PHILIPS ACH16821DGG 20-bit bus-interface d-type flip-flop; positive-edge trigger 3-state Datasheet

INTEGRATED CIRCUITS
74ALVCH16821
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
Product specification
IC24 Data Handbook
1998 May 29
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
FEATURES
DESCRIPTION
• Wide supply voltage range of 1.2V to 3.6V
• Complies with JEDEC standard no. 8-1A
• Current drive ± 24 mA at 3.0 V
• CMOS low power consumption
• Direct interface with TTL levels
• MULTIBYTETM flow-through standard pin-out architecture
• Low inductance multiple VCC and ground pins for minimum noise
The 74ALVCH16821 has two 10-bit, edge triggered registers, with
each register coupled to a 3-State output buffer. The two sections of
each register are controlled independently by the clock (nCP) and
Output Enable (nOE) control gates.
Each register is fully edge triggered. The state of each D input, one
set-up time before the Low-to-High clock transition, is transferred to
the corresponding flip-flop’s Q output.
When nOE is LOW, the data in the register appears at the outputs.
When nOE is HIGH, the outputs are in high impedance OFF state.
Operation of the nOE input does not affect the state of the flip-flops.
and ground bounce
The 74ALVCH16821 has active bus hold circuitry which is provided
to hold unused or floating data inputs at a valid logic level. This
feature eliminates the need for external pull-up or pull-down
resistors.
• All data inputs have bus hold
• Output drive capability 50Ω transmission lines @ 85°C
QUICK REFERENCE DATA
GND = 0V; Tamb = 25°C; tr = tf ≤ 2.5ns
PARAMETER
SYMBOL
CONDITIONS
tPHL/tPLH
Propagation delay
nCP to nQn
CI
Input capacitance
CPD
Power dissipation capacitance per buffer
VI = GND to VCC1
Fmax
Maximum clock frequency
VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF
TYPICAL
UNIT
2.6
2.5
ns
5.0
pF
VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF
Outputs enabled
33
Outputs disabled
17
250
350
pF
MHz
NOTE:
1. CPD is used to determine the dynamic power dissipation (PD in W):
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:
fi = input frequency in MHz; CL = output load capacitance in pF;
fo = output frequency in MHz; VCC = supply voltage in V;
(CL × VCC2 × fo) = sum of outputs.
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
DWG NUMBER
56-Pin Plastic SSOP Type III
–40°C to +85°C
74ALVCH16821 DL
ACH16821 DL
SOT371-1
56-Pin Plastic TSSOP Type II
–40°C to +85°C
74ALVCH16821 DGG
ACH16821 DGG
SOT364-1
1998 May 29
2
853-2066 19467
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
PIN DESCRIPTION
FUNCTION TABLE
PIN NUMBER
SYMBOL
55, 54, 52, 51, 49,
48, 47, 45, 44, 43
1D0 - 1D9
42, 41, 40, 38, 37,
36, 34, 33, 31, 30
2D0 - 2D9
2, 3, 5, 6, 8,
9, 10, 12, 13, 14
1Q0 - 1Q9
FUNCTION
INPUTS
nOE
CP
L
↑
L
L
L
↑
H
H
L
X
Q0
Data in
inputs
uts
Data outputs
out uts
15, 16, 17, 19, 20,
21, 23, 24, 26, 27
2Q0 - 2Q9
1, 28
1OE, 2OE
Output enable inputs
(active-Low)
56, 29
1CP, 2CP
Clock pulse inputs
(active rising edge)
4, 11, 18, 25,
32, 39, 46, 53
GND
Ground (0V)
7, 22, 35, 50
VCC
Positive supply
voltage
H
L
X
Z
↑
OUTPUT
=
=
=
=
=
=
Dx
Q
H
X
X
HIGH voltage level
LOW voltage level
Don’t care
High impedance OFF state
LOW to HIGH clock transition
Not a LOW-to-HIGH clock transition
Z
LOGIC SYMBOL
PIN CONFIGURATION
2
1Q0
3
1
56
1OE
1CP
1D0
55
1Q1
1D1
54
1D2
52
1OE
1
56
1CP
5
1Q2
1Q0
2
55
1D0
6
1Q3
1D3
51
1Q1
3
54
1D1
8
1Q4
1D4
49
GND
4
53
GND
9
1Q5
1D5
48
1Q2
5
52
1D2
1Q3
6
51
1D3
10
1Q6
1D6
47
VCC
7
50
VCC
12
1Q7
1D7
45
1Q4
8
49
1D4
13
1Q8
1D8
44
1Q5
9
48
1D5
14
1Q9
1D9
43
1Q6
10
47
1D6
15
2Q0
2D0
42
GND
11
46
GND
1Q7
12
45
1D7
16
2Q1
2D1
41
1Q8
13
44
1D8
17
2Q2
2D2
40
1Q9
14
43
1D9
19
2Q3
2D3
38
2Q0
15
42
2D0
20
2Q4
2D4
37
2Q1
16
41
2D1
21
2Q5
17
40
2D2
2D5
36
2Q2
23
2Q6
2D6
34
GND
18
39
GND
2Q3
19
38
2D3
24
2Q7
2D7
33
2Q4
20
37
2D4
26
2Q8
2D8
31
2Q5
21
36
2D5
27
2Q9
2D9
30
VCC
22
35
VCC
2Q6
23
34
2D6
2Q7
24
33
2D7
GND
25
32
GND
2Q8
26
31
2D8
2Q9
27
30
2D9
2OE
28
29
2CP
2OE
2CP
28
29
SH00127
SH00001
1998 May 29
3
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
LOGIC SYMBOL (IEEE/IEC)
1OE
1
1CP
56
2OE
28
2CP
29
1D0
55
2
1Q0
1D1
54
3
1Q1
1D2
52
5
1Q2
1D3
51
6
1Q3
1D4
49
8
1Q4
1D5
48
9
1Q5
1D6
47
10
1Q6
1D7
45
12
1Q7
1D8
44
13
1Q8
1D9
43
14
1Q9
2D0
42
15
2Q0
2D1
41
16
2Q1
2D2
40
17
2Q2
2D3
38
19
2Q3
2D4
37
20
2Q4
2D5
36
21
2Q5
2D6
34
23
2Q6
2D7
33
24
2Q7
2D8
31
26
2Q8
2D9
30
27
2Q9
EN2
C1
EN4
C3
2∇
1D
4∇
3D
SH00003
LOGIC DIAGRAM
nD0
nD1
nD2
nD3
nD4
nD5
nD6
nD7
nD8
nD9
D
D
D
D
D
D
D
D
D
D
CP Q
CP Q
CP Q
CP Q
CP Q
CP Q
CP Q
CP Q
CP Q
CP Q
nCP
nOE
nQ0
nQ1
nQ2
nQ3
nQ4
nQ5
nQ6
nQ7
nQ8
nQ9
SH00004
1998 May 29
4
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
VCC
PARAMETER
CONDITIONS
UNIT
MIN
MAX
DC supply voltage 2.5V range (for max. speed
performance @ 30 pF output load)
2.3
2.7
DC supply voltage 3.3V range (for max. speed
performance @ 50 pF output load)
3.0
3.6
V
VI
DC Input voltage range
0
VCC
V
VO
DC output voltage range
0
VCC
V
–40
+85
°C
0
0
20
10
ns/V
Tamb
Operating free-air temperature range
tr, tf
Input rise and fall times
VCC = 2.3 to 3.0V
VCC = 3.0 to 3.6V
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOL
VCC
IIK
PARAMETER
CONDITIONS
DC supply voltage
DC input diode current
VI 0
DC output diode current
VO VCC or VO 0
DC output voltage
Note 1
IO
DC output source or sink current
VO = 0 to VCC
DC VCC or GND current
Storage temperature range
For temperature range: –40 to +125 °C
above +55°C derate linearly with 11.3 mW/K
above +55°C derate linearly with 8 mW/K
NOTE:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 May 29
–50
mA
–0.5 to VCC +0.5
VO
Power dissipation per package
–plastic medium-shrink (SSOP)
–plastic thin-medium-shrink (TSSOP)
V
For data inputs1
IOK
PTOT
–0.5 to +4.6
–0.5 to +4.6
DC in
input
ut voltage
Tstg
UNIT
For control pins1
VI
IGND, ICC
RATING
5
V
50
mA
–0.5 to VCC +0.5
V
50
mA
100
mA
–65 to +150
°C
850
600
mW
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V).
LIMITS
SYMBOL
PARAMETER
VIH
HIGH level Input voltage
VIL
LOW level Input voltage
VOH
O
HIGH level output voltage
TEST CONDITIONS
Temp = -40°C to +85°C
MIN
TYP1
VCC = 2.3 to 2.7V
1.7
1.2
VCC = 2.7 to 3.6V
2.0
1.5
UNIT
MAX
V
VCC = 2.3 to 2.7V
1.2
0.7
VCC = 2.7 to 3.6V
1.5
0.8
V
3 to 3
6V; VI = VIH or VIL; IO = –100µA
100µA
VCC = 2
2.3
3.6V;
02
VCC0.2
VCC
VCC = 2.3V; VI = VIH or VIL; IO = –6mA
VCC0.3
VCC0.08
VCC = 2.3V; VI = VIH or VIL; IO = –12mA
VCC0.6
VCC0.26
VCC = 2.7V; VI = VIH or VIL; IO = –12mA
VCC0.5
VCC0.14
VCC = 3.0V; VI = VIH or VIL; IO = –12mA
VCC0.6
VCC0.09
VCC = 3.0V; VI = VIH or VIL; IO = –24mA
VCC1.0
VCC0.28
V
VCC = 2
2.3
3 to 3
3.6V;
6V; VI = VIH or VIL; IO = 100µA
GND
0 20
0.20
V
VCC = 2.3V; VI = VIH or VIL; IO = 6mA
0.07
0.40
V
VCC = 2.3V; VI = VIH or VIL; IO = 12mA
0.15
0.70
VCC = 2.7V; VI = VIH or VIL; IO = 12mA
0.14
0.40
VCC = 3.0V; VI = VIH or VIL; IO = 24mA
0.27
0.55
Input leakage
g current
VCC = 2
2.3
3 to 3
3.6V;
6V;
VI = VCC or GND
0.1
5
µA
µ
IOZ
3-State output OFF-state current
VCC = 2.7 to 3.6V; VI = VIH or VIL;
VO = VCC or GND
0.1
10
µA
ICC
Quiescent supply current
VCC = 2.3 to 3.6V; VI = VCC or GND; IO = 0
0.2
40
µA
∆ICC
Additional quiescent supply current
VCC = 2.3V to 3.6V; VI = VCC – 0.6V; IO = 0
150
750
µA
IBHL
Bus hold LOW sustaining current
IBHH
Bus hold HIGH sustaining current
IBHLO
Bus hold LOW overdrive current
VCC = 3.6V2
500
µA
IBHHO
Bus hold HIGH overdrive current
VCC = 3.6V2
–500
µA
VOL
II
LOW level output voltage
VCC = 2.3V; VI = 0.7V2
45
–
0.8V2
75
150
VCC = 2.3V; VI = 1.7V2
–45
2.0V2
–75
VCC = 3.0V; VI =
VCC = 3.0V; VI =
NOTES:
1. All typical values are at Tamb = 25°C.
2. Valid for data inputs of bus hold parts.
1998 May 29
6
–175
V
µA
µA
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
AC CHARACTERISTICS FOR VCC = 2.3V TO 2.7V RANGE
GND = 0V; tr = tf ≤ 2.0ns; CL = 30pF
LIMITS
SYMBOL
PARAMETER
VCC = 2.5V ± 0.2V
WAVEFORM
UNIT
MIN
TYP1
MAX
tPLH/tPHL
Propagation delay
nCP to nQn
1, 4
1.0
2.6
5.8
ns
tPZH/tPZL
3-State output enable time
nOEn to nQn
2, 4
1.0
2.8
6.6
ns
tPHZ/tPLZ
3-State output disable time
nOEn to nQn
2, 4
1.0
2.2
5.7
ns
tW
nCP pulse width HIGH or LOW
3, 4
3.0
1.8
ns
tSU
Set up time nDn to nCP
3, 4
1.4
0.3
ns
Hold time nDn to nCP
3, 4
0.4
0.0
ns
Maximum clock pulse frequency
1, 4
150
250
MHz
th
Fmax
NOTE:
1. All typical values are at VCC = 2.5V and Tamb = 25°C.
AC CHARACTERISTICS FOR VCC = 3.0V TO 3.6V RANGE AND VCC = 2.7V
GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF
LIMITS
SYMBOL
PARAMETER
VCC = 3.3 ± 0.3V
WAVEFORM
VCC = 2.7V
UNIT
MIN
TYP1
MAX
MIN
TYP1
MAX
tPHL/tPLH
Propagation delay
nCP to nQn
1, 4
1.0
2.5
4.5
1.0
2.8
5.3
ns
tPZH/tPZL
3-State output enable time
nOEn to nQn
2, 4
1.0
2.3
5.1
1.0
3.2
6.2
ns
tPHZ/tPLZ
3-State output disable time
nOEn to nQn
2, 4
1.0
2.8
4.6
1.0
3.1
5.0
ns
tW
nCP pulse width HIGH or
LOW
3, 4
3.3
0.2
3.3
1.7
ns
tSU
Set up time nDn to nCP
3, 4
1.0
0.2
1.2
0.3
ns
th
Hold time nDn to nCP
3, 4
0.8
0.4
0.6
–0.3
ns
Fmax
Maximum clock pulse
frequency
1, 4
150
350
150
300
MHz
NOTES:
1. All typical values are at Tamb = 25°C.
1998 May 29
7
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
AC WAVEFORMS
VCC = 2.3 TO 2.7 V RANGE
1. VM = 0.5 V
2. VX = VOL + 0.15V
3. VY = VOH – 0.15V
4. VI = VCC
5. VOL and VOH are the typical output voltage drop that occur with
the output load.
VCC = 3.0 TO 3.6 V RANGE AND VCC = 2.7 V
1. VM = 1.5 V
2. VX = VOL + 0.3V
3. VY = VOH – 0.3V
4. VI = 2.7 V
5. VOL and VOH are the typical output voltage drop that occur with
the output load.
VI
VM
nCP INPUT
GND
tsu
tsu
th
th
VI
VM
nDn INPUT
GND
VOH
nQn OUTPUT
VOL
VM
SH00129
Waveform 3. Set up and hold times.
TEST CIRCUIT
1/fMAX
VI
nCP INPUT
GND
tw
tPLH
tPHL
VOH
nQn OUTPUT
VM
PULSE
GENERATOR
2 * VCC
Open
GND
RL = 500 Ω
VO
VI
VM
VOL
D.U.T.
RT
SH00128
Waveform 1.
S1
VCC
VM
RL = 500 Ω
CL
The input (nCP) to output propagation delays.
Test Circuit for switching times
DEFINITIONS
VI
RL = Load resistor
nOE INPUT
CL = Load capacitance includes jig and probe capacitance
VM
RT = Termination resistance should be equal to ZOUT of pulse generators.
GND
SWITCH POSITION
tPLZ
TEST
tPZL
tPLH/tPHL
VCC
OUTPUT
LOW-to-OFF
OFF-to-LOW
VM
VX
S1
Open
tPLZ/tPZL
2 VCC
tPHZ/tPZH
GND
VCC
VI
< 2.7V
VCC
2.7–3.6V
2.7V
VOL
SV00906
tPHZ
tPZH
Waveform 4. Load circuitry for switching times
VOH
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
VY
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
SW00308
Waveform 2. The 3-State enable and disable times.
1998 May 29
8
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm
1998 May 29
9
SOT371-1
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm
1998 May 29
10
SOT364-1
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
NOTES
1998 May 29
11
Philips Semiconductors
Product specification
20-bit bus-interface D-type flip-flop;
positive-edge trigger (3-State)
74ALVCH16821
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Document order number:
1998 May 29
12
Date of release: 05-96
9397-750-04553
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