Sony CXN1000 Bluetooth module Datasheet

CXN1000
BluetoothTM Module
Description
The CXN1000 is a fully integrated Class 2 radio and baseband module conforming to ver. 1.1 of the BluetoothTM
specification.
Features
• UART, USB, PCM codec, PIO, and AIO interfaces, enabling a wide range of applications.
• Small package: 11 × 11 × 2.2mm
• 4M-bit or 8M-bit on-module flash memory options
• Voltage regulator options: either on-module or external 1.8V regulator supported
• The CXD3251GL is fully compatible with the Bluecore2-EXT from CSR
• Support for up to 7 slaves from a single master
• Channel quality driven data rate
General Specifications
• Product name:
BluetoothTM module
• Model number:
CXN1000-3∗∗L
• Antenna connector impedance:
50Ω
• External interfaces:
UART, USB, PCM, PIO, AIO
• Supply voltage:
2.7 to 3.6V∗
• Package dimensions:
11.0 × 11.0 × 2.2mm
∗ An external 1.8 ± 0.1V power supply is required for modules without internal voltage regulator (customer option).
Block Diagram
VDD: 3V
3AAL, 3CAL ... 4M-bit
3BAL, 3DAL ... 8M-bit
Integrated in 3AAL and
3BAL versions only
Flash Memory
Regulator
VDD: 1.8V
UART
TX
BPF
Balun
ANT
USB
RX
CXD3251GL
32MHz
X'tal
PCM
SPI
PIO, AIO
BluetoothTM is a trademark owned by Bluetooth SIG, Inc. and licensed to Sony.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E02860E43
CXN1000
Pin Configuration
1
2
3
4
5
6
7
8
9
10
36
11
35
12
34
13
33
14
32
15
31
16
30
17
29
18
28
27
26
25
24
23
22
21
20
19
Bottom View
Pin Description
No.
Name
Type
Description
1
GND
GND
Ground.
2
VDD3.0
VDD
Supply voltage 3.0V.
3
CE
CMOS input
1.8V regulator control.
Regulator on at high.
4
VDD1.8
Monitor Output/VDD
1.8V monitor(-3AAL/-3BAL)/Input 1.8V(-3CAL/
-3DAL)
5
PD-RST
CMOS input with 1kΩ pull-down
Reset at high. Input is debounced, so this pin
should be high for 5ms or more to cause a reset.
6
PIO_4/USB_ON
Bi-directional with programmable
Programmable I/O line or USB on.
weak internal pull-up/down
7
PIO_3/
Bi-directional with programmable Programmable I/O line or output goes high to
USB_WAKE_UP weak internal pull-up/down
wake up PC when in USB mode.
8
PIO_6
Bi-directional with programmable
Programmable I/O line.
weak internal pull-up/down
9
PIO_8
Bi-directional with programmable
Programmable I/O line.
weak internal pull-up/down
10
GND
GND
Ground.
11
RF
Analog
RF input/output.
12
GND
GND
Ground.
13
PIO_7
Bi-directional with programmable
Programmable I/O line.
weak internal pull-up/down
14
AIO_0
Bi-directional
Programmable I/O line.
–2–
CXN1000
No.
Name
Type
Description
15
SPI_CSB
CMOS input with weak internal
pull-up
Chip select for Serial Peripheral Interface,
active low.
16
SPI_MISO
CMOS output, tristatable with
weak internal pull-down
Serial Peripheral Interface data output.
17
SPI_CLK
CMOS input with weak internal
pull-down
Serial Peripheral Interface clock.
18
SPI_MOSI
CMOS input with weak internal
pull-down
Serial Peripheral Interface data input.
19
GND
GND
Ground.
20
GND
GND
Ground.
21
AIO_1
Bi-directional
Programmable I/O line.
22
PCM_CLK
Bi-directional with weak internal
pull-down
Synchronous data clock.
23
PCM_OUT
CMOS output, tristatable with
weak internal pull-down
Synchronous data output.
24
PCM_SYNC
Bi-directional with 100kΩ
pull-down
Synchronous data sync.
25
PCM_IN
CMOS input with weak internal
pull-down
Synchronous data input.
26
USB–
Bi-directional
USB data minus.
27
USB+
Bi-directional
USB data plus.
28
GND
GND
Ground.
29
UART_RX
CMOS input with weak internal
pull-down
UART data input, active high.
30
UART_TX
CMOS output
UART data output, active high.
31
UART_RTS
CMOS output, tristatable with
weak internal pull-up
UART request to send, active low.
32
UART_CTS
CMOS input with weak internal
pull-down
UART clear to send, active low.
33
PIO_10
Bi-directional with programmable
weak internal pull-up/down
Programmable I/O line.
34
PIO_9
Bi-directional with programmable
weak internal pull-up/down
Programmable I/O line.
35
PIO_11
Bi-directional with programmable
weak internal pull-up/down
Programmable I/O line.
36
PIO_5/
USB_DETACH
Bi-directional with programmable
weak internal pull-up/down
Programmable I/O line or chip detaches from
USB when this input is high.
–3–
CXN1000
Product Name Specifications
CXN1000-3∗1∗2L
∗1 See table below
∗2 Firmware version
Flash memory size
1.8V regulator
4M-bit
8M-bit
Integrated
CXN1000-3AAL
CXN1000-3BAL
Not integrated
(external 1.8V supply)
CXN1000-3CAL
CXN1000-3DAL
–4–
CXN1000
Electrical Characteristics
Absolute Maximum Ratings
Item
Min.
Max.
Unit
–40
+85
°C
VDD1.8
–0.40
1.90
V
VDD3.0
–0.40
3.60
V
Storage temperature
Supply voltage
(Only for CXN1000-CAL and CXN1000-3DAL)
Recommended Operating Conditions
Item
Min.
Max.
Unit
Operating temperature range
–40
+85
°C
VDD1.8
1.70
1.90
V
VDD3.0
2.70
3.60
V
Supply voltage
(Only for CXN1000-CAL and CXN1000-3DAL)
Input/Output Terminal Characteristics
(Temperature: –40 to +85°C)
This I/O pin characteristics is the CXD3251GL IC specifications used internally of the CXN1000.
Digital Terminals
Min.
Typ.
Max.
Unit
Input Voltage
VIL input logic level low
VDD3.0 = 3.0V
–0.4
0.8
0.7 × VDD3.0
VIH input logic level high
V
VDD3.0 + 0.4 V
Output Voltage
VOL output logic level low
(IO = 4.0mA)
VDD3.0 = 3.0V
—
—
0.2
V
VOH output logic level high
(IO = 4.0mA)
VDD3.0 = 3.0V
VDD3.0 – 0.2
—
—
V
Weak pull-up
–5
–1
0
µA
Weak pull-down
0
1
5
µA
I/O pad leakage current
–1
0
1
µA
CI input capacitance
2.5
—
10
pF
Input and Tristate Current
–5–
CXN1000
Input/Output Terminal Characteristics (continued)
USB Terminals
Min.
Typ.
Max.
Unit
VIL input logic level low
—
—
0.3 × VDD3.0
V
VIH input logic level high
0.7 × VDD3.0
—
—
V
GND < VIN < VDD3.0
–1
—
1
µA
CI input capacitance
2.5
—
10
pF
VOL input logic level low
0
—
0.2
V
VOH input logic level high
2.8
—
VDD3.0
V
Auxiliary DAC, 8-bit Resolution
Min.
Typ.
Max.
Unit
—
—
8
Bits
12.5
14.5
17
mV
Input Threshold
Input Leakage Current
Output Levels to Correctly Terminated USB Cable
Resolution
Average output step size
Output Voltage
Monotonic: 0.2 to VDD3.0 – 0.2V
Voltage range (IO = 0)
GND
—
VDD3.0
V
Current range
–10
—
0.1
mA
Minimum output voltage (IO = 100µA)
0
—
0.2
V
Maximum output voltage (IO = 10mA)
VDD3.0 – 0.3
—
VDD3.0
V
–1
—
1
µA
–220
—
120
mV
Integral non-linearity
–2
—
2
LSB
Starting time (50pF load)
—
—
10
µs
Setting time (50pF load)
—
—
5
µs
PD-RST Terminal
Min.
Typ.
Max.
Unit
VDD falling threshold
1.40
1.50
1.60
V
VDD rising threshold
1.50
1.60
1.70
V
Hysteresis
0.05
0.10
0.15
V
High impedance leakage current
Offset
–6–
CXN1000
Input/Output Terminal Characteristics (continued)
CE Terminal
Min.
Typ.
Max.
Unit
VIL input logic level low
—
—
0.2
V
VIH input logic level high
1.7
—
VDD3.0
V
IIL input logic level low
–0.15
—
0.15
µA
IIH input logic level high
–0.15
—
0.15
µA
Remark
Input Voltage
Input Current
Radio Characteristics
Transmitter
Condition
Min.
Typ.
Max.
Unit
Output power (Average)
N & ETC
–6
0
4
dBm
N & ETC
140
165
175
kHz
11110000 mod.
delta-f2 max N & ETC
115
140
kHz
1010 mod.
delta-f1 avg
Modulation characteristics
Initial carrier frequency
tolerance
Carrier frequency drift
Drift rate
N & ETC
10
75
kHz
DH1
N & ETC
12
25
kHz
DH3
N & ETC
12
40
kHz
DH5
N & ETC
15
40
kHz
DH1
N & ETC
8
20
kHz/
50µs
DH3
N & ETC
10
20
kHz/
50µs
DH5
N & ETC
12
20
kHz/
50µs
N & ETC
900
1000
kHz
|M-N| = 2
N & ETC
–40
–20
dBm
|M-N| ≥3
N & ETC
–50
–40
dBm
30M-1G
N & ETC
–65
–36
dBm
1G-12.75G
N & ETC
–55
–30
dBm
1.8G-1.9G
N & ETC
–75
–47
dBm
5.15G-5.3G
N & ETC
–75
–47
dBm
20dB bandwidth
Adjacent channel power
Out-of-band spurious
emissions
NTC: Normal Test Conditions +15 to +35°C, ETC: Extreme Test Conditions –40 to +85°C
–7–
CXN1000
Radio Characteristics (Continued)
Receiver
Condition
Sensitivity (single slot packets)
N & ETC
C/I performance
Blocking performance
Typ.
Max.
Unit
–85
–78
dBm
co-ch.
NTC
9
11
dB
1MHz
NTC
–2
0
dB
2MHz
NTC
–34
–30
dB
≥3MHz
NTC
–43
–40
dB
Image
NTC
–18
–9
dB
Image ± 1MHz
NTC
–23
–20
dB
30-2000M
NTC
(800M-1000M)
NTC
10
dBm
(1800M-1900M)
NTC
10
dBm
2000-2399M
NTC
–27
dBm
2498-3000M
NTC
–27
dBm
3G-12.75G
NTC
–10
dBm
NTC
–39
Inter modulation performance
Spurious emissions
Min.
–10
dBm
–30
N & ETC
–78
–57
dBm
1G-12.75G
N & ETC
–55
–47
dBm
2
5
dBm
–20
NTC
BER < 0.1%
dBm
30M-1G
Maximum input level
Remark
NTC: Normal Test Conditions +15 to +35°C, ETC: Extreme Test Conditions –40 to +85°C
Current Consumption
(Temperature: –40 to +85°C)
Mode
Average
Peak
Unit
Remark
SCO connection HV3 (1s interval sniff mode)
26
mA
SCO connection HV1 (Master or Slave)
53
mA
15.5
mA
ACL data transfer 720Kbps USB
53
mA
Master or Slave
ACL connection, Sniff Mode 40ms interval
4
mA
38.4Kbps BCSP
ACL connection, Sniff Mode 1.28s interval
0.5
mA
38.4Kbps BCSP
Parked Slave, 1.28s beacon interval
0.6
mA
38.4Kbps BCSP
Deep sleep mode
0.06
20
mA
38.4Kbps BCSP
Sleep mode
2.2
22
mA
115.2Kbps H4
(0dBm Tx)
57
68
mA
(Rx)
47
70
mA
ACL data transfer 115.2Kbps UART (Master)
Peak RF current during RF burst
–8–
Master or Slave
CXN1000
Marking Contents
1) CXN1000-3BAL
Sony logo
Product name
C X N 1 0 0 0
- 3 B A L
2 2 1 A 1 0 S
Shield case
Lot No.
Pin1 indication
(1mmφ)
Pin 1
• Sony logo: Fixed
• Product name: The string of alphanumerics "-3BAL" on the second line differs
according to the module contents.
• Lot No.: Control number, production location
2) Other than CXN1000-3BAL
Sony logo
Product name
C X N 1 0 0 0
- 3 A A L
Shield case
2 2 1 A 1 0 S
Lot No.
Pin 1
• Sony logo: Fixed
• Product name: The string of alphanumerics "-3AAL" on the second line differs
according to the module contents.
• Lot No.: Control number, production location
–9–
CXN1000
Unit: mm
11 ± 0.4
CXN1000 Package Outline
Pin 1
2.2 ± 0.1
11 ± 0.4
36 - φ0.7 ± 0.07
10
36
11
1 ± 0.05
(9)
1
19
1 ± 0.05
(9)
∗
∗ 0
1 –0.15
20
25
0.2 ± 0.05
28
0
1 –0.15
Note: ∗ Without the boss for connection/disconnection
– 10 –
CXN1000
Recommended Temperature Profile for Unleaded Reflow Soldering
250
Peak: 240 +5
0 ˚C
230˚C or more
2 to 6˚C/s
Temperature [˚C]
200
Pre heating zone
(3 to 6˚C/s)
180˚C
150
150˚C
90 ± 30 s
2 to 4˚C/s
100
20 ± 10 s
Soldering zone
50
Heating time
– 11 –
CXN1000
Radio Characteristics Measurement System Block Diagram (Application System Block Diagram)
System A
BT Module
Interface
Board
Spectrum
Analyzer
Power
Supply
[Measurement Item]
• Output power
• Out-of-Band spurious emissions
• Power density
PC
System B
BT Module
Interface
Board
Spectrum
Analyzer
BT Module
Interface
Board
[Measurement Item]
• Frequency range
• Adjacent channel power
Vector
Signal
Analyzer
BT Module
Interface
Board
PC
Vector Signal Analyzer:
Agilent 89640
or equivalent
Power
Supply
[Measurement Item]
• Modulation characteristics
• Initial carrier frequency tolerance
• Carrier frequency drift, Drift rate
• 20dB band width
PC
System D
Spectrum analyzer:
ROHDE&SCHWARZ FSEA20
or equivalent
Power
Supply
PC
System C
Spectrum analyzer:
Agilent E4407B
or equivalent
Signal
Generator
Signal Generator:
Agilent E4432B
or equivalent
Power
Supply
[Measurement Item]
• Sensitivity (single slot)
• Maximum input level
– 12 –
CXN1000
System E
(Interference)
BT Module
Interface
Board
Signal
Generator
Signal Generator:
Agilent E4432B
or equivalent
Signal
Generator
Signal Generator:
Agilent E4432B
or equivalent
Power
Supply
PC
[Measurement Item]
• C/I performance
(CW)
System F
BT Module
Interface
Board
Signal
Generator
Signal Generator:
Agilent 83712B
or equivalent
Signal
Generator
Signal Generator:
Agilent E4432B
or equivalent
Power
Supply
[Measurement Item]
• Blocking performance
PC
(Interference)
System G
Signal
Generator
Signal Generator:
Agilent 4432B
or equivalent
(CW)
BT Module
Interface
Board
PC
Signal
Generator
Signal Generator:
Agilent 83712B
or equivalent
Signal
Generator
Signal Generator:
Agilent 4432B
or equivalent
Power
Supply
[Measurement Item]
• Intermodulation performance
– 13 –
CXN1000
∗ For details of the contents below, see the specifications of the BlueCore 2-External (equivalent to the
CXD3251GL) made by CSR.
Software Stack
The CXN1000 features a 16-bit RISC microcontroller which runs a software stack complying with Bluetooth
specifications ver. 1.1.
The following are the three software stack options to integrate into the CXN1000.
Flash memory
1) HCI Stack
HCI
LM
LC
32K-byte RAM
Baseband
microcontroller
UART
Host
Host I/O
USB
Radio
PCM I/O
HCI Stack Configuration
The HCI stack enables the layers up to the host controller interface (HCI) to be executed by the on-module
RISC microcontroller. It is considered to be the most common stack configuration with general-purpose
capabilities. All layers above HCI are handled by the host processor.
– 14 –
CXN1000
2) RFCOMM Stack
Flash memory
RFCOMM
SDP
L2CAP
LM
LC
Baseband
microcontroller
32K-byte RAM
UART
Host I/O
Host
USB
Radio
PCM I/O
RFCOMM Stack Configuration
The RFCOMM stack enables the layers up to RFCOMM to be executed by the on-module RISC microcontroller.
Then, the amount of processing is reduced on the host processor.
3) Virtual Machine Stack
Flash memory
VM application software
RFCOMM
SDP
L2CAP
LM
LC
32K-byte RAM
Baseband
microcontroller
UART
Host
Host I/O
Radio
PCM I/O
Virtual Machine Stack Configuration
– 15 –
CXN1000
The Virtual Machine stack eliminates the need for a host processor. The applications and Bluetooth stack can
be run on the integrated RISC microprocessor using a application execution environment called Virtual
Machine (VM).
In order to develop applications, the BlueLabTM software development environment (SDK) and Casira
development kit supplied by CSR are required. Inquire for further details.
– 16 –
CXN1000
• External Interfaces
UART Interface
The UART interface makes it easy to communicate with other serial devices using the RS-232 standard∗1.
CXN1000
UART_TX 30
UART_RX 29
UART_RTS 31
UART_CTS 32
UART Pins
As shown in the figure above, four signals are used to execute the UART function. When the CXN1000 is
connected to another digital device, data is transmitted between the two devices using the UART_RX and
UART_TX signals. The remaining two low active signals, UART_CTS and UART_RTS, can be used for RS-232
hardware flow control. All the UART pins are configured as CMOS I/O pins. Their signal levels are 0V and VDD3.0.
The baud rate, packet format and other UART configuration parameters are set using PS Tool or other
BlueCore software.
Note: In order to communicate with UART at the maximum data rate using a standard PC, a serial port
adapter card with acceleration must be installed in the PC.
∗1 The RS-232 protocol is used, but the voltage level is from 0V to VDD3.0. (An RS-232 transceiver IC must
be externally attached.)
Parameter
Baud rate
Possible values
Minimum
Maximum
1200 baud (≤2% error)
9600 baud (≤1% error)
1.5M baud (≤1% error)
Flow control
RTS/CTS or none
Parity
None, odd or even
Number of stop bits
1 or 2
Bits per channel
8
UART Settings
– 17 –
CXN1000
With the UART interface, the CXN1000 can be reset as soon as a break signal is received. As shown in the
figure below, the break is identified by the continuous low logic level in the UART_RX pin. Resetting occurs if
tBRK is longer than the value defined by PSKEY_HOST_IO_UART_RESET_TIMEOUT (0x1A4) persistent store
key. The system can be initialized to a known status from the host using this function.
The CXN1000 can also send break characters that can be used for starting the host.
tBRK
UART_RX
Break Signal
The frequently used baud rates and the values of the PSKEY_UART_BAUD_RATE (0x204) persistent store
key linked to those rates are shown in the table below. These standard values are not necessarily required
conditions, and all baud rates within the range supported can be set by the persistent store key with the
following equation.
Baud Rate =
Baud rate
PSKEY_UART_BAUD_RATE
0.004096
Persistent store value
Error
Hex
Dec
1200
0x0005
5
1.73%
2400
0x000A
10
1.73%
4800
0x0014
20
1.73%
9600
0x0027
39
–0.82%
19200
0x004F
79
0.45%
38400
0x009D
157
–0.18%
57600
0x00EC
236
0.03%
76800
0x013B
315
0.14%
115200
0x01D8
472
0.03%
230400
0x03B0
944
0.03%
460800
0x075F
1887
–0.02%
921600
0x0EBF
3775
0.00%
1382400
0x161E
5662
–0.01%
Standard Baud Rates
– 18 –
CXN1000
USB Interface
The USB pins of the CXN1000 support a full speed (12Mbps) USB interface. They enable direct drive of the
USB cable, thereby obviating the need for an external USB transceiver. With this interface, the CXN1000 can
operate as a USB unit and respond to requests from a PC or other master host controller. The interface
supports both OHCI and UHCI standards. It also complies with Bluetooth specifications Ver.1.1 and part H2.
Although USB is a system that is capable of both master and slave operations, the CXN1000 supports USB
slave operations only.
– 19 –
CXN1000
Serial Peripheral Interface (SPI)
When data is sent or received through the SPI pins, the CXN1000 uses 16-bit data and 16-bit addresses.
Through these pins, data is transmitted and received while both the internal processor is operating and it has
stopped operating. Data is written or read one word at a time unless the auto increment function is used to
access blocks.
SPI_CLK
Write command
SPI_MOSI
C7
SPI_MISO
C6
Address
C0
A15
A14
Data
A0
T15
T14
D0
Don't care
Write Operation A
SPI_CSB
SPI_CLK
SPI_MOSI
Don't care
SPI_MISO XS
Write Operation B
– 20 –
XS
CXN1000
SPI_CLK
Read command
SPI_MOSI
C7
C6
Address
C0
A15
A14
Don't care
A0
Check word
SPI_MISO
Don't care
T15
T14
Data
T0
D15
D14
D0
Read Operation A
SPI_CSB
SPI_CLK
SPI_MOSI
SPI_MISO XS
Don't care
T15 to D0
Read Operation B
– 21 –
XS
CXN1000
PCM Interface
The PCM interface of the CXN1000 supports the continuous transmission and reception of PCM data using
hardware. This reduces the overhead of processors for wireless headset applications. The CXN1000 provides
a bidirectional digital audio interface that is connected directly to the baseband layer of the on-chip firmware.
The bidirectional digital audio interface does not pass the HCI protocol layer.
Data can be transmitted and received with one or more SCO connections using the hardware of the CXN1000.
The PCM interface supports up to three SCO connections at a time.
The CXN1000 can operate as the PCM interface master for generating an output clock of 128, 256 or 512kHz.
Alternatively, when it is set to serve as the PCM interface slave, it can operate using an input clock up to
2048kHz. The CXN1000 can support many different clock types including long frame sync, short frame sync
and GCI timings.
In terms of 8k per second sampling, the CXN1000 supports 13- or 16-bit linear, 8-bit µ-Law and 8-bit A-Law
companding sample formats. The PCM settings can be performed using the PSKEY_PCM_CONFIG (0x1B3)
persistent store key.
– 22 –
CXN1000
PCM Interface Master/Slave
When the CXN1000 is set as the PCM interface master, PCM_CLK and PCM_SYNC are generated.
CXN1000
PCM_OUT 23
PCM_IN 25
PCM_CLK 22
PCM_SYNC 24
128/256/512kHz
8kHz
PCM Interface Master
When the CXN1000 is configured as the PCM interface slave, PCM_CLK rates up to 2048kHz are accepted.
CXN1000
PCM_OUT 23
PCM_IN 25
PCM_CLK 22
PCM_SYNC 24
Up to 2048kHz
8kHz
PCM Interface Slave
– 23 –
CXN1000
PIO Port
The parallel input/output (PIO) port serves as the general-purpose I/O interface of the CXN1000. It consists of
nine programmable bidirectional I/O lines.
These programmable I/O lines can be accessed via either the installed application run by the CXN1000 or the
private channel or manufacturer-designated HCI commands.
PIO[3]/USB_WAKE_UP∗1
This multi-functional terminal is a programmable I/O line. Either the programmable I/O or USB_WAKE_UP
function can be selected with the PSKEY_USB_PIO_WAKEUP (0x2CF) persistent store key setting.
PIO[4]/USB_ON∗1
This multi-functional terminal is a programmable I/O line. It can also be used as the USB_ON function.
PIO[5]/USB_DETACH∗1
This multi-functional terminal is a programmable I/O line. It can also be used as the USB_DETACH function.
PIO[6]/CLK_REQ
This is a multi-functional terminal whose function is determined by the persistent store keys.
Using PSKEY_CLOCK_REQUEST_ENABLE (0x246), it can be set to low when the CXN1000 is in deep sleep
and to high when a clock is requested. If a shift in the timing in certain operation modes is to be avoided, the
clock must be supplied within 4ms from the PIO[6] rising edge.
PIO[7]
Programmable I/O terminal
PIO[8]
Programmable I/O terminal
PIO[9]
Programmable I/O terminal
PIO[10]
Programmable I/O terminal
PIO[11]
Programmable I/O terminal
∗1 The USB function can be mapped in the software to any of the PIO terminals.
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Sony Corporation