LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Features and Benefits Description • PWM and quasi-resonant topology • Integrated on-time control circuit (it realizes high power factor by average current control) • Integrated soft-start circuit (reduces power stress during start-up on the incorporated power MOSFET and output rectifier) • Integrated bias assist circuit (improves startup performance, suppresses VCC voltage droop during operation, and allows use of low-rated ceramic capacitor on VCC pin) • Integrated Leading Edge Blanking (LEB) circuit • Integrated maximum on-time limit circuit • Protection features: ▫ Overcurrent protection (OCP): pulse-by-pulse ▫ Overvoltage protection (OVP): latched shutdown ▫ Overload protection (OLP): latched shutdown ▫ Thermal shutdown (TSD): latched shutdown LC5550LD series are PWM and quasi-resonant topology non-isolated buck LED driver ICs. They incorporate separate controller and power MOSFET chips, and are designed for input capacitorless applications. The controller adapts the average current control method for realizing high power factors. The rich set of protection features helps to realize low component counts, and high performance-to-cost power supply. Applications • LED lighting fixtures • LED light bulbs Package: 8-pin DIP Not to scale Typical Application R1 D6 R2 U1 5 6 ISENSE D3 D4 D1 D2 D/ST 8 V AC LC5550LD Contro1 NF COMP 4 3 OCP/BD 2 1 V CC S/GND C2 C3 C4 C5 R5 C6 R3 R4 C1 T1 C7 R6 LED D5 LC5550LD-DS SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Selection Guide Part Number MOSFET VDSS(min) (V) RDS(on) (max) (Ω) PWM Operation Frequency, fOSC(typ) (kHz) On-Time tON(MAX)(typ) (μs) LC5555LD 650 3.95 72 9.3 LC5556LD 650 1.9 60 11.2 *Based on the thermal rating; the allowable maximum output power can be up to 120% to 140% of this value. However, maximum output power may be limited in such an application with low output voltage or short duty cycle. The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC. LC5550LD Absolute Maximum Ratings Unless specifically noted, TA is 25°C Characteristic Drain Current1 Single Pulse Avalanche Energy2 Symbol IDPeak EAS Pins Rating Unit LC5555LD Single pulse Notes 8–1 2.5 A LC5556LD Single pulse 8–1 4.0 A LC5555LD ILPeak = 2.0 A, VDD = 99 V, L = 20 mH 8–1 47 mJ LC5556LD ILPeak = 2.7 A, VDD = 99 V, L = 20 mH 8–1 86 mJ Input Voltage for Control Part (MIC) VCC 2–1 35 V OCP/BD Pin Voltage VOCP 3–1 −2.0 to 5.0 V COMP Pin Voltage VCOMP 4–1 −0.3 to 7.0 V ISENSE Pin Voltage VSEN 6–1 −0.3 to 5.0 V Allowable Power Dissipation of MOSFET3 PD1 8–1 0.97 W Operating Ambient Temperature TOP ― −55 to 125 °C Storage Temperature Tstg ― −55 to 125 °C Channel Temperature Tch ― 150 °C Mounted on a 15 mm × 15 mm PCB 1Refer to MOSFET Safe Operating Area Curve. to MOSFET Avalanche Energy Derating Coefficient Curve. 3Refer to MOSFET Temperature versus Power Dissipation Curve. 2Refer LC5550LD-DS 2 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver LC5550LD Electrical Characteristics of Control Part (MIC) Unless specifically noted, TA is 25°C, VCC is 18 V Characteristic Symbol Test Conditions Pins Min. Typ. Max. Unit Power Supply Startup Operation Operation Start Voltage VCC(ON) 2–1 13.8 15.1 17.3 V Operation Stop Voltage* VCC(OFF) 2–1 8.4 9.4 10.7 V ICC(ON) 2–1 – – 4.7 mA VSTARTUP 8–1 18 21 24 V 2–1 −8.5 −4.0 −1.5 mA 2–1 9.5 11.0 12.5 V 60 72 84 kHz Circuit Current in Operation Startup Circuit Operation Voltage Startup Current Startup Current Threshold Biasing Voltage* ICC(STARTUP) VCC = 13 V VCC(BIAS) Normal Operation PWM Operation Frequency Maximum On-Time COMP Pin Control Minimum Voltage LC5555LD fOSC LC5556LD LC5555LD tON(MAX) LC5556LD 8–1 8–1 50 60 70 kHz 8.0 9.3 11.2 μs 9.0 11.2 13.4 μs VCOMP(MIN) 4–1 0.30 0.55 0.80 V VSEN(TH) 6–1 –0.21 –0.2 –0.19 V ISEN(SOURCE) 4–1 −36 −24 −12 μA Error Amplifier Sink Current ISEN(SINK) 4–1 12 24 36 μA Error Amplifier Reference Voltage Error Amplifier Source Current Leading Edge Blanking Time tON(LEB) 3–1 − 600 − ns Quasi-Resonant Operation Threshold Voltage-1 VBD(TH1) 3–1 0.14 0.24 0.34 V Quasi-Resonant Operation Threshold Voltage-2 VBD(TH2) 3–1 0.11 0.16 0.21 V OCP/BD Pin Overcurrent Protection (OCP) Threshold Voltage VOCP 3–1 −0.92 −0.8 −0.68 V OCP.BD Pin Source Current IOCP 3–1 −120 −40 −10 μA OCP/BD Pin Overvoltage Protection (OVP) Operation Voltage VBD(OVP) 3–1 2.2 2.6 3.0 V Overload Protection (OLP) Threshold Voltage VCOMP(OLP) 4–1 4.1 4.5 4.9 V VCC(OVP) 2–1 28.5 31.5 34.0 V TJ(TSD) – 135 – – °C Protected Operation VCC Pin OVP Threshold Voltage Thermal Shutdown Activating Temperature *VCC(BIAS) > VCC(OFF) always. LC5550LD-DS 3 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver LC5550LD Electrical Characteristics of MOSFET Unless specifically noted, TA is 25°C Characteristic Symbol Drain-to-Source Breakdown Voltage VDSS Drain Leakage Current IDSS On-Resistance Switching Time Thermal Resistance* RDS(ON) tf Rθch-c Test Conditions LC5555LD LC5556LD LC5555LD LC5556LD LC5555LD LC5556LD Pins Min. Typ. Max. Unit 8–1 650 ― ― V 8–1 ― ― 300 μA ― ― 3.95 Ω 8–1 8–1 ― ― ― 1.9 Ω ― ― 250 ns ― ― 400 ns ― ― 42 °C/W ― ― 35.5 °C/W *The thermal resistance between the channels of the MOSFET and the case. TC measured at the center of the case marked side. LC5550LD-DS 4 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Characteristic Performance LC5555LD MOSFET Safe Operating Area Curve 10 Drain current limited by on-resistance 100 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0 0 25 50 75 100 125 0.1 ms 1 ms 1 0.1 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 1.2 1.0 0.8 0.6 0.4 0.2 0 0 Transient Thermal Resistance, Rθch-c (°C/W) Channel Temperature, Tch (°C) 10 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance Curve 1 0.1 0.01 10–6 10–5 10–4 10–3 10–2 10–1 Time (s) LC5550LD-DS 5 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Characteristic Performance LC5556LD MOSFET Safe Operating Area Curve 10 0.1 ms 100 1 ms 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0 0 25 50 75 100 125 1 Drain current limited by on-resistance 0.1 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 1.2 1.0 0.8 0.6 0.4 0.2 0 0 Transient Thermal Resistance, Rθch-c (°C/W) Channel Temperature, Tch (°C) 10 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance Curve 1 0.1 0.01 10–6 10–5 10–4 10–3 10–2 10–1 Time (s) LC5550LD-DS 6 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Typical Application Circuit 1, PWM Topology R1 D6 R2 U1 5 6 ISENSE D3 D4 D1 D2 LC5550LD Contro1 NF D/ST 8 V AC COMP 4 3 OCP/BD 2 1 V CC S/GND C2 C3 C4 C5 R5 C6 T1 R4 R3 C1 C7 R6 C7 R6 LED D5 Typical Application Circuit 2, Quasi-Resonant Topology D6 R1 R2 U1 5 6 ISENSE D3 D4 D/ST 8 V AC D1 LC5550LD Contro1 NF COMP 4 D7 3 OCP/BD 2 1 V CC S/GND C2 C3 C4 C5 R5 C6 D8 C6 R3 D2 R7 R4 T1 CV C1 LED D5 LC5550LD-DS 7 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Functional Block Diagram VCC ② Control Part ⑧ D/ST START UP TSD UVLO Reg Drv Bias OVP ① S/GND S RQ ⑥ ISENSE OCP/BD ③ Bottom Detection OCP NF ⑤ OSC OLP OTA LEB Reg Feedback Control ④ COMP Reg Pin List Table Number Name 1 S/GND 2 VCC 8 D/ST 3 OCP/BD 6 ISENSE 4 COMP 5 NF 6 ISENSE 7 – 8 D/ST Pin-out Diagram S/GND 1 VCC 2 OCP/BD 3 COMP 4 LC5550LD-DS 5 NF Function MOSFET source and GND pin for the Control Part Supply voltage input and Overvoltage Protection (OVP) signal input Overcurrent Protection (OCP), quasi-resonant signal input, and Overvoltage Protection (OVP) signal input Feedback phase-compensation input No function; must be externally connected to S/GND pin with as short a trace as possible, for stable operation of the IC Output current sensing voltage input Pin removed MOSFET drain pin and input of the startup current 8 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Package Diagram DIP8 package 9.4 ±0.3 5 1 4 6.5 ±0.2 8 1.0 +0.3 -0.05 +0.3 1.52 -0.05 3.3 ±0.2 7.5 ±0.5 4.2 ±0.3 3.4 ±0.1 (7.6 TYP) 0.2 5 + 0. - 0.01 5 ０～１５° ０～１５° 2.54 TYP 0.89 TYP 0.5 ±0.1 Unit： mm 8 LC555x SK YMD L Part Number Lot Number Y is the last digit of the year (0 to 9) M is the month (1 to 9, O, N, or D) D is a period of days (1 to 3): 1 – 1st to 10th 2 – 11th to 20th 3 – 21st to 31st Sanken Control Number 1 Pb-free. Device composition compliant with the RoHS directive. LC5550LD-DS 9 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of the products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress. • Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials Inc. SC102 Dow Corning Toray Co., Ltd. LC5550LD-DS Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10±1 s (Flow, 2 times) 380±10°C 3.5±0.5 s (Soldering iron, 1 time) • Soldering should be at a distance of at least 1.5 mm from the body of the products. Electrostatic Discharge • When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. 10 SANKEN ELECTRIC CO., LTD. July 9, 2012 LC5550LD Series Single-Stage Power Factor Corrected High Efficiency Non-Isolated Buck LED Driver • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network. • The contents in this document must not be transcribed or copied without Sanken's written consent. LC5550LD-DS 11 SANKEN ELECTRIC CO., LTD. July 9, 2012