epc111/112 Fully integrated standalone light barrier driver & receiver General Description Features The epc111/112 is a general purpose, fully integrated self-contained CMOS circuit family to be used in light-barrier applications. Fully integrated light barrier chip Needs just a photo diode and a LED with a LED driver Various types are available, i.e. high sensitivity or high speed Integrated clock generator CSP10 package with very small footprint or standard QFN16 package available The chip contains a controller which drives an LED, typically an IRLED. The LED is used in a pulsed mode to increase the signal-tonoise ratio even when there is very strong sunlight biasing the photo diode. It contains also a high sensitive photo diode amplifier and a signal conditioning circuitry to cancel unwanted environmental light including strong sunlight and pulsed light sources. The receiver is built around a synchronous demodulator circuitry. Two output signals with different threshold levels are implemented in order to trigger the light barrier output or to indicate light reserve. Applications Light barriers ranging from millimeters to tens of meters Smoke detectors Liquid detectors The chip also includes a power supply circuitry to establish all internally required voltages from one source only. It can be used as a standalone device forming the whole core of an industrial light barrier. Functional Block Diagram for 10-Pin Chip Scale Package (for 16-pin QFN Package) VDD VDD 1 (9) VLED LED Parameter Memory Interface 8 (14) VDD33 VDD18 LED Voltage Regulator 9 (12) Processor 10 (10) PD Signal Processor Controller f 3 (6) D1 2 (7) 4 (4) GND 7 (15) NC NC 6 (1) 5 (2) OUTN OUTH Figure 1: Block Diagram Type Response Time Sensitivity Typical Application epc111 Medium Medium (High) Long range light barrier epc112 Fast Medium High speed detection rate Table 1: Characteristics of available types © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 1 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 Absolute Maximum Ratings (Notes 1, 2) Recommended Operating Conditions Power Supply Voltage at pin VDD -0.3V to +5.5V Min. Max. Units Voltage to any pin except VDD -0.3V to VDD +0.3 V Supply voltage at VDD (=VDD33) 3.0 3.6 V Output current at any pin except LED -6mA to +6mA Supply voltage at VDD33 (=VDD) 3.0 3.6 V Power Consumption with maximum load 125 mW Operating Temperature (T O) -40° +85° C Lead Temperature solder, 4 sec. (T L) +260°C Relative Humidity (non-condensing) +5 +95 % Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended operating conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specific ations and test conditions, see Electrical Characteristics. Note 2: This device is a highly sensitive CMOS ac current amplifier with an ESD rating of JEDEC HBM class 0 (<250V). Handling and assembly of this device should only be done at ESD protected workstations. Electrical Characteristics 3.0V < VDD < 3.6V, -40°C < T A < +85°C, unless otherwise specified General Data Symbol VN Parameter Conditions/Comments Values Power supply voltage at VDD and VDD33 VPUP Power-up Threshold Voltage Voltage at VDD33 when the device starts up VPP Ripple on supply voltage, peak to peak Type V mV mV 2 mA VHOH Output high voltage OUTH see Figure 6 @ 3mA source. See Figure 6. in operation mode I PD = 0 mA, no load VN- 0.5V V 0.5 V 0.5 V VN- 0.5V V 0.5 ILED Source current maximum @ Pin LED fclk Reference clock of internal oscillator - for information only dfclk Temperature drift of the oscillator - for information only Characteristics subject to change without notice 3 600 @ 4mA source © 2011 ESPROS Photonics Corporation 2.4 250 Output low voltage OUTN Output low voltage 3.6 60nA Output high voltage OUTN VLEDL 3.3 108nA VNOL Output high voltage 3.0 epc111 VNOH Output low voltage OUTH Max. epc112 Current consumption VHOL Typ. Input pulse I PD NST IDD_OP VLEDH Units Min. 0.7 2 V mA 1 MHz 640 ppm/K Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 Other Data Symbol Parameter Conditions/Comments Types Values Min. IPDN IPDH Ipulse Photo Current Sensitivity OUTN Photo Current Sensitivity OUTH Maximum Input Pulse Current Typ. Pulse height to trigger internal threshold OUTN. Refer to Functional Description epc111 60 epc112 108 Pulse height to trigger internal threshold OUTH. Refer to Functional Description epc111 96 epc112 144 If the input current pulse is above this level, the recovery time t REC becomes trelax . (refer to parameter trelax) Units Max. nA nA epc111 100 epc112 100 µA IN_Imin Input related noise @ IPDDC =0 15 nA RMS IN_Imax Input related noise @ IPDDC =IPDDCMax 20 nA RMS IPDDC DC Photo Diode Current generated by ambient light with no effect to the sensitivity 2 mA CPD Photodiode Capacitance Refer to section Application Information, Photodiode Capacitance 50 pF tPulse LED Pulse Length tCycle trelax tR tF nV nM 0.0 LED Cycle Time Recovery time after a strong current pulse (I pulse = 100µA) Response Time Release Time (fall time) Valid pulse counts Missing pulse counts epc111 2 epc112 1 epc111 100 epc112 10 µs µs epc111 50 epc112 50 Minimum time from light beam detection to status change of the output OUTN or OUTH. tR_MAX = ( nV + 1 ) * tCycle epc111 800 900 epc112 30 40 Minimum time from beam interruption to status change of the output OUTN or OUTH. tF_MAX = ( nM + 1 ) * tCycle epc111 800 900 epc112 20 30 Number of valid (non-missing) pulses to trigger the output. Refer to Functional Description epc111 8 epc112 3 epc111 8 epc112 2 Number of missing pulses to release the output. Refer to Functional Description µs µs µs Other Parameters Sensitivity [nA] (typical values, T amb = 25°C, VDD = 3.3V) 120 110 100 90 80 70 60 50 40 0 1 2 3 4 5 6 Pulse width [us] Figure 2: Input Sensitivity vs. LED pulse width © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 3 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 1 2 3 4 10-Pin Chip Scale Package (CSP) Pin Name Type 8 7 6 NC_GND VDD18 VDD 1 2 3 4 NC NC NC_GND NC_GND PD NC 16 GND GND PD NC_GND Top View 15 VDD LED NC_GND 5 5 OUTH OUTH Top View 14 VDD18 13 10 NC_GND OUTN 6 OUTN 12 7 NC 11 8 LED 10 9 VDD33 9 VDD33 Connection Diagrams 16-Pin QFN Package 10-Pin CSP 16-Pin QFN Description 1 9 VDD Power Supply Positive power supply. To be connect to VDD33. 2 7 GND Power Supply Negative power supply pin. 3 6 PD Analog Input Photo diode input. 4 4 NC 5 2 OUTH Digital Out Load depending Light reserve detected - see Figure 6. Threshold level around 50% above the threshold of the filtered signal level. Open drain output 6 1 OUTN Digital Output Light pulses detected by the photo diode - see Functional Description Amplified and filtered signal Open drain output 7 15 NC 8 14 LED 9 12 10 n/a Do not connect this pin. Internally terminated. Do not connect this pin. Internally terminated. Digital Out Output to LED driver VDD33 Power Supply Positive power supply. To be connected to VDD. 10 VDD18 Decoupling Pin for external filter/decoupling of the internal LST 1.8V supply: 4.7nF ceramic type PIN Connections QFN16-VEEDNot for supply 1VN4of external circuits 3, 5, 8, 11, 13, 16 NC_GND Not connected. Connect this pins to GND (Guarding). PIN Connections QFN16-VEED1VN4 LST 15.12.2010 Page 1 File: Unbenannt This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 4 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 Functional Description Evaluation of single light pulse For each single light pulse, received and detected by the LED, the threshold levels are processed according to the following principle to propagate the output signals OUTN and OUTH resp. OUTNINT and OUTHINT. As far the received light pulse signal exceeds the corresponding threshold level, the pulse will be recognized as a valid pulse and the detection circuit sets the appropriate output signal OUTN INT or OUTHINT. IPD Light pulse detection IPD Light reserve detection Threshold levels: Light reserve OUTH Signal output OUTN t t t t t t OUTNINT OUTHINT Figure 3: Pulse evaluation Pulse Modulated Operation (e.g. OUTN int to OUTN) The epc111/112 chip operates the LED and the receiver path on a pulse modulated concept. Thus, the LED is operated with short pulses whereas the receiver channel does synchronous demodulation of the received light pulses by reading the current pulses of the photodiode. This concept allows a very high sensitivity, high speed operation, and a high suppression of input ambient or foreign light (DC currents) generated by sunlight or other DC light sources like light bulbs. In order to eliminate interference caused by modulated light, e.g. a flashing light or by other light barriers, the input signal from the photodiode is amplified, filtered, and processed by an integrated signal processor. If the photodiode signal meets the required frequency, pattern and amplitude, the output(s) are triggered. The following timing diagram shows the basic concept. tCycle tPulse on off Emitter LED yes Beam interrupted no Photo diode current IPD 1 2 nM 1 2 nV OUTNINT or OUTHINT OUTN or OUTH [V] tF tR Release time missing pulses Response time valid (non-missing) pulses Figure 4: Pulse modulation concept It is in fact a digital filter which counts missing and non-missing pulses to change the ou tput state of OUTN or OUTH. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 5 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 Working principle of the digital filter e.g. for the signal OUTNint to OUTN Filter: The aim of this programmable filter is to suppress single pulses, so they cannot trigger the output and generate a false signal. This filter is based on a counter, which is counting up (increment) the valid pulses and counting down (decrement) the missing pulses in a weighted manner. There are separate weighting factors for valid pulses (parameter nV) and missing pulses (parameter nM). If the counter reaches the upper limit (maximum count, response time), the signal OUTN is set to LOW. Similar in the opposite direction, if the counter reaches zero, the lower limit (minimum count, release time), the signal OUTN is put to HIGH. With the parameters nV and nM the filter has the advantage of individual selectable gradients of the slopes. Counter will never exceed maximum nor minimum limit. In between it acts as an integrator of both parameters. IF Pulse then – IF Pulse = valid then Counter = Counter + (nV * 1024) IF counter > 2 15 (maximum limit) then Counter = maximum limit IF counter = maximum limit then OUTN = 0 – IF Pulse = missing then Counter = Counter – (2 nM) IF counter < 0 (minimum limit) then Counter = minimum limit IF counter = minimum limit then OUTN = 1 ELSE wait for Pulse Lets assume that the photodiode does not receive light pulses for a long time: This means the light beam is interrupted. Then OUTN is at high level. If the light beam is not interrupted anymore, the photodiode receives light pulses which are strong enough to trigger the OUTNINT threshold and the internal pulse evaluation unit (designated in Figure 3 with 'Pulse evaluation') starts to count the received pulses. If the number of received pulses reach the set level n V, the output OUTN turns to low level. Thus, single pulses cannot trigger the output and generate a false signal. The same procedure is used when a beam changes from not interrupted to interrupted. The internal pulse evaluation unit counts the missing pulses. If the number of missing pulses reaches the level n M, OUTN is turned to high level. The same principle applies to the counter and signal of OUTH. The counter limit values are different, depending on the device: Type No. of Pulses nM No. of missing Pulses n V epc111 8 8 3 2 epc112 Table 2: Filter coefficients Light Pulse Detection Output OUTN The epc111/112 contains two digital outputs to indicate that a valid signal of light pulses are received by the photodiode. The first output OUTN is triggered, when the lower threshold is reached by the input signal (see Figure 3). This output is used usually to drive the output of the light barrier. This is a fully CMOS compatible digital output. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 6 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 Light Reserve Output OUTH However, if the incoming signal is just at the trigger threshold of OUTN, an unstable situation can occur. Thus, a second output OUTH is integrated with a higher trigger threshold to indicate that a certain 'light reserve' is reached (see Figure 3). This output is usually used to drive a visible LED to indicate to the operator a stable detection function of the light barrier. To have not too short pulses OUTH, this signal is stimulated by signal OUTH Filter and synchronously reset by OUTN. The trigger threshold of OUTH is set approx. 50% above the trigger threshold of OUTN. Emitter LED OUTN Filter OUTH Filter OUTN OUTH Figure 5: synchronization OUTH with OUTN This output is not CMOS compatible. Its voltage is depending of the load according to Figure 6. To have still digital compatible signals a level conversion is necessary. OUTH high max. Current OUTH [mA] OUTH low max.: 3.6V / - 40ºC OUTH low typ. OUTH low min.: 3.0V / + 85ºC Voltage OUTH [V] Figure 6: Output voltage versus output current of output OUTH File: Unbenannt This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 7 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 Below you find some examples for such circuits for converting OUTH levels to full CMOS compatible digital output. +3.3V R4 10k VDD epc11x R1 3k6 VDD33 VDD18 R2 12k T1 BC846 B LED PD OUTH OUTN OUTH GND R3 4k7 GND Figure 7: Non-inverting, low power level shifter (additional current ca.0.6mA) +3.3V +3.3V VDD epc11x VDD18 File: R3 33k R1 1k5 VDD33 R4 22k VDD epc11x VDD33 OUTH VDD18 LED <Title> PD OUTN OUTH R1 3k6 T1 BC846 B 10k OUTH T1 T2 BC846 B <name>BC846 B Figure 8: Simple inverting level shifter (additional current ca.1.6mA or 2.6mA) R3 4k7 Figure 9: Inverting, low power level shifter (additional current ca.0.8 ... 1.0mA) <name> <Title> <xx> File: This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . <name> 02.12.2011 <xx> Page 1 cted by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . Characteristics subject to change without notice Page 1 GND GND © 2011 ESPROS Photonics Corporation 02.12. <xx> OUTN OUTH R2 trades. It must not be shown to any third party nor be copied in any formGND This document is confidential and protected by law and international without our written permission . GND R2 12k LED PD R5 33k 8 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 Applications Long range light barrier application Figure 10 shows the epc111 as an example in a long range light barrier application with minimal part count. The LED flashes according to the description of the previous chapter. Light of the LED is passing either direct, reflected from a reflecting object or a retro reflector to the photo diode PD. If the received light fulfills the criteria according to the description in the previous chapter, the output signals OUTN and OUTH are set. The epc111 device is designed to operate at 3.3V power supply (VDD and VDD33). LED Driver: The output LED of the epc111 to drive the LED driver circuit is a current source capable to drive typically 1mA. For a high performance long range light barrier (>8m), an LED peak current of up to 1.5A is needed. To generate such a high LED current, an external driver circuit is necessary. The circuitry in Figure 10 is a simple implementation of such a driver circuit. The darlington circuit with T2 and T3 and R2 and R3 does the job. In order to avoid interference on the supply voltage, the supply is isolated (filtered) with R1 and C1. The high peak LED pulse current is delivered by the capacitor C1, which itself is charged by R1. Make sure, that there is no coupling of the high LED current to the ground of the epc111 or to the cathode of the photo diode. This driver circuit operates with a VDD LED in a range of 10 to 30 VDC. +3.3V VDDLED= +24V C2 1μF R1 100R C3 100nF R4 10k R6 12k VDD C4 100nF epc111 C5 4.7nF R8 10k R5 3k6 VDD33 VDD18 T1 BC846 LED PD T2 BC846 OUTN OUTH GND PD epc300 IR LED TSML1000 GND R2 1k R7 4k7 OUTN T3 BCP56 R3 1R2 C1 47μF Low ESR OUTH Marked conductors must be short and low ohmic C2 The epc111 device with its very sensitive input PD needs a well decoupled power supply Figure 10: Long range light barrier application with minimal part count Notice: The schematic is for illustrating the basic circuit idea only. For the real built up the designer has to take all other additional influence factors in consideration too e.g. design rules, power rating, heat dissipation, ... <name> <Title> <xx> benannt ment is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 9 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 High speed detection rate design Figure 11 shows the epc 112 as an example in a high speed detection rate light barrier application with minimal part count. This design is optimized for a fast reading of light beam interruptions. Whereas the working principle is similar to the above example. This driver circuit operates with a VDD LED in a range of 6 to 20 VDC. The epc112 device is designed to operate at 3.3V power supply (VDD and VDD33). VDDLED= +12V +3.3V C2 1μF C3 100nF R3 10k R5 12k VDD C4 100nF epc112 C5 4.7nF R4 3k6 VDD33 VDD18 T2 BC846B T1 BC846B OUTN OUTH GND PD epc300 IR LED TSML1000 LED PD R1 47R R7 10k GND R6 4k7 R2 13R C1 10μF Low ESR OUTH OUTN Marked conductors must be short and low ohmic C2 The epc112 device with its very sensitive input PD needs a well decoupled power supply Figure 11: High speed detection rate light barrier application with minimal part count Notice: The schematic is for illustrating the basic circuit idea only. For the real built up the designer has to take all other additional influence factors in consideration too eg. design rules, power rating, heat dissipation, ... Design Precautions: EMC shielding The sensitivity at pin PD is very high in order to achieve a long operation range of light barriers even without lenses in front of the IR LED and/or the photo diode. Thus, the pin PD is very sensitive to EMI. Special care <name> should be taken to keep the PCB track at pin PD as short as possible (a few mm only!). This track should be kept<Title> away from the IR LED signal tracks and from other sources which may induce unwanted signals. It is <xx> strongly recommended to cover the chip, the photodiode and all passive components around the chip with a File: Unbenannt metal shield. A recommended part is shown in Figure 12. The pins at the bottom are to solder the shield to This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . Figure 12: Recommended EMC the PCB with electrical connection to GND. The hole in the front is the opening window for the photo diode. shield The backside of the PCB below the sensitive area (PD, epc111 or epc112) shall be a polygon connected to GND to shield the circuit from the backside as well. Ambient Light Photodiode DC current can be generated by ambient light, e.g. sunlight. DC current at pin PD does not generate a DC output signal. However, if IPDDC is above the stated maximal value, the input is saturated. This blocks the detection of AC current pulses. Photodiode Capacitance If the photo diode capacity is above the specified value, a lower detection sensitivity and a possible higher sensitivity spread results. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 10 Datasheet epc111_112 - V2.2 www.espros.ch 11.01.201 Page 1 Layout Information (all measures in mm, ) CSP-10 Package Designed Approved Scale Page Part Name <Name> <Partname> 26.02.2009 <Name> <Data> M 1:1 DIN A4 1 Part No. <x000 000> This document is confidential and protected by law and internati onal trades. It mu st not be shown to any third party nor be copied in any form withou t our written permission . epc111/112 File: Unben annt 0.15 1.9 +0.0/-0.1 ∅ 0.3 0.1524 0.5 0.5 0.5 Pin 1 Solder balls Sn97.5Ag2.5 0.11 ±0.01 0.3 0.15 2.0 no solder mask inside this area 0.5 1.4 +0.0/-0.1 0.5 Bottom View ∅ 0.12 0.5 0.5 2.5 no solder mask inside this area Figure 13: CSP10: Mechanical dimensions Figure 14: CSP10: Layout recommendation Recommendations for reliable soldering of solder balls: • Use a pad layout similar to the one shown in Figure 14. Notice that all tracks should go underneath the solder mask area. • Do not connect any pins direct pin to pin inside of the opening of the solder mask. • In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the round landing pad with a gold surface finish as a solderable area only. QFN-16 Package VDD18 VDD NC_GND 10 9 VDD33 Opening in solder mask Conductor layout 12 11 File: 8 7 14 GND 6 13 LED NC_GND PD 5 NC_GND This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form wi NC_GND Top View 16 NC_GND 15 NC 3 OUTH NC_GND 4 NC 2 OUTN Shielding of PD pin 1 Figure 15: QFN-16: Layout recommendation © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 11 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 1.9 Bottom View 0.25 Top view 2.9 - 3.1 1.9 0.9 0.5 0.1 - 0.2 0.02 2.9 - 3.1 0.25 0.3 Figure 16: QFN-16: Mechanical dimensions Reflow Solder Profile Mechanical dimension QFN16 Package LST 15.08.2010 Page 1 For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for assembly for types ofIt must packages. The peak soldering t emperature (TLpermission ) should This document is Pb-free confidential and protected by law andboth international trades. not be shown to any third party nor be copied in any form without our written . not exceed +260°C for a maximum of 4 sec. File: hanical dimension SOT23-6L LST © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 12 Datasheet epc111_112 - V2.2 www.espros.ch CSP6 Tape QFN16 Tape Pin 1 Pin 1 8 epc111/112 12 Packaging Information (all measures in mm) Tape & Reel Information The devices are mounted on embossed tape for2 automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA) standard 8 481-1, 481-2, 481-3. CSP6 Tape QFN16 Tape Pin 1 12 8 Pin 1 4 8 Figure 17: CSP10 and QFN16 Tape Dimension. Parts are placed with solder pads on bottom side ESPROS Photonics AG does not guarantee that there are no empty cavities. Thus, the pick-and-place machine should check the presence of a chip during picking. Ordering Information Type Response Time Sensitivity Package RoHS compliance Packaging Method epc111-CSP10 Medium epc111-QFN16 Medium High CSP10 Yes Reel High QFN16 Yes Reel epc112-CSP10 Fast Medium CSP10 Yes Reel epc112-QFN16 Fast Medium QFN16 Yes Reel © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 13 Datasheet epc111_112 - V2.2 www.espros.ch epc111/112 IMPORTANT NOTICE ESPROS Photonics AG and its subsidiaries (epc) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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Further, Buyers must fully indemnify epc and its representatives against any damages arising out of the use of epc products in such safety-critical applications. epc products are neither designed nor intended for use in military/aerospace applications or environments unless the epc products are specifically designated by epc as military-grade or "enhanced plastic." Only products designated by epc as military-grade meet military specifications. Buyers acknowledge and agree that any such use of epc products which epc has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. epc products are neither designed nor intended for use in automotive applications or environments unless the specific epc products are designated by epc as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, epc will not be responsible for any failure to meet such requirements. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 14 Datasheet epc111_112 - V2.2 www.espros.ch