Material Content Data Sheet Sales Product Name BAL 99 E6327 Issued MA# MA000550600 Package PG-SOT23-3-16 Weight* Construction Element Material Group Substances chip noble metal non noble metal inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material plastics inorganic material non noble metal noble metal < 10% gold arsenic silicon chromium silicon titanium copper gold carbon black brominated resin antimonytrioxide epoxy resin silicondioxide tin silver leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 8.81 mg CAS# if applicable Weight [mg] Average Mass [%] 7440-57-5 7440-38-2 7440-21-3 7440-47-3 7440-21-3 7440-32-6 7440-50-8 7440-57-5 1333-86-4 1309-64-4 60676-86-0 7440-31-5 7440-22-4 0.002 0.02 0.000 0.00 0.017 0.20 0.008 0.09 0.001 0.01 62 0.003 0.03 311 2.731 30.99 31.12 309893 311200 0.007 0.08 0.08 758 758 0.058 0.66 0.087 0.99 9863 0.116 1.32 13151 1.246 14.14 4.288 48.64 65.75 486599 657566 0.150 1.70 1.70 16981 16981 0.100 1.13 1.13 11306 Sum [%] Average Mass [ppm] 229 2 0.22 1958 2. 3. 6576 141377 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2189 934 Important Remarks: 1. Sum [ppm] 11306 1000000