TI1 DAC3171IRGCT Single 14-/12-/10-bit 500 msps digital-to-analog converter Datasheet

DAC3151
DAC3161
DAC3171
www.ti.com
SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
Single 14-/12-/10-Bit 500 MSPS Digital-to-Analog Converters
Check for Samples: DAC3151, DAC3161, DAC3171
FEATURES
APPLICATIONS
•
•
•
1
2
•
•
•
•
•
•
•
•
•
Single Channel
Resolution
– DAC3151: 10-Bit
– DAC3161: 12-Bit
– DAC3171: 14-Bit
Maximum Sample Rate: 500 MSPS
Pin-Compatible Family
Input Interface:
– Parallel LVDS Inputs
– Single or Dual DDR Data Clock
– Internal FIFO
Chip to Chip Synchronization
Power Dissipation: 375mW
Spectral Performance at 20 MHz IF
– SNR: 76 dBFS for DAC3171; 72dBFS for
DAC3161; 62 dBFS for DAC3151
– SFDR: 78 dBc for DAC3171; 77dBc for
DAC3161; 76 dBc for DAC3151
Current Sourcing DACs
Compliance Range: -0.5V to 1V
Package: 64 Pin QFN (9x9mm)
•
•
•
•
Wireless Infrastructure
– PA Bias, Envelope Tracking, TX
Radar
Software-Defined Radio
Signal/Waveform Generators
Cable Head-End Equipment
DESCRIPTION
The DAC3151/DAC3161/DAC3171 is a family of
single channel 500MSPS digital-to-analog converters
with resolutions of 10-/12-/14-bits. The family uses a
10-/12-/14-bit wide LVDS digital bus with an input
FIFO. The 14-bit DAC3171 also supports a DDR 7-bit
LVDS interface mode. FIFO input and output pointers
can be synchronized across multiple devices for
precise signal synchronization. The DAC outputs are
current sourcing and terminate to GND with a
compliance
range
of
-0.5
to
1V.
DAC3151/DAC3161/DAC3171 is pin compatible with
the dual-channel, 10-/12-/14-bit, 500MSPS digital-toanalog converter DAC3154/DAC3164/DAC3174.
The device is available in a QFN-64 PowerPAD™
package is specified over the full industrial
temperature range (–40°C to 85°C).
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
DAC3151
DAC3161
DAC3171
SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
VDDA18
VFUSE
DIGVDD18
CLKVDD18
BLOCK DIAGRAMS
DACCLKP
Clock Distribution
LVPECL
1.2 V
Reference
DACCLKN
DATACLKN
Programmable
Delay
LVDS
100
DATA9P
BIASJ
LVDS
100
DATACLKP
EXTIO
DATA9N
DACA
Gain
10
IOUTAP
10-b
DACA
8 Sample FIFO
De-interleave
Pattern Test
QMC
A-offset
IOUTAN
10
100
DATA0P
LVDS
DATA0N
LVDS
VDDA33
100
SYNCP
SYNCN
Optional Input
Used for multi-DAC sync
ALIGNP
Control Interface
LVPECL
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
IOVDD
GND
ALIGNN
Figure 1. DAC3151 Full Word Interface Mode
2
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DAC3151
DAC3161
DAC3171
VFUSE
DIGVDD18
VDDA18
SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
CLKVDD18
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DACCLKP
Clock Distribution
LVPECL
1.2 V
Reference
DACCLKN
DATACLKN
Programmable
Delay
LVDS
100
DATA11P
BIASJ
LVDS
100
DATACLKP
EXTIO
DATA11N
DACA
Gain
12
IOUTAP
12-b
DACA
8 Sample FIFO
De-interleave
Pattern Test
QMC
A-offset
IOUTAN
12
100
DATA0P
LVDS
DATA0N
LVDS
VDDA33
100
SYNCP
SYNCN
Optional Input
Used for multi-DAC sync
ALIGNP
Control Interface
LVPECL
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
IOVDD
GND
ALIGNN
Figure 2. DAC3161 Full Word Interface Mode
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DAC3151
DAC3161
DAC3171
VFUSE
DIGVDD18
VDDA18
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CLKVDD18
SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
DACCLKP
Clock Distribution
LVPECL
1.2 V
Reference
DACCLKN
DATACLKN
Programmable
Delay
LVDS
100
DATA13P
BIASJ
LVDS
100
DATACLKP
EXTIO
DATA13N
DACA
Gain
14
IOUTAP
14-b
DACA
8 Sample FIFO
De-interleave
Pattern Test
QMC
A-offset
IOUTAN
14
100
DATA0P
LVDS
DATA0N
LVDS
VDDA33
100
SYNCP
SYNCN
Optional Input
Used for multi-DAC sync
ALIGNP
Control Interface
LVPECL
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
IOVDD
GND
ALIGNN
Figure 3. DAC3171 Full Word Interface Mode
4
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DAC3161
DAC3171
VFUSE
DIGVDD18
VDDA18
SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
CLKVDD18
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DACCLKP
Clock Distribution
LVPECL
1.2 V
Reference
DACCLKN
DA_CLKN
Programmable
Delay
DACA
Gain
LVDS
100
DA6P
QMC
A-offset
8 Sample FIFO
Pattern Test
De-interleave
DA6N
7
IOUTA1
14-b
DACA
IOUTA2
LVDS
100
DA0P
BIASJ
LVDS
100
DA_CLKP
EXTIO
DA0N
VDDA33
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
IOVDD
GND
Control Interface
Figure 4. DAC3171 7-bit Interface Mode
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DAC3151
DAC3161
DAC3171
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VDDA18
NC
NC
IOUTAP
IOUTAN
VDDA33
EXTIO
BIASJ
VDDA33
VDDA33
NC
NC
NC
NC
VDDA18
SLEEP
PINOUT – DAC3151
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DACCLKP
1
48
TXENABLE
DACCLKN
2
47
ALARM
CLKVDD18
3
46
SDO
ALIGNP
4
45
IOVDD
ALIGNN
5
44
SDIO
SYNCP
6
43
SCLK
SYNCN
7
42
SDENB
VFUSE
8
41
RESETB
(MSB) D9P
9
40
NC
D9N
10
39
NC
D8P
11
38
NC
D8N
12
37
NC
D7P
13
36
NC
D7N
14
35
NC
34
NC
33
NC
26
DATACLKP
DATACLKN
D2P
27
28
29
30
31
32
D0N
25
(LSB) D0P
24
D1N
23
D1P
22
DIGVDD18
21
D2N
20
D3N
19
D3P
18
DIGVDD18
17
D4N
16
D4P
D6N
D5N
15
GND PAD (backside)
D5P
D6P
DAC3151
PIN ASSIGNMENT TABLE – DAC3151
PIN
NAME
NO.
I/O
DESCRIPTION
CONTROL/SERIAL
SCLK
43
SDENB
42
SDIO
44
I/O Bi-directional serial data in 3 pin mode (default). In 4-pin interface mode (register sif4_ena (config 0, bit
9)), the SDIO pin in an input only. Internal Pull-down.
SDO
46
O
Uni-directional serial interface data in 4 pin mode (register sif4_ena (config 0, bit 9)). The SDO pin is tristated in 3-pin interface mode (default). Internal Pulldown.
RESETB
41
I
Serial interface reset input. Active low. Initialized internal registers during high to low transition.
Assynchronous. Internal pull-up.
ALARM
47
O
CMOS output for ALARM condition.
TXENABLE
48
I
Transmit enable active high input. TXENABLE must be high for the DATA to the DAC to be enabled.
When TXENABLE is low, the digital logic section is forced to all 0, and any input data is ignored. Internal
pull-down.
SLEEP
49
I
Puts device in sleep, active high. Internal pull-down.
6
I
Serial interface clock. Internal pull-down.
I
Serial interface clock. Internal pull-up.
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DAC3161
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SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
PIN ASSIGNMENT TABLE – DAC3151 (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
I
LVDS input data bits for both channels. Each positive/negative LVDS pair has an internal 100 Ω
termination resistor. Data format relative to DATACLKP/N clock is Double Data Rate (DDR) with two data
transfers per DATACKP/N clock cycle.
DATA INTERFACE
DATA[9:0]P/N
9/1019/20
22/23
26/27,
29/30,
31/32
The data format is interleaved with channel A (rising edge) and channel B falling edge.
In the default mode (reverse bus not enabled):
DATA13P/N is most significant data bit (MSB)
DATA0P/N is most significant data bit (LSB)
DATACLKP/N
24/25
I
DDR differential input data clock. Edge to center nominal timing. Ch A rising edge, Ch B falling edge in
multiplexed output mode.
SYNCP/N
6/7
I
Reset the FIFO or to be used as a syncing source. These two functions are captured with the rising edge
of DATACLKP/N. The signal captured by the falling edge of DATACLKP/N.
ALIGNP/N
4/5
I
LVPECL FIFO output syncrhonization. This positive/negative pair is captured with the rising edge of
DACCLKP/N. It is used to reset the clock dividers and for multiple DAC synchronization. If unused it can
be left unconnected.
1/2
I
LVPECL clock input for DAC core with a self-bias of approximately CLKVDD18/2.
61/60
O
A-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a full
scale current source and the most positive voltage on the IOUTAP pin. Similarly, a 0xFFFF data input
results in a 0 mA current source and the least positive voltage on the IOUTAP pin.
OUTPUT/CLOCK
DACCLKP/N
IOUTAP/N
REFERENCE
EXTIO
58
I/O Used as external reference input when internal reference is disabled. Requires a 0.1 µF decoupling
capacitor to GND when used as reference output.
BIASJ
57
O
Full-scale output current bias. For 20 mA full-scale output current, connect a 960 Ω resistor to GND.
IOVDD
45
I
Supply voltage for CMOS IO’s. 1.8V – 3.3V.
CLKVDD18
3
I
1.8V clock supply
DIGVDD18
21, 28
I
1.8V digital supply. Also supplies LVDS receivers.
VDDA18
50, 64
I
Analog 1.8V supply
VDDA33
55, 56,
59
I
Analog 3.3V supply
VFUSE
8
I
Digital supply voltage. (1.8V) This supply pin is also used for factory fuse programming. Connect to
DVDD pins for normal operation.
POWER SUPPLY
NC
33/3439/40,
51, 52,
53, 54
62, 63
Not Used. These pins can be left open or tied to GROUND in actual application use. It is recommended
to turn off pin 33-40 (register lvdsdata_ena) to save power.
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VDDA18
NC
NC
IOUTAP
IOUTAN
VDDA33
EXTIO
BIASJ
VDDA33
VDDA33
NC
NC
NC
NC
VDDA18
SLEEP
PINOUT – DAC3161
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DACCLKP
1
48
TXENABLE
DACCLKN
2
47
ALARM
CLKVDD18
3
46
SDO
ALIGNP
4
45
IOVDD
ALIGNN
5
44
SDIO
SYNCP
6
43
SCLK
SYNCN
7
42
SDENB
VFUSE
8
41
RESETB
(MSB) D11P
9
40
NC
D11N
10
39
NC
D10P
11
38
NC
D10N
12
37
NC
D9P
13
36
D0N
D9N
14
35
D0P (LSB)
34
D1N
33
D1P
26
DATACLKP
DATACLKN
D4P
27
28
29
30
31
32
D2N
25
D2P
24
D3N
23
D3P
22
DIGVDD18
21
D4N
20
D5N
19
D5P
18
DIGVDD18
17
D6N
16
D6P
D8N
D7N
15
GND PAD (backside)
D7P
D8P
DAC3161
PIN ASSIGNMENT TABLE – DAC3161
PIN
NAME
NO.
I/O
DESCRIPTION
CONTROL/SERIAL
SCLK
43
SDENB
42
SDIO
44
I/O Bi-directional serial data in 3 pin mode (default). In 4-pin interface mode (register sif4_ena (config 0, bit
9)), the SDIO pin in an input only. Internal Pull-down.
SDO
46
O
Uni-directional serial interface data in 4 pin mode (register sif4_ena (config 0, bit 9)). The SDO pin is tristated in 3-pin interface mode (default). Internal Pulldown.
RESETB
41
I
Serial interface reset input. Active low. Initialized internal registers during high to low transition.
Assynchronous. Internal pull-up.
ALARM
47
O
CMOS output for ALARM condition.
TXENABLE
48
I
Transmit enable active high input. TXENABLE must be high for the DATA to the DAC to be enabled.
When TXENABLE is low, the digital logic section is forced to all 0, and any input data is ignored. Internal
pull-down.
SLEEP
49
I
Puts device in sleep, active high. Internal pull-down.
8
I
Serial interface clock. Internal pull-down.
I
Serial interface clock. Internal pull-up.
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DAC3161
DAC3171
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SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
PIN ASSIGNMENT TABLE – DAC3161 (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
I
LVDS input data bits for both channels. Each positive/negative LVDS pair has an internal 100 Ω
termination resistor. Data format relative to DATACLKP/N clock is Double Data Rate (DDR) with two data
transfers per DATACKP/N clock cycle.
DATA INTERFACE
DATA[11:0]P/N
9/1019/20
22/23
26/27,
29/3035/36
The data format is interleaved with channel A (rising edge) and channel B falling edge.
In the default mode (reverse bus not enabled):
DATA13P/N is most significant data bit (MSB)
DATA0P/N is most significant data bit (LSB)
DATACLKP/N
24/25
I
DDR differential input data clock. Edge to center nominal timing. Ch A rising edge, Ch B falling edge in
multiplexed output mode.
SYNCP/N
6/7
I
Reset the FIFO or to be used as a syncing source. These two functions are captured with the rising edge
of DATACLKP/N. The signal captured by the falling edge of DATACLKP/N.
ALIGNP/N
4/5
I
LVPECL FIFO output syncrhonization. This positive/negative pair is captured with the rising edge of
DACCLKP/N. It is used to reset the clock dividers and for multiple DAC synchronization. If unused it can
be left unconnected.
1/2
I
LVPECL clock input for DAC core with a self-bias of approximately CLKVDD18/2.
61/60
O
A-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a full
scale current source and the most positive voltage on the IOUTAP pin. Similarly, a 0xFFFF data input
results in a 0 mA current source and the least positive voltage on the IOUTAP pin.
OUTPUT/CLOCK
DACCLKP/N
IOUTAP/N
REFERENCE
EXTIO
58
I/O Used as external reference input when internal reference is disabled. Requires a 0.1 µF decoupling
capacitor to GND when used as reference output.
BIASJ
57
O
Full-scale output current bias. For 20 mA full-scale output current, connect a 960 Ω resistor to GND.
IOVDD
45
I
Supply voltage for CMOS IO’s. 1.8V – 3.3V.
CLKVDD18
3
I
1.8V clock supply
DIGVDD18
21, 28
I
1.8V digital supply. Also supplies LVDS receivers.
VDDA18
50, 64
I
Analog 1.8V supply
VDDA33
55, 56,
59
I
Analog 3.3V supply
VFUSE
8
I
Digital supply voltage. (1.8V) This supply pin is also used for factory fuse programming. Connect to
DVDD pins for normal operation.
POWER SUPPLY
NC
37, 38,
39, 40,
51, 52,
53, 54,
62, 63
Not Used. These pins can be left open or tied to GROUND in actual application use. It is recommended
to turn off pin 37-40 (register lvdsdata_ena) to save power.
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VDDA18
NC
NC
IOUTAP
IOUTAP
VDDA33
EXTIO
BIASJ
VDDA33
VDDA33
NC
NC
NC
NC
VDDA18
SLEEP
PIN OUT – DAC3171 7-BIT INTERFACE MODE
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DACCLKP
1
48
TXENABLE
DACCLKN
2
47
ALARM
CLKVDD18
3
46
SDO
NC
4
45
IOVDD
NC
5
44
SDIO
DA_CLKP
6
43
SCLK
DA_CLKN
7
42
SDENB
VFUSE
8
41
RESETB
(MSB) DA6P
9
40
NC
DA6N
10
39
NC
DA5P
11
38
NC
DA5N
12
37
NC
DA4P
13
36
NC
DA4N
14
35
NC
34
NC
33
NC
23
24
25
26
DIGVDD18
(LSB) DA0P
DA0N
NC
NC
NC
27
28
29
30
31
32
NC
22
NC
21
NC
20
NC
19
DIGVDD18
18
NC
17
DA1N
16
DA1P
DA3N
DA2N
15
GND PAD (backside)
DA2P
DA3P
DAC3171
PIN ASSIGNMENT TABLE – DAC3171 7-BIT INTERFACE MODE
PIN
NAME
NO.
I/O
DESCRIPTION
CONTROL/SERIAL
SCLK
43
SDENB
42
SDIO
44
I/O Bi-directional serial data in 3 pin mode (default). In 4-pin interface mode (register XYZ), the SDIO pin
in an input only. Internal Pull-down.
SDO
46
O
Uni-directional serial interface data in 4 pin mode (register XYZ). The SDO pin is tri-stated in 3-pin
interface mode (default). Internal Pulldown.
RESETB
41
I
Serial interface reset input. Active low. Initialized internal registers during high to low transition.
Assynchronous. Internal pull-up.
ALARM
47
O
CMOS output for ALARM condition.
TXENABLE
48
I
Transmit enable active high input. TXENABLE must be high for the DATA to the DAC to be enabled.
When TXENABLE is low, the digital logic section is forced to all 0, and any input data is ignored.
Internal pull-down.
SLEEP
49
I
Puts device in sleep, active high. Internal pull-down.
10
I
Serial interface clock. Internal pull-down.
I
Serial interface clock. Internal pull-up.
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PIN ASSIGNMENT TABLE – DAC3171 7-BIT INTERFACE MODE (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
DATA INTERFACE
DA[6:0]P/N
9/1019/20
22/23
I
LVDS positive input data bits for channel A. Each positive/negative LVDS pair has an internal 100 Ω
termination resistor. Data format relative to DA_CLKP/N clock is Double Data Rate (DDR) with two
data transfers per DA_CLKP/N clock cycle.
The data format is 7 MSBs (rising edge)/7 LSBs falling edge.
In the default mode (reverse bus not enabled):
D6P/N is most significant data bit (MSB)
D0P/N is most significant data bit (LSB)
DA_CLKP/N
6/7
I
DDR differential input data clock for channel A. Edge to center nominal timing.
1/2
I
LVPECL clock input for DAC core with a self-bias of approximately CLKVDD18/2.
61/60
O
A-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a
full scale current source and the most positive voltage on the IOUTA1 pin. Similarly, a 0xFFFF data
input results in a 0 mA current source and the least positive voltage on the IOUTA1 pin. The IOUTA2
pin is the complement of IOUTA1.
OUTPUT/CLOCK
DACCLKP/N
IOUTAP/N
REFERENCE
EXTIO
58
I/O Used as external reference input when internal reference is disabled. Requires a 0.1 µF decoupling
capacitor to GND when used as reference output.
BIASJ
57
O
Full-scale output current bias. For 20 mA full-scale output current, connect a 960 Ω resistor to GND.
POWER SUPPLY
IOVDD
45
Supply voltage for CMOS IO’s. 1.8V – 3.3V.
CLKVDD18
3
1.8V clock supply
DIGVDD18
21, 28
1.8V digital supply. Also supplies LVDS receivers.
VDDA18
50, 64
Analog 1.8V supply
VDDA33
55, 56,
59
Analog 3.3V supply
VFUSE
8
NC
4,5,
24/25,
26/27
29/3039/40,
51, 52,
53, 53,
62, 63
Digital supply voltage. (1.8V) This supply pin is also used for factory fuse programming. Connect to
DVDD pins for normal operation.
Not used. Pin 4 can be left open or tied to DIGVDD18, and other pins can be left open or tied to
GROUND in actual application use. It is recommended to turn off pin 24/25, 26/27, 29/30-39/40
(register lvdsdataclk_ena, lvdsdata_ena) to save power.
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VDDA18
NC
NC
IOUTAP
IOUTAN
VDDA33
EXTIO
BIASJ
VDDA33
VDDA33
NC
NC
NC
NC
VDDA18
SLEEP
PINOUT – DAC3171 14-BIT INTERFACE MODE
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DACCLKP
1
48
TXENABLE
DACCLKN
2
47
ALARM
CLKVDD18
3
46
SDO
ALIGNP
4
45
IOVDD
ALIGNN
5
44
SDIO
SYNCP
6
43
SCLK
SYNCN
7
42
SDENB
VFUSE
8
41
RESETB
(MSB) D13P
9
40
D0N
D13N
10
39
D0P (LSB)
D12P
11
38
D1N
D12N
12
37
D1P
D11P
13
36
D2N
D11N
14
35
D2P
34
D3N
33
D3P
23
24
25
26
DIGVDD18
D7P
D7N
DATACLKP
DATACLKN
D6P
27
28
29
30
31
32
D4N
22
D4P
21
D5N
20
D5P
19
DIGVDD18
18
D6N
17
D8N
16
D8P
D10N
D9N
15
GND PAD (backside)
D9P
D10P
DAC3171
PIN ASSIGNMENT TABLE – DAC3171 14-BIT INTERFACE MODE
PIN
NAME
NO.
I/O
DESCRIPTION
CONTROL/SERIAL
SCLK
43
SDENB
42
SDIO
44
I/O Bi-directional serial data in 3 pin mode (default). In 4-pin interface mode (register sif4_ena (config 0, bit
9)), the SDIO pin in an input only. Internal Pull-down.
SDO
46
O
Uni-directional serial interface data in 4 pin mode (register sif4_ena (config 0, bit 9)). The SDO pin is tristated in 3-pin interface mode (default). Internal Pulldown.
RESETB
41
I
Serial interface reset input. Active low. Initialized internal registers during high to low transition.
Assynchronous. Internal pull-up.
ALARM
47
O
CMOS output for ALARM condition.
TXENABLE
48
I
Transmit enable active high input. TXENABLE must be high for the DATA to the DAC to be enabled.
When TXENABLE is low, the digital logic section is forced to all 0, and any input data is ignored. Internal
pull-down.
SLEEP
49
I
Puts device in sleep, active high. Internal pull-down.
12
I
Serial interface clock. Internal pull-down.
I
Serial interface clock. Internal pull-up.
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PIN ASSIGNMENT TABLE – DAC3171 14-BIT INTERFACE MODE (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
I
LVDS input data bits for both channels. Each positive/negative LVDS pair has an internal 100 Ω
termination resistor. Data format relative to DATACLKP/N clock is Double Data Rate (DDR) with two data
transfers per DATACKP/N clock cycle.
DATA INTERFACE
DATA[13:0]P/N
9/1019/20
22/23
26/27,
29/3039/40
The data format is interleaved with channel A (rising edge) and channel B falling edge.
In the default mode (reverse bus not enabled):
DATA13P/N is most significant data bit (MSB)
DATA0P/N is most significant data bit (LSB)
DATACLKP/N
24/25
I
DDR differential input data clock. Edge to center nominal timing. Ch A rising edge, Ch B falling edge in
multiplexed output mode.
SYNCP/N
6/7
I
Reset the FIFO or to be used as a syncing source. These two functions are captured with the rising edge
of DATACLKP/N. The signal captured by the falling edge of DATACLKP/N.
ALIGNP/N
4/5
I
LVPECL FIFO output syncrhonization. This positive/negative pair is captured with the rising edge of
DACCLKP/N. It is used to reset the clock dividers and for multiple DAC synchronization. If unused it can
be left unconnected.
1/2
I
LVPECL clock input for DAC core with a self-bias of approximately CLKVDD18/2.
61/60
O
A-Channel DAC current output. An offset binary data pattern of 0x0000 at the DAC input results in a full
scale current source and the most positive voltage on the IOUTAP pin. Similarly, a 0xFFFF data input
results in a 0 mA current source and the least positive voltage on the IOUTAP pin.
OUTPUT/CLOCK
DACCLKP/N
IOUTAP/N
REFERENCE
EXTIO
58
I/O Used as external reference input when internal reference is disabled. Requires a 0.1 µF decoupling
capacitor to GND when used as reference output.
BIASJ
57
O
Full-scale output current bias. For 20 mA full-scale output current, connect a 960 Ω resistor to GND.
IOVDD
45
I
Supply voltage for CMOS IO’s. 1.8V – 3.3V.
CLKVDD18
3
I
1.8V clock supply
DIGVDD18
21, 28
I
1.8V digital supply. Also supplies LVDS receivers.
VDDA18
50, 64
I
Analog 1.8V supply
VDDA33
55, 56,
59
I
Analog 3.3V supply
VFUSE
8
I
Digital supply voltage. (1.8V) This supply pin is also used for factory fuse programming. Connect to
DVDD pins for normal operation.
POWER SUPPLY
NC
51, 52,
53, 54
62, 63
Not Used. These pins can be left open or tied to GROUND in actual application use.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGELEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATUR
E RANGE
ECO PLAN
LEAD/BALL
FINISH
DAC3151
DAC3161
QFN-64
RGC
DAC3171
(1)
–40°C to 85°C
GREEN (RoHS
and no Sb/Br)
NiPdAu
ODERING
NUMBER
TRANSPORT
MEDIA
QUANTITY
DAC3151IRGCT
250
DAC3151IRGCR
2000
DAC3161IRGCT
DAC3161IRGCR
Tape and Reel
250
2000
DAC3171IRGCT
250
DAC3171IRGCR
2000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
Supply voltage
VDDA33 to GND
–0.5 to 4
VDDA18 to GND
–0.5 to 2.3
CLKVDD18 to GND
–0.5 to 2.3
IOVDD to GND
Terminal voltage
range
UNIT
V
–0.5 to 4
DIGVDD18 to GND
–0.5 to 2.3
CLKVDD18 to DIGVDD18
–0.5 to 0.5
VDDA18 to DIGVDD18
–0.5 to 0.5
DA[6..0]P, DA[6..0]N, D[13..0]P, D[13..0]N, DATACLKP, DATACLKN,
DA_CLKP, DA_CLKPN, SYNCP, SYNCN to GND
–0.5 to DIGVDD18 + 0.5
DACCLKP, DACCLKN, ALIGNP, ALIGNN
–0.5 to CLKVDD18 + 0.5
TXENABLE, ALARM, SDO, SDIO, SCLK, SDENB, RESETB to GND
IOUTAP, IOUTAN to GND
EXTIO, BIASJ to GND
V
–0.5 to IOVDD + 0.5
–0.7 to 1.4
–0.5 to VDDA33 + 0.5
Storage temperature range
–65 to 150
°C
ESD, Human Body Model
2
kV
DAC3151, DAC3161,
DAC3171
UNITS
THERMAL INFORMATION
THERMAL METRIC (1)
QFN (64 PIN)
θJA
Junction-to-ambient thermal resistance
23.0
θJCtop
Junction-to-case (top) thermal resistance
7.6
θJB
Junction-to-board thermal resistance
2.8
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
2.8
θJCbot
Junction-to-case (bottom) thermal resistance
0.2
(1)
14
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, DAC sample rate = 500MSPS, 50% clock
duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUTFS = 20mA (unless otherwise noted).
DAC3151
PARAMETER
DAC3161
DAC3171
TEST CONDITIONS
UNIT
MIN
Resolution
TYP
MAX
10
MIN
TYP
MAX
12
MIN
TYP
MAX
14
Bits
DC ACCURACY
DNL Differential nonlinearity
INL Integral nonlinearity
±0.04
±0.2
±1
±0.15
±0.5
±2
LSB
1 LSB = IOUTFS/214
ANALOG OUTPUTS
Coarse gain linearity
Offset error
±0.4
±0.4
±0.4
LSB
0.01
0.01
0.01
%FSR
With external reference
±2
±2
±2
With internal reference
±2
±2
±2
Mid code offset
Gain error
Gain mismatch
Minimum full scale output
current
Maximum full scale output
current
Output compliance range
%FSR
With internal reference
-2
Nominal full-scale current,
IOUTFS = 16xIBAIS current
IOUTFS = 20 mA
2
-2
2
-2
2
2
2
2
20
20
20
%FSR
mA
-0.5
Output resistance
1
-0.5
300
Output capacitance
1
-0.5
300
5
5
1
V
300
kΩ
5
pF
REFERENCE OUTPUT
VREF
Reference output voltage
1.14
Reference output current
1.2
1.26
1.14
100
1.2
1.26
1.14
100
1.2
1.26
100
V
nA
REFERENCE INPUT
VEXTIO Input voltage range
External reference mode
0.1
Input resistance
1.2
1.25
0.1
1.2
1.25
0.1
1.2
1.25
V
1
1
1
MΩ
Small signal bandwidth
500
500
500
kHz
Input capacitance
100
100
100
pF
±1
±1
±1
ppm of
FSR
/°C
With external reference
±15
±15
±15
ppm /°C
With internal reference
±30
±30
±30
ppm /°C
±8
±8
±8
ppm /°C
TEMPERATURE COEFFICIENTS
Offset drift
Gain drift
Reference voltage drift
POWER SUPPLY
DIGVDD18, VFUSE, VDDA18,
CLKVDD18
VDDA33
IOVDD
Sets CMOS IO voltage levels. Nominal
1.8V, 2.5V or 3.3V
1.71
1.8
1.89
1.71
1.8
1.89
1.71
1.8
1.89
V
3.15
3.3
3.45
3.15
3.3
3.45
3.15
3.3
3.45
V
3.45
1.71
3.45
1.71
3.45
V
1.71
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ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, DAC sample rate = 500MSPS, 50% clock
duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUTFS = 20mA (unless otherwise noted).
DAC3151
PARAMETER
DAC3161
DAC3171
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
POWER CONSUMPTION
IVDDA33
3.3V Analog supply current
28
28
28
35
mA
ICLKVDD18
1.8V Clock supply current
47
47
47
56
mA
IDIGVDD18
1.8V Digital supply current
(DIGVDD18 and VFUSE)
110
110
110
125
mA
IIOVDD
1.8V IO Supply current
0.002
0.002
0.002
0.015
mA
Pdis
Total power dissipation
375
375
375
442
mW
IVDDA33
3.3V Analog supply current
28
28
28
mA
ICLKVDD18
1.8V Clock supply current
37
37
37
mA
IDIGVDD18
1.8V Digital supply current
(DIGVDD18 and VFUSE)
80
80
80
mA
IIOVDD
1.8V IO Supply current
0.002
0.002
0.002
mA
Pdis
Total power dissipation
303
303
303
mW
IVDDA33
3.3V Analog supply current
2.6
2.6
2.6
mA
ICLKVDD18
1.8V Clock supply current
43
43
43
mA
IDIGVDD18
1.8V Digital supply current
(DIGVDD18 and VFUSE)
106
106
106
mA
IIOVDD
1.8V IO Supply current
0.003
0.003
0.003
mA
Pdis
Total power dissipation
277
277
277
mW
IVDDA33
3.3V Analog supply current
1.6
4
1.6
4
1.6
4
mA
ICLKVDD18
1.8V Clock supply current
1.8
4
1.8
4
1.8
4
mA
IDIGVDD18
1.8V Digital supply current
(DIGVDD18 and VFUSE)
0.7
3
0.7
3
0.7
3
mA
IIOVDD
1.8V IO Supply current
0.003
0.015
0.003
0.015
0.003
0.015
mA
Pdis
Total power dissipation
10
26
10
26
10
26
mW
PSRR
Power supply rejection ratio
T
Operating temperature
16
MODE 1
fDAC = 491.52 MSPS, QMC on,
IF = 20 MHz, Input full word width
MODE 2
fDAC = 320 MSPS, QMC on,
IF = 20 MHz, Input full word width
MODE 3
Sleep mode, fDAC = 491.52 MSPS,
DAC in sleep mode, Input full word width
MODE 4
Power-down mode, no clock,
DAC in sleep mode, Input full word width
DC tested
–0.4
0.4
–0.4
0.4
–0.4
0.4
%/FSR
/V
–40
85
–40
85
–40
85
°C
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SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
ELECTRICAL CHARACTERISTICS – AC SPECIFICATIONS
Typical values at T A = 25°C, full temperature range is T MIN = –40°C to T MAX = 85°C, DAC sample rate = 500MSPS, 50%
clock duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUT FS = 20mA (unless otherwise
noted).
DAC3151
PARAMETER
DAC3161
DAC3171
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
ANALOG OUTPUT
fDAC
Maximum sample rate
ts(DAC)
Output settling time to 0.1%
Transition: Code 0x0000 to 0x3FFF
500
tPD
Output propagation delay
Does not include digital latency
tr(IOUT)
tf(IOUT)
500
500
MSPS
11
11
11
ns
2
2
2
ns
Output rise time 10% to 90%
200
200
200
ps
Output fall time 90% to 10%
200
200
200
ps
Length of delay from DAC pin inputs to
DATA at output pins. In normal operation
mode including the latency of FIFO.
26
26
26
µs
fDAC = 500 MSPS, fout = 10.1 MHz
81
82
82
fDAC = 500 MSPS, fout = 20.1 MHz
76
77
78
fDAC = 500 MSPS, fout = 70.1 MHz
69
70
74
fDAC = 500 MSPS, fout = 10.1 ±0.5 MHz
82
83
84
fDAC = 500 MSPS, fout = 20.1 ±0.5 MHz
81
82
84
fDAC = 500 MSPS, fout = 70.1 ±0.5 MHz
73.5
74
75
Digital Latency
AC PERFORMANCE
SFDR
IMD3
Spurious free dynamic range
Intermodulation distortion
fDAC = 500 MSPS, fout = 150.1 ±0.5 MHz
NSD
ACLR
Noise spectral density
dBc
dBc
61
61
63
fDAC = 500 MSPS, fout = 10.1 MHz
147
158
160
fDAC = 500 MSPS, fout = 20.1 MHz
146
156
157
fDAC = 500 MSPS, fout = 70.1 MHz
146
153
155
fDAC = 491.52 MSPS, fout = 30.72 MHz,
WCDMA TM1
69
77
78
f AC = 491.52 MSPS, fout = 153.6 MHz,
WCDMA TM1
68
73
74
Adjacent channel leakage ratio
dBc/Hz
dBc
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ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS
Typical values at T A = 25°C, full temperature range is T MIN = –40°C to T MAX = 85°C, DAC sample rate = 500MSPS, 50%
clock duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUT FS = 20mA (unless otherwise
noted).
TEST
CONDITIONS
PARAMETER
DAC3151
DAC3161
DAC3171
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
CMOS DIGITAL INPUTS (RESETB, SDENB, SCLK, SDIO, TXENABLE)
0.6×
IOVDD
0.6×
IOVDD
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level input current
-40
40
IIL
Low-level input current
-40
40
0.6×
IOVDD
0.25×
IOVDD
IOVDD = 3.3 V, 2.5 V or
1.8 V
V
0.25×
IOVDD
0.25×
IOVDD
V
–40
40
μA
–40
40
μA
DIGITAL OUTPUTS – CMOS INTERFACE (SDOUT, SDIO)
VOH
High-level output voltage
VOL
Low-level output voltage
IOVDD = 3.3 V, 2.5 V,
1.8 V
0.85×
IOVDD
0.85×
IOVDD
0.85×
IOVDD
0.125×
IOVDD
V
0.125×
IOVDD
0.125×
IOVDD
V
SERIAL PORT TIMING
ts(SENDB)
Setup time, SDENB to rising edge of SCLK
20
20
20
ns
ts(SDIO)
Setup time, SDIO to rising edge of SCLK
10
10
10
ns
th(SDIO)
Hold time, SDIO from rising edge of SCLK
5
5
5
ns
t(SCLK)
Period of SCLK
100
100
100
ns
t(SCLKH)
High time of SCLK
40
40
40
ns
t(SCLKL)
Low time of SCLK
40
40
40
td(DATA)
Data output delay after falling edge of SCLK
10
10
10
ns
TRESET
Minimum RESTB pulsewidth
25
25
25
ns
ns
LVDS INTERFACE (D[x..0]P/N, DA[x..0]P/N , DB[x..0]P/N , DA_CLKP/N, DB_CLKP/N, DATACLKP/N, SYNCP/N, ALIGNP/N)
VA,B+
Logic high differential input voltage threshold
VA,B–
Logic low differential input voltage threshold
VCOM
Input Common Mode Range
1.0
1.2
2.0
1.0
1.2
2.0
1.0
1.2
2.0
V
ZT
Internal termination
85
110
135
85
110
135
85
110
135
Ω
CL
LVDS input capacitance
18
175
175
175
–175
mV
–175
2
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2
–175
2
mV
pF
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SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS (continued)
Typical values at T A = 25°C, full temperature range is T MIN = –40°C to T MAX = 85°C, DAC sample rate = 500MSPS, 50%
clock duty cycle, VDDA33/IOVDD = 3.3V, VDDA18/CLKVDD18/DIGVDD18 = 1.8V, IOUT FS = 20mA (unless otherwise
noted).
PARAMETER
TEST
CONDITIONS
DAC3151
DAC3161
DAC3171
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
LVDS INPUT TIMING
config3 Setting
ts(DATA)
Setup time
D[x..0] valid to DATACLK
rising or falling edge for
single bus single clock
mode ;
_
DA/DB[x…0] valid to
DB_CLK rising or falling edge
for dual bus single clock
mode;
_
DA[x..0] valid to DA_CLK
rising or falling edge, and
DB[x…0] valid for DB_CLK
rising or falling edge for dual
bus dual clock mode
datadly
clkdly
0
0
-20
-20
-20
0
1
-120
-120
-120
0
2
-220
-220
-220
0
3
-310
-310
-310
0
4
-390
-390
-390
0
5
-480
-480
-480
0
6
-560
-560
-560
0
7
-630
-630
-630
1
0
70
70
70
2
0
150
150
150
3
0
230
230
230
4
0
330
330
330
5
0
430
430
430
6
0
530
530
530
7
0
620
620
620
ps
congfig3 Setting
th(DATA)
Hold time
D[x..0] valid to DATACLK
rising or falling edge for
single bus single clock mode;
_
DA/DB[x…0] valid to
DB_CLK rising or falling edge
for dual bus single clock
mode;
_
DA[x..0] valid to DA_CLK
rising or falling edge, and
DB[x…0] valid for DB_CLK
rising or falling edge for dual
bus dual clock mode.
datadly
clkdly
0
0
310
310
310
0
1
390
390
390
0
2
480
480
480
0
3
560
560
560
0
4
650
650
650
0
5
740
740
740
0
6
850
850
850
0
7
930
930
930
1
0
200
200
200
2
0
100
100
100
3
0
20
20
20
4
0
-60
-60
-60
5
0
-140
-140
-140
6
0
-220
-220
-220
7
0
-290
-290
-290
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TYPICAL CHARACTERISTICS
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
0.2
0.05
0.15
0.04
0.03
0.02
0.05
DNL (LSB)
INL (LSB)
0.1
0
−0.05
0
−0.01
−0.02
−0.1
−0.03
−0.15
−0.2
0.01
−0.04
0
200
400
600
Code
800
−0.05
1000
0
Figure 5. DAC3151 Integral Nonlinearity
1000
G004
0dBFS
−6dBFS
−12dBFS
80
70
70
60
50
60
50
40
40
30
30
20
20
0
50
100
150
Output Frequency (dB)
200
10
250
0
50
G005
Figure 7. DAC3151 SFDR vs Output Frequency Over Input
Scale
100
150
Output Frequency (dB)
200
250
G006
Figure 8. DAC3151 Second-Order Harmonic Distortion vs
Output Frequency Over Input Scale
100
100
0dBFS
−6dBFS
−12dBFS
90
80
80
SFDR (dBc)
60
50
40
70
60
50
30
40
20
30
0
50
100
150
Output Frequency (dB)
200
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
70
HD3 (dBc)
800
90
HD2 (dBc)
SFDR (dBc)
80
250
20
0
50
G007
Figure 9. DAC3151 Third-Order Harmonic Distortion vs
Output Frequency Over Input Scale
20
600
Code
100
0dBFS
−6dBFS
−12dBFS
90
10
400
Figure 6. DAC3151 Differential Nonlinearity
100
10
200
G003
100
150
Output Frequency (MHz)
200
250
G008
Figure 10. DAC3151 SFDR vs Output Frequency Over fDAC
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
100
100
0dBFS
−6dBFS
−12dBFS
90
80
70
IMD3 (dBc)
IMD3 (dBc)
80
60
50
40
60
50
40
20
30
0
50
100
150
Output Frequency (dB)
200
20
250
50
100
150
Output Frequency (MHz)
G010
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
160
150
NSD (dBc/Hz)
150
140
130
140
130
120
120
110
110
0
50
100
150
Output Frequency (dB)
200
100
250
0
100
Output Frequency (MHz)
G011
Figure 13. DAC3151 NSD vs Output Frequency Over Input
Scale
200
250
G012
Figure 14. DAC3151 NSD vs Output Frequency Over fDAC
−50
−50
Adjacent channel
Alternate channel
−60
ACLR (dBc)
−60
ACLR (dBc)
250
170
0dBFS
−6dBFS
−12dBFS
160
−70
−80
−90
−70
−80
−90
fDAC = 500 MSPS
−100
200
Figure 12. DAC3151 IMD3 vs Output Frequency Over fDAC
170
100
0
G009
Figure 11. DAC3151 IMD3 vs Output Frequency Over Input
Scale
NSD (dBc/Hz)
70
30
10
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
0
50
fDAC = 500 MSPS
100
150
Output Frequency (MHz)
200
250
−100
0
50
G013
Figure 15. DAC3151 ACLR (Adjacent Channel) vs Output
Frequency
100
150
Output Frequency (MHz)
200
250
G012
Figure 16. DAC3151 ACLR (Alternate Channel) vs Output
Frequency
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
10
10
fDAC = 491. 52MSPS
fout = 20 MHz
−10
−10
−20
−20
−30
−40
−50
−30
−40
−50
−60
−60
−70
−70
−80
−80
−90
10
50
90
130
170
Frequency (MHz)
210
−90
250
−10
130
170
Frequency (MHz)
210
250
G016
fDAC = 500 MSPS
fout = 70 MHz
Tone spacing = 1 MHz
0
−10
−20
Power (dBm)
−20
−30
−40
−50
−60
−30
−40
−50
−60
−70
−70
−80
−80
−90
−90
−100
−100
15
17
19
21
Frequency (MHz)
23
25
-20 dBm
* Att
5 dB
* RBW
30 kHz
* VBW
300 kHz
* SWT
2 s
65
67
69
71
Frequency (MHz)
G017
Figure 19. DAC3151 Two-Tone Spectral Plot (IF = 20MHz)
73
75
G018
Figure 20. DAC3151 Two-Tone Spectral Plot (IF = 70MHz)
Ref
-10 dBm
* Att
5 dB
* RBW
30 kHz
* VBW
300 kHz
* SWT
2 s
-20
-30
A
-40
A
-30
-40
-50
1 RM *
1 RM *
-60
CLRWR
-50
-60
-70
-70
-80
NOR
-90
3DB
-110
Center
NOR
-80
-90
-100
70 MHz
Standard:
4.08 MHz/
W-CDMA
3GPP
FWD
Span
Adjacent
40.8 MHz
Tx
Channel
3DB
-100
Center
70 MHz
1.55 MHz/
Channel
Lower
Upper
Channels
Ch1
(Ref)
-18.62 dBm
Ch2
-18.64 dBm
Ch3
-18.72 dBm
Ch4
-18.70 dBm
Total
Alternate
Lower
Upper
-61.24 dB
-61.34 dB
Channel
Adjacent
Bandwidth
Span
W-CDMA
Bandwidth
Tx
3.84
MHz
3.84
MHz
5
MHz
Channel
Spacing
3GPP
15.5 MHz
FWD
Power
-10.64 dBm
Lower
Upper
-69.11 dB
-69.15 dB
-61.11 dB
-61.39 dB
-12.65 dBm
Figure 21. DAC3151 ACPR Four-Carrier
WCDMA Test Mode 1
22
90
10
fDAC = 500 MSPS
fout = 20 MHz
Tone spacing = 1 MHz
0
Power (dBm)
50
Figure 18. DAC3151 Single-Tone Spectral Plot (IF = 70MHz)
10
CLRWR
10
G011
Figure 17. DAC3151 Single-Tone Spectral Plot (IF = 20MHz)
Ref
fDAC = 491. 52MSPS
fout = 70 MHz
0
Power (dBm)
Power (dBm)
0
Figure 22. DAC3151 ACPR Single-Carrier
WCDMA Test Mode 1
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
Ref
* Att
-10 dBm
5 dB
* RBW
30 kHz
* VBW
300 kHz
* SWT
2 s
Ref
A
-30
300 kHz
* SWT
2 s
A
-30
CLRWR
-50
-50
-60
-60
-70
-70
NOR
-80
NOR
-80
-90
-90
70 MHz
2.92827419 MHz/
Channel
E-UTRA/LTE
Bandwidth
Adjacent
Span
9.015
MHz
9.015
MHz
10
MHz
Channel
Bandwidth
Spacing
Center
29.2827419 MHz
Tx
Square
Power
-12.33 dBm
Lower
Upper
-64.00 dB
-64.09 dB
3DB
-100
3DB
-100
Center
70 MHz
5.855034538 MHz/
Channel
Adjacent
Span
E-UTRA/LTE
Bandwidth
18.015
MHz
18.015
MHz
20
MHz
Channel
Bandwidth
Spacing
58.55034538 MHz
Square
Power
-11.14 dBm
Lower
Upper
-61.93 dB
-62.21 dB
Figure 23. DAC3151 ACPR LTE 10-MHz FDD E-TM 1.1
Figure 24. DAC3151 ACPR LTE 20-MHz FDD E-TM 1.1
0.4
0.2
0.3
0.15
0.2
0.1
DNL (LSB)
0.1
INL (LSB)
30 kHz
* VBW
1 RM *
1 RM *
0
−0.1
−0.2
−0.3
0
−0.05
−0.15
−0.5
−0.6
0.05
−0.1
−0.4
0
500
1000
1500
2000 2500
Code
3000
3500
−0.2
4000
0
1000
1500
2000 2500
Code
3000
3500
4000
G025
Figure 26. DAC3161 Differential Nonlinearity
100
100
0dBFS
−6dBFS
−12dBFS
90
80
0dBFS
−6dBFS
−12dBFS
90
80
70
HD2 (dBc)
70
60
50
60
50
40
40
30
30
20
20
10
500
G024
Figure 25. DAC3161 Integral Nonlinearity
SFDR (dBc)
* RBW
-40
-40
Tx
5 dB
-20
-20
CLRWR
* Att
-10 dBm
0
50
100
150
Output Frequency (dB)
200
250
10
0
50
G026
Figure 27. DAC3161 SFDR vs Output Frequency Over Input
Scale
100
150
Output Frequency (dB)
200
250
G027
Figure 28. DAC3161 Second-Order Harmonic Distortion vs
Output Frequency Over Input Scale
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
100
100
0dBFS
−6dBFS
−12dBFS
90
80
80
SFDR (dBc)
HD3 (dBc)
70
60
50
40
30
0
50
100
150
Output Frequency (dB)
200
20
250
100
150
Output Frequency (MHz)
200
250
G029
Figure 30. DAC3161 SFDR vs Output Frequency Over fDAC
80
IMD3 (dBc)
60
50
40
70
60
50
30
40
20
30
0
50
100
150
Output Frequency (dB)
200
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
70
20
250
0
50
G030
Figure 31. DAC3161 IMD3 vs Output Frequency Over Input
Scale
100
150
Output Frequency (MHz)
200
250
G031
Figure 32. DAC3161 IMD3 vs Output Frequency Over fDAC
180
180
0dBFS
−6dBFS
−12dBFS
170
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
170
160
NSD (dBc/Hz)
160
150
140
150
140
130
130
120
120
110
50
100
80
10
0
G028
0dBFS
−6dBFS
−12dBFS
90
IMD3 (dBc)
50
20
100
NSD (dBc/Hz)
60
40
Figure 29. DAC3161 Third-Order Harmonic Distortion vs
Output Frequency Over Input Scale
0
50
100
150
Output Frequency (dB)
200
250
110
0
G032
Figure 33. DAC3161 NSD vs Output Frequency Over Input
Scale
24
70
30
10
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
100
Output Frequency (MHz)
200
250
G033
Figure 34. DAC3161 NSD vs Output Frequency Over fDAC
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
−50
−50
Adjacent channel
Alternate channel
−60
ACLR (dBc)
ACLR (dBc)
−60
−70
−80
−90
−70
−80
−90
fDAC = 500 MSPS
−100
0
50
fDAC = 500 MSPS
100
150
Output Frequency (MHz)
200
−100
250
Figure 35. DAC3161 ACLR (Adjacent Channel) vs Output
Frequency
200
250
G035
−10
−10
−20
−20
−30
−40
−50
−30
−40
−50
−60
−60
−70
−70
−80
−80
10
50
90
130
170
Frequency (MHz)
210
fDAC = 491. 52MSPS
fout = 70 MHz
0
Power (dBm)
Power (dBm)
100
150
Output Frequency (MHz)
10
fDAC = 491. 52MSPS
fout = 20 MHz
0
−90
250
10
50
G036
Figure 37. DAC3161 Single-Tone Spectral Plot (IF = 20MHz)
90
130
170
Frequency (MHz)
210
250
G037
Figure 38. DAC3161 Single-Tone Spectral Plot (IF = 70MHz)
10
10
fDAC = 500 MSPS
fout = 20 MHz
Tone spacing = 1 MHz
0
−10
fDAC = 500 MSPS
fout = 70 MHz
Tone spacing = 1 MHz
0
−10
−20
Power (dBm)
−20
Power (dBm)
50
Figure 36. DAC3161 ACLR (Alternate Channel) vs Output
Frequency
10
−90
0
G034
−30
−40
−50
−60
−30
−40
−50
−60
−70
−70
−80
−80
−90
−90
−100
−100
15
17
19
21
Frequency (MHz)
23
25
65
67
G038
Figure 39. DAC3161 Two-Tone Spectral Plot (IF = 20MHz)
69
71
Frequency (MHz)
73
75
G039
Figure 40. DAC3161 Two-Tone Spectral Plot (IF = 70MHz)
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
Ref
-10 dBm
* Att
5 dB
* RBW
30 kHz
* VBW
300 kHz
* SWT
2 s
Ref
-10 dBm
* Att
* RBW
30 kHz
* VBW
300 kHz
* SWT
2 s
-20
-20
A
-30
A
-30
-40
-40
1 RM *
1 RM *
-50
CLRWR
-50
CLRWR
-60
-60
-70
-70
NOR
-80
-90
3DB
-100
Center
70 MHz
Standard:
Tx
NOR
-80
-90
4.08 MHz/
W-CDMA
3GPP
Span
Adjacent
FWD
-18.70 dBm
(Ref)
Ch2
-18.69 dBm
Ch3
-18.77 dBm
Ch4
-18.75 dBm
Total
3DB
-100
40.8 MHz
Center
Channel
Lower
Upper
Channels
Ch1
Tx
70 MHz
Ref
Adjacent
Lower
Upper
3.84
MHz
5
MHz
Channel
3GPP
FWD
Power
-10.70 dBm
Lower
Upper
-77.84 dB
-77.14 dB
-12.71 dBm
* Att
-20 dBm
5 dB
* RBW
30 kHz
* VBW
300 kHz
* SWT
2 s
Figure 42. DAC3161 ACPR Single-Carrier
WCDMA Test Mode 1
Ref
* Att
-20 dBm
5 dB
* RBW
30 kHz
* VBW
300 kHz
* SWT
2 s
-30
A
-40
A
-40
-50
-50
1 RM *
-60
CLRWR
-60
-70
-70
-80
-80
NOR
-90
NOR
-90
-100
-100
3DB
-110
Center
70 MHz
2.92827419 MHz/
Span
Channel
E-UTRA/LTE
Bandwidth
Adjacent
Bandwidth
Spacing
9.015
MHz
9.015
MHz
10
MHz
Channel
Tx
Square
Power
-12.37 dBm
Lower
Upper
-73.67 dB
-73.46 dB
70 MHz
5.855034538 MHz/
Span
Channel
Bandwidth
Adjacent
Bandwidth
Spacing
E-UTRA/LTE
18.015
MHz
Channel
18.015
MHz
20
MHz
58.55034538 MHz
Square
Power
-11.20 dBm
Lower
Upper
-70.91 dB
-70.66 dB
Figure 44. DAC3161 ACPR LTE 20-MHz FDD E-TM 1.1
2
Differential Nonlinearity Error (LSB)
2
1.5
1
0.5
0
−0.5
−1
−1.5
−2
3DB
-110
Center
29.2827419 MHz
Figure 43. DAC3161 ACPR LTE 10-MHz FDD E-TM 1.1
Integral Nonlinearity Error (LSB)
MHz
15.5 MHz
-70.86 dB
-70.84 dB
1 RM *
Tx
W-CDMA
3.84
Spacing
Channel
Span
Channel
Bandwidth
Alternate
-30
CLRWR
1.55 MHz/
Bandwidth
-70.74 dB
-70.87 dB
Figure 41. DAC3161 ACPR Four-Carrier
WCDMA Test Mode 1
5000
10000
1.5
1
0.5
0
−0.5
−1
−1.5
−2
15000
Code
5000
10000
15000
Code
G019
Figure 45. DAC3171 Integral Nonlinearity
26
5 dB
G020
Figure 46. DAC3171 Differential Nonlinearity
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SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
100
100
0dBFS
−6dBFS
−12dBFS
90
80
70
70
HD2 (dBc)
SFDR (dBc)
80
60
50
30
30
20
20
0
50
100
150
Output Frequency (dB)
200
10
250
100
150
Output Frequency (dB)
200
250
G002
100
80
80
SFDR (dBc)
60
50
40
70
60
50
30
40
20
30
0
50
100
150
Output Frequency (dB)
200
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
70
20
250
0
50
G003
Figure 49. DAC3171 Third-Order Harmonic Distortion vs
Output Frequency Over Input Scale
100
150
Output Frequency (MHz)
200
250
G004
Figure 50. DAC3171 SFDR vs Output Frequency Over fDAC
100
100
0dBFS
−6dBFS
−12dBFS
90
80
80
IMD3 (dBc)
60
50
40
70
60
50
30
40
20
30
0
50
100
150
Output Frequency (dB)
200
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
90
70
10
50
Figure 48. DAC3171 Second-Order Harmonic Distortion vs
Output Frequency Over Input Scale
0dBFS
−6dBFS
−12dBFS
90
10
0
G001
100
HD3 (dBc)
50
40
Figure 47. DAC3171 SFDR vs Output Frequency Over Input
Scale
IMD3 (dBc)
60
40
10
0dBFS
−6dBFS
−12dBFS
90
250
20
0
50
G005
Figure 51. DAC3171 IMD3 vs Output Frequency Over Input
Scale
100
150
Output Frequency (MHz)
200
250
G006
Figure 52. DAC3171 IMD3 vs Output Frequency Over fDAC
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
180
180
0dBFS
−6dBFS
−12dBFS
170
160
NSD (dBc/Hz)
NSD (dBc/Hz)
160
150
140
150
140
130
130
120
120
110
fDAC = 200 MSPS
fDAC = 300 MSPS
fDAC = 400 MSPS
fDAC = 500 MSPS
170
0
50
100
150
Output Frequency (dB)
200
110
250
0
100
Output Frequency (MHz)
G007
Figure 53. DAC3171 NSD vs Output Frequency Over Input
Scale
Altenate channel
−60
ACLR (dBc)
ACLR (dBc)
−60
−70
−80
−90
−70
−80
−90
fDAC = 500 MSPS
0
50
fDAC = 500 MSPS
100
150
Output Frequency (MHz)
200
−100
250
50
100
150
Output Frequency (MHz)
200
250
G010
Figure 56. DAC3171 ACLR (Alternate Channel) vs Output
Frequency
10
10
fDAC= 491.52 MSPS
fOUT = 20 MHz
0
−10
−10
−20
−20
−30
−40
−50
−30
−40
−50
−60
−60
−70
−70
−80
−80
10
50
90
130
170
Frequency (MHz)
210
250
fDAC= 491.52 MSPS
fOUT = 20 MHz
0
Power (dBm)
Power (dBm)
0
G009
Figure 55. DAC3171 ACLR (Adjacent Channel) vs Output
Frequency
−90
10
50
G011
Figure 57. DAC3171 Single-Tone Spectral Plot (IF = 20MHz)
28
G008
−50
Adjacent channel
−90
250
Figure 54. DAC3171 NSD vs Output Frequency Over fDAC
−50
−100
200
90
130
170
Frequency (MHz)
210
250
G012
Figure 58. DAC3171 Single-Tone Spectral Plot (IF = 70MHz)
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
10
10
fDAC = 500 MSPS
fout = 20 MHz
Tone spacing = 1 MHz
0
−10
−10
−20
Power (dBm)
−20
Power (dBm)
fDAC = 500 MSPS
fout = 70 MHz
Tone spacing = 1 MHz
0
−30
−40
−50
−60
−30
−40
−50
−60
−70
−70
−80
−80
−90
−90
−100
−100
15
17
19
21
Frequency (MHz)
23
25
65
67
G013
Figure 59. DAC3171 Two-Tone Spectral Plot (IF = 20MHz)
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
69
71
Frequency (MHz)
73
75
G014
Figure 60. DAC3171 Two-Tone Spectral Plot (IF = 70MHz)
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
Figure 61. DAC3171 Four-Carrier WCDMA Test Mode 1
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
Figure 62. DAC3171 Single-Carrier WCDMA Test Mode 1
0dBFs,
fDAC = 491.52MSPS,
fOUT = 70MHz
Figure 63. DAC3171 10-MHz Single Carrier LTE Test Mode
3.1
Figure 64. DAC3171 20-MHz Single Carrier LTE Test Mode
3.1
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltages, fDAC = 500MSPS, 50% clock duty cycle, 0-dBFS input signal and 20mA fullscale output current (unless otherwise noted).
Figure 65. Power Consumption vs fDAC
30
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DEFINITION OF SPECIFICATIONS
Adjacent Carrier Leakage Ratio (ACLR): Defined as the ratio in decibles relative to the carrier (dBc) between
the measured power within a channel and that of an adjacent channel.
Analog and Digital Power Supply Rejection Ratio (APSSR, DPSSR): Defined as the percentage error in the
ratio of the delta IOUT and delta supply voltage normalized with respect to the ideal IOUT current.
Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1 LSB
change in the digital input code.
Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the
value at ambient (25°C) to values over the full operating temperature range.
Gain Error: Defined as the percentage error (in FSR%) for the ratio between the measured full-scale output
current and the ideal full-scale output current.
Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output,
determined by a straight line drawn from zero scale to full scale.
Intermodulation Distortion (IMD3): The two-tone IMD3 is defined as the ratio (in dBc) of the 3rd-order
intermodulation distortion product to either fundamental output tone.
Offset Drift: Defined as the maximum change in DC offset, in terms of ppm of full-scale range (FSR) per °C,
from the value at ambient (25°C) to values over the full operating temperature range.
Offset Error: Defined as the percentage error (in FSR%) for the ratio between the measured mid-scale output
current and the ideal mid-scale output current.
Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the
current-output DAC. Exceeding this limit may result reduced reliability of the device or adversely affecting
distortion performance.
Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius
from value at ambient (25°C) to values over the full operating temperature range.
Spurious Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the
output signal and the peak spurious signal.
Signal to Noise Ratio (SNR): Defined as the ratio of the RMS value of the fundamental output signal to the
RMS sum of all other spectral components below the Nyquist frequency, including noise, but excluding the first
six harmonics and dc.
TIMING DIAGRAMS
D[9:0]P/N
A3[9:0]
A4[9:0]
ts(DATA)
A5[9:0]
A6[9:0]
A7[9:0]
A8[9:0]
A9[9:0]
A10[9:0]
A11[9:0]
th(DATA)
DATACLKP/N
(SDR)
ts(DATA)
SYNCP/N
th(DATA)
Resets write pointer to position 0
Figure 66. DAC3151 Input Data Timing Diagram
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D[11:0]P/N
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A3[11:0] A4[11:0] A5[11:0] A6[11:0] A7[11:0] A8[11:0] A9[11:0] A10[11:0] A11[11:0]
ts(DATA)
th(DATA)
DATACLKP/N
(SDR)
ts(DATA)
SYNCP/N
th(DATA)
Resets write pointer to position 0
Figure 67. DAC3161 Input Data Timing Diagram
DA[6:0]P/N
A3[13:7]
A3[6:0]
A4[13:7]
ts(DATA)
A4[6:0]
th(DATA)
A5[13:7]
ts(DATA)
A5[6:0]
A6[13:7]
A6[6:0]
A7[13:7]
A7[6:0]
th(DATA)
DA_CLKP/N
Figure 68. DAC3171 Input Data Timing Diagram for 7-Bit Interface Mode
D[13:0]P/N
A3[13:0] A4[13:0] A5[13:0] A6[13:0] A7[13:0] A8[13:0] A9[13:0] A10[13:0] A11[13:0]
ts(DATA)
th(DATA)
DATACLKP/N
(SDR)
ts(DATA)
SYNCP/N
th(DATA)
Resets write pointer to position 0
Figure 69. DAC3171 Input Data Timing for 14-Bit Interface Mode
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DATA INPUT FORMATS
Table 1. DAC3151: 10-Bit Interface Mode
BITS
DIFFERENTIAL PAIR (P/N)
DATACLK RISING EDGE
DATACLK FALLING EDGE
D9
A9
–
D8
A8
–
D7
A7
–
D6
A6
–
D5
A5
–
D4
A4
–
D3
A3
–
D2
A2
–
D1
A1
–
D0
A0
–
SYNC
FIFO Write Reset
–
Table 2. DAC3161: 12-Bit Interface Mode
BITS
DIFFERENTIAL PAIR (P/N)
DATACLK RISING EDGE
DATACLK FALLING EDGE
D11
A11
–
D10
A10
–
D9
A9
–
D8
A8
–
D7
A7
–
D6
A6
–
D5
A5
–
D4
A4
–
D3
A3
–
D2
A2
–
SYNC
FIFO Write Reset
–
Table 3. DAC3171: 7-Bit Interface Mode
DIFFERENTIAL PAIR (P/N)
DA_CLK RISING EDGE
DA_CLK FALLING EDGE
DA6
A13
A6
DA5
A12
A5
DA4
A11
A4
DA3
A10
A3
DA2
A9
A2
DA1
A8
A1
DA0
A7
A0
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Table 4. DAC3171: 14-Bit Interface Mode
BITS
34
DIFFERENTIAL PAIR (P/N)
DATACLK RISING EDGE
DATACLK FALLING EDGE
D13
A13
–
D12
A12
–
D11
A11
–
D10
A10
–
D9
A9
–
D8
A8
–
D7
A7
–
D6
A6
–
D5
A5
–
D4
A4
–
D3
A3
–
D2
A2
–
D1
A1
–
D0
A0
–
SYNC
FIFO Write Reset
–
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SERIAL INTERFACE DESCRIPTION
The serial port of the DAC3151/DAC3161/DAC3171 is a flexible serial interface which communicates with
industry standard microprocessors and microcontrollers. The interface provides read/write access to all registers
used to define the operating modes of DAC3151/DAC3161/DAC3171. It is compatible with most synchronous
transfer formats and can be configured as a 3 or 4 pin interface by sif4_ena in register XYZ. In both
configurations, SCLK is the serial interface input clock and SDENB is serial interface enable. For 3 pin
configuration, SDIO is a bidirectional pin for both data in and data out. For 4 pin configuration, SDIO is data in
only and SDO is data out only. Data is input into the device with the rising edge of SCLK. Data is output from the
device on the falling edge of SCLK.
Each read/write operation is framed by signal SDENB (Serial Data Enable Bar) asserted low. The first frame byte
is the instruction cycle which identifies the following data transfer cycle as read or write as well as the 7-bit
address to be accessed. Table 5 indicates the function of each bit in the instruction cycle and is followed by a
detailed description of each bit. The data transfer cycle consists of two bytes.
Table 5. Instruction Byte of the Serial interface
MSB
Bit
Description
LSB
7
R/W
6
A6
5
A5
4
A4
3
A3
2
A2
1
A1
0
A0
R/W
Identifies the following data transfer cycle as a read or write operation. A high indicates a read
operation from DAC3151/DAC3161/DAC3171 and a low indicates a write operation to
DAC3151/DAC3161/DAC3171.
[A6 : A0]
Identifies the address of the register to be accessed during the read or write operation.
Figure 70 shows the serial interface timing diagram for a DAC3151/DAC3161/DAC3171 write operation. SCLK is
the serial interface clock input to DAC3151/DAC3161/DAC3171. Serial data enable SDENB is an active low input
to DAC3151/DAC3161/DAC3171. SDIO is serial data in. Input data to DAC3151/DAC3161/DAC3171 is clocked
on the rising edges of SCLK.
Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
SDIO
rwb
A6
A5
A4
A3
A2
tS (SDENB)
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
t SCLK
SDENB
SCLK
SDIO
tS(SDIO) tH(SDIO)
Figure 70. Serial Interface Write Timing Diagram
Figure 71 shows the serial interface timing diagram for a DAC3151/DAC3161/DAC3171 read operation. SCLK is
the serial interface clock input to DAC3151/DAC3161/DAC3171. Serial data enable SDENB is an active low input
to DAC3151/DAC3161/DAC3171. SDIO is serial data in during the instruction cycle. In 3 pin configuration, SDIO
is data out from the DAC3151/DAC3161/DAC3171 during the data transfer cycle, while SDO is in a highimpedance state. In 4 pin configuration, both SDIO and SDO are data out from the
DAC3151/DAC3161/DAC3171 during the data transfer cycle. At the end of the data transfer, SDIO and SDO will
output low on the final falling edge of SCLK until the rising edge of SDENB when they will 3-state.
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Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
SDIO
rwb
A6
A5
A4
A3
A2
A1
SDO
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDENB
SCLK
SDIO
SDO
Data n
Data n-1
td (Data)
Figure 71. Serial Interface Read Timing Diagram
REGISTER DESCRIPTIONS
In the SIF interface there are four types of registers:
NORMAL:
The NORMAL register type allows data to be written and read from. All 16-bits of the data are
registered at the same time. There is no synchronizing with an internal clock thus all register
writes are asynchronous with respect to internal clocks. There are three subtypes of NORMAL:
AUTOSYNC:
A NORMAL register that causes a sync to be generated after the write is
finished. These are most commonly used in things like offsets and phaseadd
where there is a word or block setup that extends across multiple registers
and all of the registers need to be programmed before any take effect on the
circuit. For example, the phaseadd is two registers long. It wouldn’t serve the
user to have the first write 16 of the 32 bits cause a change in the frequency,
so the design allows all the registers to be written and then when that last
one for this block is finished, an autosync is generated for the mixer telling it
to grab all the new SIF values. This will occur on a mixer clock cycle so that
no meta-stability errors occur.
No RESET Value: These are NORMAL registers, but for one reason or another reset value can
not be guaranteed. This could be because the register has some read_only
bits or some internal logic partially controls the bit values. An example is the
SIF_CONFIG6 register. The bits come from the temperature sensor and the
fuses. Depending on which fuses are blown and what the die temp is the
reset value will be different.
FUSE controlled:
READ_ONLY:
While this isn’t a type of register, you may see this description in the area
describing the default value for the register. What is means is that fuses will
change the default value and the value shown in the document is for when
no fuses are blown.
Registers that are internal wires ANDed with the address bus then connected to the SIF
output data bus.
WRITE_TO_CLEAR: These registers are just like NORMAL registers with one exception. They can be written
and read, however, when the internal logic asynchronously sets a bit high in one of
these registers, that bit stays high until it is written to ‘0’. This way interrupts will be
captured and stay constant until cleared by the user.
36
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Table 6. Register Map
(MSB)
Bit 15
Name
Address
Default
Bit 14
config0
0x00
0x44FC
qmc
_offset
_ena
dual_ena
config1
0x01
0x600E
iotest_ena
reserved
config2
0x02
0x3FFF
reserved
config3
0x03
0x0000
config4
0x04
0x0000
config5
0x05
0x0000
config6
0x06
0x0000
config7
0x07
0xFFFF
config8
0x08
0x4000
reserved
config9
0x09
0x8000
fifo_offset (2:0)
config10
0x0A
0xF080
Bit 13
Bit 12
chipwidth (1:0)
fullword
_interface
_ena
64cnt
_ena
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
rev
twos
sif4_ena
reserved
fifo_ena
alarm_out
_ena
alarm_out
_pol
alignrx
_ena
lvdssyncrx
_ena
lvdsdataclk
_ena
reserved
synconly
_ena
dacclkgone
_ena
dataclkgone
_end
collision
_ena
reserved
daca
_compliment
reserved
sif_sync
sif_
sync_ena
alarm_
2away
_ena
alarm
_1away
_ena
alarm
_collision
_ena
reserved
reserved
lvdsdata_ena (13:0)
datadlya (2:0)
clkdlya (2:0)
reserved
reserved
alarm
_from
_zerochka
(LSB)
Bit 0
Bit 11
reserved
extref _ena
reserved
reserved
iotest_results (13:0)
reserved
alarms_from_fifoa (2:0)
reserved
alarm
_dacclk
_gone
alarm
_dataclk
_ gone
clock
_gone
tempdata (7:0)
alarm
_from
_ iotesta
reserved
reserved
fuse_cntl (5:0)
reserved
alarms_mask (15:0)
qmc_offseta (12:0)
reserved
coarse_dac (3:0)
fuse_ sleep
reserved
reserved
reserved
tsense
_sleep
clkrecv
_ena
sleepa
config11
0x0B
0x1111
config12
0x0C
0x3A7A
reserved
iotest_pattern0 (13:0)
config13
0x0D
0x36B6
reserved
iotest_pattern1 (13:0)
config14
0x0E
0x2AEA
reserved
iotest_pattern2 (13:0)
config15
0x0F
0x0545
reserved
iotest_pattern3 (13:0)
config16
0x10
0x1A1A
reserved
iotest_pattern4 (13:0)
config17
0x11
0x1616
reserved
iotest_pattern5 (13:0)
config18
0x12
0x2AAA
reserved
iotest_pattern6 (13:0)
config19
0x13
0x06C6
reserved
iotest_pattern7 (13:0)
config20
0x14
0x0000
config21
0x15
0xFFFF
sleepcntl (15:0)
config22
0x16
0x0000
fa002_data(15:0)
config23
0x17
0x0000
fa002_data(31:16)
config24
0x18
0x0000
fa002_data(47:32)
config25
0x19
0x0000
config127
0x7F
0x0044
sifdac
_ena
reserved
sleepb
reserved
reserved
reserved
reserved
reservedspares_west (3:0)
sifdac (13:0)
fa002_data(63:48)
reserved
reserved
reserved
reserved
reserved
titest_voh
titest_vol
vendorid (1:0)
versionid (2:0)
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Register name: config0 – Address: 0x00, Default: 0x4FC
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config0
0x00
15
qmc_offset_ena
Enable the offset function when asserted.
0
14
dual_ena
Utilizes both DACs when asserted.
0
FUSE
controlled
13:12
chipwidth
Programmable bits for setting the input interface width.
00: all 14 bits are used.
01: upper 12 bits are used10: upper 10 bits are used
11: upper 10 bits are used
00
11
rev
Reverses the input bits. When using the 7bit interface, this
reverse each 7-bit input, however when using the 14-bit
interface, all 14-bits are reversed as one word.
0
10
twos
When asserted, this bit tells the chip to presume 2’s
complement data is arriving at the input. Otherwise offset
binary is presumed.
1
9
sif4_ena
When asserted the SIF interface becomes a 4 pin interface.
This bit has a lower priority than the dieid_ena bit.
0
8
reserved
reserved
0
7
fifo_ena
When asserted, the FIFO is absorbing the difference between 1
INPUT clock and DAC clock. If it is not asserted then the
FIFO buffering is bypassed but the reversing of bits and
handling of offset binary input is still available. NOTE: When
the FIFO is bypassed the DACCCLK and DATACLK must
be aligned or there may be timing errors; and, it is not
recommended for actual application use.
6
alarm_out_ena
When asserted the pin alarm becomes an output instead of a
tri-stated pin.
1
5
alarm_out_pol
This bit changes the polarity of the ALARM signal.
(0=negative logic, 1=positive logic)
1
4
alignrx_ena
When asserted the ALIGN pin receiver is powered up. NOTE: 1
It is recommended to clear this bit when ALIGNP/N are
not used (dual bus mode, and SYNC ONLY and
SIF_SYNC modes in single bus mode).
3
lvdssyncrx_ena
When asserted the SYNC pin receiver is powered up. NOTE:
1 It is recommended to clear this bit when SYNCP/N are
not used (dual bus mode, and SIF_SYNC mode in single
bus mode.)
1
2
lvdsdataclk_ena
When asserted the DATACLK pin receiver is powered up.
1
1
reserved
reserved
0
0
synconly_ena
When asserted the chip is put into the SYNC ONLY mode
where the SYNC pin is used as the sync input for both the
front and back of the FIFO.
0
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Register name: config1 – Address: 0x01, Default: 0x600E
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config1
0x01
15
iotest_ena
Turns on the io-testing circuitry when asserted. This is the circuitry
that will compare a 8 sample input pattern to SIF programmed
registers to make sure the data coming into the chip meets
setup/hold requirements. If this bit is a ‘0’ then the clock to this
circuitry is turned off for power savings. NOTE: Sample 0 should
be aligned with the rising edge of SYNC.
0
14
reserved
reserved
1
13
fullwordinterface_ena
When asserted the input interface is changed to use the full 14-bits
for each word, instead of dual 8-bit buses for two half words. Note:
fixed to "1" for DAC3151/DAC3161.
1
12
64cnt_ena
This enables the resetting of the alarms after 64 good samples with 0
the goal of removing unnecessary errors. For instance on a lab
board, when checking the setup/hold through IO TEST, there may
initially be errors, but once the test is up and running everything
works. Setting this bit removes the need for a SIF write to clear the
alarm register.
11
dacclkgone_ena
This allows the DACCLK gone signal from the clock monitor to be
used to shut the output off.
0
10
dataclkgone_ena
This allows the DATACLK gone signal from the clock monitor to be
used to shut the output off.
0
9
collision_ena
This allows the collision alarm from the FIFO to shut the output off
0
8
reserved
reserved.
0
7
daca_compliment
When asserted the output to the DACA is complimented. This
allows the user of the chip to effectively change the + and –
designations of the DAC output pins.
0
6
reserved
reserved
0
5
sif_sync
This is the SIF_SYNC signal. Whatever is programmed into this
0
bitwill be used as the chip sync when SIF_SYNC mode is
enabled.Design is sensitive to rising edges so programming from 0>1 is when the sync pulse is generated. 1->0 has no effect.
4
sif_sync_ena
When asserted enable SIF_SYNC mode.
0
3
alarm_2away_ena
When asserted alarms from the FIFO that represent the pointers
being 2 away are enabled
1
2
alarm_1away_ena
When asserted alarms from the FIFO that represent the pointers
being 1 away are enabled
1
1
alarm_collision_ena
When asserted the collision of FIFO pointers causes an alarm to be 1
generated
0
reserved
reserved
0
Register name: config2 – Address: 0x02, Default: 0x3FFF
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config2
0x02
15
reserved
reserved.
0
14
reserved
reserved.
0
13:0
lvdsdata_ena
These 14 bits are individual enables for the 14 input pin receivers.
Note: for DAC3171 7-bit input interface mode, it is
recommended to turn off bits(6:0).
0x3FFF
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Register name: config3 – Address: 0x03, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config3
0x03
15:13
datadlya
Controls the delay of the A data inputs through the LVDS receivers. 000
0= no additional delay and each LSB adds a nominal 80ps.
12:10
clkdlya
Controls the delay of the A data clock input through the LVDS
receivers. 0= no additional delay and each LSB adds a nominal
80ps.
000
9:7
reserved
reserved.
000
6:4
reserved
reserved
000
3
extref_ ena
Enable external reference for the DAC when set.
0
2:1
reserved
reserved
00
0
reserved
reserved
0
Default Value
Register name: config4 – Address: 0x04, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config4
WRITE TO
CLEAR/
No RESET
value
0x04
15:14
reserved
reserved
00
13:0
iotest_ results
The values of these bits tell which bit in the input word failed during the
io-test pattern comparison.
0x0000
Register name: config5 – Address: 0x05, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config5
WRITE TO
CLEAR
0x05
15
alarm_from_ zerochka
When this bit is asserted the FIFOA write pointer has an all zeros
pattern in it. Since this pointer is a shift register, all zeros will cause
the input point to be stuck until the next sync. The result could be a
repeated 8T pattern at the output if the mixer is off and no syncs
occur. Check for this error will tell the user that another sync is
necessary to restart the FIFO write pointer.
0
14
reserved
reserved.
0
13:11
alarms_from_ fifoa
These bits report the FIFO A pointer status.
000: All fine
001: Pointers are 2 away
01X: Pointers are 1 away
1XX: FIFO Pointer collision
000
10:8
reserved
reserved
0
7
alarm_dacclk_ gone
Bit gets asserted when the DACCLK has been stopped long for
enough cycles to be caught. The number of cycles varies with
interpolation.
0
6
alarm_dataclk_ gone
Bit gets asserted when the DATACLK has been stopped long for
enough cycles to be caught. The number of cycles varies with
interpolation.
0
5
clock_gone
This bit gets set when either alarm_dacclk_gone or
alarm_dataclk_gone are asserted. It controls the output of the
CDRV_SER block. When high, the CDRV_SER block will output
“0x8000” for each output connected to a DAC. The bit must be
written to ‘0’ for CDRV_SER outputs to resume normal operation.
0
4
alarm_from_ iotesta
This is asserted when the input data pattern does not match the
pattern in the iotest_pattern registers.
0
3
reserved
reserved.
0
2
reserved
reserved
0
1
reserved
reserved
0
0
reserved
reserved
0
40
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Default
Value
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Register name: config6 – Address: 0x06, Default: 0x0010(DAC3171); 0x0094(DAC3161); 0x0098(DAC3151)
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config6
No RESET
Value
0x06
15:8
tempdata
This the output from the chip temperature sensor.
NOTE: when reading these bits the SIF interface must be exteremly
slow, 1MHz range.
0x00
7:2
fuse_cntl
These are the values of the blown fuses and are used to determine the
available functionality in the chip.
(*** NOTE ***) These bits are READ_ONLY and allow the user to check
what features have been disabled in the device.
bit5 = 1: Forces Full Word interface
bit4 = 0: reserved
bit3 = 0: reserved
bit2 = 1: Forces Single DAC Mode. Note: This does not force the
channel B in sleep mode. In order to do so, user needs to program
the sleepb SPI bit (config10, bit 5) to "1".
bit1:0 : Forces a different bits size.
“00” 14bit
“01” 12bit
“10” 10bit
“11” 10bit
0x10 for
DAC3171;
0x94 for
DAC3161;
0x98 for
DAC3151;
FUSE
controlled
1
reserved
reserved
0
0
reserved
reserved
0
Register name: config7 – Address: 0x07, Default: 0xFFFF
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config7
0x07
15:0
alarms_ mask
Each bit is used to mask an alarm. Assertion masks the alarm: bit15 =
alarm_mask_zerochka
bit14 = alarm_mask_zerochkb
bit13 = alarm_mask_fifoa_collision
bit12 = alarm_mask_fifoa_1away
bit11 = alarm_mask_fifoa_2away
bit10 = alarm_mask_fifob_collision
bit9 = alarm_mask_fifob_1away
bit8 = alarm_mask_fifob_2away
bit7 = alarm_mask_dacclk_gone
bit6 = alarm_mask_dataclk_gone
bit5 = Masks the signal which turns off the DAC output when a clock or
collision occurs. This bit has no effect on the PAD_ALARM output.
bit4 = alarm_mask_iotesta
bit3 = alarm_mask_iotestb
bit2 =
bit1 =
bit0 =
0xFFFF
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Register name: config8 – Address: 0x08, Default: 0x4000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config8
0x08
15:13
reserved
reserved
010
12:0
qmc_ offseta
The DAC A offset correction. The offset is measured in DAC LSBs.
0x0000
Register name: config9 – Address: 0x09, Default: 0x8000
Register
Name
Addr
(Hex)
Bit
Name
Function
config9
AUTO
SYNC
0x09
15:13
fifo_ offset
This is the starting point for the READ_POINTER in the FIFO block.
The READ_POINTER is set to this location when a sync occurs on the
DACCLK side of the FIFO.
100
12:0
reserved
reserved
0x0000
42
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Default
Value
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Register name: config10 – Address: 0x0A, Default: 0xF080
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
Config10
0x0A
15:12
coarse_ dac
Scales the output current is 16 equal steps.
1111
VrefIO
Rbias
´ (mem_coarse_daca + 1)
11
fuse_ sleep
Put the fuses to sleep when set high.
0
10
reserved
reserved
0
9
reserved
reserved
0
8
tsense_ sleep
When asserted the temperature sensor is put to sleep.
0
7
clkrecv_ ena
Turn on the DAC CLOCK receiver block when asserted.
1
6
sleepa
When asserted DACA is put to sleep.
0
5
sleepb
When asserted DACB is put to sleep. Note: This bit needs to be
programmed to "1" to save additional power.
0
4:0
reserved
reserved
00000
Register name: config11 – Address: 0x0B, Default: 0x1111
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config11
0x0B
15:12
reserved
reserved.
0001
11:8
reserved
reserved.
0001
7:4
reserved
reserved.
0001
3:0
reserved
reserved.
0001
Register name: config12 – Address: 0x0C, Default: 0x3A7A
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config12
0x0C
15:14
reserved
reserved.
00
13:0
iotest_ pattern0
This is dataword0 in the IO test pattern. It is used with the seven
other words to test the input data. (*** NOTE ***) This word should
be aligned with the rising edge of SYNC when testing the IO
interface.
0x3A7A
Register name: config13 – Address: 0x0D, Default: 0x36B6
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config13
0x0D
15:14
reserved
reserved.
00
13:0
iotest_ pattern1
This is dataword1 in the IO test pattern. It is used with the seven
other words to test the input data.
0x36B6
Register name: config14 – Address: 0x0E, Default: 0x2AEA
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config14
0x0E
15:14
reserved
reserved
00
13:0
iotest_ pattern2
This is dataword2 in the IO test pattern. It is used with the seven
other words to test the input data.
0x2AEA
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Register name: config15 – Address: 0x0F, Default: 0x0545
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config15
0x0F
15:14
reserved
reserved
00
13:0
iotest_ pattern3
This is dataword3 in the IO test pattern. It is used with the seven
other words to test the input data.
0x0545
Register name: config16 – Address: 0x10, Default: 0x1A1A
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config16
0x10
15:14
reserved
reserved
00
13:0
iotest_ pattern4
This is dataword4 in the IO test pattern. It is used with the seven
other words to test the input data.
0x1A1A
Register name: config17 – Address: 0x11, Default: 0x1616
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config17
0x11
15:14
reserved
reserved
00
13:0
iotest_ pattern5
This is dataword5 in the IO test pattern. It is used with the seven
other words to test the input data.
0x1616
Register name: config18 – Address: 0x12, Default: 0x2AAA
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config18
0x12
15:14
reserved
reserved
00
13:0
iotest_ pattern5
This is datawor6 in the IO test pattern. It is used with the seven
other words to test the input data.
0x2AAA
Register name: config19 – Address: 0x13, Default: 0x06C6
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config19
0x13
15:14
reserved
reserved
00
13:0
iotest_ pattern7
This is dataword7 in the IO test pattern. It is used with the seven
other words to test the input data.
0x06C6
Register name: config20– Address: 0x14, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config20
0x14
15
sifdac_ ena
When asserted the DAC output is set to the value in sifdac. This
can be used for trim setting and other static tests.
0
14
reserved
reserved
0
13:0
sifdac
This is the value that is sent to the DACs when sifdac_ena is
asserted.
0x0000
44
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Register name: config21– Address: 0x15, Default: 0xFFFF
Register
Name
Addr
(Hex)
Bit
Name
Function
Default Value
config21
0x15
15:0
sleepcntl
This controls what blocks get sent a SLEEP signal when the
PAD_SLEEP pin is asserted. Programming a ‘1’ in a bit will pass
the SLEEP signal to the appropriate block.
0xFFFF
bit15 = DAC A
bit14 = DAC B
bit13 = FUSE Sleep
bit12 = Temperature Sensor
bit11 = Clock Receiver
bit10 = LVDS DATA Receivers
bit9 = LVDS SYNC Receiver
bit8 = PECL ALIGN Receiver
bit7 = LVDS DATACLK Receiver
bit6 = reserved
bit5 = reserved
bit4 = reserved
bit3 = reserved
bit2 = reserved
bit1 = reserved
bit0 = reserved
Register name: config22– Address: 0x16, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config22
READ
ONLY
0x16
15:0
fa002_ data(15:0)
Lower 16bits of the DIE ID word
Default Value
Register name: config23– Address: 0x17, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config23
READ
ONLY
0x17
15:0
fa002_ data(31:16)
Lower middle 16bits of the DIE ID word
Default Value
Register name: config24– Address: 0x18, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config24
READ
ONLY
0x18
15:0
fa002_ data(47:32)
Upper middle 16bits of the DIE ID word
Default Value
Register name: config25– Address: 0x19, Default: 0x0000
Register
Name
Addr
(Hex)
Bit
Name
Function
config25
READ
ONLY
0x19
15:0
fa002_ data(63:48)
Upper 16bits of the DIE ID word
Default Value
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Register name: config127– Address: 0x7F, Default: 0x0045
Register
Name
Addr
(Hex)
Bit
Name
Function
Default
Value
config127
READ
ONLY/No
RESET
Value
0x7F
15:14
reserved
reserved
00
13:12
reserved
reserved
00
11:10
reserved
reserved
00
9:8
reserved
reserved
00
7
reserved
reserved
0
6
titest_voh
A fixed ‘1’ that can be used to test the Voh at the SIF output.
1
5
titest_vol
A fixed ‘0’ that can be used to test the Vol at the SIF output.
0
4:3
vendorid
Fixed at "01".
01
2:0
versionid
Chip version
001
Synchronization Modes
There are three modes of syncing included in the DAC3151/DAC3161/DAC3171.
•
NORMAL Dual Sync – The SYNC pin is used to align the input side of the FIFO (write pointers) with the A(0)
sample. The ALIGN pin is used to reset the output side of the FIFO (read pointers) to the offset value.
Multiple chip alignment can be accomplished with this kind of syncing.
• SYNC ONLY – In this mode only the SYNC pin is used to sync both the read and write pointers of the FIFO.
There is an asynchronized handoff between the DATACLK and DACCLK when using this mode, therefore it is
impossible to accurately align multiple chips closer than 2 or 3T.
• SIF_SYNC – When neither SYNC nor ALIGN are used, a programmable SYNC pulse can be used to sync
the design. However, the same issues as ISTROBE ONLY apply. There is an asynchronized handoff between
the serial clock domain and the two sides of the FIFO. Because of the asynchronous nature of the SIF_SYNC
it is impossible to align the sync up with any sample at the input. Note: SIF_SYNC mode is the only
synchronisation mode supported in the 7-bit interface mode.
Note: When ALIGNP/N are not used, it is recommended to clear the alignrx_ena register (config1, bit 4),
and tie ALIGNP to DIGVDD18 and ALIGNN to GROUND. When SYNCP/N are not used, it is recommended
to clear register lvdssyncrx_ena (config0, bit3), and the unused SYNCP/N pins can be left open or tied to
GROUND.
Alarm Monitoring
DAC3151/DAC3161/DAC3171 includes flexible alarm monitoring that can be used to alert a possible malfunction
scenario. All alarm events can be accessed either through the SIP registers and/or through the ALARM pin.
Once an alarm is set, the corresponding alarm bit in register config5 must be reset through the serial interface to
allow further testing. The set of alarms includes the following conditions:
Zero check alarm
• Alarm_from_zerochk. Occurs when the FIFO write pointer has an all zeros pattern. Since the write pointer is a
shift register, all zeros will cause the input point to be stuck until the next sync event. When this happens a
sync to the FIFO block is required.
FIFO alarms
• alarm_from_fifo. Occurs when there is a collision in the FIFO pointers or a collision event is close.
• alarm_fifo_2away. Pointers are within two addresses of each other.
• alarm_fifo_1away. Pointers are within one address of each other.
• alarm_fifo_collision. Pointers are equal to each other.
Clock alarms
• clock_gone. Occurs when either the DACCLK or DATACLOCK have been stopped.
• alarm_dacclk_gone. Occurs when the DACCLK has been stopped.
• alarm_dataclk_gone. Occurs when the DATACLK has been stopped.
Pattern checker alarm
46
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•
SLAS959A – AUGUST 2013 – REVISED AUGUST 2013
alarm_from_iotest. Occurs when the input data pattern does not match the pattern key.
To prevent unexpected DAC outputs from propagating into the transmit channel chain,
DAC3151/DAC3161/DAC3171 includes a feature that disables the outputs when a catastrophic alarm occurs.
The catastrophic alarms include FIFO pointer collision, the loss DACCLK or the loss of DATACLK. When any of
these alarms occur the internal TXenable signal is driven low, causing a zeroing of the data going to the DAC in
<10T. One caveat is if both clocks stop, the circuit cannot determine clock loss so no alarms are generated;
therefore, no zeroing of output data occurs.
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REVISION HISTORY
Changes from Original (August 2013) to Revision A
•
48
Page
Changed from Product Preview to Production Data ............................................................................................................. 1
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC3151IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
DAC3151I
DAC3151IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
DAC3151I
DAC3161IRGC25
PREVIEW
VQFN
RGC
64
25
TBD
Call TI
Call TI
-40 to 85
DAC3161IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
DAC3161I
DAC3161IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
DAC3161I
DAC3171IRGC25
ACTIVE
VQFN
RGC
64
25
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
DAC3171I
DAC3171IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
DAC3171I
DAC3171IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
DAC3171I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DAC3151IRGCR
VQFN
RGC
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
DAC3151IRGCT
VQFN
RGC
64
250
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
DAC3161IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
DAC3161IRGCT
VQFN
RGC
64
250
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
DAC3171IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
DAC3171IRGCT
VQFN
RGC
64
250
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Aug-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC3151IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
DAC3151IRGCT
VQFN
RGC
64
250
336.6
336.6
28.6
DAC3161IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
DAC3161IRGCT
VQFN
RGC
64
250
336.6
336.6
28.6
DAC3171IRGCR
VQFN
RGC
64
2000
336.6
336.6
28.6
DAC3171IRGCT
VQFN
RGC
64
250
336.6
336.6
28.6
Pack Materials-Page 2
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