BUK9514-55A; BUK9614-55A TrenchMOS™ logic level FET Rev. 01 — 7 Feb 2001 Product specification 1. Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology, featuring very low on-state resistance. Product availability: BUK9514-55A in SOT78 (TO-220AB) BUK9614-55A in SOT404 (D 2-PAK). 2. Features ■ ■ ■ ■ TrenchMOS™ technology Q101 compliant 175 °C rated Logic level compatible. 3. Applications c c ■ Automotive and general purpose power switching: ◆ 12 V and 24 V loads ◆ Motors, lamps and solenoids. 4. Pinning information Table 1: Pinning - SOT78 and SOT404, simplified outline and symbol Pin Description 1 gate (g) 2 drain (d) 3 source (s) mb mounting base; connected to drain (d) Simplified outline Symbol mb mb d g MBB076 2 MBK106 1 3 MBK116 1 2 3 SOT78 (TO-220AB) SOT404 (D2-PAK) s Philips Semiconductors BUK9514-55A; BUK9614-55A TrenchMOS™ logic level FET 5. Quick reference data Table 2: Quick reference data Symbol Parameter Conditions Typ Max Unit − 55 V VDS drain-source voltage (DC) ID drain current (DC) Tmb = 25 °C; VGS = 5 V − 73 A Ptot total power dissipation Tmb = 25 °C − 149 W Tj junction temperature − 175 °C RDSon drain-source on-state resistance Tj = 25 °C; VGS = 5 V; ID = 25 A 12 14 Tj = 25 °C; VGS = 4.5 V; ID = 25 A − 15 mΩ mΩ 6. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS drain-source voltage (DC) VDGR drain-gate voltage (DC) VGS gate-source voltage (DC) VGSM non-repetitive gate-source voltage ID drain current (DC) Conditions Min Max Unit − 55 V − 55 V − ±10 V tp ≤ 50 µs − ±15 V Tmb = 25 °C; VGS = 5 V; Figure 2 and 3 − 73 A Tmb = 100 °C; VGS = 5 V; Figure 2 − 52 A RGS = 20 kΩ IDM peak drain current Tmb = 25 °C; pulsed; tp ≤ 10 µs; Figure 3 − 266 A Ptot total power dissipation Tmb = 25 °C; Figure 1 − 149 W Tstg storage temperature −55 +175 °C Tj operating junction temperature −55 +175 °C Source-drain diode IDR reverse drain current (DC) Tmb = 25 °C − 73 A IDRM pulsed reverse drain current Tmb = 25 °C; pulsed; tp ≤ 10 µs − 266 A unclamped inductive load; ID = 73 A; VDS ≤ 55 V; VGS = 5 V; RGS = 50 Ω; starting Tmb = 25 °C − 230 mJ Avalanche ruggedness WDSS non-repetitive avalanche energy © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 2 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 03aa24 120 03na19 120 Ider (%) Pder (%) 100 100 80 80 60 60 40 40 20 20 0 0 0 25 50 75 100 125 0 150 175 200 Tmb (oC) 25 50 75 100 125 150 175 200 Tmb (oC) VGS ≥ 4.5 V P tot P der = ---------------------- × 100% P ° ID I der = ------------------- × 100% I ° tot ( 25 C ) D ( 25 C ) Fig 1. Normalized total power dissipation as a function of mounting base temperature. Fig 2. Normalized continuous drain current as a function of mounting base temperature. 03nd66 103 ID (A) RDSon = VDS/ ID tp = 10 us 102 100 us δ= P 10 tp 1 ms D.C. T 10 ms 100 ms t tp T 1 1 10 VDS (V) 102 Tmb = 25 °C; IDM single pulse. Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 3 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 7. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Value Unit Rth(j-a) thermal resistance from junction to ambient vertical in still air; SOT78 package 60 K/W mounted on printed circuit board; minimum footprint; SOT404 package 50 K/W Figure 4 1.0 K/W Rth(j-mb) thermal resistance from junction to mounting base 7.1 Transient thermal impedance 03nd67 10 Zth(j-mb) (K/W) 1 δ = 0.5 0.2 10-1 0.1 0.05 δ= P 0.02 tp T 10-2 Single Shot t tp T 10-3 10-6 10-5 10-4 10-3 10-2 10-1 tp (s) 1 Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 4 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 8. Characteristics Table 5: Characteristics Tj = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Tj = 25 °C 55 − − V Tj = −55 °C 50 − − V Tj = 25 °C 1 1.5 2 V Tj = 175 °C 0.5 − − V Tj = −55 °C − − 2.3 V Tj = 25 °C − 0.05 10 µA Tj = 175 °C − − 500 µA − 2 100 nA Tj = 25 °C − 12 14 mΩ Tj = 175 °C − − 28 mΩ VGS = 4.5 V; ID = 25 A − − 15 mΩ VGS = 10 V; ID = 25 A − 11 13 mΩ VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 12 − 2510 3307 pF − 430 535 pF − 290 406 pF − 26 − ns − 152 − ns − 166 − ns Static characteristics V(BR)DSS VGS(th) IDSS drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V gate-source threshold voltage ID = 1 mA; VDS = VGS; Figure 9 drain-source leakage current VDS = 55 V; VGS = 0 V IGSS gate-source leakage current VGS = ±10 V; VDS = 0 V RDSon drain-source on-state resistance VGS = 5 V; ID = 25 A; Figure 7 and 8 Dynamic characteristics Ciss input capacitance Coss output capacitance Crss reverse transfer capacitance td(on) turn-on delay time tr rise time td(off) turn-off delay time tf fall time Ld internal drain inductance Ls internal source inductance VDD = 30 V; RL = 1.2 Ω; VGS = 5 V; RG = 10 Ω − 125 − ns from drain lead 6 mm from package to centre of die − 4.5 − nH from contact screw on mounting base to centre of die SOT78 − 3.5 − nH from upper edge of drain mounting base to centre of die SOT404 − 2.5 − nH from source lead to source bond pad − 7.5 − nH © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 5 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET Table 5: Characteristics…continued Tj = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Source-drain diode VSD source-drain (diode forward) voltage IS = 20 A; VGS = 0 V; Figure 15 − 0.85 1.2 V trr reverse recovery time − 62 − ns Qr recovered charge IS = 20 A; dIS/dt = −100 A/µs VGS = −10 V; VDS = 30 V − 121 − nC 03nd63 300 ID (A) 250 VGS (V) = 10 9 8 7 RDSon (mΩ) 6 200 03nd62 16 14 5 150 12 4 100 10 3 50 2.2 0 0 2 4 6 8 8 10 VDS (V) 2 6 8 10 VGS (V) Tj = 25 °C; tp = 300 µs Tj = 25 °C; ID = 25 A Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values. 30 4 Fig 6. Drain-source on-state resistance as a function of gate-source voltage; typical values. 03aa28 2.2 03nd64 VGS (V) = 3 3.2 3.4 3.6 3.8 4 5 a RDSon 2 1.8 (mΩ) 1.6 1.4 20 1.2 1 0.8 10 0.6 0.4 0.2 0 0 0 50 100 150 200 -60 250 -20 ID (A) Tj = 25 °C 60 100 140 180 o Tj ( C) R DSon a = --------------------------R DSon ( 25 °C ) Fig 7. Drain-source on-state resistance as a function of drain current; typical values. Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification 20 Rev. 01 — 7 Feb 2001 6 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 03aa36 10-1 03aa33 2.5 VGS(th) ID (V) max (A) 10-2 2 typ 10-3 1.5 min 1 10-4 0.5 10-5 0 10-6 -60 -20 20 60 100 min 0 140 180 Tj (oC) 0.5 1 typ 1.5 max 2 2.5 3 VGS (V) Tj = 25 °C; VDS = VGS ID = 1 mA; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature. Fig 10. Sub-threshold drain current as a function of gate-source voltage. 03nd60 60 03nd65 7000 C (pF) gfs (S) 6000 5000 40 4000 3000 Ciss 20 2000 1000 Coss Crss 0 0 0 20 40 60 10-2 80 10-1 ID (A) Tj = 25 °C; VDS = 25 V 10 102 VDS (V) VGS = 0 V; f = 1 MHz Fig 11. Forward transconductance as a function of drain current; typical values. Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification 1 Rev. 01 — 7 Feb 2001 7 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 03nd61 80 03nd59 5 VGS (V) ID (A) VDD = 14V 4 60 VDD = 44V 3 40 2 20 1 Tj = 25 oC Tj = 175 oC 0 0 0 1 2 3 4 0 20 40 60 QG (nC) VGS (V) Tj = 25 °C; ID = 25 A VDS = 25 V Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values. Fig 14. Gate-source voltage as a function of turn-on gate charge; typical values. 03nd58 100 IS (A) 80 Tj = 175 oC 60 Tj = 25 oC 40 20 0 0.0 0.5 1.0 1.5 VSD (V) VGS = 0 V Fig 15. Reverse diode current as a function of reverse diode voltage; typical values. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 8 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 9. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB E SOT78 A A1 P q mounting base D1 D L1 L2(1) Q b1 L 1 2 3 b c e e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) UNIT A A1 b b1 c D D1 E e L L1 L2 max. P q Q mm 4.5 4.1 1.39 1.27 0.9 0.7 1.3 1.0 0.7 0.4 15.8 15.2 6.4 5.9 10.3 9.7 2.54 15.0 13.5 3.30 2.79 3.0 3.8 3.6 3.0 2.7 2.6 2.2 Note 1. Terminals in this zone are not tinned. OUTLINE VERSION REFERENCES IEC SOT78 JEDEC EIAJ 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 99-09-13 00-09-07 Fig 16. SOT78 (TO-220AB). © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 9 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET Plastic single-ended surface mounted package (Philips version of D2-PAK); 3 leads (one lead cropped) SOT404 A A1 E mounting base D1 D HD 2 Lp 1 3 c b e e Q 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D max. D1 E e Lp HD Q mm 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 11 1.60 1.20 10.30 9.70 2.54 2.90 2.10 15.40 14.80 2.60 2.20 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 98-12-14 99-06-25 SOT404 Fig 17. SOT404 (D2-PAK). © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 10 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 10. Soldering 10.85 10.60 10.50 handbook, full pagewidth 1.50 7.50 7.40 1.70 2.25 2.15 8.15 8.275 8.35 1.50 4.60 0.30 4.85 5.40 7.95 8.075 3.00 0.20 1.20 1.30 1.55 solder lands solder resist 5.08 MSD057 occupied area solder paste Dimensions in mm. Fig 18. Reflow soldering footprint for SOT404. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 11 of 15 Philips Semiconductors BUK9514-55A; BUK9614-55A TrenchMOS™ logic level FET 11. Revision history Table 6: Revision history Rev Date 01 20010207 CPCN Description - Product Specification; initial version © Philips Electronics N.V. 2001. All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 12 of 15 BUK9514-55A; BUK9614-55A Philips Semiconductors TrenchMOS™ logic level FET 12. Data sheet status Datasheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued data sheet before initiating or completing a design. 13. Definitions 14. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. © Philips Electronics N.V. 2001 All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 13 of 15 Philips Semiconductors BUK9514-55A; BUK9614-55A TrenchMOS™ logic level FET Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044 Finland: Tel. +358 961 5800, Fax. +358 96 158 0920 France: Tel. +33 14 099 6161, Fax. +33 14 099 6427 Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300 Hungary: Tel. +36 1 382 1700, Fax. +36 1 382 1800 India: Tel. +91 22 493 8541, Fax. +91 22 493 8722 Indonesia: see Singapore Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200 Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007 Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057 Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415 Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399 New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811 Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474 Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107 Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745 Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730 Taiwan: Tel. +886 22 134 2451, Fax. +886 22 134 2874 Thailand: Tel. +66 23 61 7910, Fax. +66 23 98 3447 Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553 For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE, P.O. 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All rights reserved. 9397 750 07886 Product specification Rev. 01 — 7 Feb 2001 14 of 15 Philips Semiconductors BUK9514-55A; BUK9614-55A TrenchMOS™ logic level FET Contents 1 2 3 4 5 6 7 7.1 8 9 10 11 12 13 14 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Transient thermal impedance . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 © Philips Electronics N.V. 2001. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 7 Feb 2001 Document order number: 9397 750 07886