NL37WZ14 Triple Schmitt−Trigger Inverter The NL37WZ14 is a high performance triple inverter with Schmitt−Trigger inputs operating from a 1.65 to 5.5 V supply. Pin configuration and function are the same as the NL37WZ04, but the inputs have hysteresis, and with its Schmitt trigger function, the NL37WZ14 can be used as a line receiver which will receive slow input signals. The NL37WZ14 is capable of transforming slowly changing input signals into sharply defined, jitter−free output signals. In addition, it has a greater noise margin than conventional inverters. The NL37WZ14 has hysteresis between the positive−going and the negative−going input thresholds (typically 1.0 V) which is determined internally by transistor ratios and is essentially insensitive to temperature and supply voltage variations. • Designed for 1.65 V to 5.5 V VCC Operation • Over Voltage Tolerant Inputs and Outputs • LVTTL Compatible − Interface Capability with 5 V TTL Logic • • • MARKING DIAGRAM 8 US8 US SUFFIX CASE 493 8 1 Features • • • http://onsemi.com with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Current Drive Capability is 24 mA at the Outputs Chip Complexity: FET = 94 Pb−Free Package is Available 1 IN A1 2 OUT Y3 IN A2 VCC 8 OUT Y1 7 3 LA M G G 1 LA M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC IN A3 6 FUNCTION TABLE GND 4 5 A Input OUT Y2 L H Y Output H L Figure 1. Pinout (Top View) 1 IN A1 ORDERING INFORMATION OUT Y1 IN A2 1 OUT Y2 IN A3 1 OUT Y3 See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 6 1 Publication Order Number: NL37WZ14/D NL37WZ14 MAXIMUM RATINGS Symbol Value Unit DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to )7.0 V IIK DC Input Diode Current VI < GND *50 mA IOK DC Output Diode Current VO < GND *50 mA IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 _C 260 _C VCC Parameter TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias )150 _C qJA Thermal Resistance (Note 1) 250 _C/W PD Power Dissipation in Still Air at 85_C 250 mW MSL Moisture Sensitivity FR Flammability Rating VESD Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Operating Data Retention Only (Note 5) (HIGH or LOW State) Min Max Unit 2.3 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V *40 )85 _C 0 0 0 No Limit No Limit No Limit ns/V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. DEVICE ORDERING INFORMATION Device Order Number NL37WZ14US NL37WZ14USG Package Type Tape and Reel Size US8 178 mm, 3000 Units / Tape & Reel US8 (Pb−Free) 178 mm, 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 NL37WZ14 DC CHARACTERISTICS VCC Symbol VT) VT* VH VOH VOL Parameter Condition (V) Min Typ Max Min Max Unit 2.3 1.0 1.5 1.8 1.0 1.8 V 2.7 1.2 1.7 2.0 1.2 2.0 3.0 1.3 1.9 2.2 1.3 2.2 4.5 1.9 2.7 3.1 1.9 3.1 5.5 2.2 3.3 3.6 2.2 3.6 2.3 0.4 0.75 1.15 0.4 1.15 2.7 0.5 0.87 1.4 0.5 1.4 3.0 0.6 1.0 1.5 0.6 1.5 4.5 1.0 1.5 2.0 1.0 2.0 5.5 1.2 1.9 2.3 1.2 2.3 2.3 0.25 0.75 1.1 1.25 1.1 2.7 0.3 0.83 1.15 0.3 1.15 3.0 0.4 0.93 1.2 0.4 1.2 4.5 0.6 1.2 1.5 0.6 1.5 5.5 0.7 1.4 1.7 0.7 1.7 IOH = −100 mA 1.65 to 5.5 VCC *0.1 VCC VCC *0.1 IOH = *3 mA 1.65 1.29 1.52 1.29 IOH = *8 mA 2.3 1.9 2.1 1.9 IOH = *12 mA 2.7 2.2 2.4 2.2 IOH = *16 mA 3.0 2.4 2.7 2.4 IOH = *24 mA 3.0 2.3 2.5 2.3 IOH = *32 mA 4.5 3.8 4.0 Positive Input Threshold Voltage Negative Input Threshold Voltage Input Hysteresis Voltage High−Level Output Voltage VIN = VIH or VIL IOL = 100 mA Low−Level Output Voltage VIN = VIH or VIL 1.65 to 5.5 0.1 0.08 0.24 0.24 IOL = 8 mA 2.3 0.2 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 4.5 0.42 VIN = VCC or GND IOFF Power Off−Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND V 3.8 0.1 1.65 Input Leakage Current V V IOL = 4 mA IOL = 32 mA IIN *40_C v TA v 85_C TA = 25_C V 0.55 0.55 0 to 5.5 $0.1 $1.0 mA 0 1 10 mA 5.5 1 10 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) VCC *40_C v TA v 85_C TA = 25_C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ Î ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol tPLH tPHL Parameter Condition Propagation Delay Input A to Y (Figure 3 and 4) (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 2.5 $ 0.2 1.8 4.3 7.4 1.8 8.1 ns RL = 1 MW, CL = 15 pF 3.3 $ 0.3 1.5 3.3 5.0 1.5 5.5 1.8 4.0 6.0 1.8 6.6 1.0 2.7 4.1 1.0 4.5 1.2 3.2 4.9 1.2 5.4 RL = 500 W, CL = 50 pF 5.0 $ 0.5 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 11 pF 10 MHz, VCC = 5.0 V, VI = 0 V or VCC 12.5 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. http://onsemi.com 3 NL37WZ14 tf = 3 ns tr = 3 ns 90% INPUT A and B 50% VCC 90% INPUT RL 10% 10% tPHL tPLH *CL includes all probe and jig capacitances. A 1−MHz square input wave is recommended for propagation delay tests. 50% 50% CL* GND VOH OUTPUT Y OUTPUT 50% VOL VT , TYPICAL INPUT THRESHOLD VOLTAGE (VOLTS) Figure 3. Switching Waveforms Figure 4. Test Circuit 4 3 (VT)) 2 VHtyp (VT*) 1 2 2.5 3.5 3 VCC, POWER SUPPLY VOLTAGE (VOLTS) VHtyp = (VT) typ) − (VT* typ) 3.6 Figure 5. Typical Input Threshold, VT), VT* versus Power Supply Voltage VH Vin VCC VCC VH VT) VT* VT) VT* Vin GND GND VOH VOH Vout Vout VOL VOL (a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt−Trigger Offers Maximum Noise Immunity Figure 6. Typical Schmitt−Trigger Applications http://onsemi.com 4 NL37WZ14 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B −X− A 8 −Y− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). J DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE D 0.10 (0.004) M H 0.10 (0.004) T K N R 0.10 TYP T X Y V M F DETAIL E DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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