MC33375 Advance Information Low Dropout 300 mA Voltage Regulator with ON/OFF Control The MC33375 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT–223, and SOP–8 surface mount packages. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. The MC33375 has a control pin that allows a logic level signal to turn–off or turn–on the regulator output. Due to the low input–to–output voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable. http://onsemi.com LOW DROPOUT MICROPOWER VOLTAGE REGULATOR Gnd 4 A = Manufacturing Code YW = Date xx = Version AYW 375xx 1 2 3 Vin ON/OFF Vout Features: • Low Quiescent Current (0.3 mA in OFF mode; 125 mA in ON mode) • Low Input–to–Output Voltage Differential of 25 mV at IO = 10 mA, • • • • 4 1 3 and 260 mV at IO = 300 mA Extremely Tight Line and Load Regulation Stable with Output Capacitance of only 0.33 mF for 2.5 V Output Voltage Internal Current and Thermal Limiting Logic Level ON/OFF Control PLASTIC ST SUFFIX CASE 318E 1 8 2 7 Output Input Gnd Simplified Block Diagram ALYW 375xx 3 Gnd Vin Vout ON/OFF 4 Gnd 6 Gnd 5 N/C Pins 4 and 5 Not Connected Thermal & Anti–sat Protection AL = Manufacturing Code YW = Date xx = Version On/Off Rint 8 1 On/Off Block 1.23 V V. Ref. PLASTIC D SUFFIX CASE 751 54 K Gnd This device contains 41 active transistors ORDERING INFORMATION This document contains information on a new product. Specifications and information herein are subject to change without notice. Semiconductor Components Industries, LLC, 2000 March, 2000 – Rev. 4 1 See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Publication Order Number: MC33375/D MC33375 ELECTRICAL CHARACTERISTICS (CL = 1.0µF, TA = 25°C, for min/max values TJ = –40°C to +125°C, Note 1) Symbol Characteristic Output Voltage 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix IO = 0 mA to 250 mA TA = 25°C, Vin = [VO + 1] V Min Typ Max 1.782 2.475 2.970 3.267 4.950 1.80 2.50 3.00 3.30 5.00 1.818 2.525 3.030 3.333 5.05 1.764 2.450 2.940 3.234 4.900 — — — — — 1.836 2.550 3.060 3.366 5.100 VO Unit Vdc 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Vin = [VO + 1] V, 0 < IO < 100 mA 2% Tolerance from TJ = –40 to +125°C Line Regulation Vin = [VO + 1] V to 12 V, IO = 250 mA, All Suffixes TA = 25°C Regline – 2.0 10 mV Load Regulation Vin = [VO + 1] V, IO = 0 mA to 250 mA, All Suffixes TA = 25°C Regload – 5.0 25 mV — — — — 25 115 220 260 100 200 400 500 65 75 — — — 160 46 — — — — — 125 0.3 1100 200 4.0 1500 — 450 — 2.4 — — — — — — 0.5 0.3 — 150 — Dropout Voltage IO = 10 mA IO = 100 mA IO = 250 mA IO = 300 mA Vin – VO TJ = –40°C to +125°C Ripple Rejection (120 Hz) Vin(peak–peak) = [VO + 1.5] V to [VO + 5.5] V Output Noise Voltage C L = 1 mF IO = 50 mA (10 Hz to 100 kHz) CL = 200 mF — mV dB mVrms Vn CURRENT PARAMETERS Quiescent Current On Mode Vin = [VO + 1] V, IO = 0 mA Off Mode On Mode SAT Vin = [VO – 0.5] V, IO = 0 mA, Note 2 Current Limit mA IQ Vin = [VO + 1] V, VO shorted ILIMIT mA ON/OFF INPUTS On/Off Input Voltage Logic “1” (Regulator On) Vout = VO ± 2% Logic “0” (Regulator Off) Vout < 0.03V Logic “0” (Regulator Off) Vout < 0.05V (1.8 V Option) VCTRL V THERMAL SHUTDOWN Thermal Shutdown — NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. NOTE: 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO – 0.5] V guarantees this condition. http://onsemi.com 2 °C MC33375 DEFINITIONS difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following: Load Regulation – The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage – The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage – The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation – The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current – Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation – The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation – The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150°C. The junction temperature is rising while the Pd + TRJ – TA qJA The maximum operating junction temperature TJ is specified at 150°C, if TA = 25°C, then PD can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as: I out +V P D – Vout CC The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150°C for MC33375) and ambient temperature. R T –T J A + qJA P D http://onsemi.com 3 MC33375 Figure 1. Line Transient Response Figure 2. Line Transient Response 7 150 TA = 25° C 6 CL = 33 mF IL = 10 mA 5 Vout = 3.3 V 100 4 50 3 0 2 Vout –50 1 0 0 20 40 60 80 100 120 140 160 70 60 Vin 40 4 30 3 20 10 2 0 1 Vout 0 50 100 Figure 4. Load Transient Response 1.0 300 –100 0.2 –200 0 0 50 –0.2 Vout CHANGE –0.4 –0.6 –0.8 100 150 200 250 300 350 LOAD CURRENT (mA) LOAD CURRENT (mA) 0.4 150 LOAD CURRENT –50 0.04 –150 –0.01 –250 –350 CL = 33.0 mF Vout = 3.3 V TA = 25° C Vin = 4.3 V Vout CHANGE –450 –550 –650 –750 –1.0 400 –0.06 –0.11 –0.16 0 50 100 TIME (mS) 150 200 250 300 TIME (mS) Figure 5. Output Voltage versus Input Voltage Figure 6. Dropout Voltage versus Output Current 300 3.5 3.0 IL = 1 mA DROPOUT VOLTAGE (mV) OUTPUT VOLTAGE (V) 0.09 50 OUTPUT VOLTAGE CHANGE (V) 0 0.14 250 0.6 LOAD CURRENT OUTPUT VOLTAGE CHANGE (V) 200 –700 350 0.8 –400 CL = 1.0 mF Vout = 3.3 V –500 TA = 25° C –600 Vin = 4.3 V –20 200 150 TIME (mS) Figure 3. Load Transient Response –300 –10 0 –100 180 200 TIME (mS) 100 50 Vin , INPUT VOLTAGE (V) Vin 200 OUTPUT VOLTAGE CHANGE (mV) TA = 25° C 6 CL = 0.47 mF IL = 10 mA 5 Vout = 3.3 V OUTPUT VOLTAGE CHANGE (mV) Vin , INPUT VOLTAGE (V) 7 2.5 IL = 250 mA 2.0 1.5 1.0 250 200 150 100 50 0.5 0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1 4.5 5.0 10 100 IO, OUTPUT CURRENT (mA) INPUT VOLTAGE (V) http://onsemi.com 4 1000 MC33375 Figure 8. Ground Pin Current versus Input Voltage Figure 7. Dropout Voltage versus Temperature 12 250 10 IL = 300 mA 8 200 Ignd (mA) DROPOUT VOLTAGE (mV) 300 IL = 250 mA 150 IL = 100 mA 100 IL = 300 mA 6 4 IL = 100 mA 50 2 IL = 10 mA 0 –40 0 IL = 50 mA 25 0 85 0 1 2 3 TEMPERATURE (°C) Figure 9. Ground Pin Current versus Ambient Temperature 2.5 8 7 4 5 6 7 8 Vin (VOLTS) Figure 10. Output Voltage versus Ambient Temperature (Vin = Vout + 1V) IO = 0 2.495 IL = 250 mA Vout (VOLTS) Ignd (mA) 6 5 4 3 2.49 IO = 250 mA 2.485 IL = 100 mA 2.48 IL = 50 mA 2.475 2 1 0 –40 –20 0 20 40 60 80 100 120 2.47 –40 140 0 25 TEMPERATURE (°C) TA (°C) http://onsemi.com 5 85 MC33375 Figure 11. Output Voltage versus Ambient Temperature (Vin = 12 V) 2.5 IO = 0 2.495 Vout (VOLTS) 2.49 IO = 250 mA 2.485 2.48 2.475 2.47 2.465 –40 0 25 85 TEMPERATURE (°C) Figure 12. Ripple Rejection Figure 13. Ripple Rejection 70 70 60 60 IL = 100 mA IL = 10 mA 50 50 IL = 250 mA dB 40 30 30 20 20 10 10 0 0.1 1 10 0 0.1 100 1 10 FREQUENCY (kHz) FREQUENCY (kHz) Figure 14. Enable Transient 5 ENABLE 4.5 4 VOLTAGE (V) dB IL = 1 mA 40 3.5 CL = 1.0 mF 3 2.5 CL = 33 mF 2 1.5 1 0.5 0 0 100 200 300 TIME (mS) http://onsemi.com 6 400 500 100 MC33375 1.8 V Option Figure 15. Output Voltage versus Temperature Figure 16. Output Voltage versus Input Voltage 1.85 2.0 ILOAD = 100 mA 1.8 VOUT, OUTPUT VOLTAGE (V) VOUT , OUTPUT VOLTAGE (V) 1.84 1.83 1.82 1.81 1.80 1.79 1.78 1.77 1.76 1.75 –40 12 1.2 1.0 0.8 0.6 0.4 TA = 25° C ILOAD = 0 mA 0.2 0 –20 0 20 40 60 80 100 120 1 0 3 2 5 4 6 TA, AMBIENT TEMPERATURE (°C) VCC, (V) Figure 17. Ground Current versus Load Current Figure 18. Quiescent Current versus Input Voltage 140 120 10 100 TA = 25° C VCC = 3 V IQ (m A) 8 Ignd , (mA) 1.6 1.4 6 4 80 60 40 2 TA = 25° C ILOAD = 0 mA 20 0 0 0 50 100 150 200 250 300 350 0 1 3 2 ILOAD, (mA) 5 4 6 VCC, (V) Figure 19. PSRR versus Frequency Figure 20. Enable Response 80 VCC = 3 V ILOAD = 1 mA TA = 25°C COUT = 1 mF 70 PSRR (dB) 60 ENABLE 2V 50 VOUT 40 30 20 0V 10 0 0.1 1 10 100 0 1000 5 10 15 20 25 30 t, TIME (ms) f, FREQUENCY (kHz) http://onsemi.com 7 35 40 45 50 MC33375 Figure 21. Load Transient Response VCC = 3 V ILOAD = 1 mA to 100 mA TA = 25°C 1.82 V 1.80 V 1.78 V 100 mA 1 mA 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 t, TIME (ms) APPLICATIONS INFORMATION Figure 22. Typical Application Circuit ON/OFF Vout Vin MC33375–xx Cin Cout LOAD GND frequencies. A 0.33 mF or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator’s input terminals. Figure 16 shows the ESR that allows the LDO to remain stable for various load currents. The MC33375 regulators are designed with internal current limiting and thermal shutdown making them user–friendly. Figure 15 is a typical application circuit. The output capability of the regulator is in excess of 300 mA, with a typical dropout voltage of less than 260 mV. Internal protective features include current and thermal limiting. EXTERNAL CAPACITORS These regulators require only a 0.33 mF (or greater) capacitance between the output and ground for stability for 1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output voltage options of 5.0 V require only 0.22 mF for stability. The output capacitor must be mounted as close as possible to the MC33375. If the output capacitor must be mounted further than two centimeters away from the MC33375, then a larger value of output capacitor may be required for stability. A value of 0.68 mF or larger is recommended. Most type of aluminum, tantalum, or multilayer ceramic will perform adequately. Solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25°C. An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. This will reduce the circuit’s sensitivity to the input line impedance at high Figure 23. ESR for Vout = 3.0V 100 ESR (ohm) Vout = 3.0 V Cout = 1.0 mF Cin = 1.0 mF 10 Stable Region 1.0 0.1 0 50 100 150 200 250 300 LOAD CURRENT (mA) Applications should be tested over all operating conditions to insure stability. http://onsemi.com 8 MC33375 THERMAL PROTECTION The internal current limit will typically limit current to 450 mA. If during current limit the junction exceeds 150°C, the thermal protection will protect the device also. Current limit is not a substitute for proper heatsinking. Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 150°C, the output is disabled. There is no hysteresis built into the thermal protection. As a result the output will appear to be oscillating during thermal limit. The output will turn off until the temperature drops below the 150°C then the output turns on again. The process will repeat if the junction increases above the threshold. This will continue until the existing conditions allow the junction to operate below the temperature threshold. OUTPUT NOISE In many applications it is desirable to reduce the noise present at the output. Reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise on the MC33375. ON/OFF PIN When this pin is pulled low, the MC33375 is off. This pin should not be left floating. The pin should be pulled high for the MC33375 to operate. Thermal limit is not a substitute for proper heatsinking. 2.50 R θ JA, THERMAL RESISTANCE JUNCTION-TO-AIR (°C/W) 280 Free Air Mounted Vertically 240 PD(max) for TA = 50°C ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 200 Minimum Size Pad 160 1.25 2.0 oz. Copper L L 120 80 0.83 0.63 0.50 0.42 RθJA 0.35 40 0 5.0 10 15 20 25 30 R θ JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (°C/W) L, LENGTH OF COPPER (mm) Figure 25. SOP–8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length 3.2 170 150 2.8 PD(max) for TA = 50°C 130 2.4 110 Graph Represents Symmetrical Layout 2.0 90 L 70 ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ 2.0 oz. Copper 3.0 mm L RθJA 50 1.6 1.2 0.8 0.4 30 0 10 20 30 L, LENGTH OF COPPER (mm) http://onsemi.com 9 40 50 PD, MAXIMUM POWER DISSIPATION (W) Figure 24. SOT–223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length MC33375 ORDERING INFORMATION MC33375ST–1.8T3 1.8 V (Fixed V) 318E SOT–223 MC33375ST–2.5T3 2.5 V (Fixed Voltage) 318E SOT–223 751–5 SOP–8 MC33375D–2.5R2 MC33375ST–3.0T3 MC33375D–3.0R2 MC33375ST–3.3T3 MC33375D–3.3R2 MC33375ST–5.0T3 MC33375D–5.0R2 3.0 V (Fixed Voltage) 1% Tolerance at TA = 25°C 3.3 V (Fixed Voltage) 2% Tolerance at TJ from –40 to +125°C 5.0 V (Fixed Voltage) 318E SOT–223 751–5 SOP–8 318E SOT–223 751–5 SOP–8 318E SOT–223 751–5 SOP–8 DEVICE MARKING Device Version Marking (1st line) MC33375 1.8V 37518 MC33375 2.5V 37525 MC33375 3.0V 37530 MC33375 3.3V 37533 MC33375 5.0V 37550 TAPE AND REEL SPECIFICATIONS Device Reel Size Tape Width Quantity MC33375D 13” 12mm embossed tape 2500 units MC33375ST 13” 8mm embossed tape 4000 units MAXIMUM RATINGS (TA = 25°C, for min/max values TJ = –40°C to +125°C) Rating Symbol Value Unit VCC 13 Vdc PD Internally Limited W RθJA RθJC 160 25 °C/W °C/W RθJA RθJC 245 15 °C/W °C/W Output Current IO 300 mA Maximum Junction Temperature TJ 150 °C Operating Junction Temperature Range TJ – 40 to +125 °C Storage Temperature Range Tstg – 65 to +150 °C Input Voltage Power Dissipation and Thermal Characteristics TA = 25°C Maximum Power Dissipation Case 751 (SOP–8) D Suffix Thermal Resistance, Junction–to–Ambient Thermal Resistance, Junction–to–Case Case 318E (SOT–223) ST Suffix Thermal Resistance, Junction–to–Air Thermal Resistance, Junction–to–Case http://onsemi.com 10 MC33375 PACKAGE DIMENSIONS ST SUFFIX PLASTIC PACKAGE CASE 318E–04 (SOT–223) ISSUE J A F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 S B 1 2 3 D L G J C 0.08 (0003) M H INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30 K D SUFFIX PLASTIC PACKAGE CASE 751–06 (SOP–8) ISSUE T D A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 4 h B e X 45 _ q A C SEATING PLANE L 0.10 A1 B 0.25 M C B S A S DIM A A1 B C D E e H h L q http://onsemi.com 11 MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ MC33375 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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