TE MS580305BA01-50 High resolution module, 30cm Datasheet

MS5803-05BA
Miniature Altimeter and Diving Module
SPECIFICATIONS
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High resolution module, 30cm
Fast conversion down to 1 ms
Low power, 1 µA (standby < 0.15 µA)
Integrated digital pressure sensor (24 bit ΔΣ ADC)
Supply voltage 1.8 to 3.6 V
Operating range: 0 to 5 bar, -40 to +85 °C
I2C and SPI interface (Mode 0,3)
No external components (Internal oscillator)
Excellent long term stability
Hermetically sealable for outdoor devices
The MS5803-05BA is a new generation of high resolution
altimeter sensors from MEAS Switzerland with SPI and I2C bus
interface. It is optimized for depth meters and altimeters with an
altitude resolution of 30 cm. The sensor module includes a high
linearity pressure sensor and an ultra low power 24 bit ΔΣ ADC
with internal factory calibrated coefficients. It provides a precise
digital 24 Bit pressure and temperature value and different
operation modes that allow the user to optimize for conversion
speed and current consumption. A high resolution temperature
output allows the implementation of an altimeter/thermometer
function without any additional sensor. The MS5803-05BA can be
interfaced to virtually any microcontroller. The communication
protocol is simple, without the need of programming internal
registers in the device. The gel protection and antimagnetic
stainless steel cap allows the use in 100m waterproof watches.
This new sensor module generation is based on leading MEMS
technology and latest benefits from MEAS Switzerland proven
experience and know-how in high volume manufacturing of
altimeter modules, which have been widely used for over a
decade. The sensing principle employed leads to very low
hysteresis and high stability of both pressure and temperature
signal.
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
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MS5803-05BA
Miniature Altimeter and Diving Module
FEATURES
FIELD OF APPLICATION
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Dual Mobile altimeter / depth meter systems
Adventure or multi-mode watches
Diving computers
TECHNICAL DATA
Sensor Performances (VDD = 3 V)
Pressure
Min
Range
Typ
0
ADC
Resolution (1), Altimeter
mode
Accuracy 20°C
300 to 1100 mbar (2)
Accuracy 0°C to +50°C,
0 to 5 bar (2)
Max
Unit
5
bar
24
0.195 / 0.126 / 0.081 /
0.054 / 0.036
mbar
-1.5
+1.5
mbar
-100
100
mbar
Long term stability
0.5 / 1.1 / 2.1 / 4.1 /
8.22
+/-1
Temperature
Min
Range
-40
Response time
bit
Resolution
Typ
ms
mbar/yr
Max
Unit
+85
°C
<0.01
Accuracy
-2.5
°C
+2.5
°C
Notes: (1) Oversampling Ratio: 256 / 512 / 1024 / 2048 / 4096
(2) With autozero at one pressure point
FUNCTIONAL BLOCK DIAGRAM
VDD
PS
Meas. MUX
SENSOR
CSB
Digital
Interface
+IN
-IN
PGA
ADC
Sensor
Interface IC
SDI/SDA
SDO
dig.
Filter
SCLK
Memory
(PROM)
128 bits
SGND
GND
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
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MS5803-05BA
Miniature Altimeter and Diving Module
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Storage temperature
Overpressure
Maximum Soldering
Temperature
Symbol
VDD
TS
Pmax
Conditions
Tmax
Min.
-0.3
-40
ISO6425
Max
+3.6
+125
30
Unit
V
°C
bar
40 sec max
250
°C
-4
+4
kV
-100
+100
mA
Max
3.6
+85
Unit
V
°C
Human Body
Model
JEDEC standard
No 78
ESD rating
Latch up
Typ.
ELECTRICAL CHARACTERISTICS
Parameter
Operating Supply voltage
Operating Temperature
Supply current
(1 sample per sec.)
Symbol
VDD
T
IDD
Peak supply current
Standby supply current
VDD Capacitor
Conditions
Min.
1.8
-40
OSR
4096
2048
1024
512
256
during conversion
at 25°c
From VDD to GND
Typ.
3.0
+25
12.5
6.3
3.2
1.7
0.9
1.4
0.02
µA
0.14
100
mA
µA
nF
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Output Word
Conversion time
SENSOR SOLUTIONS ///MS5803-05BA
Symbol
tc
Conditions
OSR
4096
2048
1024
512
256
09/2015
Min.
Typ.
24
Max
7.40
3.72
1.88
0.95
0.48
8.22
4.13
2.08
1.06
0.54
9.04
4.54
2.28
1.17
0.60
Unit
bit
ms
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MS5803-05BA
Miniature Altimeter and Diving Module
PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Operating Pressure Range
Absolute Accuracy, autozero at
one pressure point
300…1100 mbar
Absolute Accuracy, autozero at
one pressure point
0…5000 mbar
Maximum error with supply
voltage (1)
Long-term stability
Conditions
Prange
Full Accuracy
at 20°C, 300..1100 mbar
at 0..50°C, 300..1100 mbar
at -40..85°C, 300..1100 mbar
at 20°C, 0..5000 mbar
at 0..50°C, 0..5000 mbar
at -40..85°C, 0..5000 mbar
Min.
0
-1.5
-4.0
-15.0
-80
-100
-120
VDD = 1.8 V … 3.6 V
OSR
4096
2048
1024
512
256
Resolution RMS
Typ.
Max
5
+1.5
+4.0
+15.0
+80
+100
+120
Unit
bar
mbar
mbar
+/-5
mbar
+/-1
mbar/yr
0.036
0.054
0.081
0.126
0.195
mbar
(1) With autozero at 3V point
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Absolute Accuracy
Maximum error with supply
voltage (1)
Resolution RMS
Conditions
0..85°C
-40..85°C
Min.
-2.5
-5.0
VDD = 1.8 V … 3.6 V
OSR
4096
2048
1024
512
256
Typ.
Max
+2.5
+5.0
Unit
°C
+/-0.5
°C
0.002
0.003
0.005
0.008
0.012
°C
(1) With autozero at 3V point
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MS5803-05BA
Miniature Altimeter and Diving Module
PERFORMANCE SPECIFICATIONS (CONTINUED)
DIGITAL INPUTS (PS, CSB, DIN, SCLK, SDA, SCL)
Parameter
Serial data clock
Serial data clock
Input high voltage
Input low voltage
Input leakage current
Symbol
SCLK
SCL
VIH
VIL
Ileak25°C
Ileak85°C
Conditions
SPI protocol
I2C protocol
Pins CSB
Min.
Typ.
2
80% VDD
0% VDD
at 25°c
Max
20
400
100% VDD
20% VDD
0.15
Unit
MHz
kHz
V
V
µA
PRESSURE OUTPUTS (DOUT, SDA, SCL)
Parameter
Output high voltage
Output low voltage
Load capacitance
SENSOR SOLUTIONS ///MS5803-05BA
Symbol
VOH
VOL
CLOAD
Conditions
Isource = 0.6 mA
Isink = 0.6 mA
Min.
80% VDD
0% VDD
Typ.
16
09/2015
Max
100% VDD
20% VDD
Unit
V
V
pF
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MS5803-05BA
Miniature Altimeter and Diving Module
PERFORMANCE CHARACTERISTICS
PRESSURE ERROR VS PRESSURE AND TEMPERATURE
Pressure accuracy vs temperature
Typical
Absolute pressure accuracy with 2nd order compensation
Typical
80.0
80.0
40.0
85
25
20.0
-25
0.0
-40
-20.0
Pressure error [mbar]
Pressure error [mbar]
60.0
40.0
6000mbar
2nd order
0.0
700mbar
2nd order
6000mbar
1st order
-40.0
-40.0
700mbar
1st order
-80.0
-60.0
-120.0
-80.0
-40
0
1000
2000
3000
Pressure [mbar]
4000
-20
0
5000
20
40
60
80
Temperature [°C]
TEMPERATURE ERROR VS TEMPERATURE
Temperature accuracy vs temperature
Typical
Temperature error [°C]
12.0
10.0
8.0
6.0
1000mbar
2nd order
4.0
1000mbar
1st order
2.0
0.0
-2.0
-40
-20
0
20
40
60
80
Temperature [°C]
PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY
Temperature error vs Supply voltage at 25°C
Typical
Pressure error vs Supply voltage at 25°C
Typical
0.8
2.0
0.6
0.4
1.0
0.5
1000 mbar
0.0
-0.5
-1.0
-1.5
-2.0
Temperature error [°C]
Pressure error [mbar]
1.5
0.2
1000 mbar
0.0
-0.2
-0.4
-0.6
-0.8
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
1.8
2.0
Supply voltage [V]
SENSOR SOLUTIONS ///MS5803-05BA
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
Supply voltage [V]
09/2015
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MS5803-05BA
Miniature Altimeter and Diving Module
FUNCTIONAL DESCRIPTION
VDD
PS
Meas. MUX
CSB
Digital
Interface
+IN
SENSOR
PGA
-IN
ADC
SDO
dig.
Filter
Sensor
Interface IC
SDI/SDA
SCLK
Memory
(PROM)
128 bits
SGND
GND
Figure 1: Block diagram of MS5803-05BA
GENERAL
The MS5803-05BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS580305BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a 24bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 128bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the microcontroller
software and used in the program converting D1 and D2 into compensated pressure and temperature values.
The 2 coefficients W0 and W7 are for factory configuration and CRC.
SERIAL INTERFACE
The MS5803-05BA has built in two types of serial interfaces: SPI and I2C. Pulling the Protocol Select pin PS to low
selects the SPI protocol, pulling PS to high activates the I2C bus protocol.
Pin PS
Mode
Pins used
High
Low
I2 C
SPI
SDA, SCL, CSB
SDI, SDO, SCLK, CSB
SPI MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In
the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor responds
on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the interface, so that
other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the
end of the command execution (for example end of conversion). The best noise performance from the module is
obtained when the SPI bus is quiet and without communication to other devices during the ADC conversion in
progress.
SENSOR SOLUTIONS ///MS5803-05BA
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MS5803-05BA
Miniature Altimeter and Diving Module
I2C MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta). The
sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses
only 2 signal lines and does not require a chip select, which can be favourable to reduce board space. In I 2C-Mode
the complement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to use two sensors
with two different addresses on the I2C bus. The pin CSB shall be connected to VDD or GND (do not leave
unconnected!).
Pin CSB
Address (7 bits)
High
Low
0x76 (1110110 b)
0x77 (1110111 b)
COMMANDS
The MS5803-05BA has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will
return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the
PROM read command using the a2, a1 and a0 bits.
Bit number
Bit name
Command
Reset
Convert D1 (OSR=256)
Convert D1 (OSR=512)
Convert D1 (OSR=1024)
Convert D1 (OSR=2048)
Convert D1 (OSR=4096)
Convert D2 (OSR=256)
Convert D2 (OSR=512)
Convert D2 (OSR=1024)
Convert D2 (OSR=2048)
Convert D2 (OSR=4096)
ADC Read
PROM Read
Command byte
0
1
2
PR
COV M
3
Typ
4
5
6
7
Ad2/ Ad1/ Ad0/ Stop
Os2 Os1 Os0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
1
1
1
1
1
0
0
1
0
0
0
0
1
0
0
0
0
1
0
Ad2
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
hex value
1
0
0
1
1
0
0
0
1
1
0
0
Ad1
1
0
1
0
1
0
0
1
0
1
0
0
Ad0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x1E
0x40
0x42
0x44
0x46
0x48
0x50
0x52
0x54
0x56
0x58
0x00
0xA0 to
0xAE
Figure 2: Command structure
SENSOR SOLUTIONS ///MS5803-05BA
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MS5803-05BA
Miniature Altimeter and Diving Module
PRESSURE AND TEMPERATURE CALCULATION
Start
Maximum values for calculation results:
PMIN = 0mbar P MAX = 6000mbar
TMIN = -40°C T MAX = 85°C TREF = 20°C
Read
calibration
data
(factory
calibrated)
PROMof W1 to W4)
Convert
calibration
data
into
coefficients
(see from
bit pattern
[1]
Value
Variable
Description | Equation
Recommended
variable type
Size
[bit]
min
max
Example /
Typical
C1
Pressure sensitivity | SENS T1
unsigned int 16
16
0
65535
32428
C2
Pressure offset | OFF T1
unsigned int 16
16
0
65535
28100
C3
Temperature coefficient of pressure sensitivity | TCS
unsigned int 16
16
0
65535
44250
C4
Temperature coefficient of pressure offset | TCO
unsigned int 16
16
0
65535
20003
C5
Reference temperature | T REF
unsigned int 16
16
0
65535
32747
C6
Temperature coefficient of the temperature | TEMPSENS
unsigned int 16
16
0
65535
28266
Read
digital
pressure
and
temperature
data
Read
digital
pressure
and
temperature
data
D1
Digital pressure value
unsigned int 32
24
0
16777216
5251266
D2
Digital temperature value
unsigned int 32
24
0
16777216
8383686
signed int 32
25
-16776960
16777216
454
signed int 32
41
-4000
8500
Calculate temperature
dT
Difference between actual and reference temperature
8
dT = D2 - T REF = D2 - C5 * 2
TEMP
Actual temperature (-40…85°C with 0.01°C resolution)
23
TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 2
[2]
2001
= 20.01 °C
Calculate
temperature
compensated
pressure
Calculate
temperature
compensated
pressure
[3]
OFF
Offset at actual temperature
18
5
OFF = OFFT1 + TCO * dT = C2 * 2 + (C4 * dT ) / 2
SENS
P
signed int 64
41
-34358689800
51538821120
7366530192
Sensitivity at actual temperature
17
7
SENS = SENST1 + TCS * dT = C1 * 2 + (C3 * dT ) / 2
signed int 64
41
-8589672450
17179607040
4250559765
Temperature compensated pressure (0…6000mbar with
0.03mbar resolution)
21
15
P = D1 * SENS - OFF = (D1 * SENS / 2 - OFF) / 2
signed int 32
58
0
600000
[4]
100002
= 1100.02 mbar
Display pressure and temperature value
Notes
[1]
[2]
[3]
[4]
Maximal size of intermediate result during evaluation of variable
min and max have to be defined
min and max have to be defined
min and max have to be defined
Figure 2: Flow chart for pressure and temperature reading and software compensation.
SENSOR SOLUTIONS ///MS5803-05BA
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MS5803-05BA
Miniature Altimeter and Diving Module
SECOND ORDER TEMPERATURE COMPENSATION
No
Yes
TEMP<20°C
Low temperature
Low temperature
High temperature
T2 = 3  dT / 2
2
33
T2 = 0
OFF2 = 0
SENS2 = 0
OFF2 = 3  (TEMP – 2000)2 / 23
2
3
SENS2 = 7  (TEMP – 2000) / 2
Yes
No
TEMP<-15°C
Low temperature
Very low temperature
SENS2 = SENS2 + 3  (TEMP + 1500)2
Calculate pressure and temperature
TEMP = TEMP - T2
OFF = OFF - OFF2
SENS = SENS - SENS2
Figure 3: Flow chart for pressure and temperature to the optimum accuracy.
SENSOR SOLUTIONS ///MS5803-05BA
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MS5803-05BA
Miniature Altimeter and Diving Module
SPI INTERFACE
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into
the internal register. It can be also used to reset the device ROM from an unknown condition
0
1
2
3
4
5
6
7
SCLK
CSB
SDI
2.8ms RELOAD
SDO
PS
Figure 5: Reset command sequence SPI mode 0
0
1
2
3
4
5
6
7
SCLK
CSB
SDI
2.8ms RELOAD
SDO
PS
Figure 6: Reset command sequence SPI mode 3
SENSOR SOLUTIONS ///MS5803-05BA
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MS5803-05BA
Miniature Altimeter and Diving Module
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not
executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result.
If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final
result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect
result as well.
0
1
2
3
4
5
6
7
SCLK
CSB
SDI
8.22ms ADC CONVERSION
SDO
PS
Figure 7: Conversion out sequence, Typ=d1, OSR = 4096
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
27
28
29
30
31
SCLK
CSB
SDI
READING 24BIT ADC RESULT MSB FIRST
SDO
PS
Figure 8: ADC Read sequence
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the calibration
PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total memory of 128
bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and address 7 contains
the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB
first.
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
SCLK
CSB
SDI
READING 16BIT PROM VALUE MSB FIRST
SDO
PS
Figure 9: PROM Read sequence, address = 011 (Coefficient 3).
SENSOR SOLUTIONS ///MS5803-05BA
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MS5803-05BA
Miniature Altimeter and Diving Module
I2C INTERFACE
COMMANDS
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5803-05BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does not
have a microcontroller inside, the commands for I2C and SPI are quite similar.
RESET SEQUENCE
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by
the SDA being blocked by the module in the acknowledge state. The only way to get the MS5803-05BA to function
is to send several SCLKs followed by a reset sequence or to repeat power on reset.
1 1 1 0 1 1 CSB 0 0 0 0 0 1 1 1 1 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 10: I2C Reset Command
CONVERSION SEQUENCE
A conversion can be started by sending the command to MS5803-05BA. When command is sent to the system it
stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read
command, when an acknowledge appears from the MS5803-05BA, 24 SCLK cycles may be sent to receive all
result bits. Every 8 bit the system waits for an acknowledge signal.
1 1 1 0 1 1 CSB 0 0 0 1 0 0 1 0 0 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 13: I2C Command to initiate a pressure conversion (OSR=4096, typ=D1)
1 1 1 0 1 1 CSB 0 0 0 0 0 0 0 0 0 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 14: I2C ADC read sequence
1 1 1 0 1 1 CSB 1 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0
Device Address
data
data
data
S
Device Address
R A
Data 23-16
A
Data 8 - 15
A
Data 7 - 0
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 15: I2C answer from MS5803-05BA
SENSOR SOLUTIONS ///MS5803-05BA
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MS5803-05BA
Miniature Altimeter and Diving Module
PROM READ SEQUENCE
The PROM Read command consists of two parts. First command sets up the system into PROM read mode. The
second part gets the data from the system.
S
1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1
Device Address
command
Device Address
W A
cmd byte
From Master
From Slave
S = Start Condition
P = Stop Condition
1 0
0
A P
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 11: I2C Command to read memory address= 011 (Coefficient 3)
1 1 1 0 1 1 CSB 1 0 1 1 0 0 X X X X 0 X X X X X X X X 0
Device Address
data
data
S
Device Address
R A
Memory bit 15 - 8
A
Memory bit 7 - 0
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 12: I2C answer from MS5803-05BA
CYCLIC REDUNDANCY CHECK (CRC)
MS5803-05BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data validity
in memory. The application note AN520 describes in detail CRC-4 code used.
A
d
d
0
1
2
3
4
5
6
7
D
B
1
5
D
B
1
4
D
B
1
3
D
B
1
2
D
B
1
1
D
D D D D D D D D D D
B
B B B B B B B B B B
1
9 8 7 6 5 4 3 2 1 0
0
16 bit reserved for manufacturer
Coefficient 1 (16 bit unsigned)
Coefficient 2 (16 bit unsigned)
Coefficient 3 (16 bit unsigned)
Coefficient 4 (16 bit unsigned)
Coefficient 5 (16 bit unsigned)
Coefficient 6 (16 bit unsigned)
CRC
Figure 16: Memory PROM mapping
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
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MS5803-05BA
Miniature Altimeter and Diving Module
APPLICATION CIRCUIT
The MS5803-05BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
It is designed for low-voltage systems with a supply voltage of 3 V.
MS5803-05BA
MS5803-05BA
Figure 17: Typical application circuit with SPI / I2C protocol communication
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
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MS5803-05BA
Miniature Altimeter and Diving Module
PACKAGE OUTLINE AND PIN CONFIGURATION
5
4
6
3
7
2
8
1
TOP view
8
1
7
2
6
5
3
4
Pin
Name
Type
Function
1
SCLK
I
Serial data clock
2
GND
G
Ground
3
CSB
I
Chip Select (active low)
4
NC
NC
5
VDD
P
Positive supply voltage
6
PS
I
Communication protocol select
SPI / I2C
7
SDI/SDA
I
Serial data input
8
SDO
O
Serial data output
-
Figure 17: MS5803-05BA package outlines, pin configuration and description
Notes:
(1) Dimensions in mm
(2) General tolerance ±0.1
(3) Cap centering ± 0.15 from center of the ceramic
RECOMMENDED PAD LAYOUT
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
Page 16
MS5803-05BA
Miniature Altimeter and Diving Module
SHIPPING PACKAGE
Tube
Tape & reel
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
Page 17
MS5803-05BA
Miniature Altimeter and Diving Module
MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering issues.
MOUNTING
The MS5803-05BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It
is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for
applications in watches and other special devices.
SEALING WITH O-RINGS
In products like outdoor watches the electronics must be protected against direct water or humidity. For those
products the MS5803-05BA provides the possibility to seal with an O-ring. The protective cap of the MS5803-05BA
is made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5803-05BA is filled
with silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer
diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical direction.
CLEANING
The MS5803-05BA has been manufactured under cleanroom conditions. It is therefore recommended to assemble
the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the
sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of
type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore essential
to ground machines and personnel properly during assembly and handling of the device. The MS5803-05BA is
shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of
the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor must
be placed as close as possible to the MS5803-05BA VDD pin. This capacitor will stabilize the power supply during
data conversion and thus, provide the highest possible accuracy.
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
Page 18
MS5803-05BA
Miniature Altimeter and Diving Module
ORDERING INFORMATION
Part Number / Art. Number
MS580305BA01-00
MS580305BA01-50
Product
MS5803-05BA Miniature Altimeter and Diving Module
MS5803-05BA Miniature Altimeter and Diving Module T&R
Delivery Form
Tube
Tape& reel TOP-UP
NORTH AMERICA
EUROPE
ASIA
Measurement Specialties, Inc.,
a TE Connectivity Company
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
e-mail: [email protected]
Website: www.meas-spec.com
Measurement Specialties (Europe), Ltd.,
a TE Connectivity Company
Switzerland Sàrl
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: + 41 32 847 9569
e-mail: [email protected]
Website: www.meas-spec.com
Measurement Specialties (China), Ltd.,
a TE Connectivity Company
No. 26 Langshan Road
Shenzhen High-Tech Park (North) Nanshan
District, Shenzhen, 518057 China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
e-mail: [email protected]
Website: www.meas-spec.com
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Measurement Specialties, Inc., a TE Connectivity company.
Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein
might be trademarks of their respective owners.
The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes
no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard
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of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application.
© 2015
TE Connectivity Ltd. family of companies
All Rights Reserved.
DA5803-05BA_007
000058031628 ECN1702
SENSOR SOLUTIONS ///MS5803-05BA
09/2015
Page 19
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