.2 100 150 200 250 300 350 400 2.4 Output Current (mA) 2.6 2.8 3 3.2 3.4 Figure 8. Dropout Voltage vs. Output Current 100 99 90 98 80 Dropout Voltage (mV) 100 97 96 95 94 93 70 60 50 40 30 92 POK rising 20 - 40°C + 25°C 91 POK f alling 10 + 85°C 90 -40 3.6 Input Voltage (V) Figure 7. POK Voltage Threshold vs. Temperature Output Voltage (% of Voutnom) 3 Figure 6. Quiescent Current vs. Input Voltage 1.9 Quiescent Current (µA) Output Voltage (V) Figure 5. Load Regulation, VOUT vs. IOUT; 1.725 2.8 Input Voltage (V) 0 -20 0 20 40 60 80 0 Temperature (°C) www.austriamicrosystems.com 50 100 150 200 250 300 350 400 Output Current (mA) Revision 1.04 6 - 14 AS1371 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s 500mV/DIV IOUT VOUT 500mV/DIV VIN VOUT 50mA/Div Figure 10. Load Transient Response; IOUT = 0mA to 100mA 500mV/Div Figure 9. Line Transient Response; VIN = 2.3V to 2.8V, no load 100ms/Div 100ms/Div www.austriamicrosystems.com 1V/Div EN VOUT 20µs/Div 500mV/DIV 1V/Div VOUT 500mV/DIV Figure 12. Turn OFF EN Figure 11. Turn ON 20µs/Div Revision 1.04 7 - 14 AS1371 Datasheet - D e t a i l e d D e s c r i p t i o n 8 Detailed Description The AS1371 is a low-dropout, low-quiescent-current linear regulator intended for LDO regulator applications where output current load requirements range from no load to 400mA. All devices come with fixed output voltage from 0.6V to 3.3V. (see Ordering Information on page 13). The AS1371 also features a Power-OK output to indicate when the output is within 10% (max) of final value, and also an Enable pin. Shutdown current for the whole regulator is typically 10nA. The device features integrated short-circuit and over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying (e.g. in a battery powered application). Thermal Protection shuts down the device when die temperature reaches 150°C. This is a useful protection when the device is under sustained short circuit conditions. As illustrated in Figure 13, the devices comprise voltage reference, error amplifier, P-channel MOSFET pass transistor, Power-OK detect logic, internal voltage divider, current limiter, thermal sensor and shutdown logic. The bandgap reference is connected to the inverting input of the error amplifier. The error amplifier compares this reference with the feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference voltage, the P-channel MOSFET gate is pulled lower, allowing more current to pass to the output, and increases the output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to pass to the output. The output voltage feeds back through an internal resistor voltage divider connected to pin OUT. Figure 13. AS1371 - Block Diagram AS1371 IN EN Thermal Overload Protection Shutdown/ Power-On Control Logic Error Amplifier OUT + Bandgap Voltage & Current Reference Trimmable Reference Voltage SENSE POK Power-OK Compare Logic NMOS GND Output Voltages Standard products are factory-set with output voltages from 0.6V to 3.3V. A two-digit suffix of the part number identifies the nominal output (see Ordering Information on page 13). Non-standard devices are available. For more information contact: http://www.austriamicrosystems.com/contact-us www.austriamicrosystems.com Revision 1.04 8 - 14 AS1371 Datasheet - D e t a i l e d D e s c r i p t i o n Power-OK and Low-Battery-Detect Functionality The AS1371’s power-ok or low-battery-detect circuitry is built around an N-channel MOSFET. The circuitry monitors the voltage on pin SENSE and if the voltage goes out of regulation (e.g. during dropout, current limit or thermal shutdown) the pin POK goes low. The pin SENSE can be connected to a resistive-divider to monitor a particular definable voltage and compare it with an internal voltage reference. If the SENSE pin is connected to GND an internal resistive-divider is activated and connected to the output. Therefore, the Power-OK functionality can be realised with no additional external components. The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to VIN = 1.2V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output, connect a pull-up resistor from pin POK to pin OUT. Larger values for this resistor will help to minimize current consumption; a 100kΩ resistor is perfect for most applications (see Figure 1 on page 1). For the circuit shown in the left of Figure 14 on page 11, the input bias current into SENSE is very low, permitting largevalue resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as possible. Use a defined resistor for R2 and then calculate R1 as: V IN R 1 = R 2 × ⎛⎝ ------------------ – 1⎞⎠ V SENSE (EQ 1) Where: VSENSE .... Is the internal sense reference voltage. For values see Table 3 on page 4. R2 .... Is the predefined resistor in the resistor divider. In case of the SENSE pin is connected to GND, an internal resistor-divider network is activated and compares the output voltage with a 94% (typ.) voltage threshold. For this particular Power-OK application, no external resistive components are necessary. Current Limiting The AS1371 include current limiting circuitry to protect against short-circuit conditions. The circuitry monitors and controls the gate voltage of the P-channel MOSFET, limiting the output current to 400mA. The P-channel MOSFET output can be shorted to ground for an indefinite period of time without damaging the device. Thermal-Overload Protection The devices are protected against thermal runaway conditions by the integrated thermal sensor circuitry. Thermal shutdown is an effective instrument to prevent die overheating since the power transistor is the principle heat source in the device. If the junction temperature exceeds 150ºC with 15ºC hysteresis, the thermal sensor starts the shutdown logic, at which point the P-channel MOSFET is switched off. After the device temperature has dropped by approximately 15ºC, the thermal sensor will turn the P-channel MOSFET on again. Note that this will be exhibited as a pulsed output under continuous thermal-overload conditions. Note: The absolute maximum junction-temperature of +150ºC should not be exceeding during continual operation. www.austriamicrosystems.com Revision 1.04 9 - 14 AS1371 Datasheet - D e t a i l e d D e s c r i p t i o n Operating Region and Power Dissipation Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is calculated by: P = I OUT × ( V IN – V OUT ) (EQ 2) T J – T AMB P MAX = ------------------------θ JB + θ JA (EQ 3) Maximum power dissipation is calculated by: Where: TJ - TAMB is the temperature difference between the device die junction and the surrounding air. θJB is the thermal resistance of the package. θJA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding. Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin should be connected to the system ground using a large pad or a ground plane. www.austriamicrosystems.com Revision 1.04 10 - 14 AS1371 Datasheet - A p p l i c a t i o n I n f o r m a t i o n 9 Application Information Capacitor Selection and Regulator Stability Ceramic capacitors are highly recommended as they offer distinct advantages over their tantalum and aluminum electrolytic components. For stable operation with load currents up to 400mA over the entire device temperature range, use a 1µF (min) ceramic output capacitor with an ESR <0.2Ω. Use large output capacitor values (e.g. 10µF) to reduce noise and improve load transient-response, stability and power-supply rejection. Note: Some ceramic capacitors exhibit large capacitance and ESR variations with variations in temperature. Power Supply Rejection Ratio The AS1371 is designed to deliver low dropout voltages and low quiescent currents. Power-supply rejection is typically 50dB at 10kHz. To improve power supply-noise rejection and transient response, increase the values of the input and output bypass capacitors, which are shown in Figure 14. The Section 6 Electrical Characteristics on page 4 show also the device line- and load-transient responses. Dropout Voltage For standard products with output voltage greater than the minimum VIN (1.2V), the minimum input-output voltage differential (dropout voltage) determines the lowest usable supply voltage. This determines the useful end-of-life battery voltage in battery-powered systems. The dropout voltage is a function of the P-MOSFET drain-to-source onresistance multiplied by the load current, and is calculated by: V DROPOUT = V IN – V OUT = R DS ( ON ) × I OUT (EQ 4) Where: RDS(ON) is the drain-to-source on -resistance. IOUT is the output current. Figure 14. Application Diagrams External Voltage Level Detection Internal Voltage Level Detection (Input Monitoring) (Output Monitoring) Input 1.2V to 3.6V CIN 1µF ON / OFF Output 0.6V to 3.3V Input 1.2V to 3.6V OUT IN AS1371 EN GND RPU 100kΩ CIN 1µF COUT 1µF ON / OFF POK SENSE Output 0.6V to 3.3V OUT IN AS1371 EN GND RPU 100kΩ COUT 1µF POK SENSE R1 R2 www.austriamicrosystems.com Revision 1.04 11 - 14 AS1371 Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s 10 Package Drawings and Markings The device is available in a 6-pin 2x2 TDFN package. Figure 15. 6-pin 2x2 TDFN package Diagram D2 D Terminal Tip e A INDEX AREA (D/2 x E/2) B L D/2 PIN#1 ID aaa C E E/2 INDEX AREA D/2 x E/2 aaa C bbb b C A B EXPOSED PAD BOTTOM VIEW TOP VIEW A3 ccc C A B A1 SEATING PLANE 0.08 C SIDE VIEW Table 4. 6-pin 2x2 TDFN package Dimensions Symbol Min Typ A 0.51 0.55 A1 0.00 0.02 A3 0.15 ref aaa 0.15 bbb 0.10 ccc 0.10 D 1.95 2.00 E 1.95 2.00 Max 0.60 0.05 2.05 2.05 Symbol D2 E2 L N ND NE e b Min 1.30 0.85 0.15 0.20 Typ 1.45 1.00 0.25 6 3 3 0.50 0.25 Max 1.55 1.10 0.35 0.32 Note: 1. 2. 3. 4. 5. Dimensioning and tolerancing conform to ASME Y14.5M-1994. All dimensions are in millimeters, angle is in degrees. N is the total number of terminal. ND and NE refers to the number of terminals on each side respectively. Terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must be located within the area indicated. The terminal #1 identifier may be either a mold, embedded metal or mark feature. 6. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. 7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals. www.austriamicrosystems.com Revision 1.04 12 - 14 AS1371 Datasheet - O r d e r i n g I n f o r m a t i o n 11 Ordering Information The device is available as the standard products listed in Table 5. Table 5. Ordering Information Ordering Code Marking Output AS1371-BTDT-105 AT 1.05V AS1371-BTDT-12* AM 1.2V AS1371-BTDT-15* AN 1.5V AS1371-BTDT-18* AO 1.8V AS1371-BTDT-20* AP 2.0V AS1371-BTDT-25* AQ 2.5V AS1371-BTDT-30* AR 3.0V Description 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO Delivery Form Package Tape and Reel 6-pin 2x2 TDFN Tape and Reel 6-pin 2x2 TDFN Tape and Reel 6-pin 2x2 TDFN Tape and Reel 6-pin 2x2 TDFN Tape and Reel 6-pin 2x2 TDFN Tape and Reel 6-pin 2x2 TDFN Tape and Reel 6-pin 2x2 TDFN *) on request Non-standard devices from 0.6V to 3.3V are available in 50mV steps. For more information and inquiries contact http://www.austriamicrosystems.com/contact Note: All products are RoHS compliant and Pb-free. Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect For further information and requests, please contact us mailto:[email protected] or find your local distributor at http://www.austriamicrosystems.com/distributor www.austriamicrosystems.com Revision 1.04 13 - 14 AS1371 Datasheet Copyrights Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Disclaimer Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. 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