dsPIC30F2011, dsPIC30F2012, dsPIC30F3012, dsPIC30F3013 Data Sheet High-Performance Digital Signal Controllers © 2005 Microchip Technology Inc. Preliminary DS70139C Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70139C-page ii Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 dsPIC30F2011/2012/3012/3013 High-Performance Digital Signal Controllers Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). • 16-bit Compare/PWM output functions: • 3-wire SPI™ modules (supports four Frame modes) • I2C™ module supports Multi-Master/Slave mode and 7-bit/10-bit addressing • Up to two addressable UART modules with FIFO buffers High-Performance Modified RISC CPU: Analog Features: • • • • • • • • • • • 12-bit Analog-to-Digital Converter (A/D) with: - 100 Ksps conversion rate - Up to 10 input channels - Conversion available during Sleep and Idle • Programmable Low Voltage Detection (PLVD) • Programmable Brown-out Detection and Reset generation Modified Harvard architecture C compiler optimized instruction set architecture Flexible addressing modes 84 base instructions 24-bit wide instructions, 16-bit wide data path Up to 24 Kbytes on-chip Flash program space Up to 2 Kbytes of on-chip data RAM Up to 1 Kbytes of non-volatile data EEPROM 16 x 16-bit working register array Up to 30 MIPs operation: - DC to 40 MHz external clock input - 4 MHz-10 MHz oscillator input with PLL active (4x, 8x, 16x) • Up to 21 interrupt sources: - 8 user selectable priority levels - 3 external interrupt sources - 4 processor trap sources DSP Features: • Dual data fetch • Modulo and Bit-reversed modes • Two 40-bit wide accumulators with optional saturation logic • 17-bit x 17-bit single cycle hardware fractional/ integer multiplier • All DSP instructions are single cycle - Multiply-Accumulate (MAC) operation • Single cycle ±16 shift Peripheral Features: • High current sink/source I/O pins: 25 mA/25 mA • Three 16-bit timers/counters; optionally pair up 16-bit timers into 32-bit timer modules • 16-bit Capture input functions © 2005 Microchip Technology Inc. Special Microcontroller Features: • Enhanced Flash program memory: - 10,000 erase/write cycle (min.) for industrial temperature range, 100K (typical) • Data EEPROM memory: - 100,000 erase/write cycle (min.) for industrial temperature range, 1M (typical) • Self-reprogrammable under software control • Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Flexible Watchdog Timer (WDT) with on-chip low power RC oscillator for reliable operation • Fail-Safe Clock Monitor operation: - Detects clock failure and switches to on-chip low power RC oscillator • Programmable code protection • In-Circuit Serial Programming™ (ICSP™) • Selectable Power Management modes: - Sleep, Idle and Alternate Clock modes CMOS Technology: • • • • Low power, high speed Flash technology Wide operating voltage range (2.5V to 5.5V) Industrial and Extended temperature ranges Low power consumption Preliminary DS70139C-page 1 dsPIC30F2011/2012/3012/3013 dsPIC30F2011/2012/3012/3013 Sensor Family Input Cap Output Comp/Std PWM A/D 12-bit 100 Ksps I 2 C™ Timer 16-bit SPI™ EEPROM Bytes UART Program Memory dsPIC30F2011 18 12K 4K 1024 – 3 2 2 8 ch 1 1 1 dsPIC30F3012 18 24K 8K 2048 1024 3 2 2 8 ch 1 1 1 Device Bytes Instructions SRAM Bytes Pins dsPIC30F2012 28 12K 4K 1024 – 3 2 2 10 ch 1 1 1 dsPIC30F3013 28 24K 8K 2048 1024 3 2 2 10 ch 2 1 1 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 AVDD AVSS AN6/SCK1/INT0/OCFA/RB6 EMUD2/AN7/OC2/IC2/INT2/RB7 VDD VSS PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5 PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4 EMUC2/OC1/IC1/INT1/RD0 dsPIC30F2012 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS AN6/OCFA/RB6 EMUD2/AN7/RB7 AN8/OC1/RB8 AN9/OC2/RB9 CN17/RF4 CN18/RF5 VDD VSS PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 SCK1/INT0/RF6 EMUC2/IC1/INT1/RD8 dsPIC30F3013 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS AN6/OCFA/RB6 EMUD2/AN7/RB7 AN8/OC1/RB8 AN9/OC2/RB9 U2RX/CN17/RF4 U2TX/CN18/RF5 VDD VSS PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 SCK1/INT0/RF6 EMUC2/IC1/INT1/RD8 Pin Diagrams 18-Pin PDIP and SOIC dsPIC30F2011 dsPIC30F3012 MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUD3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 28-Pin PDIP and SOIC MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD IC2/INT2/RD9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-Pin SPDIP and SOIC MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD IC2/INT2/RD9 Note: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 For descriptions of individual pins, see Section 1.0. DS70139C-page 2 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 Pin Diagrams 28 27 26 25 24 23 22 EMUC3/AN1/VREF-/CN3/RB1 EMUD3/AN0/VREF+/CN2/RB0 MCLR AVDD AVSS AN6/SCK1/INT0/OCFA/RB6 EMUD2/AN7/OC2/IC2/INT2/RB7 28-Pin QFN dsPIC30F2011 8 9 10 11 12 13 14 1 2 3 4 5 6 7 21 20 19 18 17 16 15 NC NC NC NC VDD VSS PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD NC EMUC2/OC1/IC1/INT1/RD0 NC PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 NC NC VSS OSC1/CLKI OSC2/CLKO/RC15 Note: For descriptions of individual pins, see Section 1.0. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 3 dsPIC30F2011/2012/3012/3013 Pin Diagrams 28 27 26 25 24 23 22 EMUC3/AN1/VREF-/CN3/RB1 EMUD3/AN0/VREF+/CN2/RB0 MCLR AVDD AVSS AN6/OCFA/RB6 EMUD2/AN7/RB7 28-Pin QFN dsPIC30F2012 8 9 10 11 12 13 14 1 2 3 4 5 6 7 21 20 19 18 17 16 15 AN8/OC1/RB8 AN9/OC2/RB9 CN17/RF4 CN18/RF5 VDD VSS PGC/EMUC/U1RX/SDI1/SDA/RF2 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD IC2/INT2/RD9 EMUC2/IC1/INT1/RD8 SCK1/INT0/RF6 PGD/EMUD/U1TX/SDO1/SCL/RF3 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 VSS OSC1/CLKI OSC2/CLKO/RC15 Note: For descriptions of individual pins, see Section 1.0. DS70139C-page 4 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 Pin Diagram PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4 NC EMUC2/OC1/IC1/INT1/RD0 NC NC NC NC NC VDD EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 44-Pin QFN 44 43 42 41 40 39 38 37 36 35 34 PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5 VSS NC VDD NC NC NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 dsPIC30F3012 33 32 31 30 29 28 27 26 25 24 23 OSC2/CLKO/RC15 OSC1/CLKI VSS VSS NC NC NC NC AN3/CN5/RB3 NC AN2/SS1/LVDIN/CN4/RB2 EMUD2/AN7/OC2/IC2/INT2/RB7 NC AN6/SCK1/INT0/OCFA/RB6 NC AVSS AVDD MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 NC NC 12 13 14 15 16 17 18 19 20 21 22 Note: For descriptions of individual pins, see Section 1.0. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 5 dsPIC30F2011/2012/3012/3013 Pin Diagrams 44 43 42 41 40 39 38 37 36 35 34 PGD/EMUD/U1TX/SDO1/SCL/RF3 SCK1/INT0/RF6 EMUC2/IC1/INT1/RD8 NC NC NC NC IC2/INT2/RD9 VDD EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 44-Pin QFN 1 2 3 4 5 6 7 8 9 10 11 dsPIC30F3013 33 32 31 30 29 28 27 26 25 24 23 OSC2/CLKO/RC15 OSC1/CLKI VSS VSS NC NC AN5/CN7/RB5 AN4/CN6/RB4 AN3/CN5/RB3 NC AN2/SS1/LVDIN/CN4/RB2 EMUD2/AN7/RB7 NC AN6/OCFA/RB6 NC AVSS AVDD MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 NC NC 12 13 14 15 16 17 18 19 20 21 22 PGC/EMUC/U1RX/SDI1/SDA/RF2 VSS NC VDD NC NC U2TX/CN18/RF5 NC U2RX/CN17/RF4 AN9/OC2/RB9 AN8/OC1/RB8 Note: For descriptions of individual pins, see Section 1.0. DS70139C-page 6 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 CPU Architecture Overview........................................................................................................................................................ 17 3.0 Memory Organization ................................................................................................................................................................. 27 4.0 Address Generator Units............................................................................................................................................................ 41 5.0 Flash Program Memory.............................................................................................................................................................. 47 6.0 Data EEPROM Memory ............................................................................................................................................................. 53 7.0 I/O Ports ..................................................................................................................................................................................... 57 8.0 Interrupts .................................................................................................................................................................................... 63 9.0 Timer1 Module ........................................................................................................................................................................... 71 10.0 Timer2/3 Module ........................................................................................................................................................................ 75 11.0 Input Capture Module................................................................................................................................................................. 81 12.0 Output Compare Module ............................................................................................................................................................ 85 13.0 SPI Module................................................................................................................................................................................. 89 14.0 I2C Module ................................................................................................................................................................................. 93 15.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 101 16.0 12-bit Analog-to-Digital Converter (A/D) Module...................................................................................................................... 109 17.0 System Integration ................................................................................................................................................................... 117 18.0 Instruction Set Summary .......................................................................................................................................................... 131 19.0 Development Support............................................................................................................................................................... 139 20.0 Electrical Characteristics .......................................................................................................................................................... 145 21.0 Packaging Information.............................................................................................................................................................. 187 Index .................................................................................................................................................................................................. 195 The Microchip Web Site ..................................................................................................................................................................... 201 Customer Change Notification Service .............................................................................................................................................. 201 Customer Support .............................................................................................................................................................................. 201 Reader Response .............................................................................................................................................................................. 202 Product Identification System ............................................................................................................................................................ 203 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 7 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 8 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 1.0 DEVICE OVERVIEW Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). This data sheet contains information specific to the dsPIC30F2011, dsPIC30F2012, dsPIC30F3012 and dsPIC30f3013 Digital Signal Controllers. These devices contain extensive Digital Signal Processor (DSP) functionality within a high-performance 16-bit microcontroller (MCU) architecture. The following block diagrams depict the architecture for these devices: • • • • Figure 1-1 illustrates the dsPIC30F2011 Figure 1-2 illustrates the dsPIC30F2012 Figure 1-3 illustrates the dsPIC30F3012 Figure 1-4 illustrates the dsPIC30F3013 Following the block diagrams, Table 1-1 relates the I/O functions to pinout information. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 9 dsPIC30F2011/2012/3012/3013 FIGURE 1-1: dsPIC30F2011 BLOCK DIAGRAM Y Data Bus X Data Bus 16 Interrupt Controller PSV & Table Data Access 24 Control Block 8 Data Latch Y Data RAM (512 bytes) Address Latch 16 24 Address Latch 16 16 EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4 PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5 AN6/SCK1/INT0/OCFA/RB6 EMUD2/AN7/OC2/IC2/INT2/RB7 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic Data Latch X Data RAM (512 bytes) Address Latch 16 16 24 Program Memory (12 Kbytes) 16 16 16 Data Latch Effective Address PORTB 16 ROM Latch 16 24 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 OSC2/CLKO/RC15 IR 16 16 16 x 16 W Reg Array Decode PORTC Instruction Decode & Control 16 16 Power-up Timer OSC1/CLKI Timing Generation DSP Engine VDD, VSS AVDD, AVSS Watchdog Timer Low Voltage Detect 12-bit ADC DS70139C-page 10 EMUC2/OC1/IC1/INT1/RD0 Oscillator Start-up Timer ALU<16> POR/BOR Reset MCLR Divide Unit 16 16 PORTD Input Capture Module Output Compare Module I2C™ Timers SPI1 UART1 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 1-2: dsPIC30F2012 BLOCK DIAGRAM Y Data Bus X Data Bus 16 Interrupt Controller PSV & Table Data Access 24 Control Block 8 16 16 Data Latch Y Data RAM (512 bytes) Address Latch 16 24 Address Latch 16 16 EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 AN6/OCFA/RB6 EMUD2/AN7/RB7 AN8/OC1/RB8 AN9/OC2/RB9 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic Data Latch X Data RAM (512 bytes) Address Latch 16 16 24 Program Memory (12 Kbytes) 16 Data Latch Effective Address 16 PORTB ROM Latch 16 24 IR 16 x 16 W Reg Array Decode Instruction Decode & Control Timing Generation DSP Engine VDD, VSS AVDD, AVSS Divide Unit EMUC2/IC1/INT1/RD8 IC2/INT2/RD9 Oscillator Start-up Timer ALU<16> POR/BOR Reset MCLR PORTC 16 16 Power-up Timer OSC1/CLKI EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 OSC2/CLKO/RC15 16 16 Watchdog Timer Low Voltage Detect 12-bit ADC PORTD 16 16 Input Capture Module Output Compare Module I2C™ Timers SPI1 UART1 PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 CN17/RF4 CN18/RF5 SCK1/INT0/RF6 PORTF © 2005 Microchip Technology Inc. Preliminary DS70139C-page 11 dsPIC30F2011/2012/3012/3013 FIGURE 1-3: dsPIC30F3012 BLOCK DIAGRAM Y Data Bus X Data Bus 16 16 Interrupt Controller PSV & Table Data Access 24 Control Block 8 Data Latch Y Data RAM (1 Kbytes) Address Latch 16 24 Address Latch Data EEPROM (1 Kbytes) 16 16 EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4 PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5 AN6/SCK1/INT0/OCFA/RB6 EMUD2/AN7/OC2/IC2/INT2/RB7 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic Data Latch X Data RAM (1 Kbytes) Address Latch 16 16 24 Program Memory (24 Kbytes) 16 16 Effective Address PORTB 16 Data Latch ROM Latch 16 24 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 OSC2/CLKO/RC15 IR 16 16 16 x 16 W Reg Array Decode PORTC Instruction Decode & Control 16 16 Power-up Timer OSC1/CLKI Timing Generation DSP Engine VDD, VSS AVDD, AVSS Watchdog Timer Low Voltage Detect 12-bit ADC DS70139C-page 12 EMUC2/OC1/IC1/INT1/RD0 Oscillator Start-up Timer ALU<16> POR/BOR Reset MCLR Divide Unit 16 16 PORTD Input Capture Module Output Compare Module I2C™ Timers SPI1 UART1 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 1-4: dsPIC30F3013 BLOCK DIAGRAM Y Data Bus X Data Bus PSV & Table Data Access 24 Control Block 8 16 16 16 Interrupt Controller 16 24 16 24 Address Latch Data Latch X Data RAM (1 Kbytes) Address Latch 16 16 16 EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 AN6/OCFA/RB6 EMUD2/AN7/RB7 AN8/OC1/RB8 AN9/OC2/RB9 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic Program Memory (24 Kbytes) 16 Data Latch Y Data RAM (1 Kbytes) Address Latch Data EEPROM (1 Kbytes) Data Latch Effective Address 16 PORTB ROM Latch 16 24 IR 16 16 x 16 W Reg Array Decode Instruction Decode & Control Timing Generation DSP Engine VDD, VSS AVDD, AVSS Divide Unit EMUC2/IC1/INT1/RD8 IC2/INT2/RD9 Oscillator Start-up Timer ALU<16> POR/BOR Reset MCLR PORTC 16 16 Power-up Timer OSC1/CLKI EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 OSC2/CLKO/RC15 16 Watchdog Timer Low Voltage Detect 12-bit ADC PORTD 16 16 Input Capture Module Output Compare Module I2C Timers SPI1 UART1, UART2 PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 U2RX/CN17/RF4 UT2X/CN18/RF5 SCK1/INT0/RF6 PORTF © 2005 Microchip Technology Inc. Preliminary DS70139C-page 13 dsPIC30F2011/2012/3012/3013 Table 1-1 provides a brief description of device I/O pinouts and the functions that may be multiplexed to a port pin. Multiple functions may exist on one port pin. When multiplexing occurs, the peripheral module’s functional requirements may force an override of the data direction of the port pin. TABLE 1-1: PINOUT I/O DESCRIPTIONS Pin Type Buffer Type AN0-AN9 I Analog AVDD P P AVSS P P CLKI I ST/CMOS CLKO O — CN0-CN7 I ST Input change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. EMUD EMUC EMUD1 EMUC1 EMUD2 EMUC2 EMUD3 EMUC3 I/O I/O I/O I/O I/O I/O I/O I/O ST ST ST ST ST ST ST ST ICD Primary Communication Channel data input/output pin. ICD Primary Communication Channel clock input/output pin. ICD Secondary Communication Channel data input/output pin. ICD Secondary Communication Channel clock input/output pin. ICD Tertiary Communication Channel data input/output pin. ICD Tertiary Communication Channel clock input/output pin. ICD Quaternary Communication Channel data input/output pin. ICD Quaternary Communication Channel clock input/output pin. IC1-IC2 I ST Capture inputs 1 through 2. INT0 INT1 INT2 I I I ST ST ST External interrupt 0. External interrupt 1. External interrupt 2. LVDIN I Analog MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an active low Reset to the device. OC1-OC2 OCFA O I — ST Compare outputs 1 through 2. Compare Fault A input. OSC1 I ST/CMOS OSC2 I/O — Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. PGD PGC I/O I ST ST In-Circuit Serial Programming data input/output pin. In-Circuit Serial Programming clock input pin. RB0-RB9 I/O ST PORTB is a bidirectional I/O port. RC13-RC15 I/O ST PORTC is a bidirectional I/O port. RD0, RD8-RD9 I/O ST PORTD is a bidirectional I/O port. Pin Name Description Analog input channels. Positive supply for analog module. Ground reference for analog module. External clock source input. Always associated with OSC1 pin function. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. Low Voltage Detect Reference Voltage input pin. RF2-RF5 I/O ST PORTF is a bidirectional I/O port. SCK1 SDI1 SDO1 SS1 I/O I O I ST ST — ST Synchronous serial clock input/output for SPI1. SPI1 Data In. SPI1 Data Out. SPI1 Slave Synchronization. Legend: CMOS = CMOS compatible input or output Analog= ST = Schmitt Trigger input with CMOS levelsO= I = Input P = DS70139C-page 14 Analog input Output Power Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type Buffer Type SCL SDA I/O I/O ST ST SOSCO SOSCI O I — ST/CMOS T1CK T2CK I I ST ST Timer1 external clock input. Timer2 external clock input. U1RX U1TX U1ARX U1ATX U2RX U2TX I O I O I O ST — ST — ST — UART1 Receive. UART1 Transmit. UART1 Alternate Receive. UART1 Alternate Transmit. UART2 Receive. UART2 Transmit. Pin Name Description Synchronous serial clock input/output for I2C. Synchronous serial data input/output for I2C. 32 kHz low power oscillator crystal output. 32 kHz low power oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. VDD P — Positive supply for logic and I/O pins. VSS P — Ground reference for logic and I/O pins. VREF+ I Analog Analog Voltage Reference (High) input. I Analog Analog Voltage Reference (Low) input. VREF- Legend: CMOS = CMOS compatible input or output Analog= ST = Schmitt Trigger input with CMOS levelsO= I = Input P = © 2005 Microchip Technology Inc. Analog input Output Power Preliminary DS70139C-page 15 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 16 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 2.0 CPU ARCHITECTURE OVERVIEW Two ways to access data in program memory are: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). This section is an overview of the CPU architecture of the dsPIC30F. The core has a 24-bit instruction word. The Program Counter (PC) is 23-bits wide with the Least Significant (LS) bit always clear (see Section 3.1). The Most Significant (MS) bit is ignored during normal program execution, except for certain specialized instructions. Thus, the PC can address up to 4M instruction words of user program space. An instruction pre-fetch mechanism helps maintain throughput. Program loop constructs, free from loop count management overhead, are supported using the DO and REPEAT instructions, both of which are interruptible at any point. 2.1 Core Overview The working register array consists of 16 x 16-bit registers, each of which can act as data, address or offset registers. One working register (W15) operates as a software stack pointer for interrupts and calls. The data space is 64 Kbytes (32K words) and is split into two blocks, referred to as X and Y data memory. Each block has its own independent Address Generation Unit (AGU). Most instructions operate solely through the X memory, AGU, which provides the appearance of a single unified data space. The Multiply-Accumulate (MAC) class of dual source DSP instructions operate through both the X and Y AGUs, splitting the data address space into two parts (see Section 3.2). The X and Y data space boundary is device specific and cannot be altered by the user. Each data word consists of 2 bytes, and most instructions can address data either as words or bytes. © 2005 Microchip Technology Inc. • The upper 32 Kbytes of data space memory can be mapped into the lower half (user space) of program space at any 16K program word boundary, defined by the 8-bit Program Space Visibility Page (PSVPAG) register. Thus any instruction can access program space as if it were data space, with a limitation that the access requires an additional cycle. Only the lower 16 bits of each instruction word can be accessed using this method. • Linear indirect access of 32K word pages within program space is also possible using any working register, via table read and write instructions. Table read and write instructions can be used to access all 24 bits of an instruction word. Overhead-free circular buffers (modulo addressing) are supported in both X and Y address spaces. This is primarily intended to remove the loop overhead for DSP algorithms. The X AGU also supports bit-reversed addressing on destination effective addresses to greatly simplify input or output data reordering for radix-2 FFT algorithms. Refer to Section 4.0 for details on modulo and bit-reversed addressing. The core supports Inherent (no operand), Relative, Literal, Memory Direct, Register Direct, Register Indirect, Register Offset and Literal Offset Addressing modes. Instructions are associated with predefined Addressing modes, depending upon their functional requirements. For most instructions, the core is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, 3-operand instructions are supported, allowing C = A+B operations to be executed in a single cycle. A DSP engine has been included to significantly enhance the core arithmetic capability and throughput. It features a high speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. Data in the accumulator or any working register can be shifted up to 15 bits right, or 16 bits left in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC class of instructions can concurrently fetch two data operands from memory while multiplying two W registers. To enable this concurrent fetching of data operands, the data space has been split for these instructions and linear for all others. This has been achieved in a transparent and flexible manner, by dedicating certain working registers to each address space for the MAC class of instructions. Preliminary DS70139C-page 17 dsPIC30F2011/2012/3012/3013 The core does not support a multi-stage instruction pipeline. However, a single stage instruction pre-fetch mechanism is used, which accesses and partially decodes instructions a cycle ahead of execution, in order to maximize available execution time. Most instructions execute in a single cycle with certain exceptions. The core features a vectored exception processing structure for traps and interrupts, with 62 independent vectors. The exceptions consist of up to 8 traps (of which 4 are reserved) and 54 interrupts. Each interrupt is prioritized based on a user assigned priority between 1 and 7 (1 being the lowest priority and 7 being the highest), in conjunction with a predetermined ‘natural order’. Traps have fixed priorities ranging from 8 to 15. 2.2 Programmer’s Model The programmer’s model is shown in Figure 2-1 and consists of 16 x 16-bit working registers (W0 through W15), 2 x 40-bit accumulators (AccA and AccB), STATUS register (SR), Data Table Page register (TBLPAG), Program Space Visibility Page register (PSVPAG), DO and REPEAT registers (DOSTART, DOEND, DCOUNT and RCOUNT) and Program Counter (PC). The working registers can act as data, address or offset registers. All registers are memory mapped. W0 acts as the W register for file register addressing. Some of these registers have a shadow register associated with each of them, as shown in Figure 2-1. The shadow register is used as a temporary holding register and can transfer its contents to or from its host register upon the occurrence of an event. None of the shadow registers are accessible directly. The following rules apply for transfer of registers into and out of shadows. • PUSH.S and POP.S W0, W1, W2, W3, SR (DC, N, OV, Z and C bits only) are transferred. • DO instruction DOSTART, DOEND, DCOUNT shadows are pushed on loop start, and popped on loop end. 2.2.1 SOFTWARE STACK POINTER/ FRAME POINTER The dsPIC® devices contain a software stack. W15 is the dedicated software Stack Pointer (SP), and will be automatically modified by exception processing and subroutine calls and returns. However, W15 can be referenced by any instruction in the same manner as all other W registers. This simplifies the reading, writing and manipulation of the stack pointer (e.g., creating stack frames). Note: In order to protect against misaligned stack accesses, W15<0> is always clear. W15 is initialized to 0x0800 during a Reset. The user may reprogram the SP during initialization to any location within data space. W14 has been dedicated as a stack frame pointer as defined by the LNK and ULNK instructions. However, W14 can be referenced by any instruction in the same manner as all other W registers. 2.2.2 STATUS REGISTER The dsPIC core has a 16-bit STATUS register (SR), the LS Byte of which is referred to as the SR Low byte (SRL) and the MS Byte as the SR High byte (SRH). See Figure 2-1 for SR layout. SRL contains all the MCU ALU operation status flags (including the Z bit), as well as the CPU Interrupt Priority Level status bits, IPL<2:0> and the Repeat Active status bit, RA. During exception processing, SRL is concatenated with the MS Byte of the PC to form a complete word value which is then stacked. The upper byte of the STATUS register contains the DSP Adder/Subtracter status bits, the DO Loop Active bit (DA) and the Digit Carry (DC) status bit. 2.2.3 PROGRAM COUNTER The program counter is 23-bits wide; bit 0 is always clear. Therefore, the PC can address up to 4M instruction words. When a byte operation is performed on a working register, only the Least Significant Byte of the target register is affected. However, a benefit of memory mapped working registers is that both the Least and Most Significant Bytes can be manipulated through byte wide data memory space accesses. DS70139C-page 18 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 2-1: PROGRAMMER’S MODEL D15 D0 W0/WREG PUSH.S Shadow W1 DO Shadow W2 W3 Legend W4 DSP Operand Registers W5 W6 W7 Working Registers W8 W9 DSP Address Registers W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer SPLIM AD39 Stack Pointer Limit Register AD15 AD31 AD0 AccA DSP Accumulators AccB PC22 PC0 Program Counter 0 0 7 TABPAG TBLPAG 7 Data Table Page Address 0 PSVPAG Program Space Visibility Page Address 15 0 RCOUNT REPEAT Loop Counter 15 0 DCOUNT DO Loop Counter 22 0 DOSTART DO Loop Start Address DOEND DO Loop End Address 22 15 0 Core Configuration Register CORCON OA OB SA SB OAB SAB DA SRH © 2005 Microchip Technology Inc. DC IPL2 IPL1 IPL0 RA N OV Z C Status Register SRL Preliminary DS70139C-page 19 dsPIC30F2011/2012/3012/3013 2.3 Divide Support The dsPIC devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides. The following instructions and data sizes are supported: 1. 2. 3. 4. 5. DIVF - 16/16 signed fractional divide DIV.sd - 32/16 signed divide DIV.ud - 32/16 unsigned divide DIV.sw - 16/16 signed divide DIV.uw - 16/16 unsigned divide The divide instructions must be executed within a REPEAT loop. Any other form of execution (e.g., a series of discrete divide instructions) will not function correctly because the instruction flow depends on RCOUNT. The divide instruction does not automatically set up the RCOUNT value and it must, therefore, be explicitly and correctly specified in the REPEAT instruction as shown in Table 2-1 (REPEAT will execute the target instruction {operand value+1} times). The REPEAT loop count must be setup for 18 iterations of the DIV/ DIVF instruction. Thus, a complete divide operation requires 19 cycles. The 16/16 divides are similar to the 32/16 (same number of iterations), but the dividend is either zero-extended or sign-extended during the first iteration. TABLE 2-1: Note: The divide flow is interruptible. However, the user needs to save the context as appropriate. DIVIDE INSTRUCTIONS Instruction Function DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1 DIV.sd Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1 DIV.sw or DIV.s Signed divide: Wm/Wn → W0; Rem → W1 DIV.ud Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1 DIV.uw or DIV.u Unsigned divide: Wm/Wn → W0; Rem → W1 DS70139C-page 20 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 2.4 DSP Engine The DSP engine consists of a high speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/ subtracter (with two target accumulators, round and saturation logic). The DSP engine also has the capability to perform inherent accumulator-to-accumulator operations, which require no additional data. These instructions are ADD, SUB and NEG. The dsPIC30F is a single-cycle instruction flow architecture, threfore, concurrent operation of the DSP engine with MCU instruction flow is not possible. However, some MCU ALU and DSP engine resources may be used concurrently by the same instruction (e.g., ED, EDAC). TABLE 2-2: The DSP engine has various options selected through various bits in the CPU Core Configuration register (CORCON), as listed below: 1. 2. 3. 4. 5. 6. Fractional or integer DSP multiply (IF). Signed or unsigned DSP multiply (US). Conventional or convergent rounding (RND). Automatic saturation on/off for AccA (SATA). Automatic saturation on/off for AccB (SATB). Automatic saturation on/off for writes to data memory (SATDW). Accumulator Saturation mode selection (ACCSAT). 7. Note: For CORCON layout, see Table 3-3. A block diagram of the DSP engine is shown in Figure 2-2. DSP INSTRUCTION SUMMARY Instruction Algebraic Operation CLR A=0 ED A = (x – y)2 ACC WB? Yes No 2 EDAC A = A + (x – y) No MAC A = A + (x * y) Yes MAC A = A + x2 No No change in A Yes A=x*y No A=–x*y No A=A–x*y Yes MOVSAC MPY MPY.N MSC © 2005 Microchip Technology Inc. Preliminary DS70139C-page 21 dsPIC30F2011/2012/3012/3013 FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM 40 S a 40 Round t 16 u Logic r a t e 40-bit Accumulator A 40-bit Accumulator B Carry/Borrow Out Carry/Borrow In Saturate Adder Negate 40 40 40 16 X Data Bus Barrel Shifter 40 Y Data Bus Sign-Extend 32 16 Zero Backfill 32 33 17-bit Multiplier/Scaler 16 16 To/From W Array DS70139C-page 22 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 2.4.1 MULTIPLIER 2.4.2.1 The 17 x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17 x 17-bit multiplier/scaler is a 33-bit value which is sign-extended to 40 bits. Integer data is inherently represented as a signed two’s complement value, where the MSB is defined as a sign bit. Generally speaking, the range of an N-bit two’s complement integer is -2N-1 to 2N-1 – 1. For a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF) including ‘0’. For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,645 (0x7FFF FFFF). When the multiplier is configured for fractional multiplication, the data is represented as a two’s complement fraction, where the MSB is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit two’s complement fraction with this implied radix point is -1.0 to (1 – 21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF) including ‘0’ and has a precision of 3.01518x10-5. In Fractional mode, the 16x16 multiply operation generates a 1.31 product which has a precision of 4.65661 x 10-10. The same multiplier is used to support the MCU multiply instructions which include integer 16-bit signed, unsigned and mixed sign multiplies. The adder/subtracter is a 40-bit adder with an optional zero input into one side and either true, or complement data into the other input. In the case of addition, the carry/borrow input is active high and the other input is true data (not complemented), whereas in the case of subtraction, the carry/borrow input is active low and the other input is complemented. The adder/subtracter generates overflow status bits SA/SB and OA/OB, which are latched and reflected in the STATUS register: • Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. • Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits bits are not identical to each other. The adder has an additional saturation block which controls accumulator data saturation, if selected. It uses the result of the adder, the overflow status bits described above, and the SATA/B (CORCON<7:6>) and ACCSAT (CORCON<4>) mode control bits to determine when and to what value to saturate. Six Status register bits have been provided to support saturation and overflow; they are: 1. 2. 3. The MUL instruction may be directed to use byte or word sized operands. Byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the W array. 2.4.2 4. DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/ subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its preaccumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled via the barrel shifter, prior to accumulation. © 2005 Microchip Technology Inc. Adder/Subtracter, Overflow and Saturation 5. 6. OA: AccA overflowed into guard bits OB: AccB overflowed into guard bits SA: AccA saturated (bit 31 overflow and saturation) or AccA overflowed into guard bits and saturated (bit 39 overflow and saturation) SB: AccB saturated (bit 31 overflow and saturation) or AccB overflowed into guard bits and saturated (bit 39 overflow and saturation) OAB: Logical OR of OA and OB SAB: Logical OR of SA and SB The OA and OB bits are modified each time data passes through the adder/subtracter. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding overflow trap flag enable bit (OVATEN, OVBTEN) in the INTCON1 register (refer to Section 8.0) is set. This allows the user to take immediate action, for example, to correct system gain. Preliminary DS70139C-page 23 dsPIC30F2011/2012/3012/3013 The SA and SB bits are modified each time data passes through the adder/subtracter but can only be cleared by the user. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation, or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate an arithmetic warning trap when saturation is disabled. The overflow and saturation status bits can optionally be viewed in the STATUS register (SR) as the logical OR of OA and OB (in bit OAB) and the logical OR of SA and SB (in bit SAB). This allows programmers to check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This would be useful for complex number arithmetic which typically uses both the accumulators. The device supports three saturation and overflow modes: 1. 2. 3. Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF), or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. This is referred to as ‘super saturation’ and provides protection against erroneous data, or unexpected algorithm problems (e.g., gain calculations). Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF), or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. When this Saturation mode is in effect, the guard bits are not used (so the OA, OB or OAB bits are never set). Bit 39 Catastrophic Overflow: The bit 39 overflow status bit from the adder is used to set the SA or SB bit which remain set until cleared by the user. No saturation operation is performed and the accumulator is allowed to overflow (destroying its sign). If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. DS70139C-page 24 2.4.2.2 Accumulator ‘Write Back’ The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. The write is performed across the X bus into combined X and Y address space. The following Addressing modes are supported: 1. 2. W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. [W13]+=2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). 2.4.2.3 Round Logic The round logic is a combinational block which performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16bit, 1.15 data value which is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the LS Word is simply discarded. Conventional rounding takes bit 15 of the accumulator, zero-extends it and adds it to the ACCxH word (bits 16 through 31 of the accumulator). If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value will tend to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. If this is the case, the LS bit (bit 16 of the accumulator) of ACCxH is examined. If it is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme will remove any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus (subject to data saturation, see Section 2.4.2.4). Note that for the MAC class of instructions, the accumulator write back operation will function in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 2.4.2.4 Data Space Write Saturation 2.4.3 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data space may also be saturated but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. The barrel shifter is capable of performing up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators, or the X bus (to support multi-bit shifts of register or memory data). If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly, For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. The MS bit of the source (bit 39) is used to determine the sign of the operand being tested. The barrel shifter is 40-bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 to 31 for right shifts, and bit positions 0 to 16 for left shifts. The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value will shift the operand right. A negative value will shift the operand left. A value of ‘0’ will not modify the operand. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 25 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 26 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 3.0 MEMORY ORGANIZATION Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). 3.1 Program Address Space The program address space is 4M instruction words. The program space memory map for the dsPI30F2011/ 2012 is shown in Figure 3-1. The program space memory map for the dsPI30F3012/3013 is shown in Figure 3-2. © 2005 Microchip Technology Inc. Program memory is addressable by a 24-bit value from either the 23-bit PC, table instruction Effective Address (EA), or data space EA, when program space is mapped into data space as defined by Table 3-1. Note that the program space address is incremented by two between successive program words in order to provide compatibility with data space addressing. User program space access is restricted to the lower 4M instruction word address range (0x000000 to 0x7FFFFE) for all accesses other than TBLRD/TBLWT, which use TBLPAG<7> to determine user or configuration space access. In Table 3-1, Program Space Address Construction, bit 23 allows access to the Device ID, the User ID and the configuration bits. Otherwise, bit 23 is always clear. Preliminary DS70139C-page 27 dsPIC30F2011/2012/3012/3013 FIGURE 3-1: dsPIC30F2011/2012 PROGRAM SPACE MEMORY MAP Reset - GOTO Instruction Reset - Target Address FIGURE 3-2: dsPIC30F3012/3013 PROGRAM SPACE MEMORY MAP Reset - GOTO Instruction Reset - Target Address 000000 000002 000004 Interrupt Vector Table Interrupt Vector Table Vector Tables Reserved Vector Tables 00007E 000080 000084 Reserved 0000FE 000100 001FFE 002000 User Flash Program Memory (8K instructions) Reserved (Read ‘0’s) Reserved (Read ‘0’s) Data EEPROM (1 Kbyte) 7FFFFE 800000 F7FFFE F80000 F8000E F80010 Configuration Memory Space Configuration Memory Space 8005BE 8005C0 Reserved DS70139C-page 28 UNITID (32 instr.) 7FFBFE 7FFC00 8005BE 8005C0 8005FE 800600 Reserved Device Configuration Registers Reserved DEVID (2) 003FFE 004000 Reserved 8005FE 800600 Device Configuration Registers 000084 0000FE 000100 7FFFFE 800000 Reserved UNITID (32 instr.) 00007E 000080 Alternate Vector Table User Memory Space User Memory Space Alternate Vector Table User Flash Program Memory (4K instructions) 000000 000002 000004 F7FFFE F80000 F8000E F80010 Reserved FEFFFE FF0000 FFFFFE DEVID (2) Preliminary FEFFFE FF0000 FFFFFE © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION Program Space Address Access Space Access Type <23> <22:16> <15> <14:1> Instruction Access User TBLRD/TBLWT User (TBLPAG<7> = 0) TBLPAG<7:0> Data EA<15:0> TBLRD/TBLWT Configuration (TBLPAG<7> = 1) TBLPAG<7:0> Data EA<15:0> Program Space Visibility User FIGURE 3-3: <0> PC<22:1> 0 0 PSVPAG<7:0> 0 Data EA<14:0> DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION 23 bits Using Program Counter Program Counter 0 Select Using Program Space Visibility 0 1 0 EA PSVPAG Reg 8 bits 15 bits EA Using Table Instruction 1/0 User/ Configuration Space Select Note: TBLPAG Reg 8 bits 16 bits 24-bit EA Byte Select Program space visibility cannot be used to access bits <23:16> of a word in program memory. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 29 dsPIC30F2011/2012/3012/3013 3.1.1 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS A set of table instructions are provided to move byte or word sized data to and from program space. 1. This architecture fetches 24-bit wide program memory. Consequently, instructions are always aligned. However, as the architecture is modified Harvard, data can also be present in program space. There are two methods by which program space can be accessed: via special table instructions, or through the remapping of a 16K word program space page into the upper half of data space (see Section 3.1.2). The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the LS Word of any address within program space, without going through data space. The TBLRDH and TBLWTH instructions are the only method whereby the upper 8 bits of a program space word can be accessed as data. 2. 3. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit word wide address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space which contains the LS Data Word, and TBLRDH and TBLWTH access the space which contains the MS Data Byte. 4. TBLRDL: Table Read Low Word: Read the LS Word of the program address; P<15:0> maps to D<15:0>. Byte: Read one of the LS Bytes of the program address; P<7:0> maps to the destination byte when byte select = 0; P<15:8> maps to the destination byte when byte select = 1. TBLWTL: Table Write Low (refer to Section 5.0 for details on Flash Programming) TBLRDH: Table Read High Word: Read the MS Word of the program address; P<23:16> maps to D<7:0>; D<15:8> will always be = 0. Byte: Read one of the MS Bytes of the program address; P<23:16> maps to the destination byte when byte select = 0; The destination byte will always be = 0 when byte select = 1. TBLWTH: Table Write High (refer to Section 5.0 for details on Flash Programming) Figure 3-3 shows how the EA is created for table operations and data space accesses (PSV = 1). Here, P<23:0> refers to a program space word, whereas D<15:0> refers to a data space word. FIGURE 3-4: PROGRAM DATA TABLE ACCESS (LS WORD) PC Address 0x000000 0x000002 0x000004 0x000006 Program Memory ‘Phantom’ Byte (read as ‘0’) DS70139C-page 30 23 16 8 0 00000000 00000000 00000000 00000000 TBLRDL.W TBLRDL.B (Wn<0> = 0) TBLRDL.B (Wn<0> = 1) Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 3-5: PROGRAM DATA TABLE ACCESS (MS BYTE) TBLRDH.W PC Address 0x000000 0x000002 0x000004 0x000006 23 16 8 0 00000000 00000000 00000000 00000000 TBLRDH.B (Wn<0> = 0) Program Memory ‘Phantom’ Byte (read as ‘0’) 3.1.2 TBLRDH.B (Wn<0> = 1) DATA ACCESS FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY The upper 32 Kbytes of data space may optionally be mapped into any 16K word program space page. This provides transparent access of stored constant data from X data space without the need to use special instructions (i.e., TBLRDL/H, TBLWTL/H instructions). Program space access through the data space occurs if the MS bit of the data space EA is set and program space visibility is enabled by setting the PSV bit in the Core Control register (CORCON). The functions of CORCON are discussed in Section 2.4, DSP Engine. Data accesses to this area add an additional cycle to the instruction being executed, since two program memory fetches are required. Note that the upper half of addressable data space is always part of the X data space. Therefore, when a DSP operation uses program space mapping to access this memory region, Y data space should typically contain state (variable) data for DSP operations, whereas X data space should typically contain coefficient (constant) data. Although each data space address, 0x8000 and higher, maps directly into a corresponding program memory address (see Figure 3-6), only the lower 16 bits of the 24-bit program word are used to contain the data. The upper 8 bits should be programmed to force an illegal instruction to maintain machine robustness. Refer to the Programmer’s Reference Manual (DS70030) for details on instruction encoding. © 2005 Microchip Technology Inc. Note that by incrementing the PC by 2 for each program memory word, the LS 15 bits of data space addresses directly map to the LS 15 bits in the corresponding program space addresses. The remaining bits are provided by the Program Space Visibility Page register, PSVPAG<7:0>, as shown in Figure 3-6. Note: PSV access is temporarily disabled during table reads/writes. For instructions that use PSV which are executed outside a REPEAT loop: • The following instructions will require one instruction cycle in addition to the specified execution time: - MAC class of instructions with data operand pre-fetch - MOV instructions - MOV.D instructions • All other instructions will require two instruction cycles in addition to the specified execution time of the instruction. For instructions that use PSV which are executed inside a REPEAT loop: • The following instances will require two instruction cycles in addition to the specified execution time of the instruction: - Execution in the first iteration - Execution in the last iteration - Execution prior to exiting the loop due to an interrupt - Execution upon re-entering the loop after an interrupt is serviced • Any other iteration of the REPEAT loop will allow the instruction accessing data, using PSV, to execute in a single cycle. Preliminary DS70139C-page 31 dsPIC30F2011/2012/3012/3013 FIGURE 3-6: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION Data Space Program Space 0x0000 PSVPAG(1) 0x00 8 15 EA<15> = 0 Data 16 Space 15 EA EA<15> = 1 0x000000 0x8000 15 Address Concatenation 23 23 15 0 0x001200 Upper Half of Data Space is Mapped into Program Space 0x001FFF 0xFFFF Data Read BSET MOV MOV MOV Note: CORCON,#2 ; Set PSV bit #0x0, W0 ; Set PSVPAG register W0, PSVPAG 0x9200, W0 ; Access program memory location ; using a data space access PSVPAG is an 8-bit register, containing bits <22:15> of the program space address. DS70139C-page 32 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 3.2 Data Address Space The core has two data spaces. The data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. 3.2.1 DATA SPACE MEMORY MAP The data space memory is split into two blocks, X and Y data space. A key element of this architecture is that Y space is a subset of X space, and is fully contained within X space. In order to provide an apparent linear addressing space, X and Y spaces have contiguous addresses. FIGURE 3-7: When executing any instruction other than one of the MAC class of instructions, the X block consists of the 64Kbyte data address space (including all Y addresses). When executing one of the MAC class of instructions, the X block consists of the 64-Kbyte data address space excluding the Y address block (for data reads only). In other words, all other instructions regard the entire data memory as one composite address space. The MAC class instructions extract the Y address space from data space and address it using EAs sourced from W10 and W11. The remaining X data space is addressed using W8 and W9. Both address spaces are concurrently accessed only with the MAC class instructions. The data space memory map for the dsPIC30F2011 and dsPIC30F2012 is shown in Figure 3-7. The data space memory map for the dsPIC30F3012 and dsPIC30F3013 is shown in Figure 3-8. dsPIC30F2011/2012 DATA SPACE MEMORY MAP MS Byte Address MSB 2 Kbyte SFR Space 1 Kbyte SRAM Space LS Byte Address 16 bits LSB 0x0000 0x0001 SFR Space 0x07FF 0x0801 0x09FF 0x0A01 0x07FE 0x0800 X Data RAM (X) Y Data RAM (Y) 0x0BFF 0x0C01 0x0BFE 0x0C00 0x1FFF 0x1FFE 0x8001 0x8000 8 Kbyte Near Data Space X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFF © 2005 Microchip Technology Inc. 0x09FE 0x0A00 0xFFFE Preliminary DS70139C-page 33 dsPIC30F2011/2012/3012/3013 FIGURE 3-8: dsPIC30F3012/3013 DATA SPACE MEMORY MAP MS Byte Address MSB 2 Kbyte SFR Space 2 Kbyte SRAM Space LS Byte Address 16 bits LSB 0x0000 0x0001 SFR Space 0x07FE 0x0800 0x07FF 0x0801 0x0BFF 0x0C01 X Data RAM (X) Y Data RAM (Y) 0x0FFF 0x1001 0x0FFE 0x1000 0x1FFF 0x1FFE 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFE 0xFFFF DS70139C-page 34 8 Kbyte Near Data Space 0x0BFE 0x0C00 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE SFR SPACE SFR SPACE X SPACE FIGURE 3-9: Y SPACE UNUSED X SPACE (Y SPACE) X SPACE UNUSED UNUSED Non-MAC Class Ops (Read/Write) MAC Class Ops (Write) Indirect EA using any W © 2005 Microchip Technology Inc. MAC Class Ops (Read) Indirect EA using W8, W9 Preliminary Indirect EA using W10, W11 DS70139C-page 35 dsPIC30F2011/2012/3012/3013 3.2.2 DATA SPACES 3.2.3 The X data space is used by all instructions and supports all Addressing modes. There are separate read and write data buses. The X read data bus is the return data path for all instructions that view data space as combined X and Y address space. It is also the X address space data path for the dual operand read instructions (MAC class). The X write data bus is the only write path to data space for all instructions. The X data space also supports modulo addressing for all instructions, subject to Addressing mode restrictions. Bit-reversed addressing is only supported for writes to X data space. The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. No writes occur across the Y bus. This class of instructions dedicates two W register pointers, W10 and W11, to always address Y data space, independent of X data space, whereas W8 and W9 always address X data space. Note that during accumulator write back, the data address space is considered a combination of X and Y data spaces, so the write occurs across the X bus. Consequently, the write can be to any address in the entire data space. The Y data space can only be used for the data prefetch operation associated with the MAC class of instructions. It also supports modulo addressing for automated circular buffers. Of course, all other instructions can access the Y data address space through the X data path as part of the composite linear space. The boundary between the X and Y data spaces is defined as shown in Figure 3-8 and is not user programmable. Should an EA point to data outside its own assigned address space, or to a location outside physical memory, an all zero word/byte will be returned. For example, although Y address space is visible by all non-MAC instructions using any Addressing mode, an attempt by a MAC instruction to fetch data from that space using W8 or W9 (X space pointers) will return 0x0000. TABLE 3-2: The core data width is 16 bits. All internal registers are organized as 16-bit wide words. Data space memory is organized in byte addressable, 16-bit wide blocks. 3.2.4 To help maintain backward compatibility with PICmicro® devices and improve data space memory usage efficiency, the dsPIC30F instruction set supports both word and byte operations. Data is aligned in data memory and registers as words, but all data space EAs resolve to bytes. Data byte reads will read the complete word which contains the byte, using the LS bit of any EA to determine which byte to select. The selected byte is placed onto the LS Byte of the X data path (no byte accesses are possible from the Y data path as the MAC class of instruction can only fetch words). That is, data memory and registers are organized as two parallel byte wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register which matches the byte address. As a consequence of this byte accessibility, all effective address calculations (including those generated by the DSP operations which are restricted to word sized data) are internally scaled to step through word aligned memory. For example, the core would recognize that Post-Modified Register Indirect Addressing mode [Ws++] will result in a value of Ws+1 for byte operations and Ws+2 for word operations. All word accesses must be aligned to an even address. Misaligned word data fetches are not supported so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. Should a misaligned read or write be attempted, an address error trap will be generated. If the error occurred on a read, the instruction underway is completed, whereas if it occurred on a write, the instruction will be executed but the write will not occur. In either case, a trap will then be executed, allowing the system and/or user to examine the machine state prior to execution of the address fault. 15 Data Returned EA = an unimplemented address 0x0000 W8 or W9 used to access Y data space in a MAC instruction 0x0000 W10 or W11 used to access X data space in a MAC instruction 0x0000 DATA ALIGNMENT FIGURE 3-10: EFFECT OF INVALID MEMORY ACCESSES Attempted Operation DATA SPACE WIDTH DATA ALIGNMENT MS Byte 87 LS Byte 0 0001 Byte1 Byte 0 0000 0003 Byte3 Byte 2 0002 0005 Byte5 Byte 4 0004 All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes or 32K words. DS70139C-page 36 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 All byte loads into any W register are loaded into the LS Byte. The MSB is not modified. A sign-extend (SE) instruction is provided to allow users to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, users can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. Although most instructions are capable of operating on word or byte data sizes, it should be noted that some instructions, including the DSP instructions, operate only on words. 3.2.5 NEAR DATA SPACE An 8-Kbyte ‘near’ data space is reserved in X address memory space between 0x0000 and 0x1FFF, which is directly addressable via a 13-bit absolute address field within all memory direct instructions. The remaining X address space and all of the Y address space is addressable indirectly. Additionally, the whole of X data space is addressable using MOV instructions, which support memory direct addressing with a 16-bit address field. 3.2.6 There is a Stack Pointer Limit register (SPLIM) associated with the stack pointer. SPLIM is uninitialized at Reset. As is the case for the stack pointer, SPLIM<0> is forced to ‘0’ because all stack operations must be word aligned. Whenever an effective address (EA) is generated using W15 as a source or destination pointer, the address thus generated is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a Stack Error Trap will not occur. The Stack Error Trap will occur on a subsequent push operation. Thus, for example, if it is desirable to cause a Stack Error Trap when the stack grows beyond address 0x2000 in RAM, initialize the SPLIM with the value, 0x1FFE. Similarly, a stack pointer underflow (stack error) trap is generated when the stack pointer address is found to be less than 0x0800, thus preventing the stack from interfering with the Special Function Register (SFR) space. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. SOFTWARE STACK The dsPIC devices contain a software stack. W15 is used as the stack pointer. The stack pointer always points to the first available free word and grows from lower addresses towards higher addresses. It pre-decrements for stack pops and post-increments for stack pushes as shown in Figure 3-11. Note that for a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. Note: A PC push during exception processing will concatenate the SRL register to the MSB of the PC prior to the push. FIGURE 3-11: Stack Grows Towards Higher Address 0x0000 CALL STACK FRAME 15 0 PC<15:0> 000000000 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP : [--W15] PUSH : [W15++] © 2005 Microchip Technology Inc. Preliminary DS70139C-page 37 DS70139C-page 38 Preliminary 0040 0042 DOENDH SR OA — — — — — Bit 15 u = uninitialized bit 003E DOENDL Legend: 003C 0032 TBLPAG DOSTARTH 0030 PCH 003A 002E PCL DOSTARTL 002C ACCBU 0038 002A ACCBH DCOUNT 0028 ACCBL 0036 0026 ACCAU RCOUNT 0024 ACCAH 0034 0022 ACCAL PSVPAG 0020 SPLIM 001A W13 001E 0018 W12 W15 0016 W11 001C 0014 W10 W14 0010 0012 000E W8 000C W6 W7 W9 0008 000A W4 W5 0004 0006 W2 W3 0000 0002 W0 W1 SFR Name OB — — — — — Bit 14 Bit 12 Bit 11 SA — — — — — SB — — — — — OAB — — — — — Sign-Extension (ACCB<39>) SAB — — — — — Bit 10 Sign-Extension (ACCA<39>) Bit 13 CORE REGISTER MAP Address (Home) TABLE 3-3: DA — — — — — DCOUNT RCOUNT — — — PCL ACCBH ACCBL ACCAH ACCAL SPLIM W15 W14 W13 W12 W11 W10 W9 W8 W7 W6 W5 W4 W3 W2 W1 DC — DOENDL — IPL2 — — — Bit 7 W0/WREG Bit 8 DOSTARTL Bit 9 IPL1 Bit 6 IPL0 Bit 5 Bit 3 RA N DOENDH DOSTARTH PSVPAG TBLPAG PCH ACCBU ACCAU Bit 4 OV Bit 2 Z Bit 1 C 0 0 Bit 0 0000 0000 0000 0000 0000 0000 0uuu uuuu uuuu uuuu uuuu uuu0 0000 0000 0uuu uuuu uuuu uuuu uuuu uuu0 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 Reset State dsPIC30F2011/2012/3012/3013 © 2005 Microchip Technology Inc. — 0046 © 2005 Microchip Technology Inc. 004E 0050 0052 YMODSRT YMODEND XBREV DISICNT — BREN — YMODEN — Bit 14 — — Bit 13 — US Bit 12 EDT Bit 11 DL1 Bit 9 BWM<3:0> DL2 Bit 10 YE<15:1> YS<15:1> XE<15:1> XS<15:1> DL0 Bit 8 Bit 4 SATDW ACCSAT Bit 5 YWM<3:0> SATB Bit 6 DISICNT<13:0> XB<14:0> SATA Bit 7 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. u = uninitialized bit 004C XMODEND Legend: 0048 004A XMODSRT XMODEN 0044 CORCON MODCON SFR Name Bit 15 CORE REGISTER MAP (CONTINUED) Address (Home) TABLE 3-3: IPL3 Bit 3 RND Bit 1 XWM<3:0> PSV Bit 2 1 0 1 0 IF Bit 0 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuu1 uuuu uuuu uuuu uuu0 uuuu uuuu uuuu uuu1 uuuu uuuu uuuu uuu0 0000 0000 0000 0000 0000 0000 0010 0000 Reset State dsPIC30F2011/2012/3012/3013 Preliminary DS70139C-page 39 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 40 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 4.0 ADDRESS GENERATOR UNITS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). The dsPIC core contains two independent address generator units: the X AGU and Y AGU. The Y AGU supports word sized data reads for the DSP MAC class of instructions only. The dsPIC AGUs support three types of data addressing: • Linear Addressing • Modulo (Circular) Addressing • Bit-Reversed Addressing FILE REGISTER INSTRUCTIONS Most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). Most file register instructions employ a working register W0, which is denoted as WREG in these instructions. The destination is typically either the same file register, or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction allows additional flexibility and can access the entire data space during file register operation. 4.1.2 MCU INSTRUCTIONS The three-operand MCU instructions are of the form: Operand 3 = Operand 1 <function> Operand 2 Linear and Modulo Data Addressing modes can be applied to data space or program space. Bit-reversed addressing is only applicable to data space addresses. 4.1 4.1.1 Instruction Addressing Modes The addressing modes in Table 4-1 form the basis of the addressing modes optimized to support the specific features of individual instructions. The addressing modes provided in the MAC class of instructions are somewhat different from those in the other instruction types. where Operand 1 is always a working register (i.e., the addressing mode can only be register direct), which is referred to as Wb. Operand 2 can be a W register, fetched from data memory, or a 5-bit literal. The result location can be either a W register or an address location. The following addressing modes are supported by MCU instructions: • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified 5-bit or 10-bit Literal Note: TABLE 4-1: Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. FUNDAMENTAL ADDRESSING MODES SUPPORTED Addressing Mode Description File Register Direct The address of the File register is specified explicitly. Register Direct The contents of a register are accessed directly. Register Indirect The contents of Wn forms the EA. Register Indirect Post-modified The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Register Indirect Pre-modified Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Register Indirect with Register Offset The sum of Wn and Wb forms the EA. Register Indirect with Literal Offset © 2005 Microchip Technology Inc. The sum of Wn and a literal forms the EA. Preliminary DS70139C-page 41 dsPIC30F2011/2012/3012/3013 4.1.3 MOVE AND ACCUMULATOR INSTRUCTIONS In summary, the following addressing modes are supported by the MAC class of instructions: Move instructions and the DSP accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the addressing modes supported by most MCU instructions, move and accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (register offset) field is shared between both source and destination (but typically only used by one). In summary, the following addressing modes are supported by move and accumulator instructions: • • • • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: 4.1.4 Register Indirect Register Indirect Post-modified by 2 Register Indirect Post-modified by 4 Register Indirect Post-modified by 6 Register Indirect with Register Offset (Indexed) 4.1.5 OTHER INSTRUCTIONS Besides the various addressing modes outlined above, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. 4.2 Modulo Addressing Modulo addressing is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. MAC INSTRUCTIONS The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, utilize a simplified set of addressing modes to allow the user to effectively manipulate the data pointers through register indirect tables. The 2 source operand pre-fetch registers must be a member of the set {W8, W9, W10, W11}. For data reads, W8 and W9 will always be directed to the X RAGU and W10 and W11 will always be directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Note: • • • • • Modulo addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for modulo addressing since these two registers are used as the stack frame pointer and stack pointer, respectively. In general, any particular circular buffer can only be configured to operate in one direction, as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing buffers) based upon the direction of the buffer. The only exception to the usage restrictions is for buffers which have a power-of-2 length. As these buffers satisfy the start and end address criteria, they may operate in a Bidirectional mode (i.e., address boundary checks will be performed on both the lower and upper address boundaries). Register indirect with register offset addressing is only available for W9 (in X space) and W11 (in Y space). DS70139C-page 42 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 4.2.1 START AND END ADDRESS 4.2.2 The modulo addressing scheme requires that a starting and an ending address be specified and loaded into the 16-bit Modulo Buffer Address registers: XMODSRT, XMODEND, YMODSRT and YMODEND (see Table 3-3). Note: Y space modulo addressing EA calculations assume word sized data (LS bit of every EA is always clear). The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register MODCON<15:0> contains enable flags as well as a W register field to specify the W address registers. The XWM and YWM fields select which registers will operate with modulo addressing. If XWM = 15, X RAGU and X WAGU modulo addressing is disabled. Similarly, if YWM = 15, Y AGU modulo addressing is disabled. The X Address Space Pointer W register (XWM), to which modulo addressing is to be applied, is stored in MODCON<3:0> (see Table 3-3). Modulo addressing is enabled for X data space when XWM is set to any value other than ‘15’ and the XMODEN bit is set at MODCON<15>. The Y Address Space Pointer W register (YWM), to which modulo addressing is to be applied, is stored in MODCON<7:4>. Modulo addressing is enabled for Y data space when YWM is set to any value other than ‘15’ and the YMODEN bit is set at MODCON<14>. FIGURE 4-1: Byte Address 0x1100 MOV MOV MOV MOV MOV MOV #0x1100,W0 W0,XMODSRT #0x1163,W0 W0,MODEND #0x8001,W0 W0,MODCON MOV #0x0000,W0 ;W0 holds buffer fill value MOV #0x1110,W1 ;point W1 to buffer DO AGAIN,#0x31 MOV W0,[W1++] AGAIN: INC W0,W0 0x1163 MODULO ADDRESSING OPERATION EXAMPLE ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;fill the 50 buffer locations ;fill the next location ;increment the fill value Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words © 2005 Microchip Technology Inc. Preliminary DS70139C-page 43 dsPIC30F2011/2012/3012/3013 4.2.3 MODULO ADDRESSING APPLICABILITY Modulo addressing can be applied to the effective address (EA) calculation associated with any W register. It is important to realize that the address boundaries check for addresses less than, or greater than the upper (for incrementing buffers), and lower (for decrementing buffers) boundary addresses (not just equal to). Address changes may, therefore, jump beyond boundaries and still be adjusted correctly. Note: 4.3 The modulo corrected effective address is written back to the register only when PreModify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (e.g., [W7+W2]) is used, modulo address correction is performed but the contents of the register remain unchanged. Bit-Reversed Addressing Bit-reversed addressing is intended to simplify data reordering for radix-2 FFT algorithms. It is supported by the X AGU for data writes only. The modifier, which may be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. 4.3.1 2. 3. XB<14:0> is the bit-reversed address modifier or ‘pivot point’ which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: BWM (W register selection) in the MODCON register is any value other than ‘15’ (the stack cannot be accessed using bit-reversed addressing) and the BREN bit is set in the XBREV register and the addressing mode used is Register Indirect with Pre-Increment or Post-Increment. DS70139C-page 44 All bit-reversed EA calculations assume word sized data (LS bit of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. When enabled, bit-reversed addressing will only be executed for register indirect with pre-increment or post-increment addressing and word sized data writes. It will not function for any other addressing mode or for byte sized data, and normal addresses will be generated instead. When bit-reversed addressing is active, the W address pointer will always be added to the address modifier (XB) and the offset associated with the Register Indirect Addressing mode will be ignored. In addition, as word sized data is a requirement, the LS bit of the EA is ignored (and always clear). Note: BIT-REVERSED ADDRESSING IMPLEMENTATION Bit-reversed addressing is enabled when: 1. If the length of a bit-reversed buffer is M = 2N bytes, then the last ‘N’ bits of the data buffer start address must be zeros. Modulo addressing and bit-reversed addressing should not be enabled together. In the event that the user attempts to do this, bit-reversed addressing will assume priority when active for the X WAGU, and X WAGU modulo addressing will be disabled. However, modulo addressing will continue to function in the X RAGU. If bit-reversed addressing has already been enabled by setting the BREN (XBREV<15>) bit, then a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 4-2: BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-word Bit-Reversed Buffer TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address Bit-Reversed Address A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 8 0 0 1 0 2 0 1 0 0 4 0 0 1 1 3 1 1 0 0 12 0 1 0 0 4 0 0 1 0 2 0 1 0 1 5 1 0 1 0 10 0 1 1 0 6 0 1 1 0 6 0 1 1 1 7 1 1 1 0 14 1 0 0 0 8 0 0 0 1 1 1 0 0 1 9 1 0 0 1 9 1 0 1 0 10 0 1 0 1 5 1 0 1 1 11 1 1 0 1 13 1 1 0 0 12 0 0 1 1 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value 1024 0x0200 512 0x0100 256 0x0080 128 0x0040 64 0x0020 32 0x0010 16 0x0008 8 0x0004 4 0x0002 2 0x0001 © 2005 Microchip Technology Inc. Preliminary DS70139C-page 45 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 46 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 5.0 FLASH PROGRAM MEMORY 5.2 Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user may erase program memory, 32 instructions (96 bytes) at a time and can write program memory data, 32 instructions (96 bytes) at a time. The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are two methods by which the user can program this memory: 1. 2. 5.1 5.3 Table Instruction Operation Summary The TBLRDL and the TBLWTL instructions are used to read or write to bits<15:0> of program memory. TBLRDL and TBLWTL can access program memory in Word or Byte mode. Run-Time Self-Programming (RTSP) In-Circuit Serial Programming™ (ICSP™) The TBLRDH and TBLWTH instructions are used to read or write to bits<23:16> of program memory. TBLRDH and TBLWTH can access program memory in Word or Byte mode. In-Circuit Serial Programming (ICSP) dsPIC30F devices can be serially programmed while in the end application circuit. This is simply done with two lines for Programming Clock and Programming Data (which are named PGC and PGD respectively), and three other lines for Power (VDD), Ground (VSS) and Master Clear (MCLR). this allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. FIGURE 5-1: Run-Time Self-Programming (RTSP) A 24-bit program memory address is formed using bits<7:0> of the TBLPAG register and the effective address (EA) from a W register specified in the table instruction, as shown in Figure 5-1. ADDRESSING FOR TABLE AND NVM REGISTERS 24 bits Using Program Counter Program Counter 0 0 NVMADR Reg EA Using NVMADR Addressing 1/0 NVMADRU Reg 8 bits 16 bits Working Reg EA Using Table Instruction User/Configuration Space Select © 2005 Microchip Technology Inc. 1/0 TBLPAG Reg 8 bits 16 bits 24-bit EA Preliminary Byte Select DS70139C-page 47 dsPIC30F2011/2012/3012/3013 5.4 RTSP Operation 5.5 The dsPIC30F Flash program memory is organized into rows and panels. Each row consists of 32 instructions, or 96 bytes. Each panel consists of 128 rows, or 4K x 24 instructions. RTSP allows the user to erase one row (32 instructions) at a time and to program four instructions at one time. RTSP may be used to program multiple program memory panels, but the table pointer must be changed at each panel boundary. Each panel of program memory contains write latches that hold 32 instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the panel write latches. The data to be programmed into the panel is loaded in sequential order into the write latches; instruction 0, instruction 1, etc. The instruction words loaded must always be from a group of 32 boundary. The basic sequence for RTSP programming is to set up a table pointer, then do a series of TBLWT instructions to load the write latches. Programming is performed by setting the special bits in the NVMCON register. 32 TBLWTL and four TBLWTH instructions are required to load the 32 instructions. If multiple panel programming is required, the table pointer needs to be changed and the next set of multiple write latches written. All of the table write operations are single word writes (2 instruction cycles), because only the table latches are written. A programming cycle is required for programming each row. The Flash Program Memory is readable, writable and erasable during normal operation over the entire VDD range. The four SFRs used to read and write the program Flash memory are: • • • • NVMCON NVMADR NVMADRU NVMKEY 5.5.1 NVMCON REGISTER The NVMCON register controls which blocks are to be erased, which memory type is to be programmed, and start of the programming cycle. 5.5.2 NVMADR REGISTER The NVMADR register is used to hold the lower two bytes of the effective address. The NVMADR register captures the EA<15:0> of the last table instruction that has been executed and selects the row to write. 5.5.3 NVMADRU REGISTER The NVMADRU register is used to hold the upper byte of the effective address. The NVMADRU register captures the EA<23:16> of the last table instruction that has been executed. 5.5.4 NVMKEY REGISTER NVMKEY is a write-only register that is used for write protection. To start a programming or an erase sequence, the user must consecutively write 0x55 and 0xAA to the NVMKEY register. Refer to Section 5.6 for further details. Note: DS70139C-page 48 Control Registers Preliminary The user can also directly write to the NVMADR and NVMADRU registers to specify a program memory address for erasing or programming. © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 5.6 Programming Operations 4. A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. A programming operation is nominally 2 msec in duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>) starts the operation, and the WR bit is automatically cleared when the operation is finished. 5.6.1 5. PROGRAMMING ALGORITHM FOR PROGRAM FLASH The user can erase or program one row of program Flash memory at a time. The general process is: 1. 2. 3. Read one row of program Flash (32 instruction words) and store into data RAM as a data “image”. Update the data image with the desired new data. Erase program Flash row. a) Setup NVMCON register for multi-word, program Flash, erase, and set WREN bit. b) Write address of row to be erased into NVMADRU/NVMDR. c) Write ‘55’ to NVMKEY. d) Write ‘AA’ to NVMKEY. e) Set the WR bit. This will begin erase cycle. f) CPU will stall for the duration of the erase cycle. g) The WR bit is cleared when erase cycle ends. EXAMPLE 5-1: 6. Write 32 instruction words of data from data RAM “image” into the program Flash write latches. Program 32 instruction words into program Flash. a) Setup NVMCON register for multi-word, program Flash, program, and set WREN bit. b) Write ‘55’ to NVMKEY. c) Write ‘AA’ to NVMKEY. d) Set the WR bit. This will begin program cycle. e) CPU will stall for duration of the program cycle. f) The WR bit is cleared by the hardware when program cycle ends. Repeat steps 1 through 5 as needed to program desired amount of program Flash memory. 5.6.2 ERASING A ROW OF PROGRAM MEMORY Example 5-1 shows a code sequence that can be used to erase a row (32 instructions) of program memory. ERASING A ROW OF PROGRAM MEMORY ; Setup NVMCON for erase operation, multi word ; program memory selected, and writes enabled MOV #0x4041,W0 ; ; MOV W0,NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR),W0 ; ; MOV W0,NVMADRU MOV #tbloffset(PROG_ADDR),W0 ; MOV W0, NVMADR ; DISI #5 ; ; MOV #0x55,W0 ; MOV W0,NVMKEY MOV #0xAA,W1 ; ; MOV W1,NVMKEY BSET NVMCON,#WR ; NOP ; NOP ; © 2005 Microchip Technology Inc. write Init NVMCON SFR Initialize PM Page Boundary SFR Intialize in-page EA[15:0] pointer Initialize NVMADR SFR Block all interrupts with priority <7 for next 5 instructions Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted Preliminary DS70139C-page 49 dsPIC30F2011/2012/3012/3013 5.6.3 LOADING WRITE LATCHES 5.6.4 Example 5-2 shows a sequence of instructions that can be used to load the 96 bytes of write latches. 32 TBLWTL and 32 TBLWTH instructions are needed to load the write latches selected by the table pointer. EXAMPLE 5-2: INITIATING THE PROGRAMMING SEQUENCE For protection, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs. LOADING WRITE LATCHES ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000,W0 ; ; Initialize PM Page Boundary SFR MOV W0,TBLPAG MOV #0x6000,W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0,W2 ; MOV #HIGH_BYTE_0,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] ; Write PM high byte into program latch TBLWTH W3,[W0++] ; 1st_program_word MOV #LOW_WORD_1,W2 ; MOV #HIGH_BYTE_1,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] TBLWTH W3,[W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2,W2 ; MOV #HIGH_BYTE_2,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] • • • ; 31st_program_word MOV #LOW_WORD_31,W2 ; MOV #HIGH_BYTE_31,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] Note: In Example 5-2, the contents of the upper byte of W3 has no effect. EXAMPLE 5-3: INITIATING A PROGRAMMING SEQUENCE DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR DS70139C-page 50 ; ; ; ; ; ; ; ; ; Block all interrupts with priority <7 for next 5 instructions Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted Preliminary © 2005 Microchip Technology Inc. 0766 NVMKEY — — WR Bit 15 — — WRERR Bit 13 — — — — — — — — — Bit 12 Bit 11 Bit 10 — — — Bit 9 — Bit 7 — — NVMADR<15:0> TWRI Bit 8 Bit 6 Bit 5 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. — — WREN Bit 14 NVM REGISTER MAP u = uninitialized bit 0764 NVMADRU Legend: 0760 0762 NVMCON Addr. NVMADR File Name TABLE 5-1: Bit 3 Bit 2 KEY<7:0> NVMADR<23:16> PROGOP<6:0> Bit 4 Bit 1 Bit 0 0000 0000 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu 0000 0000 0000 0000 All RESETS dsPIC30F2011/2012/3012/3013 © 2005 Microchip Technology Inc. Preliminary DS70139C-page 51 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 52 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 6.0 DATA EEPROM MEMORY Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). The Data EEPROM Memory is readable and writable during normal operation over the entire VDD range. The data EEPROM memory is directly mapped in the program memory address space. The four SFRs used to read and write the program Flash memory are used to access data EEPROM memory, as well. As described in Section 6.5, these registers are: • • • • NVMCON NVMADR NVMADRU NVMKEY The EEPROM data memory allows read and write of single words and 16-word blocks. When interfacing to data memory, NVMADR in conjunction with the NVMADRU register are used to address the EEPROM location being accessed. TBLRDL and TBLWTL instructions are used to read and write data EEPROM. The dsPIC30F devices have up to 8 Kbytes (4K words) of data EEPROM with an address range from 0x7FF000 to 0x7FFFFE. Control bit WR initiates write operations similar to program Flash writes. This bit cannot be cleared, only set, in software. They are cleared in hardware at the completion of the write operation. The inability to clear the WR bit in software prevents the accidental or premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and rewrite the location. The address register NVMADR remains unchanged. Note: 6.1 Interrupt flag bit NVMIF in the IFS0 register is set when write is complete. It must be cleared in software. Reading the Data EEPROM A TBLRD instruction reads a word at the current program word address. This example uses W0 as a pointer to data EEPROM. The result is placed in register W4 as shown in Example 6-1. EXAMPLE 6-1: MOV MOV MOV TBLRDL DATA EEPROM READ #LOW_ADDR_WORD,W0 ; Init Pointer #HIGH_ADDR_WORD,W1 W1,TBLPAG [ W0 ], W4 ; read data EEPROM A word write operation should be preceded by an erase of the corresponding memory location(s). The write typically requires 2 ms to complete but the write time will vary with voltage and temperature. A program or erase operation on the data EEPROM does not stop the instruction flow. The user is responsible for waiting for the appropriate duration of time before initiating another data EEPROM write/erase operation. Attempting to read the data EEPROM while a programming or erase operation is in progress results in unspecified data. © 2005 Microchip Technology Inc. DS70139C-page 53 dsPIC30F2011/2012/3012/3013 6.2 6.2.1 Erasing Data EEPROM ERASING A BLOCK OF DATA EEPROM In order to erase a block of data EEPROM, the NVMADRU and NVMADR registers must initially point to the block of memory to be erased. Configure NVMCON for erasing a block of data EEPROM, and set the ERASE and WREN bits in the NVMCON register. Setting the WR bit initiates the erase as shown in Example 6-2. EXAMPLE 6-2: DATA EEPROM BLOCK ERASE ; Select data EEPROM block, ERASE, WREN bits MOV #0x4045,W0 MOV W0,NVMCON ; Initialize NVMCON SFR ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; ; Write the 0xAA key MOV W1,NVMKEY BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete 6.2.2 ERASING A WORD OF DATA EEPROM The NVMADRU and NVMADR registers must point to the block. Select erase a block of data Flash, and set the ERASE and WREN bits in the NVMCON register. Setting the WR bit initiates the erase as shown in Example 6-3. EXAMPLE 6-3: DATA EEPROM WORD ERASE ; Select data EEPROM word, ERASE, WREN bits MOV #0x4044,W0 MOV W0,NVMCON ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; MOV W1,NVMKEY ; Write the 0xAA key BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete DS70139C-page 54 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 6.3 Writing to the Data EEPROM To write an EEPROM data location, the following sequence must be followed: 1. 2. 3. Erase data EEPROM word. a) Select word, data EEPROM erase, and set WREN bit in NVMCON register. b) Write address of word to be erased into NVMADR. c) Enable NVM interrupt (optional). d) Write ‘55’ to NVMKEY. e) Write ‘AA’ to NVMKEY. f) Set the WR bit. This will begin erase cycle. g) Either poll NVMIF bit or wait for NVMIF interrupt. h) The WR bit is cleared when the erase cycle ends. Write data word into data EEPROM write latches. Program 1 data word into data EEPROM. a) Select word, data EEPROM program, and set WREN bit in NVMCON register. b) Enable NVM write done interrupt (optional). c) Write ‘55’ to NVMKEY. d) Write ‘AA’ to NVMKEY. e) Set the WR bit. This will begin program cycle. f) Either poll NVMIF bit or wait for NVM interrupt. g) The WR bit is cleared when the write cycle ends. EXAMPLE 6-4: The write will not initiate if the above sequence is not exactly followed (write 0x55 to NVMKEY, write 0xAA to NVMCON, then set WR bit) for each word. It is strongly recommended that interrupts be disabled during this code segment. Additionally, the WREN bit in NVMCON must be set to enable writes. This mechanism prevents accidental writes to data EEPROM due to unexpected code execution. The WREN bit should be kept clear at all times except when updating the EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect the current write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. The WREN bit must be set on a previous instruction. Both WR and WREN cannot be set with the same instruction. At the completion of the write cycle, the WR bit is cleared in hardware and the Non-Volatile Memory Write Complete Interrupt Flag bit (NVMIF) is set. The user may either enable this interrupt or poll this bit. NVMIF must be cleared by software. 6.3.1 WRITING A WORD OF DATA EEPROM Once the user has erased the word to be programmed, then a table write instruction is used to write one write latch, as shown in Example 6-4. 6.3.2 WRITING A BLOCK OF DATA EEPROM To write a block of data EEPROM, write to all sixteen latches first, then set the NVMCON register and program the block. DATA EEPROM WORD WRITE ; Point to data memory MOV #LOW_ADDR_WORD,W0 MOV #HIGH_ADDR_WORD,W1 MOV W1,TBLPAG MOV #LOW(WORD),W2 TBLWTL W2,[ W0] ; The NVMADR captures last table access address ; Select data EEPROM for 1 word op MOV #0x4004,W0 MOV W0,NVMCON ; Operate key to allow write operation DISI #5 ; Init pointer ; Get data ; Write data ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 MOV W1,NVMKEY ; Write the 0xAA key BSET NVMCON,#WR ; Initiate program sequence NOP NOP ; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete © 2005 Microchip Technology Inc. DS70139C-page 55 dsPIC30F2011/2012/3012/3013 EXAMPLE 6-5: 6.4 DATA EEPROM BLOCK WRITE MOV MOV MOV MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV MOV DISI #5 #LOW_ADDR_WORD,W0 #HIGH_ADDR_WORD,W1 W1,TBLPAG #data1,W2 W2,[ W0]++ #data2,W2 W2,[ W0]++ #data3,W2 W2,[ W0]++ #data4,W2 W2,[ W0]++ #data5,W2 W2,[ W0]++ #data6,W2 W2,[ W0]++ #data7,W2 W2,[ W0]++ #data8,W2 W2,[ W0]++ #data9,W2 W2,[ W0]++ #data10,W2 W2,[ W0]++ #data11,W2 W2,[ W0]++ #data12,W2 W2,[ W0]++ #data13,W2 W2,[ W0]++ #data14,W2 W2,[ W0]++ #data15,W2 W2,[ W0]++ #data16,W2 W2,[ W0]++ #0x400A,W0 W0,NVMCON MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR ; Init pointer ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Get 1st data write data Get 2nd data write data Get 3rd data write data Get 4th data write data Get 5th data write data Get 6th data write data Get 7th data write data Get 8th data write data Get 9th data write data Get 10th data write data Get 11th data write data Get 12th data write data Get 13th data write data Get 14th data write data Get 15th data write data Get 16th data write data. The NVMADR captures last table access address. Select data EEPROM for multi word op Operate Key to allow program operation Block all interrupts with priority <7 for next 5 instructions ; Write the 0x55 key ; Write the 0xAA key ; Start write cycle Write Verify 6.5 Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. Protection Against Spurious Write There are conditions when the device may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built-in. On power-up, the WREN bit is cleared; also, the Power-up Timer prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch, or software malfunction. DS70139C-page 56 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 7.0 I/O PORTS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). All of the device pins (except VDD, VSS, MCLR and OSC1/CLKI) are shared between the peripherals and the parallel I/O ports. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 7.1 Parallel I/O (PIO) Ports When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin may be read but the output driver for the parallel port bit will be disabled. If a peripheral is enabled but the peripheral is not actively driving a pin, that pin may be driven by a port. Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers and the port pin will read as zeros. When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. A parallel I/O (PIO) port that shares a pin with a peripheral is, in general, subservient to the peripheral. The peripheral’s output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the I/O pad cell. Figure 7-1 shows how ports are shared with other peripherals and the associated I/O cell (pad) to which they are connected. The format of the registers for the shared ports, (PORTB, PORTC, PORTD and PORTF) are shown in Table 7-1 through Table 7-6. Note: All port pins have three registers directly associated with the operation of the port pin. The Data Direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a ‘1’, then the pin is an input. All port pins are defined as inputs after a Reset. Reads from the latch (LATx), read the latch. Writes to the latch, write the latch (LATx). Reads from the port (PORTx), read the port pins and writes to the port pins, write the latch (LATx). FIGURE 7-1: The actual bits in use vary between devices. BLOCK DIAGRAM OF A SHARED PORT STRUCTURE Output Multiplexers Peripheral Module Peripheral Input Data Peripheral Module Enable Peripheral Output Enable Peripheral Output Data I/O Cell 1 Output Enable 0 1 PIO Module Output Data 0 Read TRIS Data Bus WR TRIS D I/O Pad Q CK TRIS Latch D WR LAT + WR Port Q CK Data Latch Read LAT Input Data Read Port © 2005 Microchip Technology Inc. Preliminary DS70139C-page 57 dsPIC30F2011/2012/3012/3013 7.2 7.2.1 Configuring Analog Port Pins The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. When reading the Port register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) may cause the input buffer to consume current that exceeds the device specifications. DS70139C-page 58 I/O PORT WRITE/READ TIMING One instruction cycle is required between a port direction change or port write operation and a read operation of the same port. Typically this instruction would be a NOP. EXAMPLE 7-1: MOV #0xF0, W0; ; MOV W0, TRISB; NOP ; btss PORTB, #7; Preliminary PORT WRITE/READ EXAMPLE Configure PORTB<7:4> as inputs and PORTB<3:0> as outputs additional instruction cycle bit test RB7 and skip if set © 2005 Microchip Technology Inc. 02CB PORTB LATB © 2005 Microchip Technology Inc. 02CB PORTB LATB 02CE 02D0 LATC Preliminary 02D2 02D4 02D6 TRISD PORTD LATD Addr. SFR Name TABLE 7-4: 02CC PORTC Addr. TRISC SFR Name TABLE 7-3: 02C6 02C8 TRISB Addr. SFR Name TABLE 7-2: 02C6 02C8 TRISB Addr. SFR Name TABLE 7-1: — — — Bit 14 — — — Bit 13 — — — Bit 12 — — — Bit 11 — — — Bit 10 — — — Bit 9 — — — Bit 8 — — — Bit 14 — — — Bit 13 — — — Bit 12 — — — Bit 11 — — — Bit 10 LATB9 RB9 TRISB9 Bit 9 LATB8 RB8 TRISB8 Bit 8 Bit 14 Bit 13 LATC14 RC14 LATC13 RC13 — — — Bit 12 — — — Bit 11 — — — Bit 10 — — — Bit 9 — — — Bit 8 — — — Bit 15 — — — Bit 14 — — — Bit 13 — — — Bit 12 — — — Bit 11 — — — Bit 10 — — — Bit 9 — — — Bit 8 PORTD REGISTER MAP FOR dsPIC30F2011/3012 LATC15 RC15 TRISC15 TRISC14 TRISC13 Bit 15 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State RB6 Bit 6 LATB6 RB5 Bit 5 LATB5 RB4 Bit 4 LATB4 RB3 Bit 3 LATB3 RB2 Bit 2 LATB2 RB1 Bit 1 LATB1 RB0 Bit 0 LATB0 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 LATB7 RB7 — — — — — — Bit 7 Bit 7 — — — Bit 6 — — — Bit 6 — — — Bit 5 LATB6 RB6 — — — Bit 5 — — — Bit 4 LATB5 RB5 — — — Bit 4 — — — RB3 — — — Bit 3 RB2 LATB2 — — — — — — Bit 2 Bit 2 LATB3 Bit 3 LATB4 RB4 — — — Bit 1 — — — Bit 1 LATB1 RB1 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 1110 0000 0000 0000 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 LATD0 RD0 0000 0000 0000 0000 0000 0000 0000 0000 TRISD0 0000 0000 0000 0001 Bit 0 — — — Bit 0 LATB0 RB0 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0011 1111 1111 Bit 7 LATB7 RB7 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0000 1111 1111 Bit 7 PORTC REGISTER MAP FOR dsPIC30F2011/2012/3012/3013 — — — Bit 15 PORTB REGISTER MAP FOR dsPIC30F2012/3013 — — — Bit 15 PORTB REGISTER MAP FOR dsPIC30F2011/3012 dsPIC30F2011/2012/3012/3013 DS70139C-page 59 DS70139C-page 60 02D6 PORTD LATD 02E0 02E2 PORTF LATF — — — Bit 14 — — — Bit 13 — — — Bit 12 — — — Bit 11 — — — Bit 10 LATD9 RD9 TRISD9 Bit 9 LATD8 RD8 TRISD8 Bit 8 — — — Bit 15 — — — Bit 14 — — — Bit 13 — — — Bit 12 — — — Bit 11 — — — Bit 10 — — — Bit 9 — — — Bit 8 PORTF REGISTER MAP FOR dsPIC30F2012/3013 — — — Bit 15 PORTD REGISTER MAP FOR dsPIC30F2012/3013 The dsPIC30F2011/3012 do not have TRISF, PORTF or LATF. 02DE TRISF Note: Addr. SFR Name TABLE 7-6: 02D2 02D4 TRISD Addr. SFR Name TABLE 7-5: — — — Bit 7 — — — Bit 7 LATF6 RF6 TRISF6 Bit 6 — — — Bit 6 LATF5 RF5 TRISF5 Bit 5 — — — Bit 5 LATF4 RF4 TRISF4 Bit 4 — — — Bit 4 LATF3 RF3 TRISF3 Bit 3 — — — Bit 3 LATF2 RF2 TRISF2 Bit 2 — — — Bit 2 — — — Bit 1 — — — Bit 1 — — — Bit 0 — — — Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0111 1100 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 0011 0000 0000 Reset State dsPIC30F2011/2012/3012/3013 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 7.3 Input Change Notification Module The input change notification module provides the dsPIC30F devices the ability to generate interrupt requests to the processor, in response to a change of state on selected input pins. This module is capable of detecting input change of states even in Sleep mode, when the clocks are disabled. There are up to 10 external signals (CN0 through CN7, CN17 and CN18) that may be selected (enabled) for generating an interrupt request on a change of state. TABLE 7-7: INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F2011/3012 (BITS 7-0) SFR Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000 CNEN2 00C2 — — — — — — — — 0000 0000 0000 0000 CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000 CNPU2 00C6 — — — — — — — — 0000 0000 0000 0000 TABLE 7-8: INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F2012/3013 (BITS 7-0) SFR Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CNEN2 00C2 — — — — — CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CNPU2 00C6 — — — — — Bit 2 Bit 1 Bit 0 Reset State CN2IE CN1IE CN0IE 0000 0000 0000 0000 CN18IE CN17IE — 0000 0000 0000 0000 CN1PUE CN0PUE 0000 0000 0000 0000 — 0000 0000 0000 0000 CN18PUE CN17PUE Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 61 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 62 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 8.0 INTERRUPTS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). • INTCON1<15:0>, INTCON2<15:0> Global interrupt control functions are derived from these two registers. INTCON1 contains the control and status flags for the processor exceptions. The INTCON2 register controls the external interrupt request signal behavior and the use of the alternate vector table. Note: The dsPIC30F Sensor Family has up to 21 interrupt sources and 4 processor exceptions (traps) which must be arbitrated based on a priority scheme. The CPU is responsible for reading the Interrupt Vector Table (IVT) and transferring the address contained in the interrupt vector to the program counter. The interrupt vector is transferred from the program data bus into the program counter via a 24-bit wide multiplexer on the input of the program counter. The Interrupt Vector Table (IVT) and Alternate Interrupt Vector Table (AIVT) are placed near the beginning of program memory (0x000004). The IVT and AIVT are shown in Figure 8-1. The interrupt controller is responsible for preprocessing the interrupts and processor exceptions before they are presented to the processor core. The peripheral interrupts and traps are enabled, prioritized and controlled using centralized Special Function Registers: • IFS0<15:0>, IFS1<15:0>, IFS2<15:0> All interrupt request flags are maintained in these three registers. The flags are set by their respective peripherals or external signals, and they are cleared via software. • IEC0<15:0>, IEC1<15:0>, IEC2<15:0> All interrupt enable control bits are maintained in these three registers. These control bits are used to individually enable interrupts from the peripherals or external signals. • IPC0<15:0>... IPC10<7:0> The user assignable priority level associated with each of these 41 interrupts is held centrally in these twelve registers. • IPL<3:0> The current CPU priority level is explicitly stored in the IPL bits. IPL<3> is present in the CORCON register, whereas IPL<2:0> are present in the STATUS register (SR) in the processor core. © 2005 Microchip Technology Inc. Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. All interrupt sources can be user assigned to one of 7 priority levels, 1 through 7, via the IPCx registers. Each interrupt source is associated with an interrupt vector, as shown in Table 8-1. Levels 7 and 1 represent the highest and lowest maskable priorities, respectively. Note: Assigning a priority level of ‘0’ to an interrupt source is equivalent to disabling that interrupt. If the NSTDIS bit (INTCON1<15>) is set, nesting of interrupts is prevented. Thus, if an interrupt is currently being serviced, processing of a new interrupt is prevented even if the new interrupt is of higher priority than the one currently being serviced. Note: The IPL bits become read only whenever the NSTDIS bit has been set to ‘1’. Certain interrupts have specialized control bits for features like edge or level triggered interrupts, interrupton-change, etc. Control of these features remains within the peripheral module which generates the interrupt. The DISI instruction can be used to disable the processing of interrupts of priorities 6 and lower for a certain number of instructions, during which the DISI bit (INTCON2<14>) remains set. When an interrupt is serviced, the PC is loaded with the address stored in the vector location in program memory that corresponds to the interrupt. There are 63 different vectors within the IVT (refer to Table 8-1). These vectors are contained in locations 0x000004 through 0x0000FE of program memory (refer to Table 8-1). These locations contain 24-bit addresses and in order to preserve robustness, an address error trap will take place should the PC attempt to fetch any of these words during normal execution. This prevents execution of random data as a result of accidentally decrementing a PC into vector space, accidentally mapping a data space address into vector space, or the PC rolling over to 0x000000 after reaching the end of implemented program memory space. Execution of a GOTO instruction to this vector space will also generate an address error trap. Preliminary DS70139C-page 63 dsPIC30F2011/2012/3012/3013 8.1 TABLE 8-1: Interrupt Priority The user assignable interrupt priority (IP<2:0>) bits for each individual interrupt source are located in the LS 3 bits of each nibble within the IPCx register(s). Bit 3 of each nibble is not used and is read as a ‘0’. These bits define the priority level assigned to a particular interrupt by the user. Note: The user selectable priority levels start at 0 as the lowest priority and level 7 as the highest priority. Natural Order Priority is determined by the position of an interrupt in the vector table, and only affects interrupt operation when multiple interrupts with the same user-assigned priority become pending at the same time. Table 8-1 lists the interrupt numbers and interrupt sources for the dsPIC30F2011/2012/3012/3013 devices and their associated vector numbers. Note 1: The natural order priority scheme has 0 as the highest priority and 53 as the lowest priority. 2: The natural order priority number is the same as the INT number. The ability for the user to assign every interrupt to one of seven priority levels implies that the user can assign a very high overall priority level to an interrupt with a low natural order priority. For example, the PLVD (Low Voltage Detect) can be given a priority of 7. The INT0 (External Interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. DS70139C-page 64 INT Number INTERRUPT VECTOR TABLE Vector Number Interrupt Source Highest Natural Order Priority 0 8 INT0 - External Interrupt 0 1 9 IC1 - Input Capture 1 2 10 OC1 - Output Compare 1 T1 - Timer 1 IC2 - Input Capture 2 OC2 - Output Compare 2 T2 - Timer 2 T3 - Timer 3 SPI1 U1RX - UART1 Receiver U1TX - UART1 Transmitter ADC - ADC Convert Done NVM - NVM Write Complete SI2C - I2C Slave Interrupt 14 22 MI2C - I2C Master Interrupt 15 23 Input Change Interrupt 16 24 INT1 - External Interrupt 1 17-22 25-30 Reserved 23 31 INT2 - External Interrupt 2 *U2RX - UART2 Receiver 24 32 * 25 33 U2TX - UART2 Transmitter 26-41 34-49 Reserved 42 50 LVD - Low Voltage Detect 43-53 51-61 Reserved Lowest Natural Order Priority * Only the dsPIC30F3013 has UART2 and the U2RX, U2TX interrupts. These locations are reserved for the dsPIC30F2011/2012/3012. Preliminary 3 4 5 6 7 8 9 10 11 12 13 11 12 13 14 15 16 17 18 19 20 21 © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 8.2 Reset Sequence 8.3 A Reset is not a true exception, because the interrupt controller is not involved in the Reset process. The processor initializes its registers in response to a Reset which forces the PC to zero. The processor then begins program execution at location 0x000000. A GOTO instruction is stored in the first program memory location immediately followed by the address target for the GOTO instruction. The processor executes the GOTO to the specified address and then begins operation at the specified target (start) address. 8.2.1 Traps Traps can be considered as non-maskable interrupts indicating a software or hardware error, which adhere to a predefined priority as shown in Figure 8-1. They are intended to provide the user a means to correct erroneous operation during debug and when operating within the application. Note: RESET SOURCES In addition to external Reset and Power-on Reset (POR), there are 6 sources of error conditions which ‘trap’ to the Reset vector. • Watchdog Time-out: The watchdog has timed out, indicating that the processor is no longer executing the correct flow of code. • Uninitialized W Register Trap: An attempt to use an uninitialized W register as an address pointer will cause a Reset. • Illegal Instruction Trap: Attempted execution of any unused opcodes will result in an illegal instruction trap. Note that a fetch of an illegal instruction does not result in an illegal instruction trap if that instruction is flushed prior to execution due to a flow change. • Brown-out Reset (BOR): A momentary dip in the power supply to the device has been detected which may result in malfunction. • Trap Lockout: Occurrence of multiple trap conditions simultaneously will cause a Reset. Note that many of these trap conditions can only be detected when they occur. Consequently, the questionable instruction is allowed to complete prior to trap exception processing. If the user chooses to recover from the error, the result of the erroneous action that caused the trap may have to be corrected. There are 8 fixed priority levels for traps: Level 8 through Level 15, which implies that the IPL3 is always set during processing of a trap. If the user is not currently executing a trap, and he sets the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all interrupts are disabled, but traps can still be processed. 8.3.1 TRAP SOURCES The following traps are provided with increasing priority. However, since all traps can be nested, priority has little effect. Math Error Trap: The Math Error trap executes under the following three circumstances: 1. 2. 3. 4. © 2005 Microchip Technology Inc. If the user does not intend to take corrective action in the event of a trap error condition, these vectors must be loaded with the address of a default handler that simply contains the RESET instruction. If, on the other hand, one of the vectors containing an invalid address is called, an address error trap is generated. Preliminary Should an attempt be made to divide by zero, the divide operation will be aborted on a cycle boundary and the trap taken. If enabled, a Math Error trap will be taken when an arithmetic operation on either accumulator A or B causes an overflow from bit 31 and the accumulator guard bits are not utilized. If enabled, a Math Error trap will be taken when an arithmetic operation on either accumulator A or B causes a catastrophic overflow from bit 39 and all saturation is disabled. If the shift amount specified in a shift instruction is greater than the maximum allowed shift amount, a trap will occur. DS70139C-page 65 dsPIC30F2011/2012/3012/3013 Address Error Trap: Stack Error Trap: This trap is initiated when any of the following circumstances occurs: This trap is initiated under the following conditions: 1. 2. 3. 4. A misaligned data word access is attempted. A data fetch from our unimplemented data memory location is attempted. A data access of an unimplemented program memory location is attempted. An instruction fetch from vector space is attempted. Note: 5. 6. In the MAC class of instructions, wherein the data space is split into X and Y data space, unimplemented X space includes all of Y space, and unimplemented Y space includes all of X space. Execution of a “BRA #literal” instruction or a “GOTO #literal” instruction, where literal is an unimplemented program memory address. Executing instructions after modifying the PC to point to unimplemented program memory addresses. The PC may be modified by loading a value into the stack and executing a RETURN instruction. 1. 2. The stack pointer is loaded with a value which is greater than the (user programmable) limit value written into the SPLIM register (stack overflow). The stack pointer is loaded with a value which is less than 0x0800 (simple stack underflow). Oscillator Fail Trap: This trap is initiated if the external oscillator fails and operation becomes reliant on an internal RC backup. 8.3.2 HARD AND SOFT TRAPS It is possible that multiple traps can become active within the same cycle (e.g., a misaligned word stack write to an overflowed address). In such a case, the fixed priority shown in Figure 8-2 is implemented, which may require the user to check if other traps are pending, in order to completely correct the fault. ‘Soft’ traps include exceptions of priority level 8 through level 11, inclusive. The arithmetic error trap (level 11) falls into this category of traps. ‘Hard’ traps include exceptions of priority level 12 through level 15, inclusive. The address error (level 12), stack error (level 13) and oscillator error (level 14) traps fall into this category. Each hard trap that occurs must be acknowledged before code execution of any type may continue. If a lower priority hard trap occurs while a higher priority trap is pending, acknowledged, or is being processed, a hard trap conflict will occur. The device is automatically Reset in a hard trap conflict condition. The TRAPR status bit (RCON<15>) is set when the Reset occurs, so that the condition may be detected in software. DS70139C-page 66 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 IVT AIVT 8.4 TRAP VECTORS Reset - GOTO Instruction Reset - GOTO Address Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector — — — Interrupt 52 Vector Interrupt 53 Vector Reserved Reserved Reserved Oscillator Fail Trap Vector Stack Error Trap Vector Address Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector — — — Interrupt 52 Vector Interrupt 53 Vector FIGURE 8-2: 0x000000 0x000002 0x000004 0x0000 15 Stack Grows Towards Higher Address Decreasing Priority FIGURE 8-1: 0x000014 INTERRUPT STACK FRAME 0 PC<15:0> SRL IPL3 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP : [--W15] 0x00007E 0x000080 0x000082 0x000084 PUSH: [W15++] Note 1: The user can always lower the priority level by writing a new value into SR. The Interrupt Service Routine must clear the interrupt flag bits in the IFSx register before lowering the processor interrupt priority, in order to avoid recursive interrupts. 0x000094 0x0000FE 2: The IPL3 bit (CORCON<3>) is always clear when interrupts are being processed. It is set only during execution of traps. Interrupt Sequence All interrupt event flags are sampled in the beginning of each instruction cycle by the IFSx registers. A pending interrupt request (IRQ) is indicated by the flag bit being equal to a ‘1’ in an IFSx register. The IRQ will cause an interrupt to occur if the corresponding bit in the Interrupt Enable (IECx) register is set. For the remainder of the instruction cycle, the priorities of all pending interrupt requests are evaluated. If there is a pending IRQ with a priority level greater than the current processor priority level in the IPL bits, the processor will be interrupted. The processor then stacks the current program counter and the low byte of the processor STATUS register (SRL), as shown in Figure 8-2. The low byte of the STATUS register contains the processor priority level at the time prior to the beginning of the interrupt cycle. The processor then loads the priority level for this interrupt into the STATUS register. This action will disable all lower priority interrupts until the completion of the Interrupt Service Routine. The RETFIE (return from interrupt) instruction will unstack the program counter and STATUS registers to return the processor to its state prior to the interrupt sequence. 8.5 Alternate Vector Table In program memory, the Interrupt Vector Table (IVT) is followed by the Alternate Interrupt Vector Table (AIVT), as shown in Figure 8-1. Access to the alternate vector table is provided by the ALTIVT bit in the INTCON2 register. If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not required, the program memory allocated to the AIVT may be used for other purposes. AIVT is not a protected section and may be freely programmed by the user. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 67 dsPIC30F2011/2012/3012/3013 8.6 Fast Context Saving 8.7 A context saving option is available using shadow registers. Shadow registers are provided for the DC, N, OV, Z and C bits in SR, and the registers W0 through W3. The shadows are only one level deep. The shadow registers are accessible using the PUSH.S and POP.S instructions only. When the processor vectors to an interrupt, the PUSH.S instruction can be used to store the current value of the aforementioned registers into their respective shadow registers. If an ISR of a certain priority uses the PUSH.S and POP.S instructions for fast context saving, then a higher priority ISR should not include the same instructions. Users must save the key registers in software during a lower priority interrupt if the higher priority ISR uses fast context saving. DS70139C-page 68 External Interrupt Requests The interrupt controller supports three external interrupt request signals, INT0-INT2. These inputs are edge sensitive; they require a low-to-high or a high-to-low transition to generate an interrupt request. The INTCON2 register has three bits, INT0EP-INT2EP, that select the polarity of the edge detection circuitry. 8.8 Wake-up from Sleep and Idle The interrupt controller may be used to wake-up the processor from either Sleep or Idle modes, if Sleep or Idle mode is active when the interrupt is generated. If an enabled interrupt request of sufficient priority is received by the interrupt controller, then the standard interrupt request is presented to the processor. At the same time, the processor will wake-up from Sleep or Idle and begin execution of the Interrupt Service Routine (ISR) needed to process the interrupt request. Preliminary © 2005 Microchip Technology Inc. © 2005 Microchip Technology Inc. — 00A6 00A8 u = uninitialized bit IPC9 IPC10 Legend: Preliminary — — — — — INT2IP<2:0> — — — — — — — — — NVMIE — — NVMIF — — — — — — — — — — — — — ADIE — — ADIF — — Bit 11 — U1RXIF — OVBTE Bit 9 — — — — — — LVDIE — LVDIP<2:0> — — — — — — — — — — — — — — — SPI1IE MI2CIP<2:0> — — SPI1IF U1TXIP<2:0> T2IP<2:0> Bit 8 COVTE OC1IP<2:0> — — U1TXIE U1RXIE LVDIF — U1TXIF — OVATE Bit 10 — — — — — — — — — — — — INT2IE T3IE — INT2IF T3IF — — Bit 7 — — — — 1 — — — — T2IE — — T2IF — — Bit 6 Bit 4 — — — — 0 — — SI2CIP<2:0> U1RXIP<2:0> OC2IP<2:0> — — — — 0 — — — — IC2IE — — IC2IF — MATHERR IC1IP<2:0> — — OC2IE — — OC2IF — — Bit 5 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. — — — — — — — 00A4 — 00A2 IPC8 — — IPC7 — — CNIP<2:0> — 009E 009C IPC4 ADIP<2:0> T31P<2:0> T1IP<2:0> — — SI2CIE — — — — 00A0 009A IPC3 — — IPC6 0098 IPC2 — — — MI2CIE CNIE IPC5 0094 0096 0090 IEC2 IPC0 008E IPC1 008C IEC1 — IEC0 — 0088 IFS2 — 0086 IFS1 SI2CIF — — — 0084 IFS0 — — — DISI MI2CIF 0082 ALTIVT Bit 12 Bit 13 Bit 14 CNIF 0080 NSTDIS Bit 15 INTCON2 ADR dsPIC30F2011/2012/3012 INTERRUPT CONTROLLER REGISTER MAP INTCON1 SFR Name TABLE 8-2: — — — — — — — — — — — — — T1IE — — T1IF — ADDRERR Bit 3 Bit 1 — — — — 1 — — — OC1IE — — OC1IF INT2EP — — — — 0 — INT1IP<2:0> NVMIP<2:0> SPI1IP<2:0> IC2IP<2:0> INT0IP<2:0> — — IC1IE — — IC1IF INT1EP STKERR OSCFAIL Bit 2 0000 0000 0000 0000 Reset State — — — — 0 — — INT1IE INT0IE — INT1IF INT0IF 0000 0100 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0100 0100 0100 0000 0000 0000 0000 0000 0000 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 INT0EP 0000 0000 0000 0000 — Bit 0 dsPIC30F2011/2012/3012/3013 DS70139C-page 69 DS70139C-page 70 00A4 00A6 00A8 u = uninitialized bit IPC8 IPC9 IPC10 Legend: Preliminary — — — — — — — — — — — — — — — — — — — — — — — — — — ADIE — — ADIF — — Bit 11 — U2TXIF U1RXIF — OVBTE Bit 9 — — — — — — LVDIE LVDIP<2:0> — — — — — — — — — — — — U2RXIE SPI1IE — U2RXIF MI2CIP<2:0> — — SPI1IF U1TXIP<2:0> T2IP<2:0> Bit 8 COVTE OC1IP<2:0> — U2TXIE U1TXIE U1RXIE LVDIF — U1TXIF — OVATE Bit 10 — — — — — — — — — — — — INT2IE T3IE — INT2IF T3IF — — Bit 7 — — — — — — — — T2IE — — T2IF — — Bit 6 Bit 4 — — — — U2TXIP<2:0> — — SI2CIP<2:0> U1RXIP<2:0> OC2IP<2:0> — — — — — — — — IC2IE — — IC2IF — MATHERR IC1IP<2:0> — — OC2IE — — OC2IF — — Bit 5 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. — — — — — — — — — — 00A2 INT2IP<2:0> IPC7 — — NVMIE — — CNIP<2:0> — — — ADIP<2:0> — 00A0 IPC4 T31P<2:0> T1IP<2:0> — — SI2CIE — — — IPC6 009A 009C IPC3 — — 009E 0098 IPC2 — — — MI2CIE CNIE IPC5 0094 0096 0090 IEC2 IPC0 008E IEC1 IPC1 008C IEC0 — — 0088 IFS2 — — 0086 IFS1 NVMIF — SI2CIF — DISI MI2CIF 0084 — — — Bit 12 Bit 13 Bit 14 CNIF 0082 ALTIVT INTCON2 IFS0 Bit 15 0080 NSTDIS ADR dsPIC30F3013 INTERRUPT CONTROLLER REGISTER MAP INTCON1 SFR Name TABLE 8-3: — — — — — — — — — — — — — T1IE — — T1IF — ADDRERR Bit 3 Bit 1 — — — — — — OC1IE — — OC1IF INT2EP — — — — U2RXIP<2:0> INT1IP<2:0> NVMIP<2:0> SPI1IP<2:0> IC2IP<2:0> INT0IP<2:0> — — IC1IE — — IC1IF INT1EP STKERR OSCFAIL Bit 2 0000 0000 0000 0000 Reset State — — — — — INT1IE INT0IE — INT1IF INT0IF 0000 0100 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0100 0100 0100 0000 0000 0000 0000 0000 0000 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 INT0EP 0000 0000 0000 0000 — Bit 0 dsPIC30F2011/2012/3012/3013 © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 9.0 TIMER1 MODULE These Operating modes are determined by setting the appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1 presents a block diagram of the 16-bit timer module. Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). 16-bit Timer Mode: In the 16-bit Timer mode, the timer increments on every instruction cycle up to a match value preloaded into the Period register PR1, then resets to ‘0’ and continues to count. This section describes the 16-bit General Purpose (GP) Timer1 module and associated Operational modes. Figure 9-1 depicts the simplified block diagram of the 16-bit Timer1 module. The following sections provide detailed descriptions including setup and control registers, along with associated block diagrams for the Operational modes of the timers. When the CPU goes into the Idle mode, the timer stops incrementing unless the TSIDL (T1CON<13>) bit = 0. If TSIDL = 1, the timer module logic resumes the incrementing sequence on termination of CPU Idle mode. 16-bit Synchronous Counter Mode: In the 16-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in PR1, then resets to ‘0’ and continues. The Timer1 module is a 16-bit timer that serves as the time counter for the real-time clock or operates as a free-running interval timer/counter. The 16-bit timer has the following modes: When the CPU goes into the Idle mode, the timer will stop incrementing unless the respective TSIDL bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. • 16-bit Timer • 16-bit Synchronous Counter • 16-bit Asynchronous Counter These operational characteristics are supported: 16-bit Asynchronous Counter Mode: In the 16-bit Asynchronous Counter mode, the timer increments on every rising edge of the applied external clock signal. The timer counts up to a match value preloaded in PR1, then resets to ‘0’ and continues. • Timer gate operation • Selectable prescaler settings • Timer operation during CPU Idle and Sleep modes • Interrupt on 16-bit Period register match or falling edge of external gate signal FIGURE 9-1: When the timer is configured for the Asynchronous mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing if TSIDL = 1. 16-BIT TIMER1 MODULE BLOCK DIAGRAM PR1 Equal Comparator x 16 TSYNC 1 Reset Sync TMR1 0 1 Q D Q CK TGATE TGATE TON SOSCO/ T1CK © 2005 Microchip Technology Inc. TCKPS<1:0> 2 1x LPOSCEN SOSCI TCS TGATE T1IF Event Flag 0 Gate Sync 01 TCY 00 Preliminary Prescaler 1, 8, 64, 256 DS70139C-page 71 dsPIC30F2011/2012/3012/3013 9.1 Timer Gate Operation 9.4 The 16-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T1CK pin) is asserted high. Control bit TGATE (T1CON<6>) must be set to enable this mode. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). When the CPU goes into the Idle mode, the timer will stop incrementing unless TSIDL = 0. If TSIDL = 1, the timer will resume the incrementing sequence upon termination of the CPU Idle mode. 9.2 Timer Prescaler The input clock (FOSC/4 or external clock) to the 16-bit Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256, selected by control bits TCKPS<1:0> (T1CON<5:4>). The prescaler counter is cleared when any of the following occurs: • a write to the TMR1 register • a write to the T1CON register • device Reset, such as POR and BOR However, if the timer is disabled (TON = 0), then the timer prescaler cannot be reset since the prescaler clock is halted. TMR1 is not cleared when T1CON is written. It is cleared by writing to the TMR1 register. 9.3 Timer Interrupt The 16-bit timer has the ability to generate an interrupt on period match. When the timer count matches the Period register, the T1IF bit is asserted and an interrupt will be generated if enabled. The T1IF bit must be cleared in software. The timer interrupt flag, T1IF, is located in the IFS0 Control register in the interrupt controller. When the Gated Time Accumulation mode is enabled, an interrupt will also be generated on the falling edge of the gate signal (at the end of the accumulation cycle). Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt enable bit is located in the IEC0 Control register in the interrupt controller. 9.5 Real-Time Clock Timer1, when operating in Real-Time Clock (RTC) mode, provides time of day and event time-stamping capabilities. Key operational features of the RTC are: • • • • Operation from 32 kHz LP oscillator 8-bit prescaler Low power Real-Time Clock interrupts These operating modes are determined by setting the appropriate bit(s) in the T1CON Control register. FIGURE 9-2: RECOMMENDED COMPONENTS FOR TIMER1 LP OSCILLATOR RTC Timer Operation During Sleep Mode During CPU Sleep mode, the timer will operate if: • The timer module is enabled (TON = 1) and • The timer clock source is selected as external (TCS = 1) and • The TSYNC bit (T1CON<2>) is asserted to a logic ‘0’ which defines the external clock source as asynchronous. C1 SOSCI 32.768 kHz XTAL dsPIC30FXXXX SOSCO C2 R When all three conditions are true, the timer will continue to count up to the Period register and be reset to 0x0000. When a match between the timer and the Period register occurs, an interrupt can be generated if the respective timer interrupt enable bit is asserted. DS70139C-page 72 Preliminary C1 = C2 = 18 pF; R = 100K © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 9.5.1 RTC OSCILLATOR OPERATION 9.5.2 When the TON = 1, TCS = 1 and TGATE = 0, the timer increments on the rising edge of the 32 kHz LP oscillator output signal, up to the value specified in the Period register and is then reset to ‘0’. The TSYNC bit must be asserted to a logic ‘0’ (Asynchronous mode) for correct operation. Enabling LPOSCEN (OSCCON<1>) will disable the normal Timer and Counter modes and enable a timer carry-out wake-up event. RTC INTERRUPTS When an interrupt event occurs, the respective interrupt flag, T1IF, is asserted and an interrupt will be generated if enabled. The T1IF bit must be cleared in software. The respective Timer interrupt flag, T1IF, is located in the IFS0 Status register in the interrupt controller. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt enable bit is located in the IEC0 Control register in the interrupt controller. When the CPU enters Sleep mode, the RTC will continue to operate provided the 32 kHz external crystal oscillator is active and the control bits have not been changed. The TSIDL bit should be cleared to ‘0’ in order for RTC to continue operation in Idle mode. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 73 DS70139C-page 74 u = uninitialized bit Legend: — Bit 14 TSIDL Bit 13 — Bit 12 — Bit 11 — Bit 10 — Bit 9 — Bit 7 Bit 6 — TGATE Period Register 1 Timer1 Register Bit 8 Bit 4 TCKPS1 TCKPS0 Bit 5 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. 0104 T1CON TON 0100 0102 PR1 Bit 15 TIMER1 REGISTER MAP TMR1 Addr. SFR Name TABLE 9-1: — Bit 3 TSYNC Bit 2 TCS Bit 1 — Bit 0 0000 0000 0000 0000 1111 1111 1111 1111 uuuu uuuu uuuu uuuu Reset State dsPIC30F2011/2012/3012/3013 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 10.0 TIMER2/3 MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). This section describes the 32-bit General Purpose (GP) Timer module (Timer2/3) and associated Operational modes. Figure 10-1 depicts the simplified block diagram of the 32-bit Timer2/3 module. Figure 10-2 and Figure 10-3 show Timer2/3 configured as two independent 16-bit timers, Timer2 and Timer3, respectively. The Timer2/3 module is a 32-bit timer (which can be configured as two 16-bit timers) with selectable Operating modes. These timers are utilized by other peripheral modules, such as: • Input Capture • Output Compare/Simple PWM The following sections provide a detailed description, including setup and control registers, along with associated block diagrams for the Operational modes of the timers. The only functional difference between Timer2 and Timer3 is that Timer2 provides synchronization of the clock prescaler output. This is useful for high frequency external clock inputs. 32-bit Timer Mode: In the 32-bit Timer mode, the timer increments on every instruction cycle, up to a match value preloaded into the combined 32-bit Period register PR3/PR2, then resets to ‘0’ and continues to count. For synchronous 32-bit reads of the Timer2/Timer3 pair, reading the LS Word (TMR2 register) will cause the MS word to be read and latched into a 16-bit holding register, termed TMR3HLD. For synchronous 32-bit writes, the holding register (TMR3HLD) must first be written to. When followed by a write to the TMR2 register, the contents of TMR3HLD will be transferred and latched into the MSB of the 32-bit timer (TMR3). 32-bit Synchronous Counter Mode: In the 32-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in the combined 32-bit period register PR3/PR2, then resets to ‘0’ and continues. The 32-bit timer has the following modes: • Two independent 16-bit timers (Timer2 and Timer3) with all 16-bit Operating modes (except Asynchronous Counter mode) • Single 32-bit timer operation • Single 32-bit synchronous counter Further, the following operational characteristics are supported: • • • • • 16-bit Timer Mode: In the 16-bit mode, Timer2 and Timer3 can be configured as two independent 16-bit timers. Each timer can be set up in either 16-bit Timer mode or 16-bit Synchronous Counter mode. See Section 9.0, Timer1 Module for details on these two Operating modes. ADC event trigger Timer gate operation Selectable prescaler settings Timer operation during Idle and Sleep modes Interrupt on a 32-bit period register match When the timer is configured for the Synchronous Counter mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing unless the TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. These Operating modes are determined by setting the appropriate bit(s) in the 16-bit T2CON and T3CON SFRs. For 32-bit timer/counter operation, Timer2 is the LS Word and Timer3 is the MS Word of the 32-bit timer. Note: For 32-bit timer operation, T3CON control bits are ignored. Only T2CON control bits are used for setup and control. Timer2 clock and gate inputs are utilized for the 32-bit timer module but an interrupt is generated with the Timer3 interrupt flag (T3IF) and the interrupt is enabled with the Timer3 interrupt enable bit (T3IE). © 2005 Microchip Technology Inc. Preliminary DS70139C-page 75 dsPIC30F2011/2012/3012/3013 FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM Data Bus<15:0> TMR3HLD 16 16 Write TMR2 Read TMR2 16 Reset TMR3 TMR2 MSB LSB Sync ADC Event Trigger Equal Comparator x 32 PR3 PR2 0 T3IF Event Flag 1 Q D Q CK TGATE (T2CON<6>) TCS TGATE TGATE (T2CON<6>) TON T2CK Note: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 Timer configuration bit T32 (T2CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control bits are respective to the T2CON register. DS70139C-page 76 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM PR2 Equal Reset T2IF Event Flag Comparator x 16 TMR2 Sync 0 1 Q D Q CK TGATE TCS TGATE TGATE TON T2CK FIGURE 10-3: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 16-BIT TIMER3 BLOCK DIAGRAM PR3 ADC Event Trigger Equal Comparator x 16 TMR3 Reset 0 1 Q D Q CK TGATE TCS TGATE T3IF Event Flag TGATE T3CK Sync TON 1x 01 TCY © 2005 Microchip Technology Inc. Preliminary TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 00 DS70139C-page 77 dsPIC30F2011/2012/3012/3013 10.1 Timer Gate Operation 10.4 The 32-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T2CK pin) is asserted high. Control bit TGATE (T2CON<6>) must be set to enable this mode. When in this mode, Timer2 is the originating clock source. The TGATE setting is ignored for Timer3. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). The falling edge of the external signal terminates the count operation but does not reset the timer. The user must reset the timer in order to start counting from zero. 10.2 ADC Event Trigger When a match occurs between the 32-bit timer (TMR3/ TMR2) and the 32-bit combined period register (PR3/ PR2), or between the 16-bit timer TMR3 and the 16-bit period register PR3, a special ADC trigger event signal is generated by Timer3. 10.3 Timer Operation During Sleep Mode During CPU Sleep mode, the timer will not operate because the internal clocks are disabled. 10.5 Timer Interrupt The 32-bit timer module can generate an interrupt on period match or on the falling edge of the external gate signal. When the 32-bit timer count matches the respective 32-bit period register, or the falling edge of the external “gate” signal is detected, the T3IF bit (IFS0<7>) is asserted and an interrupt will be generated if enabled. In this mode, the T3IF interrupt flag is used as the source of the interrupt. The T3IF bit must be cleared in software. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T3IE (IEC0<7>). Timer Prescaler The input clock (FOSC/4 or external clock) to the timer has a prescale option of 1:1, 1:8, 1:64, and 1:256, selected by control bits TCKPS<1:0> (T2CON<5:4> and T3CON<5:4>). For the 32-bit timer operation, the originating clock source is Timer2. The prescaler operation for Timer3 is not applicable in this mode. The prescaler counter is cleared when any of the following occurs: • a write to the TMR2/TMR3 register • a write to the T2CON/T3CON register • device Reset, such as POR and BOR However, if the timer is disabled (TON = 0), then the Timer 2 prescaler cannot be reset since the prescaler clock is halted. TMR2/TMR3 is not cleared when T2CON/T3CON is written. DS70139C-page 78 Preliminary © 2005 Microchip Technology Inc. 010C 010E 0110 0112 u = uninitialized bit TMR3 PR2 PR3 T2CON T3CON Legend: © 2005 Microchip Technology Inc. — — TSIDL TSIDL — — Bit 12 — — Bit 11 Bit 9 Bit 7 Timer2 Register Bit 8 Bit 6 Bit 5 — — — — — — — — TGATE TGATE Period Register 3 Period Register 2 Timer3 Register Bit 4 TCKPS1 TCKPS0 TCKPS1 TCKPS0 Timer3 Holding Register (for 32-bit timer operations only) Bit 10 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. TON 010A TMR3HLD TON 0106 0108 TMR2 Bit 13 Bit 15 SFR Name Addr. Bit 14 TIMER2/3 REGISTER MAP TABLE 10-1: — T32 Bit 3 — — Bit 2 TCS TCS Bit 1 — — Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 1111 1111 1111 1111 1111 1111 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu Reset State dsPIC30F2011/2012/3012/3013 Preliminary DS70139C-page 79 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 80 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 11.0 INPUT CAPTURE MODULE These operating modes are determined by setting the appropriate bits in the IC1CON and IC2CON registers. The dsPIC30F2011/2012/3012/3013 devices have two capture channels. Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). 11.1 The simple capture events in the dsPIC30F product family are: This section describes the input capture module and associated operational modes. The features provided by this module are useful in applications requiring frequency (period) and pulse measurement. • • • • • Figure 11-1 depicts a block diagram of the input capture module. Input capture is useful for such modes as: • Frequency/Period/Pulse Measurements • Additional Sources of External Interrupts Capture every falling edge Capture every rising edge Capture every 4th rising edge Capture every 16th rising edge Capture every rising and falling edge These simple Input Capture modes are configured by setting the appropriate bits ICM<2:0> (ICxCON<2:0>). Important operational features of the input capture module are its 11.1.1 • Simple Capture Event mode • Timer2 and Timer3 mode selection • Interrupt on input capture event FIGURE 11-1: Simple Capture Event Mode CAPTURE PRESCALER There are four input capture prescaler settings specified by bits ICM<2:0> (ICxCON<2:0>). Whenever the capture channel is turned off, the prescaler counter will be cleared. In addition, any Reset will clear the prescaler counter. INPUT CAPTURE MODE BLOCK DIAGRAM From GP Timer Module T3_CNT T2_CNT 16 1 ICx pin Prescaler 1, 4, 16 3 Clock Synchronizer Edge Detection Logic 16 0 ICTMR FIFO R/W Logic ICM<2:0> Mode Select ICxBUF ICBNE, ICOV ICI<1:0> ICxCON Interrupt Logic Data Bus Note: Set Flag ICxIF Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture channel (1 or 2). © 2005 Microchip Technology Inc. Preliminary DS70139C-page 81 dsPIC30F2011/2012/3012/3013 11.1.2 CAPTURE BUFFER OPERATION 11.2 Each capture channel has an associated FIFO buffer which is four 16-bit words deep. There are two status flags which provide status on the FIFO buffer: • ICBFNE - Input Capture Buffer Not Empty • ICOV - Input Capture Overflow The ICBFNE will be set on the first input capture event and remain set until all capture events have been read from the FIFO. As each word is read from the FIFO, the remaining words are advanced by one position within the buffer. In the event that the FIFO is full with four capture events and a fifth capture event occurs prior to a read of the FIFO, an overflow condition will occur and the ICOV bit will be set to a logic ‘1’. The fifth capture event is lost and is not stored in the FIFO. No additional events will be captured until all four events have been read from the buffer. If a FIFO read is performed after the last read and no new capture event has been received, the read will yield indeterminate results. 11.1.3 TIMER2 AND TIMER3 SELECTION MODE The input capture module consists of up to 8 input capture channels. Each channel can select between one of two timers for the time base, Timer2 or Timer3. Selection of the timer resource is accomplished through SFR bit, ICTMR (ICxCON<7>). Timer3 is the default timer resource available for the input capture module. 11.1.4 HALL SENSOR MODE When the input capture module is set for capture on every edge, rising and falling, ICM<2:0> = 001, the following operations are performed by the input capture logic: • The input capture interrupt flag is set on every edge, rising and falling. • The interrupt on Capture mode setting bits, ICI<1:0>, is ignored since every capture generates an interrupt. • A capture overflow condition is not generated in this mode. Input Capture Operation During Sleep and Idle Modes An input capture event will generate a device wake-up or interrupt, if enabled, if the device is in CPU Idle or Sleep mode. Independent of the timer being enabled, the input capture module will wake-up from the CPU Sleep or Idle mode when a capture event occurs if ICM<2:0> = 111 and the interrupt enable bit is asserted. The same wakeup can generate an interrupt if the conditions for processing the interrupt have been satisfied. The wake-up feature is useful as a method of adding extra external pin interrupts. 11.2.1 INPUT CAPTURE IN CPU SLEEP MODE CPU Sleep mode allows input capture module operation with reduced functionality. In the CPU Sleep mode, the ICI<1:0> bits are not applicable and the input capture module can only function as an external interrupt source. The capture module must be configured for interrupt only on rising edge (ICM<2:0> = 111) in order for the input capture module to be used while the device is in Sleep mode. The prescale settings of 4:1 or 16:1 are not applicable in this mode. 11.2.2 INPUT CAPTURE IN CPU IDLE MODE CPU Idle mode allows input capture module operation with full functionality. In the CPU Idle mode, the Interrupt mode selected by the ICI<1:0> bits is applicable, as well as the 4:1 and 16:1 capture prescale settings which are defined by control bits ICM<2:0>. This mode requires the selected timer to be enabled. Moreover, the ICSIDL bit must be asserted to a logic ‘0’. If the input capture module is defined as ICM<2:0> = 111 in CPU Idle mode, the input capture pin will serve only as an external interrupt pin. 11.3 Input Capture Interrupts The input capture channels have the ability to generate an interrupt based upon the selected number of capture events. The selection number is set by control bits ICI<1:0> (ICxCON<6:5>). Each channel provides an interrupt flag (ICxIF) bit. The respective capture channel interrupt flag is located in the corresponding IFSx Status register. Enabling an interrupt is accomplished via the respective capture channel interrupt enable (ICxIE) bit. The capture interrupt enable bit is located in the corresponding IEC Control register. DS70139C-page 82 Preliminary © 2005 Microchip Technology Inc. 0146 IC2CON — — Bit 15 ICSIDL ICSIDL Bit 13 — — Bit 12 — — Bit 11 — — Bit 10 — — Bit 8 Bit 7 ICTMR — ICTMR Input 2 Capture Register — Input 1 Capture Register Bit 9 Bit 5 ICI<1:0> ICI<1:0> Bit 6 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. — — Bit 14 INPUT CAPTURE REGISTER MAP u = uninitialized bit 0144 IC2BUF Legend: 0140 0142 IC1BUF Addr. IC1CON SFR Name TABLE 11-1: ICOV ICOV Bit 4 ICBNE ICBNE Bit 3 Bit 2 ICM<2:0> ICM<2:0> Bit 1 Bit 0 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Reset State dsPIC30F2011/2012/3012/3013 © 2005 Microchip Technology Inc. Preliminary DS70139C-page 83 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 84 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 12.0 OUTPUT COMPARE MODULE The key operational features of the output compare module include: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). This section describes the output compare module and associated Operational modes. The features provided by this module are useful in applications requiring Operational modes, such as: • Generation of Variable Width Output Pulses • Power Factor Correction Figure 12-1 depicts a block diagram of the output compare module. FIGURE 12-1: • • • • • • Timer2 and Timer3 Selection mode Simple Output Compare Match mode Dual Output Compare Match mode Simple PWM mode Output Compare During Sleep and Idle modes Interrupt on Output Compare/PWM Event These operating modes are determined by setting the appropriate bits in the 16-bit OC1CON and OC2CON registers. The dsPIC30F2011/2012/3012/3013 devices have 2 compare channels. OCxRS and OCxR in Figure 12-1 represent the Dual Compare registers. In the Dual Compare mode, the OCxR register is used for the first compare and OCxRS is used for the second compare. OUTPUT COMPARE MODE BLOCK DIAGRAM Set Flag bit OCxIF OCxRS Output Logic OCxR 3 Output Enable OCx OCM<2:0> Mode Select Comparator 0 S Q R 1 OCTSEL 0 1 OCFA (for x = 1, 2, 3 or 4) From GP Timer Module TMR2<15:0 Note: TMR3<15:0> T2P2_MATCH T3P3_MATCH Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channel (1 or 2). © 2005 Microchip Technology Inc. Preliminary DS70139C-page 85 dsPIC30F2011/2012/3012/3013 12.1 Timer2 and Timer3 Selection Mode Each output compare channel can select between one of two 16-bit timers, Timer2 or Timer3. The selection of the timers is controlled by the OCTSEL bit (OCxCON<3>). Timer2 is the default timer resource for the output compare module. 12.2 Simple Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 001, 010 or 011, the selected output compare channel is configured for one of three simple Output Compare Match modes: • Compare forces I/O pin low • Compare forces I/O pin high • Compare toggles I/O pin Dual Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 100 or 101, the selected output compare channel is configured for one of two Dual Output Compare modes, which are: • Single Output Pulse mode • Continuous Output Pulse mode 12.3.1 • Determine instruction cycle time TCY. • Calculate desired pulse value based on TCY. • Calculate timer to start pulse width from timer start value of 0x0000. • Write pulse width start and stop times into OCxR and OCxRS (x denotes channel 1, 2, ...,N) Compare registers, respectively. • Set Timer Period register to value equal to, or greater than value in OCxRS Compare register. • Set OCM<2:0> = 101. • Enable timer, TON (TxCON<15>) = 1. The user must perform the following steps in order to configure the output compare module for PWM operation: 1. 2. 4. For the user to configure the module for the generation of a single output pulse, the following steps are required (assuming timer is off): To initiate another single pulse, issue another write to set OCM<2:0> = 100. DS70139C-page 86 Set the PWM period by writing to the appropriate period register. Set the PWM duty cycle by writing to the OCxRS register. Configure the output compare module for PWM operation. Set the TMRx prescale value and enable the Timer, TON (TxCON<15>) = 1. 12.4.1 TCY. • Determine instruction cycle time • Calculate desired pulse width value based on TCY. • Calculate time to start pulse from timer start value of 0x0000. • Write pulse width start and stop times into OCxR and OCxRS Compare registers (x denotes channel 1, 2, ...,N). • Set Timer Period register to value equal to, or greater than value in OCxRS Compare register. • Set OCM<2:0> = 100. • Enable timer, TON (TxCON<15>) = 1. Simple PWM Mode When control bits OCM<2:0> (OCxCON<2:0>) = 110 or 111, the selected output compare channel is configured for the PWM mode of operation. When configured for the PWM mode of operation, OCxR is the main latch (read only) and OCxRS is the secondary latch. This enables glitchless PWM transitions. 3. SINGLE PULSE MODE CONTINUOUS PULSE MODE For the user to configure the module for the generation of a continuous stream of output pulses, the following steps are required: 12.4 The OCxR register is used in these modes. The OCxR register is loaded with a value and is compared to the selected incrementing timer count. When a compare occurs, one of these Compare Match modes occurs. If the counter resets to zero before reaching the value in OCxR, the state of the OCx pin remains unchanged. 12.3 12.3.2 INPUT PIN FAULT PROTECTION FOR PWM When control bits OCM<2:0> (OCxCON<2:0>) = 111, the selected output compare channel is again configured for the PWM mode of operation with the additional feature of input FAULT protection. While in this mode, if a logic ‘0’ is detected on the OCFA/B pin, the respective PWM output pin is placed in the high impedance input state. The OCFLT bit (OCxCON<4>) indicates whether a FAULT condition has occurred. This state will be maintained until both of the following events have occurred: • The external FAULT condition has been removed. • The PWM mode has been re-enabled by writing to the appropriate control bits. Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 12.4.2 PWM PERIOD When the selected TMRx is equal to its respective period register, PRx, the following four events occur on the next increment cycle: The PWM period is specified by writing to the PRx register. The PWM period can be calculated using Equation 12-1. • TMRx is cleared. • The OCx pin is set. - Exception 1: If PWM duty cycle is 0x0000, the OCx pin will remain low. - Exception 2: If duty cycle is greater than PRx, the pin will remain high. • The PWM duty cycle is latched from OCxRS into OCxR. • The corresponding timer interrupt flag is set. EQUATION 12-1: PWM period = [(PRx) + 1] • 4 • TOSC • (TMRx prescale value) PWM frequency is defined as 1 / [PWM period]. See Figure 12-2 for key PWM period comparisons. Timer3 is referred to in Figure 12-2 for clarity. FIGURE 12-2: PWM OUTPUT TIMING Period Duty Cycle TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS TMR3 = Duty Cycle (OCxR) 12.5 Output Compare Operation During CPU Sleep Mode When the CPU enters Sleep mode, all internal clocks are stopped. Therefore, when the CPU enters the Sleep state, the output compare channel will drive the pin to the active state that was observed prior to entering the CPU Sleep state. For example, if the pin was high when the CPU entered the Sleep state, the pin will remain high. Likewise, if the pin was low when the CPU entered the Sleep state, the pin will remain low. In either case, the output compare module will resume operation when the device wakes up. 12.6 Output Compare Operation During CPU Idle Mode When the CPU enters the Idle mode, the output compare module can operate with full functionality. The output compare channel will operate during the CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at logic ‘0’ and the selected time base (Timer2 or Timer3) is enabled and the TSIDL bit of the selected timer is set to logic ‘0’. © 2005 Microchip Technology Inc. TMR3 = Duty Cycle (OCxR) 12.7 Output Compare Interrupts The output compare channels have the ability to generate an interrupt on a compare match, for whichever Match mode has been selected. For all modes except the PWM mode, when a compare event occurs, the respective interrupt flag (OCxIF) is asserted and an interrupt will be generated if enabled. The OCxIF bit is located in the corresponding IFS Status register and must be cleared in software. The interrupt is enabled via the respective compare interrupt enable (OCxIE) bit located in the corresponding IEC Control register. For the PWM mode, when an event occurs, the respective timer interrupt flag (T2IF or T3IF) is asserted and an interrupt will be generated if enabled. The IF bit is located in the IFS0 Status register and must be cleared in software. The interrupt is enabled via the respective timer interrupt enable bit (T2IE or T3IE) located in the IEC0 Control register. The output compare interrupt flag is never set during the PWM mode of operation. Preliminary DS70139C-page 87 DS70139C-page 88 u = uninitialized bit Legend: — — OCSIDL OCSIDL — — — — Bit 11 — — Bit 10 Bit 8 Bit 7 Bit 6 — — — Output Compare 1 Main Register — — — — Output Compare 2 Main Register Output Compare 2 Secondary Register — — — Bit 5 Output Compare 1 Secondary Register Bit 9 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. 018A OC2CON — 0186 0188 — OC2R OC1CON OC2RS 0182 0184 OC1R Bit 12 0180 Bit 13 Bit 15 Addr. SFR Name OC1RS Bit 14 OUTPUT COMPARE REGISTER MAP TABLE 12-1: OCFLT OCFLT Bit 4 OCTSE OCTSEL Bit 3 Bit 2 OCM<2:0> OCM<2:0> Bit 1 Bit 0 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 dsPIC30F2011/2012/3012/3013 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 13.0 SPI MODULE • SS1 (active low slave select). In Master mode operation, SCK1 is a clock output. In Slave mode, it is a clock input. Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). A series of eight (8) or sixteen (16) clock pulses shift out bits from the SPI1SR to SDO1 pin and simultaneously shift in data from SDI1 pin. An interrupt is generated when the transfer is complete and the interrupt flag bit (SPI1IF) is set. This interrupt can be disabled through the interrupt enable bit SPI1IE. The Serial Peripheral Interface (SPI) module is a synchronous serial interface. It is useful for communicating with other peripheral devices, such as EEPROMs, shift registers, display drivers and A/D converters, or other microcontrollers. It is compatible with Motorola's SPI and SIOP interfaces. The dsPIC30F2011/2012/3012/ 3013 devices feature one SPI module, SPI1. 13.1 The receive operation is double-buffered. When a complete byte is received, it is transferred from SPI1SR to SPI1BUF. If the receive buffer is full when new data is being transferred from SPI1SR to SPI1BUF, the module will set the SPIROV bit indicating an overflow condition. The transfer of the data from SPI1SR to SPI1BUF will not be completed and the new data will be lost. The module will not respond to SCL transitions while SPIROV is ‘1’, effectively disabling the module until SPI1BUF is read by user software. Operating Function Description Figure 13-1 is a simplified block diagram of the SPI module, which consists of a 16-bit shift register, SPI1SR , used for shifting data in and out, and a buffer register, SPI1BUF. Control register SPI1CON (not shown) configures the module. Additionally, status register SPI1STAT (not shown) indicates various status conditions. Note: Transmit writes are also double-buffered. The user writes to SPI1BUF. When the master or slave transfer is completed, the contents of the shift register (SPI1SR) are moved to the receive buffer. If any transmit data has been written to the buffer register, the contents of the transmit buffer are moved to SPI1SR. The received data is thus placed in SPI1BUF and the transmit data in SPI1SR is ready for the next transfer. See dsPIC30F Family Reference Manual (DS70046) for detailed information on the control and status registers. Four I/O pins comprise the serial interface: • SDI1 (serial data input) • SDO1 (serial data output) • SCK1 (shift clock input or output) FIGURE 13-1: Note: Both the transmit buffer (SPI1TXB) and the receive buffer (SPI1RXB) are mapped to the same register address, SPI1BUF. SPI BLOCK DIAGRAM Internal Data Bus Read Write SPIxBUF SPIxBUF Receive Transmit SPI1SR SDI1 bit 0 SDO1 SS1 Shift Clock SS & FSYNC Control Clock Control Edge Select Secondary Prescaler 1:1 – 1:8 SCK1 Primary Prescaler 1, 4, 16, 64 FCY Enable Master Clock © 2005 Microchip Technology Inc. Preliminary DS70139C-page 89 dsPIC30F2011/2012/3012/3013 Figure 13-2 depicts the a master/slave connection between two processors. In Master mode, the clock is generated by prescaling the system clock. Data is transmitted as soon as a value is written to SPI1BUF. The interrupt is generated at the middle of the transfer of the last bit. In Slave mode, data is transmitted and received as external clock pulses appear on SCK. Again, the interrupt is generated when the last bit is latched. If SS1 control is enabled, then transmission and reception are enabled only when SS1 = low. The SDO1 output will be disabled in SS1 mode with SS1 high. The clock provided to the module is (FOSC/4). This clock is then prescaled by the primary (PPRE<1:0>) and the secondary (SPRE<2:0>) prescale factors. The CKE bit determines whether transmit occurs on transition from active clock state to Idle clock state, or vice versa. The CKP bit selects the Idle state (high or low) for the clock. 13.1.1 WORD AND BYTE COMMUNICATION A control bit, MODE16 (SPI1CON<10>), allows the module to communicate in either 16-bit or 8-bit mode. 16-bit operation is identical to 8-bit operation except that the number of bits transmitted is 16 instead of 8. FIGURE 13-2: The user software must disable the module prior to changing the MODE16 bit. The SPI module is reset when the MODE16 bit is changed by the user. A basic difference between 8-bit and 16-bit operation is that the data is transmitted out of bit 7 of the SPI1SR for 8-bit operation, and data is transmitted out of bit15 of the SPI1SR for 16-bit operation. In both modes, data is shifted into bit 0 of the SPI1SR. 13.1.2 SDO1 DISABLE A control bit, DISSDO, is provided to the SPI1CON register to allow the SDO1 output to be disabled. This will allow the SPI module to be connected in an input only configuration. SDO1 can also be used for general purpose I/O. 13.2 Framed SPI Support The module supports a basic framed SPI protocol in Master or Slave mode. The control bit FRMEN enables framed SPI support and causes the SS1 pin to perform the frame synchronization pulse (FSYNC) function. The control bit SPIFSD determines whether the SS1 pin is an input or an output (i.e., whether the module receives or generates the frame synchronization pulse). The frame pulse is an active high pulse for a single SPI clock cycle. When frame synchronization is enabled, the data transmission starts only on the subsequent transmit edge of the SPI clock. SPI MASTER/SLAVE CONNECTION SPI™ Master SPI™ Slave SDO1 SDI1 Serial Input Buffer (SPI1BUF) SDI1 Shift Register (SPI1SR) MSb Serial Input Buffer (SPI1BUF) SDO1 LSb MSb SCK1 Serial Clock PROCESSOR 1 DS70139C-page 90 Shift Register (SPI1SR) LSb SCK1 PROCESSOR 2 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 13.3 Slave Select Synchronization 13.5 The SS1 pin allows a Synchronous Slave mode. The SPI must be configured in SPI Slave mode with SS1 pin control enabled (SSEN = 1). When the SS1 pin is low, transmission and reception are enabled and the SDOx pin is driven. When SS1 pin goes high, the SDOx pin is no longer driven. Also, the SPI module is re-synchronized, and all counters/control circuitry are reset. Therefore, when the SS1 pin is asserted low again, transmission/reception will begin at the MS bit even if SS1 had been de-asserted in the middle of a transmit/receive. 13.4 SPI Operation During CPU Idle Mode When the device enters Idle mode, all clock sources remain functional. The SPISIDL bit (SPI1STAT<13>) selects if the SPI module will stop or continue on Idle. If SPISIDL = 0, the module will continue to operate when the CPU enters Idle mode. If SPISIDL = 1, the module will stop when the CPU enters Idle mode. SPI Operation During CPU Sleep Mode During Sleep mode, the SPI module is shutdown. If the CPU enters Sleep mode while an SPI transaction is in progress, then the transmission and reception is aborted. The transmitter and receiver will stop in Sleep mode. However, register contents are not affected by entering or exiting Sleep mode. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 91 DS70139C-page 92 0220 0222 0224 SPI1STAT SPI1CON SPI1BUF — SPIEN Bit 15 FRMEN — Bit 14 SPIFSD SPISIDL Bit 13 — — Bit 12 SPI1 REGISTER MAP — Bit 10 DISSDO MODE16 — Bit 11 CKE — Bit 8 SSEN — Bit 7 CKP SPIROV Bit 6 Transmit and Receive Buffer SMP — Bit 9 MSTEN — Bit 5 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. Addr. SFR Name TABLE 13-1: SPRE2 — Bit 4 SPRE1 — Bit 3 SPRE0 — Bit 2 PPRE1 SPITBF Bit 1 Reset State PPRE0 0000 0000 0000 0000 0000 0000 0000 0000 SPIRBF 0000 0000 0000 0000 Bit 0 dsPIC30F2011/2012/3012/3013 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 14.0 I2C MODULE 14.1.1 Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). 2 The following types of I2C operation are supported: • • • I2C slave operation with 7-bit address I2C slave operation with 10-bit address I2C master operation with 7 or 10-bit address See the I2C programmer’s model (Figure 14-1). TM The Inter-Integrated Circuit (I C ) module provides complete hardware support for both Slave and MultiMaster modes of the I2C serial communication standard, with a 16-bit interface. This module offers the following key features: • I2C interface supporting both master and slave operation. • I2C Slave mode supports 7 and 10-bit address. • I2C Master mode supports 7 and 10-bit address. • I2C port allows bidirectional transfers between master and slaves. • Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control). • I2C supports multi-master operation; detects bus collision and will arbitrate accordingly. 14.1 Operating Function Description The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode specifications, as well as 7 and 10-bit addressing. Thus, the I2C module can operate either as a slave or a master on an I2C bus. 14.1.2 PIN CONFIGURATION IN I2C MODE I2C has a 2-pin interface: the SCL pin is clock and the SDA pin is data. 14.1.3 I2C REGISTERS I2CCON and I2CSTAT are control and status registers, respectively. The I2CCON register is readable and writable. The lower 6 bits of I2CSTAT are read only. The remaining bits of the I2CSTAT are read/write. I2CRSR is the shift register used for shifting data, whereas I2CRCV is the buffer register to which data bytes are written, or from which data bytes are read. I2CRCV is the receive buffer as shown in Figure 14-1. I2CTRN is the transmit register to which bytes are written during a transmit operation, as shown in Figure 14-2. The I2CADD register holds the slave address. A status bit, ADD10, indicates 10-bit Address mode. The I2CBRG acts as the baud rate generator reload value. In receive operations, I2CRSR and I2CRCV together form a double-buffered receiver. When I2CRSR receives a complete byte, it is transferred to I2CRCV and an interrupt pulse is generated. During transmission, the I2CTRN is not double-buffered. Note: FIGURE 14-1: VARIOUS I2C MODES Following a RESTART condition in 10-bit mode, the user only needs to match the first 7-bit address. PROGRAMMER’S MODEL I2CRCV (8 bits) Bit 7 Bit 0 Bit 7 Bit 0 I2CTRN (8 bits) I2CBRG (9 bits) Bit 8 Bit 0 I2CCON (16 bits) Bit 15 Bit 0 Bit 15 Bit 0 I2CSTAT (16 bits) I2CADD (10 bits) Bit 9 © 2005 Microchip Technology Inc. Bit 0 Preliminary DS70139C-page 93 dsPIC30F2011/2012/3012/3013 FIGURE 14-2: I2C BLOCK DIAGRAM Internal Data Bus I2CRCV Read SCL Shift Clock I2CRSR LSB SDA Addr_Match Match Detect Write I2CADD Read Start and Stop bit Detect I2CSTAT Write Control Logic Start, RESTART, Stop bit Generate Write I2CCON Collision Detect Acknowledge Generation Clock Stretching Read Read Write I2CTRN LSB Shift Clock Read Reload Control BRG Down Counter DS70139C-page 94 Write I2CBRG FCY Preliminary Read © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 14.2 I2C Module Addresses 14.3.2 The I2CADD register contains the Slave mode addresses. The register is a 10-bit register. If the A10M bit (I2CCON<10>) is ‘0’, the address is interpreted by the module as a 7-bit address. When an address is received, it is compared to the 7 LS bits of the I2CADD register. If the A10M bit is ‘1’, the address is assumed to be a 10-bit address. When an address is received, it will be compared with the binary value ‘11110 A9 A8’ (where A9 and A8 are two Most Significant bits of I2CADD). If that value matches, the next address will be compared with the Least Significant 8 bits of I2CADD, as specified in the 10-bit addressing protocol. If the R_W bit received is a ‘0’ during an address match, then Receive mode is initiated. Incoming bits are sampled on the rising edge of SCL. After 8 bits are received, if I2CRCV is not full or I2COV is not set, I2CRSR is transferred to I2CRCV. ACK is sent on the ninth clock. If the RBF flag is set, indicating that I2CRCV is still holding data from a previous operation (RBF = 1), then ACK is not sent; however, the interrupt pulse is generated. In the case of an overflow, the contents of the I2CRSR are not loaded into the I2CRCV. Note: The 7-bit I2C Slave Addresses supported by the dsPIC30Fare shown in Table 14-1. TABLE 14-1: 7-BIT I2C SLAVE ADDRESSES 0x00 General call address or start byte 0x01-0x03 Reserved 0x04-0x77 Valid 7-bit addresses 0x78-0x7b Valid 10-bit addresses (lower 7 bits) 0x7c-0x7f 14.3 14.4 Reserved I2C 7-bit Slave Mode Operation If an address match occurs, an Acknowledgement will be sent, and the slave event interrupt flag (SI2CIF) is set on the falling edge of the ninth (ACK) bit. The address match does not affect the contents of the I2CRCV buffer or the RBF bit. SLAVE TRANSMISSION If the R_W bit received is a ‘1’, then the serial port will go into Transmit mode. It will send ACK on the ninth bit and then hold SCL to ‘0’ until the CPU responds by writing to I2CTRN. SCL is released by setting the SCLREL bit, and 8 bits of data are shifted out. Data bits are shifted out on the falling edge of SCL, such that SDA is valid during SCL high. The interrupt pulse is sent on the falling edge of the ninth clock pulse, regardless of the status of the ACK received from the master. © 2005 Microchip Technology Inc. The I2CRCV will be loaded if the I2COV bit = 1 and the RBF flag = 0. In this case, a read of the I2CRCV was performed but the user did not clear the state of the I2COV bit before the next receive occurred. The Acknowledgement is not sent (ACK = 1) and the I2CRCV is updated. I2C 10-bit Slave Mode Operation In 10-bit mode, the basic receive and transmit operations are the same as in the 7-bit mode. However, the criteria for address match is more complex. Once enabled (I2CEN = 1), the slave module will wait for a Start bit to occur (i.e., the I2C module is ‘Idle’). Following the detection of a Start bit, 8 bits are shifted into I2CRSR and the address is compared against I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0> are compared against I2CRSR<7:1> and I2CRSR<0> is the R_W bit. All incoming bits are sampled on the rising edge of SCL. 14.3.1 SLAVE RECEPTION The I2C specification dictates that a slave must be addressed for a write operation with two address bytes following a Start bit. The A10M bit is a control bit that signifies that the address in I2CADD is a 10-bit address rather than a 7-bit address. The address detection protocol for the first byte of a message address is identical for 7-bit and 10-bit messages, but the bits being compared are different. I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is compared against a literal ‘11110’ (the default 10-bit address) and I2CRSR<2:1> are compared against I2CADD<9:8>. If a match occurs and if R_W = 0, the interrupt pulse is sent. The ADD10 bit will be cleared to indicate a partial address match. If a match fails or R_W = 1, the ADD10 bit is cleared and the module returns to the Idle state. The low byte of the address is then received and compared with I2CADD<7:0>. If an address match occurs, the interrupt pulse is generated and the ADD10 bit is set, indicating a complete 10-bit address match. If an address match did not occur, the ADD10 bit is cleared and the module returns to the Idle state. Preliminary DS70139C-page 95 dsPIC30F2011/2012/3012/3013 14.4.1 10-BIT MODE SLAVE TRANSMISSION Once a slave is addressed in this fashion with the full 10-bit address (we will refer to this state as “PRIOR_ADDR_MATCH”), the master can begin sending data bytes for a slave reception operation. 14.4.2 10-BIT MODE SLAVE RECEPTION Once addressed, the master can generate a Repeated Start, reset the high byte of the address and set the R_W bit without generating a Stop bit, thus initiating a slave transmit operation. 14.5 Automatic Clock Stretch In the Slave modes, the module can synchronize buffer reads and write to the master device by clock stretching. 14.5.1 Clock stretching takes place following the ninth clock of the receive sequence. On the falling edge of the ninth clock at the end of the ACK sequence, if the RBF bit is set, the SCLREL bit is automatically cleared, forcing the SCL output to be held low. The user’s ISR must set the SCLREL bit before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the I2CRCV before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring. Note 1: If the user reads the contents of the I2CRCV, clearing the RBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. 2: The SCLREL bit can be set in software regardless of the state of the RBF bit. The user should be careful to clear the RBF bit in the ISR before the next receive sequence in order to prevent an overflow condition. TRANSMIT CLOCK STRETCHING Both 10-bit and 7-bit Transmit modes implement clock stretching by asserting the SCLREL bit after the falling edge of the ninth clock, if the TBF bit is cleared, indicating the buffer is empty. In Slave Transmit modes, clock stretching is always performed irrespective of the STREN bit. 14.5.4 Clock synchronization takes place following the ninth clock of the transmit sequence. If the device samples an ACK on the falling edge of the ninth clock and if the TBF bit is still clear, then the SCLREL bit is automatically cleared. The SCLREL being cleared to ‘0’ will assert the SCL line low. The user’s ISR must set the SCLREL bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the I2CTRN before the master device can initiate another transmit sequence. Clock stretching takes place automatically during the addressing sequence. Because this module has a register for the entire address, it is not necessary for the protocol to wait for the address to be updated. Note 1: If the user loads the contents of I2CTRN, setting the TBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. 2: The SCLREL bit can be set in software, regardless of the state of the TBF bit. 14.5.2 RECEIVE CLOCK STRETCHING The STREN bit in the I2CCON register can be used to enable clock stretching in Slave Receive mode. When the STREN bit is set, the SCL pin will be held low at the end of each data receive sequence. 14.5.3 CLOCK STRETCHING DURING 7-BIT ADDRESSING (STREN = 1) CLOCK STRETCHING DURING 10-BIT ADDRESSING (STREN = 1) After the address phase is complete, clock stretching will occur on each data receive or transmit sequence as was described earlier. 14.6 Software Controlled Clock Stretching (STREN = 1) When the STREN bit is ‘1’, the SCLREL bit may be cleared by software to allow software to control the clock stretching. The logic will synchronize writes to the SCLREL bit with the SCL clock. Clearing the SCLREL bit will not assert the SCL output until the module detects a falling edge on the SCL output and SCL is sampled low. If the SCLREL bit is cleared by the user while the SCL line has been sampled low, the SCL output will be asserted (held low). The SCL output will remain low until the SCLREL bit is set, and all other devices on the I2C bus have de-asserted SCL. This ensures that a write to the SCLREL bit will not violate the minimum high time requirement for SCL. If the STREN bit is ‘0’, a software write to the SCLREL bit will be disregarded and have no effect on the SCLREL bit. When the STREN bit is set in Slave Receive mode, the SCL line is held low when the buffer register is full. The method for stretching the SCL output is the same for both 7 and 10-bit Addressing modes. DS70139C-page 96 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 14.7 14.11 I2C Master Support Interrupts The I2C module generates two interrupt flags, MI2CIF (I2C Master Interrupt Flag) and SI2CIF (I2C Slave Interrupt Flag). The MI2CIF interrupt flag is activated on completion of a master message event. The SI2CIF interrupt flag is activated on detection of a message directed to the slave. 14.8 Slope Control 2 The I C standard requires slope control on the SDA and SCL signals for Fast mode (400 kHz). The control bit, DISSLW, enables the user to disable slew rate control if desired. It is necessary to disable the slew rate control for 1 MHz mode. 14.9 IPMI Support The control bit, IPMIEN, enables the module to support Intelligent Peripheral Management Interface (IPMI). When this bit is set, the module accepts and acts upon all addresses. 14.10 General Call Address Support The general call address can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledgement. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R_W = 0. The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CCON<15> = 1). Following a Start bit detection, 8 bits are shifted into I2CRSR and the address is compared with I2CADD, and is also compared with the general call address which is fixed in hardware. If a general call address match occurs, the I2CRSR is transferred to the I2CRCV after the eighth clock, the RBF flag is set and on the falling edge of the ninth bit (ACK bit), the master event interrupt flag (MI2CIF) is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the I2CRCV to determine if the address was device specific or a general call address. © 2005 Microchip Technology Inc. As a master device, six operations are supported: • Assert a Start condition on SDA and SCL. • Assert a RESTART condition on SDA and SCL. • Write to the I2CTRN register initiating transmission of data/address. • Generate a Stop condition on SDA and SCL. • Configure the I2C port to receive data. • Generate an ACK condition at the end of a received byte of data. 14.12 I2C Master Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an ACK bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address, followed by a ‘1’ to indicate receive bit. Serial data is received via SDA while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an ACK bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. 14.12.1 I2C MASTER TRANSMISSION Transmission of a data byte, a 7-bit address, or the second half of a 10-bit address is accomplished by simply writing a value to I2CTRN register. The user should only write to I2CTRN when the module is in a WAIT state. This action will set the Buffer Full Flag (TBF) and allow the baud rate generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. The Transmit Status Flag, TRSTAT (I2CSTAT<14>), indicates that a master transmit is in progress. Preliminary DS70139C-page 97 dsPIC30F2011/2012/3012/3013 14.12.2 I2C MASTER RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN (I2CCON<11>). The I2C module must be Idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The baud rate generator begins counting and on each rollover, the state of the SCL pin ACK and data are shifted into the I2CRSR on the rising edge of each clock. If a transmit was in progress when the bus collision occurred, the transmission is halted, the TBF flag is cleared, the SDA and SCL lines are de-asserted and a value can now be written to I2CTRN. When the user services the I2C master event Interrupt Service Routine, if the I2C bus is free (i.e., the P bit is set), the user can resume communication by asserting a Start condition. In I2C Master mode, the reload value for the BRG is located in the I2CBRG register. When the BRG is loaded with this value, the BRG counts down to ‘0’ and stops until another reload has taken place. If clock arbitration is taking place, for instance, the BRG is reloaded when the SCL pin is sampled high. If a Start, RESTART, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted, and the respective control bits in the I2CCON register are cleared to ‘0’. When the user services the bus collision Interrupt Service Routine, and if the I2C bus is free, the user can resume communication by asserting a Start condition. As per the I2C standard, FSCK may be 100 kHz or 400 kHz. However, the user can specify any baud rate up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal. The master will continue to monitor the SDA and SCL pins, and if a Stop condition occurs, the MI2CIF bit will be set. EQUATION 14-1: A write to the I2CTRN will start the transmission of data at the first data bit regardless of where the transmitter left off when bus collision occurred. 14.12.3 BAUD RATE GENERATOR I2CBRG = 14.12.4 SERIAL CLOCK RATE CY ( FFSCL – FCY 1,111,111 ) –1 CLOCK ARBITRATION Clock arbitration occurs when the master de-asserts the SCL pin (SCL allowed to float high) during any receive, transmit, or RESTART/Stop condition. When the SCL pin is allowed to float high, the baud rate generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the baud rate generator is reloaded with the contents of I2CBRG and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device. 14.12.5 MULTI-MASTER COMMUNICATION, BUS COLLISION, AND BUS ARBITRATION Multi-master operation support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA by letting SDA float high while another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the MI2CIF pulse and reset the master portion of the I2C port to its Idle state. DS70139C-page 98 In a multi-master environment, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the I2CSTAT register, or the bus is Idle and the S and P bits are cleared. 14.13 I2C Module Operation During CPU Sleep and Idle Modes 14.13.1 I2C OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a transmission and the state machine is partially into a transmission as the clocks stop, then the transmission is aborted. Similarly, if Sleep occurs in the middle of a reception, then the reception is aborted. 14.13.2 I2C OPERATION DURING CPU IDLE MODE For the I2C, the I2CSIDL bit selects if the module will stop on Idle or continue on Idle. If I2CSIDL = 0, the module will continue operation on assertion of the Idle mode. If I2CSIDL = 1, the module will stop on Idle. Preliminary © 2005 Microchip Technology Inc. 0204 0206 0208 020A I2CBRG I2CCON I2CSTAT I2CADD — ACKSTAT I2CEN — — — Bit 15 — TRSTAT — — — — Bit 14 — — — Bit 12 — — — Bit 11 — — — — — — I2CSIDL SCLREL IPMIEN — — — Bit 13 I2C REGISTER MAP — BCL A10M — — — Bit 10 GCSTAT DISSLW — — — Bit 9 ADD10 SMEN — — Bit 8 IWCOL GCEN Bit 7 I2COV STREN Bit 6 Bit 3 Transmit Register Receive Register Bit 4 P Address Register D_A ACKEN S RCEN Baud Rate Generator Bit 5 ACKDT Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. 0200 0202 I2CRCV I2CTRN SFR Name Addr. TABLE 14-2: R_W PEN Bit 2 RBF RSEN Bit 1 TBF SEN Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0001 0000 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 0000 0000 0000 0000 Reset State dsPIC30F2011/2012/3012/3013 © 2005 Microchip Technology Inc. Preliminary DS70139C-page 99 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 100 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 15.0 UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) MODULE 15.1 The key features of the UART module are: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). This section describes the Universal Asynchronous Receiver/Transmitter Communications module. The dsPIC30F2011/2012/3012 processors have one UART module (UART1). The dsPIC30F3013 processor has two UART modules (UART1 and UART2). • • • • • • • • • • • • FIGURE 15-1: UART Module Overview Full-duplex, 8 or 9-bit data communication Even, odd or no parity options (for 8-bit data) One or two Stop bits Fully integrated baud rate generator with 16-bit prescaler Baud rates range from 38 bps to 1.875 Mbps at a 30 MHz instruction rate 4-word deep transmit data buffer 4-word deep receive data buffer Parity, framing and buffer overrun error detection Support for interrupt only on address detect (9th bit = 1) Separate transmit and receive interrupts Loopback mode for diagnostic support Alternate receive and transmit pins for UART1 UART TRANSMITTER BLOCK DIAGRAM Internal Data Bus Control and Status bits Write UTX8 Write UxTXREG Low Byte Transmit Control – Control TSR – Control Buffer – Generate Flags – Generate Interrupt Load TSR UxTXIF UTXBRK Data Transmit Shift Register (UxTSR) ‘0’ (Start) UxTX ‘1’ (Stop) Parity Parity Generator 16 Divider 16x Baud Clock from Baud Rate Generator Control Signals Note: x = 1 or 2. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 101 dsPIC30F2011/2012/3012/3013 FIGURE 15-2: UART RECEIVER BLOCK DIAGRAM Internal Data Bus 16 Write Read Read Read UxMODE Write UxSTA URX8 UxRXREG Low Byte Receive Buffer Control – Generate Flags – Generate Interrupt – Shift Data Characters 0 · Start bit Detect · Parity Check · Stop bit Detect · Shift Clock Generation · Wake Logic Load RSR to Buffer Receive Shift Register (UxRSR) Control Signals FERR UxRX 8-9 PERR LPBACK From UxTX 1 16 Divider 16x Baud Clock from Baud Rate Generator UxRXIF DS70139C-page 102 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 15.2 15.2.1 Enabling and Setting Up UART 15.3 ENABLING THE UART 15.3.1 The UART module is enabled by setting the UARTEN bit in the UxMODE register (where x = 1 or 2). Once enabled, the UxTX and UxRX pins are configured as an output and an input respectively, overriding the TRIS and LATCH register bit settings for the corresponding I/O port pins. The UxTX pin is at logic ‘1’ when no transmission is taking place. 15.2.2 Disabling the UART module resets the buffers to empty states. Any data characters in the buffers are lost and the baud rate counter is reset. 1. 2. 3. 4. All error and status flags associated with the UART module are reset when the module is disabled. The URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and UTXBF bits are cleared, whereas RIDLE and TRMT are set. Other control bits, including ADDEN, URXISEL<1:0>, UTXISEL, as well as the UxMODE and UxBRG registers, are not affected. Clearing the UARTEN bit while the UART is active will abort all pending transmissions and receptions and reset the module as defined above. Re-enabling the UART will restart the UART in the same configuration. 15.2.3 15.2.4 5. Set up the UART: First, the data length, parity and number of Stop bits must be selected. Then, the transmit and receive interrupt enable and priority bits are setup in the UxMODE and UxSTA registers. Also, the appropriate baud rate value must be written to the UxBRG register. Enable the UART by setting the UARTEN bit (UxMODE<15>). Set the UTXEN bit (UxSTA<10>), thereby enabling a transmission. Write the byte to be transmitted to the lower byte of UxTXREG. The value will be transferred to the Transmit Shift register (UxTSR) immediately and the serial bit stream will start shifting out during the next rising edge of the baud clock. Alternatively, the data byte may be written while UTXEN = 0, following which, the user may set UTXEN. This will cause the serial bit stream to begin immediately because the baud clock will start from a cleared state. A transmit interrupt will be generated, depending on the value of the interrupt control bit UTXISEL (UxSTA<15>). 15.3.2 ALTERNATE I/O The alternate I/O function is enabled by setting the ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX and UxARX pins (alternate transmit and alternate receive pins, respectively) are used by the UART module instead of the UxTX and UxRX pins. If ALTIO = 0, the UxTX and UxRX pins are used by the UART module. SETTING UP DATA, PARITY AND STOP BIT SELECTIONS Control bits PDSEL<1:0> in the UxMODE register are used to select the data length and parity used in the transmission. The data length may either be 8 bits with even, odd or no parity, or 9 bits with no parity. The STSEL bit determines whether one or two Stop bits will be used during data transmission. The default (power-on) setting of the UART is 8 bits, no parity and 1 Stop bit (typically represented as 8, N, 1). © 2005 Microchip Technology Inc. TRANSMITTING IN 8-BIT DATA MODE The following steps must be performed in order to transmit 8-bit data: DISABLING THE UART The UART module is disabled by clearing the UARTEN bit in the UxMODE register. This is the default state after any Reset. If the UART is disabled, all I/O pins operate as port pins under the control of the latch and TRIS bits of the corresponding port pins. Transmitting Data TRANSMITTING IN 9-BIT DATA MODE The sequence of steps involved in the transmission of 9-bit data is similar to 8-bit transmission, except that a 16-bit data word (of which the upper 7 bits are always clear) must be written to the UxTXREG register. 15.3.3 TRANSMIT BUFFER (UXTXB) The transmit buffer is 9 bits wide and 4 characters deep. Including the Transmit Shift register (UxTSR), the user effectively has a 5-deep FIFO (First-In, FirstOut) buffer. The UTXBF status bit (UxSTA<9>) indicates whether the transmit buffer is full. If a user attempts to write to a full buffer, the new data will not be accepted into the FIFO, and no data shift will occur within the buffer. This enables recovery from a buffer overrun condition. The FIFO is reset during any device Reset but is not affected when the device enters or wakes up from a Power Saving mode. Preliminary DS70139C-page 103 dsPIC30F2011/2012/3012/3013 15.3.4 TRANSMIT INTERRUPT 15.4.2 The transmit interrupt flag (U1TXIF or U2TXIF) is located in the corresponding interrupt flag register. The transmitter generates an edge to set the UxTXIF bit. The condition for generating the interrupt depends on the UTXISEL control bit: a) b) If UTXISEL = 0, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR). This implies that the transmit buffer has at least one empty word. If UTXISEL = 1, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR) and the transmit buffer is empty. Switching between the two Interrupt modes during operation is possible and sometimes offers more flexibility. 15.3.5 TRANSMIT BREAK The receive buffer is 4 words deep. Including the Receive Shift register (UxRSR), the user effectively has a 5-word deep FIFO buffer. URXDA (UxSTA<0>) = 1 indicates that the receive buffer has data available. URXDA = 0 implies that the buffer is empty. If a user attempts to read an empty buffer, the old values in the buffer will be read and no data shift will occur within the FIFO. The FIFO is reset during any device Reset. It is not affected when the device enters or wakes up from a Power Saving mode. 15.4.3 a) To send a break character, the UTXBRK bit must be set by software and must remain set for a minimum of 13 baud clock cycles. The UTXBRK bit is then cleared by software to generate Stop bits. The user must wait for a duration of at least one or two baud clock cycles in order to ensure a valid Stop bit(s) before reloading the UxTXB, or starting other transmitter activity. Transmission of a break character does not generate a transmit interrupt. b) 15.4.1 RECEIVE INTERRUPT The receive interrupt flag (U1RXIF or U2RXIF) can be read from the corresponding interrupt flag register. The interrupt flag is set by an edge generated by the receiver. The condition for setting the receive interrupt flag depends on the settings specified by the URXISEL<1:0> (UxSTA<7:6>) control bits. Setting the UTXBRK bit (UxSTA<11>) will cause the UxTX line to be driven to logic ‘0’. The UTXBRK bit overrides all transmission activity. Therefore, the user should generally wait for the transmitter to be Idle before setting UTXBRK. 15.4 RECEIVE BUFFER (UXRXB) c) If URXISEL<1:0> = 00 or 01, an interrupt is generated every time a data word is transferred from the Receive Shift register (UxRSR) to the receive buffer. There may be one or more characters in the receive buffer. If URXISEL<1:0> = 10, an interrupt is generated when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a result of the transfer, contains 3 characters. If URXISEL<1:0> = 11, an interrupt is set when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a result of the transfer, contains 4 characters (i.e., becomes full). Switching between the Interrupt modes during operation is possible, though generally not advisable during normal operation. Receiving Data RECEIVING IN 8-BIT OR 9-BIT DATA MODE 15.5 Reception Error Handling The following steps must be performed while receiving 8-bit or 9-bit data: 15.5.1 1. 2. 3. The OERR bit (UxSTA<1>) is set if all of the following conditions occur: 4. 5. Set up the UART (see Section 15.3.1). Enable the UART (see Section 15.3.1). A receive interrupt will be generated when one or more data words have been received, depending on the receive interrupt settings specified by the URXISEL bits (UxSTA<7:6>). Read the OERR bit to determine if an overrun error has occurred. The OERR bit must be reset in software. Read the received data from UxRXREG. The act of reading UxRXREG will move the next word to the top of the receive FIFO, and the PERR and FERR values will be updated. DS70139C-page 104 a) b) c) RECEIVE BUFFER OVERRUN ERROR (OERR BIT) The receive buffer is full. The Receive Shift register is full, but unable to transfer the character to the receive buffer. The Stop bit of the character in the UxRSR is detected, indicating that the UxRSR needs to transfer the character to the buffer. Once OERR is set, no further data is shifted in UxRSR (until the OERR bit is cleared in software or a Reset occurs). The data held in UxRSR and UxRXREG remains valid. Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 15.5.2 FRAMING ERROR (FERR) 15.6 The FERR bit (UxSTA<2>) is set if a ‘0’ is detected instead of a Stop bit. If two Stop bits are selected, both Stop bits must be ‘1’, otherwise FERR will be set. The read only FERR bit is buffered along with the received data. It is cleared on any Reset. 15.5.3 PARITY ERROR (PERR) The PERR bit (UxSTA<3>) is set if the parity of the received word is incorrect. This error bit is applicable only if a Parity mode (odd or even) is selected. The read only PERR bit is buffered along with the received data bytes. It is cleared on any Reset. 15.5.4 IDLE STATUS When the receiver is active (i.e., between the initial detection of the Start bit and the completion of the Stop bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the completion of the Stop bit and detection of the next Start bit, the RIDLE bit is ‘1’, indicating that the UART is Idle. 15.5.5 RECEIVE BREAK The receiver will count and expect a certain number of bit times based on the values programmed in the PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. If the break is longer than 13 bit times, the reception is considered complete after the number of bit times specified by PDSEL and STSEL. The URXDA bit is set, FERR is set, zeros are loaded into the receive FIFO, interrupts are generated if appropriate and the RIDLE bit is set. When the module receives a long break signal and the receiver has detected the Start bit, the data bits and the invalid Stop bit (which sets the FERR), the receiver must wait for a valid Stop bit before looking for the next Start bit. It cannot assume that the break condition on the line is the next Start bit. Break is regarded as a character containing all ‘0’s with the FERR bit set. The break character is loaded into the buffer. No further reception can occur until a Stop bit is received. Note that RIDLE goes high when the Stop bit has not yet been received. Address Detect Mode Setting the ADDEN bit (UxSTA<5>) enables this special mode in which a 9th bit (URX8) value of ‘1’ identifies the received word as an address, rather than data. This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have any impact on interrupt generation in this mode since an interrupt (if enabled) will be generated every time the received word has the 9th bit set. 15.7 Loopback Mode Setting the LPBACK bit enables this special mode in which the UxTX pin is internally connected to the UxRX pin. When configured for the Loopback mode, the UxRX pin is disconnected from the internal UART receive logic. However, the UxTX pin still functions as in a normal operation. To select this mode: a) b) c) Configure UART for desired mode of operation. Set LPBACK = 1 to enable Loopback mode. Enable transmission as defined in Section 15.3. 15.8 Baud Rate Generator The UART has a 16-bit baud rate generator to allow maximum flexibility in baud rate generation. The baud rate generator register (UxBRG) is readable and writable. The baud rate is computed as follows: BRG = 16-bit value held in UxBRG register (0 through 65535) FCY = Instruction Clock Rate (1/TCY) The Baud Rate is given by Equation 15-1. EQUATION 15-1: BAUD RATE Baud Rate = FCY / (16*(BRG+1)) Therefore, the maximum baud rate possible is FCY /16 (if BRG = 0), and the minimum baud rate possible is FCY / (16* 65536). With a full 16-bit baud rate generator at 30 MIPs operation, the minimum baud rate achievable is 28.5 bps. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 105 dsPIC30F2011/2012/3012/3013 15.9 15.10.2 Auto Baud Support To allow the system to determine baud rates of received characters, the input can be optionally linked to a selected capture input (IC1 for UART1 and IC2 for UART2). To enable this mode, you must program the input capture module to detect the falling and rising edges of the Start bit. UART OPERATION DURING CPU IDLE MODE For the UART, the USIDL bit selects if the module will stop operation when the device enters Idle mode or whether the module will continue on Idle. If USIDL = 0, the module will continue operation during Idle mode. If USIDL = 1, the module will stop on Idle. 15.10 UART Operation During CPU Sleep and Idle Modes 15.10.1 UART OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If entry into Sleep mode occurs while a transmission is in progress, then the transmission is aborted. The UxTX pin is driven to logic ‘1’. Similarly, if entry into Sleep mode occurs while a reception is in progress, then the reception is aborted. The UxSTA, UxMODE, transmit and receive registers and buffers, and the UxBRG register are not affected by Sleep mode. If the WAKE bit (UxMODE<7>) is set before the device enters Sleep mode, then a falling edge on the UxRX pin will generate a receive interrupt. The Receive Interrupt Select mode bit (URXISEL) has no effect for this function. If the receive interrupt is enabled, then this will wake-up the device from Sleep. The UARTEN bit must be set in order to generate a wake-up interrupt. DS70139C-page 106 Preliminary © 2005 Microchip Technology Inc. 0212 0214 u = uninitialized bit U1RXREG U1BRG Legend: © 2005 Microchip Technology Inc. — — — ALTIO — — — — — Bit 10 UART2 is not available on the dsPIC30F2011/2012/3012 Note — — — — — — UTXBF — Bit 9 URX8 UTX8 TRMT — Bit 8 LPBACK Bit 6 LPBACK Bit 6 ABAUD Bit 5 PERR — Bit 3 RIDLE — Bit 4 PERR — Bit 3 Receive Register Transmit Register RIDLE — Bit 4 Receive Register Transmit Register URXISEL1 URXISEL0 ADDEN WAKE Bit 7 Baud Rate Generator Prescaler URX8 UTX8 TRMT — Bit 8 ABAUD Bit 5 URXISEL1 URXISEL0 ADDEN WAKE Bit 7 Baud Rate Generator Prescaler UTXBF — Bit 9 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. — — UTXBRK UTXEN — Bit 11 u = uninitialized bit — — — — Bit 12 Legend: — — — USIDL Bit 13 021E — — — — Bit 14 U2BRG — — UTXISEL UARTEN Bit 15 021A 1: Bit 10 UTXBRK UTXEN 021C 0218 U2STA — — — — U2RXREG 0216 U2MODE — — — USIDL Bit 11 UART2 REGISTER MAP FOR DSPIC30F3013 — — — — Bit 12 U2TXREG Addr. SFR Name TABLE 15-2: 0210 U1TXREG UARTEN 020E U1STA UTXISEL 020C U1MODE Bit 13 Bit 15 SFR Name Addr. Bit 14 UART1 REGISTER MAP FOR dsPIC30F2011/2012/3012/3013 TABLE 15-1: Bit 1 Bit 0 Reset State Bit 1 OERR FERR OERR PDSEL1 PDSEL0 Bit 2 FERR Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 000u uuuu uuuu URXDA 0000 0001 0001 0000 STSEL 0000 0000 0000 0000 Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0000 000u uuuu uuuu URXDA 0000 0001 0001 0000 PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000 Bit 2 dsPIC30F2011/2012/3012/3013 DS70139C-page 107 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 108 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 16.0 12-BIT ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE The A/D module has six 16-bit registers: • • • • • • Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). The ADCON1, ADCON2 and ADCON3 registers control the operation of the A/D module. The ADCHS register selects the input channels to be converted. The ADPCFG register configures the port pins as analog inputs or as digital I/O. The ADCSSL register selects inputs for scanning. The 12-bit Analog-to-Digital converter (A/D) allows conversion of an analog input signal to a 12-bit digital number. This module is based on a Successive Approximation Register (SAR) architecture and provides a maximum sampling rate of 100 ksps. The A/D module has up to 10 analog inputs which are multiplexed into a sample and hold amplifier. The output of the sample and hold is the input into the converter which generates the result. The analog reference voltage is software selectable to either the device supply voltage (AVDD/AVSS) or the voltage level on the (VREF+/VREF-) pin. The A/D converter has a unique feature of being able to operate while the device is in Sleep mode with RC oscillator selection. FIGURE 16-1: A/D Control Register 1 (ADCON1) A/D Control Register 2 (ADCON2) A/D Control Register 3 (ADCON3) A/D Input Select Register (ADCHS) A/D Port Configuration Register (ADPCFG) A/D Input Scan Selection Register (ADCSSL) Note: The SSRC<2:0>, ASAM, SMPI<3:0>, BUFM and ALTS bits, as well as the ADCON3 and ADCSSL registers, must not be written to while ADON = 1. This would lead to indeterminate results. The block diagram of the 12-bit A/D module is shown in Figure 16-1. 12-BIT A/D FUNCTIONAL BLOCK DIAGRAM AVDD/VREF+ AVSS/VREFComparator 0000 0001 AN2 0010 AN3 0011 AN4 0100 AN5 0101 AN6 0110 AN7 0111 AN8 1000 AN9 1001 12-bit SAR 16-word, 12-bit Dual Port Buffer Sample/Sequence Control Sample S/H © 2005 Microchip Technology Inc. Conversion Logic CH0 Preliminary Input Switches Bus Interface AN1 DAC Data Format AN0 Input Mux Control DS70139C-page 109 dsPIC30F2011/2012/3012/3013 16.1 A/D Result Buffer 16.3 Selecting the Conversion Sequence The module contains a 16-word dual port read only buffer, called ADCBUF0...ADCBUFF, to buffer the A/D results. The RAM is 12 bits wide but the data obtained is represented in one of four different 16-bit data formats. The contents of the sixteen A/D Conversion Result Buffer registers, ADCBUF0 through ADCBUFF, cannot be written by user software. Several groups of control bits select the sequence in which the A/D connects inputs to the sample/hold channel, converts a channel, writes the buffer memory and generates interrupts. 16.2 The SMPI bits select the number of acquisition/ conversion sequences that would be performed before an interrupt occurs. This can vary from 1 sample per interrupt to 16 samples per interrupt. Conversion Operation After the A/D module has been configured, the sample acquisition is started by setting the SAMP bit. Various sources, such as a programmable bit, timer time-outs and external events, will terminate acquisition and start a conversion. When the A/D conversion is complete, the result is loaded into ADCBUF0...ADCBUFF, and the DONE bit and the A/D interrupt flag ADIF are set after the number of samples specified by the SMPI bit. The ADC module can be configured for different interrupt rates as described in Section 16.3. The following steps should be followed for doing an A/D conversion: 1. 2. 3. 4. 5. 6. 7. Configure the A/D module: • Configure analog pins, voltage reference and digital I/O •Select A/D input channels •Select A/D conversion clock •Select A/D conversion trigger • Turn on A/D module Configure A/D interrupt (if required): • Clear ADIF bit • Select A/D interrupt priority Start sampling. Wait the required acquisition time. Trigger acquisition end, start conversion: Wait for A/D conversion to complete, by either: • Waiting for the A/D interrupt, or • Waiting for the DONE bit to get set. Read A/D result buffer, clear ADIF if required. The sequence is controlled by the sampling clocks. The BUFM bit will split the 16-word results buffer into two 8-word groups. Writing to the 8-word buffers will be alternated on each interrupt event. Use of the BUFM bit will depend on how much time is available for the moving of the buffers after the interrupt. If the processor can quickly unload a full buffer within the time it takes to acquire and convert one channel, the BUFM bit can be ‘0’ and up to 16 conversions (corresponding to the 16 input channels) may be done per interrupt. The processor will have one acquisition and conversion time to move the sixteen conversions. If the processor cannot unload the buffer within the acquisition and conversion time, the BUFM bit should be ‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111, then eight conversions will be loaded into 1/2 of the buffer, following which an interrupt occurs. The next eight conversions will be loaded into the other 1/2 of the buffer. The processor will have the entire time between interrupts to move the eight conversions. The ALTS bit can be used to alternate the inputs selected during the sampling sequence. The input multiplexer has two sets of sample inputs: MUX A and MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are selected for sampling. If the ALTS bit is ‘1’ and SMPI<3:0> = 0000 on the first sample/convert sequence, the MUX A inputs are selected and on the next acquire/convert sequence, the MUX B inputs are selected. The CSCNA bit (ADCON2<10>) will allow the multiplexer input to be alternately scanned across a selected number of analog inputs for the MUX A group. The inputs are selected by the ADCSSL register. If a particular bit in the ADCSSL register is ‘1’, the corresponding input is selected. The inputs are always scanned from lower to higher numbered inputs, starting after each interrupt. If the number of inputs selected is greater than the number of samples taken per interrupt, the higher numbered inputs are unused. DS70139C-page 110 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 16.4 Programming the Start of Conversion Trigger Example 16-1 shows a sample calculation for the ADCS<5:0> bits, assuming a device operating speed of 30 MIPS. The conversion trigger will terminate acquisition and start the requested conversions. EXAMPLE 16-1: The SSRC<2:0> bits select the source of the conversion trigger. The SSRC bits provide for up to 4 alternate sources of conversion trigger. A/D CONVERSION CLOCK AND SAMPLING RATE CALCULATION Minimum TAD = 667 nsec TCY = 33 .33 nsec (30 MIPS) When SSRC<2:0> = 000, the conversion trigger is under software control. Clearing the SAMP bit will cause the conversion trigger. TAD –1 TCY 667 nsec =2• 33.33 nsec = 39 ADCS<5:0> = 2 When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under A/D clock control. The SAMC bits select the number of A/D clocks between the start of acquisition and the start of conversion. This provides the fastest conversion rates on multiple channels. SAMC must always be at least 1 clock cycle. Therefore, Set ADCS<5:0> = 39 Other trigger sources can come from timer modules or external interrupts. Actual TAD = 16.5 If the clearing of the ADON bit coincides with an autostart, the clearing has a higher priority and a new conversion will not start. After the A/D conversion is aborted, a 2 TAD wait is required before the next sampling may be started by setting the SAMP bit. 16.6 TCY (ADCS<5:0> + 1) 2 33.33 nsec = (39 + 1) 2 Aborting a Conversion Clearing the ADON bit during a conversion will abort the current conversion and stop the sampling sequencing until the next sampling trigger. The ADCBUF will not be updated with the partially completed A/D conversion sample. That is, the ADCBUF will continue to contain the value of the last completed conversion (or the last value written to the ADCBUF register). Selecting the A/D Conversion Clock The A/D conversion requires 14 TAD. The source of the A/D conversion clock is software selected, using a six-bit counter. There are 64 possible options for TAD. EQUATION 16-1: A/D CONVERSION CLOCK TAD = TCY * (0.5*(ADCS<5:0> + 1)) The internal RC oscillator is selected by setting the ADRC bit. For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of 667 nsec (for VDD = 5V). Refer to the Electrical Specifications section for minimum TAD under other operating conditions. © 2005 Microchip Technology Inc. –1 = 667 nsec If SSRC<2:0> = ‘111’ and SAMC<4:0> = ‘00001’ Since, Sampling Time = Acquisition Time + Conversion Time = 1 TAD + 14 TAD = 15 x 667 nsec Therefore, Sampling Rate = 1 (15 x 667 nsec) = ~100 kHz 16.7 A/D Acquisition Requirements The analog input model of the 12-bit A/D converter is shown in Figure 16-2. The total sampling time for the A/ D is a function of the internal amplifier settling time and the holding capacitor charge time. For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the voltage level on the analog input pin. The source impedance (RS), the interconnect impedance (RIC), and the internal sampling switch (RSS) impedance combine to directly affect the time required to charge the capacitor CHOLD. The combined impedance of the analog sources must therefore be small enough to fully charge the holding capacitor within the chosen sample time. To minimize the effects of pin leakage currents on the accuracy of the A/D converter, the maximum recommended source impedance, RS, is 2.5 kΩ. After the analog input channel is selected (changed), this sampling function must be completed prior to starting the conversion. The internal holding capacitor will be in a discharged state prior to each sample operation. Preliminary DS70139C-page 111 dsPIC30F2011/2012/3012/3013 FIGURE 16-2: 12-BIT A/D CONVERTER ANALOG INPUT MODEL VDD Rs VA ANx RIC ≤ 250Ω VT = 0.6V Sampling Switch RSS ≤ 3 kΩ RSS CPIN VT = 0.6V I leakage ± 500 nA CHOLD = DAC capacitance = 18 pF VSS Legend: CPIN = input capacitance VT = threshold voltage I leakage = leakage current at the pin due to various junctions RIC = interconnect resistance RSS = sampling switch resistance CHOLD = sample/hold capacitance (from DAC) Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 2.5 kΩ. 16.8 Module Power-down Modes The module has 2 internal Power modes. When the ADON bit is ‘1’, the module is in Active mode; it is fully powered and functional. When ADON is ‘0’, the module is in Off mode. The digital and analog portions of the circuit are disabled for maximum current savings. In order to return to the Active mode from Off mode, the user must wait for the ADC circuitry to stabilize. 16.9 16.9.1 A/D Operation During CPU Sleep and Idle Modes A/D OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a conversion, the conversion is aborted. The converter will not continue with a partially completed conversion on exit from Sleep mode. Register contents are not affected by the device entering or leaving Sleep mode. The A/D module can operate during Sleep mode if the A/D clock source is set to RC (ADRC = 1). When the RC clock source is selected, the A/D module waits one instruction cycle before starting the conversion. This allows the SLEEP instruction to be executed which eliminates all digital switching noise from the conversion. When the conversion is complete, the CONV bit will be cleared and the result loaded into the ADCBUF register. DS70139C-page 112 If the A/D interrupt is enabled, the device will wake-up from Sleep. If the A/D interrupt is not enabled, the A/ D module will then be turned off, although the ADON bit will remain set. 16.9.2 A/D OPERATION DURING CPU IDLE MODE The ADSIDL bit selects if the module will stop on Idle or continue on Idle. If ADSIDL = 0, the module will continue operation on assertion of Idle mode. If ADSIDL = 1, the module will stop on Idle. 16.10 Effects of a Reset A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off, and any conversion and sampling sequence is aborted. The values that are in the ADCBUF registers are not modified. The A/D Result register will contain unknown data after a Power-on Reset. 16.11 Output Formats The A/D result is 12 bits wide. The data buffer RAM is also 12 bits wide. The 12-bit data can be read in one of four different formats. The FORM<1:0> bits select the format. Each of the output formats translates to a 16-bit result on the data bus. Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 16-3: A/D OUTPUT DATA FORMATS RAM Contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Read to Bus: Signed Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 Signed Integer Integer d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 16.12 Configuring Analog Port Pins 16.13 Connection Considerations The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The analog inputs have diodes to VDD and VSS as ESD protection. This requires that the analog input be between VDD and VSS. If the input voltage exceeds this range by greater than 0.3V (either direction), one of the diodes becomes forward biased and it may damage the device if the input current specification is exceeded. The A/D operation is independent of the state of the CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits. An external RC filter is sometimes added for antialiasing of the input signal. The R component should be selected to ensure that the sampling time requirements are satisfied. Any external components connected (via high impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. When reading the Port register, all pins configured as analog input channels will read as cleared. Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) may cause the input buffer to consume current that exceeds the device specifications. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 113 — — — 0282 0284 0286 0288 028A 028C 028E 0290 0292 0294 0296 ADCBUF1 ADCBUF2 ADCBUF3 ADCBUF4 DS70139C-page 114 ADCBUF5 ADCBUF6 ADCBUF7 ADCBUF8 ADCBUF9 ADCBUFA ADCBUFB ADCBUFC 0298 ADCBUFD 029A — 029E 02A0 ADCBUFF ADCON1 02A8 02AA u = uninitialized bit ADPCFG Preliminary ADCSSL Legend: — — — — — — — — ADSIDL — — — — — — — — — — — — — — — — Bit 13 — — CH0NB — — — — — — — — — — — — — — — — — — Bit 12 — — — — CSCNA — Bit 10 — — Bit 8 — — — — — — FORM<1:0> Bit 9 CH0SB<3:0> SAMC<4:0> Bit 11 CSSL7 Bit 5 CSSL6 CSSL5 PCFG6 PCFG5 — — — — ADC Data Buffer 15 ADC Data Buffer 14 ADC Data Buffer 13 ADC Data Buffer 12 ADC Data Buffer 11 ADC Data Buffer 10 ADC Data Buffer 9 ADC Data Buffer 8 ADC Data Buffer 7 ADC Data Buffer 6 ADC Data Buffer 5 ADC Data Buffer 4 ADC Data Buffer 3 ADC Data Buffer 2 ADC Data Buffer 1 ADC Data Buffer 0 Bit 6 SSRC<2:0> PCFG7 — ADRC BUFS Bit 7 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. — — — 02A6 ADCHS — — — — — — — — — — — — — — — — — Bit 14 VCFG<2:0> ADCON3 — 02A2 02A4 ADCON2 ADON — ADCBUFE 029C — — — — — — — — — — — 0280 ADCBUF0 Bit 15 Addr. A/D CONVERTER REGISTER MAP FOR DSPIC30F2011/3012 SFR Name TABLE 16-1: — Bit 3 CSSL4 PCFG4 CH0NA ASAM Bit 2 BUFM SAMP Bit 1 CSSL3 CSSL2 CSSL1 PCFG3 PCFG2 PCFG1 CH0SA<3:0> ADCS<5:0> SMPI<3:0> — Bit 4 CSSL0 PCFG0 ALTS DONE Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu Reset State dsPIC30F2011/2012/3012/3013 © 2005 Microchip Technology Inc. — — — 0282 0284 0286 0288 028A 028C 028E 0290 0292 0294 0296 ADCBUF1 ADCBUF2 ADCBUF3 ADCBUF4 ADCBUF5 ADCBUF6 ADCBUF7 © 2005 Microchip Technology Inc. ADCBUF8 ADCBUF9 ADCBUFA ADCBUFB ADCBUFC 0298 ADCBUFD 029A — 029E 02A0 ADCBUFF ADCON1 02A8 02AA u = uninitialized bit ADPCFG Preliminary ADCSSL Legend: — — — — — — — — ADSIDL — — — — — — — — — — — — — — — — Bit 13 — — CH0NB — — — — — — — — — — — — — — — — — — Bit 12 — — — — CSCNA — Bit 10 — — Bit 8 — — ADRC BUFS Bit 7 CSSL9 CSSL8 CSSL7 Bit 5 CSSL6 CSSL5 PCFG6 PCFG5 — — — — ADC Data Buffer 15 ADC Data Buffer 14 ADC Data Buffer 13 ADC Data Buffer 12 ADC Data Buffer 11 ADC Data Buffer 10 ADC Data Buffer 9 ADC Data Buffer 8 ADC Data Buffer 7 ADC Data Buffer 6 ADC Data Buffer 5 ADC Data Buffer 4 ADC Data Buffer 3 ADC Data Buffer 2 ADC Data Buffer 1 ADC Data Buffer 0 Bit 6 SSRC<2:0> PCFG9 PCFG8 PCFG7 — FORM<1:0> Bit 9 CH0SB<3:0> SAMC<4:0> Bit 11 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. — — — 02A6 ADCHS — — — — — — — — — — — — — — — — — Bit 14 VCFG<2:0> ADCON3 — 02A2 02A4 ADCON2 ADON — ADCBUFE 029C — — — — — — — — — — — 0280 ADCBUF0 Bit 15 Addr. A/D CONVERTER REGISTER MAP FOR DSPIC30F2012/3013 SFR Name TABLE 16-2: — Bit 3 CSSL4 PCFG4 CH0NA ASAM Bit 2 BUFM SAMP Bit 1 CSSL3 CSSL2 CSSL1 PCFG3 PCFG2 PCFG1 CH0SA<3:0> ADCS<5:0> SMPI<3:0> — Bit 4 CSSL0 PCFG0 ALTS DONE Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu Reset State dsPIC30F2011/2012/3012/3013 DS70139C-page 115 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 116 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 17.0 SYSTEM INTEGRATION 17.1 Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). There are several features intended to maximize system reliability, minimize cost through elimination of external components, provide Power Saving Operating modes and offer code protection: • Oscillator Selection • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Programmable Brown-out Reset (BOR) • Watchdog Timer (WDT) • Power Saving Modes (Sleep and Idle) • Code Protection • Unit ID Locations • In-Circuit Serial Programming (ICSP) Oscillator System Overview The dsPIC30F oscillator system has the following modules and features: • Various external and internal oscillator options as clock sources • An on-chip PLL to boost internal operating frequency • A clock switching mechanism between various clock sources • Programmable clock postscaler for system power savings • A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures • Clock Control register (OSCCON) • Configuration bits for main oscillator selection Configuration bits determine the clock source upon Power-on Reset (POR) and Brown-out Reset (BOR). Thereafter, the clock source can be changed between permissible clock sources. The OSCCON register controls the clock switching and reflects system clock related status bits. Table 17-1 provides a summary of the dsPIC30F Oscillator Operating modes. A simplified diagram of the oscillator system is shown in Figure 17-1. dsPIC30F devices have a Watchdog Timer which is permanently enabled via the configuration bits or can be software controlled. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT) which provides a delay on power-up only, designed to keep the part in Reset while the power supply stabilizes. With these two timers on-chip, most applications need no external Reset circuitry. Sleep mode is designed to offer a very low current Power-down mode. The user can wake-up from Sleep through external Reset, Watchdog Timer Wake-up, or through an interrupt. Several oscillator options are also made available to allow the part to fit a wide variety of applications. In the Idle mode, the clock sources are still active but the CPU is shut-off. The RC oscillator option saves system cost while the LP crystal option saves power. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 117 dsPIC30F2011/2012/3012/3013 TABLE 17-1: OSCILLATOR OPERATING MODES Oscillator Mode Description XTL 200 kHz-4 MHz crystal on OSC1:OSC2. XT 4 MHz-10 MHz crystal on OSC1:OSC2. XT w/ PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled. XT w/ PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled. XT w/ PLL 16x 4 MHz-7.5 MHz crystal on OSC1:OSC2, 16x PLL enabled(1). LP 32 kHz crystal on SOSCO:SOSCI(2). HS 10 MHz-25 MHz crystal. HS/2 w/PLL 4x 10 MHz -20 MHz crystal, divide by 2, 4x PLL enabled. HS/2 w/ PLL 8x 10 MHz-20 MHz crystal, divide by 2, 8x PLL enabled. HS/2 w/ PLL 16x 10 MHz-15 MHz crystal, divide by 2, 16x PLL enabled(1). HS/3 w/PLL 4x 12 MHz-25 MHz crystal, divide by 3, 4x PLL enabled. HS/3 w/ PLL 8x 12 MHz-25 MHz crystal, divide by 3, 8x PLL enabled. HS/3 w/ PLL 16x 12 MHz-22.5 MHz crystal, divide by 3, 16x PLL enabled(1). EC External clock input (0-40 MHz). ECIO External clock input (0-40 MHz), OSC2 pin is I/O. EC w/ PLL 4x External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled. EC w/ PLL 8x External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled. EC w/ PLL 16x External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1). ERC External RC oscillator, OSC2 pin is FOSC/4 output(3). ERCIO External RC oscillator, OSC2 pin is I/O(3). FRC 7.37 MHz internal RC oscillator. FRC w/ PLL 4x 7.37 MHz Internal RC oscillator, 4x PLL enabled. FRC w/ PLL 8x 7.37 MHz Internal RC oscillator, 8x PLL enabled. FRC w/ PLL 16x 7.37 MHz Internal RC oscillator, 16x PLL enabled. LPRC 512 kHz internal RC oscillator. Note 1: 2: 3: dsPIC30F maximum operating frequency of 120 MHz must be met. LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1. Requires external R and C. Frequency operation up to 4 MHz. DS70139C-page 118 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 17-1: OSCILLATOR SYSTEM BLOCK DIAGRAM Oscillator Configuration bits PWRSAV Instruction Wake-up Request FPLL OSC1 OSC2 Primary Oscillator PLL PLL x4, x8, x16 Lock Primary Osc COSC<2:0> Internal FRC Osc Internal Fast RC Oscillator (FRC) POR Done NOSC<2:0> Primary Oscillator OSWEN Stability Detector Oscillator Start-up Timer Clock Secondary Osc Switching and Control Block SOSCO SOSCI 32 kHz LP Oscillator Secondary Oscillator Stability Detector Internal Low Power RC Oscillator (LPRC) Programmable Clock Divider System Clock 2 POST<1:0> LPRC FCKSM<1:0> 2 Fail-Safe Clock Monitor (FSCM) CF Oscillator Trap To Timer1 © 2005 Microchip Technology Inc. Preliminary DS70139C-page 119 dsPIC30F2011/2012/3012/3013 17.2 17.2.1 17.2.2 Oscillator Configurations INITIAL CLOCK SOURCE SELECTION While coming out of Power-on Reset or Brown-out Reset, the device selects its clock source based on: a) b) FOS<2:0> configuration bits that select one of four oscillator groups, and FPR<4:0> configuration bits that select one of 15 oscillator choices within the primary group. The selection is as shown in Table 17-2. TABLE 17-2: OSCILLATOR START-UP TIMER (OST) In order to ensure that a crystal oscillator (or ceramic resonator) has started and stabilized, an Oscillator Start-up Timer is included. It is a simple 10-bit counter that counts 1024 TOSC cycles before releasing the oscillator clock to the rest of the system. The time-out period is designated as TOST. The TOST time is involved every time the oscillator has to restart (i.e., on POR, BOR and wake-up from Sleep). The Oscillator Start-up Timer is applied to the LP oscillator, XT, XTL and HS modes (upon wake-up from Sleep, POR and BOR) for the primary oscillator. CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Oscillator Source FOS<2:0> FPR<4:0> OSC2 Function 1 1 1 0 1 1 0 1 I/O ECIO w/ PLL 4x PLL ECIO w/ PLL 8x PLL 1 1 1 0 1 1 1 0 I/O ECIO w/ PLL 16x PLL 1 1 1 0 1 1 1 1 I/O FRC w/ PLL 4X PLL 1 1 1 0 0 0 0 1 I/O FRC w/ PLL 8x PLL 1 1 1 0 1 0 1 0 I/O FRC w/ PLL 16x PLL 1 1 1 0 0 0 1 1 I/O XT w/ PLL 4x PLL 1 1 1 0 0 1 0 1 OSC2 XT w/ PLL 8x PLL 1 1 1 0 0 1 1 0 OSC2 XT w/ PLL 16x PLL 1 1 1 0 0 1 1 1 OSC2 HS2 w/ PLL 4x PLL 1 1 1 1 0 0 0 1 OSC2 HS2 w/ PLL 8x PLL 1 1 1 1 0 0 1 0 OSC2 HS2 w/ PLL 16x PLL 1 1 1 1 0 0 1 1 OSC2 HS3 w/ PLL 4x PLL 1 1 1 1 0 1 0 1 OSC2 HS3 w/ PLL 8x PLL 1 1 1 1 0 1 1 0 OSC2 HS3 w/ PLL 16x PLL 1 1 1 1 0 1 1 1 OSC2 ECIO External 0 1 1 0 1 1 0 0 I/O XT External 0 1 1 0 0 1 0 0 OSC2 HS External 0 1 1 0 0 0 1 0 OSC2 EC External 0 1 1 0 1 0 1 1 CLKOUT ERC External 0 1 1 0 1 0 0 1 CLKOUT 0 1 1 0 1 0 0 0 I/O ERCIO External XTL External 0 1 1 0 0 0 0 0 OSC2 LP Secondary 0 0 0 X X X X X (Note 1, 2) FRC Internal FRC 0 0 1 X X X X X (Note 1, 2) LPRC Internal LPRC 0 1 0 X X X X X (Note 1, 2) Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<4:0>). 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. DS70139C-page 120 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 17.2.3 LP OSCILLATOR CONTROL Note: When a 16x PLL is used, the FRC frequency must not be tuned to a frequency greater than 7.5 MHz. Enabling the LP oscillator is controlled with two elements: 1. 2. The current oscillator group bits COSC<2:0>. The LPOSCEN bit (OSCON register). The LP oscillator is on (even during Sleep mode) if LPOSCEN = 1. The LP oscillator is the device clock if: • COSC<2:0> = 000 (LP selected as main oscillator) and • LPOSCEN = 1 TABLE 17-4: TUN<3:0> Bits 0111 0110 0101 0100 0011 0010 0001 0000 Keeping the LP oscillator on at all times allows for a fast switch to the 32 kHz system clock for lower power operation. Returning to the faster main oscillator will still require a start-up time 17.2.4 PHASE LOCKED LOOP (PLL) The PLL multiplies the clock which is generated by the primary oscillator or Fast RC oscillator. The PLL is selectable to have either gains of x4, x8, and x16. Input and output frequency ranges are summarized in Table 17-3. TABLE 17-3: PLL FREQUENCY RANGE FIN PLL Multiplier FOUT 4 MHz-10 MHz x4 16 MHz-40 MHz 4 MHz-10 MHz x8 32 MHz-80 MHz 4 MHz-7.5 MHz x16 64 MHz-120 MHz The PLL features a lock output which is asserted when the PLL enters a phase locked state. Should the loop fall out of lock (e.g., due to noise), the lock signal will be rescinded. The state of this signal is reflected in the read only LOCK bit in the OSCCON register. 17.2.5 1111 1110 1101 1100 1011 1010 1001 1000 FAST RC OSCILLATOR (FRC) The FRC oscillator is a fast (7.37 MHz nominal) internal RC oscillator. This oscillator is intended to provide reasonable device operating speeds without the use of an external crystal, ceramic resonator, or RC network. The FRC oscillator can be used with the PLL to obtain higher clock frequencies. The dsPIC30F operates from the FRC oscillator whenever the current oscillator selection control bits in the OSCCON register (OSCCON<14:12>) are set to ‘001’. The four bit field specified by TUN<3:0> (OSCTUN <3:0>) allows the user to tune the internal fast RC oscillator (nominal 7.37 MHz). The user can tune the FRC oscillator within a range of +10.5% (840 kHz) and -12% (960 kHz) in steps of 1.50% around the factory-calibrated setting, see Table 17-4. If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are set to ‘00001’, ‘01010’ or ‘00011’, then a PLL multiplier of 4, 8 or 16 (respectively) is applied. © 2005 Microchip Technology Inc. 17.2.6 FRC TUNING FRC Frequency + 10.5% + 9.0% + 7.5% + 6.0% + 4.5% + 3.0% + 1.5% Center Frequency (oscillator is running at calibrated frequency) - 1.5% - 3.0% - 4.5% - 6.0% - 7.5% - 9.0% - 10.5% - 12.0% LOW POWER RC OSCILLATOR (LPRC) The LPRC oscillator is a component of the Watchdog Timer (WDT) and oscillates at a nominal frequency of 512 kHz. The LPRC oscillator is the clock source for the Power-up Timer (PWRT) circuit, WDT, and clock monitor circuits. It may also be used to provide a low frequency clock source option for applications where power consumption is critical and timing accuracy is not required The LPRC oscillator is always enabled at a Power-on Reset because it is the clock source for the PWRT. After the PWRT expires, the LPRC oscillator will remain on if one of the following is true: • The Fail-Safe Clock Monitor is enabled • The WDT is enabled • The LPRC oscillator is selected as the system clock via the COSC<2:0> control bits in the OSCCON register If one of the above conditions is not true, the LPRC will shut-off after the PWRT expires. Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<4:0>). Preliminary 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. DS70139C-page 121 dsPIC30F2011/2012/3012/3013 17.2.7 FAIL-SAFE CLOCK MONITOR The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by appropriately programming the FCKSM configuration bits (clock switch and monitor selection bits) in the FOSC Device Configuration register. If the FSCM function is enabled, the LPRC internal oscillator will run at all times (except during Sleep mode) and will not be subject to control by the SWDTEN bit. In the event of an oscillator failure, the FSCM will generate a clock failure trap event and will switch the system clock over to the FRC oscillator. The user will then have the option to either attempt to restart the oscillator or execute a controlled shutdown. The user may decide to treat the trap as a warm Reset by simply loading the Reset address into the oscillator fail trap vector. In this event, the CF (Clock Fail) status bit (OSCCON<3>) is also set whenever a clock failure is recognized. In the event of a clock failure, the WDT is unaffected and continues to run on the LPRC clock. If the oscillator has a very slow start-up time coming out of POR, BOR or Sleep, it is possible that the PWRT timer will expire before the oscillator has started. In such cases, the FSCM will be activated and the FSCM will initiate a clock failure trap, and the COSC<2:0> bits are loaded with FRC oscillator selection. This will effectively shut-off the original oscillator that was trying to start. The OSCCON register holds the control and status bits related to clock switching. • COSC<2:0>: Read only status bits always reflect the current oscillator group in effect. • NOSC<2:0>: Control bits which are written to indicate the new oscillator group of choice. - On POR and BOR, COSC<2:0> and NOSC<2:0> are both loaded with the configuration bit values FOS<2:0>. • LOCK: The LOCK status bit indicates a PLL lock. • CF: Read only status bit indicating if a clock fail detect has occurred. • OSWEN: Control bit changes from a ‘0’ to a ‘1’ when a clock transition sequence is initiated. Clearing the OSWEN control bit will abort a clock transition in progress (used for hang-up situations). If configuration bits FCKSM<1:0> = 1x, then the clock switching and Fail-Safe Clock monitoring functions are disabled. This is the default configuration bit setting. If clock switching is disabled, then the FOS<2:0> and FPR<4:0> bits directly control the oscillator selection and the COSC<2:0> bits do not control the clock selection. However, these bits will reflect the clock source selection. Note: The user may detect this situation and restart the oscillator in the clock fail trap ISR. Upon a clock failure detection, the FSCM module will initiate a clock switch to the FRC oscillator as follows: 1. 2. 3. The COSC bits (OSCCON<14:12>) are loaded with the FRC oscillator selection value. CF bit is set (OSCCON<3>). OSWEN control bit (OSCCON<0>) is cleared. For the purpose of clock switching, the clock sources are sectioned into four groups: 1. 2. 3. 4. Primary (with or without PLL) Secondary Internal FRC Internal LPRC 17.2.8 The application should not attempt to switch to a clock of frequency lower than 100 KHz when the fail-safe clock monitor is enabled. If such clock switching is performed, the device may generate an oscillator fail trap and switch to the Fast RC oscillator. PROTECTION AGAINST ACCIDENTAL WRITES TO OSCCON A write to the OSCCON register is intentionally made difficult because it controls clock switching and clock scaling. To write to the OSCCON low byte, the following code sequence must be executed without any other instructions in between: Byte Write “0x46” to OSCCON low Byte Write “0x57” to OSCCON low The user can switch between these functional groups but cannot switch between options within a group. If the primary group is selected, then the choice within the group is always determined by the FPR<4:0> configuration bits. Byte write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. To write to the OSCCON high byte, the following instructions must be executed without any other instructions in between: Byte Write “0x78” to OSCCON high Byte Write “0x9A” to OSCCON high Byte write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. DS70139C-page 122 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 17.3 Reset The dsPIC30F2011/2012/3012/3013 between various kinds of Reset: a) b) c) d) e) f) g) h) differentiates Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep Watchdog Timer (WDT) Reset (during normal operation) Programmable Brown-out Reset (BOR) RESET Instruction Reset caused by trap lockup (TRAPR) Reset caused by illegal opcode or by using an uninitialized W register as an address pointer (IOPUWR) FIGURE 17-2: Different registers are affected in different ways by various Reset conditions. Most registers are not affected by a WDT wake-up since this is viewed as the resumption of normal operation. Status bits from the RCON register are set or cleared differently in different Reset situations, as indicated in Table 17-5. These bits are used in software to determine the nature of the Reset. A block diagram of the On-Chip Reset Circuit is shown in Figure 17-2. A MCLR noise filter is provided in the MCLR Reset path. The filter detects and ignores small pulses. Internally generated Resets do not drive MCLR pin low. RESET SYSTEM BLOCK DIAGRAM RESET Instruction Digital Glitch Filter MCLR Sleep or Idle WDT Module POR VDD Rise Detect S VDD Brown-out Reset BOR BOREN R Q SYSRST Trap Conflict Illegal Opcode/ Uninitialized W Register 17.3.1 POR: POWER-ON RESET A power-on event will generate an internal POR pulse when a VDD rise is detected. The Reset pulse will occur at the POR circuit threshold voltage (VPOR) which is nominally 1.85V. The device supply voltage characteristics must meet specified starting voltage and rise rate requirements. The POR pulse will reset a POR timer and place the device in the Reset state. The POR also selects the device clock source identified by the oscillator configuration fuses. The POR circuit inserts a small delay, TPOR, which is nominally 10 μs and ensures that the device bias circuits are stable. Furthermore, a user selected powerup time-out (TPWRT) is applied. The TPWRT parameter is based on device configuration bits and can be 0 ms (no delay), 4 ms, 16 ms, or 64 ms. The total delay is at device power-up, TPOR + TPWRT. When these delays have expired, SYSRST will be negated on the next leading edge of the Q1 clock and the PC will jump to the Reset vector. The timing for the SYSRST signal is shown in Figure 17-3 through Figure 17-5. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 123 dsPIC30F2011/2012/3012/3013 FIGURE 17-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset FIGURE 17-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset FIGURE 17-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset DS70139C-page 124 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 17.3.1.1 POR with Long Crystal Start-up Time (with FSCM Enabled) The oscillator start-up circuitry is not linked to the POR circuitry. Some crystal circuits (especially low frequency crystals) will have a relatively long start-up time. Therefore, one or more of the following conditions is possible after the POR timer and the PWRT have expired: • The oscillator circuit has not begun to oscillate. • The Oscillator Start-up Timer has not expired (if a crystal oscillator is used). • The PLL has not achieved a LOCK (if PLL is used). If the FSCM is enabled and one of the above conditions is true, then a clock failure trap will occur. The device will automatically switch to the FRC oscillator and the user can switch to the desired crystal oscillator in the trap ISR. 17.3.1.2 Operating without FSCM and PWRT A BOR will generate a Reset pulse which will reset the device. The BOR will select the clock source based on the device configuration bit values (FOS<1:0> and FPR<3:0>). Furthermore, if an Oscillator mode is selected, the BOR will activate the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, then the clock will be held until the LOCK bit (OSCCON<5>) is ‘1’. Concurrently, the POR time-out (TPOR) and the PWRT time-out (TPWRT) will be applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, then a nominal delay of TFSCM = 100 μs is applied. The total delay in this case is (TPOR + TFSCM). The BOR status bit (RCON<1>) will be set to indicate that a BOR has occurred. The BOR circuit, if enabled, will continue to operate while in Sleep or Idle modes and will reset the device should VDD fall below the BOR threshold voltage. FIGURE 17-6: If the FSCM is disabled and the Power-up Timer (PWRT) is also disabled, then the device will exit rapidly from Reset on power-up. If the clock source is FRC, LPRC, EXTRC or EC, it will be active immediately. If the FSCM is disabled and the system clock has not started, the device will be in a frozen state at the Reset vector until the system clock starts. From the user’s perspective, the device will appear to be in Reset until a system clock is available. 17.3.2 VDD D C Note 1: The BOR (Brown-out Reset) module is based on an internal voltage reference circuit. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (i.e., missing portions of the AC cycle waveform due to bad power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned on). • • • • 2: 3: Note: 2.0V 2.7V 4.2V 4.5V Note: R R1 BOR: PROGRAMMABLE BROWN-OUT RESET The BOR module allows selection of one of the following voltage trip points: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) MCLR dsPIC30F External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. R should be suitably chosen so as to make sure that the voltage drop across R does not violate the device’s electrical specifications. R1 should be suitably chosen so as to limit any current flowing into MCLR from external capacitor C, in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD), or Electrical Overstress (EOS). Dedicated supervisory devices, such as the MCP1XX and MCP8XX, may also be used as an external Power-on Reset circuit. The BOR voltage trip points indicated here are nominal values provided for design guidance only. Refer to the Electrical Specifications in the specific device data sheet for BOR voltage limit specifications. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 125 dsPIC30F2011/2012/3012/3013 Table 17-5 shows the Reset conditions for the RCON register. Since the control bits within the RCON register are R/W, the information in the table implies that all the bits are negated prior to the action specified in the condition column. TABLE 17-5: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 1 Condition Program Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR Power-on Reset Brown-out Reset 0x000000 0x000000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 1 MCLR Reset during normal operation Software Reset during normal operation 0x000000 0 0 1 0 0 0 0 0 0 0x000000 0 0 0 1 0 0 0 0 0 MCLR Reset during Sleep 0x000000 0 0 1 0 0 0 1 0 0 MCLR Reset during Idle WDT Time-out Reset WDT Wake-up 0x000000 0x000000 PC + 2 0 0 0 0 0 0 1 0 0 0 0 0 0 1 1 1 0 0 0 0 1 0 0 0 0 0 0 Interrupt Wake-up from PC + 2(1) 0 0 0 0 0 0 1 0 0 Sleep Clock Failure Trap 0x000004 0 0 0 0 0 0 0 0 0 Trap Reset 0x000000 1 0 0 0 0 0 0 0 0 Illegal Operation Trap 0x000000 0 1 0 0 0 0 0 0 0 Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’ Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. Table 17-6 shows a second example of the bit conditions for the RCON register. In this case, it is not assumed the user has set/cleared specific bits prior to action specified in the condition column. TABLE 17-6: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 2 Condition Program Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR Power-on Reset Brown-out Reset 0x000000 0x000000 0 u 0 u 0 u 0 u 0 u 0 u 0 u 1 0 1 1 MCLR Reset during normal operation Software Reset during normal operation 0x000000 u u 1 0 0 0 0 u u 0x000000 u u 0 1 0 0 0 u u MCLR Reset during Sleep 0x000000 u u 1 u 0 0 1 u u MCLR Reset during Idle WDT Time-out Reset WDT Wake-up 0x000000 0x000000 PC + 2 u u u u u u 1 0 u u 0 u 0 1 1 1 0 u 0 0 1 u u u u u u Interrupt Wake-up from Sleep Clock Failure Trap Trap Reset PC + 2(1) u u u u u u 1 u u 0x000004 u u u u u u u u u 0x000000 1 u u u u u u u u Illegal Operation Reset Legend: Note 1: 0x000000 u 1 u u u u u u u u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’ When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. DS70139C-page 126 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 17.4 17.4.1 Watchdog Timer (WDT) 17.6 WATCHDOG TIMER OPERATION The primary function of the Watchdog Timer (WDT) is to reset the processor in the event of a software malfunction. The WDT is a free-running timer which runs off an on-chip RC oscillator, requiring no external component. Therefore, the WDT timer will continue to operate even if the main processor clock (e.g., the crystal oscillator) fails. 17.4.2 There are two power saving states that can be entered through the execution of a special instruction, PWRSAV; these are Sleep and Idle. The format of the PWRSAV instruction is as follows: PWRSAV <parameter>, where ‘parameter’ defines Idle or Sleep mode. 17.6.1 ENABLING AND DISABLING THE WDT Setting FWDTEN = 1 enables the Watchdog Timer. The enabling is done when programming the device. By default, after chip erase, FWDTEN bit = 1. Any device programmer capable of programming dsPIC30F devices allows programming of this and other configuration bits. If enabled, the WDT will increment until it overflows or “times out”. A WDT time-out will force a device Reset (except during Sleep). To prevent a WDT time-out, the user must clear the Watchdog Timer using a CLRWDT instruction. If a WDT times out during Sleep, the device will wakeup. The WDTO bit in the RCON register will be cleared to indicate a wake-up resulting from a WDT time-out. Setting FWDTEN = 0 allows user software to enable/ disable the Watchdog Timer via the SWDTEN (RCON<5>) control bit. The Fail-Safe Clock Monitor is not functional during Sleep since there is no clock to monitor. However, LPRC clock remains active if WDT is operational during Sleep. The brown-out protection circuit and the Low Voltage Detect circuit, if enabled, will remain functional during Sleep. The processor wakes up from Sleep if at least one of the following conditions has occurred: • any interrupt that is individually enabled and meets the required priority level • any Reset (POR, BOR and MCLR) • WDT time-out On waking up from Sleep mode, the processor will restart the same clock that was active prior to entry into Sleep mode. When clock switching is enabled, bits COSC<1:0> will determine the oscillator source that will be used on wake-up. If clock switch is disabled, then there is only one system clock. Note: Low Voltage Detect The Low Voltage Detect (LVD) module is used to detect when the VDD of the device drops below a threshold value, VLVD, which is determined by the LVDL<3:0> bits (RCON<11:8>) and is thus user programmable. The internal voltage reference circuitry requires a nominal amount of time to stabilize, and the BGST bit (RCON<13>) indicates when the voltage reference has stabilized. In some devices, the LVD threshold voltage may be applied externally on the LVDIN pin. The LVD module is enabled by setting the LVDEN bit (RCON<12>). © 2005 Microchip Technology Inc. SLEEP MODE In Sleep mode, the clock to the CPU and peripherals is shutdown. If an on-chip oscillator is being used, it is shutdown. The Watchdog Timer can be “Enabled” or “Disabled” only through a configuration bit (FWDTEN) in the Configuration register, FWDT. 17.5 Power Saving Modes If a POR or BOR occurred, the selection of the oscillator is based on the FOS<2:0> and FPR<4:0> configuration bits. If the clock source is an oscillator, the clock to the device will be held off until OST times out (indicating a stable oscillator). If PLL is used, the system clock is held off until LOCK = 1 (indicating that the PLL is stable). In either case, TPOR, TLOCK and TPWRT delays are applied. If EC, FRC, LPRC or EXTRC oscillators are used, then a delay of TPOR (~ 10 μs) is applied. This is the smallest delay possible on wake-up from Sleep. Moreover, if LP oscillator was active during Sleep and LP is the oscillator used on wake-up, then the start-up delay will be equal to TPOR. PWRT delay and OST timer delay are not applied. In order to have -the smallest possible start-up delay when waking up from Sleep, one of these faster wake-up options should be selected before entering Sleep. Preliminary DS70139C-page 127 dsPIC30F2011/2012/3012/3013 Any interrupt that is individually enabled (using the corresponding IE bit) and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Sleep status bit in the RCON register is set upon wake-up. Note: In spite of various delays applied (TPOR, TLOCK and TPWRT), the crystal oscillator (and PLL) may not be active at the end of the time-out (e.g., for low frequency crystals). In such cases, if FSCM is enabled, then the device will detect this as a clock failure and process the clock failure trap, the FRC oscillator will be enabled and the user will have to re-enable the crystal oscillator. If FSCM is not enabled, then the device will simply suspend execution of code until the clock is stable and will remain in Sleep until the oscillator clock has started. All Resets will wake-up the processor from Sleep mode. Any Reset, other than POR, will set the Sleep status bit. In a POR, the Sleep bit is cleared. If the Watchdog Timer is enabled, then the processor will wake-up from Sleep mode upon WDT time-out. The Sleep and WDTO status bits are both set. 17.6.2 IDLE MODE Any interrupt that is individually enabled (using IE bit) and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Idle status bit in the RCON register is set upon wake-up. Any Reset other than POR will set the Idle status bit. On a POR, the Idle bit is cleared. If Watchdog Timer is enabled, then the processor will wake-up from Idle mode upon WDT time-out. The Idle and WDTO status bits are both set. Unlike wake-up from Sleep, there are no time delays involved in wake-up from Idle. 17.7 The configuration bits in each device configuration register specify some of the Device modes and are programmed by a device programmer, or by using the In-Circuit Serial Programming™ (ICSP™) feature of the device. Each device configuration register is a 24-bit register, but only the lower 16 bits of each register are used to hold configuration data. There are four device configuration registers available to the user: 1. FOSC (0xF80000): Oscillator Configuration Register FWDT (0xF80002): Watchdog Timer Configuration Register FBORPOR (0xF80004): BOR and POR Configuration Register FGS (0xF8000A): General Code Segment Configuration Register 2. In Idle mode, the clock to the CPU is shutdown while peripherals keep running. Unlike Sleep mode, the clock source remains active. Device Configuration Registers 3. Several peripherals have a control bit in each module that allows them to operate during Idle. 4. LPRC Fail-Safe Clock remains active if clock failure detect is enabled. The placement of the configuration bits is automatically handled when you select the device in your device programmer. The desired state of the configuration bits may be specified in the source code (dependent on the language tool used), or through the programming interface. After the device has been programmed, the application software may read the configuration bit values through the table read instructions. For additional information, please refer to the Programming Specifications of the device. The processor wakes up from Idle if at least one of the following conditions has occurred: • any interrupt that is individually enabled (IE bit is ‘1’) and meets the required priority level • any Reset (POR, BOR, MCLR) • WDT time-out Upon wake-up from Idle mode, the clock is re-applied to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV instruction. DS70139C-page 128 Note: Preliminary If the code protection configuration fuse bits (FGS<GCP> and FGS<GWRP>) have been programmed, an erase of the entire code-protected device is only possible at voltages VDD ≥ 4.5V. © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 17.8 Peripheral Module Disable (PMD) Registers The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a peripheral is disabled via the appropriate PMD control bit, the peripheral is in a minimum power consumption state. The control and status registers associated with the peripheral will also be disabled so writes to those registers will have no effect and read values will be invalid. A peripheral module will only be enabled if both the associated bit in the the PMD register is cleared and the peripheral is supported by the specific dsPIC variant. If the peripheral is present in the device, it is enabled in the PMD register by default. Note: If a PMD bit is set, the corresponding module is disabled after a delay of 1 instruction cycle. Similarly, if a PMD bit is cleared, the corresponding module is enabled after a delay of 1 instruction cycle (assuming the module control registers are already configured to enable module operation). 17.9 When MPLAB ICD2 is selected as a Debugger, the InCircuit Debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. When the device has this feature enabled, some of the resources are not available for general use. These resources include the first 80 bytes of Data RAM and two I/O pins. One of four pairs of Debug I/O pins may be selected by the user using configuration options in MPLAB IDE. These pin pairs are named EMUD/EMUC, EMUD1/ EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3. In each case, the selected EMUD pin is the Emulation/ Debug Data line, and the EMUC pin is the Emulation/ Debug Clock line. These pins will interface to the MPLAB ICD 2 module available from Microchip. The selected pair of Debug I/O pins is used by MPLAB ICD 2 to send commands and receive responses, as well as to send and receive data. To use the In-Circuit Debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, PGC, PGD, and the selected EMUDx/EMUCx pin pair. This gives rise to two possibilities: 1. Note: In the dsPIC30F2011, dsPIC30F3012 and dsPIC30F2012 devices, the U2MD bit is readable and writable and will be read as ‘1’ when set. © 2005 Microchip Technology Inc. In-Circuit Debugger 2. Preliminary If EMUD/EMUC is selected as the Debug I/O pin pair, then only a 5-pin interface is required, as the EMUD and EMUC pin functions are multiplexed with the PGD and PGC pin functions in all dsPIC30F devices. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/ EMUC3 is selected as the Debug I/O pin pair, then a 7-pin interface is required, as the EMUDx/EMUCx pin functions (x = 1, 2 or 3) are not multiplexed with the PGD and PGC pin functions. DS70139C-page 129 Reset state depends on type of Reset. Reset state depends on configuration bits. Only available on dsPIC30F3013. Note DS70139C-page 130 — T3MD — T2MD — T1MD Bit 9 — — — Always reads as ‘1’. — Bit 14 — MCLREN FWDTEN — — — FCKSM<1:0> Bit 15 — — — — Bit 13 — — — — Bit 12 — — Bit 8 — — — — Bit 11 SWR Bit 6 Bit 9 — — — Reserved(1) — FOS<2:0> — Bit 8 — — — — — — — Bit 7 — — — — — — — — BOR Bit 1 — — BORV<1:0> FWPSA<1:0> — Bit 4 OC2MD — TUN1 LPOSCEN Bit 5 TUN2 — IDLE Bit 2 Bit 6 SPI1MD TUN3 CF SLEEP Bit 3 BOREN WDTO Bit 4 Reserved(1) — U1MD U2MD(3) — — LOCK SWDTEN Bit 5 — Reserved(1) — I2CMD — POST<1:0> EXTR Bit 7 Bit 10 IC2MD IC1MD — — NOSC<2:0> LVDL<3:0> Bit 10 Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. 1: F8000A FGS — — F80002 F80004 FWDT FBORPOR — Bits 23-16 Addr. F80000 File Name Note — — — — Bit 11 DEVICE CONFIGURATION REGISTER MAP — FOSC TABLE 17-8: 1: 2: 3: 0772 PMD2 — — — 0770 — PMD1 — LVDEN 0744 BGST COSC<2:0> IOPUWR OSCTUN — TRAPR Bit 12 0740 Bit 13 0742 Bit 14 OSCCON Bit 15 SYSTEM INTEGRATION REGISTER MAP RCON Addr. SFR Name TABLE 17-7: — — Bit 3 Bit 1 — Bit 0 GCP GWRP FPWRT<1:0> FWPSB<3:0> FPR<4:0> Bit 2 0000 0000 0000 0000 0000 0000 0000 0000 (Note 2) (Note 2) (Note 1) Reset State Reserved(1) OC1MD ADCMD TUN0 OSWEN POR Bit 0 dsPIC30F2011/2012/3012/3013 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 18.0 INSTRUCTION SET SUMMARY Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the dsPIC30F Family Reference Manual (DS70046). For more information on the device instruction set and programming, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). The dsPIC30F instruction set adds many enhancements to the previous PICmicro® instruction sets, while maintaining an easy migration from PICmicro instruction sets. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single word instruction is a 24-bit word divided into an 8-bit opcode which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: • • • • • Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations • The W register (with or without an address modifier) or file register (specified by the value of ‘Ws’ or ‘f’) • The bit in the W register or file register (specified by a literal value or indirectly by the contents of register ‘Wb’) The literal instructions that involve data movement may use some of the following operands: • A literal value to be loaded into a W register or file register (specified by the value of ‘k’) • The W register or file register where the literal value is to be loaded (specified by ‘Wb’ or ‘f’) However, literal instructions that involve arithmetic or logical operations use some of the following operands: • The first source operand which is a register ‘Wb’ without any address modifier • The second source operand which is a literal value • The destination of the result (only if not the same as the first source operand) which is typically a register ‘Wd’ with or without an address modifier The MAC class of DSP instructions may use some of the following operands: Table 18-1 shows the general symbols used in describing the instructions. The dsPIC30F instruction set summary in Table 18-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: • The first source operand which is typically a register ‘Wb’ without any address modifier • The second source operand which is typically a register ‘Ws’ with or without an address modifier • The destination of the result which is typically a register ‘Wd’ with or without an address modifier However, word or byte-oriented file register instructions have two operands: • The file register specified by the value ‘f’ • The destination, which could either be the file register ‘f’ or the W0 register, which is denoted as ‘WREG’ © 2005 Microchip Technology Inc. Most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: • The accumulator (A or B) to be used (required operand) • The W registers to be used as the two operands • The X and Y address space pre-fetch operations • The X and Y address space pre-fetch destinations • The accumulator write back destination The other DSP instructions do not involve any multiplication, and may include: • The accumulator to be used (required) • The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier • The amount of shift specified by a W register ‘Wn’ or a literal value The control instructions may use some of the following operands: • A program memory address • The mode of the table read and table write instructions Preliminary DS70139C-page 131 dsPIC30F2011/2012/3012/3013 All instructions are a single word, except for certain double-word instructions, which were made doubleword instructions so that all the required information is available in these 48 bits. In the second word, the 8 MSbs are ‘0’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. Most single word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table reads and writes, and RETURN/RETFIE instructions, TABLE 18-1: which are single word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single word or twoword instruction. Moreover, double-word moves require two cycles. The double-word instructions execute in two instruction cycles. Note: For more details on the instruction set, refer to the Programmer’s Reference Manual. SYMBOLS USED IN OPCODE DESCRIPTIONS Field #text Description Means literal defined by “text” (text) Means “content of text” [text] Means “the location addressed by text” { } Optional field or operation <n:m> Register bit field .b Byte mode selection .d Double-Word mode selection .S Shadow register select .w Word mode selection (default) Acc One of two accumulators {A, B} AWB Accumulator write back destination address register ∈ {W13, [W13]+=2} bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15} C, DC, N, OV, Z MCU status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Expr Absolute address, label or expression (resolved by the linker) f File register address ∈ {0x0000...0x1FFF} lit1 1-bit unsigned literal ∈ {0,1} lit4 4-bit unsigned literal ∈ {0...15} lit5 5-bit unsigned literal ∈ {0...31} lit8 8-bit unsigned literal ∈ {0...255} lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode lit14 14-bit unsigned literal ∈ {0...16384} lit16 16-bit unsigned literal ∈ {0...65535} lit23 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0 None Field does not require an entry, may be blank OA, OB, SA, SB DSP status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate PC Program Counter Slit10 10-bit signed literal ∈ {-512...511} Slit16 16-bit signed literal ∈ {-32768...32767} Slit6 6-bit signed literal ∈ {-16...16} DS70139C-page 132 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 18-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Field Description Wb Base W register ∈ {W0..W15} Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Wdo Destination W register ∈ { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Wm,Wn Dividend, Divisor working register pair (direct addressing) Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈ {W4*W4,W5*W5,W6*W6,W7*W7} Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈ {W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7} Wn One of 16 working registers ∈ {W0..W15} Wnd One of 16 destination working registers ∈ {W0..W15} Wns One of 16 source working registers ∈ {W0..W15} WREG W0 (working register used in file register instructions) Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Wso Source W register ∈ { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } Wx X data space pre-fetch address register for DSP instructions ∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2, [W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2, [W9+W12],none} Wxd X data space pre-fetch destination register for DSP instructions ∈ {W4..W7} Wy Y data space pre-fetch address register for DSP instructions ∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2, [W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2, [W11+W12], none} Wyd Y data space pre-fetch destination register for DSP instructions ∈ {W4..W7} © 2005 Microchip Technology Inc. Preliminary DS70139C-page 133 dsPIC30F2011/2012/3012/3013 TABLE 18-2: Base Instr # 1 2 3 4 5 6 INSTRUCTION SET OVERVIEW Assembly Mnemonic ADD ADDC AND ASR BCLR BRA 7 BSET 8 BSW Assembly Syntax Description # of # of Words Cycles Status Flags Affected ADD Acc Add Accumulators 1 1 ADD f f = f + WREG 1 1 OA,OB,SA,SB C,DC,N,OV,Z ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z AND f f = f .AND. WREG 1 1 N,Z AND f,WREG WREG = f .AND. WREG 1 1 N,Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z BCLR f,#bit4 Bit Clear f 1 1 None BCLR Ws,#bit4 Bit Clear Ws 1 1 None BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if greater than or equal 1 1 (2) None BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None BRA GT,Expr Branch if greater than 1 1 (2) None BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None BRA LE,Expr Branch if less than or equal 1 1 (2) None BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None BRA LT,Expr Branch if less than 1 1 (2) None BRA LTU,Expr Branch if unsigned less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None DS70139C-page 134 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 18-2: Base Instr # 9 10 11 12 13 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic BTG BTSC BTSS BTST BTSTS 14 CALL 15 CLR Assembly Syntax Description # of # of Words Cycles Status Flags Affected BTG f,#bit4 Bit Toggle f 1 1 BTG Ws,#bit4 Bit Toggle Ws 1 1 None None BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 (2 or 3) None BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 (2 or 3) None BTSS f,#bit4 Bit Test f, Skip if Set 1 1 (2 or 3) None BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 (2 or 3) None BTST f,#bit4 Bit Test f 1 1 Z BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z BTSTS f,#bit4 Bit Test then Set f 1 1 Z BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z CALL lit23 Call subroutine 2 2 None CALL Wn Call indirect subroutine 1 2 None CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB 16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep 17 COM COM f f=f 1 1 N,Z COM f,WREG WREG = f 1 1 N,Z COM Ws,Wd Wd = Ws 1 1 N,Z CP f Compare f with WREG 1 1 C,DC,N,OV,Z CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z CP1 f Compare f with 0xFFFF 1 1 C,DC,N,OV,Z CP1 Ws Compare Ws with 0xFFFF 1 1 C,DC,N,OV,Z CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,Ws Compare Wb with Ws, with Borrow (Wb - Ws - C) 1 1 C,DC,N,OV,Z 18 19 20 21 CP CP0 CP1 CPB 22 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 (2 or 3) None 23 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 (2 or 3) None 24 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 (2 or 3) None 25 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠ 1 1 (2 or 3) None 26 DAW DAW Wn Wn = decimal adjust Wn 1 1 C 27 DEC DEC f f = f -1 1 1 C,DC,N,OV,Z DEC f,WREG WREG = f -1 1 1 C,DC,N,OV,Z DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z DEC2 f f = f -2 1 1 C,DC,N,OV,Z DEC2 f,WREG WREG = f -2 1 1 C,DC,N,OV,Z DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z 28 DEC2 © 2005 Microchip Technology Inc. Preliminary DS70139C-page 135 dsPIC30F2011/2012/3012/3013 TABLE 18-2: Base Instr # INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic Assembly Syntax Description # of # of Words Cycles Status Flags Affected 29 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None 30 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV 31 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV 32 DO DO #lit14,Expr Do code to PC+Expr, lit14+1 times 2 2 None DO Wn,Expr Do code to PC+Expr, (Wn)+1 times 2 2 None 33 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB, SA,SB,SAB 34 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB, SA,SB,SAB None 35 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 36 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C 37 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C 38 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C 39 GOTO GOTO Expr Go to address 2 2 None GOTO Wn Go to indirect 1 2 None 40 INC INC f f=f+1 1 1 C,DC,N,OV,Z 41 42 43 INC2 IOR LAC INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z INC2 f f=f+2 1 1 C,DC,N,OV,Z INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z IOR f f = f .IOR. WREG 1 1 N,Z IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 44 LNK LNK #lit14 Link frame pointer 1 1 None 45 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, AWB Multiply and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB None 46 47 48 MAC MOV MOVSAC MOV f,Wn Move f to Wn 1 1 MOV f Move f to f 1 1 N,Z MOV f,WREG Move f to WREG 1 1 N,Z MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f Move WREG to f 1 1 N,Z MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None MOV.D Ws,Wnd MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB DS70139C-page 136 Move Double from Ws to W(nd+1):W(nd) 1 2 None Pre-fetch and store accumulator 1 1 None Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 18-2: Base Instr # 49 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic MPY Assembly Syntax Description # of # of Words Cycles Status Flags Affected MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB Wm*Wn,Acc,Wx,Wxd,Wy,Wyd 50 MPY.N MPY.N -(Multiply Wm by Wn) to Accumulator 1 1 None 51 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, AWB Multiply and Subtract from Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 52 MUL 53 54 55 NEG NOP POP MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * unsigned(Ws) 1 1 None MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) * unsigned(lit5) 1 1 None MUL f W3:W2 = f * WREG 1 1 None NEG Acc Negate Accumulator 1 1 OA,OB,OAB, SA,SB,SAB NEG f f=f+1 1 1 C,DC,N,OV,Z NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z NOP No Operation 1 1 None NOPR No Operation 1 1 None None POP f Pop f from top-of-stack (TOS) 1 1 POP Wdo Pop from top-of-stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from top-of-stack (TOS) to W(nd):W(nd+1) 1 2 None Pop Shadow Registers 1 1 All Push f to top-of-stack (TOS) 1 1 None POP.S 56 PUSH PUSH f PUSH Wso Push Wso to top-of-stack (TOS) 1 1 None PUSH.D Wns Push W(ns):W(ns+1) to top-of-stack (TOS) 1 2 None Push Shadow Registers 1 1 None Go into Sleep or Idle mode 1 1 WDTO,Sleep None PUSH.S 57 PWRSAV PWRSAV #lit1 58 RCALL RCALL Expr Relative Call 1 2 RCALL Wn Computed Call 1 2 None Repeat Next Instruction lit14+1 times 1 1 None 59 REPEAT REPEAT #lit14 REPEAT Wn 60 RESET RESET Repeat Next Instruction (Wn)+1 times 1 1 None Software device Reset 1 1 None 61 RETFIE RETFIE 62 RETLW RETLW 63 RETURN RETURN 64 RLC RLC f RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z RLNC f f = Rotate Left (No Carry) f 1 1 N,Z RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z 65 66 67 RLNC RRC RRNC #lit10,Wn Return from interrupt 1 3 (2) None Return with literal in Wn 1 3 (2) None Return from Subroutine 1 3 (2) None f = Rotate Left through Carry f 1 1 C,N,Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z RRC f f = Rotate Right through Carry f 1 1 C,N,Z RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z RRNC f f = Rotate Right (No Carry) f 1 1 N,Z RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z © 2005 Microchip Technology Inc. Preliminary DS70139C-page 137 dsPIC30F2011/2012/3012/3013 TABLE 18-2: Base Instr # 68 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic SAC Assembly Syntax Description # of # of Words Cycles Status Flags Affected SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None 69 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z 70 SETM SETM f f = 0xFFFF 1 1 None SETM WREG WREG = 0xFFFF 1 1 None SETM Ws Ws = 0xFFFF 1 1 None SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB, SA,SB,SAB SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB, SA,SB,SAB 71 72 73 74 75 76 SFTAC SL SUB SUBB SUBR SUBBR SL f f = Left Shift f 1 1 C,N,OV,Z SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z SUB Acc Subtract Accumulators 1 1 OA,OB,OAB, SA,SB,SAB SUB f f = f - WREG 1 1 C,DC,N,OV,Z SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 SUBR f f = WREG - f 1 1 C,DC,N,OV,Z SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z C,DC,N,OV,Z SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z SUBBR f,WREG WREG = WREG -f - (C) 1 1 C,DC,N,OV,Z SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z SWAP.b Wn Wn = nibble swap Wn 1 1 None SWAP Wn Wn = byte swap Wn 1 1 None TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None 79 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None 80 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None 81 TBLWTL TBLWTL Ws,Wd 82 ULNK ULNK 83 XOR 77 78 84 SWAP ZE Write Ws to Prog<15:0> 1 2 None Unlink frame pointer 1 1 None N,Z XOR f f = f .XOR. WREG 1 1 XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N DS70139C-page 138 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 19.0 DEVELOPMENT SUPPORT 19.1 The PICmicro® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASM™ Assembler - MPLAB C17 and MPLAB C18 C Compilers - MPLINK™ Object Linker/ MPLIB™Object Librarian - MPLAB C30 C Compiler - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator - MPLAB dsPIC30 Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PRO MATE® II Universal Device Programmer - PICSTART® Plus Development Programmer • Low-Cost Demonstration Boards - PICDEM™ 1 Demonstration Board - PICDEM.net™ Demonstration Board - PICDEM 2 Plus Demonstration Board - PICDEM 3 Demonstration Board - PICDEM 4 Demonstration Board - PICDEM 17 Demonstration Board - PICDEM 18R Demonstration Board - PICDEM LIN Demonstration Board - PICDEM USB Demonstration Board • Evaluation Kits - KEELOQ® - PICDEM MSC - microID® - CAN - PowerSmart® - Analog MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® based application that contains: • An interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) • A full-featured editor with color coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Extensive on-line help The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PICmicro emulator and simulator tools (automatically updates all project information) • Debug using: - source files (assembly or C) - absolute listing file (mixed assembly and C) - machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increasing flexibility and power. 19.2 MPASM Assembler The MPASM assembler is a full-featured, universal macro assembler for all PICmicro MCUs. The MPASM assembler generates relocatable object files for the MPLINK object linker, Intel® standard Hex files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM assembler features include: • Integration into MPLAB IDE projects • User defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process © 2005 Microchip Technology Inc. Preliminary DS70139C-page 139 dsPIC30F2011/2012/3012/3013 19.3 MPLAB C17 and MPLAB C18 C Compilers 19.6 The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI C compilers for Microchip’s PIC17CXXX and PIC18CXXX family of microcontrollers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 19.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB object librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 19.5 MPLAB C30 C Compiler MPLAB C30 is distributed with a complete ANSI C standard library. All library functions have been validated and conform to the ANSI C library standard. The library includes functions for string manipulation, dynamic memory allocation, data conversion, timekeeping and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic information for high-level source debugging with the MPLAB IDE. DS70139C-page 140 MPLAB ASM30 assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 compiler uses the assembler to produce it’s object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 19.7 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the PICmicro series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until Break or Trace mode. The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and MPLAB C18 C Compilers, as well as the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 19.8 The MPLAB C30 C compiler is a full-featured, ANSI compliant, optimizing compiler that translates standard ANSI C programs into dsPIC30F assembly language source. The compiler also supports many command line options and language extensions to take full advantage of the dsPIC30F device hardware capabilities and afford fine control of the compiler code generator. MPLAB ASM30 Assembler, Linker and Librarian MPLAB SIM30 Software Simulator The MPLAB SIM30 software simulator allows code development in a PC hosted environment by simulating the dsPIC30F series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any of the pins. The MPLAB SIM30 simulator fully supports symbolic debugging using the MPLAB C30 C Compiler and MPLAB ASM30 assembler. The simulator runs in either a Command Line mode for automated tasks, or from MPLAB IDE. This high-speed simulator is designed to debug, analyze and optimize time intensive DSP routines. Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 19.9 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator 19.11 MPLAB ICD 2 In-Circuit Debugger The MPLAB ICE 2000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers. Software control of the MPLAB ICE 2000 in-circuit emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PICmicro microcontrollers. The MPLAB ICE 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 19.10 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator The MPLAB ICE 4000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for highend PICmicro microcontrollers. Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICD 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high-speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, up to 2 Mb of emulation memory and the ability to view variables in real-time. Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PICmicro MCUs and can be used to develop for these and other PICmicro microcontrollers. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial Programming™ (ICSP™) protocol, offers cost effective in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single-stepping and watching variables, CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real-time. MPLAB ICD 2 also serves as a development programmer for selected PICmicro devices. 19.12 PRO MATE II Universal Device Programmer The PRO MATE II is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features an LCD display for instructions and error messages and a modular detachable socket assembly to support various package types. In Stand-Alone mode, the PRO MATE II device programmer can read, verify and program PICmicro devices without a PC connection. It can also set code protection in this mode. 19.13 PICSTART Plus Development Programmer The PICSTART Plus development programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus development programmer supports most PICmicro devices up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 141 dsPIC30F2011/2012/3012/3013 19.14 PICDEM 1 PICmicro Demonstration Board 19.17 PICDEM 3 PIC16C92X Demonstration Board The PICDEM 1 demonstration board demonstrates the capabilities of the PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The sample microcontrollers provided with the PICDEM 1 demonstration board can be programmed with a PRO MATE II device programmer or a PICSTART Plus development programmer. The PICDEM 1 demonstration board can be connected to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232 interface, a potentiometer for simulated analog input, push button switches and eight LEDs. The PICDEM 3 demonstration board supports the PIC16C923 and PIC16C924 in the PLCC package. All the necessary hardware and software is included to run the demonstration programs. 19.15 PICDEM.net Internet/Ethernet Demonstration Board The PICDEM.net demonstration board is an Internet/ Ethernet demonstration board using the PIC18F452 microcontroller and TCP/IP firmware. The board supports any 40-pin DIP device that conforms to the standard pinout used by the PIC16F877 or PIC18C452. This kit features a user friendly TCP/IP stack, web server with HTML, a 24L256 Serial EEPROM for Xmodem download to web pages into Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface and a 16 x 2 LCD display. Also included is the book and CD-ROM “TCP/IP Lean, Web Servers for Embedded Systems,” by Jeremy Bentham 19.16 PICDEM 2 Plus Demonstration Board The PICDEM 2 Plus demonstration board supports many 18, 28 and 40-pin microcontrollers, including PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers provided with the PICDEM 2 demonstration board can be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or MPLAB ICD 2 with a Universal Programmer Adapter. The MPLAB ICD 2 and MPLAB ICE in-circuit emulators may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area extends the circuitry for additional application components. Some of the features include an RS-232 interface, a 2 x 16 LCD display, a piezo speaker, an on-board temperature sensor, four LEDs and sample PIC18F452 and PIC16F877 Flash microcontrollers. DS70139C-page 142 19.18 PICDEM 4 8/14/18-Pin Demonstration Board The PICDEM 4 can be used to demonstrate the capabilities of the 8, 14 and 18-pin PIC16XXXX and PIC18XXXX MCUs, including the PIC16F818/819, PIC16F87/88, PIC16F62XA and the PIC18F1320 family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts, including LIN and Motor Control using ECCP. Special provisions are made for low-power operation with the supercapacitor circuit and jumpers allow onboard hardware to be disabled to eliminate current draw in this mode. Included on the demo board are provisions for Crystal, RC or Canned Oscillator modes, a five volt regulator for use with a nine volt wall adapter or battery, DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2, 2 x 16 liquid crystal display, PCB footprints for H-Bridge motor driver, LIN transceiver and EEPROM. Also included are: header for expansion, eight LEDs, four potentiometers, three push buttons and a prototyping area. Included with the kit is a PIC16F627A and a PIC18F1320. Tutorial firmware is included along with the User’s Guide. 19.19 PICDEM 17 Demonstration Board The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user tailored application development. The PICDEM 17 demonstration board supports program download and execution from external on-board Flash memory. A generous prototype area is available for user hardware expansion. Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 19.20 PICDEM 18R PIC18C601/801 Demonstration Board 19.23 PICDEM USB PIC16C7X5 Demonstration Board The PICDEM 18R demonstration board serves to assist development of the PIC18C601/801 family of Microchip microcontrollers. It provides hardware implementation of both 8-bit Multiplexed/Demultiplexed and 16-bit Memory modes. The board includes 2 Mb external Flash memory and 128 Kb SRAM memory, as well as serial EEPROM, allowing access to the wide range of memory types supported by the PIC18C601/801. The PICDEM USB Demonstration Board shows off the capabilities of the PIC16C745 and PIC16C765 USB microcontrollers. This board provides the basis for future USB products. 19.21 PICDEM LIN PIC16C43X Demonstration Board The powerful LIN hardware and software kit includes a series of boards and three PICmicro microcontrollers. The small footprint PIC16C432 and PIC16C433 are used as slaves in the LIN communication and feature on-board LIN transceivers. A PIC16F874 Flash microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus communication. 19.22 PICkit™ 1 Flash Starter Kit A complete “development system in a box”, the PICkit Flash Starter Kit includes a convenient multi-section board for programming, evaluation and development of 8/14-pin Flash PIC® microcontrollers. Powered via USB, the board operates under a simple Windows GUI. The PICkit 1 Starter Kit includes the User’s Guide (on CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB® IDE (Integrated Development Environment) software, software and hardware “Tips 'n Tricks for 8-pin Flash PIC® Microcontrollers” Handbook and a USB interface cable. Supports all current 8/14-pin Flash PIC microcontrollers, as well as many future planned devices. © 2005 Microchip Technology Inc. 19.24 Evaluation and Programming Tools In addition to the PICDEM series of circuits, Microchip has a line of evaluation kits and demonstration software for these products. • KEELOQ evaluation and programming tools for Microchip’s HCS Secure Data Products • CAN developers kit for automotive network applications • Analog design boards and filter design software • PowerSmart battery charging evaluation/ calibration kits • IrDA® development kit • microID development and rfLab™ development software • SEEVAL® designer kit for memory evaluation and endurance calculations • PICDEM MSC demo boards for Switching mode power supply, high-power IR driver, delta sigma ADC and flow rate sensor Check the Microchip web page and the latest Product Selector Guide for the complete list of demonstration and evaluation kits. Preliminary DS70139C-page 143 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 144 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 20.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual (DS70046). Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(†) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD and MCLR) (Note 1) .................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V Voltage on MCLR with respect to VSS........................................................................................................ 0V to +13.25V Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin (Note 2)................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD) .......................................................................................................... ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports (Note 2)....................................................................................................200 mA Note 1: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather than pulling this pin directly to VSS. 2: Maximum allowable current is a function of device maximum power dissipation. See Table 20-2 for PDMAX. †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note: 20.1 All peripheral electrical characteristics are specified. For exact peripherals available on specific devices, please refer the the Family Cross Reference Table. DC Characteristics TABLE 20-1: OPERATING MIPS VS. VOLTAGE Max MIPS VDD Range Temp Range dsPIC30FXXX-30I dsPIC30FXXX-20I dsPIC30FXXX-20E 30 20 — 20 4.5-5.5V -40°C to 85°C 4.5-5.5V -40°C to 125°C — — 3.0-3.6V -40°C to 85°C 20 15 — 3.0-3.6V -40°C to 125°C — — 15 2.5-3.0V -40°C to 85°C 10 7.5 — © 2005 Microchip Technology Inc. Preliminary DS70139C-page 145 dsPIC30F2011/2012/3012/3013 TABLE 20-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Operating Junction Temperature Range TJ Operating Ambient Temperature Range Typ Max Unit -40 +125 °C TA -40 +85 °C Operating Junction Temperature Range TJ -40 +150 °C Operating Ambient Temperature Range TA -40 +85 °C Operating Junction Temperature Range TJ -40 +150 °C Operating Ambient Temperature Range TA -40 +125 °C dsPIC30F201x-30I dsPIC30F301x-30I dsPIC30F201x-20I dsPIC30F301x-20I dsPIC30F201x-20E dsPIC30F301x-20E Power Dissipation: Internal chip power dissipation: P INT = VD D × ( I D D – ∑ I O H) PD PINT + PI/O W PDMAX (TJ - TA) / θJA W I/O Pin power dissipation: P I/O = ∑ ( { V D D – V O H } × I OH ) + ∑ ( VO L × I O L ) Maximum Allowed Power Dissipation TABLE 20-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol Typ Max Unit Notes Package Thermal Resistance, 18-pin PDIP (P) θJA 44 — °C/W 1 Package Thermal Resistance, 18-pin SOIC (SO) θJA 57 — °C/W 1 Package Thermal Resistance, 28-pin SPDIP (SP) θJA 42 — °C/W 1 Package Thermal Resistance, 28-pin (SOIC) θJA 49 — °C/W 1 Package Thermal Resistance, 44-pin QFN θJA 28 — °C/W 1 Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations. TABLE 20-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. Symbol Characteristic Min Typ(1) Max Units 2.5 — 5.5 V Industrial temperature 3.0 — 5.5 V Extended temperature Conditions Operating Voltage(2) DC10 VDD Supply Voltage DC11 VDD Supply Voltage Voltage(3) DC12 VDR RAM Data Retention — 1.5 — V DC16 VPOR VDD Start Voltage (to ensure internal Power-on Reset signal) — VSS — V DC17 SVDD VDD Rise Rate (to ensure internal Power-on Reset signal) 0.05 Note 1: 2: 3: V/ms 0-5V in 0.1 sec 0-3V in 60 ms “Typ” column data is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. This is the limit to which VDD can be lowered without losing RAM data. DS70139C-page 146 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Operating Current (IDD)(2) DC20 — — mA -40°C DC20a DC20b TBD — — — mA mA 25°C 85°C DC20c DC20d — — — — mA mA 125°C -40°C DC20e DC20f TBD — — — mA mA 25°C 85°C DC20g DC23 — — — — mA mA 125°C -40°C DC23a DC23b TBD — — — mA mA 25°C 85°C DC23c DC23d — — — — mA mA 125°C -40°C DC23e DC23f TBD — — — mA mA 25°C 85°C DC23g DC24 — — — — mA mA 125°C -40°C DC24a DC24b TBD — — — mA mA 25°C 85°C DC24c DC24d — — — — mA mA 125°C -40°C DC24e DC24f TBD — — — mA mA 25°C 85°C DC24g DC25 — — — — mA mA 125°C -40°C DC25a DC25b TBD — — — mA mA 25°C 85°C DC25c DC25d — — — — mA mA 125°C -40°C DC25e DC25f TBD — — — mA mA 25°C 85°C DC25g Note 1: 2: 3.3V 1 MIPS EC mode 5V 3.3V 4 MIPS EC mode, 4X PLL 5V 3.3V 10 MIPS EC mode, 4X PLL 5V 3V 8 MIPS EC mode, 8X PLL 5V — — mA 125°C Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD. MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory are operational. No peripheral modules are operating. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 147 dsPIC30F2011/2012/3012/3013 TABLE 20-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Operating Current (IDD)(2) DC27 — — mA -40°C DC27a DC27b TBD — — — mA mA 25°C 85°C DC27c DC27d — TBD — — mA mA -40°C 25°C DC27e DC27f — — — — mA mA 85°C 125°C DC28 DC28a — TBD — — mA mA -40°C 25°C DC28b DC28c — — — — mA mA 85°C -40°C DC28d DC28e TBD — — — mA mA 25°C 85°C DC28f DC29 — — — — mA mA 125°C -40°C DC29a DC29b TBD — — — mA mA 25°C 85°C DC29c DC30 — — — — mA mA 125°C -40°C DC30a DC30b TBD — — — mA mA 25°C 85°C DC30c DC30d — — — — mA mA 125°C -40°C DC30e DC30f TBD — — — mA mA 25°C 85°C DC30g DC31 — — — — mA mA 125°C -40°C DC31a DC31b TBD — — — mA mA 25°C 85°C DC31c DC31d — — — — mA mA 125°C -40°C DC31e DC31f TBD — — — mA mA 25°C 85°C DC31g Note 1: 2: 3.3V 20 MIPS EC mode, 8X PLL 5V 3.3V 16 MIPS EC mode, 16X PLL 5V 5V 30 MIPS EC mode, 16X PLL 3.3V FRC (~ 2 MIPS) 5V 3.3V LPRC (~ 512 kHz) 5V — — mA 125°C Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD. MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory are operational. No peripheral modules are operating. DS70139C-page 148 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC40 — — mA -40°C DC40a DC40b TBD — — — mA mA 25°C 85°C DC40c DC40d — — — — mA mA 125°C -40°C DC40e DC40f TBD — — — mA mA 25°C 85°C DC40g DC43 — — — — mA mA 125°C -40°C DC43a DC43b TBD — — — mA mA 25°C 85°C DC43c DC43d — — — — mA mA 125°C -40°C DC43e DC43f TBD — — — mA mA 25°C 85°C DC43g DC44 — — — — mA mA 125°C -40°C DC44a DC44b TBD — — — mA mA 25°C 85°C DC44c DC44d — — — — mA mA 125°C -40°C DC44e DC44f TBD — — — mA mA 25°C 85°C DC44g DC45 — — — — mA mA 125°C -40°C DC45a DC45b TBD — — — mA mA 25°C 85°C DC45c DC45d — — — — mA mA 125°C -40°C DC45e DC45f TBD — — — mA mA 25°C 85°C DC45g Note 1: 2: 3.3V 1 MIPS EC mode 5V 3.3V 4 MIPS EC mode, 4X PLL 5V 3.3V 10 MIPS EC mode, 4X PLL 5V 3.3V 8 MIPS EC mode, 8X PLL 5V — — mA 125°C Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IIDLE current is measured with Core off, Clock on and all modules turned off. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 149 dsPIC30F2011/2012/3012/3013 TABLE 20-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC47 — — mA -40°C DC47a DC47b TBD — — — mA mA 25°C 85°C DC47c DC47d — TBD — — mA mA -40°C 25°C DC47e DC47f — — — — mA mA 85°C 125°C DC48 DC48a — TBD — — mA mA -40°C 25°C DC48b DC48c — — — — mA mA 85°C -40°C DC48d DC48e TBD — — — mA mA 25°C 85°C DC48f DC49 — — — — mA mA 125°C -40°C DC49a DC49b TBD — — — mA mA 25°C 85°C DC49c DC50 — — — — mA mA 125°C -40°C DC50a DC50b TBD — — — mA mA 25°C 85°C DC50c DC50d — — — — mA mA 125°C -40°C DC50e DC50f TBD — — — mA mA 25°C 85°C DC50g DC51 — — — — mA mA 125°C -40°C DC51a DC51b TBD — — — mA mA 25°C 85°C DC51c DC51d — — — — mA mA 125°C -40°C DC51e DC51f TBD — — — mA mA 25°C 85°C DC51g Note 1: 2: 3.3V 20 MIPS EC mode, 8X PLL 5V 3.3V 16 MIPS EC mode, 16X PLL 5V 5V 30 MIPS EC mode, 16X PLL 3.3V FRC (~ 2 MIPS) 5V 3.3V LPRC (~ 512 kHz) 5V — — mA 125°C Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IIDLE current is measured with Core off, Clock on and all modules turned off. DS70139C-page 150 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Power Down Current (IPD)(2) DC60 — — μA -40°C DC60a TBD — μA 25°C DC60b — — μA 85°C DC60c — — μA 125°C DC60d — — μA -40°C DC60e TBD — μA 25°C DC60f — — μA 85°C DC60g — — μA 125°C DC61 — — μA -40°C DC61a TBD — μA 25°C DC61b — — μA 85°C DC61c — — μA 125°C DC61d — — μA -40°C DC61e TBD — μA 25°C DC61f — — μA 85°C DC61g — — μA 125°C DC62 — — μA -40°C DC62a TBD — μA 25°C DC62b — — μA 85°C DC62c — — μA 125°C DC62d — — μA -40°C DC62e TBD — μA 25°C DC62f — — μA 85°C DC62g — — μA 125°C DC63 — — μA -40°C DC63a TBD — μA 25°C DC63b — — μA 85°C DC63c — — μA 125°C DC63d — — μA -40°C DC63e TBD — μA 25°C DC63f — — μA 85°C DC63g — — μA 125°C Note 1: 2: 3: 3.3V Base Power Down Current(3) 5V 3.3V Watchdog Timer Current: ΔIWDT(3) 5V 3.3V Timer 1 w/32 kHz Crystal: ΔITI32(3) 5V 3.3V BOR On: ΔIBOR(3) 5V Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. LVD, BOR, WDT, etc. are all switched off. The Δ current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 151 dsPIC30F2011/2012/3012/3013 TABLE 20-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Power Down Current (IPD)(2) DC66 — — μA -40°C DC66a TBD — μA 25°C DC66b — — μA 85°C DC66c — — μA 125°C DC66d — — μA -40°C DC66e TBD — μA 25°C DC66f — — μA 85°C DC66g — — μA 125°C Note 1: 2: 3: 3.3V Low Voltage Detect: ΔILVD(3) 5V Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. LVD, BOR, WDT, etc. are all switched off. The Δ current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. DS70139C-page 152 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Min Typ(1) Max Units I/O pins: with Schmitt Trigger buffer VSS — 0.2 VDD V DI15 MCLR VSS — 0.2 VDD V DI16 OSC1 (in XT, HS and LP modes) VSS — 0.2 VDD V VIL DI10 Characteristic Conditions Input Low Voltage(2) mode)(3) DI17 OSC1 (in RC VSS — 0.3 VDD V DI18 SDA, SCL TBD — TBD V SM bus disabled SDA, SCL TBD — TBD V SM bus enabled I/O pins: with Schmitt Trigger buffer 0.8 VDD — VDD V MCLR 0.8 VDD — VDD V DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD — VDD V DI27 OSC1 (in RC mode)(3) 0.9 VDD — VDD V DI28 SDA, SCL TBD — TBD V SM bus disabled DI29 SDA, SCL TBD — TBD V SM bus enabled 50 250 400 μA VDD = 5V, VPIN = VSS TBD TBD TBD μA VDD = 3V, VPIN = VSS DI19 VIH DI20 DI25 ICNPU Input High Voltage(2) CNXX Pull-up Current(2) DI30 DI31 IIL Input Leakage Current(2)(4)(5) DI50 I/O ports — 0.01 ±1 μA VSS ≤ VPIN ≤ VDD, Pin at hi-impedance DI51 Analog input pins — 0.50 — μA VSS ≤ VPIN ≤ VDD, Pin at hi-impedance DI55 MCLR — 0.05 ±5 μA VSS ≤ VPIN ≤ VDD DI56 OSC1 — 0.05 ±5 μA VSS ≤ VPIN ≤ VDD, XT, HS and LP Osc mode Note 1: 2: 3: 4: 5: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that the dsPIC30F device be driven with an external clock while in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 153 dsPIC30F2011/2012/3012/3013 TABLE 20-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units — 0.6 V Conditions Output Low Voltage(2) VOL DO10 I/O ports — IOL = 8.5 mA, VDD = 5V — — TBD V IOL = 2.0 mA, VDD = 3V DO16 OSC2/CLKOUT — — 0.6 V IOL = 1.6 mA, VDD = 5V (RC or EC Osc mode) — — TBD V IOL = 2.0 mA, VDD = 3V Output High Voltage(2) VOH DO20 I/O ports DO26 OSC2/CLKOUT (RC or EC Osc mode) VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V TBD — — V IOH = -2.0 mA, VDD = 3V VDD – 0.7 — — V IOH = -1.3 mA, VDD = 5V TBD — — V IOH = -2.0 mA, VDD = 3V Capacitive Loading Specs on Output Pins(2) DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XTL, XT, HS and LP modes when external clock is used to drive OSC1. DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode DO58 CB SCL, SDA — — 400 pF In I2C mode Note 1: 2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. FIGURE 20-1: LOW-VOLTAGE DETECT CHARACTERISTICS VDD LV10 LVDIF (LVDIF set by hardware) DS70139C-page 154 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-10: ELECTRICAL CHARACTERISTICS: LVDL Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. LV10 Characteristic(1) Min Typ Max Units LVDL Voltage on VDD transition LVDL = 0000(2) high to low — — — V LVDL = 0001(2) — — — V (2) — — — V 0011(2) — — — V LVDL = 0100 2.50 — 2.65 V LVDL = 0101 2.70 — 2.86 V LVDL = 0110 2.80 — 2.97 V LVDL = 0111 3.00 — 3.18 V LVDL = 1000 3.30 — 3.50 V LVDL = 1001 3.50 — 3.71 V LVDL = 1010 3.60 — 3.82 V LVDL = 1011 3.80 — 4.03 V LVDL = 1100 4.00 — 4.24 V LVDL = 1101 4.20 — 4.45 V LVDL = 1110 4.50 — 4.77 V LVDL = 1111 — — — V Symbol VPLVD LVDL = 0010 LVDL = LV15 Note 1: 2: VLVDIN External LVD input pin threshold voltage Conditions These parameters are characterized but not tested in manufacturing. These values not in usable operating range. FIGURE 20-2: BROWN-OUT RESET CHARACTERISTICS VDD BO10 (Device in Brown-out Reset) BO15 (Device not in Brown-out Reset) RESET (due to BOR) Power Up Time-out © 2005 Microchip Technology Inc. Preliminary DS70139C-page 155 dsPIC30F2011/2012/3012/3013 TABLE 20-11: ELECTRICAL CHARACTERISTICS: BOR Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. BO10 Symbol VBOR Min Typ(1) Max Units BORV = 00(3) — — — V BORV = 01 2.7 — 2.86 V BORV = 10 4.2 — 4.46 V BORV = 11 4.5 — 4.78 V — 5 — mV Characteristic BOR Voltage(2) on VDD transition high to low Conditions Not in operating range BO15 VBHYS Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. 00 values not in usable operating range. 2: 3: TABLE 20-12: DC CHARACTERISTICS: PROGRAM AND EEPROM Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units Conditions Data EEPROM Memory(2) -40°C ≤ TA ≤ +85°C D120 ED Byte Endurance 100K 1M — E/W D121 VDRW VDD for Read/Write VMIN — 5.5 V D122 TDEW Erase/Write Cycle Time — 2 — ms D123 TRETD Characteristic Retention 40 100 — Year Provided no other specifications are violated D124 IDEW IDD During Programming — 10 30 mA Row Erase -40°C ≤ TA ≤ +85°C Using EECON to read/write VMIN = Minimum operating voltage Program Flash Memory(2) D130 EP Cell Endurance 10K 100K — E/W D131 VPR VDD for Read VMIN — 5.5 V V VMIN = Minimum operating voltage D132 VEB VDD for Bulk Erase 4.5 — 5.5 D133 VPEW VDD for Erase/Write 3.0 — 5.5 V D134 TPEW Erase/Write Cycle Time — 2 — ms D135 TRETD Characteristic Retention 40 100 — Year D136 TEB ICSP Block Erase Time — 4 — ms D137 IPEW IDD During Programming — 10 30 mA Row Erase D138 IEB IDD During Programming — 10 30 mA Bulk Erase Note 1: 2: Provided no other specifications are violated Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are characterized but not tested in manufacturing. DS70139C-page 156 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 20.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC30F AC characteristics and timing parameters. TABLE 20-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Operating voltage VDD range as described in DC Spec Section 20.0. AC CHARACTERISTICS FIGURE 20-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464 Ω CL = 50 pF for all pins except OSC2 5 pF for OSC2 output VSS FIGURE 20-4: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 OS20 OS30 OS25 OS30 OS31 OS31 CLKOUT OS40 © 2005 Microchip Technology Inc. Preliminary OS41 DS70139C-page 157 dsPIC30F2011/2012/3012/3013 TABLE 20-14: EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. OS10 FOSC Characteristic Min Typ(1) Max Units External CLKIN Frequency(2) (External clocks allowed only in EC mode) DC 4 4 4 — — — — 40 10 10 7.5 MHz MHz MHz MHz EC EC with 4x PLL EC with 8x PLL EC with 16x PLL Oscillator Frequency(2) DC 0.4 4 4 4 4 10 10 10 10 12 12 12 31 — — — — — — — — — — — — — — — — — — — 7.37 7.37 7.37 7.37 512 4 4 10 10 10 7.5 25 20 20 15 25 25 22.5 33 — — — — — MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz kHz MHz MHz MHz MHz kHz RC XTL XT XT with 4x PLL XT with 8x PLL XT with 16x PLL HS HS/2 with 4x PLL HS/2 with 8x PLL HS/2 with 16x PLL HS/3 with 4x PLL HS/3 with 8x PLL HS/3 with 16x PLL LP FRC internal FRC internal w/4x PLL FRC internal w/8x PLL FRC internal w/16x PLL LPRC internal — — — — OS20 TOSC TOSC = 1/FOSC OS25 TCY Instruction Cycle Time(2)(3) (2) 33 — DC ns See Table 20-16 — — ns EC EC OS30 TosL, TosH OS31 TosR, TosF External Clock(2) in (OSC1) Rise or Fall Time — — 20 ns OS40 TckR CLKOUT Rise Time(2)(4) — 6 10 ns OS41 TckF CLKOUT Fall Time(2)(4) — 6 10 ns 2: 3: 4: See parameter OS10 for FOSC value .45 x TOSC External Clock in (OSC1) High or Low Time Note 1: Conditions Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “Max.” cycle time limit is “DC” (no clock) for all devices. Measurements are taken in EC or ERC modes. The CLKOUT signal is measured on the OSC2 pin. CLKOUT is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY). DS70139C-page 158 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions OS50 FPLLI PLL Input Frequency Range(2) 4 — 10 MHz EC, XT modes with PLL OS51 FSYS On-chip PLL Output(2) 16 — 120 MHz EC, XT modes with PLL OS52 TLOC PLL Start-up Time (Lock Time) — 20 50 μs OS53 DCLK CLKOUT Stability (Jitter) TBD 1 TBD % Note 1: 2: Measured over 100 ms period These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. TABLE 20-16: INTERNAL CLOCK TIMING EXAMPLES Clock Oscillator Mode FOSC (MHz)(1) TCY (μsec)(2) MIPS(3) w/o PLL MIPS(3) w PLL x4 MIPS(3) w PLL x8 MIPS(3) w PLL x16 EC 0.200 20.0 0.05 — — — XT Note 1: 2: 3: 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 — 25 0.16 6.25 — — — 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 — Assumption: Oscillator Postscaler is divide by 1. Instruction Execution Cycle Time: TCY = 1 / MIPS. Instruction Execution Frequency: MIPS = (FOSC * PLLx) / 4 [since there are 4 Q clocks per instruction cycle]. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 159 dsPIC30F2011/2012/3012/3013 TABLE 20-17: AC CHARACTERISTICS: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions Internal FRC Accuracy @ FRC Freq = 7.37 MHz(1) FRC FRC with x4 PLL FRC with x8 PLL FRC with x16 PLL Note 1: TBD % +25°C TBD % +25°C VDD = 4.5-5.5V TBD % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V TBD % TBD % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V VDD = 4.5-5.5V TBD % +25°C VDD = 3.0-3.6V TBD % +25°C VDD = 4.5-5.5V TBD % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V TBD % TBD % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V TBD % +25°C VDD = 3.0-3.6V TBD % TBD % TBD % TBD % -40°C ≤ TA ≤ +85°C +25°C VDD = 4.5-5.5V VDD = 4.5-5.5V -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V -40°C ≤ TA ≤ +85°C VDD = 4.5-5.5V TBD % +25°C VDD = 3.0-3.6V TBD % +25°C VDD = 4.5-5.5V TBD % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V TBD % TBD % -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V VDD = 4.5-5.5V Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift. DS70139C-page 160 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-18: AC CHARACTERISTICS: INTERNAL RC JITTER AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions Internal FRC Jitter @ FRC Freq = 7.37 MHz(1) FRC FRC with x4 PLL FRC with x8 PLL FRC with x16 PLL Note 1: TBD % +25°C VDD = 3.0-3.6V TBD % +25°C VDD = 4.5-5.5V TBD % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V TBD % TBD % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V -40°C ≤ TA ≤ +85°C VDD = 4.5-5.5V TBD % +25°C VDD = 3.0-3.6V TBD % +25°C VDD = 4.5-5.5V TBD % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V TBD % TBD % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V TBD % +25°C VDD = 3.0-3.6V TBD % TBD % TBD % TBD % -40°C ≤ TA ≤ +85°C +25°C VDD = 4.5-5.5V VDD = 4.5-5.5V -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V -40°C ≤ TA ≤ +85°C VDD = 4.5-5.5V TBD % +25°C VDD = 3.0-3.6V TBD % +25°C VDD = 4.5-5.5V TBD % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V TBD % TBD % -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V VDD = 4.5-5.5V Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift. TABLE 20-19: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions TBD — TBD % -40°C to +85°C VDD = 3V TBD — TBD % -40°C to +85°C VDD = 5V LPRC @ Freq = 512 kHz F20 F21 Note 1: 2: Frequency at 25°C and 5V. Change of LPRC frequency as VDD changes. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 161 dsPIC30F2011/2012/3012/3013 FIGURE 20-5: CLKOUT AND I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) New Value Old Value DO31 DO32 Note: Refer to Figure 20-3 for load conditions. TABLE 20-20: CLKOUT AND I/O TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1)(2)(3) Min Typ(4) Max Units Conditions DO31 TIOR Port output rise time — 10 25 ns — DO32 TIOF Port output fall time — 10 25 ns — DI35 TINP INTx pin high or low time (output) DI40 TRBP CNx high or low time (input) Note 1: 2: 3: 4: 20 — — ns — 2 TCY — — ns — These parameters are asynchronous events not related to any internal clock edges Measurements are taken in RC mode and EC mode where CLKOUT output is 4 x TOSC. These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. DS70139C-page 162 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 20-6: VDD RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS SY12 MCLR SY10 Internal POR SY11 PWRT Time-out OSC Time-out SY30 Internal RESET Watchdog Timer RESET SY13 SY20 SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 20-3 for load conditions. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 163 dsPIC30F2011/2012/3012/3013 TABLE 20-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) Min Typ(2) Max Units Conditions SY10 TmcL MCLR Pulse Width (low) 2 — — μs -40°C to +85°C SY11 TPWRT Power-up Timer Period TBD TBD TBD TBD 0 4 16 64 TBD TBD TBD TBD ms -40°C to +85°C User programmable SY12 TPOR Power On Reset Delay 3 10 30 μs -40°C to +85°C SY13 TIOZ I/O Hi-impedance from MCLR Low or Watchdog Timer Reset — — 100 ns SY20 TWDT1 Watchdog Timer Time-out Period (No Prescaler) 1.8 2.0 2.2 ms VDD = 5V, -40°C to +85°C 1.9 2.1 2.3 ms VDD = 3V, -40°C to +85°C TWDT2 SY25 TBOR Brown-out Reset Pulse 100 — — μs VDD ≤ VBOR (D034) SY30 TOST Oscillation Start-up Timer Period — 1024 TOSC — — TOSC = OSC1 period SY35 TFSCM Fail-Safe Clock Monitor Delay — 100 — μs -40°C to +85°C Note 1: 2: 3: Width(3) These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Refer to Figure 20-2 and Table 20-11 for BOR. FIGURE 20-7: BAND GAP START-UP TIME CHARACTERISTICS VBGAP 0V Enable Band Gap (see Note) SY40 Band Gap Stable Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set. DS70139C-page 164 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-22: BAND GAP START-UP TIME REQUIREMENTS AC CHARACTERISTICS Param No. SY40 Note 1: 2: Symbol TBGAP Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Min Typ(2) Max Units Band Gap Start-up Time — 20 50 µs Conditions Defined as the time between the instant that the band gap is enabled and the moment that the band gap reference voltage is stable. RCON<13>Status bit These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. FIGURE 20-8: TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx11 Tx10 Tx15 Tx20 OS60 TMRX Note: Refer to Figure 20-3 for load conditions. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 165 dsPIC30F2011/2012/3012/3013 TABLE 20-23: TYPE A TIMER (TIMER1) EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TA10 TA11 Symbol TTXH TTXL Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 — — ns Must also meet parameter TA15 Synchronous, with prescaler 10 — — ns Asynchronous 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns Asynchronous TA15 TTXP 10 — — ns TCY + 10 — — ns Synchronous, with prescaler Greater of: 20 ns or (TCY + 40)/N — — — Asynchronous 20 — — ns DC — 50 kHz 6 TOSC — TxCK Input Period Synchronous, no prescaler OS60 Ft1 TA20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Note: SOSC1/T1CK oscillator input frequency range (oscillator enabled by setting bit TCS (T1CON, bit 1)) 2 TOSC Must also meet parameter TA15 N = prescale value (1, 8, 64, 256) Timer1 is a Type A. DS70139C-page 166 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-24: TYPE B TIMER (TIMER2 AND TIMER4) EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TB10 TB11 TB15 Symbol TtxH TtxL TtxP Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns TCY + 10 — — ns — 6 TOSC — TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler TB20 Note: TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Greater of: 20 ns or (TCY + 40)/N 2 TOSC Conditions Must also meet parameter TB15 Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) Timer2 and Timer4 are Type B. TABLE 20-25: TYPE C TIMER (TIMER3 AND TIMER5) EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min Typ Max Units Conditions TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC15 TtxP TxCK Input Period Synchronous, no prescaler TCY + 10 — — ns N = prescale value (1, 8, 64, 256) — 6 TOSC — Synchronous, with prescaler TC20 Note: TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Greater of: 20 ns or (TCY + 40)/N 2 TOSC Timer3 and Timer5 are Type C. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 167 dsPIC30F2011/2012/3012/3013 FIGURE 20-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICX IC10 IC11 IC15 Note: Refer to Figure 20-3 for load conditions. TABLE 20-26: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol IC10 TccL ICx Input Low Time IC11 TccH ICx Input High Time IC15 TccP ICx Input Period No Prescaler Min Max Units 0.5 TCY + 20 — ns With Prescaler No Prescaler 10 — ns 0.5 TCY + 20 — ns 10 — ns (2 TCY + 40)/N — ns With Prescaler Note 1: Conditions N = prescale value (1, 4, 16) These parameters are characterized but not tested in manufacturing. FIGURE 20-10: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC10 OC11 Note: Refer to Figure 20-3 for load conditions. TABLE 20-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol No. Characteristic(1) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ(2) Max Units Conditions OC10 TccF OCx Output Fall Time — 10 25 ns — OC11 TccR OCx Output Rise Time — 10 25 ns — Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70139C-page 168 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 20-11: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA/OCFB OC15 OCx TABLE 20-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. OC15 TFD OC20 TFLT Note 1: 2: Characteristic(1) Min Typ(2) Fault Input to PWM I/O Change — — Fault Input Pulse Width — — Max Units Conditions 25 ns VDD = 3V TBD ns VDD = 5V 50 ns VDD = 3V TBD ns VDD = 5V -40°C to +85°C -40°C to +85°C These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 169 dsPIC30F2011/2012/3012/3013 FIGURE 20-12: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING CHARACTERISTICS CSCK (SCKE = 1) CS11 CS10 CS21 CS20 CS20 CS21 CSCK (SCKE = 0) COFS CS55 CS56 CS35 CS51 CSDO HIGH-Z 70 CS50 LSb MSb CS30 CSDI HIGH-Z CS31 LSb IN MSb IN CS40 CS41 Note: Refer to Figure 20-3 for load conditions. DS70139C-page 170 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-29: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. CS10 Symbol TcSCKL Characteristic(1) Min Typ(2) Max Units Conditions TCY / 2 + 20 — — ns — 30 — — ns — TCY / 2 + 20 — — ns — CSCK Output High Time(3) (CSCK pin is an output) 30 — — ns — CSCK Input Low Time (CSCK pin is an input) CSCK Output Low Time(3) (CSCK pin is an output) CS11 TcSCKH CSCK Input High Time (CSCK pin is an input) CS20 TcSCKF CSCK Output Fall Time(4) (CSCK pin is an output) — 10 25 ns — CS21 TcSCKR CSCK Output Rise Time(4) (CSCK pin is an output) — 10 25 ns — CS30 TcSDOF CSDO Data Output Fall Time(4) — 10 25 ns — CS31 TcSDOR CSDO Data Output Rise Time(4) — 10 25 ns — CS35 TDV Clock edge to CSDO data valid — — 10 ns — CS36 TDIV Clock edge to CSDO tri-stated 10 — 20 ns — CS40 TCSDI Setup time of CSDI data input to CSCK edge (CSCK pin is input or output) 20 — — ns — CS41 THCSDI Hold time of CSDI data input to CSCK edge (CSCK pin is input or output) 20 — — ns — CS50 TcoFSF COFS Fall Time (COFS pin is output) — 10 25 ns Note 1 CS51 TcoFSR COFS Rise Time (COFS pin is output) — 10 25 ns Note 1 CS55 TscoFS Setup time of COFS data input to CSCK edge (COFS pin is input) 20 — — ns — CS56 THCOFS Hold time of COFS data input to CSCK edge (COFS pin is input) 20 — — ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all DCI pins. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 171 dsPIC30F2011/2012/3012/3013 FIGURE 20-13: DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS BIT_CLK (CSCK) CS61 CS60 CS62 CS21 CS20 CS71 CS70 CS72 SYNC (COFS) CS76 CS75 CS80 SDO (CSDO) MSb LSb LSb CS76 CS75 MSb IN SDI (CSDI) CS65 CS66 TABLE 20-30: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1)(2) Min Typ(3) Max Units Conditions BIT_CLK Low Time 36 40.7 45 ns — BIT_CLK High Time 36 40.7 45 ns — BIT_CLK Period — 81.4 — ns Bit clock is input Input Setup Time to — — 10 ns — Falling Edge of BIT_CLK Input Hold Time from — — 10 ns — CS66 THACL Falling Edge of BIT_CLK — 19.5 — μs Note 1 CS70 TSYNCLO SYNC Data Output Low Time CS71 TSYNCHI SYNC Data Output High Time — 1.3 — μs Note 1 CS72 TSYNC SYNC Data Output Period — 20.8 — μs Note 1 CS75 TRACL Rise Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V CS76 TFACL Fall Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V CS77 TRACL Rise Time, SYNC, SDATA_OUT — TBD TBD ns CLOAD = 50 pF, VDD = 3V CS78 TFACL Fall Time, SYNC, SDATA_OUT — TBD TBD ns CLOAD = 50 pF, VDD = 3V CS80 TOVDACL Output valid delay from rising — — 15 ns — edge of BIT_CLK Note 1: These parameters are characterized but not tested in manufacturing. 2: These values assume BIT_CLK frequency is 12.288 MHz. 3: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. CS60 CS61 CS62 CS65 TBCLKL TBCLKH TBCLK TSACL DS70139C-page 172 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 20-14: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 BIT14 - - - - - -1 MSb SDOx SP31 SDIx LSb SP30 MSb IN LSb IN BIT14 - - - -1 SP40 SP41 Note: Refer to Figure 20-3 for load conditions. TABLE 20-31: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP10 TscL SCKX Output Low Time(3) TCY / 2 — — ns — SP11 TscH SCKX Output High Time(3) TCY / 2 — — ns — — 10 25 ns — — 10 25 ns — Time(4 SP20 TscF SCKX Output Fall SP21 TscR SCKX Output Rise Time(4) Time(4) SP30 TdoF SDOX Data Output Fall — 10 25 ns — SP31 TdoR SDOX Data Output Rise Time(4) — 10 25 ns — SP35 TscH2doV, TscL2doV SDOX Data Output Valid after SCKX Edge — — 30 ns — SP40 TdiV2scH, TdiV2scL Setup Time of SDIX Data Input to SCKX Edge 20 — — ns — SP41 TscH2diL, TscL2diL Hold Time of SDIX Data Input to SCKX Edge 20 — — ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 173 dsPIC30F2011/2012/3012/3013 FIGURE 20-15: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS SP36 SCKX (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKX (CKP = 1) SP35 BIT14 - - - - - -1 MSb SDOX SP40 SDIX LSb SP30,SP31 MSb IN BIT14 - - - -1 LSb IN SP41 Note: Refer to Figure 20-3 for load conditions. TABLE 20-32: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP10 TscL SCKX output low time(3) TCY / 2 — — ns — SP11 TscH SCKX output high time(3) TCY / 2 — — ns — — 10 25 ns — — 10 25 ns — — 10 25 ns — — 10 25 ns — time(4) SP20 TscF SCKX output fall SP21 TscR SCKX output rise time(4) time(4) SP30 TdoF SDOX data output fall SP31 TdoR SDOX data output rise time(4) SP35 TscH2doV, SDOX data output valid after TscL2doV SCKX edge — — 30 ns — SP36 TdoV2sc, SDOX data output setup to TdoV2scL first SCKX edge 30 — — ns — SP40 TdiV2scH, Setup time of SDIX data input TdiV2scL to SCKX edge 20 — — ns — SP41 TscH2diL, TscL2diL 20 — — ns — Note 1: 2: 3: 4: Hold time of SDIX data input to SCKX edge These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not violate this specification. Assumes 50 pF load on all SPI pins. DS70139C-page 174 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 20-16: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS SSX SP52 SP50 SCKX (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 MSb SDOX LSb BIT14 - - - - - -1 SP51 SP30,SP31 SDIX MSb IN BIT14 - - - -1 LSb IN SP41 SP40 Note: Refer to Figure 20-3 for load conditions. TABLE 20-33: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP70 TscL SCKX Input Low Time 30 — — ns — SP71 TscH SCKX Input High Time 30 — — ns — SP72 TscF SCKX Input Fall Time(3) — 10 25 ns — SP73 TscR SCKX Input Rise Time(3) — 10 25 ns — — 10 25 ns — — 10 25 ns — Time(3) SP30 TdoF SDOX Data Output Fall SP31 TdoR SDOX Data Output Rise Time(3) SP35 TscH2doV, SDOX Data Output Valid after TscL2doV SCKX Edge — — 30 ns — SP40 TdiV2scH, Setup Time of SDIX Data Input TdiV2scL to SCKX Edge 20 — — ns — SP41 TscH2diL, Hold Time of SDIX Data Input TscL2diL to SCKX Edge 20 — — ns — SP50 TssL2scH, SSX↓ to SCKX↑ or SCKX↓ Input TssL2scL 120 — — ns — SP51 TssH2doZ SSX↑ to SDOX Output Hi-Impedance(3) 10 — 50 ns — SP52 TscH2ssH SSX after SCK Edge TscL2ssH 1.5 TCY +40 — — ns — Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Assumes 50 pF load on all SPI pins. 3: © 2005 Microchip Technology Inc. Preliminary DS70139C-page 175 dsPIC30F2011/2012/3012/3013 FIGURE 20-17: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS SP60 SSX SP52 SP50 SCKX (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 SP52 MSb SDOX BIT14 - - - - - -1 LSb SP30,SP31 SDIX MSb IN SP51 BIT14 - - - -1 LSb IN SP41 SP40 Note: Refer to Figure 20-3 for load conditions. DS70139C-page 176 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-34: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions TscL SCKX Input Low Time 30 — — ns — SP71 TscH SCKX Input High Time 30 — — ns — SP72 TscF SCKX Input Fall Time(3) — 10 25 ns — — 10 25 ns — — 10 25 ns — SP70 (3) SP73 TscR SCKX Input Rise Time SP30 TdoF SDOX Data Output Fall Time(3) SP31 TdoR — 10 25 ns — SP35 TscH2doV, SDOX Data Output Valid after TscL2doV SCKX Edge — — 30 ns — SP40 TdiV2scH, Setup Time of SDIX Data Input TdiV2scL to SCKX Edge 20 — — ns — SP41 TscH2diL, Hold Time of SDIX Data Input TscL2diL to SCKX Edge 20 — — ns — SP50 TssL2scH, SSX↓ to SCKX↓ or SCKX↑ input TssL2scL 120 — — ns — SP51 TssH2doZ SS↑ to SDOX Output Hi-Impedance(4) 10 — 50 ns — SP52 TscH2ssH SSX↑ after SCKX Edge TscL2ssH 1.5 TCY + 40 — — ns — SP60 TssL2doV SDOX Data Output Valid after SCKX Edge — — 50 ns — Note 1: 2: 3: 4: SDOX Data Output Rise Time (3) These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not violate this specification. Assumes 50 pF load on all SPI pins. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 177 dsPIC30F2011/2012/3012/3013 FIGURE 20-18: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCL IM31 IM34 IM30 IM33 SDA Stop Condition Start Condition Note: Refer to Figure 20-3 for load conditions. FIGURE 20-19: I2C BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM21 IM11 IM10 SCL IM11 IM26 IM10 IM25 IM33 SDA In IM40 IM40 IM45 SDA Out Note: Refer to Figure 20-3 for load conditions. DS70139C-page 178 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-35: I2C BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. IM10 Min(1) Max Units Conditions TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) — μs — 400 kHz mode TCY / 2 (BRG + 1) — μs — (2) TCY / 2 (BRG + 1) — μs — Clock High Time 100 kHz mode TCY / 2 (BRG + 1) — μs — 400 kHz mode TCY / 2 (BRG + 1) — μs — 1 MHz mode(2) TCY / 2 (BRG + 1) — μs — 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns Characteristic 1 MHz mode THI:SCL IM11 TF:SCL IM20 TR:SCL IM21 SDA and SCL Fall Time SDA and SCL Rise Time TSU:DAT Data Input Setup Time IM25 THD:DAT Data Input Hold Time IM26 TSU:STA IM30 Start Condition Setup Time THD:STA Start Condition Hold Time IM31 TSU:STO Stop Condition Setup Time IM33 THD:STO Stop Condition IM34 Hold Time TAA:SCL IM40 Output Valid From Clock 1 MHz mode(2) — 100 ns 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(2) — 300 ns 100 kHz mode 250 — ns 400 kHz mode 100 — ns 1 MHz mode(2) TBD — ns 100 kHz mode 0 — ns 400 kHz mode 0 0.9 μs 1 MHz mode(2) TBD — ns 100 kHz mode TCY / 2 (BRG + 1) — μs 400 kHz mode TCY / 2 (BRG + 1) — μs 1 MHz mode(2) TCY / 2 (BRG + 1) — μs 100 kHz mode TCY / 2 (BRG + 1) — μs 400 kHz mode TCY / 2 (BRG + 1) — μs 1 MHz mode(2) TCY / 2 (BRG + 1) — μs 100 kHz mode TCY / 2 (BRG + 1) — μs 400 kHz mode TCY / 2 (BRG + 1) — μs 1 MHz mode(2) TCY / 2 (BRG + 1) — μs 100 kHz mode TCY / 2 (BRG + 1) — ns IM50 CB Note 1: 2: CB is specified to be from 10 to 400 pF — — Only relevant for repeated Start condition After this period the first clock pulse is generated — — 400 kHz mode TCY / 2 (BRG + 1) — ns 1 MHz mode(2) TCY / 2 (BRG + 1) — ns 100 kHz mode — 3500 ns — 400 kHz mode — 1000 ns — mode(2) — — ns 100 kHz mode 4.7 — μs 1 MHz TBF:SDA Bus Free Time IM45 CB is specified to be from 10 to 400 pF 400 kHz mode 1.3 — μs 1 MHz mode(2) TBD — μs — 400 pF Bus Capacitive Loading — Time the bus must be free before a new transmission can start BRG is the value of the I2C Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ (I2C)” in the dsPIC30F Family Reference Manual. Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only). © 2005 Microchip Technology Inc. Preliminary DS70139C-page 179 dsPIC30F2011/2012/3012/3013 FIGURE 20-20: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCL IS34 IS31 IS30 IS33 SDA Stop Condition Start Condition FIGURE 20-21: I2C BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS21 IS11 IS10 SCL IS30 IS26 IS31 IS25 IS33 SDA In IS40 IS40 IS45 SDA Out DS70139C-page 180 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-36: I2C BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. IS10 IS11 IS20 IS21 IS25 IS26 IS30 IS31 IS33 IS34 IS40 IS45 IS50 Note Symbol TLO:SCL THI:SCL Characteristic Clock Low Time Clock High Time Min Max Units 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs 1 MHz mode(1) 100 kHz mode 0.5 4.0 — — μs μs 400 kHz mode 0.6 — μs 1 MHz mode(1) 0.5 — μs TF:SCL SDA and SCL 100 kHz mode — 300 ns Fall Time 300 ns 400 kHz mode 20 + 0.1 CB 1 MHz mode(1) — 100 ns TR:SCL SDA and SCL 100 kHz mode — 1000 ns Rise Time 300 ns 400 kHz mode 20 + 0.1 CB 1 MHz mode(1) — 300 ns TSU:DAT Data Input 100 kHz mode 250 — ns Setup Time 400 kHz mode 100 — ns 1 MHz mode(1) 100 — ns THD:DAT Data Input 100 kHz mode 0 — ns Hold Time 400 kHz mode 0 0.9 μs 1 MHz mode(1) 0 0.3 μs TSU:STA Start Condition 100 kHz mode 4.7 — μs Setup Time 400 kHz mode 0.6 — μs 0.25 — μs 1 MHz mode(1) THD:STA Start Condition 100 kHz mode 4.0 — μs Hold Time 400 kHz mode 0.6 — μs 0.25 — μs 1 MHz mode(1) 100 kHz mode 4.7 — μs TSU:STO Stop Condition Setup Time 400 kHz mode 0.6 — μs 1 MHz mode(1) 0.6 — μs THD:STO Stop Condition 100 kHz mode 4000 — ns Hold Time 400 kHz mode 600 — ns 1 MHz mode(1) 250 ns TAA:SCL Output Valid From 100 kHz mode 0 3500 ns Clock 400 kHz mode 0 1000 ns (1) 1 MHz mode 0 350 ns TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs (1) 0.5 — μs 1 MHz mode CB Bus Capacitive — 400 pF Loading 1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only). © 2005 Microchip Technology Inc. Preliminary Conditions Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz. — Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz — CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF — — Only relevant for repeated Start condition After this period the first clock pulse is generated — — — Time the bus must be free before a new transmission can start — DS70139C-page 181 dsPIC30F2011/2012/3012/3013 FIGURE 20-22: CXTX Pin (output) CAN MODULE I/O TIMING CHARACTERISTICS New Value Old Value CA10 CA11 CXRX Pin (input) CA20 TABLE 20-37: CAN MODULE I/O TIMING REQUIREMENTS AC CHARACTERISTICS Param No. Symbol Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Min Typ(2) Max Units Conditions — 10 25 ns — 10 25 TioF Port Output Fall Time CA11 TioR Port Output Rise Time — CA20 Tcwf Pulse Width to Trigger CAN Wakeup Filter 500 CA10 Note 1: 2: ns — ns — These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70139C-page 182 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 TABLE 20-38: 12-BIT A/D MODULE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Device Supply AD01 AVDD Module VDD Supply Greater of VDD - 0.3 or 2.7 — Lesser of VDD + 0.3 or 5.5 V — AD02 AVSS Module VSS Supply VSS - 0.3 — VSS + 0.3 V — Reference Inputs AD05 VREFH Reference Voltage High AVSS + 2.7 — AVDD V — AD06 VREFL Reference Voltage Low AVSS — AVDD - 2.7 V — AD07 VREF Absolute Reference Voltage AVSS - 0.3 — AVDD + 0.3 V — AD08 IREF Current Drain — 200 .001 300 3 μA μA A/D operating A/D off AD10 VINH-VINL Full-Scale Input Span VREFL VREFH V See Note AD11 VIN Absolute Input Voltage AVSS - 0.3 AVDD + 0.3 V AD12 — Leakage Current — ±0.001 ±0.610 μA VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V Source Impedance = 2.5 kΩ AD13 — Leakage Current — ±0.001 ±0.610 μA VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V Source Impedance = 2.5 kΩ AD15 RSS Switch Resistance — 3.2K — Ω AD16 CSAMPLE Sample Capacitor — 18 AD17 RIN Recommended Impedance of Analog Voltage Source — — AD20 Nr Resolution AD21 INL Integral Nonlinearity — ±0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD21A INL Integral Nonlinearity — ±0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD22 DNL Differential Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD22A DNL Differential Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD23 GERR Gain Error — ±1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD23A GERR Gain Error — ±1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V Analog Input 2.5K — — pF — Ω — DC Accuracy Note 1: 12 data bits bits The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 183 dsPIC30F2011/2012/3012/3013 TABLE 20-38: 12-BIT A/D MODULE SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. AD24 Symbol Characteristic Min. Typ Max. Units Conditions EOFF Offset Error — ±1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD24A EOFF Offset Error — ±1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD25 — Monotonicity(1) — — — — AD26 CMRR Common-Mode Rejection — TBD — dB — AD27 PSRR Power Supply Rejection Ratio — TBD — dB — AD28 CTLK Channel to Channel Crosstalk — TBD — dB — AD30 THD Total Harmonic Distortion — — — dB — AD31 SINAD Signal to Noise and Distortion — TBD — dB — AD32 SFDR Spurious Free Dynamic Range — TBD — dB — AD33 FNYQ Input Signal Bandwidth — — 50 kHz — AD34 ENOB Effective Number of Bits — TBD TBD bits — Guaranteed Dynamic Performance Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. DS70139C-page 184 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 FIGURE 20-23: 12-BIT A/D CONVERSION TIMING CHARACTERISTICS (ASAM = 0, SSRC = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP ch0_dischrg ch0_samp eoc AD61 AD60 TSAMP AD55 DONE ADIF ADRES(0) 1 2 3 4 5 6 7 8 9 1 - Software sets ADCON. SAMP to start sampling. 2 - Sampling starts after discharge period. TSAMP is described in the dsPIC30F Family Reference Manual, Section 18. 3 - Software clears ADCON. SAMP to start conversion. 4 - Sampling ends, conversion sequence starts. 5 - Convert bit 11. 6 - Convert bit 10. 7 - Convert bit 1. 8 - Convert bit 0. 9 - One TAD for end of conversion. © 2005 Microchip Technology Inc. Confidential DS70139C-page 185 dsPIC30F2011/2012/3012/3013 TABLE 20-39: 12-BIT A/D CONVERSION TIMING REQUIREMENTS Standard Operating Conditions: 2.7V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Clock Parameters AD50 TAD A/D Clock Period — 667 — ns VDD = 3-5.5V (Note 1) AD51 tRC A/D Internal RC Oscillator Period 1.2 1.5 1.8 μs — AD55 tCONV Conversion Time — 14 TAD — ns — AD56 FCNV Throughput Rate — — 100 ksps AD57 TSAMP Sampling Time — 1 TAD — ns AD60 tPCS Conversion Start from Sample Trigger AD61 tPSS AD62 AD63 Conversion Rate VDD = VREF = 5V VDD = 3-5.5V source resistance RS = 0-2.5 kΩ Timing Parameters Note 1: 2: — — TAD ns — Sample Start from Setting Sample (SAMP) Bit 0.5 TAD — 1.5 TAD ns — tCSS Conversion Completion to Sample Start (ASAM = 1) — — TBD ns — tDPU Time to Stabilize Analog Stage from A/D Off to A/D On — — TBD μs — Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. These parameters are characterized but not tested in manufacturing. DS70139C-page 186 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 21.0 PACKAGING INFORMATION 21.1 Package Marking Information 18-Lead PDIP Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 18-Lead SOIC dsPIC30F3012 30I/P e3 0510017 Example XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN dsPIC30F2011 30I/SO e3 0510017 28-Lead SPDIP Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: dsPIC30F2012 30I/SP e3 0510017 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard PICmicro device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 187 dsPIC30F2011/2012/3012/3013 21.2 Package Marking Information (Continued) 28-Lead SOIC (.300”) Example XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN dsPIC30F3013 30I/SO e3 0510017 28-Lead QFN Example XXXXXXX XXXXXXX 30F2011 30I/MM e3 YYWWNNN 0510017 44-Lead QFN Example dsPIC 30F3013 30I/ML e3 0510017 XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN DS70139C-page 188 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 18-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP) E1 D 2 n α 1 E A2 A L c A1 B1 β p B eB Units Dimension Limits n p MIN INCHES* NOM 18 .100 .155 .130 MAX MILLIMETERS NOM 18 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 22.61 22.80 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .890 .898 .905 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing § eB .310 .370 .430 α Mold Draft Angle Top 5 10 15 β Mold Draft Angle Bottom 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-007 © 2005 Microchip Technology Inc. Preliminary MAX 4.32 3.68 8.26 6.60 22.99 3.43 0.38 1.78 0.56 10.92 15 15 DS70139C-page 189 dsPIC30F2011/2012/3012/3013 18-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC) E p E1 D 2 B n 1 h α 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D h L φ c B α β MIN .093 .088 .004 .394 .291 .446 .010 .016 0 .009 .014 0 0 A1 INCHES* NOM 18 .050 .099 .091 .008 .407 .295 .454 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .462 .029 .050 8 .012 .020 15 15 MILLIMETERS NOM 18 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 11.33 11.53 0.25 0.50 0.41 0.84 0 4 0.23 0.27 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 11.73 0.74 1.27 8 0.30 0.51 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-051 DS70139C-page 190 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP) E1 D 2 n 1 α E A2 A L c β B1 A1 eB Units Number of Pins Pitch p B Dimension Limits n p INCHES* MIN NOM MILLIMETERS MAX MIN NOM 28 MAX 28 2.54 .100 Top to Seating Plane A .140 .150 .160 3.56 3.81 4.06 Molded Package Thickness A2 .125 .130 .135 3.18 3.30 3.43 8.26 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .310 .325 7.62 7.87 Molded Package Width E1 .275 .285 .295 6.99 7.24 7.49 Overall Length D 1.345 1.365 1.385 34.16 34.67 35.18 Tip to Seating Plane L c .125 .130 .135 3.18 3.30 3.43 .008 .012 .015 0.20 0.29 0.38 B1 .040 .053 .065 1.02 1.33 1.65 Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom § 0.38 B .016 .019 .022 0.41 0.48 0.56 eB α .320 .350 .430 8.13 8.89 10.92 β 5 10 15 5 10 15 5 10 15 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-095 Drawing No. C04-070 © 2005 Microchip Technology Inc. Preliminary DS70139C-page 191 dsPIC30F2011/2012/3012/3013 28-Lead Plastic Small Outline - Wide, 300 mil Body (SOIC) E E1 p D B 2 1 n h a 45 ° c A2 A f b L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Top Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D h L f c B a b A1 MIN .093 .088 .004 .394 .288 .695 .010 .016 0 .009 .014 0 0 INCHES NOM 28 .050 .099 .091 .008 .407 .295 .704 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .712 .029 .050 8 .013 .020 15 15 MILLIMETERS NOM 28 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.32 7.49 17.65 17.87 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 18.08 0.74 1.27 8 0.33 0.51 15 15 Drawing No. C04-052 DS70139C-page 192 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 28-Lead Plastic Quad Flat No Lead Package (ML) 6x6x0.9 mm Body (QFN-S) – With 0.40 mm Contact Length (Saw Singulated) E2 E EXPOSED METAL PAD e D D2 b 2 1 n OPTIONAL INDEX AREA TOP VIEW ALTERNATE INDEX INDICATORS L BOTTOM VIEW A1 A Number of Pins Pitch Overall Height Standoff Overall Width Exposed Pad Width Overall Length Exposed Pad Length Lead Width Lead Length Units Dimension Limits n e A A1 E E2 D D2 b L MIN .031 .000 .232 .169 .232 .169 .013 .012 INCHES NOM 28 .026 BSC .035 .001 .236 .175 .236 .175 .015 .016 MAX .039 .002 .240 .177 .240 .177 .017 .020 MILLIMETERS* NOM 28 0.65 BSC 0.90 0.80 0.02 0.00 6.00 5.90 4.30 4.45 5.90 6.00 4.30 4.45 0.33 0.38 0.30 0.40 MIN MAX 1.00 0.05 6.10 4.50 6.10 4.50 0.43 0.50 *Controlling Parameter Notes: JEDEC equivalent: MO-220 Drawing No. C04-124 © 2005 Microchip Technology Inc. Revised 05/24/04 Preliminary DS70139C-page 193 dsPIC30F2011/2012/3012/3013 44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN) DS70139C-page 194 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 INDEX Numerics 12-bit Analog-to-Digital Converter (A/D) Module .............. 109 A A/D .................................................................................... 109 Aborting a Conversion .............................................. 111 ADCHS Register ....................................................... 109 ADCON1 Register..................................................... 109 ADCON2 Register..................................................... 109 ADCON3 Register..................................................... 109 ADCSSL Register ..................................................... 109 ADPCFG Register..................................................... 109 Configuring Analog Port Pins.............................. 58, 113 Connection Considerations....................................... 113 Conversion Operation ............................................... 110 Effects of a Reset...................................................... 112 Operation During CPU Idle Mode ............................. 112 Operation During CPU Sleep Mode.......................... 112 Output Formats ......................................................... 112 Power-down Modes .................................................. 112 Programming the Sample Trigger............................. 111 Register Map............................................................. 115 Result Buffer ............................................................. 110 Sampling Requirements............................................ 111 Selecting the Conversion Clock ................................ 111 Selecting the Conversion Sequence......................... 110 AC Characteristics ............................................................ 157 Load Conditions ........................................................ 157 AC Temperature and Voltage Specifications .................... 157 Address Generator Units .................................................... 41 Alternate Vector Table ........................................................ 67 Analog-to-Digital Converter. See A/D. Assembler MPASM Assembler................................................... 139 Automatic Clock Stretch...................................................... 96 During 10-bit Addressing (STREN = 1)....................... 96 During 7-bit Addressing (STREN = 1)......................... 96 Receive Mode ............................................................. 96 Transmit Mode ............................................................ 96 B Bandgap Start-up Time Requirements............................................................ 165 Timing Characteristics .............................................. 164 Barrel Shifter ....................................................................... 25 Bit-Reversed Addressing .................................................... 44 Example ...................................................................... 45 Implementation ........................................................... 44 Modifier Values Table ................................................. 45 Sequence Table (16-Entry)......................................... 45 Block Diagrams 12-bit A/D Functional ................................................ 109 16-bit Timer1 Module .................................................. 71 16-bit Timer2............................................................... 77 16-bit Timer3............................................................... 77 32-bit Timer2/3............................................................ 76 DSP Engine ................................................................ 22 dsPIC30F2011 ............................................................ 10 dsPIC30F2012 ............................................................ 11 dsPIC30F3013 ............................................................ 13 External Power-on Reset Circuit............................... 125 I2C............................................................................... 94 Input Capture Mode .................................................... 81 © 2005 Microchip Technology Inc. Oscillator System...................................................... 119 Output Compare Mode ............................................... 85 Reset System ........................................................... 123 Shared Port Structure................................................. 57 SPI.............................................................................. 89 SPI Master/Slave Connection..................................... 90 UART Receiver......................................................... 102 UART Transmitter..................................................... 101 BOR Characteristics ......................................................... 156 BOR. See Brown-out Reset. Brown-out Reset Characteristics.......................................................... 155 Timing Requirements ............................................... 164 C C Compilers MPLAB C17.............................................................. 140 MPLAB C18.............................................................. 140 MPLAB C30.............................................................. 140 CAN Module I/O Timing Characteristics ........................................ 182 I/O Timing Requirements.......................................... 182 CLKOUT and I/O Timing Characteristics.......................................................... 162 Requirements ........................................................... 162 Code Examples Data EEPROM Block Erase ....................................... 54 Data EEPROM Block Write ........................................ 56 Data EEPROM Read.................................................. 53 Data EEPROM Word Erase ....................................... 54 Data EEPROM Word Write ........................................ 55 Erasing a Row of Program Memory ........................... 49 Initiating a Programming Sequence ........................... 50 Loading Write Latches ................................................ 50 Code Protection ................................................................ 117 Control Registers ................................................................ 48 NVMADR .................................................................... 48 NVMADRU ................................................................. 48 NVMCON.................................................................... 48 NVMKEY .................................................................... 48 Core Architecture Overview..................................................................... 17 CPU Architecture Overview ................................................ 17 Customer Change Notification Service............................. 201 Customer Notification Service .......................................... 201 Customer Support..................................................... 201, 202 D Data Accumulators and Adder/Subtractor .......................... 23 Data Space Write Saturation ...................................... 25 Overflow and Saturation ............................................. 23 Round Logic ............................................................... 24 Write Back .................................................................. 24 Data Address Space........................................................... 33 Alignment.................................................................... 36 Alignment (Figure) ...................................................... 36 Effect of Invalid Memory Accesses (Table) ................ 36 MCU and DSP (MAC Class) Instructions Example .... 35 Memory Map......................................................... 33, 34 Near Data Space ........................................................ 37 Software Stack ........................................................... 37 Spaces........................................................................ 36 Width .......................................................................... 36 Data EEPROM Memory...................................................... 53 Erasing ....................................................................... 54 Erasing, Block............................................................. 54 Preliminary DS70139C-page 195 dsPIC30F2011/2012/3012/3013 Erasing, Word ............................................................. 54 Protection Against Spurious Write .............................. 56 Reading....................................................................... 53 Write Verify ................................................................. 56 Writing ......................................................................... 55 Writing, Block .............................................................. 55 Writing, Word .............................................................. 55 DC Characteristics ............................................................ 145 BOR .......................................................................... 156 Brown-out Reset ....................................................... 155 I/O Pin Input Specifications ....................................... 153 I/O Pin Output Specifications .................................... 154 Idle Current (IIDLE) .................................................... 149 Low-Voltage Detect................................................... 154 LVDL ......................................................................... 155 Operating Current (IDD)............................................. 147 Power-Down Current (IPD) ........................................ 151 Program and EEPROM............................................. 156 Temperature and Voltage Specifications .................. 145 DCI Module Timing Characteristics AC-Link Mode ................................................... 172 Multichannel, I2S Modes ................................... 170 Timing Requirements AC-Link Mode ................................................... 172 Multichannel, I2S Modes ................................... 171 Demonstration Boards PICDEM 1 ................................................................. 142 PICDEM 17 ............................................................... 142 PICDEM 18R ............................................................ 143 PICDEM 2 Plus ......................................................... 142 PICDEM 3 ................................................................. 142 PICDEM 4 ................................................................. 142 PICDEM LIN ............................................................. 143 PICDEM USB............................................................ 143 PICDEM.net Internet/Ethernet .................................. 142 Development Support ....................................................... 139 Device Configuration Register Map............................................................. 130 Device Configuration Registers FBORPOR ................................................................ 128 FGS........................................................................... 128 FOSC ........................................................................ 128 FWDT........................................................................ 128 Device Overview ............................................................. 9, 17 Disabling the UART........................................................... 103 Divide Support..................................................................... 20 Instructions (Table) ..................................................... 20 DSP Engine......................................................................... 21 Multiplier...................................................................... 23 Dual Output Compare Match Mode .................................... 86 Continuous Pulse Mode .............................................. 86 Single Pulse Mode ...................................................... 86 E Electrical Characteristics AC ............................................................................. 157 DC ............................................................................. 145 Enabling and Setting Up UART Alternate I/O .............................................................. 103 Setting Up Data, Parity and Stop Bit Selections ....... 103 Enabling the UART ........................................................... 103 Equations A/D Conversion Clock ............................................... 111 Baud Rate ................................................................. 105 Serial Clock Rate ........................................................ 98 DS70139C-page 196 Errata .................................................................................... 7 Evaluation and Programming Tools.................................. 143 Exception Sequence Trap Sources .............................................................. 65 External Clock Timing Characteristics Type A, B and C Timer ............................................. 165 External Clock Timing Requirements ............................... 158 Type A Timer ............................................................ 166 Type B Timer ............................................................ 167 Type C Timer ............................................................ 167 External Interrupt Requests ................................................ 68 F Fast Context Saving ........................................................... 68 Flash Program Memory ...................................................... 47 I I/O Pin Specifications Input.......................................................................... 153 Output ....................................................................... 154 I/O Ports.............................................................................. 57 Parallel (PIO) .............................................................. 57 I2C 10-bit Slave Mode Operation........................................ 95 Reception ................................................................... 96 Transmission .............................................................. 96 I2C 7-bit Slave Mode Operation.......................................... 95 Reception ................................................................... 95 Transmission .............................................................. 95 I2C Master Mode Operation................................................ 97 Baud Rate Generator ................................................. 98 Clock Arbitration ......................................................... 98 Multi-Master Communication, Bus Collision and Bus Arbitration ............................................. 98 Reception ................................................................... 98 Transmission .............................................................. 97 I2C Master Mode Support ................................................... 97 I2C Module Addresses................................................................... 95 Bus Data Timing Characteristics Master Mode..................................................... 178 Slave Mode....................................................... 180 Bus Data Timing Requirements Master Mode..................................................... 179 Slave Mode....................................................... 181 Bus Start/Stop Bits Timing Characteristics Master Mode..................................................... 178 Slave Mode....................................................... 180 General Call Address Support .................................... 97 Interrupts .................................................................... 97 IPMI Support............................................................... 97 Operating Function Description .................................. 93 Operation During CPU Sleep and Idle Modes ............ 98 Pin Configuration ........................................................ 93 Programmer’s Model .................................................. 93 Register Map .............................................................. 99 Registers .................................................................... 93 Slope Control .............................................................. 97 Software Controlled Clock Stretching (STREN = 1) ... 96 Various Modes............................................................ 93 Idle Current (IIDLE) ............................................................ 149 In-Circuit Serial Programming (ICSP)......................... 47, 117 Input Capture (CAPX) Timing Characteristics .................. 168 Input Capture Module ......................................................... 81 Interrupts .................................................................... 82 Register Map .............................................................. 83 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 Input Capture Operation During Sleep and Idle Modes ...... 82 CPU Idle Mode............................................................ 82 CPU Sleep Mode ........................................................ 82 Input Capture Timing Requirements ................................. 168 Input Change Notification Module ....................................... 61 dsPIC30F2012/3013 Register Map (Bits 7-0) ............. 61 Instruction Addressing Modes............................................. 41 File Register Instructions ............................................ 41 Fundamental Modes Supported.................................. 41 MAC Instructions......................................................... 42 MCU Instructions ........................................................ 41 Move and Accumulator Instructions............................ 42 Other Instructions........................................................ 42 Instruction Set Overview ................................................................... 134 Summary................................................................... 131 Internal Clock Timing Examples ....................................... 159 Internet Address................................................................ 201 Interrupt Controller Register Map......................................................... 69, 70 Interrupt Priority .................................................................. 64 Traps........................................................................... 65 Interrupt Sequence ............................................................. 67 Interrupt Stack Frame ................................................. 67 Interrupts ............................................................................. 63 L Load Conditions ................................................................ 157 Low Voltage Detect (LVD) ................................................ 127 Low-Voltage Detect Characteristics .................................. 154 LVDL Characteristics ........................................................ 155 M Memory Organization.......................................................... 27 Core Register Map...................................................... 37 Microchip Internet Web Site .............................................. 201 Modulo Addressing ............................................................. 42 Applicability ................................................................. 44 Incrementing Buffer Operation Example..................... 43 Start and End Address................................................ 43 W Address Register Selection .................................... 43 MPLAB ASM30 Assembler, Linker, Librarian ................... 140 MPLAB ICD 2 In-Circuit Debugger ................................... 141 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator .................................................... 141 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator .................................................... 141 MPLAB Integrated Development Environment Software.................................................................... 139 MPLINK Object Linker/MPLIB Object Librarian ................ 140 N NVM Register Map............................................................... 51 O OC/PWM Module Timing Characteristics.......................... 169 Operating Current (IDD)..................................................... 147 Operating Frequency vs Voltage dsPIC30FXXXX-20 (Extended)................................. 145 Oscillator Configurations........................................................... 120 Fail-Safe Clock Monitor .................................... 122 Fast RC (FRC) .................................................. 121 Initial Clock Source Selection ........................... 120 Low Power RC (LPRC) ..................................... 121 © 2005 Microchip Technology Inc. LP Oscillator Control......................................... 121 Phase Locked Loop (PLL) ................................ 121 Start-up Timer (OST)........................................ 120 Operating Modes (Table).......................................... 118 System Overview...................................................... 117 Oscillator Selection ........................................................... 117 Oscillator Start-up Timer Timing Characteristics .............................................. 163 Timing Requirements ............................................... 164 Output Compare Interrupts ................................................. 87 Output Compare Module .................................................... 85 Register Map .............................................................. 88 Timing Characteristics .............................................. 168 Timing Requirements ............................................... 168 Output Compare Operation During CPU Idle Mode ........... 87 Output Compare Sleep Mode Operation ............................ 87 P Packaging Information ...................................................... 187 Marking............................................................. 187, 188 Peripheral Module Disable (PMD) Registers .................... 129 PICkit 1 Flash Starter Kit .................................................. 143 PICSTART Plus Development Programmer..................... 141 Pinout Descriptions............................................................. 14 PLL Clock Timing Specifications ...................................... 159 POR. See Power-on Reset. Port Write/Read Example ................................................... 58 PORTB Register Map for dsPIC30F2011/3012 ....................... 59 Register Map for dsPIC30F2012/3013 ....................... 59 PORTC Register Map for dsPIC30F2011/2012/3012/3013 ..... 59 PORTD Register Map for dsPIC30F2011/3012 ....................... 59 Register Map for dsPIC30F2012/3013 ....................... 60 PORTF Register Map for dsPIC30F2012/3013 ....................... 60 Power Saving Modes........................................................ 127 Idle............................................................................ 128 Sleep ........................................................................ 127 Sleep and Idle........................................................... 117 Power-Down Current (IPD)................................................ 151 Power-up Timer Timing Characteristics .............................................. 163 Timing Requirements ............................................... 164 PRO MATE II Universal Device Programmer ................... 141 Program Address Space..................................................... 27 Construction ............................................................... 29 Data Access from Program Memory Using Program Space Visibility..................................... 31 Data Access From Program Memory Using Table Instructions ............................................... 30 Data Access from, Address Generation ..................... 29 Data Space Window into Operation ........................... 32 Data Table Access (LS Word) .................................... 30 Data Table Access (MS Byte) .................................... 31 Memory Map............................................................... 28 Table Instructions TBLRDH ............................................................. 30 TBLRDL.............................................................. 30 TBLWTH............................................................. 30 TBLWTL ............................................................. 30 Program and EEPROM Characteristics............................ 156 Program Counter ................................................................ 18 Programmable .................................................................. 117 Preliminary DS70139C-page 197 dsPIC30F2011/2012/3012/3013 Programmer’s Model........................................................... 18 Diagram ...................................................................... 19 Programming Operations .................................................... 49 Algorithm for Program Flash ....................................... 49 Erasing a Row of Program Memory ............................ 49 Initiating the Programming Sequence ......................... 50 Loading Write Latches ................................................ 50 Protection Against Accidental Writes to OSCCON ........... 122 Status Bits, Their Significance and the Initialization Condition for RCON Register, Case 1 ...................... 126 Status Bits, Their Significance and the Initialization Condition for RCON Register, Case 2 ...................... 126 Status Register ................................................................... 18 Symbols Used in Opcode Descriptions ............................ 132 System Integration Register Map ............................................................ 130 R T Reset......................................................................... 117, 123 BOR, Programmable................................................. 125 Brown-out Reset (BOR) ............................................ 117 Oscillator Start-up Timer (OST) ................................ 117 POR Operating without FSCM and PWRT ................ 125 With Long Crystal Start-up Time....................... 125 POR (Power-on Reset) ............................................. 123 Power-on Reset (POR) ............................................. 117 Power-up Timer (PWRT) .......................................... 117 Reset Sequence.................................................................. 65 Reset Sources ............................................................ 65 Reset Sources Brown-out Reset (BOR) .............................................. 65 Illegal Instruction Trap................................................. 65 Trap Lockout ............................................................... 65 Uninitialized W Register Trap ..................................... 65 Watchdog Time-out..................................................... 65 Reset Timing Characteristics ............................................ 163 Reset Timing Requirements.............................................. 164 Run-Time Self-Programming (RTSP) ................................. 47 Table Instruction Operation Summary ................................ 47 Temperature and Voltage Specifications AC............................................................................. 157 DC ............................................................................ 145 Timer 2/3 Module................................................................ 75 Timer1 Module.................................................................... 71 16-bit Asynchronous Counter Mode ........................... 71 16-bit Synchronous Counter Mode ............................. 71 16-bit Timer Mode....................................................... 71 Gate Operation ........................................................... 72 Interrupt ...................................................................... 72 Operation During Sleep Mode .................................... 72 Prescaler .................................................................... 72 Real-Time Clock ......................................................... 72 Interrupts ............................................................ 73 Oscillator Operation............................................ 73 Register Map .............................................................. 74 Timer2 and Timer3 Selection Mode.................................... 86 Timer2/3 Module 16-bit Timer Mode....................................................... 75 32-bit Synchronous Counter Mode ............................. 75 32-bit Timer Mode....................................................... 75 ADC Event Trigger...................................................... 78 Gate Operation ........................................................... 78 Interrupt ...................................................................... 78 Operation During Sleep Mode .................................... 78 Register Map .............................................................. 79 Timer Prescaler .......................................................... 78 Timing Characteristics A/D Conversion Low-speed (ASAM = 0, SSRC = 000) .............. 185 Bandgap Start-up Time............................................. 164 CAN Module I/O........................................................ 182 CLKOUT and I/O ...................................................... 162 DCI Module AC-Link Mode................................................... 172 Multichannel, I2S Modes................................... 170 External Clock........................................................... 157 I2C Bus Data Master Mode..................................................... 178 Slave Mode....................................................... 180 I2C Bus Start/Stop Bits Master Mode..................................................... 178 Slave Mode....................................................... 180 Input Capture (CAPX)............................................... 168 OC/PWM Module...................................................... 169 Oscillator Start-up Timer........................................... 163 Output Compare Module .......................................... 168 Power-up Timer ........................................................ 163 Reset ........................................................................ 163 SPI Module Master Mode (CKE = 0).................................... 173 Master Mode (CKE = 1).................................... 174 Slave Mode (CKE = 0)...................................... 175 Slave Mode (CKE = 1)...................................... 176 S Simple Capture Event Mode ............................................... 81 Buffer Operation.......................................................... 82 Hall Sensor Mode ....................................................... 82 Prescaler ..................................................................... 81 Timer2 and Timer3 Selection Mode ............................ 82 Simple OC/PWM Mode Timing Requirements.................. 169 Simple Output Compare Match Mode................................. 86 Simple PWM Mode ............................................................. 86 Input Pin Fault Protection............................................ 86 Period.......................................................................... 87 Software Simulator (MPLAB SIM)..................................... 140 Software Simulator (MPLAB SIM30)................................. 140 Software Stack Pointer, Frame Pointer............................... 18 CALL Stack Frame...................................................... 37 SPI Module.......................................................................... 89 Framed SPI Support ................................................... 90 Operating Function Description .................................. 89 Operation During CPU Idle Mode ............................... 91 Operation During CPU Sleep Mode ............................ 91 SDOx Disable ............................................................. 90 Slave Select Synchronization ..................................... 91 SPI1 Register Map ...................................................... 92 Timing Characteristics Master Mode (CKE = 0) .................................... 173 Master Mode (CKE = 1) .................................... 174 Slave Mode (CKE = 1) .............................. 175, 176 Timing Requirements Master Mode (CKE = 0) .................................... 173 Master Mode (CKE = 1) .................................... 174 Slave Mode (CKE = 0) ...................................... 175 Slave Mode (CKE = 1) ...................................... 177 Word and Byte Communication .................................. 90 DS70139C-page 198 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 Type A, B and C Timer External Clock ..................... 165 Watchdog Timer........................................................ 163 Timing Diagrams PWM Output ............................................................... 87 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 1...................... 124 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 2...................... 124 Time-out Sequence on Power-up (MCLR Tied to VDD).......................................... 124 Timing Diagrams and Specifications DC Characteristics - Internal RC Accuracy............... 159 Timing Diagrams.See Timing Characteristics Timing Requirements A/D Conversion Low-speed ........................................................ 186 Bandgap Start-up Time............................................. 165 Brown-out Reset ....................................................... 164 CAN Module I/O........................................................ 182 CLKOUT and I/O....................................................... 162 DCI Module AC-Link Mode ................................................... 172 Multichannel, I2S Modes ................................... 171 External Clock........................................................... 158 I2C Bus Data (Master Mode)..................................... 179 I2C Bus Data (Slave Mode)....................................... 181 Input Capture ............................................................ 168 Oscillator Start-up Timer ........................................... 164 Output Compare Module........................................... 168 Power-up Timer ........................................................ 164 Reset......................................................................... 164 Simple OC/PWM Mode............................................. 169 SPI Module Master Mode (CKE = 0) .................................... 173 Master Mode (CKE = 1) .................................... 174 Slave Mode (CKE = 0) ...................................... 175 Slave Mode (CKE = 1) ...................................... 177 Type A Timer External Clock .................................... 166 Type B Timer External Clock .................................... 167 Type C Timer External Clock .................................... 167 Watchdog Timer........................................................ 164 Timing Specifications PLL Clock.................................................................. 159 Trap Vectors ....................................................................... 67 © 2005 Microchip Technology Inc. U UART Module Address Detect Mode ............................................... 105 Auto Baud Support ................................................... 106 Baud Rate Generator ............................................... 105 Enabling and Setting Up........................................... 103 Framing Error (FERR) .............................................. 105 Idle Status................................................................. 105 Loopback Mode ........................................................ 105 Operation During CPU Sleep and Idle Modes.......... 106 Overview................................................................... 101 Parity Error (PERR) .................................................. 105 Receive Break .......................................................... 105 Receive Buffer (UxRXB)........................................... 104 Receive Buffer Overrun Error (OERR Bit) ................ 104 Receive Interrupt ...................................................... 104 Receiving Data ......................................................... 104 Receiving in 8-bit or 9-bit Data Mode ....................... 104 Reception Error Handling ......................................... 104 Transmit Break ......................................................... 104 Transmit Buffer (UxTXB) .......................................... 103 Transmit Interrupt ..................................................... 104 Transmitting Data ..................................................... 103 Transmitting in 8-bit Data Mode ............................... 103 Transmitting in 9-bit Data Mode ............................... 103 UART1 Register Map ............................................... 107 UART2 Register Map ............................................... 107 UART Operation Idle Mode.................................................................. 106 Sleep Mode .............................................................. 106 Unit ID Locations .............................................................. 117 Universal Asynchronous Receiver Transmitter (UART) Module......................................................... 101 W Wake-up from Sleep ......................................................... 117 Wake-up from Sleep and Idle ............................................. 68 Watchdog Timer Timing Characteristics .............................................. 163 Timing Requirements ............................................... 164 Watchdog Timer (WDT)............................................ 117, 127 Enabling and Disabling............................................. 127 Operation.................................................................. 127 WWW Address ................................................................. 201 WWW, On-Line Support ....................................................... 7 Preliminary DS70139C-page 199 dsPIC30F2011/2012/3012/3013 NOTES: DS70139C-page 200 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com In addition, there is a Development Systems Information Line which lists the latest versions of Microchip’s development systems software products. This line also provides information on how customers can receive currently available upgrade kits. The Development numbers are: Systems Information Line 1-800-755-2345 – United States and most of Canada 1-480-792-7302 – Other International Locations To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2005 Microchip Technology Inc. Preliminary DS70139C-page 201 dsPIC30F2011/2012/3012/3013 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: dsPIC30F2011/2012/3012/3013 Literature Number: DS70139C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70139C-page 202 Preliminary © 2005 Microchip Technology Inc. dsPIC30F2011/2012/3012/3013 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. d s P I C 3 0 F 3 0 1 3 AT - 3 0 I / S P - E S Custom ID (3 digits) or Engineering Sample (ES) Trademark Architecture Package P = DIP SO = SOIC SP = SPDIP ML = QFN (8x8) Flash Memory Size in Bytes 0 = ROMless 1 = 1K to 6K 2 = 7K to 12K 3 = 13K to 24K 4 = 25K to 48K 5 = 49K to 96K 6 = 97K to 192K 7 = 193K to 384K 8 = 385K to 768K 9 = 769K and Up Temperature I = Industrial -40°C to +85°C E = Extended High Temp -40°C to +125°C Speed 20 = 20 MIPS 30 = 30 MIPS Device ID T = Tape and Reel A,B,C… = Revision Level Example: dsPIC30F3013AT-30I/SP = 30 MIPS, Industrial temp., SPDIP package, Rev. A © 2005 Microchip Technology Inc. Preliminary DS70139C-page 203 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westford, MA Tel: 978-692-3848 Fax: 978-692-3821 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 10/20/04 DS70139C-page 204 Preliminary © 2005 Microchip Technology Inc. M 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 CPU Architecture Overview........................................................................................................................................................ 17 3.0 Memory Organization ................................................................................................................................................................. 27 4.0 Address Generator Units............................................................................................................................................................ 41 5.0 Flash Program Memory.............................................................................................................................................................. 47 6.0 Data EEPROM Memory ............................................................................................................................................................. 53 7.0 I/O Ports ..................................................................................................................................................................................... 57 8.0 Interrupts .................................................................................................................................................................................... 63 9.0 Timer1 Module ........................................................................................................................................................................... 71 10.0 Timer2/3 Module ........................................................................................................................................................................ 75 11.0 Input Capture Module................................................................................................................................................................. 81 12.0 Output Compare Module ............................................................................................................................................................ 85 13.0 SPI Module................................................................................................................................................................................. 89 14.0 I2C Module ................................................................................................................................................................................. 93 15.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 101 16.0 12-bit Analog-to-Digital Converter (A/D) Module...................................................................................................................... 109 17.0 System Integration ................................................................................................................................................................... 117 18.0 Instruction Set Summary .......................................................................................................................................................... 131 19.0 Development Support............................................................................................................................................................... 139 20.0 Electrical Characteristics .......................................................................................................................................................... 145 21.0 Packaging Information.............................................................................................................................................................. 187 Index .................................................................................................................................................................................................. 195 The Microchip Web Site ..................................................................................................................................................................... 201 Customer Change Notification Service .............................................................................................................................................. 201 Customer Support .............................................................................................................................................................................. 201 Reader Response .............................................................................................................................................................................. 202 Product Identification System ............................................................................................................................................................ 203 © 2004 Microchip Technology Inc. DS70139B-page 1