Material Content Data Sheet Sales Product Name BSP742T MA# MA000975734 Package PG-DSO-8-24 Issued 29. August 2013 Weight* 82.96 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.250 1.51 0.009 0.01 0.036 0.04 432 0.717 0.86 8645 29.121 35.10 36.01 351026 360211 0.281 0.34 0.34 3388 3388 0.099 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.51 15065 15065 108 1196 4.565 5.50 44.954 54.20 59.82 541873 598093 0.814 0.98 0.98 9810 9810 0.650 0.78 0.78 7838 7838 0.081 0.10 0.383 0.46 55025 979 0.56 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4615 5594 1000000