® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 2.0 Rev.2.1 Description Initial Issue Added Extended Grade Added PKG Type : 48-ball 6mm x 8mm TFBGA Revised ICC and ISB1 Added I grade Revised VTERM to VT1 and VT2 Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package available Deleted TSOLDER in ABSOLUTE MAXIMUN RATINGS Added packing type in ORDERING INFORMATION Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 0 Issue Date May.24.2006 Jan.22.2007 Jan.30.2007 Jun.23.2007 Apr.17.2009 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 FEATURES GENERAL DESCRIPTION Fast access time : 10/12/15/20/25ns Very low power consumption: Operating current: 180/160/140/80/70mA(MAX.) Standby current: 12mA(MAX. for 10/12/15ns) 5mA(MAX. for 20/25ns) 100µA( (MAX. for 20/25ns LL version) Single 3.3V power supply All inputs and outputs TTL compatible Fully static operation Tri-state output Data byte control : LB# (DQ0 ~ DQ7) UB# (DQ8 ~ DQ15) Data retention voltage : 2.0V (MIN.) Green package available Package : 44-pin 400 mil TSOP-II 48-ball 6mm x 8mm TFBGA The LY61L25616 is a 4,194,304-bit low power CMOS static random access memory organized as 262,144 words by 16 bits. It is fabricated using very high performance, high reliability CMOS technology. Its standby current is stable within the range of operating temperature. The LY61L25616 is well designed for low power application, and particularly well suited for battery back-up nonvolatile memory application. The LY61L25616 operates from a single power supply of 3.3V and all inputs and outputs are fully TTL compatible PRODUCT FAMILY Product Family LY61L25616 LY61L25616(E) LY61L25616(I) LY61L25616 LY61L25616(E) LY61L25616(I) LY61L25616(LL) LY61L25616(LLE) LY61L25616(LLI) Operating Temperature 0 ~ 70℃ -20 ~ 80℃ -40 ~ 85℃ 0 ~ 70℃ -20 ~ 80℃ -40 ~ 85℃ 0 ~ 70℃ -20 ~ 80℃ -40 ~ 85℃ Vcc Range Speed 3.15/3.0 ~ 3.6V 3.15/3.0 ~ 3.6V 3.15/3.0 ~ 3.6V 3.0 ~ 3.6V 3.0 ~ 3.6V 3.0 ~ 3.6V 3.0 ~ 3.6V 3.0 ~ 3.6V 3.0 ~ 3.6V 10/12/15ns 10/12/15ns 10/12/15ns 20/25ns 20/25ns 20/25ns 20/25ns 20/25ns 20/25ns Power Dissipation Standby(ISB1,MAX.) Operating(Icc,MAX.) 12mA 180/160/140mA 12mA 180/160/140mA 12mA 180/160/140mA 5mA 80/70mA 5mA 80/70mA 5mA 80/70mA 100µA 80/70mA 100µA 80/70mA 100µA 80/70mA Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 1 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 FUNCTIONAL BLOCK DIAGRAM PIN DESCRIPTION Vcc Vss A0-A17 DQ0-DQ7 Lower Byte DQ8-DQ15 Upper Byte CE# WE# OE# LB# UB# SYMBOL DESCRIPTION A0 - A17 Address Inputs DQ0 – DQ15 Data Inputs/Outputs DECODER I/O DATA CIRCUIT 256Kx16 MEMORY ARRAY CE# Chip Enable Input WE# Write Enable Input OE# Output Enable Input LB# Lower Byte Control UB# Upper Byte Control VCC Power Supply VSS Ground COLUMN I/O CONTROL CIRCUIT Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 2 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 PIN CONFIGURATION A4 1 44 A5 A3 2 43 A6 A2 3 42 A7 A1 4 41 OE# A0 5 40 UB# 6 39 LB# 7 38 DQ15 DQ1 8 37 DQ14 DQ2 9 36 DQ13 DQ3 10 35 DQ12 Vcc 11 34 Vss Vss 12 33 Vcc DQ4 13 32 DQ11 DQ5 14 31 DQ10 DQ6 15 30 DQ7 16 29 WE# 17 28 NC A17 18 27 A8 A16 19 26 A9 A15 20 25 A14 21 A13 22 LY61L25616 CE# DQ0 A LB# OE# A0 A1 B DQ8 UB# A3 A4 CE# DQ0 DQ9 C DQ9 DQ10 A5 A6 DQ1 DQ2 DQ8 D Vss DQ11 A17 A7 DQ3 Vcc E Vcc DQ12 NC A16 DQ4 Vss F DQ14 DQ13 A14 A15 DQ5 DQ6 A10 G DQ15 NC A12 A13 WE# DQ7 24 A11 H A10 23 A12 NC A8 A9 1 2 3 4 TFBGA TSOP II A2 NC A11 NC 5 6 ABSOLUTE MAXIMUN RATINGS* PARAMETER Voltage on VCC relative to VSS Voltage on any other pin relative to VSS Operating Temperature Storage Temperature Power Dissipation DC Output Current SYMBOL VT1 VT2 TA TSTG PD IOUT RATING -0.5 to 4.6 -0.5 to VCC+0.5 0 to 70(C grade) -20 to 80(E grade) -40 to 85(I grade) -65 to 150 1 50 UNIT V V ℃ ℃ W mA *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 3 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 TRUTH TABLE MODE CE# OE# H L L L L L L L L X H X L L L X X X Standby Output Disable Read Write Note: WE# LB# X H X H H H L L L X X H L H L L H L UB# X X H H L L H L L I/O OPERATION DQ0-DQ7 DQ8-DQ15 High – Z High – Z High – Z High – Z High – Z High – Z DOUT High – Z High – Z DOUT DOUT DOUT DIN High – Z High – Z DIN DIN DIN SUPPLY CURRENT ISB1 ICC ICC ICC H = VIH, L = VIL, X = Don't care. DC ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL Supply Voltage VCC Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage VIH *2 VIL ILI TEST CONDITION 10/12 15/20/25 *1 ILO VOH VOL Average Operating Power supply Current ICC Standby Power Supply Current ISB1 VCC ≧ VIN ≧ VSS VCC ≧ VOUT ≧ VSS, Output Disabled IOH = -4mA IOL = 8mA 10 12 15 20 25 10/12/15 CE# ≧VCC - 0.2V, 20/25 Others at 0.2V or VCC - 0.2V 20/25LL Cycle time = Min. CE# = VIL , II/O = 0mA Other pins at VIL or VIH MIN. 3.15 3.0 2.2 - 0.3 -1 *4 MAX. 3.6 3.6 VCC+0.3 0.6 1 UNIT V V V V µA -1 - 1 µA 2.4 - 50 45 0.5 20 0.4 180 160 140 80 70 12 5 5* 6 100* V V mA mA mA mA mA mA mA µA Notes: 1. VIH(max) = VCC + 3.0V for pulse width less than 10ns. 2. VIL(min) = VSS - 3.0V for pulse width less than 10ns. 3. Over/Undershoot specifications are characterized, not 100% tested. 4. Typical values are included for reference only and are not guaranteed or tested. Typical valued are measured at VCC = VCC(TYP.) and TA = 25℃ 5. 1mA for special request 6. 50µA for special request Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 4 TYP. 3.3 3.3 - ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 CAPACITANCE (TA = 25℃, f = 1.0MHz) PARAMETER Input Capacitance Input/Output Capacitance SYMBOL CIN CI/O MIN. - MAX 8 10 UNIT pF pF Note : These parameters are guaranteed by device characterization, but not production tested. AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Levels Output Load 0.2V to VCC - 0.2V 3ns 1.5V CL = 30pF + 1TTL, IOH/IOL = -8mA/16mA AC ELECTRICAL CHARACTERISTICS (1) READ CYCLE PARAMETER Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Chip Enable to Output in Low-Z Output Enable to Output in Low-Z Chip Disable to Output in High-Z Output Disable to Output in High-Z Output Hold from Address Change LB#, UB# Access Time LB#, UB# to High-Z Output LB#, UB# to Low-Z Output SYM. LY61L25616 LY61L25616 LY61L25616 LY61L25616 LY61L25616 UNIT -10 -12 -15 -20 -25 tRC tAA tACE tOE tCLZ* tOLZ* tCHZ* tOHZ* tOH tBA tBHZ* tBLZ* MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. 10 12 15 20 25 ns 10 12 15 20 25 ns 10 12 15 20 25 ns 5 6 7 8 9 ns 2 3 4 4 4 ns 0 0 0 0 0 ns 5 6 7 8 9 ns 5 6 7 8 9 ns 3 3 3 3 3 ns 5 6 7 8 9 ns 5 6 7 8 9 ns 2 3 4 4 4 ns SYM. LY61L25616 LY61L25616 LY61L25616 LY61L25616 LY61L25616 UNIT -10 -12 -15 -20 -25 tWC tAW tCW tAS tWP tWR tDW tDH tOW* tWHZ* tBW MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. 10 12 15 20 25 8 10 12 16 20 8 10 12 16 20 0 0 0 0 0 8 9 10 11 12 0 0 0 0 0 6 7 8 9 10 0 0 0 0 0 2 3 4 5 6 6 7 8 9 10 8 10 12 16 20 - (2) WRITE CYCLE PARAMETER Write Cycle Time Address Valid to End of Write Chip Enable to End of Write Address Set-up Time Write Pulse Width Write Recovery Time Data to Write Time Overlap Data Hold from End of Write Time Output Active from End of Write Write to Output in High-Z LB#, UB# Valid to End of Write *These parameters are guaranteed by device characterization, but not production tested. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 5 ns ns ns ns ns ns ns ns ns ns ns ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 TIMING WAVEFORMS READ CYCLE 1 (Address Controlled) (1,2) tRC Address tAA Dout tOH Previous Data Valid Data Valid READ CYCLE 2 (CE# and OE# Controlled) (1,3,4,5) tRC Address tAA CE# tACE LB#,UB# tBA OE# tOE tOH tOHZ tBHZ tCHZ tOLZ tBLZ tCLZ Dout High-Z Data Valid High-Z Notes : 1.WE#is high for read cycle. 2.Device is continuously selected OE# = low, CE# = low, LB# or UB# = low. 3.Address must be valid prior to or coincident with CE# = low, LB# or UB# = low transition; otherwise tAA is the limiting parameter. 4.tCLZ, tBLZ, tOLZ, tCHZ, tBHZ and tOHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state. 5.At any given temperature and voltage condition, tCHZ is less than tCLZ , tBHZ is less than tBLZ, tOHZ is less than tOLZ. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 6 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 WRITE CYCLE 1 (WE# Controlled) (1,2,3,5,6) tWC Address tAW CE# tCW tBW LB#,UB# tAS tWP tWR WE# tWHZ Dout TOW High-Z (4) tDW Din (4) tDH Data Valid WRITE CYCLE 2 (CE# Controlled) (1,2,5,6) tWC Address tAW CE# tAS tWR tCW tBW LB#,UB# tWP WE# tWHZ Dout High-Z (4) tDW tDH Data Valid Din Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 7 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 WRITE CYCLE 3 (LB#,UB# Controlled) (1,2,5,6) tWC Address tAW tWR CE# tAS tCW tBW LB#,UB# tWP WE# tWHZ Dout High-Z (4) tDW tDH Data Valid Din Notes : 1.WE#,CE#, LB#, UB# must be high during all address transitions. 2.A write occurs during the overlap of a low CE#, low WE#, LB# or UB# = low. 3.During a WE# controlled write cycle with OE# low, tWP must be greater than tWHZ + tDW to allow the drivers to turn off and data to be placed on the bus. 4.During this period, I/O pins are in the output state, and input signals must not be applied. 5.If the CE#, LB#, UB# low transition occurs simultaneously with or after WE# low transition, the outputs remain in a high impedance state. 6.tOW and tWHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 8 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 DATA RETENTION CHARACTERISTICS PARAMETER SYMBOL TEST CONDITION VCC for Data Retention VDR CE# ≧ VCC - 0.2V 10/12/15 VCC = 2.0V CE# ≧ VCC - 0.2V Data Retention Current IDR 20/25 others at 0.2V or VCC - 0.2V 20/25LL See Data Retention Chip Disable to Data tCDR Waveforms (below) Retention Time Recovery Time tR tRC* = Read Cycle Time MIN. 2.0 - TYP. 0.5 10 MAX. 3.6 1 50 UNIT V mA mA µA 0 - - ns tRC* - - ns DATA RETENTION WAVEFORM VDR ≧ 2.0V Vcc Vcc(min.) Vcc(min.) tCDR CE# VIH tR CE# ≧ Vcc-0.2V VIH Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 9 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 PACKAGE OUTLINE DIMENSION θ 44-pin 400mil TSOP-Ⅱ Package Outline Dimension SYMBOLS A A1 A2 b c D E E1 e L ZD y Θ DIMENSIONS IN MILLMETERS MIN. NOM. MAX. 1.20 0.05 0.10 0.15 0.95 1.00 1.05 0.30 0.45 0.12 0.21 18.212 18.415 18.618 11.506 11.760 12.014 9.957 10.160 10.363 0.800 0.40 0.50 0.60 0.805 0.076 o o o 3 6 0 DIMENSIONS IN MILS MIN. NOM. MAX. 47.2 2.0 3.9 5.9 37.4 39.4 41.3 11.8 17.7 4.7 8.3 717 725 733 453 463 473 392 400 408 31.5 15.7 19.7 23.6 31.7 3 o o o 0 3 6 Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 10 ® LY61L25616 Rev. 2.1 256K X 16 BIT HIGH SPEED CMOS SRAM 48-ball 6mm × 8mm TFBGA Package Outline Dimension Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 11 ® LY61L25616 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.1 ORDERING INFORMATION LY61L25616 U V - WW XX Y Z Z : Packing Type Blank : Tube or Tray T : Tape Reel Y : Temperature Range Blank : (Commercial) 0°C ~ 70°C E : (Extended) -20°C ~ +80°C I : (Industrial) -40°C ~ +85°C XX : Power Type LL : Low power WW : Access Time(Speed) V : Lead Information L : Green Package U : Package Type M : 44-pin 400 mil TSOP-II G : 48-ball 6 mm x 8 mm TFBGA Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 12 ® LY61L25616 Rev. 2.1 256K X 16 BIT HIGH SPEED CMOS SRAM THIS PAGE IS LEFT BLANK INTENTIONALLY. Lyontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan. TEL: 886-3-6668838 FAX: 886-3-6668836 13