DNB65 DNB65 Recifier Diode Replaces January 2000 version, DS4175-2.0 DS4175-3.0 August 2001 FEATURES KEY PARAMETERS ■ Double Side Cooling VRRM 4500V ■ High Surge Capability IF(AV) 2590A IFSM 31000A APPLICATIONS ■ Rectification ■ Freewheel Diode ■ DC Motor Control ■ Power Supplies ■ Welding ■ Battery Chargers VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage VRRM V DNB65 45 4500 DNB65 44 4400 DNB65 42 4200 DNB65 40 4000 DNB65 38 3800 DNB65 36 3600 Lower voltage grades available. Conditions VRSM = VRRM + 100V Outline type code: DO200AD See Package Details for further information. Fig. 1 Package outline ORDERING INFORMATION When ordering, select the required part number shown in the Voltage Ratings selection table, e.g.: DNB65 40 Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order. 1/7 www.dynexsemi.com DNB65 CURRENT RATINGS Tcase = 75oC unless otherwise stated Symbol Parameter Conditions Max. Units 2590 A Double Side Cooled Half wave resistive load IF(AV) Mean forward current IF(RMS) RMS value - 4068 A Continuous (direct) forward current - 3727 A 1940 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 3047 A Continuous (direct) forward current - 2656 A Conditions Max. Units IF Half wave resistive load Tcase = 100oC unless otherwise stated Symbol Parameter Double Side Cooled IF(AV) Mean forward current Half wave resistive load, Tcase = 100oC 2000 A IF(RMS) RMS value Tcase = 100oC 3140 A Continuous (direct) forward current Tcase = 100oC 2800 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current Half wave resistive load, Tcase = 100oC 1284 A IF(RMS) RMS value Tcase = 100oC 2017 A Continuous (direct) forward current Tcase = 100oC 1715 A IF 2/7 www.dynexsemi.com DNB65 SURGE RATINGS Parameter Symbol IFSM I2t IFSM I2t Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current Conditions Max. Units 10ms half sine; Tcase = 150oC 24.8 kA VR = 50% VRRM - 1/4 sine 3.075 x 106 A2s 10ms half sine; Tcase = 150oC 31.0 kA VR = 0 4.8 x 106 A2s I2t for fusing THERMAL AND MECHANICAL DATA Min. Max. Units dc - 0.013 o Anode dc - 0.025 o Cathode dc - 0.027 o C/W Double side - 0.003 o C/W Single side - 0.006 o C/W Forward (conducting) - 150 o Reverse (blocking) - 150 o Storage temperature range –55 175 o Clamping force 40.0 48.0 Parameter Symbol Conditions Double side cooled Rth(j-c) Thermal resistance - junction to case C/W C/W Single side cooled Rth(c-h) Tvj Tstg - Thermal resistance - case to heatsink Clamping force 45.0kN with mounting compound C Virtual junction temperature C C kN 3/7 www.dynexsemi.com DNB65 CHARACTERISTICS Symbol Conditions Parameter Typ. Max. Units VFM Forward voltage At 3000A peak, Tcase = 25oC - 1.45 V IRRM Peak reverse current At VRRM, Tcase = 150oC - 150 mA QS Total stored charge 6000 - µC - 500 A 25 - µs IF = 1500A, dIRR/dt = 25A/µs IRM Peak recovery current Tcase = 25˚C, VR = 100V trr Reverse recovery time VTO rT Threshold voltage At Tvj = 150˚C - 0.84 V Slope resistance At Tvj = 150˚C - 0.19 mΩ CURVES 10000 10000 Measured under pulse conditions dc Half wave 8000 Mean power dissipation - (W) Instantaneous forward current, IF - (A) 8000 Tj = 25˚C 6000 Tj = 150˚C 4000 6000 6 phase 4000 2000 2000 0 0 3 phase 1.0 2.0 Instantaneous forward voltage, VF - (V) 0 0 3.0 Fig.2 Maximum (limit) forward characteristics VFM Equation:VFM = A + Bln (IF) + C.IF+D.√IF 2000 4000 Mean forward current, IF(AV) - (A) 6000 Fig.3 Dissipation curves Where A = –0.36984 B = 0.292197 C = 0.000354 D = –0.03111 these values are valid for Tj = 125˚C for IF 500A to 10000A 4/7 www.dynexsemi.com DNB65 0.1 60 Conduction I2t = Î2 x t 2 6 40 5 30 4 20 3 10 10 ms Double side 0.0130 0.0141 0.0170 0.0200 Anode side 0.0210 0.0221 0.0250 0.0280 0.01 Anode side cooled Double side cooled 0.001 2 I2t 0 1 Thermal impedance - (˚C/W) VR = 0 VR = 50% VRRM I2t value - (A2s x 106) Peak half sine forward current - (kA) 50 d.c. Halfwave 3 phase 120˚ 6 phase 60˚ Effective thermal resistance Junction to case ˚C/W 1 2 3 5 10 20 1 50 Cycles at 50Hz Duration Fig.4 Surge (non-repetitive) forward current vs time at Tcase 150˚C) 0.0001 0.001 0.01 0.1 1 Time - (s) 10 100 Fig.5 Maximum (limit) transient thermal impedance junction to case 5/7 www.dynexsemi.com DNB65 PACKAGE DETAILS For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Hole Ø3.6 x 2.0 deep (One in each electrode) Cathode Ø102 max 32.9 34.1 Ø63nom Ø63nom Anode Ø92 max Nominal weight: 1100g Clamping force: 45kN ±10% Package outine type code: DO200AD Note: 1. Package maybe supplied with pins and/or tags. 6/7 www.dynexsemi.com DNB65 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS4175-3 Issue No. 3.0 August 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. 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These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 7/7 www.dynexsemi.com