Isolated Half-Bridge Gate Driver with Integrated Isolated High-Side Supply ADuM6132 FEATURES GENERAL DESCRIPTION isoPower integrated isolated high-side supply 275 mW isolated dc-to-dc converter 200 mA output sink current, 200 mA output source current High common-mode transient immunity: >50 kV/μs Wide-body 16-lead SOIC package Safety and regulatory approvals (pending) UL recognition 3750 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice #5A CSA/IEC 60950-1, 400 V rms VDE certificate of conformity DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 560 V peak The ADuM61321 is an isolated half-bridge gate driver that employs the Analog Devices, Inc., iCoupler® technology to provide an isolated high-side driver with an integrated 275 mW high-side supply. This supply, provided by an internal isolated dc-to-dc converter, powers not only the ADuM6132 high-side output but also any external buffer circuitry that is commonly used with the ADuM6132. This functionality eliminates the cost, space, and performance issues associated with external supply configurations such as a bootstrap circuit. The architecture of the ADuM6132 isolates the high-side channel and the high-side power from the control and lowside interface circuitry. Care has been taken to ensure close matching between the high-side and low-side driver timing characteristics to reduce the need for a dead time margin. APPLICATIONS In comparison to gate drivers that employ high voltage level translation methodologies, the ADuM6132 offers the benefit of true, galvanic isolation. The differential voltage between high-side and low-side channels can be as high as 800 V with good insulation lifetime (see Table 12). MOSFET/IGBT gate drivers Motor drives Solar panel inverters Power supplies isoPower® uses high frequency switching elements to transfer power through its transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to the AN-0971 Application Note for details on board layout considerations. VDD 1 ISOLATED DC-TO-DC CONVERTER GND 2 ENCODE VIB 5 VOB 6 DECODE AND LEVEL-SHIFT VIA 4 LEVELSHIFT VDDL 3 16 VISO 15 GNDISO 14 GNDA 13 VDDA 12 VOA 11 NC VDDB 7 10 NC GND 8 9 ADuM6132 GNDISO 07393-001 FUNCTIONAL BLOCK DIAGRAM Figure 1. 1 Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; 7,075,329; and other pending patents Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved. ADuM6132 TABLE OF CONTENTS Features .............................................................................................. 1 ESD Caution...................................................................................6 Applications ....................................................................................... 1 Pin Configuration and Function Descriptions..............................7 General Description ......................................................................... 1 Typical Performance Characteristics ..............................................8 Functional Block Diagram .............................................................. 1 Terminology .................................................................................... 10 Revision History ............................................................................... 2 Applications Information .............................................................. 11 Specifications..................................................................................... 3 Typical Application Usage ......................................................... 11 Electrical Characteristics ............................................................. 3 PCB Layout ................................................................................. 11 Package Characteristics ............................................................... 4 Thermal Analysis ....................................................................... 12 Regulatory Information ............................................................... 4 Undervoltage Lockout ............................................................... 12 Insulation and Safety Related Specifications ............................ 4 Propagation Delay-Related Parameters ................................... 13 DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Characteristics .............................................................................. 5 Magnetic Field Immunity.......................................................... 13 Recommended Operating Conditions ...................................... 5 Outline Dimensions ....................................................................... 15 Absolute Maximum Ratings............................................................ 6 Ordering Guide .......................................................................... 15 Insulation Lifetime ..................................................................... 14 REVISION HISTORY 7/08—Revision 0: Initial Version Rev. 0 | Page 2 of 16 ADuM6132 SPECIFICATIONS ELECTRICAL CHARACTERISTICS All voltages are relative to their respective ground; 4.5 V ≤ VDD = VDDL ≤ 5.5 V; 12.5 V ≤ VDDB ≤ 17.0 V; VDDA = VISO. All minimum/maximum specifications apply over the entire recommended operating range, unless otherwise noted. All typical specifications are at TA = 25°C, VDD = VDDL = 5.0 V, VDDB = 15 V, VDDA = VISO. Table 1. Parameter DC SPECIFICATIONS Isolated Power Supply Input Current, Quiescent Input Current, Loaded Maximum Output Current 1 Output Voltage Logic Supply Input Current Output Supplies, Channel A or Channel B 2 Supply Current, Quiescent Supply Current, fIN = 20 kHz Supply Current, fIN = 100 kHz Supply Current, fIN = 1000 kHz Logic Inputs, Channel A or Channel B Input Current Logic High Input Voltage Logic Low Input Voltage Outputs, Channel A or Channel B Channel A High Level Output Voltage Channel B High Level Output Voltage Low Level Output Voltages High Level Output Current, Peak 3 Low Level Output Current, Peak3 Undervoltage Lockout, VDDA or VDDB Supply 4 Positive Going Threshold Negative Going Threshold Hysteresis Undervoltage Lockout, VDDL Supply4 Positive Going Threshold Negative Going Threshold Hysteresis SWITCHING SPECIFICATIONS Minimum Pulse Width1 Maximum Switching Frequency1 Propagation Delay1 Change vs. Temperature Pulse Width Distortion, |tPLH − tPHL| Channel-to-Channel Matching, Rising or Falling Matching Edge Polarity1 Channel-to-Channel Matching, Rising vs. Falling Opposite Edge Polarity1 Symbol Min IDD(Q) IDD IISO(MAX) VISO Typ Max Unit Test Conditions/Comments 280 350 IISO = 0 mA, dc signal inputs IISO = IISO(MAX) 12.5 V ≤ VISO ≤ 17.0 V 0 mA ≤ IISO ≤ 22 mA 15 17 mA mA mA V IDDL 1.8 3.0 mA IDDA(Q), IDDB(Q) IDDA(20), IDDB(20) IDDA(100), IDDB(100) IDDA(1000), IDDB(1000) 1.0 1.1 1.3 4.5 2.0 2.1 2.3 5.5 mA mA mA mA +0.01 +10 μA V V 0 V ≤ VIA, VIB ≤ 5.5 V V V V mA mA IOAH = −1 mA IOBH = −1 mA IOAL, IOBL = 1 mA 22 12.5 IIA, IIB VIAH, VIBH VIAL, VIBL −10 0.7 × VDDL VOAH VOBH VOAL,VOBL IOAH, IOBH IOAL, IOBL VDDA − 0.1 VDDB − 0.1 VDDAUV+, VDDBUV+ VDDAUV−, VDDBUV− VDDAUVH, VDDBUVH 11.0 10.0 VDDLUV+ VDDLUV− VDDLUVH 3.5 3.1 PW fIN tPHL, tPLH 0.3 × VDDL 0.1 200 200 11.7 10.7 1.0 12.3 11.2 V V V 4.2 3.8 V V V 50 CL = 200 pF CL = 200 pF CL = 200 pF CL = 200 pF 0.5 PWD tM2 10 20 ns kHz ns ps/°C ns ns tM1 20 ns 1000 40 Rev. 0 | Page 3 of 16 60 100 CL = 200 pF CL = 200 pF CL = 200 pF 100 CL = 200 pF CL = 200 pF ADuM6132 Parameter Part-to-Part Matching1 Output Rise Time (10% to 90%) Output Fall Time (10% to 90%) Symbol Min Typ tR tF Max 60 15 15 Unit ns ns ns Test Conditions/Comments CL = 200 pF CL = 200 pF CL = 200 pF 1 See the Terminology section. IDDA is supplied by the output of the integrated isolated dc-to-dc power supply. IDDB is supplied by an external power connection to the VDDB pin. See Figure 16. Duration less than 1 second. Average output current must conform to the limit shown in the Absolute Maximum Ratings section. 4 Undervoltage lockout (UVLO) holds the outputs in a low state if the corresponding input or output power supply is below the referenced threshold. Hysteresis is built into the detection threshold to prevent oscillations and noise sensitivity. 2 3 PACKAGE CHARACTERISTICS Table 2. Parameter Resistance (Input Side to High-Side Output) 1 Capacitance (Input Side to High-Side Output)1 Input Capacitance Junction-to-Ambient Thermal Resistance 1 Symbol RI-O CI-O CI θJA Min Typ 1012 2.0 4.0 45 Max Unit Ω pF pF °C/W Test Conditions/Comments 4-layer PCB The device is considered a two-terminal device: Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. REGULATORY INFORMATION The ADuM6132 is pending approval by the organizations listed in Table 3. Table 3. UL (Pending) Recognized under UL 1577 component recognition program 1 Double/reinforced insulation, 3750 V rms isolation voltage File E214100 1 2 CSA (Pending) Approved under CSA Component Acceptance Notice #5A Basic insulation per CSA 60950-1-03 and IEC 60950-1, 800 V rms (1131 V peak) maximum working voltage Reinforced insulation per CSA 60950-1-03 and IEC 60950-1, 400 V rms maximum working voltage File 205078 VDE (Pending) Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 2 Reinforced insulation, 560 V peak File 2471900-4880-0001 In accordance with UL 1577, each ADuM6132 is proof-tested by applying an insulation test voltage ≥4500 V rms for 1 second (current leakage detection limit = 10 μA). In accordance with DIN V VDE V 0884-10, each ADuM6132 is proof-tested by applying an insulation test voltage ≥1050 V peak for 1 second (partial discharge detection limit = 5 pC). The asterisk (*) marking branded on the component designates DIN V VDE V 0884-10 approval. INSULATION AND SAFETY RELATED SPECIFICATIONS Table 4. Parameter Rated Dielectric Insulation Voltage Minimum External Air Gap (Clearance) Symbol L(I01) Value 3750 >8.0 Unit V rms mm Minimum External Tracking (Creepage) L(I02) >8.0 mm Minimum Internal Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group CTI 0.017 min >175 IIIa mm V Rev. 0 | Page 4 of 16 Test Conditions/Comments 1 minute duration Measured from input terminals to output terminals, shortest distance through air Measured from input terminals to output terminals, shortest distance path along body Insulation distance through insulation DIN IEC 112/VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) ADuM6132 DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS The ADuM6132 is suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by protective circuits. The asterisk (*) marking on the package denotes DIN V VDE V 0884-10 approval. Table 5. Parameter Installation Classification per DIN VDE 0110 For Rated Mains Voltage ≤ 150 V rms For Rated Mains Voltage ≤ 300 V rms For Rated Mains Voltage ≤ 400 V rms Climatic Classification Pollution Degree (DIN VDE 0110, Table 1) Maximum Working Insulation Voltage Input-to-Output Test Voltage, Method B1 Test Conditions/Comments VIORM × 1.875 = VPR, 100% production test, tm = 1 sec, partial discharge <5 pC Input-to-Output Test Voltage, Method A After Environmental Tests Subgroup 1 After Input and/or Safety Test Subgroup 2 and Subgroup 3 Highest Allowable Overvoltage Safety-Limiting Values Value Unit VIORM VPR I to IV I to III I to II 40/105/21 2 560 1050 V peak V peak 896 672 V peak V peak VTR 6000 V peak TS IS1 RS 150 555 >109 °C mA Ω VPR VIORM × 1.6 = VPR, tm = 60 sec, partial discharge <5 pC VIORM × 1.2 = VPR, tm = 60 sec, partial discharge <5 pC Transient overvoltage, tTR = 10 sec Maximum value allowed in the event of a failure (see Figure 2) Case Temperature Side 1 Current Insulation Resistance at TS VIO = 500 V 600 RECOMMENDED OPERATING CONDITIONS 500 Table 6. Parameter Operating Temperature Range, TA Input Supply Voltage, VDD and VDDL1 Channel A, Channel B Supply Voltage, VDDA and VDDB1 Input Signal Rise and Fall Times Common-Mode Transient Immunity, Input to Output Minimum Power-On Slew Rate (PSLEW), VDD and VDDL2 400 300 200 100 0 0 50 100 150 AMBIENT TEMPERATURE (°C) 200 07393-002 SAFE OPERATING VDD CURRENT (mA) Symbol 1 2 Figure 2. Thermal Derating Curve, Dependence of Safety-Limiting Values with Ambient Temperature per DIN V VDE V 0884-10 Rating −40°C to +85°C 4.5 V to 5.5 V 12.5 V to 17 V 1 ms −50 kV/μs to +50 kV/μs 1 V/ms All voltages are relative to their respective ground. The ADuM6132 power supply may fail to properly initialize if VDD and VDDL are applied too slowly. The power supply slew rate must be faster than specified over the entire turn-on ramp. Power-on should start from a completely discharged state. Rev. 0 | Page 5 of 16 ADuM6132 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 7. Parameter Storage Temperature Range, TST Ambient Operating Temperature Range, TA Input Supply Voltage, VDDL, VDD1 Channel A, Channel B Supply Voltage, VDDA, VDDB1 Input Voltage, VIA, VIB1 Output Voltage, VOA1 Output Voltage, VOB1 Average DC Output Current, IOA, IOB Peak Output Current, IOA, IOB Common-Mode Transients2 1 2 Rating −55°C to +150°C −40°C to +85°C −0.5 V to +7.0 V −0.5 V to +27 V ESD CAUTION −0.5 V to VDDL + 0.5 V −0.5 V to VISO + 0.5 V −0.5 V to VDDB + 0.5 V −10 mA to +10 mA −200 mA to +200 mA −100 kV/μs to +100 kV/μs All voltages are relative to their respective ground. Refers to common-mode transients across any insulation barrier. Commonmode transients exceeding the absolute maximum ratings can cause latch-up or permanent damage. Rev. 0 | Page 6 of 16 ADuM6132 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VDD 1 16 VISO VDDL 3 VIA 4 VIB 5 15 GNDISO ADuM6132 TOP VIEW (Not to Scale) 14 GNDA 13 VDDA 12 VOA VOB 6 11 NC VDDB 7 10 NC GND 8 9 GNDISO NC = NO CONNECT 07393-003 GND 2 Figure 3. Pin Configuration Table 8. Pin Function Descriptions Pin No. 1 2, 8 3 4 5 6 7 9, 15 10, 11 12 13 14 16 Mnemonic VDD GND VDDL VIA VIB VOB VDDB GNDISO NC VOA VDDA GNDA VISO Description Input Supply Voltage for Isolated Power Supply, 4.5 V to 5.5 V. Ground Reference for Isolated Power Supply Input and Logic Inputs. Input Supply Voltage for Logic, 4.5 V to 5.5 V. Logic Input A. Logic Input B. Output B (Nonisolated). Output B Supply Voltage Input (Nonisolated), 12.5 V to 17 V. Ground Reference for Isolated Power Supply Output. No Connect. Output A (Isolated). Output A Supply Voltage Input. Must be connected externally to VISO (Pin 16). Output A Ground Reference. Must be connected externally to GNDISO (Pin 15). Isolated Power Supply Voltage Output. Table 9. Truth Table (Positive Logic) 1 VIA Input L L H H X VIB Input L H L H X VDDL State Powered Powered Powered Powered Unpowered VDDB State Powered Powered Powered Powered Powered VOA Output L L H H L VOB Output L H L H L X X Powered Unpowered L L 1 L = low; H = high; X = high or low. Rev. 0 | Page 7 of 16 Notes VOA returns to input state within 1 μs of VDDL power restoration. ADuM6132 TYPICAL PERFORMANCE CHARACTERISTICS All typical performance curves are based on operation at TA = 25°C, unless otherwise noted. 1.2 15.5 1.0 POWER DISSIPATION (W) 16.0 VDD = 5.5V 14.5 VDD = 4.5V 14.0 VDD = 5.0V 5 10 15 20 25 VDD = 5.5V 0.6 0.4 0 07393-024 0 IISO LOAD CURRENT (mA) 0 5 10 15 20 25 IISO LOAD CURRENT (mA) Figure 4. Typical VISO Supply Voltage vs. IISO External Load Figure 7. Typical Total Power Dissipation vs. IISO External Load 300 14.8 14.6 VDD = 4.5V 250 VDD = 5.5V 14.4 VDD = 5.0V VISO AT 22mA LOAD (V) IDD INPUT CURRENT (mA) VDD = 4.5V 0.2 13.5 13.0 0.8 07393-027 VISO (V) 15.0 VDD = 5.0V 200 VDD = 5.5V 150 100 14.2 VDD = 5.0V 14.0 13.8 13.6 13.4 VDD = 4.5V 13.2 13.0 50 5 10 15 20 25 IISO LOAD CURRENT (mA) 12.6 –40 07393-025 0 –20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) Figure 5. Typical IDD Supply Current vs. IISO External Load 07393-028 12.8 0 Figure 8. Typical VISO Output Voltage at Maximum Combined Load over Temperature 30 2500 VDD = 5.5V VDD = 5.0V 15 10 5 0 5 10 15 20 IISO LOAD CURRENT (mA) Figure 6. Typical VISO Supply Efficiency vs. IISO External Load 25 1500 VDD = 5.0V 1000 VDD = 5.5V 500 0 1 10 100 VISO LOAD IMPEDANCE (Ω) 1000 07393-029 POWER DISSIPATION (mW) 20 0 VDD = 4.5V 2000 VDD = 4.5V 07393-026 EFFICIENCY (%) 25 Figure 9. Power Dissipation vs. Load Impedance for Fault Conditions Rev. 0 | Page 8 of 16 ADuM6132 6 4 VDDA = 17V VOL OUTPUT VOLTAGE (V) IDDA CURRENT (mA) 5 4 3 VDDA = 12.5V 2 VDDA = 15V 3 2 1 0 200 400 600 800 1000 VOA DATA FREQUENCY (kHz) 0 07393-030 Figure 10. Typical IDDA Supply Current, CL = 200 pF 200 250 VDDB = 17V 4 3 VDDB = 12.5V 2 VDDB = 15V 200 400 600 800 1000 VOB DATA FREQUENCY (kHz) tPLH CHA 60 tPHL CHA 55 50 –50 07393-031 0 65 –25 0 25 50 75 100 TEMPERATURE (°C) Figure 11. Typical IDDB Supply Current, CL = 200 pF 07393-034 VOA PROPAGATION DELAY (ns) IDDB CURRENT (mA) 150 70 1 Figure 14. Typical Channel A Propagation Delay vs. Temperature 0 70 VOB PROPAGATION DELAY (ns) –1 –2 –3 –4 0 50 100 150 200 250 IOH (mA) tPLH CHB 65 tPHL CHB 60 55 50 –50 07393-032 (VOH – VDD) OUTPUT VOLTAGE DROP (V) 100 Figure 13. Typical VOL vs. IOL (VDD = VDDL = 5 V, VDDA = VDDB = 12 V to 17 V) 5 –5 50 IOL (mA) 6 0 0 –25 0 25 50 75 100 TEMPERATURE (°C) Figure 15. Typical Channel B Propagation Delay vs. Temperature Figure 12. Typical VOH Voltage Drop vs. IOH (VDD = VDDL = 5 V, VDDA = VDDB = 12 V to 17 V) Rev. 0 | Page 9 of 16 07393-035 0 07393-033 1 ADuM6132 TERMINOLOGY Channel-to-Channel Matching Channel-to-channel matching with rising or falling matching edge polarity is the magnitude of the propagation delay difference between two channels of the same part when the inputs are both rising edges or both falling edges. The loads on each channel are equal. Channel-to-channel matching with rising vs. falling opposite edge polarity is the magnitude of the propagation delay difference between two channels of the same part when one input is a rising edge and one input is a falling edge. The loads on each channel are equal. Maximum Output Current The maximum output current is the maximum isolated supply current that the ADuM6132 can provide. This current supports external loads as well as the needs of the ADuM6132 Channel A output circuitry. This is achieved via external connection of the VISO pin to the VDDA pin and of the GNDISO pin to the GNDA pin (see Figure 16). The net current available to power external loads is the ADuM6132 output current, IISO, minus the Channel A supply current, IDDA. Maximum Switching Frequency The maximum switching frequency is the maximum signal frequency at which the specified timing parameters are guaranteed. Operation beyond the maximum switching frequency is not recommended, because high switching rates can cause droop in the output supply voltage. Minimum Pulse Width The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. Operation below the minimum pulse width is not recommended. Part-to-Part Matching Part-to-part matching is the magnitude of the propagation delay difference between the same channels of two different parts. This includes rising vs. rising edges, falling vs. falling edges, or rising vs. falling edges. The supply voltages, temperatures, and loads of each part are equal. Propagation Delay The propagation delay is the time that it takes a logic signal to propagate through a component. The propagation delay to a logic low output may differ from the propagation delay to a logic high output. The tPHL propagation delay is measured from the 50% level of the falling edge of the VIA or VIB signal to the 50% level of the falling edge of the VOA or VOB signal. The tPLH propagation delay is measured from the 50% level of the rising edge of the VIA or VIB signal to the 50% level of the rising edge of the VOA or VOB signal. Capacitive Load (CL) The output capacitive load simulates a typical FET, IGBT, or buffer for timing or current measurements. This load includes all discrete and parasitic capacitive loads on the output. Rev. 0 | Page 10 of 16 ADuM6132 APPLICATIONS INFORMATION voltage transistor combination can be selected to suit the requirements of the application. TYPICAL APPLICATION USAGE The architecture of the ADuM6132 is ideal for motor drive and inverter applications where the low-side channels are common to the controller. This arrangement requires only two isolation regions in a package. All the isolated signals and the isolated power are grouped on one side of the package to maintain full package creepage and clearance. The low-side driver, as well as the control signals, share a common reference and are also grouped. PCB LAYOUT The ADuM6132 digital isolator with integrated 275 mW isoPower dc-to-dc converter requires no external interface circuitry for the logic interfaces. Power supply bypassing is required at the input and output supply pins (see Figure 17). The power supply section of the ADuM6132 uses a very high oscillator frequency to efficiently pass power through its chip scale transformers. In addition, the normal operation of the data section of the iCoupler introduces switching transients on the power supply pins. Bypass capacitors are required for several operating frequencies. Noise suppression requires a low ESR, high frequency capacitor; ripple suppression and proper regulation require a large value capacitor in parallel (see Table 10). The total lead length between both ends of the capacitor and the input power supply pin should not exceed 20 mm. To maximize the effectiveness of external bypass capacitors, the isoPower dc-to-dc converter is not internally tied to the data channels, and should be treated as a completely independent subsystem, except for a UVLO function (see the Undervoltage Lockout section). This means that power must be applied to VDD to operate the dc-to-dc converter. Power must also be applied to VDDL and VDDB to operate the data input and the Channel B driver output. On the secondary side, the power generated at the VISO pin must be applied as an input power supply to the VDDA pin. GNDISO and GNDA must also be connected. Table 10. Recommended Bypass Capacitors The ADuM6132 is intended for use in driving low gate capacitance transistors (200 pF typically). Most high voltage applications involve larger transistors than this. To accommodate these applications, users can implement a buffer configuration with the ADuM6132, as shown in Figure 16. In many cases, this buffer configuration is the least expensive option to drive high capacitance devices and provides the greatest amount of design flexibility. The precise buffer/high Supply VDD VDDB VDDL VDDA VISO Pins 1, 2 7, 8 2, 3 13, 14 15, 16 Bypass Capacitors 0.1 μF, 10 μF 0.1 μF 0.1 μF 0.1 μF 0.1 μF, 10 μF ADuM6132 VDD 10µF 0.1µF GND GND 1 2 ISOLATED DC-TO-DC CONVERTER 0.1µF 15 9 VDDL +5V 16 VIA 3 4 13 ISOLATED GATE DRIVE 12 14 VDDB +15V 0.1µF GNDISO IISO GNDISO VDDA IDDA IAVAIL BUFFER 0.1µF VOA CBUF GNDA +15V 7 0.1µF VIB RG RBUF 5 NONISOLATED GATE DRIVE CBUF 6 BUFFER RG VOB RBUF GND 8 GND VDC– Figure 16. Typical Application Circuit Rev. 0 | Page 11 of 16 07393-016 +5V VDC+ VISO ADuM6132 VDD GND VDDL VIA VIB VOB VDDB GND VISO GNDISO GNDA VDDA VOA NC NC GNDISO 07393-017 In applications involving high common-mode transients, care should be taken to ensure that board capacitive coupling across the isolation barrier is minimized. Furthermore, the board layout should be designed so that any coupling that does occur affects all pins on a given component side equally. Failure to ensure this may cause voltage differentials between pins that exceed the absolute maximum ratings of the device (see Table 7), leading to latch-up or permanent damage. Figure 17. Recommended PCB Layout UNDERVOLTAGE LOCKOUT The ADuM6132 has undervoltage lockout (UVLO) circuits on the VDDL, VDDA, and VDDB supplies. For each supply, the respective UVLO circuit monitors the supply voltage and takes a predetermined action based on whether the supply voltage is above or below a given threshold. These thresholds are specified in Table 1. In the recommended configuration shown in Figure 16, only two independent supplies are controlled by the user: VDDB and VDDL/VDD (VDDL = VDD in Figure 16). VDDA is supplied by the internal dc-to-dc converter via the VISO = VDDA external connection. Nevertheless, the VDDA UVLO functionality is included in Table 11 to show how the VOA output behaves when the internal dc-to-dc converter powers on and off. Table 11. Undervoltage Lockout Functionality1 The ADuM6132 is a power device that dissipates approximately 1 W of power when fully loaded and running at maximum speed. Because it is not possible to apply a heat sink to an isolation device, the device depends primarily on heat dissipation into the PCB through the GND pins. If the device will be used at high ambient temperatures, provide a thermal path from the GND pins to the PCB ground plane. The board layout in Figure 17 shows enlarged pads for Pin 8 (GND) and Pin 9 (GNDISO). Multiple vias should be implemented from the pad to the ground plane. This layout significantly reduces the temperatures inside the chip. The dimensions of the expanded pads are left to the discretion of the designer and the available board space. THERMAL ANALYSIS The ADuM6132 consists of several internal die attached to two lead frame paddles. For the purposes of thermal analysis, the part is treated as a thermal unit with the highest junction temperature determining θJA, as shown in Table 2. The value of θJA is based on measurements taken with the part mounted on a JEDEC standard 4-layer board with fine width traces and still air. Under normal operating conditions, the ADuM6132 operates at full load across the full temperature range without derating the output current. However, following the recommendations in the PCB Layout section decreases the thermal resistance to the PCB, allowing increased thermal margin at high ambient temperatures. Under VISO output short-circuit conditions, as shown in Figure 9, the package power dissipation quickly exceeds the safe operating limit of 1.44 W for ambient temperatures up to 85°C. At low input voltage, the power dissipation can approach 2 W. Because internal compensation of the PWM makes low VDD a worst-case condition, input voltage limiting is not an effective strategy for protecting the ADuM6132 from output load fault conditions. Therefore, the preferred protection methods, where required, are either limiting ambient temperature to 60°C or the use of a fuse. User-Provided Supplies VDDL VDDB H H VISO Powered Supply VDDA H H H L X L X L X X 1 Effect Normal operation. Internal dc-to-dc converter is active. VOA/VOB output logic states match VIA/VIB input logic states. Internal dc-to-dc converter is active but VISO is below UVLO threshold. VOA output is driven low. VOB output operates normally. Internal dc-to-dc converter is turned off (VISO = 0). VOA output is driven low. VOB output is driven low. Internal dc-to-dc converter is turned off (VISO = 0). VOA output is driven low. VOB output is driven low. H: supply voltage > UVLO threshold; L: supply voltage < UVLO threshold; X: supply voltage level is irrelevant. When all three supplies are above their respective UVLO thresholds, the ADuM6132 operates normally. The internal dc-to-dc converter is active, and both outputs operate as determined by their respective input logic signals. If either of the user-provided supplies is below its UVLO threshold, the ADuM6132 is put into a disabled mode. In this mode, the internal dc-to-dc converter is turned off and both outputs are driven low. The VOB output is driven low by either the VDDL or VDDB UVLO circuit (whichever is below its threshold). The VOA output is driven low when the internal dc-to-dc converter is turned off. The VISO supply voltage drops to 0 V, causing VDDA to drop also because VISO and VDDA are externally connected. When VDDA is below its UVLO threshold, the VDDA UVLO circuit drives VOA low. Rev. 0 | Page 12 of 16 ADuM6132 100 50% tPHL OUTPUT (VOx) 07393-018 tPLH 50% Figure 18. Propagation Delay Parameters MAGNETIC FIELD IMMUNITY The ADuM6132 is extremely immune to external magnetic fields. The limitation on the ADuM6132 magnetic field immunity is set by the condition in which induced voltage in the receiving coil of the transformer is sufficiently large to falsely set or reset the decoder. The following analysis defines the conditions under which this may occur. The pulses at the transformer output have an amplitude greater than 1.0 V. The decoder has a sensing threshold at approximately 0.5 V, thus establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by V = (−dβ/dt) Σπrn2 ; n = 1, 2, … N where: 0.1 0.01 Pulse width distortion is the maximum difference between these two propagation delay values and is an indication of how accurately the timing of the input signal is preserved. Channel-to-channel matching refers to the maximum amount that the propagation delay differs between channels within a single ADuM6132 component. 1 0.001 1k 10k 100k 1M 10M MAGNETIC FIELD FREQUENCY (Hz) 100M Figure 19. Maximum Allowable External Magnetic Flux Density For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic flux density of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This voltage is approximately 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event occurs during a transmitted pulse (with the worst-case polarity), the received pulse is reduced from >1.0 V to 0.75 V—still well above the 0.5 V sensing threshold of the decoder. The preceding magnetic flux density values correspond to specific current magnitudes at given distances from the ADuM6132 transformers. Figure 20 expresses these allowable current magnitudes as a function of frequency for selected distances. As shown in Figure 20, the ADuM6132 is extremely immune and can be affected only by extremely large currents operated at high frequency and very close to the component. For example, at a magnetic field frequency of 1 MHz, a 0.5 kA current would need to be placed 5 mm away from the ADuM6132 to affect the operation of the component. Given the geometry of the receiving coil in the ADuM6132 and an imposed requirement that the induced voltage be at most 50% of the 0.5 V margin at the decoder, a maximum allowable magnetic flux density is calculated, as shown in Figure 19. MAXIMUM ALLOWABLE CURRENT (kA) 1000 β is the magnetic flux density (gauss). rn is the radius of the nth turn in the receiving coil (cm). N is the number of turns in the receiving coil. DISTANCE = 1m 100 10 DISTANCE = 100mm 1 DISTANCE = 5mm 0.1 0.01 1k 10k 100k 1M 10M MAGNETIC FIELD FREQUENCY (Hz) Figure 20. Maximum Allowable Current for Various Current-to-ADuM6132 Spacings Rev. 0 | Page 13 of 16 100M 07393-020 INPUT (VIx) 10 07393-019 Propagation delay is a parameter that describes the time it takes a logic signal to propagate through a component. The propagation delay to a logic low output may differ from the propagation delay to a logic high output. MAXIMUM ALLOWABLE MAGNETIC FLUX DENSITY (kgauss) PROPAGATION DELAY-RELATED PARAMETERS ADuM6132 Analog Devices performs accelerated life testing using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined. These factors allow calculation of the time to failure at the actual working voltage. Table 12 summarizes the recommended peak working voltages for 50 years and 15 years of service life for various operating conditions evaluated by Analog Devices. In many cases, the approved working voltage is higher than the 50-year service life voltage. Operation at these high working voltages can lead to shortened insulation life in some cases. Any cross-insulation voltage waveform that does not conform to Figure 22 or Figure 23 should be treated as a bipolar ac waveform, and its peak voltage should be limited to the 50-year lifetime voltage value listed in Table 12. Note that the voltage shown in Figure 22 is sinusoidal for illustration purposes only. It is meant to represent any voltage waveform varying between 0 V and some limiting value. The limiting value can be positive or negative, but the voltage cannot cross 0 V. RATED PEAK VOLTAGE 07393-021 All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation depends on the characteristics of the voltage waveform applied across the insulation. In addition to the testing performed by the regulatory agencies, Analog Devices conducts an extensive set of evaluations to determine the lifetime of the insulation structure within the ADuM6132. 0V Figure 21. Bipolar AC Waveform RATED PEAK VOLTAGE 07393-022 INSULATION LIFETIME In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower, which allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Table 12 can be applied while maintaining the 50-year minimum lifetime, provided that the voltage conforms to either the unipolar ac or dc voltage cases. 0V The insulation lifetime of the ADuM6132 depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 21, Figure 22, and Figure 23 illustrate these different isolation voltage waveforms. Figure 22. Unipolar AC Waveform RATED PEAK VOLTAGE 07393-023 Note that in the presence of strong magnetic fields and high frequencies, any loops formed by PCB traces may induce sufficiently large error voltages to trigger the threshold of succeeding circuitry. Care should be taken in the layout of such traces to avoid this possibility. 0V Bipolar ac voltage is the most stringent environment. The goal of a 50-year operating lifetime under the bipolar ac condition determines the maximum working voltage recommended by Analog Devices. Figure 23. DC Waveform Table 12. Maximum Continuous Working Voltage1 Parameter AC Voltage, Bipolar Waveform AC Voltage, Unipolar Waveform Basic Insulation Basic Insulation DC Voltage Waveform Basic Insulation Basic Insulation 1 Peak Voltage 424 V peak Lifetime 50-year minimum lifetime 800 V peak 660 V peak 15-year minimum lifetime 50-year minimum lifetime 800 V peak 660 V peak 15-year minimum lifetime 50-year minimum lifetime Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details. Rev. 0 | Page 14 of 16 ADuM6132 OUTLINE DIMENSIONS 10.50 (0.4134) 10.10 (0.3976) 9 16 7.60 (0.2992) 7.40 (0.2913) 1.27 (0.0500) BSC 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 10.65 (0.4193) 10.00 (0.3937) 8 0.51 (0.0201) 0.31 (0.0122) 0.75 (0.0295) 0.25 (0.0098) 2.65 (0.1043) 2.35 (0.0925) SEATING PLANE 45° 8° 0° 1.27 (0.0500) 0.40 (0.0157) 0.33 (0.0130) 0.20 (0.0079) COMPLIANT TO JEDEC STANDARDS MS-013- AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 032707-B 1 Figure 24. 16-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-16) Dimensions shown in millimeters (inches) ORDERING GUIDE Model ADuM6132ARWZ 1 ADuM6132ARWZ-RL1 1 No. of Channels 2 2 Output Peak Current (A) 0.2 0.2 Output Voltage (V) 15 15 Temperature Range −40°C to +85°C −40°C to +85°C Z = RoHS Compliant Part. Rev. 0 | Page 15 of 16 Package Description 16-Lead SOIC_W 16-Lead SOIC_W, 13-inch Tape and Reel Option (1,000 Units) Package Option RW-16 RW-16 ADuM6132 NOTES ©2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07393-0-7/08(0) Rev. 0 | Page 16 of 16