MOTOROLA MPC826XACZUSPU Mpc826xa (hip4) family hardware specification Datasheet

Advance Information
MPC8260AEC/D
Rev. 0.7 5/2002
MPC826xA (HiP4) Family
Hardware Specifications
This document contains detailed information on power considerations, DC/AC electrical
characteristics, and AC timing specifications for HiP4-enhanced derivatives of the
PowerQUICC II™ MPC8260 communications processor (collectively referred to as the
MPC826xA).
The following topics are addressed:
Topic
Page
Section 1.1, “Features”
3
Section 1.2, “Electrical and Thermal Characteristics”
7
Section 1.2.1, “DC Electrical Characteristics”
7
Section 1.2.2, “Thermal Characteristics”
12
Section 1.2.3, “Power Considerations”
12
Section 1.2.4, “AC Electrical Characteristics”
13
Section 1.3, “Clock Configuration Modes”
19
Section 1.3.1, “Local Bus Mode”
19
Section 1.3.2, “PCI Mode”
22
Section 1.4, “Pinout”
29
Section 1.5, “Package Description”
42
Section 1.6, “Ordering Information”
44
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Table 1 shows the functionality that defines each derivative of the HiP4-enhanced PowerQUICC II family.
Table 1. HiP4 PowerQUICC II Family Derivatives
Derivatives
Functionality
MPC8260A MPC8264A MPC8265A MPC8266A
HiP4 Process Enhancements
X
X
PCI Bridge
X
X
X
X
Transmission Convergence (TC) Layer
X
X
Inverse Multiplexing for ATM (IMA)
X
X
Until a revision of the current MPC8260 PowerQUICC II User’s Manual (Rev 0) is available, several
addendum documents supply information about the functionality of HiP4-enhanced PowerQUICC II
devices. Table 2 lists each device and its related documentation.
Table 2. HiP4 PowerQUICC II Documentation
Derivatives
Document
MPC8260A MPC8264A MPC8265A MPC8266A
MPC8260 PowerQUICC II User’s Manual, Rev 0
(order number: MPC8260UM/D)
X
X
X
X
MPC8260A (HiP4) Supplement to the MPC8260
PowerQUICC II User’s Manual (Preliminary)
(order number: MPC8260AUM/D)
X
X
X
X
X
X
PCI Bridge Functional Specification (Preliminary)
(order number: MPC8265AUMAD/D)
2
TC Layer Functional Specification (Preliminary)
(order number: MPC8264AUMAD/D)
X
X
IMA Functional Specification (Preliminary)
(order number: MPC8266AUMAD/D)
X
X
MPC826xA (HiP4) Family Hardware Specifications
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MOTOROLA
Features
Figure 1 shows the block diagram for the HiP4 superset device, the MPC8266A.
16 Kbytes
I-Cache
I-MMU
System Interface Unit
(SIU)
G2 Core
16 Kbytes
D-Cache
Bus Interface Unit
Communication Processor Module (CPM)
PCI Bus2,3
32 bits, up to 66 MHz
60x-to-PCI
Bridge2,3
60x-to-Local
Bridge
D-MMU
60x Bus
or
Local Bus
32 bits, up to 83 MHz
Memory Controller
Timers
Serial
DMAs
32 Kbytes
Dual-Port RAM
Interrupt
Controller
Clock Counter
Parallel I/O
32-bit RISC Microcontroller
and Program ROM
Baud Rate
Generators
MCC1
MCC2
4 Virtual
IDMAs
1,3
IMA
Microcode
FCC1
FCC2
FCC3
TC Layer Hardware1,3
SCC1
SCC2
SCC3
SCC4
System Functions
SMC1
SMC2
SPI
I2C
Time Slot Assigner
Serial Interface
8 TDM Ports
3 MII
Ports
2 UTOPIA
Ports
Non-Multiplexed
I/O
Notes:
1. MPC8264A
2. MPC8265A
3. MPC8266A
Figure 1. MPC8266A Block Diagram
1.1
Features
The major features of the MPC826xA family are as follows:
•
•
Dual-issue integer core
— A core version of the EC603e microprocessor
— System core microprocessor supporting frequencies of 150–300 MHz
— Separate 16-Kbyte data and instruction caches:
– Four-way set associative
– Physically addressed
– LRU replacement algorithm
— PowerPC architecture-compliant memory management unit (MMU)
— Common on-chip processor (COP) test interface
— High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 420 Dhrystones MIPS at
300 MHz)
— Supports bus snooping for data cache coherency
— Floating-point unit (FPU)
Separate power supply for internal logic and for I/O
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
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3
Features
•
•
•
•
Separate PLLs for G2 core and for the CPM
— G2 core and CPM can run at different frequencies for power/performance optimization
— Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
— Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
64-bit data and 32-bit address 60x bus
— Bus supports multiple master designs
— Supports single- and four-beat burst transfers
— 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
— Supports data parity or ECC and address parity
32-bit data and 18-bit address local bus
— Single-master bus, supports external slaves
— Eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
60x-to-PCI bridge (MPC8265A and MPC8266A only)
— Programmable host bridge and agent
— 32-bit data bus, 66 MHz, 3.3 V
— Synchronous and asynchronous 60x and PCI clock modes
— All internal address space available to external PCI host
— DMA for memory block transfers
— PCI-to-60x address remapping
•
System interface unit (SIU)
— Clock synthesizer
— Reset controller
— Real-time clock (RTC) register
— Periodic interrupt timer
— Hardware bus monitor and software watchdog timer
— IEEE 1149.1 JTAG test access port
•
Twelve-bank memory controller
— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other userdefinable peripherals
— Byte write enables and selectable parity generation
— 32-bit address decodes with programmable bank size
— Three user programmable machines, general-purpose chip-select machine, and page-mode
pipeline SDRAM machine
— Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local)
— Dedicated interface logic for SDRAM
•
•
4
CPU core can be disabled and the device can be used in slave mode to an external core
Communications processor module (CPM)
— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible
support for communications protocols
MPC826xA (HiP4) Family Hardware Specifications
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MOTOROLA
Features
— Interfaces to G2 core through on-chip 32-Kbyte dual-port RAM and DMA controller
— Serial DMA channels for receive and transmit on all serial channels
— Parallel I/O registers with open-drain and interrupt capability
— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
— Three fast communications controllers supporting the following protocols:
– 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent
interface (MII)
– ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5,
AAL1, AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 16 K external
connections
– Transparent
– HDLC—Up to T3 rates (clear channel)
— Two multichannel controllers (MCCs)
– Each MCC handles 128 serial, full-duplex, 64-Kbps data channels.Each MCC can be split
into four subgroups of 32 channels each.
– Almost any combination of subgroups can be multiplexed to single or multiple TDM
interfaces up to four TDM interfaces per MCC
— Four serial communications controllers (SCCs) identical to those on the MPC860, supporting
the digital portions of the following protocols:
– Ethernet/IEEE 802.3 CDMA/CS
– HDLC/SDLC and HDLC bus
– Universal asynchronous receiver transmitter (UART)
– Synchronous UART
– Binary synchronous (BISYNC) communications
– Transparent
— Two serial management controllers (SMCs), identical to those of the MPC860
– Provide management for BRI devices as general circuit interface (GCI) controllers in timedivision-multiplexed (TDM) channels
– Transparent
– UART (low-speed operation)
— One serial peripheral interface identical to the MPC860 SPI
— One inter-integrated circuit (I2C) controller (identical to the MPC860 I2C controller)
– Microwire compatible
– Multiple-master, single-master, and slave modes
— Up to eight TDM interfaces
– Supports two groups of four TDM channels for a total of eight TDMs
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
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5
Features
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Motorola interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
Additional features of the MPC826xA family are as follows:
•
CPM
— 32-Kbyte dual-port RAM
— Additional MCC host commands
— Eight transfer transmission convergence (TC) layers between the TDMs and FCC2 to support
inverse multiplexing for ATM capabilities (IMA) (MPC8264A and MPC8266A only)
•
CPM multiplexing
— FCC2 can also be connected to the TC layer.
•
TC layer (MPC8264A and MPC8266A only)
— Each of the 8 TDM channels is routed in hardware to a TC layer block
– Protocol-specific overhead bits may be discarded or routed to other controllers by the SI
– Performing ATM TC layer functions (according to ITU-T I.432)
– Transmit (Tx) updates
– Cell HEC generation
– Payload scrambling using self synchronizing scrambler (programmable by the user)
– Coset generation (programmable by the user)
– Cell rate by inserting idle/unassigned cells
– Receive (Rx) updates
– Cell delineation using bit by bit HEC checking and programmable ALPHA and DELTA
parameters for the delineation state machine
– Payload descrambling using self synchronizing scrambler (programmable by the user)
– Coset removing (programmable by the user)
– Filtering idle/unassigned cells (programmable by the user)
– Performing HEC error detection and single bit error correction (programmable by user)
– Generating loss of cell delineation status/interrupt (LOC/LCD)
— Operates with FCC2 (UTOPIA 8)
— Provides serial loop back mode
— Cell echo mode is provided
— Supports both FCC transmit modes
– External rate mode—Idle cells are generated by the FCC (microcode) to control data rate.
– Internal rate mode (sub-rate)—FCC transfers only the data cells using the required data rate.
The TC layer generates idle/unassigned cells to maintain the line bit rate.
6
MPC826xA (HiP4) Family Hardware Specifications
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MOTOROLA
Electrical and Thermal Characteristics
— Supports TC-layer and PMD-WIRE interface (according to the ATM-Forum af-phy-0063.000)
— Cell counters for performance monitoring
– 16-bit counters count
– HEC error cells
– HEC single bit error and corrected cells
– Idle/unassigned cells filtered
– Idle/unassigned cells transmitted
– Transmitted ATM cells
– Received ATM cells
– Maskable interrupt is sent to the host when a counter expires
— Overrun (Rx cell FIFO) and underrun (Tx cell FIFO) condition produces maskable interrupt
— May be operated at E1 and DS-1 rates. In addition, xDSL applications at bit rates up to 10 Mbps
are supported
•
PCI bridge (MPC8265A and MPC8266A only)
— PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz
— On-chip arbitration
— Support for PCI to 60x memory and 60x memory to PCI streaming
— PCI Host Bridge or Peripheral capabilities
— Includes 4 DMA channels for the following transfers:
– PCI-to-60x to 60x-to-PCI
– 60x-to-PCI to PCI-to-60x
– PCI-to-60x to PCI-to-60x
– 60x-to-PCI to 60x-to-PCI
— Includes all of the configuration registers (which are automatically loaded from the EPROM
and used to configure the MPC8265A) required by the PCI standard as well as message and
doorbell registers
— Supports the I2O standard
— Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0
August 3, 1998)
— Support for 66 MHz, 3.3 V specification
— 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each port
— Makes use of the local bus signals, so there is no need for additional pins
1.2
Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC826xA.
1.2.1
DC Electrical Characteristics
This section describes the DC electrical characteristics for the MPC826xA. Table 3 shows the maximum
electrical ratings.
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
7
Electrical and Thermal Characteristics
Table 3. Absolute Maximum Ratings1
Rating
Core supply voltage2
PLL supply
voltage2
I/O supply voltage3
Input voltage4
Junction temperature
Storage temperature range
Symbol
Value
Unit
VDD
-0.3 – 2.5
V
VCCSYN
-0.3 – 2.5
V
VDDH
-0.3 – 4.0
V
VIN
GND(-0.3) – 3.6
V
Tj
120
˚C
TSTG
(-55) – (+150)
˚C
1
Absolute maximum ratings are stress ratings only; functional operation (see
Table 4) at the maximums is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage.
2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time,
including during power-on reset.
3 Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no
more than 100 mSec. VDDH should not exceed VDD/VCCSYN by more than
2.5 V during normal operation.
4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including
during power-on reset.
Table 4 lists recommended operational voltage conditions.
Table 4. Recommended Operating Conditions1
Rating
Symbol
Value
Unit
Core supply voltage
VDD
1.7 – 2.12/ 1.9 –2.13
V
PLL supply voltage
VCCSYN
1.7 – 2.12/1.9–2.13
V
I/O supply voltage
VDDH
3.135 – 3.465
V
VIN
GND (-0.3) – 3.465
V
Junction temperature (maximum)
Tj
1054
˚C
Ambient temperature
TA
0–704
˚C
Input voltage
1
Caution: These are the recommended and tested operating conditions. Proper device
operating outside of these conditions is not guaranteed.
2 For devices operating at less than 233 MHz CPU, 166 MHz CPM, and 66 MHz bus
frequencies.
3 For devices operating at greater than or equal to 233 MHz CPU, 166 MHz CPM, and
66 MHz bus frequencies.
4 Note that for extended temperature parts the range is (-40) – 105 .
T
Tj
A
NOTE
VDDH and VDD must track each other and both must vary in the same
direction—in the positive direction (+5% and +0.1 Vdc) or in the negative
direction (-5% and -0.1 Vdc).
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (either GND or VCC).
8
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Electrical and Thermal Characteristics
Table 5 shows DC electrical characteristics.
Table 5. DC Electrical Characteristics
Characteristic
Symbol
Min
Max
Unit
Input high voltage, all inputs except CLKIN
VIH
2.0
3.465
V
Input low voltage
VIL
GND
0.8
V
VIHC
2.4
3.465
V
VILC
GND
0.4
V
IIN
—
10
µA
IOZ
—
10
µA
Signal low input current, VIL = 0.8 V
IL
—
1
µA
Signal high input current, VIH = 2.0 V
IH
—
1
µA
VOH
2.4
—
V
VOL
—
0.5
V
CLKIN input high voltage
CLKIN input low voltage
Input leakage current, VIN
= VDDH1
Hi-Z (off state) leakage current, VIN = VDDH1
Output high voltage, IOH = –2 mA
except XFC, UTOPIA mode, and open drain pins
In UTOPIA mode: IOH = -8.0mA
PA[0-31]
PB[4-31]
PC[0-31]
PD[4-31]
In UTOPIA mode: IOL = 8.0mA
PA[0-31]
PB[4-31]
PC[0-31]
PD[4-31]
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
9
Electrical and Thermal Characteristics
Table 5. DC Electrical Characteristics (Continued)
Characteristic
IOL = 7.0mA
BR
BG
ABB/IRQ2
TS
A[0-31]
TT[0-4]
TBST
TSIZE[0–3]
AACK
ARTRY
DBG
DBB/IRQ3
D[0-63]
DP(0)/RSRV/EXT_BR2
DP(1)/IRQ1/EXT_BG2
DP(2)/TLBISYNC/IRQ2/EXT_DBG2
DP(3)/IRQ3/EXT_BR3/CKSTP_OUT
DP(4)/IRQ4/EXT_BG3/CORE_SREST
DP(5)/TBEN/IRQ5/EXT_DBG3
DP(6)/CSE(0)/IRQ6
DP(7)/CSE(1)/IRQ7
PSDVAL
TA
TEA
GBL/IRQ1
CI/BADDR29/IRQ2
WT/BADDR30/IRQ3
L2_HIT/IRQ4
CPU_BG/BADDR31/IRQ5
CPU_DBG
CPU_BR
IRQ0/NMI_OUT
IRQ7/INT_OUT/APE
PORESET
HRESET
SRESET
RSTCONF
QREQ
10
Symbol
Min
Max
Unit
VOL
—
0.4
V
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Electrical and Thermal Characteristics
Table 5. DC Electrical Characteristics (Continued)
Characteristic
IOL = 5.3mA
CS[0-9]
CS(10)/BCTL1
CS(11)/AP(0)
BADDR[27–28]
ALE
BCTL0
PWE(0:7)/PSDDQM(0:7)/PBS(0:7)
PSDA10/PGPL0
PSDWE/PGPL1
POE/PSDRAS/PGPL2
PSDCAS/PGPL3
PGTA/PUPMWAIT/PGPL4/PPBS
PSDAMUX/PGPL5
LWE[0–3]LSDDQM[0:3]/LBS[0–3]/PCI_CFG[0–32
LSDA10/LGPL0/PCI_MODCKH02
LSDWE/LGPL1/PCI_MODCKH12
LOE/LSDRAS/LGPL2/PCI_MODCKH22
LSDCAS/LGPL3/PCI_MODCKH32
LGTA/LUPMWAIT/LGPL4/LPBS
LSDAMUX/LGPL5/PCI_MODCK2
LWR
MODCK1/AP(1)/TC(0)/BNKSEL(0)
MODCK2/AP(2)/TC(1)/BNKSEL(1)
MODCK3/AP(3)/TC(2)/BNKSEL(2)
IOL = 3.2mA
L_A14/PAR2
L_A15/FRAME2/SMI
L_A16/TRDY2
L_A17/IRDY2/CKSTP_OUT
L_A18/STOP2
L_A19/DEVSEL2
L_A20/IDSEL2
L_A21/PERR2
L_A22/SERR2
L_A23/REQ02
L_A24/REQ12/HSEJSW2
L_A25/GNT02
L_A26/GNT12/HSLED2
L_A27/GNT22/HSENUM2
L_A28/RST2/CORE_SRESET
L_A29/INTA2
L_A30/REQ22
L_A31
LCL_D(0-31)/AD(0-31)2
LCL_DP(0-3)/C/BE(0-3)2
PA[0–31]
PB[4–31]
PC[0–31]
PD[4–31]
TDO
Symbol
Min
Max
Unit
VOL
—
0.4
V
1
The leakage current is measured for nominal VDDH and VDD or both VDDH and VDD must vary in the same
direction; that is, VDDH and VDD either both vary in the positive direction (+5% and +0.1 Vdc) or both vary in
the negative direction (-5% and -0.1 Vdc).
2 MPC8265A and MPC8266A only.
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
11
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 6 describes thermal characteristics.
Table 6. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
θJA
13.071
°C/W
NC2
θJA
9.551
°C/W
1 m/s
θJA
10.483
°C/W
NC
θJA
7.783
°C/W
1 m/s
Thermal resistance for TBGA
1
Assumes a single layer board with no thermal vias
Natural convection
3 Assumes a four layer board
2
1.2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θJA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ
is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving
equations (1) and (2) iteratively for any value of TA.
1.2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 µF
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND planes.
12
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Electrical and Thermal Characteristics
All output pins on the MPC826xA have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize overdamped conditions and reflections caused by these
fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs
during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required for conditions above PD = 3W (when the ambient temperature is 70˚ C or
greater) to ensure the junction temperature does not exceed the maximum specified value. Also note that the
I/O power should be included when determining whether to use a heat sink.
Table 7. Estimated Power Dissipation for Various Configurations1
PINT(W)2
Bus
(MHz)
1
2
CPM
Core CPU
Multiplier Multiplier
CPM
(MHz)
CPU
(MHz)
Vddl 1.8 Volts
Vddl 2.0 Volts
Nominal
Maximum
Nominal
Maximum
66.66
2
3
133
200
1.2
2
1.8
2.3
66.66
2.5
3
166
200
1.3
2.1
1.9
2.3
66.66
3
4
200
266
—
—
2.3
2.9
66.66
3
4.5
200
300
—
—
2.4
3.1
83.33
2
3
166
250
—
—
2.2
2.8
83.33
2
3
166
250
—
—
2.2
2.8
83.33
2.5
3.5
208
291
—
—
2.4
3.1
Test temperature = room temperature (25˚ C)
PINT = IDD x VDD Watts
1.2.4
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and
inputs for the 66 MHz MPC826xA device. Note that AC timings are based on a 50-pf load. Typical output
buffer impedances are shown in Table 8.
Table 8. Output Buffer Impedances1
Output Buffers
60x bus
40
Local bus
40
Memory controller
40
Parallel I/O
46
PCI
25
1
MOTOROLA
Typical Impedance (Ω)
These are typical values at 65˚ C. The impedance may vary
by ±25% with process and temperature.
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
13
Electrical and Thermal Characteristics
Table 9 lists CPM output characteristics.
Table 9. AC Characteristics for CPM Outputs1
Max Delay (ns)
Spec_num
Max/Min
66 MHz 83 MHz 66 MHz 83 MHz
sp36a/sp37a FCC outputs—internal clock (NMSI)
6
5.5
1
1
sp36b/sp37b FCC outputs—external clock (NMSI)
14
12
2
1
25
16
5
4
sp38a/sp39a SCC/SMC/SPI/I2C outputs—internal clock (NMSI)
19
16
1
0.5
sp38b/sp39b Ex_SCC/SMC/SPI/I2C outputs—external clock (NMSI)
19
16
2
1
14
11
1
0.5
sp40/sp41
sp42/sp43
1
Min Delay (ns)
Characteristic
TDM outputs/SI
PIO/TIMER/DMA outputs
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of
the signal. Timings are measured at the pin.
Table 10 lists CPM input characteristics.
Table 10. AC Characteristics for CPM Inputs1
Setup (ns)
Spec_num
Hold (ns)
Characteristic
66 MHz 83 MHz 66 MHz 83 MHz
sp16a/sp17a
FCC inputs—internal clock (NMSI)
10
8
0
0
sp16b/sp17b
FCC inputs—external clock (NMSI)
3
2.5
3
2
TDM inputs/SI
15
12
12
10
sp18a/sp19a
SCC/SMC/SPI/I2C inputs—internal clock (NMSI)
20
16
0
0
sp18b/sp19b
SCC/SMC/SPI/I2C inputs—external clock (NMSI)
5
4
5
4
PIO/TIMER/DMA inputs
10
8
3
3
sp20/sp21
sp22/sp23
1
Input specifications are measured from the 50% level of the signal to the 50% level of the rising
edge of CLKIN. Timings are measured at the pin.
Note that although the specifications generally reference the rising edge of the clock, the following AC
timing diagrams also apply when the falling edge is the active edge.
Figure 2 shows the FCC external clock.
Serial ClKin
sp17b
sp16b
FCC input signals
sp36b/sp37b
FCC output signals
Figure 2. FCC External Clock Diagram
14
MPC826xA (HiP4) Family Hardware Specifications
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MOTOROLA
Electrical and Thermal Characteristics
Figure 3 shows the FCC internal clock.
BRG_OUT
sp17a
sp16a
FCC input signals
sp36a/sp37a
FCC output signals
Figure 3. FCC Internal Clock Diagram
Figure 4 shows the SCC/SMC/SPI/I2C external clock.
Serial CLKin
sp19b
sp18b
SCC/SMC/SPI/I2C input signals
sp38b/sp39b
SCC/SMC/SPI/I2C output signals
Figure 4. SCC/SMC/SPI/I2C External Clock Diagram
Figure 5 shows the SCC/SMC/SPI/I2C internal clock.
BRG_OUT
sp18a
sp19a
SCC/SMC/SPI/I2C input signals
sp38a/sp39a
SCC/SMC/SPI/I2C output signals
Figure 5. SCC/SMC/SPI/I2C Internal Clock Diagram
MOTOROLA
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Electrical and Thermal Characteristics
Figure 6 shows PIO, timer, and DMA signals.
CLKin
sp23
sp22
PIO/TIMER/DMA input signals
sp42/sp43
TIMER/DMA output signals
sp42/sp43
PIO output signals
Figure 6. PIO, Timer, and DMA Signal Diagram
Table 12 lists SIU input characteristics.
Table 11. AC Characteristics for SIU Inputs1
Setup (ns)
Spec_num
Hold (ns)
Characteristic
66 MHz 83 MHz 66 MHz 83 MHz
1
sp11/sp10 AACK/ARTRY/TA/TS/TEA/DBG/BG/BR
6
5
1
1
sp12/sp10 Data bus in normal mode
5
4
1
1
sp13/sp10 Data bus in ECC and PARITY modes
8
6
1
1
sp14/sp10 DP pins
7
6
1
1
sp15/sp10 All other pins
5
4
1
1
Input specifications are measured from the 50% level of the signal to the 50% level of
the rising edge of CLKIN. Timings are measured at the pin.
Table 12 lists SIU output characteristics.
Table 12. AC Characteristics for SIU Outputs1
Spec_num
Max/Min
Max Delay (ns)
16
66 MHz 83 MHz 66 MHz 83 MHz
sp31/sp30 PSDVAL/TEA/TA
7
6
0.5
0.5
sp32/sp30 ADD/ADD_atr./BADDR/CI/GBL/WT
8
6.5
0.5
0.5
6.5
6.5
0.5
0.5
sp33b/sp30 DP
8
7
0.5
0.5
sp34/sp30 memc signals/ALE
6
5
0.5
0.5
sp35/sp30 all other signals
6
5.5
0.5
0.5
sp33a/sp30 Data bus
1
Min Delay (ns)
Characteristic
Output specifications are measured from the 50% level of the rising edge of CLKIN to
the 50% level of the signal. Timings are measured at the pin.
MPC826xA (HiP4) Family Hardware Specifications
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MOTOROLA
Electrical and Thermal Characteristics
NOTE
Activating data pipelining (setting BRx[DR] in the memory controller)
improves the AC timing. When data pipelining is activated, sp12 can be
used for data bus setup even when ECC or PARITY are used. Also, sp33a
can be used as the AC specification for DP signals.
Figure 7 shows TDM input and output signals.
Serial CLKin
sp20
sp21
TDM input signals
sp40/sp41
TDM output signals
Figure 7. TDM Signal Diagram
Figure 8 shows the interaction of several bus signals.
CLKin
sp11
sp10
AACK/ARTRY/TA/TS/TEA/
DBG/BG/BR input signals
sp12
sp10
sp15
sp10
DATA bus normal mode
input signal
All other input signals
sp31
sp30
sp32
sp30
sp33a
sp30
sp35
sp30
PSDVAL/TEA/TA output signals
ADD/ADD_atr/BADDR/CI/
GBL/WT output signals
DATA bus output signals
All other output signals
Figure 8. Bus Signals
MOTOROLA
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17
Electrical and Thermal Characteristics
Figure 9 shows signal behavior for all parity modes (including ECC, RMW parity, and standard parity).
CLKin
sp10
sp13
DATA bus, ECC, and PARITY mode input signals
sp10
sp14
DP mode input signal
sp33b/sp30
DP mode output signal
Figure 9. Parity Mode Diagram
Figure 10 shows signal behavior in MEMC mode.
CLKin
V_CLK
sp34/sp30
Memory controller signals
Figure 10. MEMC Mode Diagram
NOTE
Generally, all MPC826xA bus and system output signals are driven from
the rising edge of the input clock (CLKin). Memory controller signals,
however, trigger on four points within a CLKin cycle. Each cycle is
divided by four internal ticks: T1, T2, T3, and T4. T1 always occurs at the
rising edge, and T3 at the falling edge, of CLKin. However, the spacing of
T2 and T4 depends on the PLL clock ratio selected, as shown in Table 13.
Table 13. Tick Spacing for Memory Controller Signals
Tick Spacing (T1 Occurs at the Rising Edge of CLKin)
PLL Clock Ratio
T2
18
T3
T4
1:2, 1:3, 1:4, 1:5, 1:6
1/4 CLKin
1/2 CLKin
3/4 CLKin
1:2.5
3/10 CLKin
1/2 CLKin
8/10 CLKin
1:3.5
4/14 CLKin
1/2 CLKin
11/14 CLKin
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MOTOROLA
Clock Configuration Modes
Figure 11 is a graphical representation of Table 13.
CLKin
for 1:2, 1:3, 1:4, 1:5, 1:6
T1
T2
T3
T4
CLKin
for 1:2.5
T1
T2
T3
T4
for 1:3.5
CLKin
T1
T2
T3
T4
Figure 11. Internal Tick Spacing for Memory Controller Signals
NOTE
The UPM machine outputs change on the internal tick determined by the
memory controller programming; the AC specifications are relative to the
internal tick. Note that SDRAM and GPCM machine outputs change on
CLKin’s rising edge.
1.3
Clock Configuration Modes
To configure the main PLL multiplication factor and the core, CPM, and 60x bus frequencies, the
MODCK[1–3] pins are sampled while HRESET is asserted. Table 14 shows the eight basic configuration
modes. Another 49 modes are available by using the configuration pin (RSTCONF) and driving four pins
on the data bus.
1.3.1
Local Bus Mode
Table 14 describes default clock modes for the MPC826xA.
Table 14. Clock Default Modes
MODCK[1–3]
Input Clock
Frequency
CPM Multiplication
Factor
CPM
Frequency
Core Multiplication
Factor
Core
Frequency
000
33 MHz
3
100 MHz
4
133 MHz
001
33 MHz
3
100 MHz
5
166 MHz
010
33 MHz
4
133 MHz
4
133 MHz
011
33 MHz
4
133 MHz
5
166 MHz
100
66 MHz
2
133 MHz
2.5
166 MHz
101
66 MHz
2
133 MHz
3
200 MHz
110
66 MHz
2.5
166 MHz
2.5
166 MHz
111
66 MHz
2.5
166 MHz
3
200 MHz
Table 15 describes all possible clock configurations when using the hard reset configuration sequence.
Note that clock configuration changes only after POR is asserted. Note also that basic modes are shown in
boldface type.
MOTOROLA
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19
Clock Configuration Modes
Table 15. Clock Configuration Modes1
MODCK_H–MODCK[1–3]
20
Core Multiplication
Input Clock CPM Multiplication
CPM
Core
Factor2
Factor2
Frequency2,3
Frequency2
Frequency2
0001_000
33 MHz
2
66 MHz
4
133 MHz
0001_001
33 MHz
2
66 MHz
5
166 MHz
0001_010
33 MHz
2
66 MHz
6
200 MHz
0001_011
33 MHz
2
66 MHz
7
233 MHz
0001_100
33 MHz
2
66 MHz
8
266 MHz
0001_101
33 MHz
3
100 MHz
4
133 MHz
0001_110
33 MHz
3
100 MHz
5
166 MHz
0001_111
33 MHz
3
100 MHz
6
200 MHz
0010_000
33 MHz
3
100 MHz
7
233 MHz
0010_001
33 MHz
3
100 MHz
8
266 MHz
0010_010
33 MHz
4
133 MHz
4
133 MHz
0010_011
33 MHz
4
133 MHz
5
166 MHz
0010_100
33 MHz
4
133 MHz
6
200 MHz
0010_101
33 MHz
4
133 MHz
7
233 MHz
0010_110
33 MHz
4
133 MHz
8
266 MHz
0010_111
33 MHz
5
166 MHz
4
133 MHz
0011_000
33 MHz
5
166 MHz
5
166 MHz
0011_001
33 MHz
5
166 MHz
6
200 MHz
0011_010
33 MHz
5
166 MHz
7
233 MHz
0011_011
33 MHz
5
166 MHz
8
266 MHz
0011_100
33 MHz
6
200 MHz
4
133 MHz
0011_101
33 MHz
6
200 MHz
5
166 MHz
0011_110
33 MHz
6
200 MHz
6
200 MHz
0011_111
33 MHz
6
200 MHz
7
233 MHz
0100_000
33 MHz
6
200 MHz
8
266 MHz
MPC826xA (HiP4) Family Hardware Specifications
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Clock Configuration Modes
Table 15. Clock Configuration Modes1 (Continued)
MODCK_H–MODCK[1–3]
Core Multiplication
Input Clock CPM Multiplication
CPM
Core
Factor2
Factor2
Frequency2,3
Frequency2
Frequency2
0100_001
Reserved
0100_010
0100_011
0100_100
0100_101
0100_110
0100_111
Reserved
0101_000
0101_001
0101_010
0101_011
0101_100
0101_101
66 MHz
2
133 MHz
2
133 MHz
0101_110
66 MHz
2
133 MHz
2.5
166 MHz
0101_111
66 MHz
2
133 MHz
3
200 MHz
0110_000
66 MHz
2
133 MHz
3.5
233 MHz
0110_001
66 MHz
2
133 MHz
4
266 MHz
0110_010
66 MHz
2
133 MHz
4.5
300 MHz
0110_011
66 MHz
2.5
166 MHz
2
133 MHz
0110_100
66 MHz
2.5
166 MHz
2.5
166 MHz
0110_101
66 MHz
2.5
166 MHz
3
200 MHz
0110_110
66 MHz
2.5
166 MHz
3.5
233 MHz
0110_111
66 MHz
2.5
166 MHz
4
266 MHz
0111_000
66 MHz
2.5
166 MHz
4.5
300 MHz
0111_001
66 MHz
3
200 MHz
2
133 MHz
0111_010
66 MHz
3
200 MHz
2.5
166 MHz
0111_011
66 MHz
3
200 MHz
3
200 MHz
0111_100
66 MHz
3
200 MHz
3.5
233 MHz
0111_101
66 MHz
3
200 MHz
4
266 MHz
0111_110
66 MHz
3
200 MHz
4.5
300 MHz
MOTOROLA
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21
Clock Configuration Modes
Table 15. Clock Configuration Modes1 (Continued)
MODCK_H–MODCK[1–3]
Core Multiplication
Input Clock CPM Multiplication
CPM
Core
Factor2
Factor2
Frequency2,3
Frequency2
Frequency2
0111_111
66 MHz
3.5
233 MHz
2
133 MHz
1000_000
66 MHz
3.5
233 MHz
2.5
166 MHz
1000_001
66 MHz
3.5
233 MHz
3
200 MHz
1000_010
66 MHz
3.5
233 MHz
3.5
233 MHz
1000_011
66 MHz
3.5
233 MHz
4
266 MHz
1000_100
66 MHz
3.5
233 MHz
4.5
300 MHz
1100_0004
66 MHz
2
133 MHz
Bypass
66 MHz
1100_0014
66 MHz
2.5
166 MHz
Bypass
66 MHz
1100_0104
66 MHz
3
200 MHz
Bypass
66 MHz
1
Because of speed dependencies, not all of the possible configurations in Table 15 are applicable.
The user should choose the input clock frequency and the multiplication factors such that the frequency of the
CPU is equal to or greater than150 MHz and the CPM ranges between 66–233 MHz.
3 Input clock frequency is given only for the purpose of reference. User should set MODCK_H–MODCK_L so that
the resulting configuration does not exceed the frequency rating of the user’s part.
2
Example. If a part is rated at 266 MHz CPU, 200 MHz CPM, and 66 MHz bus, any of the following are possible
(note that the three input clock frequencies are only three of many possible input clock frequencies):
1. 66 MHz input clock and MODCK_H–MODCK_L[0111–101] (with a core multiplication factor of 4 and a CPM
multiplication factor of 3). The resulting configuration equals the part’s maximum possible frequencies of
266 MHz CPU, 200 MHz CPM, and 66 MHz bus.
2. 50 MHz input clock and MODCK_H–MODCK_L[0111–101] to achieve a configuration of 200 MHz CPU,
150 MHz CPM, and 50 MHz bus.
3. 40 MHz input clock and MODCK_H–MODCK_L[0010–011] to achieve a configuration of 200 MHz CPU,
160 MHz CPM, and 40 MHz bus.
Note that with each example, any one of several values for MODCK_H–MODCK_L could possibly be used as
long as the resulting configuration does not exceed the part’s rating.
4 At this mode the CPU PLL is bypassed (the CPU frequency equals the bus frequency).
1.3.2
PCI Mode
This section pertains to the MPC8265A and the MPC8266A only.
In PCI mode only, MODCK_HI[0:3] and PCI_MODCK come from the following external pins:
•
PCI_MODCK = LGPL5
•
MODCK_HI[0:3] = {LGPL0,LGPL1,LGPL2,LGPL3}
NOTE
The minimum Tval = 2 when PCI_MODCK = 1 and minimum Tval = 1
when PCI_MODCK = 0; therefore, board designers should use clock
configurations that fit this condition to achieve PCI-compliant AC timing.
22
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Clock Configuration Modes
Table 16. Clock Default Configurations in PCI Host Mode (MODCK_HI = 0000)
Input Clock
CPM
Core
CPM
Core
PCI Division
PCI
Multiplication
MODCK[1–3]1 Frequency Multiplication
Frequency
Frequency
Factor2
Frequency2
(Bus)
Factor
Factor
1
2
000
66 MHz
2
133 MHz
2.5
166 MHz
2/4
66/33 MHz
001
66 MHz
2
133 MHz
3
200 MHz
2/4
66/33 MHz
010
66 MHz
2.5
166 MHz
3
200 MHz
3/6
55/28 MHz
011
66 MHz
2.5
166 MHz
3.5
233 MHz
3/6
55/28 MHz
100
66 MHz
2.5
166 MHz
4
266 MHz
3/6
55/28 MHz
101
66 MHz
3
200 MHz
3
200 MHz
3/6
66/33 MHz
110
66 MHz
3
200 MHz
3.5
233 MHz
3/6
66/33 MHz
111
66 MHz
3
200 MHz
4
266 MHz
3/6
66/33 MHz
Assumes MODCK_HI = 0000.
The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency is
divided by 2 (33 instead of 66 MHz, etc.)
Table 17 describes all possible clock configurations when using the MPC8265A or the MPC8266A’s
internal PCI bridge in host mode.
Table 17. Clock Configuration Modes in PCI Host Mode
MODCK_H –
MODCK[1–3]
Input Clock
Frequency1
(Bus)
0001_000
33 MHz
3
100 MHz
5
166 MHz
3/6
33/16 MHz
0001_001
33 MHz
3
100 MHz
6
200 MHz
3/6
33/16 MHz
0001_010
33 MHz
3
100 MHz
7
233 MHz
3/6
33/16 MHz
0001_011
33 MHz
3
100 MHz
8
266 MHz
3/6
33/16 MHz
0010_000
33 MHz
4
133 MHz
5
166 MHz
4/8
33/16 MHz
0010_001
33 MHz
4
133 MHz
6
200 MHz
4/8
33/16 MHz
0010_010
33 MHz
4
133 MHz
7
233 MHz
4/8
33/16 MHz
0010_011
33 MHz
4
133 MHz
8
266 MHz
4/8
33/16 MHz
0011_0003
33 MHz
5
166 MHz
5
166 MHz
5
33 MHz
0011_0013
33 MHz
5
166 MHz
6
200 MHz
5
33 MHz
0011_0103
33 MHz
5
166 MHz
7
233 MHz
5
33 MHz
0011_0113
33 MHz
5
166 MHz
8
266 MHz
5
33 MHz
0100_0003
33 MHz
6
200 MHz
5
166 MHz
6
33 MHz
0100_0013
33 MHz
6
200 MHz
6
200 MHz
6
33 MHz
0100_0103
33 MHz
6
200 MHz
7
233 MHz
6
33 MHz
MOTOROLA
CPM
Core
PCI
CPM
Core
PCI Division
Multiplication
Multiplication
Frequency2
Frequency
Frequency
Factor2
Factor
Factor
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23
Clock Configuration Modes
Table 17. Clock Configuration Modes in PCI Host Mode (Continued)
CPM
Core
CPM
Core
PCI Division
PCI
Multiplication
Multiplication
Frequency
Frequency
Factor2
Frequency2
Factor
Factor
MODCK_H –
MODCK[1–3]
Input Clock
Frequency1
(Bus)
0100_0113
33 MHz
6
200 MHz
8
266 MHz
6
33 MHz
0101_000
66 MHz
2
133 MHz
2.5
166 MHz
2/4
66/33 MHz
0101_001
66 MHz
2
133 MHz
3
200 MHz
2/4
66/33 MHz
0101_010
66 MHz
2
133 MHz
3.5
233 MHz
2/4
66/33 MHz
0101_011
66 MHz
2
133 MHz
4
266 MHz
2/4
66/33 MHz
0101_100
66 MHz
2
133 MHz
4.5
300 MHz
2/4
66/33 MHz
0110_000
66 MHz
2.5
166 MHz
2.5
166 MHz
3/6
55/28 MHz
0110_001
66 MHz
2.5
166 MHz
3
200 MHz
3/6
55/28 MHz
0110_010
66 MHz
2.5
166 MHz
3.5
233 MHz
3/6
55/28 MHz
0110_011
66 MHz
2.5
166 MHz
4
266 MHz
3/6
55/28 MHz
0110_100
66 MHz
2.5
166 MHz
4.5
300 MHz
3/6
55/28 MHz
0111_000
66 MHz
3
200 MHz
2.5
166 MHz
3/6
66/33 MHz
0111_001
66 MHz
3
200 MHz
3
200 MHz
3/6
66/33 MHz
0111_010
66 MHz
3
200 MHz
3.5
233 MHz
3/6
66/33 MHz
0111_011
66 MHz
3
200 MHz
4
266 MHz
3/6
66/33 MHz
0111_100
66 MHz
3
200 MHz
4.5
300 MHz
3/6
66/33 MHz
1000_000
66 MHz
3
200 MHz
2.5
166 MHz
4/8
50/25 MHz
1000_001
66 MHz
3
200 MHz
3
200 MHz
4/8
50/25 MHz
1000_010
66 MHz
3
200 MHz
3.5
233 MHz
4/8
50/25 MHz
1000_011
66 MHz
3
200 MHz
4
266 MHz
4/8
50/25 MHz
1000_100
66 MHz
3
200 MHz
4.5
300 MHz
4/8
50/25 MHz
1001_000
66 MHz
3.5
233 MHz
2.5
166 MHz
4/8
58/29 MHz
1001_001
66 MHz
3.5
233 MHz
3
200 MHz
4/8
58/29 MHz
1001_010
66 MHz
3.5
233 MHz
3.5
233 MHz
4/8
58/29 MHz
1001_011
66 MHz
3.5
233 MHz
4
266 MHz
4/8
58/29 MHz
1001_100
66 MHz
3.5
233 MHz
4.5
300 MHz
4/8
58/29 MHz
1010_000
100 MHz
2
200 MHz
2
200 MHz
3/6
66/33 MHz
1010_001
100 MHz
2
200 MHz
2.5
250 MHz
3/6
66/33 MHz
24
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Clock Configuration Modes
Table 17. Clock Configuration Modes in PCI Host Mode (Continued)
CPM
Core
CPM
Core
PCI Division
PCI
Multiplication
Multiplication
Frequency
Frequency
Factor2
Frequency2
Factor
Factor
MODCK_H –
MODCK[1–3]
Input Clock
Frequency1
(Bus)
1010_010
100 MHz
2
200 MHz
3
300 MHz
3/6
66/33 MHz
1010_011
100 MHz
2
200 MHz
3.5
350 MHz
3/6
66/33 MHz
1010_100
100 MHz
2
200 MHz
4
400 MHz
3/6
66/33 MHz
1011_000
100 MHz
2.5
250 MHz
2
200 MHz
4/8
62/31 MHz
1011_001
100 MHz
2.5
250 MHz
2.5
250 MHz
4/8
62/31MHz
1011_010
100 MHz
2.5
250 MHz
3
300 MHz
4/8
62/31 MHz
1011_011
100 MHz
2.5
250 MHz
3.5
350 MHz
4/8
62/31 MHz
1011_100
100 MHz
2.5
250 MHz
4
400 MHz
4/8
62/31 MHz
1100_0004
66MHz
2
133MHz
Bypass
66MHz
2/4
66/33 MHz
1100_0014
66MHz
2.5
166MHz
Bypass
66MHz
3/6
55/28 MHz
1100_0104
66MHz
3
200MHz
Bypass
66MHz
3/6
66/33 MHz
1
Input clock frequency is given only for the purpose of reference. User should set MODCK_H–MODCK_L so that
the resulting configuration does not exceed the frequency rating of the user’s part.
Example. If a part is rated at 266 MHz CPU, 200 MHz CPM, and 66 MHz bus, any of the following are possible
(note that the three input clock frequencies are only three of many possible input clock frequencies):
1. 66 MHz input clock, MODCK_H–MODCK_L[0111–011] (with a core multiplication factor of 4 and a CPM
multiplication factor of 3), and PCI_MODCK = 0 (see note 2 below). The resulting configuration equals the
part’s maximum possible frequencies of 266 MHz CPU, 200 MHz CPM, 66 MHz 60x bus, and a PCI
frequency of 66 MHz.
2. 50 MHz input clock, MODCK_H–MODCK_L[0111–011], and PCI_MODCK = 0 (see note 2below) to
achieve a configuration of 200 MHz CPU, 150 MHz CPM, 50 MHz 60x bus, and a PCI frequency of 50 MHz.
3. 40 MHz input clock, MODCK_H–MODCK_L[0010–000], and PCI_MODCK = 0 (see note 2 below) to
achieve a configuration of 200 MHz CPU, 160 MHz CPM, 40 MHz 60x bus, and a PCI frequency of 40 MHz.
Note that with each of the examples, any one of several values for MODCK_H–MODCK_L could possibly be
used as long as the resulting configuration does not exceed the part’s rating.
2 The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency is
divided by 2 (33 instead of 66 MHz, etc.).
3 In this mode, PCI_MODCK must be “0”.
4 In this mode the Core PLL is bypassed (core frequency equals to bus frequency; for debug purpose only).
Table 18. Clock Default Configurations in PCI Agent Mode (MODCK_HI = 0000)1
Input Clock
CPM
Core
CPM
Core
Bus Division 60x Bus
Multiplication
MODCK[1–3]2 Frequency Multiplication
4
Frequency
Frequency
Factor
Frequency5
(PCI)3
Factor3
Factor
000
66/33 MHz
2/4
133 MHz
2.5
166 MHz
2
66 MHz
001
66/33 MHz
2/4
133 MHz
3
200 MHz
2
66 MHz
010
66/33 MHz
3/6
200 MHz
3
200 MHz
3
66 MHz
011
66/33 MHz
3/6
200 MHz
4
266 MHz
3
66 MHz
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
25
Clock Configuration Modes
Table 18. Clock Default Configurations in PCI Agent Mode (MODCK_HI = 0000)1 (Continued)
Input Clock
CPM
Core
CPM
Core
Bus Division 60x Bus
Multiplication
MODCK[1–3]2 Frequency Multiplication
Frequency
Frequency4
Factor
Frequency5
3
3
(PCI)
Factor
Factor
100
66/33 MHz
3/6
200 MHz
3
240 MHz
2.5
80 MHz
101
66/33 MHz
3/6
200 MHz
3.5
280 MHz
2.5
80 MHz
110
66/33 MHz
4/8
266 MHz
3.5
300 MHz
3
88 MHz
111
66/33 MHz
4/8
266 MHz
3
300 MHz
2.5
100 MHz
1
The user should verify that all buses and functions run frequencies that are within the supported ranges.
Assumes MODCK_HI = 0000.
3 The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency is
divided by 2 (33 instead of 66 MHz, etc.) and the CPM multiplication factor is multiplied by 2.
4 Core frequency = (60x bus frequency)(core multiplication factor)
5 Bus frequency = CPM frequency / bus division factor
2
Table 19 describes all possible clock configurations when using the MPC8265A or the MPC8266A’s
internal PCI bridge in agent mode.
Table 19. Clock Configuration Modes in PCI Agent Mode 1
Input Clock
CPM
Core
Factor
Factor
CPM
Core
Bus Division 60x Bus
MODCK_H –
Frequency Multiplication
Multiplication
MODCK[1–3]
Frequency
Frequency4
Factor
Frequency5
2,3
2
(PCI)
26
0001_001
66/33 MHz
2/4
133 MHz
5
166 MHz
4
33 MHz
0001_010
66/33 MHz
2/4
133 MHz
6
200 MHz
4
33 MHz
0001_011
66/33 MHz
2/4
133 MHz
7
233 MHz
4
33 MHz
0001_100
66/33 MHz
2/4
133 MHz
8
266 MHz
4
33 MHz
0010_001
50/25 MHz
3/6
150 MHz
3
180 MHz
2.5
60 MHz
0010_010
50/25 MHz
3/6
150 MHz
3.5
210 MHz
2.5
60 MHz
0010_011
50/25 MHz
3/6
150 MHz
4
240 MHz
2.5
60 MHz
0010_100
50/25 MHz
3/6
150 MHz
4.5
270 MHz
2.5
60 MHz
0011_000
66/33 MHz
2/4
133 MHz
2.5
110MHz
3
44 MHz
0011_001
66/33 MHz
2/4
133 MHz
3
132 MHz
3
44 MHz
0011_010
66/33 MHz
2/4
133 MHz
3.5
154 MHz
3
44 MHz
0011_011
66/33 MHz
2/4
133 MHz
4
176MHz
3
44 MHz
0011_100
66/33 MHz
2/4
133 MHz
4.5
198 MHz
3
44 MHz
0100_000
66/33 MHz
3/6
200 MHz
2.5
166 MHz
3
66 MHz
0100_001
66/33 MHz
3/6
200 MHz
3
200 MHz
3
66 MHz
0100_010
66/33 MHz
3/6
200 MHz
3.5
233 MHz
3
66 MHz
0100_011
66/33 MHz
3/6
200 MHz
4
266 MHz
3
66 MHz
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Clock Configuration Modes
Table 19. Clock Configuration Modes in PCI Agent Mode (Continued)1
Input Clock
CPM
Core
Factor
Factor
CPM
Core
Bus Division 60x Bus
MODCK_H –
Frequency Multiplication
Multiplication
MODCK[1–3]
Frequency
Frequency4
Factor
Frequency5
2,3
2
(PCI)
0100_100
66/33 MHz
3/6
200 MHz
4.5
300 MHz
3
66 MHz
0101_0006
33 MHz
5
166 MHz
2.5
166 MHz
2.5
66 MHz
0101_0016
33 MHz
5
166 MHz
3
200 MHz
2.5
66 MHz
0101_0106
33 MHz
5
166 MHz
3.5
233 MHz
2.5
66 MHz
0101_0116
33 MHz
5
166 MHz
4
266 MHz
2.5
66 MHz
0101_1006
33 MHz
5
166 MHz
4.5
300 MHz
2.5
66 MHz
0110_000
50/25 MHz
4/8
200 MHz
2.5
166 MHz
3
66 MHz
0110_001
50/25 MHz
4/8
200 MHz
3
200 MHz
3
66 MHz
0110_010
50/25 MHz
4/8
200 MHz
3.5
233 MHz
3
66 MHz
0110_011
50/25 MHz
4/8
200 MHz
4
266 MHz
3
66 MHz
0110_100
50/25 MHz
4/8
200 MHz
4.5
300 MHz
3
66 MHz
0111_000
66/33 MHz
3/6
200 MHz
2
200 MHz
2
100 MHz
0111_001
66/33 MHz
3/6
200 MHz
2.5
250 MHz
2
100 MHz
0111_010
66/33 MHz
3/6
200 MHz
3
300 MHz
2
100 MHz
0111_011
66/33 MHz
3/6
200 MHz
3.5
350 MHz
2
100 MHz
1000_000
66/33 MHz
3/6
200 MHz
2
160 MHz
2.5
80 MHz
1000_001
66/33 MHz
3/6
200 MHz
2.5
200 MHz
2.5
80 MHz
1000_010
66/33 MHz
3/6
200 MHz
3
240 MHz
2.5
80 MHz
1000_011
66/33 MHz
3/6
200 MHz
3.5
280 MHz
2.5
80 MHz
1000_100
66/33 MHz
3/6
200 MHz
4
320 MHz
2.5
80 MHz
1000_101
66/33 MHz
3/6
200 MHz
4.5
360 MHz
2.5
80 MHz
1001_000
66/33 MHz
4/8
266 MHz
2.5
166 MHz
4
66 MHz
1001_001
66/33 MHz
4/8
266 MHz
3
200 MHz
4
66 MHz
1001_010
66/33 MHz
4/8
266 MHz
3.5
233 MHz
4
66 MHz
1001_011
66/33 MHz
4/8
266 MHz
4
266 MHz
4
66 MHz
1001_100
66/33 MHz
4/8
266 MHz
4.5
300 MHz
4
66 MHz
1010_000
66/33 MHz
4/8
266 MHz
2.5
222 MHz
3
88 MHz
1010_001
66/33 MHz
4/8
266 MHz
3
266 MHz
3
88 MHz
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
27
Clock Configuration Modes
Table 19. Clock Configuration Modes in PCI Agent Mode (Continued)1
Input Clock
CPM
Core
Factor
Factor
CPM
Core
Bus Division 60x Bus
MODCK_H –
Frequency Multiplication
Multiplication
MODCK[1–3]
Frequency
Frequency4
Factor
Frequency5
2,3
2
(PCI)
1010_010
66/33 MHz
4/8
266 MHz
3.5
300 MHz
3
88 MHz
1010_011
66/33 MHz
4/8
266 MHz
4
350 MHz
3
88 MHz
1010_100
66/33 MHz
4/8
266 MHz
4.5
400 MHz
3
88 MHz
1011_000
66/33 MHz
4/8
266 MHz
2
212MHz
2.5
106 MHz
1011_001
66/33 MHz
4/8
266 MHz
2.5
265 MHz
2.5
106 MHz
1011_010
66/33 MHz
4/8
266 MHz
3
318 MHz
2.5
106 MHz
1011_011
66/33 MHz
4/8
266 MHz
3.5
371 MHz
2.5
106 MHz
1011_100
66/33 MHz
4/8
266 MHz
4
424 MHz
2.5
106 MHz
1100_0007
66/33MHz
2/4
133MHz
Bypass
66MHz
2
66 MHz
1100_0017
66/33MHz
3/6
200MHz
Bypass
80MHz
2.5
80 MHz
1100_0107
66/33MHz
3/6
200MHz
Bypass
66MHz
3
66 MHz
1
The user should verify that all buses and functions run frequencies that are within the supported ranges.
The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency
is divided by 2 (33 instead of 66 MHz, etc.) and the CPM multiplication factor is multiplied by 2.
3 Input clock frequency is given only for the purpose of reference. User should set MODCK_H–MODCK_L so
that the resulting configuration does not exceed the frequency rating of the user’s part.
2
Example. If a part is rated at 266 MHz CPU, 200 MHz CPM, and 66 MHz bus, any of the following are
possible (note that the three input clock frequencies are only three of many possible input clock
frequencies):
1. 50 MHz input clock, MODCK_H–MODCK_L[0110–011] (with a core multiplication factor of 4, a CPM
multiplication factor of 4, and a bus division factor of 3), and PCI_MODCK = 0 (see note 2 above). The
PCI frequency is 50 MHz and the resulting configuration equals the part’s maximum possible frequencies
of 266 MHz CPU, 200 MHz CPM, and 66 MHz 60x bus.
2. 66 MHz input clock, MODCK_H–MODCK_L[0100–001], and PCI_MODCK = 1 (see note 2 above) to
achieve a PCI frequency of 33 MHz and a configuration of 200MHz CPU, 200 MHz CPM, and 66 MHz
60x bus.
3. 40 MHz input clock, MODCK_H–MODCK_L[1001–011], and PCI_MODCK = 0 (see note 2 above) to
achieve a PCI frequency of 40 MHz and a configuration of 160 MHz CPU, 160 MHz CPM, and 40 MHz
60x bus.
4
5
6
7
28
Note that with each of the examples, any one of several values for MODCK_H–MODCK_L could possibly
be used as long as the resulting configuration does not exceed the part’s rating.
Core frequency = (60x bus frequency)(core multiplication factor)
Bus frequency = CPM frequency / bus division factor
In this mode, PCI_MODCK must be “1”.
In this mode the Core PLL is bypassed (core frequency equals bus frequency; for debug purpose only).
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Pinout
1.4
Pinout
This section provides the pin assignments and pinout list for the MPC826xA.
1.4.1
Pin Assignments
Figure 12 shows the pinout of the MPC826xA’s 480 TBGA package as viewed from the top surface.
1
2
3
4 5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
1
2
3
4 5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Not to Scale
Figure 12. Pinout of the 480 TBGA Package as Viewed from the Top Surface
Figure 13 shows the side profile of the TBGA package to indicate the direction of the top surface view.
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
29
Pinout
View
Copper Heat Spreader
(Oxidized for Insulation)
Die
Attach
Polymide Tape
Etched
Cavity
Pressure Sensitive
Adhesive
Die
Soldermask
Glob-Top Filled Area
Glob-Top Dam
1.27 mm Pitch
Copper Traces
Figure 13. Side View of the TBGA Package
Table 20 shows the pinout list of the MPC826xA. Table 21 defines conventions and acronyms used in
Table 20.
Table 20. Pinout List
Pin Name
Ball
BR
W5
BG
F4
ABB/IRQ2
E2
TS
E3
A0
G1
A1
H5
A2
H2
A3
H1
A4
J5
A5
J4
A6
J3
A7
J2
A8
J1
A9
K4
A10
K3
A11
K2
A12
K1
A13
L5
A14
L4
A15
L3
A16
L2
A17
L1
A18
M5
A19
N5
30
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
A20
N4
A21
N3
A22
N2
A23
N1
A24
P4
A25
P3
A26
P2
A27
P1
A28
R1
A29
R3
A30
R5
A31
R4
TT0
F1
TT1
G4
TT2
G3
TT3
G2
TT4
F2
TBST
D3
TSIZ0
C1
TSIZ1
E4
TSIZ2
D2
TSIZ3
F5
AACK
F3
ARTRY
E1
DBG
V1
DBB/IRQ3
V2
D0
B20
D1
A18
D2
A16
D3
A13
D4
E12
D5
D9
D6
A6
D7
B5
D8
A20
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
31
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
D9
E17
D10
B15
D11
B13
D12
A11
D13
E9
D14
B7
D15
B4
D16
D19
D17
D17
D18
D15
D19
C13
D20
B11
D21
A8
D22
A5
D23
C5
D24
C19
D25
C17
D26
C15
D27
D13
D28
C11
D29
B8
D30
A4
D31
E6
D32
E18
D33
B17
D34
A15
D35
A12
D36
D11
D37
C8
D38
E7
D39
A3
D40
D18
D41
A17
D42
A14
D43
B12
32
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
D44
A10
D45
D8
D46
B6
D47
C4
D48
C18
D49
E16
D50
B14
D51
C12
D52
B10
D53
A7
D54
C6
D55
D5
D56
B18
D57
B16
D58
E14
D59
D12
D60
C10
D61
E8
D62
D6
D63
C2
DP0/RSRV/EXT_BR2
B22
IRQ1/DP1/EXT_BG2
A22
IRQ2/DP2/TLBISYNC/EXT_DBG2
E21
IRQ3/DP3/CKSTP_OUT/EXT_BR3
D21
IRQ4/DP4/CORE_SRESET/EXT_BG3
C21
IRQ5/DP5/TBEN/EXT_DBG3
B21
IRQ6/DP6/CSE0
A21
IRQ7/DP7/CSE1
E20
PSDVAL
V3
TA
C22
TEA
V5
GBL/IRQ1
W1
CI/BADDR29/IRQ2
U2
WT/BADDR30/IRQ3
U3
L2_HIT/IRQ4
Y4
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
33
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
CPU_BG/BADDR31/IRQ5
U4
CPU_DBG
R2
CPU_BR
Y3
CS0
F25
CS1
C29
CS2
E27
CS3
E28
CS4
F26
CS5
F27
CS6
F28
CS7
G25
CS8
D29
CS9
E29
CS10/BCTL1
F29
CS11/AP0
G28
BADDR27
T5
BADDR28
U1
ALE
T2
BCTL0
A27
PWE0/PSDDQM0/PBS0
C25
PWE1/PSDDQM1/PBS1
E24
PWE2/PSDDQM2/PBS2
D24
PWE3/PSDDQM3/PBS3
C24
PWE4/PSDDQM4/PBS4
B26
PWE5/PSDDQM5/PBS5
A26
PWE6/PSDDQM6/PBS6
B25
PWE7/PSDDQM7/PBS7
A25
PSDA10/PGPL0
E23
PSDWE/PGPL1
B24
POE/PSDRAS/PGPL2
A24
PSDCAS/PGPL3
B23
PGTA/PUPMWAIT/PGPL4/PPBS
A23
PSDAMUX/PGPL5
D22
LWE0/LSDDQM0/LBS0/PCI_CFG01
H28
LWE1/LSDDQM1/LBS1/PCI_CFG11
H27
34
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
LWE2/LSDDQM2/LBS2/PCI_CFG21
H26
LWE3/LSDDQM3/LBS3/PCI_CFG31
G29
LSDA10/LGPL0/PCI_MODCKH01
D27
LSDWE/LGPL1/PCI_MODCKH11
C28
LOE/LSDRAS/LGPL2/PCI_MODCKH21
E26
LSDCAS/LGPL3/PCI_MODCKH31
D25
LGTA/LUPMWAIT/LGPL4/LPBS
C26
LGPL5/LSDAMUX/PCI_MODCK1
B27
LWR
D28
L_A14/PAR1
N27
L_A15/FRAME1/SMI
T29
L_A16/TRDY1
R27
L_A17/IRDY1/CKSTP_OUT
R26
L_A18/STOP1
R29
L_A19/DEVSEL1
R28
L_A20/IDSEL1
W29
L_A21/PERR1
P28
L_A22/SERR1
N26
L_A23/REQ01
AA27
L_A24/REQ11/HSEJSW1
P29
L_A25/GNT01
AA26
L_A26/GNT11/HSLED1
N25
L_A27/GNT21/HSENUM1
AA25
L_A28/RST1/CORE_SRESET
AB29
L_A29/INTA1
AB28
L_A30/REQ21
P25
L_A31/DLLOUT1
AB27
LCL_D0/AD01
H29
LCL_D1/AD11
J29
LCL_D2/AD21
J28
LCL_D3/AD31
J27
LCL_D4/AD41
J26
LCL_D5/AD51
J25
LCL_D6/AD61
K25
LCL_D7/AD71
L29
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
35
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
LCL_D8/AD81
L27
LCL_D9/AD91
L26
LCL_D10/AD101
L25
LCL_D11/AD111
M29
LCL_D12/AD121
M28
LCL_D13/AD131
M27
LCL_D14/AD141
M26
LCL_D15/AD151
N29
LCL_D16/AD161
T25
LCL_D17/AD171
U27
LCL_D18/AD181
U26
LCL_D19/AD191
U25
LCL_D20/AD201
V29
LCL_D21/AD211
V28
LCL_D22/AD221
V27
LCL_D23/AD231
V26
LCL_D24/AD241
W27
LCL_D25/AD251
W26
LCL_D26/AD261
W25
LCL_D27/AD271
Y29
LCL_D28/AD281
Y28
LCL_D29/AD291
Y25
LCL_D30/AD301
AA29
LCL_D31/AD311
AA28
LCL_DP0/C01/BE01
L28
LCL_DP1/C11/BE11
N28
LCL_DP2/C21/BE21
T28
LCL_DP3/C31/BE31
W28
IRQ0/NMI_OUT
T1
IRQ7/INT_OUT/APE
D1
TRST
AH3
TCK
AG5
TMS
AJ3
TDI
AE6
TDO
AF5
36
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
TRIS
AB4
PORESET
AG6
HRESET
AH5
SRESET
AF6
QREQ
AA3
RSTCONF
AJ4
MODCK1/AP1/TC0/BNKSEL0
W2
MODCK2/AP2/TC1/BNKSEL1
W3
MODCK3/AP3/TC2/BNKSEL2
W4
XFC
AB2
CLKIN1
AH4
PA0/RESTART1/DREQ3/FCC2_UTM_TXADDR2
AC29
PA1/REJECT1/FCC2_UTM_TXADDR1/DONE3
AC25
PA2/CLK20/FCC2_UTM_TXADDR0/DACK3
AE28
PA3/CLK19/FCC2_UTM_RXADDR0/DACK4/L1RXD1A2
AG29
PA4/REJECT2/FCC2_UTM_RXADDR1/DONE4
AG28
PA5/RESTART2/DREQ4/FCC2_UTM_RXADDR2
AG26
PA6/L1RSYNCA1
AE24
PA7/SMSYN2/L1TSYNCA1/L1GNTA1
AH25
PA8/SMRXD2/L1RXD0A1/L1RXDA1
AF23
PA9/SMTXD2/L1TXD0A1
AH23
PA10/FCC1_UT8_RXD0/FCC1_UT16_RXD8/MSNUM5
AE22
PA11/FCC1_UT8_RXD1/FCC1_UT16_RXD9/MSNUM4
AH22
PA12/FCC1_UT8_RXD2/FCC1_UT16_RXD10/MSNUM3
AJ21
PA13/FCC1_UT8_RXD3/FCC1_UT16_RXD11/MSNUM2
AH20
PA14/FCC1_UT8_RXD4/FCC1_UT16_RXD12/FCC1_RXD3
AG19
PA15/FCC1_UT8_RXD5/FCC1_UT16_RXD13/FCC1_RXD2
AF18
PA16/FCC1_UT8_RXD6/FCC1_UT16_RXD14/FCC1_RXD1
AF17
PA17/FCC1_UT8_RXD7/FCC1_UT16_RXD15/FCC1_RXD0/FCC1_RXD
AE16
PA18/FCC1_UT8_TXD7/FCC1_UT16_TXD15/FCC1_TXD0/FCC1_TXD
AJ16
PA19/FCC1_UT8_TXD6/FCC1_UT16_TXD14/FCC1_TXD1
AG15
PA20/FCC1_UT8_TXD5/FCC1_UT16_TXD13/FCC1_TXD2
AJ13
PA21/FCC1_UT8_TXD4/FCC1_UT16_TXD12/FCC1_TXD3
AE13
PA22/FCC1_UT8_TXD3/FCC1_UT16_TXD11
AF12
PA23/FCC1_UT8_TXD2/FCC1_UT16_TXD10
AG11
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
37
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
PA24/FCC1_UT8_TXD1/FCC1_UT16_TXD9/MSNUM1
AH9
PA25/FCC1_UT8_TXD0/FCC1_UT16_TXD8/MSNUM0
AJ8
PA26/FCC1_UTM_RXCLAV/FCC1_UTS_RXCLAV/FCC1_MII_RX_ER
AH7
PA27/FCC1_UT_RXSOC/FCC1_MII_RX_DV
AF7
PA28/FCC1_UTM_RXENB/FCC1_UTS_RXENB/FCC1_MII_TX_EN
AD5
PA29/FCC1_UT_TXSOC/FCC1_MII_TX_ER
AF1
PA30/FCC1_UTM_TXCLAV/FCC1_UTS_TXCLAV/FCC1_MII_CRS/FCC1_RTS
AD3
PA31/FCC1_UTM_TXENB/FCC1_UTS_TXENB/FCC1_MII_COL
AB5
PB4/FCC3_TXD3/FCC2_UT8_RXD0/L1RSYNCA2/FCC3_RTS
AD28
PB5/FCC3_TXD2/FCC2_UT8_RXD1/L1TSYNCA2/L1GNTA2
AD26
PB6/FCC3_TXD1/FCC2_UT8_RXD2/L1RXDA2/L1RXD0A2
AD25
PB7/FCC3_TXD0/FCC3_TXD/FCC2_UT8_RXD3/L1TXDA2/L1TXD0A2
AE26
PB8/FCC2_UT8_TXD3/FCC3_RXD0/FCC3_RXD/TXD3/L1RSYNCD1
AH27
PB9/FCC2_UT8_TXD2/FCC3_RXD1/L1TXD2A2/L1TSYNCD1/L1GNTD1
AG24
PB10/FCC2_UT8_TXD1/FCC3_RXD2/L1RXDD1
AH24
PB11/FCC3_RXD3/FCC2_UT8_TXD0/L1TXDD1
AJ24
PB12/FCC3_MII_CRS/L1CLKOB1/L1RSYNCC1/TXD2
AG22
PB13/FCC3_MII_COL/L1RQB1/L1TSYNCC1/L1GNTC1/L1TXD1A2
AH21
PB14/FCC3_MII_TX_EN/RXD3/L1RXDC1
AG20
PB15/FCC3_MII_TX_ER/RXD2/L1TXDC1
AF19
PB16/FCC3_MII_RX_ER/L1CLKOA1/CLK18
AJ18
PB17/FCC3_MII_RX_DV/L1RQA1/CLK17
AJ17
PB18/FCC2_UT8_RXD4/FCC2_RXD3/L1CLKOD2/L1RXD2A2
AE14
PB19/FCC2_UT8_RXD5/FCC2_RXD2/L1RQD2/L1RXD3A2
AF13
PB20/FCC2_UT8_RXD6/FCC2_RXD1/L1RSYNCD2/L1TXD1A1
AG12
PB21/FCC2_UT8_RXD7/FCC2_RXD0/FCC2_RXD/L1TSYNCD2/L1GNTD2/
L1TXD2A1
AH11
PB22/FCC2_UT8_TXD7/FCC2_TXD0/FCC2_TXD/L1RXD1A1/L1RXDD2
AH16
PB23/FCC2_UT8_TXD6/FCC2_TXD1/L1RXD2A1/L1TXDD2
AE15
PB24/FCC2_UT8_TXD5/FCC2_TXD2/L1RXD3A1/L1RSYNCC2
AJ9
PB25/FCC2_UT8_TXD4/FCC2_TXD3/L1TSYNCC2/L1GNTC2/L1TXD3A1
AE9
PB26/FCC2_MII_CRS/FCC2_UT8_TXD1/L1RXDC2
AJ7
PB27/FCC2_MII_COL/FCC2_UT8_TXD0/L1TXDC2
AH6
PB28/FCC2_MII_RX_ER/FCC2_RTS/L1TSYNCB2/L1GNTB2/TXD1
AE3
PB29/FCC2_UTM_RXCLAV/FCC2_UTS_RXCLAV/L1RSYNCB2/
FCC2_MII_TX_EN
AE2
38
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
PB30/FCC2_MII_RX_DV/FCC2_UT_TXSOC/L1RXDB2
AC5
PB31/FCC2_MII_TX_ER/FCC2_UT_RXSOC/L1TXDB2
AC4
PC0/DREQ1/BRGO7/SMSYN2/L1CLKOA2
AB26
PC1/DREQ2/BRGO6/L1RQA2
AD29
PC2/FCC3_CD/FCC2_UT8_TXD3/DONE2
AE29
PC3/FCC3_CTS/FCC2_UT8_TXD2/DACK2/CTS4
AE27
PC4/FCC2_UTM_RXENB/FCC2_UTS_RXENB/SI2_L1ST4/FCC2_CD
AF27
PC5/FCC2_UTM_TXCLAV/FCC2_UTS_TXCLAV/SI2_L1ST3/FCC2_CTS
AF24
PC6/FCC1_CD/L1CLKOC1/FCC1_UTM_RXADDR2/FCC1_UTS_RXADDR2/
FCC1_UTM_RXCLAV1
AJ26
PC7/FCC1_CTS/L1RQC1/FCC1_UTM_TXADDR2/FCC1_UTS_TXADDR2/
FCC1_UTM_TXCLAV1
AJ25
PC8/CD4/RENA4/FCC1_UT16_TXD0/SI2_L1ST2/CTS3
AF22
PC9/CTS4/CLSN4/FCC1_UT16_TXD1/SI2_L1ST1/L1TSYNCA2/L1GNTA2
AE21
PC10/CD3/RENA3/FCC1_UT16_TXD2/SI1_L1ST4/FCC2_UT8_RXD3
AF20
PC11/CTS3/CLSN3/L1CLKOD1/L1TXD3A2/FCC2_UT8_RXD2
AE19
PC12/CD2/RENA2/SI1_L1ST3/FCC1_UTM_RXADDR1/FCC1_UTS_RXADDR1 AE18
PC13/CTS2/CLSN2/L1RQD1/FCC1_UTM_TXADDR1/FCC1_UTS_TXADDR1
AH18
PC14/CD1/RENA1/FCC1_UTM_RXADDR0/FCC1_UTS_RXADDR0
AH17
PC15/CTS1/CLSN1/SMTXD2/FCC1_UTM_TXADDR0/FCC1_UTS_TXADDR0
AG16
PC16/CLK16/TIN4
AF15
PC17/CLK15/TIN3/BRGO8
AJ15
PC18/CLK14/TGATE2
AH14
PC19/CLK13/BRGO7
AG13
PC20/CLK12/TGATE1
AH12
PC21/CLK11/BRGO6
AJ11
PC22/CLK10/DONE1
AG10
PC23/CLK9/BRGO5/DACK1
AE10
PC24/FCC2_UT8_TXD3/CLK8/TOUT4
AF9
PC25/FCC2_UT8_TXD2/CLK7/BRGO4
AE8
PC26/CLK6/TOUT3/TMCLK
AJ6
PC27/FCC3_TXD/FCC3_TXD0/CLK5/BRGO3
AG2
PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2
AF3
PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1
AF2
PC30/FCC2_UT8_TXD3/CLK2/TOUT1
AE1
PC31/CLK1/BRGO1
AD1
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
39
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
PD4/BRGO8/L1TSYNCD1/L1GNTD1/FCC3_RTS/SMRXD2
AC28
PD5/FCC1_UT16_TXD3/DONE1
AD27
PD6/FCC1_UT16_TXD4/DACK1
AF29
PD7/SMSYN1/FCC1_UTM_TXADDR3/FCC1_UTS_TXADDR3/FCC1_TXCLAV2 AF28
PD8/SMRXD1/FCC2_UT_TXPRTY/BRGO5
AG25
PD9/SMTXD1/FCC2_UT_RXPRTY/BRGO3
AH26
PD10/L1CLKOB2/FCC2_UT8_RXD1/L1RSYNCB1/BRGO4
AJ27
PD11/L1RQB2/FCC2_UT8_RXD0/L1TSYNCB1/L1GNTB1
AJ23
PD12/SI1_L1ST2/L1RXDB1
AG23
PD13/SI1_L1ST1/L1TXDB1
AJ22
PD14/FCC1_UT16_RXD0/L1CLKOC2/I2CSCL
AE20
PD15/FCC1_UT16_RXD1/L1RQC2/I2CSDA
AJ20
PD16/FCC1_UT_TXPRTY/L1TSYNCC1/L1GNTC1/SPIMISO
AG18
PD17/FCC1_UT_RXPRTY/BRGO2/SPIMOSI
AG17
PD18/FCC1_UTM_RXADDR4/FCC1_UTS_RXADDR4/FCC1_UTM_RXCLAV3/S AF16
PICLK
PD19/FCC1_UTM_TXADDR4/FCC1_UTS_TXADDR4/FCC1_UTM_TXCLAV3/S AH15
PISEL/BRGO1
PD20/RTS4/TENA4/FCC1_UT16_RXD2/L1RSYNCA2
AJ14
PD21/TXD4/FCC1_UT16_RXD3/L1RXD0A2/L1RXDA2
AH13
PD22/RXD4/FCC1_UT16_TXD5/L1TXD0A2/L1TXDA2
AJ12
PD23/RTS3/TENA3/FCC1_UT16_RXD4/L1RSYNCD1
AE12
PD24/TXD3/FCC1_UT16_RXD5/L1RXDD1
AF10
PD25/RXD3/FCC1_UT16_TXD6/L1TXDD1
AG9
PD26/RTS2/TENA2/FCC1_UT16_RXD6/L1RSYNCC1
AH8
PD27/TXD2/FCC1_UT16_RXD7/L1RXDC1
AG7
PD28/RXD2/FCC1_UT16_TXD7/L1TXDC1
AE4
PD29/RTS1/TENA1/FCC1_UTM_RXADDR3/FCC1_UTS_RXADDR3/
FCC1_UTM_RXCLAV2
AG1
PD30/FCC2_UTM_TXENB/FCC2_UTS_TXENB/TXD1
AD4
PD31/RXD1
AD2
VCCSYN
AB3
VCCSYN1
B9
GNDSYN
AB1
CLKIN21,2
AE11
SPARE43
U5
PCI_MODE1,4
AF25
40
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Pinout
Table 20. Pinout List (Continued)
Pin Name
Ball
SPARE63
V4
THERMAL05
AA1
THERMAL15
AG4
I/O power
AG21, AG14, AG8, AJ1, AJ2, AH1,
AH2, AG3, AF4, AE5, AC27, Y27,
T27, P27, K26, G27, AE25, AF26,
AG27, AH28, AH29, AJ28, AJ29,
C7, C14, C16, C20, C23, E10, A28,
A29, B28, B29, C27, D26, E25, H3,
M4, T3, AA4, A1, A2, B1, B2, C3,
D4, E5
Core Power
U28, U29, K28, K29, A9, A19, B19,
M1, M2, Y1, Y2, AC1, AC2, AH19,
AJ19, AH10, AJ10, AJ5
Ground
AA5, AF21, AF14, AF8, AE7, AF11,
AE17, AE23, AC26, AB25, Y26, V25,
T26, R25, P26, M25, K27, H25,
G26, D7, D10, D14, D16, D20, D23,
C9, E11, E13, E15, E19, E22, B3,
G5, H4, K5, M3, P5, T4, Y5, AA2,
AC3
1
MPC8265A and MPC8266A only.
On PCI devices (MPC8265A and MPC8266A) this pin should be used as CLKIN2. On non-PCI devices
(MPC8260A and MPC8264A) this is a spare pin that must be pulled down or left floating.
3 Must be pulled down or left floating.
4 On PCI devices (MPC8265A and MPC8266A) this pin should be asserted if the PCI function is desired or pulled
up or left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264A) this is a spare pin that
must be pulled up or left floating.
5 For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at
www.motorola.com/semiconductors.
2
Symbols used in Table 20 are described in Table 21.
Table 21. Symbol Legend
Symbol
Meaning
OVERBAR
Signals with overbars, such as TA, are active low.
UTM
Indicates that a signal is part of the UTOPIA master interface.
UTS
Indicates that a signal is part of the UTOPIA slave interface.
UT8
Indicates that a signal is part of the 8-bit UTOPIA interface.
UT16
Indicates that a signal is part of the 16-bit UTOPIA interface.
MII
Indicates that a signal is part of the media independent interface.
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
41
Package Description
1.5
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
1.5.1
Package Parameters
Package parameters are provided in Table 22. The package type is a 37.5 x 37.5 mm, 480-lead TBGA.
Table 22. Package Parameters
Parameter
Value
Package Outline
37.5 x 37.5 mm
Interconnects
480 (29 x 29 ball array)
Pitch
1.27 mm
Nominal unmounted package height 1.55 mm
42
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Package Description
1.5.2
Mechanical Dimensions
Figure 14 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter,
parallel to primary data A.
4. Primary data A and the seating
plane are defined by the spherical
crowns of the solder balls.
Millimeters
Dim
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
—
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
43
Ordering Information
1.6
Ordering Information
Figure 15 provides an example of the Motorola part numbering nomenclature for the MPC826xA. In
addition to the processor frequency, the part numbering scheme also consists of a part modifier that indicates
any enhancement(s) in the part from the original production design. Each part number also contains a
revision code that refers to the die mask revision number and is specified in the part numbering scheme for
identification purposes only. For more information, contact your local Motorola sales office.
MPC 826X A C ZU XXX X
Product Code
Die Revision Level
Device Number
Process Technology
(None = 0.29 micron
A = 0.25 micron)
Processor Frequency
(CPU/CPM/Bus)
Temperature Range
(Blank = 0 to 105 ˚C
C = -40 to 105 ˚C
Package
(ZU = 480 TBGA)
Figure 15. Motorola Part Number Key
1.7
Document Revision History
Table 23 lists significant changes in each revision of this document.
Table 23. Document Revision History
Document Revision
0
44
Substantive Changes
Initial version
0.1
Table 10, sp20/sp21: 66 MHz setup and hold times are 15 and 20 respectively. Delete ‘(10).’
0.2
•
•
•
•
0.3
• Note 3 for Table 3
• Section 1.2.1, “DC Electrical Characteristics”: Removal of “Warning” recommending use of
bootstrap diodes. They are not needed.
• sp12 in Table 11, sp32 in Table 12
• Note 2 for Table 16 and Table 17
• Addition of note at beginning of Section 1.3.2, “PCI Mode”
• Note 1 for Table 18 and Table 19
• Additions to pinout, Table 20 for balls: B27, C28, D25, D27, E26, G29, H26–28, N25, P29,
AF25, AA25, AB27
Revision of Table 7, “Power Dissipation”
Modifications to Figure 8, Table 4,Table 12, Table 13, and Table 18
Modification to pinout diagram, Figure 12
Additional revisions to text and figures throughout
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Document Revision History
Table 23. Document Revision History (Continued)
Document Revision
Substantive Changes
0.4
• Note 2 for Table 4 (changes in italics): “...greater than or equal to 266 MHz, 200 MHz CPM...”
• Table 19: core and bus frequency values for the following ranges of MODCK_HMODCK:
0011_000 to 0011_100 and 1011_000 to 1011_1000
• Table 20: notes added to pins at AE11, AF25, U5, and V4.
0.5
• Table 20: modified notes to pins AE11 and AF25.
• Table 20: added note to pins AA1 and AG4 (Therm0 and Therm1).
0.6
• Table 20: modified notes to pins AE11 and AF25.
0.7
•
•
•
•
•
•
•
MOTOROLA
Section 1.1, “Features”: minimum supported core frequency of 150 MHz
Section 1.1, “Features”: updated performance values (under “Dual-issue integer core”)
Table 4: Notes 2 and 3
Addition of note on page 8:VDDH and VDD tracking
Table 15: Note 3
Table 17: Note 1
Table 19: Note 3
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
45
Document Revision History
46
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
MOTOROLA
Document Revision History
MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
47
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MPC8260AEC/D